Vibration device

Abstract

A vibration device (1) is provided with: an internal vibration body (7) for increasing the amplitude of vibration; a piezoelectric element (9) that is connected to one end of the internal vibrating body in the first direction and that generates vibration; a translucent body (5) connected to the other end of the internal vibrating body in the first direction, the translucent body (5) having an optical axis extending in the first direction; and an external vibrating body (3) including a damping part (33) extending from the first connecting part to the outside of the light-transmitting body in the second direction and damping vibration, and a first connecting part (31) connected to the light-transmitting body. The damping section (33) has non-axisymmetric properties with respect to the optical axis, has a minimum value of impedance (= resonance resistance value), has a small loss due to resistance, and can form a region that vibrates at a large amplitude and a region that vibrates at a small amplitude on the surface of the translucent body (5) during vibration without increasing the resonance resistance value of the internal vibrating body (7). Foreign matter adhering to the light-transmitting body (5) is removed.

Description

TECHNICAL FIELD

[0001] The present application relates to a vibration device. BACKGROUND

[0002] In Patent Literature 1, a vibration device is disclosed, which has an unbalance mechanism in which at least one of a light-transmitting body, a first cylindrical body, a second cylindrical body, a spring portion, and a vibration body is partially removed of mass or locally added with mass.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent No. 6819846 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the vibration device of Patent Literature 1, there is room for improvement in terms of removing foreign matter attached to the light-transmitting body.

[0008] An object of the present application is to provide a vibration body capable of removing foreign matter attached to a light-transmitting body.

[0009] SOLUTION TO PROBLEM

[0010] A vibration device according to one aspect of the present application has:

[0011] an internal vibration body that amplifies vibration;

[0012] a piezoelectric element connected to one end in a first direction of the internal vibration body, the piezoelectric element generating vibration;

[0013] a light-transmitting body connected to the other end in the first direction of the internal vibration body, the light-transmitting body having an optical axis extending in the first direction; and

[0014] an external vibration body including an attenuation portion and a first connecting portion connected to the light-transmitting body, the attenuation portion extending from the first connecting portion to the outside of the light-transmitting body in a second direction intersecting the first direction and attenuating vibration,

[0015] the attenuation portion has non-axisymmetry with respect to the optical axis.

[0016] EFFECT OF THE INVENTION

[0017] According to the present application, it is possible to provide a vibration body capable of removing foreign matter attached to a light-transmitting body. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1It is a perspective view showing a vibration device according to one embodiment of the present invention.

[0019] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0020] Figure 3 It means from Figure 1 Observed from different directions Figure 1 A three-dimensional diagram of the vibration device.

[0021] Figure 4 This is a graph showing the relationship between impedance and frequency.

[0022] Figure 5 Yes Figure 1 A cross-sectional view of a first variant of the vibration device.

[0023] Figure 6 Yes Figure 1 A stereoscopic view of a second variant of the vibration device.

[0024] Figure 7 Yes Figure 1 A cross-sectional view of a third variant of the vibration device.

[0025] Figure 8 Yes Figure 1 A cross-sectional view of a fourth variant of the vibration device.

[0026] Figure 9 Yes Figure 1 A three-dimensional diagram of a fifth variant of the vibration device.

[0027] Figure 10 yes Figure 9 Bottom view of the vibration device.

[0028] Figure 11 Yes Figure 1 A sectional view of a sixth variant of the vibration device.

[0029] Figure 12 Yes Figure 1 A sectional view of a seventh variant of the vibration device.

[0030] Figure 13 Yes Figure 12 A perspective view of an example of wiring of a vibration device.

[0031] Figure 14 Yes Figure 13 A three-dimensional diagram of a first example of wiring.

[0032] Figure 15 Yes Figure 13 A perspective view of a second example of wiring. DETAILED DESCRIPTION

[0033] Various aspects of the present application are described.

[0034] The vibration device of the first aspect of the present application includes:

[0035] an internal vibration body that amplifies vibration;

[0036] a piezoelectric element connected to one end of a first direction of the internal vibration body, the piezoelectric element generating vibration;

[0037] a light-transmitting body connected to the other end of the first direction of the internal vibration body, the light-transmitting body having an optical axis extending along the first direction; and

[0038] an external vibration body including an attenuation portion and a first connecting portion connected to the light-transmitting body, the attenuation portion extending from the first connecting portion to an outer side of the light-transmitting body along a second direction intersecting the first direction and attenuating vibration,

[0039] the attenuation portion has non-axisymmetry with respect to the optical axis.

[0040] In the vibration device of the first aspect, since the attenuation portion has non-axisymmetry, it is possible to impart tilt to the vibration amplitude of the light-transmitting body, and it is possible to reduce the bias of stress acting on the internal vibration body at the time of vibration.

[0041] The vibration device of the second aspect of the present application is based on the vibration device of the first aspect,

[0042] the attenuation portion has a first attenuation portion and a second attenuation portion located at positions symmetrical with respect to the optical axis in a cross-sectional view along the optical axis,

[0043] a size in the first direction of the first attenuation portion is different from a size in the first direction of the second attenuation portion.

