Semiconductor laser comprehensive performance test system

By designing a semiconductor laser testing system with a combined outer and inner casing structure and a synchronous operating table, the problems of radiation exposure and low efficiency of existing testing systems have been solved, achieving an efficient and safe testing process.

CN120846649BActive Publication Date: 2025-12-30JINCHENG OPTICAL MECHANICAL & ELECTRICAL IND COORDINATION SERVICE CENT (JINCHENG OPTICAL MECHANICAL & ELECTRICAL IND RES INST)
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Patent Information

Application Number
CN202511348845.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-22
Publication Date
2025-12-30
Estimated Expiration
2045-09-22

AI Technical Summary

Technical Problem

Existing semiconductor laser testing systems lack protection for test personnel during testing and have redundant actions that lead to low testing efficiency, failing to meet the needs of high-volume, rapid testing.

Method used

A comprehensive performance testing system for semiconductor lasers was designed, employing a combination structure of an outer and inner casing. The inner casing is rotatable and, combined with the circular motion of the test stage and a synchronous operating platform, enables smooth transfer and synchronous testing of the semiconductor laser. Protective plates and light-blocking strips prevent radiation leakage, thereby improving testing efficiency and safety.

Benefits of technology

It effectively protects testers during the testing process, reduces waiting time, improves testing efficiency, and ensures the smoothness and security of the testing process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of semiconductor lasers, and particularly discloses a semiconductor laser comprehensive performance test system which comprises an outer cover and an inner cover, the two are concentrically arranged, the inner cover is rotationally arranged in the inner portion of the outer cover, the surface of the outer cover is provided with a placing opening and a taking opening, and the surface of the inner cover is provided with at least one series connection opening; a support column is fixedly arranged at the central position in the inner portion of the outer cover, the support column is provided with a test assembly; a test table is arranged in the inner portion of the outer cover and performs circumferential movement around the support column, the test table is correspondingly arranged with the series connection opening, one end of the test table is slidably connected with the support column, and the other end is fixedly connected with the inner cover; a first operation table is arranged on the outer surface of the outer cover and located at the placing opening; through the combination of the outer cover and the inner cover, the inner cover is rotationally arranged, so that the radiation overflow generated in the test process can be placed while the semiconductor laser is loaded, and the protection of the test personnel is improved.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor laser technology, and in particular to a comprehensive performance testing system for semiconductor lasers. Background Technology

[0002] Semiconductor laser tubes are widely used due to their small size, high efficiency, and ease of use. As the characteristics of semiconductor laser tubes show, their output power and spectrum vary with the driving current and operating temperature. To provide users with complete information about semiconductor lasers, various functional tests are required during the development and production phases.

[0003] During the testing of semiconductor lasers, multiple testing devices with different functions are required depending on the testing requirements. These devices will generate light radiation to varying degrees during the testing process. However, existing testing systems are often exposed during the testing process, lacking protection for testing personnel. Over time, this can easily harm the health of testing personnel. At the same time, current testing systems have a lot of redundant actions during the testing process, resulting in low testing efficiency and failing to meet the needs of large-scale rapid testing. Summary of the Invention

[0004] The main objective of this invention is to provide a comprehensive performance testing system for semiconductor lasers, which aims to solve existing technical problems.

[0005] To achieve the above objectives, the present invention provides a comprehensive performance testing system for semiconductor lasers, comprising:

[0006] A base is provided with an outer cover and an inner cover, which are concentrically arranged, and the inner cover is rotatably disposed inside the outer cover. The surface of the outer cover has a placement opening and a removal opening, and the surface of the inner cover has at least one serial port.

[0007] A support column is fixedly installed at the center of the inside of the outer cover, and a test component is provided on the support column;

[0008] The test platform is located inside the outer cover and moves in a circular motion around the support column. The test platform is correspondingly arranged with the serial port. One end of the test platform is slidably connected to the support column, and the other end is fixedly connected to the inner cover.

