Semiconductor panel-level packaging press and control method

Abstract

The invention relates to the related technical field of semiconductor packaging, discloses a semiconductor panel-level packaging press and a control method, and aims to solve the problems that the bearing capacity of a single screw rod is limited and the die assembly pressure is abnormally too large. The four lifting lead screw assemblies synchronously provide power for the lower die base, it is guaranteed that the upper portion of the lower die base is evenly stressed, meanwhile, the die assembly pressure is enhanced, meanwhile, the die assembly pressure is detected through elastic pressure of a pressure measuring spring, when the die assembly pressure is abnormally too high, an ascending switch pressing plate touches a stop switch, and the stop switch is switched on and switched off. And the whole machine stops working by using the stop switch, so that the problem of mold damage caused by overlarge mold closing pressure is avoided, and finally the effects of multi-point pressure application and overpressure mechanical protection are realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a semiconductor panel-level packaging press and a control method. BACKGROUND

[0002] The semiconductor packaging press is a key device in the semiconductor packaging process, mainly used for pressing between chips and substrates, chip molding, and hot pressing molding. Its core function is to realize high-quality combination of chips and packaging materials by accurately controlling the pressure, so as to ensure the reliability, electrical performance and heat dissipation performance of packaging.

[0003] After searching, the publication number CN119092442A proposes a new press unit for chip substrate packaging and its control method, which includes a mold closing link assembly on the press unit, including a first link, a second link and a third link. One end of the first link is hinged to the lower die, one end of the second link is hinged to the base, the other end of the first link and the other end of the second link are hinged, one end of the third link is hinged to the mold closing nut, and the other end of the third link is hinged to the first link. In this embodiment, the first link, the second link and the third link are symmetrically arranged about the mold closing screw rod. In the initial state, the hinge points of the first link and the second link are arranged close to the mold closing screw rod side, and when the lower die rises, the hinge points of the first link and the second link start to slowly move away from the mold closing screw rod.

[0004] From the above content, it can be deeply analyzed that in the current semiconductor chip molding process, the coordinated movement of a single ball screw and a crank pin mechanism is mainly relied on to gradually move the lower die seat close to the upper die seat, thereby completing the packaging process of the chip. However, in the actual working process, this design exposes some significant problems.

[0005] When the mold closing pressure reaches a certain degree, it is difficult to rely on a single ball screw to provide the mold closing force. Since the carrying capacity of a single screw is limited, it is often difficult to maintain stable output in a high-pressure environment, which may lead to insufficient mold closing force, thereby affecting the quality and efficiency of packaging. More importantly, this design also has the risk of uneven stress. When a single screw cooperates with a crank pin mechanism to move up and down, due to the asymmetry of the structure and the difference in mechanical properties, it is easy to make the mold receive uneven force during mold closing, which not only accelerates the wear of the mold, but also may cause potential damage to the chip.

[0006] In addition, the current pressure detection mechanism mainly relies on sensors to monitor the clamping force in real time. However, this detection method has obvious limitations. Once the sensor fails or is disturbed by external factors, the detection data may be distorted, and the clamping force may be out of control. In extreme cases, the clamping force may be too large, far exceeding the bearing capacity of the mold and the chip, which not only causes serious damage to the mold, but also may cause devastating damage to the chip, and even may cause the failure of the entire packaging process. SUMMARY

[0007] The present application provides a semiconductor panel-level packaging press and control method, which has the advantages of multi-point pressure application and overpressure mechanical protection, to solve the problems of limited bearing capacity of a single lead screw and abnormally large clamping pressure in the background art.

[0008] To achieve the above-mentioned purpose, the present application adopts the following technical solution: a semiconductor panel-level packaging press, comprising: a base, the surface of which is provided with an upper die holder and a lower die holder through guide pull rods; a reducer box, the input end of which is connected with a clamping motor, and the output end of which is connected with a lifting lead screw assembly which is movably connected with the lower die holder; the clamping motor drives the lifting lead screw assembly to lift the lower die holder through the reducer box to realize the clamping action; a pressure measuring spring, the bottom end of which is installed on the guide pull rod, and the top end of which abuts against a pressure sensor, the pressure sensor being used to detect the clamping pressure; the pressure sensor judges whether the pressure measuring spring can be normally used by detecting the pressure change before and after the use of the pressure measuring spring.

[0009] Further, it further comprises: a stop switch fixed at the bottom of the base; a switch pressure plate fixed on the guide pull rod, the switch pressure plate realizing the stop working of the whole machine after contacting the stop switch.

[0010] Further, it further comprises: a limiting ring groove opened on the side of the guide pull rod and located above the switch pressure plate; a detection rod installed on the upper die holder and abutting against the limiting ring groove under the elastic force of a detection spring; an adjusting arm fastened on the detection rod through bolts, the bottom of which is threadedly connected with an adjusting screw; a wedge-shaped seat installed on the lower die holder and located below the adjusting arm; when the lower die holder approaches the upper die holder, the wedge-shaped seat pushes the adjusting screw to realize the disengagement of the detection rod from the limiting ring groove.

[0011] Further, the detection rod is composed of a cylindrical rod and an elliptical rod coaxially connected by threads.

[0012] Further, the side of the wedge-shaped seat is in the shape of a right triangle.

[0013] Further, a limiting base is fixedly installed on the guide pull rod, and a supporting spring is arranged between the limiting base and the base.

[0014] Further, the number of switch pressure plates is two, and the two switch pressure plates are located above and below the stop switch, respectively.

[0015] Further, an adjusting spring is arranged between the adjusting arm and the end of the detection rod.

[0016] A control method of a semiconductor panel-level packaging press, comprising the following steps:

[0017] S1, placing a chip to be packaged into an upper mold of an upper mold base, and injecting packaging resin into a lower mold of a lower mold base.

[0018] S2, starting a mold closing motor to push the lower mold base upward through relevant components; when the mold is normally closed, the wedge-shaped seat pushes the adjusting screw rod to make the detection rod disengage from the limiting ring groove.

