Curable composition

Abstract

This curable composition contains quantum dots (A), a polymerizable compound (C), and a polymerization initiator (D), wherein the polymerization initiator (D) contains a compound represented by formula (DA). [In the formula, Rd1 represents a branched hydrocarbon group having 3-20 carbon atoms, which may have a substituent. And each of Rd2-Rd5 independently represents a hydrocarbon group having 1-20 carbon atoms, which may have a substituent. And n represents an integer of 0-4. -CH2-contained in the hydrocarbon group may be substituted by-O-,-S-,-CO-, or-OCO-. ]

Description

TECHNICAL FIELD

[0001] The present application relates to a curable composition containing quantum dots, a cured film, and a display device. BACKGROUND

[0002] A curable composition containing quantum dots and an oxime-based polymerization initiator, and a cured film and a display device formed using the curable composition are described in Patent Literature 1.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: International Publication No. 2016 / 035603 SUMMARY

[0006] The present inventors and others have conducted research, and as a result, it has been found that the problem that a pattern after exposure and development cannot be formed properly in accordance with a mask occurs in the conventional curable composition. The present application provides a curable composition that can form a pattern properly.

[0007] The present application includes the following inventions.

[0008] [1] A curable composition containing quantum dots (A), a polymerizable compound (C), and a polymerization initiator (D),

[0009] The above polymerization initiator (D) contains a compound represented by formula (DA).

[0010]

[0011] [In the formula,

[0012] R d1 represents a branched hydrocarbon group having 3 to 20 carbon atoms that can have a substituent.

[0013] R d2 ~ R d5 each independently represents a hydrocarbon group having 1 to 20 carbon atoms that can have a substituent.

[0014] n represents any one integer of 0 to 4.

[0015] The -CH2- contained in the above hydrocarbon group can be substituted with -O-, -S-, -CO-, or -OCO-.]

[0016] [2] The curable composition according to [1], wherein the above polymerizable compound (C) contains a compound (Ca) having 3 or more ethylenic unsaturated bonds in the molecule and having an acidic functional group.

[0017] [3] The curable composition according to [1] or [2], further comprising a resin (B).

[0018] [4] The curable composition according to [3], wherein the acid value of the resin (B) is 30 mgKOH / g to 150 mgKOH / g based on the solid content.

[0019] [5] The curable composition according to [3] or [4], wherein the content ratio of the quantum dots (A) is 30 mass% to 150 mass% relative to the total amount of the resin (B) and the polymerizable compound (C).

[0020] [6] The curable composition according to any one of [1] to [5], wherein R d1 is a branched saturated hydrocarbon group having 3 to 20 carbon atoms which can have a substituent.

[0021] [7] The curable composition according to any one of [1] to [6], wherein R d2 to R d5 are each independently a saturated hydrocarbon group having 1 to 20 carbon atoms which can have a substituent or an unsaturated hydrocarbon group having 2 to 20 carbon atoms which can have a substituent.

[0022] [8] A cured film formed from the curable composition according to any one of [1] to [7].

[0023] [9] A display device comprising the cured film according to [8].

[0024] According to the present application, a curable composition having excellent pattern delineation can be provided. DETAILED DESCRIPTION

[0025] <Curable Composition>

[0026] The curable composition of the present application comprises quantum dots (A), a polymerizable compound (C), and a polymerization initiator (D).

[0027] <Quantum Dots (A)>

[0028] The quantum dots (A) are semiconductor fine particles having a particle diameter of 1 nm to 100 nm, and are fine particles that absorb ultraviolet light or visible light and emit light using the band gap of the semiconductor.

[0029] As the quantum dots (A), there can be mentioned compounds of Group IIB elements and Group VIA elements such as CdO, CdS, CdSe, CdTe, ZnO, ZnS, ZnSe, ZnTe, HgO, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, etc.; compounds of Group IIIA elements and Group VA elements such as GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, InN, InP, InAs, InSb, GaNP, GaNAs, GaPAs, AlNP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GaInNP, GaInNAs, GaInPAs, InAlNP, InAlNAs, InAlPAs, etc.; compounds of Group IIIA elements and Group VIA elements such as Ga2O3, Ga2S3, Ga2Se3, Ga2Te3, In2O3, In2S3, In2Se3, In2Te3, AgInGaS, etc.; compounds of Group 14 elements and Group VIA elements such as SnS2, SnS, SnSe, SnTe, PdS, PbSe, PbTe, etc.; compounds of Group VA elements and Group VIA elements such as As2O3, As2S3, As2Se3, As2Te3, Sb2O3, Sb2S3, Sb2Se3, Sb2Te3, Bi2O3, Bi2S3, Bi2Se3, Bi2Te3, etc.; compounds of Group IIA elements and Group VIA elements such as MgS, MgSe, MgTe, CaS, CaSe, CaTe, SrS, SrSe, SrTe, BaS, BaSe, BaTe, etc.; simple substances of Group IVA elements, Group VA elements or Group VIA elements such as Si, Ge, etc.

[0030] When the quantum dots (A) contain S and Se, quantum dots surface-modified with a metal oxide or an organic substance can be used. By using the quantum dots surface-modified, S and Se can be prevented from being taken by the reaction components contained in or possibly contained in the curable composition.

[0031] In addition, the quantum dots (A) can be combined with the above-mentioned compounds to form a core-shell structure. As such combinations, there can be mentioned, for example, a particle having a core of CdSe and a shell of ZnS, a particle having a core of InP and a shell of ZnSeS, and the like.

[0032] Since the energy state of the quantum dots (A) depends on the size thereof, the wavelength of light emission can be freely selected by changing the particle diameter. For example, in the case of quantum dots composed only of CdSe, the peak wavelengths of the fluorescence spectra at particle diameters of 2.3 nm, 3.0 nm, 3.8 nm, and 4.6 nm are 528 nm, 570 nm, 592 nm, and 637 nm, respectively.

[0033] In addition, the spectrum of light emitted by the quantum dots (A) is narrow, and by combining light having such a steep peak, the color gamut that can be displayed in a display device including a cured film formed from the curable composition can be expanded. Furthermore, the quantum dots (A) have high responsiveness, and can efficiently utilize light radiated from a light source.

[0034] The curable composition can contain only one kind of quantum dots that emit light of a specific wavelength by light radiated from a light source, or can contain two or more kinds of quantum dots that emit light of different wavelengths. As the light of a specific wavelength, there can be mentioned, for example, red light, green light, and blue light.

[0035] The content of the quantum dots (A) in the curable composition is, for example, 1 to 80 mass%, preferably 10 to 70 mass%, more preferably 15 to 60 mass%, further preferably 20 to 50 mass%, still further preferably 25 to 40 mass%, and particularly preferably 30 to 38 mass%, relative to the total amount of the solid components of the curable composition.

[0036] The total amount of the solid components in the present specification means the total of the components obtained by removing the solvent (F) from the components contained in the curable composition. The content of the solid components of the curable composition can be measured using a known analysis means such as liquid chromatography or gas chromatography.

[0037] The content ratio of the quantum dots (A) to the total amount of the resin (B) and the polymerizable compound (C) is, for example, 30 to 150 mass%, preferably 45 to 120 mass%, more preferably 50 to 100 mass%, further preferably 60 to 90 mass%, and more further preferably 65 to 85 mass%. The present application is extremely useful because it can provide a curable composition having excellent pattern delineation even when the quantum dots (A) are contained at a high concentration. In addition, by containing the quantum dots (A) at a high concentration in the curable composition, it is expected that the luminous intensity will be improved. Note that when the concentration of the quantum dots (A) is simply increased, there are cases in which the quantum dots (A) are aggregated and deactivated, and the luminous intensity is instead reduced, and by appropriately adjusting the components and properties of the resin (B), the polymerizable compound (C), and the organic ligand (G) that can be used in the curable composition described later, the dispersibility of the quantum dots (A) can be improved.

[0038] When the curable composition contains the organic ligand (G), the total content ratio of the quantum dots (A) and the organic ligand (G) to the total amount of the resin (B) and the polymerizable compound (C) is, for example, 35 to 160 mass%, preferably 50 to 140 mass%, more preferably 70 to 100 mass%, further preferably 80 to 98 mass%, and more further preferably 88 to 95 mass%. The present application provides a curable composition that has excellent pattern delineation even when the quantum dots (A) are contained at a high concentration.

[0039] <Organic Ligand (G)>

[0040] The curable composition can further contain the organic ligand (G). The organic ligand (G) can be coordinated to the quantum dots (A) in the curable composition, or can be free in the curable composition.

[0041] The semiconductor particles that are the quantum dots (A) are preferably present in the curable composition in a state in which they are coordinated with the organic ligand (G). Hereinafter, the semiconductor particles that are coordinated with the organic ligand (G) will also be referred to as ligand-containing semiconductor particles. The ligand coordinated to the semiconductor particles can be, for example, an organic compound having a polar group that exhibits coordination ability with the semiconductor particles. The organic ligand (G) can also be an organic ligand (G) that is added for the purpose of stabilization or is constrained by the synthesis of the ligand-containing semiconductor particles. For example, in Japanese Patent Application Laid-Open No. 2015-529698, the ligand-containing semiconductor particles contain hexanoic acid as the organic ligand (G) from the viewpoint of controlling the particle size, and the organic ligand (G) is replaced with DDSA (dodecenyl succinic acid) for the purpose of stabilization after synthesis.

[0042] The organic ligand (G) can be coordinated, for example, to the surface of the semiconductor particles.

[0043] The polar group is preferably at least one group selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2), for example. A polar group selected from this group is advantageous in that it can improve the coordination with the semiconductor particles. High coordination can contribute to improvement in color unevenness of the cured film and / or improvement in pattern delineation of the photosensitive composition. Of these, the polar group is more preferably at least one group selected from a thiol group and a carboxyl group from the viewpoint of obtaining a cured film (wavelength conversion film, etc.) having more excellent light emission properties. The organic ligand (G) can have one or more than two polar groups.

[0044] The organic ligand (G) can be an organic compound represented by the following formula (X), for example.

[0045] X A -R X (X)

[0046] In the formula, X A is the above-described polar group, and R X is a monovalent hydrocarbon group which can contain a hetero atom (N, O, S, a halogen atom, etc.). The hydrocarbon group can have one or more than two unsaturated bonds such as carbon-carbon double bonds. The hydrocarbon group can have a linear, branched, or cyclic structure. The number of carbon atoms of the hydrocarbon group is, for example, 1 to 40, and can also be 1 to 30. A methylene group contained in the hydrocarbon group can be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -O-C(=O)-, -C(=O)-NH-, -NH-, etc.

[0047] The group R X may contain a polar group. Specific examples of the polar group can be cited from the above description of the polar group X A .

[0048] As specific examples of the organic ligand (G) having a carboxyl group as the polar group X A , in addition to formic acid, acetic acid, and propionic acid, there can be mentioned saturated or unsaturated fatty acids. Specific examples of the saturated or unsaturated fatty acids include butyric acid, valeric acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, behenic acid, lignoceric acid, and the like; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, gadoleic acid, erucic acid, nervonic acid, and the like; and polyunsaturated fatty acids such as linoleic acid, alpha-linolenic acid, gamma-linolenic acid, stearidonic acid, dihomo-gamma-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, adrenic acid (docosatetraenoic acid), and the like.

[0049] As specific examples of the organic ligand (G) having a thiol group or an amino group as the polar group X ASpecific examples of the organic ligand (G) include the above-mentioned examples of the organic ligand (G) having a carboxyl group as the polar group X A The organic ligand (G) having a carboxyl group substituted with a thiol group or an amino group.

[0050] As the preferred examples of the organic ligand (G) represented by the above-mentioned formula (X), there are compounds (J-1) and compounds (J-2).

[0051] [Compound (J-1)]

[0052] The compound (J-1) is a compound having a first functional group and a second functional group. The first functional group is a carboxyl group (-COOH), and the second functional group is a carboxyl group or a thiol group (-SH). The compound (J-1) can become a ligand coordinated to the quantum dot (A) because it has a carboxyl group and / or a thiol group.

[0053] The curable composition can contain only one kind of the compound (J-1), or can contain two or more kinds thereof.

[0054] By containing the compound (J-1) in the curable composition, the developing speed of the curable composition can be sufficiently accelerated, and the luminous intensity of the cured film formed from the curable composition can be improved. This is considered to be because both the carboxyl group and the thiol group possessed by the compound (J-1) can impart high alkali developing properties to the curable composition based on an alkali developer, and can sufficiently coordinate to the quantum dot (A) to improve the dispersibility of the quantum dot (A) in the curable composition. In particular, the effect of the carboxyl group on improving the developing properties of the alkali developer is higher, and the effect of the thiol group on improving the dispersibility of the quantum dot (A) is higher.

[0055] Accelerating the developing speed of the curable composition can also contribute to improving the luminous intensity of the cured film. This is considered to be because the penetration of water into the cured film in the developing process can be suppressed.

[0056] One example of the compound (J-1) is a compound represented by the following formula (J-1a). The compound (J-1) can be an anhydride of the compound represented by the formula (J-1a).

[0057]

[0058] [In the formula, R B represents a divalent hydrocarbon group. When a plurality of R B may be the same or different. The above-mentioned hydrocarbon group can have one or more substituents. When a plurality of substituents are present, they can be the same or different, and they can be bonded to each other and form a ring together with the atoms to which they are bonded, respectively. The -CH2- contained in the above-mentioned hydrocarbon group can be substituted with at least one of -O-, -S-, -SO2-, -CO-, and -NH-.

[0059] p represents an integer of 1 to 10.

[0060] As the divalent hydrocarbon group represented by R B As the divalent hydrocarbon group represented by R

[0061] As the chain hydrocarbon group, for example, a straight-chain or branched-chain alkanediyl group having usually 1 to 50 carbon atoms, preferably 1 to 20 carbon atoms, and more preferably 1 to 10 carbon atoms can be given.

[0062] As the straight-chain or branched-chain alkanediyl group, for example, propane-1, 2-diyl, propane-1, 3-diyl, butane-1, 4-diyl, pentane-1, 5-diyl, hexane-1, 6-diyl, heptane-1, 7-diyl, octane-1, 8-diyl, nonane-1, 9-diyl, decane-1, 10-diyl, undecane-1, 11-diyl, dodecane-1, 12-diyl, propane-1, 2-diyl, 1-methylbutane-1, 3-diyl, 2-methylpropane-1, 3-diyl, pentane-1, 4-diyl, 2-methylbutane-1, 4-diyl, and the like can be given.

[0063] As the alicyclic hydrocarbon group, for example, a monocyclic or polycyclic cycloalkanediyl group having usually 3 to 50 carbon atoms, preferably 3 to 20 carbon atoms, and more preferably 3 to 10 carbon atoms can be given.

[0064] As the monocyclic or polycyclic cycloalkanediyl group, for example, cyclobutane-1, 3-diyl, cyclopentane-1, 3-diyl, cyclohexane-1, 4-diyl, norbornane-1, 4-diyl, norbornane-2, 3-diyl, norbornane-2, 5-diyl, 5-norbornene-2, 3-diyl, adamantane-1, 5-diyl, adamantane-2, 6-diyl, and the like can be given.

[0065] As the aromatic hydrocarbon group, for example, an arenediyl group having usually 6 to 20 carbon atoms can be given. As the monocyclic or polycyclic arenediyl group, for example, benzene-diyl, naphthalene-diyl, anthracene-diyl, phenanthrene-diyl, pyrene-diyl, pyridine-diyl, pyrazine-diyl, pyrazole-diyl, and the like can be given.

[0066] As the substituent which the above hydrocarbon group can have, for example, an alkyl group having 1 to 50 carbon atoms, a cycloalkyl group having 3 to 50 carbon atoms, an aryl group having 6 to 20 carbon atoms, a carboxyl group, an amino group, a halogen atom, and the like can be given.

[0067] As the alkyl group having 1 to 50 carbon atoms, for example, a straight-chain or branched-chain alkyl group which is saturated or unsaturated can be given. Specifically, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, an isopropyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, an isoamyl group, a neopentyl group, a 2-ethylhexyl group, and the like can be given.

[0068] As the cycloalkyl group having 3 to 50 carbon atoms, for example, there are mentioned cyclopropyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl and the like.

[0069] As the aryl group having 6 to 20 carbon atoms, for example, there are mentioned phenyl, biphenyl, tolyl, xylyl, ethylphenyl, naphthyl and the like.

[0070] As the halogen atom, there are mentioned fluorine atom, chlorine atom, bromine atom and iodine atom.

[0071] The substituent which the above hydrocarbon group can have is preferably carboxyl group, amino group or halogen atom.

