Dynamic derating control method and system based on vehicle chip

Abstract

The application discloses a dynamic derating control method and system based on vehicle chips, and relates to the technical field of vehicle chip control, and comprises the following steps: a grouping module is used to acquire position information of the chips relative to the vehicle body, and the chips are grouped based on the relative position relationship of the chips; an implantation and configuration unit is used to implant a monitoring program for each chip and configure a correction parameter for each group of chips; the application optimizes the monitoring range based on the position relationship of the chips, captures chip running noise in real time in combination with a customized program, improves the accuracy of noise spectrum energy analysis by means of accurate correction parameters, and accurately judges whether the chips need to adjust working parameters, so that the chips can dynamically adapt to the running state, reliable derating protection is ensured, and the original parameters can be automatically restored after the noise is reduced to a reasonable range, thereby realizing intelligent balance of reliability and performance.

Description

Technical Field

[0001] This invention relates to the field of automotive chip control technology, specifically to a dynamic derating control method and system based on automotive chips. Background Technology

[0002] Dynamic derating of automotive chips can respond to changes in environment and load in real time, accurately balance reliability and performance, avoid excessive derating and waste of computing power, adapt to dynamic scenarios such as autonomous driving, and extend chip life. Fixed derating, on the other hand, does not require complex monitoring and adjustment mechanisms, is simple to design, low in cost, has stable operating parameters, and has no risk of dynamic adjustment fluctuations. It is suitable for traditional components with low complexity and high stability requirements.

[0003] Based on the above, it is not difficult to see that both dynamic derating and fixed derating have advantages in automotive chip derating control technology. Due to the variability of vehicle driving scenarios and the large number of uncertain factors, the development of dynamic derating technology for automotive chips is relatively difficult. On the other hand, fixed derating technology has a stable application effect, but its intelligence level is relatively poor. If more intelligent dynamic control can be implemented for fixed derating, it can achieve the same target effect as dynamic derating to a certain extent, and the design difficulty and cost are lower than those of automotive dynamic derating technology.

[0004] To address this, a dynamic derating control method and system based on automotive chips are proposed. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a dynamic derating control method and system based on automotive chips, which can effectively solve the problems of the prior art.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions; This invention discloses a dynamic derating control system based on automotive chips, comprising: The chip grouping module acquires the chip's position information relative to the vehicle body and groups the chips based on their relative positions. The implantation and configuration unit implants monitoring programs into each chip and configures correction parameters for each group of chips. The diagnostic module acquires the noise spectrum of each chip in each group, calculates the noise spectrum energy, corrects it based on the correction parameters, and diagnoses whether the chip needs to perform operating parameter adjustments. The adjustment module receives chips diagnosed by the diagnostic module as needing operating parameter adjustments and performs derating adjustments on the chip's operating parameters. The control module controls the chip's operating parameters to return to their pre-derating state.

[0007] Furthermore, during the operation phase of the grouping module, the position information of each chip relative to the vehicle body is mapped in three-dimensional space, and the mapped positions are marked with the corresponding chip name and number. Simultaneously, each chip is used as an identification target in three-dimensional space to identify the chip closest to it. The chip pointed to by the identification result is bound to the chip as a group of chips. Each chip can be bound to one or more other chips, which are all the chips deployed on the vehicle body.

[0008] Furthermore, the monitoring program implanted in the implantation and configuration unit for each chip is used to monitor in real time the noise generated by the random thermal vibration of the internal lattice of another chip in the same group as the chip at a preset frequency. The preset frequency is defined by the system user, and the noise monitoring direction of each chip is close to the chip it is bound to. When each chip monitors noise through the monitoring program, it first senses the vibration signal at its own location and extracts the noise from the vibration signal: The vibration signal is divided into several frequency bands according to a preset window. The higher the noise extraction accuracy requirement, the more frequency bands are obtained. Calculate the time-frequency complexity of each frequency band within each window. ; Calculate the correlation coefficient of each frequency band within each window. ; The noise frequency band is the frequency band that meets the following conditions: ; in, Indicates frequency band The normalized energy probability of the internal time-frequency component, where f and t represent frequency and time, respectively. Indicates frequency band The corresponding time-domain signal, express The mean, This represents the time-domain signal corresponding to the reference useful signal frequency band. express The mean, Recorded as a composite index, Indicates the weighting coefficient. ∈ (0,1), This represents the maximum value of the complexity exponent across all frequency bands. This represents the maximum absolute value of the correlation coefficient across all frequency bands. This indicates an adaptive threshold.

