A chip automatic flipping device

Abstract

This invention relates to the field of semiconductor device manufacturing technology, and in particular to an automatic chip flipping device, comprising: a base, a roller, a drum, a splitting component, and a drive module; the flipping module is used to flip a first test assembly formed by a mounting plate and a first support plate with a chip to be tested engaged; a second support plate is pre-placed on the base; the drive module is fixedly connected to the base; the drive module is drively connected to the roller; the drum is rotatably connected to the roller; the splitting component is fixedly connected to the roller; during the process of the drive module driving the roller to move, the drum connects the mounting plate and the second support plate, and the splitting component separates the mounting plate from the first support plate, so that the mounting plate and the second support plate combine to form a second test assembly. This invention can realize the automatic flipping of chips during the testing process through an automatic chip flipping device, avoiding the time wasted by manual operation and improving chip flipping efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, and in particular to an automatic chip flipping device. Background Technology

[0002] During chip manufacturing, it is usually necessary to test the electrical performance of both sides of the chip. This is typically done by placing the chip on a tray for testing, and then flipping it over to test the other side after one side has been tested.

[0003] Traditional tray designs consist of two parts, an upper tray and a lower tray, which are coupled together for flipping. However, since the chip is already fitted into the mounting slot of the upper tray before flipping, it is often tightly held in the mounting slot to prevent the chip from shifting during the flipping process. After flipping, the chip has difficulty smoothly entering the mounting slot of the lower tray.

[0004] The current solution is to manually poke the chip out of the mounting slot through the hole on the back of the upper support, but this process is not only time-consuming, but may also damage the chip during the poking process. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, the present invention provides an automatic chip flipping device:

[0006] This invention provides an automatic chip flipping device, comprising: a flipping module, a base, a roller, a drum, a splitting component, and a driving module;

[0007] The flipping module is used to flip the first test assembly formed by the mounting plate and the first support plate with the chip to be tested engaged; after the electrical performance test of one side of the chip to be tested is completed using the first test assembly formed by the mounting plate and the first support plate, the first test assembly is flipped and placed in the base.

[0008] A second support plate is pre-placed on the base;

[0009] The drive module is fixedly connected to the base;

[0010] The drive module is connected to the roller drive;

[0011] The roller is rotatably connected to the shaft.

[0012] The split component is fixedly connected to the roller;

[0013] The roller can move along the placement plane of the mounting plate;

[0014] During the process of the drive module driving the roller to move, the roller connects the mounting plate to the second support plate, and the splitting component separates the mounting plate from the first support plate, so that the mounting plate and the second support plate are combined to form a second test assembly.

[0015] The beneficial effects of this invention are reflected in the fact that the automatic chip flipping device realizes the automatic flipping of the chip during the testing process, avoiding the waste of time in manual operation, improving the chip flipping efficiency, and the chip is placed in the mounting plate without needing to be removed during the entire process. After the electrical performance test of one side of the chip to be tested is completed, the first test assembly formed by the mounting plate and the first support plate can be separated from the first support plate, and the mounting plate can be combined with the second support plate to form a second test assembly for electrical performance testing of the other side of the chip to be tested. The entire process does not require contact with the chip body, avoiding damage to the chip during the flipping process and effectively ensuring the safety of the chip. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an automatic chip flipping device provided by the present invention.

[0017] Figure 2 This is a schematic diagram of the structure of an automatic chip flipping device provided by the present invention.

[0018] Figure 3 This is a schematic diagram of the structure of an automatic chip flipping device provided by the present invention from another perspective.

[0019] Figure 4 This is a schematic diagram of the structure of a test assembly provided by the present invention.

[0020] Figure 5 This is a schematic diagram of a partial structure method for testing an assembly provided by the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of a mounting plate provided by the present invention.

[0022] Figure 7 This is a schematic diagram of the structure of a first support plate provided by the present invention.

