A chip packaging positioning fixture

Abstract

This invention relates to the field of chip packaging positioning technology, and particularly to a chip packaging positioning fixture. A working groove is formed on one side wall of the positioning base; a chip positioning mechanism is provided within the working groove. This invention controls adjacent connecting magnetic pillars to move towards their opposite sides, compressing an elastic sheet. Because the elastic sheet is wavy, its width increases during compression, extending out of the connecting groove. This allows the corresponding contact piece to abut against the chip's connection point and reduces the exit size to prevent the chip from falling out. Simultaneously, when the two sets of connecting magnetic pillars move to the bottom of the detection cavity, they magnetically drive a lifting magnetic plate, causing several sets of detection probes to extend from four sets of telescopic slots and abut against the pins of the packaging substrate. This achieves functional detection when the chip is bonded to the packaging substrate, improving both the stability of the positioning fixture and its effectiveness in chip packaging.

Description

[0001] This application is a divisional application of the application filed on April 8, 2025, with application number 2025104318435 and invention title "A chip packaging positioning fixture and its usage method". Technical Field

[0002] This invention belongs to the field of chip packaging positioning technology, and specifically relates to a chip packaging positioning fixture. Background Technology

[0003] Chip packaging is the fundamental level of integrated circuit packaging. It refers to the process of electrically connecting a single chip to a packaging substrate or lead frame, providing physical protection, and forming external pins. During chip packaging, positioning fixtures are typically used to position the chip and the packaging substrate.

[0004] A search of existing technology reveals a chip packaging positioning fixture, disclosed in Chinese Patent Publication No. CN114068378A, published on February 18, 2022. The fixture includes a control base, a main unit fixedly mounted on the control base, a positioning platform and a vertical plate fixedly mounted on the main unit, and a positioning column fixedly mounted on the positioning platform. The positioning platform has a positioning groove with a vent hole, through which a suspension rope is installed. An air inlet pipe is fixedly connected to the control base, and a main pipe is fixedly connected to the air inlet pipe. A shunt pipe is connected to the main pipe, and a positioning structure with segmented working function is connected to the shunt pipe. This invention adds a positioning structure around the positioning groove on the fixture surface, using the positioning structure to position the chip placed in the positioning groove, ensuring the smooth progress of the chip packaging process. This chip packaging positioning method standardizes the operation process of the positioning fixture, ensures the coordinated operation of the positioning structure in the fixture, and completes stable chip packaging.

[0005] However, this positioning fixture still has the following drawbacks:

[0006] When attaching the chip to the packaging substrate, it is impossible to detect whether the chip can work properly in real time. Functional testing needs to be performed after chip packaging, which reduces the effectiveness of the positioning fixture in the chip packaging process. Summary of the Invention

[0007] To address the aforementioned problems, the present invention provides a chip packaging positioning fixture, including a positioning base, a working groove formed on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove; and a substrate positioning mechanism for calibrating and positioning the packaging substrate is provided directly below the chip positioning mechanism.

[0008] The chip positioning mechanism includes several sets of auxiliary positioning components;

[0009] The auxiliary positioning component includes a second mounting frame for calibrating the positioning chip; a set of connecting slots are respectively opened on the four inner walls of the second mounting frame; each set of connecting slots is provided with two sets of connecting magnetic pillars; a set of elastic sheets is provided between the corresponding two sets of connecting magnetic pillars; the elastic sheets are wavy and have several sets of connecting contact pieces that can be connected to the chip at equal intervals on the side wall near the second positioning plate.

[0010] The second mounting frame is provided with four sets of detection chambers; each set of detection chambers is slidably connected to a set of lifting magnetic plates in the vertical direction; each set of lifting magnetic plates is provided with a set of guide blocks at the top; each set of guide blocks is provided with several sets of detection probes connected to the packaging substrate at the top.

[0011] Furthermore, the top of the working slot has an open structure; the chip positioning mechanism and the substrate positioning mechanism are connected by transmission; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is connected by transmission to the chip positioning mechanism; an installation through slot is provided on one side wall of the positioning base; an auxiliary feeding mechanism is movably inserted through the installation through slot; two sets of limiting magnets are symmetrically provided at the top two sides of the installation through slot.

