Chip mounter vacuum switching device

Abstract

The invention relates to the technical field of chip production, in particular to a chip mounter vacuum switching device which comprises a bottom plate and a limiting plate, the limiting plate is arranged on the upper side of the bottom plate, two openings are formed in the limiting plate, a plurality of adsorption holes are formed in the bottom plate, the adsorption holes are communicated through two sets of ventilation pipes, and the two sets of ventilation pipes are communicated with the limiting plate. A first adsorption area and a second adsorption area are formed in the two openings of the limiting plate respectively, and the number of adsorption holes in the first adsorption area is larger than that in the second adsorption area; a mounting opening is formed in the middle of the bottom plate, a mounting pipe communicated with the mounting opening is connected to the bottom of the bottom plate, an adjusting assembly is arranged in the mounting opening and comprises an adjusting pipe, an elastic pipe, an adjusting opening and two cleaning openings, the adjusting pipe is rotationally arranged in the mounting opening, and the elastic pipe is a folding pipe. The two adsorption areas with different suction forces are provided, and the adsorption areas on the two sides can be cleaned at the same time at regular intervals.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a vacuum switching device for a chip placement machine. Background Art

[0002] The placement machine is the core equipment of surface mount technology and advanced packaging technology. It is responsible for placing precision devices such as bare chips, wafer-level packaging components, multi-chip modules, etc. onto substrates or lead frames with high precision. The position of the substrate needs to be fixed during the placement process.

[0003] The patent with publication number CN114760773A discloses an anti-displacement patch device for an SMT patch machine, which relates to the technical field of patch machines and includes a base and a guide seat. Conveying components are movably installed on the front and rear sides above the base. The guide seat is located below the conveying component. A slide rail is provided at one end of the top of the guide seat, and a slide plate is movably installed on the slide rail through a slider. The slide plates are provided in multiple groups, and both ends of the tops of the multiple groups of slide plates are provided with electric telescopic rods, and the output ends of the electric telescopic rods are provided with supporting boxes; adsorption holes are provided on the top of the supporting box, and multiple groups of adsorption holes are provided; the above-mentioned patch device transmits the substrate through the conveying component, and provides suction through a suction pump and a stretching tube. The suction acts on the substrate from the adsorption holes to fix the substrate and prevent displacement. There is no rigid clamping in the entire fixing process to avoid damage to the substrate.

[0004] During the process of adsorption of the substrate by the adsorption hole, some component residues may block the nozzle hole or environmental dust may enter the air path, thereby reducing the adsorption effect of the adsorption hole, making it impossible to effectively fix the substrate during the processing, affecting the processing accuracy. Summary of the Invention

[0005] The purpose of the present invention is to solve the shortcomings in the prior art that some component residues may block the suction nozzle holes or environmental dust may enter the air path, thereby reducing the adsorption effect of the adsorption holes, making it impossible to effectively fix the substrate during processing, affecting the processing accuracy, and propose a vacuum switching device for a placement machine.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions: A vacuum switching device for a placement machine includes: a base plate and a limiting plate, wherein the limiting plate is arranged on the upper side of the base plate and has two openings. The base plate is provided with a plurality of adsorption holes, the plurality of adsorption holes being connected through two groups of vent pipes, and a first adsorption area and a second adsorption area are formed inside the two openings of the limiting plate, respectively. The number of adsorption holes inside the first adsorption area is greater than the number inside the second adsorption area. A mounting port is provided in the middle of the base plate, and a mounting tube connected to the mounting port is connected to the bottom of the base plate. An adjusting assembly is provided inside the mounting port. The adjusting assembly includes an adjusting tube, an elastic tube, an adjusting port and two cleaning ports. The adjusting tube is rotatably provided inside the mounting port. The elastic tube is a folding tube and is rotatably connected to the bottom of the adjusting tube for driving the adjusting tube to move up and down. The adjusting port is provided on the side of the adjusting tube. The adjusting rod rotates so that the adjusting port is connected to the elastic tube adjusted in the first adsorption area and the second adsorption area. The two cleaning ports are symmetrically provided on the adjusting tube and symmetrically provided below the adjusting port for connecting the first adsorption area and the second adsorption area.

