Portable heat preservation device

Abstract

The invention is suitable for the technical field of portable temperature control, and provides a portable heat preservation device which comprises a box body and a cover body, the cover body is connected to the box body in a buckled mode, the box body comprises a first inner container and a second inner container which are sequentially arranged from inside to outside, and an interlayer space is formed between the first inner container and the second inner container; a semiconductor chilling plate is arranged in the interlayer space, the semiconductor chilling plate is attached to the inner wall of the second inner container, the first end of the semiconductor chilling plate faces the first inner container, and an auxiliary temperature control module is arranged at the second end of the semiconductor chilling plate. When the device heats, heat is absorbed to the second end of the semiconductor chilling plate. The problem that traditional heat preservation equipment is insufficient in temperature stability under the extreme environment condition is solved.

Description

Technical Field

[0001] This invention relates to the field of portable temperature control technology, and more particularly to a portable heat preservation device. Background Technology

[0002] In existing technologies, portable thermal devices such as insulated boxes or refrigerators are widely used in various fields, including outdoor activities, transporting perishable goods, and medical applications. The primary function of these devices is to maintain the temperature of the contents to ensure their freshness and safety. However, traditional thermal devices rely on relatively primitive methods such as ice packs or heating elements for temperature regulation, which not only limits their usage time and effectiveness but also lacks convenience and precision in operation.

[0003] Furthermore, traditional insulation devices perform poorly in extreme environmental conditions, particularly in maintaining low temperatures in high-temperature environments or high temperatures in cold environments. At the same time, these devices are often large and heavy, making them inconvenient to carry, and their poor insulation performance leads to unstable temperature control and susceptibility to external environmental influences. These problems significantly limit the application range of insulation devices and the user experience.

[0004] To solve the above-mentioned technical problems, the present invention provides a portable heat preservation device. Summary of the Invention

[0005] This invention provides a portable heat preservation device, which aims to solve the problem of insufficient temperature stability of traditional heat preservation equipment under extreme environmental conditions. The technical solution is as follows: A portable heat preservation device includes a housing and a lid, the lid being fastened to the housing. The housing includes a first inner liner and a second inner liner arranged sequentially from the inside to the outside, with a space between the first and second inner liners. A thermoelectric cooling chip is disposed within the space, attached to the inner wall of the second inner liner. The first end of the thermoelectric cooling chip faces the first inner liner, and an auxiliary temperature control module is disposed on the second end of the thermoelectric cooling chip. When the device is cooling, heat is dissipated from the second end of the thermoelectric cooling chip; when the device is heating, heat is absorbed from the second end of the thermoelectric cooling chip.

[0006] Based on the above technical solution, the electrodes of the semiconductor cooling chip are connected to a switchable polarity circuit, enabling the first inner liner to switch between cooling and heating functions.

[0007] Based on the above technical solution, the first end of the semiconductor cooling chip is thermally connected to the outer wall of the first inner liner through a first heat-conducting block; the second end of the semiconductor cooling chip is thermally connected to the heat sink through a second heat-conducting block; the first and second heat-conducting blocks are metal heat-conducting blocks, and their contact area is larger than the area of ​​the corresponding end face of the semiconductor cooling chip.

[0008] Preferably, both the outer wall of the first inner liner and the outer wall of the second inner liner are provided with coolant cavities, and the coolant cavities are filled with coolant, with a filling rate ranging from 50% to 90%.

[0009] Beneficial effects Compared with existing technologies, the beneficial effects of this invention are as follows: 1. By employing a semiconductor cooling chip and switching polarity circuits to achieve the conversion between cooling and heating functions, this device can not only quickly adjust the internal temperature as needed, but also accurately maintain the required temperature, solving the inconvenience and inaccuracy problems caused by traditional equipment relying on ice packs or heating elements. 2. The design adopts a double-layer inner liner structure with a sandwich space filled with insulation material or an air layer, and an aerogel and polyurethane composite insulation layer is set on the outer layer of the second inner liner. This design greatly improves the thermal insulation performance of the device, enabling it to effectively maintain a stable internal temperature under extreme environmental conditions and enhancing the environmental adaptability of the equipment. 3. Considering the problems of large size and heavy weight of traditional insulation devices, this invention optimizes the design of the device, making it more compact and lightweight. At the same time, the application of an auxiliary temperature control module further improves thermal management efficiency, ensuring efficient operation of the equipment under various operating conditions and greatly enhancing the user experience. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of the present invention. For those skilled in the art, other embodiments can be derived from the provided drawings without creative effort.

