Current detection device and electronic equipment

Abstract

The embodiment of the invention provides a current detection device and electronic equipment, and relates to the technical field of current detection, and the current detection device comprises a magnetic sensor and an electric shielding layer. The magnetic sensor is used for detecting current on a to-be-detected wire and comprises a magnetic head and an application-specific integrated circuit, the magnetic head is used for sensing a magnetic field generated by the current of the to-be-detected wire, and the application-specific integrated circuit is used for processing a magnetic field signal sensed by the magnetic head; the electric shielding layer is located between the wire to be tested and the application-specific integrated circuit in the first direction, the electric shielding layer is grounded, and a plurality of holes are formed in the electric shielding layer and penetrate through the electric shielding layer in the first direction. The electric shielding layer not only can shield an electric field generated by the current to be detected so as to avoid influence on a special integrated circuit, but also can avoid generation of eddy current so as to avoid distortion and a phase delay effect of a parasitic magnetic field generated by the eddy current on an original magnetic field generated by the current to be detected, so that the detection precision of the magnetic sensor is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of current detection, and particularly relates to a current detection device and an electronic device. BACKGROUND

[0002] In some power converters in the prior art, the precision of some currents flowing therethrough is very high, and therefore a current detection device is needed to detect the to-be-detected current. The current detection device can detect the size of the to-be-detected current by detecting the magnetic field generated by the to-be-detected current. However, since a plurality of electronic elements are arranged in the power converter, various electric fields and magnetic fields interfere with each other, which causes the precision of the current detection device in detecting the to-be-detected current to deviate, and easily causes a safety hazard. SUMMARY

[0003] Embodiments of the present application provide a current detection device and an electronic device to improve the detection precision of a to-be-detected current.

[0004] In a first aspect, embodiments of the present application provide a current detection device. The current detection device comprises a magnetic sensor and an electric shielding layer. The magnetic sensor is configured to detect a current on a to-be-detected wire. The magnetic sensor comprises a magnetic head and an application specific integrated circuit. The magnetic head is configured to sense a magnetic field generated by the current on the to-be-detected wire. The application specific integrated circuit is configured to process a magnetic field signal sensed by the magnetic head. The electric shielding layer is located between the to-be-detected wire and the application specific integrated circuit along a first direction. The electric shielding layer is grounded. A plurality of holes are arranged on the electric shielding layer. The plurality of holes penetrate the electric shielding layer along the first direction.

[0005] In the embodiment, the electric shielding layer is located between the to-be-detected wire and the ASIC along a first direction, and the first direction is the arrangement direction of the to-be-detected wire and the ASIC. In addition, the electric shielding layer is grounded, so that the electric potential of the electric shielding layer is zero, thereby the static electricity can be rapidly discharged through the electric shielding layer, and the electric field generated by the to-be-detected current can be intercepted, so as to realize electric shielding. In addition, since the electric shielding layer is provided with a plurality of holes, the plurality of holes penetrate the electric shielding layer in the first direction, that is, the depth direction of the holes on the electric shielding layer is consistent with the thickness direction of the electric shielding layer, so that the depth direction of the holes on the electric shielding layer is substantially perpendicular to the magnetic induction lines parallel to the surface of the electric shielding layer, thereby the vortex electric field on the electric shielding layer can be effectively cut off through the holes on the electric shielding layer, so as to physically cut off the vortex current path, thereby the generation of vortex current can be effectively blocked. In addition, under the premise of ensuring the detection accuracy of the current detection device to the to-be-detected current, the overall size of the device can also be saved, because the electric shielding layer is provided with a plurality of holes, the damage of vortex current can be effectively avoided or reduced, so that it is not necessary to worry about the overheat of the electric shielding layer caused by the vortex current generated on the electric shielding layer or the interference of the vortex current to the ASIC, and it is not necessary to specially leave a safety distance between the to-be-detected wire and the electric shielding layer or between the electric shielding layer and the ASIC, so that the distance between the to-be-detected wire and the electric shielding layer and the distance between the electric shielding layer and the ASIC can be effectively shortened, the overall size of the device can be saved, and the overall miniaturization design of the electronic equipment is facilitated. Therefore, the electric shielding layer in the embodiment not only can shield the electric field generated by the to-be-detected current to avoid the influence on the ASIC, but also can avoid the generation of vortex current to avoid the distortion of the parasitic magnetic field generated by the vortex current to the original magnetic field generated by the to-be-detected current and the phase delay effect, so as to ensure the integrity of the original magnetic field generated by the to-be-detected current, and further improve the detection accuracy of the magnetic sensor, and the current detection device is also beneficial to saving the overall size.

[0006] In some embodiments, the electric shielding layer is formed by connecting a plurality of wires, and a plurality of holes are formed between the plurality of wires. Since the electric shielding layer is formed by connecting a plurality of wires, first, the gap between the wires naturally blocks the formation of a large range of vortex current, and under the dominance of the skin effect, the vortex current can be effectively limited within a single wire, and the loss is also greatly reduced. In addition, since the electric shielding layer is formed by connecting a plurality of wires, the spacing between the wires can be adjusted to control the electric field shielding capability, so as to adjust the electric field shielding capability in different use scenarios according to the needs.

[0007] In some embodiments, the plurality of wires includes a plurality of first wires and a second wire connected to each of the plurality of first wires, the plurality of first wires are arranged side by side and spaced apart, and the plurality of first wires have a same extension direction, and a plurality of holes are formed between the plurality of first wires. The second wire is connected to each of the plurality of first wires, so that any of the plurality of first wires or the second wire can be grounded, and all the wires constituting the electric shielding net can be grounded, thereby effectively reducing the grounding complexity of the electric shielding layer.

[0008] In some embodiments, the second wire is connected to an end of the plurality of first wires in the extension direction. The second wire is located at one end of the plurality of first wires in the extension direction, so that the length of the long hole in the extension direction of the first wire is as long as possible, thereby achieving a better effect of cutting off the eddy current path.

[0009] In some embodiments, the plurality of wires includes a plurality of first wires and a plurality of second wires connected to the plurality of first wires, the plurality of first wires are arranged side by side and spaced apart, and the plurality of first wires have a same extension direction, the plurality of second wires are arranged side by side and spaced apart, and the plurality of second wires have a same extension direction, the extension direction of the plurality of first wires and the extension direction of the plurality of second wires are arranged at an angle, and the plurality of first wires and the plurality of second wires enclose a plurality of holes. Since the electric shielding layer is formed by connecting the plurality of first wires and the plurality of second wires, the plurality of first wires and the plurality of second wires can support each other to form a net structure, thereby the electric shielding layer can be pre-prepared, and the prepared electric shielding layer can be arranged between the to-be-detected wire and the application-specific integrated circuit, thereby improving the preparation efficiency of the current detection device.

[0010] In some embodiments, at least one second wire is connected to each of the plurality of first wires, so that any of the plurality of first wires or the plurality of second wires can be grounded, and all the wires constituting the electric shielding net can be grounded, thereby effectively reducing the grounding complexity of the electric shielding layer.

