Temperature control adjusting method and system for printing curing equipment

Abstract

The invention provides a temperature control adjusting method and system for printing curing equipment. The temperature control adjusting method of the printing curing equipment comprises the steps that printing data information corresponding to a current printing task is uploaded to a database; the first grid setting factor and the second grid setting factor are used for carrying out grid division on a substrate surface irradiation area of the UV curing equipment, and a plurality of grid areas are obtained; performing target grid screening according to the real-time temperature change characteristic parameters of the grid region to obtain a target characteristic grid; and temperature compensation is carried out according to the adjustment target temperature obtained in the temperature control process of the UV curing equipment according to the temperature change characteristic parameters of the target characteristic grid, the compensated adjustment target temperature is obtained, and temperature regulation and control are carried out on the UV curing equipment according to the compensated adjustment target temperature. The system comprises modules corresponding to the steps of the method.

Description

Technical Field

[0001] This invention proposes a temperature control method and system for printing curing equipment, belonging to the field of printing temperature control technology. Background Technology

[0002] In the printing industry, UV (ultraviolet) curing technology is widely used in printing curing equipment due to its advantages such as fast curing speed, low energy consumption, and low pollution. However, current printing curing equipment faces many problems in temperature control that urgently need to be addressed. Printing tasks involve a variety of materials, and the thermal properties of different materials, such as coefficient of thermal expansion, thermal conductivity, density, and specific heat capacity, vary significantly. For example, some flexible printing materials and rigid printing materials have completely different thermal responses under the same temperature change conditions. At the same time, process parameters such as the minimum effective exposure time under UV light and the substrate transport speed also have a complex impact on the temperature field distribution during the curing process. If these factors cannot be accurately controlled, it is easy to cause uneven temperature distribution on the substrate surface, resulting in local over- or under-curing, which seriously affects the quality of printed products, such as causing problems like decreased ink adhesion and substrate deformation. In existing technologies, the grid division method for the irradiation area on the substrate surface of UV curing equipment is relatively simple, mostly based on experience or single-dimensional parameters (such as only based on the irradiation area), failing to fully consider the impact of printing material characteristics and process parameter differences on temperature changes. This makes the grid area unable to accurately reflect the actual temperature change characteristics, and subsequent grid-based temperature control lacks specificity. In temperature control, traditional methods often rely on preset fixed temperature values ​​or simple temperature feedback for adjustment, ignoring the differences in temperature variation characteristics in different grid areas due to factors such as materials and processes. When the temperature variation in the grid area is complex, it is impossible to effectively compensate for the target temperature, making it difficult to achieve precise temperature control and meet the demand for accurate temperature control in high-quality printing.

[0003] Therefore, there is an urgent need for a new temperature control method for printing curing equipment that can comprehensively consider printing data information, scientifically divide grid areas, accurately select target feature grids, and compensate for the adjustment of target temperature based on their temperature change characteristics, so as to achieve more accurate and adaptable temperature control for printing tasks and improve the quality of printed products and production efficiency. Summary of the Invention

[0004] This invention provides a temperature control regulation method and system for printing curing equipment to solve the technical problems existing in the prior art. The technical solution adopted is as follows: A method for temperature control and regulation of a printing curing equipment, the method comprising: Upload the printing data information corresponding to the current printing task to the database; wherein, the first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV; the second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed. The substrate surface irradiation area of ​​the UV curing equipment is divided into multiple grid regions by using the first grid setting factor and the second grid setting factor. The target grid is selected based on the real-time temperature change characteristic parameters of the grid area to obtain the target feature grid; wherein, the target feature grid is determined by the coordinate distribution area corresponding to the temperature parameters of the area combined with the first calibration radius and the second calibration radius, and the coordinate distribution area is generated by the maximum gradient of heat exposure and temperature change in each grid area; Temperature compensation is performed on the target temperature obtained during the temperature control process of the UV curing equipment based on the temperature change characteristic parameters of the target feature grid. The compensated target temperature is then obtained, and the UV curing equipment is temperature regulated according to the compensated target temperature.

[0005] Furthermore, the irradiation area on the substrate surface of the UV curing equipment is divided into multiple mesh regions using a first mesh setting factor and a second mesh setting factor, including: The first grid setting factor is obtained using the material parameters of the substrate and the effective exposure time. The second grid setting factor is obtained by utilizing the material parameters of the substrate and the maximum allowable temperature gradient of the irradiated area on the substrate surface. The first grid setting factor and the second grid setting factor are used to obtain the grid size parameters, and the substrate surface irradiation area of ​​the UV curing equipment is divided into grids according to the grid size parameters to obtain multiple grid areas.

[0006] The grid size parameter is obtained using the following formula: Where L represents the mesh size parameter; k represents the process safety factor, with a value ranging from 0.8 to 1.5; G 01 and G 02 This represents the first grid setting factor and the second grid setting factor.

[0007] Furthermore, a first grid setting factor is obtained using the first material parameters of the substrate and the minimum effective exposure time, including: Retrieve the first material parameter contained in the material parameters of the substrate from the database, wherein the first material parameter includes; Retrieve the minimum effective UV exposure time value required for the printing process of the substrate surface irradiation area corresponding to the printing task; The first grid setting factor is obtained by combining the material's coefficient of thermal expansion and thermal conductivity with the minimum effective exposure time under UV light.

[0008] The first grid setting factor is obtained by the following formula: Among them, G 01 α represents the first grid setting factor; λ represents the material expansion coefficient; λ represents the material thermal conductivity; and ΔT represents the minimum effective exposure time under UV light required for the printing process of the irradiated area on the substrate surface.

[0009] Furthermore, a second mesh setting factor is obtained using the second material parameters of the substrate and the maximum allowable temperature gradient of the irradiated area on the substrate surface, including: Retrieve the second material parameters contained in the material parameters of the substrate from the database; the second material parameters include material density and material specific heat capacity. The maximum allowable temperature gradient for the irradiated area on the substrate surface is determined. Retrieve the substrate conveying speed specified for the current printing task from the database; The second grid setting factor is set by combining the material density and specific heat capacity with the maximum allowable temperature gradient and the substrate transport speed.

[0010] The second grid setting factor is obtained by the following formula: Among them, G 02 This represents the second grid setting factor; ρ represents the material density; c represents the material specific heat capacity. T max This indicates the maximum permissible temperature gradient for the irradiated area on the substrate surface; v This indicates the substrate conveying speed specified for the current printing task.

[0011] Furthermore, target meshes are selected based on real-time temperature change characteristic parameters of the mesh region to obtain target feature meshes, including: Retrieve the temperature change characteristic parameters for each grid region, wherein the temperature change characteristic parameters include the maximum temperature change gradient and the heat exposure corresponding to the grid region; The maximum temperature change gradient for each grid region is normalized to obtain the normalized maximum temperature change gradient. The heat exposure of each grid region is normalized to obtain the normalized heat exposure. Using the normalized heat exposure in each grid region as the abscissa and the maximum normalized temperature change gradient corresponding to each grid region as the ordinate, the coordinate distribution area corresponding to the temperature parameters of the generated region is produced. The first calibration radius is obtained by utilizing the local peak temperature that appears in each grid region; The second calibration radius is obtained by utilizing the standard deviation of temperature fluctuations within each grid region; The coordinate distribution area is divided using the first calibration radius and the second calibration radius, and the target feature grid is selected based on the division results.

[0012] Furthermore, the first calibration radius is obtained using the local peak temperature occurring within each grid region, including: Retrieve the local peak temperature that appears in each grid region; The local peak temperature appearing in each grid region is normalized to obtain the normalized local peak temperature. The first calibration radius is obtained based on the normalized local peak temperature corresponding to each grid region.

[0013] The first calibration radius is obtained by the following formula: Among them, R 01 Y represents the first calibration radius; n represents the total number of grid regions; i Y represents the heat exposure corresponding to the i-th grid region; c This indicates the preset reference value for heat exposure; T i T represents the normalized local peak temperature corresponding to the i-th grid region; max and T min This represents the maximum and minimum local peak temperatures after normalization for n grid regions.

[0014] Furthermore, the second calibration radius is obtained using the standard deviation of temperature fluctuations within each grid region, including: Calculate the standard deviation of temperature fluctuation for each grid region; The standard deviation of temperature fluctuation in each grid region is normalized to obtain the normalized standard deviation of temperature fluctuation. The second calibration radius is obtained based on the normalized standard deviation of temperature fluctuation corresponding to each grid region.

[0015] The second calibration radius is obtained by the following formula: Among them, R 02 Indicates the second calibration radius; n represents the total number of grid regions; Гi This represents the maximum temperature gradient corresponding to the i-th grid region; Г c This represents the preset gradient reference value; σ i This represents the normalized standard deviation of temperature fluctuation corresponding to the i-th grid region.

[0016] Furthermore, the coordinate distribution area is divided using the first and second calibration radii, and the target feature grid is selected based on the division results, including: Using the center of the range formed by the coordinate interval corresponding to the coordinate distribution area (i.e., (0.5, 0.5)) as the center, a circular area is divided with the first calibration radius to generate the first circular area; Retrieve the x-coordinate values ​​within the coordinate distribution area, and obtain the average heat exposure value x based on the x-coordinate values; Retrieve the ordinate values ​​within the coordinate distribution area, and obtain the average value of the maximum temperature gradient y based on the ordinate values; Within the coordinate distribution area, a target data point (x, y) is determined, and a circular region is divided with the target data point (x, y) as the center and the second calibration radius to generate a second circular region. Retrieve data points that are simultaneously distributed within the first and second circular regions; The grid region corresponding to the data points simultaneously distributed in the first circular region and the second circular region is taken as the target feature grid.

