Heat dissipation assembly and board card

Abstract

The embodiment of the invention provides a heat dissipation assembly and a board card, the board card comprises a board card body, an interface cage and a heat dissipation assembly, the interface cage is arranged on one side of the board card body, an optical module is detachably arranged in the interface cage and is coupled with the board card body, and the heat dissipation assembly is arranged on the board card body and movably covers one side, facing the board card body, of the interface cage. The interface cage is provided with a first position and a second position, and a penetrating hole is formed in the side face, facing the heat dissipation assembly, of the interface cage. When located at the first position, the heat dissipation assembly penetrates through the penetrating hole and is located in the interface cage. And when the heat dissipation assembly is located at the second position, the optical module is located in the interface cage, and the heat dissipation assembly abuts against the optical module to perform multiple cooling on the optical module, so that the heat dissipation effect is better compared with a heat dissipation mode only depending on the heat dissipation plate, and it is ensured that the optical module can work well. The heat dissipation assembly can be driven to be switched between the first position and the second position when the optical module is mounted or dismounted, so that the heat dissipation assembly does not need to be mounted after the optical module is mounted, and the operation is simple and convenient.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical communication equipment, and particularly relates to a heat dissipation assembly and a board card. BACKGROUND

[0002] In the process of working, the chip and other structures inside the optical module generate heat. If the temperature is too high, the working efficiency of the optical module will be affected. Therefore, the optical module needs to be cooled in time to ensure good working efficiency. Usually, a plurality of heat dissipation fins are arranged above the plug-in cage of the board card to accelerate the dissipation of heat when the optical module is inserted into the plug-in cage. However, the height of the board card is very limited, which limits the height of the heat dissipation fins. Therefore, the area of the heat dissipation fins is limited, and the heat dissipation effect is very limited, which cannot meet the heat dissipation demand of the optical module. SUMMARY

[0003] In view of the above problems, the present application is proposed. The purpose of the present application is to provide a board card capable of cooling the optical module well.

[0004] To achieve the above purpose, the present application adopts the following technical scheme:

[0005] A board card comprises:

[0006] a board card body;

[0007] an interface cage arranged on one side of the board card body, and an optical module being detachably arranged in the interface cage and coupled with the board card body; and

[0008] a heat dissipation assembly arranged on the board card body and capable of being movably covered on the part of the interface cage and the board card body abutting each other, having a first position and a second position, and the side of the interface cage facing the heat dissipation assembly being provided with a through hole;

[0009] when being located at the first position, a part of the heat dissipation assembly passes through the through hole and is located in the interface cage;

[0010] when being located at the second position, the optical module is located in the interface cage, and the heat dissipation assembly abuts against the optical module to cool the optical module multiple times;

[0011] the optical module is installed, and the heat dissipation assembly is driven to switch from the first position to the second position;

[0012] the optical module is detached, and the heat dissipation assembly is automatically switched from the second position to the first position.

[0013] Optionally, the heat dissipation assembly comprises:

[0014] a heat dissipation frame covered on the interface cage;

[0015] a heat dissipation member disposed on a side of the heat dissipation frame facing the interface cage, and a projection of the heat dissipation member on the board body is located within a projection of the through hole on the board body;

[0016] ; and

[0017] a plurality of reset locking members passing through the heat dissipation frame and connecting the heat dissipation frame and the board body, the heat dissipation frame being slidable along the reset locking members;

[0018] when the heat dissipation assembly is in the first position, the heat dissipation member passes through the through hole and is located within the interface cage, and the reset locking members are in an initial state;

[0019] when the heat dissipation assembly is in the second position, the heat dissipation member is flush with an edge of the through hole within the interface cage and abuts against the optical module, and the reset locking members are in a compressed state.

[0020] Optionally, a plurality of heat dissipation fins are spaced apart on a side of the heat dissipation frame away from the interface cage;

[0021] a plurality of heat dissipation plates extending toward the board body are spaced apart on the heat dissipation frame on both sides of the interface cage.

[0022] Optionally, a guide surface is provided on a side of the heat dissipation member away from an edge of the board body along a mounting direction of the optical film block, the guide surface being inclined from an edge of the heat dissipation member abutting against the heat dissipation frame toward a center of the board body and away from the heat dissipation frame.