[0019] During mold closing, the upper mold base and the lower mold base move upward, after the upper mold base contacts the top of the guide pull rod, the upward driving force of the guide pull rod compresses the pressure measuring spring, the pressure sensor detects the mold closing strength, and the mold closing motor stops working when the required pressure is reached.

[0020] S3, if the pressure sensor is abnormal, the lower mold base continues to push the upper mold base upward, the guide pull rod drives the switch pressing plate to make the stop switch turn on, and the whole machine stops working to prevent the mold closing pressure from being too large.

[0021] S4, if the mold is not normally closed, the mold closing height is abnormal, the detection rod does not disengage from the limiting ring groove; when the lower mold base further moves upward, the guide pull rod directly moves upward, the switch pressing plate contacts the stop switch, and the whole machine stops working to avoid damage to the mold.

[0022] S5, after packaging is completed, the mold closing motor makes the lower mold base move downward, the upper mold base moves downward to the limit position under gravity, and the limiting base is pressed on the supporting spring.

[0023] The upper mold base drives the detection rod to move downward to the limiting ring groove, the detection rod is inserted into the limiting ring groove, and the device returns to the normal position.

[0024] If the detection rod does not normally insert into the limiting ring groove, the lower mold base moves downward to compress the supporting spring, the guide pull rod further moves downward, the switch pressing plate contacts the stop switch, so as to detect whether the device is normally reset, and ensure that the equipment can be used for the next packaging.

[0025] A control method of a semiconductor panel-level packaging press further comprises a control method of the length of the adjusting screw rod, and the steps are as follows:

[0026] S1, the fastening of the top bolt of the adjusting arm is released, the adjusting arm is attached to the upper mold base under the elastic force of the adjusting spring; at the same time, the detection rod compresses the detection spring and disengages from the limiting ring groove under the pushing of the adjusting spring.

[0027] S2, the mold clamping motor is started, the lower die seat is driven to move upward through the lifting screw rod assembly, until the upper die seat reaches the top of the guide pull rod and synchronously drives it to move upward, in this process, the guide pull rod compresses the pressure measuring spring, and the mold clamping pressure is detected by using the pressure sensor, after reaching the required pressure, the mold clamping motor stops working and the lifting screw rod assembly maintains the original height.

[0028] S3, after the mold clamping motor stops, the nut on the adjusting screw is adjusted by using a wrench to change the extension length thereof, the adjusting screw always has a tendency to move upward to the upper die seat under the action of the adjusting spring elastic force, after contacting the inclined surface of the wedge-shaped seat, the bottom is abutted on the inclined surface, the adjusting screw is adjusted to the middle part of the inclined surface of the wedge-shaped seat by extending or retracting the adjusting screw, and then driving the adjusting arm to move left and right along the detection rod.

[0029] S4, the bolt at the top of the adjusting arm after adjustment is fastened, and the actual extension height of the adjusting screw is determined.

[0030] The present application has the following beneficial effects:

[0031] The present application provides a kind of semiconductor panel level packaging press and control method, four corner parts below lower die seat are respectively provided with lifting screw rod assembly.This four lifting screw rod assemblies are not independent operation, but can provide power to lower die seat synchronously.This synchronous driving mode not only guarantees that the force above lower die seat is uniform, effectively avoids the mold wear or chip damage problem caused by uneven force, but also enhances mold clamping pressure, so that packaging process is more stable and reliable.

[0032] At the same time, the elastic pressure of the pressure measuring spring is used to sense the change of mold clamping pressure in real time.The pressure measuring spring is arranged on the pressure transmission path, and the elastic deformation amount thereof can directly reflect the size of mold clamping pressure.When mold clamping pressure is within normal range, the deformation amount of pressure measuring spring remains stable, and any protection action is not triggered.However, once mold clamping pressure is abnormally high, the deformation amount of pressure measuring spring will exceed the preset safety threshold, and the uplink switch pressure plate will touch stop switch at this time.

[0033] Stop switch as the key protection element of the present application, once triggered, will immediately cut off the power supply or control signal of the whole machine, so that the press stops working.This rapid and effective mechanical protection mechanism can intervene in time when mold clamping pressure is too large, avoid mold damage due to bearing too large pressure, so as to ensure the smooth progress of packaging process and service life of mold. BRIEF DESCRIPTION OF DRAWINGS

[0034] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present application and, together with the specification, serve to explain the principles of the present application.

[0035] The present application can be more clearly understood and appreciated from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0036] Figure 1 Fig. 1 is a schematic diagram of the overall external three-dimensional structure of the present application;

[0037] Figure 2 Fig. 2 is a schematic diagram of the overall bottom and its reducer box three-dimensional structure of the present application;

[0038] Figure 3 Fig. 3 is a schematic diagram of the front part cross-sectional plane structure of the present application;

[0039] Figure 4 Fig. 4 is a schematic diagram of the enlarged structure of the present application at point A; Figure 3

[0040] Figure 5 Fig. 5 is a schematic diagram of the enlarged structure of the present application at point B; Figure 3

[0041] Figure 6 Fig. 6 is a schematic diagram of the detection rod and adjustment arm position and its three-dimensional structure of the present application;

[0042] Figure 7 Fig. 7 is a schematic diagram of the position of each component on the wedge-shaped seat and its structure of the present application;

[0043] Figure 8 Fig. 8 is a schematic diagram of the installation position of the limit tooth row and its three-dimensional structure of the present application;

[0044] Figure 9 Fig. 9 is a schematic diagram of the position of each component on the lower die seat and its three-dimensional structure of the present application.

