Die bonding apparatus

Abstract

The application discloses a kind of solid crystal equipment, it is related to solid crystal technical field.Therein, solid crystal equipment includes rack, take crystal patch mechanism and point gum mechanism, and take crystal patch mechanism and point gum mechanism are all arranged in rack.Taking crystal patch mechanism includes wafer disc, turnover group and patch group successively distributed along first space axis;Point gum mechanism includes point gum group and patch group successively distributed along second space axis.The technical scheme of the application is by successively distributing wafer disc, turnover group and patch group of taking crystal patch mechanism along first space axis, then successively distributing point gum group and patch group of point gum mechanism along second space axis, first space axis and second space axis are spatially non coplanar layout, first space axis and second space axis form adjustable oblique included angle in horizontal projection plane, effectively utilize longitudinal space, reduce the waste of longitudinal space, improve space utilization.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonding, in particular to a die bonding equipment. BACKGROUND

[0002] The die bonding equipment is applied to the fields of semiconductor packaging and LED manufacturing, and its main function is to fix a wafer on a substrate.

[0003] The existing die bonding equipment usually adopts a layout mode in which multiple functional mechanisms are linearly arranged along a horizontal direction on a platform, and then a pin mechanism and a turnover mechanism are used to realize wafer transfer and packaging. However, the planar distribution of the functional modules occupies a large area of the platform, which is a waste of space. SUMMARY

[0004] The main purpose of the present application is to provide a die bonding equipment, which aims to solve the problem of space waste in the existing die bonding equipment.

[0005] To achieve the above purpose, the die bonding equipment provided by the present application comprises a rack, a wafer taking and pasting mechanism and a dispensing mechanism, and the wafer taking and pasting mechanism and the dispensing mechanism are both arranged in the rack.

[0006] The wafer taking and pasting mechanism comprises a wafer disc, a turnover group and a pasting group which are continuously distributed along a first spatial axis; the dispensing mechanism comprises a dispensing group and the pasting group which are continuously distributed along a second spatial axis; the first spatial axis and the second spatial axis are arranged in a spatial non-coplanar manner, and the first spatial axis and the second spatial axis form an adjustable inclined included angle in a horizontal projection plane.

[0007] In some embodiments, the die bonding equipment further comprises a hot pressing mechanism located on one side of the dispensing mechanism, the hot pressing mechanism comprises an upper hot pressing head group, a lower hot pressing head group and a pressure sensor, the upper hot pressing head group and the lower hot pressing head group are oppositely arranged, and a material belt is located between the upper hot pressing head group and the lower hot pressing head group; the upper hot pressing head group and the lower hot pressing head group are both provided with pressing heads, and each pressing head is one-to-one correspondingly provided with a temperature control assembly.

[0008] In some embodiments, the die bonding equipment further comprises a vacuum buffer groove, which is located between the dispensing mechanism and the hot pressing mechanism or in front of the dispensing mechanism, and the vacuum buffer groove comprises a suction cavity, a fan and a shooting device, and both sides or the bottom of the suction cavity is provided with an air extraction hole.

[0009] The material belt passes through the suction cavity, the fan is arranged in the suction cavity and located above the material belt, and the shooting device is used for shooting the material belt; the air extraction hole is connected with a negative pressure source, and the negative pressure source is used for extracting air below the material belt to control the tension of the material belt and make the material belt suspended in the suction cavity.

[0010] In some embodiments, the flipping group is obliquely installed on the rack, the flipping group has at least one rotating arm, each rotating arm is installed with a first suction nozzle, and the rotating arm is configured to receive a wafer of the wafer disc and flip and transform a position, so that the rotating arm is flipped from a picking position facing the wafer disc to a patching position facing the patch group, so as to transfer the wafer to the patch group.

[0011] The patch group is configured to receive the wafer transferred by the flipping group, and transform the wafer from a picking posture to a patching posture through self-rotation and spatial posture transformation.

[0012] In some embodiments, the flipping group includes a first rotating arm and a second rotating arm, the flipping group further includes a first driving assembly, the first rotating arm and the second rotating arm are arranged on an output shaft of the first driving assembly, and the first rotating arm and the second rotating arm are installed with first suction nozzles.

[0013] One of the first rotating arm and the second rotating arm is arranged towards the wafer disc to pick up a wafer of the wafer disc, and the other of the first rotating arm and the second rotating arm is arranged towards the patch group to transfer the wafer to the patch group.

[0014] The first driving assembly is used to drive the first rotating arm and the second rotating arm to rotate around the output shaft of the first driving assembly, so that the first rotating arm rotates to the patching position, and the second rotating arm rotates to the picking position.

[0015] In some embodiments, the wafer disc is installed with a pin assembly, the pin assembly includes a pin cap and a pin structure, the pin structure is arranged in the pin cap, and the pin structure protrudes relative to the pin cap to eject a wafer.

[0016] The rack is installed with a rotation adjusting mechanism, the rotation adjusting mechanism includes a universal joint and a third driving assembly, the universal joint is installed on the rack, the third driving assembly is arranged on the universal joint, and an output shaft of the third driving assembly is connected with the pin assembly; the third driving assembly is used to drive the pin assembly to rotate, so as to adjust a rotation angle of the pin structure and an angle of the wafer on the pin structure.

[0017] In some embodiments, the wafer disc is configured to move in one or both of a first direction and a second direction along the rack, so as to adjust a position of the wafer disc on the rack; the wafer disc is obliquely inclined outward relative to the rack, and the wafer disc is obliquely inclined relative to a horizontal axis and has a rotation included angle.

[0018] In some embodiments, the patch assembly includes a rotary arm assembly and a second drive assembly. The rotary arm assembly includes at least two mounting arms, at least one of which is equipped with a rotation drive and a second suction nozzle. The second drive assembly includes a tilt drive, a lifting drive, and a rotation drive. The tilt drive drives the rotary arm assembly to tilt, the rotation drive controls the second suction nozzle to rotate about its axis, and the lifting drive drives the second suction nozzle to move in the height direction.

[0019] In some embodiments, a material pulling group is movably mounted on the frame, the material pulling group has a material strip, and the second spatial axis is the running direction of the material strip; each material strip has multiple base material units, and the multiple base material units are arranged in a row; the number of material strips is at least two, and the at least two material strips are arranged parallel to each other.

[0020] In some embodiments, the rack includes a fixed platform and a stand, the stand being mounted on the fixed platform, the fixed platform being inclined relative to a horizontal axis, and an adjustable adjustment angle being formed between the fixed platform and the horizontal axis; the wafer disk is mounted on the stand to fix the fixed platform, and the wafer disk rotates synchronously with the tilt of the fixed platform, such that the rotation angle of the wafer disk relative to the horizontal axis is consistent with the adjustment angle.

