Solder ball management system and method

Abstract

The invention relates to the technical field of integrated circuit design, in particular to a solder ball management system and method. The solder ball management system comprises an information acquisition module used for acquiring a solder ball layer and a port layer from an input design layout, wherein the port layer comprises a plurality of ports; the solder ball creating module is used for creating solder balls on the solder ball layer based on a preset creating mode; and the solder ball connecting module is used for connecting the solder balls with the ports, and / or connecting the solder balls of different solder ball layers. According to the solder ball management system, automatic creation, arrangement and connection of the solder balls are realized through cooperation of a plurality of functional modules, and the problem that the existing solder ball layout management efficiency and yield are low is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit design, and in particular to a solder ball management system and method. BACKGROUND

[0002] With the semiconductor process gradually approaching the physical limit, the multi-die system becomes an important development direction in the post-Moore era due to its advantages of improving yield, reducing cost and realizing heterogeneous integration. In such advanced packaging design, the layout and connection management of solder balls which undertake the interconnection function between dies are crucial, directly affecting the signal integrity, power distribution network performance and final yield of the system.

[0003] At present, although the existing electronic design automation tools have basic solder ball generation and wiring functions, they are mostly designed for single-chip or traditional substrate design and lack special support for collaborative design of multi-die systems. In actual design, engineers often need to rely on multiple tool platforms or manual operations to complete the arrangement, interconnection and optimization of solder balls on different dies, which is tedious and inefficient. In particular, when dealing with solder ball connections across dies, the existing methods are difficult to achieve global optimization, which may easily cause problems such as long signal paths, cross-interference of connections, mismatch of power and ground networks, etc. Meanwhile, the creation, connection, exchange and removal of solder balls cannot form a unified life cycle management, which requires a lot of modification work when the design changes and is prone to human errors. SUMMARY

[0004] To solve the technical problems of low efficiency and yield of existing solder ball layout management, the present application provides a solder ball management system and method.

[0005] The technical problem solving scheme of the present application is to provide a solder ball management system, comprising: an information acquisition module for acquiring a solder ball layer and a port layer from an input design layout, the port layer comprising a plurality of ports; a solder ball creation module for creating solder balls on the solder ball layer based on a preset creation mode; a solder ball connection module for connecting the solder balls with the ports and / or connecting the solder balls of different solder ball layers.

[0006] Preferably, the preset creation mode is used to provide a layout scheme of the solder balls, which includes a global creation mode, a local creation mode, a center creation mode, a matrix creation mode and a chessboard creation mode.

[0007] Preferably, the solder ball creation module comprises a constraint unit, which is used to add distance constraints and / or area constraints to the preset creation mode.

[0008] Preferably, the solder ball connection module comprises an optimization unit, which is used to cross-optimize the connection results of the solder balls and the ports and the connection results between the solder balls.

[0009] Preferably, the solder ball management system comprises: a solder ball connection exchange module for exchanging the connection relationship between two pairs of solder balls and ports or the connection relationship between two pairs of solder balls; a solder ball connection release module for disconnecting the connection relationship between the solder balls and the ports and / or two solder balls; and a solder ball removal module for removing part or all of the solder balls on the solder ball layer.

[0010] To solve the above technical problems, the present application provides another technical solution as follows: a solder ball management method applied to the solder ball management system as claimed in any one of the above, comprising: obtaining a solder ball layer and a port layer based on a design layout, the port layer comprising a plurality of ports; creating solder balls on the solder ball layer based on a preset creation mode; connecting the solder balls with the ports and / or connecting the solder balls of different solder ball layers.

[0011] Preferably, connecting the solder balls with the ports comprises: obtaining the solder balls and the ports to be connected, and establishing a solder ball queue and a port queue; obtaining a solder ball connection sequence of the solder ball queue and a port connection sequence of the port queue; and connecting the solder balls with the ports according to the solder ball connection sequence and the port connection sequence.

[0012] Preferably, obtaining the solder ball connection sequence of the solder ball queue comprises: obtaining a starting point position and a preferred connection direction of the solder ball; and sorting the solder ball based on the starting point position and the preferred connection direction.

