Double-layer liquid cooling integrated shell for vehicle-mounted power supply system and vehicle-mounted power supply system

Abstract

The invention discloses a double-layer liquid cooling integrated shell for a vehicle-mounted power supply system and the vehicle-mounted power supply system. The double-layer liquid cooling integrated shell comprises a main box body and a flow channel cover plate, the central concave-convex wall divides the main box body into an upper cavity and a lower cavity; the central concave-convex wall is provided with a U-shaped groove on one side of the lower cavity, and the U-shaped groove sequentially comprises a first transverse shallow groove, a U-shaped deep groove and a second transverse shallow groove; the first transverse shallow groove and the second transverse shallow groove are respectively connected with the liquid inlet and the liquid outlet; the U-shaped deep groove sequentially comprises a first transverse deep groove connected with the first transverse shallow groove, a connecting groove and a second transverse deep groove connected with the second transverse shallow groove; the first transverse shallow groove is connected with the U-shaped deep groove through a flow guide inclined surface; an L-shaped protruding flow guide body is arranged on the inner side of a sealing plate of the flow channel cover plate and provided with an inclined edge opposite to the flow guide inclined face. The L-shaped protruding flow guide body extends into the first transverse deep groove and the connecting groove so that the flow channel can be obliquely and upwards guided to the groove bottom of the U-shaped deep groove from the first transverse shallow groove.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of an on-board charger, and in particular to a double-layer liquid cooling integrated shell for an on-board power supply system and an on-board power supply system. BACKGROUND

[0002] An on-board power supply system generally includes a shell having a flow channel, a PCBA circuit board, a MOS power device connected to the PCBA circuit board, a capacitor, a filter, and the like. The existing on-board power supply system is generally a single-layer structure, the PCBA circuit board is located in a side accommodating cavity of the shell, and the MOS power device is attached to the side wall in the height direction of the flow channel in the form of a plug-in to achieve heat dissipation, and the fixing form is realized by a metal spring strip, a plastic part, and an insulating gasket, which has more parts, a complicated process, and high process cost.

[0003] Patent document CN107104086B discloses a liquid cooling heat dissipation device and a motor controller, the liquid cooling heat dissipation device includes a base plate and a cooling liquid channel in the base plate, the base plate has at least one heat-conducting boss protruding from the upper surface of the base plate; and the side surface of the heat-conducting boss has a first mounting position for mounting a power device; the heat-conducting boss has a boss flow channel, and the boss flow channel constitutes part of the cooling liquid channel.

[0004] Patent document CN119730151A discloses a water-cooled heat dissipation on-board device and an electric vehicle, the shell of the on-board device includes an integrated shell, and the integrated shell includes an electrical accommodating groove and an internal water inlet channel. The electrical accommodating groove is used to accommodate an integrated support and a first circuit board, the first circuit board is used to carry electrical components of at least one of an on-board charger or a motor controller, and the integrated support is arranged between the first circuit board and the groove bottom of the electrical accommodating groove. The integrated support includes a support flow channel inlet and at least one heat sink flow channel interface, the support flow channel inlet is used to receive cooling water output by the outlet of the internal water inlet channel, and each heat sink flow channel interface is used to deliver cooling liquid to at least one of a water-cooled heat sink of the on-board charger or a water-cooled heat sink of the motor controller.

[0005] Patent document CN119855125A discloses an EMC filter electromagnetic shielding structure, which includes: a case, a shielding wall, a top cover arranged on the case, and a filter assembly and a main power assembly arranged in the case, the case is provided with a filter cavity and a main power cavity separated by the shielding wall, the filter assembly is arranged in the filter cavity, the main power assembly is arranged in the main power cavity, and the shielding wall and the top cover are connected by metal having electromagnetic shielding effect.

[0006] Patent document CN119789369A discloses a new energy vehicle small three-electricity controller, which comprises a circuit board, a field effect transistor MOS tube arranged on the circuit board, an on-board charger OBC module and a direct current converter DCDC module, a plurality of MOS tubes are arranged at opposite ends of the circuit board, and the OBC module and the DCDC module are located between the MOS tubes at the two ends; the small three-electricity controller further comprises a cooling flow channel, the cooling flow channel comprises a bottom plate and a vertical shell wall arranged on the bottom plate; the vertical shell wall and the bottom plate form a cavity with an open end, the cavity is used for accommodating the OBC module and the DCDC module, a plurality of surfaces of the OBC module and the DCDC module are in direct contact with the surface of the cooling flow channel, and the MOS tube is connected with the side surface of the vertical shell wall.

[0007] The above-mentioned patent document discloses the existing technology of the single-layer structure of the vehicle-mounted power supply system in the traditional process, and with the development of the vehicle-mounted power supply system, the power device presents a high-density trend, therefore, the double-layer shell is born, and by arranging different types of power devices in two cavities which can be distributed in the height direction, the heat dissipation efficiency is improved.

