Impedance matching method and system of MPCVD equipment, terminal and medium

Abstract

The invention relates to the technical field of microwave impedance matching, and discloses an impedance matching method and system of MPCVD equipment, a terminal and a medium, and the impedance matching method of the MPCVD equipment comprises the steps: obtaining the initial reflection power of the MPCVD equipment during working; if the initial reflection power is greater than a preset threshold value, adjusting the position of a three-pin for multiple times to obtain current reflection power data of the MPCVD equipment; target reflection power is determined according to the current reflection power data, and the target reflection power is smaller than the preset threshold value; and adjusting the three-pin to a target position according to the target reflection power so as to complete impedance matching of the MPCVD equipment. According to the invention, the purpose of high-precision impedance matching can be achieved.

Description

Technical Field

[0001] The present application relates to the field of microwave impedance matching technology, and in particular to an impedance matching method, system, terminal, and storage medium for MPCVD equipment. Background Art

[0002] In MPCVD (Microwave Plasma Assisted Chemical Vapor Deposition) equipment, microwaves are coupled into the reaction chamber via waveguides to excite the gas and form a plasma, which is used to grow high-quality diamond films. To achieve efficient energy transmission and avoid damage to the microwave source, the microwave system must maintain good impedance matching, minimizing reflected power. Traditional equipment commonly uses a "triple stub tuner" for manual adjustment. The operator rotates three metal probes (pins) located on the waveguide to change their insertion depth, thereby adjusting the microwave field distribution and achieving impedance matching. However, this method has several drawbacks: It relies on manual experience, requiring the operator to adjust based on experience and feedback from reflected power values, which is highly subjective and leads to poor consistency. Furthermore, the adjustment accuracy is low, and manual knobs struggle to achieve submillimeter precision, which affects the matching effect.

[0003] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0004] The main purpose of this application is to provide an impedance matching method, system, terminal and medium for MPCVD equipment, aiming to solve the problem of manual adjustment of three pins in MPCVD equipment in the prior art, which leads to impedance mismatch in the microwave system.

[0005] A first aspect of an embodiment of the present application provides an impedance matching method for an MPCVD device, the impedance matching method for an MPCVD device comprising the following steps: Obtain the initial reflected power of the MPCVD equipment when it is working; If the initial reflected power is greater than a preset threshold, the positions of the three pins are adjusted multiple times to obtain current reflected power data of the MPCVD device; determining a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold; The three pins are adjusted to the target position according to the target reflected power to complete the impedance matching of the MPCVD equipment.

[0006] Optionally, in one embodiment of the present application, the current reflected power data includes a first reflected power, a second reflected power, and a third reflected power; The positions of the three pins are adjusted multiple times to obtain current reflected power data of the MPCVD device, specifically including: Adjusting the positions of the three pins for the first time to obtain a first reflected power of the MPCVD device, wherein the first reflected power is less than the initial reflected power; Adjusting the positions of the three pins for a second time to obtain a second reflected power of the MPCVD device; The positions of the three pins are adjusted a preset number of times to obtain at least one third reflected power of the MPCVD device.

[0007] Optionally, in one embodiment of the present application, the first adjustment of the positions of the three pins to obtain the first reflected power of the MPCVD device further includes: Obtaining historical data of the MPCVD device; An adjustment direction of the three pins is determined according to the initial reflected power and the historical data, so as to perform a first adjustment on the positions of the three pins according to the adjustment direction.

[0008] Optionally, in one embodiment of the present application, the positions of the three pins are adjusted for the first time to obtain the first reflected power of the MPCVD device, specifically: Controlling the three pins along the adjustment direction to perform a first front-middle position adjustment at a fixed step size, and controlling the three pins along the adjustment direction to perform a first tail position adjustment at a dynamic step size, to obtain a first reflected power of the MPCVD device, wherein the fixed step size is greater than the dynamic step size; The positions of the three pins are adjusted for the second time to obtain the second reflected power of the MPCVD device, specifically: Controlling the three pins along the adjustment direction to perform a second front-middle position adjustment at a fixed step length, and controlling the three pins along the adjustment direction to perform a second tail position adjustment at a dynamic step length, to obtain a second reflected power of the MPCVD device; The adjusting the positions of the three pins a preset number of times to obtain at least one third reflected power of the MPCVD device specifically includes: If the second reflected power is less than the first reflected power, continuing to control the three pins along the adjustment direction to perform a third front-middle position adjustment at a fixed step size, and controlling the three pins along the adjustment direction to perform a third tail position adjustment at a dynamic step size, to obtain a third reflected power of the MPCVD device; If the second reflected power is greater than the first reflected power, the three pins are controlled in the reverse direction of the adjustment direction to adjust the front and middle positions for the third time at a fixed step size, and the three pins are controlled in the reverse direction of the adjustment direction to adjust the tail position for the third time at a dynamic step size to obtain the third reflected power of the MPCVD equipment.

