A manual gold return device

Abstract

This invention discloses a manual gold removal device, relating to the field of surface treatment technology for metal materials. A set of wafer clamping components is installed on both sides of the outer wall of the wafer body. A driving component is installed on one side of the outer wall of the set of wafer clamping components. The driving component is slidably installed on both sides of the inner wall of the driving component running track. A wafer carrier is installed between the outer walls of the set of driving components. A through slot is opened at the top of the driving component running track, and a bracket is inserted into the inner wall of the through slot. A bracket is connected to the upper part of the driving component. The driving component is used to drive the wafer clamping components to move the wafer body, and the bracket moves accordingly. A wafer body limiting component is installed on the outer wall of the bracket. The wafer body limiting component is used to protect and limit the rotation direction of the wafer body. A flexible transmission component is rotatably connected inside the wafer body limiting component, and the flexible transmission component acts on the outer wall of the wafer body. The flexible transmission component is used to control the rotation of the wafer body to remove the clamped gold layer.

Description

Technical Field

[0001] This invention relates to the field of surface treatment technology for metallic materials, specifically a manual gold stripping device. Background Technology

[0002] Wafer stripping is a process in semiconductor manufacturing or wafer recycling that removes the gold plating layer (or gold film) from the surface of a wafer. In the "rework and repair" process during manufacturing, if defects occur in the plating layer (such as pinholes, uneven thickness, contamination), photolithography / etching deviations, or design adjustments requiring modification of the plating area after gold plating (such as gold plating in bonding areas or electrodes), the defective gold layer must be removed through the stripping process, and the wafer must be re-plated to avoid direct wafer scrapping (single-crystal silicon wafers and gold plating are costly, and rework can significantly reduce losses). In semiconductor production, scrap wafers are generated (such as those that fail testing or contain edge waste). Their surface gold plating layer contains high-purity gold. The gold can be recovered through the stripping process, enabling resource reuse and reducing production costs.

[0003] Currently, in the wafer stripping process, the removal of gold cannot be precisely controlled, and only the gold layer is removed. This can easily damage the wafer substrate and other metal layers, leading to damage to the wafer structure and causing rework failure.

[0004] Therefore, we propose a manual gold return device to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide a manual gold stripping device, which addresses the problems of traditional manual equipment relying on manual adjustment of the wafer position during the wafer gold stripping process. This results in poor stability and easy misoperation, leading to insufficient gold stripping accuracy and easy damage to the wafer substrate and other metal layers. In addition, the gold stripping solution is mostly for single use, and the waste liquid discharge pollutes the environment and wastes resources. Furthermore, the cleaning process is independent of the gold stripping process, making the operation process cumbersome and inefficient.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a manual gold removal device, comprising a frame, wherein a manual operation mechanism and a gold removal mechanism are provided inside the frame, and the gold removal mechanism is located below the manual operation mechanism;

[0007] The gold removal mechanism includes a wafer body. A set of wafer clamping components is installed on both sides of the outer wall of the wafer body. A driving component is installed on one side of the outer wall of the set of wafer clamping components. The driving component is slidably installed on both sides of the inner wall of the driving component running track. A wafer carrier is installed between the outer walls of the set of driving components. A through slot is opened at the top of the driving component running track. A bracket is inserted into the inner wall of the through slot. A bracket is connected to the upper part of the driving component. The driving component is used to drive the wafer clamping components to move the wafer body, and the bracket moves accordingly. A wafer body limiting component is installed on the outer wall of the bracket. The wafer body limiting component is used to protect and limit the rotation direction of the wafer body. A flexible transmission component is rotatably connected inside the wafer body limiting component. The flexible transmission component acts on the outer wall of the wafer body. The flexible transmission component is used to control the rotation of the wafer body to remove the clamped gold layer.

[0008] Preferably, a guide groove is installed on one side of the outer wall of the running track of the drive component, and the drive component is slidably installed on both sides of the inner wall of the guide groove. The guide groove is opened on both sides of the outer wall of the wafer carrier, and the wafer body is disposed inside the wafer carrier. The wafer body is used for gold stripping processing.

