Electronic equipment and assembling method of electronic equipment

Abstract

The invention relates to electronic equipment and an assembling method of the electronic equipment. The electronic equipment comprises a middle frame with a containing groove; a part of the key assembly is located in the accommodating groove; the supporting assembly is mounted in the accommodating groove and is connected with the key assembly; the first sealing piece is located between the supporting assembly and the middle frame and is configured to seal a gap between the supporting assembly and the middle frame; and the second sealing element covers one side, deviating from the key assembly, of the supporting assembly, covers the first sealing element and is configured to seal a gap between the first sealing element and the middle frame. According to the embodiment of the invention, the sealing performance and waterproofness of the electronic equipment can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular to an electronic device and an assembly method of an electronic device. BACKGROUND

[0002] With the development of life, people have higher and higher requirements for the waterproofness of electronic devices, and the highest waterproof level is Ingress Protection X8 (IPX8), which is very demanding on the sealing environment of electronic devices.

[0003] At present, the waterproofness of the fingerprint side key of an electronic device such as a mobile phone in the prior art is achieved by sealing the fingerprint groove at the fingerprint side key with a sealing foam on the battery cover of the mobile phone. However, the IPX8 waterproof level requires that the width of the sealing foam on the battery cover be at least 2 mm or more, and the position of the fingerprint side key of a general mobile phone is difficult to meet this width requirement due to the limitation of the stacking space, resulting in poor waterproofness. SUMMARY

[0004] To overcome the problems in the related art, the present disclosure provides an electronic device and an assembly method of an electronic device, which can improve the sealing and waterproofness of the electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, an electronic device is provided, comprising at least:

[0006] a middle frame having a receiving groove;

[0007] a key assembly located partially in the receiving groove;

[0008] a support assembly installed in the receiving groove and connected with the key assembly;

[0009] a first sealing member located between the support assembly and the middle frame and configured to seal a gap between the support assembly and the middle frame;

[0010] a second sealing member covering a side of the support assembly away from the key assembly and covering the first sealing member and configured to seal a gap between the first sealing member and the middle frame.

[0011] In some embodiments, the first sealing member comprises a sealing rib; and the sealing rib is sleeved on the support assembly.

[0012] In some embodiments, the second sealing member comprises hot melt glue.

[0013] In some embodiments, the middle frame further has a limiting groove; and the support assembly comprises a key support located at the limiting groove and having an opening.

[0014] The key assembly comprises a first circuit board; one end of the first circuit board is electrically connected to a second circuit board of the electronic device through the opening; and the second circuit board is located inside the middle frame.

[0015] The electronic device further comprises:

[0016] A third sealing member is located at the opening of the key support and is configured to seal the first circuit board and the key support.

[0017] The first sealing member is located between the key support and the middle frame.

[0018] The second sealing member covers the third sealing member and the key support.

[0019] In some embodiments, the support assembly further comprises:

[0020] A first limiting member is located between the first circuit board and the middle frame, is connected to the first circuit board, and is configured to fix the first circuit board.

[0021] In some embodiments, the first limiting member forms a limiting platform in a direction away from the first circuit board.

[0022] The limiting platform is clamped with the limiting groove and is configured to fix the first circuit board in the accommodating groove.

[0023] In some embodiments, the support assembly further comprises:

[0024] A second limiting member is connected to the key support and is arranged in a spaced manner with the first limiting member, and is configured to limit the key assembly.

[0025] In some embodiments, the middle frame further has a mounting through hole in communication with the accommodating groove; and the accommodating groove is located between the mounting through hole and the limiting groove.

[0026] The key assembly further comprises:

[0027] A key body is partially located in the mounting through hole and is electrically connected to the first circuit board; and the key body can be exposed outside the middle frame through the mounting through hole.

[0028] The second limiting member is located at a position where the accommodating groove and the mounting through hole are in communication.

[0029] In some embodiments, the key assembly comprises a fingerprint side key.

[0030] According to a second aspect of the embodiments of the present disclosure, a method for assembling an electronic device is provided, at least comprising:

[0031] assembling the key assembly and the support assembly in the accommodating groove of the middle frame, respectively;

[0032] assembling a first sealing member at a gap between the support assembly and the middle frame;

[0033] assembling a second sealing member on a side of the support assembly facing away from the key assembly and the first sealing member.

[0034] In some embodiments, the support assembly comprises a key support with an opening; the method further comprises:

[0035] assembling a third sealing member at the opening to seal the first circuit board of the key assembly and the key support.

[0036] In some embodiments, the assembling the key assembly and the support assembly in the accommodating groove of the middle frame, respectively, comprises:

[0037] adhering a first limiting member of the support assembly to the first circuit board of the key assembly, and extending the first circuit board into the accommodating groove through a mounting through hole of the middle frame;

[0038] fixing the first circuit board in the accommodating groove by engaging a limiting platform formed by the first limiting member in a direction away from the first circuit board with a limiting groove of the middle frame.