[0011] In some embodiments, the electric shielding layer includes a plurality of hole plate pieces, each hole plate piece has a hole penetrating in the first direction, and the plurality of hole plate pieces are spliced. Since the electric shielding layer is formed by splicing a plurality of pre-prepared hole plate pieces, the shape of the electric shielding layer can be flexibly set according to requirements. Moreover, since the hole needs to be pre-prepared on the hole plate piece, the machining precision is not required to be too high when splicing the plurality of hole plate pieces, thereby improving the machining efficiency of the electric shielding layer.

[0012] In some embodiments, the magnetic sensor further comprises a package, the ASIC is located in the package, and the electric shielding layer is located in the package and on the side of the ASIC facing the wire to be measured. By encapsulating the electric shielding layer in the package, the electric shielding layer is in close contact with the ASIC, and the protection range can be more accurately controlled. Moreover, the electric shielding layer can effectively intercept external interference electric fields before they arrive, thereby effectively reducing the risk of edge leakage.

[0013] In some embodiments, the current detection device further comprises a magnetic shielding shell surrounding the periphery of the magnetic sensor, the magnetic shielding shell has an open frame structure with openings at both ends in the first direction, and the magnetic sensor is directly opposite the openings in the first direction. Since the magnetic shielding shell has openings at both ends in the first direction, and the openings are directly opposite the magnetic sensor in the first direction, and the first direction is the arrangement direction of the magnetic sensor and the wire to be measured, the magnetic induction lines generated by the current to be measured will not be affected by the magnetic shielding shell when passing through the upper and lower sides of the magnetic sensor in the first direction due to the skin effect, thereby greatly ensuring the integrity of the original magnetic field generated by the current to be measured, and the magnetic shielding shell can also shield external magnetic fields other than the original magnetic field generated by the current to be measured.

[0014] In some embodiments, the wire to be measured extends in a second direction, a direction orthogonal to the first direction and the second direction is a third direction, the magnetic shielding shell comprises a first plate and a second plate located on both sides of the magnetic sensor in the second direction and a third plate and a fourth plate located on both sides of the magnetic sensor in the third direction, and the first plate, the second plate, the third plate, and the fourth plate are connected to form an open frame with openings at both ends in the first direction. By shielding most of the external magnetic field interference other than the original magnetic field generated by the current to be measured in the second direction through the first plate and the second plate, and by shielding most of the external magnetic field interference other than the original magnetic field generated by the current to be measured in the third direction through the third plate and the fourth plate.

[0015] In some embodiments, the magnetic shielding shell further comprises a plurality of baffles located at the end of the open frame away from the wire to be measured, the plurality of baffles are respectively located at the corners of the open frame, and the plurality of baffles are spaced apart from each other. Since the plurality of baffles are respectively located at the corners of the open frame, the baffles can avoid affecting the magnetic induction lines generated by the current to be measured from being attracted and gathered by the baffles, and can avoid affecting the original magnetic field generated by the current to be measured, thereby ensuring the integrity of the induction of the original magnetic field generated by the current to be measured by the magnetic head of the magnetic sensor. At the same time, by providing the plurality of baffles, the ability of the magnetic shielding shell to shield the magnetic induction lines of external magnetic fields can be improved, thereby improving the accuracy of the magnetic sensor in detecting the current to be measured.

[0016] In some embodiments, the current detection device further comprises a magnetic concentrator, which is arranged on a track of magnetic induction lines formed by the current of the to-be-detected wire. By arranging the magnetic concentrator on the track of magnetic induction lines formed by the current of the to-be-detected wire, the magnetic induction lines generated by the current of the to-be-detected wire can be effectively utilized, and the detection accuracy of the magnetic sensor to the current of the to-be-detected wire can be improved.

[0017] In some embodiments, the to-be-detected wire extends in a second direction, and a direction orthogonal to the first direction and the second direction is a third direction. In the third direction, the magnetic head of the magnetic sensor is arranged on both sides of the magnetic concentrator, and in the third direction, the magnetic head and the magnetic concentrator at least partially overlap. Since the magnetic head and the magnetic concentrator at least partially overlap in the third direction, that is, the magnetic head and the magnetic concentrator are located at substantially the same height in the first direction, the magnetic induction lines collected by the magnetic concentrator can be effectively sensed by the magnetic head of the magnetic sensor, so as to improve the utilization rate of the magnetic sensor to the primary magnetic field generated by the current of the to-be-detected wire, and improve the detection accuracy of the magnetic sensor to the current of the to-be-detected wire.

[0018] In the second aspect, the embodiments of the present application provide an electronic device. The electronic device comprises a circuit board and the current detection device according to any one of the first aspect. The to-be-detected wire is a wire arranged on the circuit board. The magnetic sensor is arranged on the circuit board. The electric shielding layer is arranged on the circuit board and located between the wire and the magnetic sensor in the thickness direction of the circuit board.

[0019] In the third aspect, the embodiments of the present application provide an electronic device. The electronic device comprises a circuit board and the current detection device according to any one of the first aspect. The to-be-detected wire is a wire arranged on the circuit board. The magnetic sensor is arranged on the circuit board. The magnetic shielding shell is arranged on the circuit board, and an opening of one end of the magnetic shielding shell facing the circuit board is covered by the circuit board.

[0020] In some embodiments, the magnetic shielding shell is integrated on the circuit board. Since the magnetic shielding shell is arranged on the circuit board, the overall thickness of the electronic device is not affected, so that the magnetic shielding shell can be integrated on the circuit board, and the integration degree of the electronic device as a whole can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the description of the embodiments or the prior art will be briefly introduced.

[0022] Figure 1 FIG. 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0023] Figure 2An embodiment provides a structural schematic diagram of an electronic detection device;

[0024] Figure 3 Another structural schematic diagram of a current detection device is provided for an embodiment of the present application.

[0025] Figure 4 A structural schematic diagram of an electric shielding layer of a current detection device is provided for another embodiment of the present application.

[0026] Figure 5 A structural schematic diagram of a current detection device is provided for another embodiment of the present application.

[0027] Figure 6 A structural schematic diagram of a current detection device is provided for another embodiment of the present application.

[0028] Figure 7 A structural schematic diagram of a current detection device is provided for another embodiment of the present application.

[0029] Figure 8 A structural schematic diagram of a current detection device is provided for another embodiment of the present application.

[0030] Explanation of reference signs:

[0031] Z, first direction; X, second direction; Y, third direction;

[0032] 1000, electronic device; 100, shell; 200, functional module; 300, circuit board; 400, electronic element; 500, switch assembly; 600, input connecting piece; 700, output connecting piece; 800, current detection device; 900, wire to be detected;

[0033] 10, magnetic sensor; 11, package; 12, magnetic head; 13, application specific integrated circuit;

[0034] 20, electric shielding layer; 201, hole; 21, wire; 211, first wire; 212, second wire; 22, hole plate;

[0035] 30, magnetic shielding shell; 301, opening; 31, first plate; 32, second plate; 33, third plate; 34, fourth plate; 35, frame; 36, baffle;

[0036] 40, magnetic concentrator. DETAILED DESCRIPTION

[0037] The following first explains some terms related to embodiments of the present application.

