Earphone and audio device

Abstract

The invention provides an earphone and an audio device. The earphone comprises a first earphone body, a second earphone body and a connecting arm, wherein the connecting arm is connected with the first earphone body and the second earphone body. The first earphone body includes a housing and a speaker. The housing is provided with a sound outlet hole and a rear discharge hole. The loudspeaker is arranged in the inner space of the shell and divides the inner space of the shell into a first space and a second space, the sound outlet hole of the shell is communicated with the first space and the outside, and the rear discharge hole of the shell is communicated with the second space and the outside. The loudspeaker comprises a first vibrating diaphragm, a first channel is formed in the side, opposite to the sound outlet hole, of the first vibrating diaphragm, a first opening is formed in the peripheral side of the loudspeaker, the first opening is communicated with the first channel, and the first channel is communicated with the second space. According to the embodiment of the invention, the first channel is communicated with the second space at the periphery of the loudspeaker through the first opening, the rear leakage path through which the gas extruded by the vibration of the first vibrating diaphragm passes is short, and the equivalent sound load corresponding to the second space of the first earphone body is smaller, so that the loudness of the loudspeaker can be improved.

Description

Technical Field

[0001] This application relates to the field of headphones, and more particularly to a headphone and an audio device. Background Technology

[0002] Clip-on wireless earbuds can be held in place by the ear, reducing ear canal allergies and damage. Users can be aware of changes in their surroundings at any time, reducing the risk of accidents. They are suitable for prolonged wear during exercise, commuting, and daily work. Clip-on wireless earbuds consist of a first earbud body, a connecting arm, and a second earbud body, with the connecting arm connecting the first and second earbud bodies. The first earbud body is located inside the user's ear, and the second earbud body is located behind the user's ear, held in place by the clip arm. Improving the sound quality of clip-on wireless earbuds and providing a better user experience is a problem that continues to be explored and researched. Summary of the Invention

[0003] This application provides a pair of headphones and an audio device with better sound quality.

[0004] In a first aspect, embodiments of this application provide an earphone. The earphone includes a first earphone body, a second earphone body, and a connecting arm, the connecting arm connecting the first earphone body and the second earphone body. The first earphone body includes a housing and a speaker. The housing has a sound outlet and a rear vent. The speaker is disposed within the interior space of the housing, dividing the interior space of the housing into a first space and a second space. The sound outlet of the housing communicates with the first space and the outside, and the rear vent of the housing communicates with the second space and the outside. The speaker includes a first diaphragm, the side of the first diaphragm facing away from the sound outlet having a first channel, and the periphery of the speaker having a first opening communicating with the first channel, the first channel communicating with the second space.

[0005] Understandably, the first channel is a channel for the first diaphragm to vent out the gas squeezed out during the vibration of the first diaphragm. Compared to the first opening located on the side of the speaker facing the sound outlet, in this embodiment, the first channel is located on the periphery of the speaker and connects to the second space through the first opening. The venting path of the gas squeezed by the vibration of the first diaphragm is shorter, and the connection between the first diaphragm and the outside world is smoother during venting. The equivalent acoustic load corresponding to the second space of the first earphone body is smaller, which helps to improve the loudness of the speaker and makes the sound production of the earphone better.

[0006] Furthermore, compared to providing a first opening on the side of the speaker facing away from the sound outlet for gas exhaust, this embodiment eliminates the need for additional clearance space on that side for smooth gas exhaust, thus facilitating miniaturization of the entire headphone unit. For example, in a single-diaphragm scenario, if a vent hole is provided on the side of the speaker facing away from the sound outlet, the vented gas from the diaphragm will connect to the vent hole on the outer shell through an opening on the speaker cover. However, to prevent the vented gas from being blocked, additional space is usually required above the speaker cover, which hinders the miniaturization of the entire headphone unit. By using the first opening on the side as described in this embodiment, additional space above the speaker cover for smooth gas exhaust is avoided, improving the overall space utilization of the headphone unit.

[0007] In one possible implementation, the first channel is tilted.

[0008] In one possible implementation, the first channel includes a third through-hole communicating with the second space, and the third through-hole is angled. It should be understood that "angled" refers to an angle with respect to the thickness direction (X) of the speaker. For example, Figure 7A The third through hole 255 is set at an angle.

[0009] By setting the first channel or the third through hole at an angle, since the third through hole is connected to the second space, the gas squeezed by the diaphragm vibration is less affected by the outer shell after reaching the second space through the third through hole (for example, the gas is reflected back to the third through hole by the outer shell), and the gas is expelled more smoothly, resulting in better sound production of the headphones.

[0010] In one possible implementation, the first channel includes a fourth through-hole extending along the thickness direction of the loudspeaker, the fourth through-hole being located between the third through-hole and the diaphragm.

[0011] Since the diaphragm vibrates along the X direction of the speaker thickness, in order to improve the efficiency of gas removal, the fourth through hole near the diaphragm side is configured to extend in the direction of diaphragm vibration or along the direction of speaker thickness.

[0012] In one possible implementation, the first earphone body further includes a seal. The seal connects the housing and the speaker, sealing the gap between the housing and the speaker. The seal is located on the side of the first opening closest to the first space.

