System and method for monitoring a battery in a user device

Abstract

Systems and methods for monitoring a battery in a user device are disclosed. In an example, a user device includes a mobile phone and a notebook computer. The system includes a micro-electro-mechanical system (MEMS) ultrasound source, a MEMS ultrasound sensor, a signal drive and acquisition module (SDM), and a processor. The MEMS source and the sensor are included within the user device and disposed against the battery. The SDM configures the MEMS source for transmitting ultrasonic pulses into the battery, and the MEMS sensor detects ultrasonic waves reflected by or transmitted through the battery. The SDM collects the detected pulses, and the processor analyzes the detected pulses to determine states of the battery, including state of health, state of charge, and instantaneous battery thickness measurements. For example, the SDM and the processor may be included within a user device, and / or the SDM and the signal processor may be incorporated into an integrated circuit.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 437,350, entitled “Systems and Methods for Monitoring Batteries in User Devices” and filed on January 5, 2023, which is incorporated by reference herein in its entirety for all that it contains in accordance with 35 U.S.C. § 119(e) and which is a non-provisional of, and claims priority to, the U.S. Provisional Application, and the entire contents of which are hereby incorporated by reference. TECHNICAL FIELD

[0003] The present disclosure relates generally to non-invasive monitoring of energy storage devices installed in user devices, and more particularly, to monitoring of electrolyte-type batteries (e.g., lithium-ion batteries) installed or installable in user devices such as, but not limited to, notebook computers, smartphones, and tablets. BACKGROUND

[0004] User devices are increasingly equipped with powerful electrolyte-type rechargeable batteries, e.g., lithium-ion batteries. These batteries are durable and can withstand hundreds of charge-discharge cycles. However, these batteries are also typically installed by the manufacturer of the user device and are not accessible to the user.

[0005] User devices that include rechargeable batteries are limited in their ability to monitor and detect battery problems and take action in response to detected problems. Generally, for this purpose, existing battery monitoring systems included within or in communication with user devices rely on periodic voltage and / or current measurements of the battery. While existing monitoring systems can be able to determine and alert the user if the battery capacity has fallen below a recommended operating threshold (e.g., 80% of original capacity), these systems are generally unable to detect battery failure and provide early warning of failure.

[0006] Furthermore, while battery temperature increases can be an early indicator of battery failure, most user devices only include temperature sensors on their central processing units (CPUs) and / or hard drives, and not on their batteries. When the temperature of a user device exceeds a threshold, the user device can send an alert message to the user, but the user must take action by shutting down the system, and the user does not receive an indication that the temperature increase can be due to a battery failure. This can be particularly dangerous because once rechargeable batteries begin to fail, they can rapidly deteriorate to a catastrophic failure state within a few minutes (e.g., 10 to 15 minutes). In this catastrophic failure state, the electrolyte of the battery can breach the battery casing or protective packaging, resulting in a fire and other damage within the user device.

[0007] Embodiments of the subject disclosure can address one or more of the above problems and disadvantages, among others. SUMMARY

[0008] Embodiments of the subject disclosure provide systems, methods, and devices for continuously (or semi-continuously) monitoring a battery in a user device. Some embodiments can check and predict battery performance, can detect and predict early signs of battery failure, can alert one or more users about performance or failure issues, and / or can provide early indications of failure to one or more users. In this way, embodiments of the subject disclosure can protect users from harm and / or protect user devices from damage (or at least from catastrophic or irreversible damage).

[0009] In some embodiments, the instantaneous state of a battery under test can be determined by ultrasonic interrogation. The battery can be installed in a user device (e.g., a mobile phone or smartphone, a notebook computer, an e-reader, a computer workstation, a game console, a tablet computer, etc.). The state of the battery can be based on ultrasonic signals emitted by the system at one or more spatially separated locations of the battery and subsequently collected by the system. The system analyzes the collected signals to obtain the state of the battery. In some embodiments, at least one microelectromechanical system (MEMS) ultrasonic source and at least one MEMS ultrasonic sensor can be included within the user device. In some embodiments, one, more, or all of the at least one MEMS ultrasonic source and the MEMS ultrasonic sensor can be disposed against the battery.

[0010] In some embodiments, in one mode of operation of the system (also referred to as "echo mode"), the MEMS ultrasonic source and the MEMS ultrasonic sensor can be included in a single transducer device that is disposed against the same surface of the battery. The MEMS ultrasonic sensor can be configured to transmit ultrasonic pulses into the battery, and the MEMS ultrasonic sensor can be configured to detect ultrasonic pulses reflected from the interior of the battery. In another mode of operation of the system (also referred to as "penetration mode"), in some embodiments, at least one MEMS ultrasonic source and at least one MEMS ultrasonic sensor can be disposed against opposite surfaces of the battery. Here, the MEMS ultrasonic sensor can detect ultrasonic pulses transmitted by the MEMS ultrasonic source through the battery. Regardless of whether the system is configured in echo mode or penetration mode, the system can collect the detected ultrasonic pulses, and can analyze the detected pulses and information extracted or otherwise computed from the pulses to determine a state of the battery.

[0011] In some embodiments, for example, in addition to the MEMS ultrasonic source and the MEMS ultrasonic sensor, the system can include several components. These components can include, but are not limited to, a signal drive and acquisition module (SDM) and a processor (also referred to as a signal processor). In some embodiments, the SDM can include a controller, a memory, an excitation module, and a receiver module.

[0012] In some embodiments, the system can operate as follows. The excitation module can be configured by the controller to transmit an excitation signal to the MEMS ultrasonic source, and the MEMS ultrasonic source can transmit an ultrasonic pulse into the battery in response to the excitation signal. The MEMS ultrasonic sensor can be configured by the controller to detect the ultrasonic pulse from the battery, and to generate a response signal associated with the detected ultrasonic. The receiver module can receive the generated response signal from the MEMS ultrasonic sensor. The signal processor can access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis. The different states of the battery can include, for example, a state of health (SOH) of the battery, a state of charge (SOC) of the battery, a temperature of the battery, an instantaneous thickness of the battery, and a thickness of the battery determined over time (e.g., a life thickness).

[0013] In some embodiments, for example, the system (or one or more components thereof) can be incorporated into the user device upon manufacturing of the user device and / or upon manufacturing of the battery. In some embodiments, the SDM and the signal processor, and the MEMS ultrasonic source and the MEMS ultrasonic sensor, can be included within the user device. For example, the SDM and the signal processor can be incorporated into the same integrated circuit (e.g., an application specific integrated circuit (ASIC)) or combination of discrete electronic components.

[0014] In some embodiments, the system can include a battery management system (BMS). Alternatively, the system can be in communication with a BMS. In some embodiments, when the system identifies or predicts a performance and / or failure of a battery, the system can be configured to send an alert message to the BMS. In some embodiments, in response to receiving the message, the BMS can be configured to send one or more signals to a user device or components thereof, for example, as a safety precaution, to shut off power to the user device and / or to disable charging of the battery.

[0015] In one or more embodiments, a system can monitor a battery within a user device. To do so, the system can include a MEMS ultrasonic source and a MEMS ultrasonic sensor, an SDM, and a processor. The MEMS ultrasonic source and sensor can each be included within the user device and can be disposed against the battery. The SDM can include a controller, a memory, an excitation module, and a receiver module.

[0016] In some embodiments, the excitation module can be configured (e.g., by the controller) to emit an excitation signal to the MEMS ultrasonic source. In response to the excitation signal, the MEMS ultrasonic source can be configured to emit an ultrasonic pulse into the battery. The MEMS ultrasonic sensor can be configured (e.g., by the controller) to detect the ultrasonic pulse from the battery and to generate a response signal associated with the detected ultrasonic wave, which can be received by the receiver module. The processor can be configured to access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis.

[0017] In some embodiments, the MEMS ultrasonic source and the MEMS ultrasonic sensor can be disposed against the same surface of the battery, and the MEMS ultrasonic sensor detects the ultrasonic pulse reflected from the interior of the battery. Alternatively or additionally, in some embodiments, the MEMS ultrasonic source can be disposed against a first surface of the battery, the MEMS ultrasonic sensor can be disposed against a second surface of the battery opposite the first surface, and the MEMS ultrasonic sensor detects the ultrasonic wave transmitted through the battery. In some embodiments, one or both of the MEMS ultrasonic source and the MEMS ultrasonic sensor can be a capacitive micromachined ultrasonic transducer (CMUT) or a piezoelectric micromachined ultrasonic transducer (PMUT).

[0018] In some embodiments, the SDM and the processor can be included within the user device. For example, the SDM and the processor can be incorporated into the same integrated circuit.

[0019] In some embodiments, the states determined by the system can include a state of charge (SOC), a state of health (SOH), and a temperature of the battery. In some embodiments, the states can also include, but are not limited to, a momentary thickness measurement of the battery and a lifetime thickness measurement of the battery. For example, the lifetime thickness measurement can be determined from one or more momentary thickness measurements of the battery obtained over time and stored in the memory. In some embodiments, these states can be determined when the battery is empty or when the battery is fully charged. Alternatively or additionally, in some embodiments, these states can be determined while the battery is being charged or discharged.

[0020] In some embodiments, the memory can include a set of feature rules, for example, the set of feature rules define one or more features extracted from the response signal by the processor during analysis of the response signal.

[0021] In one or more embodiments, a method for monitoring a battery within a user device can include transmitting an excitation signal to a MEMS ultrasonic source such that the MEMS ultrasonic source transmits an ultrasonic pulse into the battery in response to the excitation signal. The method can also include detecting the ultrasonic pulse from the battery via a MEMS ultrasonic sensor and generating a response signal associated with the detected ultrasonic wave. The method can also include receiving the response signal from the MEMS ultrasonic sensor and analyzing the response signal. The method can also include determining different states of the battery in response to the analysis. In some embodiments, the method can also include positioning the MEMS ultrasonic source and the MEMS ultrasonic sensor against the battery, wherein the battery is included in the user device.

[0022] Any of the various innovations of the present disclosure can be used alone or in combination with one another. This summary is provided to introduce a selection of some concepts of the disclosure in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. The foregoing and other objects, features, and advantages of the disclosed technology will become more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0023] Embodiments will be described below with reference to the accompanying drawings, which are not necessarily drawn to scale. In some instances, certain elements can be omitted or simplified in favor of illustrating basic underlying principles. Identical reference numbers in the figures indicate identical elements, where applicable.

[0024] Figure 1is a schematic diagram of an in-situ battery evaluation and monitoring system according to one or more embodiments of the disclosed subject matter, wherein the system is configured to evaluate one or more states of a battery included within a user device using a MEMS ultrasonic source and sensor operating in a through-transmission mode, and wherein the system as a whole is included within the user device.

[0025] Figure 2 is a schematic diagram of a system similar to Figure 1 according to one or more embodiments of the disclosed subject matter, wherein the system is modified to be configured to use a MEMS ultrasonic transducer operating in an echo mode.

[0026] Figure 3 is a schematic diagram of a system similar to Figure 2 according to one or more embodiments of the disclosed subject matter, wherein some components of the system are positioned on the outside of a user device.

[0027] Figure 4 , Figure 5 and Figure 6 are schematic diagrams showing further details of a system similar to Figure 2 according to one or more embodiments of the disclosed subject matter, wherein the views show a single ultrasonic transducer positioned against a single battery, multiple batteries with a single ultrasonic transducer positioned against each battery, and a single battery with an array of ultrasonic transducers positioned against the battery, respectively.

[0028] Figure 7 is an image of a semiconductor wafer including thousands of individual “chips” each incorporating almost all of the components of the system in Figure 4 .

[0029] Figure 8 is an image showing individual MEMS transducer elements in the left portion of the image and exemplary groupings of individual MEMS transducer elements connected in a grid-like fashion in the right portion of the image.