[0023] Optionally, the heat dissipation assembly further comprises:

[0024] a fixing block provided on the board body, the fixing block being provided on both sides of the interface cage;

[0025] the reset locking members comprise:

[0026] a locking member and a reset member sleeved on the locking member;

[0027] one end of the locking member passes through the heat dissipation frame and is fixed to the fixing block, one end of the reset member abuts against the other end of the locking member, and the other end of the reset member abuts against the heat dissipation frame.

[0028] Optionally, a compression force in the reset member when the heat dissipation assembly is in the first position is smaller than a compression force in the reset member when the heat dissipation assembly is in the second position.

[0029] Optionally, the locking member comprises a limiting head and a screw rod located at one side of the limiting head, and the reset member is sleeved on the screw rod.

[0030] The heat dissipation frame has a connecting block on each side of the interface cage, the connecting block is provided with a through stepped hole, the reset member is accommodated in the stepped hole, one end of the reset member abuts against the limiting head, and the other end abuts against the stepped surface.

[0031] The screw rod is screwed on the fixed block through the stepped hole.

[0032] Optionally, the heat dissipation assembly further comprises:

[0033] A fan is arranged on the board card body, and an air outlet of the fan faces the heat dissipation assembly.

[0034] Another object of the embodiment of the present application is to provide a heat dissipation assembly capable of well dissipating heat of an optical module.

[0035] To achieve the object, the embodiment of the present application adopts the following technical scheme:

[0036] A heat dissipation assembly has a first position and a second position, and comprises:

[0037] A heat dissipation frame is arranged at an interface cage, and the interface cage is provided with a through hole;

[0038] A heat dissipation member is arranged on a side of the heat dissipation frame facing the interface and located at the through hole; and

[0039] A plurality of reset locking members pass through the heat dissipation frame and are connected with a PCB board, and the heat dissipation frame can slide along the reset locking members;

[0040] When the heat dissipation assembly is located at the first position, the heat dissipation member passes through the through hole and is located in the interface cage, and the reset locking members are in an initial state;

[0041] When the heat dissipation assembly is located at the second position, the heat dissipation member is flush with an edge of the through hole in the interface cage and abuts against the optical module, and the reset locking members are in a compressed state.

[0042] Optionally, the heat dissipation assembly further comprises a fan, and the fan is arranged on the PCB board and has an air outlet facing the heat dissipation frame.

[0043] The technical scheme provided by the embodiment of the present application is characterized in that the heat dissipation assembly is arranged to be movable on the board card body, so that the heat dissipation assembly has a first position and a second position; when located at the first position, the heat dissipation assembly is located in the interface cage through the through hole; when located at the second position, the optical module is located in the interface cage, and the heat dissipation assembly is in abutment with the optical module to perform multiple cooling on the optical module; compared with the traditional heat dissipation mode relying on the heat dissipation plate only, the heat dissipation effect is better, the heat dissipation requirement of the optical module is met, and the optical module can work well. In addition, the optical module is arranged to drive the heat dissipation assembly to switch from the first position to the second position during installation, and the heat dissipation assembly automatically switches from the second position to the first position after the optical module is disassembled; after the optical module is installed, the heat dissipation assembly does not need to be installed again, and the operation is simple and convenient. BRIEF DESCRIPTION OF DRAWINGS

[0044] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0045] Figure 1 The structural schematic diagram of the optical module provided by an embodiment of the present application is shown in the figure.

[0046] Figure 2 The structural schematic diagram of the board card provided by an embodiment of the present application is shown in the figure.

[0047] Figures 3-5 The partial sectional view of the board card provided by an embodiment of the present application is shown in the figure.

[0048] Figure 6 The structural schematic diagram of the heat dissipation frame, the heat dissipation piece and the reset locking piece provided by an embodiment of the present application is shown in the figure.

[0049] In the figure: 100, board card; 200, optical module.

[0050] 1, heat dissipation assembly; 2, board card body; 3, interface cage; 4, fixed block.

[0051] 10, heat dissipation frame; 11, heat dissipation fin; 12, heat dissipation plate; 13, connecting block.

[0052] 20, heat dissipation piece; 21, guide surface.

[0053] 30, reset locking piece; 31, locking piece; 311, limiting head; 312, screw rod; 32, reset piece.