[0009] The first operating platform is located on the outer surface of the outer cover and at the placement opening;

[0010] When the test stage passes through the area where the placement port is located, it drives the first operating stage to move synchronously to transfer the semiconductor laser from the first operating stage to the test stage. The placement port and the serial port remain connected during the transfer of the semiconductor laser and are in a misaligned state after the transfer.

[0011] Furthermore, the test assembly includes a sliding seat slidably connected to the support column, the sliding seat is provided with a test mechanism, the support column is provided with a groove, the sliding seat has a slider connected to the groove, and the sliding seat is provided with a protrusion;

[0012] The test platform is provided with a paddle block, which has a notch for the protrusion to pass through. The paddle block is connected to a movable shaft, on which a first elastic element is sleeved. The movable shaft slides in contact with a limiting platform located inside the inner cover. During the movement of the test platform, the movable shaft slides intermittently along the limiting platform. The protrusion and the paddle block are misaligned until they pass through each other, thereby resetting the test component.

[0013] Furthermore, the slide groove is provided with a second elastic element connected to the slider, and a damping structure is provided on the side of the slide groove.

[0014] Furthermore, the test stand is provided with at least one test station, and protective plates are provided on both sides of the test station. The protective plates divide the inner cover space and move synchronously with the test stand.

[0015] Furthermore, the protective plate has a movable plate through which the test component passes, and a pusher is provided above the test component. When the pusher contacts the movable plate, the test component does not contact the movable plate.

[0016] Furthermore, the outer surface of the outer cover is provided with a slide rail located at the placement opening, and the first operating table is slidably engaged with the slide rail. When the semiconductor laser is transferred from the first operating table to the test table, the first operating table is reset by a reset rod located at the end of the slide rail.

[0017] The first operating table is fixedly connected to a first block that extends into the inner cover. The protective plate is provided with a second block. The second block includes a protrusion that contacts the first block and a sliding part. The sliding part slides in contact with a guide groove opened on the inner wall of the outer cover. The protective plate is provided with a third elastic member that connects to the second block.

[0018] Furthermore, a test stand is provided at the test station, and a segmented fixture is provided on the test stand;

[0019] The first operating platform is equipped with a segmented fixture 2 and a first operating mechanism. During the synchronous movement of the first operating platform with the test platform, the segmented fixture 1 and the segmented fixture 2 remain connected.

[0020] Furthermore, the test seat is movably mounted on the test platform, and elastic limiting members are provided on both sides of the test seat. The support column is provided with intermittently extending stop bars for preventing the test seat from moving.

[0021] Furthermore, it also includes a second operating platform located at the pick-up port. The second operating platform is equipped with a second operating mechanism. When the test platform passes through the area where the pick-up port is located, it drives the second operating platform to move synchronously to transfer the semiconductor laser from the test platform to the second operating platform.

[0022] Furthermore, the outer surface of the inner cover is provided with a light-blocking strip that slides and fits against the inner surface of the outer cover.

[0023] The beneficial effects of this invention are reflected in:

[0024] This invention combines an outer cover and an inner cover, with the inner cover being rotatable, which allows for the loading of semiconductor lasers while preventing radiation leakage during testing, thus improving the protection of testing personnel.

[0025] This invention achieves continuous placement and retrieval of parts by using a continuously rotating test platform, in conjunction with a first operating platform and a second operating platform that move synchronously with the test platform at the placement port and the retrieval port, thereby reducing waiting time and improving efficiency.

[0026] This invention enables synchronous testing of semiconductor lasers during their rotation by intermittently and synchronously moving the test components and the test platform, making the entire testing process smoother and more efficient, and further improving efficiency.

