Electrostatic chuck mounting device and mounting method

Abstract

The electrostatic chuck mounting device is used for mounting an electrostatic chuck, the electrostatic chuck comprises a substrate and a ceramic disc, a bonding layer is arranged between the substrate and the ceramic disc, the electrostatic chuck mounting device comprises a substrate fixing mechanism, a pressing mechanism and a heating mechanism, and the substrate is connected with the substrate fixing mechanism through a magnetic adsorption assembly. A locking assembly is arranged on the base plate fixing mechanism and can lock the base plate. The pressing mechanism comprises a pressing block and a driving assembly connected with the pressing block, the driving assembly can drive the pressing block to move, the bottom face of the pressing block is parallel to the top face of the ceramic disc, and the pressing block is configured to be capable of being pressed on the upper surface of the ceramic disc so as to provide preset pressure; the heating mechanism can heat and cure the bonding layer. According to the electrostatic chuck mounting device, rapid positioning of the base plate can be achieved, the flatness of the ceramic disc can be guaranteed through the arrangement of the pressing block, and the mounting efficiency of the electrostatic chuck can be improved. In addition, the embodiment of the invention further discloses an electrostatic chuck installation method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electrostatic chucking, and more particularly to an electrostatic chuck mounting device and a mounting method. BACKGROUND

[0002] The electrostatic chucking technology of an electrostatic chuck is widely used in the fields of semiconductor wafer etching and optics. The electrostatic chuck is composed of a substrate and a ceramic disc, and the substrate and the ceramic disc are bonded by glue. The existing electrostatic chuck mounting device cannot be compatible with electrostatic chucks of different sizes and shapes, and the electrostatic chuck mounting device needs to be frequently replaced, resulting in low production efficiency. Meanwhile, the existing electrostatic chuck mounting device relies on manual adjustment, which is inefficient and prone to errors.

[0003] Therefore, how to improve the mounting efficiency of the electrostatic chuck has become a technical problem to be solved by the technical personnel in the field. SUMMARY

[0004] Therefore, the present application aims to provide an electrostatic chuck mounting device to improve the mounting efficiency of the electrostatic chuck.

[0005] Another core of the present application is to provide a mounting method for mounting an electrostatic chuck by using the above electrostatic chuck mounting device.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0007] An electrostatic chuck mounting device is used for mounting an electrostatic chuck, the electrostatic chuck includes a substrate and a ceramic disc, and an adhesive layer is arranged between the substrate and the ceramic disc. The electrostatic chuck mounting device includes:

[0008] A substrate fixing mechanism, the substrate is connected with the substrate fixing mechanism through a magnetic adsorption assembly, a locking assembly is arranged on the substrate fixing mechanism, and the locking assembly can lock the substrate;

[0009] A pressing mechanism, the pressing mechanism includes a pressing block and a driving assembly connected with the pressing block, the driving assembly can drive the pressing block to move, the bottom surface of the pressing block is parallel to the top surface of the ceramic disc, and the pressing block is configured to be pressed on the upper surface of the ceramic disc to provide a preset pressure;

[0010] A heating mechanism, the heating mechanism can heat and solidify the adhesive layer.

[0011] Optionally, in the electrostatic chuck mounting device, the magnetic attraction assembly comprises a first magnetic member and a second magnetic member, the first magnetic member is arranged on the substrate fixing mechanism, the second magnetic member is arranged on the substrate, and the first magnetic member and the second magnetic member can generate an attractive force when they are close to each other, so that the substrate fixing mechanism and the substrate are detachably connected.

[0012] Optionally, in the electrostatic chuck mounting device, the locking assembly comprises a plurality of locking members arranged along the circumference of the substrate, each locking member is in sliding fit with the substrate fixing mechanism, and each locking member can move towards the center of the substrate fixing mechanism.

[0013] Optionally, in the electrostatic chuck mounting device, the locking member comprises a locking member body and a locking portion arranged on the top of the locking member body, the locking member body is in sliding fit with the substrate fixing mechanism, an elastic reset member is arranged between the locking portion and the locking member body, and the locking member body and the locking portion are connected by a fastener.