[0039] In some embodiments, the assembling the key assembly and the support assembly in the accommodating groove of the middle frame, respectively, further comprises:

[0040] electrically connecting one end of the first circuit board of the key assembly to a second circuit board of the electronic device through the opening of the key support of the support assembly, and assembling the key support at the accommodating groove and the limiting groove of the middle frame.

[0041] In some embodiments, the method further comprises:

[0042] placing the first sealing member, the key support and the second limiting member of the support assembly in a preset injection mold for injection connection.

[0043] The technical solutions provided by the embodiments of the present disclosure can have the following beneficial effects:

[0044] The electronic device provided by the embodiment of the present disclosure comprises: a middle frame having a containing groove; a key assembly partially located in the containing groove; a support assembly installed in the containing groove and connected with the key assembly; a first sealing member located between the support assembly and the middle frame and configured to seal the gap between the support assembly and the middle frame; and a second sealing member covering the side of the support assembly away from the key assembly and covering the first sealing member and configured to seal the gap between the first sealing member and the middle frame.

[0045] That is, the fingerprint groove can be sealed by the sealing foam of the battery cover in the prior art, but in the embodiment of the present disclosure, the first sealing member is arranged between the support assembly and the middle frame to seal the gap between the support assembly and the middle frame, and the second sealing member is arranged on the side of the support assembly away from the key assembly and the first sealing member to seal the gap between the first sealing member and the middle frame, so as to isolate the containing groove of the middle frame from the internal space of the electronic device surrounded by the middle frame, thereby improving the sealing performance and waterproof performance of the electronic device and meeting the IPX8 waterproof requirement.

[0046] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0047] The accompanying drawings, which are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0048] Figure 1 is a structural schematic diagram of a conventional electronic device according to an exemplary embodiment.

[0049] Figure 2 is a structural schematic diagram of an electronic device according to an exemplary embodiment Figure 1 .

[0050] Figure 3 is a structural schematic diagram of an electronic device according to an exemplary embodiment Figure 2 .

[0051] Figure 4 is a structural schematic diagram of an electronic device according to an exemplary embodiment Figure 3 .

[0052] Figure 5 is a flowchart of an assembly method of an electronic device according to an exemplary embodiment.

[0053] Figure 6 is a structural block diagram of an electronic device according to an exemplary embodiment.

[0054] Figures 2 to 4 Reference Signs:

[0055] 10 - middle frame, 101 - accommodation groove, 11 - key assembly, 12 - support assembly, 13 - first sealing member, 14 - second sealing member, 102 - limiting groove, 121 - key support, 122 - opening, 111 - first circuit board, 15 - third sealing member, 123 - first limiting member, 124 - limiting platform, 125 - second limiting member, 103 - mounting through hole, 112 - key body. DETAILED DESCRIPTION

[0056] The exemplary embodiments will be described in detail herein below with reference to the accompanying drawings. In the following description, the same numbers refer to the same elements throughout the drawings, and a repeated description on the same elements will be omitted. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with the present disclosure. Rather, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0057] The technical solutions provided by the various embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0058] Currently, in the related art, as shown in Figure 1 , a conventional electronic device 20 can include a battery cover 21, sealing foam 22, a fingerprint side key 23, a fingerprint fixing steel sheet 24, and a middle frame 25. The fingerprint side key 23 is fixed and assembled in a fingerprint groove 251 of the middle frame 25 using the fingerprint fixing steel sheet 24, and the conventional electronic device seals the fingerprint groove 251 using the sealing foam 22 on the battery cover 21.

[0059] However, the IPX8 waterproof level requires a width of the sealing foam of the battery cover to be at least 2 mm or more, and the position of the fingerprint side key of a general mobile phone is difficult to meet this width requirement due to a stacking space limitation, resulting in poor waterproofness. In addition, the sealing foam requires high roughness and flatness of the bonding surface of the middle frame and the battery cover. Since the fingerprint groove of the middle frame causes the fingerprint side key to be the weakest position of the entire electronic device, the flatness of the middle frame at this position fluctuates greatly, consistency cannot be guaranteed, and thus waterproofness is also poor.

[0060] Based on this, the embodiments of the present disclosure provide an electronic device. Figure 2 is a structural schematic diagram of an electronic device according to an exemplary embodiment Figure 1 , Figure 3 is a structural schematic diagram of an electronic device according to an exemplary embodiment Figure 2 As shown in Figure 3 and Figure 4 , the electronic device can include:

[0061] The middle frame 10 has a receiving groove 101.

[0062] The key assembly 11 is partially located in the receiving groove 101.

[0063] The support assembly 12 is installed in the receiving groove 101 and connected with the key assembly 11.

