High-temperature reliability test clamp for silicon photodetector chip

Abstract

The invention discloses a silicon optical detector chip high-temperature reliability test fixture, which comprises a bottom plate and a fixture fixed on the bottom plate and used for fixing a silicon optical detector chip to be tested, and further comprises a needle seat fixed on a base adjustably fixed on the bottom plate, and a needle seat fixed on the base adjustably fixed on the bottom plate, the needle seat comprises a first adjusting mechanism used for adjusting the needle seat to move on the X axis, a second adjusting mechanism used for adjusting the needle seat to move on the Y axis and a third adjusting mechanism used for adjusting the needle seat to move on the Z axis. The fourth adjusting mechanism is used for adjusting the rotation of the test probe card; and the test probe card can lead out probe pins towards one side of the clamp, and the probe pins can be in contact with the silicon photodetector chip to be tested. According to the high-temperature reliability test fixture for the silicon optical detector chip, the test probe card can be finely adjusted in the X axis, the Y axis, the Z axis and the rotation direction through the four adjusting mechanisms, so that the probe pin can be in good contact with the tested silicon optical detector chip, and the test accuracy is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a high-temperature reliability test fixture for a silicon photodetector chip. BACKGROUND

[0002] With the advancement of technology, the application field of silicon photodetectors is continuously expanding, and the requirements for their performance are increasingly high. In a high-temperature environment, the performance of the photodetector may be affected, such as an increase in thermal noise, a decrease in sensitivity, and a decrease in response speed. Therefore, conducting high-temperature reliability tests to evaluate the performance changes of the photodetector at high temperatures is crucial to ensure its stability and reliability in actual applications.

[0003] In high-temperature reliability tests, the fixation and positioning of the silicon photodetector are critical. Because the photodetector includes a chip and a coupled fiber stub. The chip has a small area and a small contact pressure welding point: a diameter of 60 um, and the fiber stub is as long as 40 cm. Traditional high-temperature reliability tests of chips generally weld the chip to a substrate, pull the welding point to the substrate, and then lead it out for electrical testing. However, due to the high optical transmission rate of 50 Gbps of this silicon photodetector, using the method of pulling the welding point to the substrate will affect the output signal, resulting in inaccurate testing. If a needle is simply used for piercing, it is not convenient to hold, and the vibration during heating will cause the needle to shift, making it impossible to provide stable fixation and accurate positioning, thereby affecting the accuracy of the test results. SUMMARY

[0004] To address the above-mentioned deficiencies of the prior art, the present application aims to provide a high-temperature reliability test fixture for a silicon photodetector chip, which can fine-tune the XYZ axis and rotational direction of the test probe card through four adjusting mechanisms, thereby ensuring that the probe pins can make good contact with the measured silicon photodetector chip, and improving the accuracy of the test.

[0005] One technical solution adopted by the present application is to provide a high-temperature reliability test fixture for a silicon photodetector chip, which includes a bottom plate and a fixture fixed on the bottom plate for fixing the silicon photodetector chip to be tested, characterized in that it further comprises:

[0006] a needle seat fixed on the base, the base being adjustably fixed on the bottom plate;

[0007] The needle seat includes a first adjusting mechanism for adjusting the movement of the needle seat in the X-axis, a second adjusting mechanism for adjusting the movement of the needle seat in the Y-axis, and a third adjusting mechanism for adjusting the movement of the needle seat in the Z-axis;

[0008] A fourth adjusting mechanism, comprising a connecting block and a rotating shaft, the connecting block being capable of being fixed on the moving end of the third adjusting mechanism and being driven by the third adjusting mechanism to make vertical movement along the Z axis; the rotating shaft being arranged through the connecting block on the side close to the clamp, the rotating shaft being connected with the connecting block through a rotating adjusting mechanism, and the rotating shaft being capable of being driven by the rotating adjusting mechanism to make rotating movement;

[0009] The end of the rotating shaft is fixed with a test probe card, the test probe card being capable of leading out probe pins to one side of the clamp, and the probe pins being capable of contacting the to-be-tested silicon light detector chip.

[0010] Further, the base is a magnetic base, so that the needle seat can be adjusted at any position on the base plate, and the fixing or movement is controlled through a magnetic switch.