[0013] Preferably, connecting the solder balls of different solder ball layers comprises: obtaining a first solder ball layer and a second solder ball layer, the first solder ball layer comprising a first solder ball group and the second solder ball layer comprising a second solder ball group; sorting each solder ball in the first solder ball group; and finding the closest solder ball in the second solder ball group for each solder ball in the first solder ball group according to the sequence and connecting them until all solder balls in the first solder ball group or the second solder ball group are connected.

[0014] Preferably, after the solder balls of different solder ball layers are connected, the method comprises: cross-detecting the connection results of the solder balls of different solder ball layers; if the lines of connection between two pairs of solder balls intersect, exchanging the connection relationship between the two pairs of solder balls until there is no intersection between the lines of connection of all solder balls.

[0015] Compared with the prior art, the solder ball management system and method provided by the present application has the following advantages: 1. The embodiment of the present application provides a solder ball management system, which realizes the standardization and automation of the whole process of solder ball management through the cooperation of three core modules of information acquisition, solder ball creation and connection, improves work efficiency, and reduces the error and omission of manual operation; the information acquisition module can accurately extract solder ball layer and port layer data, avoid manual recognition error, and lay a precise data foundation for subsequent operation; the solder ball creation module supports flexible generation of solder ball layout; and the connection module simultaneously supports the interconnection of solder balls and ports or cross-layer solder balls, breaks the limitation of traditional single connection mode, and significantly improves the efficiency and consistency of circuit layout design.

[0016] 2. The solder ball management system provided by the embodiment of the present application, wherein the solder ball creation module provides multiple creation modes, so that the system can adapt to different layout requirements, and significantly enhances the adaptability to complex scenes.

[0017] Understandably, the global creation mode is applicable to the scene of uniformly distributing solder balls in the whole layer, the local creation mode can be used for accurate layout of specific areas of the layout, the center creation mode can realize symmetrical solder ball distribution around key devices, and the matrix creation and the chessboard creation can meet the needs of regular high-density layout and staggered anti-interference layout respectively.

[0018] 3. The solder ball management system provided by the embodiment of the present application, wherein the solder ball creation module comprises a constraint unit, the introduction of the constraint unit enables the solder ball creation process to be limited by distance or area rules, the distance constraint can avoid solder joint short circuit or signal crosstalk caused by too small solder ball spacing, and the area constraint can prohibit the creation of solder balls in the prohibited area of the layout, thereby guaranteeing the stability of the packaging structure and effectively solving the problems of "physical conflict" and "performance hidden danger" in the solder ball layout, so that the optimal layout is generated under the constraint condition.

[0019] 4. The solder ball management system provided by the embodiment of the present application, wherein the solder ball creation module comprises an optimization unit, the optimization unit detects and solves the connection crossing problem, avoids signal interference caused by line crossing, and greatly improves the electrical performance and layout rationality of the solder ball connection.

[0020] 5. The solder ball management system provided by the embodiment of the present application further comprises a solder ball connection exchange module for exchanging solder ball connection relationship, a solder ball connection release module for releasing the solder ball connection relationship, and a solder ball removal module for removing the solder ball; through the newly added exchange, release and removal modules, a complete closed loop of "creation-connection-adjustment-revocation" is formed, the "full life cycle controllability" of the solder ball management is realized, the dynamic adjustment capability of the system is enhanced, the user can flexibly modify the connection relationship or remove the redundant solder ball, the design change requirement is adapted, and the design iteration efficiency is improved.

[0021] 6、The embodiment of the present application also provides a solder ball management method, which is applied to the solder ball management system, converts the modular function of the system into executable process steps, ensures the standardization and repeatability of operation, and realizes full-process automation from layout processing to solder ball connection; the step logic of "obtaining layer information-creating solder ball-completing connection" is clear, reduces the manual operation threshold, and at the same time provides a unified process framework for subsequent steps, so that the output consistency of engineers with different experience levels is significantly improved.

[0022] 7、The solder ball management method provided by the embodiment of the present application ensures the orderliness and predictability of the connection process by establishing solder ball and port queues and sorting the connection, eliminates the congestion problem caused by traditional "near connection", and realizes the precision and efficiency of "solder ball-port" connection; the establishment of the queue can avoid connection confusion, the acquisition of the connection order can optimize the connection logic according to actual needs, and the connection in order ensures that the operation is traceable.

