A non-standard frame polishing method, device and storage medium

Abstract

Embodiments of the present application provide a polishing method and device for a non-standard frame, and a storage medium. The method comprises: fixing the non-standard frame at a first preset position by a first fixing unit; polishing the non-standard frame once by a first polishing unit to obtain a first frame, wherein the once polishing comprises coarse polishing and medium polishing; fixing two first frames at a second preset position by a second fixing unit after the two first frames are buckled; and controlling a second polishing unit to polish the two first frames synchronously twice to obtain a second frame. The first polishing unit can polish the non-standard frame once to obtain the first frame, and the once polishing comprises coarse polishing and medium polishing, so as to ensure the polishing precision. The second polishing unit can polish the two first frames synchronously twice to obtain the second frame, so as to complete the fine polishing of the two first frames at one time and improve the fine polishing efficiency of the frame.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of frame processing, and in particular to a polishing method and device for non-standard frames and a storage medium. BACKGROUND

[0002] Existing frame polishing is usually performed on standard frames. The polishing of standard frames cannot match the polishing of non-standard frames, and thus the existing polishing technology cannot meet the polishing requirements of non-standard frames. SUMMARY

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] The main purpose of the embodiments of the present application is to provide a polishing method and device for non-standard frames and a storage medium, which can meet the polishing requirements of non-standard frames.

[0005] In a first aspect, the embodiments of the present application provide a polishing method for non-standard frames, applied to a frame polishing device, the frame polishing device comprising a rough polishing module and a fine polishing module, the rough polishing module comprising a first fixing unit and a first polishing unit, the fine polishing module comprising a second fixing unit and a second polishing unit, and the polishing method comprising:

[0006] fixing the non-standard frame at a first preset position by the first fixing unit;

[0007] obtaining a first frame by performing one-time polishing on the non-standard frame by the first polishing unit, the one-time polishing comprising rough polishing and intermediate polishing;

[0008] fixing two first frames at a second preset position by the second fixing unit after the two first frames are buckled;

[0009] obtaining a second frame by controlling the second polishing unit to perform two-time polishing on the two first frames synchronously.

[0010] In some optional embodiments, the first polishing unit comprises a first mechanical arm, the first mechanical arm is connected with a first polishing mechanism, the first polishing mechanism comprises a first polishing wheel and a second polishing wheel; and the obtaining of the first frame by performing one-time polishing on the non-standard frame by the first polishing unit comprises:

[0011] performing rough polishing on the non-standard frame by the first polishing wheel to obtain an intermediate frame;

[0012] performing intermediate polishing on the intermediate frame by the second polishing wheel to obtain the first frame, the polishing degree of the first frame being greater than the polishing degree of the intermediate frame.

[0013] In some optional embodiments, the polishing the non-standard frame once by the first polishing unit to obtain a first frame includes:

[0014] determining a first polishing path and a second polishing path according to the first preset position, the first polishing path representing a movement path of the first polishing wheel, and the second polishing path representing a movement path of the second polishing wheel;

[0015] obtaining frame information representing material information and preset polishing degree information of the non-standard frame;

[0016] determining a first polishing curve atlas and a second polishing curve atlas according to the first polishing path, the second polishing path, and the frame information, the first polishing curve atlas representing a first polishing time, a first polishing pressure, and a first polishing rotating speed of the first polishing wheel on the first polishing path, and the second polishing curve atlas representing a second polishing time, a second polishing pressure, and a second polishing rotating speed of the second polishing wheel on the second polishing path;

[0017] driving the first polishing wheel to move along the first polishing path by the first mechanical arm, and controlling the first polishing wheel to perform rough polishing on the non-standard frame for the first polishing time, the first polishing pressure, and the first polishing rotating speed according to the first polishing curve atlas to obtain the intermediate frame;

[0018] driving the second polishing wheel to move along the second polishing path by the first mechanical arm, and controlling the second polishing wheel to perform middle polishing on the intermediate frame for the second polishing time, the second polishing pressure, and the second polishing rotating speed according to the second polishing curve atlas to obtain the first frame.

[0019] In some optional embodiments, the second polishing unit includes a second mechanical arm, and a second polishing mechanism connected to the second mechanical arm, the second polishing mechanism including a polishing disc; and the controlling the second polishing unit to perform secondary polishing on the two first frames to obtain a second frame includes:

[0020] generating a third polishing path according to the second preset position;

[0021] driving the polishing disc to move along the third polishing path by the second mechanical arm, so that the polishing disc performs secondary polishing on the two first frames to obtain the second frame.

[0022] In some optional embodiments, the second mechanical arm is further provided with a laser ranging unit, and the driving of the polishing disc along the third polishing path by the second mechanical arm comprises:

[0023] In the process of driving the polishing disc along the third polishing path by the second mechanical arm:

[0024] The relative distance between the two first frames is detected in real time by the laser ranging unit;

[0025] The middle position of the relative distance is configured as a standard path;

[0026] The position of the polishing disc is adjusted by the second mechanical arm so that the rotation center of the polishing disc coincides with the standard path.

[0027] In some optional embodiments, the laser ranging unit comprises a first laser device and a second laser device, the first laser device is arranged on a first side of the polishing disc, the second laser device is arranged on a second side of the polishing disc, and a connecting straight line between the first laser device and the second laser device passes through the rotation center of the polishing disc, and the relative distance between the two first frames is detected in real time by the laser ranging unit, comprising:

[0028] The first excitation light is emitted by the first laser device, and the first reflected light between the first excitation light and the first frame is received;

[0029] The first distance from the first laser device to the first frame on the side of the first laser device is determined according to the first reflected light;

[0030] The second excitation light is emitted by the second laser device, and the second reflected light between the second excitation light and the first frame is received;

[0031] The second distance from the second laser device to the first frame on the side of the second laser device is determined according to the second reflected light;

[0032] The straight line distance of the connecting straight line is subtracted from the first distance and the second distance respectively to obtain the relative distance.

[0033] In some optional embodiments, after the position of the polishing disc is adjusted by the second mechanical arm so that the rotation center of the polishing disc coincides with the standard path, it further comprises:

[0034] The first polishing degree of the first frame and the second polishing degree of the second frame are obtained;

[0035] determine a third polishing time, a third polishing pressure and a third polishing rotation speed of the polishing disc according to the first polishing degree, the second polishing degree and the relative distance.