[0011] Further, the first adjusting mechanism comprises a first fixed block fixed on the magnetic base, a first guide groove opened on the top of the first fixed block, a first lead screw arranged in the first guide groove, a first handle penetrating through one side of the first fixed block and fixed with one end of the first lead screw, and a first sliding plate matched with the first lead screw and capable of moving in the first guide groove.

[0012] Further, the second adjusting mechanism comprises a second guide groove opened on the top of the first sliding plate, a second lead screw arranged in the second guide groove and perpendicular to the first lead screw, a second handle penetrating through one side of the first sliding plate and fixed with one end of the second lead screw, and a second sliding plate matched with the second lead screw and capable of moving in the second guide groove.

[0013] Further, the third adjusting mechanism comprises a third guide groove opened on the side of the second sliding plate facing the clamp, a third lead screw arranged in the third guide groove, a third handle penetrating through the top of the second sliding plate and fixed with one end of the third lead screw, and a third sliding plate matched with the third lead screw and capable of moving in the third guide groove; the side of the third sliding plate facing the clamp is fixed with a height adjusting plate, and a plurality of array holes are opened on the surface of the height adjusting plate.

[0014] Further, the connecting block can be detachably connected with the height adjusting plate on the array hole to adjust the height of the connecting block in the Z axis.

[0015] Further, the to-be-tested silicon photodetector chip comprises a chip body, a coupling connector fixed at one end of the chip body, and an optical fiber connected with the chip body through the coupling connector.

[0016] Further, the clamp comprises a fixing groove opened at the top of the clamp, the width of the fixing groove is the same as the width of the chip body, the bottom of the fixing groove is composed of a plane and an inclined plane, the included angle between the plane and the inclined plane is a second included angle, and the second included angle is equal to the first included angle.

[0017] Further, the clamp further comprises a fixing piece, and the fixing piece can fix the silicon photodetector chip in the fixing groove.

[0018] Further, the end of the rotating shaft close to the clamp is provided with an extension plate, the extension plate is a stepped plate extending from one side of the probe plate close to the clamp, and the bottom of the stepped plate is fixed with a probe pin fixing block for fixing the probe pins drawn from the test probe card.

[0019] The silicon photodetector chip high-temperature reliability test clamp has at least the following beneficial effects: 1. Through the four adjusting mechanisms, the test probe card can be finely adjusted in the XYZ and rotation directions, so that the probe pins can be in good contact with the to-be-tested silicon photodetector chip, thereby improving the testing accuracy; 2. The fixing groove opened at the top of the clamp makes the to-be-tested silicon photodetector chip fixed on the clamp more firmly, thereby improving the testing stability; 3. The probe pin fixing block at the bottom of the stepped plate fixes the probe pins drawn from the test probe card, further improves the stability of the contact between the probe pins and the silicon photodetector chip, and further improves the testing stability. BRIEF DESCRIPTION OF DRAWINGS

[0020] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0021] Figure 1 It is an embodiment structure diagram of the silicon optical detector chip high temperature reliability test fixture of the application.

[0022] Figure 2 It is a front view of an embodiment of the needle holder of the application.

[0023] Figure 3 It is Figure 2 A sectional view in the direction of A-A.

[0024] Figure 4 It is Figure 2 A sectional view in the direction of B-B.

[0025] Figure 5 It is a side view of an embodiment of the needle holder of the application.

[0026] Figure 6 It is Figure 5 A sectional view in the direction of C-C.

[0027] Figure 7 It is a structure diagram of the fourth adjusting mechanism of the application.

[0028] Figure 8 It is Figure 1 A local enlarged view at D.

[0029] Figure 9 It is a structure diagram of the silicon optical detector chip to be tested of the application.

[0030] Figure 10 It is a structure diagram of the fixture of the application.

[0031] Figure 11 It is a structure diagram of the step plate and the probe pin fixing block of the application.

[0032] Explanation of reference signs:

[0033] Base plate-1; base-2; fixture-3; fixing groove-31; fixing sheet-32; first fixing block-41; first guide groove-42; first lead screw-43; first handle-44; first sliding plate-45; second guide groove-51; second lead screw-52; second handle-53; second sliding plate-54; third guide groove-61; third lead screw-62; third handle-63; third sliding plate-64; height adjusting plate-65; array hole-651; connecting block-71; rotating shaft-72; step plate-721; probe pin fixing block-722; torsional spring-73; rotating block-74; index rod-75; test probe card-8; probe pin-81; chip body-91; coupling joint-92; optical fiber-93. DETAILED DESCRIPTION

[0034] The application will be further described below with reference to the drawings.