[0038] The terms "first", "second", "third", "fourth", and the like in the description and in the claims of the present application and above-described drawings merely denote similar objects without necessarily indicating a specific order or sequence. It is to be understood that the data thus used in the description can be interchanged, where appropriate, so that the embodiments of the present application described herein can be carried out in other sequences than the ones described herein. Moreover, the terms "comprising", "having", "including" and any variations thereof in the description and in the claims of the present application are intended to cover the instance not only in the case of literal inclusion, but also in the case of inclusion of equivalent or similar objects to the extent permitted by the prior art.

[0039] In the present specification, the terms "vertical", "parallel" and the like are explained.

[0040] Vertical: The vertical defined in the present application is not limited to the absolute vertical intersection (the angle is 90 degrees) relationship, and allows the relationship that is not the absolute vertical intersection due to factors such as assembly tolerance, design tolerance, and the influence of structure flatness, and allows the existence of a small angle range of error, for example, within the assembly error range of 80 degrees to 100 degrees, which can be understood as a vertical relationship.

[0041] Parallel: The parallel defined in the present application is not limited to absolute parallel, and the definition of this parallel can be understood as substantially parallel, allowing the case that is not absolutely parallel due to factors such as assembly tolerance, design tolerance, and the influence of structure flatness, which will lead to the case that the sliding fit part and the first door plate are not absolutely parallel, but the present application also defines that this case is parallel.

[0042] It should be noted that the drawings involved in the following are schematic drawings, and the specific shapes in the drawings are not the specific shapes to be protected by the present application.

[0043] Figure 1 A structural schematic diagram of an electronic device 1000 provided by an embodiment of the present application, Figure 1 The electronic device 1000 in the above can be any device provided with a current detection device 800, such as Figure 1 The electronic device 1000 in the above can be a device in the photovoltaic field, the wind power generation field, and the new energy power generation field, and can also be a device in the electric vehicle field and the like, such as a DC / DC converter or a DC / AC converter and the like.

[0044] Taking the electronic device 1000 as an example, the power converter includes a shell 100, a functional module 200, a switch assembly 500, an input connector 600 and an output connector 700. The input connector 600 is used to be electrically connected with an external DC source. The switch assembly 500 is electrically connected between the input connector 600 and the functional module 200, and is used to control the on-off of the current between the input connector 600 and the functional module 200. Specifically, the input end of the functional module 200 is used to be electrically connected with the switch assembly 500, and the output end of the functional module 200 is electrically connected with the output connector 700. The output connector 700 is used to be electrically connected with an external load. In the embodiment, the current of the external DC source flows from the input connector 600 to the switch assembly 500, and then flows from the switch assembly 500 to the functional module 200. The current converted by the functional module 200 is output to the external load through the output connector 700, thereby forming a working path of the power converter. The normal working of the switch assembly 500 on the working path has a great influence on the safety of the use of the power converter. The external DC source can be photovoltaic power generation, wind power generation, etc. The load can be a user's power equipment or a power storage equipment such as an energy storage equipment.

[0045] It can be understood that the shape of the shell 100 in the embodiment is not limited, and can be a regular shape such as a substantially rectangular body shape, a cylindrical shape, etc., or an irregular shape, which can be set according to requirements.

[0046] In some embodiments, as shown in Figure 1 The functional module 200 includes a circuit board 300 and electronic elements 400 integrated on the circuit board 300, such as one or more of transistors, capacitors, inductors, diodes, rectifier bridges, drive circuits, control circuits, resistors, voltage stabilizers, relays, filter capacitors and processors. Of course, other electronic elements 400 can also be included.

[0047] It can be understood that, according to the integration of electronic elements 400 with different functions on the circuit board 300, the functional module 200 can realize different functions, such as, in some embodiments, the electronic elements 400 integrated on the circuit board 300 can convert DC power into AC power, such as converting DC power generated by a photovoltaic module into AC power through the functional module 200, and then outputting the AC power to a load through the output connector 700. In some embodiments, the electronic elements 400 integrated on the circuit board 300 can convert AC power into DC power. In some embodiments, the electronic elements 400 integrated on the circuit board 300 can function as voltage conversion (from high voltage to low voltage or from low voltage to high voltage). It should be noted that the accompanying Figure 1The positions of the input end of the electronic component 400 and the functional module 200 and the output end of the functional module 200 are illustrative and not necessarily arranged at the positions shown in the figures. Figure 1 The positions of the input end of the electronic component 400 and the functional module 200 and the output end of the functional module 200 are illustrative and not necessarily arranged at the positions shown in the figures.

[0048] In some embodiments, as shown in FIG. 5, the switch assembly 500 is used to provide electrical isolation and safe power-off function. The switch assembly 500 is arranged in the accommodation chamber, and the switch assembly 500 is electrically connected with the functional module 200 and the input connector 600 respectively, so as to control the on-off of the current between the functional module 200 and the input connector 600. Figure 1

[0049] In order to ensure the safety of the current transmission between the power converter and the DC source end and the load end, it is necessary to detect the current transmitted from the DC source to the power converter and the current transmitted from the power converter to the load end. The power converter in the embodiment further comprises a current detection device 800. The current detection device 800 can detect the size of the to-be-detected current by detecting the magnetic field generated by the to-be-detected current. The current detection device 800 is used to detect the current transmitted in the power converter, such as the current transmitted from the DC source to the power converter or the current transmitted from the power converter to the load end. However, due to the presence of a plurality of electronic components 400 in the power converter, various electric fields and magnetic fields interfere with each other, which causes the detection accuracy of the current detection device 800 to deviate. When the current is abnormal but not detected, it is easy to cause safety hazards of the DC source end or the load end. It can be understood that the current detection device 800 in the embodiment can not only detect the current transmitted from the DC source to the power converter or the current transmitted from the power converter to the load end, but also can be used to detect the current flowing through other conductors in the power converter.