[0030] Figure 9 is a schematic diagram showing the arrangement of semiconductor layers of a piezoelectric micro-machined ultrasonic transducer (PMUT) and a MEMS transducer.

[0031] Figure 10 is an image of a semiconductor wafer including more than one hundred capacitive micro-machined ultrasonic transducers (CMUTs).

[0032] Figure 11 is a flowchart describing a method of operation of an in-situ battery evaluation and monitoring system installed in a user device according to one or more embodiments of the disclosed subject matter.

[0033] Figure 12 is a block diagram of a computing environment in which the innovations described can be implemented. DETAILED DESCRIPTION

[0034] General

[0035] For purposes of this summary, certain aspects, advantages and novel features of the embodiments of the disclosure are described herein. The disclosed methods and systems should not be construed as limiting in any manner. Instead, the present disclosure is directed to all novel and non-obvious features and aspects of the various disclosed embodiments, both singly and in various combinations and sub-combinations with one another. The methods and systems are not limited to any particular aspect or feature or combination of features, nor do the disclosed embodiments require the presence of any one or more of a particular advantage or solve a problem. Techniques from any embodiment or example can be combined with techniques described in any one or more of the other embodiments or examples. In view of the many possible embodiments to which the principles of the disclosed technology can be applied, it should be recognized that the embodiments are only exemplary and should not be considered as limiting the scope of the disclosed technology.

[0036] Although the operations of some of the disclosed methods are described in a particular, sequential order for convenience, it should be understood that this manner of description encompasses rearrangement, unless a particular ordering is required by specific language set forth below. For example, operations described sequentially can in some cases be rearranged or performed concurrently. Moreover, for the sake of simplicity, the attached figures can not show the various ways in which the disclosed methods can be used in conjunction with other methods. Additionally, the description sometimes uses terms like “provide” or “achieve” to describe the disclosed methods. These terms are high-level abstractions of the actual operations that are performed. The actual operations that correspond to these terms can vary depending on the particular implementation and are readily discernible by one of ordinary skill in the art.

[0037] Unless otherwise indicated, the disclosure of a range of values is to be understood as a disclosure of each individual point within the range, including the end points. Unless otherwise indicated, all numbers expressing quantities of components, molecular weights, percentages, temperatures, time, and so forth, as used in the specification and claims are to be understood as being modified in all instances by the term "about." Accordingly, unless otherwise indicated, the numerical parameters are approximations and can vary depending upon the desired properties sought to be obtained by those skilled in the art utilizing, as the level of precision, their knowledge of the standard deviation of the type of measurement they are employing, or by interchanging "about" with "at." When directly and explicitly distinguished from the prior art, the numerical embodiments are not approximations, unless the words "about," "approximately," "roughly," or the like have been explicitly recited. Whenever "about," "approximately," "roughly," or the like are expressly recited, the term "about" or its like merely indicates that the value of a numerical parameter is intended to vary usually up to 10% of the stated value, unless otherwise indicated.

[0038] Directions and other related references can be used to facilitate discussion of the drawings and principles herein, but are not intended to be limiting. For example, certain terminology can be used, such as "inner," "outer," "upper," "lower," "top," "bottom," "interior," "exterior," "left," "right," "front," "back," "rear," etc. These terms are used for purposes of clarity only and are not meant to be limiting. For example, when relative positions are handled, particularly with respect to the illustrated embodiments, these terms are used to provide some clarity of description, where applicable. However, these terms do not imply absolute relationships, positions, and / or orientations. For example, with respect to an object, an "upper" portion can become a "lower" portion simply by turning the object over. Nonetheless, it remains the same portion, and the object remains the same.

[0039] As used herein, "including," "includes" or "comprising," "comprises" means "including, but not limited to," "including, but not limited to," or "comprising, but not limited to," and use of these terms are meant to encompass the items listed thereafter and equivalents thereof as well as additional items not specifically listed. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be understood by those within the art that, in general, terms used herein, and especially

[0040] While alternatives to the various components, parameters, operating conditions, etc. set forth herein are contemplated, this does not mean that those alternatives are necessarily equivalent and / or perform as well. Unless otherwise indicated, it also does not mean that alternatives are listed in order of priority. Unless otherwise indicated, any one of the groups defined below can be substituted or unsubstituted.

[0041] Unless otherwise indicated, all technical and scientific terms used herein have the same meaning as those commonly understood by one of ordinary skill in the art to which this disclosure belongs. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present disclosure, suitable methods and materials are described below. The materials, methods, and examples are illustrative only and not intended to be limiting. The features of the presently disclosed subject matter will become more fully apparent from the following detailed description and the appended claims.

[0042] Overview of Terms

[0043] The following is intended to provide an overview of various aspects of the subject matter of this disclosure and is not intended to be exhaustive or to limit the subject matter of this disclosure to the particular features described. Accordingly, the subject matter of this disclosure is not limited to the specific features described below.

[0044] Terms Definitions FFT Fast Fourier Transform IFFT Inverse Fast Fourier Transform PMUT Piezoelectric Micromachined Ultrasonic Transducer CMUT Capacitive Micromachined Ultrasonic Transducer MEMS Micro-Electro-Mechanical System ASIC Application-Specific Integrated Circuit

[0045] List of Reference Numerals

[0046] The following reference characters are used in the patent specification and drawings, unless otherwise specifically indicated:

[0047]

[0048]

[0049] Introduction

[0050] Embodiments of the subject matter of this disclosure will now be described, by way of example, with reference to the accompanying drawings, in which:

[0051] Lithium-ion batteries typically include one or more battery cells immersed in an electrolyte. These battery cells can be arranged in layers inside the battery. For example, in a prismatic battery, the layers are arranged horizontally along the length of the battery. Each battery cell includes the following layers / components: a positive electrode (positive), a separator, and a negative electrode (negative). The separator is formed of an electrically insulating material. An additional battery cell separator is added between each adjacent battery cell.

[0052] Ultrasonic "penetrating" mode

[0053] Figure 1is a schematic diagram of a battery monitoring system 1000 configured for ultrasonic interrogation of a test battery 1035 using a through-transmission method. The battery 1035 is installed in a user device 200, and the entire system 1000 is included in the user device 200. The system 1000 can also include a battery management system (BMS) 1199. In the illustrated example, the battery 1035 is a rectangular element having a first surface 1040 and an opposing second surface 1045 separated by a thickness dimension 1042. The surfaces 1040, 1045 are generally planar and parallel to each other, and extend along a length 1060 of the battery 1035. The thickness dimension 1042 is generally perpendicular to the length 1060. Other battery shapes and configurations can be interrogated by through-transmission ultrasound without departing from the concepts of the present disclosure.

[0054] The system 1000 includes various components. These components include one or more MEMS ultrasonic sources and one or more MEMS ultrasonic sensors. Three MEMS ultrasonic sources 1005, 1010, 1015 and three MEMS ultrasonic sensors 1030, 1025, 1020 are shown in the diagram. However, any number of sources and / or sensors can be used in accordance with one or more contemplated embodiments. The system 1000 also includes a signal drive and collection module (SDM) 1090, a signal processor 1110, a power sensor 1145, and a temperature sensor 1135.

[0055] The SDM 1090 includes a controller 1070, a memory module 1080, and a communication interface 1085, an excitation module 1100, an ultrasonic receiver module 1105, and a controller interface 1095. The memory module 1080 interfaces with the controller 1070, the communication interface 1085, and the controller interface 1095. The memory module 1080 includes various rules and instructions that the signal processor 1110 loads and executes, such as a set of feature rules 1081 and a set of action rules 1082. In an example, the controller 1070 can be a processor or microcontroller. The controller 1070 can also include multiple digital data processors and memory interfaced therewith.

[0056] The components of system 1000 are arranged as follows. Each MEMS ultrasonic source 1005, 1010, 1015 is disposed against a first surface 1040 of battery 1035 and is configured by SDM 1090 to emit ultrasonic waves toward and through first surface 1040. Each ultrasonic sensor 1020, 1025, 1030 is disposed against a second surface 1045 of battery 1035 and is configured by SDM 1090 to sense / detect ultrasonic waves emitted from battery 1035 through second surface 1045. In the illustrated example, power sensor 1145 and temperature sensor 1135 are each disposed against second surface 1045 of battery 1035.

[0057] In some embodiments, the MEMS ultrasonic sources and MEMS ultrasonic sensors are acoustically coupled to the corresponding surfaces of battery 1035 by a couplant material 1050. Couplant 1050 is disposed between the surface of the battery and the surface of the corresponding ultrasonic source or sensor. In the illustrated example, a separate instance of couplant 1050 is positioned between each MEMS ultrasonic source 1005, 1010, 1015 and first surface 1040 of battery 1035. Alternatively or additionally, in some embodiments, a separate instance of couplant 1050 is positioned between each MEMS ultrasonic sensor 1030, 1025, 1020 and second surface 1045 of battery 1035. The couplant material is selected to aim to reduce acoustic impedance, e.g., by eliminating air between the corresponding surface of the battery and the surface of the ultrasonic sources and sensors. The acoustically couplant material can comprise a liquid, gel, or solid material. In some examples, the couplant material can be adhered to battery 1035 via an adhesive, or bonded directly to the battery, e.g., to ensure that it is placed permanently on the battery.

[0058] The MEMS ultrasonic sources and sensors can be capacitive micro-machined ultrasonic transducers (CMUTs) or piezoelectric micro-machined ultrasonic transducers (PMUTs). In some embodiments, all of the MEMS ultrasonic sources and sensors are CMUTs or PMUTs. Both of these MEMS devices are typically based on silicon and manufactured using established integrated circuit mass production processes commonly used in the semiconductor industry. MEMS devices manufactured in this way are small in volume, thin in thickness (e.g., < 0.5 mm), and the mass production processes enable very low cost devices.

[0059] In some embodiments, for example, when the MEMS ultrasonic source 1005 is paired with the MEMS ultrasonic sensor 1030 along a common transmission axis 1055, each ultrasonic source is paired with a corresponding ultrasonic sensor. In the example shown, three MEMS ultrasonic sources 1005, 1010, 1015 are paired with different MEMS ultrasonic sensors 1030, 1025, 1020, respectively, so that each paired ultrasonic source and ultrasonic sensor is configured to interrogate a different area of ​​the interior of the battery 1035. The penetration method configuration may include one or more ultrasonic sources configured to direct ultrasonic waves into the battery along the transmission axis 1055. The ultrasonic source may be configured to direct ultrasonic waves through any surface of the battery to the ultrasonic sensor to which it is paired, and may be configured to receive ultrasonic waves emitted from the battery through any other surface of the battery when the ultrasonic sensor and the ultrasonic source are coaxially arranged along the transmission axis 1055. Therefore, ultrasonic interrogation of the battery 1035 by the penetration method involves passing through the thickness of the battery (e.g., Figure 1 The ultrasonic waves received along the transmission axis 1055 are then detected.

[0060] In such Figure 1 In the case of the illustrated prismatic battery, the ultrasonic axis 1055 is generally perpendicular to the surfaces 1040, 1045 of the battery 1035. Because the cells within the battery 1035 are "stacked" on top of each other along their length 1060, the planes of the cells are also generally perpendicular to the ultrasonic axis 1055. Thus, the thickness 1042 of the battery 1035 is at least the sum of the thicknesses of its individual cells.

[0061] The signal processor 1110 communicates with the SDM 1090 through a communication channel 1130. The communication channel 1130 is established between the signal processor 1110 and the communication interface 1085 of the SDM 1090. The controller 1070 communicates with the excitation module 1100 and the receiver module 1105 via an internal communication channel 1115 established between the controller 1070 and the controller interface 1095.

