Optical module and optical module energy consumption control method

Abstract

The invention discloses an optical module and an optical module energy consumption control method. The optical module comprises a golden finger, a light emitting chip, a TEC chip, a CDR chip, an APD circuit, a light receiving chip and an MCU. The MCU comprises a power consumption register and an optical instruction register. The MCU is configured to control the TEC chip to be closed, the CDR chip to be closed, the voltage of the APD circuit to be reduced and the optical receiving chip to be closed when a power consumption instruction value in the power consumption register is a first preset value. And when the power consumption instruction value in the power consumption register is a second preset value and the optical instruction value in the optical instruction register is a third preset value, controlling the CDR chip to be turned on, controlling the optical receiving chip to be turned on, increasing the voltage of the APD circuit, controlling the emission driving chip to be turned on and controlling the TEC chip to be turned on. And when the power consumption instruction value in the power consumption register is a second preset value and the optical instruction value in the optical instruction register is a fourth preset value, controlling the optical emission chip to be closed.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical fiber communication technology, and in particular to an optical module and an optical module energy consumption control method. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, the optical module is a tool for converting optical and electrical signals, and is one of the key devices in optical communication equipment. With the development needs of optical communication technology, the transmission rate of the optical module is continuously improved.

[0003] The optical module is connected with the host computer, and the host computer can supply power to the functional chip of the optical module and provide control signals. When the optical module receives the light-off signal, the optical emission chip is turned off, and no control is performed on other optoelectronic chips, resulting in high power consumption. SUMMARY

[0004] The present application provides an optical module and an optical module energy consumption control method to reduce the power consumption of the optical module.

[0005] To solve the above technical problems, the present application discloses the following technical solutions:

[0006] In a first aspect, the present application discloses an optical module, comprising:

[0007] A golden finger receives a low-power instruction from the outside;

[0008] An optical emission chip is configured to convert an electrical signal into an optical signal;

[0009] A TEC chip is configured to control the temperature of the optical emission chip;

[0010] A CDR chip;

[0011] An APD circuit;

[0012] An optical receiving chip is configured to convert an external optical signal into an electrical signal;

[0013] An MCU is connected with the golden finger, and the MCU includes a power consumption register and an optical instruction register;

[0014] The MCU is configured to:

[0015] When the power consumption instruction value in the power consumption register is a first preset value, the TEC chip is controlled to be turned off, the CDR chip is controlled to be turned off, the voltage of the APD circuit is controlled to be reduced, and the optical receiving chip is controlled to be turned off;

[0016] when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is the third preset value, the CDR chip is controlled to be turned on, the light receiving chip is controlled to be turned on, the voltage of the APD circuit is increased, the light emitting chip is controlled to be turned on, and the TEC chip is controlled to be turned on;

[0017] when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is the fourth preset value, the light emitting chip is controlled to be turned off.

[0018] In a second aspect, the embodiments of the present application disclose a power consumption control method of an optical module, comprising:

[0019] when the power consumption instruction value in the power consumption register is the first preset value, the TEC chip is controlled to be turned off, the CDR chip is controlled to be turned off, the voltage of the APD circuit is decreased, and the light receiving chip is controlled to be turned off;

[0020] when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is the third preset value, the CDR chip is controlled to be turned on, the light receiving chip is controlled to be turned on, the voltage of the APD circuit is increased, the light emitting chip is controlled to be turned on, and the TEC chip is controlled to be turned on;

[0021] when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is the fourth preset value, the light emitting chip is controlled to be turned off.

[0022] In a third aspect, the embodiments of the present application disclose an optical module, comprising: a golden finger configured to receive a low-power consumption instruction from an external device; and a light-off instruction from the external device.

[0023] a light emitting chip configured to convert an electrical signal into an optical signal;

[0024] a TEC chip configured to control the temperature of the light emitting chip;

[0025] a CDR chip;

[0026] an APD circuit;

[0027] a light receiving chip configured to convert an external optical signal into an electrical signal;

[0028] an MCU connected to the golden finger, the MCU being configured to:

[0029] preset a power consumption order table of the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip,

[0030] receive a low-power consumption instruction, and control the light emitting chip, the TEC chip, the CDR chip, the APD circuit, and the light receiving chip according to the power consumption sequence table.

[0031] In a fourth aspect, the embodiments of the present application disclose a light module, comprising: a golden finger configured to receive a low-power consumption instruction from outside; and a light-off instruction from outside.

[0032] a light emitting chip configured to convert an electrical signal into an optical signal;

[0033] a TEC chip configured to control a temperature of the light emitting chip;

[0034] a CDR chip;

[0035] an APD circuit;

[0036] a light receiving chip configured to convert an external optical signal into an electrical signal;

[0037] an MCU connected to the golden finger, the MCU being configured to:

[0038] preset a power consumption sequence table of the light emitting chip, the TEC chip, the CDR chip, the APD circuit, and the light receiving chip,

[0039] when a power consumption instruction value in a power consumption register is a first preset value, control the light emitting chip, the TEC chip, the CDR chip, the APD circuit, and the light receiving chip to be turned off according to the power consumption sequence table;

[0040] when the power consumption instruction value in the power consumption register is a second preset value and a light instruction value in a light instruction register is a third preset value, control the CDR chip to be turned on, control the light receiving chip to be turned on, increase a voltage of the APD circuit, control the light emitting chip to be turned on, and control the TEC chip to be turned on;

[0041] when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is a fourth preset value, control the light emitting chip to be turned off.

[0042] In a fifth aspect, the embodiments of the present application disclose a power consumption control method of a light module, comprising: when a previous power consumption instruction value is a second preset value and a current power consumption instruction value is a first preset value, controlling the CDR chip to be turned off, the TEC chip to be turned off, the light receiving chip to be turned off, the light emitting chip to be turned off, and reducing a voltage of the APD circuit.

[0043] The previous power consumption instruction value is a first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is a third preset value, and the current light instruction value is a fourth preset value, and the emission driving chip is controlled to be turned off.