[0009] Furthermore, the aforementioned The determination is based on the following logic: All frequency bands The energy percentage and stability index are used to select frequency bands with a preset percentage value of energy percentage and a stability index lower than the overall average of the stability indices of all frequency bands. The stability index is between 0 and 1. The smaller the time rate of change of the signal variance, the larger the stability index, that is, the more stable the signal. ; In the formula: frequency band The corresponding time-frequency components; This is the average of the comprehensive index across all frequency bands; This represents the standard deviation of the composite index across all frequency bands.

[0010] Furthermore, the correction parameters configured for each group of chips in the implantation and configuration unit are as follows: ; In the formula: For vibration transmission efficiency; This is the length of the line connecting the center points of two chips in this group. in, , Through experimentation, two chips in a set of chips are denoted as x and y. The vibration value of x sensed in y under the x-state of operation, and the measured vibration value under the x-state of operation. The vibration value of y sensed on x under the y-state operation and the measured vibration value under the y-state operation are respectively.

[0011] Furthermore, during the operation of the diagnostic module, the noise detected by each chip based on the monitoring program is acquired, the noise is transformed into a spectrum, the spectral energy is calculated, and corrections are made synchronously. ; In the formula: The corrected spectral energy; To correct the parameters; For spectral energy; in, If the value is greater than or equal to the preset value, the chip is determined to need to adjust its operating parameters.

[0012] Furthermore, the adjustment module stores the derating adjustment target value for each chip. Based on the derating adjustment target value, the adjustment module performs synchronous derating adjustment control on the operating parameters of the chips that need to have their operating parameters adjusted, so that the operating parameters of each chip that needs to have its operating parameters adjusted are adjusted to the corresponding derating adjustment target value and maintained.

[0013] Furthermore, during the operation phase of the control module, the noise monitored before the chip operating parameters were derating is used as the reference noise, and the chip operating noise is continuously monitored based on the monitoring program after the chip operating parameters are derating. When the noise decays to a preset percentage of the reference noise, the chip operating parameters are controlled to be restored to the operating parameters before the derating adjustment.

[0014] Furthermore, the group module is interconnected with an implantation and configuration unit via a wireless network, the implantation and configuration unit is interconnected with a diagnostic module via a wireless network, and the diagnostic module is interconnected with an adjustment module and a control module via a wireless network.

[0015] On the other hand, dynamic derating control methods based on automotive chips include: The system acquires the positional information of each chip relative to the vehicle body, maps and marks it in three-dimensional space, identifies the nearest chip to each chip, and binds it to a group, ensuring that all chips on the vehicle body participate in grouping. A monitoring program is implanted into each chip to monitor the noise of the bound chips at a preset frequency, and correction parameters are configured for each group of chips. The chips sense their own positional vibration signals through the monitoring program, divide the frequency bands, calculate the time-frequency complexity and correlation coefficient, and extract noise frequency bands that meet preset conditions. The system acquires the noise spectrum of each group of chips, calculates the energy, corrects it with correction parameters, and determines whether the chip's operating parameters need adjustment. It receives chips that need adjustment, synchronously adjusts their operating parameters according to the derating target value, and maintains this adjustment. Using the noise before derating as a reference, the system continuously monitors the noise after derating, and when the noise attenuates to a preset percentage of the reference value, the control parameters are restored to the state before adjustment.

[0016] Compared with the known prior art, the technical solution provided by this invention has the following beneficial effects: This invention provides a dynamic derating control method and system based on automotive chips. During execution, the method and system optimize the monitoring range based on the chip's position relationship, capture chip operating noise in real time with a customized program, and improve the accuracy of noise spectrum energy analysis by accurately correcting parameters. This allows for precise determination of whether the chip needs to adjust its operating parameters. The system can dynamically adapt to the chip's operating state, ensuring reliable derating protection. Furthermore, it can automatically restore the original parameters after the noise drops to a reasonable range, achieving an intelligent balance between reliability and performance. Furthermore, this method and system do not introduce new firmware, resulting in lower design costs. During the implementation phase, each chip acts as a "supervisor" of neighboring chips to supervise each other, while ensuring the comprehensiveness of dynamic derating management of automotive chips. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a dynamic derating control system based on automotive chips. Figure 2 This is a flowchart illustrating a dynamic derating control method based on automotive chips. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0020] The present invention will be further described below with reference to embodiments. Example