[0062] The excitation module 1100 is connected to the MEMS ultrasonic sources 1005, 1010, and 1015 via a power channel 1120. The power channel 1120 supports a communication protocol that enables the excitation module 1100 to transmit an excitation signal to one or more MEMS ultrasonic sources at a time. The receiver module 1105 is connected to the MEMS ultrasonic sensors 1030, 1025, and 1020 via a signal channel 1125. The signal channel 1125 also supports a communication protocol that enables the receiver module 1105 to receive a response signal from one or more MEMS ultrasonic sensors at a time. In some embodiments, for example, the communication protocol can also support metadata so that the response signal can identify which of the one or more MEMS ultrasonic sensors sent the response signal.

[0063] The power sensor 1145 is connected to the communication interface 1085 via a power signal channel 1150, while the temperature sensor 1135 (e.g., a thermistor) is connected to the communication interface via a temperature signal channel 1140.

[0064] The BMS 1199 communicates with other components of the system 1000 via the communication interface 1085. In the example shown, the BMS 1199 is included within the user device 200 and receives voltage measurements, temperature measurements, and current measurements from the temperature sensor 1135 and the power sensor 1145 via the communication interface 1085. In examples, the BMS 1199 can also receive other signals sent from the controller 1070 and / or the signal processor 1110, such as a shutdown signal and a signal to activate a cooling fan within the user device 200. Additionally or alternatively, the BMS 1199 can be positioned outside / external to the user device 200 and receive time-stamped temperature measurements, current measurements, and voltage measurements or other signal information for each battery 1035 via the communication interface 1085 or other interfaces, connectors, etc.

[0065] The system 1000 can optionally include other sensors configured to measure one or more characteristics of the batteries while the batteries are being interrogated by the ultrasonic waves (or before, after, or between ultrasonic interrogations), such as power storage characteristics, mechanical deformation characteristics, internal pressure characteristics, or other transient physical, electrical, or optical characteristics of the batteries 1035. In examples, the various signal communication channels can be configured as wired communication channels, wireless communication channels, digital or analog communication channels, or optical communication channels.

[0066] In some embodiments, the system 1000 can operate as follows. Upon system startup, the signal processor 1110 loads various information stored in the memory module 1080 for configuration and operation of the system 1000. In an example, the information includes the operating mode of the SDM 1090, processing instructions and algorithms, and a set of feature rules 1081 and a set of action rules 1082. The excitation module 1100 and the receiver module 1105 are operated in accordance with one or more operating modes stored in the memory module 1080 and executed by the controller 1070.

[0067] In the penetration operating mode, as shown, the SDM 1090 is configured by the controller 1070 to generate and deliver electrical excitation signals to each MEMS ultrasonic source through the power channel 1120. In more detail, each MEMS ultrasonic source 1005, 1010, and 1015 is configured to generate ultrasonic waves in response to electrical excitation signals received thereby from the excitation module 1100 through the power channel 1120. The generated ultrasonic waves emitted from each ultrasonic source are directed along a corresponding transmission axis 1055 toward and through the battery. The transmission axes 1055 in the present example are perpendicular to each of the first surface 1040 and the second surface 1045.

[0068] Each MEMS ultrasonic sensor 1030, 1025, and 1020, in turn, is configured to sense ultrasonic waves that pass through the second surface 1045 along the transmission axis 1055 and generate a response signal corresponding to the sensed ultrasonic waves. The response signal corresponding to each ultrasonic sensor is transmitted to the receiver module 1105 through the signal channel 1125. The response signal corresponding to each MEMS ultrasonic sensor can be represented by an A-scan that includes a sensed ultrasonic wave amplitude versus time of flight, where the time of flight is a measure of the time interval between the ultrasonic wave emitted from the ultrasonic source and sensed by the ultrasonic sensor.

[0069] The generated ultrasonic waves emitted from each ultrasonic source produce longitudinal wave oscillations that propagate through the battery along the corresponding transmission axis 1055. The longitudinal wave oscillations propagate energy and waveforms into the battery along the transmission axis. As the energy and waveforms pass through the outer surface of the battery 1035, a portion of the energy and waveforms are emitted from the battery 1035. In some embodiments, each MEMS ultrasonic source is positioned opposite and / or paired with an associated MEMS ultrasonic sensor in the case where the system 1000 is configured in the penetration mode.

[0070] The ultrasonic waveform frequencies used by the system 1000 for non-destructive testing can be in the range between 20 kHz and 15 MHz, with the selection of the ultrasonic interrogation frequency for each testing device depending on the material and size of the battery 1035. Low frequency ultrasonic waves penetrate deeper into the battery than high frequency ultrasonic waves. Thus, low frequency ultrasonic waves can be desirable for interrogating batteries having a long transmission axis 1055. High frequency ultrasonic waves provide higher resolution, which enables the detection of smaller defects or enables the detection of more information about the internal features of the battery. However, high frequency ultrasonic waves generally carry less energy and, once emitted into the battery 1035, the ultrasonic wave signal attenuates more quickly than a low frequency ultrasonic signal. One manifestation of this is that the signal amplitude is lower.

[0071] The characteristics of the ultrasonic waveforms generated by the ultrasonic source depend on the characteristics of the electrical excitation signal, the characteristics of the ultrasonic transmitter, and environmental characteristics (e.g., temperature). The ultrasonic waveforms can be tailored to suit the testing device / battery 1035. For example, in some embodiments, the frequency of the ultrasonic wave is selected to excite / interrogate the battery at its resonant frequency. When the battery 1035 is excited at its resonant frequency, the ultrasonic input energy efficiently propagates through the structures within the battery, is absorbed by the structures within the battery, and is re-emitted to the ultrasonic sensor. Thus, the ultrasonic sensor receives re-emitted ultrasonic energy, which generally has a higher ultrasonic energy amplitude than would be received if the ultrasonic frequency did not match the resonant frequency of the battery.

[0072] The battery 1035 can have multiple resonant frequencies. Thus, multiple ultrasonic frequencies can be selected to resonate the battery, to absorb ultrasonic energy and re-emit ultrasonic energy for detection by the ultrasonic sensor. In non-limiting example embodiments, the wavelength of the ultrasonic wave is less than the thickness dimension 1042 of the battery. Further, near field boundaries of the Fresnel zone and the Fraunhofer zone of the separate ultrasonic waves occur within the battery 1035.

[0073] It is also important to note that it is not an absolute requirement that the battery 1035 be excited using ultrasonic waves at the resonant frequency of the battery. While exciting a material (e.g., a battery) at the resonant frequency improves the efficiency of the acoustic re-radiation, exciting the battery at the resonant frequency is not a limiting condition for material interrogation using ultrasonic waves. In one example, an ultrasonic transducer placed at a particular location of the battery (e.g., near its edge) can not be configured to emit ultrasonic waves at a frequency equal to or near the resonant frequency of the battery. This is because, at least in the frequency domain, the behavior of ultrasonic waves at frequencies equal to or near the resonant frequency of the battery can not be representative of the entire battery at these locations. As a result, a backscatter mode or a through-transmission mode ultrasonic pulse directed at these locations can be emitted at a frequency different from the resonant frequency of the battery and can be attenuated, in part or in whole, to near the noise floor.

[0074] The signal processor 1110 evaluates differences in characteristics of the ultrasonic waves transmitted by each MEMS ultrasonic source into the battery 1035 and characteristics of the ultrasonic waves sensed by each ultrasonic sensor. In an example, the signal processor 1110 can use the differences in characteristics to determine a state of the battery 1035 as a whole and / or determine changes in battery states of different regions within the battery 1035.

[0075] The SDM 1090 and the controller 1070 then receive a response signal from each of the MEMS ultrasonic sensors 1030, 1025, 1020 over the signal channel 1125. Each response signal is responsive to ultrasonic waves sensed by at least one ultrasonic sensor, where the sensed ultrasonic waves were transmitted into the battery 1035 by at least one ultrasonic source.

[0076] The signal processor 1110 is configured to analyze the response signals received by the receiver module 1105 in conjunction with temperature signals received from the temperature sensor 1135 at the communication interface 1085 and current and voltage signals received from the power sensor 1145.

[0077] The signal processor 1110 analyzes the response signals in a manner that characterizes the battery 1035 in different states, e.g., to identify defects, characterize homogeneity, monitor physical, electrical, or compositional changes in the battery, etc. The analysis of the response signals by the signal processor 1110 can include analyzing the response signals in different domains (e.g., time domain, frequency domain, spatial domain, etc.). The analysis of the response signals by the signal processor 1110 can also include identifying features of the response signals and comparing the identified features of the response data to feature templates stored within the memory module 1080 to determine characteristics of the battery 1035 based on the feature matching.

[0078] In some embodiments, during operation of the system 1000, the SDM 1090 can be configured to operate in a “round robin” manner when transmitting signals to and receiving signals from the MEMS ultrasonic sources and sensors, respectively. The power channel 1120 can support a communication protocol that enables the excitation module 1100 to address the MEMS ultrasonic sources, and the signal channel 1125 can support a communication protocol that enables communication between the MEMS ultrasonic sensors and the receiver module 1105. For example, the excitation module 1100 can be instructed by the controller 1070 to transmit an excitation signal to a first MEMS ultrasonic source over the power channel 1120. The SDM 1090 waits to receive a response signal from a MEMS ultrasonic sensor paired with the first MEMS ultrasonic source before the SDM transmits an excitation signal to the next MEMS ultrasonic source over the power channel 1120.

[0079] The SDM 1090 stores the response signals from each of the MEMS ultrasonic sensors into a buffer. After the SDM 1090 receives the response signals from all of the MEMS ultrasonic sensors, the SDM 1090 sends a "ready" signal to the signal processor 1110 to access and analyze the response signals in the buffer. In some embodiments, the SDM 1090 can send the ready signal to the signal processor to access and analyze the response signals in the buffer in conjunction with temperature signals as well as current and voltage signals.

[0080] The signal processor 1110 determines different states 1480 of the battery 1035 based on the response signals / in response to the analysis of the response signals, and the SDM 1090 provides the states 1480 as outputs of the system 1000. These states 1480 can include: a momentary thickness measurement 1481 of the battery; a battery life thickness measurement 1482; a battery temperature 1483; a battery state of charge (SOC) 1484; and a battery state of health (SOH) 1485. In one example, the battery life thickness measurement 1482 is determined by taking an average of the momentary thickness measurements 1481 obtained over time, and storing it over time to the memory module 1080.

[0081] This set of feature rules 1081 defines one or more features that the signal processor 1110 is to extract and analyze from the response signals during the analysis of the response signals. This set of action rules 1082 can include logic (e.g., business logic), for example, to determine whether the states 1480 are within a safe / normal range compared to stored states of a reference battery of the same type as the test battery 1035. The signal processor 1110 can also create and send alert messages based on the analysis of the response signals, for example, when this set of action rules 1082 indicates that one or more of the output states 1480 and / or information inferred from the states 1480, alone and / or in combination, are not within a safe / normal range and threshold.

[0082] In some embodiments, the system 1000 can receive its power from the user device 200. In some embodiments, while the system 1000 can have low power consumption, the system 1000 can only operate when the battery 1035 of the user device 200 is charging. In some embodiments, the system 1000 can be designed to operate independently of the processing and memory resources of the user device 200.

[0083] Via the communication interface 1085, the BMS 1199 can also receive one or more of the output states 1480 from the SDM 1090. In one example, in response to receiving one or more of the output states 1480, the BMS 1199 can send a signal or message to the controller 1070 via the communication interface 1085, instructing the controller 1070 to disable and / or stop charging the battery 1035. Alternatively or additionally, based on the states 1480 or information that the signal processor 1110 can determine from these states, the signal processor 1110 can prepare a message predicting a shorter battery life than expected. The signal processor 1110 can send this information to the BMS 1199, and in response, the BMS 1199 can adjust the charging parameters (e.g., reduce the current applied to the battery during charging), for example, to extend the battery life.