[0007] Preferably, a spacer ring is provided at the bottom of the mounting tube, an opening is provided in the middle of the spacer ring for communicating with the bottom of the adjusting tube, the opening is arranged in an inverted frustum shape, and a plurality of guide ports for communicating with the elastic tube are provided on the side of the spacer ring.

[0008] Preferably, a rotating rod is fixed to the upper end of the adjusting tube, and the rotating rod is used to drive the adjusting tube to rotate.

[0009] Preferably, a limiting assembly is provided between the mounting tube and the elastic tube, and the limiting assembly is used to limit the rotation of the adjusting tube. The limiting assembly includes two limiting rings and an extrusion ring, and the extrusion ring is fixedly connected to the bottom end of the adjusting tube. The two limiting rings are fixedly connected to the inner wall of the mounting tube, and the extrusion ring is located between the two limiting rings.

[0010] Preferably, the diameter of the upper section of the installation opening is larger than the diameter of the lower section, and a sealing ring is provided at the top end of the adjustment tube. The sealing ring is provided at the upper section of the installation opening to limit the downward movement of the adjustment tube.

[0011] Preferably, a sliding opening is provided in the middle of the limiting plate between the first adsorption area and the second adsorption area, and a cleaning component is provided inside the sliding opening, and the cleaning component is used to clean the bottom plate.

[0012] Preferably, the cleaning assembly includes a telescopic tube, a sliding block, two side frames and two cleaning sheets, the telescopic tube is fixedly installed at one end of the sliding opening, the sliding block is fixedly connected to the other end of the telescopic tube and is slidably arranged inside the sliding opening, the two side frames are symmetrically fixedly connected on both sides of the sliding block, and the two cleaning sheets are respectively fixedly connected to the ends of the two side frames and are in contact with the bottom plate.

[0013] Preferably, the sliding opening is a strip-shaped opening, the middle of the sliding opening is set to be circular, and both sides are set to be downwardly inclined strip openings, and the diameter of the middle of the sliding opening is larger than the diameter of the telescopic tube after contraction.

[0014] Preferably, a connecting port is provided at the top of the adjusting tube, and a connecting component is provided inside the connecting port, and the connecting component is used to connect the adjusting tube and the telescopic pipe.