[0044] The previous power consumption instruction value is a first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is a third preset value, and the current light instruction value is a fourth preset value, and the emission driving chip is controlled to be turned off.

[0045] Compared with the prior art, the application has the following beneficial effects:

[0046] The application discloses an optical module and an optical module energy consumption control method. The optical module comprises a golden finger, an optical emission chip, a TEC chip, a CDR chip, an APD circuit, an optical receiving chip and an MCU. The MCU comprises a power consumption register and a light instruction register. The MCU is configured to: when the power consumption instruction value in the power consumption register is a first preset value, control the TEC chip to be turned off, control the CDR chip to be turned off, control the voltage of the APD circuit to be reduced, and control the optical receiving chip to be turned off; when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, control the CDR chip to be turned on, control the optical receiving chip to be turned on, increase the voltage of the APD circuit, control the optical emission chip to be turned on, and control the TEC chip to be turned on; and when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is a fourth preset value, control the optical emission chip to be turned off. The MCU receives a low-power consumption instruction from the outside through the golden finger, and controls the optical emission chip to be turned off, the TEC chip to be turned off, the CDR chip to be turned off, the voltage of the APD circuit to be reduced, and the optical receiving chip to be turned off according to the low-power consumption instruction, thereby reducing the power consumption. BRIEF DESCRIPTION OF DRAWINGS

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0048] Figure 1 A partial structure diagram of an optical communication system according to some embodiments is provided.

[0049] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided.

[0050] Figure 3A structural diagram of an optical module according to some embodiments;

[0051] Figure 4 An exploded view of an optical module according to some embodiments;

[0052] Figure 5 A first partial structural diagram of an optical module according to some embodiments;

[0053] Figure 6 A structural diagram of an MCU according to some embodiments;

[0054] Figure 7 A second partial structural diagram of an optical module according to some embodiments;

[0055] Figure 8 A schematic diagram of an optical module power consumption control method according to some embodiments Figure 1 ;

[0056] Figure 9 A schematic diagram of an optical module power consumption control method according to some embodiments Figure 2 ;

[0057] Figure 10 A flowchart of an optical module power consumption control method according to some embodiments Figure 1 ;

[0058] Figure 11 A flowchart of an optical module power consumption control method according to some embodiments Figure 2 . DETAILED DESCRIPTION

[0059] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0060] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is to be interpreted as meaning "including but not limited to"; the terms "first", "second" are not to be interpreted as indicating or implying relative importance or indicating the upper limit of the number; the term "multiple" means two or more; the term "connected" is to be interpreted broadly, for example, "connected" can be fixed connection, or detachable connection, or integral, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted for" or "configured for" means open and inclusive language, which does not exclude devices adapted for or configured for performing additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush" and the like are not limited to absolute mathematical theoretical relationship, but also include acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0061] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is realized by the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so as to realize high-speed, long-distance and low-cost information transmission. The signal that can be recognized and processed by the information processing device is an electrical signal. The information processing device usually includes an optical network terminal (Optical Network Unit, ONU), gateway, router, switch, mobile phone, computer, server, tablet computer, television and the like, and the information transmission device usually includes optical fiber and optical waveguide and the like.

[0062] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as the host machine of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be referred to as an electrical port.

[0063] Figure 1 Figure 1 is a schematic diagram of a part of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly comprises a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101 and a network cable 103. Figure 2

[0064] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. An optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby achieving long-distance and low-power-loss information transmission.

[0065] The optical communication system can comprise one or more optical fibers 101, and the optical fiber 101 can be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide a data signal to the optical module 200, or to receive a data signal from the optical module 200, or to monitor or control the working state of the optical module 200.

[0066] The host computer 100 comprises a housing which is generally cuboid, and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to access the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0067] ​The host computer 100 further comprises an external electrical interface configured to access an electrical signal network. For example, the external electrical interface comprises a Universal Serial Bus (USB) interface or a network cable interface 104 configured to access a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and the fourth electrical signal is transmitted to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0068] The host computer 100 comprises an optical network terminal, an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, etc.

[0069] Figure 2 A partial structural diagram of a host computer according to some embodiments is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 3 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 4 shown, the host computer 100 further comprises a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0070] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0071] Figure 3 is a structural diagram of an optical module provided according to some embodiments. Figure 4 FIG1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 3 As shown, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0072] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0073] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0074] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0075] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 4 The opening 205 is also located at the end of the optical module 200 ( Figure 5Or, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port and are inserted into the electrical connector of the host computer 100; the opening 205 is an optical port configured to access the external optical fiber 101 so that the optical fiber 101 connects the optical transmitting component 400 and the optical receiving component 500 in the optical module 200.

[0076] The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the optical transmitting component 400, the optical receiving component 500, etc. in the shells, and the shells can encapsulate and protect the devices. In addition, when the circuit board 300, the optical transmitting component 400, the optical receiving component 500, etc. are assembled, the positioning components, the heat dissipation components, and the electromagnetic shielding components of these devices can be arranged, which facilitates the automated production.

[0077] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0078] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside the shell of the optical module 200. The unlocking component 600 is configured to achieve the fixed connection between the optical module 200 and the host computer or to release the fixed connection between the optical module 200 and the host computer.

[0079] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202 and includes a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, releasing the fixation between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out of the cage 106.

[0080] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding, etc. The electronic components may, for example, include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may, for example, include Microcontroller Units (MCUs), laser drive chips, Transimpedance Amplifiers (TIAs), Limiting Amplifiers (LIAs), Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0081] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize a bearing function, such as stably bearing the above-mentioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0082] The circuit board 300 also includes a gold finger formed on the surface of its end portion. The gold finger is composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106, and the gold finger is in conduction with the electrical connector in the cage 106. The gold finger can be provided only on the surface of one side of the circuit board 300 (for example, the upper surface as shown in the figure), or can be provided on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish electrical connection with the host computer to realize power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to serve as a supplement to the rigid circuit board. Figure 5

[0083] At least one of the optical transmitting component 400 or the optical receiving component 500 is located on the side of the circuit board 300 away from the gold finger. The optical transmitting component 400 is used to emit optical signals. The optical receiving component 500 is used to receive optical signals.

