Wafer thinning sheet photoresist removing base and semiconductor equipment

Abstract

The invention provides a wafer thinning sheet photoresist removing base and semiconductor equipment, the wafer thinning sheet photoresist removing base comprises a supporting unit, a pressure unit and a lifting unit, the pressure unit is arranged above the supporting unit, the lifting unit is fixedly connected with the bottom surface or the side surface of the supporting unit, and the lifting unit is arranged above the supporting unit. The lifting unit is used for supporting the pressure unit to move in the vertical direction, and when the lifting unit supports the pressure unit to move downwards, after the pressure unit makes contact with the upper surface of the wafer thinning sheet, the lifting unit is disengaged from the pressure unit, and the lifting unit is used for lifting the wafer thinning sheet. The pressure unit applies downward force to the upper surface of the edge of the wafer thinning sheet under the action of gravity, so that the edge of the wafer thinning sheet is prevented from warping, the lower surface of the wafer thinning sheet is better attached to the supporting unit, diffusion of active groups on the lower surface of the wafer thinning sheet is reduced, and the yield of the wafer thinning sheet is improved. And the damage of the active groups to the lower surface of the wafer thinning sheet is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a wafer thinning sheet degumming base and semiconductor equipment. BACKGROUND

[0002] In the degumming process of the wafer thinning sheet, due to the fact that the wafer thinning sheet is thin in the middle and thick at the edges, as the photoresist in the middle of the wafer thinning sheet is removed, the thickness difference between the middle and the edges of the wafer thinning sheet will increase, and the expansion of the middle of the wafer thinning sheet is greater than that of the edges of the wafer thinning sheet, thereby causing the edges of the wafer thinning sheet to warp.

[0003] After the edges of the wafer thinning sheet warp, the wafer thinning sheet will be unevenly heated, which further increases the warping of the edges of the wafer thinning sheet, and causes a large gap to appear between the lower surface of the wafer thinning sheet and the upper surface of the base, greatly affecting the degumming speed and uniformity of the wafer thinning sheet, and also causing the active radicals to diffuse from the edges of the wafer thinning sheet and the gap between the lifting pins and the lifting pin holes on the base to the lower surface of the wafer thinning sheet, damaging the lower surface of the wafer thinning sheet and reducing the yield of the degumming process.

[0004] In the prior art: I. The shape of the wafer thinning sheet is corrected before and after the degumming process, but this method cannot avoid the damage of the active radicals to the lower surface of the wafer thinning sheet; II. The wafer thinning sheet is adsorbed by an electrostatic chuck, but this method increases the cost; III. A normal wafer is pasted on the lower surface of the wafer thinning sheet, and then the wafer thinning sheet is degummed, but this method increases the cost.

[0005] Therefore, it is necessary to provide a novel wafer thinning sheet degumming base and semiconductor equipment to solve the above problems in the prior art. SUMMARY

[0006] The purpose of the present application is to provide a wafer thinning sheet degumming base and semiconductor equipment to avoid the warping of the edges of the wafer thinning sheet and reduce the damage of the active radicals to the lower surface of the wafer thinning sheet.

[0007] To achieve the above purpose, the wafer thinning sheet degumming base of the present application comprises: a support unit for supporting and heating the wafer thinning sheet to be degummed; a pressure unit arranged above the support unit for applying a downward force to the upper surface of the edges of the wafer thinning sheet under the action of gravity; and The lifting unit is fixedly connected with the bottom surface or the side surface of the support unit, and is used for supporting the pressure unit to move in the vertical direction; In the process of supporting the pressure unit to move downward, after the pressure unit contacts the upper surface of the wafer thinning sheet, the lifting unit is disengaged from the pressure unit.

