A method and system for temperature control of a printing curing apparatus

Abstract

The application provides a temperature control adjustment method and system of a printing curing device. The temperature control adjustment method of the printing curing device comprises uploading printing data information corresponding to a current printing task to a database; using a first grid setting factor and a second grid setting factor to perform grid division on a substrate surface irradiation area of a UV curing device to obtain a plurality of grid areas; performing target grid screening according to real-time temperature change characteristic parameters of the grid areas to obtain a target characteristic grid; performing temperature compensation according to an adjustment target temperature obtained in a temperature control process of the UV curing device based on a temperature change characteristic parameter of the target characteristic grid to obtain a compensated adjustment target temperature, and performing temperature control on the UV curing device according to the compensated adjustment target temperature. The system comprises modules corresponding to the method steps.

Description

TECHNICAL FIELD

[0001] The present application provides a temperature control adjustment method and system for a printing curing device, and belongs to the technical field of printing temperature control. BACKGROUND

[0002] In the printing industry, UV (ultraviolet) curing technology is widely used in printing curing devices due to its fast curing speed, low energy consumption, and low pollution. However, there are many problems in the temperature control adjustment of current printing curing devices. Printing tasks involve various materials, and the thermal physical parameters such as the expansion coefficient, thermal conductivity, density, and specific heat capacity of different materials differ significantly. For example, some flexible printing materials and rigid printing materials have completely different thermal responses under the same temperature change conditions. At the same time, the minimum effective exposure time value under UV and the substrate conveying speed also have complex effects on the temperature field distribution during the curing process. If these factors cannot be accurately controlled, it is easy to cause uneven temperature distribution on the surface of the substrate, resulting in local overcuring or undercuring, which seriously affects the quality of the printed product, such as causing a decrease in ink adhesion and substrate deformation. In the prior art, the grid division method for the irradiation area of the substrate surface of the UV curing device is relatively simple, and is mostly based on experience or a single dimension parameter (such as only according to the area of the irradiation area), without fully considering the influence of the differences in printing material characteristics and process parameters on temperature changes. This makes the grid area unable to accurately reflect the actual temperature change characteristics, and the subsequent temperature control based on the grid lacks pertinence. In the temperature control link, the traditional method often adjusts according to a preset fixed temperature value or simple temperature feedback, ignoring the differences in temperature change characteristics caused by materials, processes, and other factors in different grid areas. When the temperature change in the grid area is complex, it is difficult to effectively compensate for the target temperature for adjustment, making it difficult to achieve fine temperature control and meet the demand for precise temperature control in high-quality printing.

[0003] Therefore, there is an urgent need for a new temperature control adjustment method for a printing curing device that can consider printing data information, scientifically divide grid areas, accurately select target feature grids, and compensate for the target temperature for adjustment according to the temperature change characteristics, to achieve more precise and adaptive temperature control adjustment for printing tasks, and improve the quality and production efficiency of printed products. SUMMARY

[0004] The present application provides a temperature control adjustment method and system for a printing curing device to solve the technical problems existing in the prior art, and the technical solutions adopted are as follows:

[0005] A temperature control adjustment method for a printing curing device, the temperature control adjustment method for the printing curing device comprising:

[0006] upload the printing data information corresponding to the current printing task to a database; wherein the first grid setting factor is set by combining a first material parameter of the substrate with a minimum effective exposure time value under UV; and the second grid setting factor is set by combining a second material parameter of the substrate with a maximum allowable temperature gradient and a substrate conveying speed;

[0007] grid division is performed on the substrate surface irradiation area of the UV curing equipment by using the first grid setting factor and the second grid setting factor, and a plurality of grid areas are obtained;

[0008] target grid screening is performed according to the real-time temperature change characteristic parameters of the grid areas, and a target characteristic grid is obtained; wherein the target characteristic grid is determined by screening the coordinate distribution area corresponding to the area temperature parameter in combination with the first calibration radius and the second calibration radius, and the coordinate distribution area is generated by the corresponding heat exposure and the maximum gradient of temperature change in each grid area;

[0009] temperature compensation is performed according to the adjustment target temperature obtained in the temperature control process of the UV curing equipment according to the temperature change characteristic parameters of the target characteristic grid, the compensated adjustment target temperature is obtained, and the UV curing equipment is temperature-regulated according to the compensated adjustment target temperature.

[0010] Further, grid division is performed on the substrate surface irradiation area of the UV curing equipment by using the first grid setting factor and the second grid setting factor, and a plurality of grid areas are obtained, including:

[0011] the first grid setting factor is obtained by using the material parameter of the substrate and the effective exposure time;

[0012] the second grid setting factor is obtained by using the material parameter of the substrate and the maximum allowable temperature gradient of the substrate surface irradiation area;

[0013] the grid size parameter is obtained by using the first grid setting factor and the second grid setting factor, and the grid division is performed on the substrate surface irradiation area of the UV curing equipment according to the grid size parameter, and a plurality of grid areas are obtained.

[0014] wherein the grid size parameter is obtained by the following formula:

[0015]

[0016] wherein L represents the grid size parameter; k represents a process safety factor, and the value range is 0.8-1.5; G 01 and G 02 represent the first grid setting factor and the second grid setting factor.

[0017] Further, a first grid setting factor is obtained by using the first material parameter of the substrate and the minimum effective exposure time under UV, comprising:

[0018] The first material parameter contained in the material parameter of the substrate is called from the database, wherein the first material parameter comprises;

[0019] The minimum effective exposure time value under UV required by the printing process of the substrate surface irradiation area corresponding to the printing task is called;

[0020] The first grid setting factor is obtained by using the material expansion coefficient and the material thermal conductivity in combination with the minimum effective exposure time value under UV.

[0021] The first grid setting factor is obtained by the following formula:

[0022]

[0023] Wherein, G 01 represents the first grid setting factor; α represents the material expansion coefficient; λ represents the material thermal conductivity; ΔT represents the minimum effective exposure time value under UV required by the printing process of the substrate surface irradiation area.

[0024] Further, a second grid setting factor is obtained by using the second material parameter of the substrate and the maximum allowable temperature gradient of the substrate surface irradiation area warming up, comprising:

[0025] The second material parameter contained in the material parameter of the substrate is called from the database; the second material parameter comprises the material density and the material specific heat capacity;

[0026] The maximum allowable temperature gradient of the substrate surface irradiation area warming up is called;

[0027] The substrate conveying speed specified by the current printing task is called from the database;

[0028] The second grid setting factor is set by using the material density and the material specific heat capacity in combination with the maximum allowable temperature gradient and the substrate conveying speed.

[0029] The second grid setting factor is obtained by the following formula:

[0030]

[0031] Wherein, G 02 represents the second grid setting factor; ρ represents the material density; c represents the material specific heat capacity; T max represents the maximum allowable temperature gradient of the substrate surface irradiation area warming up; v represents the substrate conveying speed specified by the current printing task.

[0032] Further, the target grid is screened according to the temperature change characteristic parameter of the grid area in real time, and a target characteristic grid is obtained, comprising:

[0033] The temperature change characteristic parameter of each grid area is called, wherein the temperature change characteristic parameter comprises a temperature change maximum gradient and a heat exposure of the grid area;

[0034] The temperature change maximum gradient of each grid area is normalized to obtain a normalized temperature change maximum gradient;

[0035] The heat exposure of each grid area is normalized to obtain a normalized heat exposure;

[0036] A coordinate distribution area corresponding to the area temperature parameter is generated by taking the normalized heat exposure in each grid area as the abscissa and the normalized temperature change maximum gradient corresponding to each grid area as the ordinate;

[0037] A first calibration radius is obtained by using the local peak temperature appearing in each grid area;

[0038] A second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid area;

[0039] The coordinate distribution area is divided by using the first calibration radius and the second calibration radius, and a target characteristic grid is screened according to the division result.

[0040] Further, the first calibration radius is obtained by using the local peak temperature appearing in each grid area, comprising:

[0041] The local peak temperature appearing in each grid area is called;

[0042] The local peak temperature appearing in each grid area is normalized to obtain a normalized local peak temperature;

[0043] The first calibration radius is obtained according to the normalized local peak temperature corresponding to each grid area.

[0044] The first calibration radius is obtained by the following formula:

[0045]

[0046] Wherein, R 01 represents the first calibration radius; n represents the total number corresponding to the grid area; Y i represents the heat exposure corresponding to the i-th grid area; Y c represents a preset heat exposure reference value; T iT max and T min T 02 represent the maximum and minimum of the normalized local peak temperature corresponding to the n grid regions.

[0047] Further, the second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid region, including:

[0048] The temperature fluctuation standard deviation of each grid region is called.

[0049] The temperature fluctuation standard deviation of each grid region is normalized to obtain the normalized temperature fluctuation standard deviation.

[0050] The second calibration radius is obtained according to the normalized temperature fluctuation standard deviation corresponding to each grid region.

[0051] The second calibration radius is obtained by the following formula:

[0052]

[0053] wherein R 02 represents the second calibration radius; n represents the total number of grid regions; Г i represents the maximum gradient of temperature change corresponding to the i-th grid region; Г c represents a preset gradient reference value; σ i represents the normalized temperature fluctuation standard deviation corresponding to the i-th grid region.

[0054] Further, the first calibration radius and the second calibration radius are used to divide the coordinate distribution region, and the target feature grid is selected according to the division result, including:

[0055] The range region center formed by the coordinate interval range corresponding to the coordinate distribution region (i.e. (0.5, 0.5)) is taken as the center, and the first calibration radius is used for circular region division to generate the first circular region.

[0056] The abscissa value in the coordinate distribution region is called, and the thermal exposure average x is obtained according to the abscissa value.

[0057] The ordinate value in the coordinate distribution region is called, and the maximum gradient of temperature change average y is obtained according to the ordinate value.

[0058] The target data point (x, y) is determined in the coordinate distribution region, and the second calibration radius is used for circular region division to generate the second circular region.

[0059] retrieve data points distributed in the first circular region and the second circular region simultaneously;

[0060] take the grid region corresponding to the data points distributed in the first circular region and the second circular region simultaneously as a target feature grid.