[0084] In some embodiments, the optical transmitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively.

[0085] ​In some embodiments, at least one of the light emitting component or the light receiving component can be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component can be disposed on a surface of the circuit board 300 or a side edge of the circuit board 300.

[0086] Figure 6 A first partial structure schematic diagram of a light module according to some embodiments is provided. As shown in some embodiments, the light module can include a golden finger 301. The golden finger 301 can be in communication connection with a host computer. Figure 7

[0087] The light module can include an MCU 311. The MCU 311 can be connected with the golden finger 301 and receive a communication signal from the host computer. In some embodiments, the MCU 311 can receive a light-off instruction from the host computer. The MCU 311 can receive a low-power consumption instruction from the host computer.

[0088] The host computer can issue a light-off instruction through IIC. The host computer can issue a low-power consumption instruction through IIC.

[0089] The light module can include a transmission driving chip 313. The transmission driving chip 313 can be connected with the MCU 311. The MCU 311 controls the transmission driving chip to control the switching of the light emitting chip.

[0090] The light module can include a TEC chip. The MCU 311 can control the temperature of the TEC chip.

[0091] The light module can include a TEC control chip 312. The TEC control chip 312 can be connected with the MCU 311. The MCU 311 can control the voltage of the TEC control chip 312.

[0092] The light module can include a CDR chip 315. The CDR chip 315 can be connected with the MCU 311. The MCU can control the switching of the CDR chip.

[0093] The light module can include an APD circuit 314. The APD circuit 314 can be connected with the MCU 311. The MCU can control the voltage of the APD control circuit. The APD circuit is a photodetector boost circuit.

[0094] The light module can include a light receiving chip 316. The light receiving chip 316 can be connected with the MCU 311. The light receiving chip 316 can convert the optical signal into an electrical signal. The MCU can control the switching of the light receiving chip.

[0095] Figure 8 A MCU structure schematic diagram according to some embodiments is provided. Figure 1 ​A second partial structure schematic diagram of a light module according to some embodiments.

[0096] In some embodiments, the MCU 311 can include a transmission control pin 3111. The transmission control pin 3111 is connected with the transmission driving chip 313. The MCU can write a transmission closing signal into a register in the transmission driving chip 313 through the transmission control pin 3111 to realize the switching of the light transmission chip.

[0097] For example, when the value of the register in the transmission driving chip 313 is 0, the transmission driving chip 313 does not output a driving voltage to the light transmission chip to make the light transmission chip close. When the value of the register in the transmission driving chip 313 is 1, the transmission driving chip 313 outputs a driving voltage to the light transmission chip to make the light transmission chip open.

[0098] The light module can include a TEC control chip 312. The TEC control chip 312 can be connected with the MCU 311. The MCU 311 can control the voltage of the TEC control chip 312.

[0099] In some embodiments, the TEC control chip 312 can be a temperature control chip, and the TEC control chip 312 can be GNA4007, SGM41296, etc. A temperature control voltage is output by the MCU to the TEC control chip 312 to realize temperature feedback control through the temperature control voltage. The TEC control chip 312 can control the temperature of the TEC, and the light transmission chip is in heat conduction connection with the TEC, and the TEC can control the temperature of the light transmission chip.

[0100] The MCU 311 can include a temperature control pin 3112. The temperature control pin 3112 is connected with the TEC control chip 312. The MCU can control the switching of the TEC chip by controlling the size of the temperature control voltage output.

[0101] The light module can include a CDR chip 315. The CDR chip 315 can be connected with the MCU 311.

[0102] In some embodiments, the MCU 311 can include a CDR control pin 3113. The CDR control pin 3113 is connected with the CDR chip 315. The MCU can write a CDR control signal into a register in the CDR control pin 3113 through the CDR control pin 3113 to realize the switching of the light transmission chip.

[0103] For example, when the value of the register in the CDR control pin 3113 is 0, the CDR control pin 3113 does not output a driving voltage to the light emitting chip, so that the light emitting chip is turned off. When the value of the register in the CDR control pin 3113 is 1, the transmitting driving chip 313 outputs a driving voltage to the light emitting chip, so that the light emitting chip is turned on.

[0104] The optical module can comprise an APD circuit 314. The APD circuit 314 can be connected with the MCU 311.

[0105] In some embodiments, the MCU 311 can comprise an APD control pin 3114. The APD control pin 3114 is connected with the APD control circuit 314. The MCU can control the voltage of the APD control circuit through the APD control pin 3114.

[0106] The APD circuit 314 can be connected with the light emitting chip, for adjusting the output optical power of the light emitting chip.

[0107] The optical module can comprise a light receiving chip 316. The light receiving chip 316 can be connected with the MCU 311. The light receiving chip 316 can convert the optical signal into an electrical signal.

[0108] In some embodiments, the MCU 311 can comprise a receiving control pin 3115. The receiving control pin 3115 is connected with the light receiving chip 316. The MCU can write a signal for turning off the light receiving chip into a register in the light receiving chip 316 through the receiving control pin 3115, so as to realize the switching of the light receiving chip 316.

[0109] In some embodiments, the MCU is provided with a power consumption register. When the value of the power consumption instruction in the power consumption register is a first preset value, it represents that a low power consumption instruction is received. When the value of the power consumption instruction in the power consumption register is a second preset value, it represents that a high power consumption instruction is received.

[0110] In some embodiments, the first preset value can be 1, and the second preset value can be 0. Or the first preset value is 0, and the second preset value is 1. The host computer can write the power consumption instruction into the power consumption register. In some embodiments, the MCU is provided with a light instruction register. When the value of the light instruction in the power consumption register is a third preset value, it represents that a light-on instruction is received. When the value of the light instruction in the power consumption register is a fourth preset value, it represents that a light-off instruction is received.