[0064] The first sealing member 13 is located between the support assembly 12 and the middle frame 10 and is configured to seal the gap between the support assembly 12 and the middle frame 10.

[0065] The second sealing member 14 covers the side of the support assembly 12 away from the key assembly 11 and covers the first sealing member 13 and is configured to seal the gap between the first sealing member 13 and the middle frame 10.

[0066] In the embodiments of the present disclosure, the electronic device can include a mobile phone, a tablet computer, a smart watch, a digital camera, a head-mounted display device (HMD), etc., and the embodiments of the present disclosure are not limited thereto.

[0067] Here, the middle frame can be a frame that carries various internal devices in the electronic device, and the middle frame can be located between the screen and the back cover of the electronic device. The receiving groove can be a groove in the middle frame for accommodating the key assembly and the like of the electronic device.

[0068] It should be noted that the specific shape and size of the receiving groove of the middle frame can be set according to the actual application scenario, and the embodiments of the present disclosure are not limited thereto.

[0069] In an embodiment of the present disclosure, the key assembly can include a fingerprint key, a power key, or a volume key, etc.; or the key assembly can be a fingerprint side key integrating power function and fingerprint function.

[0070] It can be understood that part of the key assembly can be located in the receiving groove of the middle frame, and the other part can pass through the mounting through hole of the middle frame and be exposed outside the electronic device for the user to press to use the function corresponding to the key assembly.

[0071] The support assembly can be a structure for supporting the key assembly in the receiving groove.

[0072] Here, the support assembly can be installed in the receiving groove and in contact with the four side walls of the receiving groove, so that the support assembly can be clamped in the receiving groove.

[0073] It should be noted that the specific size of the support assembly can be set according to the size of the receiving groove in the actual application scenario, and the embodiments of the present disclosure are not limited thereto.

[0074] In addition, the specific material of the support assembly can be set according to the actual application scenario, and the embodiments of the present disclosure are not limited. For example, the support assembly can include a plastic material key support, and a first limiting piece and a second limiting piece made of steel.

[0075] In some embodiments, the first sealing piece includes a sealing rib; the sealing rib is sleeved on the support assembly. In this way, the gap between the support assembly and the middle frame can be better sealed, and the sealing and waterproof performance of the electronic device can be improved.

[0076] In the embodiments of the present disclosure, the sealing rib can be made of silicone or rubber; the sealing rib and the support assembly can be connected by injection molding during injection molding, so that the sealing rib is sleeved on the support assembly.

[0077] It should be noted that the specific size of the sealing rib can be set according to the size of the support assembly in the actual application scenario, and the embodiments of the present disclosure are not limited.

[0078] In some embodiments, the second sealing piece includes hot melt adhesive. In this way, the gap between the first sealing piece and the middle frame can be filled, and the sealing and waterproof performance of the electronic device can be further improved.

[0079] In the embodiments of the present disclosure, the hot melt adhesive is a plastic adhesive. Within a certain temperature range, the physical state of the hot melt adhesive can change with temperature, while the chemical properties remain unchanged. It is non-toxic and odorless, and belongs to environmentally friendly chemical products. Because the product itself is a solid, it is convenient for packaging, transportation, storage, has no solvent, no pollution, and no toxicity; and the production process is simple, has high added value, large bonding strength, fast speed and other advantages, and is widely used.

[0080] It can be understood that the embodiments of the present disclosure can apply hot melt adhesive to the side of the support assembly away from the key assembly, use the flowability of the hot melt adhesive to fill the gap formed by the support assembly and the middle frame, and prevent liquid leakage; and use the cooperation of the first sealing piece around the support assembly and the middle frame to prevent the hot melt adhesive from flowing into the accommodation groove and affecting the user's key feel. After the hot melt adhesive solidifies, the support assembly around the support assembly and the middle frame are integrated, so as to isolate the internal space of the electronic device surrounded by the accommodation groove and the middle frame.

[0081] An electronic device provided by an embodiment of the present disclosure includes: a middle frame having a containing groove; a key assembly partially located in the containing groove; a support assembly installed in the containing groove and connected with the key assembly; a first sealing member located between the support assembly and the middle frame and configured to seal a gap between the support assembly and the middle frame; and a second sealing member covering the side of the support assembly away from the key assembly and covering the first sealing member and configured to seal a gap between the first sealing member and the middle frame. That is, unlike the sealing of the fingerprint groove by the sealing foam of the battery cover in the prior art, the gap between the support assembly and the middle frame is sealed by the first sealing member arranged between the support assembly and the middle frame in the embodiment of the present disclosure, and the gap between the first sealing member and the middle frame is sealed by the second sealing member arranged on the side of the support assembly away from the key assembly and the first sealing member, so as to isolate the containing groove of the middle frame and the internal space of the electronic device surrounded by the middle frame, thereby improving the sealing and waterproof performance of the electronic device and meeting the IPX8 waterproof requirement.

