Server

Abstract

The invention provides a server, and relates to the technical field of computers, the server comprises a case base and an upper cover, the case base and the upper cover are buckled to form a containing cavity, the interior of the containing cavity is divided into a first space and a second space in the first direction, and a GPU module and a first fan module located on one side of the GPU module in the second direction are arranged in the first space; an HDD module, a second fan module, a mainboard module and a PSU power supply module are sequentially arranged in the second space in the second direction, the first fan module and the second fan module dissipate heat in the second direction, and the first direction is perpendicular to the second direction. In the second direction, the first fan module is located on one side of the GPU module, the second fan module is located on one side of the mainboard module, the second direction is the flowing direction of air in the server, the heat dissipation direction of the first fan module and the heat dissipation direction of the second fan module are the same as the flowing direction of the air in the server, and the heat dissipation efficiency is improved. Due to the arrangement of the devices in the containing cavity, the server can adapt to effective heat dissipation of the electronic devices which are densely arranged in a narrow space.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a server. Background Art

[0002] AI products continue to empower healthcare, education and finance, smart manufacturing, and industrial automation, posing a severe challenge to server hardware infrastructure. AI servers are densely populated with various components, many of which require varying degrees of heat dissipation during operation. Failure to dissipate heat from these densely packed components can negatively impact the performance and speed of the AI ​​server. Therefore, addressing this high-density heat dissipation challenge in the current market. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to provide a server that can achieve efficient heat dissipation in a smaller space.

[0004] In one aspect of an embodiment of the present application, a server is provided, comprising a chassis base and an upper cover, wherein the chassis base and the upper cover are buckled together to form a cavity, wherein the cavity is divided into a first space and a second space along a first direction, wherein a GPU module and a first fan module located on one side of the GPU module along a second direction are disposed in the first space; an HDD module, a second fan module, a motherboard module and a PSU power supply module are disposed in sequence in the second direction in the second space, wherein the first fan module and the second fan module both dissipate heat along the second direction, and the first direction is perpendicular to the second direction.

[0005] Optionally, the first fan module includes a plurality of first dual-rotor axial fans, and the plurality of first dual-rotor axial fans are arranged in an array along the first direction and the third direction. The fan axes of the first dual-rotor axial fans are set along the second direction, and the third direction is perpendicular to the first direction and the second direction in pairs.

[0006] Optionally, the GPU modules are arranged in two rows along the second direction, and each row has multiple GPU modules arranged along the third direction, and the first fan module is located between the two rows of GPU modules along the second direction.

[0007] Optionally, a first air inlet and a window are formed on the side walls at both ends of the chassis base along the second direction, respectively. The air entering through the first air inlet passes through the first fan module and discharges the heat of the GPU module through the window.

[0008] Optionally, a tray is further provided in the first space, the GPU module is provided on the tray, and the tray is slidably connected to the chassis base.

[0009] Optionally, the second fan module comprises a plurality of second double-rotor axial flow fans, the plurality of second double-rotor axial flow fans are arranged side by side along a third direction, and fan shafts of the second double-rotor axial flow fans are arranged along the second direction.

[0010] Optionally, a second air inlet is formed in a side wall of the chassis base along the third direction for air intake, air entering through the second air inlet is discharged from the window after passing through the second fan module to remove heat generated by the mainboard module.

[0011] Optionally, the mainboard module comprises a mainboard, the mainboard is provided with a mainboard-end CPU, a DIMM memory module and a wind shield arranged side by side along a third direction, the wind shield is located on one side of the mainboard-end CPU and the DIMM memory module along the second direction, and the wind shield is arranged close to the second air inlet, a flow channel is formed in the wind shield along the second direction to correspond to the mainboard-end CPU and the DIMM memory module, air entering through the second air inlet is cooled by the flow channel, and the heat generated is discharged through the PSU power supply module and the window.

[0012] Optionally, the mainboard is further provided with a heat sink, the heat sink is located on one side of the mainboard-end CPU along the third direction to cool the mainboard-end CPU.

[0013] Optionally, operating points of the first double-rotor axial flow fan and the second double-rotor axial flow fan are located at one-half to two-thirds of PQ curves of the first double-rotor axial flow fan and the second double-rotor axial flow fan.

