A chip burn-in test system

By designing support and drive components to rotate the chip, the problem of temperature difference inside the chip aging test furnace was solved, thus achieving accuracy and stability in chip aging testing.

CN122109785APending Publication Date: 2026-05-29SHENZHEN JIUZHANG SEMICON CO LTD
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Patent Information

Application Number
CN202610298866.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-12
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Temperature differences caused by different chip positions within the existing chip aging test furnace affect the accuracy of the test results.

Method used

A chip aging test system was designed, including a support component and a drive component. The chip is rotated by a storage mechanism on the support component and the drive component to avoid temperature differences. A connection mechanism is used to ensure the stability of the storage mechanism. A servo motor and belt drive system are used to achieve uniform heating of the chip.

Benefits of technology

It improves the accuracy and stability of chip aging tests, ensures temperature uniformity of chips during high-temperature aging, and reduces test errors caused by temperature differences.

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Abstract

The application relates to the technical field of intelligent sensor chip testing, in particular to a chip aging test system, which comprises a furnace body for providing a sealed test environment for intelligent sensor chip aging test, a supporting assembly is rotatably installed on the inner wall of the bottom of the furnace body, a storage mechanism for carrying the intelligent sensor chip to be tested is arranged on the outer wall of the top of the supporting assembly, a connecting mechanism in contact with the storage mechanism is installed on the outer wall of the top of the furnace body, a driving assembly for driving the supporting assembly is installed on the bottom of the furnace body, and a furnace door is hinged to one side of the outer wall of the furnace body. The supporting assembly is arranged in the furnace body, the storage mechanism on the supporting assembly is convenient for placing the chip, the driving assembly is arranged to drive the storage mechanism to rotate in cooperation with the supporting assembly, so that the chip can be driven to rotate in the aging process, thereby avoiding a large temperature difference of the chip in the furnace body, and the accuracy of the chip test result is improved.
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Description

Technical Field

[0001] This invention relates to the field of intelligent sensor chip testing technology, specifically a chip aging test system. Background Technology

[0002] Integrated circuits, abbreviated as IC, are also known as microcircuits, microchips, or wafers / chips. In electronics, they are a method of miniaturizing circuits (mainly including semiconductor devices, but also passive components), often fabricated on the surface of semiconductor wafers. Chip aging refers to the phenomenon where semiconductor devices gradually degrade in performance, decrease in reliability, or even fail during long-term operation due to various physical, chemical, or electrical effects. This process does not occur instantaneously but accumulates slowly over time and with use, mainly manifested as slower chip operating speed, increased power consumption, and reduced stability. Chip aging is not caused by a single reason but is the result of multiple complex physical mechanisms, mainly including: metal migration, charge leakage and trapping, hot carrier injection, bias temperature instability, and temperature cycling fatigue.

[0003] During chip manufacturing, aging tests are required. Currently available chip aging test furnaces are prone to uneven temperature distribution during high-temperature aging tests. This is primarily because the chips are placed statically within the furnace, resulting in chips closer to the heat source reaching higher temperatures and those further away remaining cooler. This leads to significant temperature differences across different locations within a batch of chips in the aging furnace, directly impacting the test results. Therefore, a chip aging test system is proposed to solve the problems mentioned above. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a chip aging test system that can solve the problem of temperature differences caused by different chip positions within the chip testing aging furnace.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a chip aging test system, comprising a furnace body providing a sealed test environment for aging tests of smart sensor chips, a support assembly rotatably mounted on the bottom inner wall of the furnace body, and a storage mechanism for supporting the smart sensor chip to be tested being provided on the top outer wall of the support assembly, a connection mechanism in contact with the storage mechanism being installed on the top outer wall of the furnace body, a drive assembly for driving the support assembly being installed on the bottom of the furnace body, a furnace door hinged to one side outer wall of the furnace body, and a control panel fixedly connected to one side outer wall of the furnace door, an observation port being opened on one side outer wall of the furnace door, and an observation window being fixedly connected to the inner wall of the observation port, and four universal wheels with brakes rotatably connected to the bottom outer wall of the furnace body.

[0006] Preferably, the support assembly includes a support base rotatably connected to the inner wall of the bottom of the furnace body, and a plurality of U-shaped seats are fixedly connected to the outer wall of the bottom of the support base. Each of the U-shaped seats is rotatably connected to a roller. A circular groove is opened on the outer wall of the top of the support base, and a prism is fixedly connected to the center of the inner wall of the bottom of the circular groove.