[0111] In some embodiments, the third preset value can be 1, and the fourth preset value can be 0. Or the third preset value is 0, and the fourth preset value is 1. The host computer can write the light instruction into the light instruction register.

[0112] The MCU can be configured to control the switch of the emission driving chip according to the light-on instruction and the low-power consumption instruction.

[0113] The MCU can be configured to receive the low-power consumption instruction, and control the emission driving chip to be closed when the light-on instruction is received, so as to close the light emission chip. When the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, the emission driving chip is controlled to be closed, so as to close the light emission chip.

[0114] The MCU can be configured to receive the low-power consumption instruction, and control the light emission chip to be closed when the light-on instruction is received. When the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, the light emission chip is controlled to be closed.

[0115] In some embodiments, closing the emission driving chip can be writing an emission control signal into a register in the emission driving chip 313 to realize the switch of the light emission chip.

[0116] In some embodiments, closing the light emission chip can be realized by closing the emission driving chip.

[0117] The MCU can be configured to control the TEC control chip to be closed when the low-power consumption instruction and the light-on instruction are received.

[0118] When the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, the TEC control chip is controlled to be closed.

[0119] In some embodiments, closing the TEC control chip can be outputting a temperature control voltage to make the TEC control chip closed. The MCU sends the temperature control voltage to make the TEC control chip closed.

[0120] The MCU can be configured to control the CDR chip to be closed when the low-power consumption instruction and the light-on instruction are received.

[0121] When the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to be closed.

[0122] In some embodiments, closing the CDR chip can be writing a CDR control signal into a register in the CDR chip to realize the switch of the CDR chip. The MCU sends a closing CDR chip instruction to the CDR chip.

[0123] The MCU can be configured to reduce the voltage of the APD circuit when the low-power consumption instruction and the light-on instruction are received.

[0124] In some embodiments, the MCU can be configured to: receive the low-power instruction, receive the light-on instruction, send a CDR chip closing instruction to the CDR chip, send a temperature control voltage to make the TEC control chip close, send a light receiving chip closing signal to the light receiving chip, reduce the voltage of the APD circuit, and send a light emitting driving chip closing signal to the light emitting driving chip to close the light emitting chip. In some embodiments, the light emitting chip is closed after the TEC control chip is closed to ensure that the light emitting chip has a suitable temperature during light emission.

[0125] The MCU can be configured to: when the power consumption instruction value in the power consumption register is a first preset value and the light instruction value in the light instruction register is a third preset value, send a CDR chip closing instruction to the CDR chip, send a temperature control voltage to make the TEC control chip close, send a light receiving chip closing signal to the light receiving chip, reduce the voltage of the APD circuit, and send a light emitting driving chip closing signal to the light emitting driving chip to close the light emitting chip.

[0126] The MCU can be configured to: receive the low-power instruction, receive the light-on instruction, control the CDR chip to close, control the light receiving chip to close, reduce the voltage of the APD circuit, control the light emitting driving chip to close, and control the TEC control chip to close. The CDR chip is closed, the TEC control chip is closed, the light receiving chip is closed, the light emitting driving chip is closed, and the voltage of the APD circuit is reduced to reduce power consumption.

[0127] In some embodiments, the MCU controls the process when receiving the low-power instruction and receiving the light-on instruction is the same as when receiving the low-power instruction and receiving the light-off instruction.

[0128] The MCU can be configured to: receive the low-power instruction, receive the light-off instruction, control the CDR chip to close, control the light receiving chip to close, reduce the voltage of the APD circuit, control the light emitting chip to close, and control the TEC control chip to close. The CDR chip is closed, the TEC control chip is closed, the light receiving chip is closed, the light emitting chip is closed, and the voltage of the APD circuit is reduced to reduce power consumption.

[0129] In some embodiments, the MCU can preset a power consumption ranking table of optoelectronic devices, and after receiving the low-power instruction, the optoelectronic devices with a power consumption ranking less than or equal to a preset value are closed. The power consumption ranking table is arranged in descending order of power consumption.

[0130] In some examples, the preset value can be 3; the preset value can be 4; the preset value can be 5; the preset value can be 6 or other values.

[0131] In some examples, the MCU can preset a power consumption ranking table of optoelectronic devices, and after receiving the low-power instruction, the optoelectronic devices with a power consumption ranking less than or equal to 5 are closed.

[0132] In some embodiments, the MCU can be configured to receive the low power consumption instruction, and control the light emitting chip to be turned off according to the preset power consumption ranking table.

[0133] The MCU can be configured to receive the low power consumption instruction, and control the first power consumption device to be turned off according to the preset power consumption ranking table, control the second power consumption device to be turned off, and control the third power consumption device to be turned off.

[0134] The MCU can be configured to receive the low power consumption instruction and the light-off instruction, and control the emission driving chip to be turned off to turn off the light emitting chip.

[0135] When the power consumption instruction value in the power consumption register is the first preset value, and the light instruction value in the light instruction register is the third preset value, it represents that the low power consumption instruction and the light-off instruction are received.

[0136] When the power consumption instruction value in the power consumption register is the first preset value, and the light instruction value in the light instruction register is the third preset value, the emission driving chip is controlled to be turned off to turn off the light emitting chip.

[0137] In some embodiments, turning off the emission driving chip can be writing an emission control signal into a register in the emission driving chip 313 to turn on or off the light emitting chip.

[0138] The MCU can be configured to receive the low power consumption instruction and the light-off instruction, and control the TEC chip to be turned off.

[0139] The MCU can be configured to receive the low power consumption instruction and the light-off instruction, and control the TEC control chip to be turned off.

[0140] In some embodiments, controlling the TEC control chip to be turned off can be outputting a temperature control voltage to make the TEC control chip turned off. The MCU sends the temperature control voltage to make the TEC control chip turned off.

