High-frequency small planar transformer
By introducing cooling, anti-fracture, and spacing adjustment mechanisms into the planar transformer, the problems of insufficient heat dissipation and vibration shock resistance in high-frequency environments are solved, achieving more efficient heat dissipation and a longer service life, while also improving the transformer's flexibility and ease of maintenance.
Patent Information
- Application Number
- CN202511361269.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2045-09-23
AI Technical Summary
Existing planar transformers are prone to overheating in high-frequency environments, have insufficient resistance to vibration and shock, low heat dissipation efficiency, are difficult to maintain, and have easily broken pins, making them inflexible to adjust.
A high-frequency miniature planar transformer was designed, comprising a cooling mechanism, a fracture prevention mechanism, and a pitch adjustment mechanism. The cooling mechanism dissipates heat through fluorinated liquid circulation, the fracture prevention mechanism employs a nickel-titanium alloy reinforcement layer and a nano-silicon oxide coating, and the pitch adjustment mechanism achieves flexible adjustment through a gear and rack structure.
It improves heat dissipation efficiency, extends service life, enhances vibration resistance, and ensures the flexibility and ease of maintenance of the transformer.
Smart Images

Figure CN120854124A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of transformer technology, specifically to a high-frequency small planar transformer. Background Technology
[0002] A transformer is a static electrical device based on the principle of electromagnetic induction, used to regulate the voltage and current of alternating current. To adapt to the development trend of power electronics technology towards higher frequencies, smaller sizes, and greater integration, planar transformers are required, using multilayer printed circuit boards or flat copper sheets as windings and mounting the magnetic core on the PCB. This design effectively improves the transformer's performance, consistency, and power density in high-frequency environments. However, existing planar transformers have the following shortcomings: Existing transformer technologies prioritize high power density, resulting in compact device size but concentrated heat generation, which can easily lead to localized overheating, affecting the performance of the magnetic core and windings, and even damaging components. Reinforcement methods such as integrated mounting, binding, or adhesive application often result in insufficient resistance to vibration and shock, and make maintenance and replacement difficult. Furthermore, directly welded rigid leads are prone to micro-cracks at the solder joints or lead roots under the combined effects of thermal and mechanical stress, eventually leading to breakage and shortening service life. To adjust the interlayer capacitance of the transformer, existing technologies involve pressing different types and quantities of prepreg with a substrate under high temperature and pressure. The resin in the prepreg flows and completely fills the gaps, ultimately curing to form a robust multilayer board. However, this design, once finalized, cannot be changed, lacking flexibility. Additionally, the poor thermal conductivity of the resin means that interlayer heat transfer relies primarily on thermally conductive vias, affecting heat dissipation efficiency.
[0003] Therefore, we propose a high-frequency miniature planar transformer to address the problems mentioned above. Summary of the Invention
[0004] The purpose of this invention is to provide a high-frequency miniature planar transformer that achieves better heat dissipation and installation functions, longer service life, and more efficient adjustment functions by incorporating a cooling mechanism, an anti-breakage mechanism, and a spacing adjustment mechanism on the transformer, thereby solving the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-frequency small planar transformer, comprising a transformer body, the transformer body comprising a lower magnetic core, an upper magnetic core mounted on the top of the lower magnetic core, a substrate, a cooling mechanism and a spacing adjustment mechanism respectively disposed on the inner sides of the upper magnetic core and the lower magnetic core, and an anti-breakage mechanism mounted on the surface of the substrate; The upper and lower magnetic cores are both fitted with support columns on their inner middle portions. The cooling mechanism includes a cavity network installed at the bottom of the upper magnetic core. A condenser is installed inside the upper magnetic core. Delivery pipes are installed on both sides of the outer surface of the condenser. A water pump is installed on the outer surface of one set of delivery pipes, and the other end of the outer surface of the delivery pipe is installed at the top of the cavity network. Cooling fins are installed inside the condenser. A movable frame is slidably connected to the top of the lower magnetic core. A sliding groove is opened at the top of both the movable frame and the lower magnetic core. A first spring is fixedly installed at the bottom inner end of the sliding groove. A pull block is fixedly installed at one end of the outer surface of the first spring near the top of the movable frame. Positioning grooves are opened on both sides of the top of the upper magnetic core. Insert blocks are slidably connected to the inner side of the positioning grooves.