[0017] Further, temperature compensation is performed based on the temperature change characteristic parameters of the target feature grid obtained during the temperature control process of the UV curing equipment to obtain the compensated target temperature, and the UV curing equipment is temperature-regulated according to the compensated target temperature, including: Extract the normalized temperature change feature parameters corresponding to the target feature grid; wherein, the normalized temperature change feature parameters include the normalized maximum temperature change gradient and heat exposure. The temperature compensation adjustment coefficient corresponding to the irradiated area on the substrate surface is obtained based on the normalized temperature change characteristic parameters of the target feature mesh. The temperature compensation adjustment coefficient is obtained by the following formula: Where J represents the temperature compensation adjustment coefficient; m represents the number of target feature grids; s G This represents the gradient compensation intensity factor, with a value range of 0.1 to 0.3; k G This represents the gradient nonlinear gain, with a value range of 1.2 to 4.7; Г mis represents the normalized maximum temperature change gradient corresponding to the i-th target feature grid; Q This represents the heat exposure compensation intensity factor, with a value ranging from 0.2 to 0.5; k Q Y represents the heat exposure threshold steepness coefficient, with a value ranging from 7.2 to 12.3; mi Y represents the normalized maximum temperature change gradient corresponding to the i-th target feature grid; m This represents the critical offset for thermal exposure, used as the threshold offset to trigger compensation, with a value range of 0.05-0.1. Temperature compensation is performed based on the target temperature obtained during the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, and the compensated target temperature is obtained.

[0018] The compensated target temperature is obtained using the following formula: Among them, T comp Indicates the adjusted target temperature after compensation; T target Indicates the adjustment of the target temperature; ΔT mg The maximum permissible compensation amplitude is indicated by J (determined by the temperature resistance of the substrate material); J represents the temperature compensation adjustment coefficient; β represents the temperature approximation attenuation coefficient, with a value ranging from 0.5 to 4.8; T s Indicates the current actual temperature; The UV curing equipment is temperature-controlled according to the compensated target temperature.

[0019] Further, temperature control of the UV curing equipment according to the compensated target temperature includes: The first comprehensive feature parameter corresponding to each target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the target feature grid; The second comprehensive feature parameter of each non-target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the non-target feature grid; Determine whether each non-target feature grid has an adjacent target feature grid, and integrate the non-target feature grids that do not have a connected target feature network into a non-feature region; Determine whether each target feature grid has an adjacent non-target feature grid, and integrate the target feature grids that do not have an adjacent non-target feature network into a feature region; When there are no non-feature regions or feature regions, the maximum allowable gradient for temperature regulation is set by the first comprehensive feature parameter corresponding to each target feature grid and the second comprehensive feature parameter of each non-target feature grid. When no non-feature region and / or feature region exists, the maximum allowable gradient for temperature control is set by combining the area of ​​the feature region and the area of ​​the non-feature region with the comprehensive feature parameter corresponding to the non-feature region. Temperature control of the UV curing equipment is performed based on the maximum allowable gradient of temperature control as the temperature control constraint and the compensated target temperature as the final target temperature.

[0020] A temperature control system for a printing curing apparatus, the temperature control system comprising: The data upload module is used to upload the printing data information corresponding to the current printing task to the database; wherein, the first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV; the second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed; The region division module is used to divide the irradiated area of ​​the substrate surface of the UV curing equipment into multiple grid regions by using the first grid setting factor and the second grid setting factor. The target feature grid acquisition module is used to filter target grids based on real-time temperature change feature parameters of the grid area to obtain target feature grids. The target feature grids are determined by filtering the coordinate distribution area corresponding to the temperature parameters of the area in combination with a first calibration radius and a second calibration radius. The coordinate distribution area is generated by the maximum gradient of heat exposure and temperature change in each grid area. The temperature compensation module is used to obtain the temperature compensation adjustment coefficient corresponding to the irradiated area on the substrate surface based on the temperature change characteristic parameters of the target feature grid; and to perform temperature compensation based on the adjustment target temperature obtained during the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, so as to obtain the compensated adjustment target temperature.

[0021] Beneficial effects of this invention: This invention proposes a temperature control method and system for printing curing equipment. By dividing the substrate surface irradiation area into grid regions using a dual-grid setting factor, it transforms macroscopic temperature control into precise control of multiple grids. This captures localized temperature changes, solving the problem of uneven surface temperature that traditional coarse temperature control struggles to address, and improving temperature field uniformity. Target feature grids are selected based on real-time temperature change characteristic parameters, dynamically identifying areas with abnormal temperatures or critical impacts on curing quality. This allows temperature control to focus on key areas, prioritizing temperature accuracy in these regions, improving overall curing performance, and reducing defective products. The target temperature is compensated for based on the temperature change characteristic parameters of the target feature grids, enabling dynamic temperature control to adapt to actual grid temperature changes. This corrects deviations from simple preset or feedback adjustments, significantly improving temperature control accuracy and meeting the stringent temperature control requirements of high-precision printing, enhancing the equipment's adaptability to complex printing tasks. Precise temperature control reduces rework and scrap due to temperature issues, ensuring production continuity. Simultaneously, a stable and suitable temperature environment improves curing quality, such as enhancing ink adhesion and reducing substrate deformation. This optimizes printing production in terms of both efficiency and quality, enhancing the equipment's market competitiveness. Attached Figure Description

[0022] Figure 1 This is a flowchart of the method described in this invention; Figure 2 This is a system block diagram of the system described in this invention. Detailed Implementation

[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0024] This invention provides a method for temperature control adjustment of a printing curing equipment, such as... Figure 1 As shown, the temperature control method of the printing curing equipment includes: Upload the printing data information corresponding to the current printing task to the database; wherein, the printing data information corresponding to the printing task includes, but is not limited to, the material expansion coefficient, material thermal conductivity, minimum effective exposure time value under UV, material density, material specific heat capacity, maximum allowable temperature gradient for heating and substrate conveying speed. The substrate surface irradiation area of ​​the UV curing equipment is divided into multiple grid regions by using the first grid setting factor and the second grid setting factor. Target meshes are selected based on real-time temperature change characteristics of the grid region to obtain target feature meshes. Temperature compensation is performed on the target temperature obtained during the temperature control process of the UV curing equipment based on the temperature change characteristic parameters of the target feature grid. The compensated target temperature is then obtained, and the UV curing equipment is temperature regulated according to the compensated target temperature.

[0025] The working principle of the above technical solution is as follows: First, the printing data information of the current printing task (such as the material expansion coefficient, thermal conductivity, etc.) is uploaded to the database. Next, using the first and second grid setting factors, the irradiation area on the substrate surface of the UV curing equipment is divided into multiple grid regions. Then, based on the real-time temperature change characteristic parameters of each grid region, the target feature grid is selected. Finally, using the temperature change characteristic parameters of the target feature grid, the target temperature in the temperature control process is compensated to obtain the compensated target temperature, which is then used to regulate the temperature of the UV curing equipment.

[0026] The above technical solution achieves the following effects: It uploads comprehensive printing data, enabling temperature control to be based on material properties (coefficient of expansion, thermal conductivity, etc.) and process parameters (minimum effective exposure time, substrate transport speed, etc.). This allows temperature regulation to meet the needs of different printing tasks, avoiding curing quality issues caused by material and process differences and ensuring the stability of printed product quality. By dividing the substrate surface irradiation area into grid regions using a dual-grid setting factor, macro-level temperature control is transformed into precise control of multiple grids. This captures local temperature changes, solving the problem of uneven surface temperature that traditional coarse temperature control struggles to address, and improving temperature field uniformity. Target feature grids are selected based on real-time temperature change characteristic parameters, dynamically identifying areas with abnormal temperatures or critical impacts on curing quality. This allows temperature control to focus on key areas, prioritizing temperature accuracy in these areas, improving overall curing performance, and reducing defective products. Compensation adjustment of the target temperature based on the temperature change characteristic parameters of the target feature grids allows temperature control to dynamically adapt to actual grid temperature changes, correcting deviations from simple preset or feedback adjustments. This significantly improves temperature control accuracy, meeting the stringent temperature control requirements of high-precision printing and enhancing the equipment's adaptability to complex printing tasks. Precise temperature control reduces rework and scrap of printed materials due to temperature issues, ensuring production continuity. At the same time, a stable and suitable temperature environment improves curing quality, such as enhancing ink adhesion and reducing substrate deformation. This optimizes printing production in terms of both efficiency and quality, enhancing the equipment's market competitiveness.

[0027] In one embodiment of the present invention, a first grid setting factor and a second grid setting factor are used to divide the irradiated area of ​​the substrate surface of the UV curing device into grids to obtain multiple grid regions, including: The first grid setting factor is obtained using the material parameters of the substrate and the effective exposure time. The second grid setting factor is obtained by utilizing the material parameters of the substrate and the maximum allowable temperature gradient of the irradiated area on the substrate surface. The first grid setting factor and the second grid setting factor are used to obtain the grid size parameters, and the substrate surface irradiation area of ​​the UV curing equipment is divided into grids according to the grid size parameters to obtain multiple grid areas.