[0141] The MCU can be configured to receive the low power consumption instruction and the light-off instruction, and control the CDR chip to be turned off.

[0142] In some embodiments, controlling the CDR chip to be turned off can be writing a CDR control signal into a register in the CDR chip to turn on or off the CDR chip. The MCU sends a CDR chip turning off instruction to the CDR chip.

[0143] The MCU can be configured to receive the low power consumption instruction and the light-off instruction, and reduce the voltage of the APD circuit.

[0144] In some embodiments, the MCU can be configured to, when receiving the low-power consumption instruction and the light-off instruction, send a CDR chip closing instruction to the CDR chip, send a temperature control voltage to make the TEC control chip close, send a light receiving chip closing signal to the light receiving chip, reduce the voltage of the APD circuit, and send a light emitting driving chip closing signal to the light emitting driving chip to close the light emitting chip. In some embodiments, the light emitting chip is closed after the TEC control chip is closed to ensure that the light emitting chip has a proper temperature during light emission.

[0145] The MCU can be configured to, when receiving the low-power consumption instruction and the light-off instruction, control the CDR chip to close, control the light receiving chip to close, reduce the voltage of the APD circuit, control the light emitting driving chip to close, and control the TEC control chip to close. The CDR chip is closed, the TEC control chip is closed, the light receiving chip is closed, the light emitting driving chip is closed, and the voltage of the APD circuit is reduced to reduce power consumption.

[0146] In some embodiments, the MCU controls the process when receiving the low-power consumption instruction and the light-off instruction in the same way as when receiving the low-power consumption instruction and the light-on instruction.

[0147] The MCU can be configured to, when receiving the low-power consumption instruction and the light-off instruction, control the CDR chip to close, control the light receiving chip to close, reduce the voltage of the APD circuit, control the light emitting driving chip to close, and control the TEC control chip to close. The CDR chip is closed, the TEC control chip is closed, the light receiving chip is closed, the light emitting driving chip is closed, and the voltage of the APD circuit is reduced to reduce power consumption.

[0148] In some embodiments, when receiving the low-power consumption instruction and the light-off instruction, the light emitting chip can be controlled to close first, and then the TEC chip is closed. Receiving the light-off instruction indicates that the optical module currently has no signal transmission requirement, and temperature control is not needed.

[0149] The MCU can be configured to, when receiving the low-power consumption instruction and the light-off instruction, control the CDR chip to close, control the light receiving chip to close, reduce the voltage of the APD circuit, control the TEC control chip to close, and control the light emitting chip to close. The CDR chip is closed, the TEC chip is closed, the light receiving chip is closed, the light emitting chip is closed, and the voltage of the APD circuit is reduced to reduce power consumption.

[0150] The control sequence of the CDR chip, the APD circuit, and the light receiving chip can be arranged according to the size of the power consumption; or can be arranged according to any sequence.

[0151] In some embodiments, the MCU can have a pre-set power consumption sequence table of optoelectronic devices, and after receiving the low-power consumption instruction, the optoelectronic devices with a power consumption less than or equal to a pre-set value are closed. The power consumption sequence table is arranged in descending order of power consumption.

[0152] In some examples, the preset value can be 3; the preset value can be 4; the preset value can be 5; the preset value can be 6 or other values.

[0153] In some examples, the MCU can preset the power consumption order table of the optoelectronic devices, and after receiving the low-power consumption instruction, the optoelectronic devices with power consumption less than or equal to 5 are turned off.

[0154] In some examples, the MCU can preset the power consumption order table of the optoelectronic devices, and after receiving the low-power consumption instruction, the optoelectronic devices with power consumption less than or equal to 6 are turned off.

[0155] In some embodiments, the MCU can be configured to turn on the low-power consumption mode when the power consumption instruction value in the power consumption register is the first preset value.

[0156] When the power consumption instruction value in the power consumption register is the first preset value, the MCU sends a CDR chip closing instruction to the CDR chip, sends a temperature control voltage to make the TEC control chip close, sends a light receiving chip closing signal to the light receiving chip, reduces the voltage of the APD circuit, and sends a light emitting driving chip closing signal to the light emitting driving chip to close the light emitting chip.

[0157] When the power consumption instruction value in the power consumption register is the first preset value, the MCU controls the CDR chip to close, controls the light receiving chip to close, reduces the voltage of the APD circuit, controls the light emitting driving chip to close, and controls the TEC control chip to close. The CDR chip is closed, the TEC control chip is closed, the light receiving chip is closed, the light emitting driving chip is closed, and the voltage of the APD circuit is reduced, thereby reducing power consumption.

[0158] When the power consumption instruction value in the power consumption register is the first preset value, it means that a low-power consumption instruction is received. At this time, it can be unnecessary to determine whether to turn off the light and enter the low-power consumption mode.

[0159] In some embodiments, the power consumption instruction value in the power consumption register can be changed from the second preset value to the first preset value, which means that the MCU receives a low-power consumption instruction.

[0160] The MCU can be configured to control the CDR chip to close, control the light receiving chip to close, reduce the voltage of the APD circuit, control the light emitting driving chip to close, and control the TEC control chip to close when the power consumption instruction value in the power consumption register is changed from the second preset value to the first preset value. The CDR chip is closed, the TEC control chip is closed, the light receiving chip is closed, the light emitting driving chip is closed, and the voltage of the APD circuit is reduced, thereby reducing power consumption.

[0161] Figure 8 A schematic diagram of a method for controlling the power consumption of an optical module according to some embodimentsFigure 9 As shown in Figure 2 The application provides a power consumption control method of an optical module, which can include:

[0162] S100: receiving a low-power instruction. The power consumption instruction value in the power consumption register is a first preset value.

[0163] S200: turning off the light emitting chip.

[0164] S300: turning off the TEC chip.

[0165] S400: turning off the CDR chip.

[0166] S500: reducing the voltage of the APD circuit.

[0167] S600: turning off the light receiving chip.