[0015] Preferably, the connecting assembly includes a rotating part, a mounting part and a connecting pipe, the rotating part is rotatably mounted inside the connecting port, the mounting part is fixedly connected to the side of the limiting plate and is fixedly connected to the telescopic pipe, and the connecting pipe is fixedly connected between the rotating part and the mounting part.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting the first adsorption area and the second adsorption area on the bottom plate, when one adsorption area is blocked, the adjustment port can be transferred from the adsorption area on one side to the adsorption area on the other side by rotating the adjustment tube, so that the adsorption area can be quickly replaced. At the same time, due to the different weights of substrates, in order to ensure the adsorption and fixation of substrates of different weights, when the substrate mass is small, the first adsorption area with a large number of adsorption holes and a strong suction force can be selected for adsorption and fixation. When the substrate mass is large, the second adsorption area can be selected for adsorption and fixation. The selection is made independently according to the substrate to be adsorbed; 2. When regularly cleaning the first adsorption area and the second adsorption area, adjust the positive and negative pressure of the vacuum pump and ventilate the inside of the regulating tube through the vacuum pump. At this time, the cleaning ports on both sides will be connected to the first adsorption area and the second adsorption area at the same time, and the ventilation pipe and adsorption holes will be cleaned quickly; 3. The positive and negative pressure inside the elastic tube is adjusted by the inflation and suction of the vacuum pump, thereby controlling the expansion and contraction state of the elastic tube and driving the regulating tube to move up and down. When the elastic tube is under negative pressure, the regulating tube is used for negative pressure adsorption, and when the elastic tube is under positive pressure, the regulating tube is used for cleaning. 4. By setting two limiting rings inside the mounting tube and an extrusion ring at the upper end of the adjusting tube, when the elastic tube is in the contracted state, the extrusion ring below the adjusting tube elastically squeezes the limiting ring below, and when the elastic tube is in the extended state, the extrusion ring below the adjusting tube elastically squeezes the limiting ring above. Therefore, when in operation, the limiting assembly generates a vertical force to limit the position of the adjusting tube, preventing the adjusting tube from rotating during operation and limiting the adjustment spacing of the adjusting tube. 5. When the vacuum pump is inflated, first ventilate normally and clean the dust and impurities inside the adsorption hole and the vent pipe. After cleaning for a period of time, when the power of the vacuum pump is increased, due to the small aperture of the adsorption hole, the continuously introduced gas cannot be discharged quickly, which will cause the excess gas to be squeezed into the telescopic pipe, thereby driving the telescopic pipe to expand and extend, pushing the sliding block to slide inside the sliding port, and the moving sliding block drives the cleaning pieces on both sides to move on the bottom surface. The cleaning pieces on both sides push the cleaned dust and impurities in a direction, pushing the dust and impurities to one side, thereby facilitating later cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a front structural diagram of a vacuum switching device for a chip placement machine proposed by the present invention; Figure 2 This is a schematic diagram of the bottom structure of a vacuum switching device for a chip mounter proposed by the present invention; Figure 3 This is a schematic diagram of the adsorption hole structure of a vacuum switching device for a chip mounter proposed by the present invention; Figure 4 This is a schematic diagram of the structure of a regulating tube of a vacuum switching device for a chip placement machine proposed by the present invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the bottom plate of a vacuum switching device for a chip placement machine proposed by the present invention; Figure 6 for Figure 5 Schematic diagram of the enlarged structure at A in the middle; Figure 7 This is a schematic diagram of the cross-sectional structure of an adjustment component of a vacuum switching device for a chip placement machine proposed by the present invention; Figure 8 This is a schematic diagram of the cross-sectional structure of a connection component of a vacuum switching device for a chip placement machine proposed by the present invention; Figure 9 This is a schematic structural diagram of a cleaning component of a vacuum switching device for a chip placement machine proposed by the present invention.

[0018] In the figure: 1. Base plate; 2. Limit plate; 3. Adsorption hole; 4. Mounting tube; 5. Adjustment assembly; 51. Adjustment tube; 52. Elastic tube; 53. Adjustment port; 54. Cleaning port; 6. Limit assembly; 61. Limit ring; 62. Extrusion ring; 7. Cleaning assembly; 71. Telescopic pipe; 72. Sliding block; 73. Side frame; 74. Cleaning sheet; 8. Connecting assembly; 81. Rotating part; 82. Mounting part; 83. Connecting pipe; 9. Spacer ring; 10. Rotating rod. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] The terms "upper", "lower", "left", "right", "middle" and "one" used in the present invention are only for the convenience of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships should be regarded as within the scope of the present invention without substantially changing the technical content.

[0021] Reference Figures 1-9 A vacuum switching device for a placement machine includes: a bottom plate 1 and a limiting plate 2, wherein the limiting plate 2 is arranged on the upper side of the bottom plate 1 and has two openings. A plurality of adsorption holes 3 are provided on the bottom plate 1, and the plurality of adsorption holes 3 are connected through two groups of vent pipes, and a first adsorption area and a second adsorption area are formed inside the two openings of the limiting plate 2, respectively. The number of adsorption holes 3 inside the first adsorption area is greater than the number inside the second adsorption area. A mounting port is provided in the middle of the base plate 1, and a mounting pipe 4 connected to the mounting port is connected to the bottom of the base plate 1. An adjusting component 5 is provided inside the mounting port. The adjusting component 5 includes an adjusting tube 51, an elastic tube 52, an adjusting port 53 and two cleaning ports 54. The adjusting tube 51 is rotatably provided inside the mounting port. The elastic tube 52 is a folding tube and is rotatably connected to the bottom of the adjusting tube 51 to drive the adjusting tube 51 to move up and down. The adjusting port 53 is provided on the side of the adjusting tube 51. The adjusting rod rotates to switch the ventilation pipe adjusted by the adjusting port 53 in the first adsorption area and the second adsorption area. The two cleaning ports 54 are symmetrically provided on the adjusting tube 51 and symmetrically provided below the adjusting port 53 to connect the first adsorption area and the second adsorption area.