[0027] This invention, by making the testing space, placement space, and retrieval space independent, ensures that there is no radiation leakage during continuous placement, testing, and retrieval, thus further improving the protection of testing personnel. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a semiconductor laser comprehensive performance testing system according to the present invention;

[0029] Figure 2 For the present invention Figure 1 Internal structural diagram;

[0030] Figure 3 This is a schematic diagram of a single test station structure on the test bench of the present invention;

[0031] Figure 4 For the present invention Figure 3 Enlarged schematic diagram of the structure at point A in the middle;

[0032] Figure 5 This is a schematic diagram showing the changing positions of the protrusion and the push block in this invention;

[0033] Figure 6 This is a schematic diagram of the limiting platform structure of the present invention;

[0034] Figure 7 For the present invention Figure 2 Top view of a partial structure in the middle;

[0035] Figure 8 For the present invention Figure 7 Enlarged schematic diagram of the structure at point B;

[0036] Figure 9 This is a schematic diagram of the second structure of the present invention;

[0037] Figure 10 This is a schematic diagram showing the positional changes of the first and second blocks of the present invention;

[0038] Figure 11 This is a schematic diagram of the outer casing structure of the present invention;

[0039] Figure 12 This is a schematic diagram of the inner cover structure of the present invention;

[0040] Figure 13 This is a schematic diagram of the connection structure between the protective plate and the movable plate of the present invention;

[0041] Figure 14 This is a schematic diagram of the light-blocking strip structure of the present invention;

[0042] Figure 15 For the present invention Figure 1 Diagram showing the view from below.

[0043] Explanation of reference numerals in the attached figures:

[0044] 10. Base; 100. Outer cover; 101. Placement port; 102. Retrieval port; 103. Light-blocking strip; 104. Guide groove; 200. Inner cover; 201. Serial port; 300. Support column; 301. Test assembly; 3011. Sliding seat; 3012. Test mechanism; 3013. Protrusion; 302. Slide groove; 303. Slider; 304. Second elastic element; 305. Damping structure; 306. Stop bar; 400. Test platform; 401. Pulley; 402. Movable shaft; 403. First elastic element; 40 4. Limiting platform; 405. Testing station; 406. Protective plate; 407. Movable plate; 408. Push frame; 409. Testing seat; 410. Segmented fixture one; 411. Elastic limiting component; 500. First operating platform; 501. Segmented fixture two; 502. First operating mechanism; 503. Slide rail; 504. Reset rod; 505. First block; 506. Second block; 5061. Protrusion; 5062. Sliding part; 507. Third elastic component; 600. Second operating platform; 601. Second operating mechanism. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Please see Figures 1-15 This embodiment provides a comprehensive performance testing system for semiconductor lasers, specifically including:

[0047] The base 10 has an outer cover 100 and an inner cover 200 on it. Specifically, the inner cover 200 is made of transparent material. The two are concentrically arranged, and the inner cover 200 is rotatably located inside the outer cover 100.

[0048] The outer cover 100 has a placement port 101 and a removal port 102 on its surface. Specifically, the semiconductor laser to be tested enters through the placement port 101, and the semiconductor laser after testing is removed through the removal port 102. The inner cover 200 has at least one serial port 201 on its surface. The number of serial ports 201 is set according to actual needs, preferably 3-4, which can ensure the overall testing efficiency without affecting the testing quality.

[0049] The support column 300 is fixedly located at the center of the outer cover 100, and the support column 300 is equipped with a test component 301; specifically, the test component 301 adopts existing test equipment, such as an optical power meter probe.

[0050] The test platform 400 is located inside the outer casing 100 and moves in a circular motion around the support column 300. Specifically, the bottom of the test platform 400 is equipped with a gear ring, which is driven by a motor gear combination. Figure 15 (Only the gear ring is shown; the motor gear set is not shown.) The test bench 400 is correspondingly set with the serial port 201. One end of the test bench 400 is slidably connected to the support column 300, and the other end is fixedly connected to the inner cover 200. The number of test benches 400 is set according to the number of serial ports 201. If the number of test benches 400 exceeds one, adjacent test benches 400 are connected together by connectors, and the test benches 400 maintain synchronous movement.

[0051] The first operating table 500 is located on the outer surface of the outer cover 100 and at the placement opening 101;

[0052] When the test stage 400 passes through the area where the placement port 101 is located, it drives the first operating stage 500 to move synchronously, transferring the semiconductor laser from the first operating stage 500 to the test stage 400. The placement port 101 and the serial port 201 remain connected during the transfer of the semiconductor laser and are in a misaligned state after the transfer.