[0082] Figure 3 A structure diagram of an electronic device according to an exemplary embodiment Figures 2 to 4 As shown in Figures 2 to 4 The middle frame 10 of the electronic device provided by the embodiment of the present disclosure further has a limiting groove 102; the support assembly includes a key support 121 located at the limiting groove 102 and having an opening 122.

[0083] The key assembly 11 includes a first circuit board 111; one end of the first circuit board 111 is electrically connected with a second circuit board of the electronic device through the opening 122; and the second circuit board is located inside the middle frame 10.

[0084] The electronic device can further include:

[0085] A third sealing member 15 is located at the opening 122 of the key support 121 and configured to seal the first circuit board 111 and the key support 121.

[0086] A first sealing member 13 is located between the key support 121 and the middle frame 10.

[0087] A second sealing member 14 covers the third sealing member 15 and the key support 121.

[0088] In the embodiment of the present disclosure, the limiting groove can be a groove in the middle frame for defining the installation position of the support assembly; and the limiting groove can be in communication with the containing groove of the middle frame.

[0089] It should be noted that the specific shape and size of the limiting groove of the middle frame can be set according to the shape and size of the key support in the actual application scenario, and the embodiment of the present disclosure does not limit the shape and size of the limiting groove of the middle frame.

[0090] The key support can be a structure partially disposed at the limiting groove and used for supporting the key assembly. The opening can be a hole disposed at any position of the key support.

[0091] Here, the assembly direction of the key support assembled in the accommodating groove can be perpendicular to the assembly direction of the key assembly assembled in the accommodating groove. For example, the assembly direction of the key assembly can be a direction parallel to the screen of the electronic device, and the assembly direction of the key support can be a direction perpendicular to the screen of the electronic device.

[0092] The first circuit board can be a flexible printed circuit (FPC). The FPC is a flexible printed circuit board made of a polyimide or polyester film as a base material, has a high reliability, and has excellent flexibility. The FPC has the characteristics of high wiring density, light weight, thin thickness, and good bending property.

[0093] The second circuit board can be a printed circuit board (PCB). For example, the electronic device can include a mainboard inside a middle frame. The mainboard can be provided with various components of the electronic device, such as a processor, and can realize electrical connection or electrical insulation between the components.

[0094] It can be understood that one end of the FPC of the key assembly can be electrically connected to the key body of the key assembly, and the other end can pass through the opening of the key support and be electrically connected to the mainboard of the electronic device, so as to realize the key function of the key body.

[0095] In the embodiments of the present disclosure, the third sealing member can also be made of silicone or rubber.

[0096] Here, during the assembly of the electronic device, the third sealing member can be assembled at the opening of the key support to fix the end of the first circuit board passing out of the opening and seal the first circuit board and the key support.

[0097] At this time, the first sealing member can be sleeved on the key support to seal the gap between the key support and the middle frame, and the second sealing member can cover the side of the first sealing member, the third sealing member, and the key support away from the key assembly to seal the gap between the first sealing member and the middle frame and the gap between the third sealing member and the first circuit board.

[0098] It should be noted that the specific shape and size of the third sealing member can also be set according to the shape and size of the opening of the key support in the actual application scenario, and the embodiments of the present disclosure are not limited.

[0099] In the embodiments of the present disclosure, the third sealing member is arranged at the opening of the key support, so as to seal the gap between the first circuit board and the key support passing through the opening, better realize the isolation between the accommodating groove of the middle frame and the internal space of the electronic device surrounded by the middle frame, and thus the sealing performance and the waterproof performance of the electronic device can be improved.

[0100] In some embodiments, as shown in Figures 2 to 4 The support assembly 12 can further include:

[0101] The first limiting member 123 is located between the first circuit board 111 and the middle frame 10 and is connected to the first circuit board 111 and is configured to fix the first circuit board 111.

[0102] In the embodiments of the present disclosure, the first limiting member can be a limiting part of the first circuit board; for example, the first limiting member can be a steel sheet limiting the FPC.

[0103] It can be understood that the first limiting member can be fixed on the side of the mounting through hole of the first circuit board away from the middle frame by means of adhesion; and the first limiting member abuts between the first circuit board and the middle frame, and can fix the first circuit board in the accommodating groove of the middle frame.

[0104] It should be noted that the specific material of the first limiting member can be set according to the actual application scenario, as long as the hardness of the material of the first limiting member is greater than the hardness of the first circuit board, and the embodiments of the present disclosure are not limited.

[0105] In the embodiments of the present disclosure, the position of the first circuit board is fixed by arranging the first limiting member between the first circuit board and the middle frame, so as to improve the stability of assembling the key assembly in the electronic device.

