High-sensitivity integrated quartz resonance accelerometer

Abstract

A high-sensitivity integrated quartz resonance accelerometer comprises a packaging tube shell, the bottom of the inner side of the packaging tube shell is connected with a mainboard, an accelerometer movement is arranged above the mainboard, a top cover is arranged above the accelerometer movement, and the top cover is connected with the packaging tube shell in a sealed mode; the accelerometer core comprises a pendulum assembly, the upper part of the pendulum assembly is connected with an upper PCB, the lower part of the pendulum assembly is connected with a lower PCB, and the upper PCB, the pendulum assembly and the lower PCB form the accelerometer core with a sandwich structure; the sensitivity and the stability of the quartz resonance accelerometer are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of resonant accelerometer, in particular to a high-sensitivity integrated quartz resonant accelerometer. BACKGROUND

[0002] High-precision inertial navigation system is the core basis of weapon equipment precision strike target, as one of its core instruments, the precision of accelerometer directly determines the high-precision strike ability of weapon equipment. With the update of application scene, the volume, precision and reliability of accelerometer are continuously improved, and the performance of existing products has shown a gap with the demand. Compared with traditional quartz flexible accelerometer, quartz resonant accelerometer has the characteristics of simple structure, small size, high precision, accurate digital direct output and strong environmental adaptability, and is the research and application direction of next generation high-precision accelerometer.

[0003] Sensitivity is one of the key indicators of quartz resonant accelerometer, which determines the ability of acceleration signal conversion to frequency signal. At present, the sensitivity of integrated quartz resonant accelerometer is mostly about 55Hz / g, 75Hz / g, etc., and the maximum sensitivity can reach 188.6Hz / g. The low sensitivity affects the ability of the sensor to perceive acceleration. The reasons are as follows: ① there are problems in the structure design, most of the current integrated quartz resonant accelerometer chips (Bi Xiaowei, Ma Yuefei, Du Wei, et al. Development of a split type quartz vibration beam accelerometer [J]. Navigation and control, 2019, 18(04): 77-82+101.) are composed of an inertial mass and two quartz resonators arranged oppositely above and below. The axial force converted by the inertial acceleration perceived by the inertial mass is small, so the frequency change of the quartz resonator is small; ② assembly and packaging problems, since the quartz resonator needs to apply alternating voltage on the pads at its ends to make it resonate, the current method of leading wire of quartz resonator (Bi Xiaowei, Ma Yuefei, Du Wei, et al. Development of a split type quartz vibration beam accelerometer [J]. Navigation and control, 2019, 18(04): 77-82+101.) is only suitable for quartz resonant accelerometer with single inertial mass structure. SUMMARY

[0004] In order to overcome the shortcomings of the prior art, the purpose of the present application is to provide a high-sensitivity integrated quartz resonant accelerometer, which can effectively improve the sensitivity and stability of the quartz resonant accelerometer.

[0005] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows:

[0006] The utility model provides a high sensitivity integrated quartz resonant accelerometer, including the package tube shell 6, the inside bottom of package tube shell 6 is connected with mainboard 5, the accelerometer watch core is provided with above mainboard 5, the top cover 1 is provided with above the accelerometer watch core, and the top cover 1 is sealedly connected with package tube shell 6, accelerometer watch core includes swing assembly 3, the swing assembly 3 is connected with upper PCB board 2 above, and the swing assembly 3 is connected with lower PCB board 4 below, and upper PCB board 2, swing assembly 3, lower PCB board 4 constitute the accelerometer watch core of " sandwich " structure.

[0007] The upper PCB board upper surface 2-22 of the upper PCB board 2 is provided with an upper PCB board assembly limiting groove 2-1, an upper PCB board right gold wire pad 2-2, an upper PCB board left gold wire pad 2-3, an upper PCB board gold wire passing groove 2-4, a first connecting wire 2-5, a second connecting wire 2-6, a third connecting wire 2-7, an upper PCB board right side first pad 2-8, an upper PCB board right side second pad 2-9, a fourth connecting wire 2-10, an upper PCB board right side third pad 2-11, an upper PCB board right side fourth pad 2-12, a fifth connecting wire 2-13, an upper PCB board left side first pad 2-14, an upper PCB board left side second pad 2-15, an upper PCB board left side third pad 2-16, an upper PCB board left side fourth pad 2-17, a sixth connecting wire 2-18, an upper PCB board assembly alignment groove 2-19, a temperature sensor 2-20 and an upper PCB board overhead structure symmetry axis 2-21.

[0008] The upper PCB board assembly limiting groove 2-1 is used for matching the package tube shell 6 to complete assembly.

[0009] PCB board right gold wire pad 2-2, upper PCB board left gold wire pad 2-3 and upper PCB board gold wire through slot 2-4 are used for connecting with electrodes on swing assembly 3, upper PCB board right side first pad 2-8, upper PCB board right side second pad 2-9, upper PCB board left side first pad 2-14 and upper PCB board left side second pad 2-15 are used for forming electrical connection with main board 5; upper PCB board right side third pad 2-11 and upper PCB board left side third pad 2-16 are used for forming electrical connection with lower PCB board 4; first connecting wire 2-5 connecting upper PCB board left gold wire pad and upper PCB board left side first pad, second connecting wire 2-6 connecting upper PCB board right gold wire pad and upper PCB board left side second pad, third connecting wire 2-6 connecting upper PCB board right side first pad and upper PCB board left side third pad, fourth connecting wire 2-10 connecting upper PCB board right side second pad and upper PCB board right side third pad, are used for conducting upper PCB board right gold wire pad 2-2, upper PCB board left gold wire pad 2-3, upper PCB board right side first pad 2-8 and upper PCB board right side second pad 2-9 to upper PCB board left side second pad 2-15, upper PCB board left side first pad 2-14, upper PCB board left side third pad 2-16 and upper PCB board right side third pad 2-11 respectively; temperature sensor 2-20 is used for detecting and providing internal temperature of sensor; upper PCB board left side fourth pad 2-17 and upper PCB board right side fourth pad 2-12 are used for forming electrical connection with main board 5; fifth connecting wire 2-13 connecting upper PCB board right side fourth pad and temperature sensor electrode, sixth connecting wire 2-18 connecting upper PCB board left side fourth pad and temperature sensor electrode, are used for connecting upper PCB board right side fourth pad 2-12, upper PCB board left side fourth pad 2-17 and temperature sensor 2-20; upper PCB board lower surface 2-23 is bonded with swing assembly 3; upper PCB board assembly alignment slot 2-19 is used for accurately assembling upper PCB board 2 and swing assembly 3.