[0007] Preferably, the drive assembly includes a servo motor fixedly connected to the furnace body, and a pulley is fixedly connected to the output shaft of the servo motor. One end of the support base drive shaft is fixedly connected to the pulley, and the pulley and the pulley are connected by the same belt.

[0008] Preferably, the storage mechanism includes a base that is snapped onto the inner wall of the circular groove, and a mounting column is fixedly connected to the center of the outer wall of the top of the base. Multiple storage components are rotatably mounted on the outer wall of the mounting column. A top plate is rotatably connected to the outer wall of the top of the mounting column, and multiple connecting frames are fixedly connected to the outer wall of the bottom of the top plate. A first prism groove is formed on the outer wall of the top of the mounting column, and a second prism groove is formed on the outer wall of the bottom of the base. The first prism groove is inserted into the inner wall of the second prism groove.

[0009] Preferably, the storage assembly includes a placement frame rotatably connected to the mounting column, and the placement frame is a ring mechanism, with multiple equally spaced circularly distributed sensor chip holders fixedly connected to the top outer wall of the placement frame.

[0010] Preferably, the top outer wall of the sensor chip holder has a rectangular groove for placing the smart sensor chip, and the bottom inner wall of the rectangular groove has multiple through holes distributed at equal intervals. The bottom outer wall of the placement frame is fixedly connected to multiple support frames, and the bottom outer wall of the support frames is rotatably connected to rollers. The top outer wall of the placement frame at the top of the mounting column has an annular groove, and the connecting frame is slidably connected to the inner wall of the annular groove.

[0011] Preferably, the inner wall of the top of the furnace body has a circular opening, and a drive column is slidably connected to the inner wall of the circular opening. A groove is formed on the outer wall of the bottom of the drive column, and a sliding column is slidably connected to the inner wall of the groove.

[0012] Preferably, a second prism is rotatably connected to the bottom outer wall of the sliding column, and the specifications of the second prism match the specifications of the first groove. Multiple springs are fixedly connected between the sliding column and the top inner wall of the groove.

[0013] Preferably, the connecting mechanism includes a connecting box fixedly connected to the furnace body, and two symmetrically arranged lead screws are rotatably connected to the inner walls of both sides of the connecting box. The outer walls of the two lead screws are screwed with the same drive seat, and the drive seat is fixedly connected to the drive column.

[0014] Preferably, one end of each of the two lead screws is fixedly connected to a synchronous pulley, and the two synchronous pulleys are connected by the same synchronous belt. A second servo motor is fixedly connected to the top outer wall of the connecting box, and the output shaft of the second servo motor is fixedly connected to one of the synchronous pulleys.

[0015] Compared with the prior art, the present invention provides a chip aging test system, which has the following advantages: 1. This invention provides a support component in the furnace body. The storage mechanism on the support component facilitates the placement of chips. The drive component works in conjunction with the support component to drive the storage mechanism to rotate, thus facilitating the rotation of the chips. The chips rotate during the aging process, thereby avoiding large temperature differences in the chips within the furnace body and improving the accuracy of chip test results.

[0016] 2. The present invention facilitates chip placement by setting up a storage component on the mounting column. The separately set sensor chip holder on the storage component facilitates the placement of test chips. The separately set sensor chip holder avoids friction during chip testing. The cooperation between the support frame and the roller on the placement rack facilitates auxiliary support for the placement rack, thereby ensuring the stability of chip testing.

[0017] 3. The present invention provides multiple storage components in the storage mechanism, and each storage component can rotate independently, which facilitates the retrieval of chips. Furthermore, a connecting mechanism is provided on the top of the furnace body. The connecting mechanism, together with the second prism, facilitates pressing the storage mechanism onto the support component, thereby further improving the stability of the storage mechanism.