[0013] Understandably, by using a seal to fill the gap between the housing and the speaker, the first and second spaces are separated, preventing a short circuit caused by the connection between the two spaces. This allows the energy generated by the diaphragm compressing air to be transferred to the ear canal more efficiently, reducing sound leakage. For example, it can reduce low-frequency sound leakage in the 20Hz to 200Hz range, significantly improving the depth and power of the speaker's bass. The seal is located on the side of the first opening closest to the first space, allowing the first opening to connect to the second space without blocking the back leakage channel of the first diaphragm.

[0014] In one possible implementation, the housing includes a first housing and a second housing. The first and second housings are arranged in the same direction as the first and second spaces. A seal also connects the first and second housings.

[0015] It is understandable that the seal can also be used to connect the first shell and the second shell, so that no additional connection structure is needed between the first shell and the second shell, which helps to save internal space of the shell and thus helps to reduce the volume of the first earphone body.

[0016] In one possible implementation, the housing also includes a bump. The bump is fixed to the inside of the second housing. The bump is located on the side of the first opening closer to the first space, and a seal connects to the surface of the bump facing the first space.

[0017] Understandably, the protrusion is located on the side of the first opening closer to the first space to prevent it from obstructing the leakage path of the first diaphragm through the first opening. The sealing element connects to the surface of the protrusion facing the first space. By setting the protrusion, the connection area between the first shell and the second shell can be increased, making the connection between the first shell and the second shell more reliable. The protrusion can also be used to isolate the first space and the second space, preventing acoustic short circuits caused by the connection between the first space and the second space. The energy generated by the diaphragm compressing air can be transferred to the ear canal more efficiently, reducing sound leakage. For example, it can reduce low-frequency sound leakage in the 20Hz to 200Hz range, significantly improving the depth and power of the speaker's bass extension. In some embodiments, setting the protrusion can make the gap near the periphery of the speaker smaller. The protrusion can also be used to position the speaker, reducing the risk of the speaker shaking and colliding within the internal space of the housing.

[0018] In one possible implementation, the seal is a rubber component.

[0019] Understandably, adhesive components may include cured adhesives. Cured adhesives, also known as bonding agents, are bonding materials that can cure from a liquid state into a strong, gel-like substance upon contact with air or under specific conditions. For example, seals may include one or more of ultraviolet-curing adhesives (UV adhesives), infrared-curing adhesives, and moisture-curing adhesives.

[0020] In one possible implementation, the sealant is an adhesive dispensing component.

[0021] Understandably, the seal is formed by curing glue. During the curing process, the glue is fluid and can effectively fill and cover the gap between the speaker and the housing, resulting in a better seal between the speaker and the housing.

[0022] In one possible implementation, the second housing is provided with an overflow groove. The opening of the overflow groove is located on the end face of the second housing facing the first housing. The sealing portion is located within the overflow groove, and the overflow groove and the first opening are offset.

[0023] Understandably, when the seal is an adhesive-applied component, it is fluid before it cures. By setting an overflow groove on the second shell, during the speaker assembly process, when the second shell is installed on the first shell, the adhesive can flow to the overflow groove during pressure holding, preventing the adhesive from overflowing into the second shell, blocking the first opening, and affecting the back leakage of the first diaphragm.

[0024] In one possible implementation, the housing also includes a retaining wall. The retaining wall is fixed to the inside of the first housing, and the speaker is mounted on the retaining wall.

[0025] Understandably, when the sealant is an adhesive-applied component, it remains fluid before curing. By creating a baffle, the gap between the speaker and the housing can be reduced, preventing adhesive from overflowing into the primary space and affecting the speaker's normal operation. For example, it prevents adhesive from adhering to the first diaphragm and interfering with its vibration. Furthermore, the baffle increases the fixed connection area of ​​the speaker, improving the reliability of the speaker's connection to the housing. Additionally, the baffle can be used to position the speaker during installation, reducing the risk of speaker movement within the housing.

[0026] In one possible implementation, the retaining wall and the first shell enclose a receiving groove. The seal is at least partially located within the receiving groove and is fixedly connected to the retaining wall.

[0027] Understandably, the retaining wall and the first housing enclose a receiving groove. When the sealant is an adhesive-applied component, the receiving groove can hold residual adhesive before the adhesive cures. After the adhesive cures, it forms a sealant, which is at least partially located within the receiving groove and is fixedly connected to the retaining wall. By enclosing the receiving groove with the retaining wall and the first housing, more adhesive can remain between the first housing and the speaker, which is beneficial to the reliability of the connection between the speaker and the first housing. Furthermore, more adhesive can better fill the gap between the housing and the speaker, resulting in a better sealing effect. When the sealant is an adhesive-applied component, it is fluid before curing. By setting up the retaining wall, the gap between the speaker and the housing can be made smaller, and adhesive is less likely to overflow into the first space, affecting the normal operation of the speaker. For example, it prevents adhesive from sticking to the first diaphragm and interfering with its vibration.