[0008] The wafer thinning sheet adhesive removing base has the following beneficial effects: the wafer thinning sheet adhesive removing base comprises a support unit, a pressure unit and a lifting unit. The pressure unit is arranged above the support unit. The lifting unit is fixedly connected with the bottom surface or the side surface of the support unit, and is used for supporting the pressure unit to move in the vertical direction. In the process of supporting the pressure unit to move downward, after the pressure unit contacts the upper surface of the wafer thinning sheet, the lifting unit is disengaged from the pressure unit. The pressure unit applies a downward force to the upper surface of the edge of the wafer thinning sheet under the action of gravity, so as to prevent the edge of the wafer thinning sheet from being warped. In addition, the lower surface of the wafer thinning sheet is more closely attached to the support unit, the diffusion of active groups on the lower surface of the wafer thinning sheet is reduced, and the damage of active groups to the lower surface of the wafer thinning sheet is reduced.

[0009] Optionally, the pressure unit comprises a pressure piece and a connecting piece. The part of the pressure piece in contact with the wafer thinning sheet is a plane. One side of the pressure piece, which is away from the wafer thinning sheet, is fixedly connected with the connecting piece.

[0010] Optionally, the pressure piece and the connecting piece are both circular rings. The central axis of the pressure piece is collinear with the central axis of the connecting piece. The inner diameter of the pressure piece is less than or equal to the inner diameter of the connecting piece. The outer diameter of the connecting piece is greater than the outer diameter of the pressure piece.

[0011] Optionally, the pressure unit further comprises a counterweight piece. The counterweight piece comprises a plurality of counterweight blocks. The plurality of counterweight blocks are detachably fixedly connected with the connecting piece. By adjusting the number of the counterweight blocks, the overall weight of the pressure unit can be changed.

[0012] Optionally, the connecting piece comprises a box body and a box cover. The box body is threadedly and sealingly connected with the box cover. The plurality of counterweight blocks are detachably fixed in the box body.

[0013] Optionally, the lifting unit comprises a support piece and a driving piece. The support piece comprises a support rod and a ring-shaped support. One end of the support rod is fixedly connected with the outer edge of the ring-shaped support. The inner diameter of the ring-shaped support is greater than the outer diameter of the pressure piece. The inner diameter of the ring-shaped support is less than the outer diameter of the connecting piece. The other end of the support rod is fixedly connected with the driving piece. The driving piece is used for driving the support rod to move in the vertical direction.

[0014] Optionally, the pressure unit comprises a pressure piece, a part of the pressure piece in contact with the wafer thinning piece is a plane, and the pressure piece has a support rod connecting part.

[0015] Optionally, the lifting unit comprises a support piece and a driving piece, the support piece comprises a support rod, one end of the support rod is used for docking with the support rod connecting part, the other end of the support rod is fixedly connected with the driving piece, the driving piece is used for driving the support rod to move in the vertical direction, and the support rod lifts up the support rod connecting part after the support rod is docked with the support rod connecting part and moves upward.

[0016] Optionally, the wafer thinning piece adhesive removing base further comprises a limiting unit, the limiting unit is arranged on the support unit and is used for limiting the position of the wafer thinning piece.

[0017] Optionally, the limiting unit comprises at least three limiting pieces, and the limiting pieces are arranged on the wafer thinning piece supporting surface of the support unit.

[0018] Optionally, the limiting piece comprises a column and a conical head, one bottom surface of the column is fixedly connected with a bottom surface of the conical head, and the other bottom surface of the column is fixedly connected with the wafer thinning piece supporting surface of the support unit.

[0019] Optionally, the column comprises a movable inner column and a fixed outer column, an axial through hole is formed in the fixed outer column, the movable inner column is matched in shape with the axial through hole, at least part of the movable inner column is accommodated in the axial through hole, and the movable inner column is in precise sliding connection with the axial through hole.