[0045] In the figure: 1, base; 2, guide pull rod; 200, limit ring groove; 201, switch pressure plate; 3, upper die seat; 4, lower die seat; 5, clamping motor; 500, reducer box; 6, lifting screw assembly; 7, pressure measuring spring; 8, stop switch; 9, support spring; 10, limit base; 11, wedge-shaped seat; 110, guide groove; 12, detection rod; 120, detection spring; 13, adjustment arm; 130, adjustment spring; 14, adjustment screw; 140, adjustment ball; 15, pressure sensor; 16, adjustment frame; 17, adjustment rod; 18, lower die core; 181, die core positioning pressure ring; 182, limit groove; 19, limit tooth row; 191, reverse tooth; 192, anti-reverse spring; 20, electromagnet; 21, spring ejector pin; 22, in-place switch. DETAILED DESCRIPTION

[0046] ​​With reference to the drawings and embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0047] In an embodiment, the semiconductor panel-level packaging press is mainly used for mounting chips and electronic devices on a large carrier plate (PCB / steel plate / glass). The components on the carrier plate are protected by a molding process. Figure 1 Figure 2 As can be seen from

[0048] The base 1 is movably mounted with four guide rods 2 at the four corners of the surface, and the four guide rods 2 are vertically arranged. The upper die holder 3 and the lower die holder 4 are both mounted on the outer side of the guide rods 2. The upper die holder 3 is fixedly or movably mounted on the guide rods 2. In this embodiment, the upper die holder 3 is mainly fixed on the guide rods 2 and located above the lower die holder 4. The lower die holder 4 can reciprocate up and down below the upper die holder 3 under the guidance of the guide rods 2. More specifically, reference can be made to Figure 1 Figure 2 As can be seen from

[0049] Since the bottom of the upper die holder 3 is mainly mounted with an upper mold, and the surface of the lower die holder 4 is mainly mounted with a lower mold, when the chip to be packaged is placed between the two, the clamping motor 5 drives the lifting screw assembly 6 to lift the lower die holder 4 through the reducer box 500, so that the lower mold on the lower die holder 4 is finally attached to the upper mold on the upper die holder 3, thereby completing the clamping work.

[0050] For the control of the clamping force, reference can be made to Figure 1 Figure 3 and​​​Figure 4 As can be seen, the bottom of any one guide pull rod 2 is movably mounted with a pressure measuring spring 7, and according to the Figure 4 As can be seen, the bottom of the pressure measuring spring 7 abuts against the bottom of the guide pull rod 2, the top of the pressure measuring spring 7 abuts against a ring sleeve set on the outside of the guide pull rod 2, and a pressure sensor 15 abutting against the ring sleeve is fixedly mounted on the base 1, and the upward force applied by the pressure sensor 15 to the ring sleeve is detected, so as to realize detection of the clamping force. In more detail, the pressure sensor 15 is an FCRF series sensor, the range covers 2000kN-5000kN, and the output digital signal is used for system control.

[0051] In a normal state of the embodiment, the guide pull rod 2 is pushed downward by the elastic force of the pressure measuring spring 7, and the outer side thereof abuts against the surface of the base 1, i.e. Figure 4 As can be seen, the guide pull rod 2 is pushed downward to the bottom limit position. Affected by the elastic force of the pressure measuring spring 7, on the one hand, the bottom of the guide pull rod 2 always has a downward movement tendency, and on the other hand, the top of the pressure measuring spring 7 always abuts against the pressure sensor 15 by means of the ring sleeve, so the pressure detected by the pressure sensor 15 in a normal state is the initial normal pressure. The pressure can be used to judge whether the pressure measuring spring 7 and the pressure sensor 15 are damaged or not. Specifically, when used for a long time, the pressure measuring spring 7 is subject to fatigue and other problems, which causes the strength of the pressure measuring spring 7 abutting against the ring sleeve to be relatively reduced, and comparison of the pressure detected by the pressure sensor 15 with the initial normal pressure can be used to judge whether the pressure measuring spring 7 can be normally used or not.

[0052] In normal work, the packaged chip is placed in the upper mold of the upper mold base 3. The packaging resin is injected into the lower mold on the lower mold base 4. The clamping motor 5 drives the lifting screw assembly 6 to push the lower mold base 4 upward through the reducer box 500. When the lower mold on the lower mold base 4 contacts the upper mold of the upper mold base 3, the two complete clamping. With the continuous upward pushing of the lifting screw assembly 6, the lower mold base 4 pushes the upper mold base 3 to move upward, at this time, the upper mold base 3 and the guide pull rod 2 are fixed, so that the guide pull rod 2 moves upward and further compresses the pressure measuring spring 7, and the pressure measuring spring 7 after being pressed can feed back the pressure to the pressure sensor 15, and the pressure sensor 15 can accurately judge the clamping pressure between the upper mold base 3 and the lower mold base 4 until the pressure detected by the pressure sensor 15 reaches the required pressure. At this time, the control of the clamping pressure is completed.

[0053] When the pressure sensor 15 is used for a long time, it will be abnormal, which will cause the output data to be relatively distorted. As can be seen from the above, when the clamping pressure between the upper die holder 3 and the lower die holder 4 increases, the guide pull rod 2 will go up and further compress the pressure measuring spring 7. When the data output by the pressure sensor 15 is distorted, the actual clamping pressure between the lower die holder 4 and the upper die holder 3 may be greater than the detected clamping pressure, which will cause the guide pull rod 2 to move relatively upward to a certain extent. Based on this, as can be seen from Figure 2 and Figure 3 , the base 1 is fixedly installed at the bottom with a stop switch 8 on one side of the guide pull rod 2. The stop switch 8 is generally fastened by bolts, and the actual installation height of the stop switch 8 can be adjusted by the detachable fixing of the bolts. Correspondingly, the guide pull rod 2 is fixedly installed with a switch pressing plate 201 at the bottom on one side of the stop switch 8. The switch pressing plate 201 is located below the stop switch 8. When the clamping pressure between the upper die holder 3 and the lower die holder 4 is too large, the upper die holder 3 drives the guide pull rod 2 to move further upward until the switch pressing plate 201 contacts the stop switch 8 and generates an electrical signal, finally stopping the work of the entire press, avoiding the problem that the abnormal excessive clamping pressure between the upper die holder 3 and the lower die holder 4 causes damage to the mold.