[0012] Furthermore, a first working groove is formed on one side wall of the positioning base; an air guide cavity is formed on one side inner wall of the mounting through groove; a plurality of first electric push rods are provided on the inner wall of the air guide cavity away from the auxiliary feeding mechanism; an air guide plate is drivenly connected to the output end of the plurality of first electric push rods; a plurality of limiting connecting pipes are provided at equal intervals on the inner wall of the air guide plate near the auxiliary feeding mechanism; the end of each limiting connecting pipe away from the air guide plate is movably inserted into the auxiliary feeding mechanism; a cooler is provided on the inner wall of the air guide cavity away from the auxiliary feeding mechanism.

[0013] Furthermore, the chip positioning mechanism also includes a rotating shaft; a number of mounting blocks are arranged in a circular array on the outer wall of the rotating shaft; a number of chip positioning slots are equally spaced on the side wall of each mounting block away from the rotating shaft; each set of auxiliary positioning components is installed in a corresponding set of chip positioning slots; and a set of telescopic suction cups is provided in each set of chip positioning slots.

[0014] Furthermore, the substrate positioning mechanism includes a rotating column; several sets of substrate positioning grooves are arranged in a circular array on the outer wall of the rotating column; each set of substrate positioning grooves has a first positioning plate on its four inner walls that can calibrate and position the packaged substrate; each set of substrate positioning grooves has a set of adsorption holes on the inner wall of the side closest to the axis of the rotating column; the rotating column has an adsorption cavity; the adsorption cavity is connected to the several sets of adsorption holes; and a closed magnetic plate is provided in the adsorption cavity.

[0015] Furthermore, the auxiliary feeding mechanism includes a first mounting frame; the first mounting frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first mounting frame; cooling grooves and second working grooves are respectively opened on the inner walls of both sides of the first mounting frame; the second working groove is connected to the first working groove.

[0016] Furthermore, several sets of air guide holes are equally spaced on the side wall of the cooling tank away from the second working tank; each set of limiting connecting pipes is movably inserted into the corresponding set of air guide holes; several sets of second electric push rods are symmetrically arranged on the inner walls of both sides of the first mounting frame; a set of guide plates are drivenly connected to the output ends of several sets of second electric push rods on the same side; several sets of guide rollers are equally spaced on the side walls opposite to the two sets of guide plates.

[0017] Furthermore, the second mounting frame is U-shaped; a set of second positioning plates is provided on the four inner walls of the bottom of the second mounting frame; a set of telescopic grooves is provided on the four edges of the top of the second mounting frame; each set of detection cavities is connected to the corresponding set of telescopic grooves.

[0018] Furthermore, each set of lifting magnetic plates is symmetrically provided with several sets of reset springs at its top; the top of each set of reset springs is connected to the top of a corresponding set of detection chambers; each set of lifting magnetic plates is provided with a set of guide blocks at its top; each set of guide blocks is damped and slidably connected with several sets of detection probes at its top; each set of detection probes is electrically connected to a corresponding set of connecting contact pieces.

[0019] A method of using a chip packaging positioning fixture, the method comprising:

[0020] Several groups of chips are placed inside the chip positioning mechanism;

[0021] Several groups of packaging substrates are placed in the substrate positioning mechanism;

[0022] The control chip positioning mechanism drives the substrate positioning mechanism to rotate, thereby transferring the chip to the top of the packaging substrate.

[0023] By controlling two adjacent sets of connecting magnetic pillars to move towards the opposite side, the elastic sheet is compressed, so that several sets of connecting contacts are connected to the chip.

[0024] The two adjacent sets of connecting magnetic pillars move to the direct underside of the corresponding lifting magnetic plate, and the lifting magnetic plate is driven by magnetic force to extend several sets of detection probes and connect them to the packaging substrate.

[0025] The control chip positioning mechanism attaches the chip to the packaging substrate;

[0026] Complete the chip packaging and positioning work.