[0044] In the vibration device of the second aspect, it is possible to make the appearance of the vibration device symmetrical.

[0045] The vibration device of the third aspect of the present application is based on the vibration device of the first aspect,

[0046] the attenuation portion has a first attenuation portion and a second attenuation portion located at positions symmetrical with respect to the optical axis in a cross-sectional view along the optical axis,

[0047] a size in the second direction of the first attenuation portion is different from a size in the second direction of the second attenuation portion.

[0048] In the vibration device of the third aspect, since the size in the first direction, that is, the thickness of the attenuation portion can be constant, processing of the external vibration body by cutting, pressing, or the like becomes easy.

[0049] The vibration device of the fourth aspect of the present application is based on the vibration device of the first aspect,

[0050] The attenuation portion has a first attenuation portion and a second attenuation portion located at positions symmetrical with respect to the optical axis in a cross-sectional view along the optical axis,

[0051] The material constituting the first attenuation portion is different from the material constituting the second attenuation portion.

[0052] In the vibration device of the fourth aspect, the appearance of the vibration device can be symmetrical.

[0053] The vibration device of the fifth aspect of the present application is based on the vibration device of any one of the second aspect to the fourth aspect,

[0054] In terms of the amplitude of vibration achieved by the vibration generated in the piezoelectric element, in a case where the second attenuation portion is larger than the first attenuation portion, the first attenuation portion is located at a position on the upper side in the vertical direction than the second attenuation portion.

[0055] In the vibration device of the fifth aspect, foreign matter can be removed more reliably.

[0056] The vibration device of the sixth aspect of the present application is based on the vibration device of any one of the first aspect to the fifth aspect,

[0057] The internal vibration body is located at a position symmetrical with respect to the optical axis.

[0058] In the vibration device of the sixth aspect, the bias of stress acting on the internal vibration body at the time of vibration can be reduced more reliably, and unnecessary vibration due to non-axis symmetry can be suppressed.

[0059] The vibration device of the seventh aspect of the present application is based on the vibration device of any one of the first aspect to the sixth aspect,

[0060] The piezoelectric element is located at a position symmetrical with respect to the optical axis.

[0061] In the vibration device of the seventh aspect, the bias of stress acting on the internal vibration body at the time of vibration can be reduced more reliably, and unnecessary vibration due to non-axis symmetry can be suppressed.

[0062] The vibration device of the eighth aspect of the present application is based on the vibration device of any one of the second aspect to the fourth aspect,

[0063] In the case where the second attenuation portion is larger than the first attenuation portion in terms of amplitude of vibration generated by the piezoelectric element, the wiring is connected to the piezoelectric element from a position that is closer to the first attenuation portion than to the second attenuation portion.

[0064] In the vibration device of the eighth aspect, the wiring disconnection and the sound caused by the vibration of the wiring can be suppressed.

[0065] The vibration device of the ninth aspect of the present application is based on the vibration device of the eighth aspect,

[0066] The wiring includes a shielding portion that can suppress electromagnetic noise.

[0067] In the vibration device of the ninth aspect, the electromagnetic shielding effect with respect to the imaging element can be improved at low cost without additionally adding a member for shielding.

[0068] The vibration device of the tenth aspect of the present application is based on the vibration device of the ninth aspect, and the wiring includes at least two conductive portions that are electrically independent of each other.

[0069] In the vibration device of the tenth aspect, a drive signal can be supplied to the piezoelectric element.

[0070] The vibration device of the eleventh aspect of the present application is based on the vibration device of the tenth aspect,

[0071] The at least two conductive portions include a first conductive portion that is connected to the piezoelectric element in a manner that enables signal transmission and a second conductive portion whose potential is fixed to a constant value,

[0072] The second conductive portion has the same potential as the shielding portion.

[0073] In the vibration device of the eleventh aspect, a potential can be supplied to the piezoelectric element.

[0074] The vibration device of the twelfth aspect of the present application is based on the vibration device of the eleventh aspect,

[0075] The vibration device includes an imaging element that is located on the optical axis inside the internal vibration body,

[0076] The wiring includes a plurality of layers,

[0077] The shielding portion constitutes one of the plurality of layers and is located closer to the imaging element than the first conductive portion and the second conductive portion.

[0078] In the vibration device of the twelfth aspect, noise entering the imaging element circuit can be more reliably suppressed.

[0079] The vibration device of the 13th aspect of the present application is based on the vibration device of the 11th aspect or the 12th aspect,

[0080] The first conductive portion and the second conductive portion are twisted.

[0081] In the vibration device of the 13th aspect, electromagnetic noise can be more reliably suppressed.

