Wafer cleaning method and device
The wafer cleaning device with a bidirectional temperature control system solves the temperature control lag problem in traditional cleaning equipment, achieves improved wafer cleaning effect and process stability, especially efficient cleaning in removing nano-scale particles.
Patent Information
- Application Number
- CN202510672784.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2025-10-17
AI Technical Summary
Existing wafer cleaning equipment has a lag in temperature control, resulting in uneven cleaning results and difficulty in achieving temperature matching in different cleaning stages, affecting cleaning quality and process stability, especially inefficiency in removing nano-scale particles.
A two-way independent temperature control system is adopted. The first temperature control mechanism controls the wafer temperature, and the second temperature control mechanism controls the cleaning liquid temperature. A controllable temperature gradient is constructed to achieve a dynamic temperature difference between the wafer and the cleaning liquid, synergistically activating chemical reactions and physical flushing effects.
The reaction kinetics process is accelerated in the chemical etching stage, and the thermal stress stripping force is enhanced in the physical cleaning stage, achieving a dual improvement in chemical and physical cleaning effects, reducing particle residue and improving process stability.
Smart Images
Figure CN120809603A_ABST