[0020] The application further provides a semiconductor device comprising the wafer thinning piece adhesive removing base. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a structural schematic diagram of a wafer thinning piece adhesive removing base in some embodiments of the application; Figure 2 FIG. 2 is a structural schematic diagram of a pressure unit in some embodiments of the application; Figure 3 FIG. 3 is a structural schematic diagram of a pressure piece in some embodiments of the application; Figure 4 FIG. 4 is a structural schematic diagram of a connecting piece in some embodiments of the application; Figure 5 FIG. 5 is a structural schematic diagram of a support piece in some embodiments of the application; Figure 6 FIG. 6 is a top view of a support unit in some embodiments of the application.

[0022] Explanation of reference signs: 10, support unit; 11, pinhole sink; 12, lifting pin; 121, limiting piece; 20, pressure unit; 21, pressure piece; 22, connecting piece; 30, lifting unit; 31, support piece; 311, support rod; 312, annular support; 32, driving piece; 40, wafer thinning sheet. DETAILED DESCRIPTION

[0023] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the usual meanings understood by those skilled in the art. The words such as "comprise" and the like used herein mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects.

[0024] In view of the problems in the prior art, the embodiments of the present application provide a semiconductor device, which comprises a wafer thinning sheet degumming base and other mechanisms. The other mechanisms include a process cavity, a gas delivery system, etc., which are all prior art in the field and will not be described in detail here.

[0025] Reference Figure 1 The wafer thinning sheet degumming base comprises a support unit 10, a pressure unit 20 and a lifting unit 30. The support unit 10 is used to support and heat the wafer thinning sheet 40 to be degummed. The pressure unit 20 is arranged above the support unit 10 and is used to apply a downward force to the edge upper surface of the wafer thinning sheet 40 under the action of gravity. The lifting unit 30 is fixedly connected with the bottom surface of the support unit 10 and is used to support the pressure unit 20 to move in the vertical direction. When the lifting unit 30 supports the pressure unit 20 to move downward, the pressure unit 20 is in contact with the upper surface of the wafer thinning sheet 40, and then the lifting unit 30 is disengaged from the pressure unit 20.

[0026] In some embodiments, the lifting unit is fixedly connected with the side surface of the support unit.

[0027] The application adds the pressure unit 20 and the lifting unit 30 to the prior art. When the wafer thinning sheet 40 needs to be removed of glue, the wafer thinning sheet 40 is placed on the support unit 10, the lifting unit 30 drives the pressure unit 20 to descend, when the lower surface of the pressure unit 20 contacts the upper surface of the edge of the wafer thinning sheet 40, the lifting unit 30 continues to descend, the lifting unit 30 is then separated from the pressure unit, and the pressure unit 20 applies a downward force to the upper surface of the edge of the wafer thinning sheet 40 under the action of its own gravity, thereby preventing the edge of the wafer thinning sheet 40 from warping during the removal of glue, ensuring the removal speed and uniformity of the wafer thinning sheet 40, and the lower surface of the wafer thinning sheet 40 is attached to the support unit 10, greatly reducing the degree of diffusion of active groups on the lower surface of the wafer thinning sheet 40 and reducing the damage of active groups to the lower surface of the wafer thinning sheet 40.

[0028] In some embodiments, the support unit includes a base and a heater, and the specific structure and mutual relationship between the base and the heater are prior art, which will not be described in detail here.

[0029] With reference to Figure 1 and Figure 3 , the pressure unit 20 includes a pressure piece 21, the part of the pressure piece 21 in contact with the wafer thinning sheet is a plane, and the pressure piece 21 has a support rod connecting part (not shown in the figure).

[0030] With reference to Figure 1 and Figure 3 , the lifting unit 30 includes a support piece 31 and a driving piece 32, the support piece 31 includes a support rod, one end of the support rod is used to butt joint with the support rod connecting part, the other end of the support rod is fixedly connected with the driving piece 32, and the driving piece 32 is used to drive the support rod to move in the vertical direction, when the support rod moves upward to butt joint with the support rod connecting part, the support rod lifts the support rod connecting part.

[0031] With reference to Figure 3 , the pressure piece 21 is in the shape of a ring.