[0014] The server provided by the embodiment of the present application is provided with the first fan module and the second fan module, the first fan module is located on one side of the GPU module along the second direction, the second fan module is located on one side of the mainboard module along the second direction, the second direction is the flow direction of air in the server, the heat dissipation directions of the first fan module and the second fan module are the same as the flow direction of air in the server, and the heat dissipation efficiency can be improved. And the layout of the above-mentioned devices in the cavity makes the server of the present application adapt to the effective heat dissipation of the densely arranged electronic devices in a small space. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 is one of the server structure schematic diagrams provided by the embodiments of the present application;

[0017] Figure 2 is a schematic diagram of a server appearance provided by an embodiment of the present application;

[0018] Figure 3 is a schematic diagram of a server structure provided by an embodiment of the present application;

[0019] Figure 4 is a schematic diagram of a server explosion structure provided by an embodiment of the present application;

[0020] Figure 5 is a schematic diagram of a server explosion structure provided by an embodiment of the present application;

[0021] Figure 6 is a schematic diagram of a server explosion structure provided by an embodiment of the present application;

[0022] Figure 7 is a schematic diagram of a server fan operating point and PQ curve relationship provided by an embodiment of the present application;

[0023] Figure 8 is a schematic diagram of a server particle flow field cloud provided by an embodiment of the present application.

[0024] Icon: 101 - case base; 101a - second air inlet; 102 - upper cover; 103 - front panel; 11 - GPU module; 110 - tray; 12 - first fan module; 13 - HDD module; 14 - second fan module; 15 - mainboard module; 150 - mainboard; 151 - mainboard end CPU; 152 - heat sink; 153 - DIMM memory module; 154 - wind shield; 154a - flow channel; 16 - PSU power supply module; F1 - first direction; F2 - second direction; F3 - third direction. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.

[0026] In the description of the present application, it should be noted that the directions or position relationships indicated by the terms "in", "out", etc. are based on the directions or position relationships shown in the drawings, or the directions or position relationships in which the products of the present application are usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are only used for differentiation and description, and cannot be understood as indicating or implying relative importance.

[0027] It should be noted that, unless otherwise explicitly specified and limited, the terms "set", "connected" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0028] Please refer to Figure 1 , Figure 2 The server provided by the embodiments of the present application comprises a chassis base 101 and an upper cover 102, the chassis base 101 and the upper cover 102 are buckled to form a cavity, the cavity is divided into a first space and a second space along a first direction F1, a GPU module 11 and a first fan module 12 located on one side of the GPU module 11 along a second direction F2 are arranged in the first space; an HDD module 13, a second fan module 14, a mainboard module 15 and a PSU power supply module 16 are arranged in the second space along the second direction F2 in sequence, the first fan module 12 and the second fan module 14 both dissipate heat along the second direction F2, and the first direction F1 is perpendicular to the second direction F2.

[0029] The chassis base 101 forms a U-shaped structure, and the upper cover 102 is buckled above the U-shaped chassis base 101, so that the cavity is formed between the chassis base 101 and the upper cover 102. The front end of the cavity along the second direction F2 is provided with a front panel 103, and the rear end of the cavity is open to semi-encapsulate the cavity.

[0030] The cavity is divided into a first space and a second space along the first direction F1, and the first space and the second space can be separated by a partitioning baffle to form independent heat dissipation channels. For example, as shown in Figure 3 , the first space is a 4U space, and the second space is a 2U space, 1U = 44.45mm, which specifically refers to the height of the chassis in the first direction F1.

[0031] The first space is located at the top and is provided with a GPU (Graphics Processing Unit) module and a first fan module 12, and the first fan module 12 is used for dissipating heat of the GPU module 11.

[0032] The second space is located at the bottom and is provided with an HDD (Hard Disk Drive) module, a second fan module 14, a mainboard module 15 and a PSU (Power Supply Unit) power supply module. The second fan module 14 is used for dissipating heat of the mainboard module 15.

[0033] The PSU module 16 is connected with the HDD module 13, the mainboard module 15, the GPU module 11, the first fan module 12 and the second fan module 14 respectively to supply power to these devices.

[0034] The mainboard module 15 is connected with the HDD module 13, the GPU module 11, the first fan module 12 and the second fan module 14 respectively to signal connect with these devices and control the start and stop of these devices.

[0035] In the structural layout, for example, the length (second direction F2), width (third direction F3) and height (first direction F1) of the 6U cavity formed by the first space and the second space are 950mm x 445.5mm x 264mm respectively, the hole size of the cavity in the second direction F2 is 3mm x 3mm, which can be used as an air inlet and a window, and the opening rate is 45% square hole. The distance between the HDD module 13 and the second fan module 14 in the second space is 35mm, the hole size of the upper side wall of the HDD module 13 is 30mm x 75mm, and the distance between the second fan module 14 and the GPU module 11 upstream and downstream of the second direction F2 needs to be 45mm and 65mm respectively, and the distance between all GPU modules 11 and the upper cover 102 is at least 9mm.