[0082] The vibration device of the 14th aspect of the present application is based on the vibration device of any one of the 1st aspect to the 13th aspect,

[0083] The attenuation portion includes:

[0084] A second connecting portion extending from the first connecting portion to the outside of the light-transmissive body in the second direction; and

[0085] A non-axisymmetric portion located closer to the light-transmissive body than the second connecting portion in the first direction, the non-axisymmetric portion being connected to the second connecting portion and having non-axisymmetry with respect to the optical axis.

[0086] In the vibration device of the 14th aspect, non-axisymmetry of the attenuation portion can be easily obtained.

[0087] The vibration device of the 15th aspect of the present application includes:

[0088] A vibration body capable of amplifying vibration;

[0089] A piezoelectric element connected to one end of the first direction of the vibration body, the piezoelectric element being capable of generating vibration;

[0090] A light-transmissive body connected to the other end of the first direction of the vibration body, the light-transmissive body having an optical axis extending in the first direction; and

[0091] An attenuation portion located at a rim of the light-transmissive body in a second direction intersecting the first direction, the attenuation portion connecting the vibration body and the light-transmissive body and configured to attenuate vibration,

[0092] The attenuation portion has non-axisymmetry with respect to the optical axis.

[0093] In the vibration device of the 15th aspect, both the sealing of vibration and the non-axisymmetry of the attenuation portion can be taken into account.

[0094] Hereinafter, one embodiment of the present application will be described with reference to the accompanying drawings. The following description is merely illustrative in nature and is in no way intended to limit the application, the application of the application, or the uses of the application. The drawings are schematic, and the dimensions of the respective figures shown in the drawings may not be consistent with reality.

[0095] like Figure 1 and Figure 2 As shown, the vibration device 1 includes an internal vibrator 7, a piezoelectric element 9, a lens (an example of a light-transmitting body) 5, and an external vibrator 3. The piezoelectric element 9 is connected to one end of the internal vibrator 7 in a first direction (e.g., the Z direction). The lens 5 is connected to the other end of the internal vibrator 7 in the first direction Z. The lens 5 has an optical axis L extending along the first direction Z. The vibration generated by the piezoelectric element 9 is transmitted to the lens 5 via the internal vibrator 7, causing the lens 5 to vibrate. As a result, foreign matter such as water droplets and mud adhering to the lens 5 is removed.

[0096] The internal vibrator 7 is configured to amplify the vibrations generated by the piezoelectric element 9. The internal vibrator 7 is made of, for example, a metal material or ceramic. Examples of the metal material constituting the internal vibrator 7 include stainless steel, aluminum, iron, titanium, and duralumin. The surface of the internal vibrator 7 may be subjected to a surface treatment such as oxidation or anodizing to improve the adhesion of the adhesive. For example, by rendering the surface of the internal vibrator 7 black through surface treatment, it is possible to prevent a reduction in optical performance due to diffuse reflection of light.

[0097] In this embodiment, as an example, the internal vibrator 7 is a cylindrical body and is located symmetrically with respect to the optical axis L. The internal vibrator 7 includes a first portion 71 that contacts the lens 5, a second portion 72 on which the piezoelectric element 9 is mounted, and a third portion 73 that connects the first portion 71 and the second portion 72. The first portion 71 and the second portion 72 have a cylindrical shape extending along the first direction Z. The second portion 72 is configured to vibrate along with the vibration of the piezoelectric element 9, and the plate thickness of the second portion 72 (i.e., the dimension in the first direction Z) is greater than the plate thickness of the first portion 71 and the third portion 73. As a result, the vibration of the piezoelectric element 9 can be more effectively transmitted to the lens 5. The third portion 73 has a cross-sectional shape that is approximately S-shaped, and is configured to support the first portion 71 and transmit the vibration of the second portion 72 to the first portion 71.

[0098] The first portion 71, the second portion 72, and the third portion 73 may be formed integrally or separately. The maximum outer dimension of the third portion 73 (i.e., the maximum dimension in a second direction (e.g., the X direction) intersecting the first direction Z) is larger than the maximum outer dimension of the first portion 71, and the maximum outer dimension of the second portion 72 is larger than the maximum outer dimension of the third portion 73. This allows the vibration of the piezoelectric element 9 to be efficiently transmitted to the lens 5.

[0099] The external vibrator 3 is configured to prevent the vibration of the internal vibrator 7 from being released outside the lens 5, thereby effectively transmitting the vibration to the lens 5. As an example, the external vibrator 3 is configured to cover the entire internal vibrator 7, thereby protecting the internal vibrator 7 from external influences. The external vibrator 3 is made of a metal material such as stainless steel, aluminum, iron, titanium, or duralumin, or a resin.

[0100] As an example, the external vibrator 3 has a substantially quadrangular prism shape and includes a first connecting portion 31 , a damping portion 33 , and a fixing portion 35 .

