Double-sided heat dissipation optical module and assembling method thereof

Abstract

The invention relates to the technical field of optical modules, and provides a double-sided heat dissipation optical module and an assembling method thereof. The optical assembly is arranged on the PCB in a normal installation mode, so that alignment welding of the optical assembly and the PCB is facilitated, and the process is simple; meanwhile, the concave heat dissipation base and the heat dissipation upper cover both have good heat dissipation performance, and the two sides of the heat dissipation upper cover just abut against the wingspans on the two sides of the concave heat dissipation base, so that a first heat dissipation channel which sequentially passes through the bottom of the optical assembly, the concave heat dissipation base, the heat dissipation upper cover and the module upper cover is constructed, and heat which is absorbed by the concave heat dissipation base and comes from the TEC is dissipated to the module upper cover through the first heat dissipation channel. And the heat is timely transmitted to the module upper cover through the first heat dissipation channel, and heat dissipation is completed through the radiator on the mouse cage used for installing the optical module, so that the optical module has good heat dissipation performance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical modules, in particular to a double-sided heat dissipation optical module and an assembling method thereof. BACKGROUND

[0002] In the field of optical communication, as the core device for realizing photoelectric signal conversion, the performance stability of an optical module directly determines the reliability of an optical transmission system. With the evolution of data transmission rate to 800 Gbps and above, the power consumption of optical devices such as optical transmitting assemblies and driving chips integrated in the optical module increases significantly, resulting in a sharp rise in heat flux density per unit volume.

[0003] The existing optical module generally uses a heat sink on the optical network terminal side for heat dissipation. In order to ensure good heat dissipation performance, the optical components in the optical module are generally assembled in a flip-chip form on a printed circuit board (PCB). When assembled in a flip-chip form, the hot side of a thermoelectric cooler (TEC) in the optical component faces the module upper cover, and the heat can be directly transmitted to the module upper cover, and then transmitted to the squirrel cage heat sink by the module upper cover. This method can achieve good heat dissipation, but the assembly process is complex and the coupling efficiency is low.

[0004] Therefore, it is urgent to overcome the defects of the prior art in the technical field. SUMMARY

[0005] The technical problem to be solved by the embodiments of the present application is to provide a double-sided heat dissipation optical module and an assembling method thereof. The optical components are arranged on the PCB in a normal mounting manner, which facilitates the alignment welding of the optical components and the PCB, the process is simple, the coupling efficiency is high, and a first heat dissipation channel is formed through the bottom of the optical component, the concave heat dissipation base, the heat dissipation upper cover and the module upper cover in sequence. The heat generated by the TEC and absorbed by the concave heat dissipation base is transmitted to the module upper cover through the first heat dissipation channel in time, which reduces the process difficulty and ensures the coupling efficiency without reducing the heat dissipation effect.

[0006] The embodiments of the present application adopt the following technical solutions: On the one hand, a double-sided heat dissipation optical module is provided, which comprises a module upper cover 1, a module base 2, a PCB 3, one or more optical components 4 and one or more heat dissipation components 5. The optical components 4 are arranged on the PCB 3 in a normal mounting manner. One heat dissipation component 5 comprises a concave heat dissipation base 50 and a heat dissipation upper cover 51, and specifically: The wingspans 501 on both sides of the concave heat dissipation base 50 abut on the PCB board 3, and the middle concave part 502 is embedded in the preset through slot 30 of the PCB board 3, and the optical assembly 4 is vertically arranged in the concave part 502 of the concave heat dissipation base 50. The upper heat dissipation cover 51 is abutted on the wingspans 501 on both sides of the concave heat dissipation base 50, thereby forming a first heat dissipation channel sequentially passing through the bottom of the optical assembly 4, the concave heat dissipation base 50, the upper heat dissipation cover 51 and the module upper cover 1.

[0007] Further, the concave surface 503 of the concave heat dissipation base 50 is in a front-rear through type, so as to provide space for the optical fiber drawn from the front end of the optical assembly 4 and the gold wire welding between the pins at the rear end of the optical assembly 4 and the PCB board 3; the left and right sides of the concave surface 503 form the wingspans 501 which are higher than the concave surface 503, thereby forming a concave structure which can be mounted in the preset through slot 30 of the PCB board 3.

[0008] Further, the front end of the upper heat dissipation cover 51 is provided with an optical fiber avoiding groove 510; the vertical cover wall 511 at the rear end of the upper heat dissipation cover 51 exceeds the rear end of the concave heat dissipation base 50 by a preset distance, and the gold wire welding between the pins at the rear end of the optical assembly 4 and the PCB board 3 is covered in the upper heat dissipation cover 51.

[0009] Further, the vertical inner walls 512 on the left and right sides of the upper heat dissipation cover 51 are adapted in width to the wingspans 501 on both sides of the concave heat dissipation base 50, and the abutted surfaces of the vertical inner walls 512 on the left and right sides of the upper heat dissipation cover 51 and the wingspans 501 are made into inverted “﹂” type, thereby forming common heat conduction with the upper surface and the outer side surface of the wingspans 501.

[0010] Further, one or more heat conduction bridge pieces 6 are further included, one side of the heat conduction bridge piece 6 is connected with the outer surface of the upper heat dissipation cover 51, and the other side of the heat conduction bridge piece 6 is connected with the outer surface of the concave part 502 of the concave heat dissipation base 50.

[0011] Further, when the outer surface of the upper heat dissipation cover 51 is specifically the upper surface, the upper surface of the upper heat dissipation cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat conduction bridge piece 6 and maintaining the flatness of the whole upper surface of the upper heat dissipation cover 51.