[0072] When at least one of -CH2- contained in the above hydrocarbon group is replaced by -O-, -CO- and -NH-, the group replacing -CH2- is preferably at least one of -CO- and -NH-, more preferably -NH-.

[0073] P is preferably 1 or 2.

[0074] As the compound represented by formula (J- la), for example, there are mentioned the compounds represented by the following formulae (1-1) to (1-9).

[0075]

[0076] If the specific examples of the compound represented by formula (J- la) are expressed by chemical names, for example, there are mentioned mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, 4-mercaptobutyric acid, mercaptosuccinic acid, mercapto stearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2, 3, 5, 6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetyl-L-cysteine, 3-mercaptopropionic acid 3-methoxybutyl ester, 3-mercapto-2-methylpropionic acid and the like.

[0077] Among them, 3-mercaptopropionic acid and mercaptosuccinic acid are preferred.

[0078] Another example of the compound (J-1) is a polycarboxylic acid compound, and a compound (J- lb) in which -SH in formula (J- la) is replaced by carboxyl group (-COOH) among the above-mentioned compounds represented by formula (J- la) can be preferably mentioned.

[0079] As the compound (J- lb), for example, there are mentioned the following compounds.

[0080] succinic acid, glutaric acid, adipic acid, octafluoro-adipic acid, azelaic acid, dodecanedioic acid, tetradecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, dodecafluorooctanoic acid, 3-ethyl-3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenedioic acid, sebacic acid, hexadecafluorosebacic acid, acetylenedicarboxylic acid, trans-aconitic acid, 1,3-adamantanedicarboxylic acid, bicyclo[2.2.2]octane-1,4-dicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, 1,1-cyclopropanedicarboxylic acid, 1,1-cyclobutanedicarboxylic acid, cis- or trans-1,3-cyclohexanedicarboxylic acid, cis- or trans-1,4-cyclohexanedicarboxylic acid, 1,1-cyclopentanedicarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid, 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, tetrafluoroisophthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethylterephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1'-ferrocenedicarboxylic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 2,5-furandicarboxylic acid, benzophenone-2,4'-dicarboxylic acid monohydrate, benzophenone-4,4'-dicarboxylic acid, 2,3-pyrazinedicarboxylic acid, 2,3-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,5-pyridinedicarboxylic acid, 2,6-pyridinedicarboxylic acid, 3,4-pyridinedicarboxylic acid, pyrazole-3,5-dicarboxylic acid monohydrate, 4,4'-stilbenedicarboxylic acid, anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, chelidonic acid monohydrate, azobenzene-4,4'-dicarboxylic acid, azobenzene-3,3'-dicarboxylic acid, chrysophanic acid, 1H-imidazole-4,5-dicarboxylic acid, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 1,10-bis(4-carboxyphenoxy)decane, dipropylmalonic acid, dithiodiglycolic acid, 3,3'-dithiodipropionic acid, 4,4'-dithiodibutyric acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl sulfone, ethylene glycol bis(4-carboxyphenyl) ether, 3,4-ethylenedioxythiophene-2,5-dicarboxylic acid, 4,4'-isopropylidene diphenyloxyacetic acid, 1,3-propanedione dicarboxylic acid, methylenedisalicylic acid, 5,5'-thiodisalicylic acid, tris(2-carboxyethyl)isocyanurate, tetrafluorosuccinic acid, α,α,α',α'-tetramethyl-1,3-benzenepropanedicarboxylic acid, 1,3,5-benzenetricarboxylic acid, and the like.

[0081] The molecular weight of the compound (J-1) is preferably 3000 or less, more preferably 2000 or less, further preferably 1000 or less, still further preferably 800 or less, and particularly preferably 500 or less, from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film. The molecular weight of the compound (J-1) is usually 100 or more.

[0082] The above-mentioned molecular weight can be a number average molecular weight or a weight average molecular weight. In this case, the number average molecular weight and the weight average molecular weight are respectively a number average molecular weight and a weight average molecular weight measured by gel permeation chromatography (GPC) and converted to a standard polystyrene.

[0083] The compound (J-1) in the curable composition is preferably at least a part of the molecules thereof is located on the quantum dots (A), and can be all or almost all of the molecules thereof is located on the quantum dots (A). That is, the curable composition preferably contains the compound (J-1) located on the quantum dots (A), and can contain the compound (J-1) not located on the quantum dots (A) together with the compound (J-1) located on the quantum dots (A).

[0084] The compound (J-1) containing the compound (J-1) located on the quantum dots (A) is advantageous from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film. The compound (J-1) can be located on the quantum dots (A) via the 1st functional group and / or the 2nd functional group, for example. The compound (J-1) can be located on the surface of the quantum dots (A), for example.

[0085] The content ratio of the compound (J-1) to the quantum dots (A) in the curable composition is preferably 0.001 to 1, more preferably 0.01 to 0.5, and further preferably 0.02 to 0.1, in terms of mass ratio. This content ratio is advantageous from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film.

[0086] The content rate of the compound (J-1) in the curable composition is preferably 0.1 mass% to 20 mass%, more preferably 0.1 mass% to 10 mass%, further preferably 0.2 mass% to 8 mass%, still further preferably 0.2 mass% to 5 mass%, and particularly preferably 0.5 mass% to 4 mass%, relative to the total amount of the solid components of the curable composition, from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film.

[0087] [Compound (J-2)]

[0088] The compound (J-2) is a compound (J-2) different from the compound (J-1) and is a compound containing a polyalkylene glycol structure and having a polar group at a molecular terminal. The molecular terminal is preferably a terminal of a longest carbon chain (a carbon atom in the carbon chain can be replaced with an oxygen atom or other atom) in the compound (J-2).

[0089] The curable composition can contain only one kind of the compound (J-2) or can contain two or more kinds thereof.

[0090] Note that the compound containing the polyalkylene glycol structure and having the above-mentioned first functional group and the second functional group belongs to the compound (J-1).

[0091] The curable composition can contain the compound (J-1) or can contain both the compound (J-1) and the compound (J-2) from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film.

[0092] The polyalkylene glycol structure means a structure represented by the following formula (n is an integer of 2 or more).

[0093]

[0094] In the formula, R C is an alkylene group, and examples thereof include an ethylene group, a propylene group, and the like.

[0095] As a specific example of the compound (J-2), a polyalkylene glycol-based compound represented by the following formula (J-2a) can be given.

[0096]

[0097] In the formula (J-2a), X is a polar group, Y is a monovalent group, and Z C is a divalent or trivalent group. n is an integer of 2 or more. m is 1 or 2. R C is an alkylene group.

[0098] The compound (J-2) in the curable composition is preferably at least a part of the molecules thereof are located on the quantum dots (A) or can be all or almost all of the molecules thereof are located on the quantum dots (A). That is, the curable composition preferably contains the compound (J-2) located on the quantum dots (A) or can contain the compound (J-2) not located on the quantum dots (A) together with the compound (J-2) located on the quantum dots (A).

[0099] It is advantageous to include the compound (J-2) in which a group is coordinated to the quantum dot (A) from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film. The compound (J-2a) can be coordinated to the quantum dot (A) via the polar group X. In the case where the group Y includes a polar group, the compound (J-2a) can also be coordinated to the quantum dot (A) via the polar group of the group Y or via the polar group X and the polar group of the group Y. The compound (J-2) can be coordinated to the surface of the quantum dot (A), for example.

[0100] The polar group X is preferably at least one selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2). The polar group selected from the group is advantageous in improving the coordination with the quantum dot (A). Of these, the polar group X is more preferably at least one selected from a thiol group and a carboxyl group from the viewpoint of improving the luminous intensity of the cured film.

[0101] The group Y is a monovalent group. As the group Y, there is no particular limitation, and a monovalent hydrocarbon group which can have a substituent (N, O, S, a halogen atom, or the like) can be cited. The -CH2- contained in the hydrocarbon group can be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -O-C(=O)-, -C(=O)-NH-, -NH-, or the like.

[0102] The number of carbon atoms of the above hydrocarbon group is, for example, 1 to 12. The hydrocarbon group can have an unsaturated bond.

[0103] As the group Y, a straight-chain, branched-chain, or cyclic alkyl group having 1 to 12 carbon atoms; a straight-chain, branched-chain, or cyclic alkoxy group having 1 to 12 carbon atoms; or the like can be cited. The number of carbon atoms of the alkyl group and the alkoxy group is preferably 1 to 8, more preferably 1 to 6, and further preferably 1 to 4. The -CH2- contained in the alkyl group and the alkoxy group can be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -O-C(=O)-, -C(=O)-NH-, -NH-, or the like. Of these, the group Y is preferably a straight-chain or branched-chain alkoxy group having 1 to 4 carbon atoms, and more preferably a straight-chain alkoxy group having 1 to 4 carbon atoms.

[0104] The group Y can include a polar group. As the polar group, at least one selected from a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2) can be cited. However, as described above, the compound including a polyalkylene glycol structure and having the above first functional group and the second functional group belongs to the compound (J-1). The polar group is preferably disposed at the terminal of the group Y.

[0105] The group Z C is a divalent or trivalent group. As the group Z,C There is no particular limitation, and a divalent or trivalent hydrocarbon group that can contain a hetero atom (N, O, S, a halogen atom, etc.) can be given. The number of carbon atoms of the hydrocarbon group is, for example, 1 to 24. The hydrocarbon group can have an unsaturated bond.

[0106] For the group Z C An alkylene group having a linear, branched, or cyclic structure and having 1 to 24 carbon atoms; an alkenylene group having a linear, branched, or cyclic structure and having 1 to 24 carbon atoms; and the like can be given. The number of carbon atoms of the alkyl group and the alkenylene group is preferably 1 to 12, more preferably 1 to 8, and further preferably 1 to 4. The -CH2- contained in the alkyl group and the alkenylene group can be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -O-C(=O)-, -C(=O)-NH-, -NH-, or the like. For the group Z C , examples of a trivalent group can be given. C A group obtained by removing one hydrogen atom from the above-mentioned group Z

[0107] The group Z C may have a branched structure. The group Z C may have a polyalkylene glycol structure different from the polyalkylene glycol structure represented by the above-mentioned formula (J-2a) in a branched chain different from the branched chain containing the polyalkylene glycol structure represented by the above-mentioned formula (J-2a).

[0108] wherein the group Z C is preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and more preferably a linear alkylene group having 1 to 4 carbon atoms.

[0109] R C is an alkylene group, and is preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and more preferably a linear alkylene group having 1 to 4 carbon atoms.

[0110] n in formula (J-2a) is an integer of 2 or more, and is preferably 2 to 540, more preferably 2 to 120, and further preferably 2 to 60.

[0111] The molecular weight of the compound (J-2) can be, for example, about 150 to 10,000, and is preferably 150 to 5,000, and more preferably 150 to 4,000, from the viewpoint of accelerating the development speed of the curable composition and the viewpoint of improving the luminous intensity of the cured film.

[0112] The above-mentioned molecular weight can be a number average molecular weight or a weight average molecular weight. In this case, the number average molecular weight and the weight average molecular weight are respectively the number average molecular weight and the weight average molecular weight converted to a standard polystyrene by GPC.

[0113] The content ratio of the compound (J-2) to the quantum dots (A) in the curable composition is preferably 0.001 to 2, more preferably 0.01 to 1.5, and further preferably 0.1 to 1, in terms of mass ratio. This content ratio is advantageous in terms of accelerating the development speed of the curable composition and improving the luminous intensity of the cured film when it is within the range.

[0114] When the curable composition contains the organic ligand (G), the content ratio of the organic ligand (G) to the quantum dots (A) in the curable composition is preferably 0.001 to 1, more preferably 0.01 to 0.8, and further preferably 0.02 to 0.5, in terms of mass ratio. This content ratio is advantageous in terms of the stability and dispersibility of the quantum dots (A) and improving the luminous intensity of the cured film when it is within the range. The content of the organic ligand (G) herein refers to the total content of all the organic ligands contained in the curable composition.

[0115] When the curable composition contains the organic ligand (G), the total content of the quantum dots (A) and the organic ligand (G) in the curable composition is preferably 10 mass% to 75 mass%, more preferably 20 mass% to 70 mass%, further preferably 30 mass% to 65 mass%, and more further preferably 35 mass% to 50 mass%, relative to the total amount of the solid components of the curable composition, in terms of improving the stability and dispersibility of the quantum dots (A) and the luminous intensity of the cured film.

[0116] <Resin (B)>

[0117] The curable composition can further contain a resin (B).

[0118] As the resin (B), the following resins [K1] to [K5] and the like can be given.

[0119] Resin [K1]: a copolymer having a structural unit derived from at least one kind of monomer (a) (hereinafter, also referred to as "(a)") selected from an unsaturated carboxylic acid and an unsaturated carboxylic anhydride and a structural unit derived from a monomer (c) (wherein it is different from (a)) (hereinafter, also referred to as "(c)") which is copolymerizable with (a);

[0120] Resin [K2]: a copolymer having a structural unit obtained by addition of a monomer (b) (hereinafter, also referred to as "(b)") having a cyclic ether structure having 2 to 4 carbon atoms and an ethylenic unsaturated bond to the structural unit derived from the above (a) and a structural unit derived from the above (c);

[0121] Resin [K3]: a copolymer having a structural unit obtained by addition of the above (a) to the structural unit derived from the above (b) and a structural unit derived from the above (c);

[0122] Resin [K4]: a copolymer having a structural unit obtained by adding the structural unit from the above (a) to the above (b) and further forming an ester bond with a carboxylic anhydride, and the structural unit from the above (c);

[0123] Resin [K5]: a copolymer having a structural unit obtained by adding the structural unit from the above (b) to the above (a) and further forming an ester bond with a carboxylic anhydride, and the structural unit from the above (c).

[0124] As (a), for example, an unsaturated monocarboxylic acid such as (meth)acrylic acid, crotonic acid, o-, m-, or p-vinylbenzoic acid can be given.

[0125] An unsaturated dicarboxylic acid such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, 1,4-cyclohexene dicarboxylic acid, and the like.

[0126] A bicyclic unsaturated compound containing a carboxyl group such as methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, and the like.

[0127] An unsaturated dicarboxylic anhydride such as maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene anhydride, and the like.

[0128] An unsaturated mono[(meth)acryloyloxyalkyl] ester of a polybasic carboxylic acid of two or more such as succinic acid mono[2-(meth)acryloyloxyethyl] ester, phthalic acid mono[2-(meth)acryloyloxyethyl] ester, and the like.

[0129] An unsaturated (meth)acrylate such as α-(hydroxymethyl)(meth)acrylic acid containing a hydroxyl group and a carboxyl group in the same molecule.

[0130] Among them, from the aspect of copolymerizability, the solubility of the obtained resin in an aqueous alkali solution, (meth)acrylic acid, maleic anhydride, and the like are preferable.

[0131] In the present specification, (meth)acrylic acid refers to acrylic acid and / or methacrylic acid. The same applies to "(meth)acryloyl group", "(meth)acrylate" and the like.

[0132] (b) is a monomer having, for example, a cyclic ether structure having 2 to 4 carbon atoms (for example, at least one selected from the group consisting of an oxirane ring, an oxetane ring, and a tetrahydrofuran ring) and an ethylenic unsaturated bond. (b) is preferably a monomer having a cyclic ether structure having 2 to 4 carbon atoms and a (meth)acryloyloxy group.

[0133] As (b), for example, glycidyl (meth)acrylate, β-methyl glycidyl (meth)acrylate, β-ethyl glycidyl (meth)acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene, 2,4-bis(glycidyloxymethyl)styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxymethyl)styrene, 2,3,4-tris(glycidyloxymethyl)styrene, 2,3,5-tris(glycidyloxymethyl)styrene, 2,3,6-tris(glycidyloxymethyl)styrene, 3,4,5-tris(glycidyloxymethyl)styrene, 2,4,6-tris(glycidyloxymethyl)styrene, and the like having an oxirane ring and an ethylenic unsaturated bond can be given.

[0134] 3-methyl-3-methacryloyloxymethyloxetane, 3-methyl-3-acryloyloxymethyloxetane, 3-ethyl-3-methacryloyloxymethyloxetane, 3-ethyl-3-acryloyloxymethyloxetane, 3-methyl-3-methacryloyloxyethyloxetane, 3-methyl-3-acryloyloxyethyloxetane, 3-ethyl-3-methacryloyloxyethyloxetane, 3-ethyl-3-acryloyloxyethyloxetane, and the like having an oxetane ring and an ethylenic unsaturated bond;

[0135] tetrahydrofurfuryl acrylate (for example, Viscoat V#150, manufactured by Osaka Organic Chemical Industry Co., Ltd.), tetrahydrofurfuryl methacrylate, and the like having a tetrahydrofuran ring and an ethylenic unsaturated bond, and the like.