[0008] Patent document CN119893941A discloses a vehicle-mounted charger and a new energy vehicle, the vehicle-mounted charger comprises a shell and a cooling flow channel arranged in the middle of the shell in the height direction and in a rotary structure, the cooling flow channel is arranged near the middle of the shell in the height direction, so that the shell is divided into two regions with a first accommodating space and a second accommodating space by the cooling flow channel in the middle, the cooling flow channel comprises a first flow channel arranged near the first accommodating space and a third flow channel arranged near the second accommodating space, so that the first accommodating space and the second accommodating space in the shell are provided with flow channels to provide heat dissipation function for electronic elements. The upper side of the first flow channel (located on one side of the first accommodating space) is a stepped surface for heat dissipation of IGBT, and the lower side of the first flow channel (located on one side of the second accommodating space) is a first cover plate and a second cover plate for heat dissipation of input inductance and output inductance respectively. The third flow channel near the second accommodating space is actually used for heat dissipation of electronic devices in the mounting groove in the first accommodating space.

[0009] In this prior art, horizontal flow channels are arranged on both sides of the shell, and the two horizontal flow channels are staggered in the longitudinal projection and connected by vertical flow channels, the flow channel structure changes depending on the structure change of the flow channel groove in the shell body, and the flow channel cover plate is a plurality of flat plate structures, and although the depth of the cooling flow channel spans the two-layer structure of the shell, the main heat generating devices are still limited to one layer of the shell. These structural characteristics make the heat dissipation effect poor, and process defects such as friction welding at multiple places are prone to occur. SUMMARY

[0010] In response to the problems in the existing technology of poor heat dissipation and many spare parts in the vehicle power system, the present invention provides a double-layer liquid-cooled integrated shell. The double-layer liquid-cooled integrated shell is separated into two layers, upper and lower, by a partition, and both layers are equipped with power devices. Through the "double-layer one-cavity" structure, the coolant is circulated twice in the height direction to achieve simultaneous cooling of the upper and lower layers of power devices.

[0011] The technical solution provided by the present invention to solve the above technical problems is as follows: a double-layer liquid-cooled integrated housing for an on-board power supply system, comprising a main housing and a flow channel cover;

[0012] The main box body includes an integrally formed peripheral frame wall and a central concave-convex wall, wherein the central concave-convex wall divides the main box body into an upper chamber and a lower chamber; the central concave-convex wall has a U-shaped groove on one side of the lower chamber, and a liquid inlet and a liquid outlet are provided on one side wall of the peripheral frame wall;

[0013] The U-shaped groove includes a first transverse shallow groove, a U-shaped deep groove, and a second transverse shallow groove in sequence; the first transverse shallow groove and the second transverse shallow groove are connected to the liquid inlet and the liquid outlet, respectively; the depth of the first transverse shallow groove and the second transverse shallow groove is less than half the depth of the U-shaped deep groove;

[0014] The U-shaped deep groove includes, in sequence, a first transverse deep groove connected to the first transverse shallow groove, a connecting groove, and a second transverse deep groove connected to the second transverse shallow groove; the first transverse shallow groove and the U-shaped deep groove are connected by a guide slope;

[0015] The flow channel cover plate includes a U-shaped sealing plate, an L-shaped raised guide body is provided on the inner side of the sealing plate, and the L-shaped raised guide body is provided with an inclined edge opposite to the guide slope;

[0016] The L-shaped protruding guide body extends into the first transverse deep groove and the connecting groove to guide the flow channel obliquely upward from the first transverse shallow groove to the bottom of the U-shaped deep groove;

[0017] The U-shaped deep groove forms a U-shaped boss in the upper chamber, and the U-shaped boss includes a connecting section corresponding to the connecting groove; the outer surface of the sealing plate is provided with a lower mounting portion for installing a power device, and the surface of the U-shaped boss is provided with an upper mounting portion for installing a power device.

[0018] The preferred technical solution provided by the present invention to solve the above technical problems is as follows: a plurality of upper partition ridges are provided at intervals at the bottom of the second transverse deep groove, and the upper partition ridges separate the connecting groove from the second transverse deep groove and separate the second transverse deep groove into sections;

[0019] The inner side of the sealing plate is provided with a plurality of spaced lower partition protrusions; the lower partition protrusions extend into the second transverse deep groove, and the lower partition protrusions segmentally separate the second transverse deep groove, and the lower partition protrusions are staggered with the upper partition protrusions to guide the flow channel from the bottom of the connecting groove to the second transverse shallow groove in a wave-shaped and circuitous manner in the height direction.

[0020] The preferred technical solution provided by the present application to solve the above technical problems is that the lower mounting part includes a first lower mounting part and a second lower mounting part, the first lower mounting part corresponds to the position of the first transverse shallow groove, and the second lower mounting part corresponds to the positions of the second transverse shallow groove and the second transverse deep groove.

[0021] The preferred technical solution provided by the present application to solve the above technical problems is that the end face height of the upper partition protrusion is consistent with the bottom face height of the second transverse shallow groove.

[0022] The preferred technical solution provided by the present application to solve the above technical problems is that a plurality of shunt ear protrusions with a height lower than the upper partition protrusion are arranged in the U-shaped deep groove.

[0023] The preferred technical solution provided by the present application to solve the above technical problems is that two shunt ear protrusions are arranged in parallel to form a shunt ear pair, and two shunt ear pairs are arranged in parallel along the flow channel direction between two adjacent lower partition protrusions.