[0036] In some optional embodiments, the determining the third polishing time, the third polishing pressure and the third polishing rotation speed of the polishing disc according to the first polishing degree, the second polishing degree and the relative distance comprises:

[0037] configuring a target polishing degree according to a polishing degree difference between the second polishing degree and the first polishing degree;

[0038] determining a polishing area between the polishing disc and the first frame according to the relative distance;

[0039] determining the third polishing time, the third polishing pressure and the third polishing rotation speed according to the polishing area and the target polishing degree.

[0040] In a second aspect, an embodiment of the present application provides a polishing device for non-standard frame, comprising a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor executes the computer program to implement the polishing method for non-standard frame in the first aspect.

[0041] In a third aspect, a computer storage medium stores computer executable instructions for executing the polishing method for non-standard frame in the first aspect.

[0042] The present application has the following beneficial effects: the first fixed unit is used to fix the non-standard frame at a first preset position; the first polishing unit is used to polish the non-standard frame once to obtain the first frame, and the once polishing includes rough polishing and medium polishing; the second fixed unit is used to fix two first frames at a second preset position after the two first frames are buckled; and the second polishing unit is used to polish the two first frames twice synchronously to obtain the second frame. In the technical solution of the embodiment, the first polishing unit is used to polish the non-standard frame rough and medium before fine polishing, so as to ensure the polishing precision, and the second polishing unit is used to polish the two first frames twice synchronously after the two first frames are buckled and placed at the second preset position, so as to complete the fine polishing of the two first frames at one time and improve the fine polishing efficiency of the frame. Therefore, the present application can improve the polishing precision and efficiency of the non-standard frame.

[0043] Other features and advantages of the present application will be further apparent from the following detailed description, and will not be described in detail herein. The objectives and other advantages of the present application will be realized and attained by the structure particularly pointed out in the description and the appended claims. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of a system platform architecture for performing polishing of non-standard borders according to an embodiment of the present invention;

[0045] Figure 2 This is a flowchart of a polishing method for a non-standard border provided in one embodiment of the present invention;

[0046] Figure 3 This is a schematic diagram of the structure of a coarse polishing module provided in one embodiment of the present invention;

[0047] Figure 4 This is a schematic diagram of the third and fourth borders placed in the second fixing unit according to an embodiment of the present invention;

[0048] Figure 5 This is a cross-sectional schematic diagram of a polishing disc provided in one embodiment of the present invention;

[0049] Figure 6 This is a schematic diagram provided by an embodiment of the present invention, showing the positional relationship between the polishing disc and the third and fourth borders;

[0050] Figure 7 This is a schematic diagram of a laser device measuring the distance between the third and fourth borders according to an embodiment of the present invention;

[0051] Figure 8 This is a schematic diagram of a laser device for measuring the distance between a third or fourth border according to an embodiment of the present invention.

[0052] Figure label:

[0053] System platform architecture 1000, processor 1100, memory 1200;

[0054] First robotic arm 100, first polishing mechanism 110, first polishing wheel 111, second polishing wheel 112;

[0055] First fixed unit 200;

[0056] Second fixed unit 300, third frame 310, fourth frame 320;

[0057] Polishing disc 400, first laser device 410, second laser device 420. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0059] It should be noted that although the functional modules are divided in the device schematic diagram, and the logical sequence is shown in the flowchart, in some cases, the steps shown or described can be performed in a manner different from the module division in the device or the sequence in the flowchart. The terms "first", "second", etc. in the specification, claims or above-described drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0060] The embodiments of the present application will be further described below with reference to the drawings.

[0061] As Figure 1 shown, Figure 1 is a schematic diagram of a system platform architecture for performing a polishing method of a non-standard bezel provided by an embodiment of the present application.

[0062] In Figure 1 the example, the system platform architecture 1000 is provided with a processor 1100 and a memory 1200, wherein the processor 1100 and the memory 1200 can be connected by a bus or other means, Figure 1 for example, by a bus connection in the embodiment.

[0063] The memory 1200, as a kind of non-transient computer readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory 1200 can include a high-speed random access memory, and can also include a non-transient memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transient solid-state memory device. In some embodiments, the memory 1200 can optionally include a memory remotely arranged relative to the processor 1100, and these remote memories can be connected to the bezel highlight device through a network. Examples of the above-mentioned network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0064] Those skilled in the art can understand that the system platform architecture 1000 can be applied to a 5G communication network system and a subsequent evolved mobile communication network system, etc., and the embodiment does not make specific limitation thereto.

[0065] Those skilled in the art can understand that the system platform architecture 1000 shown in the embodiment does not constitute a limitation on the embodiments of the present application, and can include more or fewer components than shown, or combine certain components, or different component arrangements. Figure 1

[0066] Referring to Figure 2 , Figure 2 is a step flowchart of a polishing method of a non-standard bezel provided by the present application; and is applied to Figures 3-8 ​The edge frame polishing device shown includes a rough polishing module and a fine polishing module, the rough polishing module includes a first fixing unit 200 and a first polishing unit, the fine polishing module includes a second fixing unit 300 and a second polishing unit, and the polishing method of the non-standard edge frame of the embodiment of the application can include but is not limited to:

[0067] In step S100, the non-standard edge frame is fixed at a first preset position by the first fixing unit 200.

[0068] It should be noted that the non-standard edge frame of the present application includes a television frame, a computer frame, a vehicle-mounted decorative accessory frame, etc., which is not limited here. The first preset position is the position of the non-standard edge frame for one-time polishing, which is fixed and positioned by the fixing module. The fixing module can be a mold or a movable fixing assembly.

[0069] Specifically, the non-standard edge frame is fixed at the first preset position to prevent the non-standard edge frame from shifting during one-time polishing. The non-standard edge frame is clamped by a mechanical hand or a clamping device with a positioning recognition device and then moved to the first fixing unit 200. The non-standard edge frame is placed at the first preset position by recognizing the positioning mark or placing groove on the first fixing unit 200. The first preset position is matched with the non-standard edge frame, i.e., the same type of non-standard edge frame in the same batch has the same first preset position, so that one-time polishing of the non-standard edge frame can be performed in batches. The non-standard edge frame can be placed in a preset pose and then placed on the first fixing unit 200 after being clamped at the fixed position by a mechanical arm or other clamping device. The non-standard edge frame with a random pose can also be clamped, the pose of the non-standard edge frame is recognized by a pose recognition device on the clamping device, and the corresponding clamping part of the non-standard edge frame is clamped. At the same time, the pose of the non-standard edge frame is adjusted by rotating the mechanical arm, and then the non-standard edge frame is moved to the first fixing unit 200. The specific adjustment method and clamping method are not limited here.

