Automatic chip tray turning device

Abstract

The invention relates to the technical field of semiconductor device manufacturing, in particular to an automatic chip tray overturning device which comprises a base, a rolling shaft, a roller, a splitting piece and a driving module. The tray overturning module is used for overturning a first test assembly formed by the mounting plate clamped with the to-be-tested chip and the first supporting plate; a second supporting plate is placed on the base in advance; the driving module is fixedly connected with the base; the driving module is in transmission connection with the rolling shaft; the roller is rotationally connected with the rolling shaft; the splitting piece is fixedly connected with the rolling shaft; in the process that the driving module drives the rolling shaft to move, the mounting plate is connected with the second supporting plate through the roller, and the mounting plate is separated from the first supporting plate through the splitting piece, so that the mounting plate and the second supporting plate are combined into a second testing combination body. According to the invention, the chip can be automatically turned over in the test process through the automatic chip turning device, so that the time waste of manual operation is avoided, and the chip turning efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device manufacturing, and particularly to a chip automatic turnover device. BACKGROUND

[0002] In the process of chip manufacturing, the electrical performance of both sides of the chip usually needs to be tested. Generally, the chip is placed in a tray for testing, and then turned over to test the other side after one side is finished.

[0003] The tray design in the prior art is composed of two parts, an upper tray and a lower tray, which are coupled to be turned over. However, since the chip is embedded in the mounting groove of the upper tray before being turned over, in order to prevent the chip from being offset due to shaking during the turning process, the chip is often tightly clamped in the mounting groove, and after being turned over, the chip is difficult to smoothly enter the mounting groove of the lower tray.

[0004] The current solution is to manually push the chip out of the mounting groove through the hole on the back of the upper tray, but this process not only wastes time, but also may cause damage to the chip during the pushing process. SUMMARY

[0005] To solve the above technical problems of the prior art, the present application provides a chip automatic turnover device: The present application provides a chip automatic turnover device, comprising a turnover module, a base, a roller shaft, a roller, a split piece and a driving module; The turnover module is used to turn over a first test combination formed by the mounting plate clamping the chip to be tested and the first support plate; after the electrical performance test of a certain side of the chip to be tested is completed using the first test combination formed by the mounting plate and the first support plate, the first test combination is placed in the base after being turned over; The base is pre-placed with a second support plate; The driving module is fixedly connected with the base; The driving module is in transmission connection with the roller shaft; The roller is in rotational connection with the roller shaft; The split piece is fixedly connected with the roller shaft; The roller shaft can move along the placement plane of the mounting plate; During the movement of the roller shaft driven by the driving module, the roller connects the mounting plate with the second support plate, and the split piece separates the mounting plate from the first support plate, so that the mounting plate and the second support plate are combined into a second test combination.

[0006] The beneficial effects of the present application are embodied in that the chip automatic turnover device realizes automatic turnover of the chip in the test process, avoids time waste of manual operation, improves the chip turnover efficiency, the chip is placed in the mounting plate, the whole process does not need to be taken out, the first test assembly formed by the mounting plate and the first support plate can be separated from the first support plate after completing the electrical performance test of one side of the chip to be tested, and the mounting plate and the second support plate are combined into a second test assembly to test the other side of the chip to be tested, the whole process does not need to contact the chip body, avoids damage of the chip in the turnover process, and effectively guarantees the safety of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0007] Fig. 1 The whole schematic view of the chip automatic turnover device provided by the present application.

[0008] Fig. 2 The structural schematic view of the chip automatic turnover device provided by the present application.

[0009] Fig. 3 The structural schematic view of the chip automatic turnover device provided by the present application from another perspective.

[0010] Fig. 4 The structural schematic view of the test assembly provided by the present application.

[0011] Fig. 5 The partial structural schematic view of the test assembly provided by the present application.

[0012] Fig. 6 The structural schematic view of the mounting plate provided by the present application.

[0013] Fig. 7 The structural schematic view of the first support plate provided by the present application.