[0021] In some embodiments, the wafer disk is configured such that: the wafer disk moves on the stand in one or both of a first direction and a second direction to adjust the position of the wafer disk on the stand; the wafer disk is tilted outward relative to the fixed stage, and the wafer disk has a rotational angle relative to the horizontal axis.

[0022] In some embodiments, the die bonding equipment further includes a mounting bracket disposed on a fixed stage, wherein the flipping group and the die bonding group are mounted on the mounting bracket; the die bonding equipment further includes a vision system disposed on the mounting bracket, the vision system including a first vision camera facing the wafer disk, a second vision camera facing the flipping group, a third vision camera facing the die bonding group, a fourth vision camera facing the material pulling group and located on one side of the dispensing group, and a fifth vision camera facing the material pulling group and located on one side of the die bonding group.

[0023] The technical scheme of the present application is characterized in that the wafer disc, the turnover group and the patch group of the wafer picking mechanism are continuously distributed along a first spatial axis, the dispensing group and the patch group of the dispensing mechanism are continuously distributed along a second spatial axis, the first spatial axis and the second spatial axis are arranged in a spatial non-coplanar manner, and the first spatial axis and the second spatial axis form an adjustable inclined angle in a horizontal projection plane. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on the drawings shown.

[0025] Figure 1 The structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0026] Figure 2 The structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0027] Figure 3 The partial structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0028] Figure 4 The partial structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure. Figure 3 The partial structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0029] Figure 5 The structural schematic diagram of an embodiment of the wafer disc and the turnover group in the die bonding apparatus provided by the present application is shown in the figure.

[0030] Figure 6 The partial structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure. Figure 5 The partial structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0031] Figure 7 The structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0032] Figure 8 The structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0033] Figure 9 The structural schematic diagram of an embodiment of the die bonding apparatus provided by the present application is shown in the figure.

[0034] Figure 10Structure diagram of a patch group with three binding arms in a die bonding apparatus provided by the present application;

[0035] Figure 11 Structure diagram of a patch group with four binding arms in a die bonding apparatus provided by the present application;

[0036] Figure 12 Structure diagram of a patch group with five binding arms in a die bonding apparatus provided by the present application;

[0037] Figure 13 Structure diagram of a patch group with six binding arms in a die bonding apparatus provided by the present application;

[0038] Figure 14 Structure diagram of a vacuum buffer groove in a die bonding apparatus provided by the present application;

[0039] Figure 15 Structure diagram of a hot-pressing mechanism in a die bonding apparatus provided by the present application;

[0040] Figure 16 Layout diagram of a die bonding apparatus provided by the present application.

[0041] Explanation of reference numerals:

[0042] 100, die bonding apparatus; A, first spatial axis; B, second spatial axis; 10, rack; 11, fixed table; 12, stand;

[0043] 20, die picking and patching mechanism; 21, wafer disc; 210, moving wafer disc; 211, first horizontal moving assembly; 2111, fixed body of first horizontal moving assembly; 2112, movable body of first horizontal moving assembly; 212, second horizontal moving assembly; 2121, fixed body of second horizontal moving assembly; 2122, movable body of second horizontal moving assembly; 213, die; 214, pin assembly; 22, turning group; 221, turning arm; 2211, first turning arm; 2212, second turning arm; 2213, first suction nozzle; 222, first driving assembly; 23, patch group; 24, binding arm; 241, first binding arm; 242, second binding arm; 243, third binding arm; 240, second suction nozzle; 25, second driving assembly; 251, turning driving member; 252, lifting driving member; 253, self-rotation driving member;

[0044] 30, dispensing mechanism; 31, dispensing group; 40, material pulling group; 41, material belt; 42, substrate unit;

[0045] 51, first visual camera; 52, second visual camera; 53, third visual camera; 54, fourth visual camera; 55, fifth visual camera;

[0046] 60, vacuum buffer groove; 61, adsorption cavity; 62, fan; 63, shooting device; 64, air extraction hole;

[0047] 70, hot pressing mechanism; 71, upper hot pressing head group; 72, lower hot pressing head group; 73, pressing head.

[0048] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments in combination with the accompanying drawings. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0050] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0051] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection claimed by the present application.

[0052] The die bonding equipment is applied to the fields of semiconductor packaging and LED manufacturing, and mainly functions to fix a wafer on a substrate.

[0053] The existing die bonding equipment usually adopts a layout mode in which multiple functional mechanisms are linearly arranged in a horizontal direction on a platform, and then a thimble mechanism and a turnover mechanism are used to realize wafer transfer and packaging. However, the planar distribution of the functional modules occupies a large area of the platform, which is relatively space-wasting.

[0054] Figure 1The present application provides a die bonding device 100. Please refer to Figure 1 and Figure 7 In an embodiment of the present application, the die bonding device 100 comprises a rack 10, a wafer picking and die bonding mechanism 20 and a dispensing mechanism 30, and the wafer picking and die bonding mechanism 20 and the dispensing mechanism 30 are arranged in the rack 10.

[0055] Please refer to Figure 1 and Figure 7 The wafer picking and die bonding mechanism 20 comprises a wafer disc 21, a flipping group 22 and a die bonding group 23 arranged along a first spatial axis A; the dispensing mechanism 30 comprises a dispensing group 31 and the die bonding group 23 arranged along a second spatial axis B; the first spatial axis A and the second spatial axis B are arranged in a spatial non-coplanar manner, and the first spatial axis A and the second spatial axis B form an adjustable inclined angle ∠e in a horizontal projection plane.

[0056] The die bonding group 23 of the dispensing mechanism 30 and the die bonding group 23 of the wafer picking and die bonding mechanism 20 are the same physical mechanism. The dispensing mechanism 30 can further comprise a hot-pressing mechanism 70, and the dispensing group 31, the die bonding group 23 and the hot-pressing mechanism are arranged in sequence from left to right along the second spatial axis B. Please refer to Figure 1 and Figure 2 The die bonding device 100 further comprises a material pulling group 40, and the material pulling group 40 has a material belt 41, and the material belt 41 has a plurality of substrate units 42.

[0057] The wafer disc 21 is used for carrying a wafer 213; the flipping group 22 is used for picking up the wafer 213 on the wafer disc 21 and rotating the position of the wafer 213 to a position corresponding to the die bonding group 23, so as to transfer the wafer 213 to the die bonding group 23; and the die bonding group 23 is used for picking up the wafer 213 on the flipping group 22 and bonding the wafer 213 to the substrate units 42 of the material pulling group 40.

[0058] Further, the second spatial axis B is along the running direction of the material belt 41, and the second spatial axis B is parallel to the horizontal plane. Understandably, the first spatial axis A is inclined relative to the horizontal plane and arranged in an adjustable inclined angle.