[0054] Example two is further improved on the basis of example one. When the mold on the upper die holder 3 and the lower die holder 4 is normally clamped, the upper and lower molds should be attached together, that is, the actual clamping height of the two is relatively fixed. However, in the actual application process, when the upper mold appears to be stacked or not installed in place, it will cause the mold to directly clamp the chip / substrate during the clamping process, and as the clamping strength of the two increases, the chip / substrate will be crushed between the two molds, and in severe cases, the mold may be deformed. In order to prevent such problems from occurring, as can be seen from Figures 3-6 , unlike example one, the upper die holder 3 can move up and down within a certain range outside the guide pull rod 2, as shown in Figure 3 , the upper die holder 3 moves downward to the bottom limit and is blocked by the convex ring outside the guide pull rod 2, so it cannot continue to move downward. At the same time, the guide pull rod 2 on one side of the stop switch 8 is provided with a limiting ring groove 200 on the side, and the detection rod 12 is movably arranged outside the upper die holder 3 by a mounting flange. The detection spring 120 is arranged between the detection rod 12 and the upper die holder 3, and is pushed by the elastic force of the detection spring 120, so that the top of the detection rod 12 abuts against the limiting ring groove 200; on the contrary, when the detection rod 12 moves away from the limiting ring groove 200, the detection rod 12 will retract into the upper die holder 3 and relatively away from the limiting ring groove 200, so as to release the limitation of the limiting ring groove 200. From Figure 5As can be seen, the upper die holder 3 is provided with a stepped hole, when the detection rod 12 moves to the right and is separated from the limiting ring groove 200, the right end of the detection rod 12 will be on the stepped hole, preventing the detection rod 12 from moving too far to the right (the mounting flange end can also be inserted into the hole where the detection rod 12 is installed to limit the movement of the detection rod 12 to the right, and actual application can be arranged as needed). For the structure arrangement of the detection rod 12, a cylindrical and elliptical rod threaded connection is adopted, wherein the cylindrical is used as the end and is inserted into the limiting ring groove 200, and the elliptical rod is sleeved on the mounting flange, so that the detection rod 12 can only move left and right along the guide rod 2.

[0055] The outer side of the elliptical rod of the detection rod 12 has an adjusting arm 13 fastened by bolts, Figure 6 As can be seen, the end of the adjusting arm 13 is provided with an oval slot, when the adjusting arm 13 is inserted into the detection rod 12, the oval slot is fastened by bolts, so that the adjusting arm 13 can be tightly clamped on the detection rod 12. The adjusting screw 14 is threadedly connected to the bottom of the adjusting arm 13, and the adjusting nut is arranged at the bottom of the adjusting screw 14. By turning the nut with a wrench, the adjusting screw 14 can move up and down along the threaded groove at the bottom of the adjusting arm 13. Correspondingly, Figure 1 And Figure 3 As can be seen, the outer side of the lower die holder 4 has a wedge-shaped seat 11 fastened by bolts, and the side of the wedge-shaped seat 11 is in the shape of a right triangle. When the lower die holder 4 approaches the upper die holder 3, the inclined surface of the wedge-shaped seat 11 will push the adjusting screw 14 to move away from the guide rod 2, and finally make the detection rod 12 separate from the limiting ring groove 200. However, it should be noted that when the upper die holder 3 and the lower die holder 4 just complete the mold closing, the normal mold closing height will not change, therefore, by adjusting the extension length of the adjusting screw 14, it is ensured that when the mold just closes, the inclined surface on the wedge-shaped seat 11 pushes the adjusting screw 14 and drives the detection rod 12 to just move away from the limiting ring groove 200. When the mold just closes, the detection rod 12 separates from the limiting ring groove 200.

[0056] The advantage of this design is that when the lower die holder 4 drives the lower die to move upward:

[0057] If the mold is normally closed, the wedge-shaped seat 11 pushes the adjusting screw 14 to move to the right, and the direction is referred to Figure 5 The adjusting screw 14 drives the detection rod 12 to move to the right synchronously according to the adjusting arm 13, until the detection rod 12 and the limiting ring groove 200 are separated.

[0058] When the lower die holder 4 continues to push upward after the mold is closed, the upper die holder 3 and the lower die holder 4 are both moved upward along the outer side of the guide pull rod 2. When the top of the upper die holder 3 contacts the top of the guide pull rod 2, the top of the guide pull rod 2 blocks the upward movement of the upper die holder 3. The upper die holder 3 exerts pressure on the top of the guide pull rod 2, which drives the guide pull rod 2 to compress the pressure measuring spring 7. The pressure measuring spring 7 not only cushions the direct contact between the two, but also increases the compression intensity of the pressure measuring spring 7 when the guide pull rod 2 continues to move upward and constantly exerts pressure on the pressure measuring spring 7. The pressure sensor 15 detects the increase in the clamping strength.

[0059] Under normal conditions, when the pressure sensor 15 detects the required clamping pressure, the clamping motor 5 stops working and maintains the clamping pressure. However, if the pressure sensor 15 malfunctions, the lower die holder 4 will push the upper die holder 3 to move further upward. The guide pull rod 2 will abnormally move upward, causing the stop switch 8 to be turned on and the entire machine to stop working. This avoids excessive clamping pressure between the lower die holder 4 and the upper die holder 3.

[0060] If there are problems such as material stacking or positioning deviation between the molds, it will cause the molds not to be normally clamped. When the lower die holder 4 moves upward, the clamping height is relatively higher than the normal height. Therefore, the inclined surface of the wedge-shaped seat 11 will not cause the detection rod 12 to disengage from the limiting ring groove 200 through the adjusting screw 14. When the lifting lead screw assembly 6 pushes the lower die holder 4 to move further upward, the lower die holder 4 drives the guide pull rod 2 on one side of the stop switch 8 to move upward directly. When the switch pressing plate 201 moves upward and contacts the stop switch 8, it directly causes the entire machine to stop working. This avoids the problem of excessive pressure applied by the molds when the molds are not normally clamped, which causes damage to the molds.