[0010] The swing assembly 3 is provided with first upper PCB board bonding surface 3-1, second upper PCB board bonding surface 3-2, upper PCB board bonding surface symmetry axis 3-3, upper metal swing assembly alignment slot 3-5, upper quartz resonator upper pad 3-6, and the swing assembly 3 is provided with lower quartz resonator upper pad 3-7, lower PCB board bonding surface symmetry axis 3-8, lower metal swing assembly alignment slot 3-9, first lower PCB board bonding surface 3-10, and second lower PCB board bonding surface 3-11.

[0011] The first upper PCB bonding surface 3-1, the second upper PCB bonding surface 3-2 and the upper metal pendulum assembly alignment slot 3-5 are symmetrically arranged about the upper PCB bonding surface symmetry axis 3-3, the first upper PCB bonding surface 3-1 and the second upper PCB bonding surface 3-2 are used for assembling with the upper PCB 2; the upper quartz resonator upper pad 3-6 is used for connecting with an external circuit to excite the upper quartz resonator to vibrate; the first upper PCB bonding surface 3-1 is symmetric about the pendulum assembly left view symmetry axis 3-4 with the first lower PCB bonding surface 3-10, and the second upper PCB bonding surface 3-2 is symmetric about the pendulum assembly left view symmetry axis 3-4 with the second lower PCB bonding surface 3-11; the lower metal pendulum assembly alignment slot 3-9, the first lower PCB bonding surface 3-10 and the second lower PCB bonding surface 3-11 are symmetrically arranged about the lower PCB bonding surface symmetry axis 3-8, and the lower quartz resonator upper pad 3-7 is used for connecting with an external circuit to excite the upper quartz resonator to vibrate; the upper metal pendulum assembly alignment slot 3-5 and the lower metal pendulum assembly alignment slot 3-9 are matched with the upper PCB 2 and the lower PCB 4 respectively, so as to realize the accurate assembly of the upper PCB 2, the pendulum assembly 3 and the lower PCB 4.

[0012] The lower PCB lower surface 4-12 of the lower PCB 4 is provided with a lower PCB assembly limiting slot 4-1, a lower PCB gold wire passing slot 4-2, a lower PCB right gold wire pad 4-3, a seventh connecting lead 4-4, a lower PCB right side first pad 4-5, a lower PCB assembly alignment slot 4-6, a lower PCB left gold wire pad 4-7, an eighth connecting lead 4-8, a lower PCB left side first pad 4-9 and a lower PCB overhead structure symmetry axis 4-10.

[0013] The lower PCB 4 is symmetrically designed about the lower PCB overhead structure symmetry axis 4-10; the lower PCB gold wire passing slot 4-2, the lower PCB right gold wire pad 4-3 and the lower PCB left gold wire pad 4-7 are used for electrode connection with the pendulum assembly 3; the lower PCB right side first pad 4-5 and the lower PCB left side first pad 4-9 are used for forming electrical connection with the upper PCB 2; the seventh connecting lead 4-4 connected between the lower PCB right gold wire pad and the lower PCB right side first pad and the eighth connecting lead 4-8 connected between the lower PCB right gold wire pad and the lower PCB left side first pad are used for conducting the lower PCB right gold wire pad 4-3 and the lower PCB left gold wire pad 4-7 to the lower PCB left side first pad 4-9 and the lower PCB right side first pad 4-5 respectively; the lower PCB upper surface 4-11 is bonded with the pendulum assembly 3; and the lower PCB assembly alignment slot 4-6 is used for accurately assembling the pendulum assembly 3 and the lower PCB 4.

[0014] The main plate upper surface 5-10 of the main plate 5 is provided with a main plate lead post through hole 5-1, a main plate right side first pad 5-2, a main plate right side second pad 5-3, a main plate right side third pad 5-4, a main plate left side first pad 5-5, a main plate left side second pad 5-6, a main plate left side third pad 5-7; the main plate 5 is symmetrically designed about the main plate overhead structure symmetry axis 5-8; the main plate right side first pad 5-2, the main plate right side second pad 5-3, the main plate right side third pad 5-4, the main plate left side first pad 5-5, the main plate left side second pad 5-6, the main plate left side third pad 5-7 and the upper PCB board 2 are electrically connected.

[0015] The package tube shell 6 is provided with a package tube shell first mounting hole 6-1, a package tube shell flange upper surface 6-2, a package tube shell assembly limiting groove 6-3, a package tube shell top surface 6-4, a lead post 6-5, a package tube shell ground lead post 6-6, a first package tube shell swing component mounting plane 6-7, a package tube shell top cover mounting plane 6-8, a package tube shell main plate mounting plane 6-9, a second package tube shell swing component mounting plane 6-10, a package tube shell second mounting hole 6-11, a package tube shell inner bottom surface 6-12, a package tube shell overhead structure symmetry axis 6-13, and the lead post 6-5 and the package tube shell ground lead post 6-6 pass through a package tube shell flange lower surface 6-14; except the package tube shell ground lead post 6-6, the rest of the structures are symmetrical about the package tube shell overhead structure symmetry axis 6-13.