[0009] Optionally, in one embodiment of the present application, the preset number of times is multiple, and the number of the third reflected powers is multiple; The determining the target reflected power according to the current reflected power data specifically includes: When the first reflected power, the second reflected power, and the third reflected power corresponding to the third position adjustment are all less than a preset threshold, calculate a first difference between the second reflected power and the first reflected power, and calculate a second difference between the third reflected power and the second reflected power; if the first difference and the second difference are both within a preset range, use the minimum value of the first reflected power, the second reflected power, and the third reflected power as the target reflected power; or when multiple consecutive third reflected powers are all less than the preset threshold, calculate the power difference between every two adjacent ones of the multiple consecutive third reflected powers; if the multiple power differences are all within the preset range, use the minimum value of the multiple consecutive third reflected powers as the target reflected power; or The minimum value among the first reflected power, the second reflected power and the plurality of third reflected powers is used as the target reflected power.

[0010] Optionally, in one embodiment of the present application, adjusting the three pins to target positions according to the target reflected power specifically includes: When the target reflected power is the third reflected power of the last time, the current positions of the three pins corresponding to the third reflected power are used as target positions; When the target reflected power is not the third reflected power of the last time, the target positions of the three pins are determined according to the target reflected power, and the three pins are controlled to be adjusted to the target positions.

[0011] Optionally, in one embodiment of the present application, the adjusting the three pins to target positions according to the target reflected power further includes: Obtaining a current process mode of the MPCVD device; The target position is used as the set position corresponding to the current process mode, so that when the MPCVD equipment is in the current process mode next time, the three pins are adjusted to the corresponding set position.

[0012] A second aspect of the embodiments of the present application further provides an impedance matching system for an MPCVD device, wherein the impedance matching system for the MPCVD device is applied to the impedance matching method for the MPCVD device according to any one of the above-mentioned solutions; the impedance matching system for the MPCVD device comprises: Power acquisition module, used to obtain the initial reflected power of the MPCVD equipment when it is working; a power monitoring module, configured to adjust the positions of the three pins multiple times to obtain current reflected power data of the MPCVD device if the initial reflected power is greater than a preset threshold; a power optimization module, configured to determine a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold; The pin adjustment module is used to adjust the three pins to target positions according to the target reflected power to complete the impedance matching of the MPCVD equipment.

[0013] The third aspect of an embodiment of the present application also provides a terminal, wherein the terminal includes: a memory, a processor, and an impedance matching program for an MPCVD device stored in the memory and runnable on the processor, wherein the impedance matching program for the MPCVD device, when executed by the processor, implements the steps of the impedance matching method for the MPCVD device as described above.

[0014] The fourth aspect of the embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores an impedance matching program for an MPCVD device, and when the impedance matching program for the MPCVD device is executed by a processor, the steps of the impedance matching method for the MPCVD device as described above are implemented.

[0015] Beneficial effects: The present application provides an impedance matching method, system, terminal and medium for MPCVD equipment. The present application collects the reflected power data of the MPCVD equipment and electrically controls the three pins to adjust the position, so that the reflected power can be stably controlled, thereby ensuring efficient transmission of microwave energy and achieving the purpose of high-precision impedance matching. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a schematic diagram of the structure of the electric three-pin in the MPCVD equipment of this application; Figure 2 This is a flow chart of a preferred embodiment of the impedance matching method of the MPCVD device of the present application; Figure 3 This is a structural diagram of a preferred embodiment of the impedance matching system of the MPCVD equipment of the present application; Figure 4 This is a structural diagram of a preferred embodiment of the terminal of this application.

[0018] Description of reference numerals: 100. Power acquisition module; 200. Power monitoring module; 300. Power optimization module; 400. Pin adjustment module. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and effects of this application clearer and more specific, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. The described embodiments are only possible technical implementations of this application and are not all possible implementations. Based on the embodiments in this application, those skilled in the art can fully combine the embodiments of this application to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of this application.