[0035] Referring to Figure 1 The application provides a high-temperature reliability test fixture for a silicon photodetector chip, which specifically comprises a bottom plate 1 and a fixture 3 fixed on the bottom plate 1 and used for fixing a silicon photodetector chip to be tested, further comprising a needle seat fixed on a base 2, wherein the base 2 is adjustably fixed on the bottom plate 1; the needle seat comprises a first adjusting mechanism used for adjusting movement of the needle seat on an X-axis, a second adjusting mechanism used for adjusting movement of the needle seat on a Y-axis and a third adjusting mechanism used for adjusting movement of the needle seat on a Z-axis; a fourth adjusting mechanism comprises a connecting block 71 and a rotating shaft 72, the connecting block 71 is capable of being fixed on a moving end of the third adjusting mechanism and is driven by the third adjusting mechanism to move vertically on the Z-axis, the rotating shaft 72 is arranged through one side of the connecting block 71 close to the fixture 3, the rotating shaft 72 is connected with the connecting block 71 through a rotating adjusting mechanism, and the rotating shaft 72 is capable of being driven by the rotating adjusting mechanism to rotate, and a test probe card 8 is fixed on the end of the rotating shaft 72, the test probe card 8 is capable of leading probe pins 81 to one side of the fixture 3, and the probe pins 81 are capable of contacting the silicon photodetector chip to be tested. The test fixture is capable of realizing translation of the test probe card 8 on XYZ axes and rotation of the test probe card 8 on the X-axis through the four adjusting mechanisms, so as to ensure that the probe pins 81 are capable of contacting the silicon photodetector chip to be tested well, thereby improving the accuracy and stability of the test.

[0036] In some embodiments, the base 2 is a magnetic base, so that the needle seat is capable of being adjusted at an arbitrary position on the bottom plate 1 and is controlled to be fixed or moved through a magnetic switch. The base 2 is capable of being adjusted at an arbitrary position on the bottom plate 1, and after adjustment, the magnetic switch is opened to be adsorbed on the bottom plate 1, which is beneficial to alignment and debugging of the silicon photodetector chip and the probe pins 81. It should be noted that the base 2 only provides preliminary adjustment of the position of the test probe card 8, and in order to ensure the position accuracy of the test probe card 8, fine adjustment of the four adjusting mechanisms is further needed.

[0037] Referring to Figure 2 and Figure 3The first adjusting mechanism comprises a first fixed block 41 fixed on the magnetic base, a first guide slot 42 opened on the top of the first fixed block 41, a first screw rod 43 arranged in the first guide slot 42, a first handle 44 penetrating through one side of the first fixed block 41 and fixed with one end of the first screw rod 43, and a first sliding plate 45 matched with the first screw rod 43 and capable of moving in the first guide slot 42. The first adjusting mechanism is mainly used for adjusting the position of the test probe card 8 in the X axis, and thus the structure can be a screw rod sliding table mechanism. The structure can transmit the rotation applied on the first handle 44 to the first screw rod 43, the rotation of the first screw rod 43 can drive the first sliding plate 45 matched with the first screw rod 43 to move in the first guide slot 42 in a reciprocating straight line, and the first guide slot 42 is arranged in the X axis direction. Thus, the first sliding plate 45 can adjust the position in the X axis under the rotation of the first handle 44, so as to adjust the position of the test probe card 8 in the X axis. In addition, in order to improve the accuracy of the position adjustment, the screw rod in the screw rod sliding table mechanism can be a precision screw rod.

[0038] Please refer to Figure 5 and Figure 6 The second adjusting mechanism comprises a second guide slot 51 opened on the top of the first sliding plate 45, a second screw rod 52 arranged in the second guide slot 51 and perpendicular to the first screw rod 43, a second handle 53 penetrating through one side of the first sliding plate 45 and fixed with one end of the second screw rod 52, and a second sliding plate 54 matched with the second screw rod 52 and capable of moving in the second guide slot 51. The structure of the second adjusting mechanism can be the same as that of the first adjusting mechanism, and the difference is that the direction of the second adjusting mechanism is different. That is, the first sliding plate 45 of the first adjusting mechanism is used as the fixed block, the second guide slot 51 is opened on the top of the first sliding plate 45 and arranged in the Y axis direction perpendicular to the X axis, and the second screw rod 52 and the second sliding plate 54 are also arranged in the Y direction. Thus, the second sliding plate 54 can adjust the position in the Y axis along the second guide slot 51, so as to adjust the position of the test probe card 8 in the Y axis.