[0016] The package tube shell first mounting hole 6-1, the package tube shell flange upper surface 6-2 and the package tube shell second mounting hole 6-11 are used for fixing the accelerometer to the moving carrier; the package tube shell top cover mounting plane 6-8 is used for cooperating with the top cover 1 to finally package the whole accelerometer; the lead post 6-5 is electrically insulated from the package tube shell 6, and the lead post 6-5 and the main plate 5 are electrically connected; the package tube shell assembly limiting groove 6-3 is used for cooperating with the upper PCB board 2 and the lower PCB board 4 to complete the alignment assembly of the watch movement, and at this time, a gap exists between the lower PCB board lower surface 4-12 and the main plate upper surface 5-10 in the main plate 5; the package tube shell main plate mounting plane 6-9 is used for being connected with the main plate 5, and a gap exists between the main plate lower surface 5-9 and the package tube shell inner bottom surface 6-12; the package tube shell ground lead post 6-6 facilitates the electrical connection between the package tube shell 6 and the outside.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] The high-sensitivity integrated quartz resonant accelerometer comprises a top cover 1, an upper PCB board 2, a pendulum assembly 3, a lower PCB board 4, a main board 5 and a packaging tube 6, the sensitivity of the quartz resonant accelerometer is greatly improved, the problem of how to reverse the solder pad on the lower quartz resonator to the upper PCB board and connect with the main board is solved, and the structural stability and assembly convenience of the accelerometer chip are improved. In addition, the design of multiple limiting grooves and assembly alignment grooves can realize high parallelism assembly of the pendulum assembly and the main board 5, reduce the assembly position error and zero error of the quartz resonant accelerometer, and further improve the long-term stability of the quartz resonant accelerometer. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic view of each component of the high-sensitivity integrated quartz resonant accelerometer of the embodiment of the application.

[0020] Figure 2 It is a front view of the upper PCB board of the embodiment of the application.

[0021] Figure 3 It is a top view of the upper PCB board of the embodiment of the application.

[0022] Figure 4 It is a left view of the upper PCB board of the embodiment of the application.

[0023] Figure 5 It is a front view of the pendulum assembly of the embodiment of the application.

[0024] Figure 6 It is a top view of the pendulum assembly of the embodiment of the application.

[0025] Figure 7 It is a left view of the pendulum assembly of the embodiment of the application.

[0026] Figure 8 It is a bottom view of the pendulum assembly of the embodiment of the application.

[0027] Figure 9 It is a front view of the lower PCB board of the embodiment of the application.

[0028] Figure 10 It is a bottom view of the lower PCB board of the embodiment of the application.

[0029] Figure 11 It is a right view of the lower PCB board of the embodiment of the application.

[0030] Figure 12 It is a front view of the main board of the embodiment of the application.

[0031] Figure 13 It is a top view of the main board of the embodiment of the application.

[0032] Figure 14 It is a left view of the main board of the embodiment of the application.

[0033] Figure 15 Front view of package tube for the embodiment of the present application.

[0034] Figure 16 Top view of package tube for the embodiment of the present application.

[0035] Figure 17 Bottom view of package tube for the embodiment of the present application.

[0036] Figure 18 Left view of package tube for the embodiment of the present application. DETAILED DESCRIPTION

[0037] The technical solutions of the present application will be described clearly and completely below in conjunction with the embodiments and drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0038] Referring to Figure 1 The high-sensitivity integrated quartz resonant accelerometer comprises a package tube 6, a main board 5 connected to the inside bottom of the package tube 6, an accelerometer movement arranged above the main board 5, and a top cover 1 arranged above the accelerometer movement, wherein the top cover 1 is sealed with the package tube 6 by laser welding. The accelerometer movement comprises a pendulum assembly 3, an upper PCB board 2 connected to the top of the pendulum assembly 3, and a lower PCB board 4 connected to the bottom of the pendulum assembly 3, and the upper PCB board 2, the pendulum assembly 3, and the lower PCB board 4 form a "sandwich" structure of the accelerometer movement.

[0039] Referring to Figure 2 、 Figure 3 and Figure 4The upper PCB 2 has an upper PCB upper surface 2-22 and an upper PCB lower surface 2-23. The upper PCB upper surface 2-22 is provided with an upper PCB assembly limiting groove 2-1, an upper PCB right gold wire pad 2-2, an upper PCB left gold wire pad 2-3, an upper PCB gold wire passing groove 2-4, a first connecting wire 2-5 connecting the upper PCB right gold wire pad 2-2 and a first pad on the left side of the upper PCB, a second connecting wire 2-6 connecting the upper PCB left gold wire pad 2-3 and a second pad on the left side of the upper PCB, a third connecting wire 2-7 connecting a first pad on the right side of the upper PCB and a third pad on the left side of the upper PCB, a first pad on the right side of the upper PCB 2-8, a second pad on the right side of the upper PCB 2-9, a fourth connecting wire 2-10 connecting the second pad on the right side of the upper PCB and a third pad on the right side of the upper PCB, a third pad on the right side of the upper PCB 2-11, a fourth pad on the right side of the upper PCB 2-12, a fifth connecting wire 2-13 connecting the fourth pad on the right side of the upper PCB and a temperature sensor electrode, a first pad on the left side of the upper PCB 2-14, a second pad on the left side of the upper PCB 2-15, a third pad on the left side of the upper PCB 2-16, a fourth pad on the left side of the upper PCB 2-17, a sixth connecting wire 2-18 connecting the fourth pad on the left side of the upper PCB and a temperature sensor electrode, an upper PCB assembly alignment groove 2-19, a temperature sensor 2-20, and a viewing structure symmetry axis of the upper PCB 2-21.