[0070] In step S200, the non-standard edge frame is one-time polished by the first polishing unit to obtain a first edge frame, and the one-time polishing includes rough polishing and medium polishing.

[0071] Specifically, the first polishing unit removes the original defects on the surface of the edge frame and flattens the surface of the non-standard edge frame, so that the first edge frame obtained by one-time polishing meets the corresponding preset polishing degree. The specific preset polishing degree is set according to the demand, which is not limited here.

[0072] The first polishing unit switches to a rough polishing mode when starting a polishing, and the polishing mechanism contacts the frame surface according to a preset track (such as reciprocating swing along the length direction of the frame to cover the entire surface to be polished); during the rough polishing, surface protrusions (such as burrs and oxide scales) are removed through cutting, and uniform scratches are generated; after the rough polishing is completed, verification is performed through visual detection or a surface roughness instrument, and if the standard is reached, the medium polishing is entered. After the first polishing unit switches to the medium polishing mode, the polishing mechanism covers the frame surface with a finer track (such as a spiral or a grid); the medium polishing refines the surface through micro-cutting and polishing to eliminate the traces of rough polishing; after the medium polishing is completed, the surface polishing degree is detected again, and if the standard is reached, the polishing is completed, and the first frame is obtained.

[0073] In some optional embodiments, the first polishing unit comprises a first mechanical arm 100, a first polishing mechanism 110 connected to the first mechanical arm 100, the first polishing mechanism 110 comprising a first polishing wheel 111 and a second polishing wheel 112; the first frame obtained after the non-standard frame is polished by the first polishing unit once comprises: an intermediate frame obtained after the non-standard frame is rough polished by the first polishing wheel 111; the first frame obtained after the intermediate frame is medium polished by the second polishing wheel 112, the polishing degree of the first frame being greater than the polishing degree of the intermediate frame.

[0074] Specifically, referring to Figure 3 , the first polishing unit is composed of a first mechanical arm 100 and a first polishing mechanism 110 on the first mechanical arm 100, and the first polishing is completed by the cooperation of the first mechanical arm 100 and the first polishing mechanism 110.

[0075] The first mechanical arm 100 is responsible for driving the first polishing mechanism 110 (including the first polishing wheel 111 and the second polishing wheel 112) to move to the designated polishing area of the non-standard frame, and adjusting the position, angle and pressure of the polishing wheel according to the shape of the frame. The first mechanical arm 100 is a multi-degree-of-freedom mechanical arm (such as a 6-axis or collaborative robot), which has high-precision positioning and flexible control capability, can adapt to the special-shaped profile (such as arc-shaped edge and bevel edge) of the non-standard frame, and ensures that the polishing wheel is closely attached to the frame surface.

[0076] The first polishing mechanism 110 integrates the first polishing wheel 111 (rough polishing wheel) and the second polishing wheel 112 (medium polishing wheel), which are controlled by independent driving systems (such as servo motors) and can be adjusted in speed (controlled by servo motor), pressure and movement track (the pressure of the polishing wheel on the non-standard frame can be controlled by pressing the first mechanical arm 100), so as to realize the hierarchical polishing of “rough first and fine later”. The first polishing wheel 111 (rough polishing wheel) and the second polishing wheel 112 (medium polishing wheel) are arranged oppositely, and the first polishing wheel 111 and the second polishing wheel 112 can be switched by rotating the first polishing mechanism 110.

[0077] The non-standard frame is rough polished by the first polishing wheel 111 (rough polishing wheel) to obtain an intermediate frame. The first mechanical arm 100 moves according to a preset trajectory (such as along the outer contour of the frame or the inner edge) to attach the first polishing wheel 111 to the polishing surface (such as the front surface or the side surface) of the non-standard frame. For the special-shaped area (such as the circular arc corner), the mechanical arm automatically adjusts the polishing wheel angle (such as 15°-30°) to ensure that there is no dead angle. The first polishing wheel 111 starts at a first rotating speed, and the mechanical arm applies a first initial pressure to make the rough polishing wheel tightly contact the frame surface. The abrasive (such as silicon carbide) removes the surface protruding defects by cutting to produce uniform shallow scratches. The polishing effect is detected in real time by a corresponding detection device (such as a visual sensor or a surface roughness meter). If the local defects are not removed (such as the scratches are too deep), the mechanical arm automatically increases the residence time or the pressure of the area. If the scratches are too deep (affecting the subsequent medium polishing efficiency), the pressure is reduced or the rotating speed is increased (within the abrasive bearing range according to the requirements). When the surface defects are basically removed (such as no obvious burrs or scratches are confirmed by visual detection), and the surface roughness reaches the preset roughness, the rough polishing is completed, and the intermediate frame is obtained.

[0078] The intermediate frame is medium polished by the second polishing wheel 112 (medium polishing wheel) to obtain the first frame. The first mechanical arm 100 rotates the first polishing mechanism 110 to adjust the first polishing wheel 111 and the second polishing wheel 112, so that the second polishing wheel 112 reaches above the intermediate frame and is adjusted to the contact position with the intermediate frame. The second polishing wheel 112 rotates at a second rotating speed, and the mechanical arm applies a second initial pressure to make the aluminum oxide abrasive fill the rough polishing scratches by micro-cutting and polishing, while slightly polishing the surface. For the local scratches (such as the corner area) remaining after rough polishing, the mechanical arm automatically reduces the moving speed to prolong the contact time of the medium polishing wheel in the area. For the smooth area (such as the plane), the moving speed is increased to improve the efficiency. When the medium polishing wheel reduces the surface scratch depth to below the preset depth, and the surface roughness reaches the medium polishing standard, the medium polishing is completed, and the first frame is obtained.