[0006] Preferably, the outer surface of the support column is provided with a groove.
[0007] Preferably, the cavity network is sleeved on the outer surface of the support column, and the inner side of the cavity network is filled with a high-performance fluorinated liquid, and the substrate is sleeved on the outer surface of the cavity network.
[0008] Preferably, the insert blocks are respectively installed at the bottom end of the pull block and on one side of the outer surface of the movable frame, and the insert blocks, pull blocks and movable frame are arranged in an inverted L-shape to achieve lateral and longitudinal limiting of the upper magnetic core's moving path.
[0009] Preferably, the anti-breakage mechanism includes a pin, which is mounted on the outer surface of the substrate, and a grounding plate is mounted at the bottom of the pin. The outer surface of the grounding plate has heat dissipation holes, and a reinforcing block is fixedly mounted on the inner side of the grounding plate. The other side of the outer surface of the reinforcing block is mounted on the outer surface of the pin.
[0010] Preferably, the inner surface of the pin is provided with a reinforcing layer, the reinforcing layer is made of nickel-titanium alloy, and the outer surface of the reinforcing layer is provided with a conductive layer, the conductive layer is made of tantalum alloy, and the outer surface of the conductive layer is provided with an insulating layer, the insulating layer is made of polytetrafluoroethylene, and both the insulating layer and the outer surface of the grounding piece are coated with a surface coating, the surface coating being made of nano-silicon oxide.
[0011] Preferably, the spacing adjustment mechanism includes a rubber pad, which is slidably connected to the inner side of the lower magnetic core and the upper magnetic core. A second spring is fixedly installed on the outer surface of multiple sets of rubber pads. A connecting frame is fixedly installed on the top of one set of rubber pads, and a threaded rod is installed on the top of the connecting frame. A storage groove is opened on the inner surface of both the lower magnetic core and the upper magnetic core.
[0012] Preferably, the connecting frame is slidably connected to the inner side of the storage slot, a driven gear is fixedly installed at one end of the outer surface of the threaded rod, a rack is rotatably connected to the outer surface of the driven gear, a protective cover is sleeved on the outer surface of the rack, and a telescopic cylinder is fixedly installed at the bottom end of the protective cover and the outer surface of the rubber pad.
[0013] Preferably, the inner middle part of the rack is rotatably connected to a drive gear, and a knob is fixedly installed at one end of the outer surface of the drive gear. The driven gear, the rack, and the drive gear mesh with each other.
[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention achieves superior heat dissipation and installation functions through the design of a cooling mechanism. First, the substrate is placed on the lower magnetic core, and the movable frame and pull block are pulled to stretch the first spring. Then, the upper magnetic core is placed on the lower magnetic core, and the movable frame and pull block are released. The first spring returns to its original position and moves, causing the insert block to engage with the positioning groove to form an inverted L-shaped layout, thus limiting the upper magnetic core laterally and longitudinally. This design ensures convenient maintenance and improves the transformer body's resistance to vibration and impact. When the transformer body is running, the grooves in the support columns facilitate air circulation, and the heat of the substrate is concentrated in the middle. Through contact with the cavity network, the high-performance fluorinated liquid inside absorbs heat and changes from liquid to gas. After the phase change, the high-performance fluorinated liquid enters the condenser through the delivery pipe, is cooled by the cooling fins and changes back to liquid, and then circulates back to the cavity network through the water pump and delivery pipe, realizing continuous heat dissipation of the substrate, avoiding local overheating, and improving heat dissipation efficiency.