[0012] Further, the outer surface of the concave part 502 of the concave heat dissipation base 50 is provided with a second bearing gap 5021 for bearing the thickness of the heat conduction bridge piece 6 and maintaining the flatness of the whole outer surface of the concave part 502 of the concave heat dissipation base 50; and the outer surface of the concave part 502 of the concave heat dissipation base 50 is further used for abutting on the module base 2, thereby forming a second heat dissipation channel.

[0013] Further, the heat-conducting bridge sheet 6 is a tungsten-copper sheet, a graphene sheet or a heat-conducting adhesive sheet.

[0014] Further, a heat-conducting sheet 7 is arranged between one side of the heat-conducting bridge sheet 6 and the outer surface of the heat-dissipating upper cover 51, and / or a heat-conducting sheet 7 is arranged between the other side of the heat-conducting bridge sheet 6 and the outer surface of the lower recessed portion 502 of the concave heat-dissipating base 50.

[0015] Further, the optical assembly 4 is composed of one or more of a laser array, a detector array, an optical path structure, a heat sink and a thermoelectric cooler TEC.

[0016] Further, a heat pipe 8 is arranged on the module upper cover 1 and abuts against the heat-dissipating upper cover 51 of the optical assembly 4.

[0017] Further, the optical assembly 4 specifically includes a first optical assembly and a second optical assembly, and the optical module further includes an optical connecting piece 9, the second optical assembly is arranged between the first optical assembly and the optical connecting piece 9, and the first optical assembly and the second optical assembly are connected with the optical connecting piece 9 through an optical fiber.

[0018] Further, the gold fingers of the optical connecting piece 9 and the PCB board 3 are located on the same side of the optical module.

[0019] On the other hand, a method for assembling a double-sided heat-dissipating optical module is provided, which is suitable for the double-sided heat-dissipating optical module, and includes the following steps. After the internal structures of the optical assembly 4 are assembled, the bottom surface of the thermoelectric cooler in the optical assembly 4 is fixed towards the concave surface 503 of the concave heat-dissipating base 50. The lower recessed portion 502 of the concave heat-dissipating base 50 is embedded in the pre-set through slot 30 of the PCB board 3, and the wingspans 501 on both sides of the concave heat-dissipating base 50 abut against the PCB board 3. After the gold wire welding between the pins of the optical assembly 4 and the PCB board 3 is completed, the heat-dissipating upper cover 51 on both sides abuts against the wingspans 501 on both sides of the concave heat-dissipating base 50, thereby constructing a first heat-dissipating channel sequentially passing through the bottom of the optical assembly 4, the concave heat-dissipating base 50, the heat-dissipating upper cover 51 and the module upper cover 1.

[0020] Compared with the prior art, the embodiment of the present application has the following advantages: The optical assembly is arranged on the PCB board in a positive manner, facilitating alignment welding of the optical assembly and the PCB board, and the process is simple; meanwhile, the concave heat dissipation base and the heat dissipation upper cover have good heat dissipation performance, the two sides of the heat dissipation upper cover are just in abutment with the wingspans of the two sides of the concave heat dissipation base, thereby constructing a first heat dissipation channel sequentially passing through the optical assembly bottom, the concave heat dissipation base, the heat dissipation upper cover and the module upper cover, heat generated from the TEC and absorbed by the concave heat dissipation base is timely transmitted to the module upper cover through the first heat dissipation channel, and heat dissipation is completed through the heat sink on the squirrel cage for installing the optical module, and good heat dissipation performance is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, below the drawings needed to be used in the embodiments or the prior art description will be briefly introduced, obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0022] Figure 1 is a structure schematic diagram of an optical communication system provided by the embodiment of the present application; Figure 2 is a partial structure schematic diagram of an optical module plugged in an optical network terminal provided by the embodiment of the present application; Figure 3 is a whole structure schematic diagram of an optical module provided by the embodiment of the present application; Figure 4 is an explosion structure schematic diagram of an optical module provided by the embodiment of the present application; Figure 5 is a partial explosion structure schematic diagram of an optical module provided by the embodiment of the present application; Figure 6 is a structure schematic diagram of a concave heat dissipation base provided by the embodiment of the present application; Figure 7 is a structure schematic diagram of a heat dissipation upper cover abutting on a concave heat dissipation base provided by the embodiment of the present application; Figure 8 is a structure schematic diagram of another heat dissipation upper cover abutting on a concave heat dissipation base provided by the embodiment of the present application; Figure 9 is a structure schematic diagram of another concave heat dissipation base provided by the embodiment of the present application; Figure 10 is a structure schematic diagram of a heat dissipation upper cover provided by the embodiment of the present application; Figure 11 is a structure schematic diagram of a heat-conducting bridge piece provided on one side of a heat dissipation upper cover and a concave heat dissipation base provided by the embodiment of the present application; Figure 12 This is a structural diagram of a heat-conducting bridge provided by an embodiment of the present invention, in which heat-conducting bridges are arranged on both sides of a heat-dissipating upper cover and a concave heat-dissipating base; Figure 13 This is a schematic diagram of a structure in which another heat dissipation upper cover abuts against a concave heat dissipation base provided by an embodiment of the present invention; Figure 14 This is a schematic diagram of a structure in which another heat dissipation upper cover abuts against a concave heat dissipation base provided by an embodiment of the present invention; Figure 15 This is a schematic diagram of a partially exploded structure of another optical module provided by an embodiment of the present invention; Figure 16 1 is a schematic structural diagram of a module upper cover equipped with a heat pipe provided in an embodiment of the present invention; Figure 17 is a schematic cross-sectional structural diagram of an optical module provided by an embodiment of the present invention; Figure 18 The embodiment of the present invention provides Figure 17 A schematic diagram of a heat dissipation channel in a cross-sectional view; Figure 19 The figure is a flow chart of an assembly method of a double-sided heat dissipation optical module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as meaning open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that the specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0025] In the description of the present application, it needs to be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0026] In the description of the present application, the terms "first", "second" are only for description purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can include one or more of the features explicitly or implicitly. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality of" is two or more. In addition, for example, in the description, the same type of nouns may also be described as two independent individuals by adding "A", "B" at the end, in which case the features defined with "A", "B" are only for the purpose of distinguishing the same type of individual description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0027] In describing some embodiments, "coupled", "coupling" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. For another example, the term "coupling" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the term "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other, but still cooperate or interact with each other, such as "optical coupling", "wireless connection" and the like. The embodiments disclosed herein are not necessarily limited to the content of the present application.