[0050] It can be understood that the power converter in the embodiment can further comprise other components in addition to the above-mentioned components, such as a heat dissipation fin (not shown in the figures) arranged outside the shell 100. For example, a communication module (not shown in the figures) can be arranged in the shell 100 to perform remote control. Figure 1 Figure 1

[0051] ​​​In order to improve the detection accuracy of the electronic detection device to the current to be detected, in some embodiments, the electronic detection device realizes the electric shielding of the current detection device 800 through the grounding copper foil, and realizes the magnetic shielding of the current detection device 800 through the magnetic shielding cover, so as to improve the detection accuracy of the electronic detection device. However, when the current to be detected or other currents in the power converter change rapidly, such as the existence of time-varying magnetic field in the power converter, the change of the magnetic field will induce a closed ring-shaped electric field in the conductor, that is, the eddy current field. As a good conductor, the internal free electrons form a ring-shaped current, that is, the eddy current, under the action of the electric field. The eddy current will significantly affect the detection accuracy of the electronic detection device, and the interference mechanism mainly comes from the distortion of the parasitic magnetic field generated by the eddy current to the original magnetic field and the phase delay effect. Moreover, due to the generation of the eddy current, a sufficient safety distance needs to be left between the copper foil and the measured conductor to prevent the copper foil eddy current from overheating, and a safety distance also needs to be left between the copper foil and the current detection device 800 to prevent the magnetic field interference of the eddy current to the special integrated circuit of the current detection device 800, so that the overall thickness of the electronic device 1000 is large. At the same time, when the magnetic shielding cover is covered on the electronic detection device, part of the magnetic induction lines generated by the current to be measured will change the magnetic field path by the magnetic shielding cover, so that the number of the magnetic induction lines generated by the current to be measured passing through the current detection device 800 is reduced, the signal-to-noise ratio of the current to be measured is reduced, and the detection accuracy of the current to be measured is reduced.

[0052] In order to improve the detection accuracy of the electronic detection device to the current to be detected, Figure 2 The embodiment provides a structural schematic diagram of an electronic detection device. Figure 2 The electronic detection device in the embodiment can not only be applied to Figure 1 The electronic device 1000 in the embodiment, such as for detecting the current of the direct current source delivered to the power converter or the current delivered to the load end by the power converter, can of course also be used for detecting other currents in the electronic device 1000.

[0053] Referring to Figure 2 The current detection device 800 is applied to Figure 1 Taking the power converter in the embodiment as an example, the current detection device 800 is arranged on the circuit board 300, and the current detection device 800 can detect the current of the wiring on the circuit board 300 and also can supply power to the current detection device 800 through the wiring on the circuit board 300, so that the current detection device 800 can be integrated on the circuit board 300, and the integration is improved.

[0054] Referring to Figure 2The current detection device 800 comprises the magnetic sensor 10, the electric shielding layer 20 and the magnetic shielding shell 30. The magnetic sensor 10 is used to detect the current on the to-be-detected wire 900. The electric shielding layer 20 is used to shield the electric field formed by the current of the to-be-detected wire 900 or the electric field formed by the energization of other electronic elements 400 or wires in the same space. The magnetic shielding shell 30 is used to shield the magnetic field generated by other electronic elements 400 or wires in the same space.

[0055] The magnetic sensor 10 measures the magnetic field generated by the current on the to-be-detected wire 900 by using the principle of electromagnetic induction, and obtains the size of the current on the to-be-detected wire 900 through calculation based on the detected magnetic field signal.

[0056] The magnetic sensor 10 can be a magnetoresistance sensor, such as an AMR (Anisotropic Magnetoresistance Sensor) sensor, a GMR (Giant Magnetoresistance Sensor) sensor or a TMR (Tunnel Magnetoresistance Sensor) sensor, etc.

[0057] Referring to Figure 2 The magnetic sensor 10 comprises a package 11, a magnetic head 12 and an application-specific integrated circuit (ASIC) 13 encapsulated in the package 11. When the to-be-detected current flows through the to-be-detected wire 900, a magnetic induction line is generated around the to-be-detected wire 900. The core component of the magnetic head 12 is a TMR element, i.e., a magnetic tunnel junction. The resistance value of the TMR element will change significantly with the change of the external magnetic field intensity, i.e., the tunnel magnetoresistance effect. By arranging the magnetic head 12 beside the to-be-detected wire 900, the magnetic induction line generated by the to-be-detected current can pass through the TMR element of the magnetic head 12, so that the current size of the to-be-detected current can be converted into the magnetic field intensity acting on the TMR element of the magnetic head 12. The application-specific integrated circuit 13 is used to process the magnetic field signal sensed by the magnetic head 12 and finally obtain a readable signal to obtain the size of the to-be-detected current. Specifically, since the resistance change detected by the TMR element of the magnetic head 12 is usually small, it is difficult to measure directly and is susceptible to interference. The application-specific integrated circuit 13 can convert the resistance change into a differential voltage through a Wheatstone bridge. The application-specific integrated circuit 13 can also amplify, temperature compensate and linearize the differential voltage, and finally obtain the size of the to-be-detected current on the to-be-detected wire 900.

[0058] To avoid the influence of the to-be-detected current on the ASIC 13, for example, the to-be-detected current with high dv / dt may interfere with the operational amplifier, the ADC reference source, etc. of the ASIC 13, may introduce additional error voltage, reduce the signal-to-noise ratio of the device, and cause the circuit to generate continuous high-frequency oscillation, thereby reducing the detection accuracy of the magnetic sensor 10 on the to-be-detected current. To improve the detection accuracy of the magnetic sensor 10 on the to-be-detected current, with reference to Figure 2 In some embodiments, the electric shielding layer 20 is located between the to-be-detected wire 900 and the ASIC 13 along the first direction Z, that is, the first direction Z is the arrangement direction of the to-be-detected wire 900 and the ASIC 13. To arrange the current detection device 800 on the circuit board 300, the to-be-detected wire 900 is taken as an example of the wire of the circuit board 300, and the first direction Z is perpendicular to the circuit board 300, that is, the thickness direction of the circuit board 300. The electric shielding layer 20 is grounded to make the electric potential of the electric shielding layer 20 zero, so that the electric shielding layer 20 can quickly discharge static electricity and intercept the electric field generated by the to-be-detected current to achieve electric shielding.

[0059] The material of the electric shielding layer 20 can be a high-conductivity material, which can be a metal material such as copper, aluminum, nickel, or steel, or a composite material with high conductivity.

[0060] To avoid the influence of the to-be-detected current on the ASIC 13, for example, the to-be-detected current with high dv / dt may interfere with the operational amplifier, the ADC reference source, etc. of the ASIC 13, may introduce additional error voltage, reduce the signal-to-noise ratio of the device, and cause the circuit to generate continuous high-frequency oscillation, thereby reducing the detection accuracy of the magnetic sensor 10 on the to-be-detected current. To improve the detection accuracy of the magnetic sensor 10 on the to-be-detected current, with reference to Figure 2 The electric shielding layer 20 is provided with a plurality of holes 201, and the plurality of holes 201 penetrate the electric shielding layer 20 along the first direction Z.