[0011] Figure 1 : A schematic diagram of the structure of the present invention; Figure 2 : Front view of the present invention; Figure 3 : Figure 2 Sectional view of AA; Figure 4 : A schematic diagram showing the position of the first heat-conducting block in this invention; Figure 5 : Figure 3 A partial enlarged view of point B in the middle; Figure 6 : A schematic diagram of the sealing device of the present invention. Detailed Implementation

[0012] The present invention will be further described below with reference to the accompanying drawings and examples: Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0013] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0014] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0015] like Figure 1 and Figure 2 As shown, a portable heat preservation device includes a box body 1 and a cover body 2. The box body 1 includes a first inner liner 11 and a second inner liner 12 arranged sequentially from the inside to the outside, and a sandwich space 13 is formed between the first inner liner 11 and the second inner liner 12. like Figure 3 As shown, the interlayer space 13 formed between the two inner liner layers can be filled with insulation material or left as an air layer to reduce heat conduction and thus improve insulation performance. This double-layer structure can more effectively prevent the influence of external temperature on internal temperature, whether used to maintain low or high temperatures.

[0016] A semiconductor cooling chip 3 is installed in the interlayer space. The electrodes of the semiconductor cooling chip 3 are connected to a switchable polarity circuit, enabling the first inner liner 11 to switch between cooling and heating functions. It can achieve cooling or heating by changing the direction of the current. This means that the device can not only maintain temperature but also adjust the internal temperature as needed, increasing the device's application scenarios and flexibility.

[0017] The semiconductor cooling chips 3 are configured in multiples and arranged on the same side or one side of the housing 1. The intensity and area of ​​cooling or heating can be adjusted as needed. For example, when rapid cooling or heating of a specific area is required, these cooling chips can be used in a concentrated manner; while when maintaining a large constant temperature area is required, multiple cooling chips can be evenly distributed on one side.

[0018] like Figure 5 As shown, both the outer walls of the first inner liner 11 and the second inner liner 12 are provided with coolant chambers 6, which are filled with coolant. The fill rate of the coolant chambers 6 ranges from 50% to 90%, and expansion gaps are maintained within the coolant chambers 6. During operation, the coolant may undergo volume changes due to temperature variations. These expansion gaps allow sufficient space for the coolant to expand or contract during temperature changes, thus preventing excessive pressure caused by liquid volume changes from damaging the device structure.

[0019] When the device needs heating, the working direction of the semiconductor cooling chip 3 changes, providing heat to the first inner liner 11. At this time, the coolant helps absorb this additional heat and distributes it evenly, ensuring a smooth temperature rise and avoiding localized overheating.

[0020] The semiconductor cooling chip 3 is disposed on the inner wall of the second inner liner 12, with the cooling or heating surface facing the first inner liner 11. The semiconductor cooling chip is relatively fragile, and directly attaching it to the first inner liner 11 may cause damage due to mechanical stress or thermal stress. Therefore, there is a gap between the inner liner 11 and the semiconductor cooling chip 3.

[0021] Further, such as Figure 4 As shown, a semiconductor cooling chip 3 is provided in the interlayer space 13. The first end of the semiconductor cooling chip 3 is thermally connected to the outer wall of the first inner liner 11 through the first heat-conducting block 41, and the second end of the semiconductor cooling chip 3 is connected to the heat sink through the second heat-conducting block 42. The first heat-conducting block 41 and the second heat-conducting block 42 are metal heat-conducting blocks, and their contact area is larger than the area of ​​the corresponding end face of the semiconductor cooling chip 3.

[0022] Metal heat-conducting blocks have a high thermal conductivity, enabling rapid and efficient heat transfer. Using a larger contact area reduces the heat flux density per unit area, decreasing thermal resistance and thus more efficiently transferring heat from the thermoelectric cooler to the target area—the first inner liner or radiator—improving overall heat transfer efficiency.

[0023] A first heat-conducting block 41 is used as an intermediary to connect the inner liner 11 and the semiconductor cooling chip 3. By using the first heat-conducting block 41, a buffer layer can be formed between the semiconductor cooling chip and the first inner liner 11, reducing the mechanical stress that may be caused by direct contact and protecting the semiconductor cooling chip from physical damage.

[0024] Preferably, the first heat-conducting block 41 is flexible, which can better adapt to uneven surfaces, reduce the pressure on the cooling element during installation, and further reduce the risk of damage caused by mechanical stress.

[0025] The heat sink is a finned heat sink with a cooling fan on its outer side. Finned heat sinks improve heat exchange efficiency by increasing the heat dissipation area. The fins increase the surface area in contact with air, allowing heat to be transferred to the surrounding air more quickly, thereby more effectively reducing the temperature at the second end of the semiconductor cooling chip 3.