[0084] Using this set of action rules 1082, the signal processor 1110 can also create an alert message based on the output states 1480. The alert message can use a standard communication protocol (e.g., an internet-based protocol, a cellular-based message, such as a short message service (SMS) and a multimedia message service (MMS)), or a proprietary protocol. In another example, the alert message can be in the form of a pre-coded number / message code associated with different types of specific warnings and faults that can be signaled without the need for communication software and protocol stacks. The BMS 1199 and user devices of the operator of the system 1000 can be configured as the recipients / destination addresses of the alert message.

[0085] Batteries (e.g., lithium-ion batteries) swell over time for various reasons and have different types of swell. These types include normal reversible swell, normal irreversible swell, and abnormal irreversible swell. The system 1400 (and other embodiments of systems in this disclosure) uses ultrasound to detect different types of battery swell and then provides a measure or degree of the swell as an output / state of the battery. In examples, these swell states include an instantaneous thickness measure 1481 and a battery life thickness measure 1482.

[0086] For example, a new battery that has never been charged has an initial and roughly uniform thickness and swells (changes its thickness) when charged. During charging, the chemical reactions within the battery change its density, stiffness, and generate heat, causing the battery thickness to increase. The chemical reactions that occur during charging also change the speed of sound of the battery, a derivative property. Once discharged, the battery substantially returns to its initial thickness. This type of battery swell is referred to as normal reversible swell.

[0087] During the life of a battery, materials inside the battery can decompose and accumulate within the battery, which also causes the battery to swell. This type of battery swelling is referred to as normal, irreversible swelling. The decomposed materials include a portion of the battery terminals and a portion of the solid electrolyte interface (SEI). The materials accumulate within the electrolyte of the lithium-ion battery. Over time, the net effect of this material accumulation is to increase the thickness of the battery and to decrease the charge capacity of the battery. While this swelling is irreversible, it is normal as the battery ages and / or the number of charge / discharge cycles increases.

[0088] The battery can also experience abnormal swelling. The abnormal swelling type occurs when over-heating and / or gas accumulation occurs inside the battery. In an example, causes include manufacturing defects, battery damage, or the number of charge / discharge cycles exceeding a threshold, among others. This abnormal swelling is an early indicator that the battery is experiencing catastrophic, irreversible failure, which can result in material damage to the user device 200, release of harmful chemicals, and / or fire. This abnormal swelling should generally be avoided.

[0089] In some embodiments, this set of action rules 1082 can also define absolute and relative thresholds (or threshold ranges) for each state 1480. These thresholds have been obtained through experimentation using a plurality of batteries of the same type as each battery 1035 in the user device 200. In one example, an absolute threshold for the instantaneous battery thickness measurement 1481 can be a thickness measurement associated with a battery exhibiting normal, irreversible swelling. However, the value is large enough such that it is at the cusp of values associated with abnormal thickness measurements (e.g., thicknesses of failed batteries). When the value of the instantaneous battery thickness measurement 1481 reaches or exceeds the absolute threshold, the rule 1082 can explicitly dictate that the signal processor 1110 create an alert message with a "medium" severity and include information in the message that caused the creation of the alert. The BMS 1199 can receive the alert message and, in response, send a signal to the controller 1070 to charge the battery more slowly in an attempt to extend the life of the battery.

[0090] In another example, when the instantaneous battery thickness measurement 1481 reaches or exceeds a thickness measurement associated with a battery exhibiting abnormal swelling, the signal processor 1110 can send a "high" severity message to the controller 1070 or the BMS 1199 to disable and / or stop charging the battery 1035 and notify the user to service the user device 200. Alternatively or additionally, in some embodiments, the system (e.g., via the signal processor 1110) can send a signal to the user device 200 itself to notify the user (e.g., via a display of the user device, via a wired or wireless communication system of the user device, etc.) and / or to a remote device or system (e.g., a network through which the user device communicates).

[0091] In another example, for a reference battery of the same type as the test battery 1035, the set of message rules 1082 may include logic (e.g., business logic) that compares the instantaneous battery thickness measurement 1481 to a relative threshold value having the same metric. For example, the threshold value may be relative, in that there are different thickness threshold values ​​stored for different SOCs of the reference battery and / or different threshold values ​​stored for different numbers of charge / discharge cycles of the reference battery. To do this, the signal processor 1110 may access the number of charge / discharge cycles of the test battery 1035, perform a lookup of that value for the reference battery (e.g., within the memory module 1080), and obtain threshold values ​​for approximately the same number of charge / discharge cycles (e.g., the minimum and maximum expected instantaneous battery thickness measurements). The signal processor 1110 may then compare the actual thickness measurement 1481 to the reference threshold value.

[0092] It will also be appreciated that the functionality of the temperature sensor 1135 and / or the power sensor 1145 may be provided by an external BMS 1199 in communication with the user device 200, or as shown, by an internal BMS 1199 incorporated into the user device 200. In some embodiments, because the system 1000 is fully included within the user device 200, the processing and analysis of the response signal may therefore be performed entirely within the user device 200.

[0093] Ultrasonic "echo" mode

[0094] Figure 2 is a schematic diagram of a battery monitoring system 1200 configured for ultrasonic interrogation of a battery 1035 using an echo transmission method. The system 1200 includes Figure 1 The components of the system 1000 are generally similar, but there are some differences. Figure 1 As in the system 1000 , the entire system 1200 may be included in the user device 200 .

[0095] exist Figure 2 In the example shown, the system 1200 includes one or more MEMS ultrasonic sources and one or more MEMS ultrasonic sensors disposed against the same surface of the battery 1035. Three MEMS ultrasonic sources 1210, 1215, 1220 and three MEMS ultrasonic sensors 1225, 1230, 1235 are shown disposed against the second surface 1045 of the battery 1035. However, any number of MEMS ultrasonic sources and MEMS ultrasonic sensors is possible according to one or more contemplated embodiments. The system 1200 also includes a signal processor 1110, an SDM 1090, a temperature sensor 1135, and a power sensor 1145, which are generally similar to Figure 1and operate in a substantially similar manner to corresponding components in system 1000.

[0096] Each MEMS ultrasonic wave source 1210, 1215, 1220 is configured to direct the ultrasonic wave generated thereby toward the battery 1035, for example, toward and through the second surface 1045 of the battery 1035. Each MEMS ultrasonic wave sensor 1225, 1230, 1235 is configured to sense the ultrasonic wave emitted from the battery 1035, for example, to sense the ultrasonic wave echo emitted from the inside of the battery through the second surface 1045.

[0097] In some embodiments, the MEMS ultrasonic source and the MEMS ultrasonic sensor are paired with each other, for example, each ultrasonic source is paired with one ultrasonic sensor. Each paired MEMS ultrasonic source and ultrasonic sensor combination is positioned at a different location on the second surface 1045 to be interrogated. In some embodiments, each paired MEMS source and sensor is acoustically coupled to the second surface of the battery via a couplant material 1050. The couplant is disposed between the second surface of the battery and the surface of each ultrasonic source and ultrasonic sensor.

[0098] In some embodiments, for example, Figure 2 As shown, each pair of MEMS ultrasonic source and MEMS ultrasonic sensor is housed in the same MEMS transducer 1270. MEMS transducers 1270-1, 1270-2, and 1270-3 are shown and include the following MEMS ultrasonic source / MEMS ultrasonic sensor pairs: 1210 / 1225, 1215 / 1230, and 1220 / 1235, respectively.

[0099] Alternatively, in some embodiments, each MEMS transducer 1270 is configured to operate as both an ultrasonic source and a sensor. During operation of the system 1200, each transducer is alternately configured (e.g., by the controller 1070 and / or the actuator module 1100) to operate as an ultrasonic source and then configured (e.g., by the controller 1070 and / or the receiver module 1105) to operate as an ultrasonic sensor.

[0100] In the illustrated example, each MEMS ultrasonic source 1210, 1215, 1220 is paired with a MEMS ultrasonic sensor 1225, 1230, 1235, for example, which are schematically shown as being in contact with each other. Each MEMS ultrasonic source transmits ultrasonic waves into the battery 1035 in response to an electrical excitation signal received from the excitation module 1100 via the power channel 1120, as described above with respect to the ultrasonic penetration mode. The transmitted ultrasonic waves are directed toward the second surface 1045 of the battery 1035, through the coupling agent 1050 and the second surface 1045, and toward the first surface 1040 into the battery. The transmitted ultrasonic waves are directed along a transmission axis 1255.

[0101] When the transmitted ultrasonic wave reaches the first surface 1040 of the battery 1035, the reflected / "echoed" ultrasonic wave returns from the first surface 1040 as an ultrasonic echo. The ultrasonic echo is then directed back along the transmission axis 1255 toward the second surface 1045. The ultrasonic echo then passes through the second surface 1045 and the couplant 1050 and is sensed by the ultrasonic sensor paired with the ultrasonic source. In response to sensing the ultrasonic echo, the ultrasonic sensor generates a response signal based thereon and transmits the response signal to the signal receiver module 1105 via the signal channel 1125.

[0102] In some embodiments, because battery 1035 has parallel and opposing first and second surfaces, battery 1035 can be suitable for ultrasonic interrogation using an echogenic transmission method. However, embodiments of the disclosed subject matter are not limited in this regard. Rather, according to one or more contemplated embodiments, the echogenic transmission modes and methods described herein can be used to interrogate any battery by receiving ultrasonic echoes from within the battery.

[0103] In some embodiments, SDM 1090 may be configured to operate in a "round-robin" manner (e.g., as described above for Figure 1 1000 ) and stores the response signal from each MEMS ultrasonic sensor in a buffer. After SDM 1090 receives the response signals from all MEMS ultrasonic sensors, SDM 1090 sends a "ready" signal to signal processor 1110, which accesses the response signals in the buffer and analyzes them, for example, by combining the temperature signal with the current and voltage signals. In some embodiments, because system 1200 is fully integrated within user device 200, the processing and analysis of the response signals can be performed entirely within user device 200.

[0104] Figures 3-6 Shows something like Figure 2 More details on the echo mode system. Figures 3-6In the example shown, the system 1300 is configured similarly to the echo mode system of

[0105] Figure 3 is another battery monitoring system 1300 constructed in accordance with the principles of the present application. In Figure 3 the example shown, the system 1300 is configured similarly to the echo mode system of Figure 2 the difference being that the SDM 1090, BMS 1199, and signal processor 1110 are located external to the user device 200.

[0106] Figure 4 Another echo mode battery monitoring system 1400 is shown. This system 1400 is included within a user device 200 that is designed to interrogate a single battery 1035. To this end, the system 1400 includes a single MEMS transducer 1270. The MEMS transducer 1270 is disposed against a surface of the battery 1035. Also shown are terminals 1242 of the battery 1035 that are connected to a power bus (not shown) of the user device 200. In examples, via its terminals 1242 and the power bus, the battery can provide power to various components of the user device 200, which discharges the battery 1035, and the battery can receive power via the power bus to charge the battery 1035. In comparison to the existing systems 1000, 1200, and 1300, the system 1400 shows more detail of the components within the SDM 1090.

[0107] The system 1400 includes generally similar components to the systems 1000, 1200, and 1300, and can be operated in generally similar fashion. However, there are differences between the two. The signal processor 1110 is included within the SDM 1090, which is included within the user device 200, and the signal processor 1110 is combined with the SDM 1090 into an integrated circuit form factor (e.g., an application specific integrated circuit (ASIC)) or otherwise constructed in that manner. The power sensor 1145 is connected to the battery 1035, rather than being a separate component that is disposed against the battery 1035. As with the system 1300, the BMS 1199 of the system 1400 is located external to the user device 200 and communicates with the system 1400 via the communication interface 1085.

[0108] The ASIC form factor of the SDM 1090 and signal processor 1110 has advantages. For example, the ASIC form factor has a low unit cost, is extremely thin so that it can be included within a user device 200 that is as small as a cell phone and even smaller, and its compact, small form factor provides short and efficient signal paths.