[0061] Further, temperature compensation is performed on the adjustment target temperature obtained in the temperature control process of the UV curing equipment according to the temperature variation characteristic parameter of the target feature grid, a compensated adjustment target temperature is obtained, and the UV curing equipment is temperature-regulated according to the compensated adjustment target temperature, comprising:

[0062] extract the normalized temperature variation characteristic parameter corresponding to the target feature grid; wherein the normalized temperature variation characteristic parameter comprises a normalized temperature variation maximum gradient and a heat exposure amount;

[0063] obtain a temperature compensation adjustment coefficient corresponding to the irradiation region on the substrate surface according to the normalized temperature variation characteristic parameter of the target feature grid;

[0064] wherein the temperature compensation adjustment coefficient is obtained by the following formula:

[0065]

[0066] wherein J represents the temperature compensation adjustment coefficient; m represents the number of target feature grids; s G represents a gradient compensation intensity factor, and the value range is 0.1-0.3; k G represents a gradient nonlinear gain, and the value range is 1.2-4.7; Г mi represents the normalized temperature variation maximum gradient corresponding to the i-th target feature grid; s Q represents a heat exposure compensation intensity factor, and the value range is 0.2-0.5; k Q represents a heat exposure threshold steepness coefficient, and the value range is 7.2-12.3; Y mi represents the normalized temperature variation maximum gradient corresponding to the i-th target feature grid; Y m represents a heat exposure critical offset, which is a threshold offset for triggering compensation, and the value range is 0.05-0.1;

[0067] temperature compensation is performed on the adjustment target temperature obtained in the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient.

[0068] wherein the compensated adjustment target temperature is obtained by the following formula:

[0069]

[0070] wherein, T comp represents the compensated adjustment target temperature; T target represents the adjustment target temperature; ΔT mg represents the maximum allowed compensation amplitude (determined by the temperature resistance of the substrate material); J represents the temperature compensation adjustment coefficient; β represents the temperature approximation attenuation coefficient, and the value range is 0.5-4.8; T s represents the current actual temperature;

[0071] controlling the temperature of the UV curing equipment according to the compensated adjustment target temperature.

[0072] Further, the temperature of the UV curing equipment is controlled according to the compensated adjustment target temperature, comprising:

[0073] obtaining the first comprehensive feature parameter corresponding to each target feature grid by using the normalized temperature change feature parameter corresponding to the target feature grid;

[0074] obtaining the second comprehensive feature parameter of each non-target feature grid by using the normalized temperature change feature parameter corresponding to the non-target feature grid;

[0075] judging whether each non-target feature grid has a target feature grid adjacent thereto, and integrating the non-target feature grid which does not have a target feature network connected thereto into a non-feature region;

[0076] judging whether each target feature grid has a non-target feature grid adjacent thereto, and integrating the target feature grid which does not have a non-target feature network connected thereto into a feature region;

[0077] when there is no non-feature region and feature region, setting the temperature control maximum allowed gradient by the first comprehensive feature parameter corresponding to each target feature grid and the second comprehensive feature parameter of each non-target feature grid;

[0078] when there is no non-feature region and / or feature region, setting the temperature control maximum allowed gradient by the comprehensive feature parameter corresponding to the combined area of the feature region and the non-feature region;

[0079] controlling the temperature of the UV curing equipment according to the compensated adjustment target temperature as the final target temperature with the temperature control maximum allowed gradient as the temperature control constraint condition.

[0080] A temperature control adjustment system of a printing curing equipment, comprising:

[0081] The data uploading module is configured to upload the printing data information corresponding to the current printing task to a database; wherein the first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV; and the second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed;

[0082] The area division module is configured to divide the substrate surface irradiation area of the UV curing equipment into grid areas by using the first grid setting factor and the second grid setting factor.

[0083] The target feature grid acquisition module is configured to select target grids according to the real-time temperature change characteristic parameters of the grid areas, and acquire target feature grids; wherein the target feature grids are determined by screening the coordinate distribution area corresponding to the area temperature parameter in combination with the first calibration radius and the second calibration radius, and the coordinate distribution area is generated by the corresponding heat exposure and the maximum gradient of temperature change in each grid area.

[0084] The temperature compensation module is configured to acquire the temperature compensation adjustment coefficient corresponding to the substrate surface irradiation area according to the temperature change characteristic parameters of the target feature grids; and perform temperature compensation according to the adjustment target temperature acquired in the temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient, and acquire the compensated adjustment target temperature.

[0085] The present application has the following advantages:

[0086] The temperature control adjustment method and system of the printing curing equipment proposed in the present application can subdivide the substrate surface irradiation area by dividing the grid area through the double grid setting factors, convert the macro temperature regulation into precise control of multiple grids, capture local temperature changes, solve the problem of uneven surface temperature that cannot be dealt with by traditional extensive temperature control, and improve the uniformity of the temperature field. The target feature grids are selected according to the real-time temperature change characteristic parameters, which can dynamically identify temperature abnormalities or areas that have a key impact on curing quality, focus the temperature control adjustment on the key positions, prioritize the accurate temperature of the areas, improve the overall curing effect, and reduce the generation of defective products. The temperature change characteristic parameters of the target feature grids compensate the adjustment target temperature, so that the temperature regulation can dynamically adapt to the actual temperature change of the grid, correct the deviation of the simple preset or simple feedback adjustment, greatly improve the temperature control accuracy, meet the strict temperature control requirements of high-precision printing, and enhance the adaptability of the equipment to complex printing tasks. Precise temperature control reduces the rework and scrap of printed products caused by temperature problems, ensures production continuity; at the same time, a stable and adaptive temperature environment improves the curing quality, such as enhancing the adhesion of ink and reducing substrate deformation, optimizes the printing production from the aspects of efficiency and quality, and enhances the market competitiveness of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0087] Figure 1 a flow chart of the method of the present application;

[0088] Figure 2 a system block diagram of the system of the present application. DETAILED DESCRIPTION

[0089] The preferred embodiments of the present application will be described hereinafter with reference to the accompanying drawings, in which, it should be understood that the preferred embodiments described herein are intended for the purpose of illustration and explanation only, and are not intended to limit the present application in any manner.

[0090] The embodiment of the present application provides a temperature control adjustment method of a printing curing equipment, as shown in the figure, the temperature control adjustment method of the printing curing equipment comprises the following steps: Figure 1

[0091] uploading printing data information corresponding to a current printing task to a database; wherein the printing data information corresponding to the printing task includes but is not limited to material expansion coefficient, material thermal conductivity, minimum effective exposure time value under UV, material density, material specific heat capacity, maximum allowable temperature gradient of temperature rise and substrate conveying speed;

[0092] dividing the substrate surface irradiation area of the UV curing equipment by using a first grid setting factor and a second grid setting factor to obtain a plurality of grid areas;

[0093] screening a target grid according to a real-time temperature change characteristic parameter of the grid area to obtain a target characteristic grid;

[0094] performing temperature compensation according to an adjustment target temperature obtained in a temperature control process of the UV curing equipment based on the temperature change characteristic parameter of the target characteristic grid, obtaining a compensated adjustment target temperature, and performing temperature control on the UV curing equipment according to the compensated adjustment target temperature.

[0095] The working principle of the above technical solution is as follows: first, the printing data information (such as material expansion coefficient, thermal conductivity, etc.) of the current printing task is uploaded to the database. Then, by means of the first and second grid setting factors, the substrate surface irradiation area of the UV curing equipment is divided into grid areas. Then, according to the real-time temperature change characteristic parameter of each grid area, the target characteristic grid is screened out. Finally, the adjustment target temperature in the temperature control process is compensated by using the temperature change characteristic parameter of the target characteristic grid, and the compensated adjustment target temperature is obtained, and the temperature of the UV curing equipment is adjusted by using the compensated adjustment target temperature.

[0096] ​The effect of the above technical scheme is that comprehensive printing data information is uploaded, temperature control adjustment is established on the basis of material characteristics (expansion coefficient, thermal conductivity, etc.) and process parameters (minimum effective exposure time, substrate conveying speed, etc.), the temperature control is adapted to different printing task requirements, the curing quality problems caused by material and process differences are avoided, and the printing quality stability is ensured. Through the grid area division factor, the substrate surface irradiation area is subdivided, the macro temperature control is converted into precise control for multiple grids, local temperature changes can be captured, the surface temperature unevenness that cannot be coped with by traditional extensive temperature control is solved, and the temperature field uniformity is improved. According to the real-time temperature change characteristic parameter, the target characteristic grid is screened, the temperature abnormality or the area that has a key influence on the curing quality can be dynamically identified, the temperature control adjustment is focused on the key position, the temperature precision of the area is preferentially ensured, the overall curing effect is improved, and the generation of defective products is reduced. The target temperature of the temperature change characteristic parameter of the target characteristic grid is compensated and adjusted, the temperature control can dynamically adapt to the actual temperature change of the grid, the deviation of the simple preset or simple feedback adjustment is corrected, the temperature control precision is greatly improved, the strict temperature control requirement of high-precision printing is met, and the adaptability of the equipment to complex printing tasks is enhanced. Precise temperature control reduces the rework and scrap of printed products caused by temperature problems, ensures production continuity, and at the same time, a stable and adaptive temperature environment improves the curing quality, such as enhancing the ink adhesion and reducing the substrate deformation, so that the printing production is optimized from the aspects of efficiency and quality, and the market competitiveness of the equipment is enhanced.

[0097] In an embodiment of the present application, the substrate surface irradiation area of the UV curing equipment is divided into multiple grid areas by using the first grid setting factor and the second grid setting factor.

[0098] The first grid setting factor is obtained by using the material parameters of the substrate and the effective exposure time.

[0099] The second grid setting factor is obtained by using the material parameters of the substrate and the maximum allowed temperature gradient of the substrate surface irradiation area.

[0100] The grid size parameter is obtained by using the first grid setting factor and the second grid setting factor, and the substrate surface irradiation area of the UV curing equipment is divided into multiple grid areas according to the grid size parameter.

[0101] The grid size parameter is obtained by using the first grid setting factor and the second grid setting factor, and the substrate surface irradiation area of the UV curing equipment is divided into multiple grid areas according to the grid size parameter.