[0020] In the related art, manual operation struggles to achieve high-precision adjustment of the three pin positions, resulting in low accuracy. This leads to inaccurate adjustment of microwave reflected power, which in turn affects the quality and consistency of diamond growth. When rapid adjustment of microwave reflected power is required based on process requirements, manual operation is far slower than automated control systems. This slow response can easily lead to missed optimal adjustment opportunities, impacting product quality. Prolonged fine-tuning can easily fatigue operators, especially when frequent adjustments are required. The high labor intensity not only reduces work efficiency but also increases the likelihood of error. Because individual operating habits and judgment criteria may vary, ensuring consistent operation from one operation to the next is difficult, resulting in poor repeatability, a significant challenge for production processes requiring strict parameter control. Purely manual control often lacks real-time data feedback, making it difficult for operators to understand the current working status and results. This lack of real-time monitoring and feedback prevents rapid adjustments. In some situations, such as those involving high temperatures, high pressures, or hazardous substances, manual operation can pose a health and safety risk to the operator. Compared to automated systems, manual control often requires more time to complete the same task, resulting in lower overall production efficiency. During manual operation, the response speed is slow and it is impossible to respond in real time to dynamic changes in the process (such as changes in gas composition, pressure, and temperature); the repeatability is poor, and the adjustment results vary greatly between different batches or different operators, affecting the stability of product quality; the labor intensity is high and there are safety hazards. Operations must be carried out near the microwave area when the equipment is running, which poses a risk of electromagnetic radiation.

[0021] It can be understood that MPCVD, Microwave Plasma Assisted Chemical Vapor Deposition (MPCVD), is a core device used for growing high-quality diamond films, and achieves material deposition through microwave-excited plasma.

[0022] To address the problem of impedance mismatch in the microwave system caused by manual adjustment of the three pins in the MPCVD equipment, this application collects the reflected power data of the MPCVD equipment and electrically controls the three pins to adjust their positions so that the reflected power can be stably controlled, thereby ensuring efficient transmission of microwave energy and achieving high-precision impedance matching.

[0023] The following specific embodiments are used to describe the technical solution of the present application in detail. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0024] like Figure 1As shown, the MPCVD equipment described in the preferred embodiment of this application is equipped with three motorized pins, each connected to a transmission module equipped with a stepper motor and coupling. The motor is fixed to a dedicated bracket on the outer wall of the waveguide, and the output shaft is connected to the original manual lead screw via a flexible coupling, achieving seamless transmission. Combined with a motor with a minimum step angle of 0.005492 degrees, high resolution can be achieved. By utilizing a high-performance closed-loop stepper motor driver, this application supports micro-control (up to 64 subdivisions), ensuring smooth and vibration-free operation and multi-axis synchronous control capabilities.

[0025] Furthermore, the pins, controlled by a motor, move up and down to adjust the microwave reflection path within the resonant cavity and optimize the plasma distribution. A connecting rod connects the rigid components of the three pins, ensuring synchronous movement of the pins. A through-axis stepper motor is used to drive the connecting rod up and down via a screw drive, enabling precise adjustment of the pin position (small lead and high precision). A limit ring is set on the outside of the connecting rod to prevent the pin from moving beyond its travel, protecting the equipment. In the cooling system, a water-cooled copper tube surrounds the pin area, circulating cooling water to remove heat generated by the high-temperature plasma and maintain a stable equipment temperature. A copper tube clamp ensures a reliable connection between the cooling pipe and the cavity, preventing leakage caused by vibration.

[0026] In this application, three pins are arranged in an equilateral triangle, with maximum spacing to improve positioning accuracy. The pin axes are perpendicular to the cavity axis to ensure symmetry in microwave reflection. A stepper motor drives the connecting rod, which moves the three pins up and down synchronously, changing the distribution of the microwave field within the cavity and thus controlling the density and uniformity of the plasma.

[0027] The impedance matching method of the MPCVD device described in the preferred embodiment of the present application is as follows: Figure 2 As shown, the impedance matching method of the MPCVD device includes the following steps: In step S101, the initial reflected power of the MPCVD device during operation is obtained.

[0028] Specifically, after the MPCVD equipment is started, the system reads the initial reflected power in real time through the microwave detection module to determine the current impedance matching state.