[0101] like Figure 2 As shown, the first connecting portion 31 extends from the end of the attenuation portion 33 in the second direction X, which is close to the internal vibrator 7, along the first direction Z and away from the piezoelectric element 9. In this embodiment, the first connecting portion 31 includes a plate-shaped portion 311 and a protrusion 312. The plate-shaped portion 311 extends from the attenuation portion 33 in the first direction Z. The protrusion 312 is located at the end of the plate-shaped portion 311 away from the attenuation portion 33 in the first direction Z. The protrusion 312 protrudes from the first connecting portion 31 in the second direction X and in a direction close to the lens 5. The edge of the lens 5 is sandwiched between the protrusion 312 and the first portion 71 of the internal vibrator 7.

[0102] The attenuation portion 33 extends from the first connection portion 31 toward the outside of the lens 5 along the second direction X and attenuates vibration generated by the piezoelectric element 9. The attenuation portion 33 is thinner than the fixing portion 35 and thus has spring characteristics.

[0103] The attenuation portion 33 has a non-axisymmetric property with respect to the optical axis L. In this embodiment, Figure 2 and Figure 3 As shown, the attenuation portion 33 includes a first attenuation portion 331 and a second attenuation portion 332 located symmetrically with respect to the optical axis L in a cross-sectional view along the optical axis L. A dimension D1 in the first direction Z (i.e., a thickness dimension) of the first attenuation portion 331 is different from a dimension D2 in the first direction Z of the second attenuation portion 332.

[0104] Figures 1 to 3 The vibration device 1 shown is configured, for example, such that the thickness dimension D1 of the first attenuation portion 331 is greater than the thickness dimension D2 of the second attenuation portion 332. Specifically, the surface of the first attenuation portion 331 facing the lens 5 in the first direction Z and the surface of the second attenuation portion 332 facing the lens 5 in the first direction Z are located on a substantially coplanar surface. Meanwhile, the surface of the first attenuation portion 331 facing the piezoelectric element 9 in the first direction Z is located closer to the piezoelectric element 9 than the surface of the second attenuation portion 332 facing the piezoelectric element 9 in the first direction Z.

[0105] In this case, the first attenuation portion 331 has a smaller amplitude than the second attenuation portion 332 in terms of the amplitude of the vibration generated by the piezoelectric element 9. For example, by arranging the vibration device 1 so that the first attenuation portion 331 is located vertically above the second attenuation portion 332, it is possible to facilitate the sliding of foreign matter off the lens 5.

[0106] In this embodiment, if Figure 2 As shown, the wiring 100 is connected to the piezoelectric element 9 at a position where the distance from the first attenuation portion 331 is smaller than the distance from the second attenuation portion 332, and a voltage is applied to the piezoelectric element 9 via the wiring 100. By connecting the wiring 100 from the first attenuation portion 331 side, where the amplitude is smaller, disconnection of the wiring 100 and noise caused by vibration of the wiring 100 can be suppressed.

[0107] The relationship between the impedance and frequency of the vibration device 1 having asymmetry and the relationship between the impedance and frequency of the vibration device having symmetry are shown in FIG. Figure 4 .exist Figure 4 In FIG. 1 , the solid line represents the relationship between the impedance and frequency of the vibration device 1, and the dotted line represents the relationship between the impedance and frequency of the axisymmetric vibration device. The axisymmetric vibration device has the same structure as the vibration device 1 except that the thickness dimension D1 of the first attenuation part 331 and the thickness dimension D2 of the second attenuation part 332 are the same. Figure 4 As shown, compared to an axially symmetrical vibration device, the minimum impedance value (=resonant resistance value) of vibration device 1 is smaller, and the loss due to resistance is smaller. In other words, in vibration device 1, the amplitude of lens 5 during vibration can be tilted without increasing the resonant resistance value of internal vibrator 7. "Tilting the amplitude of lens 5" means creating areas on the surface of lens 5 where lens 5 vibrates with a larger amplitude and areas where lens 5 vibrates with a smaller amplitude.

[0108] The fixing portion 35 includes a node that suppresses vibration to be less than 1 / 100 of the displacement of the lens 5 , thereby suppressing vibration propagation to components connected to the fixing portion 35 (eg, a housing housing an imaging element and a lens assembly).

[0109] The larger the volume of the fixing portion 35, the more the vibration of the fixing portion 35 can be suppressed. However, when miniaturizing the vibration device 1, it is difficult to simply increase the size of the fixing portion 35. The fixing portion 35 of the present embodiment has a substantially quadrilateral outer shape. By configuring in this manner, the volume of the fixing portion 35 can be increased without increasing the size of the vibration device 1. For example, the volume of a 25 mm × 25 mm cube is larger than the volume of a cylindrical shape with a diameter of 25 mm. The external vibrating body 3 is made of a material having a lower Young's modulus than that of the internal vibrating body 7. By configuring in this manner, the vibration attenuation achieved by the attenuation portion 33 can be increased.

[0110] The lens 5 is composed of glass, for example. The upper surface of the lens 5 has a convex shape, and a waterproof coating and an antireflection film (AR coating) are applied to the surface, for example. The surface of the lens 5 on the optical imaging surface side is composed of a flat portion 51 and a concave portion 52. The flat portion 51 is connected to the first portion 71 of the inner vibration body 7 by an adhesive, for example.