[0102]

[0103] Wherein, L represents the grid size parameter; k represents the process safety factor, and the value range is 0.8-1.5; G 01g and G 02grepresent the first and second grid setting factors after normalization processing; L0 represents a preset initial grid size parameter. The above grid size parameter acquisition method can thus locally fine-tune energy input and avoid warping or pattern misalignment caused by uneven temperature. Compared with traditional fixed grid division, this method can reduce thermal deformation error by 30%-50% (depending on material property differences), greatly improving printing register accuracy (for example, pattern splicing error in label printing is reduced from ±0.2 mm to ±0.05 mm). At the same time, in high-speed printing (for example, thin film printing at 150 m / min), this method can reduce the curing failure rate from 8%-12% in the traditional method to below 2%, while energy consumption is reduced by 15%-20%. At the same time, the normalized G 01g and G 02g The formula converts material properties and process parameters into grid energy distribution weights, can adjust grid size based on material heat capacity and thermal sensitivity, and can maximize control of single-grid energy by clamping grid size to prevent scorching while ensuring sufficient energy within the grid.

[0104] The working principle of the above technical solution is as follows: first, calculate the first grid setting factor according to the material parameters of the substrate and the effective exposure time, then obtain the second grid setting factor in combination with the material parameters of the substrate and the maximum allowable temperature gradient of the irradiated area of the substrate surface. Then, put these two factors into the formula, combine with the process safety factor, calculate the grid size parameter, and finally divide the irradiated area of the substrate surface of the UV curing equipment into multiple grid regions according to the parameter.

[0105] The effect of the above technical solution is: by constructing the first and second grid setting factors respectively based on material parameters, the grid division is fully associated with the characteristics of the substrate itself (such as material parameters) and process requirements (effective exposure time, maximum allowable temperature gradient), so that the divided grid can accurately adapt to different substrates and printing processes, avoiding temperature control deviation caused by mismatch between grid and actual demand, and laying a foundation for subsequent accurate temperature control. The process safety factor k (value 0.8-1.5) is introduced, which can be flexibly adjusted according to the actual production demand for safety and precision. When pursuing accurate temperature control, k is appropriately reduced, or k is increased to avoid risk, balancing process requirements and safety margin, reducing the risk of temperature loss of control and material damage caused by unreasonable grid division, and improving the reliability of the production process. Based on the calculation of grid size parameters and the division of grids based on the two factors, the irradiation area of the substrate surface is subdivided into multiple grids, and the macro temperature control area is decomposed into micro controllable units, which can capture local temperature change details and solve the problem of temperature unevenness under traditional extensive division, improve the fine degree of temperature control, and improve the realization of curing uniformity. Different grid factors correspond to different material and process parameters in the corresponding area, and the temperature change characteristics are different. Reasonable grid division provides a basis for subsequent accurate selection of target grid based on grid temperature characteristics and targeted compensation adjustment of temperature, so that the temperature control strategy can focus on key grid areas, improve the efficiency and effect of temperature control, and ensure the consistency of the quality of printed products. Regardless of how the substrate type changes (different material parameters) and how the process requirements are adjusted (effective exposure time, temperature gradient changes), the grid setting factor and size parameter can be recalculated to quickly adapt to new printing tasks, enhance the adaptability of the UV curing equipment to diversified production needs, and expand the application range of the equipment.

[0106] At the same time, from the perspective of the printing process, dynamic printing that adapts to continuous production is an important technical element in the continuous production process. The substrate is continuously conveyed (the speed v changes), and the UV curing energy is continuously input (the exposure time ΔT is related), and the material completes curing in motion. The grid division in this scheme is based on G 01 and G 02 , which allows the grid size to be adjusted in real time according to the dynamic parameters of the printing operation, improving the matching and synchronization of the grid division rhythm with the substrate conveying and energy input rhythm. For example, when printing at high speed (v is large), the grid size is adjusted through the formula to adapt the energy acting area on the substrate surface to the conveying speed, avoiding energy misplacement and delayed curing caused by grid lag.

[0107] In addition, in the printing process, there are differences in material properties (alpha, rho, etc.) and process parameters (Delta T, |nabla T|max, etc.) in different batches and at different speeds. In this case, the grid size can be dynamically changed to maintain consistency with the curing quality of each section of the substrate, solving the problems of "quality difference between the beginning and the end" and "quality fluctuation in variable speed sections" in continuous printing. Moreover, during UV curing of the printing substrate (such as paper, plastic film), thermal expansion (alpha dominant) and heat conduction (lambda dominant) may occur due to energy absorption. If the energy distribution is uneven (i.e., the grid division is unreasonable), it is easy to cause material thermal stress concentration and local deformation, affecting the subsequent printing register accuracy (such as pattern misregistration). The grid division of the present embodiment is based on G 01 associated thermal expansion and heat conduction parameters, so that the grid size adapts to the material thermal deformation law, and the grid fineness is adjusted through the formula to accurately control the local energy input and reduce the thermal deformation difference. At the same time, combined with G 02 associated temperature gradient constraints, the temperature fluctuation in the grid area is limited to avoid substrate tearing and wrinkling due to excessive thermal stress, ensuring the stability of the physical form of the printed material and improving the appearance and internal quality of the printed product (such as ink layer adhesion). On the other hand, the energy output of the UV curing equipment is in units of regions (grid corresponding energy output unit), and the grid size of the present embodiment is accurately matched with the energy demand of the material (i.e., through G 01 , G 02 reflecting the energy absorption and thermal management needs of the material), the energy output of different grid areas is coordinated with the thermal response of the material, reducing "energy waste and substrate damage caused by over-curing" and "quality defects caused by under-curing", improving the UV energy utilization efficiency, and reducing the printing production cost.

[0108] In one embodiment of the present application, a first grid setting factor is obtained using a first material parameter of the substrate and a minimum effective exposure time, including:

[0109] The first material parameter contained in the material parameter of the substrate is called from the database, wherein the first material parameter includes a material expansion coefficient and a material thermal conductivity;

[0110] The minimum effective exposure time value under UV required by the printing process of the substrate surface irradiation area corresponding to the printing task is called;

[0111] The first grid setting factor is obtained using the material expansion coefficient and the material thermal conductivity in combination with the minimum effective exposure time value under UV.

[0112] The first grid setting factor is obtained by the following formula:

[0113]

[0114] G 01represents the first grid setting factor; a represents the material expansion coefficient; l represents the material thermal conductivity; and AT represents the minimum effective exposure time value of the substrate surface irradiation area under UV required by the printing process.

[0115] The working principle of the technical solution is as follows: first, the material expansion coefficient and the material thermal conductivity in the substrate material parameter are called from the database, and the minimum effective exposure time value of the substrate surface irradiation area under UV corresponding to the printing task is called. Then, the material expansion coefficient, the material thermal conductivity and the minimum effective exposure time value are substituted into a specific formula to calculate the first grid setting factor.

[0116] The effect of the technical solution is as follows: by the material expansion coefficient and the thermal conductivity, the physical characteristics of the substrate are taken into account in the grid division. The expansion coefficient directly affects the deformation degree of the material when the temperature changes, and the thermal conductivity determines the heat transfer efficiency in the material. Combined with the minimum effective exposure time value, the first grid setting factor can reflect the material characteristics and the UV curing process requirements at the same time, ensuring that the subsequent grid division is highly adapted to the actual printing task, avoiding curing defects caused by the mismatch between material characteristics and process. The first grid setting factor calculated based on the material parameters and the exposure time provides a key input for the grid size parameter. Reasonable grid size can capture the details of temperature changes caused by the characteristics of different regions of the material, and does not over-subdivide to increase the calculation burden, so that the substrate surface irradiation area of the UV curing equipment is divided into scientific and reasonable grid units, providing a basis for fine temperature control. The first grid setting factor as the core parameter of grid division directly affects the accuracy of subsequent temperature regulation. By accurately reflecting the material thermal response characteristics and process requirements, each grid area can be more accurately adjusted in the temperature control process, reducing the local temperature that is too high or too low caused by unreasonable grid division, and improving the stability of the overall curing quality. The characteristics of different printing tasks and process requirements of the substrate are quite different. This method retrieves parameters from the database and dynamically calculates the first grid setting factor, so that the UV curing equipment can quickly adapt to different material and process requirements, automatically adjust the grid division strategy, without frequent manual intervention, improving the versatility and flexibility of the equipment, and expanding the application range. The material parameters and process parameters are converted into the first grid setting factor, realizing the digitization and intelligentization of the UV curing process. Based on the grid division method of the factor, the equipment can automatically optimize the temperature control strategy according to the characteristics of the specific task, reduce the dependence on the experience of the operator, reduce human error, improve production efficiency and product consistency.

[0117] In an embodiment of the present application, a second grid setting factor is obtained by using the second material parameter of the substrate and the maximum allowed temperature gradient of the substrate surface irradiation area during heating, which includes:

[0118] retrieve a second material parameter included in the material parameters of the substrate from a database; the second material parameter includes a material density and a material specific heat capacity;

[0119] retrieve a maximum allowed temperature gradient of the substrate surface irradiation area warming;

[0120] retrieve a substrate conveying speed specified by a current printing task from a database;

[0121] set a second grid setting factor by using the material density and the material specific heat capacity in combination with the maximum allowed temperature gradient and the substrate conveying speed.

[0122] wherein the second grid setting factor is obtained by the following formula:

[0123]

[0124] wherein G 02 represents the second grid setting factor; p represents the material density; c represents the material specific heat capacity; T max represents the maximum allowed temperature gradient of the substrate surface irradiation area warming; v represents the substrate conveying speed specified by the current printing task.

[0125] The working principle of the above technical solution is as follows: firstly, the material density and the material specific heat capacity in the material parameters of the substrate, and the maximum allowed temperature gradient of the substrate surface irradiation area warming and the substrate conveying speed specified by the current printing task are retrieved from a database. Then, the parameters are substituted into a specific formula, and the second grid setting factor is calculated by multiplying the material density, the material specific heat capacity and the maximum allowed temperature gradient, and then dividing by the substrate conveying speed.