[0136] Since the reactivity at the time of production of the resins [K2] to [K5] is high, unreacted (b) is not easily left, and thus a monomer having an oxirane ring and an ethylenic unsaturated bond is preferred as (b).

[0137] As (c), for example, there can be mentioned methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2- ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2- methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.02'6]decane-8-yl (meth)acrylate (in this technical field, it is called as "dicyclopentyl (meth)acrylate" as a conventional name. Further, it is sometimes called as "tricyclodecyl (meth)acrylate"), tricyclo[5.2.1.02'6]decene-8-yl (meth)acrylate (in this technical field, it is called as "dicyclopentenyl (meth)acrylate" as a conventional name), dicyclopentyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, allyl (meth)acrylate, propargyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, benzyl (meth)acrylate and the like (meth)acrylates; 2,6 2,6 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate and the like (meth)acrylates containing a hydroxyl group;

[0138] diethyl maleate, diethyl fumarate, diethyl itaconate and the like dicarboxylic acid diesters;

[0139] diethyl maleate, diethyl fumarate, diethyl itaconate and the like dicarboxylic acid diesters;

[0140] ​bicyclic unsaturated compounds such as bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-bis(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-t-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxy carbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(t-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene, and the like.

[0141] N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimide benzoate, N-succinimidyl-4-maleimide butyrate, N-succinimidyl-6-maleimide hexanoate, N-succinimidyl-3-maleimide propionate, N-(9-acridinyl)maleimide, and the like.

[0142] styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, and the like.

[0143] Among them, from the aspects of copolymerizability and heat resistance of the resin (B), methyl (meth)acrylate, tricyclo[5.2.1.02, 6]dec-8-yl (meth)acrylate, styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo[2.2.1]hept-2-ene, and the like are preferred. 2,6

[0144] ​In the resin [K1], the ratio of the structural units from each unit is preferably 2 to 60 mol% of the structural unit from (a) and 40 to 98 mol% of the structural unit from (c), more preferably 10 to 50 mol% of the structural unit from (a) and 50 to 90 mol% of the structural unit from (c), among all the structural units constituting the resin [K1].

[0145] When the ratio of the structural units of the resin [K1] is within the above range, there is a tendency that the storage stability of the curable composition, the developability at the time of forming a cured pattern, and the solvent resistance of the obtained cured pattern are excellent.

[0146] In the present specification, the cured pattern refers to one form of the cured film, and is a cured film formed in a pattern shape.

[0147] The resin [K1] can be produced, for example, by the method described in the literature "Experimental Methods of Polymer Synthesis" (written by TAKASHI OHTA, published by KAGAKU DOJINSHA CO., LTD., 1st edition, 1st printing, published on March 1, 1972) and the references described in the literature, with reference thereto.

[0148] Specifically, the following method can be mentioned: a prescribed amount of (a) and (c), a polymerization initiator, and a solvent or the like are charged into a reaction vessel, a deoxygenated atmosphere is prepared, for example, by replacing oxygen with nitrogen, and heating and incubation are performed while stirring.

[0149] The polymerization initiator and the solvent or the like used are not particularly limited, and a polymerization initiator and a solvent generally used in the field can be used. For example, as the polymerization initiator, azo compounds (2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and the like), organic peroxides (benzoyl peroxide and the like) can be mentioned, and as the solvent, as long as it is a solvent that dissolves each monomer, solvents described later as the solvent (F) that can be contained in the curable composition of the present application and the like can be mentioned.

[0150] As for the obtained copolymer, the solution after the reaction can be used as it is, or a solution after concentration or dilution can be used, or a substance taken out in the form of a solid (powder) by a method such as reprecipitation can be used. If the solvent (F) described later is used as the solvent at the time of polymerization, the solution after the reaction can be directly used for the production of the curable composition, and thus the manufacturing process of the curable composition can be simplified.

[0151] The resin [K2] can be produced by adding the cyclic ether having 2 to 4 carbon atoms possessed by (b) to the carboxylic acid and / or carboxylic anhydride possessed by (a) of the copolymer of (a) and (c).

[0152] First, the copolymer of (a) and (c) is produced in the same manner as described in the production method of the resin [Kl]. In this case, the ratio of the structural units from each unit is preferably the same as described for the resin [Kl].

[0153] Next, a part of the carboxylic acid and / or carboxylic anhydride from (a) in the above copolymer is reacted with the cyclic ether having 2 to 4 carbon atoms of (b).

[0154] After the production of the copolymer of (a) and (c), the atmosphere in the flask is replaced from nitrogen to air, and in the presence of (b), a reaction catalyst for the carboxylic acid or carboxylic anhydride and the cyclic ether (for example, an organophosphorus compound, a metal complex, an amine compound, etc.), and a polymerization inhibitor (for example, hydroquinone, etc.), etc., the reaction is carried out at 60°C to 130°C for 1 to 10 hours, for example, whereby the resin [K2] can be produced.

[0155] The use amount of (b) is preferably 5 moles to 80 moles, more preferably 10 moles to 75 moles, relative to 100 moles of (a). By being in this range, there is a tendency for the balance of the storage stability of the curable composition, the developability at the time of forming a cured pattern, and the solvent resistance, heat resistance, mechanical strength, and sensitivity of the obtained cured pattern to become good.

[0156] As the organophosphorus compound as the reaction catalyst, for example, triphenylphosphine, etc. can be given. As the amine compound as the reaction catalyst, for example, an aliphatic tertiary amine compound or an aliphatic quaternary ammonium salt compound, etc. can be used, and as specific examples thereof, for example, tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, tetrabutylammonium chloride, etc. can be given. From the viewpoints of developability and the luminous intensity of the cured film, the reaction catalyst is preferably an organophosphorus compound.

[0157] The use amount of the reaction catalyst is preferably 0.001 parts by mass or more and 5 parts by mass or less, relative to 100 parts by mass of the total amount of (a), (b), and (c).

[0158] The use amount of the polymerization inhibitor is preferably 0.001 parts by mass to 5 parts by mass, relative to 100 parts by mass of the total amount of (a), (b), and (c).

[0159] The feeding method, the reaction temperature, and the time, etc. of the reaction conditions can be appropriately adjusted in consideration of the production equipment, the amount of heat generation based on polymerization, etc. It should be noted that the feeding method, the reaction temperature, etc. can be appropriately adjusted in consideration of the production equipment, the amount of heat generation based on polymerization, etc. in the same manner as the polymerization conditions.

[0160] For the resin [K3], as the first stage, the copolymer of (b) and (c) is obtained in the same manner as the production method of the resin [Kl] described above. As with the above, for the obtained copolymer, the solution after the reaction can be used as it is, or a solution after concentration or dilution can be used, or a substance taken out in the form of a solid (powder) by reprecipitation or the like can be used.

[0161] The ratio of the structural units from (b) and (c) with respect to the total moles of all the structural units constituting the above copolymer is preferably 5 mol% to 95 mol% of the structural units from (b) and 5 mol% to 95 mol% of the structural units from (c), and more preferably 10 mol% to 90 mol% of the structural units from (b) and 10 mol% to 90 mol% of the structural units from (c), respectively.

[0162] The resin [K3] can be obtained by reacting the carboxylic acid or carboxylic anhydride possessed by (a) with the cyclic ether from (b) possessed by the copolymer of (b) and (c) under the same conditions as the production method of the resin [K2].

[0163] The amount of (a) used for the reaction with the above copolymer is preferably 5 moles to 80 moles with respect to 100 moles of (b).

[0164] The resin [K4] is a resin obtained by further reacting the resin [K2] with a carboxylic anhydride. The carboxylic anhydride is reacted with the hydroxyl group generated by the reaction of the carboxylic acid or carboxylic anhydride with the cyclic ether.

[0165] As the carboxylic anhydride, for example, maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene anhydride, and the like can be given.

[0166] The amount of the carboxylic anhydride used is preferably 0.5 to 1 mole with respect to 1 mole of (b) used.

[0167] The resin [K5] is a resin obtained by further reacting the resin [K3] with a carboxylic anhydride under the same conditions as the production method of the resin [K4]. The carboxylic anhydride is reacted with the hydroxyl group generated by the reaction of the cyclic ether with the carboxylic acid or carboxylic anhydride.

[0168] As the carboxylic anhydride, the same carboxylic anhydride as exemplified in the resin [K4] can be used.

[0169] The amount of the carboxylic anhydride used is preferably 0.5 to 1 mole with respect to 1 mole of (a) used.

[0170] As the resin [K1], resin [K2], resin [K3], resin [K4], and resin [K5], for example, there can be mentioned a benzyl (meth)acrylate / (meth)acrylic acid copolymer, a styrene / (meth)acrylic acid copolymer, and the like.

[0171] a resin obtained by adding glycidyl (meth)acrylate to a benzyl (meth)acrylate / (meth)acrylic acid copolymer, a resin obtained by adding glycidyl (meth)acrylate to a tricyclodecane (meth)acrylate / styrene / (meth)acrylic acid copolymer, a resin obtained by adding glycidyl (meth)acrylate to a tricyclodecane (meth)acrylate / benzyl (meth)acrylate / (meth)acrylic acid copolymer, a resin obtained by adding glycidyl (meth)acrylate to a dicyclopentyl (meth)acrylate / methyl (meth)acrylate / (meth)acrylic acid copolymer, and the like resin [K2];

[0172] a resin obtained by adding (meth)acrylic acid to a copolymer of tricyclodecane (meth)acrylate / glycidyl (meth)acrylate, a resin obtained by adding (meth)acrylic acid to a copolymer of tricyclodecane (meth)acrylate / styrene / glycidyl (meth)acrylate, and the like resin [K3];

[0173] a resin obtained by further forming an ester bond with tetrahydrophthalic anhydride to a resin obtained by adding glycidyl (meth)acrylate to a benzyl (meth)acrylate / (meth)acrylic acid copolymer, a resin obtained by further forming an ester bond with tetrahydrophthalic anhydride to a resin obtained by adding glycidyl (meth)acrylate to a tricyclodecane (meth)acrylate / benzyl (meth)acrylate / (meth)acrylic acid copolymer, a resin obtained by further forming an ester bond with tetrahydrophthalic anhydride to a resin obtained by adding glycidyl (meth)acrylate to a dicyclopentyl (meth)acrylate / methyl (meth)acrylate / (meth)acrylic acid copolymer, and the like resin [K4];

[0174] a resin obtained by further forming an ester bond with tetrahydrophthalic anhydride to a resin obtained by adding (meth)acrylic acid to a copolymer of tricyclodecane (meth)acrylate / glycidyl (meth)acrylate, and the like resin [K5]; and the like.

[0175] Among them, the resin (B) preferably contains at least one selected from the group consisting of resin [K2], resin [K3], resin [K4], and resin [K5].

[0176] As another example of the resin (B), an alkali-soluble resin described in Japanese Patent Application Publication No. 2018-123274 (JP 2018-123274 A) can be given. As the alkali-soluble resin, a polymer having a side chain with a double bond, and a main chain containing a constitutional unit (a) represented by the following formula (I) and a constitutional unit (b) represented by the following formula (II), and further containing an acid group (hereinafter, also referred to as "resin (Ba)") can be given.

[0177] The acid group can be introduced into the resin by, for example, the resin (Ba) containing a constitutional unit (g) from an acid group-containing monomer (for example, (meth)acrylic acid or the like). The resin (Ba) preferably contains the constitutional units (a), (b), and (g) in the main chain skeleton.

[0178]

[0179] [In the formula, R A and R B are the same or different and represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms. n represents the average number of repeating units of the constitutional unit represented by formula (I) and is a number of 1 or more.]

[0180]

[0181] [In the formula, R C are the same or different and represent a hydrogen atom or a methyl group. R D are the same or different and represent a linear or branched hydrocarbon group having 4 to 20 carbon atoms. m represents the average number of repeating units of the constitutional unit represented by formula (II) and is a number of 1 or more.]

[0182] In the resin (Ba), from the viewpoint of heat resistance and storage stability of the resin (Ba), the content ratio of the constitutional unit (a) is, for example, 0.5% by mass or more and 50% by mass or less, preferably 1% by mass or more and 40% by mass or less, and more preferably 5% by mass or more and 30% by mass or less, with respect to the total amount of 100% by mass of all monomer units that provide the main chain skeleton of the resin (Ba). n in formula (I) represents the average number of repeating units of the constitutional unit (a) in the resin (Ba), and n can be set in a manner that the content ratio of the constitutional unit (a) is within the above range.

[0183] From the viewpoint of solvent resistance of the cured film, the content ratio of the constitutional unit (b) is, for example, 10% by mass or more and 90% by mass or less, preferably 20% by mass or more and 80% by mass or less, and more preferably 30% by mass or more and 75% by mass or less, with respect to the total amount of 100% by mass of all monomer units that provide the main chain skeleton of the resin (Ba). m in formula (II) represents the average number of repeating units of the constitutional unit (b) in the resin (Ba), and m can be set in a manner that the content ratio of the constitutional unit (b) is within the above range.

[0184] The content ratio of the unit (γ) is, for example, 0.5% by mass or more and 50% by mass or less, preferably 2% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 45% by mass or less, relative to 100% by mass of the total amount of all monomer units that provide the main chain skeleton of the resin (Ba) from the viewpoint of the solubility of the resin (Ba) with respect to the base substance, the solubility of the resin (Ba) with respect to the solvent (F).

[0185] The resin (B) can contain one or more selected from the group consisting of the resin [K1], the resin [K2], the resin [K3], the resin [K4], the resin [K5], and the resin (Ba) described above.

[0186] The weight average molecular weight of the resin (B) in terms of standard polystyrene as determined by gel permeation chromatography (GPC) is preferably 9000 or less. By the resin (B) having the above weight average molecular weight, there is a tendency that the development speed is fast even when it is a thick film, and a cured film having a high luminous intensity is obtained.

[0187] The weight average molecular weight of the resin (B) in terms of standard polystyrene is, for example, 1000 to 100000, and is preferably 2000 to 50000, and more preferably 3000 to 20000 from the viewpoint of the development speed and the luminous intensity.

[0188] The weight average molecular weight of the resin (B) in terms of standard polystyrene is measured according to the measurement method in the column of the Examples described later.

[0189] In order to make the Mw of the resin (B) be in the above range, the selection of the raw material to be used, the feeding method, the reaction temperature and time, and the like reaction conditions are adjusted as appropriate.

[0190] The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] of the resin (B) as determined by GPC is, for example, 1.0 to 6.0, and is preferably 1.2 to 4.0 from the viewpoint of the developability of the cured film.

[0191] The acid value of the resin (B) is preferably 30 mgKOH / g to 150 mgKOH / g, and is preferably 35 mgKOH / g to 140 mgKOH / g, and more preferably 40 mgKOH / g to 130 mgKOH / g based on the solid content from the viewpoint of the developability of the cured film. Here, the acid value is a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of the resin (B), and can be obtained, for example, by titration using an aqueous potassium hydroxide solution. The acid value of the resin (B) is measured according to the measurement method in the column of the Examples described later.

[0192] The resin (B) can include a resin having a double bond equivalent of, for example, 300 g / eq to 2000 g / eq, preferably 500 g / eq to 1500 g / eq. By the resin (B) including a resin having a double bond equivalent of 300 g / eq to 2000 g / eq, there is a tendency that a phenomenon of being easily prevented from being quenched in a process of manufacturing a cured pattern is present. In the case where the resin (B) includes a resin having a double bond equivalent of more than 2000 g / eq, there is a tendency that the ability of the resin (B) to effectively protect the quantum dots (A) decreases. In the case where the resin (B) includes a resin having a double bond equivalent of less than 300 g / eq, there is a tendency that the cured film is easily peeled off without being dissolved at the time of development.

[0193] As the resin having a double bond equivalent of 300 g / eq to 2000 g / eq, a (meth)acrylic resin can be given. The resin (B) is preferably composed of a (meth)acrylic resin.

[0194] The content ratio of the resin (B) in the curable composition is, for example, 5 mass% to 80 mass% with respect to the total amount of the solid components of the curable composition, preferably 10 mass% to 70 mass%, more preferably 13 mass% to 60 mass%, and further preferably 17 mass% to 55 mass%. In the case where the content ratio of the resin (B) is within the above range, there is a tendency that the quantum dots (A) are easily dispersed and that the luminous efficiency is easily maintained to be high in the process of manufacturing a cured pattern.