[0029] In step S102, if the initial reflected power is greater than a preset threshold, the positions of the three pins are adjusted multiple times to obtain current reflected power data of the MPCVD device.

[0030] Specifically, if the initial reflected power exceeds a preset threshold, the automatic matching algorithm is triggered; otherwise, the algorithm remains in standby mode. It is understood that users can customize the preset threshold to reflect the system's upper limit on reflected power tolerance. It is understood that the preset threshold is a numerical value, and its value can be set based on actual requirements. It can be a percentage (e.g., 5%) or a fixed value, and is not specifically limited here.

[0031] In one possible implementation, the current reflected power data includes a first reflected power, a second reflected power, and a third reflected power. The positions of the three pins are adjusted for a first time to obtain a first reflected power of the MPCVD device, wherein the first reflected power is less than the initial reflected power. The positions of the three pins are adjusted for a second time to obtain a second reflected power of the MPCVD device. The positions of the three pins are adjusted for a preset number of times to obtain at least one third reflected power of the MPCVD device.

[0032] In one possible implementation, before adjusting the positions of the three pins for the first time, historical data of the MPCVD device is obtained; based on the initial reflected power and the historical data, the adjustment direction of the three pins is determined to adjust the positions of the three pins for the first time according to the adjustment direction.

[0033] Specifically, the position of each pin is adjusted sequentially (for example, by slightly moving it up or down) to observe changes in reflected power. If the reflected power decreases in a particular direction after adjustment, it is marked as a favorable direction; if it increases, it is marked as an unfavorable direction. It can be understood that the three pins are adjusted simultaneously, and the feedback from the three directions is integrated to select the globally optimal adjustment path.

[0034] In one possible implementation, during a first adjustment of the three pins, the three pins are controlled along the adjustment direction to perform a first front-middle position adjustment at a fixed step size, and the three pins are controlled along the adjustment direction to perform a first tail position adjustment at a dynamic step size, thereby obtaining a first reflected power of the MPCVD device, wherein the fixed step size is greater than the dynamic step size. During a second adjustment, the three pins are controlled along the adjustment direction to perform a second front-middle position adjustment at a fixed step size, and the three pins are controlled along the adjustment direction to perform a second tail position adjustment at a dynamic step size, thereby obtaining a second reflected power of the MPCVD device.

[0035] During the third adjustment process, if the second reflected power is less than the first reflected power, the three pins are continued to be controlled along the adjustment direction to adjust the front and middle sections for the third time at a fixed step size, and the three pins are controlled along the adjustment direction to adjust the tail section position for the third time at a dynamic step size to obtain the third reflected power of the MPCVD device; if the second reflected power is greater than the first reflected power, the three pins are controlled along the reverse direction of the adjustment direction to adjust the front and middle sections for the third time at a fixed step size, and the three pins are controlled along the reverse direction of the adjustment direction to adjust the tail section position for the third time at a dynamic step size to obtain the third reflected power of the MPCVD device.

[0036] It can be understood that the fixed step size is a larger step size (such as 0.1mm) used in the initial stage to quickly approach the optimal zone; the dynamic step size is that after approaching the optimal zone, the step size gradually decreases (such as 0.01mm) to avoid oscillation.

[0037] Specifically, if the current reflection frequency is less than the previous reflection frequency, the adjustment is continued in the current direction; if the current reflection frequency is greater than or equal to the previous reflection frequency, the adjustment is reversed or the step size is reduced.

[0038] In step S103, a target reflected power is determined according to the current reflected power data, wherein the target reflected power is less than the preset threshold.

[0039] In one possible implementation, the preset number of times is multiple, and the number of the third reflected powers is multiple. When the first reflected power, the second reflected power, and the third reflected power corresponding to the third position adjustment are all less than a preset threshold, the first difference between the second reflected power and the first reflected power is calculated, and the second difference between the third reflected power and the second reflected power is calculated. If the first difference and the second difference are both within a preset range, the minimum value among the first reflected power, the second reflected power, and the third reflected power is used as the target reflected power; or when multiple consecutive third reflected powers are all less than the preset threshold, the power difference between each two adjacent ones of the multiple consecutive third reflected powers is calculated. If the multiple power differences are all within the preset range, the minimum value among the multiple consecutive third reflected powers is used as the target reflected power; or The minimum value among the first reflected power, the second reflected power and the plurality of third reflected powers is used as the target reflected power.