[0024] The preferred technical solution provided by the present application to solve the above technical problems is that the inner side of the first arm of the sealing plate is provided with a strip-shaped shunt plate, and the strip-shaped shunt plate is matched with the first transverse shallow groove and located at the middle position of the width of the first transverse shallow groove.

[0025] The preferred technical solution provided by the present application to solve the above technical problems is that the inner side of the second arm of the sealing plate is provided with a plurality of turbulence ridge pairs, the turbulence ridge pair includes an outer ridge and an inner ridge, at least the outer ridge is in an arc-shaped plate structure and has a height smaller than the lower partition protrusion.

[0026] The preferred technical solution provided by the present application to solve the above technical problems is that the lower mounting part and the upper mounting part each include a plurality of rectangular protrusions arranged at intervals.

[0027] The preferred technical solution provided by the present application to solve the above technical problems is that the vehicle-mounted power supply system sequentially includes a first printed circuit board assembly, a double-layer liquid cooling integrated shell for the vehicle-mounted power supply system, and a second printed circuit board assembly from top to bottom; the upper mounting part and the lower mounting part are provided with insulating heat-conducting pads, and power devices on the first printed circuit board assembly and the second printed circuit board assembly are mounted on the insulating heat-conducting pads.

[0028] Compared with the prior art, the application has the advantages that: the flow channel is a slanting flow channel enclosed by the flow guide slope and the inclined edge, and the depth of the flow channel is compressed by the L-shaped convex flow guide, so that the main flow is directly pressed to the groove bottom, the layer change based on the height position of the main box is realized, the whole flow channel is circulated and radiated in two layers, the setting of the slanting flow channel not only avoids excessive pressure loss caused by the right-angle turning, but also prolongs the actual length of the flow channel in the limited space, and forms a cooling buffer zone between the two layers, weakens the interlayer thermal interference, and improves the radiating effect. BRIEF DESCRIPTION OF DRAWINGS

[0029] The application will be described in further detail below with reference to the drawings and preferred embodiments, but those skilled in the art will appreciate that the drawings are only drawn for the purpose of explaining the preferred embodiments and therefore should not be regarded as limiting the scope of the application. In addition, unless specifically indicated, the drawings only schematically show the composition or structure of the described objects and can contain exaggerated display, and the drawings are not necessarily drawn to scale.

[0030] Figure 1 is a schematic view of the vehicle-mounted power supply system in the preferred embodiment of the application;

[0031] Figure 2 is an exploded view of the vehicle-mounted power supply system in the preferred embodiment of the application Figure 1 ;

[0032] Figure 3 is a schematic view of the vehicle-mounted power supply system in the preferred embodiment of the application Figure 2 (inverse);

[0033] Figure 4 is a sectional view of the vehicle-mounted power supply system at E-E in the preferred embodiment of the application;

[0034] Figure 5 is a sectional view of the vehicle-mounted power supply system at C-C in the preferred embodiment of the application;

[0035] Figure 6 is a schematic view of the lower chamber of the main box in the preferred embodiment of the application, facing upward;

[0036] Figure 7 is a partial schematic view of the main box in the preferred embodiment of the application, with the lower chamber facing upward;

[0037] Figure 8 is a schematic view of the upper chamber of the main box in the preferred embodiment of the application, facing upward;

[0038] Figure 9 is a schematic view of the flow channel cover plate in the preferred embodiment of the application Figure 1 ;

[0039] Figure 10Schematic diagram of the flow channel cover plate in the preferred embodiment of the present application Figure 2 ;

[0040] Figure 11 Schematic diagram of the grid-shaped mounting plate in the preferred embodiment of the present application

[0041] Figure 12 Temperature distribution of the double-layer liquid cooling integrated shell when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 6 L / min test condition Figure 1 (lower chamber upward);

[0042] Figure 13 Temperature distribution of the double-layer liquid cooling integrated shell when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 6 L / min test condition Figure 2 (upper chamber upward);

[0043] Figure 14 Temperature distribution of the double-layer liquid cooling integrated shell when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 12 L / min test condition Figure 1 (lower chamber upward);

[0044] Figure 15 Temperature distribution of the double-layer liquid cooling integrated shell when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 12 L / min test condition Figure 2 (upper chamber upward);

[0045] Figure 16 Temperature diagram of the inlet and outlet when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 6 L / min test condition

[0046] Figure 17 Pressure diagram of the inlet and outlet when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 6 L / min test condition

[0047] Figure 18 Temperature diagram of the inlet and outlet when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 12 L / min test condition

[0048] Figure 19 Pressure diagram of the inlet and outlet when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 12 L / min test condition

[0049] Figure 20 Temperature distribution of the cooling liquid in the flow channel when the vehicle-mounted power supply system in the preferred embodiment of the present application is simulated under the cooling liquid flow rate 6 L / min test condition Figure 1 ;

[0050] Figure 21 The temperature distribution of the coolant in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of the coolant flow rate of 6L / min Figure 2 ;

[0051] Figure 22 The coolant flow rate distribution in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of coolant flow rate 6L / min Figure 1 ;

[0052] Figure 23 The coolant flow rate distribution in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of coolant flow rate 6L / min Figure 2 ;

[0053] Figure 24 The temperature distribution of the coolant in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of the coolant flow rate of 12L / min Figure 1 ;

[0054] Figure 25 The temperature distribution of the coolant in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of the coolant flow rate of 12L / min Figure 2 ;

[0055] Figure 26 The coolant flow rate distribution in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of coolant flow rate 12L / min Figure 1 ;

[0056] Figure 27 The coolant flow rate distribution in the flow channel of the vehicle power system in the preferred embodiment of the present invention is simulated under the test condition of coolant flow rate 12L / min Figure 2 . DETAILED DESCRIPTION

[0057] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Those skilled in the art will appreciate that these descriptions are merely illustrative and exemplary and should not be construed as limiting the scope of protection of the present invention.