[0028] In the description of the present application, the expression "A and / or B" (where A and B are used to represent specific feature content) includes the following three combinations: only A, only B, and the combination of A and B.

[0029] In the present application, "about", "approximately" or "approximately" includes the value stated and the average value within an acceptable deviation range of the specific value, wherein the acceptable deviation range is determined by considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system) by the ordinary skill in the art.

[0030] Figure 1 A connection diagram of an optical communication system. AsFigure 1 As shown, the optical communication system mainly comprises an optical network terminal 90, a remote server 91, a local information processing device 92, an optical module 93, an optical fiber 94 and a network cable 95.

[0031] One end of the optical fiber 94 is connected to the remote server 91, and the other end is connected to the optical network terminal 90 through the optical module 93. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of thousands of meters (6-8 kilometers), and theoretically, super-long distance transmission can be achieved if a repeater is used. Therefore, in a general optical communication system, the distance between the remote server 91 and the optical network terminal 90 can usually reach thousands of meters, tens of kilometers or hundreds of kilometers.

[0032] One end of the network cable 95 is connected to the local information processing device 92, and the other end is connected to the optical network terminal 90. The local information processing device 92 can be any one or several of the following devices: a router, an optical network terminal, a computer, a mobile phone, a tablet computer and a television, etc.

[0033] The physical distance between the remote server 91 and the optical network terminal 90 is greater than the physical distance between the local information processing device 92 and the optical network terminal 90. The connection between the local information processing device 92 and the remote server 91 is completed by the optical fiber 94 and the network cable 95; and the connection between the optical fiber 94 and the network cable 95 is completed by the optical module 93 and the optical network terminal 90.

[0034] The optical module 93 comprises an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 94, so that the optical module 93 and the optical fiber 94 establish a bidirectional optical signal connection; the electrical port is configured to access the optical network terminal 90, so that the optical module 93 and the optical network terminal 90 establish a bidirectional electrical signal connection. The optical module 93 can realize the mutual conversion between optical signals and electrical signals, so as to establish a connection between the optical fiber 94 and the optical network terminal 90. For example, the optical signal from the optical fiber 94 is converted into an electrical signal by the optical module 93 and then input into the optical network terminal 90, and the electrical signal from the optical network terminal 90 is converted into an optical signal by the optical module 93 and then input into the optical fiber 94.

[0035] The optical network terminal 90 includes a housing in the shape of a cuboid, and a network cable interface 96 and an optical module interface 97 arranged on the housing. The optical module interface 97 is configured to access the optical module 93, so that the optical network terminal 90 and the optical module 93 establish a bidirectional electrical signal connection. The network cable interface 96 is configured to access the network cable 95, so that the optical network terminal 90 and the network cable 95 establish a bidirectional electrical signal connection. The connection between the optical module 93 and the network cable 95 is established through the optical network terminal 90. For example, the optical network terminal 90 transmits electrical signals from the optical module 93 to the network cable 95, and transmits signals from the network cable 95 to the optical module 93, so that the optical network terminal 90 can monitor the operation of the optical module 93 as a host of the optical module 93. The host of the optical module 93 can also include an optical line terminal (OLT) and the like in addition to the optical network terminal 90.

[0036] The remote server 91 establishes a bidirectional signal transmission channel with the local information processing device 92 through the optical fiber 94, the optical module 93, the optical network terminal 90, and the network cable 95.

[0037] Figure 2 The structure diagram of the optical module according to some embodiments is inserted into the mouse cage, it is not difficult to see that Figure 2 The optical module in Figure 1 The optical module in Figure 1 The optical module in Figure 2 The optical module inThe reason for such a conversion of the optical module structure diagram is that on the one hand, the technical solution of the present application is suitable for optical modules of various standards, and has the motivation to improve according to the scheme proposed by the present application when encountering the technical problems set by the present application; on the other hand, it is also intended to emphasize that the typical case of the technical solution of the present application is proposed and improved in the optical module scenario as shown in Figure 2

[0038] The optical network terminal 90 further includes a PCB circuit board arranged in the housing, a cage arranged on the surface of the PCB circuit board, an electrical connector arranged in the interior of the cage, and a heat sink 98 arranged on the surface of the cage. The electrical connector is configured to access the electrical port of the optical module 93. The heat sink 98 has a fin or other protruding part that increases the heat dissipation area.