[0168] When the optical module receives the low-power instruction, the light emitting chip, the TEC chip, the CDR chip and the light receiving chip are turned off, and the voltage of the APD circuit is reduced, so that the power consumption of the optical module is reduced to meet the low-power requirement.

[0169] In some embodiments, the MCU can be configured to receive a high-power instruction, receive a light-on instruction, and control the TEC control chip to turn on to make the TEC work normally.

[0170] When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, it represents that the MCU receives the high-power instruction and the light-on instruction, and at this time, the high-power light-on mode is entered.

[0171] The MCU can be configured to receive a high-power instruction, receive a light-on instruction, and control the CDR chip to turn on. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to turn on.

[0172] In some embodiments, controlling the CDR chip to turn on can be writing a CDR control signal into a register in the CDR chip to realize the switching of the CDR chip. The MCU sends a CDR chip turning-on instruction to the CDR chip. After the CDR chip receives the CDR chip turning-on instruction, it starts to work.

[0173] The MCU can be configured to receive a high-power instruction, receive a light-on instruction, and control the light emitting chip to turn on. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the light emitting chip is controlled to turn on.

[0174] The MCU can be configured to receive a high-power consumption instruction, receive a light-on instruction, and control the emission driving chip to turn on to enable the light emission chip to turn on. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the emission driving chip is controlled to turn on to enable the light emission chip to turn on.

[0175] In some embodiments, turning on the emission driving chip can be writing an emission control signal into a register in the emission driving chip 313 to realize the switching of the light emission chip.

[0176] In some embodiments, turning on the light emission chip can be realized by turning on the emission driving chip.

[0177] The MCU can be configured to receive a high-power consumption instruction, receive a light-on instruction, and control the TEC chip to turn on. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the TEC chip is controlled to turn on.

[0178] Controlling the TEC chip to turn on can be realized by controlling the TEC driving chip.

[0179] In some embodiments, turning on the TEC control chip can be outputting a temperature control voltage to enable the TEC control chip to turn on. The MCU sends a temperature control voltage to enable the TEC control chip to turn off.

[0180] The MCU can be configured to receive a high-power consumption instruction, receive a light-on instruction, and control the CDR chip to turn on. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the CDR chip is controlled to turn on.

[0181] In some embodiments, controlling the CDR chip to turn on can be writing a CDR control on signal into a register in the CDR chip to realize the switching of the CDR chip. The MCU sends an on-chip instruction to the CDR chip.

[0182] The MCU can be configured to receive a high-power consumption instruction, receive a light-on instruction, and increase the voltage of the APD circuit. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the voltage of the APD circuit is increased.

[0183] In some embodiments, the MCU can be configured to: receive a high-power consumption instruction, receive a light-on instruction, send a CDR chip start-up instruction to the CDR chip, send a temperature control voltage to start up the TEC control chip, send a light receiving chip start-up signal to the light receiving chip, increase the voltage of the APD circuit, and send a light emitting driving signal to the transmitting driving chip to start up the light emitting chip. In some embodiments, the light emitting chip is started up after the TEC control chip is started up to ensure that the light emitting chip has a proper temperature during light emission.

[0184] The MCU can be configured to: receive a high-power consumption instruction, receive a light-on instruction, control the CDR chip to start up, control the light receiving chip to start up, increase the voltage of the APD circuit, control the transmitting driving chip to start up, and control the TEC control chip to start up. The CDR chip, the TEC control chip, the light receiving chip, the light emitting chip, and the APD circuit are started up to realize light emission or light signal reception of the optical module.

[0185] Figure 9 An optical module power consumption control method according to some embodiments Figure 10 . As shown in Figure 1 , the present application provides an optical module power consumption control method, which can include:

[0186] T100: receiving a high-power consumption instruction and a light-on instruction, and starting up the TEC chip.

[0187] T200: receiving a high-power consumption instruction and a light-on instruction, and starting up the light emitting chip.

[0188] T300: receiving a high-power consumption instruction and a light-on instruction, and starting up the CDR chip.

[0189] T400: receiving a high-power consumption instruction and a light-on instruction, and increasing the voltage of the APD circuit.

[0190] S500: receiving a high-power consumption instruction and a light-on instruction, and starting up the light receiving chip.

[0191] When the optical module receives a low-power consumption instruction and does not receive a light-off instruction, the light emitting chip, the TEC chip, the CDR chip, and the light receiving chip are started up, and the voltage of the APD circuit is increased, so that the transmitting and receiving functions of the optical module operate normally.

[0192] In some embodiments, the light-on instruction can be a switch-on instruction.

[0193] In some embodiments, the MCU can be configured to receive a high-power consumption instruction, receive a light-off instruction, and control the light-emitting chip to be turned off. When the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a fourth preset value, the MCU controls the light-emitting chip to be turned off.

[0194] The MCU can be provided with a first state memory, which can be used to store the previous power consumption instruction value.

[0195] In some embodiments, the MCU can be provided with a second state memory, which can be used to store the previous light instruction value.

[0196] The MCU can be configured to remain unchanged when the previous power consumption instruction value is a first preset value and the current power consumption instruction value is the first preset value.

[0197] The MCU can be configured to control the CDR chip to be turned off, control the light-receiving chip to be turned off, reduce the voltage of the APD circuit, control the light-emitting driving chip to be turned off, and control the TEC control chip to be turned off when the previous power consumption instruction value is a second preset value and the current power consumption instruction value is the first preset value. The CDR chip is turned off, the TEC control chip is turned off, the light-receiving chip is turned off, the light-emitting driving chip is turned off, the voltage of the APD circuit is reduced, and the power consumption is reduced.

[0198] When the previous power consumption instruction value is a second preset value and the current power consumption instruction value is a first preset value, the MCU enters a low-power consumption mode. At this time, there is no need to compare the previous light instruction value with the current light instruction value.