[0027] The beneficial effects of this invention are:

[0028] 1. By controlling the adjacent connecting magnetic pillars to move towards the opposite side, the elastic sheet is compressed. Since the elastic sheet is wavy, its width increases during compression, extending out of the connecting groove. This allows the corresponding contact to abut against the chip's connection point and reduces the outlet size to prevent the chip from falling out. At the same time, when the two sets of connecting magnetic pillars move to the bottom of the detection cavity, they magnetically push the lifting magnetic plate to drive several sets of detection probes to extend from the four sets of telescopic slots and abut against the pins of the packaging substrate. This achieves functional detection when the chip is bonded to the packaging substrate, improving the stability of the positioning fixture while enhancing its effectiveness in chip packaging.

[0029] 2. Since heating is usually required when the chips are attached to the packaging substrate, when the corresponding sets of packaging substrates and chips rotate to face the cooling tank, cold air is introduced through the corresponding sets of air guide holes to cool the packaging substrates and chips. This allows the packaging substrates and chips to be unloaded directly when they rotate to the bottom, avoiding the need for static cooling. At the same time, the guide plates on both sides drive the guide rollers to make slow reciprocating motions, which can correct the position of the packaging substrates and chips, so that the unloading positions of the packaging substrates and chips are consistent, improving the unloading efficiency and quality of the positioning fixture.

[0030] 3. By controlling the circulating motor to drive the rotating shaft to rotate, the rotating shaft will drive the rotating column to rotate, exposing several sets of substrate positioning slots in the first working slot. Then, several sets of packaging substrates are placed in the corresponding substrate positioning slots for calibration and positioning. When the corresponding sets of chips rotate to the underside of the rotating shaft, the corresponding sets of packaging substrates rotate to the topside of the rotating column. Since the corresponding sets of chips and packaging substrates are correctly aligned at this time, the corresponding telescopic suction cups will stick the chips onto the packaging substrates. This achieves continuous chip packaging and positioning work and improves the working efficiency of the positioning fixture.

[0031] 4. When it is necessary to disassemble the auxiliary feeding mechanism, several sets of first electric push rods can be controlled to move the air guide plate toward the side away from the auxiliary feeding mechanism, so that several sets of limit connecting pipes are disengaged from the corresponding sets of air guide holes. Then the first mounting frame can be pulled out directly from the side of the mounting slot for corresponding repair or maintenance work. This improves the maintenance efficiency of the positioning fixture while ensuring the refrigeration efficiency.

[0032] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic diagram of the positioning fixture according to an embodiment of the present invention is shown;

[0035] Figure 2 A cross-sectional schematic diagram of a positioning fixture according to an embodiment of the present invention is shown;

[0036] Figure 3 A schematic diagram of the chip positioning mechanism according to an embodiment of the present invention is shown;

[0037] Figure 4 A schematic diagram of the structure of an auxiliary positioning component according to an embodiment of the present invention is shown;

[0038] Figure 5 A cross-sectional schematic diagram of an auxiliary positioning component according to an embodiment of the present invention is shown;

[0039] Figure 6 A schematic diagram of the structure of the elastic sheet according to an embodiment of the present invention is shown;

[0040] Figure 7 A schematic diagram of the substrate positioning mechanism according to an embodiment of the present invention is shown;

[0041] Figure 8 A cross-sectional schematic diagram of a substrate positioning mechanism according to an embodiment of the present invention is shown;

[0042] Figure 9 A schematic diagram of the auxiliary feeding mechanism according to an embodiment of the present invention is shown.