[0039] The optical module 93 is inserted into the cage of the optical network terminal 90, and the cage fixes the optical module 93. The heat generated by the optical module 93 is conducted to the cage, and then diffused through the heat sink 98. After the optical module 93 is inserted into the cage, the electrical port of the optical module 93 is connected to the electrical connector inside the cage, so that the optical module 93 and the optical network terminal 90 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 93 is connected to the optical fiber 94, so that the optical module 93 and the optical fiber 94 establish a bidirectional electrical signal connection.

[0040] In some embodiments of the present application, the optical module 93 comprises a housing composed of a module cover 1 and a module base 2, and a circuit board body. Figure 3

[0041] The assembly mode of the module cover 1 and the module base 2 facilitates the installation of the circuit board and other devices into the housing, and the module cover 1 and the module base 2 can form encapsulation protection for these devices. In addition, when the circuit board and other devices are assembled, the deployment of the positioning components, heat dissipation components and electromagnetic shielding components of these devices is facilitated, which is conducive to the implementation of automated production.

[0042] In some embodiments, the module cover 1 and the module base 2 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.

[0043] In some embodiments, the optical module 93 further comprises an unlocking component located on the outer wall of the housing of the optical module 93. The unlocking component is configured to realize the fixed connection between the optical module 93 and the host computer, or to release the fixed connection between the optical module 93 and the host computer.

[0044] For example, the unlocking component is located on the outer wall of the two lower side plates of the module base 2, and comprises a clamping component matched with the cage of the host computer (for example, the cage of the optical network terminal 90). When the optical module 93 is inserted into the cage of the host computer, the clamping component of the unlocking component fixes the optical module 93 in the cage of the host computer. When the unlocking component is pulled, the clamping component of the unlocking component moves, thereby changing the connection relationship between the clamping component and the host computer, so as to release the clamping relationship between the optical module 93 and the host computer, and the optical module 93 can be pulled out of the cage of the host computer.

[0045] ​The circuit board includes circuit traces, electronic components and chips. The electronic components and chips are connected together by the circuit traces according to circuit design to realize power supply, electrical signal transmission and grounding functions. The electronic components may include, for example, capacitors, resistors, transistors, metal oxide semiconductor field effect transistors (MOSFETs). The chips may include, for example, microcontroller units (MCUs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0046] The circuit board is generally a hard circuit board. Due to its relatively hard material, the hard circuit board can also realize a bearing function, such as the hard circuit board can stably bear the chips; the hard circuit board can also be inserted into an electrical connector in the host computer cage.

[0047] The circuit board also includes a gold finger formed on the surface of the end thereof. The gold finger is composed of a plurality of pins independent of each other. The circuit board is inserted into the cage, and the gold finger is connected in conduction with the electrical connector in the cage. The gold finger can be provided only on the surface (such as the upper surface or the lower surface) of one side of the circuit board. The gold finger is configured to establish electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0048] In the examples shown in the present application, ELSFP (External Laser Small Form Factor Pluggable) is mainly shown, but it should be noted that in the embodiments of the present application, the improvement of the optical path structure and / or the circuit structure in the corresponding technical solutions, the applicable packaging structure includes but is not limited to OSFP (English full name: Octal Small Form-factor Pluggable, abbreviated as: OSFP) packaging, OSFP-XD (English full name: Octal Small Form-factor eXtra Dense Pluggable) packaging, etc. Therefore, the optical path structure and / or circuit structure theory proposed by the inventive labor of the present application should also be applicable to the packaging system that may be proposed in the future without explicit technical contradiction, and therefore should also be understood as being within the protection scope of the present application.

[0049] It should be noted that the above is only an example of the structure of the optical module to facilitate a systematic introduction to the optical module, and does not constitute a limitation on the structure of the optical module. In actual application scenarios, the structure of the optical module can be adaptively modified according to actual needs. For example, the shape of the unlocking structure, the layout of the optical transmitting and receiving components, the structure of the tube module housing, and the shape of the optical fiber connector can be changed.

[0050] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0051] Embodiment 1: This embodiment provides an optical module with double-sided heat dissipation, such as Figure 3 、 Figure 4 and Figure 5 As shown, the optical module includes a module cover 1, a module base 2, a PCB board 3, one or more optical components 4 and one or more heat dissipation components 5. The optical component 4 is arranged on the PCB board 3 in a positive manner, and a heat dissipation component 5 includes a concave heat dissipation base 50 and a heat dissipation cover 51.

[0052] Specifically, the wingspan 501 on both sides of the concave heat dissipation base 50 abuts against the PCB board 3, and the middle lower recess 502 is embedded in the preset through groove 30 on the PCB board 3. The optical component 4 is installed in the lower recess 502 of the concave heat dissipation base 50; the two sides of the heat dissipation cover 51 just abut against the wingspan 501 on both sides of the concave heat dissipation base 50, thereby constructing a first heat dissipation channel that passes through the bottom of the optical component 4, the concave heat dissipation base 50, the heat dissipation cover 51 and the module cover 1 in sequence.

[0053] In the embodiment, when the optical assembly 4 is arranged on the PCB board 3 in a positive manner, the thermoelectric cooler TEC and the optical element (for example, a COC chip, an optical lens, an isolator, etc.) are directly assembled from the front side and directly observed from the side by a charge-coupled device (CCD), the assembly coupling process is lower in difficulty, the alignment welding of the optical assembly 4 and the PCB board 3 is facilitated, the fiber exit and the optical assembly 4 are on the same side of the PCB board 3, the fiber needs not to be penetrated, and the process is simple; meanwhile, the concave heat dissipation base 50 and the heat dissipation upper cover 51 have good heat dissipation performance, the heat dissipation upper cover 51 is in abutment with the wingspans 501 on the two sides of the concave heat dissipation base 50, the heat generated by the optical assembly 4 is transferred to the lower recessed part 502, then to the wingspans 501, and then to the heat dissipation upper cover 51, thereby a first heat dissipation channel sequentially passing through the bottom of the optical assembly 4, the concave heat dissipation base 50, the heat dissipation upper cover 51 and the module upper cover 1 is constructed, the heat absorbed by the concave heat dissipation base 50 from the TEC is timely transferred to the module upper cover 1 through the first heat dissipation channel, and is dissipated through the heat sink on the squirrel cage for mounting the optical module, thereby having good heat dissipation performance.