[0028] The grid size parameter is obtained using the following formula: Where L represents the mesh size parameter; k represents the process safety factor, with a value ranging from 0.8 to 1.5; G 01g and G 02g This represents the first and second grid setting factors after normalization; L0 represents the preset initial grid size parameters. The above method of obtaining grid size parameters enables localized, fine-grained control of energy input, avoiding warping or pattern misalignment caused by uneven temperature. Compared to traditional fixed grid division, this method can reduce thermal deformation error by 30%-50% (depending on material properties), significantly improving printing registration accuracy (e.g., reducing pattern splicing error in label printing from ±0.2mm to ±0.05mm). Simultaneously, in high-speed printing (e.g., 150m / min film printing), this method can reduce the curing defect rate from 8%-12% of traditional methods to below 2%, while reducing energy consumption by 15%-20%. Furthermore, through normalization, G... 01g and G 02g The formula transforms material properties and process parameters into grid energy distribution weights. It can adjust the grid size by combining the material's heat capacity and heat sensitivity. It can control the energy of a single grid to the maximum extent by clamping the grid size while ensuring sufficient energy within the grid, thus preventing scorching.

[0029] The working principle of the above technical solution is as follows: First, a first grid setting factor is calculated based on the material parameters of the substrate and the effective exposure time. Then, a second grid setting factor is obtained by combining the material parameters of the substrate and the maximum allowable temperature gradient of the substrate surface irradiation area. Next, these two factors are substituted into the formula, combined with a process safety factor, to calculate the grid size parameter. Finally, the substrate surface irradiation area of ​​the UV curing equipment is divided into grids according to this parameter, resulting in multiple grid regions.

[0030] The above technical solution achieves the following effects: By constructing first and second grid setting factors using material parameters, the grid division is fully correlated with the substrate's own characteristics (such as material parameters) and process requirements (effective exposure time, maximum allowable temperature gradient). This ensures that the divided grids can accurately adapt to different substrates and printing processes, avoiding temperature control deviations caused by grid mismatch with actual needs, thus laying the foundation for subsequent precise temperature control. Introducing a process safety factor k (valued between 0.8 and 1.5) allows for flexible adjustment based on actual production requirements for safety and precision. k can be appropriately reduced when pursuing precise temperature control, or increased to avoid risks, balancing process requirements and safety margins. This reduces the risk of temperature runaway and material damage caused by unreasonable grid division, improving the reliability of the production process. Based on dual-factor calculation of grid size parameters and grid division, the substrate surface irradiation area is subdivided into multiple grids, breaking down the macroscopic temperature control area into microscopic controllable units. This captures details of local temperature changes, solving the problem of uneven temperature control under traditional coarse division, improving the precision of temperature control, and enhancing curing uniformity. Different grids exhibit different temperature change characteristics due to differences in materials and process parameters in their corresponding areas. A well-defined grid provides the foundation for precise selection of target grids based on grid temperature characteristics and targeted temperature compensation adjustments. This allows temperature control strategies to focus on key grid areas, improving temperature control efficiency and effectiveness, and ensuring consistent print quality. Regardless of changes in substrate type (different material parameters) or process requirements (variations in effective exposure time and temperature gradient), the grid setting factors and size parameters can be recalculated to quickly adapt to new printing tasks. This enhances the adaptability of UV curing equipment to diverse production needs and expands the equipment's application range.

[0031] Meanwhile, from the perspective of the printing process, adapting to the dynamic nature of continuous production is a crucial technical element of continuous production. The substrate is continuously transported (speed v varies), and UV curing energy is continuously input (related to exposure time ΔT), allowing the material to cure while in motion. The mesh generation in this scheme is based on G, which is strongly correlated with transport speed and exposure time. 01 and G 02 This allows the grid size to be adjusted in real time according to the dynamic parameters of the printing process, improving the matching and synchronization between the grid division rhythm and the substrate delivery and energy input rhythm. For example, during high-speed printing (when v is large), the grid size is adjusted by formula to make the area of ​​energy action on the substrate surface match the delivery speed, avoiding energy misalignment and untimely curing due to grid lag.

[0032] Furthermore, during the printing process, differences in material properties (α, ρ, etc.) and process parameters (ΔT, |∣∇T∣max, etc.) exist between different batches and at different speeds. In this case, dynamically changing the grid size ensures consistency with the curing quality of each segment of the substrate, solving the problems of "quality differences between the beginning and end" and "quality fluctuations in variable speed segments" in continuous printing. Moreover, printing substrates (such as paper and plastic films) absorb energy during UV curing, resulting in thermal expansion (α-dominant) and thermal conduction (λ-dominant). If the energy distribution is uneven (i.e., the grid division is unreasonable), it can easily lead to concentrated thermal stress and localized deformation in the material, affecting the registration accuracy of subsequent printing (such as pattern misalignment). The grid division in this embodiment is based on G... 01 The associated thermal expansion and thermal conduction parameters allow the mesh size to be adapted to the material's thermal deformation characteristics. The mesh density is adjusted using formulas to precisely control local energy input and reduce differences in thermal deformation. Simultaneously, combined with G... 02 The associated temperature gradient constraint limits temperature fluctuations within the grid area, preventing substrate tearing and wrinkling due to excessive thermal stress, ensuring the physical stability of the printed material, and improving the appearance and internal quality of the printed product (such as ink layer adhesion). On the other hand, the energy output of the UV curing equipment is based on regions (grids correspond to energy output units). In this embodiment, the grid size and the material's energy requirements (i.e., via G...) 01 G 02 It accurately matches the energy absorption and thermal management requirements of materials, and the energy output and thermal response of different grid areas are coordinated to reduce energy waste and substrate damage caused by over-curing and quality defects caused by under-curing, thereby improving UV energy utilization efficiency and reducing printing production costs.

[0033] One embodiment of the present invention uses a first material parameter of the substrate and a minimum effective exposure time to obtain a first grid setting factor, including: Retrieve the first material parameter from the material parameters of the substrate in the database, wherein the first material parameter includes the material expansion coefficient and the material thermal conductivity; Retrieve the minimum effective UV exposure time value required for the printing process of the substrate surface irradiation area corresponding to the printing task; The first grid setting factor is obtained by combining the material's coefficient of thermal expansion and thermal conductivity with the minimum effective exposure time under UV light.

[0034] The first grid setting factor is obtained by the following formula: Among them, G 01 α represents the first grid setting factor; λ represents the material expansion coefficient; λ represents the material thermal conductivity; and ΔT represents the minimum effective exposure time under UV light required for the printing process of the irradiated area on the substrate surface.

[0035] The working principle of the above technical solution is as follows: First, the material expansion coefficient and thermal conductivity of the substrate material are retrieved from the database, and the minimum effective exposure time value of the irradiated area of ​​the substrate surface corresponding to the printing task under UV light is also retrieved. Then, the material expansion coefficient, thermal conductivity, and minimum effective exposure time value are substituted into a specific formula to calculate the first grid setting factor.

[0036] The above technical solution achieves the following results: by incorporating the physical properties of the substrate into the mesh generation considerations through the material's coefficient of thermal expansion and thermal conductivity. The coefficient of thermal expansion directly affects the degree of material deformation under temperature changes, while thermal conductivity determines the efficiency of heat transfer within the material. Combined with the minimum effective exposure time value, the first mesh setting factor simultaneously reflects the material's inherent characteristics and UV curing process requirements, ensuring that subsequent mesh generation is highly compatible with the actual printing task and avoiding curing defects caused by mismatches between material properties and processes. The first mesh setting factor, calculated based on material parameters and exposure time, provides crucial input for mesh size parameters. A reasonable mesh size can capture the details of temperature changes caused by differences in material properties in different regions without excessive subdivision increasing the computational burden. This allows the substrate surface irradiation area of ​​the UV curing equipment to be divided into scientifically and rationally defined mesh units, providing a foundation for refined temperature control. As the core parameter for mesh generation, the first mesh setting factor directly affects the accuracy of subsequent temperature control. By accurately reflecting the material's thermal response characteristics and process requirements, each mesh area can be more precisely adjusted during temperature control, reducing localized excessively high or low temperatures caused by unreasonable mesh generation and improving the overall stability of curing quality. The substrate characteristics and process requirements vary significantly across different printing tasks. This method retrieves parameters from a database and dynamically calculates the first grid setting factor, enabling UV curing equipment to quickly adapt to different material and process needs. It automatically adjusts the grid division strategy without frequent manual intervention, improving the equipment's versatility and flexibility, and expanding its applicability. By converting material and process parameters into a quantified first grid setting factor, the UV curing process becomes digital and intelligent. Based on this factor, the grid division method allows the equipment to automatically optimize temperature control strategies according to specific task characteristics, reducing reliance on operator experience, minimizing human error, and improving production efficiency and product consistency.

[0037] In one embodiment of the present invention, a second mesh setting factor is obtained using a second material parameter of the substrate and the maximum allowable temperature gradient of the irradiated area on the substrate surface, including: Retrieve the second material parameters contained in the material parameters of the substrate from the database; the second material parameters include material density and specific heat capacity. The maximum allowable temperature gradient for the irradiated area on the substrate surface is determined. Retrieve the substrate conveying speed specified for the current printing task from the database; The second grid setting factor is set by combining the material density and specific heat capacity with the maximum allowable temperature gradient and the substrate transport speed.

[0038] The second grid setting factor is obtained by the following formula: Among them, G 02 This represents the second grid setting factor; ρ represents the material density; c represents the material specific heat capacity. T max This indicates the maximum permissible temperature gradient for the irradiated area on the substrate surface; v This indicates the substrate conveying speed specified for the current printing task.

[0039] The working principle of the above technical solution is as follows: First, the material density and specific heat capacity of the substrate material, as well as the maximum allowable temperature gradient for the irradiated area of ​​the substrate surface and the substrate conveying speed specified in the current printing task, are retrieved from the database. Then, these parameters are substituted into a specific formula, and the second grid setting factor is calculated by multiplying the material density, specific heat capacity, and maximum allowable temperature gradient, and then dividing by the substrate conveying speed.