[0126] The effect of the above technical solution is: through the material density and the specific heat capacity, the ability of the substrate to store and transfer heat is accurately reflected. Materials with high density and large specific heat capacity have a slow temperature rise, and require more precise temperature control. This factor quantifies the characteristics, allowing the mesh division to adapt to the differences in thermal response of different materials, avoiding local overheating or overcooling caused by material thermal characteristics. The maximum allowed temperature gradient is directly related to the safety and quality of the printing process. A temperature gradient that is too high can cause the substrate to deform, uneven ink curing, and other problems. The second mesh setting factor incorporates this parameter into the calculation, ensuring that the mesh division meets the process's temperature change rate limit, ensuring the safety and stability of the printing process and reducing waste. The substrate conveying speed affects the UV irradiation time and the heat accumulation process. When the speed is fast, the substrate stays in the irradiation area for a short time, requiring higher instantaneous power; when the speed is slow, the opposite is true. This factor, through the conveying speed parameter, allows the mesh division to match the dynamic characteristics of the substrate, optimize the temperature distribution, and improve the uniformity of the curing effect. By combining the thermal physical parameters, temperature gradient limits, and conveying speed, the second mesh setting factor provides a scientific basis for mesh size. Reasonable mesh division neither overcoarsens the temperature control nor overrefines the system's computational burden, balancing control accuracy and system efficiency. The characteristics of the substrate, process requirements, and conveying speed of different printing tasks differ significantly. By retrieving parameters from the database and dynamically calculating the second mesh setting factor, the UV curing equipment can automatically adapt to diverse production needs without manual adjustment, enhancing the device's compatibility with different tasks and reducing operational complexity. By converting material parameters, process limits, and equipment operating parameters into quantifiable mesh setting factors, the UV curing process is digitized and intelligentized. Based on this factor, the mesh division method allows the device to automatically optimize the temperature control strategy based on the specific task characteristics, reducing reliance on operator experience, improving production efficiency, and enhancing product quality stability.

[0127] In an embodiment of the present application, the target mesh is selected according to the real-time temperature change characteristic parameters of the mesh area, and the target characteristic mesh is obtained, comprising:

[0128] Retrieving the temperature change characteristic parameters of each mesh area, wherein the temperature change characteristic parameters include the maximum temperature change gradient and the heat exposure of the mesh area;

[0129] Normalizing the maximum temperature change gradient of each mesh area to obtain the normalized maximum temperature change gradient;

[0130] Normalizing the heat exposure of each mesh area to obtain the normalized heat exposure;

[0131] Generating a coordinate distribution area corresponding to the area temperature parameters with the normalized heat exposure in each mesh area as the abscissa and the corresponding normalized maximum temperature change gradient of each mesh area as the ordinate.

[0132] a first calibration radius is obtained by using the local peak temperature in each grid area;

[0133] a second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid area;

[0134] the coordinate distribution area is divided by using the first calibration radius and the second calibration radius, and a target feature grid is screened according to the division result.

[0135] The working principle of the above technical solution is as follows: first, the maximum temperature change gradient and the heat exposure of each grid area are obtained as temperature change characteristic parameters. Then, the maximum temperature change gradient and the heat exposure are normalized to eliminate the dimensional influence. Then, the normalized heat exposure is taken as the abscissa, and the normalized maximum temperature change gradient is taken as the ordinate to generate the coordinate distribution area of the temperature parameters of each grid area. Then, the first calibration radius is calculated by using the local peak temperature in the grid area, and the second calibration radius is calculated according to the temperature fluctuation standard deviation. Finally, the coordinate distribution area is divided by using the two calibration radii, and the target feature grid with significant temperature change characteristics is screened according to the division result.

[0136] The effect of the above technical solution is that by comprehensively considering the two core parameters of the maximum temperature change gradient and the heat exposure, the intensity of temperature change and the heat accumulation in the grid area can be comprehensively captured. After normalization, the coordinate distribution area is generated, and the calibration radius calculated based on the local peak temperature and the temperature fluctuation standard deviation is divided, which can accurately identify the target feature grid with temperature anomaly and large influence on curing quality, avoiding the problem of local overheating or insufficient curing caused by extensive temperature control. The target feature grid screened represents the key area of the temperature change of the substrate surface. According to the temperature characteristics of the key area, the overall temperature is adjusted, which can avoid the problem of large temperature adjustment error caused by indiscriminate adjustment according to all grid areas, thereby improving the efficiency and accuracy of temperature compensation and regulation, and improving the stability of printing and curing quality. The local peak temperature and the temperature fluctuation standard deviation are used to calculate the calibration radius, which converts the peak value and fluctuation degree of the temperature change in the grid area into quantitative indexes, improving the reliability of temperature control and adjustment. In the actual printing process, the temperature field distribution on the substrate surface is complex and changeable. This method can adapt to complex temperature changes under different printing tasks, materials and process conditions by comprehensive analysis of multi-dimensional parameters (temperature change gradient, heat exposure, peak temperature, temperature fluctuation), accurately screen the key grid area, and ensure that the temperature control system can effectively work under various conditions.

[0137] Meanwhile, by accurately obtaining the two core temperature change characteristic parameters of the maximum gradient of temperature change and heat exposure of each grid area, constructing the coordinate distribution after normalizing the two core temperature change characteristic parameters, and combining the first and second calibration radii to screen the target grid, the printing quality can be deeply guaranteed from the aspects of thermal characteristic quantification and abnormality identification, and local peak value and fluctuation collaborative constraint. In terms of thermal characteristic quantification and abnormality identification, the grid thermal state which is originally difficult to perceive is accurately presented in the form of double parameters, so that problems such as ink brittleness caused by excessive solidification during ink solidification, and adhesion affected by uneven solidification can be captured and identified in the grid dimension in advance, replacing the extensive mode of traditional full-surface solidification, building a solid printing quality foundation from a micro perspective, and greatly reducing various printing defects caused by out-of-control thermal state. In terms of local peak value and fluctuation collaborative constraint, with the help of the double calibration radii, the local extreme thermal risk and unstable energy distribution caused by small equipment abnormalities (such as UV lamp aging and reflector dust accumulation) in continuous printing production can be accurately locked and intervened, avoiding the rejection of the entire batch of printing materials caused by local problems, and providing reliable quality guarantee for high-value and high-precision printing scenes. In terms of dynamic adaptation to continuous production rhythm, the real-time parameter mapping production state link of the embodiment, the coordinate distribution area converts the abstract thermal characteristic parameters into intuitive distribution, which is highly consistent with the real-time nature of continuous printing production. When the printing speed switches or other production states change, the grid thermal characteristics change synchronously, and the system can quickly locate the grid with energy supply and demand imbalance relying on the coordinate distribution. Compared with the long response of traditional manual troubleshooting, the process adjustment time is greatly shortened, so that the production line can adapt to the complex production scene of “high speed + variable speed” more agilely, and the overall operation efficiency is improved. In terms of accurate landing of compensation strategy, based on the temperature compensation of the target grid, the UV curing equipment partition energy control can be directly affected. In the scene of multi-color printing superposition solidification, the energy demand difference caused by the thickness difference of the ink layer can be targetedly made up, the traditional global power-on extensive mode is abandoned, the energy supply and printing demand are more accurately matched, and the printing process efficiency and quality are improved. Meanwhile, from the perspective of early warning of equipment abnormalities, the target grid screening breaks through the traditional post-maintenance mode, and can sensitively capture the thermal characteristic signals of potential equipment failures such as local aging of UV lamp, pollution of reflector, and blockage of water cooling system, realize preventive maintenance, greatly reduce the interference of equipment unplanned downtime on the continuous operation of the printing production line, and reduce the equipment maintenance cost and fault loss. In the collaborative regulation of multiple physical fields, printing production involves multiple physical field coupling such as mechanical movement, energy curing, and material phase change. The target grid screening takes the thermal characteristics as the core regulation node, links the conveying speed, UV power, cooling system and other equipment parameters, and collaboratively optimizes the multiple physical fields, so that the substrate deformation in the thin paper printing scene and other scenes prone to printing through and deformation can be effectively controlled, and the printing quality can be effectively improved.

[0138] In an embodiment of the present application, the first calibration radius is obtained by using the local peak temperature appearing in each grid area, comprising:

[0139] retrieve a local peak temperature occurring in each grid region;

[0140] normalize the local peak temperature occurring in each grid region to obtain a normalized local peak temperature;

[0141] obtain a first calibration radius according to the normalized local peak temperature corresponding to each grid region.

[0142] wherein the first calibration radius is obtained by the following formula:

[0143]

[0144] wherein R 01 represents the first calibration radius; n represents the total number of grid regions; Y i represents the heat exposure of the i-th grid region; Y c represents a preset heat exposure reference value; T i represents the normalized local peak temperature corresponding to the i-th grid region; T max and T min represent the maximum and minimum of the normalized local peak temperatures corresponding to the n grid regions. The above technical solution couples the heat exposure Y i , the heat exposure reference value Y c , the local peak temperature Ti, and the temperature extremes T max and T min to deeply associate the "energy accumulation" of the grid with the "temperature peak". Compared with the traditional "single temperature threshold" judgment, this formula can accurately represent the nonlinear relationship between "energy input-temperature response", avoiding ink scorching and substrate deformation caused by thermal runaway. At the same time, in precision printing, the "thermal stress concentration area" can be locked in advance, reducing the pattern misregistration error caused by thermal deformation from ±0.1 mm to ±0.02 mm, and ensuring the precision requirements of high-end printing.

[0145] The working principle of the above technical solution is as follows: first, the local peak temperature occurring in each grid region is retrieved, and the normalized local peak temperature is obtained by normalizing it to eliminate the dimension effect. Then, the heat exposure of each grid region, the preset heat exposure reference value, the normalized local peak temperature, and the maximum and minimum of the normalized local peak temperatures of all grid regions are substituted into a specific formula to calculate the first calibration radius.

[0146] The effect of the above technical scheme is: by normalizing the local peak temperature and combining with the heat exposure amount and other parameters to calculate the first calibration radius, the extreme change of the temperature in the grid area is converted into a quantitative index. The degree of deviation of the temperature peak of each grid area from the overall temperature level can be accurately measured, providing accurate basis for subsequent screening of temperature change key areas, and avoiding missing temperature abnormal grids. The comparison between the heat exposure amount and the preset reference value, and the maximum value information of the local peak temperature of different grid areas are included in the formula, so that the calculation of the first calibration radius comprehensively considers the temperature peak and the heat accumulation. It is ensured that the calibration radius not only reflects the temperature peak, but also reflects the temperature abnormality characteristics of the grid area under the heat exposure condition, and more comprehensively evaluates the temperature characteristics of the grid area. The first calibration radius as a key parameter for dividing the coordinate distribution area, its accuracy directly affects the screening of the target feature grid. Based on the radius calculated based on multiple parameters, the grid area boundaries of different temperature characteristics can be reasonably defined, and the grid areas with significant temperature changes and large influence on the curing quality are distinguished from other areas, improving the pertinence of temperature control adjustment. Different printing tasks and material characteristics will cause great differences in the substrate surface temperature field. The method dynamically calculates the first calibration radius, so that the system can automatically adjust the evaluation standard of the temperature characteristics of the grid area according to the actual temperature change of the printing task. No matter how complex the temperature field is, the key grid can be accurately identified, and the adaptability of the temperature control system to diversified working conditions is enhanced. The grid area screened by the first calibration radius determines the key area of temperature regulation. The temperature control resources can be concentrated in the area, avoiding uniform treatment of all grids, reducing unnecessary energy consumption and adjustment operation. While ensuring the printing and curing quality, the resource utilization efficiency is improved, and the equipment operation cost is reduced.

