Perovskite film layer quality detection method, device, equipment and medium

Abstract

The invention relates to a perovskite film layer quality detection method, device and equipment and a medium. The method comprises the steps that the surface of a perovskite film layer of a to-be-detected piece is photographed, a target surface image is obtained, the to-be-detected piece comprises a substrate and the perovskite film layer, an observation mark is arranged on the first face, facing the perovskite film layer, of the substrate, and the target surface image is obtained based on the size change condition of the observation mark in the target surface image relative to the real observation mark. And determining film layer quality data of the perovskite film layer. By adopting the method, the perovskite film layer quality detection efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of perovskite film layer detection, in particular to a perovskite film layer quality detection method, device, equipment and medium. BACKGROUND

[0002] In products such as perovskite solar cells, perovskite detectors and perovskite quantum dot light emitting, the quality of the perovskite film layer has a great influence on the photoelectric conversion efficiency of the product. Therefore, it is necessary to detect the quality of the perovskite film layer.

[0003] The perovskite film layer quality detection method in the related art cuts the product including the perovskite film layer into multiple small block samples, obtains SEM images reflecting the surface and cross-sectional morphology of the perovskite film layer through a scanning electron microscope (SEM), and then obtains the size, distribution and morphology of the perovskite crystal grains by analyzing the SEM images to determine whether the perovskite film layer has quality problems.

[0004] However, the efficiency of the above-mentioned perovskite film layer quality detection method is low. SUMMARY

[0005] Therefore, it is necessary to provide a perovskite film layer quality detection method, device, equipment and medium capable of improving the detection efficiency in view of the above technical problems.

[0006] In a first aspect, the present application provides a perovskite film layer quality detection method, comprising:

[0007] Taking a photo of the surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image, the to-be-detected piece including a substrate and a perovskite film layer, and the substrate being provided with an observation mark on the first surface facing the perovskite film layer;

[0008] Determining film layer quality data of the perovskite film layer based on the size change of the observation mark in the target surface image relative to the real observation mark.

[0009] In one embodiment, determining the film layer quality data of the perovskite film layer based on the size change of the observation mark in the target surface image relative to the real observation mark includes:

[0010] Obtaining target size data of the observation mark in the target surface image;

[0011] Obtaining target size change data based on the target size data and real size data of the observation mark;

[0012] Obtaining the film layer quality data of the perovskite film layer based on the target size change data.

[0013] In one of the embodiments, the observation mark comprises at least one line shape;

[0014] The target size data of the observation mark in the target surface image is obtained, comprising:

[0015] The line width of the observation mark in the target surface image is obtained.

[0016] The target size data is determined based on the line width.

[0017] In one of the embodiments, the target size change data is obtained based on the target size data and the real size data of the observation mark, comprising:

[0018] The difference between the target size data and the real size data is determined.

[0019] The target size change data is determined based on the difference.

[0020] In one of the embodiments, the number of the observation marks is multiple, and the number of the target size data is multiple;

[0021] The target size change data is obtained based on the target size data and the real size data of the observation mark, comprising:

[0022] The initial size change data corresponding to each target size data is obtained based on each target size data and the real size data.

[0023] The target size change data is obtained based on at least one of the initial size change data.

[0024] In one of the embodiments, the method further comprises:

[0025] Before the perovskite film layer is prepared on the substrate, the first surface of the substrate is photographed to obtain an initial surface image;

[0026] The real size data of the observation mark in the initial surface image is obtained.

[0027] In one of the embodiments, the number of the observation marks is multiple, and the number of the target size change data is multiple, and the target size change data corresponds to the observation mark;

[0028] The film layer quality data of the perovskite film layer is obtained based on the target size change data, comprising:

[0029] The film layer quality data of the corresponding position of each observation mark in the perovskite film layer is obtained based on each target size change data.

[0030] In a second aspect, the application further provides a perovskite film layer quality detection device, comprising:

[0031] an image acquisition module configured to take a picture of a surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image, the to-be-detected piece comprising a substrate and a perovskite film layer, and the substrate being provided with an observation mark on a first surface thereof facing the perovskite film layer;

[0032] a quality assessment module configured to determine film layer quality data of the perovskite film layer based on a size change of the observation mark in the target surface image relative to a real observation mark.

[0033] In a third aspect, the present application also provides a computer device comprising a memory and a processor, the memory storing a computer program, and the processor implementing the following steps when executing the computer program:

[0034] taking a picture of a surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image, the to-be-detected piece comprising a substrate and a perovskite film layer, and the substrate being provided with an observation mark on a first surface thereof facing the perovskite film layer;

[0035] determining film layer quality data of the perovskite film layer based on a size change of the observation mark in the target surface image relative to a real observation mark.