[0023] 8、The solder ball management method provided by the embodiment of the present application sorts the solder ball queue based on the starting point position and the preferred connection direction, so that the solder ball connection order is more in line with the actual design needs, reduces the wiring length and intersection, and avoids the long connection path caused by disordered sorting, which causes signal transmission to be prolonged.

[0024] 9、The solder ball management method provided by the embodiment of the present application realizes the efficiency and low loss of cross-layer solder ball connection through the steps of "obtaining cross-layer solder ball group-sorting-near connection", the sorting step ensures the order of the connection logic, and the near connection can minimize the cross-layer connection length, reduce the interlayer signal interference and delay, and reduce the parasitic effect.

[0025] 10、The solder ball management method provided by the embodiment of the present application completely solves the "connection intersection" problem in cross-layer solder ball connection through the intersection detection and exchange mechanism, wherein the intersection detection can accurately identify the conflict connection, and the exchange of connection relationship optimizes the layout without changing the number of solder balls, avoids the signal crosstalk and wiring difficulty caused by intersection, and improves the connection reliability and electrical performance. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is a structure diagram of a solder ball management system provided by the embodiment of the present application Figure 1 .

[0028] Figure 2 is a solder ball layout generated based on a global creation mode in a solder ball management system according to an embodiment of the present application.

[0029] Figure 3 is a solder ball layout generated based on a local creation mode in a solder ball management system according to an embodiment of the present application.

[0030] Figure 4 is a solder ball layout generated based on a center creation mode in a solder ball management system according to an embodiment of the present application.

[0031] Figure 5 is a solder ball layout generated based on a matrix creation mode in a solder ball management system according to an embodiment of the present application.

[0032] Figure 6 is a solder ball layout generated based on a chessboard creation mode in a solder ball management system according to an embodiment of the present application.

[0033] Figure 7 is a solder ball layout generated based on a constraint condition in a solder ball management system according to an embodiment of the present application.

[0034] Figure 8 is a structure diagram of a solder ball creation module in a solder ball management system according to an embodiment of the present application. Figure 1 .

[0035] Figure 9 is a structure diagram of a solder ball creation module in a solder ball management system according to an embodiment of the present application. Figure 2 .

[0036] Figure 10 is a structure diagram of a solder ball management system according to an embodiment of the present application. Figure 2 .

[0037] Figure 11 is a schematic diagram of a solder ball and a port exchange connection in a solder ball management system according to an embodiment of the present application.

[0038] Figure 12 is a step flow chart of a solder ball management method according to an embodiment of the present application.

[0039] Figure 13 is a step flow chart of a solder ball and a port connection in a solder ball management method according to an embodiment of the present application.

[0040] Figure 14 is a step flow chart of a solder ball queue sorting in a solder ball management method according to an embodiment of the present application.

[0041] Figure 15is a solder ball queue sorting schematic diagram in a solder ball management method provided by an embodiment of the present application.

[0042] Figure 16 is a step flow chart of solder ball connection in a solder ball management method provided by an embodiment of the present application.

[0043] Figure 17 is a structure schematic diagram of automatic connection in a solder ball management method provided by an embodiment of the present application.

[0044] Figure 18 is a step flow chart of cross optimization in a solder ball management method provided by an embodiment of the present application.

[0045] Figure 19 is a structure schematic diagram of cross connection in a solder ball management method provided by an embodiment of the present application.

[0046] Figure 20 is a structure schematic diagram after first exchange connection in a solder ball management method provided by an embodiment of the present application.

[0047] Figure 21 is a structure schematic diagram after second exchange connection in a solder ball management method provided by an embodiment of the present application.

[0048] Explanation of the drawings: 10, solder ball management system; 1, information acquisition module; 11, constraint unit; 12, optimization unit; 2, solder ball creation module; 3, solder ball connection module; 4, solder ball connection exchange module; 5, solder ball connection release module; 6, solder ball removal module. DETAILED DESCRIPTION

[0049] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0050] In the embodiments provided by the present application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that the determination of B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information.

[0051] It should be understood that every feature and combination of features that is described above in relation to one embodiment is applicable to at least one other embodiment, unless specifically stated otherwise. It should also be understood that every embodiment described above can be combined with any other embodiment unless specifically stated otherwise.