[0028] In one possible implementation, the outer casing has a recess. The recess connects the first opening and the second space.

[0029] Understandably, by creating a groove, the space between the housing and the first opening of the speaker is increased, thus avoiding the first opening. This allows for a larger backflow path for the gas compressed by the vibration of the first diaphragm, facilitating the passage of the backflow gas from the first diaphragm. For example, the groove can be formed by removing adhesive from the housing.

[0030] In one possible implementation, the outer surface of the first earphone body is spherical. The outer surface of the first earphone body has a central axis. The central axis passes through the connection point between the connecting arm and the first earphone body. The rear vent hole and the first opening of the housing both pass through a first plane. The central axis lies within the first plane.

[0031] Understandably, compared to the solution where the first opening and the rear vent hole of the outer shell are not on the same cross section, this embodiment sets the rear vent hole of the outer shell and the first opening on the same cross section. The rear vent path of the gas squeezed by the vibration of the first diaphragm is shorter, and the gas squeezed by the vibration of the first diaphragm is more smoothly connected with the outside when it is vented. The equivalent acoustic load corresponding to the second space of the first earphone body will be smaller, which is beneficial to improving the loudness of the speaker.

[0032] In one possible implementation, the loudspeaker also includes a frame to which the first diaphragm is fixedly connected. A first opening is located on the frame. Thus, the frame can be used to fix the first diaphragm.

[0033] In one possible implementation, the first earphone body also includes a bone sensor and a baffle. Both the bone sensor and the baffle are mounted inside the housing. The bone sensor is located on the side of the speaker away from the sound outlet of the housing. The baffle is at least partially located on the side of the bone sensor closer to the speaker.

[0034] Understandably, bone sensors can be used to pick up vibrations when a user speaks, thus improving call noise reduction. Understandably, a baffle, at least partially located on the side of the bone sensor closer to the speaker, can be used to block backflow of gas from the speaker, preventing it from interfering with the bone sensor's operation.

[0035] In one possible implementation, the outer surface of the first earphone body is spherical, and the outer surface of the first earphone body has a central axis passing through the connection point between the connecting arm and the first earphone body. The number of rear vent holes in the housing is two, and the two rear vent holes are rotationally symmetrical about the central axis.

[0036] It is understandable that by arranging the two rear vent holes symmetrically about the central axis, the two rear vent holes can form a dipole, generating a sound wave in the opposite direction to the sound emitted by the speaker, which can reduce the sound leakage of the first earphone body.

[0037] In one possible implementation, the outer surface of the first earphone body is spherical, and the outer surface of the first earphone body has a central axis passing through the connection position between the connecting arm and the first earphone body. The sound outlet of the outer shell is offset from the central axis. The outer shell has one sound outlet; or, the outer shell has multiple sound outlets, and the multiple sound outlets of the outer shell are rotationally symmetrical about the central axis.

[0038] It is understandable that when the earphone is clipped onto a user's ear, the central axis of the first earphone extends in roughly the same direction as the ear canal. If the sound outlet of the outer shell faces the same direction as the central axis of the first earphone, the sound outlet is easily clogged by dust and oil. In this embodiment, the sound outlet of the outer shell can be offset from the central axis, which can effectively reduce the accumulation of dust and oil in the sound outlet and prevent clogging.

[0039] Furthermore, when the sound outlet of the housing can be offset from the central axis, more space can be provided at the bottom of the housing to place the feedback microphone. This facilitates the downward movement of the feedback microphone, and the pickup channel can be set on one side of the feedback microphone. The space originally used for setting the sound channel below the feedback microphone can be saved, which helps to save internal space of the housing and facilitates the miniaturization of the first earphone body.

[0040] In one possible implementation, the outer surface of the first earphone body is spherical, and the outer surface of the first earphone body has a central axis passing through the connection position between the connecting arm and the first earphone body. The housing is provided with a perforated area, and the sound outlet includes a plurality of sub-holes, which are spaced apart in the perforated area, are rotationally symmetrical about the central axis, and at least some of the sub-holes are offset from the central axis.

[0041] It is understandable that when the earphones are clipped onto a user's ear, the central axis of the first earphone body extends in roughly the same direction as the ear canal. If the sound outlet of the outer shell is oriented in the same direction as the central axis of the first earphone body, the sound outlet is easily clogged by dust and oil. In this embodiment, the sub-holes offset from the central axis are less prone to dust and oil accumulation, and even if some sub-holes are blocked, it will not affect the sound output of the earphones.

[0042] In one possible implementation, the outer surface of the first earphone body is spherical, and the outer surface of the first earphone body has a central axis passing through the connection point between the connecting arm and the first earphone body. The first earphone body also includes a feedback microphone and a second bracket. Both the feedback microphone and the second bracket are located within a first space. The second bracket is fixedly connected to the outer shell. The feedback microphone is mounted on the second bracket. The second bracket has a pickup channel. The pickup channel connects the sound outlet of the outer shell and the pickup port of the feedback microphone. The pickup port of the feedback microphone faces the speaker, and the pickup channel portion is located between the feedback microphone and the speaker; alternatively, the pickup port of the feedback microphone faces a second direction, which forms an angle with the central axis.