[0036] In a fourth aspect, the present application also provides a computer-readable storage medium having a computer program stored thereon, the computer program being executed by a processor to implement the following steps:

[0037] taking a picture of a surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image, the to-be-detected piece comprising a substrate and a perovskite film layer, and the substrate being provided with an observation mark on a first surface thereof facing the perovskite film layer;

[0038] determining film layer quality data of the perovskite film layer based on a size change of the observation mark in the target surface image relative to a real observation mark.

[0039] The perovskite film layer quality detection method, device, equipment and medium determine film layer quality data of the perovskite film layer based on a size change of the observation mark in the target surface image relative to a real observation mark. In this way, by setting the observation mark on the substrate of the to-be-detected piece, after the perovskite film layer is prepared, the surface of the perovskite film layer is photographed to obtain a target surface image, and the transmission of light by the perovskite film layer is determined based on the size change of the observation mark in the target surface image relative to the real observation mark, so that the film layer quality data of the perovskite film layer is determined, and the problem of low efficiency caused by the need to cut the product into multiple small samples, obtain SEM images of the film layer surface and section by SEM, and analyze the SEM images to obtain the film layer quality data in the related art is avoided. The perovskite film layer quality detection method does not need to cut the product, directly analyzes the surface of the perovskite film layer to obtain the film layer quality data, and can improve the efficiency of perovskite film layer quality detection. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the embodiments or the related art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0041] Figure 1 An application environment diagram of the perovskite film layer quality detection method in an embodiment;

[0042] Figure 2 A flowchart of the perovskite film layer quality detection method in an embodiment;

[0043] Figure 3 A comparison diagram example of the observation mark in the target surface image and the actual observation mark in an embodiment;

[0044] Figure 4 Another comparison diagram example of the observation mark in the target surface image and the actual observation mark in an embodiment;

[0045] Figure 5 Another comparison diagram example of the observation mark in the target surface image and the actual observation mark in an embodiment;

[0046] Figure 6 A flowchart of the step of determining the film layer quality data of the perovskite film layer in an embodiment;

[0047] Figure 7 An exemplary schematic diagram of observation identification in one embodiment;

[0048] Figure 8 An exemplary schematic diagram of observation identification in another embodiment;

[0049] Figure 9 An exemplary schematic diagram of mapping relationship between size change data and film layer quality data in one embodiment;

[0050] Figure 10 A flowchart of perovskite film layer quality detection method in another embodiment;

[0051] Figure 11 A structural block diagram of perovskite film layer quality detection device in one embodiment;

[0052] Figure 12 An internal structure diagram of computer device in one embodiment. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0054] The perovskite film layer quality detection method provided by the embodiments of the present application can be applied in an application environment as shown in the figure. Figure 1 The computer device 104 is in communication connection with the image acquisition device 102; the computer device 104 can be a terminal device or a server; for example, the terminal 102 can be, but is not limited to, various personal computers, notebook computers, smart phones, tablet computers and Internet of Things devices; for example, the server can be implemented by an independent server or a server cluster composed of multiple servers.

[0055] The image acquisition device 102 is used to take a photo of the to-be-detected piece based on the control of the computer device 104. For example, the image acquisition device 102 is an industrial camera including a Charge-Coupled Device (CCD). The CCD realizes high-sensitivity and high-resolution image imaging technology by converting light signals into charge signals and transmitting and reading charges row by row.

[0056] In a possible implementation, the image acquisition device 102 and the computer device 104 are integrated into an industrial detection device; the industrial detection device includes a CCD sensor or a photoelectric sensor as the image acquisition device 102, a processor with computing processing capability, and an embedded operating system; for example, the image acquisition device 102 and the computer device 104 are an intelligent industrial camera as a whole; for example, the image acquisition device 102 and the computer device 104 are a machine vision system as a whole.

[0057] In an example embodiment, as shown in Figure 2 , a perovskite film layer quality method is provided, and the method is applied to the computer device 104 in Figure 1 for example, and includes the following steps 202 to 204. Wherein:

[0058] Step 202, taking a photo of the surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image.

[0059] Wherein, the to-be-detected piece refers to a product intermediate or product in which the perovskite film layer has been completed on the substrate. The to-be-detected piece in this embodiment includes a substrate and a perovskite film layer, and the first surface of the substrate facing the perovskite film layer is provided with an observation mark.