[0052] In various embodiments of the present application, it should be understood that the magnitude of the serial number of the above-mentioned processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0053] The flow diagrams and the block diagrams in the drawings are illustrations of the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flow diagrams or block diagrams can represent a module, a segment, or a portion of code that comprises one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and / or flow diagrams, and combinations thereof, can be implemented by dedicated hardware-based systems that perform the specified functions or operations, or combinations of hardware and software.

[0054] Referring to Figure 1 The embodiment of the present application provides a solder ball management system, which comprises: an information acquisition module, configured to acquire a solder ball layer and a port layer from an input design layout, the port layer comprising a plurality of ports; a solder ball creation module, configured to create solder balls on the solder ball layer based on a preset creation mode; and a solder ball connection module, configured to connect the solder balls with the ports and / or connect the solder balls of different solder ball layers.

[0055] It should be noted that the solder ball management system provided by the present application can be applied to the management of the solder balls connecting the cores in the whole life cycle in the design of the multi-core system, which can not only realize the arrangement and connection of the solder balls in the single core, but also support the protocol design and arrangement and connection of the solder balls between the multi-cores.

[0056] The embodiment of the present application provides a solder ball management system, which realizes the standardization and automation of the whole process of solder ball management through the cooperation of three core modules of information acquisition, solder ball creation and connection, improves work efficiency, and reduces the error and omission of manual operation; the information acquisition module can accurately extract solder ball layer and port layer data, avoids manual recognition error, and lays a precise data foundation for subsequent operation; the solder ball creation module supports flexible generation of solder ball layout; and the connection module simultaneously supports the interconnection of solder balls and ports or cross-layer solder balls, breaks the limitation of the traditional single connection mode, and significantly improves the efficiency and consistency of circuit layout design.

[0057] Specifically, the information acquisition module, the solder ball creation module and the solder ball connection module are signal connected.

[0058] It should be noted that the information acquisition module is used for analyzing the design layout input by a user, and can automatically identify and extract the solder ball layer and the port layer in the design layout, the information acquisition module supports data analysis of design layout formats including but not limited to GDSII (Graphic Design System II Stream Format), OASIS (Open Artwork System Interchange Standard), LEF (Library Exchange Format), DEF (Design Exchange Format) and the like, and is compatible with data variants generated by different EDA (Electronic design automation) tools.

[0059] It should be understood that the design layout input by the user can be a conventional chip design layout or a multi-core system design layout.

[0060] In some embodiments, the user inputs the design layout of a multi-core system into the information acquisition module, the information acquisition module identifies the solder ball layer and the port layer of each core particle in the multi-core system by analyzing the design layout, specifically, the solder ball layer of the core particle is generally located in the top layer and / or the bottom layer of the core particle, and the port layer generally contains a plurality of port information; the information processing module transmits the analyzed information to the solder ball creation module, the solder ball creation module automatically creates a solder ball array on the solder ball layer according to the preset creation mode selected by the user and the related information, and then establishes the electrical connection between the solder balls and the ports and between different solder ball layers through the solder ball connection module.

[0061] Specifically, the preset creation mode is used to provide a layout scheme of the solder ball, which includes a global creation mode, a local creation mode, a center creation mode, a matrix creation mode and a chessboard creation mode.

[0062] The solder ball management system provided by the embodiment of the application can adapt to different layout requirements and significantly enhance adaptability to complex scenarios, because the solder ball creation module provides multiple creation modes, and a user can select a corresponding creation mode to create a solder ball array according to actual application requirements.

[0063] It should be noted that the global creation mode refers to generating a solder ball array uniformly in a user-set interval and avoiding a boundary, within the boundary of the entire solder ball layer, and is applicable to a scenario in which solder balls need to be uniformly distributed in an entire layer. For details, refer to Figure 2 ; The local creation mode refers to generating a solder ball array according to a user-set interval in a user-specified region, that is, the solder balls are arranged only in a specified local region, and the local region includes but is not limited to a rectangle, a circle, a polygon, and the like. The local creation mode is applicable to accurate layout for a specific region of a layout. For details, refer to Figure 3 ; The central creation mode refers to generating solder balls symmetrically to the four directions with a user-specified fixed point as the center, that is, the overall layout of the solder balls presents central symmetry, and is applicable to solder ball layout that needs to be arranged around a key device. For details, refer to Figure 4 ; The matrix creation mode creates a regular solder ball matrix according to a user-input number of rows, a number of columns, and a starting coordinate. For details, refer to Figure 5 ; the chessboard creation mode generates solder balls in an interleaved layout, can create more solder balls in the same area, and improves solder ball density. The interleaved layout can also effectively reduce signal crosstalk. For details, refer to Figure 6 .