[0043] In the diagram: 1. Positioning base; 2. Working slot; 3. Chip positioning mechanism; 4. Substrate positioning mechanism; 5. Circulating motor; 6. Mounting through slot; 7. Auxiliary feeding mechanism; 8. Limiting magnet; 9. First working slot; 10. Air guide cavity; 11. First electric push rod; 12. Air guide plate; 13. Limiting connecting pipe; 14. Cooler; 301. Rotating shaft; 302. Mounting block; 303. Chip positioning slot; 304. Auxiliary positioning component; 305. Telescopic suction cup; 401. Rotating column; 402. Substrate positioning slot; 403. First positioning plate; 404. Adsorption hole; 405. Adsorption cavity; 406. Enclosed magnetic plate; 701. First mounting frame; 702. Conveyor. 703. Cooling tank; 704. Second working tank; 705. Air vent; 706. Second electric push rod; 707. Guide plate; 708. Guide roller; 30401. Second mounting frame; 30402. Second positioning plate; 30403. Telescopic slot; 30404. Power chamber; 30405. Third electric push rod; 30406. Lead screw; 30407. Transmission block; 30408. Connecting slot; 30409. Connecting magnetic column; 30410. Elastic sheet; 30411. Detection chamber; 30412. Lifting magnetic plate; 30413. Return spring; 30414. Guide block; 30415. Detection probe; 30416. Connecting contact piece. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] This invention provides a chip packaging positioning fixture, including a positioning base 1. For example, as shown... Figure 1 and Figure 2As shown, a working groove 2 is formed on one side wall of the positioning base 1; the top of the working groove 2 is an open structure; a chip positioning mechanism 3 is provided inside the working groove 2; a substrate positioning mechanism 4 is provided directly below the chip positioning mechanism 3; the chip positioning mechanism 3 and the substrate positioning mechanism 4 are connected in a driving manner; a circulating motor 5 is provided on one side wall of the positioning base 1; the output end of the circulating motor 5 is connected in a driving manner to the chip positioning mechanism 3; an installation through groove 6 is formed on one side wall of the positioning base 1; an auxiliary feeding mechanism 7 is movably inserted through the installation through groove 6; two sets of limiting magnets 8 are symmetrically arranged at the top two sides of the installation through groove 6. A first working groove 9 is provided on one side wall of the positioning base 1; an air guide cavity 10 is provided on one side inner wall of the mounting through groove 6; a plurality of sets of first electric push rods 11 are provided on the inner wall of the air guide cavity 10 away from the auxiliary feeding mechanism 7; an air guide plate 12 is connected to the output end of the plurality of sets of first electric push rods 11; a plurality of sets of limiting connecting pipes 13 are provided at equal intervals on the inner wall of the air guide plate 12 near the auxiliary feeding mechanism 7; the end of each set of limiting connecting pipes 13 away from the air guide plate 12 is movably inserted into the auxiliary feeding mechanism 7; a cooler 14 is provided on the inner wall of the air guide cavity 10 away from the auxiliary feeding mechanism 7.

[0046] During chip packaging and positioning, several sets of chips and packaging substrates are placed in chip positioning mechanism 3 and substrate positioning mechanism 4 respectively for positioning. Then, chip positioning mechanism 3 is controlled to attach the chips to the packaging substrate, and substrate positioning mechanism 4 is controlled to move the packaging substrate and chips for unloading, which facilitates the subsequent protective shell injection molding.

[0047] For example, such as Figure 3 As shown, the chip positioning mechanism 3 includes a rotating shaft 301; several sets of mounting blocks 302 are arranged in a circular array on the outer wall of the rotating shaft 301; several sets of chip positioning slots 303 are evenly spaced on the side wall of each set of mounting blocks 302 away from the rotating shaft 301; each set of chip positioning slots 303 is provided with an auxiliary positioning component 304; and each set of chip positioning slots 303 is provided with a telescopic suction cup 305.

[0048] For example, such as Figure 4 and Figure 5As shown, the substrate positioning mechanism 4 includes a rotating column 401; the rotating column 401 is connected to the rotating shaft 301; several sets of substrate positioning grooves 402 are arranged in a ring array on the outer wall of the rotating column 401; a set of first positioning plates 403 are provided on the four inner walls of each set of substrate positioning grooves 402; a set of adsorption holes 404 are provided on the inner wall of each set of substrate positioning grooves 402 near the axis of the rotating column 401; an adsorption cavity 405 is provided inside the rotating column 401; the adsorption cavity 405 is connected to several sets of adsorption holes 404; a closed magnetic plate 406 is provided inside the adsorption cavity 405.