[0061] Based on the above content, in combination with Figure 3 It can be seen that the guide pull rod 2 on one side of the stop switch 8 is fixedly installed with a limiting base 10 above the switch pressing plate 201, and the limiting base 10 can move up and down synchronously with the guide pull rod 2. The base 1 is movably installed with a supporting spring 9 on the outer side of the guide pull rod 2, and the supporting spring 9 is below the limiting base 10. Under normal conditions, the detection rod 12 is in the limiting ring groove 200. When the upper die holder 3 moves downward to the limit, the guide pull rod 2 on the switch pressing plate 201 cannot also move downward, and finally the limiting base 10 is above the supporting spring 9.

[0062] When the lower die holder 4 moves upward for clamping, it is consistent with the above content, which will not be repeated here.

[0063] After the package is completed, the mold clamping motor 5 moves the lower mold base 4 downward by lifting the screw assembly 6. After the lower mold base 4 releases the upward push force on the upper mold base 3, the upper mold base 3 moves downward under gravity until it reaches the downward limit and hits the guide rod 2. At the same time, the limit base 10 is also pressed on the support spring 9. At this time, the support spring 9 is not compressed and is blocked by the support spring 9, so that the guide rod 2 on the limit base 10 is in a fixed downward position under normal conditions. When the upper mold base 3 has descended to the bottom limit, it will drive the detection rod 12 to synchronously descend to the limit ring groove 200. Pushed by the elastic force of the detection spring 120, the detection rod 12 hits the limit ring groove 200. As the lower mold base 4 continues to descend, it will eventually press on the limit base 10 and push the limit base 10 to move downward. Since the detection rod 12 is inserted into the limiting ring groove 200 at this time, when the limiting base 10 drives the guide rod 2 to move downward, it is restricted by the detection rod 12 and cannot move downward. At the same time, the detection rod 12 also has a downward trend by driving the upper die base 3, but the upper die base 3 has been pressed down to the limit. Therefore, it is blocked by the guide rod 2 on the pressure measuring spring 7, so that the upper die base 3 cannot continue to move downward. It can be seen from this that when the detection rod 12 is inserted into the limiting ring groove 200, the entire device can be restored to its normal position. In addition, since the detection rod 12 drives the upper die base 3 to press the guide rod 2 downward to the bottom, when the top of the pressure measuring spring 7 is pressed against the pressure sensor 15 using the ring sleeve, the pressure sensor 15 can be used to detect the elastic force of the pressure measuring spring 7 under normal conditions, thereby judging whether the pressure measuring spring 7 is fatigued.

[0064] Similarly, if the detection rod 12 fails to be inserted into the limiting ring groove 200 normally, when the lower die base 4 compresses the limiting base 10, the limiting base 10 will further compress the supporting spring 9, which will cause the guide rod 2 on the switch pressure plate 201 to move downward further. Figure 3 It can be clearly seen that there are two switch pressure plates 201, which are respectively located at the upper and lower positions of the stop switch 8. When the guide rod 2 drives the switch pressure plate 201 to move downward, it finally contacts the stop switch 8. Therefore, by moving the lower mold base 4 downward, it is possible to detect whether the device is reset normally, thereby ensuring whether the equipment has the conditions for the next chip packaging.

[0065] From the above, it can be seen that in the second embodiment, when the lower die base 4 is ascending, the four guide rods 2 are used to alternately guide and limit the die base, thereby achieving the mold closing operation between the lower die base 4 and the upper die base 3. At the same time, it can detect whether the lower die base 4 and the upper die base 3 are closing normally. If the mold closing is abnormal, the power source can be quickly cut off to avoid extrusion damage to the mold caused by abnormal mold closing. When the lower die base 4 is descending, it can also detect whether the entire device has been properly reset, thereby determining whether the equipment is ready for re-sealing.

[0066] In addition to embodiment two, the embodiment two mentioned that "the detection rod 12 and the limiting ring groove 200 are separated when the mold is just closed", because the height of the closed mold is not consistent when different molds are installed on the upper mold base 3 and the lower mold base 4, in order to ensure that the detection rod 12 and the limiting ring groove 200 are separated when the mold is just closed, the application proposes a method for determining the length of the adjusting screw 14, specifically, from Figure 5 And Figure 6 As can be seen, the adjusting arm 13 and the end of the detection rod 12 are provided with an adjusting spring 130, which makes the adjusting arm 13 always have a tendency to move towards the upper mold base 3. When the bolt on the adjusting arm 13 is loosened, the adjusting arm 13 can move along the oval rod of the detection rod 12 and be pushed against the upper mold base 3 under the elastic force of the adjusting spring 130, and the elastic strength of the adjusting spring 130 is relatively greater than that of the detection spring 120, so that when the adjusting arm 13 is pushed against the upper mold base 3, it is limited by the upper mold base 3 and cannot move, and under the elastic force of the adjusting spring 130, the detection rod 12 compresses the detection spring 120 and finally separates from the limiting ring groove 200.

[0067] Specifically, the bolt is loosened to remove the fastening of the top of the adjusting arm 13, so that the adjusting arm 13 is attached to the upper mold base 3, and the detection rod 12 is away from the limiting ring groove 200.

[0068] Then, the mold closing motor 5 drives the lifting screw assembly 6 to move the lower mold base 4 upwards, because the detection rod 12 is no longer inserted into the limiting ring groove 200 at this time, so that the lower mold base 4 continuously pushes the upper mold base 3 upwards after the mold closing is completed, until the upper mold base 3 is pushed against the top of the guide pull rod 2 and drives the guide pull rod 2 to move upwards at the same time, the upward guide pull rod 2 compresses the pressure measuring spring 7, and the pressure sensor 15 detects the mold closing pressure. When the required mold closing pressure is reached, the mold closing motor 5 stops working and the lifting screw assembly 6 maintains the original height.