[0043] Understandably, the pickup channel can be located to one side of the feedback microphone, eliminating the space below the feedback microphone that was originally intended for the pickup channel. This saves internal space in the housing and facilitates miniaturization of the first earphone unit. Furthermore, the space previously used for the pickup channel can be used for the feedback microphone, which can be moved downwards, away from the speaker. This increased distance between the feedback microphone and the speaker's first diaphragm prevents the feedback microphone from obstructing the speaker's sound output path.

[0044] In one possible implementation, the loudspeaker further includes a second diaphragm, with the first diaphragm facing the first space and the second diaphragm facing the second space. The side of the second diaphragm facing away from the sound outlet has a second channel, and the second through holes are all connected to the second space.

[0045] Understandably, the second channel serves as a venting channel for the second diaphragm, allowing the gas compressed during its vibration to escape from the first earphone housing. The speaker within the first earphone housing employs a dual-diaphragm design, with both diaphragms connected to the second space. The gas compressed by the vibration of the two diaphragms can be vented to the outside via the rear vent hole in the outer shell, thus balancing the internal air pressure of the speaker. The rear venting channels corresponding to the two diaphragms can share the same rear vent hole in the outer shell, reducing the need for a separate rear venting path. This saves internal space in the outer shell, improving its utilization rate and facilitating miniaturization of the first earphone housing. This allows the earphone to be suitable for more people with smaller ear canals; alternatively, it allows for the inclusion of more components within the first earphone housing.

[0046] In one possible implementation, the loudspeaker further includes a magnetic circuit system, a first voice coil, and a second voice coil. The first voice coil is fixedly connected to a first diaphragm. The second voice coil is fixedly connected to a second diaphragm. The magnetic circuit system is fixedly connected to the frame. When the first voice coil is energized, it drives the first diaphragm to vibrate in the magnetic field of the magnetic circuit system. When the second voice coil is energized, it drives the second diaphragm to vibrate in the magnetic field of the magnetic circuit system.

[0047] Understandably, the first and second diaphragms are driven by a magnetic circuit system via a first and second voice coil, respectively. By controlling the current in the first and second voice coils, the vibration of the first and second diaphragms can be controlled. Since the first and second voice coils share the same magnetic circuit system to drive the first and second diaphragms, the internal space utilization of the speaker is higher, and the speaker size can be made smaller.

[0048] In one possible implementation, the sound outlet of the housing is located at the first end of the housing. A connecting arm connects to the second end of the housing. The first end and the second end of the housing are positioned opposite each other. The direction from the first end of the housing to the second end of the housing is a first direction. A first space and a second space are arranged along the first direction. The rear vent of the housing faces the side where the second end of the housing is located.

[0049] Understandably, the rear vent of the outer shell faces the side where the connecting arm is located. When the user wears the headphones, the rear vent faces the side away from the user's skin to prevent the user's skin from blocking the rear vent of the first earphone body.

[0050] Secondly, embodiments of this application provide an audio device. The audio device includes an earphone case and earphones, with the earphones disposed inside the earphone case. Thus, the earphone case can be used to protect the earphones.

[0051] Thirdly, embodiments of this application provide an earphone. The earphone includes a first earphone body, a second earphone body, and a connecting arm, with the connecting arm connecting the first earphone body and the second earphone body. The outer surface of the first earphone body is spherical, and the outer surface of the first earphone body has a central axis, which passes through the connection point between the connecting arm and the first earphone body. The first earphone body includes a housing and a speaker. The housing has a sound outlet. The speaker is disposed inside the housing, and the sound outlet of the housing communicates with the inside of the housing and the outside.

[0052] The sound outlet of the housing is offset from the central axis. Alternatively, the housing has a perforated area, the sound outlet includes multiple sub-holes, the multiple sub-holes are spaced apart in the perforated area, the multiple sub-holes are rotationally symmetrical about the central axis, and at least some of the multiple sub-holes are offset from the central axis.

[0053] Understandably, when the earphones are clipped onto a user's ear, the central axis of the first earphone extends in roughly the same direction as the ear canal. If the sound outlet of the outer shell faces the same direction as the central axis of the first earphone, the sound outlet is easily clogged by dust and oil.

[0054] The sound outlet on the outer shell can be offset from the central axis, which can effectively reduce the accumulation of dust and oil in the sound outlet and prevent clogging. Alternatively, the sound outlet can include multiple sub-holes, and these sub-holes that are offset from the central axis are less prone to dust and oil accumulation. Even if some sub-holes are blocked, it will not affect the sound output of the headphones. Attached Figure Description

[0055] To illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0056] Figure 1 This is a schematic diagram of one embodiment of the headphones provided in this application;

[0057] Figure 2 yes Figure 1 An exploded view of one embodiment of the headphones shown;

[0058] Figure 3 This is a state diagram illustrating one implementation of the headphones provided in this application by a user;

[0059] Figure 4 yes Figure 2 A schematic diagram of the first earpiece shown from another angle;

[0060] Figure 5 yes Figure 4 An exploded view of part of the structure of the first earphone body shown in the figure;