[0049] During chip packaging and positioning, several sets of chips are placed in chip positioning slots 303, and corresponding sets of auxiliary positioning components 304 are controlled to calibrate and position the chips. Then, the circulating motor 5 is controlled to drive the rotating shaft 301 to rotate, and the rotating shaft 301 drives the rotating column 401 to rotate, exposing the corresponding sets of substrate positioning slots 402 in the first working slot 9. Then, several sets of packaging substrates are placed in the corresponding substrate positioning slots 402. First, the suction holes 404 generate a slight suction force on the packaging substrate to prevent it from falling off. Then, the four sets of first positioning plates 403 in each set of substrate positioning slots 402 calibrate and position the corresponding packaging substrate. When the corresponding sets of chips rotate to the position directly below the rotating shaft 301, the corresponding sets of packaging substrates rotate to the position directly above the rotating column 401. Since the corresponding sets of chips and packaging substrates are correctly aligned at this time, the auxiliary positioning components 304 are controlled to release the restriction on the chips, and the corresponding telescopic suction cups 305 attach the chips to the packaging substrate. This achieves continuous chip packaging and positioning work and improves the working efficiency of the positioning fixture. Under the magnetic action of the two sets of limiting magnets 8, the closed magnetic plate 406 is always kept at the bottom of the adsorption cavity 405. When the corresponding packaging substrates and chips rotate to the direct below the rotating column 401, the closed magnetic plate 406 will close the corresponding adsorption holes 404, so that the corresponding packaging substrates and chips will fall into the auxiliary unloading mechanism 7 for unloading.

[0050] For example, such as Figure 6As shown, the auxiliary feeding mechanism 7 includes a first mounting frame 701; the first mounting frame 701 is U-shaped; a conveyor belt 702 is provided on the bottom inner wall of the first mounting frame 701; cooling grooves 703 and second working grooves 704 are respectively opened on the inner walls of both sides of the first mounting frame 701; the second working groove 704 is connected to the first working groove 9; a number of sets of air guide holes 705 are equally spaced on the side wall of the cooling groove 703 away from the second working groove 704; each set of limiting connecting pipes 13 is movably inserted into the corresponding set of air guide holes 705; a number of sets of second electric push rods 706 are symmetrically arranged on the inner walls of both sides of the first mounting frame 701; a set of guide plates 707 are drivenly connected to the output ends of the sets of second electric push rods 706 on the same side; a number of sets of guide rollers 708 are equally spaced on the side walls opposite to the two sets of guide plates 707.

[0051] During chip packaging and positioning, since the chips are typically heated when attached to the packaging substrate, when the corresponding sets of packaging substrates and chips rotate to face the cooling tank 703, cold air is introduced through the corresponding sets of air guide holes 705 to cool the packaging substrates and chips. This allows the packaging substrates and chips to be directly unloaded when they rotate downwards, avoiding the need for static cooling. Simultaneously, the guide plates 707 on both sides drive the guide rollers 708 to perform slow reciprocating motion, which can correct the position of the packaging substrates and chips, ensuring that the unloading positions of the packaging substrates and chips are consistent, thus improving the unloading efficiency and quality of the positioning fixture. When it is necessary to disassemble the auxiliary unloading mechanism 7, the first electric push rods 11 can be controlled to move the air guide plates 12 away from the auxiliary unloading mechanism 7, causing the limiting connecting pipes 13 to disengage from the corresponding sets of air guide holes 705. Subsequently, the first mounting frame 701 can be pulled directly out from the side of the mounting slot 6 for corresponding repair or maintenance work, ensuring cooling efficiency while improving the maintenance efficiency of the positioning fixture.