[0059] The plane where the wafer picking and die bonding mechanism 20 is arranged can be arranged perpendicularly to the plane where the dispensing mechanism 30 is arranged, or can be arranged in an angle. When the plane where the wafer picking and die bonding mechanism 20 is arranged is arranged perpendicularly to the plane where the dispensing mechanism 30 is arranged, the wafer disc 21, the flipping group 22 and the die bonding group 23 are arranged along the second spatial axis B, and the angle between the second spatial axis B and the horizontal line can be 60 degrees to 90 degrees, or 90 degrees to 120 degrees.

[0060] When the plane where the wafer picking and patching mechanism 20 is located is arranged obliquely relative to the plane where the dispensing mechanism 30 is located, and the two planes have an oblique included angle ∠e, the angle of the oblique included angle ∠e can be 60 degrees to 90 degrees, or 90 degrees to 120 degrees.

[0061] Please refer to Figure 1 and Figure 2 The dispensing group 31 is located on the right side of the patching group 23, the turnover group 22 of the wafer picking and patching mechanism 20 is located on the upper right side of the patching group 23, or the turnover group 22 is located on the upper right side of the patching group 23; similarly, the wafer disc 21 is located on the upper right side of the turnover group 22, or the wafer disc 21 is located on the upper right side of the turnover group 22.

[0062] The disc, the turnover group 22 and the patching group 23 of the wafer picking and patching mechanism 20 are continuously distributed along the first spatial axis A, and the dispensing group 31 and the patching group 23 of the dispensing mechanism 30 are continuously distributed along the second spatial axis B, so that the wafer picking and patching mechanism 20 is placed more flexibly, the space utilization rate is improved by 30%, and the wafer is attached to the substrate unit 42 at a more accurate attachment position, so that the good rate of the product is improved to 99.7%.

[0063] The wafer picking and patching mechanism 20 and the dispensing mechanism 30 of the present application are arranged in three-dimensional space to improve the space utilization rate and the cooperation efficiency. The wafer disc 21, the turnover group 22 and the patching group 23 of the wafer picking and patching mechanism 20 are continuously distributed along the first spatial axis A to form a continuous wafer 213 picking and placing path; at the same time, the dispensing group 31 and the patching group 23 of the dispensing mechanism 30 are continuously arranged along the second spatial axis B to construct a linkage process of dispensing and die bonding. The first spatial axis A and the second spatial axis B adopt a unique layout mode of non-coplanar space, and form a staggered structure in the vertical direction, while maintaining an adjustable oblique included angle ∠e in the horizontal projection plane, so as to fully utilize the longitudinal space, avoid the motion interference between mechanisms, and reduce the space waste of the die bonding equipment 100 in the vertical direction, so as to improve the overall space utilization rate.

[0064] Further, the spatial layout mode of the wafer picking and patching mechanism 20 and the dispensing mechanism 30 of the present application not only provides independent working areas for the wafer disc 21, the turnover group 22, the patching group 23, the dispensing group 31, but also ensures that the wafer 213 picking, turning and dispensing and die bonding processes can be executed in parallel, and through the adjustability of the oblique included angle ∠e of the two spatial axes, the die bonding equipment 100 can flexibly cope with the demand of wafers 213 of different sizes.

[0065] The technical scheme of the present application is characterized in that the wafer disc 21, the turnover group 22 and the patch group 23 of the wafer picking and patching mechanism 20 are continuously distributed along a first spatial axis A, the glue dispensing group 31 and the patch group 23 of the glue dispensing mechanism 30 are continuously distributed along a second spatial axis B, the first spatial axis A and the second spatial axis B are non-coplanar in space, and the first spatial axis A and the second spatial axis B form an adjustable inclined angle ∠e in the horizontal projection plane. In this way, the longitudinal space is effectively utilized, the waste of longitudinal space is reduced, and the space utilization rate is improved.

[0066] Please refer to Figure 1 , Figure 7 and Figure 8 , in order to be able to more flexibly place the wafer picking and patching mechanism 20, the angle of the inclined angle ∠e is greater than or equal to 60 degrees, and the angle of the inclined angle ∠e is less than or equal to 120 degrees.

[0067] Among them, the inclined angle ∠e formed by the first spatial axis A and the second spatial axis B in the horizontal projection plane can be 90 degrees, so that the first spatial axis A and the second spatial axis B are perpendicular to each other.

[0068] In an embodiment, the inclined angle ∠e is designed to be adaptively adjusted by ±30 degrees based on a reference angle. When the reference angle is 90 degrees, the adjustment range of the inclined angle ∠e covers 60 degrees to 120 degrees. The adjustable inclined angle ∠e design makes the wafer picking and patching mechanism 20 break through the limitation of the traditional vertical plane layout and can be arranged on an inclined plane with an acute angle or an obtuse angle with the horizontal plane. Specifically: when the inclined angle ∠e is in the range of 60 degrees to 90 degrees, the wafer picking and patching mechanism 20 can be arranged on an inclined wafer picking plane from the upper left to the horizontal plane. At this time, the wafer picking plane forms an acute angle with the horizontal plane. At this time, the position of the wafer disc 21, the position of the turnover group 22 and the position of the patch group 23 of the wafer picking and patching mechanism 20 can be from the left oblique upper direction to the position close to the horizontal, and the heights of the three are arranged in turn.

[0069] When the inclined angle ∠e is in the range of 90 degrees to 120 degrees, the wafer picking and patching mechanism 20 can be arranged on an inclined plane from the upper right to the horizontal plane. At this time, the wafer disc 21 is located at the relatively highest point, that is, the upper right oblique upper side, the turnover group 22 is next, and the patch group 23 is located at the relatively lowest point and close to the horizontal plane.

[0070] The wafer picking and patching mechanism 20 is arranged on the wafer picking plane, which can save vertical space. Since the wafer picking and patching mechanism 20 is arranged vertically on the longitudinal plane, the wafer picking and patching mechanism 20 is too straight, making it difficult for the operator to overhaul and maintain. The present application tilts the wafer picking plane where the wafer picking and patching mechanism 20 is located, reduces the height of the whole die bonding equipment 100, and reduces the difficulty of the operator's overhaul and maintenance.

[0071] The angle of the inclined included angle ∠e is greater than or equal to 60 degrees and less than or equal to 120 degrees: it can reduce the problem that the included angle is too small, which leads to that the crystal taking and patching mechanism 20 and the dispensing mechanism 30 are too crowded, interference between multiple components is prone to occur, and maintenance difficulty is improved, and it also reduces the problem that the included angle is too large, which leads to that the crystal taking and patching mechanism 20 and the dispensing mechanism 30 are too far apart, the device size is large, the motion path is too long, and the efficiency is low.

[0072] Please refer to Figure 15 , the die bonding device 100 further comprises a hot pressing mechanism 70, the hot pressing mechanism 70 is located on one side of the dispensing mechanism 30, the hot pressing mechanism 70 comprises an upper hot pressing head group 71, a lower hot pressing head group 72 and a pressure sensor, the upper hot pressing head group 71 and the lower hot pressing head group 72 are oppositely arranged, and the material belt is located between the upper hot pressing head group 71 and the lower hot pressing head group 72; the upper hot pressing head group 71 and the lower hot pressing head group 72 are each provided with a pressing head 73, and each pressing head 73 is one-to-one corresponding to a temperature control component.