[0064] Further, refer to Figure 7 and Figure 8 The solder ball creation module includes a constraint unit, and the constraint unit is configured to add distance constraints and / or region constraints to a preset creation mode.

[0065] The solder ball management system provided by the embodiment of the application includes a constraint unit in the solder ball creation module. The introduction of the constraint unit enables the solder ball creation process to be limited by distance or region rules. The distance constraints can avoid soldering short circuits or signal crosstalk caused by too small solder ball intervals, and the region constraints can prohibit the creation of solder balls in a layout prohibited region, thereby ensuring the stability of a packaging structure and effectively solving the "physical conflict" and "performance risk" problems in solder ball layout. Through the cooperation of rich creation modes and intelligent constraints, the solder ball layout is quickly, flexibly, and compliantly generated, and the efficiency and reliability of the solder ball layout are greatly improved.

[0066] As a feasible implementation, the solder ball creating module also supports constraint condition creating, that is, in addition to selecting a creating mode, the user can also set a constraint condition for solder ball creating, such as setting a distance constraint or a region constraint, etc. before creating the solder ball.

[0067] In some embodiments, when the user selects a creating mode, the user sets a constraint value range for the distance between two solder balls, and then the solder ball creating module checks the distance between each new solder ball and the existing solder balls before generating the new solder ball. If the distance is not within the preset constraint range, the solder ball creating module prohibits creating the solder ball at the position, that is, the generation of the solder ball is revoked. Otherwise, a new solder ball is created at the position.

[0068] In some other embodiments, when the user selects a creating mode, the user can draw one or more forbidden regions, the size and shape of which can be set by the user according to actual needs. The solder ball creating module automatically avoids the forbidden regions when creating the solder balls, and does not generate the solder balls at the positions. Through this design, the newly generated solder balls can avoid sensitive circuits, mechanical mechanisms or reserved test regions on the die when quickly generating the array of solder balls.

[0069] Further, please refer to Figure 9 The solder ball connecting module includes an optimization unit, which is configured to cross-optimize the connection results of the solder balls and the ports and the connection results between the solder balls.

[0070] It should be noted that after the solder ball creating module generates the solder balls, the solder ball connecting module can connect the solder balls with the ports of the die according to the user's settings, or connect the solder balls of different dies, such as connecting the solder balls on the top layer of the A die with the solder balls on the bottom layer of the B die, so as to realize the electrical connection of the two dies.

[0071] It can be understood that after the solder ball connecting module completes the connection of the solder balls and the ports or the solder balls, the optimization unit can detect the connection results to identify whether there is a cross connection. If there is a cross connection, the connection relationship of the two is exchanged to eliminate the cross connection. This process can be iterated until all cross connections are eliminated, avoiding problems such as wiring winding, signal delay increase and cross talk aggravation caused by cross connection, and improving the signal quality and wiring feasibility, and greatly improving the electrical performance and layout rationality of the solder ball connection.

[0072] Further, please refer to Figure 10 The solder ball management system includes a solder ball connection exchange module configured to exchange the connection relationship of two pairs of solder balls and ports or the connection relationship of two pairs of solder balls. The solder ball connection exchange module supports exchanging the established connection relationship. The user can select the connection relationship of two or more groups of solder balls, and exchange the connection targets of the solder balls.

[0073] For example, please refer toFigure 11 The original connection relationship is that the solder ball A is connected with the port 1 and the solder ball B is connected with the port 2, and after the exchange, the solder ball A is connected with the port 2 and the solder ball B is connected with the port 1.

[0074] Through the design, the user can still flexibly adjust the logical connection relationship after the overall electrical connection relationship is fixed, and the electrical connection of the core particle system is locally optimized and adjusted.

[0075] In some embodiments, the solder ball management system further comprises a solder ball connection release module for disconnecting the connection relationship between the solder ball and the port and / or two solder balls; when the layout design is changed or a connection error occurs, the connection needs to be deleted or locally reconnected, the user can select one or more solder balls according to the actual situation to disconnect the connection between the solder balls and the port or other solder balls; the solder ball connection release module supports batch release of solder ball connection.