[0195] In the curable composition, the mass ratio (solid component ratio) of the resin (B) to the polymerizable compound (C) described later is, for example, 1 or more, and from the viewpoints of the developability of the cured film and the luminous intensity, it is preferably 1.5 or more, more preferably 2 or more, and further preferably 2.5 or more.

[0196] < POLYMERIZABLE COMPOUND (C) >

[0197] The polymerizable compound (C) is a compound that can be polymerized by an active radical, an acid, or the like generated from the polymerization initiator (D) described later. As the polymerizable compound (C), a photopolymerizable compound such as a compound having an ethylenic unsaturated bond, for example, a (meth)acrylate compound can be given. Another example of the polymerizable compound (C) is a thermal polymerizable compound. The composition can include two or more kinds of polymerizable compounds (C).

[0198] The polymerizable compound (C) is preferably a photopolymerizable compound having three or more ethylenic unsaturated bonds in a molecule. The weight average molecular weight of the polymerizable compound (C) is preferably 150 to 2900, and more preferably 250 to 1500.

[0199] As the photopolymerizable compound having 3 or more ethylenic unsaturated bonds in a molecule, a compound (Ca) having 3 or more ethylenic unsaturated bonds in a molecule and having an acidic functional group, and a compound (Cb) having 3 or more ethylenic unsaturated bonds in a molecule and having no acidic functional group can be given. The polymerizable compound (C) preferably contains at least one of the compound (Ca) and the compound (Cb), and can contain two or more kinds of the compound (Ca), two or more kinds of the compound (Cb), or at least one of the compound (Ca) and at least one of the compound (Cb).

[0200] As the acidic functional group, for example, a carboxyl group, a sulfonic acid group, a phosphoric acid group, and the like can be given. Among them, the acidic functional group is preferably a carboxyl group.

[0201] By the polymerizable compound (C) containing the compound (Ca), the dispersibility of the quantum dots (A) can be improved, and the luminous intensity of the cured film can be improved. In addition, by the polymerizable compound (C) containing the compound (Ca), the curability and the heat resistance of the curable composition can be improved. When the polymerizable compound (C) contains the compound (Ca), the content of the compound (Ca) in 100 mass% of the polymerizable compound (C) is preferably 5 to 100 mass%, more preferably 15 to 65 mass%, and further preferably 35 to 50 mass%. By making the content of the compound (Ca) be the lower limit value or more, the luminous intensity of the cured film becomes good.

[0202] The ethylenic unsaturated bond possessed by the compound (Ca) is preferably a (meth)acryloyloxy group. The number of the ethylenic unsaturated bonds possessed by one molecule of the compound (Ca) is preferably 3 to 5, and more preferably 3. The number of the acidic functional groups possessed by one molecule of the compound (Ca) is 1 or more. In the case where two or more acidic functional groups are possessed, each of the acidic functional groups can be different or the same, and at least one carboxyl group is preferably possessed.

[0203] As the compound (Ca), a compound obtained by subjecting a compound having 3 or more (meth)acryloyloxy groups and 1 or more hydroxyl groups such as pentaerythritol tri(meth)acrylate or dipentaerythritol penta(meth)acrylate to polybasic acid modification can be given. As the compound, for example, a compound obtained by mono-esterifying pentaerythritol tri(meth)acrylate with succinic acid, a compound obtained by mono-esterifying dipentaerythritol penta(meth)acrylate with succinic acid, a compound obtained by mono-esterifying pentaerythritol tri(meth)acrylate with maleic acid, a compound obtained by mono-esterifying dipentaerythritol penta(meth)acrylate with maleic acid, and the like can be given. Among them, a compound obtained by mono-esterifying pentaerythritol tri(meth)acrylate with succinic acid is preferred.

[0204] As a commercial product of the compound (Ca), for example, "Aronix M-510" manufactured by Toagosei Co., Ltd., which is a diacid anhydride adduct of tri(meth)acrylate of pentaerythritol as a main component, "Aronix M-520D" manufactured by Toagosei Co., Ltd., which is a diacid anhydride adduct of pentaerythritol tetra(meth)acrylate as a main component, and the like can be given. These commercial products have a carboxyl group as an acidic functional group.

[0205] The compound (Cb) preferably has a (meth)acryloyloxy group as the ethylenically unsaturated bond. The number of the ethylenically unsaturated bond per one molecule of the compound (Cb) is preferably 3 to 6.

[0206] As the compound (Cb), for example, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tris(2-(meth)acryloyloxyethyl) isocyanurate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, and the like can be given. Among them, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like are preferable.

[0207] From the viewpoint of improving the developing speed of the curable composition, the polymerizable compound (C) preferably contains the compound (Cb). When the polymerizable compound (C) contains the compound (Cb), the content of the compound (Cb) in 100 mass% of the polymerizable compound (C) is preferably 5 to 100 mass%, more preferably 30 to 95 mass%, and further preferably 50 to 85 mass%. By making the content of the compound (Cb) be the lower limit value or more, the developing speed of the curable composition becomes good.

[0208] From the viewpoint of improving the luminous intensity of the cured film and improving the solvent resistance (residual film rate) of the cured film, the polymerizable compound (C) preferably contains the compound (Ca) and the compound (Cb), and the ratio of the content of the compound (Ca) to the compound (Cb) (compound (Ca): compound (Cb)) is preferably 5:95 to 95:5, more preferably 15:85 to 85:15, and further preferably 35:65 to 65:35 on a mass basis.

[0209] The content of the polymerizable compound (C) in the curable composition is preferably 7 to 60% by mass, more preferably 10 to 45% by mass, and further preferably 13 to 30% by mass, relative to the total amount of the solid components of the curable composition. When the content of the polymerizable compound (C) is within the above range, there is a tendency for the solvent resistance (residual film rate) of the cured film to improve.

[0210] < POLYMERIZATION INITIATOR (D) >

[0211] The polymerization initiator (D) is a compound that can generate an active radical, an acid, or the like under the action of light or heat and initiate the polymerization of the polymerizable compound (C). The composition can contain one or two or more kinds of polymerization initiators (D).

[0212] The polymerization initiator (D) contains a compound represented by formula (DA) as an essential component. By the polymerization initiator (D) containing a compound represented by formula (DA), a curable composition excellent in pattern delineation can be produced. In particular, it is sometimes the case that a good cured pattern cannot be obtained when the amount of the quantum dots (A) is made high in the composition of the conventional curable composition, but by containing a compound represented by formula (DA), a good cured pattern can be formed even in a curable composition containing quantum dots (A) at a high content. Here, the "curable composition containing quantum dots (A) at a high content" can refer to a curable composition in which the content of the quantum dots (A) relative to the total amount of the resin (B) and the polymerizable compound (C) is, for example, 30% by mass or more, and more specifically 45% by mass or more.

[0213]

[0214] [In the formula,

[0215] R d1 represents a branched hydrocarbon group having 3 to 20 carbon atoms which can have a substituent.

[0216] R d2 ~ R d5 each independently represents a hydrocarbon group having 1 to 20 carbon atoms which can have a substituent.

[0217] n represents any one integer of 0 to 4.

[0218] The -CH2- contained in the above hydrocarbon group can be substituted with -O-, -S-, -CO-, or -OCO-.

[0219] The branched hydrocarbon group having 3 to 20 carbon atoms represented by R d1 The branched hydrocarbon group having 3 to 20 carbon atoms represented by R

[0220] The branched hydrocarbon group having 3 to 20 carbon atoms represented by Rd1 The branched saturated hydrocarbon group having 3 to 20 carbon atoms represented by butyl includes, for example, 1-methylethyl (isopropyl), 1-methylpropyl (sec-butyl), 2-methylpropyl (isobutyl), 1,1-dimethylethyl (tert-butyl), 1,1-dimethylpropyl, 2,2-dimethylpropyl, 1,2-dimethylpropyl, 1-ethylpropyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1,1-dimethylbutyl, 2,2-dimethylbutyl, 3,3-dimethylbutyl, 1,2-dimethylbutyl, 1,3-dimethylbutyl 1-Methylhexyl, 2-Methylhexyl, 3-Methylhexyl, 4-Methylhexyl, 1,1-dimethylpentyl, 2,2-dimethylpentyl, 3,3-dimethylpentyl, 1,2-dimethylpentyl, 1,3-dimethylpentyl, 2,3-dimethylpentyl, 1-ethylpentyl, 2-ethylpentyl, 3-ethylpentyl, 1-methylhexyl, 2-methylhexyl, 3-methylhexyl, 4-methylhexyl, 1,1-dimethylhexyl, 2,2-dimethylhexyl, 3 ,3-dimethylhexyl, 1,2-dimethylhexyl, 1,3-dimethylhexyl, 2,3-dimethylhexyl, 1-ethylhexyl, 2-ethylhexyl, 3-ethylhexyl, 1-methylheptyl, 2-methylheptyl, 3-methylheptyl, 4-methylheptyl, 1,1-dimethylheptyl, 2,2-dimethylheptyl, 3,3-dimethylheptyl, 1,2-dimethylheptyl, 1,3-dimethylheptyl, 2,3-dimethylheptyl, 1-ethylheptyl, 2-ethylheptyl, 3-ethylheptyl, 1-methyloctyl, 2-methyloctyl, 3 branched-chain alkyl groups such as 1-methyloctyl, 4-methyloctyl, 1,1-dimethyloctyl, 2,2-dimethyloctyl, 3,3-dimethyloctyl, 1,2-dimethyloctyl, 1,3-dimethyloctyl, 2,3-dimethyloctyl, 1-ethyloctyl, 2-ethyloctyl, 3-ethyloctyl, 1-methylnonyl, 2-methylnonyl, 3-methylnonyl, 4-methylnonyl, dimethylnonyl, ethylnonyl, methyldecyl, dimethyldecyl, ethyldecyl, methylundecyl, dimethylundecyl, ethylundecyl, and methyldodecyl.

[0221] R d1 The branched alkyl group represented by may be any of a branched primary alkyl group, a branched secondary alkyl group, and a branched tertiary alkyl group.

[0222] R d1 The number of carbon atoms in the branched saturated hydrocarbon group represented by is preferably 4 or more, more preferably 5 or more, and is preferably 16 or less, more preferably 12 or less, and further preferably 10 or less.

[0223] As R d1 The branched unsaturated hydrocarbon group represented by R d1a group in which at least one or more carbon-carbon single bonds contained in the above-mentioned branched saturated hydrocarbon group represented by the formula: -C(R

[0224] R d1 The branched unsaturated hydrocarbon group represented by the formula: -C(R

[0225] R d1 The number of carbon atoms of the branched unsaturated hydrocarbon group represented by the formula: -C(R

[0226] R d2 R d3 R d4 R d5 The hydrocarbon group represented by the formula: -C(R d2 R d3 R d4 R d5 The hydrocarbon groups represented by the formulae: -C(R

[0227] As the above-mentioned saturated hydrocarbon group having 1 to 20 carbon atoms, for example, there can be mentioned straight chain alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, dodecyl, hexadecyl, eicosyl, etc.; branched alkyl groups such as isopropyl, isobutyl, isopentyl, neopentyl, 2-ethylhexyl, etc.; alicyclic saturated hydrocarbon groups having 3 to 20 carbon atoms such as cyclopropyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, tricyclodecyl, etc. The number of carbon atoms of the saturated hydrocarbon group is preferably 1 to 18, more preferably 1 to 15, further preferably 1 to 10, and still further preferably 1 to 8.

[0228] As the above-mentioned unsaturated hydrocarbon group having 2 to 20 carbon atoms, there can be mentioned alkenyl groups such as ethenyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, dodecenyl, hexadecenyl, octadecenyl, eicosenyl, etc.; alkynyl groups such as ethynyl, propynyl, hexynyl, decynyl, eicosynyl, etc.; cycloalkenyl groups such as cyclopentenyl, cyclohexenyl, cycloheptenyl, etc. The number of carbon atoms of the unsaturated hydrocarbon group is preferably 2 to 18, more preferably 2 to 15, and further preferably 2 to 10.

[0229] Examples of the aromatic hydrocarbon group having 6 to 20 carbon atoms include phenyl, xylyl, trimethylphenyl, dipropylphenyl, di(2,2-dimethylpropyl)phenyl, naphthyl, benzyl, phenylethyl, and phenylbutyl. The aromatic hydrocarbon group preferably has 6 to 18 carbon atoms, more preferably 6 to 15, and even more preferably 6 to 12 carbon atoms.

[0230] As R d1 、R d2 、R d3 , R d4 and R d5 The substituents that the hydrocarbon group represented by may have include a halogen atom, a cyano group, and a nitro group. The halogen atom is preferably a fluorine atom, a bromine atom, a chlorine atom, or an iodine atom.

[0231] The -CH2- contained in the above hydrocarbon group can be substituted by -O-, -S-, -CO- or -OCO-, the adjacent -CH2- will not be substituted by the same group at the same time, and the terminal -CH2- will not be substituted.

[0232] n represents an integer of 0 to 4, preferably an integer of 0 to 3, more preferably an integer of 0 to 2, further preferably an integer of 0 or 1, and even more preferably 0.

[0233] -OCO-R d4 base( The bonding position of (denoting the bonding site to the phenyl group) may be the -OCO-R d4 The phenyl group to which the phenyl group is bonded is at any of the 2-position, 3-position, or 4-position, preferably the 3-position or the 4-position, and more preferably the 4-position.

[0234] R d1 The branched hydrocarbon group having 3 to 20 carbon atoms represented by is preferably a branched saturated hydrocarbon group having 3 to 20 carbon atoms, more preferably a branched alkyl group having 3 to 20 carbon atoms, further preferably a branched alkyl group having 3 to 10 carbon atoms, and preferably at least one member selected from the group consisting of 1-methylpentyl, 2-methylpentyl, 3-methylpentyl, 1-ethylpentyl, 2-ethylpentyl, 3-ethylpentyl, 1-methylhexyl, 2-methylhexyl, 3-methylhexyl, 1-ethylhexyl, 2-ethylhexyl, 3-ethylhexyl, 1-methylheptyl, 2-methylheptyl, 3-methylheptyl, 1-ethylheptyl, 2-ethylheptyl and 3-ethylheptyl.

[0235] R d2 、R d3 、R d4 and R d5The hydrocarbon group having 1 to 20 carbon atoms represented by R is preferably a saturated hydrocarbon group having 1 to 20 carbon atoms, an unsaturated hydrocarbon group having 2 to 20 carbon atoms, more preferably a saturated hydrocarbon group having 1 to 20 carbon atoms, and further preferably a chain saturated hydrocarbon group having 1 to 10 carbon atoms, and more further preferably a chain alkyl group having 1 to 8 carbon atoms.

[0236] R d2 The chain saturated hydrocarbon group having 1 to 20 carbon atoms is preferably a chain alkyl group having 1 to 8 carbon atoms, and more preferably a chain alkyl group having 1 to 6 carbon atoms.

[0237] R d3 The chain saturated hydrocarbon group having 1 to 20 carbon atoms is preferably a chain alkyl group having 1 to 8 carbon atoms, and more preferably a chain alkyl group having 1 to 6 carbon atoms.

[0238] R d4 The chain saturated hydrocarbon group having 1 to 20 carbon atoms is preferably a chain alkyl group having 1 to 8 carbon atoms, and more preferably a chain alkyl group having 1 to 6 carbon atoms.

[0239] R d5 The chain saturated hydrocarbon group having 1 to 20 carbon atoms is preferably a chain alkyl group having 1 to 8 carbon atoms, and more preferably a chain alkyl group having 1 to 6 carbon atoms.

[0240] As the polymerization initiator (D) other than the compound represented by formula (DA), there are exemplified oxime compounds (however, the compound represented by formula (DA) is excluded), alkyl phenone compounds, bisimidazole compounds, triazine compounds, and acyl phosphine compounds and the like polymerization initiators, azo-based compounds, organic peroxides and the like thermal polymerization initiators.

[0241] One example of the oxime compound (however, the compound represented by formula (DA) is excluded) is an oxime compound having a first molecular structure represented by the following formula (1). Hereinafter, the oxime compound will also be referred to as "oxime compound (1)".

[0242]

[0243] [In formula (1), R 1 represents R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 or CN. represents a bonding site of a second molecular structure other than the first molecular structure possessed by the oxime compound (1).]

[0244] It is advantageous to contain the oxime compound (1) as the polymerization initiator (D) from the viewpoint of improving the luminous intensity of the cured film. One factor that is presumed to exert such an effect is that the oxime compound (1) has a unique molecular structure, and the absorption wavelength of the oxime compound (1) before and after cleavage (decomposition) of the oxime compound (1) required for the oxime compound (1) to initiate photopolymerization changes greatly, and thus the photoradical polymerization initiating ability of the oxime compound (1) is high.