[0036] The server provided by the embodiment of the present application is located on one side of the GPU module 11 in the second direction F2, and the second fan module 14 is located on one side of the mainboard module 15, the second direction F2 is the flow direction of air in the server, and the heat dissipation direction of the first fan module 12 and the second fan module 14 is the same as the flow direction of air in the server, which can improve the heat dissipation efficiency. And through the layout of the above devices in the cavity, the server of the present application can adapt to the effective heat dissipation of the densely arranged electronic devices in the narrow space.

[0037] Specifically, as shown in Figure 4 , Figure 5 , Figure 6 The first fan module 12 includes a plurality of first double-rotor axial flow fans, the plurality of first double-rotor axial flow fans are arranged in an array along the first direction F1 and the third direction F3, the fan shafts of the first double-rotor axial flow fans are arranged along the second direction F2, and the third direction F3 is perpendicular to the first direction F1 and the second direction F2.

[0038] The first fan module 12 for dissipating heat from the GPU module 11 can use an 8080 double-rotor axial flow fan, and the air volume and air pressure parameters thereof are 201.9cfm and 7.40inch-H2O respectively, and the outer dimension thereof is 80x80x80 (unit: mm).

[0039] The first double-rotor axial fan has eight, which are arranged in two rows along the first direction F1, and each row has four along the third direction F3.

[0040] The GPU module 11 is arranged in two rows along the second direction F2, and each row has multiple GPU modules 11 along the third direction F3. The first fan module 12 is located between the two rows of GPU modules 11 along the second direction F2.

[0041] The eight first double-rotor axial fans are located between the two rows of GPU modules 11, which can simultaneously dissipate heat from the two rows of GPU modules 11. Each GPU module 11 is spaced apart in the third direction F3 to form a gap between adjacent GPU modules 11, so that the heat dissipated can be discharged from the gap.

[0042] The first air inlet and the window are formed on the side walls at both ends of the chassis base 101 along the second direction F2. The air entering the first air inlet is discharged from the window after passing through the first fan module 12 to dissipate the heat of the GPU module 11.

[0043] The first air inlet is arranged on the front panel 103, and the window is located at the rear end of the cavity. The air enters the first space from the first air inlet on the front panel 103, passes through the GPU module 11 upstream of the first double-rotor axial fan, is sucked into the first double-rotor axial fan, and is discharged from the rear rotor to blow to the GPU module 11 downstream. Finally, all system heat is carried away through the window at the rear end.

[0044] Further, the first space is also provided with a tray 110, and the GPU module 11 is arranged on the tray 110. The tray 110 is slidably connected with the chassis base 101.

[0045] The GPU module 11 is located on the tray 110, and when installed, the GPU module 11 is conveniently inserted into the first space through the sliding connection of the tray 110 with the chassis base 101. For example, the tray 110 and the chassis base 101 can be connected through a slide rail, and the tray 110 can be pulled out of the first space along the second direction F2 along the slide rail, which is convenient for detecting and maintaining the GPU module 11. The front panel 103, the GPU module 11 and the tray 110 can be fixed as a whole through screws, and then the whole is inserted into the first space through the slide rail.

[0046] The first fan module 12 can also be installed in the first space of the cavity along the first direction F1 through a slide rail, and then the upper cover 102 can be installed. The upper cover 102 can be fixedly connected with the positioning hole of the outer wall of the chassis base 101 to ensure that the upper cover 102 does not loosen during use of the equipment.

[0047] For the device in the second space, the second space uses a second double-rotor axial fan as the second fan module 14 to dissipate heat for the mainboard module 15. Specifically, the second double-rotor axial fan is multiple, and the multiple second double-rotor axial fans are arranged side by side along the third direction F3, and the fan shaft of the second double-rotor axial fan is arranged along the second direction F2.

[0048] The 8056 double-rotor axial fan is used as the second double-rotor axial fan, and the air volume and air pressure parameters thereof are 130.4cfm and 8.41inch-H2O respectively, and the outer dimension thereof is 80x80x56 (unit: mm).

[0049] The fan shaft of the second double-rotor axial fan is also consistent with the fluid flow direction in the cavity, and is arranged along the second direction F2, which can directly target the heat source to carry away and discharge the system, so that the heat dissipation efficiency is high.

[0050] Meanwhile, the first double-rotor axial fan and the second double-rotor axial fan are arranged in a parallel array, and multiple high-pressure fan units can increase the total air volume of the system, thereby improving the heat dissipation efficiency.

[0051] Further, the second air inlet 101a is provided on the side wall of the chassis base 101 along the third direction F3 for air inlet, and the air entering through the second air inlet 101a is discharged from the rear window after passing through the second fan module 14.