[0040] The upper PCB assembly limiting groove 2-1 is used for the subsequent matching of the package tube assembly limiting groove 6-3 to complete the coincident assembly of the viewing structure symmetry axis 2-21 of the upper PCB and the viewing structure symmetry axis 6-13 of the package tube. The upper PCB right gold wire pad 2-2, the upper PCB left gold wire pad 2-3, and the upper PCB gold wire passing groove 2-4 are used for connecting two electrodes on the upper pad 3-6 of the upper quartz resonator in a gold wire bonding manner. One end of the gold wire is connected to the two electrodes on the upper pad 3-6 of the upper quartz resonator, and the gold wire is connected to the upper PCB right gold wire pad 2-2 and the upper PCB left gold wire pad 2-3 after passing through the upper PCB gold wire passing groove 2-4. The first pad on the right side of the upper PCB 2-8, the second pad on the right side of the upper PCB 2-9, the first pad on the left side of the upper PCB 2-14, and the second pad on the left side of the upper PCB 2-15 are used for connecting the first pad on the left side of the main board 5-5, the second pad on the left side of the main board 5-6, the first pad on the right side of the main board 5-2, and the second pad on the right side of the main board 5-3 in the subsequent main board 5 by wires to form a conductive electrical connection. The third pad on the right side of the upper PCB 2-11 and the third pad on the left side of the upper PCB 2-16 are used for connecting the first pad on the right side of the lower PCB 4-5 and the first pad on the left side of the lower PCB 4-9 in the subsequent lower PCB 4 by wires to form a conductive electrical connection. The upper PCB left gold wire pad and the upper

[0041] The first connecting wire 2-5 connected with the first pad on the left side of the PCB, the second connecting wire 2-6 connected with the right gold wire pad of the upper PCB and the second pad on the left side of the upper PCB, the third connecting wire 2-6 connected with the first pad on the right side of the upper PCB and the third pad on the left side of the upper PCB, and the fourth connecting wire 2-10 connected with the third pad on the right side of the upper PCB and the second pad on the right side of the upper PCB are used to make the right gold wire pad 2-2, the left gold wire pad 2-3, the first pad on the right side of the upper PCB 2-8 and the second pad on the right side of the upper PCB 2-9 conductive with the second pad on the left side of the upper PCB 2-15, the first pad on the left side of the upper PCB 2-14, the third pad on the left side of the upper PCB 2-16 and the third pad on the right side of the upper PCB 2-11 respectively.

[0042] The fourth connecting wire 2-10 connected with the second pad on the right side of the upper PCB and the third pad on the right side of the upper PCB is used to make the right gold wire pad 2-2, the left gold wire pad 2-3, the first pad on the right side of the upper PCB 2-8 and the second pad on the right side of the upper PCB 2-9 conductive with the second pad on the left side of the upper PCB 2-15, the first pad on the left side of the upper PCB 2-14, the third pad on the left side of the upper PCB 2-16 and the third pad on the right side of the upper PCB 2-11 respectively; the temperature sensor 2-20 is used to detect and provide the internal temperature of the sensor; the fourth pad on the left side of the upper PCB 2-17 and the fourth pad on the right side of the upper PCB 2-12 are used to be connected with the third pad on the right side of the mainboard 5-4 and the third pad on the left side of the mainboard 5-7 in the subsequent mainboard 5 by wires to form a conductive electrical connection; the fifth connecting wire 2-13 connected with the electrode of the temperature sensor on the fourth pad on the right side of the upper PCB and the sixth connecting wire 2-18 connected with the electrode of the temperature sensor on the fourth pad on the left side of the upper PCB are used to connect the fourth pad on the right side of the upper PCB 2-12 and the fourth pad on the left side of the upper PCB 2-17 with two electrodes in the temperature sensor 2-20; the lower surface 2-23 of the upper PCB is bonded with the first upper PCB bonding surface 3-1 and the second upper PCB bonding surface 3-2 in the swing assembly 3 by glue; the upper

[0043] The upper PCB assembly alignment groove 2-19 is used to cooperate with the upper metal swing assembly alignment groove 3-5 to accurately assemble the upper PCB 2 and the swing assembly 3.

[0044] Referring to Figure 5 , Figure 6 , Figure 7 , Figure 8 The upper surface of the swing assembly 3 is provided with the first upper PCB bonding surface 3-1, the second upper PCB bonding surface 3-2, the upper PCB bonding surface symmetry axis 3-3, the upper metal swing assembly alignment groove 3-5 and the upper quartz resonator upper pad 3-6; the lower surface of the swing assembly 3 is provided with the lower quartz resonator upper pad 3-7, the lower PCB bonding surface symmetry axis 3-8, the lower metal swing assembly alignment groove 3-9, the first lower PCB bonding surface 3-10 and the second lower PCB bonding surface 3-11.

[0045] Referring to Figure 6, the first upper PCB bonding surface 3-1, the second upper PCB bonding surface 3-2 and the upper metal pendulum assembly alignment slot 3-5 are symmetrically arranged about the upper PCB bonding surface symmetry axis 3-3, and the first upper PCB bonding surface 3-1 and the second upper PCB bonding surface 3-2 are used for assembling with the upper PCB lower surface 2-23 in the upper PCB 2; the upper quartz resonator upper pad 3-6 is used for connecting with an external circuit to excite the upper quartz resonator to vibrate.

[0046] With reference to Figure 7 , the first upper PCB bonding surface 3-1 is symmetric about the pendulum assembly left view symmetry axis 3-4 with the first lower PCB bonding surface 3-10, and the second upper PCB bonding surface 3-2 is symmetric about the pendulum assembly left view symmetry axis 3-4 with the second lower PCB bonding surface 3-11.

[0047] With reference to Figure 8 , the lower metal pendulum assembly alignment slot 3-9, the first lower PCB bonding surface 3-10 and the second lower PCB bonding surface 3-11 are symmetrically arranged about the lower PCB bonding surface symmetry axis 3-8, and the first lower PCB bonding surface 3-10 and the second lower PCB bonding surface 3-11 are used for assembling with the lower PCB upper surface 4-11 in the lower PCB 4; the lower quartz resonator upper pad 3-7 is used for connecting with an external circuit to excite the upper quartz resonator to vibrate.

[0048] With reference to Figure 6 and Figure 8 , the upper metal pendulum assembly alignment slot 3-5 and the lower metal pendulum assembly alignment slot 3-9 are respectively matched with the upper PCB assembly alignment slot 2-19 in the upper PCB 2 and the lower PCB assembly alignment slot 4-6 in the lower PCB 4, used for completing the coincidence installation of the upper PCB top view structure symmetry axis 2-21, the lower PCB bonding surface symmetry axis 3-8 and the lower PCB top view structure symmetry axis 4-10, and realizing the precise assembly of the upper PCB 2, the pendulum assembly 3 and the lower PCB 4.