[0079] Through the grading polishing of the rough polishing wheel and the medium polishing wheel, the balance between polishing efficiency and polishing quality is ensured. The high cutting force of the rough polishing wheel can quickly remove most of the defects, reducing the load and wear of the subsequent medium polishing wheel. The medium polishing wheel only needs to process the remaining slight defects, shortening the overall polishing time. The multi-degree-of-freedom design of the first mechanical arm 100 can adapt to the special-shaped structure (such as variable cross-section and inclined angle) of the non-standard frame, and cooperate with the independent control of the double polishing wheels to ensure the uniformity of polishing in complex areas.

[0080] In some optional embodiments, the first frame obtained after the non-standard frame is polished once by the first polishing unit comprises: determining a first polishing path and a second polishing path according to the first preset position, wherein the first polishing path represents a movement path of the first polishing wheel 111, and the second polishing path represents a movement path of the second polishing wheel 112; obtaining frame information representing material information and preset polishing degree information of the non-standard frame; determining a first polishing curve atlas and a second polishing curve atlas according to the first polishing path, the second polishing path, and the frame information, wherein the first polishing curve atlas represents a first polishing time, a first polishing pressure, and a first polishing rotating speed of the first polishing wheel 111 on the first polishing path, and the second polishing curve atlas represents a second polishing time, a second polishing pressure, and a second polishing rotating speed of the second polishing wheel 112 on the second polishing path; driving the first polishing wheel 111 to move along the first polishing path by the first mechanical arm 100, and controlling the first polishing wheel 111 to perform rough polishing on the non-standard frame for the first polishing time, the first polishing pressure, and the first polishing rotating speed according to the first polishing curve atlas, so as to obtain the intermediate frame; and driving the second polishing wheel 112 to move along the second polishing path by the first mechanical arm 100, and controlling the second polishing wheel 112 to perform medium polishing on the intermediate frame for the second polishing time, the second polishing pressure, and the second polishing rotating speed according to the second polishing curve atlas, so as to obtain the first frame.

[0081] Specifically, the first preset position of the present application is the initial fixed position of the non-standard frame in the rough polishing module (such as being fixed on the reference surface of the first fixing unit 200, or being fixed in the mold groove of the first fixing unit 200, and the specific first preset position is not limited).

[0082] Firstly, the moving track of the rough polishing wheel is planned according to the fixed position (first preset position) of the non-standard frame, so as to cover all the polishing surfaces (such as the front surface, side surface, round corner, etc.) of the non-standard frame and avoid the fixed clamps (mold grooves or clamping fixtures) or weak areas (such as groove edges) of the frame. Then, based on the positioning data of the frame in the first fixed unit 200 (such as the 3D profile of the non-standard frame obtained by laser scanning), the boundaries of the polishing area (such as the upper surface edge, inner chamfer, etc.) are extracted. Finally, the historical optimization data of polishing is generated according to the historical polishing data, and the polishing is optimized according to the historical optimization data (that is, the polishing area to be optimized is determined according to the historical polishing data, and the optimization polishing pressure, optimization polishing time and optimization polishing speed of the polishing area to be optimized are determined according to the specific polishing pressure, polishing time and polishing speed in the historical polishing data), such as optimizing the polishing pressure and polishing time of a corner area according to the historical optimization data.

[0083] Second polishing path (middle polishing wheel moving path): The middle polishing wheel needs to be fine processed for local defects (such as deep scratches) or transition areas (such as the junction of the plane and the round corner) after rough polishing, so the path needs to partially overlap or locally encrypt the rough polishing path. The surface defects or polishing degree after rough polishing are identified by a detection device (such as a visual sensor arranged on the first mechanical arm 100), so as to determine the polishing parameters of each area on the surface (that is, the polishing pressure, polishing time and polishing speed in each area) according to the polishing degree or surface defects.

[0084] The moving direction of the middle polishing wheel is usually perpendicular to the rough polishing wheel or the polishing texture of the middle polishing wheel is perpendicular to the polishing texture of the rough polishing wheel, so as to avoid single polishing texture direction on the frame (reduce uneven light reflection) and improve the polishing degree.

[0085] The material information of the frame information is the material of the non-standard frame (such as aluminum alloy, stainless steel, engineering plastic), and different materials determine the hardness, wear resistance and adaptability to abrasive of the non-standard frame, so as to adjust the polishing parameters accordingly: such as high surface hardness of hard materials (such as stainless steel), rough polishing needs greater pressure and lower speed to enhance the cutting force; the middle polishing needs to appropriately reduce the pressure to avoid excessive wear of the abrasive; soft materials (such as aluminum alloy) are easy to produce surface scratches, so the rough polishing pressure needs to be reduced to avoid crushing the material; the middle polishing needs to increase the speed to accelerate the flow of abrasive and reduce the scratches.

[0086] The polishing curve atlas of the present application is a mapping relationship atlas of "path-parameter", which binds each position point (defined by path coordinates) on the path with specific polishing time, pressure and speed, to ensure the predictability and controllability of the polishing process.

[0087] The first polishing curve map is generated: according to the total path length and the movement speed of the mechanical arm, the total polishing time is calculated; for defect-intensive areas (such as long sides), the corresponding preset residence time is increased; according to the polishing pressure range determined by the frame information, a preset high pressure is used in the initial stage to quickly remove defects; the pressure is gradually reduced in the later stage to avoid over-polishing; the rotational speed is kept stable throughout the process to ensure stable cutting force.

[0088] The second polishing curve map is generated: the total time is shorter than that of rough polishing (1 / 2-2 / 3 of rough polishing), and the specific polishing time is determined according to the specific polishing degree, and more time is allocated to key areas (such as defect-intensive sections) (such as 30% of the total time); low pressure is maintained throughout the process to avoid crushing the medium-grit abrasive (such as aluminum oxide); high rotational speed (n=1000-1500 rpm) is maintained throughout the process to utilize the flow of abrasive caused by high-speed rotation of the polishing wheel to refine surface scratches; for brittle materials, the rotational speed needs to be reduced (such as 800-1000 rpm) to avoid edge collapse.