[0053] In this embodiment, the test stage 400 moves in a circular motion within the outer cover 100, synchronously driving the inner cover 200 to move. When the serial port 201 on the inner cover 200 connects with the placement port 101, the semiconductor laser to be tested is placed onto the test stage 400 through the placement port 101. During this operation, the test stage 400 and the inner cover 200 do not stop moving. As the inner cover 200 continues to rotate, the placement port 101 and the serial port 201 gradually become misaligned. When they are completely misaligned, the test assembly 301 performs the test on the semiconductor laser, avoiding the problem of invisible radiation generated during the test affecting the test personnel, while also ensuring test efficiency.

[0054] In this embodiment, the test component 301 includes a sliding seat 3011 slidably connected to the support column 300, a test mechanism 3012 is provided on the sliding seat 3011, and a groove 302 is provided on the support column 300. Specifically, the length of the groove 302 is defined as follows: if the protective plate 406 divides the internal space of the inner cover 200 into 4 pieces, then the length of the groove 302 is one-quarter of the diameter of the support column 300; the sliding seat 3011 has a slider 303 connected to the groove 302, and a protrusion 3013 is provided on the sliding seat 3011;

[0055] The test bench 400 is provided with a lever 401, which has a notch for the protrusion 3013 to pass through, and the lever 401 is connected to the movable shaft 402. Specifically, the movable shaft 402 is fixedly connected to the lever 401, and a first elastic element 403 is sleeved on the movable shaft 402. The movable shaft 402 is slidably engaged with the limiting platform 404 located inside the inner cover 200. Specifically, the limiting platform 404 has an arc-shaped surface. Specifically, the first elastic element 403 can be a spring.

[0056] During the movement of the test bench 400, the movable axis 402 slides intermittently along the limiting platform 404, causing the protrusion 3013 and the toggle block 401 to misalign until they pass through each other, thus resetting the test component 301.

[0057] In this embodiment, when the semiconductor laser is placed on the test stage 400, as the outer cover 100 and the inner cover 200 are misaligned, and as the test stage 400 continues to rotate, the lever 401 on it will contact the protrusion 3013, thereby pushing the sliding seat 3011 to move synchronously with the test stage 400. During the movement, the test operation is completed. During the test, the movable shaft 402 slides along the limiting platform 404. When the movable shaft 402 slides on the arc surface, it will push the lever 401 to move, causing the lever 401 and the protrusion 3013 to be misaligned until the protrusion 3013 passes through the notch on the lever 401. At this time, the test component 301 and the semiconductor laser are misaligned, and the test operation is completed.

[0058] It should be noted that multiple test components 301 with different functions can be set along the circumference of the support column 300. As the test stage 400 continues to rotate, the semiconductor laser will sequentially dock with each test component 301 to achieve different functional tests.

[0059] In one embodiment, a second elastic element 304 connected to the slider 303 is provided in the slide groove 302, and a damping structure 305 is provided on the side of the slide groove 302. Specifically, the second elastic element 304 can be a spring, and the damping structure 305 can be a damping rod.

[0060] In this embodiment, when the protrusion 3013 passes through the notch on the push block 401, the sliding seat 3011 loses the external force obstruction and then resets to the initial position under the action of the second elastic member 304, connecting to the next semiconductor laser that is subsequently delivered.

[0061] To prevent excessive reaction force during the reset of the sliding seat 3011 from causing vibration that could affect the test component 301, a damping structure 305 is set to reduce the speed of the sliding seat 3011 at the end of the reset path, thus protecting the test component 301.

[0062] In one embodiment, the test bench 400 is provided with at least one test station 405, and protective plates 406 are provided on both sides of the test station 405. The protective plates 406 divide the space of the inner cover 200, and the protective plates 406 move synchronously with the test bench 400.