[0061] The eddy current in the electric shielding layer 20 is a closed loop current generated by the time-varying magnetic field. Based on the law of electromagnetic induction and the skin effect of the conductor, the electric shielding layer 20 made of high-conductivity material can repel the time-varying magnetic field and make the magnetic induction lines flow parallel to the surface of the electric shielding layer 20. Since the plurality of holes 201 in the electric shielding layer 20 of the present embodiment penetrate the electric shielding layer 20 along the first direction Z, that is, the depth direction of the holes 201 in the electric shielding layer 20 is consistent with the thickness direction of the electric shielding layer 20, so that the depth direction of the holes 201 in the electric shielding layer 20 is substantially perpendicular to the magnetic induction lines parallel to the surface of the electric shielding layer 20, and the holes 201 in the electric shielding layer 20 can effectively cut off the eddy current field on the electric shielding layer 20 to physically cut off the eddy current path, thereby effectively blocking the generation of eddy current. Therefore, the electric shielding layer 20 in the present embodiment not only shields the electric field generated by the to-be-detected current to avoid the influence on the ASIC 13, but also avoids the generation of eddy current to avoid the distortion of the parasitic magnetic field generated by the eddy current on the original magnetic field generated by the to-be-detected current and the phase delay effect, so as to ensure the integrity of the original magnetic field generated by the to-be-detected current, and further improve the detection accuracy of the magnetic sensor 10.

[0062] It can be understood that the number and size of the holes 201 on the electric shielding layer 20 in the embodiment are not specifically limited, as long as the physical cutting of the eddy current path can be met, and the generation of eddy current on the electric shielding layer 20 can be effectively prevented.

[0063] With reference to Figure 2 The electric shielding layer 20 in the embodiment is a mesh structure formed by connecting a plurality of wires 21, such as a grid or a woven mesh structure, and a plurality of holes 201 are formed between the plurality of wires 21. The material of the wire 21 is the material of the electric shielding layer 20. Since the electric shielding layer 20 is formed by connecting a plurality of wires 21, first, the gap between the wires 21 naturally blocks the formation of a large range of eddy current, which can effectively limit the eddy current within a single wire 21 under the dominance of the skin effect, and the loss is also greatly reduced. In addition, since the electric shielding layer 20 is formed by connecting a plurality of wires 21, the spacing between the wires 21 can be adjusted to control the electric field shielding capability, so as to adjust the electric field shielding capability in different use scenarios according to the needs. In addition, the electric shielding layer 20 formed by connecting a plurality of wires 21 has good flexibility and is not prone to cracking when expanding, which can improve the service life and use stability. Moreover, the electric shielding layer 20 can be formed by a plurality of wires 21 through weaving or welding, which can effectively reduce the precision manufacturing cost.

[0064] In addition, under the premise of ensuring the current detection precision of the current detection device 800 to the measured current, the overall size of the current detection device 800 and the electronic equipment can also be saved, because the electric shielding layer 20 is provided with a plurality of holes 201, which can effectively avoid or reduce the generation of eddy current on the electric shielding layer 20, so as to avoid the damage caused by the eddy current, so that there is no need to worry about the overheating of the electric shielding layer 20 or the interference to the application specific integrated circuit 13 caused by the eddy current generated by the electric shielding layer 20, and there is no need to specially leave a safety distance between the measured wire 900 and the electric shielding layer 20, and there is no need to specially leave a safety distance between the electric shielding layer 20 and the application specific integrated circuit 13, so that the embodiment can effectively shorten the distance between the measured wire 900 and the electric shielding layer 20, and effectively shorten the distance between the electric shielding layer 20 and the application specific integrated circuit 13, save the overall size, and facilitate the overall miniaturization design of the electronic equipment 1000.

[0065] With reference to Figure 2In some embodiments, the plurality of wires 21 are arranged in parallel and form the electric shielding layer 20, and the plurality of wires 21 are arranged in a long strip shape with a long hole 201 formed between each two adjacent wires 21, that is, the size of the hole 201 in the extension direction of the wire 21 is much larger than the size of the hole 201 in the first direction Z. In the present embodiment, the hole 201 not only penetrates the electric shielding layer 20 in the first direction Z, but also penetrates the electric shielding layer 20 in the extension direction of the wire 21. Since the electric shielding layer 20 is also penetrated in the extension direction of the wire 21, the eddy current is still cut off even if the eddy current circulates a long path, so that the eddy current can be more thoroughly eliminated. Moreover, compared with the way of opening the hole 201 on the flat plate, since the electric shielding layer 20 is formed by the plurality of wires 21, and each wire 21 can be prepared in advance, the hole 201 is formed by the adjacent wires 21, so that the problem of stress cracking at the end of the hole 201 in the extension direction of the wire 21 can be avoided, thereby effectively improving the use stability of the electric shielding layer 20.

[0066] With reference to Figure 2 In some embodiments, the plurality of wires 21 are arranged in a straight line, and the arrangement direction of the plurality of wires 21 is perpendicular to the extension direction of the plurality of wires 21, and the first direction Z is orthogonal to the arrangement direction of the plurality of wires 21 and the extension direction of the plurality of wires 21. Since the plurality of wires 21 are arranged in a straight line and have the same extension direction, the arrangement of the plurality of wires 21 not only can reduce the manufacturing difficulty, but also can effectively ensure the manufacturing precision.

[0067] With reference to Figure 2 In some embodiments, the arrangement direction of the plurality of wires 21 and the spacing between the plurality of wires 21 can be arranged in a variable spacing, such as a center density and an edge sparsity, to balance the shielding effectiveness and weight, and to improve the heat dissipation effect.

[0068] With reference to Figure 2 In some embodiments, the plurality of wires 21 are arranged on the circuit board 300. When the plurality of wires 21 are arranged on the circuit board 300, the spacing of the plurality of wires 21 can be more accurately controlled to improve the manufacturing precision of the electric shielding layer 20. It can be understood that when the plurality of wires 21 are arranged on the circuit board 300, the plurality of wires 21 need to be insulated from the traces on the circuit board 300.

[0069] In order to avoid the influence of the external magnetic field on the original magnetic field of the measured current, with reference to Figure 2In some embodiments, the magnetic shielding shell 30 is arranged around the periphery of the magnetic sensor 10 to shield other magnetic field lines other than the primary magnetic field generated by the current to be measured by the magnetic shielding shell 30. For example, when the current detection device 800 is applied in a power converter, the magnetic field generated by some electronic components 400 or other conductive wires other than the conductive wire 900 arranged on the circuit board 300 can be effectively shielded by the magnetic shielding shell 30.