[0076] Through the design of the solder ball connection release module, the "undo" function is provided for the electrical connection of the core particle system, which greatly enhances the fault tolerance and flexibility of the design process.

[0077] In some embodiments, the solder ball management system further comprises a solder ball removal module for removing part or all of the solder balls on the solder ball layer; it supports deleting the specified solder balls from the solder ball layer, including two removal modes, one is local removal, that is, the user can frame or point to the solder balls to be deleted for deletion; the other is global removal, that is, the user can select one or more solder ball layers to delete all solder balls on the selected solder ball layer; through the design, redundant solder balls can be removed, creation errors can be corrected, or space can be created for a new layout scheme, which is the basis for resource optimization and design iteration.

[0078] The solder ball management system provided by the embodiment of the application further comprises a solder ball connection exchange module for exchanging the connection relationship of the solder balls, a solder ball connection release module for releasing the connection relationship of the solder balls, and a solder ball removal module for removing the solder balls; through the newly added exchange, release and removal modules, a complete closed loop of "creation-connection-adjustment-undo" is formed, the "full life cycle controllability" of solder ball management is realized, the dynamic adjustment capability of the system is enhanced, the user can flexibly modify the connection relationship or remove redundant solder balls, the design change demand is adapted, and the design iteration efficiency is improved.

[0079] In other embodiments, the solder ball management system further comprises a display module which can display the hierarchical information of the design layout in real time, such as the information of the solder ball layer, the port layer and the solder balls and ports thereon, the user can select the corresponding solder ball layer to create the solder balls, and click or drag the solder balls or the ports to exchange, remove and the like; through the design of the display module, the abstract instructions are converted into intuitive images, which facilitates the user to understand and operate.

[0080] Please refer toFigure 12 The embodiment of the present application also provides a solder ball management method, applied to the solder ball management system as any one of the above, comprising: Step S1: obtaining a solder ball layer and a port layer based on a design layout, the port layer comprising a plurality of ports; Step S2: creating a solder ball on the solder ball layer based on a preset creation mode; Step S3: connecting the solder ball with the port, and / or connecting the solder balls of different solder ball layers.

[0081] The embodiment of the present application also provides a solder ball management method, applied to the solder ball management system as any one of the above, comprising:

[0082] It should be noted that the process of creating and connecting the solder ball by using the solder ball management system is as follows: the information acquisition module is used to analyze the design layout, so as to obtain the solder ball layer and the port layer of the core grain, the solder ball layer to be created is selected and the creation mode is set, the solder ball is created on the solder ball layer based on the preset creation mode, and finally, the solder ball is connected with the port or the solder ball is connected with the solder ball by using the solder ball connection module.

[0083] Optionally, the preset creation mode comprises a global creation mode, a local creation mode, a center creation mode, a matrix creation mode and a chessboard creation mode, and a user can select a corresponding solder ball creation mode according to a demand.

[0084] Specifically, before the solder ball is created, a constraint condition of the solder ball to be created can also be set, such as limiting the interval of the solder ball or the setting position of the solder ball.

[0085] Further, please refer to Figure 13 The step of connecting the solder ball with the port comprises: Step S31a: obtaining the solder ball to be connected and the port to be connected, and establishing a solder ball queue and a port queue; Step S32a: obtaining a solder ball connection sequence of the solder ball queue and a port connection sequence of the port queue; Step S33a: connecting the solder ball with the port according to the solder ball connection sequence and the port connection sequence.

[0086] It should be noted that when the connection between the solder balls in the core and the ports is performed, the user needs to select the solder balls and the ports to be connected first, wherein the ports include power ports and signal ports, the user can select the corresponding ports to be connected according to actual needs, and add the selected solder balls and ports to the solder ball queue or the port queue, then sort the solder balls in the solder ball queue and the ports in the port queue, and sequentially connect the solder balls and the ports according to the sorting result.

[0087] The solder ball management method provided by the embodiment of the application ensures the orderliness and predictability of the connection process by establishing the solder ball queue and the port queue and sorting and connecting, eliminates the congestion problem caused by the traditional 'near connection', and realizes the precision and efficiency of the'solder ball-port' connection; the establishment of the queue can avoid connection confusion, the acquisition of the connection order can optimize the connection logic according to actual needs, and the sequential connection ensures traceability of the operation.