[0060] The product in the embodiment of the present application can be a single-junction perovskite solar cell, a stacked perovskite solar cell, a perovskite detector, a perovskite quantum light-emitting product, etc.

[0061] Wherein, the substrate can be a silicon substrate, or a glass substrate or other substrate, and the specific material of the substrate is selected according to the specific application product of the perovskite film layer. For example, in the application scenario of the perovskite solar cell, the substrate can be a silicon substrate, which can also be referred to as a bottom cell, and the to-be-detected piece can be a silicon wafer on which a hole transport layer and a perovskite film layer are prepared; for example, in the perovskite quantum light-emitting product, the substrate can be a transparent substrate such as glass, PEN (Polyethylenenaphthalate two formic acid glycol ester, polyethylene naphthalate), etc.

[0062] In a possible implementation, the image acquisition device 102 is arranged above a detection position of the product production line after the perovskite film layer is formed; at the detection position, the first surface of the to-be-detected piece is placed upward; for example, the computer device 104 controls the image acquisition device 102 to take a photo of the surface of the perovskite film layer of the to-be-detected piece in a direction perpendicular to the first surface, to obtain a target surface image. For another example, the computer device 104 controls the image acquisition device 102 to take a photo of the surface of the perovskite film layer of the to-be-detected piece at a preset shooting angle, to obtain a target surface image. The preset shooting angle is known, so as to facilitate subsequent size calculation for the observation mark.

[0063] This implementation can be used in a scenario that the perovskite film layer quality of each silicon wafer produced is detected, that is, the film layer quality of each silicon wafer on which the perovskite film layer is prepared can be detected in time. In this implementation, the to-be-detected piece can be any silicon wafer on which the perovskite film layer has been prepared.

[0064] In a possible implementation, the to-be-detected piece is a first detection piece in the product production line. In this way, only the observation mark needs to be arranged on the substrate of the first detection piece.

[0065] In step 204, the film layer quality data of the perovskite film layer is determined based on the size change of the observation mark in the target surface image relative to the real observation mark.

[0066] The perovskite film has optical properties that enable it to partially transmit light. Therefore, in the target surface image obtained by taking a photo of the surface of the perovskite film layer of the to-be-detected piece, the observation mark can be identified, and the perovskite film layer will absorb, emit and transmit light, so the observation mark in the target surface image will be edge blurred, pattern enlarged or distorted, etc. relative to the real observation mark. In this embodiment, the size change of the observation mark in the target surface image relative to the real observation mark is used to measure the transmission ability of the perovskite film layer to light, so as to determine the crystallization quality of the perovskite film layer, that is, the film layer quality of the perovskite film layer.

[0067] This embodiment first explains the relationship between the light transmittance of the above-mentioned perovskite film and its crystal quality: the quality of the perovskite film is generally measured by the number of large grains and through-crystals. Through-crystals refer to grains that penetrate the entire film. On the one hand, large grains can reduce the number of grain boundaries, where grain boundaries are the main source of defects in the perovskite film and will cause carrier recombination. Large grains can reduce the number of grain boundaries, thereby reducing the carrier recombination filter and improving the carrier lifetime; large-grain films have higher light absorption rates, fewer defects, and lower photogenerated carrier recombination rates; on the other hand, the through-crystal structure makes the carrier transmission path in the vertical direction more continuous, reducing defects and recombination centers; through-crystal films can reduce carrier losses during transmission, resulting in higher charge collection efficiency. Therefore, perovskite films with large grains and a large number of through-crystals can significantly improve the photoelectric conversion efficiency of solar cells and reduce defects and recombination centers, thereby improving the long-term stability of perovskite film products. A high number of through-crystals results in relatively fewer defects within the crystals within the perovskite film, resulting in a smoother surface, reduced light reflection, and improved transmittance. Furthermore, a high number of large grains means fewer grain boundaries, which reduces light scattering at these boundaries, further improving the film's transmittance. Therefore, films with large grains and numerous through-crystals have fewer grain boundaries and defects, resulting in weaker light reflection and scattering, and stronger transmission. Fine grains, however, have more grain boundaries and defects, resulting in stronger light reflection and scattering, and weaker transmission. The greater the light transmission of the perovskite film, the clearer the observed mark in the captured target surface image and the smaller the size variation. The weaker the light transmission of the perovskite film, the blurrier and larger the observed mark in the captured target surface image. Therefore, the smaller the size variation of the observed mark in the target surface image relative to the true observed mark, the better the perovskite film quality. The smaller the size variation of the observed mark in the target surface image relative to the true observed mark, the worse the perovskite film quality.