[0014] Optionally, in the electrostatic chuck mounting device, the locking member is a pneumatic locking member, the locking member comprises a locking member body and a bent portion, a piston and a piston rod connected with the piston are arranged in the locking member body, a sealing cavity is arranged on the side of the piston away from the piston rod, the piston rod is connected with the bent portion, and the sealing cavity can be connected with an external air source.

[0015] Optionally, in the electrostatic chuck mounting device, the driving assembly comprises a first driving portion, a second driving portion and a third driving portion, the second driving portion is arranged on the first driving portion, the third driving portion is arranged on the second driving portion, the pressing block is arranged on the third driving portion, the first driving portion can drive the pressing block to move in a first direction, the second driving portion can drive the pressing block to move in a second direction, the third driving portion can drive the pressing block to move in a third direction, and any two of the first direction, the second direction and the third direction are perpendicular to each other.

[0016] Optionally, in the electrostatic chuck mounting device, the heating mechanism comprises a heating block, and the heating block is connected with the substrate.

[0017] Optionally, in the electrostatic chuck mounting device, the electrostatic chuck mounting device comprises a vacuum pumping mechanism, the pressing block is arranged on a first shell, the substrate fixing mechanism is arranged on a second shell, when the pressing block is pressed on the ceramic disc, the first shell can be connected with the second shell to form a cavity, and the vacuum pumping mechanism is connected with the cavity.

[0018] An electrostatic chuck mounting method using the electrostatic chuck mounting device, comprising the steps of:

[0019] Fixing the substrate, connecting the substrate to the substrate fixing mechanism through the magnetic adsorption assembly, and locking the substrate through the locking assembly;

[0020] Gluing, gluing on one side of the substrate to form an adhesive layer;

[0021] Fixing the ceramic disc, placing the ceramic disc on the adhesive layer, connecting the ceramic disc and the substrate through the fixing assembly, and forming the initial structure of the electrostatic chuck;

[0022] Pressing the block against the ceramic disc, starting the driving assembly to press the block against the ceramic disc to provide a predetermined pressure;

[0023] Heating and curing the adhesive layer, the heating mechanism heats the initial structure of the electrostatic chuck to cure the adhesive layer, and the curing is completed to form the electrostatic chuck.

[0024] Optionally, in the electrostatic chuck mounting method, the step of pressing the block against the ceramic disc is followed by the step of vacuumizing, and the cavity containing the initial structure of the electrostatic chuck is vacuumized through the vacuumizing mechanism.

[0025] As can be seen from the above scheme, the electrostatic chuck mounting device disclosed in the present application can realize rapid positioning and reduce the time for manual alignment. Meanwhile, the substrate fixing mechanism can adapt to substrates of different sizes and shapes, and can adapt to the installation requirements of electrostatic chucks of different shapes and sizes, without the need for frequent replacement of the substrate fixing mechanism, thereby improving the installation efficiency of the electrostatic chuck. The driving assembly drives the block to translate so that the block is pressed against the ceramic disc. The arrangement of the block can ensure the flatness of the ceramic disc, and the arrangement of the driving assembly can improve the degree of automation and reduce labor, thereby improving the installation efficiency of the electrostatic chuck. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 The structure diagram of the electrostatic chuck mounting device disclosed in the embodiments of the present application;

[0028] Figure 2Partial structure diagram of electrostatic chuck mounting device disclosed by embodiments of the present application Figure One ;

[0029] Figure 3 Partial structure diagram of electrostatic chuck mounting device disclosed by embodiments of the present application Figure Two ;

[0030] Figure 4 Schematic diagram of substrate fixing mechanism and heating mechanism disclosed by embodiments of the present application Figure One ;

[0031] Figure 5 Schematic diagram of substrate fixing mechanism and heating mechanism disclosed by embodiments of the present application Figure Two ;

[0032] Figure 6 Schematic diagram of substrate fixing mechanism and heating mechanism disclosed by embodiments of the present application Figure Three ;

[0033] Figure 7 Structure schematic diagram of locking member disclosed by embodiments of the present application

[0034] Figure 8 Flow chart of electrostatic chuck mounting method disclosed by embodiments of the present application

[0035] Wherein, 100 is an electrostatic chuck, 110 is a substrate, 120 is a ceramic disc, and 121 is a first positioning hole.