[0073] The hot pressing mechanism 70 is located adjacent to the dispensing mechanism 30, and is mainly used for hot pressing process on the material belt after dispensing. The hot pressing mechanism 70 comprises an upper hot pressing head group 71 and a lower hot pressing head group 72, the upper hot pressing head group 71 and the lower hot pressing head group 72 are oppositely arranged, and the material belt 41 passes through the gap between the upper hot pressing head group 71 and the lower hot pressing head group 72. Among them, each pressing head 73 is equipped with an independent temperature control component, the temperature of each pressing head 73 is set separately, and can be maintained at the required working temperature respectively. The temperature of the pressing head 73 of the upper hot pressing head group 71 and the pressing head 73 of the lower hot pressing head group 72 can be set differently, so that the upper hot pressing head group 71 and the lower hot pressing head group 72 can be set at different temperatures respectively according to the material properties and process requirements of the material belt 41 or the substrate unit 42, and the hot pressing effect is optimized. In addition, a pressure sensor is integrated in the hot pressing mechanism 70 to monitor and feedback the actual pressure value applied to the material belt 41 between the upper hot pressing head group 71 and the lower hot pressing head group 72 in real time.

[0074] Please refer to Figure 14 and Figure 16 , the die bonding device 100 further comprises a vacuum buffer tank 60, the vacuum buffer tank 60 is located between the dispensing mechanism 30 and the hot pressing mechanism 70 or before the dispensing mechanism 30, the vacuum buffer tank 60 comprises a suction chamber 61, a fan 62 and a shooting device 63, and the two sides or the bottom of the suction chamber 61 is provided with an air extraction hole 64. The material belt 41 passes through the suction chamber 61, the fan 62 is arranged in the suction chamber 61 and located above the material belt 41, and the shooting device 63 is used for shooting the material belt 41. The air extraction hole 64 is communicated with a negative pressure source, and the negative pressure source is used for extracting air below the material belt 41 to control the tension of the material belt 41, so that the material belt 41 is suspended in the suction chamber 61.

[0075] The adsorption cavity 61 under the action of the negative pressure source extracts the air below the material belt by the air extraction hole 64, so that the material belt 41 forms a controllable suspended state in the adsorption cavity 61. This suspended state not only reduces the frictional resistance between the material belt 41 and the surface of the adsorption cavity 61, but also allows the suspended material belt 41 to form a certain amount of slack or storage length in the adsorption cavity 61, thereby establishing a temporary material belt storage between the dispensing mechanism 30 and the hot-pressing mechanism 70. In an embodiment, the fan 62 cooperates with the negative pressure source to adjust the tension of the material belt. When it is necessary to slow down the delivery of the material belt 41 to the hot-pressing mechanism 70, the tension can be increased by adjusting the negative pressure and other parameters, so that the suspended material belt 41 tends to be taut and the release speed is slowed down. Conversely, when more material belt 41 is needed at the back end, the tension can be appropriately reduced to allow the material belt 41 to move more smoothly.

[0076] Further, the shooting device 63 is located in the adsorption cavity 61, and the shooting device 63 can provide real-time visual monitoring information feedback to the external control system, so that the control system can dynamically adjust the negative pressure intensity and the operating state of the fan 62 according to the actual position and slack degree of the material belt 41.

[0077] The vacuum buffer groove 60 effectively absorbs the speed fluctuations that may be generated during upstream delivery, avoiding the material belt 41 from directly rushing into the hot-pressing mechanism 70 too quickly.

[0078] Please refer to Figure 3 , Figure 4 and Figure 7 , the turnover group 22 is obliquely installed on the rack 10, and the turnover group 22 has at least one rotating arm 221, each rotating arm 221 is installed with a first suction nozzle 2213, and the rotating arm 221 is configured to receive a wafer 213 of the wafer disc 21 and change the position by turning over, so that the rotating arm 221 is turned over from a picking position facing the wafer disc 21 to a die bonding position facing the die bonding group 23, to transfer the wafer 213 to the die bonding group 23.

[0079] The turnover group 22 is the core module for realizing the spatial posture conversion of the wafer 213 in the wafer picking and die bonding mechanism 20, and the core function of the turnover group 22 is to complete the transfer of the wafer 213 from the wafer disc 21 to the die bonding group 23 through the turning over action.

[0080] Specifically, the turnover group 22 realizes the position and orientation conversion of the wafer 213 through the rotary motion of the at least one rotating arm 221: after the wafer 213 on the wafer disc 21 is picked up, the rotating arm 221 first receives the wafer 213 at the picking position facing the wafer disc 21, at this time the surface of the wafer 213 is usually upward to adapt to the loading posture of the wafer disc 21; then the rotating arm 221 rotates around its pivot by a certain angle, moving the wafer 213 from the picking position to the die bonding position facing the die bonding group 23, in this process, the surface of the wafer 213 is downward to match the requirement of the die bonding group 23 for the fixed crystal posture.

[0081] Please refer to Figure 3 , Figure 4 and Figure 9 , in order to eliminate the time gap in the single-arm design that needs to wait for one action to complete before proceeding to the next action, the turnover group 22 includes a first rotating arm 2211 and a second rotating arm 2212, and the turnover group 22 further includes a first driving assembly 222, the first rotating arm 2211 and the second rotating arm 2212 are arranged on the output shaft of the first driving assembly 222, and the first rotating arm 2211 and the second rotating arm 2212 are both installed with a first suction nozzle 2213. One of the first rotating arm 2211 and the second rotating arm 2212 is arranged towards the wafer disc 21 to pick up the wafer on the wafer disc 21, and the other of the first rotating arm 2211 and the second rotating arm 2212 is arranged towards the patch group 23 to transfer the wafer to the patch group 23. The first driving assembly 222 is used to drive the first rotating arm 2211 and the second rotating arm 2212 to rotate around the output shaft of the first driving assembly 222, so that the first rotating arm 2211 rotates to the patch position, and the second rotating arm 2212 rotates to the pickup position.

[0082] Specifically, the first rotating arm 2211 and the second rotating arm 2212 are arranged in a 180-degree symmetrical array on the output shaft of the first driving assembly 222. When the first rotating arm 2211 is in the pickup position facing the wafer disc 21, the suction nozzle device at the end of the first rotating arm 2211 picks up the wafer on the wafer disc 21, and at the same time, the second rotating arm 2212 is located at the patch position facing the patch group 23 to transfer the wafer picked up in the last cycle to the patch group 23. Under the drive of the first driving assembly 222, the output shaft drives the first rotating arm 2211 and the second rotating arm 2212 to rotate synchronously by 180 degrees, so that the positions and functions of the two rotating arms 221 are interchanged, the first rotating arm 2211 originally picking up the wafer is turned to the patch position to perform wafer 213 transfer, and the second rotating arm 2212 is turned to the pickup position to prepare for the next round of wafer 213 pickup. This alternating operation mode can realize the connection of the wafer picking and patching processes, and eliminate the time gap in the single-arm design that needs to wait for one action to complete before proceeding to the next action.