[0245] R 11 , R 12 , and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0246] R 11 , R 12 , or R 13 representing a group can be substituted with a hydrogen atom by OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, a halogen atom, or COOR 21 .

[0247] R 21 , R 22 , and R 23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0248] R 21 , R 22 , or R 23 representing a group can be substituted with a hydrogen atom by CN, a halogen atom, a hydroxyl group, or a carboxyl group.

[0249] R 11 , R 12 , R 13 , R 21 , R 22 , or R 23When the group represented by has an alkylene moiety, the alkylene moiety can be represented by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-、-NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- is interrupted 1 to 5 times.

[0250] R 24 It represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0251] R 11 、R 12 、R 13 、R 21 、R 22 or R 23 When the group represented by has an alkyl portion, the alkyl portion may be branched or cyclic. 12 With R 13 and R 22 With R 23 They can form a ring together.

[0252] As R in formula (1) 11 、R 12 、R 13 、R 21 、R 22 、R 23 and R 24 Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, tert-pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, tert-octyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, and cyclohexylethyl.

[0253] As R in formula (1) 11 、R 12 、R 13 、R 21 、R 22 、R 23 and R 24 Examples of the aryl group having 6 to 30 carbon atoms represented by phenyl include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracenyl, phenanthrenyl, and phenyl substituted with one or more of the above alkyl groups, biphenyl, naphthyl, anthracenyl, and the like.

[0254] As R in formula (1) 11 、R 12 、R 13 、R 21 、R 22 、R 23 and R 24 Examples of the aralkyl group having 7 to 30 carbon atoms represented by alkyl include benzyl, α-methylbenzyl, α,α-dimethylbenzyl, and phenylethyl.

[0255] As R in formula (1) 11 、R 12 、R 13 、R 21 、R 22 、R 23 and R 24 The heterocyclic group having 2 to 20 carbon atoms represented by the present invention includes, for example, pyridyl, pyrimidinyl, furyl, thienyl, tetrahydrofuranyl, dioxolanyl, benzo Oxazol-2-yl, tetrahydropyranyl, pyrrolidinyl, imidazolidinyl, pyrazolidinyl, thiazolidinyl, isothiazolidinyl, Oxazolidinyl, isocyanate oxazolidinyl, piperidinyl, piperazinyl, morpholinyl, etc., preferably a five- to seven-membered heterocyclic ring.

[0256] R in formula (1) 12 With R 13 and R 22 With R 23 can form a ring together, which means R 12 With R 13 and R 22 With R 23 They can form a ring together with the nitrogen atom, carbon atom or oxygen atom to which they are connected.

[0257] As R in formula (1) 12 With R 13 and R 22 With R 23 Examples of the ring that can be formed together include a cyclopentane ring, a cyclohexane ring, a cyclopentene ring, a benzene ring, a piperidine ring, a morpholine ring, a lactone ring, and a lactam ring, and a five- to seven-membered ring is preferred.

[0258] As R in formula (1) 11 、R 12 、R 13 、R 21 、R 22 and R 23 Examples of the halogen atom which may be present as a substituent include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

[0259] R in formula (1)1 Preferably R 11 , more preferably an alkyl group having 1 to 20 carbon atoms, further preferably an alkyl group having 1 to 10 carbon atoms, and further preferably an alkyl group having 1 to 6 carbon atoms.

[0260] An example of the second molecular structure linked to the first molecular structure represented by formula (1) is a structure represented by the following formula (2): The second molecular structure refers to a molecular structure portion other than the first molecular structure possessed by the oxime compound (1).

[0261] In formula (2), The bonding site represented by " " is directly bonded to the bonding site represented by ". That is, when the second molecular structure is the structure represented by formula (2), the structure having "- The benzene ring of " and the benzene ring of formula (1) with "- " is directly bonded to the carbonyl group.

[0262]

[0263] [In formula (2),

[0264] R 2 and R 3 Each independently represents R 11 , OR 11 SR 11 、COR 11 、CONR 12 R 13 NR 12 COR 11 , OCOR 11 、COOR 11 SCOR 11 , OCSR 11 、COSR 11 , CSOR 11 , CN or halogen atom.

[0265] There are multiple R 2 When , they may be the same or different.

[0266] There are multiple R 3 When , they may be the same or different.

[0267] R 11 、R 12 and R 13 Means the same as above.

[0268] s and t each independently represent an integer of 0-4.

[0269] L represents a sulfur atom, CR31 R 32 , CO or NR 33 .

[0270] R 31 、R 32 and R 33 Each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms.

[0271] R 31 、R 32 or R 33 When the group represented by has an alkyl portion, the alkyl portion may be branched or cyclic. 31 、R 32 and R 33 Each of them can independently form a ring together with an adjacent benzene ring.

[0272] R 4 represents a hydroxyl group, a carboxyl group, or a group represented by the following formula (2-1).

[0273]

[0274] [In formula (2-1),

[0275] L 1 Indicates -O-, -S-, and -NR 22 -, -NR 22 CO-, -SO2-, -CS-, -OCO- or -COO-.

[0276] R 22 Means the same as above.

[0277] L 2 It represents a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, a group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, or a group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms.

[0278] L 2 When the group represented by has an alkylene moiety, the alkylene moiety can be represented by -O-, -S-, -COO-, -OCO-, -NR 22 -, -NR 22 COO-、-OCONR 22 -, -SCO-, -COS-, -OCS- or -CSO- is interrupted 1 to 5 times, and the alkylene portion may be branched or cyclic.

[0279] R 4a represents an OR 41 group, an SR 41 group, a CONR 42 R 43 group, a NR 42 COR 43 group, an OCOR 41 group, a COOR 41 group, a SCOR 41 group, an OCSR 41 group, a COSR 41 group, a CSOR 41 group, a CN group or a halogen atom.

[0280] R 4a may be the same or different.

[0281] R 41 , R 42 and R 43 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an aralkyl group having 7 to 30 carbon atoms, R 41 , R 42 and R 43 representing an alkyl group can be branched or cyclic, R 42 and R 43 may form a ring together.

[0282] v represents an integer of 1 to 3.

[0283] represents a bonding site to the 1st molecular structure possessed by the oxime compound (1).

[0284] Examples of the alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 30 carbon atoms and the aralkyl group having 7 to 30 carbon atoms represented by R 11 , R 12 , R 13 , R 21 , R 22 , R 23 , R 24 , R 31 , R 32 and R 33 in the formula (2) and R 22 , R 41 , R 42 and R 43 in the above formula (2-1) are the same as those of R 11 , R 12 , R 13 , R 21 , R 22 , R23 and R 24 Examples of R

[0285] Examples of R 11 , R 12 , R 13 , R 21 , R 22 , R 23 , R 24 , and R 22 in the above formula (2-1) are the same as those of R 11 , R 12 , R 13 , R 21 , R 22 , R 23 , and R 24 in the above formula (1).

[0286] Examples of R 31 , R 32 , and R 33 in the above formula (2) that can each independently form a ring together with an adjacent benzene ring are the same as those of R 31 , R 32 , and R 33 in the above formula (1).

[0287] Examples of the ring that R 31 , R 32 , and R 33 in the above formula (2) can form together with an adjacent benzene ring are the same as those of R 12 and R 13 in the above formula (1). 22 and R 23 in the above formula (1).

[0288] L 2 in the above formula (2-1) represents a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0289] As a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, for example, in the case where v is 1, there are mentioned methylene, ethylene, propylene, methylethylene, butylene, 1-methylpropylene, 2-methylpropylene, 1,2-dimethylpropylene, 1,3-dimethylpropylene, 1-methylbutylene, 2-methylbutylene, 3-methylbutylene, 4-methylbutylene, 2,4-dimethylbutylene, 1,3-dimethylbutylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, dodecylene, tridecylene, tetradecylene, pentadecylene, ethane-1,1-diyl, propane-2,2-diyl and the like alkylene groups.

[0290] As a group obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, for example, in the case where v is 1, there are mentioned 1,2-phenylene, 1,3-phenylene, 1,4-phenylene, 2,6-naphthylene, 1,4-naphthylene, 2,5-dimethyl-1,4-phenylene, diphenylmethane-4,4'-diyl, 2,2-diphenylpropane-4,4'-diyl, diphenyl sulfide-4,4'-diyl, diphenyl sulfone-4,4'-diyl and the like arylene groups.

[0291] As a group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, for example, in the case where v is 1, there are mentioned a group represented by the following formula (a) and a group represented by the following formula (b) and the like.

[0292]

[0293] [In formulae (a) and (b), L 3 and L 5 represent an alkylene group having 1 to 10 carbon atoms, L 4 and L 6 represent a single bond or an alkylene group having 1 to 10 carbon atoms.]

[0294] As an alkylene group having 1 to 10 carbon atoms, there are mentioned methylene, ethylene, propylene, methylethylene, butylene, 1-methylpropylene, 2-methylpropylene, 1,2-dimethylpropylene, 1,3-dimethylpropylene, 1-methylbutylene, 2-methylbutylene, 3-methylbutylene, 4-methylbutylene, 2,4-dimethylbutylene, 1,3-dimethylbutylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene and the like.

[0295] Examples of the group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms include, for example, when v is 1, 2,5-pyridinediyl, 2,6-pyridinediyl, 2,5-pyrimidinediyl, 2,5-thiophenediyl, 3,4-tetrahydrofurandiyl, 2,5-tetrahydrofurandiyl, 2,5-furandiyl, 3,4-thiazoldiyl, 2,5-benzofurandiyl, 2,5-benzothiophenediyl, N-methylindole-2,5-diyl, 2,5-benzothiazolediyl, 2,5-benzothiazoldiyl, and 2,5-benzothiazoldiyl. divalent heterocyclic groups such as oxadiyl and the like.

[0296] As R in formula (2) 2 and R 3 , and R in the above formula (2-1) 4a Examples of the halogen atom represented by include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

[0297] From the viewpoint of solubility in the solvent (F) and developability of the composition, a preferred example of the structure represented by formula (2) is a structure represented by the following formula (2a).

[0298]

[0299] [In formula (2a), L' represents a sulfur atom or NR 50 , R 50 represents a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, R 2 、R 3 、R 4 , s and t have the same meanings as above. It represents the bonding site with the first molecular structure of the oxime compound (1).]

[0300] From the same viewpoint as above, another preferred example of the structure represented by formula (2) is a structure represented by the following formula (2b).

[0301]

[0302] [In formula (2b), R 44 represents a hydroxyl group, a carboxyl group, or a group represented by the following formula (2-2).

[0303]

[0304] [In formula (2-2), L 11 Indicates -O- or -OCO-, Indicates that L 12 The bonding site, L 12represents an alkylene group having 1 to 20 carbon atoms, the alkylene group can be interrupted by 1 to 3 -O-, R 44a represents OR 55 or COOR 55 , R 55 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

[0305] represents a bonding site to the 1st molecular structure possessed by the oxime compound (1).

[0306] R 44 is preferably a group represented by formula (2-2). In this case, it is advantageous in terms of solubility of the oxime compound (1) in a solvent (F) and developability of the composition.

[0307] L 12 The number of carbon atoms of the alkylene group represented by R

[0308] R 44a is preferably a hydroxyl group or a carboxyl group, more preferably a hydroxyl group.

[0309] The method for producing the oxime compound (1) having the 2nd molecular structure represented by formula (2) is not particularly limited, and for example, it can be produced by the method described in Japanese Patent Application Publication No. 2011-132215.

[0310] Another example of the 2nd molecular structure connected to the 1st molecular structure represented by formula (1) is a structure represented by the following formula (3).

[0311] The bonding site represented by "in formula (3) is directly bonded to the bonding site represented by "in formula (1). That is, when the 2nd molecular structure is a structure represented by formula (3), the benzene ring having "in formula (3) is directly bonded to the carbonyl group having "in formula (1). In formula (3),

[0312]

[0313] [In formula (3),

[0314] R 5 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0315] R 5 When the group represented by R

[0316] R​​​5 The hydrogen atoms of the group represented by R 21 , OR 21 、COR 21 SR 21 NR 22 R 23 、CONR 22 R 23 、-NR 22 -OR 23 、-N(COR 22 )-OCOR 23 NR 22 COR 21 , OCOR 21 、COOR 21 、-C(=N-OR 21 )-R 22 、-C(=N-OCOR 21 )-R 22 SCOR 21 , OCSR 21 、COSR 21 , CSOR 21 , hydroxyl, nitro, CN, halogen atom or COOR 21 replace.

[0317] R 21 、R 22 and R 23 Means the same as above.

[0318] R 21 、R 22 or R 23 The hydrogen atom of the group represented by may be substituted by CN, a halogen atom, a hydroxyl group or a carboxyl group.

[0319] R 21 、R 22 and R 23 When the group represented by has an alkylene moiety, the alkylene moiety can be represented by -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-、-NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- is interrupted 1 to 5 times.

[0320] R 24 Means the same as above.

[0321] R 21 、R 22 and R 23In the case where the group represented by R 22 R 23 may form a ring together.

[0322] R 6 , R 7 , R 8 and R 9 each independently represent R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61 , OCSR 61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN or a halogen atom.

[0323] R 61 , R 62 , R 63 , R 64 and R 65 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms.

[0324] R 61 , R 62 , R 63 , R 64 or R 65 representing a group can be substituted with a hydrogen atom by OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, a halogen atom or COOR 21 ​

[0325] R 6 With R 7 、R 7 With R 8 and R 8 With R 9 They can form a ring together.

[0326] It represents the bonding site with the first molecular structure of the oxime compound (1).]

[0327] R in formula (3) 5 、R 21 、R 22 、R 23 、R 24 、R 61 、R 62 、R 63 、R 64 and R 65 Examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, arylalkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those in R in formula (1). 11 、R 12 、R 13 、R 21 、R 22 、R 23 and R 24 Same as the example.

[0328] R in formula (3) 22 With R 23 Can form a ring together means R 22 With R 23 Together with the nitrogen atom, carbon atom or oxygen atom to which it is connected, they can form a ring.

[0329] R in formula (3) 22 With R 23 Examples of rings that can be formed together are the same as R in formula (1). 12 With R 13 and R 22 With R 23 The same applies to examples of rings that can be formed together.

[0330] As R in formula (3) 6 、R 7 、R 8 and R 9 The halogen atom represented by R 5 、R 21 、R 22 、R 23 、R 61 、R 62 、R63 R 64 and R 65 Examples of the halogen atom of the hydrogen atom of R

[0331] From the viewpoints of solubility in a solvent (F) and developability of the composition, in one preferred mode, R 5 is a group represented by the following formula (3-1).

[0332]

[0333] In formula (3-1),

[0334] Z represents a group obtained by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, a group obtained by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms, or a group obtained by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms,

[0335] In the case where the group represented by Z has an alkylene moiety, the alkylene moiety can be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24 -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO-, and the alkylene moiety can be branched or cyclic,

[0336] R 21 , R 22 , and R 24 represent the same meanings as described above.

[0337] From the same viewpoints as described above, Z in formula (3-1) is preferably a methylene group, an ethylene group, or a phenylene group.

[0338] From the same viewpoints as described above, R 21 and R 22 in formula (3-1) are preferably an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, and more preferably a methyl group, an ethyl group, or a phenyl group.

[0339] From the same viewpoints as described above, in another preferred mode, R 7 is a nitro group.

[0340] The method for producing the oxime compound (1) having the second molecular structure represented by formula (3) is not particularly limited, and for example, can be produced by the methods described in Japanese Patent Application Publication No. 2000-80068 and Japanese Patent Application Publication No. 2011-178776.

[0341] Another example of the second molecular structure linked to the first molecular structure represented by formula (1) is a structure represented by the following formula (4).

[0342] In formula (4), The bonding site represented by " " is directly bonded to the bonding site represented by ". That is, when the second molecular structure is the structure represented by formula (4), the structure having "- The benzene ring of " and the benzene ring of formula (1) with "- " is directly bonded to the carbonyl group.

[0343]

[0344] [In formula (4),

[0345] R 71 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0346] R 71 When the group represented by has an alkyl portion, the alkyl portion may be branched or cyclic.

[0347] R 71 The hydrogen atoms of the group represented by R 21 , OR 21 、COR 21 SR 21 NR 22 R 23 、CONR 22 R 23 、-NR 22 -OR 23 、-N(COR 22 )-OCOR 23 NR 22 COR 21 , OCOR 21 、COOR 21 、-C(=N-OR 21 )-R 22 、-C(=N-OCOR 21 )-R 22 SCOR 21 , OCSR 21 、COSR 21 , CSOR 21 , hydroxyl, nitro, CN, halogen atom or COOR 21 replace.