[0109] In Figure 4 In the example shown, the excitation module 1100 includes a pulse-shaping instruction 1097 and a pulse generator 1401. The controller 1070 includes and controls a single transmit / receive switch ("T / R switch") 1402. The receiver module 1105 includes a linear amplifier 1403 and an analog-to-digital converter ("A / D converter") 1404.

[0110] The power sensor 1145 includes a separate current sensor 1146 and a voltage sensor 1147, both of which are connected to the battery 1035. The current sensor 1146 and the voltage sensor 1147 are also connected to and in communication with the communication interface 1085.

[0111] The components of the system 1400 can be arranged and configured to operate as follows. The T / R switch 1402 of the controller 1070 has the following communication path to the MEMS ultrasonic transducer 1270: the T / R switch 1402 is connected to the internal communication channel 1115, which in turn is connected to the signal channel 1225 via the controller interface 1095. The T / R switch 1402 is normally open, during which time the pulse generator 1401 of the excitation module 1100 can send an excitation signal to the MEMS ultrasonic transducer 1270 via the controller interface 1095 through the power channel 1120.

[0112] When the MEMS ultrasonic transducer 1270 sends a response signal back to the controller 1070 via the controller interface 1095 through the signal channel 1225, the controller 1070 closes the T / R switch 1402, and the response signal is sent to the receiver module 1105. In the receiver module 1105, the response signal is amplified by the linear amplifier 1403 and then converted to digital format by the A / D converter 1404 as a digitized response signal 1086.

[0113] At the same time, the temperature sensor 1135 sends its temperature signal to the communication interface 1085 periodically through the temperature signal channel 1140. The A / D converter 1404 receives the temperature signal via the communication interface 1085 and converts it to a digitized temperature signal 1087. In addition, the current sensor 1146 and the voltage sensor 1147 of the power sensor 1145 send the current and voltage measurements of the battery 1035 to the A / D converter 1404 via the communication interface 1085 periodically, respectively. The A / D converter 1404 converts these signals to a digitized current signal 1088 and a digitized voltage signal 1089, respectively, and sends them to the signal processor 1110. In the following, the word "digitized" is omitted from the names of the digitized signals 1086, 1087, 1088, and 1089.

[0114] The signal processor 1110 is connected to the A / D converter 1404, the memory module 1080, and the communication interface 1085. The signal processor 1110 accesses the signals 1086, 1087, 1088, and 1089 buffered in the receiver module 1105. By utilizing a set of characteristic rules 1081 in the memory module 1080, the signal processor 1110 analyzes the response signal 1086 (possibly in conjunction with the temperature signal 1087, the current signal 1088, and the voltage signal 1089) to determine different states 1480 of the battery 1035.

[0115] After detecting abnormal swelling of the battery, a catastrophic battery failure can occur within 10-15 minutes (or even possibly less time). In an example, the system 1400 (and other embodiments disclosed herein) can detect and report the degree of swelling of the battery installed in the user device 200 via the instantaneous thickness measurement 1481 and the battery life thickness measurement 1482.

[0116] In one implementation, the BMS 1199 can monitor these outputs / states 1480 and send an alert message when the signal processor 1110 determines that the thickness measurements 1481, 1482 reach or exceed one or more thresholds (e.g., stored in the memory module 1080). The alert message can be sent to a software application running on the user device 200, or to another user device carried or otherwise accessed by one or more individuals (e.g., an active user of the user device, a potential user of the user device, an administrator of the user device, a maintenance person for the user device, etc.). In this way, one or more individuals can be alerted of potential problems with the user device 200 before the problems occur, thereby avoiding catastrophic events such as abnormal swelling of the battery 1035. Additionally and / or alternatively, the signal processor 1110 can also send the alert message.

[0117] The ability of the system 1400 to predict and detect early signs of abnormal swelling of the battery 1035 in the user device 200 has other advantages in addition to safeguarding user safety and possibly preventing damage to the user device 200. The manufacturer of the user device 200 can also save on repair costs and warranty claims, and benefit from the increased brand recognition that can come from the user device 200 including the system 1400.

[0118] In some embodiments, the system 1400 may periodically (e.g., once per minute) analyze the battery 1035 to determine thickness measurements 1481, 1482 and other states 1483-1485. The states 1480 may be time-stamped and saved locally to the memory module 1080. Additionally or alternatively, the SDM 1090 may include the time-stamped states 1480 obtained during each measurement and / or polling iteration in a message and may send these messages to an external database (not shown). In the database, the information in the message may be stored as a separate record for each battery 1035 in each user device 200.

[0119] Figure 5 Another echo-mode battery monitoring system 1500 is shown, included within user device 200. System 1500 is designed to interrogate multiple batteries 1035-1…1035-N within the same user device 200. To this end, system 1500 includes multiple MEMS transducers 1270, wherein an independent MEMS ultrasonic transducer is positioned against the surface of each battery 1035. Additionally, an independent temperature sensor 1135 is provided, for example, positioned against the surface of each battery 1035. Furthermore, system 1500 includes multiple power sensors 1145, wherein an independent current sensor 1146 and voltage sensor 1147 within each power sensor 1145 are connected to the terminals of each battery 1035 to measure the current and voltage of each battery 1035, respectively. Due to limited space in the figure, the terminals of the batteries 1035 are not shown; only the connections between the power sensor 1145-N and its associated battery 1035-N are shown. As in systems 1300 and 1400 , the BMS 1199 of system 1500 is located outside the user device 200 and communicates with the system 1500 via the communication interface 1085 .

[0120] System 1500 includes additional components. Controller 1070 includes a plurality of T / R switches 1402-1 ... 1402-N (where N is the number of cells 1035 to be interrogated) and a first sequence controller 1406 for selecting a MEMS transducer 1270 associated with each individual cell 1035. Receiver module 1105 includes a second sequence controller 1407 configured to select a temperature measurement from each of the N cells 1035. SDM 1090 also includes a third sequence controller 1408 for selecting a power sensor 1145 from a plurality of power sensors.

[0121] It is also understood that the functionality of the power sensors 1145 can be provided by an internal or external BMS 1199 connected to each of the N batteries, rather than by independent physical power sensors 1145-1...1145-N as shown.

[0122] In Figure 5 In the example shown, the controller 1070 uses a first sequence controller 1406 to select one T / R switch 1402 at a time from the N T / R switches. Each T / R switch 1401-1, 1402-2...1402-N is connected to a respective MEMS transducer 1270-1, 1270-2...1270-N disposed against each battery 1035-1, 1035-2...1035-N. Via the first sequence controller 1406, the controller 1070 can select a T / R switch 1402 for each MEMS transducer 1270 and operate the T / R switch 1402 to transmit an excitation signal to the MEMS transducer or receive a response signal 1086 from the MEMS transducer.

[0123] Likewise, the receiver module 1105 uses a second sequence controller 1407 to select the temperature measurements obtained and transmitted from the temperature sensors 1135-1...1135-N associated with each battery 1035-1...1035-N. The receiver module 1105 also uses a third sequence controller 1408 to select the current and voltage measurements provided by the power sensors 1145-1...1145-N for each battery (or independent BMS connection for each battery). To do so, the power sensor 1145-N includes an associated instance of a current sensor 1146-N and an associated instance of a voltage sensor 1147-N, each connected to the battery 1035-N.

[0124] Each MEMS ultrasonic transducer 1270 is assigned a unique number (e.g., transducer number), and the memory module 1080 includes a mapping relating the number of each MEMS transducer to its battery 1035. Using the mapping, the controller 1070 and / or the SDM 1090 can route signals and / or messages between components. In one example, the excitation and response signals 1086 can also include the transducer number in the metadata to identify the associated MEMS transducer 1270. The signal processor 1110 and / or the controller 1070 can in turn access the mapping to identify the associated MEMS transducer 1270 and battery 1035 for each excitation and response signal 1086.

[0125] Then, for each battery cell 1035-1 ... 1035-N, the signal processor 1110 accesses the response signal 1086, the temperature signal 1087, the current signal 1088, and the voltage signal 1089 buffered at the receiver module 1105. Using a set of characterization rules 1081 in the memory 1080, the signal processor 1110 analyzes the signals 1086-1089 associated with each battery cell to determine a different state 1480 for each battery cell 1035-1 ... 1035-N.

[0126] Figure 6 Another echo mode system 1600 included in user device 200 is shown. In system 1600, multiple MEMS transducers 1270 are each disposed at different locations on the surface of a single battery 1035. The MEMS transducers 1270 are arranged in N rows and M columns, abbreviated as "row" and "column" in the figure, such that each individual transducer is represented by 1270 (N, M). To this end, in one example, the N×M transducers 1270 may be approximately equidistant / regularly spaced from each other on the battery surfaces 1040, 1045 and slightly away from the edges of the surfaces 1040, 1045. In another example, for the same number of N×M transducers 1270, the transducers 1270 may be more sparsely spaced on the surfaces 1040, 1045 and extend all the way to the edges of the surfaces 1040, 1045.

[0127] A single temperature sensor 1335 is also disposed against the surface of the battery 1035, and a single instance of a power sensor 1145 measures the current and voltage from the battery 1035. As in systems 1300, 1400, and 1500, the BMS 1199 of system 1600 is located external to the user device 200 and communicates with the system 1600 via the communication interface 1085.

[0128] As in Figure 5 As in the system 1500, the controller 1070 of the system 1600 includes a plurality of T / R switches 1402 and a first sequence controller 1406. Since an independent T / R switch is associated with a specific MEMS ultrasonic transducer, each T / R switch 1402 is represented by 1402 (N, M). Figure 6 In the example shown, the controller 1070 configures the T / R switches 1402 (N, M) and the first sequence controller 1406 to send information to and receive information from each MEMS transducer 1270 (N, M).

[0129] In some embodiments, each MEMS transducer 1270 is assigned a unique number (e.g., transducer number) and each surface 1040, 1045 on which a MEMS transducer is disposed is also assigned an x-y coordinate system with an origin 1602. Alternatively or additionally, in some embodiments, row-column addresses are used. The memory module 1080 can include a mapping of the number of each MEMS transducer 1270 to its battery location relative to the origin 1602. In this way, the excitation signals and response signals can include the transducer number to identify the MEMS transducer 1270. The controller 1070, other components of the SDM 1090, and / or the signal processor 1110 can then access the mapping to identify the associated MEMS transducer / battery location for each excitation signal and response signal 1086.

[0130] In Figure 6 In the example shown, the controller 1070 uses the first sequence controller 1406 to select one T / R switch 1402 from among a plurality of N T / R switches. Each T / R switch 1401-1, 1402-2... 1402-N is connected to a respective corresponding MEMS transducer 1270-1, 1270-2... 1270-N disposed against a surface of the battery 1035. Via the first sequence controller 1406, the controller 1070 can select a T / R switch 1402 for each MEMS transducer 1270 and operate the T / R switch 1402 to send an excitation signal to or receive a response signal 1086 from the MEMS transducer 1270.

[0131] The signal processor 1110 then accesses the signals 1086-1089 buffered at the receiver module 1105. By utilizing a set of characteristic rules 1081 in the memory 1080, the signal processor 1110 analyzes the response signals 1086 to determine different states 1480 of the battery 1035. As described above with respect to the systems 1000, 1200, 1300, 1400, and 1500, the signal processor 1110 of the system 1600 can also analyze the response signals 1086 in conjunction with the temperature signals 1087, the current signals 1088, and the voltage signals 1089 to determine different states 1480 of the battery 1035.

[0132] The memory module 1080 can also include one or more machine learning models that the signal processor 1110 can access and load. These models can or can not be pre-trained. In one example, the signal processor 1110 can determine a set of initial states 1480, which it then passes as input to one or more machine learning models, the result of which is a predicted version of the states 1480. Over time, multiple sets of output states 1480 can then be fed back as input to the model to produce additional predicted output states.