[0061] Figure 6A yes Figure 5 The speaker shown is a structural schematic diagram from another angle;

[0062] Figure 6B yes Figure 6A An exploded view of one embodiment of the loudspeaker shown;

[0063] Figure 7A yes Figure 6A A partial cross-sectional schematic diagram of one embodiment of the loudspeaker shown at A1-A1;

[0064] Figure 7B yes Figure 6A A partial cross-sectional schematic diagram of one embodiment of the loudspeaker shown at A2-A2;

[0065] Figure 8 yes Figure 4 A partial cross-sectional schematic diagram of one embodiment of the first earpiece body at BB shown;

[0066] Figure 9 yes Figure 5 A partial structural diagram of the outer shell shown from another angle;

[0067] Figure 10 yes Figure 9 The diagram shows a partial cross-sectional view of one embodiment of the structure shown at C1-C1;

[0068] Figure 11 yes Figure 5 The diagram shows a partial structural schematic of the outer casing at another angle;

[0069] Figure 12 yes Figure 4 A partial cross-sectional view of one embodiment of the first earpiece shown at C2-C2 from another angle;

[0070] Figure 13 yes Figure 4 A partial cross-sectional schematic diagram of one embodiment of the first earpiece body at BB shown;

[0071] Figure 14 yes Figure 5 A schematic diagram of the assembly structure of one embodiment of the electrical connection structure, the first bracket, the sensor and the baffle shown in the figure;

[0072] Figure 15 yes Figure 4 A partial cross-sectional schematic diagram of one embodiment of the first earpiece shown at DD;

[0073] Figure 16 yes Figure 4 A partial cross-sectional schematic diagram of another embodiment of the first earpiece shown at BB;

[0074] Figure 17 yes Figure 5 A partial structural schematic diagram of another embodiment of the first shell shown in the diagram from another angle;

[0075] Figure 18 Figure 4 A partial cross-sectional schematic diagram of another embodiment of the first earpiece shown at DD;

[0076] Figure 19 yes Figure 4 A partial cross-sectional schematic diagram of another embodiment of the first earpiece shown at DD;

[0077] Figure 20 yes Figure 5 A structural schematic diagram of another embodiment of the first shell shown in the diagram from another angle;

[0078] Figure 21 yes Figure 5 A structural schematic diagram of another embodiment of the first shell shown in the diagram from another angle;

[0079] Figure 22 yes Figure 5 A structural schematic diagram of another embodiment of the first shell shown in the diagram from another angle;

[0080] Figure 23 This is a schematic diagram of one embodiment of the audio device provided in this application. Detailed Implementation

[0081] The embodiments of this application are described below with reference to the accompanying drawings. The embodiments described herein with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0082] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. It should be understood that in this application, "electrical connection" can be understood as components physically contacting and conducting electricity; it can also be understood as a form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A connecting to B or A being connected to B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0083] Furthermore, the term "fixed" in this document should be interpreted broadly. For example, "fixed" can mean direct fixing or indirect fixing through an intermediate medium. "Fixed" refers to connections where the relative positional relationship remains unchanged after connection. The directional terms used in the embodiments of this application, such as "upper" and "lower," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to two or more.

[0084] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in the text is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, “multiple” refers to two or more than two.

[0085] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0086] Furthermore, the limitations on relative positional relationships mentioned in the embodiments of this application, such as parallel, perpendicular, and aligned, are all relative to the current technological level and are not absolutely strict limitations. Slight deviations are allowed; approximations of parallelism, perpendicularity, and alignment are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees (°) and 10 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0087] This application provides an earphone 1000 and a pair of earphones. The earphone 1000 is a clip-on wireless earphone (True Wireless Stereo, TWS) that can be clipped onto the ear. Clip-on earphones can reduce ear discomfort and improve wearing comfort. A pair of earphones may include two earphones 1000, which can be divided into a first earphone and a second earphone. The first earphone and the second earphone are used for wearing on the user's left and right ears, respectively. In some embodiments, the first earphone and the second earphone may not distinguish between left and right ears; that is, the first earphone can be worn on either the left or right ear, and the second earphone can be worn on either the left or right ear; this improves the portability of the earphone 1000. In other embodiments, the first earphone and the second earphone can distinguish between left and right ears. This application does not impose any limitations.

[0088] In some implementations, the headphones 1000 can be open-back headphones. This way, the headphones 1000 do not need to be inserted deep into the user's ear canal, reducing ear canal allergies and damage, allowing the user to be aware of changes in their surroundings at any time, and reducing the risk of accidents.

[0089] Figure 1 This is a schematic diagram of one embodiment of the earphone 1000 provided in this application. Figure 2yes Figure 1 The diagram shows an exploded view of one embodiment of the earphone 1000. All figures in this application are illustrative of an example where the earphone 1000 does not distinguish between left and right ears.