[0070] With reference to Figure 1 In some embodiments, the magnetic shielding shell 30 is a frame 35 structure having openings 301 at both ends in the first direction Z, and the magnetic sensor 10 is arranged opposite to the openings 301 in the first direction Z. The magnetic field lines generated by the current to be measured on the conductive wire 900 surround the conductive wire 900. Since the magnetic shielding shell 30 has openings 301 at both ends in the first direction Z, and the openings 301 are arranged opposite to the magnetic sensor 10 in the first direction Z, and the first direction Z is the arrangement direction of the magnetic sensor 10 and the conductive wire 900, therefore, when the magnetic field lines generated by the current to be measured pass through the upper and lower sides of the magnetic sensor 10 in the first direction Z, they will not be affected by the magnetic shielding shell 30 due to the skin effect, thereby greatly ensuring the integrity of the primary magnetic field generated by the current to be measured. At the same time, the magnetic shielding shell 30 can also shield the interference of external magnetic fields other than the primary magnetic field generated by the current to be measured, specifically in directions perpendicular to the first direction Z, thereby effectively improving the detection accuracy of the magnetic sensor 10. In addition, since the magnetic shielding shell 30 has openings 301 at both ends in the first direction Z, taking the conductive wire 900 as an example of the wiring on the circuit board 300, the magnetic shielding shell 30 is arranged on the circuit board 300, at this time, one of the openings 301 of the magnetic shielding shell 30 faces the circuit board 300 and is covered by the circuit board 300, and the other opening 301 is arranged opposite to the circuit board 300 in the thickness direction of the circuit board 300, thereby effectively reducing the overall thickness of the electronic device 1000 (such as a power converter) in the thickness direction of the circuit board 300. Figure 2

[0071] ​It can be understood that most of the external magnetic field in addition to the original magnetic field generated by the current to be measured is generated by each electronic element 400 arranged on the circuit board 300, and the magnetic sensor 10 is also arranged on the circuit board 300, so that the magnetic shielding shell 30 can shield the external magnetic field in the extension direction of the circuit board 300, that is, in the direction perpendicular to the first direction Z, that is, most of the external magnetic field sources in the electronic device 1000 can be effectively shielded, that is, the magnetic induction lines passing through the magnetic sensor 10 from the two openings 301 in the first direction Z are few, and basically do not affect the original magnetic field generated by the current to be measured. For direction description, the extension direction of the wire to be measured 900 is set as the second direction X, and the direction perpendicular to the first direction Z and the second direction X is the third direction Y, and the magnetic shielding shell 30 in the embodiment can effectively shield the external magnetic field interference in addition to the original magnetic field generated by the current to be measured in the second direction X and the third direction Y.

[0072] Referring to Figure 2 In some embodiments, the magnetic shielding shell 30 includes a first plate 31 and a second plate 32 located on both sides of the magnetic sensor 10 in the second direction X, and a third plate 33 and a fourth plate 34 located on both sides of the magnetic sensor 10 in the third direction Y. Thus, the first plate 31 and the second plate 32 can shield most of the external magnetic field interference in addition to the original magnetic field generated by the current to be measured in the second direction X, and the third plate 33 and the fourth plate 34 can shield most of the external magnetic field interference in addition to the original magnetic field generated by the current to be measured in the third direction Y, and thus the magnetic field generated by the electronic element 400 arranged on the circuit board 300 can be effectively shielded outside the magnetic shielding shell 30.

[0073] Referring to Figure 2 In some embodiments, the first plate 31, the second plate 32, the third plate 33 and the fourth plate 34 are connected to form a frame 35 opening the two openings 301 at the ends of the first direction Z. It can be understood that in other embodiments, the frame 35 surrounded by the first plate 31, the second plate 32, the third plate 33 and the fourth plate 34 can be a rectangle, and the frame 35 can also be a parallelogram, a circle or an oval or other irregular shape frame 35.

[0074] In order to improve the magnetic head 12 of the magnetic sensor 10 to perceive as much as possible the original magnetic field generated by the current to be measured, referring to Figure 2In some embodiments, the current detection device 800 further comprises a magnetic concentrator 40, which is arranged in the magnetic shielding shell 30 and is arranged on the magnetic field line track formed by the current of the to-be-detected wire 900. By arranging the magnetic concentrator 40 on the magnetic field line track formed by the current of the to-be-detected wire 900, the magnetic field lines on the outer edge of the magnetic field lines generated by the to-be-detected current can also be absorbed and concentrated to be sensed by the magnetic head 12 of the magnetic sensor 10, so that the magnetic field lines on the outer edge of the magnetic field lines generated by the to-be-detected current can be effectively utilized, and the utilization rate of the original magnetic field generated by the to-be-detected current by the magnetic sensor 10 is improved, so as to improve the detection accuracy of the to-be-detected current by the magnetic sensor 10.

[0075] In order to enable the concentrated magnetic field lines to be effectively sensed by the magnetic head 12 of the magnetic sensor 10, the magnetic concentrator 40 is arranged on both sides of the magnetic head 12 of the magnetic sensor 10 in the third direction Y, and the magnetic head 12 and the magnetic concentrator 40 at least partially overlap in the third direction Y, that is, the magnetic head 12 and the magnetic concentrator 40 are located at substantially the same height in the first direction Z, so that the magnetic field lines concentrated by the magnetic concentrator 40 can be effectively sensed by the magnetic head 12 of the magnetic sensor 10, the utilization rate of the original magnetic field generated by the to-be-detected current by the magnetic sensor 10 is improved, and the detection accuracy of the to-be-detected current by the magnetic sensor 10 is improved.

[0076] Referring to Figure 2 In some embodiments, the to-be-detected wire 900 is a wire on the circuit board 300, and the magnetic concentrator 40 is arranged on the circuit board 300.

[0077] Referring to Figure 1 In some embodiments, the to-be-detected wire 900 is a wire on the circuit board 300, and the magnetic shielding shell 30 is integrated on the circuit board 300. Since the magnetic shielding shell 30 is arranged on the circuit board 300, the overall thickness of the electronic device 1000 (such as a mobile phone) is not affected, so that the magnetic shielding shell 30 can be integrated on the circuit board 300, and the integration degree of the electronic device 1000 is improved. Figure 3 ) is not affected, so that the magnetic shielding shell 30 can be integrated on the circuit board 300, and the integration degree of the electronic device 1000 is improved.

[0078] Figure 2 Another structure schematic diagram of a current detection device 800 provided by an embodiment of the present application is shown. The structure of the current detection device 800 in the embodiment is the same as that of the current detection device 800 in the embodiment shown in FIG. 1, and the difference between the two is that the structure of the electric shielding layer 20 in the current detection device 800 in the embodiment is different from that in the embodiment shown in FIG. 1. Figure 3 The magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment can be referred to the magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment shown in FIG. 1, and details are not described herein. Figure 2 The magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment can be referred to the magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment shown in FIG. 1, and details are not described herein. Figure 3 The magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment can be referred to the magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment shown in FIG. 1, and details are not described herein.

[0079] Referring to Figure 2In some embodiments, the plurality of wires 21 include a plurality of first wires 211 and a second wire 212 connected to the plurality of first wires 211. The plurality of first wires 211 are arranged side by side and spaced apart, and the extension directions of the plurality of first wires 211 are consistent. Figure 3 The electric shielding layer 20 in the embodiment is equivalent to being composed only of Figure 3 In the embodiment, a plurality of first conductive lines 211 are arranged side by side. Figure 2 In the embodiment, the electric shielding layer 20 is provided with a second wire 212 on the basis of the plurality of first wires 211. By connecting the second wire 212 to the plurality of first wires 211, any one of the plurality of first wires 211 or the second wire 212 is grounded, so that all the wires 21 constituting the electric shielding network can be grounded, effectively reducing the grounding complexity of the electric shielding layer 20. In addition, since the plurality of first wires 211 are arranged at intervals, the adjacent first wires 211 can also form the same grounding. Figure 3 The same long strip-shaped holes 201 as in the embodiment are used to cut off the eddy current path and avoid the generation of eddy current on the electric shielding layer 20 .