[0348] R 21 , R 22 and R 23 represent the same meaning as described above.

[0349] R 21 , R 22 or R 23 represent a group in which a hydrogen atom of the group represented by R

[0350] R 21 , R 22 and R 23 represent a group in which an alkylene moiety of the group can be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24 -NR 24 CO-, -NR 24 COO-, -OCONR 24 -, -SCO-, -COS-, -OCS- or -CSO-.

[0351] R 24 represents the same meaning as described above.

[0352] R 21 , R 22 and R 23 represent a group in which an alkyl moiety of the group can be branched or cyclic, and in addition, R 22 and R 23 may form a ring together.

[0353] R 72 , R 73 and 3 R 74 each independently represent R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61 , OCSR 61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN or a halogen atom.

[0354] R 61 , R 62 , R 63 , R 64 and R65 each independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0355] R 61 , R 62 , R 63 , R 64 or R 65 The hydrogen atom of the group represented by R 21 , R 21 , R 21 , R 22 R 23 , R 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, a halogen atom or COOR 21 may be substituted.

[0356] R 72 and R 73 and 2 R 74 may each form a ring together.

[0357] represents a bonding site to the 1st molecular structure possessed by the oxime compound (1).

[0358] Examples of the alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 30 carbon atoms, the aralkyl group having 7 to 30 carbon atoms, and the heterocyclic group having 2 to 20 carbon atoms represented by R 71 , R 21 , R 22 , R 23 , R 24 , R 61 , R 62 , R 63 , R 64 and R 65 in the formula (4) are the same as the examples of R 11 , R 12 , R 13 , R 21 , R 22 , R 23 and R 24 in the formula (1).

[0359] R in formula (4) 22 R in formula (1) 23 may form a ring together is that R 22 R in formula (1) 23 may form a ring together with the connected nitrogen atom, carbon atom, or oxygen atom.

[0360] R in formula (4) 22 R in formula (1) 23 may form a ring together is that R 12 R in formula (1) 13 and R 22 R in formula (1) 23 may form a ring together.

[0361] Examples of the halogen atom represented by R 72 , R 73 , and R 74 in formula (4) that can substitute the hydrogen atom of R 71 , R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 , and R 65 are a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0362] The method for producing the oxime compound (1) having the 2nd molecular structure represented by formula (4) is not particularly limited, and for example, can be produced by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0363] Another example of the 2nd molecular structure connected to the 1st molecular structure represented by formula (1) is a structure represented by the following formula (5).

[0364] The bonding site represented by “ ” in formula (5) is directly bonded to the bonding site represented by “ ” in formula (1). That is, when the 2nd molecular structure is a structure represented by formula (5), the pyrrole ring having “ ” in formula (5) is directly bonded to the carbonyl group having “ ” in formula (1).

[0365]

[0366] [In formula (5),

[0367] R 81represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0368] R 81 In the case where the group represented by the above formula has an alkyl moiety, the alkyl moiety can be branched or cyclic.

[0369] R 81 The hydrogen atom of the group represented by the above formula can be substituted with R 21 , OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , NR 22 COR 21 , OCOR 21 , COOR 21 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , SCOR 21 , OCSR 21 , COSR 21 , CSOR 21 , a hydroxyl group, a nitro group, CN, a halogen atom, or COOR 21 .

[0370] R 21 , R 22 , and R 23 represent the same meaning as described above.

[0371] R 21 , R 22 , or R 23 The hydrogen atom of the group represented by the above formula can be substituted with CN, a halogen atom, a hydroxyl group, or a carboxyl group.

[0372] R 21 , R 22 , and R 23 In the case where the group represented by the above formula has an alkylene moiety, the alkylene moiety can be substituted with -O-, -S-, -COO-, -OCO-, -NR 24 -, -NR 24 CO-, -NR 24 COO-, -OCONR24 - SCO-, - COS-, - OCS-, or - CSO- interrupts 1 to 5 times.

[0373] R 24 have the same meanings as described above.

[0374] R 21 , R 22 , and R 23 In the case where the group represented by R 22 and R 23 may form a ring together.

[0375] R 82 , R 83 , R 84 , R 85 , and R 86 each independently represent R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61 , OCSR 61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN, or a halogen atom.

[0376] R 61 , R 62 , R 63 , R 64 , and R 65 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms.

[0377] R 61 , R 62 , R 63 , R 64 , or R 65 The hydrogen atom of the group represented by R 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR23 、-N(COR 22 )-OCOR 23 、-C(=N-OR 21 )-R 22 、-C(=N-OCOR 21 )-R 22 , CN, halogen atoms or COOR 21 replace.

[0378] R 83 With R 84 、R 84 With R 85 and R 85 With R 86 They can form a ring together.

[0379] It represents the bonding site with the first molecular structure of the oxime compound (1).]

[0380] R in formula (5) 81 、R 21 、R 22 、R 23 、R 24 、R 61 、R 62 、R 63 、R 64 and R 65 Examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, arylalkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those in R in formula (1). 11 、R 12 、R 13 、R 21 、R 22 、R 23 and R 24 Same as the example.

[0381] R in formula (5) 22 With R 23 Can form a ring together means R 22 With R 23 Together with the nitrogen atom, carbon atom or oxygen atom to which it is connected, they can form a ring.

[0382] R in formula (5) 22 With R 23 Examples of rings that can be formed together are the same as R in formula (1). 12 With R 13 and R 22 With R 23 The same applies to examples of rings that can be formed together.

[0383] R 82 , R 83 , R 84 , R 85 , and R 86 representing a halogen atom, a hydrogen atom of R 81 , R 21 , R 22 , R 23 , R 61 , R 62 , R 63 , R 64 , and R 65 may be exemplified by a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0384] The method for producing the oxime compound (1) having the 2nd molecular structure represented by formula (5) is not particularly limited, and may be produced, for example, by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0385] Another example of the 2nd molecular structure connected to the 1st molecular structure represented by formula (1) is a structure represented by the following formula (6).

[0386] The bonding site represented by “ ” in formula (6) is directly bonded to the bonding site represented by “ ” in formula (1). That is, when the 2nd molecular structure is a structure represented by formula (6), the benzene ring having “ ” in formula (6) is directly bonded to the carbonyl group having “ ” in formula (1).

[0387]

[0388] [In formula (6),

[0389] 4 R 91 , R 92 , R 93 , R 94 , R 95 , R 96 , and R 97 each independently represent R 61 , OR 61 , SR 61 , COR 62 , CONR 63 R 64 , NR 65 COR 61 , OCOR 61 , COOR 62 , SCOR 61, OCSR 61 , COSR 62 , CSOR 61 , a hydroxyl group, a nitro group, CN or a halogen atom.

[0390] R 61 , R 62 , R 63 , R 64 and R 65 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms.

[0391] R 61 , R 62 , R 63 , R 64 or R 65 representing a group can be substituted by a hydrogen atom with OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , -NR 22 -OR 23 , -N(COR 22 )-OCOR 23 , -C(=N-OR 21 )-R 22 , -C(=N-OCOR 21 )-R 22 , CN, a halogen atom or COOR 21 .

[0392] R 21 , R 22 and R 23 represent the same meanings as described above.

[0393] R 92 and R 93 , R 94 and R 95 , R 95 and R 96 , and R 96 and R 97 may form a ring together, respectively.

[0394] represents a bonding site of the 1st molecular structure possessed by the oxime compound (1).

[0395] R 21 , R 22 , R23 、R 61 、R 62 、R 63 、R 64 and R 65 Examples of alkyl groups having 1 to 20 carbon atoms, aryl groups having 6 to 30 carbon atoms, arylalkyl groups having 7 to 30 carbon atoms, and heterocyclic groups having 2 to 20 carbon atoms are the same as those in R in formula (1). 11 、R 12 、R 13 、R 21 、R 22 and R 23 Same as the example.

[0396] R in formula (6) 22 With R 23 Can form a ring together means R 22 With R 23 Together with the nitrogen atom, carbon atom or oxygen atom to which it is connected, they can form a ring.

[0397] R in formula (6) 22 With R 23 Examples of rings that can be formed together are the same as R in formula (1). 12 With R 13 and R 22 With R 23 The same applies to examples of rings that can be formed together.

[0398] As R in formula (6) 91 、R 92 、R 93 、R 94 、R 95 、R 96 and R 97 The halogen atom represented by R 21 、R 22 、R 23 、R 61 、R 62 、R 63 、R 64 and R 65 Examples of the halogen atom in place of a hydrogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

[0399] The method for producing the oxime compound (1) having the second molecular structure represented by formula (6) is not particularly limited, and for example, it can be produced by the methods described in International Publication Nos. 2017 / 051680 and 2020 / 004601.

[0400] As oxime compounds other than the compound represented by formula (DA) and the oxime compound (1), oxime compounds having a partial structure represented by the following formula (d1) can be given. represents a bonding site.

[0401]

[0402] As the oxime compound having a partial structure represented by formula (d1), for example, N-benzoyloxy-1-(4-phenylsulfanylphenyl)butane-1-ketone-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)octane-1-ketone-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropane-1-ketone-2-imine, N-acetyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethane-1-imine, N-acetyloxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxocyclopentylmethoxy)benzoyl}-9H-carbazol-3-yl]ethane-1-imine, N-acetyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-3-cyclopentylpropane-1-imine, N-benzoyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-3-cyclopentylpropane-1-ketone-2-imine; the compounds described in Japanese Patent Application Publication No. 2011-132215, International Publication No. 2008 / 78678, International Publication No. 2008 / 78686, International Publication No. 2012 / 132558, and the like can be given. Commercially available products such as Irgacure (registered trademark) OXE01, Irgacure OXE02, Irgacure OXE03 (all of which are manufactured by BASF Corporation), N-1919, NCI-930, NCI-831 (all of which are manufactured by ADEKA Corporation), and the like can also be used.

[0403] Among the oxime compounds having a partial structure represented by formula (d1), the oxime compound is preferably at least one selected from the group consisting of N-benzoyloxy-1-(4-phenylsulfanylphenyl)butane-1-ketone-2-imine, N-benzoyloxy-1-(4-phenylsulfanylphenyl)octane-1-ketone-2-imine, and N-benzoyloxy-1-(4-phenylsulfanylphenyl)-3-cyclopentylpropane-1-ketone-2-imine, and more preferably N-benzoyloxy-1-(4-phenylsulfanylphenyl)octane-1-ketone-2-imine.

[0404] The alkylphenone compound is a compound having a partial structure represented by the following formula (d2) or a partial structure represented by the following formula (d3). In these partial structures, the benzene ring can have a substituent. represents a bonding site.

[0405]

[0406] As the compound having a structure represented by formula (d2), 2-methyl-2-morpholino-l- (4-methylthiophenyl)propan-l-one, 2-dimethylamino-l- (4-morpholinophenyl) -2-benzylbutan-l-one, 2- (dimethylamino) -2- [ (4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] butan-l-one, and the like can be given. OMNIRAD (registered trademark) 369, OMNIRAD 907, OMNIRAD 379 (all of which are manufactured by IGM Resins Co.), and the like commercially available products can also be used.

[0407] As the compound having a structure represented by formula (d3), 2-hydroxy-2-methyl-l-phenylpropan-l-one, 2-hydroxy-2-methyl-l- [4- (2-hydroxyethyloxy) phenyl] propan-l-one, 1-hydroxycyclohexyl phenyl ketone, an oligomer of 2-hydroxy-2-methyl-l- (4-isopropenylphenyl) propan-l-one, α, α-diethoxyacetophenone, benzil dimethyl ketal, and the like can be given.

[0408] As the alkyl phenone compound, a compound having a structure represented by formula (d2) is preferable in terms of sensitivity.

[0409] As the bisimidazole compound, for example, a compound represented by formula (d5) can be given.

[0410]

[0411] [In formula (d5), R E ~R J represents an aryl group having 6 to 10 carbon atoms which can have a substituent.]

[0412] As the aryl group having 6 to 10 carbon atoms, for example, a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, and the like can be given, and a phenyl group is preferable.

[0413] As the substituent, for example, a halogen atom, an alkoxy group having 1 to 4 carbon atoms, and the like can be given. As the halogen atom, for example, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like can be given, and a chlorine atom is preferable. As the alkoxy group having 1 to 4 carbon atoms, for example, a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and the like can be given, and a methoxy group is preferable.

[0414] As the biimidazole compound, for example, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (for example, refer to Japanese Patent Application Publication No. 06-75372, Japanese Patent Application Publication No. 06-75373, and the like), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxylphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(dialkoxylphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxylphenyl)biimidazole (for example, refer to Japanese Patent Application Publication No. 48-38403, Japanese Patent Application Publication No. 62-174204, and the like), a biimidazole compound in which the phenyl group at the 4,4',5,5'-positions is substituted with a carbonylalkoxy group (for example, refer to Japanese Patent Application Publication No. 7-10913), and the like can be given. Among these, a compound represented by the following formula or a mixture thereof is preferable.

[0415]

[0416] As the triazine compound, for example, 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine, and the like can be given. Among these, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine is preferable.

[0417] As the acylphosphine compound, for example, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, (2,4,6-trimethylbenzoyl)diphenylphosphine oxide, and the like can be given. Commercially available products such as OMNIRAD (registered trademark) 819 (manufactured by IGM Resins) can also be used.

[0418] As other examples of the polymerization initiator, for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and the like benzoin compounds; benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyl diphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4,4'-bis(diethylamino)benzophenone, and the like benzophenone compounds; 9,10-phenanthrenequinone, 2-ethylanthraquinone, camphorquinone, and the like quinone compounds; 10-butyl-2-chloroacridone, benzil, methyl benzoylformate, a titanocene compound, and the like can be given.

[0419] The content of the compound represented by formula (DA) in the polymerization initiator (D) is preferably 30 to 100% by mass, more preferably 50 to 100% by mass, further preferably 70 to 100% by mass, still further preferably 80 to 100% by mass, yet further preferably 90 to 100% by mass, particularly preferably 95 to 100% by mass, and can be 100% by mass, with respect to the total amount of the polymerization initiator (D), from the viewpoint of forming a cured film having excellent pattern delineation.

[0420] The content of the polymerization initiator (D) in the composition is, for example, 0.01 to 20% by mass, and is preferably 0.1 to 15% by mass, more preferably 0.2 to 10% by mass, further preferably 0.3 to 8% by mass, still further preferably 0.5 to 5% by mass, particularly preferably 3% by mass or less, with respect to the total amount of the solid components in the composition, from the viewpoint of improving the sensitivity of the composition, and from the viewpoint of improving the luminescence intensity and heat resistance of the film.

[0421] The content of the polymerization initiator (D) is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, further preferably 20 parts by mass or less, with respect to 100 parts by mass of the polymerizable compound (C). When the content of the polymerization initiator (D) is within the above range, a composition capable of forming a cured film having more excellent residual film rate, and a composition capable of forming a cured film having excellent heat resistance can be obtained.

[0422] < Polymerization Initiating Aid (D1 ) >

[0423] The curable composition can further contain a polymerization initiating aid (D1) together with the polymerization initiator (D). The polymerization initiating aid (D1) is a compound or a sensitizer for promoting the polymerization of the polymerizable compound (C) initiated by the polymerization initiator (D). As the polymerization initiating aid (D1), amine compounds, alkoxyanthracene compounds, thioxanthone compounds, carboxylic acid compounds, and the like can be given.

[0424] As the amine compound, for example, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N,N-dimethyl-p-toluidine, 4,4'-bis(dimethylamino)benzophenone (commonly known as Michler's ketone), 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(ethylmethylamino)benzophenone, and the like can be given, of which 4,4'-bis(diethylamino)benzophenone is preferred. Commercially available products such as EAB-F (manufactured by Hokoku Corporation) can also be used.

[0425] As the alkoxyanthracene compound, for example, 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, 2-ethyl-9,10-dibutoxyanthracene, and the like can be given.

[0426] As the thioxanthone compound, for example, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, and 1-chloro-4-propoxythioxanthone, and the like can be given.

[0427] As the carboxylic acid compound, for example, phenylsulfanylacetic acid, methylphenylsulfanylacetic acid, ethylphenylsulfanylacetic acid, methylethylphenylsulfanylacetic acid, dimethylphenylsulfanylacetic acid, methoxyphenylsulfanylacetic acid, dimethoxyphenylsulfanylacetic acid, chlorophenylsulfanylacetic acid, dichlorophenylsulfanylacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylsulfanylacetic acid, N-naphthylglycine, naphthyloxyacetic acid, and the like can be given.