[0054] 40, fan. DETAILED DESCRIPTION

[0055] Before implementing the embodiments of the present application, the inventors of the present application conducted research on the heat dissipation structures currently used for optical modules in operation. They found that most heat dissipation structures are multiple heat sinks disposed above the interface cage. During airflow, the heat sinks can more fully contact the airflow, allowing the airflow to carry away more heat. However, this method has a very limited heat dissipation effect. Another part of the heat dissipation structure is based on the previous solution and further provides a cooling fan above the heat sink with the air outlet facing the heat sink to accelerate the flow of air. Although the heat dissipation effect is better than the previous solution, it still cannot meet the heat dissipation needs of the optical module. In addition, this situation requires the installation space of the board to be relatively high. However, under normal circumstances, the installation space of the board is very limited and cannot accommodate the installation of the cooling fan.

[0056] To this end, the inventors of this application have attempted to provide a heat sink integrated into the board. Once the optical module is inserted into the interface cage, it comes into close contact with the heat sink, effectively dissipating heat from the optical module. Since the interface cage is of a certain height, the multiple heat sinks traditionally located above the interface cage can be arranged as a heat sink cover above the interface cage. This allows for heat sinks to be provided not only above the interface cage, but also on both sides of the interface cage. The heat sinks located above the interface cage extend upward, while the heat sinks located on either side of the interface cage can extend upward and downward, further increasing the heat dissipation area. Secondly, heat sinks are provided on the side of the heat sink facing the interface cage. When the optical module is inserted into the interface cage, the heat sinks directly contact the optical module, dissipating heat more promptly than a heat sink. Finally, a cooling fan with an opening facing the heat sink is provided on the board to accelerate airflow, effectively dissipating heat from the heat sink. The heat dissipation component performs multiple cooling operations on the optical module, thereby meeting the heat dissipation requirements of the optical module, so that the optical module can always be at a suitable working temperature, ensuring good working efficiency.

[0057] The following embodiments are provided, and the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the drawings only illustrate portions relevant to the present invention, rather than all structures.

[0058] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0059] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "above" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0060] In the description of the present embodiment, the terms "up", "down", "right", and other orientation or position relationships are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used to distinguish in the description and have no special meaning.

[0061] In the field of optical communication equipment, please refer to Figure 1 As shown in the figure, the optical module 200 as an important electronic device can realize the mutual conversion between optical signals and electrical signals to meet the transmission requirements of data in different media. The board card 100 not only can provide the required power for the optical module 200 to ensure that the optoelectronic devices, drive chips and other internal components of the optical module 200 can work normally, but also can realize the electrical signal transmission between the optical module 200 and other devices or systems. Please refer to Figures 1-2 As shown in the figure, therefore, the board card 100 generally includes a board card body 2 and an interface cage 3, the interface cage 3 is coupled with the board card body 2, and the optical module 200 is pluggable arranged on the interface cage 3, and is coupled with the board card body 2 through the interface cage 3.

[0062] When the optical module 200 is working, there is a certain amount of energy loss because the internal light-emitting device (such as a laser diode) and the photoelectric detection device (such as a photodiode) are not ideal energy conversion devices. Taking the laser diode as an example, when it converts electrical energy into light energy, only a part of the electrical energy can be effectively converted into an optical signal, and the rest is lost in the form of heat energy. Moreover, as the transmission rate of the optical module 200 increases, in order to ensure the quality of the optical signal, it is necessary to increase the driving current of the light-emitting device, which will cause more electrical energy to be converted into heat energy, so that the heat generation of the optical module 200 further increases. As a result, the optical module 200 will generate a large amount of heat. If the heat cannot be dissipated in a timely and effective manner, it will affect the performance and reliability of the optical module 200, reduce the working efficiency of the optical module 200, and may even cause the optical module 200 to malfunction.

[0063] Please refer to Figure 2 As shown, an embodiment of the present application provides a card 100, which also includes a heat sink assembly 1. The heat sink assembly 1 is mounted on the card body 2 and removably covers the portion of the interface cage 3 that abuts the removed body 2. The heat sink assembly 1 has a first position and a second position. A hole is provided on the side of the interface cage 3 facing the heat sink assembly 1. In the first position, a portion of the heat sink assembly 1 is positioned within the interface cage 3 through the hole. In the second position, the optical module 200 is positioned within the interface cage 3, and the heat sink assembly 1 and the optical module 200 are tightly abutted, providing multiple cooling effects on the optical module 200. Compared to a system with only a heat sink 12, the heat sink assembly 1 achieves a better heat dissipation effect, meets the heat dissipation requirements of the optical module 200, and ensures stable operation of the optical module 200. When the optical module 200 is installed, the heat sink assembly 1 can be driven to switch from the first position to the second position. After the optical module 200 is removed, the heat sink assembly 1 automatically switches from the second position to the first position. Therefore, after the optical module 200 is inserted into the interface cage 3, the heat sink assembly 1 does not need to be installed again, making operation simple and quick.