[0090] like Figure 1 and Figure 2 As shown, the earphone 1000 is generally U-shaped and includes a first earphone body 100, a second earphone body 200, and a connecting arm 300. The connecting arm 300 is generally U-shaped and connects the first earphone body 100 and the second earphone body 200. The first earphone body 100 is electrically connected to the second earphone body 200. Exemplarily, along the length of the connecting arm 300, the connecting arm 300 has a first end and a second end disposed opposite to each other, the first end connecting to the first earphone body 100 and the second end connecting to the second earphone body 200. Thus, the first earphone body 100 and the second earphone body 200 can be physically connected through the connecting arm 300. Furthermore, the first earphone body 100 and the second earphone body 200 can also be electrically connected through the connecting arm 300. For example, the connecting arm 300 may include a wire harness 301, one end of which is electrically connected to the first earphone body 100, and the other end of which can be electrically connected to the second earphone body 200.

[0091] For ease of description, the geometric center of the outer surface of the first earphone body 100, the geometric center of the outer surface of the second earphone body 200, and the geometric center of the outer surface of the connecting arm 300 define a unique plane, denoted as the OO plane. Figure 1 (Illustrated by dashed lines). For ease of description, the direction perpendicular to the OO plane is defined as the Z-axis, the direction from the end of the connecting arm 300 connecting to the first earphone body 100 to the center of the first earphone body 100 is defined as the X-axis, and the direction perpendicular to both the X-axis and Z-axis is defined as the Y-axis.

[0092] Figure 3 This is a state diagram of one implementation of the earphone 1000 provided in this application.

[0093] like Figure 3 As shown, the first earphone body 100 can be used to produce sound. When a user uses the earphone 1000, the first earphone body 100 can be held within the user's concha cavity without penetrating deep into the user's ear canal; that is, the earphone 1000 of this application is an open-back earphone. The concha cavity of the human ear is much more tolerant than the ear canal, therefore, when the earphone 1000 of this application is an open-back earphone, it can greatly improve wearing comfort compared to in-ear audio devices.

[0094] The second earphone body 200 can be located outside the user's ear and on the side opposite to the first earphone body 100. The connecting arm 300 is fastened to the outer edge of the user's ear, extending from the concha to the back of the ear. It can be understood that the connecting arm 300, together with the first earphone body 100 and the second earphone body 200, clamps the user's auricle, thereby wearing the earphone 1000 on the ear.

[0095] In some embodiments, the connecting arm 300 may be deformable, allowing adjustment of the distance between the first earphone body 100 and the second earphone body 200, from an initial distance to an adjustable distance. The initial distance refers to the distance between the first earphone body 100 and the second earphone body 200 when the earphone 1000 is not worn on the user's ear. The adjustable distance refers to the distance after the initial distance has increased or decreased. It should be noted that both the initial distance and the adjustable distance refer to the distance between the first earphone body 100 and the second earphone body 200; the distance between the facing surfaces of the first earphone body 100 and the second earphone body 200, that is, the distance between the two earphone surfaces 1000 that first come into contact with the ear.

[0096] Understandably, the earphone 1000 equipped with the deformable connecting arm 300 can accommodate users with different ear thicknesses, providing appropriate clamping force for each user and avoiding excessive tightness or looseness that could affect the wearing experience. Simultaneously, when putting on and taking off the earphone 1000 provided in this application, the user can use the connecting arm 300 to increase the distance between the first earphone body 100 and the second earphone body 200 to ensure smooth insertion and removal of the earphone 1000, preventing ear deformation due to pressure and improving the user's experience when putting on and taking off the earphone 1000.

[0097] In some implementations, when a user uses headphones 1000, the first earphone body 100 can be used to generate sound. For example, the first earphone body 100 may include a speaker to generate sound. The first earphone body 100 can be held within the user's concha, and the second earphone body 200 is located outside the user's ear and on the side opposite to the first earphone body 100. The second earphone body 200 can be used to pick up external noise for use in the active noise cancellation (ANC) design system of headphones 1000. Active noise cancellation is a method of identifying unwanted sound sources as noise and eliminating the original noise by generating an "anti-noise" signal, thereby eliminating noise in real time. When a user uses headphones 1000, the sound emitted by headphones 1000 has less noise, resulting in a better user experience.

[0098] In some implementations, the second earphone body 200 may contain structures such as batteries, antennas, and chips.

[0099] In some embodiments, the outer surface of the first earphone body 100 is symmetrical about a first plane of symmetry. The outer surface of the second earphone body 200 is symmetrical about a second plane of symmetry. The outer surface of the connecting arm 300 is symmetrical about a third plane of symmetry. The first, second, and third planes of symmetry are coplanar. Exemplarily, any one of the first, second, and third planes of symmetry can be coplanar with the plane of symmetry (i.e., the 0-0 plane). Thus, the overall appearance of the earphone 1000 is a symmetrical structure, and the user does not need to distinguish between the left and right ears while using the earphone 1000.

[0100] In other embodiments, due to assembly tolerances, there may be an included angle between any two of the three planes of symmetry—the first, second, and third planes of symmetry—with the included angle being less than or equal to 1°. For example, the included angle between any two of the three planes of symmetry can be 0.2°, 0.5°, 0.9°, or 1°, etc. Exemplarily, the included angle between the first and second planes of symmetry can be less than 1°, or the included angle between the first and third planes of symmetry can be less than 1°, or the included angle between the second and third planes of symmetry can be less than 1°.