[0080] It is understandable that Figure 2 The arrangement of the plurality of first conductive lines 211 in the embodiment can refer to Figure 3 The arrangement of the plurality of wires 21 in the embodiment will not be described in detail here.

[0081] Reference Figure 4 In some embodiments, the second wire 212 is located at one end of the extension direction of the multiple first wires 211, so that the length of the long strip hole 201 in the extension direction of the first wire 211 is as long as possible, thereby achieving a better effect of cutting off the eddy current path.

[0082] It is understood that in other embodiments, the second wire 212 may also be connected to the middle of the plurality of first wires 211. Furthermore, the angle between the second wire 212 and the plurality of first wires 211 may be a right angle or other angles.

[0083] Figure 3 This is a structural diagram of the electric shielding layer 20 of another current detection device 800 provided in an embodiment of the present application. Figure 4 The difference between the electric shielding layer 20 in the embodiment is that Figure 3 In the embodiment, the number of the second conductors 212 is greater, and the structure of the electric shielding layer 20 is the same. Figure 4 There is a difference. Figure 2 The magnetic shielding shell 30 and the magnet collecting body 40 in the embodiment can refer to Figure 4 The embodiments will not be described in detail here.

[0084] Reference Figure 2In some embodiments, the plurality of conductors 21 include a plurality of first conductors 211 and a plurality of second conductors 212 connected to the plurality of first conductors 211. The plurality of first conductors 211 are spaced side by side and extend in the same direction. The plurality of second conductors 212 are spaced side by side and extend in the same direction. The extension direction of the plurality of first conductors 211 is arranged at an angle to the extension direction of the plurality of second conductors 212. The plurality of first conductors 211 and the plurality of second conductors 212 enclose a plurality of holes 201. In this embodiment, firstly, because the first shielding layer is formed by connecting the plurality of first conductors 211 and the plurality of second conductors 212, the gaps between the conductors 21 naturally block the formation of large-scale eddy currents. Under the dominance of the skin effect, the eddy currents can be effectively confined to the interior of a single conductor 21, and the loss is also significantly reduced. Moreover, since the plurality of first conductors 211 and the plurality of second conductors 212 enclose the plurality of holes 201, the dimensions of the plurality of holes 201 in the direction in which the plurality of first conductors 211 are arranged or in the direction in which the plurality of second conductors 212 are arranged are not similar. For example, the plurality of holes 201 are roughly square holes or diamond holes. In this embodiment, since the electric shielding layer 20 is formed by connecting the plurality of first conductors 211 and the plurality of second conductors 212, the plurality of first conductors 211 and the plurality of second conductors 212 can support each other to form a mesh structure, so that the electric shielding layer 20 can be pre-prepared, and then the prepared electric shielding layer 20 can be placed on the conductor 900 to be tested (such as Figure 2 ) and ASIC 13 (such as Figure 4 ), the preparation efficiency of the current detection device 800 can be improved.

[0085] Reference Figure 4 In some embodiments, at least one second conductor 212 is connected to all of the first conductors 211. Thus, grounding any one of the first conductors 211 or the second conductors 212 allows all of the conductors 21 constituting the electric shielding network to be grounded, effectively reducing the grounding complexity of the electric shielding layer 20.

[0086] It is understandable that the angle formed by the extending direction of the plurality of first conductive lines 211 and the extending direction of the plurality of second conductive lines 212 may be a right angle or other angles.

[0087] It is understandable that in some other embodiments, no second wire 212 needs to be connected to all the first wires 211 .

[0088] It is understandable that Figure 2 The arrangement of the plurality of first conductive lines 211 in the embodiment can refer to Figure 5 The arrangement of the plurality of wires 21 in the embodiment will not be described in detail here.

[0089] Figure 5 Another structure schematic diagram of the current detection device 800 provided by the embodiment of the present application is shown in FIG. 8. As to Figure 2 The magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment can refer to Figure 5 the embodiment, which will not be repeated here.

[0090] Referring to Figure 2 , in some embodiments, the electric shielding layer 20 includes a plurality of perforated plate pieces 22, and the plurality of perforated plate pieces 22 are spliced to form the electric shielding layer 20. Each perforated plate piece 22 is provided with a hole 201, so that each perforated plate piece 22 will not form eddy current when arranged beside the to-be-detected wire 900 (such as Figure 2 ). After the plurality of perforated plate pieces 22 are spliced, there is still enough area between the to-be-detected wire 900 and the ASIC 13 (such as Figure 6 ) of the magnetic sensor 10, so as to realize the electric field shielding of the to-be-detected current on the to-be-detected wire 900 and avoid interference with the ASIC 13. In the embodiment, since the electric shielding layer 20 is formed by splicing a plurality of prefabricated perforated plate pieces 22, the shape of the electric shielding layer 20 can be flexibly set according to requirements. Moreover, since the hole 201 needs to be prefabricated on the perforated plate piece 22, when the plurality of perforated plate pieces 22 are spliced, there is no high requirement for the machining precision at this time, so as to improve the machining efficiency of the electric shielding layer 20. Especially when the to-be-detected wire 900 is a trace on the circuit board 300, and the electric shielding layer 20 needs to be arranged on the circuit board 300, the electric shielding layer 20 is formed by splicing a plurality of perforated plate pieces 22, which can accurately set the electric shielding layer 20 on the circuit board 300 with extremely high density of electronic elements 400, and skillfully use the available area of the circuit board 300, so that the layout of the electric shielding layer 20 is more flexible and accurate.

[0091] Figure 2 Another structure schematic diagram of the current detection device 800 provided by the embodiment of the present application is shown in FIG. 8. As to Figure 6 the electric shielding layer 20 in the embodiment is arranged outside the magnetic sensor 10, Figure 2 the electric shielding layer 20 in the embodiment is arranged inside the magnetic sensor 10, but still between the ASIC 13 and the to-be-detected wire 900 (such as Figure 6 ). As to Figure 2 the electric shielding layer 20, the magnetic shielding shell 30 and the magnetic concentrator 40 in the embodiment can refer to Figure 6 the embodiment, which will not be repeated here.

[0092] Referring to Figure 2 , in some embodiments, the ASIC 13 is located in the package 11, and the electric shielding layer 20 is arranged in the package 11 and faces the to-be-detected wire 900 (such as Figure 7) side. By encapsulating the electric shielding layer 20 within the package body 11, the electric shielding layer 20 is in close contact with the ASIC 13, and the protection range can be controlled more accurately. Moreover, by encapsulating the electric shielding layer 20 within the package body 11, the electric shielding layer 20 can be directly connected to the single point ground of the magnetic sensor 10, completely cutting off the ground loop and avoiding the introduction of common-mode interference. It can also effectively intercept external interfering electric fields before they arrive, effectively reducing the risk of edge leakage.

