A liquid-cooled power module heat sink structure with grooved pin teeth

By employing a grooved pin structure and a flow rate regulation module in the liquid cooler, the problem of insufficient heat dissipation efficiency of chips under high power density is solved, achieving efficient heat dissipation and flow rate regulation, and reducing chip temperature and flow resistance.

CN120809690BActive Publication Date: 2026-03-17DONGGUAN UNIV OF TECH
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-07-07
Publication Date
2026-03-17

AI Technical Summary

Technical Problem

The heat dissipation fin structure of existing liquid coolers cannot meet the heat dissipation requirements of chips under high power density, resulting in insufficient heat dissipation efficiency.

Method used

The liquid-cooled power module heat sink structure with grooved needle teeth is adopted. By designing grooves on the heat dissipation teeth to increase the heat exchange area and turbulence, and by using a flow rate regulation module to automatically adjust the coolant flow rate according to the temperature, the heat exchange performance is improved.

Benefits of technology

It significantly improves heat dissipation efficiency, reduces chip temperature and flow resistance, reduces the risk of blockage, and achieves dynamic heat exchange efficiency matching.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120809690B_ABST
    Figure CN120809690B_ABST
Patent Text Reader

Abstract

This invention belongs to the field of liquid cooling heat sink technology, specifically a liquid-cooled power module heat sink structure with grooved pin teeth. Addressing the problem that the heat dissipation efficiency provided by existing liquid cooling heat sinks for power modules is insufficient to meet the increasing demands for chip heat dissipation due to continuously rising power density, the present invention proposes the following solution: a heat sink substrate; heat dissipation pins, multiple of which are equidistantly fixedly connected to the bottom of the heat sink substrate; and a water jacket, which is fixedly connected to the bottom of the heat sink substrate. The grooved pin tooth structure of the liquid-cooled power module heat sink disclosed in this invention differs from traditional circular or rhomboid heat dissipation pins, significantly increasing the surface heat transfer area and turbulence, thereby improving heat transfer performance and reducing chip temperature. Simultaneously, the grooved pin tooth structure breaks up tail vortices, reducing flow resistance, and increases the distance between the heat dissipation pins.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of liquid cooling radiator technology, and in particular to a liquid cooling power module heat sink structure with grooved pin teeth. Background Technology

[0002] A liquid-cooled radiator is a device that uses coolant to circulate and dissipate heat. The water-cooled radiator system uses a pump to circulate the coolant in the heat pipes to dissipate heat. The heat-absorbing part on the radiator is used to absorb heat, and the heat absorbed by the heat-absorbing part is discharged through the radiator designed on the back of the unit. It has the advantages of quiet operation and fast heat dissipation.

[0003] In the existing technology, the heat dissipation fins of liquid cooling heat sinks for power modules are mainly circular, rhomboid, elliptical, powder-injected irregular shapes, and micro-cut fins. However, due to the continuous increase in power density and the continuous increase in the demand for chip heat dissipation, the heat dissipation efficiency provided by the current heat dissipation fins is insufficient to meet the demand. Summary of the Invention

[0004] This invention discloses a liquid-cooled power module heat sink structure with grooved pin teeth, aiming to solve the technical problem in the background art that due to the continuous increase in power density and the continuous increase in the demand for chip heat dissipation, the heat dissipation efficiency provided by the heat dissipation teeth of the existing power module liquid cooling heat sink is insufficient to meet the demand.

[0005] The present invention proposes a heat sink structure for a liquid-cooled power module with grooved needle teeth, including a heat dissipation substrate;

[0006] Heat dissipation teeth, a plurality of such heat dissipation teeth are fixedly connected at equal intervals to the bottom of the heat dissipation substrate;

[0007] A water jacket, which is fixedly connected to the bottom of the heat dissipation substrate;

[0008] A flow outlet pipe is fixedly connected to one side of the water jacket;

[0009] A flow rate adjustment module is mounted on the water jacket. The flow rate adjustment module includes a flow inlet pipe, which is fixedly connected to the side of the water jacket away from the flow outlet pipe. Two mounting holes are opened on the flow inlet pipe, and a rotating shaft is rotatably connected to each of the two mounting holes. An adjustment guide plate is fixedly connected to the outside of each of the two rotating shafts. The flow rate adjustment module adjusts the flow rate of the heat exchange coolant according to the temperature of the heat dissipation substrate, thereby changing the heat exchange efficiency.