[0021] The dynamic derating control system based on automotive chips in this embodiment, such as Figure 1 As shown, it includes: The grouping module is used to obtain the position information of the chips relative to the vehicle body and group the chips based on their relative positional relationship. During the grouping module operation phase, the position information of each chip relative to the vehicle body is mapped in three-dimensional space, and the mapped positions are marked with the corresponding chip name and number. Simultaneously, each chip is used as a recognition target in three-dimensional space to identify the chip closest to it. The chip pointed to by the recognition result is bound to the chip as a group of chips. It should be noted that when measuring the distance between chips, the surface of the vehicle component where the chip is located should be used as a reference surface to determine the distance between chips. Each chip can be bound to one or more other chips, and the chips are all the chips deployed on the vehicle body; The implantation and configuration unit is used to implant monitoring programs into each chip and configure correction parameters for each group of chips. The monitoring program implanted in the implantation and configuration unit for each chip is used to monitor in real time the noise generated by the random thermal vibration of the internal lattice of another chip in the same group as the chip at a preset frequency. The preset frequency is defined by the system user. The noise monitoring direction of each chip is close to the chip it is attached to. Regarding the above-mentioned preset frequency recommendations: For power chips (such as IGBTs), it is recommended to set it to 1kHz-5kHz (because the thermal noise of power devices changes rapidly); for logic chips (such as MCUs), it is recommended to set it to 500Hz-2kHz (for more stable noise characteristics); users can fine-tune it within this range based on the noise bandwidth parameters in the chip datasheet. The following is an example of the monitoring program described above, represented in code form (only the key parts are shown). It should be noted that the monitoring program here is not limited to the following; it can be adaptively configured according to usage requirements during the specific implementation phase, and only needs to meet the functional limitations of the monitoring program in this embodiment: import numpy as np class Chip: def __init__(self, chip_id): self.chip_id = chip_id self.vibration_data = [] # Raw vibration data def collect_vibration_data(self): "Simulated acquisition of vibration signals, including vehicle vibration and chip noise." # Vehicle vibration signal (periodic) vehicle_vibration = 0.5 * np.sin(np.linspace(0, 10*np.pi,100)) # Internal thermal noise of the chip (random) thermal_noise = np.random.normal(0, 0.1, 100) # Merge signal combined_signal = vehicle_vibration + thermal_noise self.vibration_data = combined_signal return combined_signal def main(): # Create 4 chips chips = [Chip(i) for i in range(4)] # Analog signal acquisition process For chip in chips: # Collect vibration data signal_data = chip.collect_vibration_data() print(f"The chip {chip.chip_id} has acquired a signal: {signal_data[:5]}...") print("-" * 40) if __name__ == "__main__": main(). When each chip monitors noise through the monitoring program, it first senses the vibration signal at its own location and extracts the noise from the vibration signal: The vibration signal is divided into several frequency bands according to a preset window. The higher the noise extraction accuracy requirement, the more frequency bands are obtained. Calculate the time-frequency complexity of each frequency band within each window. ; Calculate the correlation coefficient of each frequency band within each window. ; The noise frequency band is the frequency band that meets the following conditions: ; in, Indicates frequency band The normalized energy probability of the internal time-frequency component, where f and t represent frequency and time, respectively. Indicates frequency band The corresponding time-domain signal, express The mean, This represents the time-domain signal corresponding to the reference useful signal frequency band. express The mean, Recorded as a composite index, Indicates the weighting coefficient. ∈ (0,1), This represents the maximum value of the complexity exponent across all frequency bands. This represents the maximum absolute value of the correlation coefficient across all frequency bands. Indicates an adaptive threshold; The above formula, based on the differences in time-frequency characteristics between noise and useful signals, comprehensively considers the normalized energy probability of time-frequency components within the frequency band, the difference between the mean of the time-domain signal and the mean of the reference useful signal, and combines time-frequency complexity, the maximum value of the correlation coefficient, and the adaptive threshold to construct multi-dimensional conditions for accurately screening noise frequency bands. The advantage of this design is that it breaks through the limitations of single-index judgment. By integrating multiple features such as energy probability, mean difference, complexity, and correlation coefficient, it can effectively distinguish noise from useful signals in the complex and mixed chip vibration signals in automotive environments. Furthermore, the number of frequency bands can be flexibly adjusted according to the noise extraction accuracy requirements, significantly improving the accuracy and adaptability of noise identification.

