Fingerprint identification module and display device

Abstract

The invention provides a fingerprint identification module and a display device. The fingerprint identification module comprises a circuit board, a fingerprint identification chip, a component and a reinforcing plate, the first surface and the second surface of the circuit board are opposite; the fingerprint identification chip is attached to the first surface of the circuit board, the component is attached to the second surface of the circuit board, and the reinforcing plate and the component are located on the same side of the circuit board; wherein the reinforcing plate comprises a containing cavity, and at least part of the components are located in the containing cavity. The fingerprint identification module provided by the invention has relatively small thickness, so that the space occupied by the fingerprint identification module in the display device can be reduced, and the difficulty of integrating the fingerprint identification module into the display device is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and specifically to a fingerprint recognition module and a display device. Background Art

[0002] With the development of display technology, biometric recognition functions have been widely integrated into display devices. For example, facial recognition, iris recognition, fingerprint recognition and other functions are integrated into display devices. Among them, fingerprint recognition function is a more widely used biometric recognition function, which is used to verify user identity, wake up the screen, and make quick payments. Depending on the setting position of the fingerprint recognition chip used to realize the fingerprint recognition function, the fingerprint recognition modes of existing display devices mainly include under-screen fingerprint recognition, side fingerprint recognition and rear fingerprint recognition. Although under-screen fingerprint recognition has a trend of developing into the main recognition mode, side fingerprint recognition and rear fingerprint recognition are still favored by many users and developers due to their advantages such as low cost, high recognition accuracy and fast response speed. Summary of the Invention

[0003] In view of this, the present application provides a fingerprint recognition module and a display device to solve the problems in the prior art.

[0004] In a first aspect, the present application provides a fingerprint recognition module comprising a circuit board, a fingerprint recognition chip, components, and a reinforcement plate; the first side of the circuit board is opposite the second side; the fingerprint recognition chip is bonded to the first side of the circuit board, the components are bonded to the second side of the circuit board, and the reinforcement plate and components are located on the same side of the circuit board; wherein the reinforcement plate includes a receiving cavity, and at least some of the components are located within the receiving cavity. The fingerprint recognition module provided by the present application has a relatively small thickness, thereby reducing the space occupied by the fingerprint recognition module in the display device, thereby reducing the difficulty of integrating the fingerprint recognition module into the display device.

[0005] In an implementation of the first aspect, the accommodating cavity penetrates the reinforcing plate, which reduces the process difficulty of forming the accommodating cavity and improves the compatibility with components.

[0006] In an implementation of the first aspect, the accommodating cavity does not penetrate the reinforcing plate and the opening of the accommodating cavity faces the circuit board. The opening of the accommodating cavity does not significantly affect the strength of the reinforcing plate.

[0007] In an implementation of the first aspect, the accommodating cavity further includes a filling structure.

[0008] In one implementation of the first aspect, the components within the cavity are aligned with an edge region of the circuit board, and the edge region is away from the center region of the circuit board. The cavity and components are positioned away from the primary pressing area of ​​the fingerprint recognition module, thereby improving reliability.

[0009] In an implementation of the first aspect, two edge regions located on opposite sides of the central region are both bonded to the components.

[0010] In an implementation of the first aspect, the fingerprint recognition module further includes a buffer structure, the elastic modulus of the buffer structure is smaller than the elastic modulus of the reinforcement plate; the buffer structure is located on a side of the reinforcement plate away from the circuit board; and along the thickness direction of the fingerprint recognition module, the orthographic projection of the buffer structure covers the orthographic projection of the accommodating cavity.

[0011] In an implementation manner of the first aspect, the circuit board is a flexible printed circuit board.

[0012] In a second aspect, the present application provides a display device, comprising a display module and a fingerprint recognition module as provided in the first aspect.