[0036] 10 is a substrate fixing mechanism, and 11 is a sliding groove.

[0037] 20 is a locking assembly, 21 is a locking member, 211 is a locking member body, and 212 is a locking portion.

[0038] 30 is a pressing block.

[0039] 40 is a heating block.

[0040] 50 is a driving assembly.

[0041] 60 is a ceramic block.

[0042] 70 is a first shell, and 80 is a second shell. DETAILED DESCRIPTION

[0043] The core of the present application is to disclose an electrostatic chuck mounting device to improve the installation efficiency of the electrostatic chuck.

[0044] Another core of the present application is to disclose an installation method for installing an electrostatic chuck by using the above electrostatic chuck mounting device.

[0045] With reference to the drawings and embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0046] As shown in Figure 2 , the present application discloses a static chuck mounting device for mounting a static chuck 100, the static chuck mounting device comprising a substrate fixing mechanism 10, a pressing mechanism and a heating mechanism. It should be noted that the static chuck 100 generally comprises a substrate 110 and a ceramic disc 120, the substrate 110 includes but is not limited to an aluminum substrate, and other materials can also be used. An adhesive layer is provided between the substrate 110 and the ceramic disc 120, and the adhesive layer is usually formed by gluing.

[0047] As shown in Figure 6 , the substrate 110 is connected to the substrate fixing mechanism 10 through a magnetic adsorption assembly, and a locking assembly 20 is provided on the substrate fixing mechanism 10, which can lock the substrate 110. As shown in Figure 1 , the pressing mechanism comprises a pressing block 30 and a driving assembly 50 connected to the pressing block 30, the driving assembly 50 can drive the pressing block 30 to move, the bottom surface of the pressing block 30 is parallel to the top surface of the ceramic disc 120, and the pressing block 30 is configured to be pressed on the upper surface of the ceramic disc 120 to provide a predetermined pressure. The heating mechanism can heat and solidify the adhesive layer.

[0048] In the installation of the static chuck 100, first, the substrate 110 is connected to the substrate fixing mechanism 10 through the magnetic adsorption assembly, and the substrate 110 is locked by the locking assembly 20. Then, glue is applied on the substrate 110, and after the gluing is completed, the ceramic disc 120 is placed on the side of the substrate 110 with glue and fixed by the fixing assembly, forming the initial structure of the static chuck 100. Then, the driving assembly 50 drives the pressing block 30 to move, so that the pressing block 30 is pressed on the ceramic disc 120, and the bottom surface of the pressing block 30 abuts against the top surface of the ceramic disc 120. Then, the initial structure of the static chuck 100 is heated by the heating mechanism, so that the adhesive layer between the substrate 110 and the ceramic disc 120 solidifies, forming the static chuck 100.

[0049] Among them, the fixing assembly is preferably a positioning pin, as shown in Figure 4 , the ceramic disc 120 is provided with a first positioning hole 121, and the substrate 110 is provided with a second positioning hole corresponding to the first positioning hole 121. The number of first positioning holes 121 shown in the figure includes three and is arranged in a triangular shape. The specific number and position can be adjusted according to actual needs.

[0050] The electrostatic chuck mounting device disclosed by the embodiment of the application can realize quick positioning, reduce the time for manual alignment, and can adapt to different sizes and shapes of the substrate 110 and the installation requirements of electrostatic chucks 100 of different shapes and sizes, without frequent replacement of the substrate fixing mechanism 10, thereby improving the installation efficiency of the electrostatic chuck 100.

[0051] It should be noted that the driving assembly 50 drives the translation of the pressing block 30, which can be up-down translation, up-down-left-right translation, or three-dimensional translation, preferably three-dimensional translation. In order to monitor the flatness of the surface of the ceramic disc 120, a displacement sensor is arranged on the ceramic disc 120, and the displacement sensor is connected with the driving assembly 50. Through the detection result of the displacement sensor, the driving assembly 50 drives the pressing block 30 to move, so as to adjust the flatness of the surface of the ceramic disc 120.