[0022] The determination is based on the following logic: All frequency bands The energy percentage and stability index are used to select frequency bands with a preset percentage value of energy percentage and a stability index lower than the overall average of the stability indices of all frequency bands. The stability index is between 0 and 1. The smaller the time rate of change of the signal variance, the larger the stability index, that is, the more stable the signal. ; In the formula: frequency band The corresponding time-frequency components; This is the average of the comprehensive index across all frequency bands; The standard deviation of the composite index across all frequency bands; The correction parameters configured for each group of chips in the implantation and configuration unit are as follows: ; In the formula: For vibration transmission efficiency; This is the length of the line connecting the center points of two chips in this group. in, , Through experimentation, two chips in a set of chips are denoted as x and y. The vibration value of x sensed in y under the x-state of operation, and the measured vibration value under the x-state of operation. The vibration value of y sensed on x under the y-state operation and the measured vibration value under the y-state operation. To eliminate the impact of chip positional differences on vibration transmission, the above formula incorporates a comprehensive consideration of the length of the line connecting the center points of the two chips and the vibration transmission efficiency. The vibration transmission efficiency is obtained by measuring the ratio of the vibration values ​​sensed between chips to the actual measured vibration values, which accurately reflects the transmission loss of vibration between chips. Combined with the distance factor, the correction parameters are made more consistent with actual working conditions. By obtaining the vibration transmission efficiency through actual measurement, the spatial relationship of automotive chip deployment and the true characteristics of vibration transmission are fully considered, making the subsequent correction of noise spectrum energy more accurate and effectively avoiding noise assessment deviations caused by differences in vehicle component distribution and component material characteristics.

[0023] The diagnostic module is used to acquire the noise spectrum monitored by each chip in each group of chips, calculate the noise spectrum energy and correct it based on the correction parameters, and diagnose whether the chip needs to perform operating parameter adjustments. During the diagnostic module's operation, it acquires the noise detected by each chip based on the monitoring program, transforms the noise into a spectrum, calculates the spectral energy, and makes synchronous corrections. ; In the formula: The corrected spectral energy; To correct the parameters; For spectral energy; in, If the value is greater than or equal to the preset value, it is determined that the chip needs to perform operating parameter adjustments. The adjustment module is used to receive chips diagnosed by the diagnostic module as requiring adjustment of operating parameters, and to perform derating adjustment on the operating parameters of the chips. The adjustment module stores the derating adjustment target values ​​for each chip. Based on the derating adjustment target values, the adjustment module performs synchronous derating adjustment control on the operating parameters of the chips that need to have their operating parameters adjusted, so that the operating parameters of each chip that needs to have its operating parameters adjusted to the corresponding derating adjustment target values ​​and maintained. The logic for setting the target value for the reduction adjustment includes: Reference chip derating standards: Based on JEDEC standards, the voltage derating of power chips shall not exceed 15%, and the frequency derating shall not exceed 20%; the voltage derating of logic chips shall not exceed 10%, and the frequency derating shall not exceed 15%. Based on functional priority: the derating target value for critical chips (such as ESP control chips) is set to the minimum (only 5%-10%), while the derating target value for non-critical chips (such as entertainment system chips) can be reduced by 15%-25%; Dynamic optimization: The failure rate of the chip and vehicle performance data after derating are recorded through machine learning models, and the target value is continuously iterated (e.g., if a chip has no failures and no impact on performance after derating by 10%, the value can be maintained next time). The control module is used to restore the chip's operating parameters to the operating parameters before the derating adjustment; During the operation of the control module, the noise monitored before the chip operating parameters were derating is used as the reference noise. After the chip operating parameters are derating, the chip operating noise is continuously monitored based on the monitoring program. When the noise decays to a preset percentage of the reference noise, the chip operating parameters are controlled to be restored to the operating parameters before the derating adjustment. The formula for calculating the percentage of noise attenuation is: ; In the formula: The noise intensity is used as a reference noise level; The noise level of the current chip operation; The group module is interconnected with the implantation and configuration unit via a wireless network. The implantation and configuration unit is interconnected with the diagnostic module via a wireless network. The diagnostic module is interconnected with the adjustment module and the control module via a wireless network. In addition, to ensure the fault tolerance of the system and automotive chips, redundancy can be configured for the chips: at least one chip in each group is equipped with a backup monitoring program (independent of the main program), and the main program will automatically switch to the backup program when it fails, with a switching time of <100ms.