[0088] Further, please refer to Figure 14 , the solder ball connection order of the solder ball queue includes: Step S321a: obtaining the starting point position and the preferred connection direction of the solder ball; Step S322a: sorting the solder ball based on the starting point position and the preferred connection direction.

[0089] It should be noted that the relative position of the starting point indicates which solder ball from the relative position is connected with the port, and specifically includes the lower left corner, the lower right corner, the upper left corner and the upper right corner; the preferred connection direction indicates the direction along which the solder ball is sorted from the starting point, and specifically includes the horizontal direction and the vertical direction, please refer to Figure 15 which shows the solder ball order obtained by preferentially connecting in the horizontal direction with the lower left corner as the starting point. After the solder ball queue and the port queue are sorted, the solder balls and the ports are sequentially connected in order, such as connecting the solder ball with the order of 1 with the port with the order of 1, connecting the solder ball with the order of 2 with the port with the order of 2, and so on.

[0090] In some embodiments, the addition order of each port in the port queue is the connection order.

[0091] The solder ball management method provided by the embodiment of the application sorts the solder ball queue based on the starting point position and the preferred connection direction, so that the solder ball connection order is more in line with the actual design requirements, reduces the wiring length and intersection, and avoids the connection path being too long caused by disordered sorting, which causes the signal transmission to be prolonged.

[0092] Further, please refer to Figure 16 , the solder balls in different solder ball layers are connected, including: Step S31b: obtaining a first solder ball layer and a second solder ball layer, the first solder ball layer including a first solder ball group, and the second solder ball layer including a second solder ball group; Step S32b: sorting each solder ball in the first solder ball group; Step S33b: searching for the nearest solder ball in the second solder ball group for each solder ball in the first solder ball group in order and connecting them until all solder balls in the first solder ball group or the second solder ball group are connected.

[0093] It should be noted that the first solder ball layer and the second solder ball layer belong to different core particles, that is, the connection between solder balls in different solder ball layers is essentially the connection between solder balls in different core particles.

[0094] In some embodiments, the solder ball creation module names each solder ball based on ASCII code characters when creating the solder balls. The ASCII code characters themselves have an order, so the first solder ball group can be sorted according to their names; after determining the order of the solder balls in the first solder ball group, the solder ball closest to the first solder ball group is found according to the order, and the two solder balls are connected, and so on, until all the solder balls in one of the solder ball groups are connected.

[0095] It should be noted that during the automatic solder ball connection process, the following may occur: Figure 17 The situation shown is that the connection between the two pairs of solder balls forms a cross, and the crossing of the connection may result in the use of flying wires or a large circle to complete the wiring of this pair of solder balls, which will reduce the signal transmission rate between the solder balls.

[0096] The solder ball management method provided in the embodiment of the present invention realizes efficient and low-loss cross-layer solder ball connection through the steps of "obtaining a cross-layer solder ball group - sorting - nearest connection". The sorting step ensures that the connection logic is orderly, and the nearest connection can minimize the length of the cross-layer connection, reduce inter-layer signal interference and delay, and reduce parasitic effects.

[0097] Further, see Figure 18 After the solder balls of different solder ball layers are connected, it includes: Step S34b: performing cross-check on the connection results of the solder balls in different solder ball layers; Step S35b: If the connection lines between two pairs of solder balls intersect, the connection relationship between the two pairs of solder balls is swapped until all the solder ball connection lines do not intersect.

[0098] In some embodiments, after the solder balls are connected, an optimization unit is required to perform a cross detection on the connection result and swap the two cross-connected lines to solve the line splitting or signal delay problem caused by the cross-connected lines.

[0099] See also Figure 19, the example in the figure has three pairs of crossing lines, the line of 1 and a crosses the line of 3 and b, the line of 4 and e crosses the line of 2 and c, and the line of 4 and e crosses the line of 5 and d. It should be noted that in the optimization method provided in the embodiment, a group of lines is exchanged only once in one line exchange process, that is, the line of 4 and e crosses the line of 2 and c and the line of 5 and d, but when the line relationship is exchanged, it is exchanged with only one group of lines each time; after the first line exchange, 3 is connected with a, 1 is connected with b, and 4 is connected with c, and the three groups of lines no longer cross, as shown in Figure 20 . However, the line of 2 and e and the line of 5 and d cross, and at this time, the second exchange is required, after the exchange, 2 is connected with d and 5 is connected with e, and the final result is as shown in Figure 21 , that is, the cross problem is optimized.