[0068] In one possible embodiment, the substrate is first photographed to obtain an initial surface image, and the film quality data of the perovskite film layer is determined based on the size change of the observation mark in the target surface image relative to the actual observation mark in the initial surface image.

[0069] For example, please refer to Figures 3 to 5 , is a schematic diagram comparing the observed mark in the target surface image and the actual observed mark under different film quality conditions. Figures 3 to 5 The perovskite film layers in the figure are prepared using different film forming methods, which are marked as film forming method ①, film forming method ② and film forming method ③. Figure 3 (a) is the initial surface image corresponding to the first substrate, Figure 3(b) in the figure is the target surface image corresponding to the first substrate after the perovskite film layer is prepared by film-forming method ①. It can be seen that after the perovskite film is formed by film-forming method ①, the observation mark on the substrate is invisible, indicating that the perovskite is poorly crystallized and the grains are relatively fine, resulting in strong reflection and scattering of light, poor transmission, and invisible observation mark.

[0070] Figure 4 (a) is the initial surface image corresponding to the second basis. Figure 4 (b) is the target surface image corresponding to the second substrate after the perovskite film is prepared using film-forming method ②. It can be seen that after the perovskite film is formed using film-forming method ②, the observation mark on the substrate becomes blurred and deformed in size, indicating that the perovskite crystallization is not very good and the grains are fine, resulting in a certain amount of reflection and scattering of light, and general transmission. The observation mark is visible but the size changes greatly.

[0071] Figure 5 (a) is the initial surface image corresponding to the third basis. Figure 5 (b) is the target surface image corresponding to the third substrate after the perovskite film layer is prepared by film-forming method ③. It can be seen that when using film-forming method ③, after the perovskite film is formed, the observation mark on the substrate is still clear and the size does not change much, indicating that the perovskite is well crystallized, the grains are large and there are many penetrating crystals, the light transmission is good, the observation mark is visible and the size does not change much.

[0072] In one possible embodiment, before preparing a perovskite film layer on a substrate, the substrate is first photographed to obtain an initial surface image, and the initial surface image and the target surface image are input into a pre-trained film quality recognition model to obtain film quality data output by the film quality recognition model; wherein the film quality recognition model is used to output the film quality data based on the size change between the observation mark in the initial surface image and the observation mark in the target surface image.

[0073] The perovskite film layer quality detection method provided in the above embodiment can be applied to detect each perovskite film layer prepared perovskite film layer of the to-be-detected piece on the production line, reduce the detection difficulty, and achieve real-time perovskite film layer quality detection effect without stopping the machine, reduce the risk of a larger scale of defective products, and improve the product quality.

[0074] The perovskite film layer quality detection method provided in the embodiment can be applied to detect each perovskite film layer prepared perovskite film layer of the to-be-detected piece on the production line, reduce the detection difficulty, and achieve real-time perovskite film layer quality detection effect without stopping the machine, reduce the risk of a larger scale of defective products, and improve the product quality.

[0075] The perovskite film layer quality detection method provided in the embodiment can avoid the problem that, in the related art, the to-be-detected piece needs to be cut before the SEM is used to obtain the SEM image of the surface and the section of the film layer for analysis, and the to-be-detected piece is scrapped, resulting in material waste. In the method provided in the embodiment, the to-be-detected piece can continue to be used for the production of subsequent products such as batteries.

[0076] In the perovskite industrialization, the perovskite film layer quality detection method provided in the embodiment can improve the production efficiency, reduce the product scrap rate, and reduce the cost caused by product scrapping.

[0077] In one exemplary embodiment, based on Figure 2 The perovskite film layer quality detection method provided in the embodiment relates to a process of determining the film layer quality data of the perovskite film layer based on the size change of the observation mark in the target surface image relative to the real observation mark. Please refer to Figure 6 The process includes steps 602 to 606, wherein:

[0078] Step 602: Obtain the target size data of the observation mark in the target surface image.

[0079] For example, the target size data is obtained by analyzing the target surface image and acquiring size data of the observed mark imaged in the target surface image.

[0080] In a possible implementation, the observed mark includes at least one line shape, and the step 303 of acquiring the target size data of the observed mark in the target surface image includes: acquiring a line width of the observed mark in the target surface image, and determining the target size data based on the line width.