[0069] At the same time, the nut on the adjustment screw 14 is adjusted using a wrench to adjust the extension length of the adjustment screw 14. As can be seen from the above, since the bolts on the adjustment arm 13 have been loosened, the elastic force of the adjustment spring 130 forces the adjustment screw 14 to consistently move toward the upper mold base 3. Therefore, when the adjustment screw 14 contacts the inclined surface of the wedge seat 11, the force exerted by the adjustment screw 14 in the direction of the upper mold base 3 causes the bottom of the adjustment screw 14 to consistently rest against the inclined surface of the wedge seat 11. Extending and retracting the adjustment screw 14 causes it to move along the inclined surface of the wedge seat 11, which in turn causes the adjustment arm 13 to move left and right along the detection rod 12. Generally, it is best to adjust the adjustment screw 14 to the middle of the inclined surface of the wedge seat 11. Finally, the bolts at the top of the adjusted adjustment arm 13 are tightened, completing the determination of the actual extension height of the adjustment screw 14.

[0070] It can be seen from this that the third embodiment determines the actual extension length of the adjustment screw 14 through the actual mold closing height, ensuring that the detection rod 12 is exactly separated from the limiting ring groove 200 when the mold is just closed.

[0071] The fourth embodiment is further optimized based on the third embodiment. Figures 7-9 As can be clearly seen, a guide groove 110 is defined on the inclined surface of the wedge seat 11. Correspondingly, an adjustment ball 140 is positioned at the bottom of the adjustment screw 14. When the upper die seat 3 and the lower die seat 4 are closed, the adjustment ball 140 enters the guide groove 110 and moves along the inclined surface of the wedge seat 11. Unlike the third embodiment, the wedge seat 11 in this fourth embodiment utilizes a guide rail to allow for a certain range of up and down movement along the outer side of the lower die seat 4. Furthermore, an adjustment bracket 16 is bolted to the side of the wedge seat 11, and the adjustment bracket 16 always follows the wedge seat 11 in its up and down reciprocating motion.

[0072] More detailed, from Figure 8 It can be seen that inside the wedge-shaped seat 11 and in the guide groove 110, there is a limit tooth row 19 guided by a round rod, and an anti-reverse thrust spring 192 located on the outer side of the round rod is fixedly installed between the limit tooth row 19 and the wedge-shaped seat 11. The limit tooth row 19 is pushed by the elastic force of the anti-reverse thrust spring 192, forcing the limit tooth row 19 to always move toward the middle of the guide groove 110. In addition, an anti-reverse tooth 191 is fixedly provided on the side of the limit tooth row 19 in the direction of the guide groove 110. The shape of the anti-reverse tooth 191 is preferably a right triangle. The advantage of this design is that when the adjustment ball 140 is inserted into the guide groove 110, the elastic force of the anti-reverse thrust spring 192 is used to push the anti-reverse tooth 191 to restrict the adjustment ball 140 in the guide groove 110. Combined with the shape of the anti-reverse tooth 191, it has a one-way limiting effect, and the direction reference Figure 8As shown, when the adjusting ball 140 moves downward along the slope, the extended anti-reverse tooth 191 will limit its downward movement; similarly, when the adjusting ball 140 moves upward along the slope, the slope on the anti-reverse tooth 191 will not affect its upward movement. The electromagnet 20 is fixedly installed in the wedge-shaped seat 11. After the electromagnet 20 is powered on and generates magnetism, it will pull the limit tooth row 19 and compress the anti-reverse spring 192 according to the magnetic force. At this time, the anti-reverse tooth 191 moves away from the guide groove 110.

[0073] As can be seen from the arrangement of the lower mold base 4, Figure 9 As can be seen from the arrangement of the lower mold base 4, Figure 9 As can be seen from the arrangement of the lower mold base 4,

[0074] In the actual application process of the fourth embodiment, under normal circumstances, the spring top rod 21 is pressed against the lower limit groove 182, forcing the groove on the mold core positioning pressure ring 181 to be above the lower mold core 18, facilitating the positioning of the chip / substrate during feeding. The electromagnet 20 is powered on and generates magnetism to the limit tooth row 19, forcing the limit tooth row 19 to pull the anti-reverse tooth 191 away from the guide groove 110.

[0075] If the lower mold core 18 is normally placed, it will cause the lower mold base 4 and the upper mold base 3 to be closed, the upper mold base 3 will press the mold core positioning pressure ring 181 downward, and finally the spring top rod 21 will be pressed into the upper limit groove 182, and the chip / substrate will be placed on the top of the lower mold core 18. As can be seen from the arrangement of the lower mold base 4, Figure 9As can be seen, when the mold core positioning pressure ring 181 descends and the spring top rod 21 abuts against the upper limit slot 182, the bottom of the mold core positioning pressure ring 181 can abut against the to-position switch 22 fixed on the lower mold base 4. After the to-position switch 22 is turned on, the power supply of the electromagnet 20 is cut off, and the electromagnet 20 will no longer generate magnetism after being powered off. The limit tooth row 19 is pushed in the direction of the guide slot 110 under the elastic pushing of the anti-reverse spring 192. However, at this time, since the upper mold base 3 and the lower mold base 4 are normally clamped, the adjusting ball 140 will also abut against the guide slot 110, and when the adjusting ball 140 moves along the wedge-shaped seat 11, the detection rod 12 is separated from the limit ring groove 200 on the guide pull rod 2. Then, according to the description in Example Two, the packaging work of the chip is completed.