[0100] In other embodiments, the optimization unit can also detect and optimize the connection result after the solder ball and port connection is completed, and the specific optimization method is the same as the above method.

[0101] The solder ball management method provided in the embodiment completely solves the "line crossing" problem in cross-layer solder ball connection through the cross detection and exchange mechanism, wherein the cross detection can accurately identify the conflict line, and the exchange of the connection relationship optimizes the layout without changing the number of solder balls, avoids signal crosstalk and wiring difficulty caused by crossing, and improves the connection reliability and electrical performance.

[0102] The above describes in detail the solder ball management system and method disclosed in the embodiment of the present application, and the principle and implementation manner of the present application are described by applying specific examples. The above embodiment is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range will be changed, and the above description should not be understood as a limitation of the present application. Any modification, equivalent replacement and improvement within the principle of the present application should be included in the protection scope of the present application.

Claims

1. A solder ball management system, characterized in that: The solder ball management system includes: Information acquisition module: used to obtain solder ball layer and port layer from input design layout, wherein the port layer includes multiple ports; Solder ball creation module: used for creating solder balls on the solder ball layer based on a preset creation mode; Solder ball connection module: used to connect the solder ball to the port and / or connect the solder balls of different solder ball layers.

2. The solder ball management system according to claim 1, wherein: The preset creation mode is used to provide a layout solution for the solder balls, which includes a global creation mode, a local creation mode, a center creation mode, a matrix creation mode and a chessboard creation mode.

3. The solder ball management system according to claim 1, wherein: The solder ball creation module includes a constraint unit, which is used to add distance constraints and / or area constraints to the preset creation mode.

4. The solder ball management system according to claim 1, wherein: The solder ball connection module includes an optimization unit, which is used to perform cross-optimization on the connection results between the solder balls and the ports, and the connection results between the solder balls.

5. The solder ball management system according to claim 1, wherein: The solder ball management system includes: Solder ball connection exchange module: used for exchanging the connection relationship between two pairs of solder balls and the ports or the connection relationship between two pairs of solder balls; Solder ball connection release module: used for disconnecting the connection between the solder ball and the port and / or the connection between the two solder balls; The solder ball removal module is used to remove part or all of the solder balls on the solder ball layer.

6. A solder ball management method, applied to the solder ball management system according to any one of claims 1 to 5, characterized in that: include: Acquire a solder ball layer and a port layer based on a design layout, wherein the port layer includes a plurality of ports; Creating solder balls on the solder ball layer based on a preset creation mode; The solder balls are connected to the ports, and / or the solder balls of different solder ball layers are connected.

7. The solder ball management method according to claim 6, wherein: Connecting the solder ball to the port includes: Obtain the solder balls and the ports to be connected, and establish a solder ball queue and a port queue; Get the solder ball connection order of the solder team array and the port connection order of the port queue; The solder balls are connected to the ports according to the solder ball connection sequence and the port connection sequence.

8. The solder ball management method according to claim 7, wherein: Get the solder ball connection order of the solder ball array, including: Obtaining a starting point position and a preferred connection direction of the solder ball; The solder balls are sorted based on the starting point locations and the preferred connection directions.

9. The solder ball management method according to claim 6, wherein: Connecting the solder balls of different solder ball layers comprises: Acquire a first solder ball layer and a second solder ball layer, wherein the first solder ball layer includes a first solder ball group, and the second solder ball layer includes a second solder ball group; sorting each of the solder balls in the first group of solder balls; Searching for the nearest solder ball in the second solder ball group for each solder ball in the first solder ball group and connecting them in sequence until all solder balls in the first solder ball group or the second solder ball group are connected.

10. The solder ball management method according to claim 6, wherein: After the solder balls of different solder ball layers are connected, the method includes: Performing cross-detection on connection results of the solder balls in different solder ball layers; If the connection lines between two pairs of solder balls intersect, the connection relationships between the two pairs of solder balls are swapped until all the solder ball connection lines no longer intersect.

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