[0018] 4. The present invention provides a lead screw and a drive seat in the connecting box, which facilitates the lifting and lowering of the second prism by the drive column. When the chip is taken out, the drive seat drives the second prism to rise, moving it away from the storage mechanism, thus making it easy to take out the storage mechanism as a whole. A spring is provided between the drive column and the second prism to ensure that the second prism is always inserted into the first prism slot. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the storage mechanism structure of the present invention; Figure 3 This is a schematic diagram of the servo motor and belt structure of the present invention; Figure 4 This is a schematic diagram of the storage component structure of the present invention; Figure 5 This is a schematic diagram of the U-shaped seat and roller structure of the present invention; Figure 6 This is a schematic diagram of the support structure of the present invention; Figure 7 This is a schematic diagram of the base and top plate structure of the present invention; Figure 8 This is a schematic diagram of the placement rack structure of the present invention; Figure 9 This is a schematic diagram of the connection mechanism structure of the present invention; Figure 10 This is a schematic diagram of the connecting box structure of the present invention; Figure 11 This is a schematic cross-sectional view of the drive column structure of the present invention.

[0020] In the diagram: 1. Furnace body; 2. Furnace door; 3. Control panel; 4. Observation window; 5. Connecting mechanism; 6. Support assembly; 7. Storage mechanism; 8. Servo motor one; 9. Belt; 10. Caster wheel; 11. Support base; 12. Base; 13. Top plate; 14. Mounting column; 15. Rib groove one; 16. Storage assembly; 17. Connecting frame; 18. Roller one; 19. Pulley one; 20. U-shaped seat; 21. Circular groove; 22. Prism one; 23. Rib groove two; 24. Placement rack; 25. Sensor chip holder; 26. Rectangular groove; 27. Through hole; 28. Support frame; 29. ​​Roller two; 30. Annular groove; 31. Connecting box; 32. Servo motor two; 33. Drive column; 34. Prism two; 35. Lead screw; 36. Drive base; 37. Synchronous belt; 38. Spring; 39. Sliding column. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Example: Please see Figure 1 - Figure 11 This embodiment of a chip aging test system includes a furnace body 1 that provides a sealed test environment for aging tests of smart sensor chips. A support component 6 is rotatably installed on the bottom inner wall of the furnace body 1, and a storage mechanism 7 for holding the smart sensor chip to be tested is provided on the top outer wall of the support component 6. A connection mechanism 5 that contacts the storage mechanism 7 is installed on the top outer wall of the furnace body 1. A drive component for driving the support component 6 is installed at the bottom of the furnace body 1. A furnace door 2 is hinged to one side outer wall of the furnace body 1, and a control panel 3 is fixedly connected to one side outer wall of the furnace door 2. An observation port is opened on one side outer wall of the furnace door 2, and an observation window 4 is fixedly connected to the inner wall of the observation port. Four universal wheels 10 with brakes are rotatably connected to the bottom outer wall of the furnace body 1.

[0023] By adopting the above structure, the storage mechanism 7 is easily placed by the support component 6 on the furnace body 1. The connecting mechanism 5 on the furnace body 1 can press the storage mechanism 7 tightly onto the support component 6, thus ensuring the stability of the storage mechanism 7. The drive component, in conjunction with the support component 6, drives the storage mechanism 7 to rotate, thereby ensuring uniform heating during the high-temperature aging test of the chip. The control panel 3 facilitates the control of the electrical components in the aging test equipment. The casters 10 facilitate the movement of the aging test equipment. The braked structure ensures the stability of the aging test equipment.

[0024] Please see Figure 4 - Figure 6 The support assembly 6 includes a support base 11 rotatably connected to the inner wall of the bottom of the furnace body 1, and a plurality of U-shaped seats 20 distributed at equal intervals are fixedly connected to the outer wall of the bottom of the support base 11. Rollers 18 are rotatably connected to the outer walls of the plurality of U-shaped seats 20. A circular groove 21 is opened on the outer wall of the top of the support base 11, and a prism 22 is fixedly connected to the center of the inner wall of the bottom of the circular groove 21. The drive assembly includes a servo motor 8 fixedly connected to the furnace body 1, and a pulley 2 is fixedly connected to the output shaft of the servo motor 8. A pulley 19 is fixedly connected to one end of the drive shaft of the support base 11, and the same belt 9 is connected between the pulley 19 and the pulley 2.

[0025] By adopting the above structure, when the aging furnace is conducting aging tests, when the servo motor 8 starts, it works with the belt 9 to drive the support base 11 to rotate. The support base 11 drives the storage mechanism 7 to rotate through the prism 22, thereby avoiding the chips from being in the same position for a long time, which would cause temperature differences between chips in different positions. The U-shaped seat 20 works with the roller 18 to support the support base 11, ensuring the stability of the chips in the storage mechanism 7.