[0013] In an implementation of the second aspect, the fingerprint recognition module is located on a side or back side of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 A schematic top view of a fingerprint recognition module provided in an embodiment of the present application;

[0016] Figure 2 A bottom-up schematic diagram of a fingerprint recognition module provided in an embodiment of the present application;

[0017] Figure 3 For the Figure 1 、 Figure 2 Schematic cross-section diagram along the A1-A2 direction;

[0018] Figure 4 A schematic diagram of a partial structure of a fingerprint recognition module provided in an embodiment of the present application;

[0019] Figure 5 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application;

[0020] Figure 6 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application;

[0021] Figure 7 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application;

[0022] Figure 8 A schematic top view of a fingerprint recognition module provided in an embodiment of the present application;

[0023] Figure 9 A bottom-up schematic diagram of a fingerprint recognition module provided in an embodiment of the present application;

[0024] Figure 10 For the Figure 8 、 Figure 9 Schematic diagram of the cross section along the B1-B2 direction;

[0025] Figure 11 A schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings. It should be understood that the embodiments described are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0028] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0029] Side fingerprint recognition and rear fingerprint recognition are to integrate the fingerprint recognition module into the side and back of the display device respectively. At this time, the shape and size of the fingerprint recognition module integrated in the display device will affect the difficulty of integrated design. In the pursuit of thin and light display devices with high screen-to-body ratio, the fingerprint recognition module integrated into the display device should have a small size. Based on this, the present application provides a fingerprint recognition module and a display device, wherein the fingerprint recognition module can be integrated into the display device. The embodiment of the present application is described by taking the fingerprint recognition module integrated in the side fingerprint recognition display device as an example.

[0030] Figure 1 A top view of a fingerprint recognition module provided in an embodiment of the present application is shown in FIG. Figure 2This is a bottom-up schematic diagram of a fingerprint recognition module provided in an embodiment of the present application. Figure 3 For the Figure 1 、 Figure 2 Schematic diagram of the cross section along the A1-A2 direction. Figure 1 、 Figure 2 and Figure 3 The fingerprint recognition module 10 includes a circuit board 11, a fingerprint recognition chip 12, and components 13, wherein the fingerprint recognition chip 12 and the components 13 are both attached to the circuit board 11 and electrically connected to each other through the circuit board 11.

[0031] The fingerprint recognition chip 12 is the core structure of the fingerprint recognition module 10, capable of collecting fingerprint information, extracting fingerprint features, and comparing fingerprint features. The fingerprint recognition chip 12 is packaged with at least one of a capacitive sensor, an optical sensor, an ultrasonic sensor, a pressure sensor, etc.

[0032] The component 13 can be electrically connected to the fingerprint recognition chip 12 and can serve as an auxiliary device for the fingerprint recognition function. For example, at least part of the component 13 can realize a filtering function; for example, the component 13 can include at least one of a capacitor, a resistor, and an inductor.

[0033] The circuit board 11 can be used for signal transmission. For example, the circuit board 11 includes metal interconnects, and the fingerprint recognition chip 12 and the components 13 are electrically connected via the metal interconnects in the circuit board 11. Furthermore, the circuit board 11 can also be used to transmit signals between the fingerprint recognition module 10 and peripheral chips. For example, when the fingerprint recognition module is used in a display device, the circuit board 11 can transmit signals between the fingerprint recognition module 10 and the display device's driver chip.

[0034] In the embodiments of this application, Figure 3 As shown, the circuit board 11 includes a first surface and a second surface opposite to each other in the thickness direction, the fingerprint recognition chip 12 is attached to the first surface of the circuit board 11 and the components 13 are attached to the second surface of the circuit board 11. For example, Figure 3 The upper surface of the circuit board 11 is the first surface and the lower surface is the second surface. The fingerprint recognition chip 12 is bonded to the upper surface of the circuit board 11, and the components 13 are bonded to the lower surface of the circuit board 11. When the fingerprint chip and the components 13 are bonded to two opposite surfaces of the circuit board 11, on the one hand, by bonding the components 13 to the circuit board 11, there is no need to package too many components 13 in the fingerprint recognition chip 12, which reduces the difficulty of packaging the fingerprint recognition chip 12. On the other hand, by bonding the fingerprint chip and the components 13 to both sides of the circuit board 11, the utilization rate of the circuit board 11 can be improved, thereby reducing the requirement for the area size of the circuit board 11. On the other hand, the distance between the fingerprint recognition chip 12 and the components 13 is made closer, which reduces the difficulty of electrical connection between the two.