[0015] 2. This invention incorporates an anti-breakage mechanism, resulting in a longer service life. The pins are reinforced with a nickel-titanium alloy shape memory alloy layer, which has high specific strength and excellent corrosion resistance, and can recover its original shape under temperature changes. A tantalum alloy conductive layer is used to ensure excellent conductivity at high temperatures. A polytetrafluoroethylene insulating layer is provided, offering good insulation and durability under high temperature and high voltage. A nano-silica superhydrophobic surface coating is applied to prevent the intrusion of moisture and corrosive substances, improving corrosion resistance and durability, and extending service life. At the same time, the triangular reinforcing block design enhances the stable connection between the pins and the grounding plate, and the heat dissipation holes on the grounding plate increase the heat dissipation area.
[0016] 3. This invention incorporates a spacing adjustment mechanism, enabling more efficient adjustment. When adjusting the substrate spacing, rotating the knob drives the drive gear to rotate, which in turn drives the rack and driven gear to rotate synchronously. The driven gear drives the threaded rod to rotate, pushing the connecting frame to move inside the storage slot. The connecting frame causes the rubber pads to shift, triggering the extension and retraction of the second springs. The force generated by the extension and compression of multiple sets of second springs is evenly distributed among multiple sets of rubber pads, ensuring that the rubber pads move synchronously and have consistent spacing. The telescopic cylinder provides stable support for the movement of the rubber pads and the protective cover, ultimately achieving rubber pad spacing adjustment. This enhances the flexibility of the transformer body and facilitates airflow and efficient heat dissipation between substrates. Attached Figure Description
[0017] Figure 1 This is a perspective view of the front structure of a high-frequency small planar transformer according to the present invention; Figure 2 This is a three-dimensional view of the disassembled structure of a high-frequency small planar transformer according to the present invention; Figure 3 This is a three-dimensional view of the disassembled structure of the cooling mechanism in a high-frequency small planar transformer according to the present invention; Figure 4 This is a partial cross-sectional perspective view of the cavity network in a high-frequency small planar transformer according to the present invention. Figure 5 This is a side view of the substrate structure in a high-frequency small planar transformer according to the present invention. Figure 6 This is a three-dimensional cross-sectional view of the pin structure in a high-frequency small planar transformer according to the present invention; Figure 7 This is a three-dimensional view of the split structure of the spacing adjustment mechanism for a high-frequency small planar transformer according to the present invention; Figure 8 This is a three-dimensional cross-sectional view of a high-frequency miniature planar transformer according to the present invention; Figure 9 This invention relates to a high-frequency miniature planar transformer. Figure 8 Enlarged 3D view of the structure at point A.
[0018] In the diagram: 1. Transformer body; 101. Lower magnetic core; 102. Upper magnetic core; 103. Support column; 104. Base plate; 2. Cooling mechanism; 201. Cavity network; 202. Condenser; 203. Delivery pipe; 204. Water pump; 205. Cooling fins; 206. Movable frame; 207. Slide groove; 208. Pull block; 209. First spring; 210. Positioning groove; 211. Insert block; 3. Anti-breakage mechanism; 301. Pin; 30 2. Grounding plate; 303. Heat dissipation hole; 304. Reinforcing block; 305. Surface coating; 306. Reinforcing layer; 307. Conductive layer; 308. Insulating layer; 4. Spacing adjustment mechanism; 401. Rubber pad; 402. Second spring; 403. Connecting frame; 404. Threaded rod; 405. Driven gear; 406. Rack; 407. Driven gear; 408. Knob; 409. Protective cover; 410. Telescopic cylinder; 411. Storage slot. Detailed Implementation
[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0020] Please see the appendix Figure 1 -Attached Figure 9 As shown, the present invention provides a technical solution: a high-frequency small planar transformer, including a transformer body 1, the transformer body 1 including a lower magnetic core 101, an upper magnetic core 102 installed at the top of the lower magnetic core 101, a substrate 104, a cooling mechanism 2 and a spacing adjustment mechanism 4 respectively provided on the inner sides of the upper magnetic core 102 and the lower magnetic core 101, and an anti-breakage mechanism 3 installed on the surface of the substrate 104.