[0009] Preferably, a sieve plate is installed at the bottom of the outer wall of the wafer carrier. The sieve plate is used to filter impurities in the solution. A secondary tank is installed on the outer wall of the sieve plate. The bottom of the secondary tank is connected to a liquid passage pipe, which is used to transport the processed solution. The sieve plate is used to support the wafer carrier.

[0010] Preferably, a liquid collection tank is connected to one side of the outer wall of the liquid pipe, a liquid storage tank is provided on the outside of the wafer carrier, the liquid storage tank is used to store gold stripping solution, and the sub-tank is located between the wafer carrier and the liquid storage tank, and a set of U-shaped water inlet grooves are opened on the top of the liquid storage tank.

[0011] Preferably, the U-shaped inlet channel is used to guide the solution into the sub-tank, and the liquid in the storage tank enters the sub-tank through the U-shaped inlet channel. A slide rail is installed on the top of the sub-tank, and a gap is left between the slide rail and the sub-tank. A pulley is slidably connected to the upper part of the inner wall of the slide rail.

[0012] Preferably, a slide rail is installed on the top of the sub-tank, and a gap is left between the slide rail and the sub-tank. A pulley is slidably connected to the upper part of the inner surface wall of the slide rail, and an ultrasonic cleaning component is installed on one side of the outer surface wall of the pulley. The pulley is used to drive the ultrasonic cleaning component to move.

[0013] Preferably, the ultrasonic cleaning component is used to perform ultrasonic cleaning on the wafer body, and a set of mounting grooves are provided on both sides of the outer wall of the wafer carrier.

[0014] Preferably, a lifting frame is installed on the inner wall of one set of mounting slots, and a chain is connected to the upper part of the outer wall of one set of lifting frames. A sprocket shaft is inserted into the inner wall of the frame, and a set of sprockets is rotatably connected to the outer wall of the sprocket shaft, and the chain operates on the sprockets.

[0015] Preferably, one end of the chain is connected to the lifting frame, and the other end is controlled by a worker. The chain is used to drive the lifting frame to move up and down. A set of guide positioning plates is installed on the inner surface wall of the frame, and a guide rail is opened on one side of the outer surface wall of the set of guide positioning plates. The chain runs inside the guide rail.

[0016] Preferably, the guide rail is used to guide the operation of the chain, the inside of the liquid storage tank is connected to a liquid delivery pipe, the liquid delivery pipe is used to deliver the gold stripping solution, one end of the liquid delivery pipe is connected to a pump, one side of the pump is connected to a suction pipe, and one end of the suction pipe is connected to a liquid storage tank.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. This invention achieves precise control of the wafer gold stripping process through the coordinated design of a manual operation mechanism and a gold stripping mechanism. By pulling the chain, the operator can smoothly raise and lower the lifting frame with the guidance of the sprocket and guide rail, and accurately adjust the contact depth between the wafer body and the gold stripping solution. At the same time, the drive component slides along the drive component running track and guide groove, which, together with the wafer body limiting component to constrain the wafer rotation direction and the flexible transmission component to precisely control the wafer rotation, removes the gold layer only in the clamping area, effectively avoiding damage to the wafer substrate and other metal layers, and meeting the stringent requirements of rework and high-purity recycling.

[0019] 2. This invention constructs a closed-loop solution system from liquid storage to gold stripping, filtration, and final recovery. The gold stripping solution in the storage tank is pumped and delivered to the storage tank via a pump and delivery pipe. It then flows evenly into the secondary tank and wafer carrier through a U-shaped water inlet channel, ensuring that the wafer is in full contact with the solution. After use, the solution is filtered for impurities by a sieve plate and then flows into the collection tank through a liquid pipe. It can be reused after secondary treatment, reducing the frequency of solution replacement and lowering costs. In addition, the pulley drives the ultrasonic cleaning component to move along the slide rail, which can thoroughly clean the wafer after gold stripping and avoid corrosion from residual solution. The integrated design greatly improves the continuity and efficiency of operation. Attached Figure Description