[0022] In the embodiment of the application of the above technical solution, during the vacuum adsorption process of the substrate, residues on the bottom of the substrate and dust in the environment will be transferred to the inside of the adsorption hole 3, causing the adsorption hole 3 to be blocked. When the adsorption hole 3 is blocked, it needs to be cleaned in time, otherwise it will affect the adsorption effect of the substrate, but cleaning will affect the processing efficiency of the placement machine.

[0023] When the substrate is placed on the limiting plate 2, the two adsorption areas below are both located below the substrate, and a vacuum adsorption area can be formed. By setting the first adsorption area and the second adsorption area on the bottom plate 1, after the adsorption area on one side is blocked, the adjustment port 53 can be transferred from the adsorption area on one side to the adsorption area on the other side by rotating the adjustment tube 51, so as to quickly change the adsorption area. At the same time, due to the different weights of the substrates, in order to ensure the adsorption and fixation of substrates of different weights, when the substrate mass is small, the first adsorption area with a large number of adsorption holes 3 and a large suction force can be selected for adsorption and fixation. When the substrate mass is large, the second adsorption area can be selected for adsorption and fixation. The selection is made independently according to the substrate to be adsorbed. At the same time, when regularly cleaning the first adsorption area and the second adsorption area, the positive and negative pressure of the vacuum pump is adjusted, and air is ventilated to the inside of the adjustment tube 51 through the vacuum pump. At this time, the cleaning ports 54 on both sides will be connected to the first adsorption area and the second adsorption area at the same time, and the ventilation tube and the adsorption hole 3 will be quickly cleaned.

[0024] The present invention provides two adsorption areas with different suction forces. When the adsorption hole 3 on one side is clogged, resulting in insufficient adsorption force, the adsorption can be quickly switched to the other side for adsorption, thereby ensuring the adsorption of the substrate during long-term processing. At the same time, the adsorption areas on both sides can be cleaned regularly.

[0025] The preferred technical solution in this embodiment is: Reference Figure 6 A spacer ring 9 is provided at the bottom of the mounting tube 4, and an opening is provided in the middle of the spacer ring 9 to communicate with the bottom of the adjusting tube 51. The opening is set to be an inverted frustum shape, and a plurality of guide ports to communicate with the elastic tube 52 are provided on the side of the spacer ring 9.

[0026] The spacer ring 9 divides the mounting tube 4 into a central opening portion and an outer blocking portion, dividing the air flow generated during the vacuum pump's evacuation and inflation. When the vacuum pump is not working, the elastic tube 52 supports the regulating tube 51 due to its own elastic effect. The outer side of the elastic tube 52 is a folded elastic ring, and the inner part of the ring has an air cavity. At the same time, an elastic member (the elastic member can be a spring or an elastic strip) is provided inside for support, thereby extending the service life of the elastic tube 52. The elastic tube 52 is staggered with the regulating port 53 and the two cleaning ports 54 on the side. When not in use, dust in the air is reduced from entering the regulating tube 51, avoiding blockage of the connection between the mounting tube 4 and the vacuum pump. During the process of the vacuum pump evacuating the mounting tube 4, the spacer ring 9 is provided to evacuate the air from the inside of the elastic tube 52, extracting the gas inside the elastic tube 52, causing the elastic tube 52 to be compressed under the action of negative pressure. The elastic tube 52 drives the adjustment tube 51 downward, so that the adjustment port 53 is connected to the side vent pipe. The first adsorption area or the second adsorption area is vacuumed through the vent pipe, and the substrate is vacuum adsorbed. During the process of the vacuum pump inflating and cleaning the interior, the vacuum pump ventilates the interior of the mounting tube 4. The introduced gas is blocked by the spacer ring 9 and rushes into the interior of the elastic tube 52 from the guide port, causing the elastic tube 52 to expand, thereby pushing the regulating tube 51 upward, so that the two cleaning ports 54 on the regulating tube 51 are respectively connected to the ventilation pipes on both sides, and the air pushed by the vacuum pump is directed to the first adsorption area and the second adsorption area, blowing out the dust inside the ventilation pipes of the first adsorption area and the second adsorption area, and at the same time causing an outward impact on the blockage inside the adsorption hole 3, thereby cleaning the adsorption hole 3.