[0021] Example 1, according to Figure 1-4As shown, support columns 103 are fitted onto the inner middle portions of both the upper magnetic core 102 and the lower magnetic core 101. The cooling mechanism 2 includes a cavity network 201, which is installed at the bottom end of the upper magnetic core 102. A condenser 202 is installed inside the upper magnetic core 102. Delivery pipes 203 are installed on both sides of the outer surface of the condenser 202. A water pump 204 is installed on the outer surface of one set of delivery pipes 203, and the other end of the outer surface of the delivery pipe 203 is installed at the top of the cavity network 201. Cooling fins 205 are installed inside the condenser 202. A movable frame 206 is slidably connected to the top of the lower magnetic core 101. A groove 207 is opened on the top of both the movable frame 206 and the lower magnetic core 101. The bottom end of the inner side of the groove 207 is fixedly installed. A first spring 209 is provided, and a pull block 208 is fixedly installed on one end of the outer surface of the first spring 209 near the top of the movable frame 206. Positioning grooves 210 are provided on both sides of the top of the upper magnetic core 102. Insert blocks 211 are slidably connected to the inner side of the positioning grooves 210. A groove is provided on the outer surface of the support column 103. A cavity network 201 is sleeved on the outer surface of the support column 103, and the inner side of the cavity network 201 is filled with high-performance fluorinated liquid. A substrate 104 is sleeved on the outer surface of the cavity network 201. Insert blocks 211 are respectively installed on the bottom end of the pull block 208 and one side of the outer surface of the movable frame 206. The insert blocks 211, pull blocks 208 and movable frame 206 are arranged in an inverted L-shape to achieve lateral and longitudinal limiting of the movement path of the upper magnetic core 102.
[0022] The overall effect of Embodiment 1 is as follows: it achieves superior heat dissipation and installation functions. First, the substrate 104 is placed on the lower magnetic core 101, and the movable frame 206 and the pull block 208 are pulled, causing the movable frame 206 and the pull block 208 to drive the first spring 209 to stretch. Then, the upper magnetic core 102 is placed on the lower magnetic core 101. At this time, the movable frame 206 and the pull block 208 are released, and the reset of the first spring 209 will drive it to move, so that the insert 211 is engaged in the positioning groove 210, forming an inverted L-shaped layout, thereby limiting the movement path of the upper magnetic core 102 laterally and longitudinally. This design ensures convenient maintenance while improving the vibration and shock resistance of the transformer body 1. During operation, the grooves in the support column 103 facilitate air circulation, and the heat generated by the substrate 104 is mainly concentrated in the middle part. Through the contact between the substrate 104 and the cavity network 201, the high-performance fluorinated liquid inside absorbs heat and changes from liquid to gas. The high-performance fluorinated liquid after phase change enters the condenser 202 through the delivery pipe 203. With the help of the condenser 202, the cooling fins 205 cool it, so that the gaseous fluorinated liquid is converted back into liquid. Then, the liquid high-performance fluorinated liquid is circulated back into the cavity network 201 through the water pump 204 and the delivery pipe 203, realizing continuous heat dissipation of the substrate 104, effectively avoiding local overheating of the transformer body 1, and significantly improving the heat dissipation efficiency of the transformer body 1.
[0023] Example 2, according to Figure 2 , Figure 5 and Figure 6 As shown, the anti-fracture mechanism 3 includes a pin 301, which is mounted on the outer surface of the substrate 104. A grounding plate 302 is mounted at the bottom of the pin 301. A heat dissipation hole 303 is opened on the outer surface of the grounding plate 302. A reinforcing block 304 is fixedly mounted on the inner side of the grounding plate 302. The other side of the outer surface of the reinforcing block 304 is mounted on the outer surface of the pin 301. A reinforcing layer 306 is provided on the inner surface of the pin 301. The reinforcing layer 306 is made of nickel-titanium alloy. A conductive layer 307 is provided on the outer surface of the reinforcing layer 306. The conductive layer 307 is made of tantalum alloy. An insulating layer 308 is provided on the outer surface of the conductive layer 307. The insulating layer 308 is made of polytetrafluoroethylene. Both the insulating layer 308 and the outer surface of the grounding plate 302 are coated with a surface coating 305, which is made of nano-silicon oxide.