[0083] In an embodiment, the first driving assembly 222 is a motor.

[0084] Among them, please refer to Figure 4, the first rotating arm 2211 and the second rotating arm 2212 are each provided with a first suction nozzle 2213, the wafer disc 21 is provided with a thimble assembly 214, the thimble assembly 214 comprises a thimble cap and a thimble structure, the thimble structure is arranged in the thimble cap, and the thimble structure can eject the wafer 213 at a high frequency. The first suction nozzle on the first rotating arm 2211 vacuum-sucks the wafer 213. The first suction nozzle is provided with an independent vacuum channel, which is used for sucking the wafer 213 at the pickup position. The first suction nozzle 2213 is arranged on the first rotating arm 2211 and is inclined relative to the first rotating arm 2211, and the first suction nozzle 2213 is arranged correspondingly to the thimble structure. The first suction nozzle 2213 is on the same axis as the thimble assembly 214, so as to ensure that the wafer 213 sucked by the first suction nozzle 2213 is on the thimble structure. The present application sets the inclination of the first suction nozzle 2213, so that the central axis of the first suction nozzle 2213 coincides with the ejecting direction of the thimble structure, and also ensures that the suction force of the first suction nozzle 2213 acts vertically on the central plane of the wafer 213. After the suction is completed, the thimble structure immediately retracts below the thimble cap, and the first suction nozzle 2213 carries the wafer 213 to perform a flip action with the first rotating arm 2211.

[0085] The thimble structure is connected to a piezoelectric micro-displacement driver, so as to control the force of the thimble structure through the piezoelectric micro-displacement driver. The force of the thimble structure can be controlled at 0.5N to 5N.

[0086] Further, referring to Figure 4 、 Figure 7 and Figure 8 , the die bonding apparatus 100 further comprises a first vision camera 51 and a second vision camera 52. The first vision camera 51 photographs the wafer 213 on the wafer disc 21, so as to calibrate the position of the wafer 213 on the wafer disc 21 through an algorithm. The method for calibrating the position of the wafer 213 on the wafer disc 21 through the algorithm can be analyzed and calculated by using an existing method. The second vision camera 52 is used for photographing the position of the wafer 213 sucked by the first suction nozzle 2213 of the first rotating arm 2211.

[0087] In order to realize accurate mounting of the wafer 213, the patch group 23 is configured to receive the wafer 213 of the flip group 22, and convert the wafer 213 from a pickup pose to a mounting pose through self-rotation and spatial pose transformation.

[0088] The patch group 23 has a binding arm 24, which has a receiving position, a self-rotation position and a mounting position in the process of flipping. When the binding arm 24 rotates to the receiving position, the binding arm 24 receives the wafer 213 of the flip group 22; when the binding arm 24 rotates to the self-rotation position, the binding arm 24 can rotate by a certain angle to adjust the mounting pose of the wafer 213; when the binding arm 24 rotates to the mounting position, the binding arm 24 descends to attach the wafer 213 to the substrate unit 42 on the pulling group 40.

[0089] Specifically, the patch group 23 is used to convert the wafer 213 from the pick-up posture to the mounting posture. When the patch group 23 receives the wafer 213 of the flip group 22, the binding arms 24 on the patch group 23 first pick up the wafer 213, and then the binding arms 24 of the patch group 23 perform a flip action, flip to the self-rotation position, drive the wafer 213 to rotate a certain angle around the normal direction of the wafer 213, so that the mounting posture of the wafer 213 is corrected, and it can be ensured that the electrode direction of the wafer 213 matches the pad pattern on the substrate unit 42; then, the binding arms 24 continue the flip action, flip to the mounting position, so as to mount the wafer 213 on the substrate unit 42 on the pulling group 40.

[0090] Among them, the binding arms 24 on the patch group 23 can all adopt piezoelectric ceramic arms, so as to realize micron-level position adjustment, so that the position of the wafer 213 descending or the fine adjustment of the wafer mounting posture can be micron-level adjustment.

[0091] Among them, while the flip group 22 and the patch group 23 are working, the dispensing group 31 is also working. The glue spraying head of the dispensing group 31 is used to apply adhesive to the substrate unit 42 on the pulling group 40. The substrate unit 42 with adhesive applied moves to the lower side of the patch group 23, and the patch group 23 mounts the wafer 213 with the corrected mounting posture on the substrate unit 42 with adhesive applied. The dispensing group 31 is spatially separated from the patch group 23, reducing the risk of cross-contamination of the wafer 213 on the patch group 23 by the glue spraying head of the dispensing group 31.

[0092] The die bonding apparatus 100 further comprises a third vision camera 53, which is correspondingly arranged at the self-rotation position of the patch group 23, so as to calculate and mark the position of the wafer 213 on the patch group 23, etc.

[0093] Please refer to Figure 4 , the patch group 23 comprises a rotary arm assembly and a second driving assembly 25, please refer to Figure 9 to Figure 13 , the rotary arm assembly comprises at least two binding arms 24, and can be extended to six binding arms 24, wherein at least one binding arm 24 is provided with a self-rotation driving member 253, and the binding arm 24 is provided with a second suction nozzle 240. The second driving assembly 25 comprises a flip driving member 251, a lifting driving member 252 and a self-rotation driving member 253, the flip driving member 251 is used to drive the rotary arm assembly to perform a flip motion, the self-rotation driving member 253 is used to control the second suction nozzle 240 to rotate around its axis, and the lifting driving member 252 is used to drive the second suction nozzle 240 to displace in the height direction.

[0094] Among them, the at least two binding arms 24 are arrayed and arranged on the output shaft of the flip driving member 251, and the flip driving member 251 is used to drive the at least two binding arms 24 to flip.

[0095] Please refer to Figure 9 , the patch group 23 is provided with two binding arms 24, which are symmetrically distributed at 180 degrees and are driven by the overturning driving member 251 of the second driving assembly 25 to perform a reciprocating overturning motion of 0 degrees to 180 degrees around a horizontal axis; the second suction nozzle 240 of one of the binding arms 24 receives the wafer 213 handed over by the overturning group 22 at the receiving position, and the second suction nozzle 240 of the other binding arm 24 can perform the wafer 213 pressing action at the mounting position.