[0032] In some embodiments, the support rod connecting part is a hole structure, after one end of the support rod is inserted into the hole structure, the support rod connecting part and the support rod are relatively fixed, the support rod moves vertically upward, thereby driving the pressure piece to rise; when the support rod moves vertically downward, driving the pressure piece to descend, the pressure piece cannot continue to descend after contacting the wafer thinning sheet, and then one end of the support rod is separated from the support rod connecting part.

[0033] With reference to Figure 2 , Figure 3 and Figure 4 , the pressure unit 20 comprises a pressure piece 21 and a connecting piece 22, the part of the pressure piece 21 in contact with the wafer thinning sheet is a plane, and the side of the pressure piece 21 away from the wafer thinning sheet is fixedly connected with the connecting piece 22. Wherein, the part of the pressure piece 21 in contact with the wafer thinning sheet is a plane, which can ensure the pressure applied to the wafer thinning sheet while avoiding damaging the upper surface of the wafer thinning sheet.

[0034] With reference to Figure 2 , Figure 3 and Figure 4 , the pressure piece 21 and the connecting piece 22 are both circular rings, the central axis of the pressure piece 21 is collinear with the central axis of the connecting piece 22, the inner diameter R1 of the pressure piece 21 is equal to the inner diameter R3 of the connecting piece, and the outer diameter R2 of the connecting piece 22 is greater than the outer diameter R4 of the pressure piece.

[0035] In some embodiments, the inner diameter of the pressure piece is smaller than the inner diameter of the connecting piece, and the outer diameter of the connecting piece is greater than the outer diameter of the pressure piece.

[0036] In some embodiments, the pressure piece and the connecting piece are integrally formed, and the materials of the pressure piece and the connecting piece are high-temperature-resistant and corrosion-resistant materials such as silicon, silicon dioxide, silicon carbide, and ceramics.

[0037] In some embodiments, the pressure unit further comprises a counterweight piece, the counterweight piece comprises a plurality of counterweight blocks, and the plurality of counterweight blocks are detachably fixedly connected with the connecting piece. By adjusting the number of the counterweight blocks, the overall weight of the pressure unit can be changed. Wherein, changing the overall weight of the pressure unit can adapt to wafer thinning sheets of different thicknesses.

[0038] In some embodiments, the connecting piece is provided with a plurality of grooves at equal intervals around the central axis, the grooves are provided with internal threads, the counterweight blocks are provided with external threads, and the detachable fixed connection between the connecting piece and the counterweight blocks is realized through the internal threads and the external threads.

[0039] In yet another embodiment, the connecting piece comprises a box body and a box cover, the box body and the box cover are threadedly sealed, and the plurality of counterweight blocks are detachably fixed in the box body.

[0040] In some embodiments, a plurality of grooves are provided in the box body, the grooves are provided with internal threads, the counterweight blocks are provided with external threads, and the detachable fixed connection between the connecting piece and the counterweight blocks is realized through the internal threads and the external threads.

[0041] The counterweight is arranged in the box body, the box body is threadedly connected with the box cover, gaps at various positions of the connecting piece can be reduced, and the accumulation of reactants and products at the gaps can be avoided, thereby reducing the influence on subsequent processes.

[0042] With reference to Figure 1 , Figure 3 , Figure 4 and Figure 5 , the lifting unit 30 comprises a support member 31 and a driving member 32, the support member 31 comprises a support rod 311 and a ring-shaped holder 312, one end of the support rod 311 is fixedly connected with an outer edge of the ring-shaped holder 312, an inner diameter R5 of the ring-shaped holder 312 is greater than an outer diameter R2 of the pressure member 21, the inner diameter R5 of the ring-shaped holder 312 is less than an outer diameter R4 of the connecting piece 22, and the other end of the support rod 311 is fixedly connected with the driving member 32, and the driving member 32 is used to drive the support rod 311 to move in the vertical direction.