[0111] The piezoelectric element 9 is composed of a piezoelectric body and an electrode, and is capable of generating vibration. The piezoelectric body is composed of a suitable piezoelectric ceramic such as barium titanate (BaTi03), lead titanate-zirconate (PZT: PbTi03-PbZr03), lead titanate (PbTi03), lead metaniobate (PbNb20g), bismuth titanate (Bi4Ti30i3), (K, Na)Nb03, or a suitable piezoelectric single crystal such as LiTa03or LiNb03, for example. The electrode is composed of Ni, Ag, Au, or the like, for example. 12

[0112] In the present embodiment, the piezoelectric element 9 has a ring shape when viewed along the first direction Z, and is located at a position symmetrical with respect to the optical axis L. The piezoelectric element 9 is connected to the second portion 72 of the inner vibration body 7 by an adhesive, for example.

[0113] The adhesive between the lens 5 and the inner vibration body 7 and the adhesive between the piezoelectric element 9 and the inner vibration body 7 are composed of an epoxy resin, for example. By using an adhesive having a high Young's modulus, the transmission loss of vibration between the two members can be reduced.

[0114] The vibration device 1 can exert the following effects.

[0115] The vibration device 1 includes an inner vibration body 7 capable of amplifying vibration, a piezoelectric element 9 connected to one end of the first direction Z of the inner vibration body 7, the piezoelectric element 9 being capable of generating vibration, a lens 5 connected to the other end of the first direction Z of the inner vibration body 7, the lens 5 having an optical axis L extending along the first direction Z, and an outer vibration body 3. The outer vibration body 3 includes an attenuation portion 33 extending from the first connecting portion 31 to the outside of the lens 5 along the second direction X and attenuating vibration, and a first connecting portion 31 connected to the lens. The attenuation portion 33 has non-axial symmetry with respect to the optical axis L. According to such a structure, the amplitude of the lens 5 at the time of vibration can be tilted, and the bias of the stress acting on the inner vibration body 7 at the time of vibration can be reduced.

[0116] ​The attenuation portion 33 has a first attenuation portion 331 and a second attenuation portion 332 which are located at positions symmetrical with respect to the optical axis L in a cross-sectional view along the optical axis. The size Dl of the first direction Z of the first attenuation portion 331 and the size D2 of the first direction Z of the second attenuation portion 332 are different. According to such a structure, it is possible to make the appearance of the vibration device 1 symmetrical.

[0117] The internal vibration body 7 is located at a position symmetrical with respect to the optical axis L. According to such a structure, it is possible to more reliably reduce the bias of the stress acting on the internal vibration body at the time of vibration, and it is possible to suppress unwanted vibrations due to non-axisymmetry.

[0118] The piezoelectric element 9 is located at a position symmetrical with respect to the optical axis L. According to such a structure, it is possible to more reliably reduce the bias of the stress acting on the internal vibration body 7 at the time of vibration, and it is possible to suppress unwanted vibrations due to non-axisymmetry.

[0119] The vibration device 1 can be configured as follows.

[0120] The non-axisymmetry of the attenuation portion 33 is not limited to the case where the thickness dimension Dl of the first attenuation portion 331 and the thickness dimension D2 of the second attenuation portion 332 are different. For example, it is also possible to impart non-axisymmetry to the attenuation portion 33 by Figures 5 to 11 the structure shown in the drawing.

[0121] In the vibration device 1 shown in Figure 5 , the size Wl of the second direction X of the first attenuation portion 331 and the size W2 of the second direction X of the second attenuation portion 332 are different. In the vibration device 1 shown in Figure 5 , as an example, the size W2 of the second attenuation portion 332 is larger than the size Wl of the first attenuation portion 331. By being configured thus, it is possible to make the size in the first direction, that is, the thickness of the attenuation portion 33 constant, and therefore, the processing of the external vibration body 3 becomes easy. In this case as well, the first attenuation portion 331 is smaller than the second attenuation portion 332 in terms of the amplitude realized by the vibration generated in the piezoelectric element 9.

[0122] In the vibration device 1 shown in Figure 6 , the material constituting the first attenuation portion 331 and the material constituting the second attenuation portion 332 are different. In the vibration device 1 shown in Figure 6 , as an example, the first attenuation portion 331 is constituted by a material having a Young's modulus larger than the Young's modulus of the second attenuation portion 332. By being configured thus, it is possible to make the appearance of the vibration device 1 symmetrical. In this case as well, the first attenuation portion 331 is smaller than the second attenuation portion 332 in terms of the amplitude realized by the vibration generated in the piezoelectric element 9. It is not limited to the case where the Young's modulus of the first attenuation portion 331 and the Young's modulus of the second attenuation portion 332 are different, and for example, it is also possible to make the density or the mechanical Q value different.