[0089] The polishing is performed by the first mechanical arm 100 driving the polishing wheel. The first mechanical arm 100 serves as an execution mechanism to accurately control the movement and parameter output of the polishing wheel according to the generated curve map, ensuring the matching of "path-parameters". The mechanical arm monitors its position (such as joint angle) in real time through the encoder, compares it with the preset first polishing path (coordinate sequence), adjusts the joint torque through the PID controller, ensures the movement of the polishing wheel along the planned path, and the specific control is not described here. According to the first polishing curve map, the servo motor of the mechanical arm adjusts in real time; the contact force between the polishing wheel and the frame is monitored through the pressure sensor (such as strain sensor), if the actual pressure deviates from the target value (such as target , actual ), the output force of the mechanical arm is adjusted; the rotational speed of the rough polishing wheel is adjusted through the motor driver (such as target 600 rpm, actual 550 rpm) to ensure stable cutting force. The online detection device (such as laser thickness gauge or vision camera) collects the surface roughness (Ra value) and scratch depth of the frame in real time, if the Ra value of a certain area does not meet the standard, the mechanical arm automatically prolongs the residence time of that area (such as 5 seconds).

[0090] The path of the intermediate polishing wheel partially overlaps with that of the rough polishing wheel (such as moving in the vertical direction), the mechanical arm ensures smooth transition of the path through the motion planning algorithm (such as spline interpolation) to avoid vibration caused by sudden turning; according to the second polishing curve map, the mechanical arm is controlled synchronously: an "incremental pressure" strategy (initial pressure , gradually increased to ) is adopted to avoid abrasive splashing caused by sudden loading; the motor frequency of the intermediate polishing wheel is adjusted through the frequency converter to achieve precise control of the rotational speed; for the intermediate polishing target , the online detection device focuses on monitoring the local scratches (such as depth > If the problem is not eliminated, the robot arm automatically increases the rotation speed of the area (e.g., from 1300 rpm to 1400 rpm) or prolongs the contact time (e.g., by 2 seconds).

[0091] In step S300, the two first frames are fixed at the second preset position by the second fixing unit 300.

[0092] Specifically, referring to Figure 4 , the first frame has an opening, and the two first frames are buckled through the opening. Moreover, the second fixing unit 300 is provided with a mold groove matched with the two first frames (i.e., the third frame 310 and the fourth frame 320) after buckling, or a specific fixed clamping assembly. After the two first frames are placed on the second fixing unit 300, the second preset position of the two first frames is fixed due to the mold groove or the specific position of the fixed clamping assembly.

[0093] In step S400, the second polishing unit is controlled to synchronously perform secondary polishing on the two first frames to obtain the second frame.

[0094] Specifically, the single polishing mechanism of the second polishing unit moves along the two buckled first frames and synchronously completes the secondary polishing (fine polishing) of the two first frames in the moving process, thereby improving the polishing efficiency.

[0095] In some optional embodiments, the second polishing unit includes a second robot arm, and a second polishing mechanism is connected to the second robot arm, and the second polishing mechanism includes a polishing disc 400. The control of the second polishing unit to synchronously perform secondary polishing on the two first frames to obtain the second frame includes: generating a third polishing path according to the second preset position; and driving the polishing disc 400 to move along the third polishing path by the second robot arm, so that the polishing disc 400 synchronously performs secondary polishing on the two first frames to obtain the second frame.

[0096] Specifically, referring to Figure 5 and Figure 6, the second mechanical arm can move freely in space, ensuring the freedom of the second polishing mechanism, and the second polishing mechanism completes polishing by installing a polishing disc 400; different polishing discs 400 (such as coarse granularity and ultra-fine granularity) can be switched through a quick-change interface; the second mechanical arm converts the coordinate sequence of the third polishing path into the angle command of each joint through inverse kinematics calculation, and drives the polishing disc 400 to move along the planned trajectory. Through a polishing disc 400, two first frames that are buckled are polished twice (fine polishing) during movement, and the position of the polishing disc 400 is adjusted in real time to ensure the polishing synchronization of the two first frames, so that the fine polishing of the two first frames is completed synchronously, and the fine polishing efficiency is high.

[0097] In some optional embodiments, the second mechanical arm is further provided with a laser ranging unit, and the driving of the polishing disc 400 along the third polishing path by the second mechanical arm comprises: during the driving of the polishing disc 400 along the third polishing path by the second mechanical arm: detecting the relative distance between the two first frames in real time by the laser ranging unit; configuring the middle position of the relative distance as a standard path; adjusting the position of the polishing disc 400 by the second mechanical arm, so that the rotation center of the polishing disc 400 coincides with the standard path.

[0098] Specifically, the laser ranging unit of the present application comprises a laser emitter, a receiver and a signal processor: the laser emitter emits wavelength-stable infrared laser to avoid environmental light interference; the receiver receives reflected laser and converts it into an electrical signal, and the laser emitter and the laser receiver are at the same position or integrated together; the signal processor calculates the distance by phase comparison method or pulse timing method.

[0099] The standard path is the ideal moving trajectory of the rotation center of the polishing disc 400, that is, the center line between the two adjacent edges (such as the upper edge of the third frame 310 and the lower edge of the fourth frame 320, which are the edges of the third frame 310 and the fourth frame 320 after buckling) of the two first frames after buckling. The relative distance obtained by the laser ranging unit can dynamically calculate this middle position. After obtaining the relative distance between the third frame 310 and the fourth frame 320 and the corrected standard path by laser ranging, the posture and position of the polishing disc 400 are adjusted by the second mechanical arm, so that the rotation center coincides with the standard path. The second mechanical arm realizes real-time monitoring of the relative distance between the two first frames and dynamic calculation of the middle position by integrating the laser ranging unit, and adjusts the position of the polishing disc 400 by the motion control of the mechanical arm, so that the rotation center coincides with the standard path. The rotation center of the polishing disc 400 coincides with the middle path, which ensures that the polishing thickness of the mating surface of the two frames is consistent, not only improves the polishing efficiency, but also ensures the polishing consistency of the two first frames.

[0100] In some optional embodiments, the laser ranging unit comprises a first laser device 410 and a second laser device 420, the first laser device 410 is arranged on a first side of the polishing disc 400, the second laser device 420 is arranged on a second side of the polishing disc 400, a connecting straight line between the first laser device 410 and the second laser device 420 passes through the rotation center of the polishing disc 400, the relative distance between the two first frames is detected in real time by the laser ranging unit, comprising: emitting a first excitation light by the first laser device 410, and receiving a first reflected light between the first excitation light and the first frame; determining a first distance from the first laser device 410 to the first frame on the side of the first laser device 410 according to the first reflected light; emitting a second excitation light by the second laser device 420, and receiving a second reflected light between the second excitation light and the first frame; determining a second distance from the second laser device 420 to the first frame on the side of the second laser device 420 according to the second reflected light; and subtracting the straight line distance of the connecting straight line from the first distance and the second distance respectively to obtain the relative distance.