[0023] Reference numerals: 1. Base; 101. Limiting groove; 2. Roller; 3. Drum; 301. Pressing protrusion; 4. Split piece; 5. Drive module; 6. Mounting plate; 601. Mounting groove; 602. Connecting protrusion; 603. Split guide surface; 71. First support plate; 701. Connecting groove; 72. Second support plate; 8. Sloping surface alignment piece; 9. Tilting module. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Reference manual attached Figures 1 to 7 An automatic chip flipping device provided in this embodiment of the invention includes: a flipping module 9, a base 1, a roller 2, a drum 3, a splitting component 4, and a drive module 5.

[0026] The flip module 9 is used to flip the first test assembly formed by the mounting plate 6 with the chip to be tested and the first support plate.

[0027] Optionally, after the electrical performance test of one side of the chip under test is completed in the first test assembly, the flipping module 9 can be used to flip the first test assembly and place it in the base 1. Furthermore, a second support plate 72 can be pre-placed on the base 1 to prepare for the next flipping test.

[0028] Optionally, the flipping module 9 can be a robotic arm, a rotary axis flipping mechanism, a linkage flipping mechanism, etc. The present invention does not limit the specific structural form of the flipping module 9.

[0029] The drive module 5 is fixedly connected to the base 1. The roller 2 is one of the core components of the automatic chip flipping device, and the drive module 5 is connected to the roller 2 via a transmission connection. The drum 3 is rotatably connected to the roller 2. The splitting component 4 is fixedly connected to the roller 2. The roller 2 can move along the placement plane of the mounting plate 6. During the movement of the roller 2 driven by the drive module 5, the drum 3 first firmly connects the mounting plate 6 to the second support plate 72, while the splitting component 4 separates the mounting plate 6 from the first support plate 71. At this point, the mounting plate 6 and the second support plate 72 combine to form the second test assembly for electrical performance testing of the other side of the chip to be tested.

[0030] Optionally, after the first test assembly completes the electrical performance test of one side of the chip under test, the second test assembly formed after the chip under test is flipped can facilitate the electrical performance test of the other side.

[0031] Optionally, the drive module 5 is powered by a motor and driven by a lead screw and nut.

[0032] In this embodiment of the invention, an automatic chip flipping device is used to automatically flip the chip during the testing process, avoiding the waste of time from manual operation and improving the chip flipping efficiency. The chip is placed in the mounting plate 6 and does not need to be removed during the entire process. After the electrical performance test of one side of the chip to be tested is completed, the first test assembly formed by the mounting plate 6 and the first support plate 71 can be separated from the first support plate 71, and the mounting plate 6 can be combined with the second support plate 72 to form a second test assembly for electrical performance testing of the other side of the chip to be tested. The entire process does not require contact with the chip body, avoiding damage to the chip during the flipping process and effectively ensuring the safety of the chip.

[0033] In one possible implementation, the mounting plate 6 is provided with multiple mounting slots 601, each slot 601 designed to engage a single chip under test (DUT), with each DUT engaged within its slot 601. These mounting slots 601 can be customized according to the chip's size, shape, and testing requirements to ensure the DUT is securely fixed in its position during flipping, preventing displacement or damage due to shaking or external forces during the flipping process. Each DUT is precisely engaged in its corresponding mounting slot 601, ensuring stability during testing and further improving test reliability. The multiple mounting slots allow for the simultaneous placement of multiple DUTs on the same mounting plate 6, improving testing efficiency and saving space.

[0034] In one possible implementation, the first support plate 71 and the second support plate 72 are used to prevent the chip under test from contacting the test platform, thereby effectively preventing damage to the chip surface from friction or pressure and maintaining the cleanliness of the chip surface. Both the first support plate 71 and the second support plate 72 adopt a hollow structure. When the chip under test is mounted on the first support plate 71 or the second support plate 72, the surface of the chip under test protrudes from the hollow structure. The hollow design fully exposes the chip surface, allowing the test probes to contact the pads without obstruction, improving test accuracy and stability. The mounting plate 6 has connecting protrusions 602 on both its front and back sides. The first support plate 71 and the second support plate 72 have connecting grooves 701. The connecting protrusions 602 can precisely mate with the connecting grooves 701 on the first support plate 71 and the second support plate 72. When the connecting protrusions 602 of the mounting plate 6 mate with the connecting grooves 701 of the first support plate 71, the mounting plate 6 and the first support plate 71 are combined to form a first test assembly. When the connecting protrusion 602 of the mounting plate 6 engages with the connecting groove 701 of the second support plate 72, the mounting plate 6 and the second support plate 72 are combined to form the second test assembly. The engagement between the connecting protrusion 602 and the connecting groove 701 firmly secures the mounting plate 6 and the support plate, effectively preventing the chip under test from falling out of the mounting groove 601 during flipping or testing, ensuring that the chip remains stable. Simultaneously, the engagement of the protrusion and groove allows for quick and precise assembly of the mounting plate 6 and the support plate, simplifying the installation and disassembly steps during testing and making the operation more efficient and convenient.