[0096] In an embodiment, please refer to Figure 4 , Figure 7 and Figure 10 , when the patch group 23 adopts three binding arms 120-degree equidistantly distributed in the circumference, the three binding arms 24 are uniformly distributed on the output shaft of the overturning driving member 251, are spaced apart by 120 degrees, form a stable triangular symmetric structure, and enable each binding arm 24 to pass through the receiving position, the self-rotation position and the mounting position in turn in the rotation process, so as to realize continuous and uninterrupted wafer 213 mounting operation cycle. When the second suction nozzle 240 of the first binding arm 241 completes the wafer 213 handover with the overturning group 22 at the receiving position, the second suction nozzle 240 of the second binding arm 242 is fine-tuning the wafer 213 mounting posture at the self-rotation position, and the second suction nozzle 240 of the third binding arm 243 is synchronously performing the wafer 213 pressing action at the mounting position. The operations of the three stations can be performed synchronously to improve the work efficiency of the patch group 23.

[0097] Among them, please refer to Figure 4 and Figure 10 , the overturning group 22 adopts a double-rotation-arm 180-degree symmetric layout. When the first suction nozzle 2213 of the first rotation arm 2211 completes the wafer 213 picked up by the inclined pick pin structure, the first suction nozzle 2213 of the second rotation arm 2212 synchronously hands over the wafer 213 at the receiving position of the patch group 23. The first rotation arm 2211 and the second rotation arm 2212 alternately work through half a circle by the first driving assembly 222, thereby shortening the waiting time of single-arm overturning. The 120-degree circumferential array of the binding arms of the patch group 23 cooperates with the overturning group 22: when the rotation arm 221 of the overturning group 22 hands over the wafer 213 to the receiving position of the patch group 23, one of the binding arms 24 of the patch group 23 is just at the receiving position, the second suction nozzle 240 of the other binding arm 24 performs the posture compensation of the wafer 213 of 0 degrees to 360 degrees at the self-rotation position, and the second suction nozzle 240 of the third binding arm 243 descends and presses at the mounting position to paste the wafer 213 to the substrate unit 42. The patch group 23 and the overturning group 22 can work in time to connect with each other, so as to improve the work efficiency of the die bonding equipment 100.

[0098] Due to the spatial non-coplanar layout of the dispensing group 31 and the patch group 23, the dispensing work of the dispensing group 31 is not affected by the work of other mechanisms. Specifically, when the wafer disc 21 adjusts the position in the X-axis and Y-axis directions, the motion adjustment route of the wafer disc 21 does not interfere with the trajectory of the dispensing head of the dispensing group 31 in the non-coplanar layout. The double-arm flipping operation of the flipping group 22 and the multi-arm operation of the patch group 23 do not affect the dispensing work of the dispensing group 31. Further, the dispensing group 31 can first coat glue points on the substrate unit 42 along the second spatial axis B, and the substrate unit 42 is conveyed by the pulling group 40 to the mounting area overlapped with the projection of the patch group 23, thereby shortening the time for the patch group 23 to wait for the dispensing work of the dispensing group 31. While the dispensing group 31 works independently on the non-coplanar axis, the flipping group 22 picks up the wafer and the patch group 23 mounts to form a three-station closed loop from receiving rotation to pressing, thereby greatly improving the working efficiency of the die bonding equipment 100.

[0099] The die bonding equipment 100 further comprises a fourth vision camera 54 arranged on the side of the dispensing group 31 and facing the pulling group 40, and the fourth vision camera 54 photographs the dispensing position of the substrate unit 42 on the pulling group 40.

[0100] In an embodiment, the second vision camera 52 vertically monitors the position of the wafer 213 on the needle, and the data of the second vision camera 52 can guide the angle compensation of the self-rotation position of the patch group 23 in real time. The third vision camera 53 on the self-rotation position of the patch group 23 can also synchronously identify the position of the wafer 213 on the binding arm 24, and further can construct a spatial coordinate mapping network together with the fourth vision camera 54 on the side of the dispensing group 31, so as to realize the cross-domain cooperation of the vision system, and also enable the patch group 23 to accurately attach the wafer 213 to the substrate unit 42 on the pulling group 40.

[0101] The first spatial axis A and the second spatial axis B form an adjustable inclined angle ∠e in the horizontal projection plane, and the position of the wafer picking and patching mechanism 20 is more flexible, and the wafer picking and patching mechanism 20 and the dispensing mechanism 30 are arranged in three-dimensional space, thereby improving the space utilization and the cooperation efficiency.

[0102] Please refer to Figure 1 and Figure 7 The rack 10 further movably mounts the pulling group 40, the pulling group 40 has a material belt 41, and the second spatial axis B is along the running direction of the material belt 41; the material belt 41 has a plurality of substrate units 42, and the plurality of substrate units 42 are arranged in a column to form the material belt 41; the number of the material belt 41 is at least two, and the at least two material belts 41 are arranged in parallel.

[0103] The at least two parallel material belts 41 movably mounted on the rack 10 can be expanded to four, each material belt 41 is composed of a plurality of base material units 42 arranged linearly, and all the material belts 41 move synchronously along the first spatial axis A, i.e. the running direction of the material belt 41. Among them, the pulling group 40 can move along the vertical direction of the running direction of the material belt 41 on the rack 10, so that the position of the pulling group 40 is adjusted. By adjusting the position of the pulling group 40, the base material units 42 on the next column of material belts 41 can be moved to the lower side of the die group 23, so that the die group 23 can perform die 213 mounting on multiple columns of material belts 41.

[0104] In an embodiment, the die group 23 has three binding arms 24, when the first binding arm 241 of the die group 23 rotates to the mounting position, the first binding arm 241 presses the die 213 to the base material unit 42 of the first material belt, at this time, the second binding arm 242 synchronously rotates at the self-rotation position to adjust the mounting posture of the die 213, and the third binding arm 243 returns to the receiving position to receive the die.

[0105] After the second suction nozzle 240 of the first binding arm 241 completes the pressing work, the first binding arm 241 is flipped to the receiving position, during the flipping process of the first binding arm 241, the pulling group 40 moves on the Y axis, and the pulling group 40 can rotate, so that when the second binding arm 242 is flipped above the pulling group 40, the second binding arm 242 can press the die 213 to the base material unit 42 of the second material belt, the second suction nozzle 240 of the third binding arm 243 of the die group 23 rotates at the self-rotation position to adjust the mounting posture of the new die 213, so that the die group 23 can perform die 213 mounting on multiple columns of material belts 41.

[0106] Please refer to Figure 1 , Figure 7 and Figure 8 , in order to keep the surface of the wafer disc 21 and the material belt 41 on the pulling group 40 always parallel, the rack 10 includes a fixed table 11 and a stand 12, the stand 12 is installed on the fixed table, the fixed table 11 is arranged inclinedly relative to the horizontal axis, and an adjustable adjustment angle is formed between the fixed table 11 and the horizontal axis; the wafer disc 21 is installed on the stand 12 to fix the fixed table 11, the wafer disc 21 deflects synchronously with the inclination of the fixed table 11, so that the rotation angle ∠f of the wafer disc 21 relative to the horizontal axis is consistent with the adjustment angle.