[0081] In this embodiment, the observed mark can be a line shape mark or a mark composed of multiple line shapes. In the example where the observed mark is composed of multiple line shapes, the multiple line shapes can be parallel to each other or intersect with each other.

[0082] For example, the observed mark includes two line shapes intersecting with each other perpendicularly, as shown in FIG. 4. Figure 7 The target size data is determined based on line widths of the two line shapes. For example, the target size data is a sum of a first line target width H1 and a second target line width H2. In some embodiments of the present application, the two line shapes intersecting with each other perpendicularly are referred to as a cross star pattern, as shown in FIG. 5. Figure 7

[0083] In a possible implementation, the observed mark includes a circular shape. The target size data can be a diameter or a radius or an area of the circular shape.

[0084] In a possible implementation, the observed mark includes a rectangular shape. The target size data can be a length or a width or an area of the rectangular shape.

[0085] In a possible implementation, the observed mark can also include other shapes whose sizes can be calculated.

[0086] In step 604, the target size change data is obtained based on the target size data and real size data of the observed mark.

[0087] The real size data refers to size data of the observed mark without distortion.

[0088] In a possible implementation, the real size data is size data pre-stored in the computer device 104. The observed size is set on the substrate according to the real size data, so that the size data can be pre-stored in the computer device 104 and called when the target size change data is calculated.

[0089] ​In a possible implementation, before the perovskite film layer is prepared on the substrate, the first surface of the substrate is photographed to obtain an initial surface image, and real size data of the observation mark in the initial surface image is obtained.

[0090] In the embodiment, the real size data and the target size data are obtained by the image acquisition device 102, the calculation deviation caused by inconsistent sources of the size data can be avoided, and the accuracy of the target size change data is improved. In the scenario where the image acquisition device 102 photographs according to the preset angle, the initial surface image and the target surface image are both obtained by the image acquisition device 102 according to the preset photographing angle, the preset photographing angle does not need to be considered when calculating the target size data, and the size data of the observation mark in the target surface image is directly calculated to obtain the target size change data, and the real size data is also directly calculated from the size data of the observation mark in the initial surface image, so that the calculation process of the target size data is simplified, and the calculation efficiency is improved.

[0091] In a possible implementation, based on the target size data and the real size data of the observation mark, the process of obtaining the target size change data includes: determining a difference value between the target size data and the real size data, and determining the target size change data based on the difference value.

[0092] For example, the difference value between the target size data and the real size data is determined as the target size change data.

[0093] For example, a ratio between the difference value and the real size data is determined as the target size change data.

[0094] In a possible implementation, based on the target size data and the real size data of the observation mark, the process of obtaining the target size change data includes: determining a ratio between the target size data and the real size data, and determining the target size change data based on the ratio.

[0095] For example, the ratio between the target size data and the real size data is determined as the target size change data.

[0096] In a possible implementation, the number of observation marks is multiple. For example, refer to Figure 8 , five observation marks are arranged on the substrate, and each observation mark includes two lines perpendicular to each other.

[0097] In the embodiment, the process of obtaining the target size change data based on the target size data and the real size data of the observation mark includes: obtaining initial size change data corresponding to the target size data respectively based on the target size data and the real size data; and obtaining the target size change data based on at least one of the initial size change data.

[0098] In an optional implementation of the embodiment, the plurality of observation marks arranged on the first surface of the substrate are the same, i.e., the real size data corresponding to each observation mark is consistent.

[0099] In an optional implementation of the embodiment, the plurality of observation marks arranged on the first surface of the substrate are not completely the same, i.e., the real size data corresponding to each observation mark is not completely consistent. For each observation mark, the initial size change data between the target size data corresponding to each observation mark and the real size data corresponding to each observation mark is calculated respectively.

[0100] In an optional implementation of the embodiment, the process of obtaining the target size change data based on at least one of the initial size change data includes: determining the initial size data with the maximum value in the initial size change data as the target size change data. In this implementation, the greater the value of the size change data, the greater the deformation of the observation mark in the target surface image.

[0101] In an optional implementation of the embodiment, the process of obtaining the target size change data based on at least one of the initial size change data includes: determining the initial size data with the minimum value in the initial size change data as the target size change data. In this implementation, the smaller the value of the size change data, the greater the deformation of the observation mark in the target surface image. For example, the initial size change data is the ratio between the real size data and the target size data.

[0102] In the above two optional implementations, the initial size change data corresponding to the observation mark with the most serious deformation of the observation mark in the target surface image is determined as the target size change data corresponding to the detection piece, and the film quality state data of the perovskite film layer is determined.