[0049] With reference to Figure 9 , Figure 10 and Figure 11The lower PCB board 4 has a lower PCB board bottom surface 4-12 on one side and an upper surface 4-11 on the other side. The lower PCB board bottom surface 4-12 is provided with a lower PCB board assembly limiting groove 4-1, a lower PCB board gold wire passing groove 4-2, a lower PCB board right gold wire pad 4-3, a seventh connecting wire 4-4 connecting the lower PCB board right gold wire pad and the first right pad of the lower PCB board, the first right pad 4-5 of the lower PCB board, a lower PCB board assembly alignment groove 4-6, a lower PCB board left gold wire pad 4-7, an eighth connecting wire 4-8 connecting the lower PCB board right gold wire pad and the first left pad of the lower PCB board, the first left pad 4-9 of the lower PCB board, and a symmetry axis 4-10 of the lower PCB board structure when viewed from above.

[0050] Reference Figure 10 The lower PCB board 4 is symmetrically designed about the symmetry axis 4-10 of the top view structure of the lower PCB board; the lower PCB board assembly limit groove 4-1 is used to cooperate with the packaging tube shell assembly limit groove 6-3 to complete the coincidence assembly of the symmetry axis 4-10 of the top view structure of the lower PCB board and the symmetry axis 6-13 of the top view structure of the packaging tube shell; the lower PCB board gold wire passing groove 4-2, the lower PCB board right gold wire pad 4-3 and the lower PCB board left gold wire pad 4-7 are used to connect with the two electrodes on the lower quartz resonator upper pad 3-7, and the connection method is gold wire bonding. One end of the gold wire is connected to the two electrodes on the lower quartz resonator upper pad 3-7, and the gold wire passes through the lower quartz resonator.

[0051] The gold wires on the PCB board pass through the slot 4-2 and are connected to the right gold wire pad 4-3 and the left gold wire pad 4-7 of the lower PCB board respectively; the first pad 4-5 on the right side of the lower PCB board and the lower gold wire pad 4-7 are connected respectively.

[0052] The first solder pad 4-9 on the left side of the PCB board is used to connect with the third solder pad 2-11 on the right side of the upper PCB board and the third solder pad 2-16 on the left side of the upper PCB board in the upper PCB board 2 by means of wires to form a conductive electrical connection; the seventh connecting wire 4-4 connecting the right gold wire solder pad of the lower PCB board and the first solder pad on the right side of the lower PCB board and the eighth connecting wire 4-8 connecting the right gold wire solder pad of the lower PCB board and the first solder pad on the left side of the lower PCB board are used to connect the right gold wire solder pad 4-3 of the lower PCB board and the left gold wire solder pad 4-7 of the lower PCB board to the first solder pad 4-9 on the left side of the lower PCB board and the first solder pad 4-5 on the right side of the lower PCB board respectively; the upper surface 4-11 of the lower PCB board is bonded to the first lower PCB board bonding surface 3-10 and the second lower PCB board bonding surface 3-11 in the pendulum assembly 3 by means of glue; the lower PCB board assembly alignment groove 4-6 is used to cooperate with the lower metal pendulum assembly alignment groove 3-9 to accurately assemble the pendulum assembly 3 and the lower PCB board 4.

[0053] Reference Figure 12 、 Figure 13 and Figure 14The main plate 5 is symmetrically designed about the main plate overhead structure symmetry axis 5-8; the main plate 5 is the excitation circuit of the quartz resonator, and only the key design idea is described herein; the main plate lead post through hole 5-1 is used for matching the lead post 6-5 to realize the electrical connection between the lead post 6-5 in the packaging tube shell 6 and the internal surface core; the main plate right side first solder pad 5-2, the main plate right side second solder pad 5-3, the upper PCB plate 2, the upper PCB plate right side first solder pad 2-8, and the upper PCB plate right side second solder pad 2-9 are electrically connected by wires; the main plate left side first solder pad 5-5, the main plate left side second solder pad 5-6, the upper PCB plate 2, the upper PCB plate left side first solder pad 2-14, and the upper PCB plate left side second solder pad 2-15 are electrically connected by wires; the main plate right side third solder pad 5-4, the main plate left side third solder pad 5-7, the upper PCB plate 2, the upper PCB plate right side fourth solder pad 2-12, and the upper PCB plate left side fourth solder pad 2-17 are electrically connected by wires.

[0054] Referring to Figure 13 , the main plate 5 is symmetrically designed about the main plate overhead structure symmetry axis 5-8; the main plate 5 is the excitation circuit of the quartz resonator, and only the key design idea is described herein; the main plate lead post through hole 5-1 is used for matching the lead post 6-5 to realize the electrical connection between the lead post 6-5 in the packaging tube shell 6 and the internal surface core; the main plate right side first solder pad 5-2, the main plate right side second solder pad 5-3, the upper PCB plate 2, the upper PCB plate right side first solder pad 2-8, and the upper PCB plate right side second solder pad 2-9 are electrically connected by wires; the main plate left side first solder pad 5-5, the main plate left side second solder pad 5-6, the upper PCB plate 2, the upper PCB plate left side first solder pad 2-14, and the upper PCB plate left side second solder pad 2-15 are electrically connected by wires; the main plate right side third solder pad 5-4, the main plate left side third solder pad 5-7, the upper PCB plate 2, the upper PCB plate right side fourth solder pad 2-12, and the upper PCB plate left side fourth solder pad 2-17 are electrically connected by wires.