[0054] In one embodiment, as shown in Figure 6 , the concave surface 503 of the concave heat dissipation base 50 is in a front-rear through form, and provides space for the optical fiber drawn from the front end of the optical assembly 4 and the gold wire welding between the pins at the rear end of the optical assembly 4 and the PCB board 3; the wingspans 501 on the left and right sides of the concave surface 503 are higher than the concave surface 503, thereby constructing the concave structure that can be hung on the pre-set through slot 30 of the PCB board 3. Figure 5 and Figure 6 For example, the front end refers to the right end, and the rear end refers to the left end.

[0055] In one embodiment, as shown in Figure 7 , the front end of the heat dissipation upper cover 51 is made with a fiber avoiding recess 510, so that the optical fiber is drawn out from the fiber avoiding recess 510, and then connected with the optical connecting piece 9 (as shown in Figure 4 ). Referring to Figure 8 , the vertical cover wall 511 at the rear end of the heat dissipation upper cover 51 is beyond the rear end of the concave heat dissipation base 50 below by a pre-set distance L1, and the gold wire welding between the pins at the rear end of the optical assembly 4 and the PCB board 3 is covered in the heat dissipation upper cover 51. In the embodiment, the heat dissipation upper cover 51 and the concave heat dissipation base 50 construct a relatively closed space, avoid optical crosstalk and electromagnetic wave crosstalk, and can also physically protect the optical element and the optical path, the bonding gold wire, etc. in the optical assembly 4, avoid smoke or particulate matter from entering and then polluting the optical end face and affecting the optical path signal.

[0056] In one embodiment, as shown in Figure 9 and Figure 10 the width of the vertical inner wall 512 on the left and right sides of the heat dissipation upper cover 51 (i.e., W1 in Figure 10 ) is adapted to the width of the wingspan 501 on the left and right sides of the concave heat dissipation base 50 (i.e., W0 in Figure 9 ), wherein the abutting surface of the vertical inner wall 512 on the left and right sides of the heat dissipation upper cover 51 and the wingspan 501 is made into an inverted "﹂" shape, thereby forming a common heat conduction with the upper surface and the outer side surface of the wingspan 501. That is, in combination with Figure 6 and Figure 10 , the lower surface 5120 of the vertical inner wall 512 abuts against the upper surface 5010 of the wingspan 501, and the inner side surface 5121 of the vertical inner wall 512 abuts against the outer side surface 5011 of the wingspan 501, so as to conduct heat through different surfaces.

[0057] The heat is transferred from the lower concave part 502 to the wingspan 501 through a long path, in order to shorten the path and improve heat dissipation. In one embodiment, in combination with Figure 5 , the double-sided heat dissipation optical module further comprises one or more heat-conducting bridge pieces 6, one side of the heat-conducting bridge piece 6 is connected to the outer surface of the heat dissipation upper cover 51, and the other side of the heat-conducting bridge piece 6 is connected to the outer surface of the lower concave part 502 of the concave heat dissipation base 50. The heat-conducting bridge piece 6 can be a tungsten-copper sheet, a graphene sheet, a heat-conducting adhesive sheet, or can also be formed by other materials with good heat-conducting properties.

[0058] The heat-conducting bridge piece 6 can include a connecting piece body (not marked in the figure), both sides of the connecting piece body are bent to the same side to form a first connecting piece (not marked in the figure) and a second connecting piece (not marked in the figure), respectively, the first connecting piece is connected to the outer surface of the heat dissipation upper cover 51, and the second connecting piece is connected to the outer surface of the lower concave part 502 of the concave heat dissipation base 50, and the connecting piece body not bent is in close contact with the side wall of the heat dissipation upper cover 51. In this way, both sides of the heat-conducting bridge piece 6 are connected to the heat dissipation upper cover 51 and the concave heat dissipation base 50 located on both sides of the circuit board, respectively, so as to transfer the heat absorbed by the concave heat dissipation base 50 to the heat dissipation upper cover 51 through the heat-conducting bridge piece 6.

[0059] After the heat-conducting bridge piece 6 is added, the heat generated by the optical assembly 4 is transferred to the lower concave part 502, a part of the heat can be transferred from the lower concave part 502 to the wingspan 501, and then to the heat dissipation upper cover 51 through the wingspan 501; more heat is directly transferred from the lower concave part 502 to the heat-conducting bridge piece 6, and the heat-conducting bridge piece 6 transfers the heat to the heat dissipation upper cover 51, thereby constructing a first heat dissipation channel through the optical assembly 4, the concave heat dissipation base 50, the heat dissipation upper cover 51 and the module upper cover 1 in turn.