[0040] The effects of the above technical solution are as follows: It accurately reflects the substrate's ability to store and transfer heat through material density and specific heat capacity. Materials with high density and high specific heat capacity heat up slowly, requiring more precise temperature control. This factor quantifies these characteristics, allowing the mesh division to adapt to the differences in thermal response of different materials, avoiding localized overheating or undercooling caused by material thermal properties. The maximum allowable temperature gradient is directly related to the safety and quality of the printing process. Excessively high temperature gradients may lead to problems such as substrate deformation and uneven ink curing. The second mesh setting factor incorporates this parameter into the calculation, ensuring that the mesh division meets the process's limitations on the rate of temperature change, guaranteeing a safe and stable printing process, and reducing the scrap rate. The substrate transport speed affects the UV irradiation time and heat accumulation process. At high speeds, the substrate spends less time in the irradiated area, requiring higher instantaneous power; conversely, at low speeds, the opposite is true. This factor, through the transport speed parameter, matches the mesh division with the dynamic characteristics of the substrate, optimizes temperature distribution, and improves the uniformity of the curing effect. Combining thermophysical parameters, temperature gradient limitations, and transport speed, the second mesh setting factor provides a scientific basis for mesh size. A well-defined grid is neither too coarse, leading to inaccurate temperature control, nor too fine, increasing the system's computational burden, thus balancing control precision and system efficiency. Different printing tasks exhibit significant differences in substrate characteristics, process requirements, and conveyor speeds. By retrieving parameters from a database and dynamically calculating a second grid setting factor, the UV curing equipment can automatically adapt to diverse production needs without manual adjustments, enhancing its compatibility with different tasks and reducing operational complexity. Transforming material parameters, process limitations, and equipment operating parameters into quantified grid setting factors achieves the digitalization and intelligentization of the UV curing process. Based on this factor-driven grid division method, the equipment can automatically optimize temperature control strategies according to specific task characteristics, reducing reliance on operator experience and improving production efficiency and product quality stability.

[0041] One embodiment of the present invention involves selecting target meshes based on real-time temperature change characteristic parameters of a mesh region to obtain target feature meshes, including: Retrieve the temperature change characteristic parameters for each grid region, wherein the temperature change characteristic parameters include the maximum temperature change gradient and the heat exposure corresponding to the grid region; The maximum temperature change gradient for each grid region is normalized to obtain the normalized maximum temperature change gradient. The heat exposure of each grid region is normalized to obtain the normalized heat exposure. Using the normalized heat exposure in each grid region as the abscissa and the maximum normalized temperature change gradient corresponding to each grid region as the ordinate, the coordinate distribution area corresponding to the temperature parameters of the generated region is produced. The first calibration radius is obtained by utilizing the local peak temperature that appears in each grid region; The second calibration radius is obtained by utilizing the standard deviation of temperature fluctuations within each grid region; The coordinate distribution area is divided using the first calibration radius and the second calibration radius, and the target feature grid is selected based on the division results.

[0042] The working principle of the above technical solution is as follows: First, the maximum temperature gradient and heat exposure of each grid region are obtained as temperature change characteristic parameters. Next, the maximum temperature gradient and heat exposure are normalized to eliminate the influence of dimensions. Then, the coordinate distribution region of the temperature parameters for each grid region is generated using the normalized heat exposure as the abscissa and the normalized maximum temperature gradient as the ordinate. Next, the first calibration radius is calculated based on the local peak temperature within the grid region, and the second calibration radius is calculated based on the standard deviation of temperature fluctuation. Finally, the coordinate distribution region is divided using the two calibration radii, and target feature grids with significant temperature change characteristics are selected based on the division results.

[0043] The above technical solution achieves the following results: by comprehensively considering two core parameters—the maximum temperature gradient and heat exposure—it can fully capture the intensity of temperature changes and heat accumulation within the grid area. After normalization, a coordinate distribution area is generated. This area is then divided using a calibration radius calculated based on local peak temperatures and the standard deviation of temperature fluctuations. This allows for precise identification of target feature grids with abnormal temperatures and significant impacts on curing quality, avoiding localized overheating or insufficient curing caused by coarse temperature control. The selected target feature grids represent key areas of temperature change on the substrate surface. Overall temperature adjustment based on the temperature characteristics of these key areas avoids the large temperature adjustment errors caused by indiscriminate adjustment across all grid areas, thereby improving the efficiency and accuracy of temperature compensation and control, and enhancing the stability of printing curing quality. Calculating the calibration radius using local peak temperatures and the standard deviation of temperature fluctuations transforms the peak values ​​and fluctuations of temperature changes within the grid area into quantitative indicators, improving the reliability of temperature control. In actual printing processes, the temperature field distribution on the substrate surface is complex and variable. This method uses multi-dimensional parameters (temperature change gradient, heat exposure, peak temperature, temperature fluctuation) to comprehensively analyze complex temperature changes under different printing tasks, materials and processes, accurately select key grid areas, and ensure that the temperature control system can effectively function under various operating conditions.

[0044] Meanwhile, by accurately acquiring the two core temperature change characteristic parameters—the maximum temperature gradient and heat exposure—for each grid region, normalizing them, and constructing a coordinate distribution, and combining this with the first and second calibration radii to screen target grids, printing quality can be deeply guaranteed from two aspects: thermal characteristic quantification and anomaly identification, and the coordinated constraint of local peaks and fluctuations. Regarding thermal characteristic quantification and anomaly identification, the grid thermal state, which was originally difficult to perceive precisely, is presented in a dual-parameter form. This allows problems such as over-curing leading to ink embrittlement and uneven curing affecting adhesion during ink curing to be captured and identified in advance at the grid dimension, replacing the traditional extensive curing method of whole-surface curing. This strengthens the foundation of printing quality from a microscopic level and significantly reduces various printing defects caused by uncontrolled thermal states. Regarding the coordinated constraint of local peaks and fluctuations, the dual calibration radii are used to accurately locate and intervene in local extreme thermal risks and unstable energy distribution caused by minor equipment anomalies (such as UV lamp aging and dust accumulation on reflectors) during continuous printing production. This prevents the scrapping of entire batches of printing materials due to local problems, providing reliable quality assurance for high-value, high-precision printing scenarios. In terms of dynamically adapting to continuous production rhythms, this embodiment maps real-time parameters to production status stages. The coordinate distribution area transforms abstract thermal characteristic parameters into an intuitive distribution, which is highly compatible with the real-time nature of continuous printing production. When production status changes, such as printing speed switching, the grid thermal characteristics change synchronously. The system can quickly locate grids with energy supply and demand imbalances based on the coordinate distribution. Compared to the lengthy response of traditional manual troubleshooting, this greatly shortens the process adjustment time, allowing the production line to adapt more nimbly to complex "high-speed + variable-speed" production scenarios and improve overall operational efficiency. Regarding the precise implementation of compensation strategies, temperature compensation based on the target grid can directly affect the zoned energy control of UV curing equipment. In scenarios such as multi-color printing and overlay curing, it specifically compensates for energy demand differences caused by variations in ink layer thickness. This abandons the traditional crude method of global power supply, enabling a more precise match between energy supply and printing needs, achieving a dual improvement in printing process efficiency and quality. Meanwhile, from the perspective of early warning of equipment anomalies, target grid screening breaks through the traditional post-maintenance model. By monitoring the trend of changes in grid thermal parameters, it can keenly capture the thermal characteristic signals of potential equipment failures such as local aging of UV lamps, contamination of reflectors, and blockage of water cooling systems, enabling preventive maintenance and significantly reducing the interference of unplanned equipment downtime on the continuous operation of the printing production line, thereby reducing equipment maintenance costs and failure losses. In multi-physics field collaborative control, printing production involves the coupling of multiple physical fields such as mechanical motion, energy solidification, and material phase change. Target grid screening uses thermal characteristics as the core control node, linking equipment parameters such as transmission speed, UV power, and cooling system to collaboratively optimize multiple physical fields. In scenarios prone to bleed-through and deformation, such as thin paper printing, it effectively controls the amount of substrate deformation, thereby effectively improving printing quality.

[0045] One embodiment of the present invention utilizes the local peak temperature occurring within each grid region to obtain a first calibration radius, including: Retrieve the local peak temperature that appears in each grid region; The local peak temperature appearing in each grid region is normalized to obtain the normalized local peak temperature. The first calibration radius is obtained based on the normalized local peak temperature corresponding to each grid region.

[0046] The first calibration radius is obtained by the following formula: Among them, R 01 Y represents the first calibration radius; n represents the total number of grid regions; i Y represents the heat exposure corresponding to the i-th grid region; c This indicates the preset reference value for heat exposure; T i T represents the normalized local peak temperature corresponding to the i-th grid region; max and T min This represents the maximum and minimum local peak temperatures after normalization for n grid regions. The above technical solution uses the heat exposure Y... i Heat exposure reference value Y c Local peak temperature Ti and extreme temperature T max and T min This coupling deeply correlates the "energy accumulation" and "temperature peak" of the grid. Compared to the traditional "single temperature threshold" judgment, this formula can accurately characterize the nonlinear relationship between "energy input and temperature response," avoiding ink scorching and substrate deformation caused by thermal runaway. Simultaneously, in precision printing, "thermal stress concentration areas" can be pre-identified, reducing pattern misalignment errors caused by thermal deformation from ±0.1mm to ±0.02mm, ensuring the precision requirements of high-end printing.

[0047] The working principle of the above technical solution is as follows: First, the local peak temperature appearing in each grid area is retrieved and normalized to eliminate the influence of dimensions, resulting in the normalized local peak temperature. Next, the heat exposure of each grid area, the preset heat exposure reference value, the normalized local peak temperature, and the maximum and minimum values ​​of the normalized local peak temperatures of all grid areas are substituted into a specific formula to calculate the first calibration radius.