[0035] In addition, if Figure 1-Figure 3 As shown, the fingerprint recognition module 10 further includes a reinforcement plate 14. The reinforcement plate 14 and the components 13 are located on the same side of the circuit board 11. For example, Figure 3 As shown, the reinforcing plate 14 and the components 13 are both located on the underside of the circuit board 11. The reinforcing plate 14 is a substrate with a certain degree of rigidity and is used to support the circuit board 11. Therefore, the reinforcing plate 14 can ensure the structural strength of the fingerprint recognition module 10. When a finger presses the fingerprint recognition module 10, the reinforcing plate 14 can provide strong support for the fingerprint recognition module 10, improving the pressing reliability of the fingerprint recognition module 10. Specifically, the reinforcing plate 14 can be a steel sheet.

[0036] In the embodiment of the present application, the reinforcing plate 14 includes a receiving cavity 140, and at least part of the components 13 is located within the receiving cavity 140. That is, the reinforcing plate 14 is designed with slots to accommodate the components 13. Because the components 13 located on the same side of the circuit board 11 as the reinforcing plate 14 are located within the receiving cavity 140 of the reinforcing plate 14, the height of the components 13 and the reinforcing plate 14 located on the same side of the circuit board 11 can be partially folded in the thickness direction of the fingerprint recognition module 10. Therefore, although the components 13 and the reinforcing plate 14 are arranged on the same side of the circuit board 11, the height of the two in the thickness direction of the fingerprint recognition module 10 can basically be the thickness of the reinforcing plate 14.

[0037] The technical solution provided in this application can make the fingerprint recognition module 10 have a smaller thickness, thereby reducing the space occupied by the fingerprint recognition module 10 in the display device, making it easier to integrate the fingerprint recognition module 10 into the display device.

[0038] In the embodiment of the present application, the circuit board 11 may be a flexible circuit board. Since flexible circuit boards can be relatively thin, using a flexible circuit board as the circuit board 11 in the fingerprint recognition module 10 facilitates a smaller fingerprint recognition module 10. Furthermore, when the fingerprint recognition module 10 is used in a display device, signal transmission between the fingerprint recognition chip 12 and the mainboard or driver circuit in the display device can be facilitated via the flexible circuit board.

[0039] Figure 4 A schematic diagram of the partial structure of a fingerprint recognition module provided in an embodiment of the present application.

[0040] In one embodiment of the present application, Figure 4 and Figure 1-Figure 3As shown, the accommodating cavity 140 extends through the reinforcing plate 14, thus forming a hollow structure extending through the reinforcing plate 14. When the accommodating cavity 140 extends through the reinforcing plate 14, the difficulty in creating the hollowed-out portion of the reinforcing plate 14 is reduced. Furthermore, when the accommodating cavity 140 extends through the reinforcing plate 14, the height requirement for the component 13 located within the accommodating cavity 140 is reduced. Therefore, even if the height of the component 13 protruding from the circuit board 11 is greater than the thickness of the reinforcing plate 14, since the accommodating cavity 140 of the reinforcing plate 14 is a hollow structure extending through the reinforcing plate 14, the component 13 can even pass through the accommodating cavity 140 and protrude from the reinforcing plate 14, or the surface of the component 13 facing away from the circuit board 11 can be flush with the surface of the accommodating cavity 140 facing away from the circuit board 11.

[0041] Figure 5 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application.

[0042] In one embodiment of the present application, Figure 5 As shown, if the accommodating cavity 140 does not penetrate the reinforcing plate 14 and the opening of the accommodating cavity 140 faces the circuit board 11, the accommodating cavity 140 on the reinforcing plate 14 can be a recessed structure that is recessed away from the circuit board 11. When the accommodating cavity 140 does not penetrate the reinforcing plate 14 and the component 13 is placed in the accommodating cavity 140, the accommodating cavity 140 can provide good protection for the component 13. Furthermore, since the accommodating cavity 140 is only a recessed structure, the opening of the accommodating cavity 140 does not significantly affect the strength of the reinforcing plate 14.

[0043] Figure 6 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application is shown in FIG. Figure 7 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application.

[0044] In one embodiment of the present application, Figure 6 and Figure 7 As shown, the accommodating cavity 140 further includes a filling structure 15, which can protect and fix the components 13 in the accommodating cavity 140. The filling structure 15 can be made of organic materials, such as PET, PVC, etc.