[0026] Please see Figure 7 - Figure 8The storage mechanism 7 includes a base 12 that is snapped onto the inner wall of the circular groove 21. A mounting post 14 is fixedly connected to the center of the outer top wall of the base 12. Multiple storage components 16 are rotatably mounted on the outer wall of the mounting post 14. A top plate 13 is rotatably connected to the outer top wall of the mounting post 14. Multiple connecting brackets 17 are fixedly connected to the outer bottom wall of the top plate 13. A first prism 15 is formed on the outer top wall of the mounting post 14, and a second prism 23 is formed on the outer bottom wall of the base 12. The first prism 22 is inserted into the inner wall of the second prism 23. The storage components 16 include a holder rotatably connected to the mounting post 14. The placement frame 24 is a ring-shaped mechanism. Multiple equally spaced circularly distributed sensor chip holders 25 are fixedly connected to the top outer wall of the placement frame 24. The top outer wall of the sensor chip holder 25 has a rectangular groove 26 for placing smart sensor chips, and the bottom inner wall of the rectangular groove 26 has multiple equally spaced through holes 27. Multiple support frames 28 are fixedly connected to the bottom outer wall of the placement frame 24, and rollers 29 are rotatably connected to the bottom outer wall of the support frame 28. The top outer wall of the placement frame 24 at the top of the mounting column 14 has an annular groove 30, and the connecting frame 17 is slidably connected to the inner wall of the annular groove 30.

[0027] By adopting the above structure, the second prism 23 on the base 12 can be easily connected to the first prism 22, thus facilitating the rotation of the mounting column 14 via the first prism 22. When the mounting column 14 rotates, it drives the storage component 16 to rotate, which in turn drives the chip to rotate. The rectangular slot 26 in the sensor chip holder 25 in the storage component 16 facilitates the placement of the chip, thus avoiding friction between the chips during the rotation of the mounting column 14. The roller 29 on the placement frame 24 provides auxiliary support for the placement frame 24. The cooperation between the annular groove 30 and the connecting frame 17 facilitates the connection between the top plate 13 and the highest storage component 16, further ensuring the stability of the storage component 16.

[0028] Please see Figure 9 - Figure 11The furnace body 1 has a circular opening on the inner wall of the top, and a drive column 33 is slidably connected to the inner wall of the circular opening. The bottom outer wall of the drive column 33 has a groove, and a sliding column 39 is slidably connected to the inner wall of the groove. A second prism 34 is rotatably connected to the bottom outer wall of the sliding column 39, and the specifications of the second prism 34 match the specifications of the first groove 15. Multiple springs 38 are fixedly connected between the sliding column 39 and the top inner wall of the groove. The connecting mechanism 5 includes a connecting box 31 fixedly connected to the furnace body 1, and two symmetrically arranged lead screws 35 are rotatably connected to the inner walls of both sides of the connecting box 31. The outer walls of the two lead screws 35 are screwed with the same drive seat 36, and the drive seat 36 is fixedly connected to the drive column 33. One end of each of the two lead screws 35 is fixedly connected to a synchronous pulley, and the two synchronous pulleys are connected to the same synchronous belt 37. A second servo motor 32 is fixedly connected to the top outer wall of the connecting box 31, and the output shaft of the second servo motor 32 is fixedly connected to one of the synchronous pulleys.

[0029] By adopting the above structure, when the chip to be tested is placed into the sensor chip holder 25, the entire storage mechanism 7 is placed into the furnace body 1. When prism 1 22 is inserted into prism slot 2 23, servo motor 2 32 is started to drive one of the lead screws 35 to rotate. When the lead screw 35 rotates, it works with the synchronous belt 37 and the synchronous pulley to drive the two lead screws 35 to rotate synchronously, thereby driving the drive seat 36 to move down in the connecting box 31. When the drive seat 36 moves down, it drives prism 2 34 to be inserted into prism slot 1 15 through the drive column 33. Therefore, the storage mechanism 7 is pressed tightly on the support component 6, ensuring the stability of the storage mechanism 7. The spring 38 drives the sliding column 39 to extend, thereby driving prism 2 34 to always be pressed tightly in prism slot 1 15.

[0030] Working principle: The entire testing system is moved to the designated testing position by the universal casters 10 with brakes at the bottom of the furnace body 1. After locking the brakes to ensure equipment stability, the furnace door 2, which is hinged to one side of the furnace body 1, is opened, and the situation inside the furnace can be observed in advance through the observation window 4 on the furnace door 2. The storage mechanism 7 is taken out, and its base 12 can be separated from the support seat 11 of the support component 6 for easy chip loading.