[0010] In a preferred embodiment, all of the heat dissipation teeth are rhomboid teeth, and grooves are formed on multiple surfaces of the heat dissipation teeth.

[0011] In a preferred embodiment, the water jacket has multiple flow channels equidistantly arranged inside, and two corresponding fixing holes are provided on the water jacket, with an inlet pipe and an outlet pipe respectively fixedly connected in the two fixing holes.

[0012] In a preferred embodiment, a first connection layer is disposed above the heat dissipation substrate, a metal connection layer is disposed above the first connection layer, an insulating substrate is disposed above the metal connection layer, and a conductive metal layer is disposed above the insulating substrate.

[0013] In a preferred embodiment, a plurality of connection layers two are provided on the top of the conductive metal layer, wherein a power chip is provided above each of the plurality of connection layers two, a connection layer three is provided above each of the plurality of power chips, and a conductive metal component is provided above one of the connection layers two located on one side of the plurality of power chips, and the bottom end of the conductive metal component away from the connection layer two is fixedly connected to the top of the plurality of connection layers three.

[0014] In a preferred embodiment, multiple lead frames are provided above the two connecting layers on both sides.

[0015] In a preferred embodiment, the flow rate adjustment module further includes an installation sleeve, the top of the water jacket has an installation groove, the installation sleeve is fixedly connected in the installation groove, and the top of the installation sleeve is in contact with the bottom of the heat dissipation substrate.

[0016] In a preferred embodiment, a piston is slidably connected to the inner wall of the mounting sleeve, and a connecting rod is fixedly connected to one side of the piston.

[0017] In a preferred embodiment, a sliding toothed rod is slidably connected to the top of the flow inlet pipe, and the bottom end of the connecting rod away from the piston is fixedly connected to the top of the sliding toothed rod.

[0018] In a preferred embodiment, gears are fixedly connected to the upper ends of both shafts, and both gears mesh with a sliding rack.

[0019] As can be seen from the above, the heat sink structure of the liquid-cooled power module with grooved pin teeth provided by the present invention covers the heat-generating area of ​​the chip with the heat dissipation teeth of the grooved pin structure, which can be distinguished from the traditional circular and diamond-shaped heat dissipation teeth. It can significantly improve the surface heat transfer area and turbulence, thereby improving heat transfer performance and reducing chip temperature. At the same time, the heat dissipation teeth of the grooved pin structure can break the tail vortex, reduce flow resistance, and increase the distance between the heat dissipation teeth, reducing the risk of blockage. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a heat sink structure for a liquid-cooled power module with grooved needle teeth proposed in this invention.

[0021] Figure 2 This is a cross-sectional schematic diagram of a heat sink structure for a liquid-cooled power module with grooved needle teeth proposed in this invention.

[0022] Figure 3 This is a schematic diagram of the internal structure of the water jacket and the heat dissipation teeth of a liquid-cooled power module heat sink structure with grooved needle teeth proposed in this invention.

[0023] Figure 4 This is a schematic diagram of a flow rate regulation module structure for a liquid-cooled power module heat sink structure with grooved needle teeth proposed in this invention.

[0024] Figure 5 This is a schematic diagram of the heat sink structure of a liquid-cooled power module with grooved needle teeth proposed in this invention.

[0025] Figure 6 This is a schematic diagram of the heat sink structure of a liquid-cooled power module with grooved needle teeth proposed in this invention;

[0026] Figure 7 This is a schematic diagram of the heat sink structure of a liquid-cooled power module with grooved needle teeth proposed in this invention, showing the three-dimensional cross-section of the heat dissipation teeth.