[0027] The positive and negative pressures inside the elastic tube 52 are adjusted by the inflation and suction of the vacuum pump, thereby controlling the expansion and contraction state of the elastic tube 52 and driving the regulating tube 51 to move up and down. When the elastic tube 52 is under negative pressure, the regulating tube 51 is used for negative pressure adsorption. When the elastic tube 52 is under positive pressure, the regulating tube 51 is used for cleaning.

[0028] Reference Figure 7 A rotating rod 10 is fixed to the upper end of the adjusting tube 51, and the rotating rod 10 is used to drive the adjusting tube 51 to rotate.

[0029] Since the position of the regulating port 53 inside the regulating tube 51 needs to be rotated, the regulating port 53 is rotated and connected to the corresponding vent pipe position. The rotating rod 10 can be manually rotated. At this time, the rotating rod 10 can be set to be L-shaped, or the rotating rod 10 can be pushed by an external electric push rod. The regulating tube 51 is driven to rotate by the rotating rod 10, thereby realizing rapid change and adjustment of the adsorption area.

[0030] Reference Figure 7 A limiting assembly 6 is provided between the mounting tube 4 and the elastic tube 52. The limiting assembly 6 is used to limit the rotation of the adjusting tube 51. The limiting assembly 6 includes two limiting rings 61 and an extrusion ring 62. The extrusion ring 62 is fixedly connected to the bottom end of the adjusting tube 51. The two limiting rings 61 are fixedly connected to the inner wall of the mounting tube 4. The extrusion ring 62 is located between the two limiting rings 61.

[0031] To facilitate the rotation of the regulating tube 51, the regulating tube 51 is rotatably connected to the interior of the mounting cavity with a small gap. However, during the process of pumping or filling, the gas moves horizontally between the regulating tube 51 and the vent pipe. This horizontal movement of the gas may push the regulating tube 51 in the gap, causing the regulating tube 51 to deflect. This will reduce the ventilation area between the regulating port 53 and the vent pipe, thereby affecting the gas flow rate and the adsorption effect. By arranging two limiting rings 61 inside the mounting tube 4 and an extrusion ring 62 at the upper end of the adjusting tube 51, when the elastic tube 52 is in a contracted state, the extrusion ring 62 below the adjusting tube 51 elastically squeezes the limiting ring 61 below, and when the elastic tube 52 is in an extended state, the extrusion ring 62 below the adjusting tube 51 elastically squeezes the limiting ring 61 above. Therefore, when in working state, a vertical force is generated by the limiting assembly 6 to limit the position of the adjusting tube 51, thereby preventing the adjusting tube 51 from rotating during operation and limiting the adjustment spacing of the adjusting tube 51.

[0032] Reference Figure 6 The diameter of the upper section of the installation port is larger than the diameter of the lower section. A sealing ring is provided at the top of the adjusting tube 51. The sealing ring is provided at the upper section of the installation port to limit the downward movement of the adjusting tube 51.

[0033] In order to prevent the gap between the regulating tube 51 and the installation cavity from affecting the normal flow of gas, an elastic sealing ring is set on the top to seal the upper part of the gap, and at the same time, the lower part of the gap is sealed by the mutual extrusion of the limiting ring 61 and the extrusion ring 62, thereby preventing a large amount of gas from entering the gap and affecting the normal flow of gas.