[0024] The overall effect of Embodiment 2 is as follows: it achieves a longer service life. The pin 301 is reinforced with a shape memory alloy layer 306 made of nickel-titanium alloy, which achieves high specific strength and excellent corrosion resistance and can recover its original shape under temperature changes. In addition, the conductive layer 307 made of tantalum alloy ensures that it maintains excellent conductivity in high-temperature environments. The pin 301 is also equipped with a polytetrafluoroethylene insulating layer 308, which exhibits excellent insulation and durability under high temperature and high voltage conditions. By applying a superhydrophobic surface coating 305 made of nano-silica, it effectively prevents moisture and corrosive substances from penetrating the surface of the pin 301, further improving its corrosion resistance and durability, thereby extending the service life of the pin 301. At the same time, the design of the triangular reinforcing block 304 enhances the stable connection between the pin 301 and the grounding plate 302, while the heat dissipation holes 303 on the grounding plate 302 increase the limited heat dissipation area.
[0025] Example 3, according to Figure 2 , Figure 7-9As shown, the spacing adjustment mechanism 4 includes a rubber pad 401, which is slidably connected to the inner side of the lower magnetic core 101 and the upper magnetic core 102. A second spring 402 is fixedly installed on the outer surface of multiple sets of rubber pads 401. A connecting frame 403 is fixedly installed at the top of one set of rubber pads 401, and a threaded rod 404 is installed at the top of the connecting frame 403. A storage groove 411 is formed on the inner surface of both the lower magnetic core 101 and the upper magnetic core 102. The connecting frame 403 is slidably connected to the inner side of the storage groove 411. The threaded rod 404... A driven gear 405 is fixedly installed on one end of the outer surface of 04. A rack 406 is rotatably connected to the outer surface of the driven gear 405. A protective cover 409 is fitted on the outer surface of the rack 406. Telescopic cylinders 410 are fixedly installed on the bottom end of the protective cover 409 and the outer surface of the rubber pad 401. A driving gear 407 is rotatably connected to the middle part of the inner side of the rack 406. A knob 408 is fixedly installed on one end of the outer surface of the driving gear 407. The driven gear 405, the rack 406 and the driving gear 407 mesh with each other.
[0026] The overall effect of Embodiment 3 is as follows: it achieves a more efficient adjustment function. When it is necessary to adjust the spacing of the substrates 104, the rotary knob 408 can be used to drive the drive gear 407 to rotate, which in turn drives the rack 406 and the driven gear 405 to rotate synchronously. Then, the driven gear 405 drives the threaded rod 404 to rotate, which pushes the connecting frame 403 to move inside the receiving groove 411. The movement of the connecting frame 403 further drives the rubber pad 401 to move, which in turn causes the second spring 402 to expand and contract. The force generated by the stretching and compression of multiple sets of second springs 402 is evenly distributed by multiple sets of rubber pads 401, ensuring that each rubber pad 401 moves synchronously and has a consistent spacing. The telescopic cylinder 410 provides stable support for the movement of the rubber pads 401 and the protective cover 409, and finally realizes the adjustment of the spacing of the rubber pads 401. This not only improves the flexibility of the transformer body 1, but also helps the air circulation and efficient heat dissipation between the substrates 104.