[0055] Referring to Figure 14 , the main plate 5 is symmetrically designed about the main plate overhead structure symmetry axis 5-8; the main plate 5 is the excitation circuit of the quartz resonator, and only the key design idea is described herein; the main plate lead post through hole 5-1 is used for matching the lead post 6-5 to realize the electrical connection between the lead post 6-5 in the packaging tube shell 6 and the internal surface core; the main plate right side first solder pad 5-2, the main plate right side second solder pad 5-3, the upper PCB plate 2, the upper PCB plate right side first solder pad 2-8, and the upper PCB plate right side second solder pad 2-9 are electrically connected by wires; the main plate left side first solder pad 5-5, the main plate left side second solder pad 5-6, the upper PCB plate 2, the upper PCB plate left side first solder pad 2-14, and the upper PCB plate left side second solder pad 2-15 are electrically connected by wires; the main plate right side third solder pad 5-4, the main plate left side third solder pad 5-7, the upper PCB plate 2, the upper PCB plate right side fourth solder pad 2-12, and the upper PCB plate left side fourth solder pad 2-17 are electrically connected by wires.

[0056] Referring to Figure 15 , Figure 16 , Figure 17 and Figure 18 , the packaging tube shell 6 is provided with a packaging tube shell first mounting hole 6-1, a packaging tube shell flange upper surface 6-2, a packaging tube shell assembly limiting groove 6-3, a packaging tube shell top surface 6-4, a lead post 6-5, a packaging tube shell ground lead post 6-6, a first packaging tube shell swing component mounting plane 6-7, a packaging tube shell top cover mounting plane 6-8, a packaging tube shell main plate mounting plane 6-9, a second packaging tube shell swing component mounting plane 6-10, a packaging tube shell second mounting hole 6-11, a packaging tube shell inner bottom surface 6-12, and a packaging tube shell overhead structure symmetry axis 6-13; the lead post 6-5 and the packaging tube shell ground lead post 6-6 pass through the packaging tube shell flange lower surface 6-14.

[0057] Referring to Figure 16The package shell 6 is symmetrical about the symmetrical axis 6-13 of the package shell top view structure except the package shell ground lead 6-6; the package shell first mounting hole 6-1, the package shell flange upper surface 6-2 and the package shell second mounting hole 6-11 are used for fixing the accelerometer to a moving carrier; the package shell top cover mounting plane 6-8 is used for cooperating with the top cover 1 to finally package the whole accelerometer, and the upper surface of the top cover 1 is at the same horizontal plane with the package shell top surface 6-4; the lead 6-5 is a glass sintered lead, the lead 6-5 is electrically insulated from the package shell 6, and the part of the lead 6-5 in the package shell 6 can pass through the main board lead through hole 5-1 in the main board 5 and is electrically connected to the solder pad of the main board lead through hole 5-1 through tin soldering; the package shell assembly limiting groove 6-3 is used for cooperating with the upper PCB board assembly limiting groove 2-1 and the lower PCB board assembly limiting groove 4-1 to complete the alignment assembly of the watch core, and the first package shell pendulum assembly mounting plane 6-7 and the second package shell pendulum assembly mounting plane 6-10 coincide with the lower surface 4-12 of the lower PCB board 4-1 after assembly, and at this time, the lower surface 4-12 of the lower PCB board 4-1 and the main board upper surface 5-10 in the main board 5 have a gap, so that the main board 5 and the lower surface 4-12 of the lower PCB board 4-1 do not have the risk of short circuit; the package shell main board mounting plane 6-9 is used for bonding and fixing the main board 5 by using structural glue with the main board lower surface 5-9 in the main board 5, and there is a gap between the main board lower surface 5-9 and the inner bottom surface 6-12 of the package shell; the package shell ground lead 6-6 is convenient for electrically connecting the package shell 6 with the outside.

[0058] The top cover 1, the upper PCB board 2, the pendulum assembly 3, the lower PCB board 4, the main board 5 and the package shell 6 are manufactured by precise machining process.

[0059] The high-sensitivity integrated quartz resonant accelerometer can solve the problems of low sensitivity and poor long-term stability of the current accelerometer. The top cover 1 and the package shell 6 seal and package the upper PCB board 2, the pendulum assembly 3, the lower PCB board 4 and the main board 5, so that the stability of the accelerometer is improved; the “sandwich” design of the upper PCB board 2, the pendulum assembly 3, the lower PCB board 4 and the main board 5 solves the problems of difficult excitation of the lower quartz resonator and low sensitivity of the accelerometer. The specific advantages are as follows:

[0060] (1) The “sandwich” assembly of the upper PCB board 2, the pendulum assembly 3 and the lower PCB board 4 can reverse the lower metal pendulum quartz resonator upper pad 3-7 to the upper PCB board 2 and electrically connect the upper PCB board right first pad 2-8 and the upper PCB board right second pad 2-9, which provides necessary conditions for the excitation of the quartz resonator;

[0061] (2) The parallel assembly of the upper PCB 2 and the main board 5 in the application can simultaneously realize electrical conduction of the upper quartz resonator upper pad 3-6, the lower quartz resonator upper pad 3-7 in the pendulum assembly 3 and the temperature sensor 2-20 in the upper PCB 2 to the pad of the main board 5, so that the temperature signal can be collected while the upper quartz resonator upper pad 3-6 and the lower quartz resonator upper pad 3-7 are synchronously excited.

[0062] (3) The upper cover type design of the top cover 1 and the packaging tube shell 6 in the application can seal and package the key components of the accelerometer, i.e., the upper PCB 2, the pendulum assembly 3, the lower PCB 4 and the main board 5 at one time, so as to improve the long-term comprehensive stability of the accelerometer.

[0063] Through experiments, the sensitivity of the quartz resonant accelerometer in the embodiment is 350 Hz / g, which is significantly improved compared with the sensitivity of 55 Hz / g in the literature (Bi Xiaowei, Ma Yuefei, Du Wei, et al. Development of a split type quartz vibrating beam accelerometer [J]. Navigation and control, 2019, 18(04): 77-82.), the sensitivity of 75.346 Hz / g in the literature (Xue H, Li C, Zhao Y, et al. An All-Quartz Integrated Resonant Accelerometer With High Sensitivity and Stability: Design, Fabrication, and Measurement [J]. IEEE Sensors Journal, 2024, 24(5): 5936-5949.), and the sensitivity of 188.6 Hz / g in the literature (C. Li, H. Xue, Y. Zhang, J. Ai and Y. Zhao A laterally sensitive quartz vibrating beam accelerometer for inertial navigation application [J]. Sensors and Actuators A: Physics, 2024, 366: 115015.).