[0063] In this embodiment, the protective plate 406 is configured to prevent radiation leakage from the previous test component 301 when multiple semiconductor lasers are being tested in a pipeline testing process and the next semiconductor laser is being loaded. This ensures that there is no radiation leakage when the open placement port 101 is being loaded, meaning that the testing and loading actions are independent of each other. This makes the testing process smooth and does not affect the continuous loading progress, while also ensuring the safety of the personnel being tested and the overall testing efficiency.

[0064] In one embodiment, the protective plate 406 has a movable plate 407 through which the test component 301 passes, and a pusher 408 is provided above the test component 301. When the pusher 408 contacts the movable plate 407, the test component 301 does not contact the movable plate 407.

[0065] Specifically, the movable plate 407 is connected to the protective plate 406 via a rotating shaft. A torsion spring is provided on the rotating shaft, which allows the movable plate 407 to automatically rotate and reset after deviating from its initial position.

[0066] In this embodiment, the test component 301 moves synchronously with the test bench 400 during the test. After the test is completed, the test component 301 needs to be reset to connect to the next semiconductor laser test. A movable plate 407 is provided on the protective plate 406. Specifically, during the automatic reset of the test component 301, the pusher 408 contacts the movable plate 407 and pushes the movable plate 407 away. The test component 301 passes through the protective plate 406 to reset, and after passing through, the movable plate 407 automatically resets.

[0067] In one embodiment, the outer surface of the outer cover 100 is provided with a slide rail 503 located at the placement opening 101. The first operating table 500 is slidably engaged with the slide rail 503. When the semiconductor laser is transferred from the first operating table 500 to the test stage 400, the first operating table 500 is reset by a reset rod 504 located at the end of the slide rail 503. Specifically, the reset rod 504 can be a pneumatic push rod.

[0068] The first operating table 500 has a first block 505 fixedly connected to it, extending into the inner cover 200. A second block 506 is provided on the protective plate 406. The second block 506 includes a protrusion 5061 that contacts the first block 505 and a sliding part 5062. The sliding part 5062 slides in contact with a guide groove 104 formed on the inner wall of the outer cover 100. Specifically, the guide groove 104 is formed on the outer cover 100 at the placement opening 101 and near the end. A third elastic element 507 is provided on the protective plate 406, connected to the second block 506. Specifically, the third elastic element 507 can be a spring.

[0069] In this embodiment, when the test stage 400 passes the area where the placement port 101 is located, the protrusion 5061 on the second block 506 contacts the first block 505, causing the first operating stage 500 to move synchronously. When the sliding part 5062 of the second block 506 enters the guide groove 104, the sliding part 5062 slides along the surface of the guide groove 104. Since the guide groove 104 has an arc-shaped surface, the sliding part 5062 moves towards the center of the outer cover 100 during the sliding process, synchronously driving the protrusion 5061 to move in the same direction, thereby causing the second block 506 to separate from the first block 505. At this time, the first operating stage 500 is reset by the reset rod 504, and the current semiconductor laser is moved to the test position inside the inner cover 200, driving the test assembly 301 to move synchronously to perform the test operation.

[0070] In one embodiment, a test stand 409 is provided at the test station 405, and a segmented fixture 410 is provided on the test stand 409;

[0071] The first operating table 500 is equipped with a segmented fixture 2 501 and a first operating mechanism 502. During the synchronous movement of the first operating table 500 with the test table 400, the segmented fixture 1 410 and the segmented fixture 2 501 remain connected.

[0072] Specifically, both segmented fixture 1 410 and segmented fixture 2 501 are equipped with baffles for limiting the semiconductor laser.

[0073] Specifically, the first operating mechanism 502 can be a cylinder rod with a push block at the end of the cylinder rod. The push block is provided with a negative pressure adsorption hole, which is connected to an external negative pressure device. That is, when placing the laser, the cylinder rod drives the push block to push the laser onto the test stage 400. When removing the laser, the laser is moved outward through the negative pressure adsorption hole on the push block.