[0034] Reference Figure 8 and Figure 9 A sliding opening is provided in the middle of the limiting plate 2 between the first adsorption area and the second adsorption area, and a cleaning component 7 is provided inside the sliding opening, and the cleaning component 7 is used to clean the bottom plate 1; The cleaning assembly 7 includes a telescopic tube 71, a sliding block 72, two side frames 73 and two cleaning pieces 74. The telescopic tube 71 is fixedly installed at one end of the sliding opening. The sliding block 72 is fixedly connected to the other end of the telescopic tube 71 and is slidably arranged inside the sliding opening. The two side frames 73 are symmetrically fixedly connected to both sides of the sliding block 72. The two cleaning pieces 74 are respectively fixedly connected to the ends of the two side frames 73 and are in contact with the bottom plate 1. The sliding opening is a strip-shaped opening, and the middle portion of the sliding opening is set to be circular, and the two sides are set to be downwardly inclined strip openings. The diameter of the middle portion of the sliding opening is larger than the diameter of the telescopic tube 71 after contraction; The top of the regulating tube 51 is provided with a connection port, inside which a connection assembly 8 is provided, and the connection assembly 8 is used to connect the regulating tube 51 and the telescopic pipe 71; The connecting assembly 8 includes a rotating member 81, a mounting member 82 and a connecting pipe 83. The rotating member 81 is rotatably mounted inside the connecting port. The mounting member 82 is fixedly connected to the side of the limiting plate 2 and is fixedly connected to the telescopic pipe 71. The connecting pipe 83 is fixedly connected between the rotating member 81 and the mounting member 82.

[0035] During the adsorption process of the substrate, residues at the bottom of the substrate, such as solder paste, glue, etc., will be transferred to the inside of the adsorption hole 3, causing the adsorption hole 3 to be blocked. At the same time, due to negative pressure suction, floating dust in the air will be transferred to the inside of the ventilation pipe, causing the inside of the ventilation pipe to be blocked, causing suction fluctuations, and affecting the adsorption effect on the bottom of the substrate. Therefore, the adsorption hole 3 and the ventilation pipe need to be cleaned regularly.

[0036] During the cleaning process, the two cleaning ports 54 are connected to the two ventilation pipes respectively by expanding the elastic tube 52. The air is introduced into the ventilation pipe and the adsorption hole 3 by the inflation of the vacuum pump. The dust inside the ventilation pipe can be discharged from the adsorption hole 3. At the same time, it is used for inflation to spray out and clean the blockage inside the adsorption hole 3, and form a continuous upward push to prevent dust and debris from falling back.

[0037] When the vacuum pump is exhausted and negative pressure is formed, the gas inside the telescopic tube 71 will be extracted through the connecting pipe 83, causing the telescopic tube 71 to contract, driving the cleaning pieces 74 on both sides to move to a position close to the mounting piece 82. When the vacuum pump is inflated, normal ventilation is first performed to clean the dust and impurities inside the adsorption hole 3 and the vent pipe. After cleaning for a period of time, when the power of the vacuum pump is increased, the adsorption hole 3 is small and the continuously introduced gas cannot be discharged quickly, which will cause the excess gas to be squeezed into the telescopic tube 71, thereby driving the telescopic tube 71 to expand and extend, pushing the sliding block 72, causing the sliding block 72 to slide inside the sliding port. The moving sliding block 72 drives the cleaning pieces 74 on both sides to move on the surface of the bottom, and the dust and impurities cleaned out are pushed in a targeted manner by the cleaning pieces 74 on both sides, pushing the dust and impurities to one side, thereby facilitating subsequent cleaning.

[0038] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A vacuum switching device for a chip placement machine, comprising: A bottom plate (1) and a limiting plate (2), characterized in that the limiting plate (2) is arranged on the upper side of the bottom plate (1), and two openings are provided on the limiting plate (2), a plurality of adsorption holes (3) are provided on the bottom plate (1), the plurality of adsorption holes (3) are respectively connected through two groups of vent pipes, and a first adsorption area and a second adsorption area are respectively formed inside the two openings of the limiting plate (2), and the number of adsorption holes (3) inside the first adsorption area is greater than the number inside the second adsorption area; A mounting port is provided in the middle of the bottom plate (1), and a mounting tube (4) connected to the mounting port is connected to the bottom of the bottom plate (1). An adjusting assembly (5) is provided inside the mounting port. The adjusting assembly (5) comprises an adjusting tube (51), an elastic tube (52), an adjusting port (53) and two cleaning ports (54). The adjusting tube (51) is rotatably provided inside the mounting port. The elastic tube (52) is a folding tube and is rotatably connected to the bottom of the adjusting tube (51) for driving the adjusting tube (51) to move up and down. The adjusting port (53) is provided on the side of the adjusting tube (51). The adjusting rod rotates to switch the adjusting port (53) between the elastic tube (52) adjusted in the first adsorption zone and the second adsorption zone. The two cleaning ports (54) are symmetrically provided on the adjusting tube (51) and symmetrically provided below the adjusting port (53) for connecting the first adsorption zone and the second adsorption zone.