[0106] In one embodiment of the present disclosure, as shown in Figures 2 to 4 The first limiting member 123 forms a limiting table 124 in the direction away from the first circuit board 111;

[0107] The limiting table 124 is clamped with the limiting groove 102 and is configured to fix the first circuit board 111 in the accommodating groove 101.

[0108] Here, the limiting table can be formed by bending the first limiting member away from the first circuit board.

[0109] It should be noted that the bending angle between the limiting table and the first limiting member can also be set according to the shape of the limiting groove in the actual application, and the embodiments of the present disclosure are not limited.

[0110] It can be understood that, in the assembling process of the electronic device, the first limiting member and the first circuit board adhered together can be inserted into the accommodating groove, and the limiting table of the first limiting member is clamped with the limiting groove to fix the first circuit board in the accommodating groove.

[0111] In the embodiments of the present disclosure, the limiting table formed by the first limiting member cooperates with the limiting groove of the middle frame to fix the first circuit board in the accommodating groove, so that the fixation of the first circuit board in various directions can be better achieved, and the positional degree requirement of the key assembly in function can be met.

[0112] In some embodiments, as shown in Figures 2 to 4 The support assembly 12 can further include:

[0113] The second limiting member 125 is connected to the key support 121 and is arranged in a spaced manner with the first limiting member 123, and is configured to limit the key assembly 11.

[0114] In the embodiments of the present disclosure, the second limiting member can be a limiting component of the key body of the key assembly; for example, the second limiting member can be a limiting steel sheet of a fingerprint key.

[0115] It can be understood that the second limiting member can be overmolded on the key support to realize the integration of the second limiting member and the key support, so as to better realize the limiting of the key assembly while supporting the key assembly.

[0116] Here, after the key support is assembled in the accommodating groove, the second limiting member can be parallel to the first limiting member.

[0117] It should be noted that the specific material of the second limiting member can be set according to the actual application scene, and the embodiments of the present disclosure are not limited.

[0118] In the embodiments of the present disclosure, the second limiting member can be overmolded on the key support to limit the key assembly, so that the key function of the key assembly can be better realized while supporting the key assembly.

[0119] In one embodiment of the present disclosure, as shown in Figure 5 The middle frame 10 further has a mounting through hole 103 communicating with the accommodating groove 101; the accommodating groove 101 is located between the mounting through hole 103 and the limiting groove 102;

[0120] The key assembly 11 can further include:

[0121] The key body 112 is partially located in the mounting through hole 103 and is electrically connected with the first circuit board 111; the key body 112 can be exposed outside the middle frame 10 through the mounting through hole 103;

[0122] The second limiting member 125 is located at a position where the accommodating groove 101 and the mounting through hole 103 are communicated.

[0123] In the embodiments of the present disclosure, the mounting through hole can be a through hole in the middle frame which can pass through the outside of the middle frame and communicate with the accommodating groove of the middle frame.

[0124] It should be noted that the specific shape and size of the mounting through hole can also be set according to the shape and size of the key assembly in the actual application scenario, and the embodiments of the present disclosure are not limited.

[0125] Here, the key body can be a component that is partially exposed outside the middle frame and can be pressed by a user.

[0126] For example, the key assembly is a fingerprint side key of an electronic device, and the key body can be a fingerprint key including a key cap; the key cap can be exposed outside the middle frame through the mounting through hole, and the main body part of the fingerprint key can be located in the mounting through hole.

[0127] It can be understood that after the key assembly and the support assembly of the electronic device are installed, the second limiting member can be located at a position where the accommodating groove and the mounting through hole are communicated. At this time, the second limiting member can partially close the communication port of the accommodating groove and the mounting through hole, so that when the user presses the key body, the key assembly will not be displaced, thereby affecting the hand feeling of the key assembly.

[0128] It should be noted that the distance between the second limiting member and the surface of the key body exposed outside the middle frame can be the range in which the key body can move when pressed by the user.

[0129] In the embodiments of the present disclosure, the second limiting member can be arranged at the position where the accommodating groove and the mounting through hole are communicated to limit the key body, so that the key assembly can be better supported while the key function of the key assembly is better ensured, thereby improving the user experience.

[0130] Figure 5 is a flowchart of an assembly method of an electronic device according to an example embodiment, as shown in Figure 6 The assembly method of the electronic device provided by the embodiments of the present disclosure can at least include the following steps:

[0131] Step 510, assembling the key assembly and the support assembly in the accommodating groove of the middle frame, respectively;

[0132] Step 520, assembling the first sealing member at the gap between the support assembly and the middle frame;

[0133] Step 530, assembling the second sealing member on the side of the support assembly away from the key assembly and the first sealing member.