[0060] In the embodiment, as shown in the drawings, the heat-conducting bridge 6 can be connected to one side of the heat-dissipating upper cover 51 and the concave heat-dissipating base 50. In order to further improve the heat-conducting efficiency, as shown in the drawings, the heat-conducting bridge 6 can also be connected to both sides of the heat-dissipating upper cover 51 and the concave heat-dissipating base 50. Then the concave heat-dissipating base 50 can conduct heat to the heat-dissipating upper cover 51 through the heat-conducting bridges 6 on both sides, so that the first heat-dissipating channel has two sub-heat-dissipating channels, and the heat-conducting efficiency is improved. Figure 11 Figure 12 In the embodiment, as shown in the drawings, the heat-conducting bridge 6 can be connected to one side of the heat-dissipating upper cover 51 and the concave heat-dissipating base 50. In order to further improve the heat-conducting efficiency, as shown in the drawings, the heat-conducting bridge 6 can also be connected to both sides of the heat-dissipating upper cover 51 and the concave heat-dissipating base 50. Then the concave heat-dissipating base 50 can conduct heat to the heat-dissipating upper cover 51 through the heat-conducting bridges 6 on both sides, so that the first heat-dissipating channel has two sub-heat-dissipating channels, and the heat-conducting efficiency is improved.

[0061] In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole. Figure 13 In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole.

[0062] Figure 9 In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole. Figure 14 In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole.

[0063] Figure 15 In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole.

[0064] In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole.

[0065] In the embodiment, as shown in the drawings, the outer surface of the heat-dissipating upper cover 51 is specifically the upper surface, and the upper surface of the heat-dissipating upper cover 51 is provided with a first bearing gap 513 for bearing the thickness of the heat-conducting bridge 6 to maintain the flatness of the upper surface of the heat-dissipating upper cover 51 as a whole. Figure 16 ​​​As shown, the double-sided heat dissipation optical module further comprises a heat pipe 8; the heat pipe 8 is fixedly arranged on the module upper cover 1 and abuts against the heat dissipation upper cover 51 on the optical assembly 4. In order to facilitate the fixation of the heat pipe 8, the module upper cover 1 is provided with a receiving groove 10, wherein the length and width of the heat pipe 8 match the size of the receiving groove 10. In this embodiment, the heat dissipation upper cover 51 transmits the absorbed heat to the heat pipe 8, the heat pipe 8 transmits the heat to the module upper cover 1, and finally the heat is taken away by the heat sink 98 on the cage (as shown in Figure 2 ).

[0066] In one embodiment, in combination with Figure 6 , the concave surface 503 of the concave heat dissipation base 50 is further provided with a reference groove 504, which serves as a reference positioning line when the TEC is attached, and it is easier to align the position when the TEC is attached under the microscope.

[0067] In summary, in combination with Figure 17 and Figure 18 , the main heat dissipation path of one possible implementation is described: the heat generated by the optical assembly 4 is transmitted to the lower concave part 502, a part of the heat can be transmitted to the wing span 501 by the lower concave part 502, and then transmitted to the heat dissipation upper cover 51 by the wing span 501; more heat is directly transmitted to the heat conduction bridge 6 by the lower concave part 502, and the heat conduction bridge 6 transmits the heat to the heat dissipation upper cover 51, thereby constructing a first heat dissipation channel passing through the bottom of the optical assembly 4, the concave heat dissipation base 50, the heat dissipation upper cover 51 and the module upper cover 1 in turn. In combination with Figure 18 , for the scheme shown in Figure 12 both sides are provided with heat conduction bridges 6, the first heat dissipation channel comprises a left sub-heat dissipation channel a1 and a left sub-heat dissipation channel a2; for the scheme shown in Figure 11 one side is provided with a heat conduction bridge 6, the first heat dissipation channel comprises a left sub-heat dissipation channel a1 and a heat dissipation channel formed by the right wing span 501 and the heat dissipation upper cover 51.

[0068] Whether it is the scheme shown in Figure 11 one side is provided with a heat conduction bridge 6 or the scheme shown in Figure 12 both sides are provided with heat conduction bridges 6, both of them further comprise a second heat dissipation channel b formed by the lower concave part 502 and the module base 2.

[0069] So far, the relatively complete heat dissipation scheme of the embodiment of the present application is constructed, and the unique assembly process matched in the embodiment of the present application can also be brought out, including: after the internal structural components of the optical assembly 4 are assembled, the bottom surface of the thermoelectric cooler in the optical assembly 4 is fixed towards the concave surface 503 of the concave heat dissipation base 50. The lower concave part 502 of the concave heat dissipation base 50 is embedded in the pre-set through slot 30 on the PCB 3, and the wingspans 501 on both sides of the concave heat dissipation base 50 are abutted on the PCB 3. After the gold wire welding between the pins of the optical assembly 4 and the PCB 3 is completed, the wingspans 501 on both sides of the concave heat dissipation base 50 are abutted on the wingspans 501 on both sides of the concave heat dissipation base 50, so as to construct the first heat dissipation channel passing through the bottom of the optical assembly 4, the concave heat dissipation base 50, the heat dissipation upper cover 51 and the module upper cover 1 in turn. In order to further improve the heat dissipation efficiency, one side of the heat-conducting bridge 6 is connected with the outer surface of the heat dissipation upper cover 51, and the other side of the heat-conducting bridge 6 is connected with the outer surface of the lower concave part 502 of the concave heat dissipation base 50.

[0070] In one embodiment, the optical assembly 4 is composed of one or more of a laser array, a detector array, an optical path structure, a heat sink and a thermoelectric cooler TEC.