[0093] It is understandable that, in some other embodiments, the electric shielding layer 20 may also completely enclose the ASIC 13 to avoid interference from the external electric field to the greatest extent.

[0094] Figure 8 A schematic structural diagram of another current detection device 800 provided in an embodiment of the present application; Figure 7 This is a structural diagram of another current detection device 800 provided in an embodiment of the present application. Figure 2 The example is Figure 3 or Figure 8 The structure of the new magnetic shielding shell 30 is improved based on the frame 35 of the embodiment. Figure 5 The example is Figure 7 The structure of the magnetic shielding shell 30 is improved based on the embodiment, and Figure 8 and Figure 7 The structure of the magnetic shielding case 30 in the embodiment is the same. Figure 8 and Figure 2 The electric shielding layer 20 and the magnetizing body 40 in the embodiment can all refer to Figure 7 The embodiments will not be described in detail here.

[0095] Reference Figure 8 and Figure 2 In some embodiments, the magnetic shielding shell 30 further includes a magnetic shielding shell 30 disposed in the surrounding frame 35 away from the wire to be tested 900 (eg Figure 2 ) at one end of the frame 35, the baffles 36 are respectively arranged at the corners of the frame 35, and the baffles 36 are spaced apart from each other. In this embodiment, since the baffles 36 are respectively arranged at the corners of the frame 35, the baffles 36 can block a portion of the opening 301 at one end of the frame 35 away from the wire 900 to be measured. However, in the third direction Y, the baffles 36 are not provided at the positions facing each other on both sides of the magnetic sensor 10, that is, in the second direction X, the baffles 36 are located on both sides of the magnetic sensor 10, thereby preventing the baffles 36 from affecting the magnetic flux lines generated by the current to be measured from being attracted and gathered by the baffles 36, and preventing the baffles 36 from affecting the original magnetic field generated by the current to be measured, so as to ensure that the magnetic head 12 (such as ​The inductivity of the original magnetic field generated by the current to be measured is improved, and the magnetic shielding shell 30 can shield the magnetic induction lines of the external magnetic field through the arrangement of the plurality of baffles 36, so as to improve the detection precision of the magnetic sensor 10.

[0096] It can be understood that the shape of the baffle 36 can be square, rectangular or other shapes.

[0097] It can be understood that the baffle 36 can be arranged at each corner of the frame 35, or only at some corners.

[0098] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A current detection device, characterized in that: The current detection device includes a magnetic sensor and an electric shielding layer; The magnetic sensor is used to detect the current on the wire to be measured. The magnetic sensor includes a magnetic head and a dedicated integrated circuit. The magnetic head is used to sense the magnetic field generated by the current of the wire to be measured, and the dedicated integrated circuit is used to process the magnetic field signal sensed by the magnetic head. The electric shielding layer is located between the conductor to be tested and the ASIC along a first direction, the electric shielding layer is grounded, and a plurality of holes are provided on the electric shielding layer, and the plurality of holes penetrate the electric shielding layer in the first direction.

2. The current detection device according to claim 1, characterized in that The electric shielding layer is formed by connecting a plurality of conductive wires, and the plurality of holes are formed by spacing between the plurality of conductive wires.

3. The current detection device according to claim 2, characterized in that: The plurality of wires include a plurality of first wires and second wires connected to the plurality of first wires. The plurality of first wires are arranged side by side and have the same extension direction. The plurality of holes are formed between the plurality of first wires.

4. The current detection device according to claim 3, characterized in that: The second conductive wire is connected to ends of the plurality of first conductive wires in an extending direction.

5. The current detection device according to claim 2, characterized in that: The plurality of conductive wires include a plurality of first conductive wires and a plurality of second conductive wires connected to the plurality of first conductive wires. The plurality of first conductive wires are arranged side by side and spaced apart, and the plurality of first conductive wires extend in the same direction. The plurality of second conductive wires are arranged side by side and spaced apart, and the plurality of second conductive wires extend in the same direction. The extension direction of the plurality of first conductive wires and the extension direction of the plurality of second conductive wires are arranged at an angle. The plurality of first conductive wires and the plurality of second conductive wires enclose the plurality of holes.

6. The current detection device according to claim 5, characterized in that: At least one second conductive line is connected to all of the first conductive lines.

7. The current detection device according to claim 1, characterized in that: The electric shielding layer includes a plurality of perforated plates, each of which is provided with a hole penetrating along a first direction, and the plurality of perforated plates are spliced ​​together.

8. The current detection device according to any one of claims 1 to 7, characterized in that: The magnetic sensor further includes a package body, the ASIC is located in the package body, and the electric shielding layer is disposed in the package body and located on a side of the ASIC facing the conductor to be measured.

9. The current detection device according to any one of claims 1 to 8, characterized in that: The current detection device further includes a magnetic shielding shell arranged around the periphery of the magnetic sensor. The magnetic shielding shell is a frame structure having openings at both ends in a first direction. The magnetic sensor is opposite to the openings in the first direction.

10. The current detection device according to claim 9, characterized in that: The direction in which the wire to be tested extends is the second direction, and the direction orthogonal to the first direction and the second direction is the third direction. The magnetic shielding shell includes a first plate and a second plate located on both sides of the magnetic sensor in the second direction, and a third plate and a fourth plate located on both sides of the magnetic sensor in the third direction. The first plate, the second plate, the third plate and the fourth plate are connected to form a frame with openings at both ends in the first direction.

11. The current detection device according to claim 10, characterized in that: The magnetic shielding shell further comprises a plurality of baffles arranged at one end of the enclosure away from the wire to be measured, the plurality of baffles being respectively arranged at corners of the enclosure and spaced apart from each other.

12. The current detection device according to any one of claims 1 to 11, characterized in that: The current detection device further includes a magnetic focusing body, which is arranged on the magnetic flux line track formed by the current of the conductor to be measured.

13. The current detection device according to claim 12, characterized in that: The direction in which the wire to be tested extends is the second direction, and the direction orthogonal to the first direction and the second direction is the third direction. In the third direction, the magnetizing body is provided on both sides of the magnetic head of the magnetic sensor, and in the third direction, the projections of the magnetic head and the magnetizing body at least partially overlap.

14. An electronic device, characterized in that: The electronic device includes a circuit board and a current detection device as described in any one of claims 1 to 13 above, the conductor to be measured is a trace arranged on the circuit board, the magnetic sensor is arranged on the circuit board, and the electric shielding layer is arranged on the circuit board and is located between the trace and the magnetic sensor in the thickness direction of the circuit board.

15. An electronic device, characterized in that: The electronic device includes a circuit board and a current detection device as described in any one of claims 9 to 11 above, the conductor to be measured is a trace arranged on the circuit board, the magnetic sensor is arranged on the circuit board, the magnetic shielding shell is arranged on the circuit board, and the opening of the magnetic shielding shell at one end facing the circuit board is covered by the circuit board.

16. The electronic device according to claim 15, characterized in that The magnetic shielding shell is integrated on the circuit board.

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