[0134] In step 510, the key assembly can include a key body and a first circuit board. The support assembly can include a key support, a first limiting piece and a second limiting piece. The middle frame can include a receiving groove, a mounting through hole and a limiting groove.

[0135] In one embodiment of the present disclosure, step 510 can include:

[0136] The first limiting piece of the support assembly is bonded on the first circuit board of the key assembly, and the first circuit board is extended into the receiving groove through the mounting through hole of the middle frame;

[0137] The first circuit board is fixed in the receiving groove by the limiting groove of the middle frame and the limiting table formed by the first limiting piece in the direction away from the first circuit board.

[0138] In this way, the first circuit board can be fixed in the receiving groove by the cooperation of the limiting table formed by the first limiting piece and the limiting groove of the middle frame, so that the fixation of the first circuit board in various directions can be better realized, and the positional degree requirement of the key assembly in function can be met.

[0139] Here, the first limiting piece can be bonded on the first circuit board first, and the first circuit board is fixed in the receiving groove through the first limiting piece; then, one end of the first circuit board can be electrically connected to the key body, and the key body is partially fixed in the mounting through hole.

[0140] In one embodiment of the present disclosure, step 510 can further include:

[0141] One end of the first circuit board of the key assembly is electrically connected to the second circuit board of the electronic device through the opening of the key support of the support assembly, and the key support is assembled at the receiving groove and the limiting groove of the middle frame.

[0142] In this way, the first circuit board can be electrically connected to the second circuit board of the electronic device through one end away from the key body, so that the key function of the key assembly can be realized; and the key support can be assembled in place by the limiting groove of the middle frame, so that the second limiting piece connected to the key support can be prevented from being assembled out of place to affect the user experience of using the key function.

[0143] In the embodiment of the present disclosure, when the key support is assembled at the limiting groove, the second limiting piece connected to the key support can be located at the communication position of the receiving groove and the mounting through hole to limit the key body, so that the key function of the key assembly can be better realized while supporting the key assembly, and the user experience can be improved.

[0144] In step 520, the first seal is assembled at the gap between the support assembly and the middle frame, which can seal the gap between the support assembly and the middle frame, thereby preventing the second seal from flowing into the accommodation groove when the second seal is in a liquid state, affecting the user's experience of using the key function.

[0145] In step 530, the second seal is assembled on the side of the support assembly away from the key assembly and the first seal, which can seal the gap between the first seal and the middle frame, thereby preventing the liquid such as water flowing from the mounting through hole from entering the internal space of the electronic device surrounded by the middle frame, to improve the sealing and waterproof performance of the electronic device.

[0146] In the embodiments of the present disclosure, the first seal is arranged between the support assembly and the middle frame to seal the gap between the support assembly and the middle frame, and the second seal is arranged on the side of the support assembly away from the key assembly and the first seal to seal the gap between the first seal and the middle frame, so as to isolate the accommodation groove of the middle frame from the internal space of the electronic device surrounded by the middle frame, thereby improving the sealing and waterproof performance of the electronic device and meeting the IPX8 waterproof requirement.

[0147] In some embodiments, the support assembly includes a key support with an opening; and the assembly method of the electronic device can further include:

[0148] The third seal is assembled at the opening to seal the gap between the first circuit board of the key assembly and the key support.

[0149] In this way, the third seal can be assembled at the opening of the key support to seal the gap between the first circuit board and the key support passing through the opening, so as to better isolate the accommodation groove of the middle frame from the internal space of the electronic device surrounded by the middle frame, thereby improving the sealing and waterproof performance of the electronic device.

[0150] It can be understood that after the third seal is assembled at the opening, the second seal can also cover the third seal and the key support to seal the gap between the third seal and the first circuit board.

[0151] In some embodiments, the assembly method of the electronic device can further include:

[0152] The first seal, the key support of the support assembly, and the second limiting member are all placed in a pre-set injection mold for injection connection.

[0153] In this way, the first sealing member can be connected to the key support by injection molding, so that the gap between the first sealing member and the key support can be reduced, and the sealing performance between the key support and the first sealing member can be improved. Meanwhile, the second limiting member is connected to the key support by injection molding, so that the key assembly can be limited, and the key function of the key assembly can be realized while the key assembly is supported.

[0154] In the embodiments of the present disclosure, the injection molding model can be a model in which the first sealing member is sleeved on the key support, and the second limiting member is connected to the key support.

[0155] It should be noted that the first sealing member can be connected to the key support by injection molding first, and then the second limiting member can be connected to the key support by injection molding. Alternatively, the second limiting member can be connected to the key support by injection molding first, and then the first sealing member can be connected to the key support by injection molding. Alternatively, the first sealing member and the second limiting member can be connected to the key support by injection molding at the same time, and the embodiments of the present disclosure are not limited in this regard.