[0024] In this embodiment, the grouping module obtains the chip's position information relative to the vehicle body, groups the chips based on their relative positions, and then the implantation and configuration unit implants a monitoring program for each chip and configures correction parameters for each group of chips. The diagnostic module then obtains the noise spectrum of each chip in each group, calculates the noise spectrum energy and corrects it based on the correction parameters, diagnoses whether the chip needs to perform operating parameter adjustments, and receives the chips diagnosed by the diagnostic module as needing operating parameter adjustments through the adjustment module. The operating parameters of the chips are then derated, and finally, the control module controls the chip's operating parameters to be restored to the operating parameters before the derated adjustment.

[0025] In the above embodiments, the system accurately monitors the noise generated by thermal vibration between automotive chips by associating their locations. Combined with parameter correction, it precisely judges the chip status and promptly derates the operating parameters of chips requiring adjustment, reducing their operating load to decrease the risk of failure and extend their service life. Once the noise drops to a reasonable range, the original parameters are restored to ensure performance. This process improves the operational stability of automotive chips, reduces vehicle malfunctions caused by chip problems, and enhances the reliability and safety of the entire vehicle's electronic system. Example

[0026] At the implementation level, based on Example 1, this example refers to... Figure 2 The dynamic derating control system based on automotive chips in Example 1 will be further described in detail below: Dynamic derating control methods based on automotive chips include: The position information of each chip relative to the vehicle body is obtained, mapped and labeled in three-dimensional space, the nearest chip to each chip is identified, and the chip is bound to that chip as a group, so that all chips on the vehicle body participate in the grouping. A monitoring program is implanted into each chip to monitor the noise of the bonded chips at a preset frequency, and correction parameters are configured for each group of chips; The chip senses its own position vibration signal through a monitoring program, divides the frequency band, calculates the time-frequency complexity and correlation coefficient, and extracts the noise frequency band that meets the preset conditions; Obtain the noise spectrum of each group of chips, calculate the energy and correct it with correction parameters to determine whether the chip needs to adjust its operating parameters; Receive the chip that needs adjustment, synchronously adjust its operating parameters according to the derating target value, and maintain them; Using the noise level before derating as a reference, continuously monitor the noise level after derating. When the noise level decreases to a preset percentage of the reference value, the control parameters are restored to the state before adjustment.

[0027] In summary, the methods and systems described in the above embodiments optimize the monitoring range based on chip location relationships during execution, combine customized programs to capture chip operating noise in real time, and improve the accuracy of noise spectrum energy analysis by precisely correcting parameters. This allows for accurate determination of whether the chip needs to adjust its operating parameters. The system can dynamically adapt to the chip's operating state, ensuring reliable derating protection. Furthermore, it can automatically restore the original parameters after the noise drops to a reasonable range, achieving an intelligent balance between reliability and performance. In addition, the method and system do not introduce new firmware, resulting in lower design costs. During the implementation phase, each chip acts as a "supervisor" of neighboring chips to monitor each other, while ensuring the comprehensiveness of dynamic derating management for automotive chips.

[0028] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dynamic derating control system based on automotive chips, characterized in that, include: The grouping module is used to obtain the position information of the chips relative to the vehicle body and group the chips based on the relative position relationship of each chip; An implantation and configuration unit is used to implant a monitoring program into each chip and configure correction parameters for each group of chips; the correction parameters configured for each group of chips in the implantation and configuration unit are as follows: ； In the formula: For vibration transmission efficiency; This is the length of the line connecting the center points of two chips in this group. in, , Through experimentation, two chips in a set of chips are denoted as x and y. The vibration value of x sensed in y under the x-state of operation, and the measured vibration value under the x-state of operation. The vibration value of y sensed on x under the y-state operation and the measured vibration value under the y-state operation. The diagnostic module is used to acquire the noise spectrum monitored by each chip in each group, calculate the noise spectrum energy and correct it based on correction parameters, and diagnose whether the chip needs to perform operating parameter adjustments. During the operation phase of the diagnostic module, the noise detected by each chip based on the monitoring program is acquired, the noise is converted into a spectrum, the spectrum energy is calculated, and corrections are made synchronously. ； In the formula: The corrected spectral energy; To correct the parameters; For spectral energy; in, If the value is greater than or equal to the preset value, it is determined that the chip needs to perform operating parameter adjustments; The adjustment module is used to receive chips diagnosed by the diagnostic module as requiring adjustment of operating parameters, and to perform derating adjustment on the operating parameters of the chips. The control module is used to restore the chip's operating parameters to the parameters before the derating adjustment.