[0103] In an optional implementation of the embodiment, the process of obtaining the target size change data based on at least one of the initial size change data includes: adding the initial size change data to obtain the target size change data.

[0104] In an optional implementation of this embodiment, the process of obtaining target size change data based on at least one of the initial size change data includes performing weighted addition processing on the initial size change data to obtain the target size change data. Exemplarily, the weighting coefficient for each initial size change data is determined based on the position of the corresponding observation mark on the silicon substrate.

[0105] Step 606 : Obtaining film quality data of the perovskite film based on the target size change data.

[0106] Among them, the larger the target size change data, the worse the film quality of the perovskite film layer, and the smaller the target size change data, the better the film quality of the perovskite film layer.

[0107] In one possible embodiment, a mapping relationship between dimensional change data and film quality data is established through experiments; in the process of executing the perovskite film quality detection method, the film quality data corresponding to the target dimensional change data is determined from the mapping relationship based on the target dimensional change data.

[0108] Observation mark Figure 7 The two lines intersecting vertically are shown in the figure, and the target size data includes the first target width data H1 (corresponding to Figure 7 horizontal lines in the middle) and the second target width data H2 (corresponding to Figure 7 The vertical lines in the real size data include the first real width data H1' (corresponding to Figure 7 The horizontal line in the middle) and the second real width data H2' (corresponding to Figure 7 As an example, the target size change data △H=△H1+△H2, △H1=H1-H1', △H2=H2-H2', after a lot of experiments, the mapping constructed is as follows Figure 9 As shown, Figure 9 The vertical coordinate in Indicates the film quality data, and its value can be determined based on SEM scanning.

[0109] For example, Figure 3 In the target surface image (b) shown in FIG, the observation mark is not visible, and the values ​​of H1 and H2 are considered to be infinite, while H1' and H2' are both fixed values. It can be judged that the target change size data △H is infinite. Figure 9 , the corresponding film quality data If it tends to zero, it means that the crystal quality is poor and the grains are fine and fragmented, which is not conducive to the overall quality of the device. It is judged that the batch corresponding to the part to be tested cannot be produced. The production can be shut down based on the film quality data to determine the cause of the abnormality. Figure 4The target surface image shown in (b) in FIG. 1A observes the corresponding H1=0.501 mm, H2=0.512 mm, Figure 4 The initial surface image shown in (a) in FIG. 1A observes the corresponding H1'=0.278 mm, H2'=0.268 mm; the target size change data ΔH=0.501-0.278+0.512-0.268=0.467 mm can be obtained. Figure 5 The target surface image shown in (b) in FIG. 1A observes the corresponding H1=0.393 mm, H2=0.397 mm, Figure 5 The initial surface image shown in (a) in FIG. 1A observes the corresponding H1'=0.272 mm, H2'=0.268 mm; the target size change data ΔH=0.393-0.272+0.397-0.268=0.25 mm can be obtained. It can be seen that the smaller the ΔH change is, the better the crystallization quality is, the larger the grain size is, the more the through grains are, and the fewer the grain boundaries are; the larger the ΔH change is, the more the grain is broken, the fewer the through grains are, the more the grain boundaries are, and the more the defects are, that is, the worse the crystallization quality is.

[0110] The method for detecting the quality of the perovskite film layer provided by the above embodiment, by acquiring the target size data of the observation mark in the target surface image, and then calculating based on the target size data and the real size data to obtain the target size change data, and determining the film layer quality data of the perovskite film layer based on the target size change data, in this way, the film layer quality data of the perovskite film layer is quickly determined through image processing and mathematical calculation, and the efficiency of the perovskite film layer quality detection is improved.

[0111] In an exemplary embodiment, the target size change data is obtained based on the target size data and the real size data of each observation mark. Figure 3 As shown in the embodiment of FIG. 1B, the number of observation marks in the embodiment is multiple, the number of target size change data is multiple, and the target size change data corresponds to the observation mark. In the embodiment, based on the target size change data, the process of obtaining the film layer quality data of the perovskite film layer includes: based on each target size change data, obtaining the film layer quality data of the corresponding position of each observation mark in the perovskite film layer.

[0112] In a possible implementation, each observation mark is uniformly and spacedly arranged on the substrate.

[0113] In the embodiment, the size change data between the target size data and the real size data of each observation mark is obtained as the target size change data corresponding to each observation mark. In the embodiment, each observation mark is arranged in a different region of the first surface of the substrate, so as to obtain the film layer quality data of the corresponding position of each observation mark through the target size change data corresponding to each observation mark, to judge the regional uniformity of the perovskite film layer quality.