[0101] Figure 4 yes Figure 2 The diagram shows the structure of the first earphone body 100 from another angle. Figure 5 yes Figure 4 The diagram shows a partial structural exploded view of the first earphone body 100 shown.

[0102] like Figure 4 and Figure 5 As shown, the first earphone body 100 may include a housing 10, a speaker 20, a bone pickup sensor (VPU) 30, a first bracket 40, a baffle 50, a feedback microphone (FB mic) 60, an electrical connection structure 70, and a sealing element 80. The speaker 20, bone pickup sensor (VPU) 30, first bracket 40, baffle 50, feedback microphone (FB mic) 60, electrical connection structure 70, and sealing element 80 may all be disposed within the internal space 101 of the housing 10.

[0103] In some embodiments, the outer shell 10 of the first earphone body 100 may be spherical. The outer surface of the first earphone body 100 is spherical, and the outer surface of the first earphone body 100 has a central axis L, which passes through the connection position between the connecting arm 300 and the first earphone body 100. Exemplarily, the central axis L may be located within a first plane of symmetry.

[0104] In some embodiments, the outer shell 10 of the first earphone body 100 may include a first shell 1 and a second shell 2. The first shell 1 is connected to the second shell 2, enclosing the internal space of the outer shell 10. Exemplarily, the first shell 1 and the second shell 2 may be arranged along the X-axis direction.

[0105] Figure 6A yes Figure 5 The speaker 20 shown is a structural schematic diagram from another angle. Figure 6B yes Figure 6A An exploded view of one embodiment of the loudspeaker 20 shown.

[0106] like Figure 6A and Figure 6B As shown, the loudspeaker may include a diaphragm, a voice coil, a frame 25, a magnetic circuit system 26, and a top cover 27. The loudspeaker 20 can be a single-diaphragm loudspeaker or a dual-diaphragm loudspeaker. The accompanying drawings of the embodiments of this application illustrate a dual-diaphragm loudspeaker as an example. Exemplarily, the loudspeaker 20 may include two diaphragms, namely a first diaphragm 21 and a second diaphragm 22. Correspondingly, the loudspeaker 20 may include two voice coils, namely a first voice coil 23 and a second voice coil 24.

[0107] Figure 7A yes Figure 6A The speaker 20 shown is a partial cross-sectional view of one embodiment at A1-A1. Figure 7B yes Figure 6A The speaker 20 shown is a partial cross-sectional view of one embodiment at A2-A2.

[0108] like Figures 6A to 7B As shown, the speaker 20 may have a first side 210, a second side 220, and a peripheral side 230. The first side 210 and the second side 220 of the speaker 20 are arranged opposite to each other, and the peripheral side 230 is located between the first side 210 and the second side 220. In some embodiments, the speaker 20 may be a dual-diaphragm speaker, wherein a first diaphragm 21 may be disposed on the first side 210 of the speaker 20, and a second diaphragm 22 may be disposed on the second side 220 of the speaker 20. In other embodiments, the speaker 20 may also be a single-diaphragm speaker, for example, having only a first diaphragm 21.

[0109] In some embodiments, the basin frame 25 may have a first end 251 and a second end 252 disposed opposite to each other. A first diaphragm 21 is fixedly connected to the first end 251 of the basin frame 25. A second diaphragm 22 is fixedly connected to the second end 252 of the basin frame 25. Exemplarily, the first diaphragm 21 and the second diaphragm 22 may be arranged along the X-axis direction. The basin frame 25 may be used to fix the first diaphragm 21 and the second diaphragm 22.

[0110] In some embodiments, the basin frame 25 may include a first portion 253 and a second portion 254. The first portion 253 and the second portion 254 may be arranged along the X-axis. The first portion 253 of the basin frame 25 is connected to the magnetic circuit system 26 and the first diaphragm 21. The second portion 254 of the basin frame 25 is connected to the magnetic circuit system 26 and the second diaphragm 22. The end of the first portion 253 facing away from the second portion 254 is the first end 251 of the basin frame 25, and the end of the second portion 254 facing away from the first portion 253 is the second end 252 of the basin frame 25.

[0111] In some embodiments, the first voice coil 23 can be fixedly connected to the first diaphragm 21. The second voice coil 24 can be fixedly connected to the second diaphragm 22. The magnetic circuit system 26 can be fixedly connected to the frame 25. When the first voice coil 23 is energized, it can drive the first diaphragm 21 to vibrate in the magnetic field of the magnetic circuit system 26. When the second voice coil 24 is energized, it can drive the second diaphragm 22 to vibrate in the magnetic field of the magnetic circuit system 26. It can be understood that the first diaphragm 21 and the second diaphragm 22 are driven by the first voice coil 23 and the second voice coil 24 respectively in conjunction with the magnetic circuit system 26. By controlling the current of the first voice coil 23 and the second voice coil 24, the vibration control of the first diaphragm 21 and the second diaphragm 22 can be achieved. The first voice coil 23 and the second voice coil 24 share the magnetic circuit system to drive the vibration of the first diaphragm 21 and the second diaphragm 22, resulting in a higher utilization rate of the internal proximity of the speaker 20. In other embodiments, the first diaphragm 21 and the second diaphragm 22 can also adopt other driving methods.