[0020] Figure 1 This is a perspective view of the main structure of a manual gold stripping device according to the present invention;

[0021] Figure 2 This is a three-dimensional view of the gold return mechanism in a manual gold return device according to the present invention;

[0022] Figure 3This is a schematic diagram of the installation position of the wafer carrier in a manual gold stripping device according to the present invention;

[0023] Figure 4 This is a three-dimensional view of the installation position structure of the wafer body limiting component and the flexible transmission component in a manual gold stripping device of the present invention;

[0024] Figure 5 This is a perspective view of the gold removal mechanism in a manual gold removal device according to the present invention;

[0025] Figure 6 This is a three-dimensional view of the internal structure of a manual gold removal device according to the present invention.

[0026] Figure 7 This is a three-dimensional exploded view of the manual operating mechanism in a manual gold-removing device according to the present invention;

[0027] Figure 8 This is a schematic diagram showing the installation position of the suction pipe and the storage tank in a manual gold stripping device according to the present invention.

[0028] In the diagram: 1. Frame; 200. Manual operating mechanism; 201. Guide positioning plate; 202. Guide rail; 203. Chain; 204. Sprocket; 205. Sprocket shaft; 206. Lifting frame; 207. Mounting slot; 300. Gold removal mechanism; 301. Main tank; 302. Liquid storage tank; 303. Secondary tank; 304. Infusion pipe; 305. Pump; 306. Suction pipe; 307. Liquid storage tank; 308. U-shaped inlet 309. Water tank; 310. Slide rail; 311. Pulley; 312. Ultrasonic cleaning component; 313. Wafer carrier; 314. Sieve plate; 315. Liquid pipe; 316. Liquid collection tank; 317. Wafer body; 318. Wafer clamping component; 319. Drive component; 320. Drive component running track; 321. Through slot; 322. Support; 323. Wafer body limiting component; 324. Flexible transmission component; 325. Guide slot. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] This invention addresses the problems of insufficient gold removal accuracy, low operating efficiency, and disconnect between cleaning and waste liquid treatment in existing manual gold removal equipment.

[0031] Traditional manual equipment relies on manual adjustment of the wafer position, which is unstable and prone to errors. The gold stripping solution is mostly for single use, and the waste liquid discharge pollutes the environment and wastes resources. The cleaning process is separate from the gold stripping process, and the operation process is cumbersome.

[0032] In order to solve the above problems, this invention sets up a coordinated manual operation mechanism and a gold removal mechanism, combined with a closed-loop solution circulation system, to achieve a unified approach of precise gold removal, efficient operation, and environmentally friendly treatment.

[0033] Please see Figure 1 As shown, the present invention provides a technical solution: a manual gold stripping device, including a frame 1 and a gold stripping mechanism 300, the gold stripping mechanism 300 being located inside and below the frame 1. The gold stripping mechanism 300 adjusts the rotation direction of the wafer body 316 within the gold stripping mechanism 300, and specifically removes the gold layer from the clamping area.

[0034] Preferably, the specific technical solution for the operation of the gold removal mechanism 300 is as follows: The gold removal mechanism 300 includes a wafer body 316 and a wafer carrier 312. A set of wafer clamping components 317 are installed on both sides of the outer wall of the wafer body 316. A drive component 318 is connected to one side of the set of wafer clamping components 317. The drive component 318 is slidably installed in the drive component running track 319. A manual operation mechanism 200 is provided on the upper part of the frame 1. The manual operation mechanism 200 includes a set of guide positioning plates 201. A guide rail 202 is opened on one side of the guide positioning plate 201. A chain 203 is provided in the guide rail 202. The chain 203 is meshed with a sprocket 204. The sprocket 204 is sleeved on the sprocket shaft 205. One end of the chain 203 is connected to a lifting frame 206. The lifting frame 206 is installed in the mounting grooves 207 on both sides of the wafer carrier 312.