[0058] It should be noted that like reference numerals denote like items in the following drawings, and thus, once an item is defined in one drawing, it may not be further defined or explained in subsequent drawings.

[0059] In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed during use, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0060] As shown in Figures 1-3 The present embodiment provides a vehicle-mounted power supply system, which comprises a double-layer liquid-cooled integrated shell 10 for vehicle-mounted power supply system, a first printed circuit board assembly 20, a second printed circuit board assembly 30, and a first cover 40 and a second cover 50 for packaging the integrated shell 10. For example, in the present embodiment, the first printed circuit board assembly 20 is a DCDC PCBA, and the second printed circuit board assembly 30 is an OBC PCBA.

[0061] As shown in Figures 1-3 Specifically, the double-layer liquid-cooled integrated shell 10 comprises a main box body 1 and a flow channel cover plate 2. The main box body 1 comprises an integrally formed peripheral wall 111 and a central concave-convex wall 112, and the central concave-convex wall 112 divides the main box body 1 into an upper chamber 101 and a lower chamber 102. The central concave-convex wall 112 has a U-shaped groove 110 on one side of the lower chamber 102, and the peripheral wall 111 has a liquid inlet 113 and a liquid outlet 114 on one side wall thereof. The flow channel cover plate 2 is combined with the main box body 1 by friction stir welding, thereby sealing the U-shaped groove 110, so that the double-layer liquid-cooled integrated shell 10 forms a cooling flow channel that enters the inside of the main box body 1 from the liquid inlet 113 and flows out from the liquid outlet 114.

[0062] In the present embodiment, the flow channel cover plate 2 and the main box body 1 are both pressure-cast open-mold parts, which have simple process and low product unit price. By integrally forming through friction stir welding, the product carrier and the cooling flow channel are formed, which also play the roles of strength protection, heat dissipation, shielding, and the like.

[0063] This cooling and heat dissipation is mainly for the first printed circuit board assembly 20 and the second printed circuit board assembly 30 located in the upper chamber 101 and the lower chamber 102, respectively, and the first printed circuit board assembly 20 and the second printed circuit board assembly 30 have a plurality of power devices 100, such as MOS, thereon. At the same time, other heat-generating components (including capacitors, etc.) in the main box body 1 are also cooled. With the flow of the cooling liquid, the heat of the power devices 100 and other heat-generating components is taken away, thereby enabling the entire vehicle-mounted power supply system to achieve rapid heat dissipation and ensuring efficient and stable operation of the power management system.

[0064] The U-shaped liquid cooling flow channel is common in the field of vehicle power supply system, and the setting purpose is to arrange the liquid inlet 113 and the liquid outlet 114 on the same side. Compared with the traditional U-shaped liquid cooling flow channel, the embodiment obtains a more optimal heat dissipation effect through the structural innovation of the U-shaped groove 110 and the flow channel cover plate 2.

[0065] Compared with the traditional "box + independent liquid cooling plate" and "box + multiple separated flow channel covers", the embodiment simplifies the technical solution to "integrated box + single cover", reduces the number of parts and sealing interfaces, reduces the risk of leakage, and improves the assembly efficiency. The central concave-convex wall 112 divides the main box 1 into an upper chamber 101 and a lower chamber 102, thereby providing independent installation space for the upper and lower two layers of power devices 100, and realizing "one cavity double cooling".

[0066] As shown in Figures 4-7 , the U-shaped groove 110 sequentially includes a first transverse shallow groove 11, a U-shaped deep groove 12, and a second transverse shallow groove 13. The first transverse shallow groove 11 and the second transverse shallow groove 13 are respectively located on the first arm and the second arm of the U-shaped groove 110, the starting end of the first transverse shallow groove 11 is connected with the liquid inlet 113, and the end of the second transverse shallow groove 13 is connected with the liquid outlet 114. The U-shaped deep groove 12 is located on the side away from the liquid inlet 113 and the liquid outlet 114, and connects the first transverse shallow groove 11 and the second transverse shallow groove 13.

[0067] The depths of the first transverse shallow groove 11 and the second transverse shallow groove 13 are both less than half of the depth of the U-shaped deep groove 12. This means that from the height direction, the flow channel formed by the first transverse shallow groove 11 and the second transverse shallow groove 13 is located in the lower half of the double-layer liquid cooling integrated shell 10, and the U-shaped deep groove 12 is deep into the upper half of the double-layer liquid cooling integrated shell 10.