[0027] The working principle of the entire device is as follows: During the operation of the transformer, the substrate 104 is first placed on the lower magnetic core 101, and the movable frame 206 and the pull block 208 are pulled, causing the movable frame 206 and the pull block 208 to drive the first spring 209 to stretch. Then, the upper magnetic core 102 is placed on the lower magnetic core 101. At this time, the movable frame 206 and the pull block 208 are released, and the reset of the first spring 209 will drive it to move, so that the insertion block 211 is engaged in the positioning groove 210 and forms an inverted L-shaped layout, which limits the movement path of the upper magnetic core 102 laterally and longitudinally. Under the premise of convenient maintenance, the vibration and impact resistance of the transformer body 1 is improved. When the transformer body 1 is running, the groove opened in the support column 103 facilitates the air circulation, and the base The heat generated by the substrate 104 is concentrated in the middle part. Through contact between the substrate 104 and the cavity network 201, the high-performance fluorinated liquid inside absorbs heat and changes from a liquid to a gaseous state. Then, the phase-change high-performance fluorinated liquid enters the condenser 202 through the delivery pipe 203, and the condenser 202 drives the cooling fins 205 to cool it, causing the gaseous high-performance fluorinated liquid to return to a liquid state. Subsequently, the liquid high-performance fluorinated liquid is circulated back into the cavity network 201 by the water pump 204 and the delivery pipe 203, completing the continuous heat dissipation of the substrate 104, avoiding local overheating of the transformer body 1, and improving the heat dissipation efficiency of the transformer body 1. The pin 301 uses a shape memory alloy reinforcement layer 306 made of nickel-titanium alloy, giving it high specific strength and... Excellent corrosion resistance and the ability to recover its original shape under temperature changes are achieved through a tantalum alloy conductive layer 307, which maintains excellent conductivity at high temperatures. A polytetrafluoroethylene insulating layer 308 provides excellent insulation and durability under high temperature and high voltage conditions. A superhydrophobic surface coating 305 made of nano-silica effectively prevents moisture and corrosive substances from entering the pin 301 surface, improving its corrosion resistance and durability, thus extending the lifespan of the pin 301. A triangular reinforcing block 304 enhances the stability between the pin 301 and the grounding plate 302. Heat dissipation holes 303 on the grounding plate 302 increase the limited heat dissipation area. Adjustments to the spacing of the substrate 104 can be made using knob 408. The driving gear 407 rotates, which in turn drives the rack 406 and driven gear 405 to rotate. The driven gear 405 then drives the threaded rod 404 to rotate, causing the threaded rod 404 to move the connecting frame 403 inside the receiving groove 411. The connecting frame 403 then moves the rubber pads 401. The movement of the rubber pads 401 causes the second springs 402 to extend and retract. The force from the extension and compression of the multiple sets of second springs 402 is evenly distributed among the multiple sets of rubber pads 401, allowing the rubber pads 401 to move simultaneously with consistent spacing. The telescopic cylinder 410 supports the movement of the rubber pads 401 and the protective cover 409, thus adjusting the spacing of the rubber pads 401 and improving the flexibility of the transformer body 1.This facilitates airflow and heat dissipation between the substrates 104.
[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A high-frequency miniature planar transformer, comprising a transformer body (1), characterized in that: The transformer body (1) includes a lower magnetic core (101), an upper magnetic core (102) is installed at the top of the lower magnetic core (101), a base plate (104), a cooling mechanism (2) and a spacing adjustment mechanism (4) are respectively provided on the inner sides of the upper magnetic core (102) and the lower magnetic core (101), and an anti-breakage mechanism (3) is installed on the surface of the base plate (104). The upper magnetic core (102) and the lower magnetic core (101) are both fitted with support columns (103) in the middle of their inner sides. The cooling mechanism (2) includes a cavity network (201), which is installed at the bottom of the upper magnetic core (102). A condenser (202) is installed inside the upper magnetic core (102). Delivery pipes (203) are installed on both sides of the outer surface of the condenser (202). A water pump (204) is installed on the outer surface of one set of delivery pipes (203), and the other end of the outer surface of the delivery pipes (203) is installed at the top of the cavity network (201). Cooling fins (205) are installed on the inner side of the device (202). A movable frame (206) is slidably connected to the top of the lower magnetic core (101). A sliding groove (207) is opened on the top of both the movable frame (206) and the lower magnetic core (101). A first spring (209) is fixedly installed on the bottom inner side of the sliding groove (207). A pull block (208) is fixedly installed on one end of the outer surface of the first spring (209) near the top of the movable frame (206). A positioning groove (210) is opened on both sides of the top of the upper magnetic core (102). An insert block (211) is slidably connected to the inner side of the positioning groove (210).