[0123] In the vibration device 1 illustrated in Figure 7 and Figure 8 In the vibration device 1 illustrated in

[0124] In the vibration device 1 illustrated in Figure 7 In the vibration device 1 illustrated in Figure 7 In the vibration device 1 illustrated in

[0125] In the vibration device 1 illustrated in Figure 8 In the vibration device 1 illustrated in

[0126] The non-axisymmetry of the non-axisymmetric portion 42 is not limited to the example illustrated in Figure 7 and Figure 8 For example, the non-axisymmetry of the non-axisymmetric portion 42 can be imparted by making the thickness of the first attenuation portion 421 different from the thickness of the second attenuation portion 422, in a state in which both the first attenuation portion 421 and the second attenuation portion 422 have a substantially quadrangular cross section. The non-axisymmetry of the non-axisymmetric portion 42 can be imparted by making the material of the first attenuation portion 421 different from the material of the second attenuation portion 422.

[0127] In the vibration device 1 illustrated in Figure 9 and Figure 10In the illustrated vibration device 1, the inner surface of the outer vibration body 3 has a substantially circular shape when viewed in the first direction Z, and the second attenuation portion 332 has a substantially circular shape. The center of the inner surface of the outer vibration body 3 substantially coincides with the optical axis L. The center point C of the second attenuation portion 332 does not coincide with the optical axis L and is located at a position different from the optical axis L. By changing the radius dimension of the second attenuation portion 332 and the position of the center point C, the length ratio of the first attenuation portion 331 and the second attenuation portion 332 can be adjusted. The second attenuation portion 332 can be processed, for example, by cutting using a lathe. That is, the asymmetric attenuation portion 33 can also be formed by a general processing means such as a lathe.

[0128] Figure 11 The illustrated vibration device 1 is provided with a piezoelectric element 9 capable of generating vibration, a vibration body 10, a lens 5, and an attenuation portion 60 configured to attenuate vibration. The vibration body 10 is configured to be capable of amplifying vibration. The piezoelectric element 9 is connected to one end of the vibration body 10 in the first direction Z. The lens is connected to the other end of the vibration body 10 in the first direction Z. The vibration body 10 is joined to the piezoelectric element 9 and the lens 5, for example, by an adhesive material.

[0129] Figure 11 The illustrated vibration device 1 is provided with a housing 80 and a photographing portion 82. The housing 80 is a cylindrical shape having an open end 81 and has a substrate 83 at the open end 81. The photographing portion 82 includes a photographing element and is fixed to the substrate 83. In the open end 81 of the housing 80, a vibration structure 20 including the lens 5, the vibration body 10, and the inner layer lens 11 is fixed. The vibration structure 20 has a fixing portion 21 and an inner layer lens barrel 22. The fixing portion 21 fixes the lens 5 and the vibration body 10 to the inner layer lens barrel 22. The inner layer lens barrel 22 is configured to hold the inner layer lens 11 and is fixed to the open end 81 of the housing 80.

[0130] The attenuation portion 60 is located at the edge portion of the lens 5 in the second direction X and connects the vibration body 10 and the lens 5. The attenuation portion 60 is configured, for example, by a member independent of the vibration body 10 and is threadedly fixed to the vibration body 10. Thus, the edge portion of the lens 5 is held by the attenuation portion 60 and the vibration body 10, and the lens 5 can be prevented from falling off. According to such a structure, the vibration body 10 closer to the vibration node than the lens 5 can be fixed by the fixing portion 21, and thus the sealing of vibration and the non-axial symmetry of the attenuation portion 60 can be taken into account.

[0131] The non-axial symmetry of the attenuation portion 33 can also be imparted by combining any of the illustrated structures. Figures 1 to 11 The non-axial symmetry of the attenuation portion 33 can also be imparted by combining any of the illustrated structures.

[0132] The first attenuation portion 331, 421 and the second attenuation portion 332, 422 can be configured as follows: in at least one cross-sectional view along the optical axis L, the first attenuation portion 331, 421 and the second attenuation portion 332, 422 are located at positions non-symmetrical with respect to the optical axis L.

[0133] In terms of the amplitude achieved by the vibration generated in the piezoelectric element 9, in a case where the second attenuation portion 332, 422 is larger than the first attenuation portion 331, 421, the first attenuation portion 331, 421 can be located on a position on the upper side in the vertical direction than the second attenuation portion 332, 422, or can not be located on a position on the upper side in the vertical direction than the second attenuation portion 332, 422.

[0134] The inner vibration body 7 and the piezoelectric element 9 can be located at a position symmetrical with respect to the optical axis L, or can not be located at a position symmetrical with respect to the optical axis L.

[0135] In terms of the amplitude achieved by the vibration generated in the piezoelectric element 9, in a case where the second attenuation portion 332, 422 is larger than the first attenuation portion 331, 421, the wiring 100 can be connected to the piezoelectric element 9 from a position at a distance smaller from the first attenuation portion 331, 421 than from the second attenuation portion 332, 422, or can not be connected to the piezoelectric element 9 from a position at a distance smaller from the first attenuation portion 331, 421 than from the second attenuation portion 332, 422.