[0107] When the fixing table 11 is placed in an inclined manner, the fixing table 11 is arranged to be inclined relative to a horizontal axis, and the wafer disc 21 is deflected synchronously with the inclination of the fixing table 11, so as to ensure that the direction in which the pin structure vertically lifts the wafer 213 and the wafer 213 is separated is orthogonal to the plane of the tape 41, so that in the process of pressing the wafer 213 to the tape 41 by the subsequent patch group 23, the wafer 213 can be attached to the tape 41 in a full-surface uniform contact manner, and then attached to the substrate unit 42, reducing the situation of wafer 213 unilateral stress concentration or wafer 213 cracking caused by angle deviation, and the attachment position of the wafer 213 attached to the substrate unit 42 is more accurate, so that the yield of the product is improved to 99.7%.

[0108] In the angle range of the rotation included angle ∠f of the wafer disc 21 relative to the horizontal axis is less than or equal to 30 degrees.

[0109] Specifically, please refer to Figure 3 , Figure 5 and Figure 6 The wafer disc 21 includes a moving wafer disc 210, a first horizontal moving assembly 211 and a second horizontal moving assembly 212, the fixed body 2111 of the first horizontal moving assembly is installed on the stand 12, the moving wafer disc 210 and the fixed body 2121 of the second horizontal moving assembly are installed on the movable body 2112 of the first horizontal moving assembly, the movable body 2112 of the first horizontal moving assembly moves relative to the stand 12 along a first direction to adjust the position of the moving wafer disc 210 and the second horizontal moving assembly 212 in the first direction; the moving wafer disc 210 is installed on the movable body 2122 of the second horizontal moving assembly, and the movable body 2122 of the second horizontal moving assembly moves relative to the stand 12 along a second direction to adjust the position of the moving wafer disc 210 and the second horizontal moving assembly 212 in the first direction. The wafer disc 21 can move in the first direction and the second direction to adjust the position. Wherein, the first direction is the Y-axis direction, and the second direction is the X-axis direction. Wherein, the first horizontal moving assembly 211 and the second horizontal moving assembly can be provided as a sliding block and a sliding rail.

[0110] In some embodiments, the wafer disc 21 is configured to: the wafer disc 21 moves along one or both of the first direction and the second direction of the stand 12 to adjust the position of the wafer disc 21 on the stand 12; the wafer disc 21 is inclined outward relative to the fixing table 11, and the wafer disc 21 has a rotation included angle ∠f relative to the horizontal axis.

[0111] Please refer to Figure 3 and Figure 4The wafer disc 21 is provided with a pin assembly 214, the pin assembly 214 comprises a pin cap and a pin structure, the pin structure is arranged in the pin cap, and the pin structure is protruded from the pin cap to eject the wafer 213; the pin structure is arranged opposite to a first suction nozzle 2213, and the pin structure and the first suction nozzle 2213 are arranged on the same axis, and the first suction nozzle 2213 is used to adsorb the wafer 213 on the pin structure.

[0112] Specifically, the pin assembly 214 comprises a pin cap and a pin structure, the pin structure is arranged in the pin cap, and the pin structure can eject the wafer 213 at a high frequency. The first suction nozzle 2213 on the first rotating arm 2211 vacuum-sucks the wafer 213. The first suction nozzle 2213 is provided with an independent vacuum channel, which is used to adsorb the wafer 213 at the pickup position. The first suction nozzle 2213 is arranged on the first rotating arm 2211 and is inclined relative to the first rotating arm 2211, and the first suction nozzle 2213 is arranged corresponding to the pin structure. The first suction nozzle 2213 is on the same axis as the pin assembly 214, so as to ensure that the first suction nozzle 2213 adsorbs the wafer 213 on the pin structure. The present application ensures that the central axis of the first suction nozzle 2213 coincides with the ejecting direction of the pin structure by arranging the first suction nozzle 2213 to be inclined and arranging the pin structure to be inclined and rotatable, so as to ensure that the adsorption force of the first suction nozzle 2213 acts vertically on the central plane of the wafer 213. After the first suction nozzle 2213 completes adsorption, the pin structure is immediately retracted below the plane of the pin cap, and the first suction nozzle 2213 carries the wafer 213 to perform a flip action with the first rotating arm 2211.

[0113] In some embodiments, the rack 10 is provided with a rotation adjusting mechanism, the rotation adjusting mechanism comprises a universal joint and a third driving assembly 26, the universal joint is arranged on the rack 10, the third driving assembly 26 is arranged on the universal joint, and the output shaft of the third driving assembly 26 is connected with the pin assembly 214, and the third driving assembly 26 is used to drive the pin assembly 214 to rotate, so as to adjust the rotation angle of the pin structure and the angle of the wafer 213 on the pin structure.

[0114] The third driving assembly 26 is a motor. The output shaft of the third driving assembly 26 is connected with the pin assembly 214, so that the pin assembly 214 can rotate by 360 degrees, thereby adjusting the angle of the wafer 213, so that the wafer 213 can be adsorbed by the first suction nozzle 2213 in a full-surface uniform contact manner, and the situation that the wafer 213 is single-side stress concentrated or the wafer 213 is cracked due to angle deviation is reduced.

[0115] In some embodiments, the die bonding apparatus 100 further comprises a mounting bracket arranged on the fixing table 11, and the flipping group 22 and the patching group 23 are arranged on the mounting bracket; the die bonding apparatus 100 further comprises a vision system arranged on the mounting bracket, and the vision system comprises a first vision camera 51 arranged to face the wafer disc 21, a second vision camera 52 arranged to face the flipping group 22, a third vision camera 53 arranged to face the patching group 23, a fourth vision camera 54 arranged to face the pulling group 40 and located on one side of the dispensing group 31, and a fifth vision camera 55 arranged to face the pulling group 40 and located on one side of the patching group 23.

[0116] Please refer to Figure 7 and Figure 8 The vision system realizes a full-closed-loop monitoring network through at least five video cameras. The first vision camera 51 is obliquely arranged at an angle of 45 degrees to face the needle structure at the wafer disc 21, and the first vision camera 51 can capture the microscopic state of the wafer 213 at the moment of being picked up on the needle structure to analyze whether the wafer 213 appears to be chipped or cracked. The second vision camera 52 is vertically aligned with the wafer 213 on the flipping group 22 to analyze and calculate the center coordinates of the wafer 213 in cooperation with an external controller to guide the precise adsorption of the suction nozzle of the patching group 23. The third vision camera 53 is used to take a picture of the wafer 213 when the binding arm 24 of the patching group 23 is in the self-rotating position to take a picture of the electrode pattern of the wafer 213, and a correction instruction is generated by combining a deep learning algorithm to make the binding arm 24 of the patching group 23 rotate to correct the patching posture of the wafer 213 in the self-rotating position. The fourth vision camera 54 is arranged on one side of the dispensing group 31 and can view the substrate unit 42 of the pulling group 40 at an angle of about 70 degrees to take a picture of the glue point pattern of the substrate unit 42. The fifth vision camera 55 is arranged on one side of the patching station, and the camera of the fifth vision camera 55 downwardly takes a picture of the substrate unit 42. The fifth vision camera 55 and the third vision camera 53 are electrically connected with each other, and when the binding arm 24 is pressed down, the fifth vision camera 55 and the third vision camera 53 are synchronized to compare the relative positions of the wafer electrode and the substrate unit 42 to realize dynamic patching correction.