[0068] As shown in Figures 4-7 , the U-shaped deep groove 12 sequentially includes a first transverse deep groove 121 connected with the first transverse shallow groove 11, a connecting groove 122, and a second transverse deep groove 123 connected with the second transverse shallow groove 13. The first transverse shallow groove 11 and the first transverse deep groove 121 form the first arm of the U-shaped groove 110, the second transverse shallow groove 13 and the second transverse deep groove 123 form the second arm of the U-shaped groove 110, and the connecting groove 122 connects the first arm and the second arm of the U-shaped groove 110.

[0069] The first transverse shallow groove 11 and the U-shaped deep groove 12 are connected through a flow guide inclined surface 14. As shown in Figures 9-10 , the flow channel cover plate 2 includes a U-shaped sealing plate 21, and the inner side of the sealing plate 21 is provided with an L-shaped protruding flow guide 22, and the L-shaped protruding flow guide 22 is provided with an inclined edge 220 opposite to the flow guide inclined surface 14.

[0070] As shown in Figures 4-5As shown, when the flow channel cover plate 2 closes the U-shaped deep groove 12, the sealing plate 21 is friction-welded with the edge of the groove of the U-shaped deep groove 12, and the first lower layer flow channel S3 is formed at the first transverse shallow groove 11, and the L-shaped protruding guide body 22 is adapted to the shape of the first transverse deep groove 121 and the connecting groove 122, and extends into the first transverse deep groove 121 and the connecting groove 122, thereby guiding the flow channel obliquely upward from the first transverse shallow groove 11 to the bottom of the U-shaped deep groove 12. Through such a setting, the flow channel passes through the oblique flow channel S1 surrounded by the guide bevel 14 and the inclined edge 220, and the flow channel depth is compressed by the L-shaped protruding guide body 22, pressing the main flow directly to the bottom of the groove, realizing layer change based on the height position of the main box body 1, and the flow channel as a whole is divided into two layers for circulating heat dissipation.

[0071] It should be noted that the provision of oblique flow channel S1 not only avoids excessive pressure loss caused by right-angle turns, but also extends the actual length of the flow channel within a limited space and forms a cooling buffer zone between the two layers, reducing interlayer thermal interference and improving heat dissipation. The L-shaped raised guide body 22 partially intercepts the cross-section of the U-shaped groove 110, reducing the flow channel cross-section and accelerating the coolant flow rate, allowing the coolant to remove more heat in a shorter period of time, significantly improving the heat dissipation efficiency of the upper flow channel.

[0072] like Figure 8 As shown, the U-shaped deep groove 12 forms a U-shaped boss 16 in the upper chamber 101, and the U-shaped boss 16 includes a connecting section 61 corresponding to the connecting groove 122. Figure 10 As shown, the outer surface of the sealing plate 21 is provided with a lower mounting portion 3 for mounting the power device 100 . The surface of the U-shaped boss 16 is provided with an upper mounting portion 4 for mounting the power device 100 .

[0073] Among them, the upper mounting portion 4 includes a first upper mounting portion 41 located on the connecting section 61. The first printed circuit board assembly 20 is placed horizontally in the upper chamber 101. The power device 100 soldered thereto is abutted against the first upper mounting portion 4, and heat is exchanged with the bottom wall of the connecting section 61 through the surface of the U-shaped boss 16. Because the U-shaped deep groove 12 where the connecting groove 122 is located is transferred to the upper layer by the L-shaped protruding guide body 22, the power device 100 of the first printed circuit board assembly 20 is able to exchange heat with the coolant in the upper flow channel.

[0074] Furthermore, the second printed circuit board assembly 30 is placed flat in the lower chamber 102, and the power device 100 welded thereto is abutted against the lower mounting portion 3, and heat is exchanged through the outer surface of the sealing plate 21. The heat exchange direction is located on the side away from the bottom of the U-shaped groove 110, that is, heat is exchanged with the coolant in the lower layer flow channel, thereby avoiding heat dissipation interference between the two layers of structure.

[0075] It should be noted that in the traditional vehicle power supply system, the power device 100 is installed outside the flow channel wall extending in the housing height direction in a plug-in manner, which requires the setting of a corresponding mounting groove, the fixation of metal spring clips, insulating plastic parts, heat conduction sheets, etc., so there are many parts, the process is complicated, and the process cost is high. In this embodiment, this surface compression and close contact method can be fixed by using the compression force of the printed circuit board assembly itself, without metal springs and plastic parts, and good insulation can be achieved, reducing parts and process steps to achieve cost reduction and efficiency improvement.

[0076] More importantly, as shown in Figure 4 , 6 , 7, 10, the bottom of the second transverse deep groove 123 in this embodiment is provided with a plurality of spaced-apart upper protrusions 15, which separate the connecting groove 122 and the second transverse deep groove 123 and segmentally separate the second transverse deep groove 123. The inner side of the sealing plate 21 is provided with a plurality of spaced-apart lower protrusions 23. The lower protrusions 23 extend into the second transverse deep groove 123, the lower protrusions 23 segmentally separate the second transverse deep groove 123, and the lower protrusions 23 are distributed in staggered relationship with the upper protrusions 15 to guide the flow channel from the bottom of the connecting groove 122, and after winding in a wave shape in the height direction, the flow channel is guided downward to the second transverse shallow groove 13. The lower protrusions 23 and the upper protrusions 15 construct the flow channel S2 between the rear end of the connecting groove 122 and the second transverse shallow groove 13 in a wave shape that circulates repeatedly upward and downward. The second transverse shallow groove 13 is closed to form a second lower flow channel S4.