[0064] For details, please refer to Figure 2 、 Figure 3 、 Figure 6As shown in the drawings, in some embodiments of the present application, the heat dissipation assembly 1 comprises a heat dissipation frame 10, a heat dissipation piece 20 and a plurality of reset locking pieces 30, wherein the heat dissipation frame 10 is covered on the interface cage 3, the heat dissipation piece 20 is arranged on the side of the heat dissipation frame 10 facing the interface cage 3, the projection of the heat dissipation piece 20 on the board body 2 is located within the projection of the penetrating hole on the board body 2, and the plurality of reset locking pieces 30 are connected with the board body 2 through the heat dissipation frame 10 to limit the heat dissipation frame 10 on the board body 2. The heat dissipation frame 10 can slide along the reset locking piece 30, thereby driving the heat dissipation piece 20 to move relative to the interface cage 3 to realize the switching of the heat dissipation assembly 1 between the first position and the second position. When the heat dissipation assembly 1 is located at the first position, the heat dissipation frame 10 abuts against the interface cage 3, the heat dissipation piece 20 penetrates into the interface cage 3 through the penetrating hole, and the reset locking piece 30 is in the initial state. When the heat dissipation assembly 1 is located at the second position, the heat dissipation frame 10 is separated from the interface cage 3, the heat dissipation piece 20 is flush with the edge of the penetrating hole in the interface cage 3 and abuts against the optical module 200, and the reset locking piece 30 is in the compressed state. The heat dissipation piece 20 can better absorb the heat emitted by the optical module 200 compared with the interface cage 3, and dissipate the heat to the air in time and transfer the heat to the heat dissipation frame 10 in time. The heat dissipation frame 10 can quickly dissipate the heat, and compared with the mode of arranging a plurality of heat dissipation fins 11 on the interface cage 3, the heat dissipation piece 20 is more conducive to heat conduction, and therefore has better heat dissipation effect.

[0065] Of course, in the embodiments of the present application, please refer to Figure 2 、 Figure 6 As shown in the drawings, the heat dissipation piece 20 can be a heat dissipation fin 11 with better heat conduction property, and the material can be metal material or composite material, as long as the heat conduction property is better than that of the interface cage 3. The heat dissipation piece 20 can also be a semiconductor condensing fin with refrigeration function, which can refrigerate, and has better heat dissipation effect compared with the physical heat dissipation effect relying on air flow. It can be understood that the semiconductor condensing fin usually refrigerates on one side and heats on the other side, the refrigerating side abuts against the optical module 200, and the heating side abuts against the heat dissipation frame 10, and the heat dissipation frame 10 timely dissipates the heat released by the semiconductor condensing fin to ensure that the semiconductor condensing fin can work better.

[0066] As can be seen from the above, the heat dissipation assembly 1 of the embodiments of the present application not only relies on one heat dissipation part for the heat dissipation of the optical module 200, but also adopts the double heat dissipation mode of the heat dissipation piece 20 and the heat dissipation frame 10, thereby achieving better heat dissipation effect. Of course, the heat dissipation mode adopted by the present application is not only the above two modes, and more heat dissipation modes will be described below.

[0067] In some embodiments of the present application, please refer to Figure 6As shown, the side of the heat dissipation frame 10 away from the interface cage 3 is provided with a plurality of fins 11, which can increase the area of the heat dissipation frame 10 in contact with air, and more heat on the heat dissipation frame 10 can be taken away when the air flows. However, since the space of the card is very limited, and the interface cage 3 needs to accommodate the optical module 200 and has a certain height, the height of the fins 11 is limited. However, in the embodiment of the present application, in order to make the heat dissipation frame 10 have better heat dissipation effect, the heat dissipation frame 10 extends to both sides of the interface cage 3, and the heat dissipation plate 12 extends towards the direction of the card body 2, and a plurality of heat dissipation plates 12 are arranged at intervals, so as to increase the heat dissipation area to obtain better heat dissipation effect.