[0026] A thermoelectric cooler (TEC) operates based on the Peltier effect, which is the phenomenon where heat is generated at one end and absorbed at the other when an electric current is applied to a specific material. Each TEC has a maximum temperature difference ΔTmax, which refers to the maximum temperature difference that can be achieved between the cold and hot ends under ideal conditions. If the temperature of the hot end is too high or too low, this maximum temperature difference will be affected.

[0027] Therefore, an auxiliary temperature control module is further provided, which is located on the second end of the semiconductor cooling chip 3; when the device is in cooling mode, the auxiliary temperature control module dissipates heat to the second end of the semiconductor cooling chip 3; when the device is in heating mode, the auxiliary temperature control module absorbs heat from the second end of the semiconductor cooling chip 3.

[0028] In cooling mode, the goal is to make the cold end as cold as possible. However, the lowest temperature the cold end can reach depends not only on the input current but also on the temperature of the hot end. If the hot end cannot dissipate heat effectively, its temperature will rise, reducing the temperature difference between the cold and hot ends and thus decreasing the cooling effect. Therefore, to improve the cooling capacity of the cold end, it is essential to ensure that the hot end remains at a low temperature. This requires an auxiliary temperature control module to help the hot end dissipate heat effectively, maintaining a larger temperature difference.

[0029] In heating mode, the goal is to make the hot end as hot as possible. Similarly, the maximum temperature the hot end can reach is limited by the temperature of the cold end. If the cold end cannot effectively absorb heat and its temperature drops too much, this will reduce the temperature difference between the two ends, thus affecting the heating effect. To improve the heating capacity of the hot end, it is necessary to ensure that the cold end can effectively absorb and dissipate excess heat. In this case, the auxiliary temperature control module can improve overall heating efficiency by increasing heat absorption capacity, such as by using an additional cooling medium circulation system, to absorb more heat from the surrounding environment and transfer it to the cold end.

[0030] The auxiliary temperature control module is a cascaded semiconductor refrigeration unit 7, and the first end of the cascaded semiconductor refrigeration unit 7 is thermally connected to the second end of the semiconductor refrigeration chip 3.

[0031] In cooling mode, the cascaded semiconductor cooling unit helps to remove heat from the hot end of the semiconductor cooling chip more effectively, thereby reducing the hot end temperature and improving the overall cooling efficiency of the system. In heating mode, it can absorb more heat from the surrounding environment and transfer it to the hot end, increasing the hot end temperature and thus improving the heating effect.

[0032] By cascading, a wider temperature range can be achieved. The temperature range of a single TEC is limited, but cascading multiple TECs can significantly expand the achievable temperature range without significantly increasing complexity, enabling the device to operate over a wider temperature range.

[0033] The auxiliary temperature control module is a liquid spraying system, which includes a liquid storage container, a spraying device, and a circulating pump. The liquid storage container stores a cooling medium, and the circulating pump drives the cooling medium to flow from the liquid storage container to the spraying device.

[0034] Liquids, as cooling media, possess a high specific heat capacity, enabling them to absorb or release large amounts of heat. Compared to air cooling, liquid cooling can more efficiently remove heat from the second end of a thermoelectric cooler, especially in high-temperature environments or situations requiring rapid cooling. Through a spray system, the cooling medium can be evenly distributed over the surface requiring heat dissipation or absorption, ensuring uniform heat absorption or dissipation and preventing localized overheating or overcooling, thereby improving the overall accuracy of temperature control.

[0035] like Figure 6As shown, a sealing device is provided between the box body 1 and the lid 2. The sealing device includes a first sealing strip 81 and a second sealing strip 82. The first sealing strip 81 is located on the inner top edge of the lid 2. When the lid is closed, the first sealing strip 81 fits tightly against the opening end face of the box body 1 in the horizontal direction. The second sealing strip 82 is located on the top of the protrusion of the lid 2. When the lid is closed, the second sealing strip 82 fits tightly against the upper part of the opening of the box body 1 in the vertical direction. This double sealing structure ensures that the connection between the lid 2 and the box body 1 can effectively prevent the entry of outside air and the loss of internal temperature from multiple directions, providing a more comprehensive sealing effect. Good sealing is one of the key factors in ensuring the heat preservation performance of portable heat preservation devices. By sealing the joint between the box body 1 and the lid 2 from both horizontal and vertical directions, heat exchange can be significantly reduced, thereby maintaining a stable internal temperature, achieving better results whether refrigeration or heating is required.