[0077] This way not only increases the length and turbulence of the flow, but also the lower protrusions 23 can play a heat conduction role, guiding the heat on the sealing plate 21 to the flow channel to fully contact the cooling liquid to achieve heat exchange, increase the contact area, and improve the cooling effect; moreover, the lower protrusions 23 and the upper protrusions 15 can also return the flow channel from the upper layer at the end of the connecting groove 122 to the lower layer, and then back to the upper layer, and after several turns, the flow channel is conveniently turned back to the second transverse shallow groove 13 in the lower layer, realizing smooth connection of the flow channel. In addition, in this embodiment, the lower protrusions 23 and the upper protrusions 15 serve as reinforcing ribs while constructing the flow channel, improving the rigidity of the main box body 1 and the flow channel cover plate 2.

[0078] As shown in Figure 10 , the lower mounting part 3 includes a first lower mounting part 31 and a second lower mounting part 32. As shown in Figures 2-9 , the first lower mounting part 31 corresponds in position to the first transverse shallow groove 11, and the second lower mounting part 32 corresponds in position to the second transverse shallow groove 13 and the second transverse deep groove 123. Each mounting unit at the position corresponding to the second transverse deep groove 123 of the second lower mounting part 32 is located between two adjacent upper protrusions 15 and is separate on both sides of the lower protrusion 23, further improving the heat dissipation effect.

[0079] AsFigure 4 、 6 , the end face height of the upper protrusion 15 is consistent with the bottom face height of the second transverse shallow groove 13, which can be beneficial to maintaining fluid pressure and avoiding local cavitation.

[0080] As shown in Figure 6 、 7 , the first-stage upper protrusion 15a closest to the connecting groove 122 in the U-shaped deep groove 12 has an extension direction that forms a 90-degree angle with the extension direction of the other-stage upper protrusions 15, that is, the extension direction of the first-stage upper protrusion 15 is consistent with the extension direction of the first arm and the second arm of the U-shaped groove 110, and the extension direction of the other-stage upper protrusions 15 is consistent with the extension direction of the connecting groove 122, so as to change the flow direction of the flow channel in the horizontal direction.

[0081] As shown in Figure 6 、 7 , the inner side wall of the second transverse deep groove 123 includes a wavy section 18. The wavy section 18 increases the heat dissipation path and the disturbance area, breaks the boundary layer, improves the local heat transfer coefficient, and the smooth curved surface transition avoids the pressure loss and gas stagnation problems caused by the corner.

[0082] As shown in Figure 4 、 6 , 7, the U-shaped deep groove 12 is provided with a plurality of flow distribution lugs 17 with a height lower than the upper protrusion 15, and the upper protrusion 15 is transitioned with a large-angle arc to the groove bottom. The flow distribution lugs 17 form micro-turbulent flow in the main flow, facilitate the flow distribution of the cooling liquid and increase the Reynolds number of the fluid, improve the heat transfer coefficient, and the height of the flow distribution lugs 17 is low, which does not increase the flow resistance, and can improve the gas and water stagnation phenomenon and improve the heat dissipation efficiency.

[0083] As shown in Figure 6 、 7 , two flow distribution lugs 17 are arranged in parallel relative to each other to form a flow distribution lug pair 171, and two flow distribution lug pairs 171 are arranged side by side along the flow direction between the adjacent two lower protrusions 23. Such flow distribution lug pairs 171 are mainly arranged in the second transverse deep groove 123. The flow distribution lug pair 171 generates a "double vortex pair" to enhance the transverse mixing and further uniform the temperature field.

[0084] As shown in Figure 7 , the end section of the wavy section 18 is provided with an inner recess section 181 that is further recessed towards the inner side wall. The inner recess section 181 is provided with a vertical disturbance wall 180 connected thereto, which increases the Reynolds number of the fluid and improves the heat transfer coefficient.

[0085] As shown in Figure 4As shown, the second transverse deep groove 123 and the second transverse shallow groove 13 are connected by a slope, and a heat channel T is formed between the last stage of the second transverse deep groove 123 and the slope, so that the temperature of the cooling liquid in the wave-shaped flow channel S2 is reduced when entering the second lower flow channel S4 of the second transverse shallow groove 13.

[0086] As shown in Figure 5 As shown in FIG. 9, the inner side of the first arm of the sealing plate 21 is provided with a strip-shaped flow distribution plate 24, which matches the first transverse shallow groove 11 and is located at the middle position of the width of the first transverse shallow groove 11. The strip-shaped flow distribution plate 24 divides the single flow into two symmetrical branch flows, eliminates the deflection, and improves the transverse temperature uniformity. In addition, the two top corners of the strip-shaped flow distribution plate 24 are in a circular arc transition structure, which further optimizes the flow channel, reduces the right angle and straight bend, and avoids excessive pressure loss.