[0074] In this embodiment, when the test stage 400 moves to the placement port 101, it drives the first operating stage 500 to move synchronously. At this time, the segmented fixture 1 410 and the segmented fixture 2 501 are connected. The semiconductor laser is pushed from the segmented fixture 2 501 to the segmented fixture 1 410 through the first operating mechanism 502 to complete the placement.

[0075] In one embodiment, the test seat 409 is movably mounted on the test platform 400, and elastic limiting members 411 are provided on both sides of the test seat 409. The support column 300 is provided with a stop bar 306 that extends intermittently and is used to block the movement of the test seat 409.

[0076] Specifically, the stop lever 306 can be extended by a cylinder.

[0077] In this embodiment, when the test component 301 completes the test and resets, in order to ensure that the semiconductor laser located on the test stage 400 can be properly connected to the test component 301, the stop lever 306 is intermittently extended to prevent the test seat 409 from moving synchronously with the test stage 400 during the reset process of the test component 301, and keeps it in the current position to wait for the test component 301 to be fully reset. This ensures the smoothness of the test connection process and improves the test efficiency.

[0078] In one embodiment, a second operating table 600 is provided at the pick-up port 102. The second operating table 600 is provided with a second operating mechanism 601. When the test table 400 passes through the area where the pick-up port 102 is located, it drives the second operating table 600 to move synchronously to transfer the semiconductor laser from the test table 400 to the second operating table 600.

[0079] Specifically, the second operating mechanism 601 has the same structure as the first operating mechanism 502.

[0080] In this embodiment, the second operating platform 600 performs the same actions as the first operating platform 500 during item retrieval, completing the retrieval while moving synchronously with the test platform 400. Its working principle is the same as that of the first operating platform 500, which can be referred to in the above description of the principle of placing the semiconductor laser on the first operating platform 500. The only difference between the two is that the first operating platform 500 pushes the semiconductor laser onto the test platform 400 by pushing, while the second operating platform 600 uses the second operating mechanism 601 to transfer the semiconductor laser from the test platform 400 to the second operating platform 600 by pulling.

[0081] It should be noted that the above embodiments only take the first operating table 500 for placing parts and the second operating table 600 for retrieving parts as examples. The first operating table 500 can also perform the retrieving operation, and the second operating table 600 can also perform the placing operation. Specifically, parts can be placed at both the first operating table 500 and the second operating table 600 at the same time. After the test is completed, the laser that placed the part at the first operating table 500 is retrieved by the second operating table 600, and the laser that placed the part at the second operating table 600 is retrieved by the first operating table 500.

[0082] In one embodiment, the outer surface of the inner cover 200 is provided with a light-blocking strip 103 that slides and fits against the inner surface of the outer cover 100.

[0083] In this embodiment, the light-blocking strip 103 is configured to reduce the outward transmission of light generated by the test component 301. Specifically, the light-blocking strip 103 can be made of any kind of opaque material.

[0084] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0085] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied. Furthermore, "multiple" refers to two or more. Moreover, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent.

[0086] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A comprehensive performance test system for semiconductor lasers, characterized in that , comprising: Base (10), which is provided with an outer cover (100) and an inner cover (200), which are concentrically arranged, and the inner cover (200) is rotationally arranged inside the outer cover (100), the surface of the outer cover (100) has a placing opening (101) and a taking opening (102), and the surface of the inner cover (200) is provided with at least one serial port (201); Support (300) fixedly arranged at the center of the inner surface of the outer cover (100), the support (300) is provided with a test assembly (301); Test table (400) arranged inside the outer cover (100) and making circular motion around the support (300), and the test table (400) is arranged corresponding to the serial port (201), one end of the test table (400) is slidingly connected with the support (300), and the other end is fixedly connected with the inner cover (200); First operation table (500) arranged on the outer surface of the outer cover (100) and located at the placing opening (101); Wherein, when the test table (400) passes through the area where the placing opening (101) is located, the first operation table (500) is driven to move synchronously to transfer the semiconductor laser from the first operation table (500) to the test table (400), the placing opening (101) and the serial port (201) are in communication during the transfer process of the semiconductor laser, and are in a misaligned state after the transfer; The test assembly (301) includes a sliding seat (3011) slidingly connected with the support (300), the sliding seat (3011) is provided with a test mechanism (3012), the support (300) is provided with a sliding groove (302), the sliding seat (3011) is provided with a sliding block (303) connected with the sliding groove (302), and the sliding seat (3011) is provided with a protruding block (3013); The test table (400) is provided with a dial block (401), the dial block (401) has a gap for the protruding block (3013) to pass through, the dial block (401) is connected with a movable shaft (402), the movable shaft (402) is sleeved with a first elastic member (403), and the movable shaft (402) is slidingly attached with a limiting table (404) arranged in the inner cover (200), wherein the movable shaft (402) intermittently slides along the limiting table (404) during the movement of the test table (400), the protruding block (3013) and the dial block (401) are misaligned until they pass through each other, so that the test assembly (301) is reset, and the limiting table (404) has an arc surface.