[0048] The above technical solution achieves the following results: By normalizing the local peak temperature and calculating the first calibration radius in conjunction with parameters such as heat exposure, the extreme temperature variations within the grid area are transformed into a quantitative indicator. This accurately measures the degree to which the temperature peak of each grid area deviates from the overall temperature level, providing a precise basis for subsequent screening of key temperature variation areas and avoiding the omission of grids with temperature anomalies. The formula incorporates a comparison between heat exposure and a preset reference value, as well as the maximum and minimum values ​​of local peak temperatures in different grid areas, ensuring that the calculation of the first calibration radius comprehensively considers both temperature peaks and heat accumulation. This ensures that the calibration radius not only reflects the temperature peak but also embodies the temperature anomaly characteristics of the grid area under heat exposure conditions, providing a more comprehensive assessment of the temperature characteristics of the grid area. As a key parameter for dividing the coordinate distribution area, the accuracy of the first calibration radius directly affects the screening of target feature grids. Based on the radius calculated using multiple parameters, the boundaries of grid areas with different temperature characteristics can be reasonably defined, distinguishing grid areas with significant temperature changes and a large impact on curing quality from other areas, thus improving the targeting of temperature control. Different printing tasks and material characteristics can lead to significant differences in the temperature field of the substrate surface. This method dynamically calculates the first calibration radius, enabling the system to automatically adjust the evaluation criteria for the temperature characteristics of the grid region based on actual printing temperature variations. Regardless of the complexity of the temperature field, it accurately identifies key grids, enhancing the temperature control system's adaptability to diverse operating conditions. The grid region selected using the first calibration radius clearly defines the key areas for temperature regulation. Temperature control resources can be concentrated on these areas, avoiding the need for homogenization of all grids and reducing unnecessary energy consumption and adjustment operations. This improves resource utilization efficiency and reduces equipment operating costs while ensuring printing and curing quality.

[0049] One embodiment of the present invention uses the standard deviation of temperature fluctuation within each grid region to obtain a second calibration radius, including: Calculate the standard deviation of temperature fluctuation for each grid region; The standard deviation of temperature fluctuation in each grid region is normalized to obtain the normalized standard deviation of temperature fluctuation. The second calibration radius is obtained based on the normalized standard deviation of temperature fluctuation corresponding to each grid region.

[0050] The second calibration radius is obtained by the following formula: Among them, R 02 Indicates the second calibration radius; n represents the total number of grid regions; Г i This represents the maximum temperature gradient corresponding to the i-th grid region; Г c This represents the preset gradient reference value; σ iThis represents the normalized standard deviation of temperature fluctuation corresponding to the i-th grid region. The above technical solution utilizes the maximum gradient Γ of temperature change. i (Reflecting thermal shock intensity) and standard deviation of temperature fluctuation σ i The coupling (reflecting the stability of thermal distribution) integrates the "transient thermal shock" and "steady-state thermal noise" of the mesh into a second calibration radius. Compared with the traditional "single standard deviation" judgment, this formula can distinguish between "high-intensity but stable thermal input" (such as thick ink layers requiring high gradient but low fluctuation) and "low-intensity but disordered thermal fluctuation" (such as abnormal noise caused by equipment failure), improving the accuracy of thermal stability control by 40%-60% and avoiding ink layer cracking and decreased adhesion caused by thermal runaway.

[0051] The working principle of the above technical solution is as follows: First, the standard deviation of temperature fluctuation for each grid region is retrieved to measure the degree of temperature fluctuation in that region over time. Then, the standard deviation of temperature fluctuation for each grid region is normalized to eliminate the influence of dimensions, resulting in a normalized standard deviation of temperature fluctuation. Finally, the total number of grid regions, the maximum temperature gradient for each grid region, the preset gradient reference value, and the normalized standard deviation of temperature fluctuation are substituted into a specific formula to calculate the second calibration radius.

[0052] The above technical solution achieves the following results: by quantifying the dynamic changes in temperature within the grid area through the standard deviation of temperature fluctuations, and combining this with the normalized processing and formula-calculated second calibration radius, the stability of temperature in each grid area can be accurately reflected. A larger standard deviation indicates more severe temperature fluctuations, and the second calibration radius is adjusted accordingly, effectively identifying grid areas with unstable temperatures that easily affect curing results. The formula incorporates the maximum gradient of temperature changes and a preset gradient reference value, ensuring that the calculation of the second calibration radius is not only based on temperature fluctuations themselves but also related to the severity of temperature changes within the area. This multi-parameter fusion calculation method avoids the one-sidedness of single-parameter evaluation and enables a more comprehensive and objective assessment of the temperature characteristics of the grid area. The accuracy of the second calibration radius, as a crucial basis for dividing the coordinate distribution area, directly affects the selection results of the target feature grid. The radius calculated based on the standard deviation of temperature fluctuations can accurately divide grid areas with abnormal temperature fluctuations, working synergistically with the first calibration radius to improve the accuracy of selecting key temperature control areas, providing a foundation for subsequent precise temperature control. In actual printing processes, the surface temperature of the substrate is affected by various factors, resulting in complex and variable operating conditions. This method calculates the standard deviation of temperature fluctuations in each grid region in real time and dynamically generates a second calibration radius. It can quickly adapt to temperature fluctuations under different printing tasks, materials, and process conditions, ensuring accurate identification of grid regions requiring key control even under complex operating conditions. After identifying the abnormal temperature fluctuation grid regions selected based on the second calibration radius, temperature control resources can be allocated selectively for focused monitoring and adjustment of these regions. This avoids evenly distributing resources across all grids, reducing resource waste and improving equipment energy consumption while ensuring printing and curing quality, thus enhancing the operational efficiency and economy of the temperature control system.

[0053] In one embodiment of the present invention, the coordinate distribution area is divided using the first calibration radius and the second calibration radius, and the target feature grid is selected based on the division result, including: Using the center of the range formed by the coordinate interval corresponding to the coordinate distribution area (i.e., (0.5, 0.5)) as the center, a circular area is divided with the first calibration radius to generate the first circular area; Retrieve the x-coordinate values ​​within the coordinate distribution area, and obtain the average heat exposure value x based on the x-coordinate values; Retrieve the ordinate values ​​within the coordinate distribution area, and obtain the average value of the maximum temperature gradient y based on the ordinate values; Within the coordinate distribution area, a target data point (x, y) is determined, and a circular region is divided with the target data point (x, y) as the center and the second calibration radius to generate a second circular region. Retrieve data points that are simultaneously distributed within the first and second circular regions; The grid region corresponding to the data points simultaneously distributed in the first circular region and the second circular region is taken as the target feature grid.

[0054] The working principle of the above technical solution is as follows: Using the center of the coordinate distribution area (0.5, 0.5) as the center, a circular region is drawn using a first calibration radius (reflecting the correlation between local peak temperature and heat exposure) to delineate grid data points with high temperature peaks and abnormal heat exposure. The average heat exposure (x) and the average maximum temperature gradient (y) of all grids within the coordinate distribution area are calculated to determine the target data point (x, y). Then, a circular region is drawn using a second calibration radius (reflecting the correlation between temperature fluctuation standard deviation and gradient characteristics) to delineate grid data points with drastic temperature fluctuations and abnormal gradients. Data points located simultaneously within both the first and second circular regions are extracted. Their corresponding grid regions, satisfying both the dual characteristics of "high temperature peak and abnormal heat exposure" and "drastic temperature fluctuation and abnormal gradient," are identified as target feature grids that significantly affect curing quality.

[0055] The above technical solution achieves the following results: By superimposing and filtering the first circular region (peak temperature + heat exposure) and the second circular region (temperature fluctuation + gradient change), it ensures that the target feature mesh simultaneously possesses the dual key attributes of "prominent temperature extremes" and "intense dynamic fluctuations," avoiding misjudgment based on a single dimension and accurately identifying the region with the greatest impact on the curing process. Using the coordinate center and mean data point as the center, combined with a calibration radius calculated based on statistical characteristics, the region is divided, avoiding interference from human experience and ensuring that the screening criteria are entirely based on data quantification results, thus improving the objectivity and repeatability of target mesh identification. Regardless of whether the substrate surface temperature field is uniformly distributed or locally abnormal, the division boundary can be adaptively adjusted through dynamically calculated radius and mean point. For example, when the heat exposure of a certain region is significantly higher than the mean and the temperature peak is prominent, the first circular region can accurately cover it; if the standard deviation of temperature fluctuation in a certain region is large and the gradient exceeds the reference value, the second circular region can effectively capture it, ensuring that no key regions are missed under complex working conditions. By eliminating meshes with gentle temperature characteristics through dual screening, temperature compensation is only performed on target feature meshes that simultaneously meet both conditions, avoiding energy waste caused by uniform control of the entire region. For example, in areas with complex printing patterns and mixed materials, energy can be concentrated to regulate local high-temperature fluctuations, improving resource utilization efficiency. Precise identification of the target feature grid allows temperature compensation to directly target areas prone to curing defects (such as ink accumulation areas and material interfaces), effectively suppressing problems like incomplete curing and substrate deformation caused by uneven temperature, ensuring uniform surface quality of printed materials, and reducing defect rates.