[0156] Exemplarily, the key assembly of the electronic device is a fingerprint side key. In the assembly process of the electronic device, the first step can be to bond the first limiting member to the first circuit board such as a fingerprint FPC, then extend the fingerprint FPC into the accommodating groove along the mounting through hole of the middle frame, and use the limiting table of the first limiting member to engage with the limiting groove of the middle frame to fix the fingerprint FPC in the accommodating groove of the middle frame, and then insert the key body such as a fingerprint key into the mounting through hole.

[0157] The second step can be to injection mold the first sealing member and the second limiting member on the key support such as a fingerprint support, that is, the first sealing member forms a ring of sealing ribs around the fingerprint support, and the other end of the fingerprint FPC is fixed in the opening on the fingerprint support. Then, the fingerprint support connected with the first sealing member and the second limiting member by injection molding is assembled into the accommodating groove, and the fingerprint support is assembled in place by the limiting groove of the middle frame, so as to prevent the second limiting member from being assembled out of place and affecting the fingerprint feel of the fingerprint side key.

[0158] The third step can be to assemble the third sealing member into the opening on the fingerprint support, so as to fix and seal the fingerprint FPC.

[0159] The fourth step can be to point a second sealing member such as hot melt glue above the fingerprint support, fill the gap between the fingerprint support and the middle frame and the gap between the fingerprint support and the fingerprint FPC with the fluidity of the hot melt glue to prevent liquid leakage. Moreover, the cooperation of the first sealing member around the fingerprint support and the middle frame can prevent the hot melt glue from flowing into the accommodation groove to affect the fingerprint feeling of the fingerprint side key; and the cooperation of the third sealing member and the fingerprint FPC can also prevent the hot melt glue from falling into the accommodation groove. After the hot melt glue solidifies, the fingerprint support around the fingerprint support and the middle frame are integrated into one, thereby isolating the accommodation groove of the middle frame from the internal space of the electronic device surrounded by the middle frame, to improve the sealing and waterproof performance of the electronic device and meet the IPX8 waterproof requirement.

[0160] Figure 6 is a structural block diagram of an electronic device 600 according to an exemplary embodiment. The electronic device 600 can be, for example, a mobile phone, a computer, a digital broadcasting terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, or the like.

[0161] Referring to ​ , the electronic device 600 can include one or more of the following components: a processing component 602, a memory 604, a power supply component 606, a multimedia component 608, an audio component 610, an input / output (I / O) interface 612, a sensor component 614, and a communication component 616.

[0162] The processing component 602 usually controls overall operations of the electronic device 600, such as operations associated with display, telephone call, data communication, camera operation, and recording operation. The processing component 602 can include one or more processors 620 to execute instructions to complete all or part of steps of the above methods. In addition, the processing component 602 can include one or more modules to facilitate the interaction between the processing component 602 and other components. For example, the processing component 602 can include a multimedia module to facilitate the interaction between the multimedia component 608 and the processing component 602.

[0163] The memory 604 is configured to store various types of data to support operations on the electronic device 600. Examples of such data include at least one of instructions for any application or method operating on the electronic device 600, contact data, phonebook data, messages, pictures, and videos. The memory 604 can be implemented by any type of volatile or nonvolatile memory, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, a magnetic disc, or an optical disc.

[0164] The power component 606 supplies power to various components of the electronic device 600. The power component 606 can include at least one of a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 600.

[0165] The multimedia component 608 includes a screen providing an output interface between the electronic device 600 and a user. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes the touch panel, the screen can be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense a touch, a slide, and a gesture on the touch panel. The touch sensor can not only sense a boundary of a touching or a sliding action, but also detect duration and pressure related to the touching or sliding action. In some embodiments, the multimedia component 608 includes a front camera and / or a back camera. When the electronic device 600 is in an operating mode, such as a photographing mode or a video mode, the front camera and / or the back camera can receive external multimedia data. Each of the front camera and the back camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0166] The audio component 610 is configured to output and / or input audio signals. For example, the audio component 610 includes a microphone (MIC) that is configured to receive an external audio signal when the electronic device 600 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 604 or transmitted via the communication component 616. In some embodiments, the audio component 610 also includes a speaker for outputting audio signals.

[0167] The I / O interface 612 provides an interface between the processing component 602 and peripheral interface modules, which can include a keyboard, a click wheel, buttons, and so on. The buttons can include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0168] The sensor component 614 includes one or more sensors for providing status assessments of various aspects of the electronic device 600. For example, the sensor component 614 can detect an open / closed position of the electronic device 600, relative positioning of components, such as a display and a keypad of the electronic device 600, a change in position of the electronic device 600 or a component of the electronic device 600, presence or absence of user contact with the electronic device 600, orientation or acceleration / deceleration of the electronic device 600, and temperature changes of the electronic device 600. The sensor component 614 can include a proximity sensor configured to detect presence of a nearby object without any physical touch. The sensor component 614 can also include a light sensor, such as a complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) image sensor, utilized in an imaging application. In some embodiments, the sensor component 614 can further include at least one of an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, and a temperature sensor.