[0087] As shown in Figure 9 As shown in FIG. 9, the inner side of the first arm of the sealing plate 21 is provided with a strip-shaped flow distribution plate 24, which matches the first transverse shallow groove 11 and is located at the middle position of the width of the first transverse shallow groove 11. The strip-shaped flow distribution plate 24 divides the single flow into two symmetrical branch flows, eliminates the deflection, and improves the transverse temperature uniformity. In addition, the two top corners of the strip-shaped flow distribution plate 24 are in a circular arc transition structure, which further optimizes the flow channel, reduces the right angle and straight bend, and avoids excessive pressure loss.

[0088] Specifically, the first turbulence ridge pair 251 integrated with the lower partition 23 includes a first outer ridge 25a in an arc-shaped plate structure and a first inner ridge 25b on both sides of the lower partition 23. The first inner ridge 25b is in a triangular plate-like structure and gradually shrinks in width to the end of the lower partition 23, thereby playing a role in strengthening the structural rigidity. The second turbulence ridge pair 252 arranged at the position of the second transverse shallow groove 13 includes a second outer ridge 25c in an arc-shaped plate structure and a second inner ridge 25d. The second outer ridge 25c and the second inner ridge 25d are parallel and have the same height.

[0089] As shown in Figure 8 , 10 As shown in FIG. 8, the lower mounting part 3 and the upper mounting part 4 each include a plurality of rectangular protrusions 7 distributed at intervals. To match the rectangular protrusions 7, the grid-shaped mounting plate 8 has rectangular through holes 82 through which the rectangular protrusions 7 pass to determine the relative position of the grid-shaped mounting plate 8 and the main box body 1, thereby playing a positioning role. Around the rectangular through holes 82 of the grid-shaped mounting plate 8, there is a stepped recess 81, which is a containing position for the power device 100.

[0090] As Figures 2-3 shown in 8-11, the upper mounting portion 4 and the lower mounting portion 3 are provided with an insulating and heat-conducting pad 70, which is arranged on the rectangular protrusion 7 and / or constitutes the rectangular protrusion 7, and the power devices 100 on the first printed circuit board assembly 20 and the second printed circuit board assembly 30 are mounted on the insulating and heat-conducting pad 70, which serves as an insulating and heat-conducting medium.

[0091] As Figure 8 shown in 8-11, the upper mounting portion 4 and the lower mounting portion 3 are provided with an insulating and heat-conducting pad 70, which is arranged on the rectangular protrusion 7 and / or constitutes the rectangular protrusion 7, and the power devices 100 on the first printed circuit board assembly 20 and the second printed circuit board assembly 30 are mounted on the insulating and heat-conducting pad 70, which serves as an insulating and heat-conducting medium.

[0092] Under the premise of ambient temperature 85℃ and cooling liquid being a mixture of ethylene glycol and water in a ratio of 1:1, simulation comparison experiments are carried out on the vehicle power supply system at two cooling liquid flow rates of 6L / min and 12L / min, respectively.

[0093] As Figures 12-15 shown in 8-11, the upper mounting portion 4 and the lower mounting portion 3 are provided with an insulating and heat-conducting pad 70, which is arranged on the rectangular protrusion 7 and / or constitutes the rectangular protrusion 7, and the power devices 100 on the first printed circuit board assembly 20 and the second printed circuit board assembly 30 are mounted on the insulating and heat-conducting pad 70, which serves as an insulating and heat-conducting medium.

[0094] As Figures 16-19 shown in 8-11, the upper mounting portion 4 and the lower mounting portion 3 are provided with an insulating and heat-conducting pad 70, which is arranged on the rectangular protrusion 7 and / or constitutes the rectangular protrusion 7, and the power devices 100 on the first printed circuit board assembly 20 and the second printed circuit board assembly 30 are mounted on the insulating and heat-conducting pad 70, which serves as an insulating and heat-conducting medium.

[0095] As Figure 20 、 22 , 24, 26 shown, under the conditions of two cooling liquid flow rates of 6L / min and 12L / min, the cooling liquid flow rate of the first lower flow channel S3 at the first transverse shallow groove is fast and the temperature is low, which can quickly take away the heat of the power devices of the second printed circuit board assembly 30 at the first lower mounting portion 31. Figure 20 、 22 , 24, 26 shown, when the cooling liquid passes through the oblique flow channel S1, the temperature of the cooling liquid increases due to the absorption of heat, at this time, the flow rate slows down, the heat is exchanged with the main box body 1, and the temperature decreases when passing through the connecting groove, which can cool the power devices of the first printed circuit board assembly 20 on the first upper mounting portion 41.

[0096] As Figure 21 , 23 shown in 25, 27, when the cooling liquid passes through the wave-shaped flow channel S2, due to the structural characteristics of the flow channel, the cooling liquid temperature of the upper and lower boundaries of the flow channel is kept at a low level, so the power devices of the first printed circuit board assembly 20 and the second printed circuit board assembly 30 at this position can be cooled at the same time. When the cooling liquid flows into the second lower flow channel S4 at the second transverse shallow groove 13 from the wave-shaped flow channel S2 along the inclined surface, the flow rate is increased, thereby quickly taking away the heat of the power devices of the second printed circuit board assembly 30 at the second lower mounting part 32.