[0133] Although Figures 4-6 While more details of the backscatter mode systems 1400, 1500, and 1600 are shown, it is also understood that aspects of these systems are equally applicable to the Figure 1 The penetration mode system 1000 is shown. To this end, one or more pairs of MEMS ultrasonic sources / sensors can be disposed against opposite sides 1040, 1045 of each battery 1035, if applicable. Accordingly, an appropriate number and configuration of T / R switches 1402 can connect each pair of MEMS ultrasonic sources / sensors to the controller 1070. In this way, the controller 1070 can instruct the excitation module 1100 to send an excitation signal to the MEMS ultrasonic source of each source / sensor pair, and can instruct the receiver module 1105 to receive a response signal 1086 from the MEMS ultrasonic sensor of each source / sensor pair. Likewise, an appropriate number and configuration of sequence controllers 1406-1408 can connect the temperature sensor 1135 and the power sensor 1145 to each battery 1035, and enable the signal processor 1110 to receive the response signal 1086, the temperature signal 1087, the current signal 1088, and the voltage signal 1089.

[0134] In some embodiments, for example, as Figure 6 shown, the MEMS ultrasonic sources and sensors can be arranged in an array format, and a single array can be disposed against one side of each battery 1035. To this end, the array can include a plurality of MEMS ultrasonic transducers 1270, each of which can be configured (e.g., by the controller 1070) to be a MEMS ultrasonic source or sensor at different times, for example, based on the test target. Alternatively or additionally, in some embodiments, two arrays of MEMS transducers can be disposed against each battery 1035, with a first array placed on a first side of each battery and a second array placed on a second side of each battery 1035 opposite the first side. Additionally or alternatively, a plurality of independent MEMS transducers that can be configured to be MEMS ultrasonic sources or sensors can be disposed against one or more sides of each battery 1035 according to the backscatter and / or penetration modes of the system 1600.

[0135] It is also understood that each system 1000, 1200, 1300, 1400, 1500, and 1600 can be configured to send multiple excitation pulses to each MEMS ultrasonic source and / or MEMS transducer 1270 in each test run, and to perform multiple test runs. For example, in some embodiments, a set of excitation pulses including up to 16 excitation pulses in a sequence can be sent to each MEMS ultrasonic sensor and / or MEMS transducer 1270 in each test run. For example, the signal processor 1110 can wait to receive all response signals 1086 for the associated MEMS ultrasonic sensor and / or MEMS transducer 1270, if applicable, before sending the set of excitation pulses to the next MEMS ultrasonic source and / or MEMS transducer 1270.

[0136] In each test run, the excitation pulses within the set of excitation pulses can be the same or different. In examples, the excitation pulses can differ in one or more of frequency / wavelength, amplitude, phase, pulse width, cycle count, pulse repetition frequency, and waveform type. In examples, the waveform type can include square wave (unipolar or bipolar) and sine wave. For example, the waveform of each excitation pulse can be programmed such that the wavelength of the ultrasonic waves emitted from the MEMS ultrasonic source and / or MEMS ultrasonic transducer 1270 is less than the battery thickness dimension 1042.

[0137] Ultrasonic monitoring device

[0138] Figure 7 Figure 1 is an image of a semiconductor wafer 1710 that includes thousands of individual "chips" in an array 1720. Each chip on the wafer is an ASIC and is typically designed and fabricated to have the same structure and functionality. Each chip includes nearly all of the components of one of the battery monitoring systems 1000, 1200, 1300, 1400, 1500, and 1600. Typically, a separate wafer 1710 is designed and fabricated for each system.

[0139] In one implementation, each chip on the wafer 1710 includes, in addition to the external BMS 1199 and the power sensor 1145, Figure 4The chip / system 1400 is designed to be used in and included within a single user device 200. In some embodiments, during manufacture and assembly of the user device 200, the chip is glued or otherwise adhered to a surface of a single battery 1035 such that the MEMS transducer 1270 and temperature sensor 1135 of the chip / device 1400 are placed against the battery surface. In some embodiments, the glue or adhesive also serves as the couplant 1050. Alternatively, in some embodiments, a separate couplant can be provided in addition to the glue or adhesive.

[0140] In some embodiments, the MEMS transducer is a CMUT device, for example, a CMUT device having a thickness of about 0.6 mm. Alternatively, in some embodiments, the MEMS transducer 1270 is a CMUT device having a thickness less than or equal to 0.4 mm.

[0141] The power sensor 1145 is then connected to the interface 1085 of the SDM 1090 and to the battery 1035. The chip can also be connected to the battery terminals 1242 such that the chip, and thus the system 1400 formed from the chip, is powered and operates only when the battery 1035 is charged. Alternatively, even the power sensor 1145 can be included in the chip.

[0142] In some embodiments, each chip includes at least the signal processor 1110 and the SDM 1090 for one of the systems 1000, 1200, 1300, 1400, 1500, or 1600, but does not include the MEMS transducer 1270. During manufacture / assembly of the user device 200, a miniature CMUT or PMUT device as the MEMS transducer 1270 can be adhered to one or more surfaces 1040, 1045 of each battery 1035 in the user device 200. In accordance with the connections described above for each of the systems 1000, 1200, 1300, 1400, 1500, or 1600, a single chip including at least the signal processor 1110 and the SDM 1090 is included within the user device 200, and wires connect each MEMS transducer 1270 to the SDM 1090 and / or the signal processor 1110. Then, as described above, power to the chip, connection to the power sensor 1145, and other interface connections are provided for the “system on a chip” / chip forming the system 1400.

[0143] Figure 8is an image showing individual elements 1802 of a MEMS transducer 1270 in the left portion of the image and an exemplary grouping of nine individual MEMS transducer elements 1802 connected in a grid-like fashion in the right portion of the image. In some embodiments, the interconnected MEMS transducer elements can operate collectively to provide the functionality of the MEMS transducer 1270. MEMS transducer elements operating as a single transducer have advantages over standard monolithic piezoelectric transducers. For example, when Figures 1-6 The system of is configured to provide explicit control over each sub-element 1802 of the MEMS transducer 1270. As a result, the ultrasound waves emitted by the MEMS transducer have fewer side lobes. Alternatively or additionally, the MEMS transducer can have an improved response, for example, because the individual elements 1802 add much less deleterious vibration than a single conventional ultrasound transducer. Furthermore, the MEMS transducer can have a low unit cost, have a sub-millimeter thickness, which enables the transducer to fit within a minimal user device 200, and can have a high bandwidth.

[0144] Figure 10 is an image of a semiconductor wafer including more than one hundred CMUT devices 1270. The devices 1270 can be cut from the wafer individually or in groups and adhered to the surface 1040, 1045 of the battery 1035 in the user device 200. The devices 1270 can include any number of individual "drums" / elements 1802 that are connected together to form the CMUT device 1270.

[0145] In some embodiments, instead of or in addition to CMUT elements, PMUT MEMS transducers can be used. Figure 9 is a schematic diagram showing the arrangement of semiconductor layers of a PMUT MEMS transducer. The PMUT is constructed as a plurality of successively stacked layers on a non-conductive substrate 1902. The substrate 1902 is mounted on the surface of the battery 1035 or other test object, with a coupling agent 1050 (not shown) disposed between the substrate and the surface of the battery 1035.

[0146] More details of an exemplary arrangement of the plurality of layers within a PMUT are as follows. A bottom non-conductive layer with a vacuum well 1906 is fabricated on top of the substrate 1902. A silicon dioxide insulating layer 1908 is fabricated on top of the vacuum well 1906 and the bottom layer 1904. Then, a first metal electrode layer 1910 is fabricated on top of the insulating layer 1908. Then, a piezoelectric layer 1912 is fabricated on top of the first electrode layer 1910, followed by a second electrode layer 1914 on top of the piezoelectric layer 1912. In this way, the piezoelectric layer 1912 is sandwiched between the first electrode layer 1910 on the bottom and the second electrode layer 1914 on the top.

[0147] In some embodiments, the PMUT can operate as follows. When the PMUT operates as an ultrasonic source, an AC voltage 1920 in the form of an excitation signal is applied to the first electrode layer 1910 and the second electrode layer 1914. The excitation signal causes the transducer to vibrate, which results in ultrasonic waves being emitted downward, through the coupling agent 1050, and into the battery 1035. When the PMUT operates as an ultrasonic sensor, the AC voltage 1920 representing the vibration sensed by the PMUT is measured across the first electrode layer 1910 and the second electrode layer 1914.

[0148] System operation

[0149] In some embodiments, Figures 1-6 The system of any of the figures in FIG can only operate when the battery 1035 is charging. This has advantages, including preserving battery life by not depleting the battery's charge, and because charging the battery 1035 is a higher risk mode for battery failure than discharging. In some embodiments, via the SOC state 1484 and the SOH state 1485, any of the battery monitoring systems 1000, 1200, 1300, 1400, 1500, and 1600 can estimate the capacity change of the battery 1035 and adjust the charging parameters to extend the battery life. If the system determines signs of abnormal expansion via the instantaneous thickness measurement state 1481 and / or the lifetime thickness measurement state 1482, the system can be configured to send one or more shutdown signals to the internal or external BMS 1199 (e.g., shutting down the charging of the battery 1035) and / or sending a notification message to an individual (e.g., a user of the user device). Alternatively or additionally, the battery temperature status 1483 may be used to measure a possible battery fault, and the internal or external BMS 1199 may shut down charging of the battery 1035 and / or send a notification message to an individual.

[0150] As mentioned above Figures 1-6 As described in the description of FIG. 1 , the signal processor 1110 may analyze the time-stamped response signal 1086 in combination with the time-stamped temperature signal 1087 , the current signal 1088 , and the voltage signal 1089 to determine the state 1480 of the battery 1035 .

[0151] Additionally or alternatively, in some embodiments, the system (e.g., Figures 1-6 ) can operate on a stack of batteries 1035. For example, as few as two or three thin "pouch" type batteries can be glued together to form a stack, and the systems 1000, 1200, 1300, 1400, 1500, and 1600 can operate on this stack to determine various conditions of the battery stack.

[0152] In some embodiments, any of the systems (e.g., of FIGS. 1- 16) can be included within and / or configured for operation within devices other than user devices. For example, these devices can include consumer devices, including electronic toys, consumer televisions, cable set-top boxes and modems, Internet access points, communication equipment, military devices and systems, battery packs such as electric vehicle (EV) battery packs, and battery storage systems. Figures 1-6

[0153] In some embodiments, any of the systems (e.g., of FIGS. 1- 16) can be configured to adjust a charging parameter of the battery 1035 in response to a set of outputs 1480 generated by the respective system. For example, if the battery temperature 1483 exceeds a first threshold and / or the instantaneous battery thickness 1481 has exceeded a second threshold, the system (e.g., via the signal processor 1110) can send a message to the internal or external BMS 1199 via the communication interface 1085 in order to charge the battery more slowly, thereby extending the battery life. In some embodiments, the second threshold can be a typical thickness measurement for a battery of the same type as the battery being measured and approximately the same number of charge / discharge cycles. Figures 1-6

[0154] In some embodiments, the state 1480 can be determined when the battery 1035 is empty or fully charged. Alternatively or additionally, the state 1480 (or at least the data used to determine the state 1480) can be determined while the battery 1035 is discharging or charging. In some embodiments, it can be helpful to determine the instantaneous thickness measurement 1481 and the life thickness measurement 1482 while the battery is charging, as most battery failures occur during charging, and abnormal swelling that leads to catastrophic battery failure and / or fire can occur within a few minutes (e.g., < 10-15 minutes).

[0155] Ultrasonic monitoring method

[0156] Figure 11 is a flowchart that describes a method of operating a battery monitoring system according to one or more embodiments of the disclosed subject matter. In some embodiments, Figure 11 The method of FIG. 20 can describe operation of any of the battery monitoring systems 1000, 1100, 1200, 1300, 1400, 1500, and 1600.