[0035] In one possible implementation, as the roller 2 moves, the roller 3 engages the connecting protrusion 602 of the mounting plate 6 with the connecting groove 701 of the second support plate 72. This action not only ensures a secure connection between the mounting plate 6 and the second support plate 72, but also effectively completes the transition from the first test assembly to the second test assembly. Through this cooperation, the mounting plate 6 and the second support plate 72 are stably connected, ensuring that the chip under test remains firmly positioned during subsequent chip flipping and testing.

[0036] In one possible implementation, the automatic chip flipping device further includes a bevel alignment member 8. The bevel alignment member 8 is fixedly connected to the roller 2. The bevel alignment member 8 has an outwardly expanding opening formed by the bevel, a clever design that allows the first test assembly to be smoothly placed into the base 1 along the opening after being flipped. This design provides guidance during the flipping process, ensuring that the connection between the mounting plate 6 and the second support plate 72 remains stable, avoiding deviations caused by inaccurate angles or positions, ensuring the smooth progress of the chip flipping process, and reducing errors during the flipping process. By providing precise guidance, the bevel alignment member 8 makes chip flipping and placement smoother and more stable, thereby improving the level of automation, reducing errors and damage risks, and optimizing the efficiency and safety of the entire testing process.

[0037] In one possible implementation, the connecting groove 701 penetrates the first support plate 71, and the roller 3 is provided with a pressing protrusion 301. During the movement of the roller 2, the pressing protrusion 301 on the roller 3 engages with the connecting groove 701 on the first support plate 71. The cooperation between the pressing protrusion 301 and the connecting groove 701 improves the accuracy between the roller 2 and the first support plate 71, ensuring that the connection between the mounting plate 6 and the first support plate 71 is accurate and error-free, avoiding errors during the pressing process, and making the process of pressing the mounting plate 6 into the second support plate 72 more precise and smooth.

[0038] In one possible implementation, the width of the pressing protrusion 301 is smaller than the width of the connecting groove 701. This allows the pressing protrusion 301 to engage with the connecting groove 701 with a certain gap, rather than a completely tight fit. This gap design allows the pressing protrusion 301 to enter the connecting groove 701 more smoothly during the movement of the roller 2, reducing resistance caused by an overly tight fit, and facilitating fine-tuning of the engagement angle to ensure the flexibility and stability of the connection during flipping.

[0039] In one possible implementation, the splitting component 4 is specifically a rope or iron bar. During device operation, the splitting component 4 plays a crucial role. As the roller 2 moves, the rope or iron bar also moves, gradually separating the first support plate 71 from the mounting plate 6 after contacting it, thus completing the transition from the first test assembly to the second test assembly. Using a rope or iron bar as the splitting component 4 not only simplifies the operation process and improves the level of automation, but also enhances the safety, efficiency, and accuracy of the overall testing process, while ensuring the safety of the chip and the stable operation of the equipment.

[0040] In one possible implementation, the mounting plate 6 is provided with a splitting guide surface 603. The splitting guide surface 603 is designed to guide the splitting component 4 accurately into the mating wall between the mounting plate 6 and the first support plate 71 during operation. As the roller 2 moves, the splitting component 4 will enter the mating wall between the mounting plate 6 and the first support plate 71 along the splitting guide surface 603, thereby separating the mounting plate 6 from the first support plate 71. This design ensures the smoothness and accuracy of the separation process, avoids unnecessary mechanical interference, and maintains the efficient operation of the equipment.