[0031] Multiple storage components 16 are rotatably mounted on the outer wall of the mounting column 14 of the storage mechanism 7. Each storage component 16 has multiple equidistantly distributed circular sensor chip holders 25 on its annular placement rack 24. The chips to be tested are placed one by one into the rectangular slots 26 of the sensor chip holders 25. The through holes 27 at the bottom of the rectangular slots 26 ensure smooth heat flow and prevent local heat accumulation on the chips. The support frame 28 at the bottom of the placement rack 24 and the rotatably connected rollers 29 can help support the placement rack 24 and ensure structural stability after the chips are loaded. The top plate 13 at the top of the mounting column 14 is slidably connected to the annular slot 30 of the uppermost placement rack 24 through the connecting frame 17, further reinforcing the storage components 16 and preventing them from shaking.

[0032] Place the chip-loaded storage mechanism 7 back into the furnace body 1, so that the base 12 is engaged with the inner wall of the circular groove 21 at the top of the support base 11, while ensuring that the first prism 22 at the bottom of the circular groove 21 of the support base 11 is accurately inserted into the second prism 23 at the bottom of the base 12, thus achieving the initial positioning of the storage mechanism 7.

[0033] The servo motor 32 in the connection mechanism 5 is activated, and its output shaft drives a synchronous pulley in the connection box 31 to rotate. Through the synchronous belt 37, the two symmetrically arranged lead screws 35 rotate synchronously. The drive seat 36 screwed to the outer wall of the lead screw 35 drives the drive column 33 to slide downward along the circular opening at the top of the furnace body 1. The sliding column 39 in the groove at the bottom of the drive column 33 extends under the elastic force of the spring 38, pushing the prism 34, which is rotatably connected at the bottom, into the prism slot 15 at the top of the mounting column 14. The elastic pressure of the spring 38 keeps the prism 34 pressed tightly in the prism slot 15, firmly fixing the storage mechanism 7 to the support assembly 6 and preventing displacement due to rotation during the test.

[0034] Using the control panel 3 on the furnace door 2, key parameters such as temperature and time for the chip aging test are set, and the heating system inside the furnace body 1 is started to heat up. The drive assembly at the bottom of the furnace body 1 is activated, and the output shaft of the servo motor 8 drives the pulley 2 to rotate. This rotation is transmitted via belt 9 to pulley 19 at one end of the drive shaft of the support base 11, thereby driving the support base 11 to rotate along the inner wall of the bottom of the furnace body 1. The multiple U-shaped seats 20 at the bottom of the support base 11 and the rollers 18 rotatably connected to the outer wall reduce the friction during the rotation of the support base 11, ensuring smooth rotation.

[0035] The support base 11 drives the storage mechanism 7 to rotate synchronously via prism 22, and the mounting column 14 drives the multiple storage components 16 and the chips in the sensor chip holder 25 to rotate together. The chips rotate continuously during the aging process, avoiding the problem of chips near the heat source having a higher temperature and chips far from the heat source having a lower temperature, which is common in traditional static placement methods. This ensures that all chips in the furnace body 1 are heated evenly, fundamentally solving the problem of test result deviation caused by temperature difference.

[0036] During testing, staff can observe the aging status of the chips in real time through the observation window 4 on the furnace door 2, and monitor and adjust the test parameters through the control panel 3. After the test is completed, the heating system and servo motor 8 are turned off through the control panel 3. After the temperature of the furnace body 1 drops to a safe range, the servo motor 32 is started to reverse, and the drive column 33 drives the prism 34 to rise, disengage from the prism slot 15, and release the top fixation of the storage mechanism 7. The furnace door 2 is then opened, and the storage mechanism 7 is removed from the support assembly 6. Since the storage assembly 16 can rotate independently around the mounting column 14, staff can rotate the placement rack 24 to easily remove the tested chips from the rectangular slot 26 of the sensor chip holder 25, completing the entire aging test process.