[0045] In a technical solution corresponding to this embodiment, as Figure 6 and Figure 7 As shown, the surface of the filling structure 15 facing the circuit board 11 may be flush with the surface of the reinforcing plate 14 facing the circuit board 11 .

[0046] In a technical solution corresponding to this embodiment, as Figure 6As shown, when the accommodating cavity 140 passes through the reinforcing plate 14 , the surface of the filling structure 15 facing away from the circuit board 11 may also be flush with the surface of the reinforcing plate 14 facing away from the circuit board 11 .

[0047] In a technical solution corresponding to this embodiment, as Figure 7 As shown, when the accommodating cavity 140 does not penetrate the reinforcing plate 14 , the accommodating cavity 140 may also be filled with the filling structure 15 .

[0048] In one embodiment of the present application, Figure 3 As shown, the circuit board 11 includes an edge region R1 and a center region R0, wherein the edge region R1 is away from the center region R0 of the circuit board 11 and is located between the center region R0 and the edge of the circuit board 11. In this embodiment, the component 13 located in the accommodating cavity 140 is bonded to the circuit board 11, specifically, to the edge region R1 of the circuit board 11.

[0049] The main pressed area of ​​the fingerprint recognition module 10 corresponds to the middle area R0 of the circuit board 11. When the component 13 is attached to the edge area R1 of the circuit board 11, the main protrusion structure located on the side of the circuit board 11 facing the reinforcement plate 14 is concentrated in the edge area R1 of the circuit board 11, while the middle area R1 of the circuit board 11 is relatively flat. Therefore, the position of the circuit board 11 corresponding to the main pressed area (i.e., the middle area R0) is more likely to obtain strong and uniform support from the reinforcement plate 14. In addition, the component 13 located in the accommodating cavity 140 is in contact with the edge area R1 of the circuit board 11, so the component 13 is arranged away from the main pressed area (i.e., the middle area R0) of the fingerprint recognition module 10, thereby improving the reliability of the contact between the component 13 and the circuit board 11; and the accommodating cavity 140 of the reinforcement plate 14 also avoids the main pressed area (i.e., the middle area R0) of the fingerprint recognition module 10. Therefore, although the accommodating cavity 140 is provided in the reinforcement plate 14, it can still provide ideal support for the circuit board 11 and the fingerprint recognition chip 12 thereon.

[0050] In addition, the fingerprint recognition module 10 can be stacked with other functional modules. The following example illustrates a stacked fingerprint recognition module 10 and a power button module located on one side of the display device's middle frame. When pressed, the power button module can control the display device's on / off state. The power button module is located between the fingerprint recognition module 10 and the middle frame, and the power button module and fingerprint recognition module 10 can be located on the side of the middle frame to enable side fingerprint recognition and side power on / off. When a user needs to control the power button module, they actually need to press the fingerprint recognition module to apply force to the power button module. In this embodiment of the present application, the component 13 is aligned with the edge region R1 of the circuit board 11, which facilitates positioning the power button module so that its projection on the fingerprint recognition module 10 is located in the middle region R0. Pressing the middle region R0 of the fingerprint recognition module 10 can control the force applied to the power button module, and in this case, the mechanical components (such as buttons) in the power control module can be pressed vertically and rebound, improving the reliability of the power button module. Therefore, when the fingerprint recognition module 10 can be stacked with other functional modules, since the components 13 in the fingerprint recognition module 10 are not attached to the middle area R0 of the circuit board 11, it is beneficial to achieve the reliability of the other functional modules.

[0051] In a technical solution corresponding to this embodiment, continue to refer to Figure 3 , the two edge regions R1 on opposite sides of the central region R0 are both in contact with the components 13. The orthographic projections of the accommodating cavities 140 on the circuit board 11 are essentially symmetrical. On the one hand, while ensuring that the components 13 can be placed in the corresponding accommodating cavities 140, the accommodating cavities 140 are relatively dispersed, avoiding the situation where the strength of the reinforcing plate 14 near the accommodating cavities 140 is significantly reduced due to the large area of ​​the accommodating cavities 140. On the other hand, the components 13 are relatively flexibly placed in the corresponding accommodating cavities 140, making it easier for the components 13 to achieve metal interconnection with the fingerprint recognition chip 12.