2. A vacuum switching device for a chip mounter according to claim 1, characterized in that: A spacer ring (9) is provided at the bottom of the mounting tube (4), an opening is provided in the middle of the spacer ring (9) and is communicated with the bottom of the regulating tube (51), the opening being arranged in an inverted truncated cone shape, and a plurality of guide ports are provided on the side of the spacer ring (9) and are communicated with the elastic tube (52).

3. A vacuum switching device for a chip mounter according to claim 2, characterized in that: A rotating rod (10) is fixed to the upper end of the regulating tube (51), and the rotating rod (10) is used to drive the regulating tube (51) to rotate.

4. A vacuum switching device for a chip mounter according to claim 1, characterized in that: A limiting assembly (6) is provided between the mounting tube (4) and the elastic tube (52), and the limiting assembly (6) is used to limit the rotation of the regulating tube (51). The limiting assembly (6) comprises two limiting rings (61) and an extrusion ring (62), wherein the extrusion ring (62) is fixedly connected to the bottom end of the regulating tube (51), and the two limiting rings (61) are fixedly connected to the inner wall of the mounting tube (4), and the extrusion ring (62) is located between the two limiting rings (61).

5. A vacuum switching device for a chip mounter according to claim 1, characterized in that: The diameter of the upper section of the installation opening is larger than the diameter of the lower section. A sealing ring is provided at the top of the regulating tube (51). The sealing ring is provided at the upper section of the installation opening and is used to limit the downward movement of the regulating tube (51).

6. A vacuum switching device for a chip mounter according to claim 1, characterized in that: A sliding opening is provided in the middle of the limiting plate (2) between the first adsorption area and the second adsorption area, and a cleaning component (7) is provided inside the sliding opening. The cleaning component (7) is used to clean the bottom plate (1).

7. A vacuum switching device for a chip mounter according to claim 6, characterized in that: The cleaning assembly (7) comprises a telescopic tube (71), a sliding block (72), two side frames (73) and two cleaning sheets (74), wherein the telescopic tube (71) is fixedly mounted on one end of the sliding opening, the sliding block (72) is fixedly connected to the other end of the telescopic tube (71) and is slidably arranged inside the sliding opening, the two side frames (73) are symmetrically fixedly connected to both sides of the sliding block (72), and the two cleaning sheets (74) are respectively fixedly connected to the ends of the two side frames (73) and are in contact with the bottom plate (1).

8. A vacuum switching device for a chip mounter according to claim 7, characterized in that: The sliding opening is a strip-shaped opening, and the middle of the sliding opening is set to be circular, and the two sides are set to be downwardly inclined strip openings. The diameter of the middle of the sliding opening is larger than the diameter of the telescopic tube (71) after contraction.

9. A vacuum switching device for a chip mounter according to claim 7, characterized in that: A connection port is provided at the top of the regulating tube (51), and a connection assembly (8) is provided inside the connection port. The connection assembly (8) is used to connect the regulating tube (51) and the telescopic pipe (71).

10. A vacuum switching device for a chip mounter according to claim 9, characterized in that: The connecting assembly (8) includes a rotating member (81), a mounting member (82) and a connecting pipe (83), wherein the rotating member (81) is rotatably mounted inside the connecting port, the mounting member (82) is fixedly connected to the side of the limiting plate (2) and is fixedly connected to the telescopic pipe (71), and the connecting pipe (83) is fixedly connected between the rotating member (81) and the mounting member (82).

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