[0097] The double-layer liquid cooling integrated shell for vehicle-mounted power supply system and the vehicle-mounted power supply system provided by the present application are described in detail above, and the principles and implementation modes of the present application are described by applying specific examples in this paper. The above description of the embodiments is only used to help understand the present application and the core idea. It should be pointed out that for ordinary skilled persons in the technical field, the implementation of each section can be separated or combined without departing from the principles of the present application, and the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. Double-layer liquid-cooled integrated housing for vehicle power system, characterized by Including main box and flow channel cover; The main box body includes an integrally formed peripheral frame wall and a central concave-convex wall, wherein the central concave-convex wall divides the main box body into an upper chamber and a lower chamber; the central concave-convex wall has a U-shaped groove on one side of the lower chamber, and a liquid inlet and a liquid outlet are provided on one side wall of the peripheral frame wall; The U-shaped groove includes a first transverse shallow groove, a U-shaped deep groove, and a second transverse shallow groove in sequence; the first transverse shallow groove and the second transverse shallow groove are connected to the liquid inlet and the liquid outlet, respectively; the depth of the first transverse shallow groove and the second transverse shallow groove is less than half the depth of the U-shaped deep groove; The U-shaped deep groove includes, in sequence, a first transverse deep groove connected to the first transverse shallow groove, a connecting groove, and a second transverse deep groove connected to the second transverse shallow groove; the first transverse shallow groove and the U-shaped deep groove are connected by a guide slope; The flow channel cover plate includes a U-shaped sealing plate, an L-shaped raised guide body is provided on the inner side of the sealing plate, and the L-shaped raised guide body is provided with an inclined edge opposite to the guide slope; The L-shaped protruding guide body extends into the first transverse deep groove and the connecting groove to guide the flow channel obliquely upward from the first transverse shallow groove to the bottom of the U-shaped deep groove; The U-shaped deep groove forms a U-shaped boss in the upper chamber, and the U-shaped boss includes a connecting section corresponding to the connecting groove; the outer surface of the sealing plate is provided with a lower mounting portion for installing a power device, and the surface of the U-shaped boss is provided with an upper mounting portion for installing a power device.

2. The double-layer liquid-cooled integrated housing for the vehicle power system according to claim 1, characterized in that: A plurality of upper partition ridges are provided at the bottom of the second transverse deep groove, which are spaced apart from each other. The upper partition ridges separate the connecting groove from the second transverse deep groove and separate the second transverse deep groove into sections. The inner side of the sealing plate is provided with a plurality of spaced-apart lower partition bulges; the lower partition bulges extend into the second transverse deep groove, and the lower partition bulges separate the second transverse deep groove into sections. The lower partition bulges and the upper partition bulges are staggered to lead the flow channel out from the bottom of the connecting groove and guide it downward to the second transverse shallow groove after winding in a wave-like manner in the height direction.

3. The double-layer liquid-cooled integrated housing for the vehicle power system according to claim 3, characterized in that: The lower mounting portion includes a first lower mounting portion and a second lower mounting portion. The first lower mounting portion corresponds to the first horizontal shallow groove, and the second lower mounting portion corresponds to the second horizontal shallow groove and the second horizontal deep groove.

4. The double-layer liquid-cooled integrated housing for an on-vehicle power system according to claim 2, characterized in that: The height of the end surface of the upper partition protrusion is consistent with the height of the bottom surface of the second transverse shallow groove.

5. The double-layer liquid-cooled integrated housing for the vehicle-mounted power system according to claim 2, characterized in that: A plurality of diversion ear protrusions whose height is lower than that of the upper partition protrusion are arranged in the U-shaped deep groove.

6. The double-layer liquid-cooled integrated housing for the vehicle-mounted power system according to claim 5, characterized in that: The two diverter ear convexities are arranged in parallel and spaced apart to form a diverter ear pair, and two diverter ear pairs arranged in parallel along the flow channel direction are arranged between two adjacent lower partition convexities.

7. The double-layer liquid-cooled integrated housing for an on-vehicle power system according to claim 1, characterized in that: A strip-shaped diverter plate is provided on the inner side of the first arm of the sealing plate. The strip-shaped diverter plate matches the first transverse shallow groove and is located in the middle of the width of the first transverse shallow groove.

8. The double-layer liquid-cooled integrated housing for an on-vehicle power system according to claim 2, characterized in that: A plurality of spoiler ridge pairs are provided on the inner side of the second arm of the sealing plate. The spoiler ridge pairs include outer ridges and inner ridges. At least the outer ridges are in an arc-shaped plate structure and are smaller in height than the lower partition ridges.

9. The double-layer liquid-cooled integrated housing for an on-vehicle power system according to claim 1, characterized in that: The lower mounting portion and the upper mounting portion both include a plurality of rectangular protrusions distributed at intervals.

10. The vehicle power supply system is characterized by: From top to bottom, it includes a first printed circuit board assembly, a double-layer liquid-cooled integrated housing for an on-board power supply system as described in any one of claims 1 to 9, and a second printed circuit board assembly; the upper mounting portion and the lower mounting portion are provided with insulating thermal pads, and the power devices on the first printed circuit board assembly and the second printed circuit board assembly are mounted on the insulating thermal pads.

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