[0052] For example, such as Figure 7 , Figure 8 and Figure 9As shown, the auxiliary positioning component 304 includes a second mounting frame 30401; the second mounting frame 30401 is U-shaped; a set of second positioning plates 30402 are respectively provided on the four inner walls of the bottom of the second mounting frame 30401; a set of telescopic slots 30403 are respectively provided on the four edges of the top of the second mounting frame 30401; four sets of power chambers 30404 are provided inside the second mounting frame 30401; each set of power chambers 30404 has several sets of third electric push rods 30405 on the inner wall of the side near the second positioning plate 30402; each set of third electric push rods 30405... The output ends are all connected to a corresponding set of second positioning plates 30402; each set of power chambers 30404 is provided with two sets of lead screws 30406; one end of each set of two sets of lead screws 30406 is fixedly connected, and the other end is rotatably connected to the inner walls on both sides of the corresponding set of power chambers 30404; the thread directions of the two sets of lead screws 30406 are opposite, and their central axes are on the same straight line; two sets of transmission blocks 30407 are slidably connected to the top inner wall of each set of power chambers 30404; each set of transmission blocks 30407 is threadedly connected to a corresponding set of lead screws 30406; the second mounting frame A set of connecting grooves 30408 ​​are respectively opened on the four inner walls of 30401; one end of each set of transmission blocks 30407 extends into the corresponding set of connecting grooves 30408, and is connected to a set of connecting magnetic pillars 30409; a set of elastic sheets 30410 is provided between each pair of corresponding sets of connecting magnetic pillars 30409; the elastic sheets 30410 are wavy, and several sets of connecting contact sheets 30416 are evenly spaced on the side wall near the second positioning plate 30402; four sets of detection cavities 30411 are provided in the second mounting frame 30401; each set of detection cavities 30411 is connected to a corresponding set of telescopic through grooves. 30403 is connected; a set of lifting magnetic plates 30412 is slidably connected in the vertical direction in each set of detection chambers 30411; several sets of reset springs 30413 are symmetrically arranged on the top of each set of lifting magnetic plates 30412; the top of each set of reset springs 30413 is connected to the top of the corresponding set of detection chambers 30411; a set of guide blocks 30414 is arranged on the top of each set of lifting magnetic plates 30412; several sets of detection probes 30415 are damped and slidably connected to the top of each set of guide blocks 30414; each set of detection probes 30415 is electrically connected to a corresponding set of connecting contact pieces 30416.

[0053] During chip packaging and positioning, several groups of chips are placed within the second mounting frame 30401. Several sets of third electric push rods 30405 drive four sets of second positioning plates 30402 to calibrate and position the chips. Subsequently, when the chips rotate to a position directly below, the lead screw 30406 is rotated. Through the threaded connection between the lead screw 30406 and the transmission block 30407, adjacent transmission blocks 30407 can drive adjacent connecting magnetic pillars 30409 to move towards opposite sides, compressing the elastic sheet 30410. Because the elastic sheet 30410 is wavy, its width changes during compression. The large extension connecting groove 30408 ​​allows the corresponding contact pad to abut against the connection point of the chip. At the same time, when the two sets of connecting magnetic pillars 30409 move to the bottom of the detection cavity 30411, they magnetically push the lifting magnetic plate 30412 to drive several sets of detection probes 30415 to extend from the four sets of telescopic through slots 30403 and abut against the pins of the packaging substrate. This not only realizes the functional detection when the chip is pasted to the packaging substrate, but also the extension of the elastic sheet 30410 can reduce the size of the exit and prevent the chip from falling off during transfer. This improves the working stability of the positioning fixture and enhances the effectiveness of the positioning fixture in chip packaging.

[0054] By controlling the adjacent connecting magnetic pillars 30409 to move toward the opposite side, the elastic sheet 30410 is compressed. Since the elastic sheet 30410 is wavy, its width increases during compression, extending out of the connecting groove 30408, so that the corresponding contact can abut against the connection point of the chip. At the same time, when the two sets of connecting magnetic pillars 30409 move to the bottom of the detection cavity 30411, they magnetically push the lifting magnetic plate 30412 to drive several sets of detection probes 30415 to extend from the four sets of telescopic through slots 30403 and abut against the pins of the packaging substrate. This not only realizes the functional detection when the chip is pasted to the packaging substrate, but also reduces the size of the exit when the elastic sheet 30410 extends, preventing the chip from falling off during transfer. This improves the working stability of the positioning fixture and enhances the effectiveness of the positioning fixture in chip packaging.