[0199] The MCU can be configured to control the CDR chip to be turned on, control the light-receiving chip to be turned on, increase the voltage of the APD circuit, control the light-emitting driving chip to be turned on, and control the TEC control chip to be turned on when the previous power consumption instruction value is a first preset value and the current power consumption instruction value is a second preset value, and the previous light instruction value is a third preset value and the current light instruction value is the third preset value. The CDR chip is turned on, the TEC control chip is turned on, the light-receiving chip is turned on, the light-emitting chip is turned on, and the voltage of the APD circuit is increased, so that the optical module emits light or receives optical signals.

[0200] The MCU can be configured to control the CDR chip to be turned on, control the light-receiving chip to be turned on, increase the voltage of the APD circuit, and control the TEC control chip to be turned on when the previous power consumption instruction value is a first preset value and the current power consumption instruction value is a second preset value, and the previous light instruction value is a fourth preset value and the current light instruction value is the fourth preset value. The CDR chip is turned on, the TEC control chip is turned on, the light-receiving chip is turned on, and the voltage of the APD circuit is increased, so that the optical module emits light or receives optical signals.

[0201] The MCU can be configured to: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the second preset value; when the previous light instruction value is the third preset value and the current light instruction value is the fourth preset value, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, control the emission driver chip to turn on, and control the TEC control chip to turn on. This enables the CDR chip, TEC control chip, light receiving chip, light transmitting chip to turn on, and increase the voltage of the APD circuit, so that the optical module can emit light or receive light signals.

[0202] The MCU can be configured to: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the second preset value; when the previous light instruction value is the fourth preset value and the current light instruction value is the third preset value, control the CDR chip to turn on, control the light receiving chip to turn on, increase the voltage of the APD circuit, control the emission driver chip to turn on, and control the TEC control chip to turn on. This enables the CDR chip, TEC control chip, light receiving chip, light transmitting chip to turn on, and increase the voltage of the APD circuit, so that the optical module can emit light or receive light signals.

[0203] The MCU can be configured as follows: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the first preset value; when the previous light instruction value is the fourth preset value and the current light instruction value is the third preset value, the transmitting driver chip is controlled to turn on, the light transmitting chip is turned on, and the optical module emits light or receives light signals.

[0204] The MCU can be configured as follows: when the previous power consumption instruction value is the first preset value and the current power consumption instruction value is the first preset value; when the previous light instruction value is the third preset value and the current light instruction value is the fourth preset value, the emission driver chip is controlled to be turned off, thereby turning off the light emission chip.

[0205] Figure 11 A method for controlling power consumption of an optical module according to some embodiments is provided. Figure 2 . Figure 10 A method for controlling power consumption of an optical module according to some embodiments is provided. Figure 11 .like Figure 10 and Figure 11 As shown, the present application provides a method for controlling power consumption of an optical module, which may include:

[0206] A01: Determine whether to receive a low power consumption instruction.

[0207] A02: Determine whether the light-off command is received.

[0208] S200: Turn off the light emitting chip.

[0209] S300: Turn off the TEC chip.

[0210] S400: Turn off the CDR chip.

[0211] S500: Reduce the voltage of the APD circuit.

[0212] S600: Turn off the light receiving chip.

[0213] T01: Turn on the TEC chip.

[0214] T02: Turn on the light emitting chip.

[0215] T03: Turn on the CDR chip.

[0216] T04: Increase the voltage of the APD circuit.

[0217] T05: Turn on the light receiving chip.

[0218] When receiving a high-power consumption instruction, receiving a light-on instruction, T01: Turn on the TEC chip; T02: Turn on the light emitting chip;

[0219] T03: Turn on the CDR chip; T04: Increase the voltage of the APD circuit; T05: Turn on the light receiving chip. So that the light emitting and receiving functions of the optical module are normally operated.

[0220] When receiving a low-power consumption instruction, receiving a light-on instruction, S200: Turn off the light emitting chip; S300: Turn off the TEC chip; S400: Turn off the CDR chip; S500: Reduce the voltage of the APD circuit; S600: Turn off the light receiving chip. To turn off the light emitting and receiving functions of the optical module, reduce the power consumption.

[0221] When receiving a low-power consumption instruction, receiving a light-off instruction, S200: Turn off the light emitting chip; S300: Turn off the TEC chip; S400: Turn off the CDR chip; S500: Reduce the voltage of the APD circuit; S600: Turn off the light receiving chip. To turn off the light emitting and receiving functions of the optical module, reduce the power consumption.

[0222] When receiving a high-power consumption instruction, receiving a light-off instruction, S200: Turn off the light emitting chip.

[0223] In some embodiments of the present application, when a low-power consumption instruction is received, the optoelectronic devices with high power consumption in the optical module are turned off to reduce power consumption.

[0224] ​When the MCU receives the power consumption instruction, the control mode of the MCU. When the MCU receives the power consumption instruction, first determine whether the power consumption instruction is a low power consumption instruction. If it is a low power consumption instruction, it is not necessary to determine whether the light-off instruction is received, and it can directly enter the low power consumption mode. If the power consumption instruction is a high power consumption instruction, it is necessary to determine whether the light-off instruction is received. If the current is the light-off instruction, it enters the high power consumption light-off mode. If the power consumption instruction is a high power consumption instruction, and the current is the light-on instruction, it enters the high power consumption light-on mode.

[0225] ​ When the MCU receives the light instruction, the control mode of the MCU. When the MCU receives the light instruction, first determine whether the light instruction is the light-off instruction. If it is the light-off instruction, it is necessary to determine whether the power consumption instruction is received. If the light instruction is the light-on instruction, and the power consumption instruction is the low power consumption instruction, it enters the low power consumption mode. If the light instruction is the light-on instruction, and the power consumption instruction is the high power consumption instruction, it enters the high power consumption light-off mode. If the light instruction is the light-off instruction, and the power consumption instruction is the low power consumption instruction, it enters the low power consumption mode. If the light instruction is the light-off instruction, and the power consumption instruction is the high power consumption instruction, it enters the high power consumption light-on mode.