[0035] In some embodiments, such as Figures 1-5 and Figure 8As shown, a guide groove 324 is provided on one side of the drive component running track 319. The drive component 318 is slidably connected in the guide groove 324. The guide groove 324 is opened on both sides of the wafer carrier 312. The wafer body 316 is placed inside the wafer carrier 312. A through groove 320 is opened at the top of the drive component running track 319. A bracket 321 is inserted into the through groove 320. The bracket 321 is connected to the upper part of the drive component 318. A wafer body limiting member 322 is installed on the outer wall of the bracket 321. A flexible transmission member 323 is rotatably connected inside the wafer body limiting member 322. The flexible transmission member 323 is in contact with the outer wall of the wafer body 316. The bottom of the wafer carrier 312... A sieve plate 313 is installed on the inner wall of the sub-tank 303. A liquid pipe 314 is connected to the bottom of the sub-tank 303, and one end of the liquid pipe 314 is connected to a collection tank 315. A slide rail 309 is installed on the top of the sub-tank 303, with a gap between the slide rail 309 and the sub-tank 303. A pulley 310 is slidably connected inside the slide rail 309, and an ultrasonic cleaning component 311 is installed on one side of the pulley 310. A liquid storage tank 302 is also provided inside the frame 1, located outside the sub-tank 303. A U-shaped water inlet trough 308 is opened on the top of the liquid storage tank 302. The liquid storage tank 302 is connected to a pump 305 through a liquid delivery pipe 304. The pump 305 (e.g., Figure 8 Pump 305 (a suction pump) is connected to the storage tank 307 via suction pipe 306.

[0036] When using, such as Figures 2-8 As shown, first check the connection status of each component of the equipment to ensure that the storage tank 307 contains sufficient gold stripping solution. The operator starts the control pump 305, and the gold stripping solution is transported to the storage tank 302 through the suction pipe 306 and the delivery pipe 304. Then, it flows evenly into the auxiliary tank 303 through the U-shaped water inlet 308 until the solution level reaches the preset height. Then, the wafer body 316 to be stripped is flexibly fixed by the wafer clamping component 317. Next, the operator (or through a gear structure (existing technology, not shown in the figure) to form a reciprocating drive) pulls the free end of the chain 203. The chain 203 runs along the guide rail 202 on the sprocket 204 (e.g., Figure 7The chain 203 rotates around the sprocket 204 outside the sprocket shaft 205, causing the chain 203 to reciprocate along the vertical trajectory of the guide rail 202, driving the lifting frame 206 to descend smoothly, thereby causing the wafer carrier 312 and the wafer body 316 to descend synchronously into the gold stripping solution in the sub-tank 303. The flexible transmission component 323 is activated to drive the wafer body 316 to rotate slowly (i.e., the wafer body 316 is driven to rotate slowly by the contact friction between the flexible transmission component 323 and the edge of the wafer body 316). During the rotation, the gold layer of the clamping part reacts fully with the gold stripping solution and falls off. According to the gold stripping requirements, the drive component 318 (which consists of a small servo motor and gears) moves along the drive component running track 319 (which consists of a vertical running guide and teeth installed on the inner wall of the vertical running guide; the drive component 318 drives the gear to rotate through the small servo motor and meshes with the teeth, rising along the vertical running guide) and so on. Figure 3 As the drive component 318 rises along the drive component running track 319, it also slides synchronously along the guide groove 324, gradually adjusting the height of the wafer body 316 in the solution. Simultaneously, the wafer body limiting component 322 constrains the rotation direction of the wafer body 316 to prevent deviation. During height adjustment, because the support 321 is mounted on the upper part of the drive component 318, the flexible transmission component 323 mounted on the support 321 rises or falls synchronously with the drive component 318, thus preventing damage to the surface of the wafer body 316. During this period, the pulley 310 moves along the trajectory of the slide rail 309 (the slide rail 309 is a ring structure), aligning the ultrasonic cleaning component 311 mounted on one side of the pulley 310 with the rising... The wafer body 316 is cleaned by the ultrasonic cleaning unit 311 to ensure a clean wafer surface and remove residual gold stripping solution and impurities during the gold stripping process. If the wafer body 316 is located inside, the flexible transmission unit 323 continues to slowly rotate the wafer body 316. While the gold layer in the clamping part fully reacts with the gold stripping solution and falls off, ultrasonic gold stripping is also performed on both sides of the wafer body 316 surface. This prevents the wafer body 316 placed inside other wafer clamping components 317 from not being able to be deeply gold stripped. Impurities in the solution are filtered by the sieve plate 313 at the bottom of the wafer carrier 312. The filtered solution flows into the collection tank 315 through the liquid pipe 314 for storage, facilitating reuse after subsequent processing. After gold stripping is completed, the chain 203 is pulled to lift the wafer carrier 312 to detach it from the solution.