[0039] Please refer to Figure 4The third adjusting mechanism comprises a third guide slot 61 opened on the side of the second sliding plate 54 facing the clamp 3, a third screw rod 62 arranged in the third guide slot 61, a third handle 63 penetrating through the top of the second sliding plate 54 and fixed with one end of the third screw rod 62, and a third sliding plate 64 matched with the third screw rod 62 and capable of moving in the third guide slot 61; the side of the third sliding plate 64 facing the clamp 3 is fixed with a height adjusting plate 65, and the surface of the height adjusting plate 65 is provided with a plurality of array holes 651. Referring to the first adjusting mechanism and the second adjusting mechanism, the transmission process of the third adjusting mechanism is completely same as that of the first adjusting mechanism and the second adjusting mechanism, and the difference is that the third adjusting mechanism takes the second sliding plate 54 as the fixed block, and the third adjusting mechanism is used for adjusting the position of the test probe card 8 in the Z axis, so that the third guide slot 61, the third screw rod 62 and the third sliding plate 64 are arranged along the Z axis. In addition, in order to facilitate the connection with the connecting block 71 of the fourth adjusting mechanism, the third adjusting mechanism is used as the mechanism connected with the fourth adjusting mechanism on the needle seat, and the movement end of the third adjusting mechanism, i.e. the side of the third sliding plate 64 facing the clamp 3, is fixed with the height adjusting plate 65, and the surface of the height adjusting plate 65 is provided with a plurality of array holes 651.

[0040] Therefore, according to the structures of the first adjusting mechanism, the second adjusting mechanism and the third adjusting mechanism, the three mechanisms can respectively independently fine-tune the positions of the test probe card 8 in the XYZ axes without affecting each other.

[0041] Please refer to Figure 7The connecting block 71 can be detachably connected with the third sliding plate 64 on the array hole 651 to adjust the height of the connecting block 71 on the Z axis; the rotation adjusting mechanism comprises a torsion spring 73, a rotating block 74 and a indexing rod 75; the torsion spring 73 is sleeved on the rotating shaft 72, and one end of the torsion spring 73 is fixed in the connecting block 71, and the other end is fixed on the rotating shaft 72; the connecting block 71 is fixed on the rotating shaft 72; the indexing rod 75 penetrates through the top of the connecting block 71 and is threadedly connected with the connecting block 71; the connecting block 71 can contact the bottom end of the indexing rod 75 in the rotation process of the indexing rod 75 and drive the rotating shaft 72 to rotate. The above-mentioned first adjusting mechanism, second adjusting mechanism and third adjusting mechanism can only adjust the horizontal displacement of the test probe card 8, and when the test probe card 8 is fixed, there is an included angle relative to the horizontal plane, which cannot be adjusted by the first adjusting mechanism, second adjusting mechanism and third adjusting mechanism, so a fourth adjusting mechanism capable of adjusting the fixed angle of the test probe card 8 is further arranged. The fourth adjusting mechanism is detachably connected with the array hole 651 through the connecting block 71, and since the array hole 651 is a plurality of mounting holes, the fourth adjusting mechanism can be installed according to the actual height requirement of the test probe card 8, so that the position of the test probe card 8 on the Z axis can be adjusted in advance, and then the fine adjustment of the third adjusting mechanism is matched, so as to further improve the position adjustment precision of the test probe card 8 and ensure the accuracy of the test.

[0042] Please refer to Figure 8 and Figure 9 The to-be-tested silicon light detector chip comprises a chip body 91, a coupling connector 92 fixed at one end of the chip body 91, and an optical fiber 93 connected with the chip body 91 through the coupling connector 92; the coupling connector 92 and the chip body 91 form a first included angle. The to-be-tested silicon light detector chip mainly comprises the chip body 91, the coupling connector 92 and the optical fiber 93, wherein the chip body 91 is a component that needs to be in contact with the probe pin 81 for testing, and the coupling connector 92 is a connecting piece between the chip body 91 and the optical fiber 93.