[0052] Further, the magnetic adsorption assembly includes a first magnetic member and a second magnetic member. The first magnetic member is arranged on the substrate fixing mechanism 10, and the second magnetic member is arranged on the substrate 110. When the first magnetic member and the second magnetic member approach each other, an attractive force is generated to enable the detachable connection of the substrate 110 and the substrate fixing mechanism 10. Specifically, the first magnetic member can be a magnetic attraction positioning groove arranged on the substrate fixing mechanism 10, and a permanent magnet is arranged in the magnetic attraction positioning groove. The second magnetic member is a magnet or a magnetic material arranged on the substrate 110 and matched with the magnetic attraction positioning groove. The shape of the magnetic attraction positioning groove can be V-shaped, conical or rectangular, and the specific shape can be determined according to actual requirements. The arrangement of the magnetic adsorption assembly can realize the quick positioning of the substrate 110 and the substrate fixing mechanism 10, and can improve the installation efficiency.

[0053] Further, as shown in FIG. 6, the substrate fixing mechanism 10 includes a base 11 and a plurality of substrate fixing mechanisms 10 arranged on the base 11. The substrate fixing mechanism 10 is arranged on the base 11 in a matrix form, and the substrate 110 is arranged on the substrate fixing mechanism 10 in a matrix form. Figure 4 and Figure 6As shown, the locking assembly 20 comprises a plurality of locking pieces 21 arranged along the circumference of the base plate 110, each locking piece 21 is in sliding fit with the base plate fixing mechanism 10, and each locking piece 21 can move towards the center of the base plate fixing mechanism 10. Specifically, the base plate fixing mechanism 10 is provided with a sliding groove 11 corresponding to each locking piece 21. Taking the case that the cross-sectional shape of the base plate fixing mechanism 10 is circular, the extension direction of the sliding groove 11 is along the radial direction of the base plate fixing mechanism 10, and each locking piece 21 is in sliding fit with the corresponding sliding groove 11. Of course, the cross-sectional shape of the base plate fixing mechanism 10 is not limited to the above-mentioned circular shape, and can also be rectangular, oval or other polygonal shape. After the base plate 110 is connected with the base plate fixing mechanism 10 through the magnetic adsorption assembly, each locking piece 21 is slid along the corresponding sliding groove 11, and then the base plate 110 is locked, and the next step of the glue coating operation can be performed. The sliding fit of the locking piece 21 with the base plate fixing mechanism 10 can adapt to the mounting requirements of electrostatic chucks 100 of different sizes and shapes, without the need to replace the mounting device, and can improve the mounting efficiency of the electrostatic chuck.

[0054] Further, as shown in some embodiments, Figure 7 The locking piece 21 comprises a locking piece body 211 and a locking portion 212 arranged on the top of the locking piece body 211. The locking piece body 211 is in sliding fit with the base plate fixing mechanism 10, and the locking portion 212 is provided with an elastic reset member between the locking piece body 211 and the locking portion 212. The locking piece body 211 and the locking portion 212 are connected by a fastener. Specifically, the locking piece body 211 is provided with a first mounting hole, which can be in sliding fit or fixed with the sliding groove 11 by a first bolt and a nut. The first bolt passes through the first mounting hole and is in threaded fit with the nut. By screwing the nut, the sliding or relative fixation of the locking piece 21 and the sliding groove 11 can be achieved. The locking portion 212 is preferably of a bent structure, and the locking portion 212 is bent towards the center of the base plate 110. The locking portion 212 is provided with a second mounting hole, and the locking piece body 211 is provided with a threaded hole corresponding to the second mounting hole. The second bolt can be used to lock the base plate 110. After the base plate 110 is connected with the base plate fixing mechanism 10 through the magnetic adsorption assembly, each locking piece 21 is slid along the corresponding sliding groove 11, so that the locking portion 212 is located above the upper surface of the base plate 110, and then the first bolt is locked, and the second bolt is sequentially passed through the second mounting hole and is in threaded fit with the threaded hole until the bottom surface of the locking portion 212 abuts against the top surface of the base plate 110.