[0037] In some embodiments, such as Figure 1 and Figures 5-8As shown, the frame 1 has a main tank 301 inside, and a liquid storage tank 302 and a secondary tank 303 are both located inside the main tank 301. The inner wall of the main tank 301 is in contact with the outer wall of the liquid storage tank 302, and the outer wall of the secondary tank 303 is separated from the inner wall of the liquid storage tank 302 to form a solution flow channel. The opening end of the U-shaped water inlet trough 308 is connected to the inside of the secondary tank 303 to ensure that the solution in the liquid storage tank 302 can be completely introduced into the secondary tank 303. The guide positioning plate 201 of the manual operation mechanism 200 is fixed to the inner wall of the frame 1 by bolts. The two ends of the sprocket shaft 205 are rotatably connected to the inner wall of the frame 1 to ensure the stability of the sprocket 204 when rotating. The lifting frame 206 and the mounting groove 207 are connected by a snap fastener for easy disassembly and maintenance. The wafer carrier 312 is made of corrosion-resistant material to extend the service life of the equipment.

[0038] When using, such as Figure 2 , Figure 4 and Figure 8 As shown, if gold stripping is required for wafers of different specifications, the appropriate wafer clamping component 317 can be replaced to ensure clamping stability. When the solution in the collection tank 315 reaches a certain volume, it can be purified to remove impurities and reaction products, and then pumped back into the storage tank 307 for recycling, reducing solution waste and environmental pollution. The cleaned wafer body 316 can be raised to a height that is easy to pick up and put down via the lifting frame 206. The wafer clamping component 317 can be released to complete the material removal. During the entire operation, the lifting adjustment is achieved by manually controlling the chain 203. With the precise control of the drive component 318 and the flexible transmission component 323, the gold stripping accuracy can be guaranteed and the wafer substrate can be avoided. At the same time, the closed-loop solution system and integrated cleaning design can improve the operation efficiency and reduce the overall cost.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A manual gold return device, characterized in that: Includes a frame (1), inside which is provided a manual operation mechanism (200) and a gold refund mechanism (300), and the gold refund mechanism (300) is located below the manual operation mechanism (200); The gold removal mechanism (300) includes a wafer body (316). A set of wafer clamping components (317) are installed on both sides of the outer wall of the wafer body (316). A drive component (318) is installed on one side of the outer wall of the set of wafer clamping components (317). The drive component (318) is slidably installed on both sides of the inner wall of the drive component running track (319). A wafer carrier (312) is installed between the outer walls of the set of drive components (318). A through slot (320) is opened at the top of the drive component running track (319). A bracket (321) is inserted into the inner wall of the through slot (320), and the upper part of the drive component (318) is connected to... There is a support (321), and the driving component (318) is used to drive the wafer clamping component (317) to move the wafer body (316), and the support (321) moves accordingly. The outer wall of the support (321) is equipped with a wafer body limiting component (322). The wafer body limiting component (322) is used to protect and limit the rotation direction of the wafer body (316). The wafer body limiting component (322) is internally rotatably connected to a flexible transmission component (323), and the flexible transmission component (323) acts on the outer wall of the wafer body (316). The flexible transmission component (323) is used to control the wafer body (316) to rotate and remove the clamping part of the gold layer.