[0226] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module characterized by comprising: The application comprises: a golden finger; a light emitting chip configured to convert an electrical signal into a light signal; a TEC chip configured to control the temperature of the light emitting chip; a CDR chip; an APD circuit; a light receiving chip configured to convert an external light signal into an electrical signal; an MCU connected to the golden finger, the MCU comprising: a power consumption register and a light instruction register; wherein: when the power consumption instruction value in the power consumption register is a first preset value, the MCU controls the TEC chip to be turned off, controls the CDR chip to be turned off, controls the voltage of the APD circuit to be reduced, and controls the light receiving chip to be turned off; when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the MCU controls the CDR chip to be turned on, controls the light receiving chip to be turned on, increases the voltage of the APD circuit, controls the light emitting chip to be turned on, and controls the TEC chip to be turned on; when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is a fourth preset value, the MCU controls the light emitting chip to be turned off. The application comprises:

2. The optical module according to claim 1, characterized by a TEC control chip connected to the MCU and the TEC chip, and the MCU controls the TEC control chip to be turned off so as to make the TEC chip be turned off. The application comprises:

3. The optical module according to claim 1 or 2, characterized by a transmitting driving chip connected to the MCU and the light emitting chip, and the MCU controls the transmitting driving chip to be turned off so as to make the light emitting chip be turned off. The MCU is configured to:

4. The optical module according to claim 3, characterized by receive a low-power consumption instruction and write a transmitting-off signal to the register of the transmitting driving chip so as to make the transmitting driving chip be turned off. The application comprises:

5. A method for controlling power consumption of an optical module, the method comprising: when the power consumption instruction value in the power consumption register is a first preset value, the MCU controls the TEC chip to be turned off, controls the CDR chip to be turned off, controls the voltage of the APD circuit to be reduced, and controls the light receiving chip to be turned off; when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, the MCU controls the CDR chip to be turned on, controls the light receiving chip to be turned on, increases the voltage of the APD circuit, controls the transmitting driving chip to be turned on, and controls the TEC chip to be turned on; when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is a fourth preset value, the MCU controls the light emitting chip to be turned off. The application comprises:

6. An optical module characterized by comprising: a golden finger receiving a low-power consumption instruction from the outside and a light-off instruction from the outside; a light emitting chip configured to convert an electrical signal into a light signal; a TEC chip configured to control the temperature of the light emitting chip; a CDR chip; an APD circuit; a light receiving chip configured to convert an external light signal into an electrical signal; an MCU connected to the golden finger, the MCU being configured to: preset a power consumption sequence table of the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip, receive a low-power consumption instruction and control the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip according to the power consumption sequence table. The application comprises:

7. An optical module characterized by comprising: ​ The golden finger receives a low-power consumption instruction from the outside; receives a light-off instruction from the outside; The light emitting chip is configured to convert an electrical signal into a light signal; The TEC chip is configured to control the temperature of the light emitting chip; The CDR chip; The APD circuit; The light receiving chip is configured to convert an external light signal into an electrical signal; The MCU is connected with the golden finger, and the MCU is configured to: preset the power consumption sequence table of the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip, when the power consumption instruction value in the power consumption register is a first preset value, control the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip to be turned off according to the power consumption sequence table; when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, control the CDR chip to be turned on, control the light receiving chip to be turned on, increase the voltage of the APD circuit, control the light emitting chip to be turned on, and control the TEC chip to be turned on; when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is a fourth preset value, control the light emitting chip to be turned off.

8. A method for controlling power consumption of an optical module, the method comprising: comprising: preset the power consumption sequence table of the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip, when the power consumption instruction value in the power consumption register is a first preset value, control the light emitting chip, the TEC chip, the CDR chip, the APD circuit and the light receiving chip to be turned off according to the power consumption sequence table; when the power consumption instruction value in the power consumption register is a second preset value and the light instruction value in the light instruction register is a third preset value, control the CDR chip to be turned on, control the light receiving chip to be turned on, increase the voltage of the APD circuit, control the light emitting chip to be turned on, and control the TEC chip to be turned on; when the power consumption instruction value in the power consumption register is the second preset value and the light instruction value in the light instruction register is a fourth preset value, control the light emitting chip to be turned off.

9. An optical module characterized by comprising: comprising: The golden finger receives a low-power consumption instruction from the outside; The light emitting chip is configured to convert an electrical signal into a light signal; The TEC chip is configured to control the temperature of the light emitting chip; The CDR chip; The APD circuit; The light receiving chip is configured to convert an external light signal into an electrical signal; The MCU is connected with the golden finger, and the MCU includes: The power consumption register is used to store the current power consumption instruction value; The light instruction register is used to store the previous power consumption instruction value; The first state memory is used to store the previous power consumption instruction value; The second state memory is used to store the previous light instruction value; wherein the MCU is configured to: when the previous power consumption instruction value is a second preset value and the current power consumption instruction value is a first preset value, control the CDR chip to be turned off, the TEC chip to be turned off, the light receiving chip to be turned off, the light emitting chip to be turned off, and reduce the voltage of the APD circuit; The previous power consumption instruction value is a first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is a fourth preset value, and the current light instruction value is a third preset value, and the emission driving chip is controlled to be turned on. The previous power consumption instruction value is a first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is a third preset value, and the current light instruction value is a fourth preset value, and the emission driving chip is controlled to be turned off.

10. A method for controlling power consumption of an optical module, the method comprising: Comprise: When the previous power consumption instruction value is a second preset value and the current power consumption instruction value is a first preset value, the CDR chip, the TEC chip, the light receiving chip, the light emitting chip, and the APD circuit are controlled to be turned off and the voltage of the APD circuit is reduced. The previous power consumption instruction value is a first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is a fourth preset value, and the current light instruction value is a third preset value, and the emission driving chip is controlled to be turned on. The previous power consumption instruction value is a first preset value, the current power consumption instruction value is the first preset value, the previous light instruction value is a third preset value, and the current light instruction value is a fourth preset value, and the emission driving chip is controlled to be turned off.

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