[0055] Since heating is usually required when the chips are attached to the packaging substrate, when the corresponding sets of packaging substrates and chips rotate to face the cooling tank 703, cold air is introduced through the corresponding sets of air guide holes 705 to cool the packaging substrates and chips. This allows the packaging substrates and chips to be unloaded directly when they rotate to the bottom, avoiding the need for static cooling. At the same time, the guide plates 707 on both sides drive the guide rollers 708 to perform slow reciprocating motion, which can correct the position of the packaging substrates and chips, so that the unloading positions of the packaging substrates and chips are consistent, improving the unloading efficiency and quality of the positioning fixture.

[0056] By controlling the circulating motor 5 to drive the rotating shaft 301 to rotate, the rotating shaft 301 will drive the rotating column 401 to rotate, exposing the corresponding sets of substrate positioning slots 402 in the first working slot 9. Then, the corresponding sets of packaging substrates are placed in the corresponding substrate positioning slots 402 for calibration and positioning. When the corresponding sets of chips rotate to the underside of the rotating shaft 301, the corresponding sets of packaging substrates rotate to the topside of the rotating column 401. Since the corresponding sets of chips and packaging substrates are correctly aligned at this time, the corresponding telescopic suction cups 305 will stick the chips onto the packaging substrates, thereby realizing continuous chip packaging and positioning work and improving the working efficiency of the positioning fixture.

[0057] When it is necessary to disassemble the auxiliary feeding mechanism 7, several sets of first electric push rods 11 can be controlled to drive the air guide plate 12 to move toward the side away from the auxiliary feeding mechanism 7, so that several sets of limiting connecting pipes 13 are disengaged from the corresponding several sets of air guide holes 705. Then the first mounting frame 701 can be pulled out directly from the side of the mounting slot 6 for corresponding repair or maintenance work, which improves the maintenance efficiency of the positioning fixture while ensuring the cooling efficiency.

[0058] Based on the aforementioned chip packaging positioning fixture, this embodiment of the invention also proposes a method for using the chip packaging positioning fixture. For example, the method includes:

[0059] Several groups of chips are placed inside the chip positioning mechanism;

[0060] Several groups of packaging substrates are placed in the substrate positioning mechanism;

[0061] The control chip positioning mechanism drives the substrate positioning mechanism to rotate, thereby transferring the chip to the top of the packaging substrate.

[0062] By controlling two adjacent sets of connecting magnetic pillars to move towards the opposite side, the elastic sheet is compressed, so that several sets of connecting contacts are connected to the chip.

[0063] The two adjacent sets of connecting magnetic pillars move to the direct underside of the corresponding lifting magnetic plate, and the lifting magnetic plate is driven by magnetic force to extend several sets of detection probes and connect them to the packaging substrate.

[0064] The control chip positioning mechanism attaches the chip to the packaging substrate;

[0065] Complete the chip packaging and positioning work.

[0066] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip packaging positioning fixture, comprising a positioning base, characterized in that: A working groove is provided on one side wall of the positioning base; a chip positioning mechanism is provided in the working groove; and a substrate positioning mechanism for calibrating and positioning the packaging substrate is provided directly below the chip positioning mechanism. The chip positioning mechanism includes several sets of auxiliary positioning components; The auxiliary positioning component includes a second mounting frame for calibrating the positioning chip; a set of connecting slots are respectively opened on the four inner walls of the second mounting frame; each set of connecting slots is provided with two sets of connecting magnetic pillars; a set of elastic sheets is provided between the corresponding two sets of connecting magnetic pillars; the elastic sheets are wavy and have several sets of connecting contact pieces that can be connected to the chip at equal intervals on the side wall near the second positioning plate. The second mounting frame is provided with four sets of detection chambers; each set of detection chambers is slidably connected to a set of lifting magnetic plates in the vertical direction; each set of lifting magnetic plates is provided with a set of guide blocks at the top; each set of guide blocks is provided with several sets of detection probes connected to the packaging substrate at the top; each set of detection probes is electrically connected to a corresponding set of connecting contacts. Each set of lifting magnetic plates has several sets of reset springs symmetrically arranged on its top; the top of each set of reset springs is connected to the top of the corresponding set of detection chambers. Adjacent connecting magnetic pillars move toward the opposite side, causing the elastic sheet to be compressed. Since the elastic sheet is wavy, its width increases during compression and it extends out of the connecting groove, so that the corresponding contact can abut against the connection point of the chip. At the same time, when the two sets of connecting magnetic pillars move to the bottom of the detection cavity, they drive the lifting magnetic plate through magnetism to drive several sets of detection probes to extend out from the four sets of telescopic slots and abut against the pins of the packaging substrate. The chip positioning mechanism also includes a rotating shaft; several sets of mounting blocks are arranged in a circular array on the outer wall of the rotating shaft; several sets of chip positioning slots are equally spaced on the side wall of each set of mounting blocks away from the rotating shaft; each set of auxiliary positioning components is installed in a corresponding set of chip positioning slots; and each set of chip positioning slots is provided with a set of telescopic suction cups.