[0157] ​​The method can begin at flow block 902, where a MEMS ultrasonic source and a MEMS ultrasonic sensor can be disposed against a battery included in a user device. At flow block 904, an excitation module can transmit an excitation signal to the MEMS ultrasonic source. The MEMS ultrasonic source can receive the excitation signal and can transmit an ultrasonic pulse into the battery in response to receiving the excitation signal.

[0158] At flow block 906, the system can detect the ultrasonic pulse from the battery (e.g., via the MEMS ultrasonic sensor) and can generate a response signal associated with the detected ultrasonic wave (e.g., by the MEMS ultrasonic sensor). At flow block 908, the system can receive the response signal (e.g., from the MEMS ultrasonic sensor) (e.g., via the receiver module 1105). Then, at flow block 910, the response signal can be analyzed (e.g., via the signal processor 1110) and a different state of the battery can be determined (e.g., by the signal processor 1110) in response to the analysis.

[0159] Although Figure 11 some of the blocks 902-910 of the method have been described as being performed only once, in some embodiments, a particular flow block can be repeated multiple times before proceeding to the next decision block or flow block. Moreover, although Figure 11 the blocks 902-910 of the method have been shown and described individually, in some embodiments, the flow blocks can be combined together and executed (either simultaneously or sequentially). Moreover, although Figure 11 a particular order of the blocks 902-910 is shown, embodiments of the subject disclosure are not limited thereto. In fact, in certain embodiments, these blocks can occur in a different order than illustrated, or concurrently with other blocks. In some embodiments, the method can include steps or other aspects not specifically shown in Figure 11 the method 900. Alternatively or additionally, in some embodiments, the method can include only some of the blocks 902-910 of the method 900. Figure 11

[0160] Computer implementation

[0161] Figure 12 A general example of a computing environment 531 suitable for implementing the described innovations is depicted in FIG. 31, such as but not limited to the BMS 1199, the SDM 1090, and / or the method of the subject disclosure. The computing environment 531 is not intended to suggest any limitation as to scope or functionality, since the innovations can be implemented in various general- purpose or special-purpose computing systems. For example, the computing environment 531 can be any of a variety of computing devices, such as a desktop computer, a notebook computer, a server computer, a tablet computer, etc. Figure 11 ​​

[0162] Reference Figure 12 The computing environment 531 includes a system bus 553 for communicating information, and a processing resource 535 coupled with the system bus 553 for processing information. The basic configuration 551 includes one or more processing units 535, 537 and memory 539, 541. The processing units 535, 537 execute computer-executable instructions. A processing unit can be a central processing unit (CPU), processor in an application-specific integrated circuit (ASIC), microcontroller, or any other type of processing unit (e.g., hardware processor, graphics processing unit (GPU), virtualized processor, etc.). In a multi-processing system, multiple processing units execute computer-executable instructions to increase processing power. For example, Figure 12 A bus controller provides the bus master functionality for the bus 553. The illustrated bus 553 is an address- and data bus that allows one or more of the attached devices to transfer addresses and data to one another. Address connections are used to send addresses and control signals that allow the devices to properly communicate information both to and from one another. Data connections are used to send the actual data being transmitted. In some embodiments, the address and data buses 553 allow 64-bit addresses and 64-bit data to be transferred between devices.

[0163] The computing system can have additional features. For example, the computing environment 531 includes storage 561, one or more input devices 571, one or more output devices 581, and one or more communication connections 591. An interconnection mechanism (not shown) such as a bus, controller, or network interconnects the components of the computing environment 531. Typically, operating system software (not shown) provides an operating environment for software executing in the computing environment 531, and coordinates activities of the components of the computing environment 531.

[0164] The storage 561 can be removable or non-removable, and includes magnetic disks, magnetic tapes or cassettes, CD-ROMs, DVDs, or any other medium which can be used to store information in a non-transitory way and which can be accessed by the computing environment 531. The storage 561 can store instructions for the software 533 implementing one or more innovations described herein.

[0165] The input devices 571 can be a touch input device such as a keyboard, mouse, pen, or trackball, a voice input device, a scanning device, or another device that provides input to the computing environment 531. The output devices 581 can be a display, printer, speaker, CD-writer, or another device that provides output from the computing environment 531.

[0166] The communication connection(s) 591 enable communication over a communication medium to another computing entity. The communication medium conveys information such as computer-executable instructions, audio or video input or output, or other data in a modulated data signal. A modulated data signal is a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, communication media can use an electrical, optical, radio, or other carrier.

[0167] Any of the disclosed modes or methods can be implemented as computer- executable instructions stored on one or more computer-readable storage media (e.g., one or more optical media discs, volatile memory components (such as DRAM or SRAM), or non-volatile memory components (such as flash memory or hard drives)) and executed on a computer (e.g., any commercially available computer, including smart phones or other mobile devices that include computing hardware). The term computer- readable storage media does not include communication connections, such as signals and carrier waves. Any computer-executable instructions suitable for implementing the disclosed techniques, and any data created and used during implementation of the disclosed embodiments, can be stored on one or more computer-readable storage media. The computer-executable instructions can be part of, for example, a dedicated software application or part of a software application that is accessed or downloaded via a web browser or other software application (such as a remote computing application). Such software can be executed, for example, on a single local computer (e.g., any commercially available computer) or in a network environment (e.g., via the Internet, a wide-area network, a local-area network, a client-server network (e.g., a cloud computing network), or any other such network) using one or more network computers.

[0168] For clarity, only certain selected aspects of the software-based implementations are described. Other details that are well known in the art are omitted. For example, it should be understood that the disclosed technology is not limited to any particular computer language or program. For instance, the disclosed technology can be implemented using software written in C++, Java, Python, Ruby, Perl, JavaScript, Flash, or any other suitable computer language. Likewise, the disclosed technology is not limited to any particular computer or type of hardware. Suitable TM 、 computers and hardware are well known and need not be detailed herein.

[0169] It should also be well understood that any of the functionality described herein can be performed, at least in part, by one or more hardware logic components, instead of software. For example, and without limitation, illustrative types of hardware logic components that can be used include Field-programmable Gate Arrays (FPGAs), Application-specific Integrated Circuits (ASICs), Application-specific Standard Products (ASSPs), System-on-a-chip systems (SOCs), Complex Programmable Logic Devices (CPLDs), etc.

[0170] Moreover, any of the software-based embodiments (including at least all of the software-controlled aspects of the disclosed methods and apparatus) can be uploaded, downloaded, or remotely accessed through a suitable communication means. Such suitable communication means include, for example, the Internet, the World Wide Web, an intranet, software applications, cable (including fiber optic cable), magnetic communications, electromagnetic communications (including RF, microwave, and infrared communications), electronic communications, or other such communication means.

[0171] The techniques described in this disclosure can be implemented, at least in part, in hardware, software, firmware or any combination thereof. For example, various aspects of the described techniques can be implemented within one or more processors, including one or more microprocessors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or any other equivalent integrated or discrete logic circuitry, as well as any combinations of such components. The term "processor" or "processing circuitry" can generally refer to any of the foregoing logic circuitry, alone or in combination with other logic circuitry. A control unit comprising hardware can also perform one or more of the techniques of this disclosure.

[0172] Such hardware, software, and firmware can be implemented within the same device or within separate devices to support the various operations and functions described in this disclosure. In addition, any of the described units, modules or components can be implemented together or separately as discrete but interoperable logic devices. Different features described herein can be implemented as modules or units within separate hardware or software components. Different features described herein can be implemented as modules or units within a single hardware or software component. Various components can be implemented as software modules or components that are portable or executable code stored on a physical computer readable storage medium.

[0173] The techniques described in this disclosure can also be embodied or encoded in a computer readable medium, such as a computer readable storage medium, including propitiatory instructions. Instructions embedded or encoded in computer readable medium can cause a programmable processor, or other processor, to perform the methods, e.g., when the instructions are executed. Computer readable medium can include non-transitory computer readable storage medium and transitory computer readable storage medium. Tangible and non-transitory computer readable storage medium can include random access memory (RAM), read only memory (ROM), programmable read only memory (PROM), erasable programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), flash memory, a hard disk, a CD-ROM, a floppy disk, a cassette, a magnetic tape, a magnetic medium, an optical medium, or other computer readable storage medium. It is understood that the term "computer readable storage medium" refers to physical storage medium, not signals, carrier waves, or other transitory medium.

[0174] Additional examples of the disclosed technology

[0175] In view of the above implementations of the subject matter of this disclosure, the present application discloses additional examples in the following listed clauses. It should be noted that one feature in isolation or more than one feature given in combination in a clause and optionally in combination with one or more features in one or more other clauses are other examples falling within the scope of the disclosure of the present application.

[0176] Clause 1. A system comprising:

[0177] a microelectromechanical system (MEMS) ultrasonic source located in a user device and disposed with respect to a battery of the user device, the MEMS ultrasonic source configured to generate an ultrasonic pulse;

[0178] a MEMS ultrasonic sensor located within the user device and disposed with respect to the battery of the user device, the MEMS ultrasonic sensor configured to detect an ultrasonic wave from the battery and generate a response signal based on the detected ultrasonic wave; and

[0179] a control system operatively coupled to the MEMS ultrasonic source and the MEMS ultrasonic sensor, the control system configured to:

[0180] transmit an excitation signal to the MEMS ultrasonic source such that the MEMS ultrasonic source transmits the ultrasonic pulse into the battery in response to receiving the excitation signal;

[0181] receive the response signal from the MEMS ultrasonic sensor; and

[0182] analyzing the response signal to determine at least two different states of the battery.

[0183] Clause 2. The system of any of the clauses or examples herein, particularly of clause 1, wherein the control system comprises:

[0184] a signal drive and collection module (SDM) comprising a controller, a memory, an excitation module, and a receiver module, wherein the excitation module is configured by the controller to emit the excitation signal to the MEMS ultrasonic source, the MEMS ultrasonic source is configured to emit the ultrasonic pulse into the battery in response to receiving the excitation signal, and the MEMS ultrasonic sensor is configured by the controller to detect the ultrasonic pulse from the battery and to generate the response signal associated with the detected ultrasonic wave received by the receiver module; and

[0185] a processor configured to access the receiver module, analyze the response signal, and determine different states of the battery in response to the analysis.

[0186] Clause 3. The system of any of the clauses or examples herein, particularly of clause 2, wherein the SDM and the processor are included within the user device.

[0187] Clause 4. The system of any of the clauses or examples herein, particularly of any of clauses 2-3, wherein the SDM and the processor are part of a common integrated circuit.

[0188] Clause 5. The system of any of the clauses or examples herein, particularly of any of clauses 1-4, wherein the control system is formed as part of or included within the user device.

[0189] Clause 6. The system of any of the clauses or examples herein, particularly of any of clauses 1-4, wherein the control system is formed as part of or coupled to the battery.

[0190] Clause 7. The system of any of the clauses or examples herein, particularly of any of clauses 1-6, wherein the user device is a laptop, a tablet, a smartphone, or a mobile phone.

[0191] Clause 8. The system of any of the clauses or examples herein, particularly of any of clauses 1-7, wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are disposed against a same surface of the battery, and the MEMS ultrasonic sensor detects ultrasonic pulses reflected from an interior of the battery.

[0192] Clause 9. The system of any of the clauses or examples herein, particularly of any of clauses 1-7, wherein the MEMS ultrasonic source is disposed against a first surface of the battery, and the MEMS ultrasonic sensor is disposed against a second surface of the battery opposite the first surface, and the MEMS ultrasonic sensor detects ultrasonic waves transmitted through the battery.

[0193] Clause 10. The system of any of the clauses or examples herein, particularly of any of clauses 1-9, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a capacitive micro-machined ultrasonic transducer (CMUT).

[0194] Clause 11. The system of any of the clauses or examples herein, particularly of any of clauses 1-10, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a piezoelectric micro-machined ultrasonic transducer (PMUT).