[0056] In one embodiment of the present invention, temperature compensation is performed based on the temperature change characteristic parameters of the target feature grid obtained during the temperature control process of the UV curing equipment, a compensated target temperature is obtained, and the UV curing equipment is temperature regulated according to the compensated target temperature, including: Extract the normalized temperature change feature parameters corresponding to the target feature grid; wherein, the normalized temperature change feature parameters include the normalized maximum temperature change gradient and heat exposure. The temperature compensation adjustment coefficient corresponding to the irradiated area on the substrate surface is obtained based on the normalized temperature change characteristic parameters of the target feature mesh. The temperature compensation adjustment coefficient is obtained by the following formula: Where J represents the temperature compensation adjustment coefficient; m represents the number of target feature grids; s G This represents the gradient compensation intensity factor, with a value range of 0.1 to 0.3; k G This represents the gradient nonlinear gain, with a value range of 1.2 to 4.7; Г mi s represents the normalized maximum temperature change gradient corresponding to the i-th target feature grid; Q This represents the heat exposure compensation intensity factor, with a value ranging from 0.2 to 0.5; k Q Y represents the heat exposure threshold steepness coefficient, with a value ranging from 7.2 to 12.3; mi Y represents the normalized maximum temperature change gradient corresponding to the i-th target feature grid; m This represents the critical offset for thermal exposure, used as the threshold offset to trigger compensation, with a value range of 0.05-0.1. Temperature compensation is performed based on the target temperature obtained during the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, and the compensated target temperature is obtained.

[0057] The compensated target temperature is obtained using the following formula: Among them, T comp Indicates the adjusted target temperature after compensation; T target Indicates the adjustment of the target temperature; ΔT mg The maximum permissible compensation amplitude is indicated by J (determined by the temperature resistance of the substrate material); J represents the temperature compensation adjustment coefficient; β represents the temperature approximation attenuation coefficient, with a value ranging from 0.5 to 4.8; T s Indicates the current actual temperature; The UV curing equipment is temperature-controlled according to the compensated target temperature.

[0058] The working principle of the above technical solution is as follows: Normalized maximum temperature gradient (reflecting the severity of temperature change) and heat exposure (reflecting the level of heat accumulation) are extracted from the target feature grid, eliminating dimensional differences for comprehensive calculation. The gradient compensation intensity factor (s) is then fused using a formula. G ), gradient nonlinear gain (k G ), heat exposure compensation intensity factor (s Q ), heat exposure threshold steepness coefficient (k) Q Parameters such as temperature gradient and heat exposure are nonlinearly weighted to generate a temperature compensation adjustment coefficient (J), where the critical offset of heat exposure (Y) is also considered. m This is used to trigger the compensation logic. The adjustment coefficient (J) is compared with the target temperature (T). target ), Maximum permissible compensation amplitude (ΔT) mg ), temperature approximation attenuation coefficient (β) and current actual temperature (T) s Substitute the values ​​into the formula, dynamically adjust the target temperature, and output the compensated adjusted target temperature (T). comp ).

[0059] The above technical solution achieves the following effect: by separating the influence of temperature gradient and heat exposure, and combining nonlinear gain and steepness coefficient, the compensation coefficient can be differentiated for different scenarios such as "high gradient low temperature rise" or "low gradient high cumulative heat". For example, for areas with steep temperature gradients but low heat exposure, the compensation coefficient can be adjusted differently based on k... G Enhance gradient compensation weights; for areas where heat exposure exceeds a threshold, use k... Q Trigger steep rise compensation to avoid compensation deviations caused by a single parameter. Thermal exposure critical offset (Y) m The compensation trigger threshold is set to 0.05-0.1, meaning compensation is only initiated when the heat exposure deviates from the normal level by more than 0.05-0.1, thus avoiding over-adjustment within the normal fluctuation range and balancing response sensitivity with system stability. The maximum allowable compensation amplitude (ΔT) is... mg Based on the substrate's temperature resistance, this design prevents excessive temperature adjustments during compensation from damaging the substrate, thus improving process safety. The temperature approximation attenuation coefficient (β) dynamically adjusts the compensation level according to the deviation between the current temperature and the target temperature. When the actual temperature approaches the target temperature, the adjustment range is automatically reduced to avoid temperature overshoot or oscillation. In the later stages of compensation, increasing β smooths the adjustment curve, improving temperature control accuracy. This is achieved through parameter value ranges (e.g., s...). G =0.1−0.3、k Q With a flexible configuration of 7.2-12.3, it can adapt to the temperature control requirements of different materials (such as flexible films and rigid sheets) and processes (such as high-speed printing and thick-layer ink curing). This reduces the temperature of high thermal conductivity substrates. G To reduce gradient compensation, increase s for slow printing scenarios.Q This method enhances heat exposure compensation and improves the equipment's adaptability to diverse production tasks. Targeted compensation of the desired feature grid directly addresses areas prone to curing defects, such as high temperature differences and high cumulative heat, effectively suppressing issues like ink scorching and substrate shrinkage. Actual test data shows that this compensation method reduces the curing uniformity error of printed materials by 30%-50%, significantly decreasing the scrap rate.

[0060] Meanwhile, the aforementioned technical solution achieves temperature control of printing equipment through thermal control granularity. Traditional overall control methods have significant shortcomings in this area. Based on average temperature feedback, they employ a coarse approach, such as adjusting the UV lamp power by ±5% across the entire surface. This fails to address the differentiated needs of different areas during printing. For example, areas with thick ink require more energy, while thin substrate areas need to avoid thermal shock. This easily leads to localized over-curing, causing ink embrittlement, or under-curing, resulting in poor adhesion. This technical solution, however, utilizes a target grid screening to achieve point-to-point matching of energy distribution with material requirements. Taking multi-color overprinting as an example, this precise control can significantly reduce curing energy deviation from the traditional ±8% to ±2%, and improve ink adhesion by 30%-50%. It fundamentally solves the localized curing quality problem caused by excessively coarse granularity in traditional overall control, allowing UV curing energy supply in different areas to better meet actual needs, thus laying a solid microscopic foundation for printing quality.

[0061] On the other hand, traditional overall control is relatively passive in terms of process adaptability when dealing with material differences and changes in production rhythm. When changing materials, such as switching from paper to plastic film, the temperature profile needs to be manually recalibrated, which takes 10-15 minutes and is difficult to balance the conflicting energy and peak temperature requirements of different materials. When the production rhythm changes, such as increasing the printing speed from 80m / min to 120m / min, the lag in overall control can cause temperature fluctuations of ±3℃-±5℃ in a short period of time, resulting in fluctuations in curing quality. This technical solution, however, demonstrates strong dynamic adaptability, with the thermal characteristic parameters of the target mesh (Γ) being more flexible. mi Y mi This technology can automatically reflect material differences, and formula J dynamically adjusts the compensation coefficient based on these differences. It adapts to new materials without manual intervention, reducing material changeover and debugging time from 10-15 minutes to 2-3 minutes, thus adapting to flexible production of "small batch, multi-variety" printing. Simultaneously, the temperature compensation of the target grid is strongly correlated with the production rhythm; changes in speed will affect the grid's heat exposure time and Y... mi Changes, and thus adjustments to the compensation coefficient J, formula T compBy rapidly responding to temperature deviations through the exp function, temperature fluctuations in "high-speed + variable-speed" production are reduced from ±3℃-±5℃ to ±0.5℃-±1℃, and the curing defect rate is reduced from 8%-12% to 1%-2%, enabling UV curing equipment to cope with complex and ever-changing production scenarios more flexibly and stably.

[0062] Regarding the resolution of quality issues, traditional overall control is reactive. When quality problems such as ink peeling or pattern distortion occur in printed products, manual inspection and adjustment of the overall temperature are required, taking 1-2 hours and failing to trace the root cause of the problem. This technical solution achieves a shift from "prevention + precise tracing." Through target grid screening, risk grids with "abnormally high heat exposure and abnormally large temperature gradients," such as the UV lamp focus area, can be identified in advance. Formula J automatically adapts the overall temperature compensation control to the temperature control of the risk grid in real time during the overall temperature control compensation process, based on the temperature characteristic parameters of the target grid. This intercepts risks before defects occur, reducing the scrap rate caused by thermal runaway from 5%-8% to 0.5%-1%, which is particularly suitable for high-value printing scenarios. Moreover, the thermal characteristic parameters (Γ) of the target grid... mi Y mi The system, along with the compensation coefficient J, forms a "digital trajectory," allowing for precise reverse tracing of the causes of quality fluctuations. For example, if a batch of printed materials has poor adhesion, the system analyzes Y... mi To determine if there is insufficient UV energy, analyze the distribution. mi Fluctuations can be used to determine if the substrate has excessive thermal stress, reducing the root cause analysis time for quality anomalies from 1-2 hours to 10-15 minutes, improving process optimization efficiency by 80%-90%, and establishing a complete quality protection closed loop to improve printing quality control from both prevention and traceability perspectives.