[0052] The second fan module 14 is located between the HDD module 13 and the mainboard module 15, and can dissipate heat for the HDD module 13 in addition to dissipating heat for the mainboard module 15, and the second fan module 14 can suck the air out of the HDD module 13.

[0053] The mainboard module 15 includes a mainboard 150, and the mainboard 150 has a mainboard end CPU 15, a DIMM memory module 153, and a wind shield 154 arranged side by side along the third direction F3. The wind shield 154 is located on one side of the mainboard end CPU 15 and the DIMM memory module 153 along the second direction F2, and the wind shield 154 is arranged close to the second air inlet 101a. The wind shield 154 has a flow channel 154a formed thereon along the second direction F2 for corresponding to the mainboard end CPU 15 and the DIMM memory module 153. The air entering through the second air inlet 101a is used to dissipate heat for the mainboard end CPU 15 and the DIMM memory module 153 through the flow channel 154a, and the heat dissipated is discharged through the PSU power supply module 16 and the window.

[0054] The mainboard 150 is also provided with a radiator 152 located on one side of the mainboard CPU 15 along the third direction F3, which is used to actively cool the mainboard CPU 15. The radiator 152 mainly cools the mainboard CPU 15, so as to guarantee the effective cooling of the mainboard CPU 15 in the case of failure of the second fan module 14, and provide double cooling protection.

[0055] The mainboard 150 is also provided with a radiator 152 located on one side of the mainboard CPU 15 along the third direction F3, which is used to actively cool the mainboard CPU 15. The radiator 152 mainly cools the mainboard CPU 15, so as to guarantee the effective cooling of the mainboard CPU 15 in the case of failure of the second fan module 14, and provide double cooling protection.

[0056] In this way, the second space is ventilated by the side wall hole of the case base 101, which can absorb more air for the mainboard module 15 downstream of the 8056 double-rotor axial fan under the guarantee of the cooling specification of the HDD module 13. The air entering the flow channel 154a of the wind shield 154 can effectively distribute the air to the mainboard CPU 15, the DIMM memory module 153 and the radiator 152, and finally exhaust the hot air through the four PSU power supply modules 16 at the rear end of the case and the window.

[0057] The present application adopts the design of independent cooling channels up and down along the first direction F1, which avoids the situation that the front and rear pressures are inconsistent due to different fan parameters. For example, the tray 110 can be used as a isolation baffle to separate the air volume generated by the 8056 double-rotor axial fan in the lower 2U space from the air volume generated by the 8080 double-rotor axial fan in the upper 4U space, so as to ensure that the air volume is evenly passed in the respective cooling channels, effectively improve the cooling effect, meet the fan selection under the cooling specification of high-temperature components, avoid overdesign, save fan procurement cost, and correspondingly reduce the overall power consumption.

[0058] Also refer to Figure 8 which shows the system particle flow field, the yellow arrow indicates the air outlet direction, and the cloud color from blue to red represents the increasing speed. It can be seen that the speed in the front and rear ranges of the fan is the largest, and the overall system particle distribution is relatively uniform, and all components are blown by air. At the same time, a large amount of air enters the second air inlet 101a to cool the CPU and the downstream components well.

[0059] The air passes through the HDD module 13 to the second double-rotor axial fan, and then is blown into the downstream radiator 152 and DIMM memory module 153. At the same time, the air entering the second air inlet 101a and the air out of the HDD module 13 enter the downstream together, and finally exhaust the system through the PSU module.

[0060] Similarly, the first double-rotor shaft fan mainly uses 8080 fans, and eight 8080 fans are arranged along the first direction F1 and along the third direction F3. This layout adopts a parallel mode, the air pressure is unchanged, and the air volume is added, effectively increasing the system air intake. Air passes through four groups of GPU modules 11 upstream of the eight 8080 fans. For example, the GPU module 11 can be a 5090 three-fan graphics card. At this time, the fan acts as an exhaust system compared to the upstream GPU module 11 and acts as a blowing system compared to the downstream GPU module 11. This layout can better improve the fan heat exchange efficiency, and the current state working point of the fan falls on the highest efficiency point, Figure 8 The particle flow results in an overall flow field without backflow.

[0061] On the other hand, the system heat dissipation performance is directly related to the fan PQ curve, and the fan operating point (also known as the working point, the intersection of the system impedance and the fan PQ) changes with the change of the system impedance. In order to make the whole system heat dissipation efficiency reach the highest, the prerequisite is to place the operating point of the fan at one-half to two-thirds of the PQ curve.