2. The dynamic derating control system based on automotive chips according to claim 1, characterized in that, During the operation of the grouping module, the position information of each chip relative to the vehicle body is mapped in three-dimensional space, and the mapped position is marked. The marking content is the corresponding chip name and number. Simultaneously, each chip is used as a recognition target in three-dimensional space to identify the chip closest to it. The chip pointed to by the recognition result is bound to the chip as a group of chips. Each chip is bound to one or more other chips, which are all the chips deployed on the vehicle body.

3. The dynamic derating control system based on automotive chips according to claim 1, characterized in that, The implantation and configuration unit contains a monitoring program implanted in each chip, which is used to monitor in real time the noise generated by the random thermal vibration of the internal lattice of another chip in the same group as the chip at a preset frequency. The preset frequency is defined by the system user, and the noise monitoring direction of each chip is close to the chip it is bound to. When each chip monitors noise through the monitoring program, it first senses the vibration signal at its own location and extracts the noise from the vibration signal: The vibration signal is divided into several frequency bands according to a preset window. The higher the noise extraction accuracy requirement, the more frequency bands are obtained. Calculate the time-frequency complexity of each frequency band within each window. ; Calculate the correlation coefficient of each frequency band within each window. ; The noise frequency band is the frequency band that meets the following conditions: ； in, Indicates frequency band The normalized energy probability of the internal time-frequency component, where f and t represent frequency and time, respectively. Indicates frequency band The corresponding time-domain signal, express The mean, This represents the time-domain signal corresponding to the reference useful signal frequency band. express The mean, Recorded as a composite index, Indicates the weighting coefficient. ∈ (0,1), This represents the maximum value of the complexity exponent across all frequency bands. This represents the maximum absolute value of the correlation coefficient across all frequency bands. This indicates an adaptive threshold.

4. The dynamic derating control system based on automotive chips according to claim 3, characterized in that, The The determination is based on the following logic: All frequency bands The energy percentage and stability index are used to select frequency bands with a preset percentage value of energy percentage and a stability index lower than the overall average of the stability indices of all frequency bands. The stability index is between 0 and 1. The smaller the time rate of change of the signal variance, the larger the stability index, that is, the more stable the signal. ； In the formula: frequency band The corresponding time-frequency components; This is the average of the comprehensive index across all frequency bands; This represents the standard deviation of the composite index across all frequency bands.

5. The dynamic derating control system based on automotive chips according to claim 1, characterized in that, The adjustment module stores the derating adjustment target values ​​for each chip. Based on the derating adjustment target values, the adjustment module performs synchronous derating adjustment control on the operating parameters of the chips that need to have their operating parameters adjusted, so that the operating parameters of each chip that needs to have its operating parameters adjusted are adjusted to the corresponding derating adjustment target values ​​and maintained.

6. The dynamic derating control system based on automotive chips according to claim 1, characterized in that, During the operation phase of the control module, the noise monitored before the chip operating parameters were derating is used as the reference noise. After the chip operating parameters are derating, the chip operating noise is continuously monitored based on the monitoring program. When the noise decays to a preset percentage of the reference noise, the chip operating parameters are controlled to be restored to the operating parameters before the derating adjustment.

7. The dynamic derating control system based on automotive chips according to claim 1, characterized in that, The group module is interconnected with the implantation and configuration unit via a wireless network. The implantation and configuration unit is interconnected with the diagnostic module via a wireless network. The diagnostic module is interconnected with the adjustment module and the control module via a wireless network.

8. A dynamic derating control method based on automotive chips, wherein the method is an implementation method of the dynamic derating control system based on automotive chips as described in any one of claims 1-7, characterized in that, include: The position information of each chip relative to the vehicle body is obtained, mapped and labeled in three-dimensional space, the nearest chip to each chip is identified, and the chip is bound to that chip as a group, so that all chips on the vehicle body participate in the grouping. A monitoring program is implanted into each chip to monitor the noise of the bonded chips at a preset frequency, and correction parameters are configured for each group of chips; The chip senses its own position vibration signal through a monitoring program, divides the frequency band, calculates the time-frequency complexity and correlation coefficient, and extracts the noise frequency band that meets the preset conditions; Obtain the noise spectrum of each group of chips, calculate the energy and correct it with correction parameters to determine whether the chip needs to adjust its operating parameters; Receive the chip that needs adjustment, synchronously adjust its operating parameters according to the derating target value, and maintain them; Using the noise level before derating as a reference, continuously monitor the noise level after derating. When the noise level decreases to a preset percentage of the reference value, the control parameters are restored to the state before adjustment.

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