[0195] Clause 12. The system of any of the clauses or examples herein, particularly of any of clauses 1-11, wherein the at least two different states comprise a state of charge (SOC) of the battery, a state of health (SOH) of the battery, a temperature of the battery, or any combination thereof.

[0196] Clause 13. The system of any of the clauses or examples herein, particularly of any of clauses 1-12, wherein the at least two different states comprise: (a) an instantaneous thickness measurement of the battery and / or (b) an age thickness measurement of the battery, the age thickness measurement determined from one or more instantaneous thickness measurements of the battery obtained over time.

[0197] Clause 14. The system of any of the clauses or examples herein, particularly of any of clauses 1-13, wherein the control system is configured to transmit the excitation signal and / or receive the response signal only when the battery is empty of charge or when the battery is full of charge.

[0198] Clause 15. The system of any of the clauses or examples herein, particularly of any of clauses 1-14, wherein the control system is configured to transmit the excitation signal and / or receive the response signal while the battery is actively charging or discharging.

[0199] Clause 16. The system of any of the clauses or examples herein, particularly of any of clauses 1-15, wherein the control system comprises one or more non-volatile computer- readable storage media storing computer-readable instructions for a set of feature rules that define one or more features extracted from the response signal during analysis of the response signal.

[0200] Clause 17. The system of any of the clauses or examples herein, particularly of any of clauses 1-16, wherein the MEMS source and the MEMS sensor are part of a common MEMS transducer.

[0201] Clause 18. The system of any of the clauses or examples herein, particularly of any of clauses 1-17, wherein the MEMS source and / or the MEMS sensor are disposed on respective surface portions of the battery via respective ultrasonic couplants or respective portions of a common ultrasonic couplant.

[0202] Clause 19. The system of any of the clauses or examples herein, particularly of any of clauses 1-18, wherein the MEMS source and / or the MEMS sensor are coupled to respective surface portions of the battery by glue or adhesive.

[0203] Clause 20. The system of any of the clauses or examples herein, particularly of clause 19, wherein the glue or adhesive functions as an ultrasonic couplant.

[0204] Clause 21. A method comprising:

[0205] emitting an ultrasonic pulse into a battery of a user device via a MEMS ultrasonic source;

[0206] detecting, via a MEMS ultrasonic sensor, an ultrasonic wave from the battery in response to the emitted ultrasonic pulse; and

[0207] determining, based at least in part on the detected ultrasonic wave, at least two different states of the battery,

[0208] wherein the MEMS ultrasonic source and the MEMS ultrasonic sensor are disposed within the user device.

[0209] Clause 22. The method of any of the clauses or examples herein, particularly the method of clause 21, wherein the method further comprises disposing the MEMS ultrasonic source and the MEMS ultrasonic sensor within the user device with respect to the battery.

[0210] Clause 23. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-22, wherein the transmitting comprises transmitting an excitation signal to the MEMS ultrasonic source, the MEMS ultrasonic source transmitting the ultrasonic pulse into the battery in response to receiving the excitation signal.

[0211] Clause 24. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-23, wherein the detecting comprises generating, by the MEMS ultrasonic sensor, a response signal associated with the detected ultrasonic wave.

[0212] Clause 25. The method of any of the clauses or examples herein, particularly the method of clause 24, wherein the determining comprises:

[0213] receiving the response signal from the MEMS ultrasonic sensor; and

[0214] analyzing the response signal to determine a different state of the battery.

[0215] Clause 26. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-25, wherein the determining is performed by a control system operatively coupled to the MEMS ultrasonic source and the MEMS ultrasonic sensor, the control system disposed within the user device.

[0216] Clause 27. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-26, wherein the method further comprises, prior to the transmitting, disposing the MEMS ultrasonic source and the MEMS ultrasonic sensor against a same surface of the battery, and the MEMS ultrasonic sensor detects the ultrasonic pulse reflected from an interior of the battery.

[0217] Clause 28. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-26, wherein the method further comprises, prior to the emitting, disposing the MEMS ultrasonic source against a first surface of the battery and disposing the MEMS ultrasonic sensor against a second surface of the battery opposite the first surface, and the MEMS ultrasonic sensor detects ultrasonic waves emitted through the battery.

[0218] Clause 29. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-28, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a capacitive micromachined ultrasonic transducer (CMUT).

[0219] Clause 30. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-29, wherein at least one of the MEMS ultrasonic source and the MEMS ultrasonic sensor comprises a piezoelectric micromachined ultrasonic transducer (PMUT).

[0220] Clause 31. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-30, wherein the determining is performed by a processor included within the user device.

[0221] Clause 32. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-31, wherein the at least two different states include a state of charge (SOC) of the battery, a state of health (SOH) of the battery, a temperature of the battery, or any combination thereof.

[0222] Clause 33. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-32, wherein the at least two different states include: (a) an instantaneous thickness measurement of the battery and / or (b) a lifetime thickness measurement of the battery, the lifetime thickness measurement determined from one or more instantaneous thickness measurements of the battery obtained over time.

[0223] Clause 34. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-33, wherein the ultrasonic pulses are emitted and / or the ultrasonic waves from the battery are detected only when the battery is empty and / or when the battery is fully charged.

[0224] Clause 35. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-34, wherein the ultrasonic pulses are emitted and / or the ultrasonic waves from the battery are detected while the battery is actively charging or discharging.

[0225] Clause 36. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-35, wherein the method comprises disposing the MEMS ultrasonic source and / or the MEMS ultrasonic sensor on a respective surface portion of the battery via a respective portion of a respective ultrasonic couplant or a common ultrasonic couplant.

[0226] Clause 37. The method of any of the clauses or examples herein, particularly the method of any of clauses 21-36, wherein the method comprises coupling the MEMS ultrasonic source and / or the MEMS ultrasonic sensor on a respective surface portion of the battery by a glue or adhesive.

[0227] Clause 38. The method of any of the clauses or examples herein, particularly the method of clause 37, wherein the glue or adhesive functions as an ultrasonic couplant.

[0228] Clause 39. A method for operating a system as described in any of the clauses or examples herein, particularly the system of any of clauses 1-20 and / or the system shown in any of Figures 1-12 .

[0229] Conclusion

[0230] While the batteries, components, and configurations have been illustrated in the drawings and described in detail above, the embodiments of the subject disclosure are not limited thereto. Indeed, those skilled in the art will readily appreciate that other batteries, components, or configurations, or additions of components, can be selected to achieve the same results. In practical implementations, embodiments can include other components or other variations beyond those illustrated. Thus, the embodiments of the subject disclosure are not limited to the particular batteries, components, and configurations specifically illustrated and described herein.

[0231] Any feature described herein, for example with reference to Figures 1-12 and clauses 1-39, can be combined with other features described herein, for example with reference to Figures 1-12 and clauses 1-39, to provide systems, apparatuses, methods, and embodiments not specifically shown or described herein. All features described herein are independent of each other, and can be used in combination with any other feature described herein, except where structurally impossible.

[0232] In view of the principles of the present disclosure, which can be applied to various possible embodiments, it should be appreciated that the illustrated embodiments are merely examples and should not be considered limiting of the scope of the present disclosure. Rather, the scope of the present disclosure is defined by the claims. Therefore, we intend that everything in the claims be considered an element of at least one claim. Like numbers refer to like elements throughout.

Claims

1. A system for monitoring a battery in a user device, the system comprising: a microelectromechanical system (MEMS) ultrasonic source and a MEMS ultrasonic sensor, both included within the user device and positioned against the battery; A signal driving and acquisition module (SDM), the SDM including a controller, a memory, an excitation module and a receiver module, wherein the excitation module is configured by the controller to transmit an excitation signal to the MEMS ultrasonic source, the MEMS ultrasonic source is configured to transmit an ultrasonic pulse into the battery in response to receiving the excitation signal, and the MEMS ultrasonic sensor is configured by the controller to detect the ultrasonic pulse from the battery and to generate a response signal associated with the detected ultrasonic wave received by the receiver module; and A processor is configured to access the receiver module, analyze the response signal, and determine a different state of the battery in response to the analysis.

2. The system of claim 1, wherein: The MEMS ultrasonic source and the MEMS ultrasonic sensor are disposed against a same surface of the battery, and the MEMS ultrasonic sensor detects ultrasonic pulses reflected from an interior of the battery.

3. The system of claim 1 , wherein: The MEMS ultrasonic source is disposed against the first surface of the battery; The MEMS ultrasonic sensor is disposed against a second surface of the battery opposite the first surface; and The MEMS ultrasonic sensor detects ultrasonic waves transmitted through the battery.

4. The system of claim 1, wherein: The MEMS ultrasonic source and the MEMS ultrasonic sensor are capacitive micro-machined ultrasonic transducers (CMUTs).

5. The system of claim 1, wherein: The MEMS ultrasonic source and the MEMS ultrasonic sensor are piezoelectric micro-machined ultrasonic transducers (PMUTs).

6. The system of claim 1, wherein: The SDM and the processor are included in the user device.

7. The system of claim 1, wherein: The SDM and the processor are incorporated into the same integrated circuit.

8. The system of claim 1, wherein: The status includes the state of charge (SOC), state of health (SOH), and temperature of the battery.

9. The system of claim 1, wherein: The status includes: An instantaneous thickness measurement of the battery; and A lifetime thickness measurement of the battery is determined from one or more instantaneous thickness measurements of the battery obtained over time and stored in the memory.

10. The system of claim 1, wherein: The status is determined when the battery is discharged or when the battery is fully charged.

11. The system of claim 1, wherein: The status is determined while the battery is charging or while the battery is discharging.

12. The system of claim 1, wherein: The memory includes a set of feature rules that define one or more features that the processor uses to extract from the response signal during analysis of the response signal.

13. A method for monitoring a battery in a user device, the method comprising: placing a microelectromechanical system (MEMS) ultrasonic source and a MEMS ultrasonic sensor against the battery, the battery being included in the user device; transmitting an excitation signal to the MEMS ultrasonic source, and the MEMS ultrasonic source transmitting an ultrasonic pulse into the battery in response to receiving the excitation signal; The MEMS ultrasonic sensor detects the ultrasonic pulse from the battery and generates a response signal associated with the detected ultrasonic wave; receiving the response signal from the MEMS ultrasonic sensor; as well as The response signal is analyzed, and an output state of the battery is determined in response to the analysis.

14. The method of claim 13, wherein: The method also includes positioning the MEMS ultrasonic source and the MEMS ultrasonic sensor against a same surface of the battery, the MEMS ultrasonic sensor detecting ultrasonic pulses reflected from an interior of the battery.

15. The method of claim 13, wherein: The method also includes positioning the MEMS ultrasonic source against a first surface of the battery and positioning the MEMS ultrasonic sensor against a second surface of the battery opposite the first surface, the MEMS ultrasonic sensor detecting ultrasonic waves transmitted through the battery.

16. The method of claim 13, wherein: The MEMS ultrasonic source and the MEMS ultrasonic sensor are capacitive micro-machined ultrasonic transducers (CMUTs).

17. The method of claim 13, wherein: The MEMS ultrasonic source and the MEMS ultrasonic sensor are piezoelectric micro-machined ultrasonic transducers (PMUTs).

18. The method of claim 13, wherein: At least analyzing the response signal is performed by a processor included in the user device.

19. The method of claim 13, wherein: The method also includes status, the status including state of charge (SOC), state of health (SOH), and temperature of the battery.

20. The method of claim 13, wherein: The method further includes a state, wherein the state includes: An instantaneous thickness measurement of the battery; and A lifetime thickness measurement of the battery is determined from one or more instantaneous thickness measurements of the battery taken over time.

21. The method of claim 13, wherein: The method also includes determining the status when the battery is discharged or when the battery is fully charged.

22. The method of claim 13, wherein: The method also includes determining the status while the battery is discharging or while the battery is charging.

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