[0036] The second inner liner 12 has an outer heat insulation layer, which is a composite layer comprising an aerogel layer and a polyurethane layer. Aerogel is one of the best known solid heat insulation materials, possessing extremely low thermal conductivity. It effectively reduces heat loss or entry into the inner liner through conduction. Polyurethane is also a highly efficient heat insulation material; its foam structure traps a large amount of air, further reducing thermal conductivity. The combination of the two significantly improves overall heat insulation performance. Aerogel primarily achieves heat insulation by preventing the movement of gas molecules through its nanoscale porous structure, while polyurethane relies on the air within its closed-cell structure for insulation. This combination of materials utilizes different heat insulation mechanisms, providing more comprehensive protection.

[0037] Although aerogels are expensive, combining them with relatively inexpensive and efficient polyurethanes can provide a cost-effective solution while maintaining high performance.

[0038] The combination of physical isolation provided by the two inner layers and dynamic regulation by the auxiliary temperature control module effectively blocks external temperature interference while precisely controlling the internal temperature, achieving optimal insulation and temperature stability. Whether for outdoor activities in extreme weather conditions or professional occasions requiring strict temperature control, this device can meet the needs of different application scenarios.

[0039] It should be noted that the semiconductor cooling chip in this embodiment is a general standard part or a component known to those skilled in the art. Its structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0040] The present invention has been described above by way of example, but the present invention is not limited to the specific embodiments described above. Any modifications or variations made based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A portable heat preservation device, comprising a housing (1) and a cover (2), wherein the cover (2) is fastened to the housing (1), characterized in that: The housing (1) includes a first inner liner (11) and a second inner liner (12) arranged sequentially from the inside to the outside. A sandwich space (13) is formed between the first inner liner (11) and the second inner liner (12). A semiconductor cooling chip (3) is provided in the sandwich space (13). The semiconductor cooling chip (3) is attached to the inner wall of the second inner liner (12). The first end of the semiconductor cooling chip (3) faces the first inner liner (11). An auxiliary temperature control module is provided on the second end of the semiconductor cooling chip (3). When the device is cooling, it dissipates heat to the second end of the semiconductor cooling chip (3). When the device is heating, it absorbs heat from the second end of the semiconductor cooling chip (3).

2. The portable heat preservation device according to claim 1, characterized in that: The electrodes of the semiconductor cooling chip (3) are connected to a switchable polarity circuit, enabling the first inner liner (11) to switch between cooling and heating functions.

3. A portable heat preservation device according to claim 2, characterized in that: The first end of the semiconductor cooling chip (3) is thermally connected to the outer wall of the first inner liner (11) through the first heat-conducting block (41); the second end of the semiconductor cooling chip (3) is thermally connected to the heat sink through the second heat-conducting block (42); the first heat-conducting block (41) and the second heat-conducting block (42) are metal heat-conducting blocks, and their contact area is larger than the area of ​​the corresponding end face of the semiconductor cooling chip (3).

4. A portable heat preservation device according to claim 2, characterized in that: The outer walls of the first inner liner (11) and the second inner liner (12) are provided with coolant chambers (6), which are filled with coolant. The filling rate of the coolant chambers (6) ranges from 50% to 90%.

5. A portable heat preservation device according to claim 3, characterized in that: The radiator is a finned radiator with a cooling fan on its outer side.

6. A portable heat preservation device according to claim 1, characterized in that: The auxiliary temperature control module is a cascaded semiconductor refrigeration unit (7), and the first end of the cascaded semiconductor refrigeration unit (7) is thermally connected to the second end of the semiconductor refrigeration chip (3).

7. A portable heat preservation device according to claim 1, characterized in that: The auxiliary temperature control module is a liquid spraying system, which includes a liquid storage container, a spraying device, and a circulating pump. The liquid storage container stores a cooling medium, and the circulating pump drives the cooling medium to flow from the liquid storage container to the spraying device.

8. A portable heat preservation device according to claim 1, characterized in that: A sealing device is provided between the box body (1) and the cover body (2).

9. A portable heat preservation device according to claim 8, characterized in that: The sealing device includes a first sealing strip (81) and a second sealing strip (82). The first sealing strip (81) is disposed on the inner top edge of the cover (2). When the cover is closed, the first sealing strip (81) is tightly attached to the opening end face of the box (1) in the horizontal direction. The second sealing strip (82) is disposed on the top of the protrusion of the cover (2). When the cover is closed, the second sealing strip (82) is tightly attached to the upper part of the opening of the box (1) in the vertical direction.

10. A portable heat preservation device according to claim 1, characterized in that: The outer layer of the second inner liner (12) is provided with a heat insulation layer, which is a composite layer, including an aerogel layer and a polyurethane layer.

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