[0428] When the curable composition contains the polymerization initiation aid (D1), the content of the polymerization initiation aid (D1) in the curable composition is preferably 0.1 to 300 parts by mass, more preferably 0.1 to 200 parts by mass, relative to 100 parts by mass of the polymerizable compound (C). In addition, the content of the polymerization initiation aid (D1) in the curable composition is preferably 0.1 to 30 parts by mass, more preferably 1 to 20 parts by mass, relative to 100 parts by mass of the total amount of the resin (B) and the polymerizable compound (C). When the content of the polymerization initiation aid (D1) is within the above range, further high sensitivity of the curable composition can be achieved.

[0429] <Antioxidant (E)>

[0430] The curable composition can further contain an antioxidant (E).

[0431] As the antioxidant (E), there is no particular limitation as long as it is an antioxidant generally used in industry, and a phenol-based antioxidant, a phosphorus-based antioxidant, a phosphorus / phenol complex antioxidant, and a sulfur-based antioxidant, etc. can be used. Two or more kinds of the antioxidant (E) can be used in combination.

[0432] The phosphorus / phenol complex antioxidant can be a compound having one or more phosphorus atoms and a phenol structure in the molecule, respectively. Among them, from the viewpoints of the developability of the cured film and the luminous intensity, the antioxidant (E) preferably contains a phosphorus / phenol complex antioxidant.

[0433] As the phenol-based antioxidant, for example, Irganox (registered trademark) 1010 (Irganox 1010: pentaerythritol tetra [3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], manufactured by BASF Corporation), Irganox (registered trademark) 1076 (Irganox 1076: octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, manufactured by BASF Corporation), Irganox (registered trademark) 1330 (Irganox 1330: 3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(m-phenylene-2,4,6-triyl) tri-p-cresol, manufactured by BASF Corporation), Irganox (registered trademark) 3114 (Irganox 3114: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation), Irganox (registered trademark) 3790 (Irganox 3790: 1,3,5-tris((4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation), Irganox (registered trademark) 1035 (Irganox 1035: thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], manufactured by BASF Corporation), Irganox (registered trademark) 1135 (Irganox 1135: 3,5-bis(1,1-dimethylethyl)-4-hydroxy-C7-C9 side alkyl ester of benzenepropionic acid, manufactured by BASF Corporation), Irganox (registered trademark) 1520L (Irganox 1520L: 4,6-bis(octylthiomethyl) o-cresol, manufactured by BASF Corporation), Irganox (registered trademark) (IrganoX3125, manufactured by BASF Corporation), Irganox (registered trademark) 565 (Irganox 565: 2,4-bis(n-octylthio)-6-(4-hydroxy-3',5'-di-tert-butyl anilino)-1,3,5-triazine, manufactured by BASF Corporation), ADK STAB (registered trademark) AO-80 (ADK STAB AO-80: 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro[5,5] dodecane, Sumilizer (registered trademark) BHT, Sumilizer (registered trademark) GA-80, Sumilizer (registered trademark) GS (all of the above, manufactured by Sumitomo Chemical Co., Ltd.), Cyanox (registered trademark) 1790 (Cyanox 1790, manufactured by Sitech Co., Ltd.), vitamin E (manufactured by Eisai Co., Ltd.), and the like.

[0434] As the phosphorus-based antioxidant, for example, Irgafos (registered trademark) 168 (Irgafos 168: tris (2,4-di-tert-butylphenyl) phosphite, manufactured by BASF Corporation), Irgafos (registered trademark) 12 (Irgafos 12: tris [2- [ [2,4,8,10-tetra-tert-butyl-dibenzo [d,f] [1,3,2] dioxaphosphepin-6-yl]oxy] ethyl] amine, manufactured by BASF Corporation), Irgafos (registered trademark) 38 (Irgafos 38: bis (2,4-bis (1,1-dimethylethyl) -6-methylphenyl) ethyl phosphite, manufactured by BASF Corporation), ADK STAB (registered trademark) 329K, ADK STAB (registered trademark) PEP36, ADK STAB (registered trademark) PEP-8 (all of the above, manufactured by ADEKA Corporation), Sandstab P-EPQ (manufactured by Clariant AG), Weston (registered trademark) 618, Weston (registered trademark) 619G (both of the above, manufactured by GE), Ultranox 626 (manufactured by GE), and the like can be given.

[0435] As the phosphorus / phenol complex antioxidant, for example, Sumilizer (registered trademark) GP (6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2, 4, 8, 10-tetra-tert-butyl-dibenzo [d, f] [1, 3, 2] dioxaphosphepin) (manufactured by Sumitomo Chemical Co., Ltd.), and the like can be given.

[0436] As the sulfur-based antioxidant, for example, dilauryl thiodipropionate, dimyristyl thiodipropionate, or distearyl thiodipropionate, and the like of dialkyl thiodipropionate compounds, and tetra [methylene (3-dodecylthio) propionate] methane, and the like of β-alkyl mercapto propionate compounds of polyhydric alcohols can be given.

[0437] The content of the antioxidant (E) in the curable composition is, for example, 0.05 to 20% by mass, preferably 0.1 to 10% by mass, more preferably 0.5 to 7% by mass, and further preferably 1 to 5% by mass, with respect to the total amount of the solid components of the curable composition.

[0438] The content of the antioxidant (E) in the curable composition is, for example, 1 to 50 parts by mass, preferably 5 to 40 parts by mass, more preferably 7 to 30 parts by mass, and further preferably 9 to 25 parts by mass, relative to 100 parts by mass of the resin (B), from the viewpoint of the light emission amount and heat resistance of the cured film.

[0439] The content ratio (antioxidant (E) / polymerization initiator (D)) of the above-mentioned antioxidant (E) and the polymerization initiator (D) in the curable composition is preferably greater than 1, more preferably 1.1 or greater, and further preferably 1.2 or greater, in terms of mass ratio, from the viewpoint of increasing the light emission intensity of the cured film.

[0440] <Solvent (F)>

[0441] The solvent (F) is not particularly limited as long as it dissolves the polymerizable compound (C) and the polymerization initiator (D), and the resin (B) used as necessary, and a solvent generally used in the field can be used. For example, ester solvents (solvents containing -COO- in the molecule and not containing -O-), ether solvents (solvents containing -O- in the molecule and not containing -COO-), ether ester solvents (solvents containing -COO- and -O- in the molecule), ketone solvents (solvents containing -CO- in the molecule and not containing -COO-), alcohol solvents (solvents containing OH in the molecule and not containing -O-, -CO-, and -COO-), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide, and the like can be mentioned.

[0442] As the ester solvent, methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isoamyl acetate, n-butyl propionate, isopropyl butyrate, ethyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexyl acetate, and γ-butyrolactone, and the like can be mentioned.

[0443] As the ether solvent, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-l-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, 1,3-dioxolane, 2-methoxyethyl ether, 2-ethoxyethyl ether, 2-methoxypropyl ether, 2-ethoxypropyl ether, 2-methoxybutyl ether, 2-ethoxybutyl ether, anisole, phenetol, and methyl anisole, and the like can be mentioned.

[0444] ​As the ether ester solvent, there can be mentioned methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and the like.

[0445] As the ketone solvent, there can be mentioned 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, isophorone, and the like.

[0446] As the alcohol solvent, there can be mentioned methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, glycerol, and the like.

[0447] As the aromatic hydrocarbon solvent, there can be mentioned benzene, toluene, xylene, mesitylene, and the like.

[0448] As the amide solvent, there can be mentioned N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, and the like.

[0449] As the solvent (F), propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, cyclohexyl acetate, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone, or toluene, or a mixture of two or more of these is preferred.

[0450] The solvent (F) is a component other than the solid component, and for example, a solvent contained in the quantum dots (A), the resin (B), and the like is also included in the solvent (F).

[0451] The content ratio of the solvent (F) in the curable composition is the proportion of the total mass of all the solvents contained in the composition to the total amount of the composition, and is, for example, 40 to 95% by mass, preferably 55 to 90% by mass, with respect to the total amount of the curable composition. In other words, the solid component of the curable composition is preferably 5 to 60% by mass, more preferably 10 to 45% by mass. When the content ratio of the solvent (F) is within the above range, there is a tendency that the flatness of the composition layer at the time of coating becomes better, and a cured film of an appropriate film thickness is easily formed.

[0452] <Leveling agent (G)>

[0453] The curable composition can further contain a leveling agent (G).

[0454] As the leveling agent (G), a silicone-based surfactant, a fluorine-based surfactant, and a silicone-based surfactant having a fluorine atom, and the like can be given. They can have a polymerizable group in a side chain. From the viewpoints of development properties of a cured film and luminous intensity, the leveling agent (G) is preferably a fluorine-based surfactant.

[0455] As the silicone-based surfactant, a surfactant having a siloxane bond in a molecule, and the like can be given. Specifically, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (trade name: manufactured by Dow Corning Toray Co., Ltd.), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452, and TSF4460 (manufactured by MOMENTIVE PERFORMANCE MATERIALS JAPAN KK), and the like can be given.

[0456] As the fluorine-based surfactant, a surfactant having a fluorocarbon chain in the molecule can be given. Specifically, FLUORAD (registered trademark) FC430, FLUORAD FC431 (manufactured by Sumitomo 3M Co., Ltd.), MEGAFAC (registered trademark) F142D, MEGAFAC F171, MEGAFAC F172, MEGAFAC F173, MEGAFAC F177, MEGAFAC F183, MEGAFAC F554, MEGAFAC F575, MEGAFAC R30, MEGAFAC RS-718-K (manufactured by DIC Corp.), F-top (registered trademark) EF301, F-top EF303, F-top EF351, F-top EF352 (manufactured by Mitsubishi Materials Electronic Materials Co., Ltd.), Surflon (registered trademark) S381, Surflon S382, Surflon SC101, Surflon SC105 (manufactured by Asahi Glass Co., Ltd.), and E5844 (manufactured by Daikin Industries, Ltd.) and the like can be given.

[0457] As the organosilicon-based surfactant having a fluorine atom, a surfactant having a siloxane bond and a fluorocarbon chain in the molecule can be given. Specifically, MEGAFAC (registered trademark) R08, MEGAFAC BL20, MEGAFAC F475, MEGAFAC F477, and MEGAFAC F443 (manufactured by DIC Corp.) and the like can be given.

[0458] When the curable composition contains the leveling agent (G), the content rate of the leveling agent (G) in the curable composition is, for example, 0.001 to 1.0% by mass, preferably 0.005 to 0.75% by mass, more preferably 0.01 to 0.5% by mass, and further preferably 0.03 to 0.5% by mass, with respect to the total amount of the curable composition. When the content rate of the leveling agent (G) is within the above range, the planarity of the cured film can be made more excellent.

[0459] <Light Scattering Agent (H)>

[0460] The curable composition can further contain a light scattering agent (H). As the light scattering agent (H), a particle of a metal or a metal oxide, a glass particle, and the like can be given.

[0461] As the metal oxide, TiO2, SiO2, BaTiO3, ZnO, and the like can be given. The particle diameter of the light scattering agent (H) is, for example, about 0.03 to 20 μm, preferably 0.05 to 1 μm, and more preferably 0.05 to 0.5 μm.

[0462] As the light scattering agent (H), a dispersion liquid obtained by previously dispersing the light scattering agent in a part or all of the solvent (F) using a dispersant can be used. As the dispersant, a commercially available product can be used. As examples of the commercially available product, the following can be given:

[0463] DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000, 2001, 2020, 2025, 2050, 2070, 2095, 2150, 2155; ANTI-TERRA-U, U100, 203, 204, 250; BYK-P104, P104S, P105, 220S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS; Bykumen, etc. manufactured by BYK-Chemie Japan Co., Ltd.;

[0464] SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 76500, etc. manufactured by Japan Lubrizol Co., Ltd.;

[0465] EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc. manufactured by BASF Co., Ltd.;

[0466] Ajisper PA111, PB711, PB821, PB822, PB824, etc. manufactured by Ajinomoto Fine Techno Co., Inc.

[0467] The content of the light scattering agent (H) in the curable composition is, for example, 0.001 to 50% by mass, relative to the total amount of the solid components of the curable composition, and is preferably 1 to 30% by mass, more preferably 2 to 10% by mass, from the viewpoints of development properties and luminous intensity of the cured film.

[0468] It should be noted that the curable composition can further contain, as necessary, a polymerization inhibitor, a filler, and other polymer compounds, an adhesion promoter, a light stabilizer, a chain transfer agent, and the like, which are known in the art.

[0469] <Method for producing a curable composition>

[0470] The method for producing a curable composition can include a step of mixing the quantum dots (A), the polymerizable compound (C), and the polymerization initiator (D), and other components used as necessary. The method for producing a curable composition can further include a step of preparing the resin (B).

[0471] <Curved film>

[0472] The cured film of the present application can be obtained by applying the above-mentioned curable composition of the present application to a substrate and curing it under the action of light and, as necessary, further under the action of heat. The cured film contains the quantum dots (A) contained in the curable composition. In addition, the cured film contains a cured reaction product of the polymerizable compound (C) and the polymerization initiator (D) contained in the curable composition. The cured reaction product is a substance containing a structure derived from the structures of the polymerizable compound (C) and the polymerization initiator (D). The structure derived from the structures of the polymerizable compound (C) and the polymerization initiator (D) refers to, for example, a skeletal structure or a part thereof other than the cured reaction sites of the polymerizable compound (C) and the polymerization initiator (D). In addition, the cured film contains the resin (B) used as necessary in the curable composition.

[0473] The cured film can be formed on the entire surface of the above-mentioned substrate, or on a part of the above-mentioned substrate (i.e., a cured pattern). As described above, the cured pattern refers to one form of the cured film, and is a cured film formed in a pattern shape.

[0474] As a method for forming a cured film on a part of the above-mentioned substrate, photolithography, inkjet method, printing method, and the like can be given. Among them, photolithography is preferred. The photolithography is a method of forming a composition layer by applying a curable composition to a substrate and, as necessary, drying it, exposing the composition layer through a photomask, and developing it.

[0475] As a method for forming a cured film on the entire surface of a substrate, a method of forming a composition layer by applying a curable composition to a substrate and, as necessary, drying it, and heating the composition layer and / or exposing the entire surface of the composition layer can be given.

[0476] As the substrate, there can be mentioned a glass plate such as quartz glass, borosilicate glass, aluminosilicate glass, soda-lime glass coated with silica on the surface, a resin plate such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, silicon, a substrate on which an aluminum, silver, silver / copper / palladium alloy thin film or the like is formed on the above substrate, and the like.

[0477] The formation of the cured pattern by photolithography can be performed by known or conventional means and conditions. For example, it can be produced as follows.

[0478] First, the curable composition is applied to a substrate, and heated and dried (pre-baking) and / or reduced-pressure dried to remove volatile components such as a solvent, to obtain a composition layer. As the application method, there can be mentioned spin coating, slit coating, slit and spin coating, and the like.

[0479] The temperature at the time of heating and drying is preferably from 30°C to 120°C, and more preferably from 50°C to 110°C. The heating time is preferably from 10 seconds to 60 minutes, and more preferably from 30 seconds to 30 minutes.

[0480] At the time of reduced-pressure drying, it is preferable to perform it at a pressure of from 50 Pa to 150 Pa and a temperature of from 20°C to 25°C.

[0481] The film thickness of the composition layer is not particularly limited, and it is only necessary to select it appropriately according to the film thickness of the target cured pattern, and for example, it is from 1 μm to 20 μm, preferably from 1.5 μm to 18 μm, more preferably from 2 μm to 14 μm, and further preferably from 2 μm to 12 μm.

[0482] Next, the composition layer is exposed through a photomask for forming the target cured pattern. The shape of the pattern on the photomask is not particularly limited.

[0483] As the light source used in the exposure, a light source that generates light having a wavelength of from 250 nm to 450 nm is preferable. For example, from the light having the wavelength, light near 436 nm, near 408 nm, or near 365 nm can be selectively extracted using a band-pass filter according to the absorption wavelength of the polymerization initiator (D). As the light source, specifically, there can be mentioned a mercury lamp, a light-emitting diode, a metal halide lamp, a halogen lamp, and the like.

[0484] In order to be able to uniformly irradiate parallel light to the entire exposure surface, and to perform accurate alignment of the photomask and the substrate on which the composition layer is formed, it is preferable to use an exposure device such as a mask aligner and a stepper. The composition layer to be exposed is cured by polymerization of the polymerizable compound (C) or the like contained in the composition layer.