[0068] Since the optical module 200 triggers the heat dissipation frame 10 to drive the heat dissipation member 20 to move away from the interface cage 3 when the optical module 200 is inserted into the interface cage 3, the heat dissipation assembly 1 is switched from the first position to the second position, but since the heat dissipation member 20 is located in the interface cage 3 through the through hole, it will interfere with the insertion of the optical module 200. In order to solve this problem, please refer to Figure 3 、 Figure 6 As shown, in some embodiments of the present application, along the installation direction of the optical module 200, the side of the heat dissipation member 20 located at the edge of the card body 2 is provided with a guide surface 21, which is inclined from the edge of the heat dissipation member 20 abutting with the heat dissipation frame 10 to the center of the card body 2 and away from the heat dissipation frame 10. When the optical module 200 is inserted into the interface cage 3 and abuts against the guide surface 21 of the heat dissipation member 20, and a pushing force is applied to the guide surface 21, the guide surface 21 will be pushed upward, thereby driving the heat dissipation frame 10 to drive the heat dissipation member 20 to move away from the interface cage 3 along the reset locking member 30.

[0069] In some embodiments of the present application, please refer to Figure 2 As shown, a plurality of reset locking members 30 are arranged on both sides of the heat dissipation frame 10, and the plurality of reset locking members 30 on each side are arranged at intervals to ensure the stability of the switching of the heat dissipation assembly 1 from the first position to the second position. Please refer to Figures 4-6As shown, one of the possible ways to reset the locking member 30 is to include a locking member 31 and a reset member 32 sleeved on the locking member 31. One end of the locking member 31 is connected to the main body of the board card 100 through the heat dissipation frame 10, the other end of the locking member 31 abuts against one end of the reset member 32, and the other end of the reset member 32 abuts against the heat dissipation frame 10. The locking member 31 can limit the heat dissipation assembly 1 on the board card 100 assembly, and the reset member 32 can drive the heat dissipation assembly 1 to automatically return to the first position from the second position when the optical module 200 is pulled out of the interface cage 3. Specifically, when the optical module 200 is inserted into the interface cage 3 to drive the heat dissipation frame 10 to move away from the interface cage 3, the reset member 32 is compressed, and an elastic force for resetting is generated in the reset member 32. After the optical module 200 is installed, the heat dissipation member 20 is tightly abutted against the optical module 200 under the action of the elastic force of the reset member 32, which not only makes the installation of the optical module 200 more reliable, but also realizes better heat conduction compared to the state without abutment.

[0070] Further, please refer to Figure 5 As shown, in some embodiments of the present application, the locking member 31 includes a limiting head 311 and a screw rod 312 located on one side of the limiting head 311, and the reset member 32 is sleeved on the screw rod 312. The heat dissipation frame 10 has a connecting block 13 on both sides of the interface cage 3, and the connecting block 13 is provided with a through stepped hole. The hole diameter on the side away from the board card body 2 is R1 for accommodating the limiting head 311, and the diameter on the side toward the board card body 2 is R2 for accommodating the screw rod 312. The diameter of the reset member 32 is r, R1>r>R2, so that the reset member 32 can be limited between the limiting head 311 and the stepped surface, that is, accommodated in the stepped hole, one end abuts against the limiting head 311, and the other end abuts against the stepped surface. The distance that the reset member 32 can be compressed is the stroke that the heat dissipation frame 10 can slide along the locking member.

[0071] Generally, the board card body 2 is made of a printed circuit board (PCB), so the strength is limited, and the material is relatively brittle. If the screw rod 312 of the locking member 31 is directly screwed on the PCB for threaded fixing, not only the installation strength is not enough, but also the card plate body can be damaged. Therefore, please refer to Figure 2 、 Figure 4 、 Figure 6 As shown, in some embodiments of the present application, the board card 100 further includes a fixing block 4, and the fixing block 4 is arranged on the board card body 2. Both sides of the interface cage 3 are provided with the fixing block 4,

[0072] In some embodiments of the present application, please refer to Figure 2As shown, the card also includes a fan 40, which is arranged on the card body, and the air outlet is directed to the heat sink 10. In order to increase the air flow at the heat sink 10, and accelerate the air flow between the fins 11 and the heat sink plate 12 on the heat sink 10, so that the heat dissipation effect of the heat sink 10 is better. Therefore, in the embodiment of the application, the fan 40 is the third heat dissipation measure, which further increases the heat dissipation effect of the heat dissipation assembly 1. Since the fan 40 is located on the card body 2 on one side of the interface cage 3, and not above the heat sink 10, it is not limited by the space of the card 100.

[0073] It should be noted that although the application specifically lists three heat dissipation structures, in actual application, it can not be limited to three heat dissipation structures, and other heat dissipation structures can be added. If the other heat dissipation structures only have one heat dissipation effect, it is only a further improvement of the heat dissipation effect, and it will also fall within the protection scope of the application.