Claims

1. A high-sensitivity integrated quartz resonant accelerometer, comprising a packaging tube shell (6), characterized in that: The bottom of the inner side of the package tube shell (6) is connected to a main board (5), an accelerometer core is arranged above the main board (5), a top cover (1) is arranged above the accelerometer core, and the top cover (1) is sealedly connected to the package tube shell (6); the accelerometer core comprises a pendulum assembly (3), the upper side of the pendulum assembly (3) is connected to an upper PCB board (2), and the lower side of the pendulum assembly (3) is connected to a lower PCB board (4), and the upper PCB board (2), the pendulum assembly (3), and the lower PCB board (4) form an accelerometer core with a "sandwich" structure.

2. The accelerometer according to claim 1, wherein: The upper PCB board (2) is provided with an upper PCB board assembly limit groove (2-1), an upper PCB board right gold wire pad (2-2), an upper PCB board left gold wire pad (2-3), an upper PCB board gold wire passing groove (2-4), a first connecting wire (2-5), a second connecting wire (2-6), a third connecting wire (2-7), a first soldering pad (2-8) on the right side of the upper PCB board, a second soldering pad (2-9) on the right side of the upper PCB board, a fourth connecting wire (2-10), an upper PCB board The invention also comprises a third soldering pad (2-11) on the right side of the upper PCB board, a fourth soldering pad (2-12) on the right side of the upper PCB board, a fifth connecting wire (2-13), a first soldering pad (2-14) on the left side of the upper PCB board, a second soldering pad (2-15) on the left side of the upper PCB board, a third soldering pad (2-16) on the left side of the upper PCB board, a fourth soldering pad (2-17) on the left side of the upper PCB board, a sixth connecting wire (2-18), an upper PCB board assembly alignment groove (2-19), a temperature sensor (2-20) and a top view structural symmetry axis (2-21) of the upper PCB board.

3. The accelerometer according to claim 2, wherein: The upper PCB assembly limiting groove (2-1) is used to cooperate with the packaging tube shell (6) to complete the assembly; the upper PCB right gold wire pad (2-2), the upper PCB left gold wire pad (2-3) and the upper PCB gold wire passing groove (2-4) are used to connect with the electrodes on the pendulum component (3); the upper PCB right first pad (2-8), the upper PCB right second pad (2-9), the upper PCB left first pad (2-14) and the upper PCB left second pad (2-15) are used to form an electrical connection with the main board (5); the upper PCB right third pad (2-16) is used to connect with the main board (5); the upper PCB right third pad (2-17) is used to connect with the main board (5); the upper PCB right third pad (2-18) is used to connect with the main board (5); the upper PCB right third pad (2-19) is used to connect with the main board (5); the upper PCB right third pad (2-15 ... The soldering pad (2-11) and the third soldering pad (2-16) on the left side of the upper PCB board are used to form an electrical connection with the lower PCB board (4); a first connecting wire (2-5) connecting the left gold soldering pad of the upper PCB board to the first soldering pad on the left side of the upper PCB board, a second connecting wire (2-6) connecting the right gold soldering pad of the upper PCB board to the second soldering pad on the left side of the upper PCB board, a third connecting wire (2-6) connecting the first soldering pad on the right side of the upper PCB board to the third soldering pad on the left side of the upper PCB board, and a fourth connecting wire (2-6) connecting the second soldering pad on the right side of the upper PCB board to the third soldering pad on the right side of the upper PCB board. The wire (2-10) is used to connect the right gold wire pad (2-2) of the upper PCB board, the left gold wire pad (2-3) of the upper PCB board, the first pad (2-8) on the right side of the upper PCB board, and the second pad (2-9) on the right side of the upper PCB board to the second pad (2-15) on the left side of the upper PCB board, the first pad (2-14) on the left side of the upper PCB board, the third pad (2-16) on the left side of the upper PCB board, and the third pad (2-11) on the right side of the upper PCB board respectively; the temperature sensor (2-20) is used to detect and provide the internal temperature of the sensor; the left side of the upper PCB board The fourth solder pad (2-17) and the fourth solder pad (2-12) on the right side of the upper PCB are used to form an electrical connection with the main board (5); the fifth connecting wire (2-13) connecting the fourth solder pad on the right side of the upper PCB and the temperature sensor electrode, and the sixth connecting wire (2-18) connecting the fourth solder pad on the left side of the upper PCB and the temperature sensor electrode are used to connect the fourth solder pad (2-12) on the right side of the upper PCB and the fourth solder pad (2-17) on the left side of the upper PCB to the temperature sensor (2-20); the lower side (2-23) of the upper PCB is bonded to the pendulum assembly (3); The upper PCB assembly alignment groove (2-19) is used for accurately assembling the upper PCB (2) and the pendulum assembly (3).

4. The accelerometer according to claim 1, wherein: The pendulum assembly (3) is provided with a first upper PCB board bonding surface (3-1), a second upper PCB board bonding surface (3-2), an upper PCB board bonding surface symmetry axis (3-3), an upper metal pendulum assembly alignment groove (3-5), and an upper quartz resonator upper soldering pad (3-6) on the upper surface; and the pendulum assembly (3) is provided with a lower quartz resonator upper soldering pad (3-7), a lower PCB board bonding surface symmetry axis (3-8), a lower metal pendulum assembly alignment groove (3-9), a first lower PCB board bonding surface (3-10), and a second lower PCB board bonding surface (3-11) on the lower surface.