[0071] In one embodiment, in combination with Figure 4 , the optical assembly 4 specifically includes a first optical assembly (i.e. Figure 5 , the optical assembly arranged on the left concave heat dissipation base 50 is called the first optical assembly) and a second optical assembly (i.e. Figure 5 , the optical assembly arranged on the right concave heat dissipation base 50 is called the second optical assembly). In combination with Figure 4 , the optical module further includes an optical connector 9, the second optical assembly is arranged between the first optical assembly and the optical connector 9, and the first optical assembly, the second optical assembly and the optical connector 9 are connected through optical fibers.

[0072] In the embodiment of the present application, the interface of the corresponding optical connector 9 is usually an MPO (English full name: Multi-fiber Push On) interface.

[0073] In one embodiment, the gold fingers of the optical connector 9 and the PCB 3 are located on the same side of the optical module. For example, the gold fingers are arranged on the lower surface of the PCB 3, and the optical connector 9 is arranged on the upper surface of the PCB 3.

[0074] The first optical assembly and the second optical assembly are both light emitting assemblies; or the first optical assembly can be a light emitting assembly, and the second optical assembly can be a light receiving assembly; or the first optical assembly can be a light receiving assembly, and the second optical assembly can be a light emitting assembly. In addition, in the feasible scheme, the first optical assembly and the second optical assembly can also be a mixed mode in which part is a light receiving assembly and part is a light emitting assembly.

[0075] The embodiment of the application is also applicable to future higher-speed optical modules, such as 3.2T or even higher-speed optical modules. Due to the requirement of the speed, the integration of the first optical assembly and the second optical assembly is improved. For example, in the embodiment of the application, the typical first optical assembly includes eight optical devices (which can be lasers and / or detectors), and in a higher integration solution, an arrayed waveguide grating (AWG) can be introduced into the first optical assembly to pre-couple the output of the optical device, thereby reducing the number of optical fibers exported by the first optical assembly.

[0076] Embodiment 2 Based on the foregoing embodiment, the embodiment provides an assembly method of the double-sided heat dissipation optical module, which is suitable for the double-sided heat dissipation optical module described in the foregoing embodiment, and combines Figures 3-18 As shown in the structural diagram shown in Figure 19 The assembly method of the double-sided heat dissipation optical module includes the following steps. Step 101: After the internal structure assembly of the optical assembly 4 is completed, the bottom surface of the thermoelectric cooler in the optical assembly 4 is fixed towards the concave surface 503 of the concave heat dissipation base 50.

[0077] In this embodiment, the reference groove 504 is used as a reference positioning line when the thermoelectric cooler TEC is attached, and the TEC is attached under a microscope.

[0078] Step 102: The lower concave part 502 of the concave heat dissipation base 50 is embedded in the pre-set through slot 30 on the PCB 3, and the wingspans 501 on both sides of the concave heat dissipation base 50 are abutted on the PCB 3.

[0079] After the concave heat dissipation base 50 with the optical assembly 4 attached is installed on the PCB 3, the gold wire welding operation between the pins of the optical assembly 4 and the PCB 3 is performed, and the optical fiber of the optical assembly 4 is led out from the front end of the concave heat dissipation base 50.

[0080] Step 103: after the gold wire welding between the pins of the optical component 4 and the PCB board 3 is completed, the two sides of the heat dissipation upper cover 51 are just in contact with the wingspans 501 on the two sides of the concave heat dissipation base 50, so as to build a first heat dissipation channel through the bottom of the optical component 4, the concave heat dissipation base 50, the heat dissipation upper cover 51 and the module upper cover 1 in sequence.

[0081] In order to ensure better heat conduction effect, the two sides of the heat conduction bridge 6 are connected with the heat dissipation upper cover 51 and the concave heat dissipation base 50 on the two sides of the circuit board respectively, so as to transmit the heat absorbed by the concave heat dissipation base 50 to the heat dissipation upper cover 51 through the heat conduction bridge 6.

[0082] In order to make the heat conduction bridge 6 have better heat conduction performance with the heat dissipation upper cover 51 and the concave heat dissipation base 50, a heat conduction sheet 7 is arranged between one side of the heat conduction bridge 6 and the outer surface of the heat dissipation upper cover 51, and a heat conduction sheet 7 is arranged between the other side of the heat conduction bridge 6 and the outer surface of the lower concave part 502 of the concave heat dissipation base 50.

[0083] In the embodiment, the optical component 4 is arranged on the PCB board 3 in a normal manner, which is convenient for the alignment welding of the optical component 4 and the PCB board 3, and the process is simple; meanwhile, the concave heat dissipation base 50 and the heat dissipation upper cover 51 have good heat dissipation performance, the two sides of the heat dissipation upper cover 51 are just in contact with the wingspans 501 on the two sides of the concave heat dissipation base 50, so as to build a first heat dissipation channel through the bottom of the optical component 4, the concave heat dissipation base 50, the heat dissipation upper cover 51 and the module upper cover 1 in sequence, the heat absorbed by the concave heat dissipation base 50 from the TEC is timely transmitted to the module upper cover 1 through the first heat dissipation channel, and heat dissipation is completed through the heat sink on the squirrel cage for installing the optical module, which has good heat dissipation performance.

[0084] The above only describes the preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A double-sided heat dissipation optical module, comprising a module cover (1), a module base (2), a PCB board (3), one or more optical components (4) and one or more heat dissipation components (5), characterized in that: The optical component (4) is arranged on the PCB board (3) in a normal manner, and a heat dissipation component (5) includes a concave heat dissipation base (50) and a heat dissipation upper cover (51), specifically: The wingspans (501) on both sides of the concave heat dissipation base (50) abut against the PCB board (3), the middle concave portion (502) is embedded in a preset through groove (30) on the PCB board (3), and the optical component (4) is mounted in the concave portion (502) of the concave heat dissipation base (50); The two sides of the heat dissipation cover (51) are in contact with the wingspans (501) on both sides of the concave heat dissipation base (50), thereby forming a first heat dissipation channel that passes through the bottom of the optical component (4), the concave heat dissipation base (50), the heat dissipation cover (51) and the module cover (1) in sequence.