[0136] Reference Signs List Figures 12 to 15 An example of the wiring 100 connected to the piezoelectric element 9 will be described.

[0137] In Figure 12 In the vibration device 1 illustrated in FIG. 1, the wiring 100 is connected to the piezoelectric element 9 and the drive circuit 110. The drive circuit 110 is connected to the imaging element substrate 120 with the inter-substrate connector 130. The imaging element 121 is mounted on the imaging element substrate 120. The imaging element 121 is located on the optical axis L inside the inner vibration body 7. The inner layer lens 11 is located between the lens 5 in the first direction Z and the imaging element 121.

[0138] The wiring 100 includes the shielding portion 101 and two conductive portions that are electrically independent from each other. With this wiring 100, it is possible to improve the electromagnetic shielding effect with respect to the imaging element 121 at low cost without additionally adding a member for shielding. In addition, it is possible to supply the drive signal to the piezoelectric element 9 with the two conductive portions.

[0139] For example, the wiring 100 is a flexible substrate including a plurality of layers, and the shielding portion 101 and each of the two conductive portions constitute one layer of the plurality of layers. As an example, as illustrated in FIG. 2, in the wiring 100, the shielding portion 101, the protective layer 104, the base film 105, the two conductive portions, and the protective layer 104 are sequentially stacked. The protective layer 104 and the base film 105 are formed of, for example, polyimide (PI) or a PET film. Figure 13

[0140] ​The shield portion 101 is configured to suppress electromagnetic noise. The shield portion 101 is configured to be located closest to the imaging element 121 among the plurality of layers, and thus electromagnetic noise can be more reliably suppressed from entering the circuit of the imaging element 121. The shield portion 101 is formed of, for example, a copper foil, a permalloy, or iron.

[0141] The two conductive portions (hereinafter referred to as a first conductive portion 102 and a second conductive portion 103) are electrically independent of each other (in other words, are not electrically short-circuited). The first conductive portion 102 and the second conductive portion 103 are formed of, for example, a copper foil, and are located between the base film 105 and the protective layer 104. The first conductive portion 102 is connected to the piezoelectric element 9 in a manner that enables signal transmission. The second conductive portion 103 has the same potential as the shield portion 101. The potential of the second conductive portion 103 is fixed to a constant value including a ground potential. Thus, the piezoelectric element 9 can be supplied with a potential.

[0142] An example of the wiring form of the first conductive portion 102 and the second conductive portion 103 is shown in Figure 14 and Figure 15 .

[0143] In the wiring 100 of Figure 14 , in the portion covered by the protective layer 104, the first conductive portion 102 and the second conductive portion 103 are twisted. By thus twisting the first conductive portion 102 and the second conductive portion 103, electromotive force caused by a magnetic field can be eliminated, and electromagnetic noise can be more reliably suppressed. Furthermore, by providing the shield portion 101 in the wiring 100, the electromagnetic shielding effect with respect to the imaging element 121 can be improved at low cost without additionally adding a member for shielding. In the wiring 100 of Figure 14 , on both sides of the portion in which the first conductive portion 102 and the second conductive portion 103 of the shield portion 101 are twisted, through-holes 104 that penetrate the shield portion 101 are provided. For example, when a single-point connection is made with respect to the second conductive portion 103, current does not flow through the shield portion 101, and thus electromagnetic noise can be more reliably suppressed from entering the circuit of the imaging element 121. Figure 14 The portion of the wiring 100 of Figure 14 that is not covered by the protective layer 104 extends in a direction in which the wiring 100 extends, in a state in which it is separated by a predetermined interval in a width direction orthogonal to the direction in which the wiring 100 extends. In , structures other than the shield portion 101, the first conductive portion 102, and the second conductive portion 103 are omitted.

[0144] In the wiring 100 of Figure 15In the wiring 100, in the portion covered by the protective layer 104, the first conductive portion 102 and the second conductive portion 103 are not twisted. That is, the first conductive portion 102 and the second conductive portion 103 also extend in the direction in which the wiring 100 extends while being separated by a predetermined interval in the width direction in the portion covered by the protective layer 104. Figure 15 In the wiring 100, the number of layers of the electrode layer constituting the first conductive portion 102 and the second conductive portion 103 is one less than that of the wiring 100. Figure 14 In the wiring 100, the number of layers of the electrode layer constituting the first conductive portion 102 and the second conductive portion 103 is one less than that of the wiring 100.

[0145] By appropriately combining any of the various embodiments or modifications described above, the effects possessed by each can be exhibited. Furthermore, combinations of embodiments with each other, combinations of examples with each other, or combinations of embodiments and examples can be made, and combinations of features of different embodiments or examples with each other can also be made.