[0101] Specifically, referring to FIG. 7, the first laser device 410 (left) and the second laser device 420 (right) of the laser ranging unit are symmetrically arranged on the two sides of the polishing disc 400, and the connecting straight line (i.e. the straight line connecting the centers of the two laser devices) passes through the rotation center (denoted as point A) of the polishing disc 400. The emission directions of the first laser device 410 and the second laser device 420 are both parallel to the polishing disc 400, and the emitted excitation light passes through the gap between the substrate of the second fixing unit 300 and the polishing disc 400 to reach the third frame 310 or the fourth frame 320.

[0102] The length (denoted as L) of the connecting straight line is the distance between the centers of the two laser devices; the measurement range of each laser device covers the edge region of the corresponding side frame, for example, the left laser covers the edge of the left frame (the third frame 310), and the right laser covers the edge of the right frame (the fourth frame 320). The laser ranging unit measures the distance from the first laser device 410 to the left frame (denoted as L1) ) and the distance from the second laser device 420 to the right frame (denoted as L2) ) respectively through the closed loop process of “emission-reflection-reception”. The first laser device 410 (left) emits a beam of wavelength-stable laser light (such as 635 nm infrared light), which forms a parallel light beam through a collimating lens, irradiates to the edge of the mating surface of the left first frame; the mating surface of the left frame reflects the laser light, and the reflected light converges to a photodetector (such as an APD avalanche photodiode) through the receiving lens of the first laser device 410, and is converted into an electrical signal, so that the first distance L1 is calculated by the corresponding signal processor. The second laser device 420 measures the second distance of the right side frame, and the measurement process is similar to that of the first laser device 410, which will not be described here. Based on the geometric relationship between the connecting straight line and the double distances, the relative distance (denoted as ) of the two first side frames (i.e., the third side frame 310 and the fourth side frame 320) is defined as the positional deviation (such as the left-right offset) thereof in the direction perpendicular to the polishing direction. In combination with the layout of the double laser devices and the measurement values, the relative distance can be derived through the following geometric relationship: let the rotation center of the polishing disc 400 be A, the first distance from the fitting surface edge point B of the left side frame (the third side frame 310) to the center of the first laser device 410 be , the second distance from the fitting surface edge point C of the right side frame (the fourth side frame 320) to the center of the second laser device 420 be , and the relative distance be . Referring to Figure 8 , if the two side frames have no offset (i.e., only the third side frame 310 or the fourth side frame 320 has an edge at this time, and the edge is the edge of the third side frame 310 and the fourth side frame 320 that is not buckled), then , at this time ; otherwise . It can be clearly seen from Figure 7 that when the rotation center A is located at the middle position of , the B point on the third side frame 310 and the C point on the fourth side frame 320 are located on the same concentric circle on the polishing disc 400, thereby ensuring the uniformity of polishing of the third side frame 310 and the fourth side frame 320.

[0103] In some optional embodiments, in order to ensure the calculation accuracy of the relative distance, the potential errors in the laser ranging process need to be compensated and calibrated: geometric error compensation of laser emission and reception. Angle deviation correction: if there is a small angle (such as ) between the laser beam and the side frame fitting surface, the receiving position of the reflected light will be offset, resulting in a distance measurement error . By pre-calibrating the incident angle of the laser beam and introducing an angle compensation factor in the calculation, the error can be reduced. Environmental interference compensation: the propagation speed of laser in air is affected by temperature, and the speed of light c is corrected in real time by integrating a temperature sensor; the refractive index of air is also related to air pressure, which is further corrected by an air pressure sensor; slight vibration of the mechanical arm can cause laser beam jitter, which is controlled by integrating an inertial stabilization platform (such as a gyroscope + piezoelectric ceramic) in the laser device to control the vibration error. Periodically calibrate the distance L between the double laser devices using a high-precision three-coordinate measuring instrument to correct the mechanical drift after long-term use; in combination with a vision camera (which captures the edge profile of the side frame) and laser ranging data, the calculation result of the relative distance is verified through an image registration algorithm (such as SIFT feature matching) to improve reliability.

[0104] In some optional embodiments, after the position of the polishing disc 400 is adjusted by the second mechanical arm so that the center of rotation of the polishing disc 400 coincides with the standard path, the method further comprises: obtaining a first polishing degree of the first frame and a second polishing degree of the second frame; and determining a third polishing time, a third polishing pressure and a third polishing rotation speed of the polishing disc 400 according to the first polishing degree, the second polishing degree and the relative distance.

[0105] Specifically, after the position of the polishing disc 400 is adjusted (i.e., the center of rotation of the polishing disc 400 coincides with the standard path), the third polishing time, the third polishing pressure and the third polishing rotation speed of the polishing disc 400 are dynamically calculated according to the current polishing degree (the first polishing degree) and the target polishing degree (the second polishing degree) of the two first frames and the relative distance, so as to ensure that the surface quality of the two frames meets the standard after synchronous polishing.

[0106] The surface roughness (Ra) ) of the frame is reduced from the first polishing degree (Ra1) ) to the second polishing degree (Ra2 ). In this process, the relative distance (D ) reflects the position deviation of the two frames and determines the uniformity of the coverage of the polishing disc 400 on the two frames. The deviation is compensated by adjusting the parameters to avoid local over-polishing or under-polishing. That is, different position deviations result in different coverage areas, which in turn result in different polishing effects on the third frame 310 and the fourth frame 320. Therefore, the polishing time, the polishing pressure and the polishing rotation speed need to be adjusted for the third frame 310 and the fourth frame 320 with different relative distances, so as to ensure that the polishing degree is uniform in the process of polishing the third frame 310 and the fourth frame 320 by the polishing disc 400, and the uniformity of the polishing degree is good. It is known that if different areas of the third frame 310 and the fourth frame 320 have different polishing degree requirements, the differential polishing control can also be achieved by adjusting the polishing parameters (i.e., the third polishing time, the third polishing pressure and the third polishing rotation speed) of the polishing disc 400.