[0040] Specifically, if the reflected power is lower than the threshold for N consecutive times (e.g., 3 times) and the fluctuation is less than the tolerance range (e.g., ±1%), the iteration terminates; or if the maximum number of adjustment steps (e.g., 50 steps) is reached, the iteration terminates to prevent an infinite loop.

[0041] In step S104, the three pins are adjusted to target positions according to the target reflected power to complete the impedance matching of the MPCVD device.

[0042] In one possible implementation, when the target reflected power is the third reflected power of the last time, the current position of the three pins corresponding to the third reflected power is used as the target position; when the target reflected power is not the third reflected power of the last time, the target position of the three pins is determined according to the target reflected power, and the three pins are controlled to adjust to the target position.

[0043] Specifically, when the termination condition is met, it is determined that the matching is completed and the motor movement is stopped.

[0044] In one possible implementation, the current process mode of the MPCVD device is obtained; the target position is used as the set position corresponding to the current process mode, so that when the MPCVD device is in the current process mode next time, the three pins are adjusted to the corresponding set positions.

[0045] Specifically, after the matching is completed, the current three-pin positions and adjustment parameters (such as step size and convergence time) are recorded and saved to the process database for subsequent reuse.

[0046] The specific implementation of this application is described below in conjunction with a specific application scenario.

[0047] In the automatic matching mode, start the MPCVD equipment and ignite the plasma. The system reads the current reflected power r p If r p When the reflected power exceeds the threshold, the automatic matching algorithm is activated. The controller uses the "hill climbing method" to gradually adjust the positions of the three pins to find the minimum point of reflected power. The hill climbing method is a feedback-based successive approximation optimization algorithm. Its core idea is to "adjust the pin position in the direction that can reduce the reflected power, step by step downhill, until a better direction is found." It does not rely on the system model and is simple to implement. It is particularly suitable for engineering problems such as microwave matching with complex input-output relationships and difficult to model. When r p When the reflected power remains below the threshold for a certain period of time, adjustment stops. This threshold is when the reflected power on the touch screen is relatively low and the value does not "jump." Record the optimal parameters for subsequent processes.

[0048] In the preset process mode, users can pre-save multiple sets of "process recipes", including the target positions and matching conditions of the three pins; they can be called with one click under the same process conditions to achieve fast matching.

[0049] In this application, dual limits of software and hardware are set to prevent motor overshoot; the current position is automatically memorized in the event of an abnormal power outage; an electromagnetic compatibility design is adopted, and the motor cable uses shielded twisted pair cable, away from microwave paths; the emergency stop button can immediately cut off the power to all motors.

[0050] This application can significantly improve the matching accuracy, the stepper motor can achieve micron-level positioning, and the reflected power can be stably controlled within 1%; this application has a fast response speed, and the time from startup to completion of matching is shortened from 5-10 minutes manually to 30-60 seconds; this application has high process repeatability, and the matching results between different batches are consistent, which improves the uniformity and quality stability of the diamond film layer; this application can reduce manual dependence, reduce dependence on operating experience, and reduce training costs; this application supports intelligent integration and can be connected to the factory MES system to achieve remote monitoring and data traceability; this application can improve safety, avoid close operation of personnel in a microwave environment, and reduce occupational health risks; this application can extend equipment life and reduce the risk of magnetron damage due to high reflected power.

[0051] Next, an impedance matching system for an MPCVD device according to an embodiment of the present application is described with reference to the accompanying drawings, which is applied to an impedance matching method for an MPCVD device in any one of the above-mentioned schemes.

[0052] Figure 3 It is a structural diagram of the impedance matching system of the MPCVD equipment in an embodiment of the present application.

[0053] like Figure 3 As shown, the impedance matching system of the MPCVD equipment includes: a power collection module 100, a power monitoring module 200, a power optimization module 300 and a pin adjustment module 400.

[0054] Specifically, the power acquisition module 100 is used to obtain the initial reflected power of the MPCVD device when it is working; A power monitoring module 200 is configured to adjust the positions of the three pins multiple times to obtain current reflected power data of the MPCVD device if the initial reflected power is greater than a preset threshold; a power optimization module 300, configured to determine a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold; The pin adjustment module 400 is used to adjust the three pins to target positions according to the target reflected power to complete the impedance matching of the MPCVD equipment.