[0014] Fig. 1 is a base; 101 is a limiting groove; 2 is a roller; 3 is a roller; 301 is a pressing protrusion; 4 is a split part; 5 is a driving module; 6 is a mounting plate; 601 is a mounting groove; 602 is a connecting protrusion; 603 is a split guiding surface; 71 is a first support plate; 701 is a connecting groove; 72 is a second support plate; 8 is a bevel alignment part; 9 is a turnover module. DETAILED DESCRIPTION

[0015] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0016] Reference is made to the drawings attached Figs. 1 to 7 The chip automatic turnover device provided by the embodiments of the present application comprises a turnover module 9, a base 1, a roller shaft 2, a roller 3, a disassembly part 4 and a driving module 5.

[0017] The turnover module 9 is used to turn over the first test combination formed by the mounting plate 6 clamped with the chip to be tested and the first support plate.

[0018] Optionally, after the first test combination completes the electrical performance test of a certain surface of the chip to be tested, the first test combination is turned over by the turnover module 9 and then placed in the base 1. Further, the second support plate 72 can be placed in the base 1 in advance, so as to prepare for the next turnover test.

[0019] Optionally, the turnover module 9 can adopt a mechanical hand, a rotating shaft turnover mechanism, a connecting rod turnover mechanism, etc. The specific structure of the turnover module 9 is not limited in the present application.

[0020] The driving module 5 is fixedly connected with the base 1. The roller shaft 2 is one of the core components of the chip automatic turnover device. The driving module 5 is in transmission connection with the roller shaft 2. The roller 3 is in rotation connection with the roller shaft 2. The disassembly part 4 is fixedly connected with the roller shaft 2. The roller shaft 2 can move along the placing plane of the mounting plate 6. In the process that the driving module 5 drives the roller shaft 2 to move, the roller 3 first firmly connects the mounting plate 6 with the second support plate 72, and at the same time, the disassembly part 4 separates the mounting plate 6 from the first support plate 71. At this time, the mounting plate 6 and the second support plate 72 are combined to form a second test combination, so as to test the electrical performance of the other surface of the chip to be tested.

[0021] Optionally, after the first test combination completes the electrical performance test of a certain surface of the chip to be tested, the second test combination formed after the chip to be tested is turned over can facilitate the electrical performance test of the other surface.

[0022] Optionally, the driving module 5 adopts a motor to provide power and transmits power through a screw nut.

[0023] In the embodiment of the present application, the automatic chip turning device is used to realize the automatic turning of the chip during the testing process, which avoids the time waste of manual operation, improves the chip turning efficiency, and the chip is placed in the mounting plate 6, and the whole process does not need to be taken out. The first test assembly formed by the mounting plate 6 and the first support plate 71 is separated from the first support plate 71 after completing the electrical performance test of one side of the chip to be tested, and the mounting plate 6 is combined with the second support plate 72 to form a second test assembly to test the electrical performance of the other side of the chip to be tested. The whole process does not need to touch the chip body, avoids the damage of the chip during the turning process, and effectively protects the safety of the chip.

[0024] In a possible implementation, the mounting plate 6 is provided with a plurality of mounting grooves 601, each of which is designed to clamp a single chip to be tested, and each chip to be tested is clamped in the mounting groove 601. These mounting grooves 601 can be customized according to the size, shape and testing requirements of the chip to ensure that the chip to be tested is firmly fixed in its position during the turning process, avoiding the displacement or damage of the chip due to the shaking or external force during the turning process. Each chip to be tested is accurately clamped into the corresponding mounting groove 601, ensuring that each chip can remain stable during the testing process, further improving the reliability of the test. Through the design of multiple mounting grooves, multiple chips to be tested can be accommodated on the same mounting plate 6, improving the work efficiency of the testing process and saving space.