[0043] Please refer to Figure 10The fixture 3 comprises a fixing groove 31 formed on the top of the fixture 3, the width of the fixing groove 31 is the same as the width of the chip body 91, the bottom of the fixing groove 31 is composed of a plane and an inclined plane, the included angle between the plane and the inclined plane is a second included angle, and the second included angle is equal to the first included angle. Since the coupling joint 92 of the silicon photodetector chip to be tested and the chip body 91 form the first included angle, in order to improve the stability of the silicon photodetector chip to be tested in the fixing groove 31, the contact surface of the fixture 3 and the silicon photodetector chip to be tested is set to the same shape, that is, the width of the fixing groove 31 is set to be the same as the width of the chip body 91, the two sides of the chip body 91 are clamped, the bottom of the fixing groove 31 is set to be connected with the inclined plane in the form of a plane, and the included angle between the plane and the inclined plane is set to be the same as the first included angle, so as to match the included angle between the chip body 91 and the coupling joint 92. By setting in this way, the chip body 91 and the coupling joint 92 are tightly fitted with the fixing groove 31, and the stability of the silicon photodetector chip to be tested during fixing is improved.

[0044] In some embodiments, the fixture 3 further comprises a fixing sheet 32, which can fix the silicon photodetector chip in the fixing groove 31. In order to further improve the stability of the silicon photodetector chip to be tested during fixing, the fixture 3 can further be provided with a fixing sheet 32, which can be detachably connected with the top of the fixture 3 through a bolt, and the fixing sheet 32 is provided with an opening at a position corresponding to the chip body 91 during fixing, which can ensure that the chip body 91 is not completely closed by the fixing sheet 32, so that there is a contact space between the probe pin 81 and the chip body 91, thereby ensuring the smooth progress of the test.

[0045] Please refer to Figure 11 The extension plate is a stepped plate 721 extending from one side of the probe plate close to the fixture 3; the bottom of the stepped plate 721 is fixed with a probe pin fixing block 722 for fixing the probe pin 81 extending from the test probe card 8. The stepped plate 721 is used for mounting the test probe card 8, and the probe pin 81 extending from the test probe card 8 can fix its position through a probe pin fixing block 722, thereby improving the stability of the contact between the probe pin 81 and the chip body 91, and further improving the test effect. A plurality of through holes can be formed in the probe pin fixing block 722, so that the probe pin 81 can complete the fixation of the position through the through holes.

[0046] The specific test steps of the test fixture are as follows: first, the chip body 91 is placed in the fixing groove 31 of the fixture 3 and fixed by the fixing piece 32; next, the needle seat is installed on the base 2, the base 2 is placed on the bottom plate 1, the position of the base 2 is coarsely adjusted according to the position of the fixture 3, so that the probe pin 81 can approach the chip body 91, the magnetic attraction switch is opened to fix the base 2 on the bottom plate 1; next, according to the position difference of the probe pin 81 and the chip body 91 on the Z axis, the array hole 651 with a suitable height is selected to install the connecting block 71, so that the probe pin 81 can approach the chip body 91 on the Z axis; next, according to the positions of the probe pin 81 and the chip body 91, the first handle 44 and / or the second handle 53 and / or the third handle 63 are adjusted, so that the position of the probe pin 81 on the XYZ axis is finely adjusted, until the probe pin 81 can contact the test point on the chip body 91.

[0047] The silicon photodetector chip high-temperature reliability test fixture provided by the application can finely adjust the test probe card 8 in XYZ and rotation directions through four adjusting mechanisms, so that the probe pin 81 can be in good contact with the measured silicon photodetector chip, thereby improving the accuracy of the test; the fixture 3 is provided with the fixing groove 31 at the top, so that the measured silicon photodetector chip is more firmly fixed on the fixture 3, thereby improving the stability of the test; meanwhile, the probe pin fixing block 722 at the bottom of the stepped plate 721 can fix the probe pin 81 drawn from the test probe card 8, thereby further improving the stability of the contact between the probe pin 81 and the silicon photodetector chip, and further improving the stability of the test.

[0048] The above only expresses the preferred embodiments of the application, which are described in detail, but cannot be understood as limiting the scope of the patent. It should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the application, several modifications and improvements can be made, which all belong to the protection scope of the application. Therefore, the protection scope of the patent of the application should be subject to the appended claims.