[0147] In an embodiment of the present application, the second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid area, including:

[0148] The temperature fluctuation standard deviation of each grid area is retrieved.

[0149] The temperature fluctuation standard deviation of each grid area is normalized to obtain the normalized temperature fluctuation standard deviation.

[0150] The second calibration radius is obtained according to the normalized temperature fluctuation standard deviation corresponding to each grid area.

[0151] The second calibration radius is obtained by the following formula:

[0152]

[0153] Wherein, R 02 represents the second calibration radius; n represents the total number of grid areas corresponding to each grid area; Г irepresents the maximum temperature change gradient corresponding to the i-th grid area; Г c represents the preset gradient reference value; σ i represents the normalized temperature fluctuation standard deviation corresponding to the i-th grid area. The technical solution integrates the "transient thermal shock" and the "steady thermal noise" of the grid into the second calibration radius by coupling the maximum temperature change gradient Γ i (reflecting thermal shock intensity) and the temperature fluctuation standard deviation σ i (reflecting thermal distribution stability). Compared with the traditional "single standard deviation" judgment, the formula can distinguish between "high-intensity but stable heat input" (such as thick ink layer requiring high gradient but low fluctuation) and "low-intensity but disordered heat fluctuation" (such as abnormal noise caused by equipment failure), and the thermal stability control precision is improved by 40%-60%, avoiding ink layer cracking and adhesion reduction caused by thermal runaway.

[0154] The working principle of the technical solution is as follows: first, the temperature fluctuation standard deviation of each grid area is retrieved to measure the fluctuation degree of the temperature of the area over time. Then, the temperature fluctuation standard deviation of each grid area is normalized to eliminate the dimension influence and obtain the normalized temperature fluctuation standard deviation. Finally, the total number of grid areas, the maximum temperature change gradient of each grid area, the preset gradient reference value, and the normalized temperature fluctuation standard deviation are substituted into a specific formula to calculate the second calibration radius.

[0155] The effect of the above technical scheme is that: by quantifying the dynamic change degree of the temperature of the grid area through the temperature fluctuation standard deviation, and combining the second calibration radius obtained through normalization processing and formula calculation, the stability of the temperature of each grid area can be accurately reflected. The larger the standard deviation, the more intense the temperature fluctuation, and the second calibration radius is adjusted accordingly, so that the grid area with unstable temperature which easily affects the curing effect can be effectively identified. The maximum gradient of temperature change and the preset gradient reference value are included in the formula, so that the calculation of the second calibration radius is not only based on the temperature fluctuation itself, but also related to the intensity of the temperature change in the area. This multi-parameter fusion calculation method avoids the one-sidedness of single parameter evaluation and can more comprehensively and objectively evaluate the temperature characteristics of the grid area. The second calibration radius, as an important basis for dividing the coordinate distribution area, its accuracy directly affects the screening result of the target feature grid. The radius calculated based on the temperature fluctuation standard deviation can accurately divide the grid area with abnormal temperature fluctuation, and cooperates with the first calibration radius to improve the accuracy of screening the key temperature control area and provides a basis for subsequent accurate temperature regulation. In actual printing process, the surface temperature of the substrate is affected by many factors, and the working condition is complex and changeable. The method can quickly adapt to the temperature fluctuation change under different printing tasks, materials and process conditions by calculating the temperature fluctuation standard deviation of each grid area in real time and dynamically generating the second calibration radius, so as to ensure that the grid area which needs to be controlled can be accurately locked under complex working conditions. After the temperature fluctuation abnormal grid area is screened based on the second calibration radius, the temperature control resources can be allocated to the area for targeted monitoring and adjustment. Avoiding the average allocation of resources to all grids, reducing resource waste, reducing equipment energy consumption under the premise of ensuring printing curing quality, improving the operation efficiency and economy of the temperature control system.

[0156] In an embodiment of the present application, the first calibration radius and the second calibration radius are used to divide the coordinate distribution area, and the target feature grid is screened according to the division result, comprising:

[0157] A range area center formed by a coordinate interval range corresponding to the coordinate distribution area (i.e. (0.5, 0.5)) is taken as the center of a circle, and the first calibration radius is used for circular area division to generate a first circular area;

[0158] The abscissa value in the coordinate distribution area is called, and the average value x of the heat exposure is obtained according to the abscissa value;

[0159] The ordinate value in the coordinate distribution area is called, and the average value y of the maximum gradient of temperature change is obtained according to the ordinate value;

[0160] A target data point (x, y) is determined in the coordinate distribution area, and the second calibration radius is used for circular area division with the target data point (x, y) as the center to generate a second circular area;

[0161] retrieve data points distributed in both the first circular region and the second circular region;

[0162] take the grid region corresponding to the data points distributed in both the first circular region and the second circular region as the target feature grid.

[0163] The working principle of the above technical solution is as follows: taking the center (0.5, 0.5) of the coordinate distribution region as the center of the circle, a circular region is drawn using the first calibration radius (reflecting the correlation between local peak temperature and heat exposure), and the grid data points with high temperature peak value and abnormal heat exposure are circled. Calculate the average value (x) of the heat exposure of all grids in the coordinate distribution region and the average value (y) of the maximum gradient of temperature change, determine the target data point (x, y), and then draw a circular region using the second calibration radius (reflecting the correlation between temperature fluctuation standard deviation and gradient feature), and circle the grid data points with high temperature fluctuation and abnormal gradient. Extract the data points located in both the first circular region and the second circular region, and the grid region corresponding to the data points is determined as the target feature grid because it simultaneously satisfies the dual characteristics of "high temperature peak value and abnormal heat exposure" and "high temperature fluctuation and abnormal gradient".

[0164] The effect of the above technical solution is as follows: through the superposition screening of the first circular region (peak temperature + heat exposure) and the second circular region (temperature fluctuation + gradient change), it is ensured that the target feature grid has the dual key attributes of "temperature extreme value outstanding" and "dynamic fluctuation severe", avoiding single dimension misjudgment and accurately locking the area with the greatest impact on the curing process. Taking the coordinate center and the mean value data point as the center of the circle, and combining the calibration radius calculated based on the statistical characteristics to divide the region, it avoids human experience interference, makes the screening standard completely based on data quantization results, and improves the objectivity and repeatability of target grid identification. No matter whether the substrate surface temperature field is uniformly distributed or locally abnormal, the radius and mean value point calculated dynamically can be used to adaptively adjust the division boundary. For example, when the heat exposure of a certain area is significantly higher than the mean value and the temperature peak value is outstanding, the first circular region can accurately cover it; if the temperature fluctuation standard deviation of a certain area is large and the gradient exceeds the reference value, the second circular region can effectively capture it, ensuring that the key area is not missed under complex conditions. By double screening, the grid with flat temperature characteristics is excluded, and only the target feature grid that meets the dual conditions is subjected to temperature compensation, avoiding energy waste caused by uniform regulation of the whole area. For example, in the printing pattern complex and material mixing area, energy can be concentrated to regulate the local high temperature fluctuation area, improving resource utilization efficiency. The accurate identification of the target feature grid makes the temperature compensation directly act on the area prone to curing defects (such as ink accumulation and material interface), effectively inhibiting the problems of incomplete curing and substrate deformation caused by uneven temperature, ensuring the uniformity of the surface quality of the printed product and reducing the defect rate.

[0165] One embodiment of the present application, according to the target feature grid temperature variation characteristic parameter in the temperature control process of UV curing equipment to obtain the adjustment target temperature for temperature compensation, obtain the compensation target temperature, according to the compensation target temperature of UV curing equipment for temperature control, including:

[0166] Extraction target feature grid corresponding to the normalized temperature variation characteristic parameters; wherein, the normalized temperature variation characteristic parameters include normalized temperature variation maximum gradient and heat exposure;

[0167] According to the normalized temperature variation characteristic parameters of the target feature grid to obtain the temperature compensation adjustment coefficient corresponding to the substrate surface irradiation area;

[0168] Wherein, the temperature compensation adjustment coefficient is obtained by the following formula:

[0169]

[0170] Wherein, J represents the temperature compensation adjustment coefficient; m represents the number of target feature grids; s G Indicates the gradient compensation intensity factor, the value range is 0.1~0.3; k G Indicates the gradient nonlinear gain, the value range is 1.2~4.7; Г mi Indicates the normalized temperature variation maximum gradient corresponding to the i target feature grid; s Q Indicates the heat exposure compensation intensity factor, the value range is 0.2~0.5; k Q Indicates the heat exposure threshold steepness coefficient, the value range is 7.2~12.3; Y mi Indicates the normalized temperature variation maximum gradient corresponding to the i target feature grid; Y m Indicates the heat exposure critical offset, the threshold offset for triggering compensation, the value range is 0.05-0.1;

[0171] According to the temperature compensation adjustment coefficient in the temperature control process of UV curing equipment to obtain the adjustment target temperature for temperature compensation, obtain the compensation target temperature.

[0172] Wherein, the compensation target temperature is obtained by the following formula:

[0173]

[0174] Wherein, T comp Indicates the compensation target temperature; T target Indicates the adjustment target temperature; ΔT mgrepresents the maximum allowed compensation amplitude (determined by the temperature resistance of the substrate material); J represents the temperature compensation adjustment coefficient; β represents the temperature approximation attenuation coefficient, and the value range is 0.5-4.8; T s represents the current actual temperature;

[0175] The UV curing equipment is temperature-regulated according to the adjusted target temperature after compensation.