2. The system of claim 1, wherein the system further comprises: a laser driver configured to drive the laser diode; and a laser controller configured to control the laser driver. The sliding groove (302) is provided with a second elastic member (304) connected with the sliding block (303), and the sliding groove (302) is provided with a damping structure (305) beside it.

3. The semiconductor laser comprehensive performance testing system as described in claim 1, characterized in that: The test platform (400) is provided with at least one test station (405), both sides of the test station (405) are provided with a protective plate (406), the protective plate (406) divides the space of the inner cover (200), and the protective plate (406) moves synchronously with the test platform (400).

4. The system of claim 3, wherein the system further comprises a laser diode driver. The protective plate (406) is provided with a movable plate (407) for the test assembly (301) to pass through, and a push frame (408) is arranged above the test assembly (301), when the push frame (408) contacts the movable plate (407), the test assembly (301) does not contact the movable plate (407).

5. The system of claim 3, wherein the system further comprises: a laser driver for driving the laser diode; and a laser controller for controlling the laser driver. The outer cover (100) is provided with a sliding rail (503) at the placing opening (101), the first operation table (500) is in sliding fit with the sliding rail (503), when the semiconductor laser is transferred from the first operation table (500) to the test platform (400), the first operation table (500) is reset through a reset rod (504) arranged at the end of the sliding rail (503). The first operation table (500) is fixedly connected with a first block (505) extending into the inner cover (200), the protective plate (406) is provided with a second block (506), the second block (506) includes a protruding portion (5061) in contact with the first block (505) and a sliding portion (5062), the sliding portion (5062) is in sliding contact with a guide groove (104) arranged in the inner wall of the outer cover (100), and the protective plate (406) is provided with a third elastic member (507) connected with the second block (506).

6. The system of claim 3, wherein the system further comprises: a laser driver for driving the laser diode; and a laser controller for controlling the laser driver. The test station (405) is provided with a test seat (409), and the test seat (409) is provided with a segmented jig one (410). The first operation table (500) is provided with a segmented jig two (501) and a first operation mechanism (502), during synchronous movement of the first operation table (500) with the test platform (400), the segmented jig one (410) and the segmented jig two (501) are in butt joint.

7. The system of claim 6, wherein the system further comprises: a laser driver for driving the laser diode; and a laser controller for controlling the laser driver. The test seat (409) is movably arranged on the test platform (400), and both sides of the test seat (409) are provided with elastic limit members (411), and the support column (300) is provided with a blocking rod (306) intermittently extending and used for blocking movement of the test seat (409).

8. The semiconductor laser comprehensive performance testing system as described in claim 1, characterized in that: The second operation table (600) is arranged at the taking opening (102), the second operation table (600) is provided with a second operation mechanism (601), when the test platform (400) passes through the area where the taking opening (102) is located, the second operation table (600) is driven to move synchronously to transfer the semiconductor laser from the test platform (400) to the second operation table (600).

9. The semiconductor laser comprehensive performance testing system as described in claim 1, characterized in that: The inner cover (200) is provided with a light blocking strip (103) in sliding fit with the inner surface of the outer cover (100).

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