[0043] In some embodiments, the driving member comprises but is not limited to a pneumatic cylinder, an electric cylinder, a linear motor and a piezoelectric ceramic drive.

[0044] With reference to Figure 1 , Figure 2 and Figure 5 , when the driving member 32 drives the support rod to rise, the ring-shaped holder rises under the driving of the support rod, the ring-shaped holder is then sleeved on the outer side of the pressure member 21, until the upper surface of the ring-shaped holder is in contact with the lower surface of the connecting piece 22, and the ring-shaped holder continues to rise, and the ring-shaped holder drives the pressure member 21 and the connecting piece 22 to rise.

[0045] With reference to Figure 1 , Figure 2 and Figure 5 , when the driving member 32 drives the support rod to descend, the ring-shaped holder descends under the driving of the support rod, when the lower surface of the pressure member 21 is in contact with the upper surface of the edge of the wafer thinning sheet 40, the ring-shaped holder continues to descend, the pressure member 21 stops descending due to being blocked by the wafer thinning sheet 40, and the upper surface of the ring-shaped holder is out of contact with the lower surface of the connecting piece 22.

[0046] With reference to Figure 1 , a plurality of needle hole grooves 11 with upper surfaces and lower surfaces are arranged on the support unit 10, a lifting needle 12 is arranged in each needle hole groove 11, the bottom of the lifting needle 12 is fixedly connected with the driving member 32, and the driving member 32 drives the lifting needle 12 to move in the vertical direction, that is, the driving member 32 drives the lifting needle 12 to move along the needle hole groove 11.

[0047] In some embodiments, the upper surface of the support unit is circular, the distances from the needle hole grooves to the center of the support unit are the same, and the distances between adjacent needle hole grooves are the same.

[0048] Referring to Figure 6 , the upper surface of the support unit 10 is circular, and the distances from the three needle hole grooves 11 to the center of the support unit 10 are the same, and the distances between the three needle hole grooves 11 are the same.

[0049] Referring to Figure 1 , the wafer thinning piece degumming base further comprises a limiting unit arranged on the support unit for limiting the position of the wafer thinning piece.

[0050] In some embodiments, the limiting unit comprises at least three limiting pieces arranged on the wafer thinning piece supporting surface of the support unit.

[0051] Referring to Figure 6 , for example, the three limiting pieces 121 have the same distance to the center of the support unit 10.

[0052] Referring to FIG. 6, the distance from the limiting piece 121 to the center of the support unit 10 is greater than the distance from the needle hole groove 11 to the center of the support unit 10. The distance from the limiting piece 121 to the center of the support unit 10 is equal to or slightly greater than the radius of the wafer thinning piece, which can limit the position of the wafer thinning piece and avoid position deviation of the wafer thinning piece.

[0053] In some embodiments, the limiting piece comprises a column and a conical head, one bottom surface of the column is fixedly connected with the bottom surface of the conical head, and the other bottom surface of the column is fixedly connected with the wafer thinning piece supporting surface of the support unit. The conical head can adapt to the edge of the wafer thinning piece that is raised, and when the edge of the wafer thinning piece recovers under the gravity of the pressure piece, it is convenient for the edge of the wafer thinning piece to slide along the side surface of the conical head, thereby reducing the influence of the column head on the recovery deformation of the wafer thinning piece.

[0054] In some embodiments, the column comprises a movable inner column and a fixed outer column, an axial through hole is formed in the fixed outer column, the movable inner column has a shape that is adapted to the shape of the axial through hole, at least part of the movable inner column is accommodated in the axial through hole, and the movable inner column and the axial through hole are in precise sliding connection.

[0055] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made to the embodiments without departing from the scope and spirit of the application, as described in the claims. Moreover, the application described is not limited in its application to the details set forth in the description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or carried out in various ways.