[0055] Figure 4 This is a diagram of the structure of a terminal provided in an embodiment of the present application. The terminal may include: Memory 501 , processor 502 , and computer programs stored in the memory 501 and executable on the processor 502 .

[0056] When the processor 502 executes the program, the impedance matching method for the MPCVD device provided in the above embodiment is implemented.

[0057] Furthermore, the terminal further includes: The communication interface 503 is used for communication between the memory 501 and the processor 502 .

[0058] The memory 501 is used to store computer programs that can be run on the processor 502 .

[0059] The memory 501 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0060] If the memory 501, processor 502, and communication interface 503 are implemented independently, the communication interface 503, memory 501, and processor 502 can be connected to each other via a bus and communicate with each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EIS) bus. Buses can be divided into address buses, data buses, control buses, etc. For ease of representation, Figure 4 Only one thick line is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0061] Optionally, in a specific implementation, if the memory 501, the processor 502 and the communication interface 503 are integrated on a chip, the memory 501, the processor 502 and the communication interface 503 can communicate with each other through an internal interface.

[0062] The processor 502 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0063] This embodiment also provides a computer-readable storage medium having a computer program stored thereon. When the program is executed by a processor, the impedance matching method of the MPCVD device as described above is implemented.

[0064] One embodiment of the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the Figure 2 The impedance matching method of the MPCVD equipment provided in any embodiment of the corresponding embodiment.

[0065] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this application, "N" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0067] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing a custom logical function or process step, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may be performed in a different order than shown or discussed, including performing functions in a substantially simultaneous manner or in a reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present application pertain.

[0068] The logic and / or steps represented in a flowchart or otherwise described herein, for example, can be considered a sequenced list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable storage medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device). For purposes of this specification, a "computer-readable storage medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (not exhaustive) of computer-readable storage media include the following: an electrical connection with one or more wires (electronic devices), a portable computer disk cartridge (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and programmable read-only memory (EPROM or flash memory), fiber optic devices, and a portable compact disc read-only memory (CDROM). In addition, the computer-readable storage medium may even be paper or other suitable medium on which the program is printed, since the program can be obtained electronically by optically scanning the paper or other medium and then editing, interpreting or processing it in other suitable ways as necessary, and then storing it in a computer memory.

[0069] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiment, the N steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one of the following technologies known in the art or a combination thereof can be used: a discrete logic circuit having logic gate circuits for implementing logical functions on data signals, an application-specific integrated circuit having suitable combinational logic gate circuits, a programmable gate array (PGA), a field-programmable gate array (FPGA), etc.

[0070] Those skilled in the art will understand that all or part of the steps in the method of the above embodiment can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiment.

[0071] In addition, the functional units in the various embodiments of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into a module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0072] The storage medium mentioned above may be a read-only memory, a magnetic disk, or an optical disk, etc. Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application. Persons skilled in the art may make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

[0073] It should be understood that the application of this application is not limited to the above examples. For ordinary technicians in this field, they can make improvements or changes based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An impedance matching method for MPCVD equipment, characterized in that: The impedance matching method of the MPCVD device includes: Obtain the initial reflected power of the MPCVD equipment when it is working; If the initial reflected power is greater than a preset threshold, the positions of the three pins are adjusted multiple times to obtain current reflected power data of the MPCVD device; determining a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold; The three pins are adjusted to the target position according to the target reflected power to complete the impedance matching of the MPCVD equipment.

2. The impedance matching method of MPCVD equipment according to claim 1, characterized in that: The current reflected power data includes a first reflected power, a second reflected power and a third reflected power; The positions of the three pins are adjusted multiple times to obtain current reflected power data of the MPCVD device, specifically including: Adjusting the positions of the three pins for the first time to obtain a first reflected power of the MPCVD device, wherein the first reflected power is less than the initial reflected power; Adjusting the positions of the three pins for a second time to obtain a second reflected power of the MPCVD device; The positions of the three pins are adjusted a preset number of times to obtain at least one third reflected power of the MPCVD device.

3. The impedance matching method of MPCVD equipment according to claim 2, characterized in that: The positions of the three pins are adjusted for the first time to obtain a first reflected power of the MPCVD device, and the method further includes: Obtaining historical data of the MPCVD device; An adjustment direction of the three pins is determined according to the initial reflected power and the historical data, so as to perform a first adjustment on the positions of the three pins according to the adjustment direction.