[0176] The working principle of the technical solution is as follows: the normalized maximum gradient of temperature change (reflecting the degree of temperature change) and the heat exposure (reflecting the heat accumulation level) are extracted from the target feature grid, and the dimensional differences are eliminated for comprehensive calculation. Through formula fusion of gradient compensation intensity factor (s G ), gradient nonlinear gain (k G ), heat exposure compensation intensity factor (s Q ), heat exposure threshold steepness coefficient (k Q ), and other parameters, the temperature change gradient and heat exposure are nonlinearly weighted to generate the temperature compensation adjustment coefficient (J), wherein the heat exposure critical offset (Y m ) is used to trigger the compensation logic. The adjustment coefficient (J) is substituted into the formula with the adjustment target temperature (T target ), the maximum allowed compensation amplitude (ΔT mg ), the temperature approximation attenuation coefficient (β), and the current actual temperature (T s ), the dynamic adjustment target temperature is output, and the adjusted target temperature after compensation (T comp ) is output.

[0177] The effect of the technical solution is as follows: by separating the influence of the temperature change gradient and the heat exposure, combining the nonlinear gain and the steepness coefficient, the compensation coefficient can be adjusted differently for different scenes such as "high gradient low temperature rise" or "low gradient high accumulated heat". For example, for an area with steep temperature gradient but low heat exposure, the gradient compensation weight is enhanced through k G ; for an area with heat exposure exceeding the threshold, steep compensation is triggered through k Q , avoiding compensation deviation caused by a single parameter. The heat exposure critical offset (Y m ) is used as a compensation trigger threshold, and compensation is started only when the heat exposure deviates from the normal level by more than 0.05-0.1, avoiding excessive adjustment of normal fluctuation areas, balancing the response sensitivity and system stability. The maximum allowed compensation amplitude (ΔT mg) is set based on the temperature resistance of the substrate, preventing the substrate from being damaged due to excessive temperature adjustment during compensation, and improving process safety. The temperature approximation decay coefficient (β) dynamically adjusts the compensation strength with the deviation of the current temperature and the target temperature. When the actual temperature approaches the target temperature, the adjustment amplitude is automatically reduced to avoid temperature overshoot or oscillation. In the later compensation stage, the adjustment curve is smoothed and converged by increasing β, improving the temperature control accuracy. Through flexible configuration of parameter value range (such as s G =0.1−0.3、k Q =7.2−12.3), it can adapt to the temperature control needs of different materials (such as flexible film, rigid plate) and processes (such as high-speed printing, thick layer ink curing). For high thermal conductivity substrates, s G is reduced to weaken gradient compensation, and s Q is increased for slow printing scenarios to strengthen heat exposure compensation, improving the adaptability of the equipment to diversified production tasks. The directional compensation for the target feature grid directly acts on the high temperature difference and high cumulative heat area prone to curing defects, effectively suppressing ink carbonization, substrate shrinkage and other problems. The actual measurement data shows that after using the compensation method, the curing uniformity error of the printed product is reduced by 30%-50%, and the waste rate is significantly reduced.

[0178] At the same time, the above technical solution realizes temperature regulation of the printing equipment from the perspective of heat control granularity. In terms of heat control granularity, the traditional overall regulation mode has obvious shortcomings. The traditional overall regulation mode is based on average temperature feedback and uses a rough method such as ±5% adjustment of the overall power of the UV lamp, which cannot meet the differentiated needs of different areas in the printing process. For example, thick ink areas need more energy, and thin substrate areas need to avoid thermal shock, which can easily cause local over-curing and make the ink brittle, or under-curing and make the adhesion poor. The technical solution uses target grid screening to realize point-to-point matching of energy distribution and material demand. Taking the multi-color overprinting scenario as an example, this precise regulation can greatly compress the curing energy deviation from ±8% of the traditional overall regulation to ±2%, and the ink adhesion can be improved by 30%-50%, fundamentally solving the local curing quality problem caused by the coarse granularity of the traditional overall regulation, and making the energy supply in different areas more in line with the actual needs, laying a solid micro-level foundation for printing quality.

[0179] On the other hand, in terms of process adaptation flexibility, the traditional overall regulation is relatively passive in dealing with material differences and production rhythm changes. When changing materials, such as switching from paper to plastic film, manual recalibration of the temperature curve is required, which takes 10-15 minutes and is difficult to balance the contradictory needs of different materials for energy and peak temperature. When the production rhythm changes, such as the printing speed increasing from 80m / min to 120m / min, the lag of overall regulation will cause temperature fluctuations of ±3℃-±5℃ in a short time, causing curing quality fluctuations. The technical solution shows strong dynamic adaptation capability. The heat characteristic parameter (Γmi , Y mi ) can automatically reflect material differences, formula J dynamically adjusts the compensation coefficient according to these differences, and can adapt to new materials without manual intervention, so that the material changing debugging time is shortened from 10-15 minutes to 2-3 minutes, and the flexible production of'small batch and multi-variety' printing is adapted. At the same time, the temperature compensation of the target grid is strongly associated with the production rhythm, and the speed change will cause the grid heat exposure time, Y mi change, and then adjust the compensation coefficient J, formula T comp Through the exp function, the temperature deviation is quickly responded, and in the 'high speed + variable speed' production, the temperature fluctuation is compressed from ±3℃-±5℃ to ±0.5℃-±1℃, and the curing failure rate is reduced from 8%-12% to 1%-2%, so that the UV curing equipment can more flexibly and stably cope with complex and variable production scenes.

[0180] As for the quality problem solving path, the traditional overall control is in a passive state. When the printed matter appears quality problems such as ink peeling and pattern deformation, manual intervention is needed to start troubleshooting and adjust the overall temperature, which takes 1-2 hours and cannot trace the specific problem source. The technical solution realizes the change of 'prevention + accurate tracing'. Through target grid screening, it can identify the risk grid of 'abnormally high heat exposure + abnormally large temperature gradient' in advance, such as the UV lamp focusing area, and formula J can make the overall temperature compensation control and the temperature control of the risk grid real-time adapt to each other in the overall temperature compensation control process according to the temperature characteristic parameters in the target grid, so as to intercept the risk before the defect occurs, and reduce the scrap rate caused by heat runaway from 5%-8% to 0.5%-1%, which is especially suitable for high-value printing scenes. Moreover, the thermal characteristic parameters (Γ mi , Y mi ) and the compensation coefficient J form a 'digital track', which can accurately trace the quality fluctuation reason in reverse. If the adhesion of a batch of printed matter is poor, the system analyzes Y mi distribution to determine whether the UV energy is insufficient, analyzes Γ mi fluctuation to determine whether the substrate thermal stress is too large, shortens the root cause analysis time of quality abnormalities from 1-2 hours to 10-15 minutes, improves the process optimization efficiency by 80%-90%, and builds a perfect quality protection closed loop, which improves the printing quality control level from the aspects of prevention and tracing.

[0181] In an embodiment of the present application, the temperature of the UV curing equipment is controlled according to the adjusted target temperature after compensation, which comprises:

[0182] The first comprehensive characteristic parameters corresponding to each target characteristic grid are obtained by using the normalized temperature change characteristic parameters corresponding to the target characteristic grid.

[0183] The second comprehensive feature parameter of each non-target feature grid is acquired by using the normalized temperature change feature parameter corresponding to the non-target feature grid.

[0184] It is judged whether each non-target feature grid has a target feature grid adjacent thereto, and the non-target feature grid without the target feature grid adjacent thereto is integrated as a non-feature region.

[0185] It is judged whether each target feature grid has a non-target feature grid adjacent thereto, and the target feature grid without the non-target feature grid adjacent thereto is integrated as a feature region.

[0186] When the non-feature region and the feature region do not exist, the temperature control maximum allowable gradient is set by using the first comprehensive feature parameter corresponding to each target feature grid and the second comprehensive feature parameter of each non-target feature grid.

[0187] The temperature control maximum allowable gradient is acquired by using the following formula:

[0188]

[0189] ΔF max represents the temperature control maximum allowable gradient; Г p represents the average value of the maximum gradient of the temperature change corresponding to all target feature grids; ξ 01 represents the comprehensive feature parameter factor corresponding to the target feature grid; ξ 02 represents the comprehensive feature parameter factor corresponding to the non-target feature grid; and the comprehensive feature parameter factor corresponding to the target feature grid and the comprehensive feature parameter factor corresponding to the non-target feature grid are acquired by using the following formula:

[0190]

[0191] n represents the total number of grid regions; m represents the number of target feature grids; Z 01i represents the first comprehensive feature parameter corresponding to the i-th target feature grid; Z 02pi represents the average value of the second comprehensive feature parameters corresponding to all non-target feature grids adjacent to the i-th target feature grid; Z 02i represents the second comprehensive feature parameter corresponding to the i-th non-target feature grid; Z 01pi represents the average value of the first comprehensive feature parameters corresponding to all target feature grids adjacent to the i-th non-target feature grid;

[0192] When the non-feature region and / or the feature region do not exist, the temperature control maximum allowable gradient is set by using the comprehensive feature parameter corresponding to the feature region and the non-feature region corresponding to the area area combination of the feature region and the non-feature region.

[0193] The temperature control maximum allowable gradient is obtained by the following formula:

[0194]

[0195] ΔF max represents the temperature control maximum allowable gradient; Г p represents the average value of the maximum gradient of temperature change corresponding to all target feature grids; a and b respectively represent the number of feature areas and non-feature areas; A mi represents the area of the ith feature area; A fi represents the area of the ith non-feature area; Z mpi represents the average value of the first comprehensive feature parameter corresponding to the ith feature area; Z fpi represents the average value of the second comprehensive feature parameter corresponding to the ith non-feature area;

[0196] The temperature control maximum allowable gradient is used as the temperature control constraint condition, and the compensated adjustment target temperature is used as the final target temperature to perform temperature control on the UV curing equipment.

[0197] The working principle of the above technical solution is as follows: first, the first comprehensive feature parameter corresponding to each target feature grid is obtained by using the normalized temperature change feature parameter corresponding to the target feature grid; and the second comprehensive feature parameter of each non-target feature grid is obtained by using the normalized temperature change feature parameter corresponding to the non-target feature grid.

[0198] In this embodiment, the first comprehensive feature parameter and the second comprehensive feature parameter are obtained as follows:

[0199] The normalized temperature change feature parameter corresponding to the target feature grid is retrieved as the first temperature change feature parameter.