[0055] Further, in order to improve the mounting efficiency of the electrostatic chuck 100, in some embodiments, the locking member 21 is a pneumatic locking member. Specifically, the locking member 21 comprises a locking member body and a bent portion. A piston and a piston rod connected with the piston are arranged in the locking member body. A sealing cavity is arranged on the side of the piston away from the piston rod. The piston rod is connected with the bent portion. The sealing cavity is connectable with an external air source. When locking is needed, the air in the sealing cavity is extracted by the external air source. The piston rod moves downward. The bent portion moves downward until the bottom surface of the bent portion abuts against the top surface of the base plate 110. When unlocking is needed, the external air source fills air into the sealing cavity. The piston rod moves upward. The bent portion is separated from the base plate 110 to achieve unlocking. In some other embodiments, the bent portion is provided with a limiting member. The locking member body is provided with a limiting groove matched with the limiting member. When the bottom surface of the bent portion abuts against the top surface of the base plate 110, the limiting member is matched with the limiting groove. It should be noted that the specific structure of the pneumatic locking member described above is only an example. Other forms of pneumatic locking members can also be used. The specific structure can refer to the specific structure of the existing pneumatic locking member. The working principle will not be repeated.

[0056] Further, in some embodiments, the driving assembly 50 comprises a first driving portion, a second driving portion and a third driving portion. The second driving portion is arranged on the first driving portion. The third driving portion is arranged on the second driving portion. The pressing block 30 is arranged on the third driving portion. The first driving portion can drive the pressing block 30 to move in a first direction. The second driving portion can drive the pressing block 30 to move in a second direction. The third driving portion can drive the pressing block 30 to move in a third direction. Any two of the first direction, the second direction and the third direction are perpendicular to each other.

[0057] Exemplarily, the first driving part, the second driving part and the third driving part can be selected as nut-screw mechanisms. The first driving part comprises a first screw rod and a first nut threadedly matched with the first screw rod. The first screw rod has an axial direction as the first direction. The first screw rod preferably comprises two. The second driving part comprises a second screw rod and a second nut threadedly matched with the second screw rod. The second screw rod has an axial direction as the second direction. The third driving part comprises a third screw rod and a third nut threadedly matched with the third screw rod. The third screw rod has an axial direction as the third direction. The second screw rod is connected with the corresponding first nut of the first screw rod on the two sides respectively. The third screw rod is connected with the second nut. The pressing block 30 is connected with the third nut. The first screw rod, the second screw rod and the third screw rod are connected with the driving motor respectively. Alternatively, the first driving part is selected as a first cylinder. The piston rod of the first cylinder extends along the first direction. The second driving part is selected as a second cylinder. The piston rod of the second cylinder extends along the second direction. The third driving part is selected as a third cylinder. The piston rod of the third cylinder extends along the third direction. The second cylinder is connected with the piston rod of the first cylinder. The third cylinder is connected with the piston rod of the second cylinder. The pressing block 30 is connected with the piston rod of the third cylinder. It should be noted that the specific structure of the driving assembly 50 is not limited to the above description, as long as the three-dimensional movement of the pressing block 30 can be realized.

[0058] Further, as shown in Figure 4 and Figure 5 , the heating mechanism comprises a heating block 40. The heating block 40 is connected with the base plate 110. Specifically, the heating block 40 is arranged at the bottom of the base plate 110 and connected with the side of the base plate 110 away from the ceramic disc 120. Specifically, the heating block 40 can be connected by bonding or clamping. The specific connection mode is not limited. In some specific embodiments, in order to bear the heating block 40, a ceramic block 60 with small thermal deformation is arranged at the bottom of the heating block 40.