4. The impedance matching method of the MPCVD equipment according to claim 3, characterized in that: The positions of the three pins are adjusted for the first time to obtain the first reflected power of the MPCVD device, specifically: Controlling the three pins along the adjustment direction to perform a first front-middle position adjustment at a fixed step size, and controlling the three pins along the adjustment direction to perform a first tail position adjustment at a dynamic step size, to obtain a first reflected power of the MPCVD device, wherein the fixed step size is greater than the dynamic step size; The positions of the three pins are adjusted for the second time to obtain the second reflected power of the MPCVD device, specifically: Controlling the three pins along the adjustment direction to perform a second front-middle position adjustment at a fixed step length, and controlling the three pins along the adjustment direction to perform a second tail position adjustment at a dynamic step length, to obtain a second reflected power of the MPCVD device; The adjusting the positions of the three pins a preset number of times to obtain at least one third reflected power of the MPCVD device specifically includes: If the second reflected power is less than the first reflected power, continuing to control the three pins along the adjustment direction to perform a third front-middle position adjustment at a fixed step size, and controlling the three pins along the adjustment direction to perform a third tail position adjustment at a dynamic step size, to obtain a third reflected power of the MPCVD device; If the second reflected power is greater than the first reflected power, the three pins are controlled in the reverse direction of the adjustment direction to adjust the front and middle positions for the third time at a fixed step size, and the three pins are controlled in the reverse direction of the adjustment direction to adjust the tail position for the third time at a dynamic step size to obtain the third reflected power of the MPCVD equipment.

5. The impedance matching method of MPCVD equipment according to claim 2, characterized in that: The preset number of times is multiple, and the number of the third reflected powers is multiple; The determining the target reflected power according to the current reflected power data specifically includes: When the first reflected power, the second reflected power, and the third reflected power corresponding to the third position adjustment are all less than a preset threshold, calculate a first difference between the second reflected power and the first reflected power, and calculate a second difference between the third reflected power and the second reflected power; if the first difference and the second difference are both within a preset range, use the minimum value of the first reflected power, the second reflected power, and the third reflected power as the target reflected power; or when multiple consecutive third reflected powers are all less than the preset threshold, calculate the power difference between every two adjacent ones of the multiple consecutive third reflected powers; if the multiple power differences are all within the preset range, use the minimum value of the multiple consecutive third reflected powers as the target reflected power; or The minimum value among the first reflected power, the second reflected power and the plurality of third reflected powers is used as the target reflected power.

6. The impedance matching method of MPCVD equipment according to claim 5, characterized in that: The adjusting the three pins to the target position according to the target reflected power specifically includes: When the target reflected power is the third reflected power of the last time, the current positions of the three pins corresponding to the third reflected power are used as target positions; When the target reflected power is not the third reflected power of the last time, the target positions of the three pins are determined according to the target reflected power, and the three pins are controlled to be adjusted to the target positions.

7. The impedance matching method for MPCVD equipment according to claim 6, characterized in that: The step of adjusting the three pins to target positions according to the target reflected power further comprises: Obtaining a current process mode of the MPCVD device; The target position is used as the set position corresponding to the current process mode, so that when the MPCVD equipment is in the current process mode next time, the three pins are adjusted to the corresponding set position.

8. An impedance matching system for an MPCVD device, characterized in that: The impedance matching system of the MPCVD device is applied to the impedance matching method of the MPCVD device according to any one of claims 1 to 7; the impedance matching system of the MPCVD device comprises: Power acquisition module, used to obtain the initial reflected power of the MPCVD equipment when it is working; a power monitoring module, configured to adjust the positions of the three pins multiple times to obtain current reflected power data of the MPCVD device if the initial reflected power is greater than a preset threshold; a power optimization module, configured to determine a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold; The pin adjustment module is used to adjust the three pins to target positions according to the target reflected power to complete the impedance matching of the MPCVD equipment.

9. A terminal, characterized in that: The terminal includes: a memory, a processor, and an impedance matching program for an MPCVD device stored in the memory and runnable on the processor. When the impedance matching program for the MPCVD device is executed by the processor, the steps of the impedance matching method for the MPCVD device according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores an impedance matching program for an MPCVD device, and when the impedance matching program for the MPCVD device is executed by a processor, the steps of the impedance matching method for an MPCVD device according to any one of claims 1 to 7 are implemented.

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