[0200] The weight values corresponding to the normalized maximum temperature change gradient and the heat exposure amount contained in the first temperature change feature parameter are retrieved, and the first comprehensive feature parameter of each target feature grid is obtained by using the normalized maximum temperature change gradient and the heat exposure amount combined with the respective weight values through weighted average.

[0201] The normalized temperature change feature parameter corresponding to the non-target feature grid is retrieved as the second temperature change feature parameter.

[0202] The weight values corresponding to the normalized maximum temperature change gradient and the heat exposure amount in the second temperature change characteristic parameter are called, and the second comprehensive characteristic parameter of each non-target feature grid is obtained by using the normalized maximum temperature change gradient and the heat exposure amount combined with the corresponding weight values through weighted average.

[0203] It is judged whether the non-target feature grid has adjacent target feature grids, and the non-target feature grid without adjacent target feature grids is integrated into a non-feature region; it is judged whether the target feature grid has adjacent non-target feature grids, and the target feature grid without adjacent non-target feature grids is integrated into a feature region.

[0204] When there is no non-feature region and feature region, the first comprehensive characteristic parameter of the target feature grid and the second comprehensive characteristic parameter of the non-target feature grid are used to calculate the maximum allowed gradient (ΔFmax) of temperature regulation according to the corresponding formula (through the comprehensive characteristic parameter factors of the target and non-target feature grids, and the average value of the maximum temperature change gradient of the target feature grid, etc.).

[0205] When there is a non-feature region and / or a feature region, the area of the feature region and the non-feature region, and their corresponding comprehensive characteristic parameters are called, and the maximum allowed gradient (ΔFmax) of temperature regulation is calculated according to the corresponding formula (combined with the number of feature and non-feature regions, area, average value of comprehensive characteristic parameter, average value of maximum temperature change gradient of target feature grid, etc.).

[0206] Then the temperature of the printing equipment is regulated, the maximum allowed gradient of temperature regulation is used as the constraint condition, the adjusted target temperature after compensation is the final target temperature, and the temperature of the UV curing equipment is regulated.

[0207] The above technical solution has the following effects: by using the weighted average method, the first and second comprehensive feature parameters are calculated by fusing the maximum gradient of temperature change and the heat exposure amount (combined with their respective weights), which can comprehensively and selectively reflect the temperature change characteristics of the target and non-target feature grids, provide accurate and detailed features for subsequent temperature regulation, and make the control of different grid temperature characteristics more in line with actual needs. Through the judgment and integration of non-feature areas and feature areas, the calculation method of the maximum allowed gradient of temperature regulation is flexibly switched according to different area existence states (whether there are non-feature areas and feature areas). This dynamic adaptation mechanism can fully cope with the complex and variable adjacent relationship and distribution of grid areas, ensuring that the temperature regulation constraints can be reasonably set in various scenarios, and improving the adaptability and scientificity of the temperature regulation scheme. The maximum allowed gradient of temperature regulation calculated based on the comprehensive feature parameters and the area state sets a reasonable boundary for the temperature regulation of the UV curing equipment from the feature level and the area distribution level. This constraint condition can effectively avoid the curing quality problems (such as uneven curing, excessive curing or insufficient curing) caused by unreasonable gradient during temperature regulation, ensuring the stability and consistency of the UV curing process, and thus improving the curing quality and production reliability of the product.

[0208] Meanwhile, the temperature regulation gradient of the traditional printing equipment usually adopts a fixed value, or is set according to a single feature (for example, only the average temperature), and cannot adapt to the temperature heterogeneity of different regions (for example, the feature grid and non-feature grid of the UV curing region). The first / second comprehensive feature parameter of the embodiment fuses the "maximum temperature change gradient + heat exposure + weight distribution" to accurately describe the temperature characteristics of the target / non-target feature grid. The comprehensive feature parameter can highlight the temperature change intensity, making the gradient constraint more in line with the actual thermal behavior, thereby effectively improving the gradient control accuracy. Meanwhile, when the traditional gradient setting relies on a fixed value, the static rule is easy to fail in the face of complex working conditions in the printing equipment, such as sudden changes in temperature distribution caused by different printing materials and ink types, resulting in problems such as over-constraint (i.e., inhibiting necessary temperature changes) or under-constraint (i.e., allowing undesirable temperature fluctuations). The embodiment improves the matching of the constraint condition setting and the current printing situation by fusing the "average value of the maximum temperature change gradient, comprehensive feature parameter, and region area" factors during the UV curing process, avoiding substrate deformation caused by excessive temperature fluctuations, and improving product yield stability. On the other hand, in the traditional temperature regulation mode of the printing equipment, the gradient setting and the temperature features and region states in the equipment are in a state of mutual fragmentation, and each link operates in isolation, such as simply measuring the temperature first and then adjusting the gradient based on the experience of engineers, lacking system coordination, and it is difficult to respond in a timely and accurate manner to the dynamic needs of continuous printing. The above technical solution establishes a closed-loop coordination logic of "feature parameter calculation → region state judgment → gradient dynamic generation → equipment regulation execution", and each link is closely related and dynamically responds. The comprehensive feature parameter provides accurate basis for gradient calculation based on grid temperature change from a micro perspective, allowing the gradient constraint to adapt to the local temperature characteristics; the region integration judgment creates conditions for gradient logic switching from a macro perspective based on the distribution of feature and non-feature regions, allowing the gradient setting to adapt to different region conditions; and the finally generated gradient constraint directly acts on the equipment regulation execution link to guide the temperature regulation action. This can upgrade the UV curing temperature regulation from the previous "isolated link" to a coherent and intelligent "system coordination system", with each process supporting and orderly linking each other, accurately adapting to the dynamic temperature regulation needs caused by the replacement of printing materials and process switching in continuous and high-speed production of the printing equipment, effectively ensuring the stability and controllability of the temperature gradient in the printing process, improving the ink curing quality (such as optimizing the ink adhesion and ensuring color consistency), enhancing the adaptability of the equipment to complex working conditions, and promoting the development of the printing equipment temperature regulation towards a more intelligent and efficient direction. The technical foundation for the continuity and stability of printing production is built, and the temperature regulation mode is innovated from the overall system level, breaking through the limitations of traditional isolated regulation and realizing accurate temperature control under the deep coordination of each link.

[0209] The embodiment of the present application proposes a temperature control and regulation system of a printing and curing equipment, as shown in Figure 2As shown, the temperature control adjustment system of the printing curing device comprises:

[0210] a data uploading module for uploading printing data information corresponding to a current printing task to a database; wherein the first grid setting factor is set by a first material parameter of the substrate in combination with a minimum effective exposure time value under UV; and the second grid setting factor is set by a second material parameter of the substrate in combination with a maximum allowable temperature gradient and a substrate conveying speed;

[0211] a region dividing module for dividing the substrate surface irradiation region of the UV curing device into a plurality of grid regions by using the first grid setting factor and the second grid setting factor;

[0212] a target feature grid obtaining module for selecting a target grid according to real-time temperature variation characteristic parameters of the grid regions, and obtaining a target feature grid;

[0213] a temperature compensation module for obtaining a temperature compensation adjustment coefficient corresponding to the substrate surface irradiation region according to the temperature variation characteristic parameters of the target feature grid; and performing temperature compensation according to an adjustment target temperature obtained in the temperature control process of the UV curing device, to obtain a compensated adjustment target temperature.

[0214] The working principle of the above technical solution is as follows: first, the printing data information (such as material expansion coefficient, thermal conductivity, etc.) of the current printing task is uploaded to the database. Then, by means of the first and second grid setting factors, the substrate surface irradiation region of the UV curing device is divided into a plurality of grid regions. Then, according to the real-time temperature variation characteristic parameters of each grid region, the target feature grid is selected. Finally, the adjustment target temperature in the temperature control process is compensated by using the temperature variation characteristic parameters of the target feature grid, to obtain the compensated adjustment target temperature, which is used to regulate the temperature of the UV curing device.

[0215] The effect of the above technical scheme is that comprehensive printing data information is uploaded, temperature control adjustment is established on the basis of material properties (expansion coefficient, thermal conductivity, etc.) and process parameters (minimum effective exposure time, substrate conveying speed, etc.), the temperature control is adapted to different printing task requirements, the curing quality problems caused by material and process differences are avoided, and the printing quality stability is ensured. By dividing the grid area with the double-grid setting factor, the substrate surface irradiation area is subdivided, the macro temperature control is converted into precise control for multiple grids, local temperature changes can be captured, the surface temperature unevenness problem that cannot be solved by traditional extensive temperature control is solved, and the temperature field uniformity is improved. According to the target characteristic grid selected according to the real-time temperature change characteristic parameter, the temperature abnormality or the area that affects the curing quality can be dynamically identified, the temperature control adjustment is focused on the key position, the temperature precision of the area is preferentially ensured, the overall curing effect is improved, and the generation of defective products is reduced. The target temperature is adjusted based on the temperature change characteristic parameter of the target characteristic grid, the temperature control can dynamically adapt to the actual temperature change of the grid, the deviation of simple preset or simple feedback adjustment is corrected, the temperature control precision is greatly improved, the requirement of strict temperature control for high-precision printing is met, and the adaptability of the equipment to complex printing tasks is enhanced. Precise temperature control reduces the rework and scrap of printed products caused by temperature problems, ensures production continuity; at the same time, stable and adaptive temperature environment improves the curing quality, such as enhancing the adhesion of ink, reducing substrate deformation, etc., which optimizes the printing production from the aspects of efficiency and quality, and enhances the market competitiveness of the equipment.

[0216] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if the modifications and variations of the present application belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include the modifications and variations.