[0114] In one exemplary embodiment, as shown in Figure 10 FIG. 1, a perovskite film layer quality method is provided, and the method is applied to the computer device 104 in Figure 1 FIG. 1, including the following steps 1002 to 1010. Among them:

[0115] Step 1002, photographing the first surface of the substrate to obtain an initial surface image, and obtaining real size data of the observation mark in the initial surface image, wherein the first surface of the substrate is the surface of the substrate facing the perovskite film layer, and the first surface of the substrate is provided with an observation mark.

[0116] Step 1004, photographing the surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image, and the to-be-detected piece includes a substrate and a perovskite film layer.

[0117] Step 1006, obtaining target size data of the observation mark in the target surface image.

[0118] Optionally, the observation mark includes at least one line shape; the process of obtaining the target size data of the observation mark in the target surface image includes: obtaining the line width of the observation mark in the target surface image; and determining the target size data based on the line width.

[0119] Step 1008, obtaining target size change data based on the target size data and the real size data of the observation mark.

[0120] Optionally, the process of obtaining the target size change data based on the target size data and the real size data of the observation mark includes: determining the difference between the target size data and the real size data; and determining the target size change data based on the difference.

[0121] Optionally, the number of observation marks is multiple, and the number of target size data is multiple; the process of obtaining the target size change data based on the target size data and the real size data of the observation mark includes: obtaining initial size change data corresponding to each target size data based on each target size data and real size data; and obtaining the target size change data based on at least one of the initial size change data.

[0122] Step 1010, obtaining film layer quality data of the perovskite film layer based on the target size change data.

[0123] Optionally, the number of observation marks is multiple, and the number of target size change data is multiple, and the target size change data corresponds to the observation mark; the process of obtaining the film layer quality data of the perovskite film layer based on the target size change data includes: obtaining the film layer quality data of the position corresponding to each observation mark in the perovskite film layer based on each target size change data.

[0124] It should be understood that although the steps in the flowcharts involved in the embodiments described above are shown in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts involved in the embodiments described above can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of the steps or stages is not necessarily sequential, but can be alternately or alternately executed with at least part of other steps or steps or stages in other steps.

[0125] It can be understood that the term "based on" used in the present application is used to describe one or more factors that affect the determination, and does not exclude other factors that can affect the determination. For example, the phrase "determining A based on B" means that the determination of A can be based entirely or at least partially on factor B, that is, B is one factor that affects the determination of A, but does not exclude that the determination of A is also based on C.

[0126] Based on the same inventive concept, the embodiments of the present application also provide a perovskite film layer quality detection device for implementing the above-mentioned perovskite film layer quality detection method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more perovskite film layer quality detection device embodiments provided below can refer to the limitations of the perovskite film layer quality detection method described above, which will not be repeated here.

[0127] In one exemplary embodiment, as shown in Figure 11 A perovskite film layer quality detection device is provided, comprising: an image acquisition module 1102 and a quality evaluation module 1104, wherein:

[0128] The image acquisition module 1102 is configured to take a photo of the surface of the perovskite film layer of the to-be-detected piece to obtain a target surface image, the to-be-detected piece comprising a substrate and a perovskite film layer, and the substrate being provided with an observation mark on the first surface facing the perovskite film layer;

[0129] The quality evaluation module 1104 is configured to determine film layer quality data of the perovskite film layer based on a size change of the observation mark in the target surface image relative to the real observation mark.

[0130] In an example embodiment, the quality evaluation module 1104 comprises a size calculation unit and a quality determination unit, wherein the size calculation unit is configured to obtain target size data of the observation mark in the target surface image; and obtain target size change data based on the target size data and the real size data of the observation mark; and the quality determination unit is configured to obtain the film layer quality data of the perovskite film layer based on the target size change data.

[0131] In an example embodiment, the observation mark comprises at least one line shape; and the size calculation unit is configured to obtain a line width of the observation mark in the target surface image; and determine the target size data based on the line width.

[0132] In an example embodiment, the size calculation unit is configured to determine a difference between the target size data and the real size data; and determine the target size change data based on the difference.

[0133] In an example embodiment, the number of observation marks is a plurality, and the number of target size data is a plurality; the size calculation unit is configured to obtain initial size change data corresponding to each target size data based on each target size data and the real size data; and obtain the target size change data based on at least one of the initial size change data.