[0169] The communication component 616 is configured to facilitate communication between the electronic device 600 and other devices in a wired or wireless manner. The electronic device 600 can access a wireless network based on a communication standard, such as Wi-Fi, 4G, 5G, or a combination thereof. In an exemplary embodiment, the communication component 616 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra wide band (UWB) technology, Bluetooth (BT) technology and other technologies.

[0170] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0171] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is further provided, such as a memory 604 including executable instructions or a computer program. The instructions or computer program can be executed by a processor 620 of the electronic device 600 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a compact disc read-only memory (CD-ROM), a magnetic tape, a floppy disk, an optical data storage device, etc.

[0172] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the features disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

[0173] It should be understood that the present disclosure is not limited to the precise structures as herein described and illustrated in the drawings, and that various modifications and changes can be made without departing from its scope. The scope of the present disclosure is limited only by the claims that follow.

Claims

1. An electronic device, comprising: The method comprises the following steps: The middle frame has a containing groove; The key assembly is partially located in the containing groove; The support assembly is installed in the containing groove and connected with the key assembly; The first sealing member is located between the support assembly and the middle frame and is configured to seal the gap between the support assembly and the middle frame; The second sealing member covers the side of the support assembly away from the key assembly and covers the first sealing member and is configured to seal the gap between the first sealing member and the middle frame.

2. The electronic device of claim 1, wherein, The first sealing member comprises a sealing rib; the sealing rib is sleeved on the support assembly.

3. The electronic device of claim 1, wherein, The second sealing member comprises hot melt adhesive.

4. The electronic device of any one of claims 1 to 3, wherein, The middle frame further has a limiting groove; the support assembly comprises a key support located at the limiting groove and having an opening; The key assembly comprises a first circuit board; one end of the first circuit board is electrically connected with a second circuit board of the electronic device through the opening; wherein the second circuit board is located inside the middle frame; The electronic device further comprises: A third sealing member is located at the opening of the key support and is configured to seal the first circuit board and the key support; The first sealing member is located between the key support and the middle frame; The second sealing member covers the third sealing member and the key support.

5. The electronic device of claim 4, wherein, The support assembly further comprises: A first limiting member is located between the first circuit board and the middle frame and is connected with the first circuit board and is configured to fix the first circuit board.

6. The electronic device of claim 5, wherein, The first limiting member forms a limiting platform in the direction away from the first circuit board; The limiting platform is engaged with the limiting groove and is configured to fix the first circuit board in the containing groove.

7. The electronic device of claim 5, wherein, The support assembly further comprises: A second limiting member is connected with the key support and is spaced apart from the first limiting member and is configured to limit the key assembly.

8. The electronic device of claim 7, wherein, The middle frame further has a mounting through hole in communication with the containing groove; the containing groove is located between the mounting through hole and the limiting groove; The key assembly further comprises: A key body is partially located in the mounting through hole and is electrically connected with the first circuit board; the key body can be exposed outside the middle frame through the mounting through hole; The second limiting member is located at the communication position of the containing groove and the mounting through hole.

9. The electronic device of any one of claims 1 to 3, wherein, The key assembly comprises a fingerprint side key.

10. A method of assembling an electronic device, comprising: The method comprises the following steps: Assembling the key assembly and the support assembly in the containing groove of the middle frame respectively; Assembling the first sealing member at the gap between the support assembly and the middle frame; Assembling the second sealing member on the side of the support assembly away from the key assembly and the first sealing member.

11. The method of claim 10, wherein, The support assembly comprises a key support having an opening; the method further comprises: Assembling a third sealing member at the opening to seal the first circuit board of the key assembly and the key support.

12. The method according to claim 10 or 11, characterized in that, The assembling of the key assembly and the support assembly in the containing groove of the middle frame comprises: Bonding the first limiting member of the support assembly on the first circuit board of the key assembly and extending the first circuit board into the containing groove through the mounting through hole of the middle frame; The first circuit board is fixed in the accommodating groove by engagement of a limiting platform formed by the first limiting member in a direction away from the first circuit board and a limiting groove of the middle frame.

13. The method of claim 10 or 11, wherein, The assembling of the key assembly and the supporting assembly in the accommodating groove of the middle frame respectively further includes: One end of the first circuit board of the key assembly is electrically connected with the second circuit board of the electronic device through the opening of the key support of the supporting assembly, and the key support is assembled at the accommodating groove and the limiting groove of the middle frame.

14. The method of claim 10 or 11, wherein, The method further includes: The first sealing member, the key support of the supporting assembly and the second limiting member are all placed in a preset injection mold for injection connection.

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