[0052] Figure 8 A top view of a fingerprint recognition module provided in an embodiment of the present application is shown in FIG. Figure 9 This is a bottom-up schematic diagram of a fingerprint recognition module provided in an embodiment of the present application. Figure 10 For the Figure 8 、 Figure 9 Schematic diagram of the cross section along the B1-B2 direction.

[0053] In one embodiment of the present application, Figure 8 、 Figure 9 and Figure 10The fingerprint recognition module 10 further includes a buffer structure 16, wherein the elastic modulus of the buffer structure 16 is less than that of the reinforcing plate 14, that is, the buffer structure 16 has greater elasticity than the reinforcing plate 14. In this embodiment, the buffer structure 16 is located on the side of the reinforcing plate 14 away from the circuit board 11. Therefore, when the fingerprint recognition module 10 is pressed, the buffer structure 16 can provide a buffer; and when the fingerprint recognition module 10 is integrated into a display device, the buffer structure 16 contacts other structures in the display device, thereby preventing the fingerprint recognition module 10 from damaging other structures in the display device.

[0054] In addition, along the thickness direction of the fingerprint recognition module 10 , the orthographic projection of the buffer structure 16 covers the orthographic projection of the accommodating cavity 140 , so that the buffer structure 16 can provide support for the area around the accommodating cavity 140 in the reinforcement plate 14 .

[0055] Figure 11 A schematic diagram of a display device provided in an embodiment of the present application.

[0056] like Figure 11 As shown, the display device provided in the embodiment of the present application includes a display module 20 and the fingerprint recognition module 10 provided in any of the above embodiments. The display device can be any one of a mobile phone, a computer, a tablet, a watch, etc. The display module 20 can be at least one of a liquid crystal display module (LCD), an organic light-emitting display module (OLED), a micro-light-emitting diode (Micro-LED) display module, a sub-millimeter light-emitting diode (Mini-LED) display module, etc.

[0057] In addition, the fingerprint recognition module 10 can be located on the side or back of the display module 10 .

[0058] According to the technical solution provided in the present application, the fingerprint recognition module 10 in the display device has a relatively small thickness, thereby reducing the space occupied by the fingerprint recognition module 10 in the display device, thereby reducing the difficulty of integrating the fingerprint recognition module 10 into the display device.

Claims

1. A fingerprint recognition module, characterized in that: include: circuit boards; a fingerprint recognition chip, attached to the first surface of the circuit board; Components are bonded to a second surface of the circuit board, the second surface being opposite to the first surface; a reinforcing plate, located on the same side of the circuit board as the components, and comprising a receiving cavity; Wherein, at least part of the components are located in the accommodating cavity.

2. The fingerprint recognition module according to claim 1, characterized in that: The accommodating cavity passes through the reinforcing plate.

3. The fingerprint recognition module according to claim 1, characterized in that: The accommodating cavity does not penetrate the reinforcing plate and an opening of the accommodating cavity faces the circuit board.

4. The fingerprint recognition module according to claim 1, characterized in that: The accommodating cavity also includes a filling structure.

5. The fingerprint recognition module according to claim 1, characterized in that: The components located in the accommodating cavity are fitted with an edge area on the circuit board, and the edge area is away from the central area of ​​the circuit board.

6. The fingerprint recognition module according to claim 5, characterized in that: The two edge areas located on opposite sides of the central area are both fitted with components.

7. The fingerprint recognition module according to claim 1, characterized in that: Also included is a buffer structure, wherein the elastic modulus of the buffer structure is smaller than the elastic modulus of the reinforcing plate; The buffer structure is located on a side of the reinforcing plate away from the circuit board; and along the thickness direction of the fingerprint recognition module, the orthographic projection of the buffer structure covers the orthographic projection of the accommodating cavity.

8. The fingerprint recognition module according to claim 1, characterized in that: The circuit board is a flexible printed circuit board.

9. A display device, characterized in that: It comprises a display module and a fingerprint recognition module as claimed in any one of claims 1 to 8.

10. The display device according to claim 9, wherein The fingerprint recognition module is located on the side or back of the display module.

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