[0134] In an example embodiment, the image acquisition unit 1102 is further configured to take a photograph of the first surface of the substrate before the perovskite film layer is prepared on the substrate to obtain an initial surface image; and the quality evaluation unit 1104 is further configured to obtain real size data of the observation mark in the initial surface image.

[0135] In an example embodiment, the number of observation marks is a plurality, and the number of target size change data is a plurality, and the target size change data corresponds to the observation mark; and the quality determination unit is configured to obtain film layer quality data of positions corresponding to each observation mark in the perovskite film layer based on each target size change data.

[0136] Each module in the above perovskite film layer quality detection device can be realized by software, hardware and combinations thereof, in whole or in part. Each module described above can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory in the computer device in software form, so as to be called and executed by the processor to perform the operations corresponding to each module.

[0137] In an example embodiment, a computer device is provided, which can be a terminal, and the internal structure diagram thereof can be as shown in Figure 12The computer device shown in the figure includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capability. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operating system and the computer program in the non-volatile storage medium to run. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner. The wireless manner can be realized through WIFI, mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by the processor to realize a perovskite film layer quality detection method. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer overlaid on the display screen, or a key, trackball or touchpad arranged on the shell of the computer device, or an external keyboard, touchpad or mouse, etc.

[0138] Those skilled in the art can understand that, Figure 12 The skilled in the art can understand that,

[0139] In one embodiment, a computer device is also provided, including a memory and a processor, the memory stores a computer program, and the processor executes the computer program to realize the steps in the above method embodiments.

[0140] In one embodiment, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to realize the steps in the above method embodiments.

[0141] In one embodiment, a computer program product is provided, including a computer program, and the computer program is executed by a processor to realize the steps in the above method embodiments.

[0142] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of related data need to comply with relevant regulations.

[0143] It can be understood by those skilled in the art that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing related hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, it can include the processes of the above-mentioned embodiments of each method. Any reference to memory, database or other medium used in the embodiments provided by the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided by the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided by the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0144] The technical features of the above embodiments can be combined in any way. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0145] The above-described embodiments are merely illustrative of several embodiments of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A method for detecting the quality of a perovskite film, characterized in that: The method comprises: Taking a photo of a surface of a perovskite film layer of a to-be-tested object to obtain a target surface image, wherein the to-be-tested object includes a substrate and a perovskite film layer, and an observation mark is provided on a first surface of the substrate facing the perovskite film layer; Based on the size change of the observation mark in the target surface image relative to the actual observation mark, the film quality data of the perovskite film layer is determined.

2. The method according to claim 1, characterized in that Determining the film quality data of the perovskite film layer based on the size change of the observation mark in the target surface image relative to the actual observation mark includes: Acquiring target size data of the observation mark in the target surface image; Obtaining target size change data based on the target size data and the actual size data of the observation mark; Based on the target size change data, film quality data of the perovskite film layer is obtained.

3. The method according to claim 2, characterized in that The observation mark includes at least one line shape; The acquiring target size data of the observation mark in the target surface image includes: Obtaining the line width of the observation mark in the target surface image; The target size data is determined based on the line width.

4. The method according to claim 2, characterized in that The step of obtaining target size change data based on the target size data and the real size data of the observation mark includes: determining a difference between the target size data and the actual size data; Based on the difference, the target size change data is determined.

5. The method according to claim 2, characterized in that There are multiple observation marks and multiple target size data; The step of obtaining target size change data based on the target size data and the real size data of the observation mark includes: Based on the target size data and the true size data, obtaining initial size change data corresponding to each target size data; The target size change data is obtained based on at least one of the initial size change data.

6. The method according to claim 2, characterized in that The method further comprises: Before forming the perovskite film layer on the substrate, photographing the first surface of the substrate to obtain an initial surface image; The real size data of the observation mark in the initial surface image is obtained.

7. The method according to claim 2, characterized in that There are multiple observation identifiers, multiple target size change data, and the target size change data correspond to the observation identifiers; The obtaining of the film quality data of the perovskite film layer based on the target size change data includes: Based on the target size change data, the film quality data of the position corresponding to each observation mark in the perovskite film layer is obtained.

8. A perovskite film quality detection device, characterized in that: The device comprises: An image acquisition module is configured to photograph a surface of a perovskite film layer of a test object to obtain a target surface image, wherein the test object includes a substrate and a perovskite film layer, and an observation mark is provided on a first surface of the substrate facing the perovskite film layer; A quality assessment module is used to determine the film quality data of the perovskite film layer based on the size change of the observation mark in the target surface image relative to the real observation mark.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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