[0027] Figure 8 This is a schematic diagram of the heat dissipation tooth arrangement of a liquid-cooled power module heat sink structure with grooved needle teeth proposed in this invention.

[0028] Figure 9 This is a schematic diagram of a multi-layer heat dissipation tooth structure for a liquid-cooled power module heat sink with grooved needle teeth proposed in this invention.

[0029] In the diagram: 1. Heat dissipation substrate; 2. Water jacket; 3. Flow rate adjustment module; 301. Flow inlet pipe; 302. Mounting sleeve; 303. Piston component; 304. Connecting rod component; 305. Sliding gear; 306. Rotating shaft; 307. Adjusting guide plate; 308. Gear; 4. Connection layer one; 5. Metal connection layer; 6. Insulating substrate; 7. Conductive metal layer; 8. Connection layer two; 9. Power chip; 10. Connection layer three; 11. Conductive metal component; 12. Lead frame; 13. Liquid inlet pipe; 14. Liquid outlet pipe; 15. Heat dissipation teeth; 16. Flow outlet pipe. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] The heat sink structure for liquid-cooled power modules with grooved pins disclosed in this invention is mainly used in scenarios where the heat dissipation efficiency provided by existing liquid-cooled heat sinks is insufficient to meet the needs due to the continuous increase in power density and the increasing demand for chip heat dissipation.

[0032] Example 1

[0033] Reference Figures 1-8 A liquid-cooled power module heat sink structure with grooved needle teeth, including a heat dissipation substrate 1;

[0034] Heat dissipation teeth 15, multiple heat dissipation teeth 15 are fixedly connected to the bottom of the heat dissipation base plate 1 at equal intervals;

[0035] Water jacket 2 is fixedly connected to the bottom of heat dissipation base plate 1;

[0036] The flow outlet pipe 16 is fixedly connected to one side of the water jacket 2;

[0037] The flow rate adjustment module 3 is mounted on the water jacket 2. The flow rate adjustment module 3 includes a flow inlet pipe 301, which is fixedly connected to the side of the water jacket 2 away from the flow outlet pipe 16. Two mounting holes are provided on the flow inlet pipe 301, and a rotating shaft 306 is rotatably connected to each of the two mounting holes. Adjustment guide plates 307 are fixedly connected to the outside of the two rotating shafts 306. The flow rate adjustment module 3 adjusts the flow rate of the heat exchange coolant according to the temperature of the heat dissipation substrate 1, thereby changing the heat exchange efficiency.

[0038] Reference Figure 1 , Figure 2 and Figure 3 Each of the multiple heat dissipation teeth 15 is a diamond-shaped tooth, and each of the multiple heat dissipation teeth 15 has grooves on multiple surfaces.

[0039] Reference Figure 1 , Figure 2 and Figure 3 The water jacket 2 has multiple flow channels at equal intervals inside, and two corresponding fixing holes are opened on the water jacket 2. The inlet pipe 13 and the outlet pipe 14 are fixedly connected in the two fixing holes respectively.

[0040] Reference Figure 1 , Figure 2 and Figure 3 A connection layer 4 is disposed above the heat dissipation substrate 1, a metal connection layer 5 is disposed above the connection layer 4, an insulating substrate 6 is disposed above the metal connection layer 5, and a conductive metal layer 7 is disposed above the insulating substrate 6.

[0041] Reference Figure 1 , Figure 2 and Figure 3Multiple connecting layers 8 are provided on the top of the conductive metal layer 7. Power chips 9 are provided above each of the multiple connecting layers 8. Connecting layers 3 10 are provided above each of the multiple power chips 9. A conductive metal component 11 is provided above one of the connecting layers 8 located on one side of the multiple power chips 9. The bottom end of the conductive metal component 11 away from the connecting layer 8 is fixedly connected to the top of the multiple connecting layers 3 10.

[0042] Reference Figure 1 , Figure 2 and Figure 3 Multiple lead frames 12 are provided above the two connecting layers 8 on both sides.