[0063] In one embodiment of the present invention, temperature control of a UV curing device is performed according to the compensated target temperature, including: The first comprehensive feature parameter corresponding to each target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the target feature grid; The second comprehensive feature parameter of each non-target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the non-target feature grid; Determine whether each non-target feature grid has an adjacent target feature grid, and integrate the non-target feature grids that do not have a connected target feature network into a non-feature region; Determine whether each target feature grid has an adjacent non-target feature grid, and integrate the target feature grids that do not have an adjacent non-target feature network into a feature region; When there are no non-feature regions or feature regions, the maximum allowable gradient for temperature regulation is set by the first comprehensive feature parameter corresponding to each target feature grid and the second comprehensive feature parameter of each non-target feature grid. The maximum allowable gradient for temperature control is obtained using the following formula: Where, ΔF max Indicates the maximum permissible gradient for temperature control; Г p ξ represents the average of the maximum gradients of temperature changes corresponding to all target feature grids; 01 ξ represents the comprehensive feature parameter factor corresponding to the target feature grid; 02 The comprehensive feature parameter factor corresponding to the non-target feature grid is represented by the following formula: Where n represents the total number of grid regions; m represents the number of target feature grids; Z 01i Z represents the first comprehensive feature parameter corresponding to the i-th target feature grid; 02pi Z represents the average value of the second comprehensive feature parameter corresponding to all non-target feature grids adjacent to the i-th target feature grid; 02i Z represents the second comprehensive feature parameter corresponding to the i-th non-target feature grid; 01pi This represents the average value of the first comprehensive feature parameters corresponding to all target feature grids adjacent to the i-th non-target feature grid; When no non-feature region and / or feature region exists, the maximum allowable gradient for temperature control is set by combining the area of ​​the feature region and the area of ​​the non-feature region with the comprehensive feature parameter corresponding to the non-feature region. The maximum allowable gradient for temperature control is obtained using the following formula: Where, ΔF max Indicates the maximum permissible gradient for temperature control; Г p A represents the average maximum gradient of temperature change corresponding to all target feature grids; a and b represent the number of feature regions and non-feature regions, respectively; A mi A represents the area of ​​the region corresponding to the i-th feature region; fi Z represents the area of ​​the i-th non-feature region; mpi Z represents the average value of the first comprehensive feature parameter corresponding to the i-th feature region; fpi This represents the average value of the second comprehensive feature parameter corresponding to the i-th non-feature region; Temperature control of the UV curing equipment is performed based on the maximum allowable gradient of temperature control as the temperature control constraint and the compensated target temperature as the final target temperature.

[0064] The working principle of the above technical solution is as follows: First, the first comprehensive feature parameter corresponding to each target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the target feature grid; and second comprehensive feature parameter is obtained by using the normalized temperature change feature parameters corresponding to the non-target feature grid. In this embodiment, the first comprehensive feature parameter and the second comprehensive feature parameter are obtained in the following ways: Retrieve the normalized temperature change feature parameters corresponding to the target feature grid, and use them as the first temperature change feature parameters; The weight values ​​corresponding to the normalized maximum gradient of temperature change and the amount of heat exposure contained in the first temperature change feature parameters are retrieved. The first comprehensive feature parameter of each target feature grid is obtained by weighted averaging the normalized maximum gradient of temperature change and the amount of heat exposure with their respective weight values. The normalized temperature change feature parameters corresponding to the non-target feature grid are retrieved and used as the second temperature change feature parameters. The normalized maximum gradient of temperature change and the weight value corresponding to the heat exposure amount are retrieved from the second temperature change feature parameters. The normalized maximum gradient of temperature change and the heat exposure amount are combined with their respective weight values ​​and weighted averaged to obtain the second comprehensive feature parameter of each non-target feature grid.

[0065] Determine whether there are adjacent target feature grids for non-target feature grids, and integrate non-target feature grids that do not have adjacent target feature grids into non-feature regions; determine whether there are adjacent non-target feature grids for target feature grids, and integrate target feature grids that do not have adjacent non-target feature grids into feature regions.

[0066] When no non-feature region or feature region exists, the first comprehensive feature parameter of the target feature grid and the second comprehensive feature parameter of the non-target feature grid are used, combined with the corresponding formula (using the comprehensive feature parameter factor of the target and non-target feature grids, and the average value of the maximum gradient of the temperature change of the target feature grid, etc.) to calculate the maximum allowable gradient of temperature regulation (ΔFmax).

[0067] When non-feature regions and / or feature regions exist, retrieve the area of ​​the feature regions and non-feature regions, as well as their corresponding comprehensive feature parameters. Calculate the maximum allowable gradient for temperature control (ΔFmax) based on the corresponding formula (combining the number of feature and non-feature regions, the area of ​​the regions, the average value of the comprehensive feature parameters, the average value of the maximum gradient of the target feature grid temperature change, etc.).

[0068] Then, the temperature of the printing equipment is controlled, with the maximum allowable temperature gradient as a constraint and the compensated target temperature as the final target temperature, and the temperature of the UV curing equipment is controlled.

[0069] The above technical solution achieves the following results: By using a weighted average method, the maximum temperature gradient and heat exposure (combined with their respective weights) are integrated to calculate the first and second comprehensive characteristic parameters. This comprehensively and selectively reflects the temperature change characteristics of target and non-target feature grids, providing accurate and detailed characteristic basis for subsequent temperature control, making the control of temperature characteristics of different grids more aligned with actual needs. Through the judgment and integration of non-feature and feature regions, the calculation method for the maximum allowable gradient of temperature control is flexibly switched based on different region existence states (the presence or absence of non-feature and feature regions). This dynamic adaptation mechanism can fully address the complex and varied adjacency relationships and distribution of grid regions, ensuring that temperature control constraints can be reasonably set in various scenarios, improving the adaptability and scientific nature of the temperature control scheme. Based on the maximum allowable gradient of temperature control calculated from the comprehensive characteristic parameters and region states, a reasonable boundary is defined for the temperature control of UV curing equipment from both the feature level and the region distribution level. This constraint effectively avoids curing quality problems (such as uneven curing, over-curing, or under-curing) caused by unreasonable gradients during temperature control, ensuring the stability and consistency of the UV curing process, thereby improving product curing quality and production reliability.

[0070] Meanwhile, traditional printing equipment often uses fixed values ​​for temperature control gradients or sets constraints based solely on a single feature (such as the average temperature), which cannot adapt to the heterogeneity of temperature changes in different areas within the equipment (such as the feature grids and non-feature grids in the UV curing zone). This embodiment uses first / second comprehensive feature parameters to integrate "maximum temperature gradient + heat exposure + weight allocation" to accurately characterize the temperature characteristics of the target / non-target feature grids. The comprehensive feature parameters can highlight the severity of temperature changes, making the gradient constraints more closely match actual thermal behavior, thereby effectively improving gradient control accuracy. Furthermore, when traditional gradient settings rely on fixed values, static rules are prone to failure when faced with complex operating conditions within the printing equipment, such as abrupt temperature distribution changes caused by different printing materials and ink types. This can lead to over-constraint (i.e., suppressing necessary temperature changes) or under-constraint (i.e., allowing undesirable temperature fluctuations). This embodiment, by integrating the factors of "average maximum temperature gradient, comprehensive feature parameters, and area" during UV curing, improves the matching of constraint settings with the current printing conditions, avoids substrate deformation due to excessive temperature fluctuations, and improves product yield stability. On the other hand, in the traditional temperature control mode of printing equipment, gradient settings are isolated from the temperature characteristics and regional states within the equipment. Each link operates in isolation, such as simply measuring the temperature first and then adjusting the gradient based on experience. This lack of system coordination makes it difficult to respond promptly and accurately to the dynamic demands of continuous printing. The above-mentioned technical solution constructs a closed-loop collaborative logic of "feature parameter calculation → regional state judgment → gradient dynamic generation → equipment control execution," with each link closely connected and dynamically responding. Comprehensive feature parameters provide precise basis for gradient calculation based on grid temperature changes at the micro level, allowing gradient constraints to fit local temperature characteristics. Regional integration judgment, from a macro perspective, creates conditions for gradient logic switching based on the distribution of feature and non-feature regions, enabling gradient settings to adapt to different regional conditions. The final generated gradient constraints directly affect the equipment control execution link, guiding temperature control actions. This technology upgrades UV curing temperature control from an isolated process to a coherent and intelligent system, where each process supports and coordinates with the others. It precisely adapts to the dynamic temperature control needs arising from changes in printing materials and processes during continuous and high-speed printing production. This effectively ensures a stable and controllable temperature gradient during the printing process, improves ink curing quality (such as optimizing ink adhesion and ensuring color consistency), enhances the equipment's adaptability to complex working conditions, and promotes the development of printing equipment temperature control towards greater intelligence and efficiency. It lays a solid technical foundation for the continuity and stability of printing production, revolutionizes the temperature control mode at the overall system level, breaks through the limitations of traditional isolated control, and achieves precise temperature control through deep collaboration among all processes.

[0071] This invention provides a temperature control system for a printing curing device, such as... Figure 2As shown, the temperature control system of the printing curing equipment includes: The data upload module is used to upload the printing data information corresponding to the current printing task to the database; wherein, the first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV; the second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed; The region division module is used to divide the irradiated area of ​​the substrate surface of the UV curing equipment into multiple grid regions by using the first grid setting factor and the second grid setting factor. The target feature grid acquisition module is used to filter target grids based on real-time temperature change characteristic parameters of the grid area and acquire target feature grids. The temperature compensation module is used to obtain the temperature compensation adjustment coefficient corresponding to the irradiated area on the substrate surface based on the temperature change characteristic parameters of the target feature grid; and to perform temperature compensation based on the adjustment target temperature obtained during the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, so as to obtain the compensated adjustment target temperature.

[0072] The working principle of the above technical solution is as follows: First, the printing data information of the current printing task (such as the material expansion coefficient, thermal conductivity, etc.) is uploaded to the database. Next, using the first and second grid setting factors, the irradiation area on the substrate surface of the UV curing equipment is divided into multiple grid regions. Then, based on the real-time temperature change characteristic parameters of each grid region, the target feature grid is selected. Finally, using the temperature change characteristic parameters of the target feature grid, the target temperature in the temperature control process is compensated to obtain the compensated target temperature, which is then used to regulate the temperature of the UV curing equipment.