Claims

1. A high-temperature reliability test fixture for a silicon photodetector chip, comprising a base plate and a fixture, wherein the fixture is fixed on the base plate and is used to fix the silicon photodetector chip to be tested, characterized in that: Also includes: The needle holder is fixed on the base, and the base is adjustably fixed on the bottom plate; The needle seat includes a first adjustment mechanism for adjusting the movement of the needle seat in the X axis, a second adjustment mechanism for adjusting the movement of the needle seat in the Y axis, and a third adjustment mechanism for adjusting the movement of the needle seat in the Z axis; a fourth adjustment mechanism comprising a connecting block and a rotating shaft, wherein the connecting block can be fixed to the moving end of the third adjustment mechanism and driven by the third adjustment mechanism to perform vertical movement along the Z axis; the rotating shaft is provided through a side of the connecting block close to the clamp, the rotating shaft is connected to the connecting block via the rotating adjustment mechanism, and the rotating shaft can be driven by the rotating adjustment mechanism to perform rotational movement; A test probe card is fixed to the end of the rotating shaft. The test probe card can lead out probe pins toward one side of the fixture, and the probe pins can contact the silicon photodetector chip to be tested.

2. The high-temperature reliability test fixture for silicon photodetector chips according to claim 1, characterized in that: The base is a magnetic base, so that the needle seat can be adjusted to any position on the bottom plate and can be fixed or moved by a magnetic switch.

3. The high temperature reliability test fixture for silicon photodetector chips according to claim 2, characterized in that: The first adjustment mechanism includes a first fixed block fixed on the magnetic base, a first guide groove opened on the top of the first fixed block, a first screw arranged in the first guide groove, a first handle passing through one side of the first fixed block and fixed to one end of the first screw, and a first slide cooperated with the first screw and capable of moving in the first guide groove.

4. The high temperature reliability test fixture for silicon photodetector chips according to claim 3, wherein: The second adjustment mechanism includes a second guide groove opened at the top of the first slide, a second screw arranged in the second guide groove and the second screw and the first screw are perpendicular to each other, a second handle passing through one side of the first slide and fixed to one end of the second screw, and a second slide cooperating with the second screw and capable of moving in the second guide groove.

5. The high temperature reliability test fixture for silicon photodetector chips according to claim 4, characterized in that: The third adjustment mechanism includes a third guide groove provided on the side of the second slide facing the clamp, a third lead screw arranged in the third guide groove, a third handle passing through the top of the second slide and fixed to one end of the third lead screw, and a third slide cooperating with the third lead screw and capable of moving in the third guide groove; a height adjustment plate is fixed to the side of the third slide facing the clamp, and a plurality of array holes are provided on the surface of the height adjustment plate.

6. The high-temperature reliability test fixture for silicon photodetector chips according to claim 5, characterized in that: The connecting block can be detachably connected to the height adjustment plate on the array hole to adjust the height of the connecting block on the Z axis; the rotation adjustment mechanism includes a torsion spring, a rotating block and a dividing rod; the torsion spring is sleeved on the rotating shaft, and one end of the torsion spring is fixed to the inside of the connecting block, and the other end is fixed to the rotating shaft; the connecting block is fixed to the rotating shaft; the dividing rod passes through the top of the connecting block and is threadedly connected to the connecting block; the connecting block can contact the bottom end of the dividing rod during the rotation of the dividing rod and drive the rotating shaft to rotate.

7. The high-temperature reliability test fixture for silicon photodetector chips according to claim 1, wherein: The silicon photodetector chip to be tested includes a chip body, a coupling joint fixed at one end of the chip body, and an optical fiber connected to the chip body through the coupling joint; a first angle is formed between the coupling joint and the chip body.

8. The high-temperature reliability test fixture for silicon photodetector chips according to claim 7, wherein: The fixture includes a fixing groove opened on the top of the fixture, the width of the fixing groove is the same as the width of the chip body, the bottom of the fixing groove is composed of a plane and an inclined surface, the angle between the plane and the inclined surface is a second angle, and the second angle is equal to the first angle.

9. The high-temperature reliability test fixture for silicon photodetector chips according to claim 8, wherein: The fixture further includes a fixing plate, and the fixing plate can fix the silicon photodetector chip in the fixing groove.

10. The high-temperature reliability test fixture for silicon photodetector chips according to claim 1, wherein: An extension plate is provided at the end of the rotating shaft near the clamp, and the extension plate is a stepped plate extending from one side of the probe board near the clamp; a probe pin fixing block is fixed at the bottom of the stepped plate for fixing the probe pins led out from the test probe card.

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