[0025] In a possible implementation, the first support plate 71 and the second support plate 72 are used to avoid the contact between the chip to be tested and the test platform, so as to effectively avoid the damage of the chip surface caused by friction or compression and maintain the cleanliness of the chip surface. The first support plate 71 and the second support plate 72 are both in a hollow structure, and when the chip to be tested is installed on the first support plate 71 or the second support plate 72, the surface of the chip to be tested protrudes from the hollow structure. The hollow design exposes the chip surface completely, and the test needle can contact the pad without obstacles, thereby improving the test accuracy and stability. The front surface and the back surface of the mounting plate 6 are both provided with a connecting protrusion 602. The first support plate 71 and the second support plate 72 are provided with a connecting groove 701. The connecting protrusion 602 can be accurately matched with the connecting groove 701 on the first support plate 71 and the second support plate 72. When the connecting protrusion 602 of the mounting plate 6 is matched with the connecting groove 701 of the first support plate 71, the mounting plate 6 and the first support plate 71 are combined into a first test combination. When the connecting protrusion 602 of the mounting plate 6 is matched with the connecting groove 701 of the second support plate 72, the mounting plate 6 and the second support plate 72 are combined into a second test combination. The matching between the connecting protrusion 602 and the connecting groove 701 can firmly fix the mounting plate 6 and the support plate, effectively avoid the chip to be tested from falling off from the mounting groove 601 during the turning or testing process, and ensure that the chip is always in a stable state. At the same time, through the matching of the protrusion and the groove, the combination of the mounting plate 6 and the support plate becomes fast and accurate, simplifies the installation and disassembly steps in the testing process, and the operation is more efficient and convenient.

[0026] In a possible implementation, during the movement of the roller shaft 2, the roller 3 clamps the connecting protrusion 602 of the mounting plate 6 into the connecting groove 701 of the second support plate 72. This action not only ensures the firm combination between the mounting plate 6 and the second support plate 72, but also effectively completes the conversion from the first test combination to the second test combination. Through this matching, the mounting plate 6 and the second support plate 72 are stably connected, which ensures that the chip to be tested is always positioned stably during the subsequent chip turning and testing process.

[0027] In a possible implementation, the chip automatic flipping device further comprises a slope alignment piece 8. The slope alignment piece 8 is fixedly connected with the roller 2. The slope alignment piece 8 is provided with an outwardly expanding opening formed by a slope, and the first test combination can be smoothly placed into the base 1 along the opening after being flipped. This design can provide guidance during the flipping process, ensure that the connection between the mounting plate 6 and the second support plate 72 always remains stable, avoid deviations caused by inaccurate angles or positions, ensure the smooth progress of the chip flipping process, and reduce errors in the flipping process. The slope alignment piece 8 provides accurate guidance, making the chip flipping and placing more smooth and stable, thereby improving the automation level, reducing the error and damage risk, and optimizing the efficiency and safety of the entire test process.

[0028] In a possible implementation, the connecting groove 701 penetrates through the first support plate 71, and the roller 3 is provided with a pressing protrusion 301, which is clamped into the connecting groove 701 on the first support plate 71 during the movement of the roller 2. The cooperation between the pressing protrusion 301 and the connecting groove 701 improves the accuracy between the roller 2 and the first support plate 71, ensures the accurate connection of the mounting plate 6 and the first support plate 71, avoids errors during pressing, and makes the process of pressing the mounting plate 6 into the second support plate 72 more accurate and smooth.

[0029] In a possible implementation, the width of the pressing protrusion 301 is less than the width of the connecting groove 701. When the pressing protrusion 301 cooperates with the connecting groove 701, it can be clamped into the groove with a certain gap, rather than a complete tight fit. This gap design allows the pressing protrusion 301 to enter the connecting groove 701 more smoothly during the movement of the roller 2, reduces the resistance caused by too tight cooperation, and helps to fine-tune the cooperation angle to ensure the flexibility and stability of the connection during the flipping process.

[0030] In a possible implementation, the disassembling piece 4 is a rope or an iron bar. During the operation of the device, the disassembling piece 4 plays an important role. When the roller 2 moves, the rope or iron bar also moves, and after contacting the first support plate 71, the first support plate 71 is gradually separated from the mounting plate 6, completing the conversion from the first test combination to the second test combination. Using a rope or an iron bar as the disassembling piece 4 not only simplifies the operation process and improves the automation level, but also improves the safety, efficiency and accuracy of the entire test process, while ensuring the safety of the chip and the stable operation of the equipment.

[0031] In a possible implementation, the mounting plate 6 is provided with a split guide surface 603. The split guide surface 603 is designed to guide the split piece 4 to accurately enter the fitting wall surface between the mounting plate 6 and the first support plate 71 during operation. During the movement of the roller 2, the split piece 4 will enter the fitting wall surface between the mounting plate 6 and the first support plate 71 along the split guide surface 603, so as to separate the mounting plate 6 from the first support plate 71. This design ensures the smoothness and accuracy of the separation process, avoids unnecessary mechanical interference, and maintains the efficient operation of the equipment.