[0041] In one possible implementation, a limiting groove 101 is provided on the base 1. During the movement of the roller 2, the first test assembly is pushed into the limiting groove 101 to prevent the first test assembly from tilting due to pressure. The limiting groove 101 provides a stable positioning point for the first test assembly. By effectively providing physical constraints, the limiting groove 101 ensures that the first test assembly is firmly fixed on the base, preventing flipping or errors during the testing process due to unstable positioning.

[0042] In the description of the embodiments of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "center," "top," "bottom," "top," "bottom," "inner," "outer," "inner side," and "outer side," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. "Inner side" refers to the interior or enclosed area or space. "Outer perimeter" refers to the area surrounding a specific component or specific area.

[0043] In the description of embodiments of the present invention, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise stated, "a plurality of" means two or more.

[0044] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "assembly" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0045] In the description of embodiments of the present invention, specific features, structures, materials or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0046] In the description of the embodiments of the present invention, it should be understood that "-" and "~" represent a range of two numerical values, and this range includes the endpoints. For example, "AB" represents a range greater than or equal to A and less than or equal to B. "A~B" represents a range greater than or equal to A and less than or equal to B.

[0047] In the description of embodiments of the present invention, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip automatic flipping device, characterized in that, include: The tilting module, base, rollers, drum, split components, and drive module; The flipping module is used to flip the first test assembly formed by the mounting plate and the first support plate that hold the chip to be tested. A second support plate is pre-placed on the base; The drive module is fixedly connected to the base; The drive module is connected to the roller drive; The roller is rotatably connected to the shaft. The split component is fixedly connected to the roller. The roller can move along the placement plane of the mounting plate; During the process of the drive module driving the roller to move, the roller connects the mounting plate to the second support plate, and the splitting component separates the mounting plate from the first support plate, so that the mounting plate and the second support plate are combined to form a second test assembly.

2. The chip automatic flipping device according to claim 1, characterized in that, The mounting plate is provided with multiple mounting slots, and each of the chips to be tested is engaged in the mounting slots.

3. The chip automatic flipping device according to claim 1, characterized in that, The first support plate and the second support plate are used to prevent the chip under test from contacting the test platform; Both the first support plate and the second support plate adopt a hollow structure. When the chip to be tested is installed on the first support plate or the second support plate, the surface of the chip to be tested protrudes from the hollow structure. The mounting plate has connecting protrusions on both the front and back sides; The first support plate and the second support plate are provided with connecting grooves; The mounting plate and the first support plate are combined into a first test assembly by the cooperation between the connecting protrusion of the mounting plate and the connecting groove of the first support plate. The mounting plate and the second support plate are combined to form a second test assembly by the cooperation between the connecting protrusion of the mounting plate and the connecting groove of the second support plate.

4. The chip automatic flipping device according to claim 3, characterized in that, During the movement of the roller, the roller engages the connecting protrusion of the mounting plate with the connecting groove of the second support plate.

5. The chip automatic flipping device according to claim 1, characterized in that, Also includes: Align the beveled surfaces; The inclined surface alignment component is fixedly connected to the roller; The inclined alignment member is provided with an outwardly expanding opening formed by the inclined surface, and the first test assembly is placed into the base along the opening after being flipped over.

6. The chip automatic flipping device according to claim 3, characterized in that, The connecting groove penetrates through the first support plate, and the roller is provided with a pressing protrusion. During the movement of the roller, the pressing protrusion on the roller engages with the connecting groove on the first support plate.

7. The chip automatic flipping device according to claim 6, characterized in that, The width of the pressing protrusion is smaller than the width of the connecting groove.

8. The chip automatic flipping device according to claim 1, characterized in that, The disassembly component is specifically a rope or an iron bar.

9. The chip automatic flipping device according to claim 1, characterized in that, The mounting plate is provided with a splitting guide surface; during the movement of the roller, the splitting component will enter the wall surface that is attached between the mounting plate and the first support plate along the splitting guide surface, so as to separate the mounting plate from the first support plate.

10. The chip automatic flipping device according to claim 1, characterized in that, The base is provided with a limiting groove. During the movement of the roller, the first test assembly is pushed into the limiting groove to prevent the first test assembly from being lifted up due to pressure.

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