Claims

1. A wafer thinning and debonding base, characterized in that: include: A supporting unit, used for supporting and heating the wafer thinning sheet to be debonded; a pressure unit, disposed above the support unit, for applying a downward force to the upper edge surface of the wafer thinning sheet under the action of gravity; as well as, a lifting unit, fixedly connected to the bottom surface or side surface of the supporting unit, and used to support the pressure unit to move in the vertical direction; Wherein, when the lifting unit supports the pressure unit to move downward, after the pressure unit contacts the upper surface of the wafer thinning sheet, the lifting unit is disengaged from the pressure unit.

2. The wafer thinning and debonding base according to claim 1, characterized in that: The pressure unit includes a pressure piece and a connecting piece. The portion of the pressure piece that contacts the wafer thinning sheet is a plane. The surface of the pressure piece that faces away from the wafer thinning sheet is fixedly connected to the connecting piece.

3. The wafer thinning and debonding base according to claim 2, characterized in that: The pressure piece and the connecting piece are both annular, the central axis of the pressure piece is collinear with the central axis of the connecting piece, the inner diameter of the pressure piece is smaller than or equal to the inner diameter of the connecting piece, and the outer diameter of the connecting piece is larger than the outer diameter of the pressure piece.

4. The wafer thinning and debonding base according to claim 2 or 3, characterized in that: The pressure unit further comprises a counterweight component, which comprises a plurality of counterweight blocks. The plurality of counterweight blocks are detachably and fixedly connected to the connecting component. By adjusting the number of the counterweight blocks, the overall weight of the pressure unit can be changed.

5. The wafer thinning and debonding base according to claim 4, characterized in that: The connecting member includes a box body and a box cover, the box body and the box cover are threaded and sealed, and a plurality of the counterweight blocks are detachably fixed in the box body.

6. The wafer thinning and debonding base according to claim 3, characterized in that: The lifting unit includes a support member and a driving member, the support member includes a support rod and an annular support, one end of the support rod is fixedly connected to the outer edge of the annular support, the inner diameter of the annular support is larger than the outer diameter of the pressure member, and the inner diameter of the annular support is smaller than the outer diameter of the connecting member, the other end of the support rod is fixedly connected to the driving member, and the driving member is used to drive the support rod to move in the vertical direction.

7. The wafer thinning and debonding base according to claim 1, characterized in that: The pressure unit includes a pressure piece, a portion of the pressure piece that contacts the wafer thinning sheet is a plane, and the pressure piece has a support rod connecting portion.

8. The wafer thinning and debonding base according to claim 7, characterized in that: The lifting unit includes a support member and a driving member. The support member includes a support rod. One end of the support rod is used to dock with the support rod connecting part, and the other end of the support rod is fixedly connected to the driving member. The driving member is used to drive the support rod to move in the vertical direction. When the support rod moves upward and docks with the support rod connecting part, the support rod lifts the support rod connecting part.

9. The wafer thinning and debonding base according to claim 1, characterized in that: It also includes a limiting unit, which is arranged on the supporting unit and is used to limit the position of the wafer thinning sheet.

10. The wafer thinning and debonding base according to claim 9, characterized in that: The limiting unit includes at least three limiting members, and the limiting members are arranged on the wafer thinning support surface of the supporting unit.

11. The wafer thinning and debonding base according to claim 10, characterized in that: The limiting member includes a column and a conical head, one bottom surface of the column is fixedly connected to the bottom surface of the conical head, and the other bottom surface of the column is fixedly connected to the wafer thinning sheet supporting surface of the supporting unit.

12. The wafer thinning and debonding base according to claim 11, characterized in that: The column includes a movable inner column and a fixed outer column. An axial through hole is opened inside the fixed outer column. The shape of the movable inner column is adapted to the shape of the axial through hole. At least part of the movable inner column is accommodated in the axial through hole, and the movable inner column and the axial through hole are precisely slidably connected.

13. A semiconductor device, characterized in that: It comprises the wafer thinning and debonding base as described in any one of claims 1 to 12.

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