[0037] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip aging test system, comprising an oven (1) providing a sealed test environment for aging tests of smart sensor chips, characterized in that: The bottom inner wall of the furnace body (1) is rotatably equipped with a support assembly (6), and the top outer wall of the support assembly (6) is provided with a storage mechanism (7) for carrying the smart sensor chip to be tested. The top outer wall of the furnace body (1) is equipped with a connection mechanism (5) that contacts the storage mechanism (7). The bottom of the furnace body (1) is equipped with a drive assembly for driving the support assembly (6). The furnace body (1) is hinged to one side outer wall with a furnace door (2), and the furnace door (2) is fixedly connected to one side outer wall with a control panel (3). The furnace door (2) is provided with an observation port on one side outer wall, and the inner wall of the observation port is fixedly connected with an observation window (4). The bottom outer wall of the furnace body (1) is rotatably connected with four universal wheels (10) with brakes.

2. The chip aging test system according to claim 1, characterized in that: The support assembly (6) includes a support seat (11) rotatably connected to the inner wall of the bottom of the furnace body (1), and a plurality of U-shaped seats (20) are fixedly connected to the outer wall of the bottom of the support seat (11). Rollers (18) are rotatably connected to the outer walls of the plurality of U-shaped seats (20). A circular groove (21) is opened on the outer wall of the top of the support seat (11), and a prism (22) is fixedly connected to the center of the inner wall of the bottom of the circular groove (21).

3. The chip aging test system according to claim 2, characterized in that: The drive assembly includes a servo motor (8) fixedly connected to the furnace body (1), and a pulley (2) fixedly connected to the output shaft of the servo motor (8). A pulley (19) is fixedly connected to one end of the drive shaft of the support base (11), and the same belt (9) connects the pulley (19) and the pulley (2).

4. The chip aging test system according to claim 2, characterized in that: The storage mechanism (7) includes a base (12) that is snapped onto the inner wall of the circular groove (21), and a mounting column (14) is fixedly connected to the center of the outer wall of the top of the base (12). Multiple storage components (16) are rotatably mounted on the outer wall of the mounting column (14). A top plate (13) is rotatably connected to the outer wall of the top of the mounting column (14), and multiple connecting frames (17) are fixedly connected to the outer wall of the bottom of the top plate (13). A first prism (15) is opened on the outer wall of the top of the mounting column (14), and a second prism (23) is opened on the outer wall of the bottom of the base (12). The first prism (22) is inserted into the inner wall of the second prism (23).

5. The chip aging test system according to claim 4, characterized in that: The storage component (16) includes a placement frame (24) rotatably connected to the mounting column (14), and the placement frame (24) is a ring mechanism. Multiple equally spaced circularly distributed sensor chip holders (25) are fixedly connected to the top outer wall of the placement frame (24).

6. The chip aging test system according to claim 5, characterized in that: The top outer wall of the sensor chip holder (25) is provided with a rectangular groove (26) for placing the smart sensor chip, and the bottom inner wall of the rectangular groove (26) is provided with multiple through holes (27) distributed at equal intervals. The bottom outer wall of the placement frame (24) is fixedly connected with multiple support frames (28), and the bottom outer wall of the support frame (28) is rotatably connected with rollers (29). The top outer wall of the placement frame (24) at the top of the mounting column (14) is provided with an annular groove (30), and the connecting frame (17) is slidably connected to the inner wall of the annular groove (30).

7. The chip aging test system according to claim 4, characterized in that: The furnace body (1) has a circular opening on the inner wall at the top, and a drive column (33) is slidably connected to the inner wall of the circular opening. The drive column (33) has a groove on the outer wall at the bottom, and a sliding column (39) is slidably connected to the inner wall of the groove.

8. The chip aging test system according to claim 7, characterized in that: The bottom outer wall of the sliding column (39) is rotatably connected to a second prism (34), and the specifications of the second prism (34) match those of the first groove (15). Multiple springs (38) are fixedly connected between the sliding column (39) and the inner wall of the top of the groove.

9. The chip aging test system according to claim 7, characterized in that: The connecting mechanism (5) includes a connecting box (31) fixedly connected to the furnace body (1), and two symmetrically arranged lead screws (35) are rotatably connected to the inner walls of both sides of the connecting box (31). The outer walls of the two lead screws (35) are screwed with the same drive seat (36), and the drive seat (36) is fixedly connected to the drive column (33).

10. A chip aging test system according to claim 9, characterized in that: One end of each of the two lead screws (35) is fixedly connected to a synchronous pulley, and the two synchronous pulleys are connected by the same synchronous belt (37). The top outer wall of the connecting box (31) is fixedly connected to a servo motor (32), and the output shaft of the servo motor (32) is fixedly connected to one of the synchronous pulleys.