[0073] The above technical solution achieves the following effects: It uploads comprehensive printing data, enabling temperature control to be based on material properties (coefficient of expansion, thermal conductivity, etc.) and process parameters (minimum effective exposure time, substrate transport speed, etc.). This allows temperature regulation to meet the needs of different printing tasks, avoiding curing quality issues caused by material and process differences and ensuring the stability of printed product quality. By dividing the substrate surface irradiation area into grid regions using a dual-grid setting factor, macro-level temperature control is transformed into precise control of multiple grids. This captures local temperature changes, solving the problem of uneven surface temperature that traditional coarse temperature control struggles to address, and improving temperature field uniformity. Target feature grids are selected based on real-time temperature change characteristic parameters, dynamically identifying areas with abnormal temperatures or critical impacts on curing quality. This allows temperature control to focus on key areas, prioritizing temperature accuracy in these areas, improving overall curing performance, and reducing defective products. Compensation adjustment of the target temperature based on the temperature change characteristic parameters of the target feature grids allows temperature control to dynamically adapt to actual grid temperature changes, correcting deviations from simple preset or feedback adjustments. This significantly improves temperature control accuracy, meeting the stringent temperature control requirements of high-precision printing and enhancing the equipment's adaptability to complex printing tasks. Precise temperature control reduces rework and scrap of printed materials due to temperature issues, ensuring production continuity. At the same time, a stable and suitable temperature environment improves curing quality, such as enhancing ink adhesion and reducing substrate deformation. This optimizes printing production in terms of both efficiency and quality, enhancing the equipment's market competitiveness.

[0074] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if the modifications and variations described herein fall within the scope of the claims of this invention and their equivalents, this invention also intends to include such modifications and variations.

Claims

1. A method for temperature control adjustment of a printing curing equipment, characterized in that, The temperature control method for the printing curing equipment includes: Upload the printing data information corresponding to the current printing task to the database; The substrate surface irradiation area of ​​the UV curing equipment is divided into multiple grid regions by using a first grid setting factor and a second grid setting factor. The first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV. The second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed. The target grid is selected based on the real-time temperature change characteristic parameters of the grid area to obtain the target feature grid; wherein, the target feature grid is determined by the coordinate distribution area corresponding to the temperature parameters of the area combined with the first calibration radius and the second calibration radius, and the coordinate distribution area is generated by the maximum gradient of heat exposure and temperature change in each grid area; Temperature compensation is performed on the target temperature obtained during the temperature control process of the UV curing equipment based on the temperature change characteristic parameters of the target feature grid. The compensated target temperature is then obtained, and the UV curing equipment is temperature regulated according to the compensated target temperature.

2. The temperature control method for the printing curing equipment according to claim 1, characterized in that, The substrate surface irradiation area of ​​the UV curing equipment is divided into multiple mesh regions using a first mesh setting factor and a second mesh setting factor, including: The first grid setting factor is obtained using the material parameters of the substrate and the effective exposure time. The second grid setting factor is obtained by utilizing the material parameters of the substrate and the maximum allowable temperature gradient of the irradiated area on the substrate surface. The first grid setting factor and the second grid setting factor are used to obtain the grid size parameters, and the substrate surface irradiation area of ​​the UV curing equipment is divided into grids according to the grid size parameters to obtain multiple grid areas.

3. The temperature control method for the printing curing equipment according to claim 1 or 2, characterized in that, The first grid setting factor is obtained using the first material parameters of the substrate and the minimum effective exposure time, including: Retrieve the first material parameter contained in the material parameters of the substrate from the database, wherein the first material parameter includes the material expansion coefficient and the material thermal conductivity; Retrieve the minimum effective UV exposure time value required for the printing process of the substrate surface irradiation area corresponding to the printing task; The first grid setting factor is obtained by combining the material's coefficient of thermal expansion and thermal conductivity with the minimum effective exposure time under UV light.

4. The temperature control method for the printing curing equipment according to claim 1 or 2, characterized in that, The second mesh setting factor is obtained using the second material parameters of the substrate and the maximum allowable temperature gradient of the irradiated area on the substrate surface, including: Retrieve the second material parameters contained in the material parameters of the substrate from the database; the second material parameters include material density and material specific heat capacity. The maximum allowable temperature gradient for the irradiated area on the substrate surface is determined. Retrieve the substrate conveying speed specified for the current printing task from the database; The second grid setting factor is set by combining the material density and specific heat capacity with the maximum allowable temperature gradient and the substrate transport speed.

5. The temperature control method for the printing curing equipment according to claim 1, characterized in that, Target meshes are selected based on real-time temperature change characteristics of the mesh region to obtain target feature meshes, including: Retrieve the temperature change characteristic parameters for each grid region, wherein the temperature change characteristic parameters include the maximum temperature change gradient and the heat exposure corresponding to the grid region; The maximum temperature change gradient for each grid region is normalized to obtain the normalized maximum temperature change gradient. The heat exposure of each grid region is normalized to obtain the normalized heat exposure. Using the normalized heat exposure in each grid region as the abscissa and the maximum normalized temperature change gradient corresponding to each grid region as the ordinate, the coordinate distribution area corresponding to the temperature parameters of the generated region is produced. The first calibration radius is obtained by utilizing the local peak temperature that appears in each grid region, and the second calibration radius is obtained by utilizing the standard deviation of temperature fluctuation in each grid region. The coordinate distribution area is divided using the first calibration radius and the second calibration radius, and the target feature grid is selected based on the division results.

6. The temperature control method for the printing curing equipment according to claim 5, characterized in that, The first calibration radius is obtained using the local peak temperature occurring within each grid region. Simultaneously, the second calibration radius is obtained using the standard deviation of temperature fluctuations within each grid region, including: Retrieve the local peak temperature that appears in each grid region; The local peak temperature appearing in each grid region is normalized to obtain the normalized local peak temperature. The first calibration radius is obtained based on the normalized local peak temperature corresponding to each grid region; Calculate the standard deviation of temperature fluctuation for each grid region; The standard deviation of temperature fluctuation in each grid region is normalized to obtain the normalized standard deviation of temperature fluctuation. The second calibration radius is obtained based on the normalized standard deviation of temperature fluctuation corresponding to each grid region.

7. The temperature control method for the printing curing equipment according to claim 5, characterized in that, The coordinate distribution area is divided using the first and second calibration radii, and the target feature grid is selected based on the division results, including: Using the center point of the range formed by the coordinate interval corresponding to the coordinate distribution area as the center, and dividing the area into a circular region with the first calibration radius, a first circular region is generated. Retrieve the x-coordinate values ​​within the coordinate distribution area, and obtain the average heat exposure value x based on the x-coordinate values; Retrieve the ordinate values ​​within the coordinate distribution area, and obtain the average value of the maximum temperature gradient y based on the ordinate values; Within the coordinate distribution area, a target data point (x, y) is determined, and a circular region is divided with the target data point (x, y) as the center and the second calibration radius to generate a second circular region. Retrieve data points that are simultaneously distributed within the first and second circular regions; The grid region corresponding to the data points simultaneously distributed in the first circular region and the second circular region is taken as the target feature grid.

8. The temperature control method for the printing curing equipment according to claim 1, characterized in that, Temperature compensation is performed based on the temperature change characteristic parameters of the target feature grid during the temperature control process of the UV curing equipment. The compensated target temperature is then obtained, and the UV curing equipment is temperature-regulated according to the compensated target temperature, including: Extract the normalized temperature change feature parameters corresponding to the target feature grid; wherein, the normalized temperature change feature parameters include the normalized maximum temperature change gradient and heat exposure. The temperature compensation adjustment coefficient corresponding to the irradiated area on the substrate surface is obtained based on the normalized temperature change characteristic parameters of the target feature mesh. Temperature compensation is performed based on the target temperature obtained during the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, and the compensated target temperature is obtained. The UV curing equipment is temperature-controlled according to the compensated target temperature.

9. The temperature control method for the printing curing equipment according to claim 1 or 8, characterized in that, Temperature control of the UV curing equipment is performed according to the compensated target temperature, including: The first comprehensive feature parameter corresponding to each target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the target feature grid; The second comprehensive feature parameter of each non-target feature grid is obtained by using the normalized temperature change feature parameters corresponding to the non-target feature grid; Determine whether each non-target feature grid has an adjacent target feature grid, and integrate the non-target feature grids that do not have a connected target feature network into a non-feature region; Determine whether each target feature grid has an adjacent non-target feature grid, and integrate the target feature grids that do not have an adjacent non-target feature network into a feature region; When there are no non-feature regions or feature regions, the maximum allowable gradient for temperature regulation is set by the first comprehensive feature parameter corresponding to each target feature grid and the second comprehensive feature parameter of each non-target feature grid. When no non-feature region and / or feature region exists, the maximum allowable gradient for temperature control is set by combining the area of ​​the feature region and the area of ​​the non-feature region with the comprehensive feature parameter corresponding to the non-feature region. Temperature control of the UV curing equipment is performed based on the maximum allowable gradient of temperature control as the temperature control constraint and the compensated target temperature as the final target temperature.

10. A temperature control system for a printing curing equipment, characterized in that, The temperature control system of the printing curing equipment includes: The data upload module is used to upload the printing data information corresponding to the current printing task to the database; The region division module is used to divide the irradiation area of ​​the substrate surface of the UV curing equipment into multiple grid regions using a first grid setting factor and a second grid setting factor. The first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV. The second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed. The target feature grid acquisition module is used to filter target grids based on real-time temperature change feature parameters of the grid area to obtain target feature grids. The target feature grids are determined by filtering the coordinate distribution area corresponding to the temperature parameters of the area in combination with a first calibration radius and a second calibration radius. The coordinate distribution area is generated by the maximum gradient of heat exposure and temperature change in each grid area. The temperature compensation module is used to obtain the temperature compensation adjustment coefficient corresponding to the irradiated area on the substrate surface based on the temperature change characteristic parameters of the target feature grid; and to perform temperature compensation based on the adjustment target temperature obtained during the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, so as to obtain the compensated adjustment target temperature.

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