Claims

1. A method of temperature control adjustment of a printing and curing apparatus, characterized by, The temperature control adjustment method of the printing curing equipment comprises: uploading printing data information corresponding to a current printing task to a database; dividing the substrate surface irradiation area of the UV curing equipment into a plurality of grid areas by using a first grid setting factor and a second grid setting factor; wherein the first grid setting factor is set by combining the first material parameter of the substrate with the minimum effective exposure time value under UV; and the second grid setting factor is set by combining the second material parameter of the substrate with the maximum allowable temperature gradient and the substrate conveying speed; target grid screening is performed according to the real-time temperature change characteristic parameters of the grid areas to obtain target characteristic grids; wherein the target characteristic grids are determined by screening the coordinate distribution area corresponding to the area temperature parameters in combination with the first calibration radius and the second calibration radius, and the coordinate distribution area is generated by the corresponding heat exposure and the maximum temperature change gradient in each grid area; temperature compensation is performed according to the adjustment target temperature obtained in the temperature control process of the UV curing equipment based on the temperature change characteristic parameters of the target characteristic grids to obtain the compensated adjustment target temperature, and the UV curing equipment is temperature controlled according to the compensated adjustment target temperature; wherein the first grid setting factor is obtained by using the first material parameter of the substrate and the minimum effective exposure time, comprising: the first material parameter contained in the material parameter of the substrate is called from the database, wherein the first material parameter includes the material expansion coefficient and the material thermal conductivity; the minimum effective exposure time value under UV required by the printing process of the substrate surface irradiation area corresponding to the printing task is called, and the first grid setting factor is obtained by combining the material expansion coefficient and the material thermal conductivity with the minimum effective exposure time value under UV; wherein the second grid setting factor is obtained by using the second material parameter of the substrate and the maximum allowable temperature gradient of the substrate surface irradiation area, comprising: the second material parameter contained in the material parameter of the substrate is called from the database; the second material parameter includes the material density and the material specific heat capacity; the maximum allowable temperature gradient of the substrate surface irradiation area is called, and the substrate conveying speed specified by the current printing task is called from the database; the second grid setting factor is set by combining the material density and the material specific heat capacity with the maximum allowable temperature gradient and the substrate conveying speed; wherein the target grid screening is performed according to the real-time temperature change characteristic parameters of the grid areas to obtain the target characteristic grids, comprising: the temperature change characteristic parameters of each grid area are called, wherein the temperature change characteristic parameters include the maximum temperature change gradient and the heat exposure corresponding to the grid area; the maximum temperature change gradient of each grid area is normalized to obtain the normalized maximum temperature change gradient; and the heat exposure of each grid area is normalized to obtain the normalized heat exposure; the normalized heat exposure in each grid area is taken as the abscissa, and the corresponding normalized maximum temperature change gradient of each grid area is taken as the ordinate to generate the coordinate distribution area corresponding to the area temperature parameters; The first calibration radius is obtained by using the local peak temperature in each grid area, and the second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid area; The first calibration radius and the second calibration radius are used to divide the coordinate distribution area, and the target feature grid is screened according to the division result.

2. The method of claim 1, wherein the temperature of the printing and curing apparatus is controlled by adjusting the temperature of the air supplied to the printing and curing apparatus. The substrate surface irradiation area of the UV curing equipment is divided into multiple grid areas by using the first grid setting factor and the second grid setting factor, including: The first grid setting factor is obtained by using the material parameters of the substrate and the effective exposure time; The second grid setting factor is obtained by using the material parameters of the substrate and the maximum allowed temperature gradient of the substrate surface irradiation area; The grid size parameter is obtained by using the first grid setting factor and the second grid setting factor, and the substrate surface irradiation area of the UV curing equipment is divided into multiple grid areas according to the grid size parameter.

3. The method of claim 1, wherein the temperature of the printing and curing apparatus is controlled by adjusting the temperature of the air supplied to the printing and curing apparatus. The first calibration radius is obtained by using the local peak temperature in each grid area, and the second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid area, including: The local peak temperature in each grid area is called; The local peak temperature in each grid area is normalized to obtain the normalized local peak temperature; The first calibration radius is obtained according to the normalized local peak temperature corresponding to each grid area; The temperature fluctuation standard deviation of each grid area is called; The temperature fluctuation standard deviation of each grid area is normalized to obtain the normalized temperature fluctuation standard deviation; The second calibration radius is obtained according to the normalized temperature fluctuation standard deviation corresponding to each grid area.

4. The method of claim 1, wherein the temperature of the printing and curing apparatus is controlled by adjusting the temperature of the air supplied to the printing and curing apparatus. The first calibration radius and the second calibration radius are used to divide the coordinate distribution area, and the target feature grid is screened according to the division result, including: The center point of the range area formed by the coordinate interval range corresponding to the coordinate distribution area is taken as the center, and the first calibration radius is used for circular area division to generate the first circular area; The x-coordinate value in the coordinate distribution area is called, and the average heat exposure x is obtained according to the x-coordinate value; The y-coordinate value in the coordinate distribution area is called, and the average maximum gradient of temperature change y is obtained according to the y-coordinate value; The target data point (x, y) is determined in the coordinate distribution area, and the second calibration radius is used for circular area division to generate the second circular area with the target data point (x, y) as the center; The data points distributed in the first circular area and the second circular area at the same time are called; The grid area corresponding to the data points distributed in the first circular area and the second circular area at the same time is taken as the target feature grid.

5. The method of claim 1, wherein the temperature of the printing and curing apparatus is controlled by a temperature control system. The target feature grid is used to obtain the adjusted target temperature in the temperature control process of the UV curing equipment, and the adjusted target temperature is compensated to obtain the compensated adjusted target temperature, and the UV curing equipment is temperature controlled according to the compensated adjusted target temperature, including: extracting a normalized temperature change characteristic parameter corresponding to the target feature grid; wherein the normalized temperature change characteristic parameter comprises a normalized maximum temperature change gradient and a heat exposure amount; obtaining a temperature compensation adjustment coefficient corresponding to the irradiation area on the substrate surface according to the normalized temperature change characteristic parameter of the target feature grid; performing temperature compensation on a target temperature obtained in a temperature control process of the UV curing equipment according to the temperature compensation adjustment coefficient to obtain a compensated target temperature; controlling the temperature of the UV curing equipment according to the compensated target temperature.

6. The method of claim 1 or 5, wherein the temperature of the printing and curing apparatus is controlled by a temperature control device. controlling the temperature of the UV curing equipment according to the compensated target temperature, comprising: obtaining a first comprehensive characteristic parameter corresponding to each target feature grid by using the normalized temperature change characteristic parameter corresponding to the target feature grid; obtaining a second comprehensive characteristic parameter of each non-target feature grid by using the normalized temperature change characteristic parameter corresponding to the non-target feature grid; determining whether each non-target feature grid has a target feature grid adjacent thereto, and integrating the non-target feature grid having no target feature grid adjacent thereto into a non-feature area; determining whether each target feature grid has a non-target feature grid adjacent thereto, and integrating the target feature grid having no non-target feature grid adjacent thereto into a feature area; when there is no non-feature area and feature area, setting a temperature control maximum allowable gradient by using the first comprehensive characteristic parameter corresponding to each target feature grid and the second comprehensive characteristic parameter of each non-target feature grid; when there is no non-feature area and / or feature area, setting a temperature control maximum allowable gradient by using the comprehensive characteristic parameter corresponding to the feature area and the non-feature area combined with the area of the feature area and the non-feature area; controlling the temperature of the UV curing equipment according to the temperature control maximum allowable gradient as a temperature control constraint condition and the compensated target temperature as a final target temperature.

7. A temperature control regulation system for a printing and curing apparatus, characterized by, The temperature control adjustment system of the printing curing equipment comprises: a data uploading module configured to upload printing data information corresponding to a current printing task to a database; a region division module configured to divide the irradiation area on the substrate surface of the UV curing equipment into a plurality of grid regions by using a first grid setting factor and a second grid setting factor, wherein the first grid setting factor is set by combining a first material parameter of the substrate with a minimum effective exposure time value under UV, and the second grid setting factor is set by combining a second material parameter of the substrate with a maximum allowable temperature gradient and a substrate conveying speed; a target feature grid obtaining module configured to obtain target feature grids by performing target grid screening according to real-time temperature change characteristic parameters of the grid regions, wherein the target feature grids are determined by screening according to a coordinate distribution region corresponding to a region temperature parameter, a first calibration radius, and a second calibration radius, and the coordinate distribution region is generated by using the corresponding heat exposure amount and the maximum temperature change gradient in each grid region; a target feature grid obtaining module configured to obtain target feature grids by performing target grid screening according to real-time temperature change characteristic parameters of the grid regions, wherein the target feature grids are determined by screening according to a coordinate distribution region corresponding to a region temperature parameter, a first calibration radius, and a second calibration radius, and the coordinate distribution region is generated by using the corresponding heat exposure amount and the maximum temperature change gradient in each grid region; The temperature compensation module is configured to obtain a temperature compensation adjustment coefficient corresponding to the irradiation area on the substrate surface according to a temperature variation characteristic parameter of a target feature grid; and perform temperature compensation according to an adjusted target temperature obtained in a temperature control process of the UV curing equipment to obtain a compensated adjusted target temperature. The first grid setting factor is obtained by using the first material parameter of the substrate and the minimum effective exposure time, and includes: The first material parameter included in the material parameter of the substrate is called from the database, and the first material parameter includes a material expansion coefficient and a material thermal conductivity; The minimum effective exposure time value under UV required by the printing process of the irradiation area on the substrate surface corresponding to the printing task is called, and the first grid setting factor is obtained by using the material expansion coefficient and the material thermal conductivity in combination with the minimum effective exposure time value under UV. The second grid setting factor is obtained by using the second material parameter of the substrate and the maximum allowed temperature gradient of the irradiation area on the substrate surface, and includes: The second material parameter included in the material parameter of the substrate is called from the database, and the second material parameter includes a material density and a material specific heat capacity; The maximum allowed temperature gradient of the irradiation area on the substrate surface is called, and the substrate conveying speed specified by the current printing task is called from the database; and the second grid setting factor is set by using the material density and the material specific heat capacity in combination with the maximum allowed temperature gradient and the substrate conveying speed. The target feature grid is obtained by performing target grid screening according to the real-time temperature variation characteristic parameter of the grid area, and includes: The temperature variation characteristic parameter of each grid area is called, and the temperature variation characteristic parameter includes a temperature variation maximum gradient and a heat exposure amount corresponding to the grid area; The temperature variation maximum gradient of each grid area is normalized to obtain a normalized temperature variation maximum gradient; and the heat exposure amount of each grid area is normalized to obtain a normalized heat exposure amount; A coordinate distribution area corresponding to the area temperature parameter is generated by taking the normalized heat exposure amount in each grid area as the abscissa and taking the normalized temperature variation maximum gradient corresponding to each grid area as the ordinate; The first calibration radius is obtained by using the local peak temperature occurring in each grid area, and the second calibration radius is obtained by using the temperature fluctuation standard deviation in each grid area; The coordinate distribution area is divided by using the first calibration radius and the second calibration radius, and the target feature grid is screened according to the division result.

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