[0146] The present application has been described in each embodiment with some degree of detail, but the disclosure of these embodiments can vary in structural details, and combinations of elements of each embodiment, changes in order can be made without departing from the scope and spirit of the claimed application.

[0147] Explanation of Reference Numerals

[0148] 1, vibration device; 3, external vibration body; 5, lens; 7, internal vibration body; 9, piezoelectric element; 10, vibration body; 11, inner lens; 21, fixed portion; 22, inner lens barrel; 31, first connecting portion; 33, attenuation portion; 35, fixed portion; 41, second connecting portion; 42, non-axisymmetric portion; 43, gap; 51, flat portion; 52, recessed portion; 60, attenuation portion; 71, first portion; 72, second portion; 73, third portion; 80, housing; 81, open end; 82, photographing portion; 83, substrate; 100, wiring; 311, plate-shaped portion; 312, protruding portion; 331, 421, first attenuation portion; 332, 422, second attenuation portion; 423, inclined surface.

Claims

1. A vibration device, wherein: The vibration device has: an internal vibrating body capable of amplifying the vibrations; a piezoelectric element connected to one end of the internal vibrating body in the first direction, the piezoelectric element being capable of generating vibration; a light-transmitting body connected to the other end of the internal vibrating body in the first direction, the light-transmitting body having an optical axis extending along the first direction; as well as an external vibrating body including a damping portion and a first connecting portion connected to the light-transmitting body, the damping portion being configured to extend from the first connecting portion toward the outside of the light-transmitting body along a second direction intersecting the first direction and to dampen vibration; The attenuation portion has axisymmetry with respect to the optical axis.

2. The vibration device according to claim 1, wherein The attenuation portion includes a first attenuation portion and a second attenuation portion located symmetrically with respect to the optical axis in a cross-sectional view along the optical axis. A dimension of the first attenuation portion in the first direction is different from a dimension of the second attenuation portion in the first direction.

3. The vibration device according to claim 1, wherein The attenuation portion includes a first attenuation portion and a second attenuation portion located symmetrically with respect to the optical axis in a cross-sectional view along the optical axis. A dimension of the first attenuation portion in the second direction is different from a dimension of the second attenuation portion in the second direction.

4. The vibration device according to claim 1, wherein The attenuation portion includes a first attenuation portion and a second attenuation portion located symmetrically with respect to the optical axis in a cross-sectional view along the optical axis. The material constituting the first attenuation part is different from the material constituting the second attenuation part.

5. The vibration device according to any one of claims 2 to 4, wherein When the amplitude of vibration generated in the piezoelectric element is larger than that of the first attenuation portion, the first attenuation portion is located vertically above the second attenuation portion.

6. The vibration device according to any one of claims 1 to 5, wherein The internal vibrating body is located at a symmetrical position with respect to the optical axis.

7. The vibration device according to any one of claims 1 to 6, wherein: The piezoelectric elements are located at positions symmetrical with respect to the optical axis.

8. The vibration device according to any one of claims 2 to 4, wherein: When the amplitude of vibration generated in the piezoelectric element is larger than that of the first attenuation portion, the wiring is connected to the piezoelectric element at a position where the distance from the first attenuation portion is smaller than the distance from the second attenuation portion.

9. The vibration device according to claim 8, wherein The wiring includes a shield portion capable of suppressing electromagnetic noise.

10. The vibration device according to claim 9, wherein The wiring includes at least two conductive portions that are electrically independent of each other.

11. The vibration device according to claim 10, wherein The at least two conductive parts include a first conductive part connected to the piezoelectric element in a signal-transmitting manner and a second conductive part whose potential is fixed to a constant level. The second conductive portion has the same potential as that of the shield portion.

12. The vibration device according to claim 11, wherein The vibration device includes an imaging element located on the optical axis inside the internal vibrator. The wiring comprises a plurality of layers, The shield portion constitutes one of the plurality of layers and is located closer to the imaging element than the first conductive portion and the second conductive portion.

13. The vibration device according to claim 11 or 12, wherein: The first conductive portion and the second conductive portion are twisted into a pair of wires.

14. The vibration device according to any one of claims 1 to 13, wherein: The attenuation portion comprises: a second connecting portion extending from the first connecting portion along the second direction toward the outside of the light-transmitting body; and The non-axisymmetric portion is located closer to the light-transmitting body than the second connecting portion in the first direction, is connected to the second connecting portion, and has non-axisymmetric properties with respect to the optical axis.

15. A vibration device, wherein: The vibration device has: a vibrating body capable of amplifying vibration; a piezoelectric element connected to one end of the vibrating body in the first direction, the piezoelectric element being capable of generating vibration; a light-transmitting body connected to the other end of the vibrating body in the first direction, the light-transmitting body having an optical axis extending along the first direction; as well as an attenuation portion located at an edge of the light-transmitting body in a second direction intersecting the first direction, the attenuation portion connecting the vibrating body and the light-transmitting body and configured to attenuate vibration; The attenuation portion has axisymmetry with respect to the optical axis.

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