[0059] Further, in order to ensure the bonding effect of the base plate 110 and the ceramic disc 120 and remove the air in the bonding layer, in some specific embodiments, the electrostatic chuck mounting device comprises a vacuum pumping mechanism. As shown in Figure 2 and Figure 3 , the pressing block 30 is arranged in the first shell 70. The base plate fixing mechanism 10 is arranged in the second shell 80. When the pressing block 30 is pressed on the upper surface of the ceramic disc 120, the first shell 70 is connected with the second shell 80 to form a cavity. The vacuum pumping mechanism is connected with the cavity. The cavity is pumped by the vacuum pumping mechanism to remove the air in the bonding layer, and then heated by the heating mechanism.

[0060] In other specific embodiments, as shown in Figure 1As shown, the pressing block 30 is arranged in the cavity, the driving assembly 50 is arranged outside the cavity and is in transmission connection with the pressing block 30. When the electrostatic chuck 100 is installed, the substrate fixing mechanism 10 can be directly placed in the cavity, then the ceramic disc 120 is placed and fixed by gluing and the ceramic disc 120 and the substrate 110 are fixed in sequence, then the driving assembly 50 drives the pressing block 30 to move and press the surface of the ceramic disc 120, then the cavity is vacuumized by the vacuumizing mechanism, and finally the adhesive layer is heated and solidified by the heating mechanism.

[0061] In addition, the application further discloses an electrostatic chuck installation method, as shown in the accompanying drawings. Figure 8 As shown, the method specifically comprises the following steps:

[0062] Step S1, fixing the substrate 110.

[0063] The substrate 110 is connected to the substrate fixing mechanism 10 by the magnetic adsorption assembly, and the substrate 110 is locked by the locking assembly 20.

[0064] Step S2, gluing.

[0065] The substrate 110 is glued on one side to form an adhesive layer.

[0066] Step S3, fixing the ceramic disc 120.

[0067] The ceramic disc 120 is placed on the adhesive layer, the ceramic disc 120 and the substrate 110 are connected by the fixing assembly, and the initial structure of the electrostatic chuck 100 is formed.

[0068] Step S4, the pressing block 30 is pressed on the ceramic disc 120.

[0069] The driving assembly 50 is started to press the pressing block 30 on the ceramic disc 120 to provide a preset pressure. Preferably, a pressure sensor is arranged on the ceramic disc 120 to detect a pressure signal.

[0070] Step S5, heating and solidifying the adhesive layer.

[0071] The initial structure of the electrostatic chuck 100 is heated by the heating mechanism, the adhesive layer is solidified, the solidification is completed, and the electrostatic chuck 100 is formed. After the adhesive layer is solidified, the driving assembly 50 drives the pressing block 30 to move and separate from the ceramic disc 120, and the electrostatic chuck 100 can be taken out.

[0072] Further, after the ceramic disc 120 is fixed in step S3, step S4', vacuumizing, is further included between step S4 and step S5, the cavity containing the electrostatic chuck 100 is vacuumized by the vacuumizing mechanism to remove air in the adhesive layer, so as to improve the stability and firmness of the adhesion.

[0073] It should be noted that each of the embodiments in the specification focuses on the difference from other embodiments, and the same and similar parts between each embodiment can be referred to each other.

[0074] It should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0075] Hereinafter, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features.

[0076] Unless otherwise expressly specified and limited, the terms "connected", "connected" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, can be electrically connected; can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0077] The principles and implementation modes of the present application are described by applying specific examples in this paper, and the above description of the embodiments is only used to help understand the core idea of the present application. It should be noted that for ordinary skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. An electrostatic chuck mounting device for mounting an electrostatic chuck (100), wherein the electrostatic chuck (100) comprises a substrate (110) and a ceramic disc (120), wherein an adhesive layer is provided between the substrate (110) and the ceramic disc (120), and wherein: The electrostatic chuck mounting device comprises: A substrate fixing mechanism (10), wherein the substrate (110) is connected to the substrate fixing mechanism (10) via a magnetic adsorption component, and a locking component (20) is provided on the substrate fixing mechanism (10), and the locking component (20) is capable of locking the substrate (110); A pressing mechanism, the pressing mechanism comprising a pressing block (30) and a driving assembly (50) connected to the pressing block (30), the driving assembly (50) being capable of driving the pressing block (30) to move, the bottom surface of the pressing block (30) being parallel to the top surface of the ceramic disk (120), and the pressing block (30) being configured to be pressed against the upper surface of the ceramic disk (120) to provide a preset pressure; A heating mechanism capable of heating and curing the adhesive layer.