[0117] The five vision cameras are mutually connected for data input and output to form a real-time feedback chain of “wafer picking-flipping-dispensing-patching”. Further, the fourth vision camera 54 and the fifth vision camera 55 are respectively located at the front and rear ends of the movement direction of the pulling group 40 to form a time stamp synchronized flight detection system. Even if the material belt 41 is conveyed at a high speed of 1 m / s, the two high-precision visual verifications can still be triggered when each substrate unit 42 passes through the dispensing and patching stations. The scheme changes the positioning dependence on mechanical precision of the traditional die bonding apparatus 100 to optical intelligent compensation, so that the patching yield of the die bonding apparatus 100 is improved. The five vision cameras of the present application can adopt existing image recognition positioning methods, calculation analysis methods and control methods. The present application does not repeat the methods used by the five vision cameras.

[0118] The five visual cameras can be CCD or CMOS.

[0119] The above merely illustrates the embodiments of the present application, and is not intended to limit the protection scope of the present application. Any equivalent structure transformation based on the technical concept of the present application, or direct / indirect application in other related technical fields, which is made according to the content of the present application specification and drawings, is included in the protection scope of the present application.

Claims

1. A die bonding device, characterized in that, It includes a frame, a die picking and placement mechanism, and a dispensing mechanism, wherein the die picking and placement mechanism and the dispensing mechanism are both located on the frame; The chip-attachment mechanism includes a wafer disk, a flipping group, and a patching group continuously distributed along the first spatial axis; The dispensing mechanism includes dispensing groups continuously distributed along the second spatial axis; The first spatial axis and the second spatial axis are arranged in a non-coplanar spatial configuration, and the first spatial axis and the second spatial axis form an adjustable tilt angle on the horizontal projection plane; The flipping assembly is tilted and mounted on the rack. The flipping assembly has at least one rotating arm, and each rotating arm is equipped with a first nozzle. The rotating arm is configured to receive a wafer from the wafer disk and flip its position to change from a pick-up position facing the wafer disk to a placement position facing the placement group, so as to transfer the wafer to the placement group. The placement group is configured to receive the wafer transferred by the flipping assembly and, through rotation and spatial pose transformation, change the wafer from a pick-up posture to a placement posture. The flipping assembly includes a first rotating arm and a second rotating arm, and further includes a first driving component. The first rotating arm and the second rotating arm are arrayed on the output shaft of the first driving component. Both the first rotating arm and the second rotating arm are equipped with a first suction nozzle. One of the first rotating arm and the second rotating arm is positioned towards the wafer disk to pick up the wafer from the wafer disk, and the other of the first rotating arm and the second rotating arm is positioned towards the mounting group to transfer the wafer to the mounting group. The first driving component is used to drive the first rotating arm and the second rotating arm to rotate around the output shaft of the first driving component, so that the first rotating arm rotates to the mounting position and the second rotating arm rotates to the picking position.

2. The die bonding equipment as described in claim 1, characterized in that, The die bonding equipment also includes a hot pressing mechanism, which is located on one side of the dispensing mechanism. The hot pressing mechanism includes an upper hot pressing head group, a lower hot pressing head group, and a pressure sensor. The upper hot pressing head group and the lower hot pressing head group are arranged opposite to each other, and the material strip is located between the upper hot pressing head group and the lower hot pressing head group. Both the upper hot pressing head group and the lower hot pressing head group are equipped with pressing heads, and each pressing head is equipped with a temperature control component.

3. The die bonding equipment as described in claim 2, characterized in that, The die bonding equipment also includes a vacuum buffer tank, which is located between the dispensing mechanism and the hot pressing mechanism or before the dispensing mechanism. The vacuum buffer tank includes an adsorption chamber, a fan, and an imaging device. The adsorption chamber has air extraction holes on both sides or at the bottom. The material belt passes through the adsorption chamber, the fan is located in the adsorption chamber and above the material belt, and the imaging device is used to photograph the material belt; The air extraction port is connected to a negative pressure source, which is used to extract air from below the material belt to control the tension of the material belt and suspend the material belt in the adsorption chamber.

4. The die bonding apparatus as described in claim 1, characterized in that, The wafer disk is equipped with a push pin assembly, which includes a top cap and a push pin structure. The push pin structure is disposed inside the top cap and extends relative to the top cap to push out the wafer. The frame is equipped with a rotation adjustment mechanism, which includes a universal joint and a third drive assembly. The universal joint is mounted on the frame, the third drive assembly is located on the universal joint, and the output shaft of the third drive assembly is connected to the ejector pin assembly. The third driving component is used to drive the ejector pin assembly to rotate, so as to adjust the rotation angle of the ejector pin structure and the angle of the wafer on the ejector pin structure.

5. The die bonding apparatus as described in claim 1, characterized in that, The wafer disk is configured such that it can move along one or both of the first and second directions in the rack to adjust its position in the rack. The wafer disk is tilted outward relative to the rack, and the wafer disk is tilted relative to the horizontal axis and has a rotation angle.

6. The die bonding apparatus as described in claim 1, characterized in that, The frame is movably mounted with a material pulling assembly, which has a material belt, and the second spatial axis is the running direction of the material belt; Each strip has multiple substrate units, which are arranged in a row; the number of strips is at least two, and the at least two strips are arranged in parallel to each other.

7. The die bonding apparatus as described in claim 6, characterized in that, The die bonding equipment also includes a mounting bracket on a fixed platform, and the flipping assembly and the patch assembly are mounted on the mounting bracket; The die bonding equipment also includes a vision system disposed on the mounting bracket. The vision system includes a first vision camera facing the wafer disk, a second vision camera facing the flip group, a third vision camera facing the placement group, a fourth vision camera facing the pulling group and located on one side of the dispensing group, and a fifth vision camera facing the pulling group and located on one side of the placement group.

8. The die bonding apparatus as described in claim 1, characterized in that, The frame includes a fixed platform and a vertical frame. The vertical frame is mounted on the fixed platform. The fixed platform is inclined relative to the horizontal axis, and an adjustable angle is formed between the fixed platform and the horizontal axis. The wafer disk is mounted on the vertical frame. The wafer disk rotates synchronously with the inclination of the fixed platform, so that the rotation angle of the wafer disk relative to the horizontal axis is consistent with the adjustable angle.

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