[0107] The difference (D ) between the first polishing degree (Ra1 ) and the second polishing degree (Ra2 ) determines the total amount of material to be removed (cutting amount), and thus determines the corresponding polishing time or pressure. According to the above content, the relative distance (D The uniformity of contact between the polishing pad 400 and the two borders is affected, and the deviation needs to be compensated by adjusting the polishing parameters. The material properties of the third border 310 and the fourth border 320, as well as the parameters of the polishing pad 400 (such as abrasive particle size and hardness), determine the material removal rate per unit time.

[0108] Based on the above correlation logic, the polishing parameters (third polishing time, pressure, and rotation speed) can be calculated using the following empirical formulas or physical models:

[0109] Third polishing time ( Determining the polishing time and the amount of material to be removed: The pressure is directly proportional to the material removal rate (MRR) and inversely proportional to the current pressure exerted by the polishing disc 400 on the third border 310 and the fourth border 320. ), speed ( Abrasive particle size ( ) and material hardness ( The formula can be expressed as follows:

[0110]

[0111] in, This is an empirical coefficient (related to the 400 polishing pad structure). For the index ( ).

[0112] because The relationship with MRR can be approximated as follows: ,therefore:

[0113]

[0114] If the target is known (as from) Down to , (This can be achieved by pre-storing historical process data) Values, such as aluminum alloy + alumina abrasive. In light of the current pressure Rotation speed The time can be calculated by determining the abrasive particle size G (e.g., 800 mesh). .

[0115] Third polishing pressure ( The determination of the pressure: Pressure directly affects the contact area and cutting force between the polishing pad 400 and the frame. To compensate for the relative distance... Uneven coverage caused by this needs to be addressed according to... Adjust pressure distribution:

[0116]

[0117] in, The standard pressure when there is no deviation. This is the pressure compensation coefficient.

[0118] Third polishing rotation speed ( The determination of the rotational speed: The rotational speed affects the cutting efficiency of the polishing disc 400 and the surface texture direction. To avoid the influence of relative distance... Inconsistent polishing textures caused by this require adjusting the rotation speed according to the material hardness and abrasive properties.

[0119]

[0120] in, For standard speed, This is the speed compensation coefficient.

[0121] After determining the third polishing parameters (third polishing time, pressure, and rotation speed), the second robotic arm needs to dynamically adjust the polishing parameters of the polishing disk 400 through real-time feedback. The specific process is as follows:

[0122] Retrieve the current polish level of the first border from the database. ) and the target polishing degree of the second border ( ),calculate The current relative distance is obtained through the laser ranging unit. Input material properties (e.g., aluminum alloy) and polishing pad parameters (e.g., 800-mesh alumina abrasive), and call the pre-stored process model to calculate. The second robotic arm drives the polishing disc 400 to move along the third path, while simultaneously outputting... Parameters are transmitted to the servo control system; online inspection devices (such as online roughness testers and vision cameras) collect real-time data on the polished area. The value and scratch depth are fed back to the controller. If a certain area is detected... If the value is not met, the controller automatically extends the dwell time of the polishing disc 400 in that area, increases the rotation speed, or increases the pressure; if the relative distance... When changes occur (such as frame displacement due to thermal deformation), the laser ranging unit remeasures and updates. Controller synchronous adjustment and .

[0123] In some optional embodiments, the second robotic arm is equipped with a polishing slurry delivery pipe. The polishing slurry is delivered through this pipe to the area between the polishing disc 400 and the first frame, thereby enhancing the polishing effect and cooling the first frame to reduce the risk of deformation due to high temperatures. After polishing, the polishing slurry is recycled to a circulation device. This device cools the slurry and adds appropriate abrasive particles, chemical additives, pH adjusters, etc., thus circulating the slurry back to the second robotic arm for reuse and preventing waste.

[0124] In some optional embodiments, determining the third polishing time, third polishing pressure, and third polishing rotation speed of the polishing disk 400 based on the first polishing degree, the second polishing degree, and the relative distance includes: configuring a target polishing degree based on the polishing degree difference between the second polishing degree and the first polishing degree; determining a polishing area between the polishing disk 400 and the first frame based on the relative distance; and determining the third polishing time, the third polishing pressure, and the third polishing rotation speed based on the polishing area and the target polishing degree.

[0125] Specifically, the relative distance is obtained through a laser ranging unit. After that, combined with the physical dimensions (diameter D) of the polishing pad 400, the effective coverage area (effective coverage width) of the polishing area can be calculated. ):

[0126]

[0127] By effective coverage width The polishing area can then be determined, such as At this time, the polishing area is the entire polishing disk 400, meaning that the entire polishing disk 400 polishes the first frame. The larger the polishing area, the faster the polishing disk 400 polishes the first frame. Therefore, according to the corresponding polishing area, the corresponding third polishing time, third polishing pressure, and third polishing rotation speed can be adjusted to ensure that the polishing of the frame (the two interlocking third frames 310 and the fourth frame 320) is uniform, that is, to ensure that the polishing degree of each part is equal to the target polishing degree.

[0128] The implementation of this embodiment of the invention has the following beneficial effects: the non-standard frame is fixed at a first preset position by the first fixing unit 200; the non-standard frame is polished once by the first polishing unit to obtain a first frame, the first polishing including coarse polishing and medium polishing; the two first frames are interlocked and fixed at a second preset position by the second fixing unit 300; the two first frames are simultaneously polished twice by the second polishing unit to obtain a second frame. In the technical solution of this embodiment, the first polishing unit can perform coarse and medium polishing on the non-standard frame before fine polishing, ensuring polishing accuracy, and the second polishing unit can simultaneously polish the two interlocked first frames placed at the second preset position to obtain a second frame, which can complete the fine polishing of the two first frames in one go, improving the fine polishing efficiency of the frame. Therefore, this application can improve the polishing accuracy and polishing efficiency of non-standard frames.

[0129] In addition, one embodiment of the present invention provides a polishing device for non-standard borders, the device including: a memory, a processor, and a computer program stored in the memory and executable on the processor.

[0130] The processor and memory can be connected via a bus or other means.

[0131] It should be noted that the computer in this embodiment may correspond to, for example, including, Figure 1 The memory and processor in the illustrated embodiment can constitute Figure 1 The system architecture platform shown in the embodiment is part of the same inventive concept, and therefore has the same implementation principle and beneficial effects, which will not be described in detail here.