2. The electrostatic chuck mounting device according to claim 1, wherein: The magnetic adsorption assembly comprises a first magnetic part and a second magnetic part, wherein the first magnetic part is arranged on the substrate fixing mechanism (10), and the second magnetic part is arranged on the substrate (110), and when the first magnetic part and the second magnetic part are close to each other, an attractive force can be generated, so that the substrate fixing mechanism (10) and the substrate (110) are detachably connected.

3. The electrostatic chuck mounting device according to claim 1, wherein: The locking assembly (20) comprises a plurality of locking members (21) arranged at intervals along the circumference of the substrate (110), each of the locking members (21) being slidably engaged with the substrate fixing mechanism (10), and each of the locking members (21) being capable of moving toward the center direction of the substrate fixing mechanism (10).

4. The electrostatic chuck mounting device according to claim 3, wherein: The locking member (21) comprises a locking member body (211) and a locking portion (212) arranged at the top of the locking member body (211); the locking member body (211) is slidably matched with the substrate fixing mechanism (10); an elastic reset member is provided between the locking portion (212) and the locking member body (211); and the locking member body (211) and the locking portion (212) are connected by a fastener.

5. The electrostatic chuck mounting device according to claim 3, wherein: The locking member (21) is a pneumatic locking member, comprising a locking member body and a bent portion, wherein a piston and a piston rod connected to the piston are provided in the locking member body, a sealing cavity is provided on a side of the piston away from the piston rod, the piston rod is connected to the bent portion, and the sealing cavity can be connected to an external air source.

6. The electrostatic chuck mounting device according to claim 1, wherein: The driving assembly (50) includes a first driving part, a second driving part and a third driving part, the second driving part is arranged on the first driving part, the third driving part is arranged on the second driving part, and the pressing block (30) is arranged on the third driving part, the first driving part can drive the pressing block (30) to move along a first direction, the second driving part can drive the pressing block (30) to move along a second direction, and the third driving part can drive the pressing block (30) to move along a third direction, and any two of the first direction, the second direction and the third direction are perpendicular to each other.

7. The electrostatic chuck mounting device according to claim 1, wherein: The heating mechanism comprises a heating block (40), and the heating block (40) is connected to the substrate (110).

8. The electrostatic chuck mounting device according to any one of claims 1 to 7, wherein: The electrostatic suction cup mounting device includes a vacuum pumping mechanism, the pressing block (30) is arranged on a first shell (70), and the substrate fixing mechanism (10) is arranged on a second shell (80). When the pressing block (30) is pressed onto the ceramic disk (120), the first shell (70) can be connected to the second shell (80) to form a cavity, and the vacuum pumping mechanism is connected to the cavity.

9. A method for installing an electrostatic chuck, characterized in that: The electrostatic chuck mounting device according to any one of claims 1 to 8 comprises the following steps: Fixing the substrate (110), connecting the substrate (110) to the substrate fixing mechanism (10) via a magnetic adsorption component, and locking the substrate (110) via the locking component (20); Glue coating: applying glue on one side of the substrate (110) to form an adhesive layer; Fixing the ceramic disc (120), placing the ceramic disc (120) on the adhesive layer, and connecting the ceramic disc (120) and the substrate (110) via a fixing component to form the initial structure of the electrostatic chuck (100); The pressing block (30) is pressed onto the ceramic disk (120), and the driving assembly (50) is started to press the pressing block (30) onto the ceramic disk (120) to provide a preset pressure; The adhesive layer is heated and cured, and a heating mechanism heats the initial structure of the electrostatic suction cup (100) to cure the adhesive layer. After curing is completed, the electrostatic suction cup (100) is formed.

10. The electrostatic chuck installation method according to claim 9, wherein: After the step of pressing the pressing block (30) onto the ceramic disc (120), a vacuuming step is also included, wherein a vacuuming mechanism is used to vacuum the cavity of the initial structure accommodating the electrostatic chuck (100).

Images