[0485] The composition layer after exposure is developed by bringing it into contact with a developer, whereby the unexposed portions of the composition layer are removed by dissolving in the developer, to obtain a cured pattern. As the developer, for example, an aqueous solution of an alkali compound such as potassium hydroxide, sodium bicarbonate, sodium carbonate, tetramethylammonium hydroxide, an organic solvent can be cited. The concentration in the aqueous solution of the alkali compound is preferably 0.01 to 10 mass%, more preferably 0.03 to 5 mass%. As the organic solvent, the same solvent as the above-mentioned solvent (F) can be cited. The developer can contain a surfactant.

[0486] The developing method can be any one of a spin-coating immersion method, a dipping method, a spraying method, and the like. Further, the substrate can be inclined at an arbitrary angle at the time of development.

[0487] It is preferable to further heat (post-bake) the cured pattern obtained by development. The heating temperature is preferably 150 to 250°C, more preferably 160 to 235°C. The heating time is preferably 1 to 120 minutes, more preferably 10 to 60 minutes. By heating after development, the unreacted polymerizable compound (C) and the like contained in the cured pattern can be polymerized, and thus a cured pattern having more excellent reagent resistance can be obtained. In the case where development is not performed, it is also preferable to further heat (post-bake) the exposed composition layer.

[0488] By irradiating the cured film with ultraviolet light or visible light, the cured film can emit light of a wavelength different from the irradiated light. By selecting the component and particle diameter of the quantum dot (A) in the curable composition used at the time of forming the cured film, the wavelength of the emitted light can be adjusted. The cured film has a function of converting the wavelength of the irradiated light as described above, and thus can be used as a color conversion layer (wavelength conversion film) of a display device.

[0489] The cured film can exhibit a good luminous intensity. The luminous intensity of the cured film, which is measured according to the measurement method in the column of the examples described later, is preferably 400 mW sr -1 m -2 ·nm -1 More preferably, the above is 500 mW sr -1 m -2 ·nm -1 Further preferably, the above is 600 mW sr -1 m -2 ·nm -1 More further preferably, the above is 650 mW sr -1 m -2 ·nm -1 More preferably, the above is 700 mW sr -1 m -2 ·nm -1 Further preferably, the above is 750 mW sr-1 m -2 ·nm -1 Further more preferably, the above is 800 mW·sr -1 m -2 ·nm -1 The content ratio of the quantum dot (A) of the curable composition with respect to the total amount of the solid components is preferably 20 to 80 mass%, and particularly preferably 30 to 70 mass% in order to achieve the above-described luminous intensity of the cured film.

[0490] As long as it is the curable composition of the present application, it can be appropriately patterned, and thus is useful as a color conversion layer of a display device, particularly a liquid crystal display device, an organic EL display device, or an inorganic EL display device. As such a display device, for example, those described in Japanese Patent Application Publication No. 2006-309219, Japanese Patent Application Publication No. 2006-310303, Japanese Patent Application Publication No. 2013-15812, Japanese Patent Application Publication No. 2009-251129, Japanese Patent Application Publication No. 2014-2363, and the like can be given.

[0491] The display device at least has a light source and the above-described cured film. The display device is not particularly limited, and for example, can further include a light absorbing layer, a light reflecting member (a reflective film or the like), a diffusion film, a brightness enhancement portion, a prism sheet, a light guide plate, a layer of a medium material between elements, and the like.

[0492] The light absorbing layer is a wavelength-selective layer that transmits light in a specific wavelength range and absorbs light in a wavelength range other than the specific wavelength range. The light absorbing layer is typically a layer containing a coloring agent such as a dye or a pigment, and can be disposed on the above-described cured film. As the light absorbing layer, an element conventionally known as a color filter can be used.

[0493] The light reflecting member is a member for reflecting light from the light source toward the above-described cured film, and can be a mirror, a film of reflecting particles, a reflective metal film, or a reflector, or the like. The diffusion film can be a film for diffusing light from the light source or light emitted from the cured film, an amplification diffusion film, or the like. The brightness enhancement portion is a member for reflecting a part of light toward the direction of light transmission and returning.

[0494] The prism sheet has a base material portion and a prism portion. Note that the base material portion can be omitted in correspondence with an adjacent member. The prism sheet can be attached to an adjacent member via an appropriate adhesive layer (e.g., an adhesive layer, a bonding agent layer). The prism sheet is formed by arranging a plurality of unit prisms protruding on the side opposite to the viewing side (back side) in parallel. By arranging the protruding portions of the prism sheet toward the back side, light passing through the prism sheet is easily condensed. In addition, if the protruding portions of the prism sheet are arranged toward the back side, light that is not incident on the prism sheet and is reflected is less than in the case where the protruding portions are arranged toward the viewing side, and a display device with high luminance can be obtained.

[0495] As the light guide plate, an appropriate light guide plate can be used. For example, in order to enable light from the lateral direction to be deflected in the thickness direction, a light guide plate in which a lens pattern is formed on the back side, a light guide plate in which a prism shape or the like is formed on the back side and / or the viewing side, or the like can be used.

[0496] The display device can include a layer composed of one or more medium materials in the optical path between adjacent elements (layers). As the one or more medium materials, for example, vacuum, air, a gas, an optical material, an adhesive, an optical adhesive, glass, a polymer, a solid, a liquid, a gel, a cured material, an optical bonding material, a refractive index matching or non-matching material, a refractive index gradient material, a cladding or anti-cladding material, a spacer material, silicone, a brightness enhancement material, a scattering or diffusion material, a reflection or anti-reflection material, a wavelength selective material, a wavelength selective anti-reflection material, or other appropriate medium known in the art can be included, but is not limited thereto, and any appropriate material can be included.

[0497] As a specific example of the display device, for example, an EL display, a display device provided with a wavelength conversion material for a liquid crystal display can be given. Specifically, a display device in which the above-described cured film serving as a wavelength conversion layer is arranged between a blue light source (A) and a light guide plate in a manner along the end surface (side surface) of the light guide plate, a backlight (on-edge type backlight) that emits white light is formed, and a light absorbing layer is arranged on the light guide plate side; a display device in which the above-described cured film serving as a wavelength conversion layer is arranged on a light guide plate, a backlight (surface mounting type backlight) that emits light from a blue light source arranged on the end surface (side surface) of the light guide plate to the wavelength conversion layer through the light guide plate in the form of white light is formed, and a light absorbing layer is arranged on the wavelength conversion layer; a display device in which the above-described cured film is arranged near the light emitting portion of a blue light source as a wavelength conversion layer, a backlight (on-chip type backlight) that emits light in the form of white light is formed, and a light absorbing layer is arranged on the wavelength conversion layer; and the like can be given.

[0498] Embodiment

[0499] Hereinafter, the present application is described in more detail according to Examples. "%" and "parts" in the Examples are mass % and mass parts, unless otherwise specified.

[0500] Evaluation of Pattern Engraving Property of Film

[0501] The obtained pattern was observed using a microscope (magnification 1000 times; VHX-2000; Keyence Corporation) and evaluated for pattern engraving property according to the following evaluation criteria. The results are shown in Table 1.

[0502] A: The pattern was formed in a linear shape according to the mask

[0503] B: Other than A (there are sites where the interval is not properly formed, sites where the linear pattern is not properly formed or the linear pattern is collapsed, etc.)

[0504] Evaluation of Luminescence Intensity of Film

[0505] A light diffusion plate was disposed on a backlight in which a blue LED lamp with a peak wavelength of luminescence of 450 nm was used as a point light source to make a backlight portion. The light diffusion plate was placed on the backlight portion with the light diffusion plate facing upward, and a spectroradiometer ("SR-UL1R" manufactured by Topcon Corporation) was disposed at a position 60 cm above the surface of the light diffusion plate.

[0506] A substrate having a cured film made of the composition was disposed on the above-mentioned diffusion plate. The backlight was turned on in this state, and the luminescence intensity L of the cured film in terms of the cumulative radiant flux in the range of wavelengths of 480 nm to 780 nm was measured for the light emitted from the cured film. -1 m -2 ·nm -1 . The obtained luminescence intensity L was evaluated according to the following evaluation criteria.

[0507] S: 790 mW • sr -1 m -2 ·nm -1 and more than

[0508] A: 740 mW • sr -1 m -2 ·nm -1 and less than 790 mW • sr -1 m -2 ·nm -1

[0509] B: 700 mW • sr -1 m -2 ·nm -1 and less than 740 mW • sr -1 m -2 ·nm -1

[0510] <Weight average molecular weight (Mw) of resin>

[0511] The weight average molecular weight (Mw) of the resin (B-1) was measured by GPC method under the following conditions.

[0512] Apparatus: K2479 (manufactured by Shimadzu Corporation)

[0513] Column: SHIMADZU Shim-pack GPC-80M

[0514] Column temperature: 40°C

[0515] Solvent: Tetrahydrofuran

[0516] Flow rate: 1.0 mL / min

[0517] Detector: RI

[0518] Calibration standard substance: TSK STANDARD POLYSTYRENE F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation)

[0519] <Acid value of resin>

[0520] The acid value of the resin (B-1) solution was measured using an automatic titrator (manufactured by Hirahara Industrial Co., Ltd., trade name: COM-555) with 0.1 equivalent of an aqueous KOH solution as a titrant, based on 3 g of the resin (B-1) solution dissolved in a mixed solvent of 90 g of acetone and 10 g of water. The acid value per 1 g of solid content was calculated from the acid value of the solution and the solid content of the solution.

[0521] (Production Example 1: Preparation of dispersion of quantum dots (A-1))

[0522] A toluene dispersion of InP / ZnSeS quantum dots to which oleic acid was coordinated as an organic ligand (G-1) was prepared. The dispersion was distilled under reduced pressure to remove toluene. Cyclohexyl acetate was added at 70 parts with respect to 30 parts of the solid content, to obtain a dispersion of quantum dots (A-1) (30% of solid content).

[0523] (Production Example 2: Preparation of dispersion of light scattering agent (H-1))

[0524] To 70 parts of titanium oxide nanoparticles, 3 parts of DISPERBYK 21116 (manufactured by BYK-Chemie Japan) were added, based on a solid content. Propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA") was then added to bring the total to 100 parts. The mixture was then stirred with a paint shaker until fully dispersed, yielding a dispersion of the light scattering agent (H-1) (solid content 73%).

[0525] (Production Example 3: Preparation of Resin (B-1) Solution)

[0526] 110 parts of PGMEA were placed in a flask equipped with a stirrer, a reflux condenser with a thermometer, a dropping funnel, and a nitrogen inlet tube. The mixture was stirred while nitrogen substitution was performed and the temperature was raised to 80°C. 25 parts of dicyclopentanyl methacrylate, 23 parts of methyl methacrylate, 19 parts of methacrylic acid, and 10 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) were dissolved in 110 parts of PGMEA. The resulting solution was added dropwise to the flask from the dropping funnel and stirred at 80°C for 3 hours.

[0527] Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and 0.8 parts of triphenylphosphine were placed in a flask, heated to 110°C, and stirred for 8 hours to react the carboxylic acid in the polymer with the epoxy groups, introducing polymerizable unsaturated bonds. Subsequently, 17 parts of 1,2,3,6-tetrahydrophthalic anhydride was added and the reaction continued for 3 hours to introduce carboxylic acid groups into the side chains. The reaction solution was cooled to room temperature to obtain a resin (B-1) solution.

[0528] The weight average molecular weight of the resin (B-1) in terms of standard polystyrene was 8400, the acid value was 120 mgKOH / g, and the solid content in the resin (B-1) solution was 40% by mass.

[0529] <Examples 1 to 4, Comparative Examples 1 and 2>

[0530] The dispersion of quantum dots (A-1) obtained in Production Example 1, the dispersion of the light scattering agent (H-1) obtained in Production Example 2, the resin (B-1) solution obtained in Production Example 3, and other components shown in Table 1 were mixed in predetermined amounts to prepare a curable composition.

[0531] The contents of the various components in the curable composition, calculated from the added amounts, are shown in Table 1. In Table 1, the contents of the components other than the solvent (F) are expressed in parts by mass in terms of solid content. The contents of the solvent (F) are expressed in parts by mass.

[0532] For example, the quantum dots (A-1) are incorporated in the form of a dispersion liquid of the quantum dots (A-1) in the preparation of the curable composition, but the content shown in Table 1 is the amount of the quantum dots (A-1) themselves contained in the solution. The solvent (F) in Table 1 includes the solvent contained in the dispersion liquid, the solution used in the preparation of the curable composition.

[0533] [Table 1]

[0534]

[0535] Details of the abbreviations of the components shown in Table 1 are as follows.

[0536] Polymerizable compound (C-1): Aronix (registered trademark) M-510 (containing carboxyl group multifunctional (meth) acrylate, manufactured by Toagosei Co., Ltd., solid content 100%)

[0537] Polymerizable compound (C-2): A-9550 (dipentaerythritol polyacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., solid content 100%)

[0538] Polymerization initiator (D-1): a compound represented by the following formula (DA-1)

[0539] Polymerization initiator (D-2): Irgacure (registered trademark) OXE02 (manufactured by BASF Co., Ltd.), a compound represented by the following formula (DA-2)

[0540]

[0541] Antioxidant (E-1): Sumilizer-GP (phosphorus / phenol complex type antioxidant, manufactured by Sumitomo Chemical Co., Ltd., solid content 100%)

[0542] Solvent (F-1): a mixture of PGMEA (propylene glycol monomethyl ether acetate) and cyclohexyl acetate

[0543] Leveling agent (G-1): SH8400 (silicone-based leveling agent, manufactured by Toray Dow Corning Co., Ltd., solid content 100%)

[0544] Dispersant (I-1): DISPERBYK21116 (manufactured by BYK-Chemie Japan)

[0545] The composition was applied to a 5 cm square glass substrate (EAGLE 2000; manufactured by Corning Incorporated) in a manner such that the thickness of the composition after post-baking by the spin coating method was 8.0 μm, and then the composition layer was obtained by pre-baking in a clean oven at 100°C for 3 minutes. After cooling, the interval between the substrate on which the composition layer was formed and a photomask made of quartz glass was set to 150 μm, and light irradiation was performed in an atmospheric air atmosphere at an exposure amount (reference wavelength: 365 nm) of 200 mJ / cm2using an exposure machine (UPE-1255MA; manufactured by Bunkoshōsō Corporation). As the photomask, a photomask for forming a 1:1 line-and-space pattern of 20 μm was used. The composition layer after light irradiation was developed by immersion in an aqueous solution containing a nonionic surfactant at 0.14% and potassium hydroxide at 0.048% at 25°C for 20 seconds, and after water washing, a post-bake was performed in an oven at 180°C for 30 minutes, thereby obtaining a pattern composed of a cured film in which a line-and-space pattern of 20 μm in line width (each having 10 lines and 10 spaces) was formed. 2

[0546] The obtained cured film was subjected to the measurement and evaluation of the pattern delineation and the emission intensity in accordance with the above. The results are shown together in Table 1. Note that in Comparative Example 1 and Comparative Example 2, since an appropriate cured pattern was not obtained, the evaluation of the emission intensity was not performed.​

Claims

1. A curable composition comprising quantum dots (A), a polymerizable compound (C) and a polymerization initiator (D), The polymerization initiator (D) comprises a compound represented by formula (DA), Where, R d1 represents a branched hydrocarbon group having 3 to 20 carbon atoms which may have a substituent, R d2 ~R d5 each independently represents a hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, n represents any integer from 0 to 4, The -CH2- contained in the hydrocarbon group may be substituted with -O-, -S-, -CO- or -OCO-.

2. The curable composition according to claim 1, wherein The polymerizable compound (C) includes a compound (Ca) having three or more ethylenically unsaturated bonds in the molecule and having an acidic functional group.

3. The curable composition according to claim 1, wherein It further contains a resin (B).

4. The curable composition according to claim 3, wherein The acid value of the resin (B) is 30 mgKOH / g to 150 mgKOH / g based on the solid content.

5. The curable composition according to claim 3, wherein The content of the quantum dots (A) is 30% by mass to 150% by mass relative to the total amount of the resin (B) and the polymerizable compound (C).

6. The curable composition according to claim 1, wherein R d1 It is a branched saturated hydrocarbon group having 3 to 20 carbon atoms which may have a substituent.

7. The curable composition according to claim 1, wherein R d2 ~R d5 Each is independently a saturated hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, or an unsaturated hydrocarbon group having 2 to 20 carbon atoms which may have a substituent. 8 . A cured film formed from the curable composition according to claim 1 . 9 . A display device comprising the cured film according to claim 8 .

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