[0074] It should be noted that the heat dissipation assembly 1 of the application can be integrated on the card body 2 of the application, or can be a separate component integrated on other PCBs to realize the heat dissipation of plug-in electronic elements. The application field can be the field of optoelectronic communication or other fields requiring heat dissipation. As long as the heat dissipation requirement can be met, it can be applied, and the application does not make specific limitations.

[0075] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. A board, characterized in that: include: Board body; An interface cage is provided on one side of the card body, and an optical module is detachably provided in the interface cage and coupled to the card body; as well as A heat dissipation assembly is disposed on the card body and movably covers the portion where the interface cage abuts the card body, and has a first position and a second position. A through hole is provided on the side of the interface cage facing the heat dissipation assembly. When located at the first position, a portion of the heat dissipation assembly passes through the through hole and is located in the interface cage; When in the second position, the optical module is located in the interface cage, and the heat dissipation component is pressed against the optical module to perform multiple cooling on the optical module; The optical module is installed to drive the heat dissipation component to switch from the first position to the second position; When the optical module is removed, the heat dissipation assembly automatically switches from the second position to the first position.

2. The board according to claim 1, wherein: The heat dissipation component includes: a heat dissipation frame, the cover of which is arranged on the interface cage; a heat sink disposed on a side of the heat sink facing the interface cage, wherein the projection of the heat sink on the card body is located within the projection of the through hole on the card body; and A plurality of reset locking members pass through the heat dissipation frame and are connected to the board body, and the heat dissipation frame can slide along the reset locking members; When the heat dissipation assembly is located at the first position, the heat dissipation element passes through the through hole and is located in the interface cage, and the reset locking element is in an initial state; When the heat dissipation assembly is located at the second position, the heat dissipation element is flush with the edge of the through hole in the interface cage and abuts against the optical module, and the reset locking element is in a compressed state.

3. The board according to claim 2, wherein: A plurality of heat sinks are provided at intervals on a side of the heat sink facing away from the interface cage; The heat dissipation frames on both sides of the interface cage are provided with a plurality of heat dissipation plates extending toward the board body.

4. The board according to claim 2, wherein: Along the installation direction of the optical module, the heat sink is provided with a guide surface on one side of the edge of the card body, and the guide surface is inclined from the edge where the heat sink and the heat sink are in contact toward the center of the card body and away from the heat sink.

5. The board according to claim 2, wherein: Also includes: A fixing block is provided on the board body, with the fixing block being provided on both sides of the interface cage; The reset locking member comprises: A locking member and a resetting member sleeved on the locking member; One end of the locking member passes through the heat dissipation frame and is fixed on the fixing block, one end of the reset member abuts against the other end of the locking member, and the other end of the reset member abuts against the heat dissipation frame.

6. The board according to claim 5, wherein: When the heat dissipation assembly is located at the first position, the compressive force in the restoration member is smaller than the compressive force in the restoration member when the heat dissipation assembly is located at the second position.

7. The board according to claim 5, wherein: The locking member includes a limit head and a screw located on one side of the limit head, and the reset member is sleeved on the screw; The heat dissipation rack is provided with connecting blocks on both sides of the interface cage, and a transparent step hole is provided on the connecting block. The reset member is accommodated in the step hole, and one end of the reset member abuts against the limit head, and the other end abuts against the step surface; The screw rod passes through the step hole and is screwed onto the fixing block.

8. The board according to any one of claims 1 to 7, characterized in that: The heat dissipation component further includes: A fan is arranged on the board body, and an air outlet of the fan faces the heat dissipation component.

9. A heat dissipation component, characterized in that: Having a first position and a second position, the heat dissipation assembly includes: The heat dissipation frame is covered at the interface cage, and the interface cage is provided with a through hole; a heat sink, disposed on a side of the heat sink facing the interface and located at the through hole; and A plurality of reset locking members pass through the heat dissipation frame and are connected to the PCB board, and the heat dissipation frame can slide along the reset locking members; When the heat dissipation assembly is located at the first position, the heat dissipation element passes through the through hole and is located in the interface cage, and the reset locking element is in an initial state; When the heat dissipation assembly is located at the second position, the heat dissipation element is flush with the edge of the through hole in the interface cage and abuts against the optical module, and the reset locking element is in a compressed state.

10. The heat dissipation assembly according to claim 9, wherein: Also includes: The fan is arranged on the PCB board, and the air outlet faces the heat dissipation frame.

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