[0043] In specific application scenarios, the heat transfer coolant is injected between the heat dissipation substrate 1 and the water jacket 2 through the inlet pipe 13, absorbing the heat conducted by the heat dissipation teeth 15. When the heat transfer coolant flows through the heat dissipation teeth 15, the grooves on multiple surfaces of the heat dissipation teeth 15 increase the heat exchange area and disrupt the flow trajectory of the heat transfer coolant, causing turbulence and irregular flow, disturbing the boundary layer between the heat dissipation teeth 15 and the heat transfer coolant, and reducing thermal resistance. The heat transfer coolant is injected through the flow inlet pipe 301, passes through the internal flow channel of the water jacket 2, and is discharged through the flow outlet pipe 16. While the heat transfer coolant is flowing, the heat transferred by the heat transfer coolant is absorbed and carried away. During use, it can significantly improve the surface heat exchange area and turbulence, thereby improving heat exchange performance and reducing chip temperature. At the same time, the grooved tooth structure of the heat dissipation teeth 15 can break the tail vortex, reduce flow resistance, and increase the distance between the heat dissipation teeth 15, reducing the risk of blockage.

[0044] Reference Figure 1 , Figure 3 and Figure 4 The flow rate adjustment module 3 also includes an installation sleeve 302. The top of the water jacket 2 is provided with an installation groove. The installation sleeve 302 is fixedly connected in the installation groove, and the top of the installation sleeve 302 is in contact with the bottom of the heat dissipation substrate 1.

[0045] Reference Figure 1 , Figure 3 and Figure 4 A piston 303 is slidably connected to the inner wall of the mounting sleeve 302, and a connecting rod 304 is fixedly connected to one side of the piston 303.

[0046] Reference Figure 1 , Figure 3 and Figure 4 The top of the flow inlet pipe 301 is slidably connected to a sliding toothed rod 305, and the bottom of the end of the connecting rod 304 away from the piston 303 is fixedly connected to the top of the sliding toothed rod 305.

[0047] Reference Figure 1 , Figure 3 and Figure 4 The upper ends of the two rotating shafts 306 are fixedly connected with gears 308, and both gears 308 mesh with the sliding rack 305.

[0048] In specific application scenarios, when the heat transferred by the heat dissipation substrate 1 increases and the temperature rises, the gas inside the mounting sleeve 302 expands due to thermal expansion and contraction as it comes into contact with the heat dissipation substrate 1. This pushes the piston 303 to slide outward, and through the connecting rod 304, it pushes the sliding toothed rod 305 to slide on the flow inlet pipe 301. Since the teeth of the sliding toothed rod 305 mesh with the gear 308, when the sliding toothed rod 305 moves, it meshes with the rotating gear 308 and the rotating shaft 306, thereby driving the adjusting guide plate 307 to rotate inward and close, reducing the inner diameter of the flow, increasing the flow rate of the heat exchange coolant, and increasing the heat exchange efficiency. When the temperature drops, the piston 303 drives the sliding toothed rod 305 to reset, the inner diameter of the flow channel increases, and the flow rate of the heat exchange coolant decreases. During use, the flow rate adjustment module 3 can automatically adjust the flow rate of the heat exchange coolant according to different temperatures, thereby adjusting the heat exchange efficiency and achieving dynamic matching between heat exchange efficiency and temperature.

[0049] It should be noted that the heat dissipation base plate 1 and the water jacket 2, as well as the water jacket 2 and the components installed on the water jacket 2, are all coated with a sealing material to serve as an adhesive, fixation and sealant, ensuring the liquid cooling seal.

[0050] Example 2

[0051] The heat sink structure of the liquid-cooled power module with grooved needle teeth provided in Embodiment 1 is further optimized, such as... Figure 5 As shown, replacing the heat dissipation teeth 15 with grooved tooth structure with heat dissipation teeth 15 with rounded corners can make the fluid boundary layer smoother when the heat transfer coolant flows through the heat dissipation teeth 15, reduce local stress, extend the structural life, reduce flow separation and turbulence, reduce friction resistance, and enable the heat transfer coolant to cover the surface of the heat dissipation teeth 15 more evenly, thereby improving heat exchange efficiency.