[0076] If the lower mold core 18 is not normally placed, and the material is stacked or the installation is not in place as described in Example Three, when the lower mold base 4 moves upward, the mold core positioning pressure ring 181 and the chip / substrate above it will first contact the upper mold base 3. When the mold core positioning pressure ring 181 and the chip / substrate are blocked by the upper mold base 3 and move downward, the to-position switch 22 will be started first, but at this time, the upper mold base 3 and the lower mold base 4 have not reached the normal clamping height, and the adjusting ball 140 has been inserted into the guide slot 110, but it cannot achieve the separation of the detection rod 12 from the limit ring groove 200. After the electromagnet 20 is powered off, the limit tooth row 19 is pushed against the adjusting screw 14 under the elastic pushing of the anti-reverse spring 192, more specifically, the shaft rod on the adjusting screw 14 abuts against the anti-reverse teeth 191, the adjusting ball 140 is below the anti-reverse teeth 191, and is limited by the one-way movement of the anti-reverse teeth 191. When the lower mold base 4 drives the wedge-shaped seat 11 to move upward, the anti-reverse teeth 191 make the adjusting screw 14 unable to continue to move outward, thereby maintaining the tendency of the detection rod 12 to always lock the limit ring groove 200. Finally, after the lower mold base 4 pushes the guide pull rod 2 upward, the switch pressing plate 201 on the guide pull rod 2 will compress the stop switch 8, and the whole machine will stop working. As can be seen, compared with Example Two, through the optimization of the detection function, it is ensured that the chip / substrate can be determined to be installed in place when it is subjected to a smaller clamping force, and after the abnormality, the components on the wedge-shaped seat 11 and the adjusting screw 14 complete the locking work, and it is ensured that the upper mold base 3 and the lower mold base 4 will not be clamped too tightly. The reason is that the upper mold base 3 itself has a certain weight, and the content in Example Two is only applicable to the scene where the upper mold base 3 is light in weight. However, as the production size increases, the size of the upper mold base 3 will also increase accordingly, which will result in a larger self-gravity of the upper mold base 3, and thus the chip / substrate is still prone to being crushed under the scene of a larger and heavier upper mold base 3.

[0077] Finally, when the chip / substrate is encapsulated, the lower die holder 4 moves downward. Since the adjusting ball 140 is still below the limiting tooth row 19, the adjusting screw 14 is pulled downward synchronously according to the resistance of the limiting tooth row 19, so that the upper die holder 3 has a certain downward strength to complete the reset action. After that, when the detection rod 12 moves to the vicinity of the limiting ring groove 200, the upper die holder 3 cannot continue to move downward. With the continuous downward movement of the lower die holder 4, the limiting tooth row 19 cannot move downward with the lower die holder 4 due to the resistance of the adjusting ball 140. When the wedge-shaped seat 11 drives the adjusting frame 16 to move upward relative to the lower die holder 4, the adjusting frame 16 and the adjusting rod 17 contact and push the mold core positioning pressure ring 181 to move upward. When the mold core positioning pressure ring 181 moves upward, it moves away from the in-place switch 22. At this time, the in-place switch 22 is turned off, and the electromagnetic iron 20 is closed by program control (such as a programmable controller) with a delay. In this way, when the lower die holder 4 moves upward, the mold core positioning pressure ring 181 moves upward relative to the lower die core 18 until the spring top rod 21 reaches the limiting groove 182 below. At this time, the mold core positioning pressure ring 181 moves to the limit. When the lower die holder 4 continues to move downward, the mold core positioning pressure ring 181 limits the movement of the adjusting frame 16 by the adjusting rod 17, forcing the adjusting frame 16 to continue to move upward. With the downward movement of the lower die holder 4 driving the wedge-shaped seat 11, the pressure of the limiting tooth row 19 pressing on the top of the adjusting ball 140 will further increase. Since the limiting tooth row 19 is a spherical body, its outer side is an arc surface. When the contact pressure increases, the limiting tooth row 19 will move along the outer arc surface until the limiting tooth row 19 and the adjusting ball 140 are separated. The lower die holder 4 finally moves downward to the bottom, and then the chip / substrate on the mold core positioning pressure ring 181 is taken out, and the encapsulation work is completed.

[0078] As can be seen from the above, in the actual application process of the fourth embodiment, the assembly between the wedge-shaped seat 11 and the adjusting screw 14 can detect the pressure of the chip / substrate and the clamping height, so that the chip / substrate on the mold core positioning pressure ring 181 can be detected whether it is normally placed under low pressure, and after the encapsulation is completed, the assembly between the wedge-shaped seat 11 and the adjusting screw 14 forces the chip / substrate on the mold core positioning pressure ring 181 to be easily taken up and down, thereby avoiding continuous chip / substrate encapsulation work.

Claims

1. A semiconductor panel-level packaging press, characterized in that: include: A base (1) is provided with an upper die base (3) and a lower die base (4) mounted on its surface via a guide rod (2); The reducer box (500) has an input end connected to the mold clamping motor (5), and an output end connected to a lifting screw assembly (6) movably connected to the lower mold base (4); the mold clamping motor (5) drives the lifting screw assembly (6) through the reducer box (500) to lift the lower mold base (4) to achieve a mold clamping action; A pressure measuring spring (7), the bottom end of which is mounted on the guide rod (2) and the top end of which is against a pressure sensor (15), the pressure sensor (15) being used to detect the mold clamping pressure; The pressure sensor (15) determines whether the pressure measuring spring (7) can be used normally by measuring the pressure change before and after the pressure measuring spring (7) is used; A stop switch (8) is fixed to the bottom of the base (1); A switch pressing plate (201) is fixed on the guide rod (2); When the pressure sensor 15 is abnormal, the upper die seat (3) drives the guide rod (2) upward and causes the switch pressing plate (201) to contact the stop switch (8) to stop the entire machine.