2. The double-sided heat dissipation optical module according to claim 1, characterized in that: The concave surface (503) of the concave heat dissipation base (50) is in a front-to-back through-type form, so as to provide space for the optical fiber led out from the front end of the optical component (4) and for the gold wire welding between the pins at the rear end of the optical component (4) and the PCB board (3); the left and right sides of the concave surface (503) form a wingspan (501) higher than the concave surface (503), thereby constructing a concave structure that can be mounted on the preset through slot (30) on the PCB board (3).

3. The double-sided heat dissipation optical module according to claim 1, characterized in that: The front end of the heat dissipation cover (51) is provided with an optical fiber avoidance groove (510); the vertical cover wall (511) at the rear end of the heat dissipation cover (51) extends beyond a preset distance from the rear end of the concave heat dissipation base (50) located below, wherein the gold wire bonding wire between the pins at the rear end of the optical component (4) and the PCB board (3) is covered within the heat dissipation cover (51).

4. The double-sided heat dissipation optical module according to claim 3, characterized in that: The widths of the vertical inner walls (512) on the left and right sides of the heat dissipation upper cover (51) are adapted to the widths of the wingspans (501) on both sides of the concave heat dissipation base (50), wherein the contact surfaces of the vertical inner walls (512) on the left and right sides of the heat dissipation upper cover (51) and the wingspans (501) are made into an inverted "﹂" shape, thereby forming a common heat conduction with the upper surface and outer side surface of the wingspans (501).

5. The double-sided heat dissipation optical module according to claim 1, characterized in that: It also includes one or more heat-conducting bridge pieces (6), one side of the heat-conducting bridge piece (6) is connected to the outer surface of the heat-dissipating upper cover (51), and the other side of the heat-conducting bridge piece (6) is connected to the outer surface of the lower concave portion (502) of the concave heat-dissipating base (50).

6. The double-sided heat dissipation optical module according to claim 5, characterized in that: When the outer surface of the heat dissipation upper cover (51) is specifically the upper surface, the upper surface of the heat dissipation upper cover (51) is provided with a first bearing notch (513) for bearing the thickness of the heat-conducting bridge sheet (6) and maintaining the overall flatness of the upper surface of the heat dissipation upper cover (51).

7. The double-sided heat dissipation optical module according to claim 5, characterized in that: The outer surface of the concave portion (502) of the concave heat dissipation base (50) is provided with a second bearing notch (5021), which is used to bear the thickness of the heat-conducting bridge sheet (6) and maintain the overall flatness of the outer surface of the concave portion (502) of the concave heat dissipation base (50); wherein the outer surface of the concave portion (502) of the concave heat dissipation base (50) is also used to abut against the module base (2) to construct a second heat dissipation channel.

8. The double-sided heat dissipation optical module according to claim 5, characterized in that: The heat-conducting bridge sheet (6) is a tungsten-copper sheet, a graphene sheet or a heat-conducting adhesive sheet.

9. The double-sided heat dissipation optical module according to claim 5, characterized in that: A heat conducting sheet (7) is further provided between one side of the heat conducting bridge sheet (6) and the outer surface of the heat dissipation upper cover (51); and / or a heat conducting sheet (7) is further provided between the other side of the heat conducting bridge sheet (6) and the outer surface of the lower concave portion (502) of the concave heat dissipation base (50).

10. The double-sided heat dissipation optical module according to any one of claims 1 to 9, characterized in that: The optical component (4) is composed of one or more of a laser array, a detector array, an optical path structure, a heat sink, and a thermoelectric cooler.

11. The double-sided heat dissipation optical module according to any one of claims 1 to 9, characterized in that: It also includes a heat pipe (8); the heat pipe (8) is fixedly arranged on the module upper cover (1) and abuts against the heat dissipation upper cover (51) on the optical component (4).

12. The double-sided heat dissipation optical module according to any one of claims 1 to 9, characterized in that: The optical component (4) specifically includes a first optical component and a second optical component, and the optical module further includes an optical connector (9), wherein the second optical component is arranged between the first optical component and the optical connector (9), and the first optical component and the second optical component are connected to the optical connector (9) via an optical fiber.

13. The double-sided heat dissipation optical module according to claim 12, characterized in that: The optical connector (9) and the gold finger of the PCB board (3) are located on the same side of the optical module.

14. A method for assembling a double-sided heat dissipation optical module, the method being applicable to the double-sided heat dissipation optical module according to any one of claims 1 to 13, characterized in that: include: After assembling all internal structural components of the optical component (4), fix the bottom surface of the thermoelectric cooler in the optical component (4) toward the concave surface (503) of the concave heat dissipation base (50); The lower concave portion (502) of the concave heat dissipation base (50) is embedded in a preset through groove (30) on the PCB board (3), and the wingspans (501) on both sides of the concave heat dissipation base (50) are abutted against the PCB board (3); After the gold wire welding between the pins of the optical component (4) and the PCB board (3) is completed, the two sides of the heat dissipation cover (51) are exactly in contact with the wingspans (501) on both sides of the concave heat dissipation base (50), thereby constructing a first heat dissipation channel that passes through the bottom of the optical component (4), the concave heat dissipation base (50), the heat dissipation cover (51) and the module cover (1) in sequence.

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