[0052] Example 3

[0053] The heat sink structure of the liquid-cooled power module with grooved needle teeth provided in Embodiment 1 is further optimized, such as... Figures 6-7As shown, the heat dissipation tooth 15 with one groove on each side is replaced with a heat dissipation tooth 15 with a different number of grooves on each side. By increasing the number of grooves in the incoming flow direction and the wake direction, the contact area between the heat dissipation tooth 15 and the heat transfer coolant can be further increased, thereby improving the heat exchange efficiency. Furthermore, the turbulence of the heat transfer coolant flowing through the heat dissipation tooth 15 will be further enhanced. At the same time, the added grooves can extend the flow path of the heat transfer coolant, increase the contact time between the heat transfer coolant and the heat dissipation tooth 15, and further enhance heat absorption.

[0054] Example 4

[0055] The heat sink structure of the liquid-cooled power module with grooved needle teeth provided in Embodiment 1 is further optimized, such as... Figure 8 As shown, replacing the heat dissipation teeth 15, which can be arranged to fill the heat sink, with teeth arranged only at the corresponding locations on the chip can increase the flow rate of the heat transfer coolant at the chip location, further enhance the heat dissipation efficiency at the chip location, avoid the risk of insufficient heat dissipation in the surrounding area of ​​the chip, and significantly reduce fluid resistance.

[0056] Example 5

[0057] The heat sink structure of the liquid-cooled power module with grooved needle teeth provided in Embodiment 1 is further optimized, such as... Figure 9 As shown, different designs can be made in different directions based on the heat dissipation tooth 15 structure, such as designs with different numbers of layers. The staggered arrangement of the heat dissipation tooth 15 can optimize the heat transfer path, significantly improve the heat dissipation efficiency in the near heat source area, achieve a balanced overall temperature distribution, and enhance system reliability.

[0058] Working principle: The heat transfer coolant is injected between the heat dissipation substrate 1 and the water jacket 2 through the inlet pipe 13, absorbing the heat conducted by the heat dissipation teeth 15. When the heat transfer coolant flows through the heat dissipation teeth 15, the grooves on multiple surfaces of the heat dissipation teeth 15 increase the heat transfer area and disrupt the flow trajectory of the heat transfer coolant, causing turbulence and irregular flow. This disrupts the boundary layer between the heat dissipation teeth 15 and the heat transfer coolant, reduces thermal resistance, increases the surface heat transfer area and turbulence, thereby improving heat transfer performance and reducing chip temperature. At the same time, the grooved tooth structure of the heat dissipation teeth 15 can break the tail vortex, reduce flow resistance, and increase the distance between the heat dissipation teeth 15, reducing the risk of blockage. The heat transfer coolant is injected through the flow inlet pipe 301, passes through the internal flow channel of the water jacket 2, and is discharged through the flow outlet pipe 16. While the heat transfer coolant is flowing, it absorbs and carries away the heat transferred by the heat transfer coolant. When the heat dissipation substrate 1... As the heat transfer increases and the temperature rises, the gas inside the mounting sleeve 302 expands due to thermal expansion and contraction as it comes into contact with the heat dissipation base plate 1. This expansion pushes the piston 303 outward, which in turn pushes the sliding rack 305 onto the flow inlet pipe 301 via the connecting rod 304. Since the teeth of the sliding rack 305 mesh with the gear 308, the sliding rack 305 will mesh with the rotating gear 308 and the rotating shaft 306 as it moves. This, in turn, causes the regulating guide plate 307 to rotate inward and close, reducing the inner diameter of the flow path, increasing the flow rate of the heat exchange coolant, and increasing the heat exchange efficiency. When the temperature drops, the piston 303 drives the sliding rack 305 to reset, increasing the inner diameter of the flow path and reducing the flow rate of the heat exchange coolant. The flow rate regulation module 3 can automatically adjust the flow rate of the heat exchange coolant according to different temperatures, thereby adjusting the heat exchange efficiency and achieving dynamic matching between heat exchange efficiency and temperature.