2. The semiconductor panel-level packaging press according to claim 1, characterized in that: Also included are: A limiting ring groove (200) is provided on the side of the guide rod (2) and is located above the switch pressure plate (201); A detection rod (12) is mounted on the upper die base (3) and is pressed into the limiting ring groove (200) by the elastic force of a detection spring (120); An adjusting arm (13) is bolted to the detection rod (12), and an adjusting screw (14) is threadedly connected to the bottom; A wedge-shaped seat (11) is mounted on the lower die seat (4) and is located below the adjustment arm (13); When the lower die base (4) approaches the upper die base (3), the wedge-shaped seat (11) pushes the adjusting screw (14) to enable the detection rod (12) to disengage from the limiting ring groove (200).

3. The semiconductor panel-level packaging press according to claim 2, characterized in that: The detection rod (12) is composed of a cylinder and an elliptical rod coaxially threaded together.

4. The semiconductor panel-level packaging press according to claim 2, characterized in that: The side of the wedge-shaped seat (11) is in the shape of a right triangle.

5. The semiconductor panel-level packaging press according to claim 2, characterized in that: A limiting base (10) is fixedly mounted on the guide pull rod (2), and a supporting spring (9) is provided between the limiting base (10) and the base (1).

6. The semiconductor panel-level packaging press according to any one of claims 2 or 5, characterized in that: There are two switch pressing plates (201), and the two switch pressing plates (201) are respectively located at the upper and lower positions of the stop switch (8).

7. The semiconductor panel-level packaging press according to claim 5, characterized in that: An adjustment spring (130) is provided between the adjustment arm (13) and the end of the detection rod (12).

8. The semiconductor panel-level packaging press according to claim 5, characterized in that: A guide groove (110) is provided on the inclined surface of the wedge-shaped seat (11), and the wedge-shaped seat (11) can move up and down along the lower die seat (4) by means of a guide rail frame, and an adjustment frame (16) is fastened to the side of the wedge-shaped seat (11); An adjusting ball (140) is provided at the bottom of the adjusting screw (14); A limited motion tooth row (19) is movably installed inside the wedge-shaped seat (11), and an anti-reverse thrust spring (192) is fixedly installed between the limited motion tooth row (19) and the wedge-shaped seat (11), and an anti-reverse thrust tooth (191) is provided on the side of the limited motion tooth row (19); An electromagnet (20) is fixedly installed in the wedge-shaped seat (11). The magnetic force generated by the electromagnet (20) when it is energized pulls the limit gear row (19) and compresses the anti-reverse thrust spring (192); The surface of the lower mold base (4) is fastened with a lower mold core (18) and a mold core positioning pressure ring (181) movably mounted on the outer side of the lower mold core (18); an adjustment rod (17) located above the adjustment frame (16) is fixedly mounted on the outer side of the mold core positioning pressure ring (181); a spring push rod (21) is fixedly mounted on the outer side of the lower mold core (18); limiting grooves (182) are provided on the upper and lower sides of the inner side of the mold core positioning pressure ring (181); when the spring push rod (21) reaches the limiting groove (182), the separation resistance between the two is increased; A position switch (22) located below the mold core positioning pressure ring (181) is fixedly mounted on the lower mold base (4) to control the on and off of the electromagnet (20).

9. A control method for a semiconductor panel-level packaging press according to claim 7, characterized in that: The following steps are involved: S1. Place the chip to be packaged into the upper mold of the upper mold base, and inject the packaging resin into the lower mold of the lower mold base; S2. Start the mold closing motor and push the lower mold base upward through related components. During normal mold closing, the wedge seat pushes the adjusting screw to disengage the detection rod from the limit ring groove. During the mold closing process, the upper mold base and the lower mold base move upward. After the upper mold base contacts the top of the guide rod, the upward driving force of the guide rod compresses the pressure spring. The pressure sensor detects the mold closing strength. When the required pressure is reached, the mold closing motor stops working. S3. If the pressure sensor is abnormal, the lower mold base continues to push the upper mold base upward, and the guide rod drives the switch pressure plate to turn on the stop switch, and the entire machine stops working to prevent the mold clamping pressure from being too high; S4. If the mold is not closed normally or the mold closing height is abnormal, the detection rod will not separate from the limit ring groove; when the lower mold base moves upward further, it will drive the guide rod to move upward directly, the switch pressure plate will contact the stop switch, and the entire machine will stop working to avoid damage to the mold; S5. After the packaging is completed, the mold clamping motor moves the lower mold base downward, and the upper mold base moves downward to the limit position under gravity, and the limit base is pressed on the support spring; The upper die seat drives the detection rod down to the limit ring groove, the detection rod is inserted into the limit ring groove, and the device returns to the normal position; If the detection rod is not inserted into the limit ring groove normally, the lower die seat will move downward to compress the support spring, the guide rod will move downward further, and the switch pressure plate will contact the stop switch to detect whether the device is reset normally to ensure that the equipment can proceed to the next packaging.

10. The control method of the semiconductor panel-level packaging press according to claim 9, characterized in that: The invention also includes a control method for adjusting the screwing length of the screw rod (14), the steps of which are as follows: S1. Release the bolt on the top of the adjusting arm. The adjusting arm is attached to the upper die seat under the action of the adjusting spring. At the same time, the detection rod is pushed by the adjusting spring to compress the detection spring and disengage from the limit ring groove. S2. Start the mold clamping motor, which drives the lower mold base upward through the lifting screw assembly until the upper mold base reaches the top of the guide rod and drives it upward synchronously; During this process, the guide rod compresses the pressure spring and uses the pressure sensor to detect the mold clamping pressure; when the required pressure is reached, the mold clamping motor stops working and the lifting screw assembly maintains its original height; S3. After the mold clamping motor stops, use a wrench to adjust the nut on the adjusting screw to change its extension length. The adjusting screw, under the action of the adjustment spring, tends to move upward toward the mold base. After contacting the wedge seat slope, its bottom rests on the slope. By extending or retracting the adjusting screw, it moves along the wedge seat slope, which in turn drives the adjusting arm to move left and right along the detection rod until the adjusting screw is adjusted to the middle of the wedge seat slope. S4. Tighten the bolt on the top of the adjustment arm after adjustment to determine the actual extension height of the adjustment screw.

Images