[0132] The non-transient software program and instructions required to implement the uplink co-channel interference cancellation method of the above embodiments are stored in memory. When executed by the processor, the non-standard border polishing method of the above embodiments is executed, for example, the method described above is executed. Figure 2 Method steps S100 to S600.

[0133] Furthermore, one embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions, which, when used to execute the polishing method for a non-standard border of the aforementioned non-standard border polishing apparatus, for example, execute the above-described polishing... Figure 2 Method steps S100 to S400.

[0134] As will be appreciated by one of ordinary skill in the art, all or some of the steps, systems, etc. in the methods disclosed above can be embodied in software, firmware, hardware, and / or suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, as hardware, or as an integrated circuit, such as an application- specific integrated circuit. Such software can be distributed on computer readable media, which can comprise computer storage media (or non-transitory media), and communication media (or transitory media). As is well known to those of ordinary skill in the art, the term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Further, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as a carrier wave or other transport mechanism, and includes any information delivery media.

[0135] The above description is that of the preferred embodiments of the application. Various modifications and changes can be made thereto without departing from the spirit and scope of the application as set forth in the claims.

Claims

1. A polishing method for non-standard borders, characterized in that, An edge polishing device is used, comprising a coarse polishing module and a fine polishing module. The coarse polishing module includes a first fixing unit and a first polishing unit. The fine polishing module includes a second fixing unit and a second polishing unit. The second polishing unit includes a second robotic arm connected to a second polishing mechanism, which includes a polishing disc. A laser ranging unit is also mounted on the second robotic arm. The laser ranging unit includes a first laser device and a second laser device. The first laser device is located on a first side of the polishing disc, and the second laser device is located on a second side of the polishing disc. The connecting line between the first laser device and the second laser device passes through the rotation center of the polishing disc. The polishing method for non-standard edges includes: The non-standard frame is fixed at a first preset position by the first fixing unit; The first frame is obtained by polishing the non-standard frame once through the first polishing unit. The first polishing includes coarse polishing and medium polishing. The two first frames are interlocked and fixed at a second preset position by the second fixing unit; The second polishing unit is controlled to perform a second polishing process on the two first frames simultaneously to obtain the second frame. Specifically, this includes: generating a third polishing path according to the second preset position; and driving the polishing disk to move along the third polishing path by the second robotic arm so that the polishing disk performs a second polishing process on the two first frames simultaneously to obtain the second frame. The step of driving the polishing disk to move along the third polishing path by the second robotic arm includes: during the process of the second robotic arm driving the polishing disk to move along the third polishing path: the relative distance between the two first frames is detected in real time by the laser ranging unit; the middle position of the relative distance is configured as the standard path; and the position of the polishing disk is adjusted by the second robotic arm so that the rotation center of the polishing disk coincides with the standard path. The real-time detection of the relative distance between the two first frames using the laser ranging unit includes: emitting a first excitation light through the first laser device and receiving a first reflected light between the first excitation light and the first frame; determining a first distance from the first laser device to the first frame located on one side of the first laser device based on the first reflected light; emitting a second excitation light through the second laser device and receiving a second reflected light between the second excitation light and the first frame; determining a second distance from the second laser device to the first frame located on one side of the second laser device based on the second reflected light; and obtaining the relative distance by subtracting the straight-line distance of the connecting line from the first distance and the second distance, respectively.

2. The polishing method for non-standard borders according to claim 1, characterized in that, The first polishing unit includes a first robotic arm, on which a first polishing mechanism is connected. The first polishing mechanism includes a first polishing wheel and a second polishing wheel. The process of obtaining the first frame by polishing the non-standard frame once using the first polishing unit includes: The middle frame is obtained by rough polishing the non-standard frame using the first polishing wheel; The first frame is obtained by polishing the middle frame with the second polishing wheel, and the polishing degree of the first frame is greater than that of the middle frame.

3. The polishing method for non-standard borders according to claim 2, characterized in that, The process of obtaining the first frame by polishing the non-standard frame once through the first polishing unit includes: A first polishing path and a second polishing path are determined based on the first preset position, wherein the first polishing path represents the movement path of the first polishing wheel, and the second polishing path represents the movement path of the second polishing wheel; Obtain border information, wherein the border information represents the material information and preset polishing degree information of the non-standard border; A first polishing curve spectrum and a second polishing curve spectrum are determined based on the first polishing path, the second polishing path, and the border information. The first polishing curve spectrum represents the first polishing time, the first polishing pressure, and the first polishing speed of the first polishing wheel on the first polishing path. The second polishing curve spectrum represents the second polishing time, the second polishing pressure, and the second polishing speed of the second polishing wheel on the second polishing path. The first polishing wheel is driven by the first robotic arm to move along the first polishing path, and the first polishing wheel is controlled according to the first polishing curve to perform rough polishing on the non-standard frame with the first polishing time, the first polishing pressure and the first polishing speed to obtain the middle frame; The first robotic arm drives the second polishing wheel to move along the second polishing path, and controls the second polishing wheel to perform intermediate polishing on the middle frame according to the second polishing curve, with the second polishing time, the second polishing pressure and the second polishing speed, to obtain the first frame.

4. The polishing method for non-standard borders according to claim 1, characterized in that, After adjusting the position of the polishing disk using the second robotic arm so that the rotation center of the polishing disk coincides with the standard path, the method further includes: Obtain the first polishing degree of the first border and the preset second polishing degree of the second border; The third polishing time, third polishing pressure, and third polishing rotation speed of the polishing pad are determined based on the first polishing degree, the second polishing degree, and the relative distance.

5. The polishing method for non-standard borders according to claim 4, characterized in that, The step of determining the third polishing time, third polishing pressure, and third polishing rotation speed of the polishing pad based on the first polishing degree, the second polishing degree, and the relative distance includes: Configure the difference between the second polishing degree and the first polishing degree as the target polishing degree; The polishing area between the polishing disk and the first frame is determined based on the relative distance; The third polishing time, the third polishing pressure, and the third polishing rotation speed are determined based on the polishing area and the target polishing degree.

6. A polishing device for non-standard borders, characterized in that, include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the polishing method for a non-standard border as described in any one of claims 1-5.

7. A computer storage medium, characterized in that, The computer storage medium stores computer-executable instructions for performing the polishing method for the non-standard border as described in any one of claims 1-5.

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