2. The high-frequency miniature planar transformer according to claim 1, characterized in that: The outer surface of the support column (103) is provided with a groove.
3. The high-frequency miniature planar transformer according to claim 1, characterized in that: The cavity network (201) is sleeved on the outer surface of the support column (103), and the inner side of the cavity network (201) is filled with high-performance fluorinated liquid. The substrate (104) is sleeved on the outer surface of the cavity network (201).
4. The high-frequency miniature planar transformer according to claim 1, characterized in that: The insert (211) is installed at the bottom of the pull block (208) and on one side of the outer surface of the movable frame (206), and the insert (211), pull block (208) and movable frame (206) are arranged in an inverted L-shape to achieve lateral and longitudinal limiting of the movement path of the upper magnetic core (102).
5. The high-frequency miniature planar transformer according to claim 1, characterized in that: The anti-fracture mechanism (3) includes a pin (301), which is mounted on the outer surface of the substrate (104). A grounding plate (302) is mounted at the bottom of the pin (301). A heat dissipation hole (303) is opened on the outer surface of the grounding plate (302). A reinforcing block (304) is fixedly mounted on the inner side of the grounding plate (302). The other side of the outer surface of the reinforcing block (304) is mounted on the outer surface of the pin (301).
6. The high-frequency miniature planar transformer according to claim 5, characterized in that: The inner surface of the pin (301) is provided with a reinforcing layer (306), the material of the reinforcing layer (306) is nickel-titanium alloy, and the outer surface of the reinforcing layer (306) is provided with a conductive layer (307), the material of the conductive layer (307) is tantalum alloy, and the outer surface of the conductive layer (307) is provided with an insulating layer (308), the material of the insulating layer (308) is polytetrafluoroethylene, and the outer surfaces of the insulating layer (308) and the grounding piece (302) are both coated with a surface coating (305), the material of the surface coating (305) is nano-silicon oxide.
7. The high-frequency miniature planar transformer according to claim 1, characterized in that: The spacing adjustment mechanism (4) includes a rubber pad (401), which is slidably connected to the inner side of the lower magnetic core (101) and the upper magnetic core (102). A second spring (402) is fixedly installed on the outer surface of multiple sets of rubber pads (401). A connecting frame (403) is fixedly installed on the top of one set of rubber pads (401). A threaded rod (404) is installed on the top of the connecting frame (403). A storage groove (411) is opened on the inner surface of the lower magnetic core (101) and the upper magnetic core (102).
8. The high-frequency miniature planar transformer according to claim 7, characterized in that: The connecting frame (403) is slidably connected to the inner side of the storage groove (411). A driven gear (405) is fixedly installed on one end of the outer surface of the threaded rod (404). A rack (406) is rotatably connected to the outer surface of the driven gear (405). A protective cover (409) is sleeved on the outer surface of the rack (406). A telescopic cylinder (410) is fixedly installed on the bottom end of the protective cover (409) and the outer surface of the rubber pad (401).
9. The high-frequency miniature planar transformer according to claim 8, characterized in that: The inner middle part of the rack (406) is rotatably connected to the drive gear (407), and a knob (408) is fixedly installed on one end of the outer surface of the drive gear (407). The driven gear (405), the rack (406) and the drive gear (407) mesh with each other.
Citation Information
Patent Citations
Planar transformer
CN112271058A
Heat pipe heat dissipation device and medium-frequency transformer
CN117476326A
Safe sealed electronic transformer
CN118039300A
Heat sink is used in dry -type transformer processing
CN208315373U
Planar wire-wound transformer and manufacturing method therefor
WO2022133662A1
Cited By
Laminated high-frequency miniature transformer
CN121528690A
A laminated high-frequency micro transformer
CN121528690B
Miniature planar transformer capable of being flexibly adjusted
CN121545891A
A flexibly adjustable micro planar transformer
CN121545891B
Planar transformer
CN122136144A