[0032] In a possible implementation, the base 1 is provided with a limiting groove 101. During the movement of the roller 2, the first test assembly is pushed into the limiting groove 101 to prevent the first test assembly from being tilted due to pressing. The limiting groove 101 provides a stable positioning point for the first test assembly. By effectively providing physical constraints, the first test assembly can be firmly fixed on the base, preventing tilting or errors during testing due to unstable position.

[0033] In the description of the embodiments of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "center", "top", "bottom", "top", "bottom", "inner", "outer", "inner side", "outer side" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. Among them, "inboard" refers to the interior or enclosed area or space. "Periphery" refers to the area around a particular component or a particular area.

[0034] In the description of the embodiments of the present application, the terms "first", "second", "third", "fourth" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0035] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mounting", "connected", "connection", "assembly" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium; can be internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0036] In the description of the embodiments of the present application, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0037] In the description of the embodiments of the present application, it should be understood that "-" and "~" represent the range of the same of two numerical values, and the range includes the end point. For example: "A-B" represents the range of greater than or equal to A, and less than or equal to B. "A~B" represents the range of greater than or equal to A, and less than or equal to B.

[0038] In the description of the embodiments of the present application, the term "and / or" herein is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents that the front and rear associated objects are in an "or" relationship.

[0039] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip automatic turning device, characterized in that: include: Turning plate module, base, roller, drum, split parts and driving module; The turning module is used to turn over the first test assembly formed by the mounting plate clamping the chip to be tested and the first support plate; A second support plate is pre-placed on the base; The driving module is fixedly connected to the base; The driving module is in transmission connection with the roller; The drum is rotatably connected to the roller; The split part is fixedly connected to the roller; The roller can move along the placement plane of the mounting plate; When the driving module drives the roller to move, the roller connects the mounting plate and the second support plate, and the splitter separates the mounting plate from the first support plate, so that the mounting plate and the second support plate are combined into a second test assembly.

2. The chip automatic turning device according to claim 1, characterized in that: The mounting plate is provided with a plurality of mounting slots, and each of the chips to be tested is engaged in the mounting slot.

3. The chip automatic turning device according to claim 1, characterized in that: The first supporting plate and the second supporting plate are used to prevent the chip to be tested from contacting the test platform; The first support plate and the second support plate both adopt a hollow structure, and when the chip to be tested is mounted on the first support plate or the second support plate, the surface of the chip to be tested protrudes from the hollow structure; The front and back surfaces of the mounting plate are both provided with connecting protrusions; The first support plate and the second support plate are provided with a connecting groove; By means of the engagement between the connection protrusion of the mounting plate and the connection groove of the first support plate, the mounting plate and the first support plate are combined into a first test assembly; The mounting plate and the second support plate are combined into a second test assembly by the cooperation between the connecting protrusion of the mounting plate and the connecting groove of the second support plate.

4. The chip automatic turning device according to claim 3, characterized in that: During the movement of the roller, the roller clamps the connecting protrusion of the mounting plate into the connecting groove of the second supporting plate.

5. The chip automatic turning device according to claim 1, characterized in that: Also includes: Bevel alignment piece; The inclined surface alignment member is fixedly connected to the roller; The sloped surface alignment member is provided with an outwardly expanding opening formed by a sloped surface, and the first test assembly is placed in the base along the opening after being turned over.

6. The automatic chip turning device according to claim 3, characterized in that: The connecting groove passes through the first supporting plate. A pressing protrusion is provided on the roller. During the movement of the roller, the pressing protrusion on the roller is clamped into the connecting groove on the first supporting plate.

7. The automatic chip turning device according to claim 6, characterized in that: The width of the pressing protrusion is smaller than the width of the connecting groove.

8. The automatic chip turning device according to claim 1, characterized in that: The split piece is specifically a rope or an iron bar.

9. The automatic chip turning device according to claim 1, characterized in that: A splitting guide surface is provided on the mounting plate; during the movement of the roller, the splitting piece will enter the wall surface between the mounting plate and the first support plate along the splitting guide surface to separate the mounting plate from the first support plate.

10. The automatic chip turning device according to claim 1, characterized in that: A limiting groove is provided on the base. During the movement of the roller, the first test assembly is pushed into the limiting groove to prevent the first test assembly from tilting due to being pressed.

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