[0059] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A liquid-cooled power module heat sink structure with grooved pin teeth, characterized by, Including heat dissipation base plate (1); Heat dissipation tooth (15), a plurality of heat dissipation tooth (15) equidistant fixedly connected to the bottom of heat dissipation base plate (1); Water jacket (2), the water jacket (2) is fixedly connected to the bottom of heat dissipation base plate (1); Flow out pipe (16), the flow out pipe (16) is fixedly connected to one side of water jacket (2); Flow rate regulating module (3) is arranged on water jacket (2), and the flow rate regulating module (3) includes flow inlet pipe (301), and the flow inlet pipe (301) is fixedly connected to the side of water jacket (2) away from flow out pipe (16), two mounting holes are formed in the flow inlet pipe (301), two shafts (306) are rotatably connected in the two mounting holes, adjusting flow guide plates (307) are fixedly connected to the outer portions of the two shafts (306), and the flow rate regulating module (3) adjusts the flow rate of heat exchange cooling liquid according to the temperature of heat dissipation base plate (1), so as to change the heat exchange efficiency; The flow rate regulating module (3) further includes a mounting sleeve (302), a mounting groove is formed in the top of water jacket (2), the mounting sleeve (302) is fixedly connected in the mounting groove, and the top of the mounting sleeve (302) is in contact with the bottom of heat dissipation base plate (1); The inner wall of the mounting sleeve (302) is slidably connected with a piston (303), and one side of the piston (303) is fixedly connected with a connecting rod (304); The top of the flow inlet pipe (301) is slidably connected with a sliding gear rod (305), and the bottom of one end of the connecting rod (304) away from the piston (303) is fixedly connected with the top of the sliding gear rod (305); The upper ends of the two shafts (306) are fixedly connected with gears (308), and the two gears (308) are meshed with the sliding gear rod (305).

2. The liquid-cooled power module heat sink structure with grooved pin teeth of claim 1, wherein, A plurality of heat dissipation tooth (15) are all diamond teeth, and a plurality of surfaces of a plurality of heat dissipation tooth (15) are provided with grooves.

3. The liquid-cooled power module heat sink structure with grooved pin teeth of claim 2, wherein, A plurality of flow channels are equidistantly formed in the water jacket (2), and two corresponding fixing holes are formed in the water jacket (2), and a liquid inlet pipe (13) and a liquid outlet pipe (14) are fixedly connected in the two fixing holes.

4. The liquid-cooled power module heat sink structure with grooved pin teeth of claim 3, wherein, A connecting layer one (4) is arranged above the heat dissipation base plate (1), a metal connecting layer (5) is arranged above the connecting layer one (4), an insulating substrate (6) is arranged above the metal connecting layer (5), and a conductive metal layer (7) is arranged above the insulating substrate (6).

5. The liquid-cooled power module heat sink structure with grooved pin teeth of claim 4, wherein, A plurality of connecting layer two (8) are arranged on the top of the conductive metal layer (7), a power chip (9) is arranged above each of the plurality of connecting layer two (8), a connecting layer three (10) is arranged above each of the plurality of power chips (9), a conductive metal piece (11) is arranged above one of the connecting layer two (8) on one side of the plurality of power chips (9), and the bottom of one end of the conductive metal piece (11) away from the connecting layer two (8) is fixedly connected with the top of the plurality of connecting layer three (10).

6. The liquid-cooled power module heat sink structure with grooved pin teeth of claim 5, wherein, A plurality of lead frame (12) are arranged above the two connecting layer two (8) on both sides.

Citation Information

Patent Citations

  • Water-cooled laser

    CN209516306U

  • Liquid cooling radiator of semiconductor device and vehicle

    CN222071926U