2. The chip packaging positioning fixture according to claim 1, characterized in that: The top of the working slot is an open structure; the chip positioning mechanism and the substrate positioning mechanism are connected by transmission; a circulating motor is provided on one side wall of the positioning base; the output end of the circulating motor is connected by transmission to the chip positioning mechanism; an installation through slot is provided on one side wall of the positioning base; an auxiliary feeding mechanism is movably inserted through the installation through slot; two sets of limiting magnets are symmetrically provided on the top two sides of the installation through slot.

3. The chip packaging positioning fixture according to claim 2, characterized in that: A first working groove is formed on one side wall of the positioning base; an air guide cavity is formed on one side inner wall of the mounting through groove; a plurality of first electric push rods are provided on the inner wall of the air guide cavity away from the auxiliary feeding mechanism; an air guide plate is drivenly connected to the output end of the plurality of first electric push rods; a plurality of limiting connecting pipes are provided at equal intervals on the inner wall of the air guide plate near the auxiliary feeding mechanism; the end of each limiting connecting pipe away from the air guide plate is movably inserted into the auxiliary feeding mechanism; a cooler is provided on the inner wall of the air guide cavity away from the auxiliary feeding mechanism.

4. The chip packaging positioning fixture according to claim 1, characterized in that: The substrate positioning mechanism includes a rotating column; several sets of substrate positioning slots are arranged in a circular array on the outer wall of the rotating column; each set of substrate positioning slots has a first positioning plate on its four inner walls that can calibrate and position the packaged substrate; each set of substrate positioning slots has a set of adsorption holes on the inner wall of the side closest to the axis of the rotating column; the rotating column has an adsorption cavity; the adsorption cavity is connected to several sets of adsorption holes; and a closed magnetic plate is provided in the adsorption cavity.

5. A chip packaging positioning fixture according to claim 3, characterized in that: The auxiliary feeding mechanism includes a first mounting frame; the first mounting frame is U-shaped; a conveyor belt is provided on the bottom inner wall of the first mounting frame; cooling grooves and second working grooves are respectively opened on the two inner walls of the first mounting frame; the second working groove is connected to the first working groove.

6. A chip packaging positioning fixture according to claim 5, characterized in that: The cooling tank has several sets of air guide holes at equal intervals on the side wall away from the second working tank; each set of limiting connecting pipes moves through the corresponding set of air guide holes; several sets of second electric push rods are symmetrically arranged on the inner walls of both sides of the first mounting frame; a set of guide plates are driven to the output end of several sets of second electric push rods on the same side; several sets of guide rollers are equally spaced on the side walls opposite to the two sets of guide plates.

7. A chip packaging positioning fixture according to claim 1, characterized in that: The second mounting frame is U-shaped; a set of second positioning plates are respectively provided on the four inner walls of the bottom of the second mounting frame; a set of telescopic grooves are respectively provided on the four edges of the top of the second mounting frame; each set of detection chambers is connected to the corresponding set of telescopic grooves.

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