5. The accelerometer according to claim 4, wherein: The first upper PCB board bonding surface (3-1), the second upper PCB board bonding surface (3-2) and the upper metal pendulum assembly alignment groove (3-5) are respectively arranged symmetrically about the upper PCB board bonding surface symmetry axis (3-3); the first upper PCB board bonding surface (3-1) and the second upper PCB board bonding surface (3-2) are used for assembly with the upper PCB board (2); the upper quartz resonator upper soldering pad (3-6) is used for connecting with an external circuit to excite the upper quartz resonator to generate vibration; the first upper PCB board bonding surface (3-1) and the first lower PCB board bonding surface (3- 10) symmetrical about the symmetry axis (3-4) of the left side view of the pendulum assembly, the second upper PCB board bonding surface (3-2) and the second lower PCB board bonding surface (3-11) are symmetrical about the symmetry axis (3-4) of the left side view of the pendulum assembly; the lower metal pendulum assembly alignment groove (3-9), the first lower PCB board bonding surface (3-10) and the second lower PCB board bonding surface (3-11) are respectively arranged symmetrically about the symmetry axis (3-8) of the lower PCB board bonding surface; the upper pad (3-7) of the lower quartz resonator is used to connect to an external circuit to excite the upper quartz resonator to generate vibration; The upper metal pendulum assembly alignment groove (3-5) and the lower metal pendulum assembly alignment groove (3-9) respectively cooperate with the upper PCB board (2) and the lower PCB board (4) to achieve precise assembly of the upper PCB board (2), the pendulum assembly (3), and the lower PCB board (4).

6. The accelerometer according to claim 1, wherein: The lower PCB board (4) is provided with a lower PCB board assembly limiting groove (4-1), a lower PCB board gold wire passing groove (4-2), a lower PCB board right gold wire pad (4-3), a seventh connecting wire (4-4), a first pad on the right side of the lower PCB board (4-5), a lower PCB board assembly alignment groove (4-6), a lower PCB board left gold wire pad (4-7), an eighth connecting wire (4-8), a first pad on the left side of the lower PCB board (4-9), and a lower PCB board top view structural symmetry axis (4-10).

7. The accelerometer according to claim 6, wherein: The lower PCB board (4) is symmetrically designed about the symmetry axis (4-10) of the lower PCB board's top-view structure; the lower PCB board's gold wire passing slot (4-2), the lower PCB board's right gold wire pad (4-3), and the lower PCB board's left gold wire pad (4-7) are used to connect to the electrodes of the pendulum assembly (3); the lower PCB board's right first pad (4-5) and the lower PCB board's left first pad (4-9) are used to form an electrical connection with the upper PCB board (2); A seventh connecting wire (4-4) connecting the right gold wire pad of the lower PCB board to the first pad on the right side of the lower PCB board, and an eighth connecting wire (4-8) connecting the right gold wire pad of the lower PCB board to the first pad on the left side of the lower PCB board are used to connect the right gold wire pad (4-3) of the lower PCB board and the left gold wire pad (4-7) of the lower PCB board to the first pad on the left side of the lower PCB board (4-9) and the first pad on the right side of the lower PCB board (4-5), respectively; and the upper surface (4-11) of the lower PCB board is bonded to the pendulum assembly (3); The lower PCB assembly alignment groove (4-6) is used to accurately assemble the pendulum assembly (3) and the lower PCB (4).

8. The accelerometer according to claim 1, wherein: The mainboard (5) is provided with a mainboard lead column through hole (5-1), a first solder pad (5-2) on the right side of the mainboard, a second solder pad (5-3) on the right side of the mainboard, a third solder pad (5-4) on the right side of the mainboard, a first solder pad (5-5) on the left side of the mainboard, a second solder pad (5-6) on the left side of the mainboard, and a third solder pad (5-7) on the left side of the mainboard; the mainboard (5) is symmetrically designed about a symmetry axis (5-8) of the mainboard top view structure; the first solder pad (5-2) on the right side of the mainboard, the second solder pad (5-3) on the right side of the mainboard, the third solder pad (5-4) on the right side of the mainboard, the first solder pad (5-5) on the left side of the mainboard, the second solder pad (5-6) on the left side of the mainboard, the third solder pad (5-7) on the left side of the mainboard, and an upper PCB board (2) are electrically connected.

9. The accelerometer according to claim 1, wherein: The package tube shell (6) is provided with a first package tube shell mounting hole (6-1), a package tube shell flange top surface (6-2), a package tube shell assembly limiting groove (6-3), a package tube shell top surface (6-4), a lead post (6-5), a package tube shell ground lead post (6-6), a first package tube shell pendulum assembly mounting plane (6-7), a package tube shell top cover mounting plane (6-8), a package tube shell mainboard mounting plane (6-9), a second package tube shell pendulum assembly mounting plane (6-10), a package tube shell second mounting hole (6-11), a package tube shell inner bottom surface (6-12) and a package tube shell top view structural symmetry axis (6-13); the lead post (6-5) and the package tube shell ground lead post (6-6) pass through the package tube shell flange bottom surface (6-14); except for the package tube shell ground lead post (6-6), the remaining structures are symmetrical about the package tube shell top view structural symmetry axis (6-13).

10. The accelerometer according to claim 6, 8 or 9, characterized in that: The first mounting hole (6-1) of the package tube shell, the upper surface (6-2) of the package tube shell flange, and the second mounting hole (6-11) of the package tube shell are used to fix the accelerometer to the moving carrier; the package tube shell top cover mounting plane (6-8) is used to cooperate with the top cover (1) to finally package the accelerometer as a whole; the lead post (6-5) is electrically insulated from the package tube shell (6), and the lead post (6-5) is electrically connected to the main board (5); the package tube shell assembly limiting groove (6-3) is used to cooperate with the upper PCB board (2) and the lower PCB board (4) to complete the alignment assembly of the watch movement, and at this time, there is a gap between the lower surface (4-12) of the lower PCB board and the upper surface (5-10) of the main board in the main board (5); the package tube shell main board mounting plane (6-9) is used to connect with the main board (5), and there is a gap between the lower surface (5-9) of the main board and the inner bottom surface (6-12) of the package tube shell; the package tube shell ground lead post (6-6) facilitates the package tube shell (6) to be electrically connected to the outside world.

Images