2. The manual gold withdrawal device according to claim 1, characterized in that: A guide groove (324) is installed on one side of the outer wall of the drive component running track (319), and the drive component (318) is slidably installed on both sides of the inner wall of the guide groove (324). The guide groove (324) is opened on both sides of the outer wall of the wafer carrier (312), and the wafer body (316) is located inside the wafer carrier (312). The wafer body (316) is used for gold stripping.

3. The manual gold withdrawal device according to claim 2, characterized in that: A sieve plate (313) is installed at the bottom of the outer wall of the wafer carrier (312). The sieve plate (313) is used to filter impurities in the solution. A sub-tank (303) is installed on the outer wall of the sieve plate (313). A liquid-passing pipe (314) is connected to the bottom of the sub-tank (303). The liquid-passing pipe (314) is used to transport the processed solution. The sieve plate (313) is used to support the wafer carrier (312).

4. The manual gold withdrawal device according to claim 3, characterized in that: The outer wall of the liquid pipe (314) is connected to a liquid collection tank (315). The outer side of the wafer carrier (312) is provided with a liquid storage tank (302). The liquid storage tank (302) is used to store gold stripping solution. The sub-tank (303) is located between the wafer carrier (312) and the liquid storage tank (302). A set of U-shaped water inlet grooves (308) is opened on the top of the sub-tank (303).

5. The manual gold withdrawal device according to claim 4, characterized in that: The U-shaped inlet channel (308) is used to guide the solution into the sub-tank (303), and the liquid in the storage tank (302) enters the sub-tank (303) through the U-shaped inlet channel (308). A slide rail (309) is installed on the top of the sub-tank (303), and a gap is left between the slide rail (309) and the sub-tank (303). A pulley (310) is slidably connected to the upper part of the inner surface wall of the slide rail (309).

6. The manual gold removal device according to claim 5, characterized in that: A slide rail (309) is installed on the top of the sub-tank (303), and a gap is left between the slide rail (309) and the sub-tank (303). A pulley (310) is slidably connected to the upper part of the inner surface wall of the slide rail (309), and an ultrasonic cleaning component (311) is installed on one side of the outer surface wall of the pulley (310). The pulley (310) is used to drive the ultrasonic cleaning component (311) to move.

7. The manual gold removal device according to claim 6, characterized in that: The ultrasonic cleaning component (311) is used to perform ultrasonic cleaning on the wafer body (316), and a set of mounting grooves (207) are provided on both sides of the outer wall of the wafer carrier (312).

8. The manual gold removal device according to claim 7, characterized in that: A set of mounting slots (207) has a lifting frame (206) installed on its inner surface wall. A chain (203) is connected to the upper part of the outer surface wall of the set of lifting frames (206). A sprocket shaft (205) is inserted into the inner surface wall of the frame (1). A set of sprockets (204) is rotatably connected to the outer surface wall of the sprocket shaft (205), and the chain (203) operates on the sprockets (204).

9. The manual gold removal device according to claim 8, characterized in that: One end of the chain (203) is connected to the lifting frame (206), and the other end is controlled by the staff. The chain (203) is used to drive the lifting frame (206) to rise and fall. A set of guide positioning plates (201) are installed on the inner surface of the frame (1). A guide rail (202) is opened on one side of the outer surface of the set of guide positioning plates (201). The chain (203) runs inside the guide rail (202).

10. The manual gold removal device according to claim 9, characterized in that: The guide rail (202) is used to guide the operation of the chain (203). The inside of the liquid storage tank (302) is connected to the infusion pipe (304), which is used to transport the gold stripping solution. One end of the infusion pipe (304) is connected to the pump (305), one side of the pump (305) is connected to the suction pipe (306), and one end of the suction pipe (306) is connected to the liquid storage tank (307).

Images