[0062] The present application obtains the fan operating point falling at two-thirds of the PQ curve as Figure 7 , the horizontal coordinate is the volume flow rate (cfm), the vertical coordinate is the pressure (in-H2O), the green color is the reduced modified curve, and the intersection with the rectangular coordinate system is the working point of the current working condition. The selected fan PQ curve of the green curve does not have a stall region, as shown in Figure 7 The intersection of the green curve and the coordinate system is the fan working point obtained by numerical calculation (the air volume is 147.0651cfm, and the air pressure is 1.739186inch-H2O).

[0063] In summary, the server provided by the embodiment of the present application is a 6U8 card all-in-one machine for comprehensive training and reasoning, and the main feature is high power density. It can support NVIDIA RTX 5090 with a single card power consumption of 575W and a total machine power consumption of up to 7000W. It can discharge the accumulated high heat flux in a small space through an efficient heat dissipation architecture. It can support 1500m altitude, high temperature 35℃ environment temperature, and N+2 fan redundancy requirements, etc. The system is equipped with 8056 and 8080 double-rotor fans that can meet all electronic component heat dissipation specifications; the first space and the second space adopt independent heat dissipation channel design, all fans support hot plug function, select corresponding specification fans (8056 and 8080 two models of fans) to accurately control the air volume output, reduce the heat dissipation power consumption; a fan wall structure formed by multiple fans in parallel effectively reduces the system backflow. Under the condition of a parallel fan system, a high air pressure fan is used to increase the total air volume of the system. In a higher system impedance scenario, the fan efficiency can reach the highest, and efficient heat dissipation can be achieved.

[0064] The above merely provides an example of the present application, and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A server, characterized in that: include: A chassis base and an upper cover, wherein the chassis base and the upper cover are buckled together to form a cavity, wherein the cavity is divided into a first space and a second space along a first direction, wherein a GPU module and a first fan module located on one side of the GPU module along the second direction are disposed in the first space; The HDD module, the second fan module, the motherboard module and the PSU power supply module are sequentially arranged in the second space along the second direction. The first fan module and the second fan module both dissipate heat along the second direction, and the first direction is perpendicular to the second direction.

2. The server according to claim 1, wherein: The first fan module includes a plurality of first dual-rotor axial fans, which are arranged in an array along the first direction and the third direction. The fan axes of the first dual-rotor axial fans are set along the second direction, and the third direction is perpendicular to the first direction and the second direction in pairs.

3. The server according to claim 1, wherein: The GPU modules are arranged in two rows along the second direction, and each row has multiple GPU modules arranged along the third direction. The first fan module is located between the two rows of GPU modules along the second direction, and the third direction is perpendicular to the first direction and the second direction.

4. The server according to claim 1, wherein: A first air inlet and a window are respectively formed on the side walls at both ends of the chassis base along the second direction. The air entering through the first air inlet passes through the first fan module and discharges the heat of the GPU module through the window.

5. The server according to any one of claims 1 to 4, characterized in that: A tray is further provided in the first space. The tray is slidably connected to the chassis base, and the GPU module is provided on the tray.

6. The server according to claim 1, wherein: The second fan module includes multiple second dual-rotor axial fans, which are arranged side by side along a third direction. The fan axes of the second dual-rotor axial fans are arranged along the second direction, and the third direction is perpendicular to the first direction and the second direction.

7. The server according to claim 6, wherein: The chassis base is provided with a second air inlet on the side wall along the third direction for air intake. The air entering through the second air inlet passes through the second fan module and discharges the heat generated by the mainboard module through the window.

8. The server according to claim 7, wherein: The motherboard module includes a motherboard, and a motherboard-side CPU, a DIMM memory module and a wind shield are arranged side by side along the third direction on the motherboard. The wind shield is located on one side of the motherboard-side CPU and the DIMM memory module along the second direction, and the wind shield is arranged close to the second air inlet. A flow channel is formed on the wind shield along the second direction to correspond to the motherboard-side CPU and the DIMM memory module. The air entering from the second air inlet dissipates heat to the motherboard-side CPU and the DIMM memory module through the flow channel, and the dissipated heat is discharged through the PSU power supply module and the window.

9. The server according to claim 8, wherein: A radiator is also provided on the mainboard. The radiator is located on one side of the mainboard-side CPU along the third direction and is used to dissipate heat from the mainboard-side CPU.

10. The server according to claim 2 or 6, characterized in that: The operating points of the first dual-rotor axial fan and the second dual-rotor axial fan are both located at one-half to two-thirds of the PQ curves of the first dual-rotor axial fan and the second dual-rotor axial fan.

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