[0112] Exemplarily, the magnetic circuit system may include a central magnet 263 and an edge magnet 264. The edge magnet 264 is located around the central magnet 263 and forms a magnetic gap with the central magnet 263. A portion of the first voice coil 23 and a portion of the second voice coil 24 are located within the magnetic gap. Under the influence of the magnetic field within the magnetic gap, the vibration control of the first diaphragm 21 and the second diaphragm 22 can be achieved by controlling the current in the first voice coil 23 and the second voice coil 24.

[0113] In some embodiments, the magnetic circuit system 26 may further include a magnetic guide plate. The magnetic guide plate can be used to concentrate the magnetic fields of the central magnet 263 and the edge magnets 264, resulting in a stronger magnetic field at the location of the voice coil. Under the same current, the voice coil experiences a greater driving force and higher driving efficiency in the scheme with the magnetic guide plate. The magnetic guide plate can be made of iron. Exemplarily, the magnetic circuit system 26 may include a first magnetic guide plate 265, a second magnetic guide plate 266, and a third magnetic guide plate 267. The central magnet 263 can be fixedly connected to the side of the first magnetic guide plate 265 near the first diaphragm 21, and the second magnetic guide plate 266 can be fixedly connected to the side of the central magnet 263 near the first diaphragm 21. The first voice coil 23 has magnetic guide plates on both its inner and outer sides, resulting in a stronger magnetic field at the location of the first voice coil 23. The direction of movement of the first voice coil 23 is approximately perpendicular to the direction of the magnetic field lines. The third magnetic plate 267 is located on the side of the edge magnet 264 near the second diaphragm 22, so that there are magnetic plates on both the inner and outer sides of the second voice coil 24. The magnetic field at the location of the second voice coil 24 is relatively strong, and the direction of movement of the second voice coil 24 is roughly perpendicular to the direction of the magnetic field lines.

[0114] In some embodiments, the third magnetic plate 267 can be integrally formed with the second part 254 of the frame 25. For example, the third magnetic plate 267 and the second part 254 of the frame 25 can be integrally formed using an injection molding process. This reduces the number of parts in the speaker 20 assembly process, simplifying the assembly procedure.

[0115] In some embodiments, the top cover 27 may be fixedly connected to the side of the second diaphragm 22 away from the first diaphragm 21. That is, the top cover 27 may be located on the second side 220 of the speaker 20.

[0116] In other embodiments, by changing the structure of the speaker 20, the second opening 271 can also be provided on the periphery 230 of the speaker 20.

[0117] In other embodiments, the speaker 20 may also be provided with a lower cover. And / or, the speaker 20 may also be without an upper cover 27.

[0118] It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm loudspeaker as an example. However, this does not mean that the loudspeaker 20 in the embodiments of this application can only be a dual-diaphragm loudspeaker. In other embodiments of this application, the loudspeaker 20 can also be a single-diaphragm loudspeaker or other types of loudspeakers. When the loudspeaker 20 is a single-diaphragm loudspeaker, only the first voice coil 23 can be provided, and the second voice coil 24 can be omitted. At the same time, the specific structure of the magnetic circuit system 26 can also be adjusted according to the number of diaphragms and voice coils. In addition, the loudspeaker 20 in this application is illustrated using the example of a magnet cooperating with a voice coil to drive the diaphragm to vibrate. In other embodiments, the first diaphragm 21 and the second diaphragm 22 can also adopt other driving methods.

[0119] Figure 8 yes Figure 4 The first earphone body 100 shown is a partial cross-sectional schematic diagram at BB of one embodiment. Figure 8 The diagram illustrates the assembly relationship between the speaker 20 and the housing 10.

[0120] like Figures 7A to 8 As shown, the speaker 20 can be disposed within the internal space 101 of the housing 10, dividing the internal space 101 of the housing 10 into a first space 1011 and a second space 1012. Exemplarily, the housing 10 can be provided with a sound outlet 102 and a rear vent 103. The sound outlet 102 of the housing 10 can connect the first space 1011 to the outside. The rear vent 103 of the housing 10 can connect the second space 1012 to the outside.

[0121] In some embodiments, the loudspeaker 20 includes a first diaphragm 21 and a second diaphragm 22 disposed opposite to each other. When the loudspeaker 20 is installed in the internal space 101 of the housing 10, the first side 210 of the loudspeaker 20 faces the first space 1011, and the second side 220 of the loudspeaker 20 faces the second space 1012. The first diaphragm 21 faces the first space 1011, and the second diaphragm 22 faces the second space 1012. The side of the first diaphragm 21 facing away from the sound outlet 102 has a first channel 211, and the side of the second diaphragm 22 facing away from the sound outlet 102 has a second channel 221. Both the first channel 211 and the second channel 221 communicate with the second space. Figure 7A The diagram illustrates one implementation of the first channel 211 and the second channel 221 using arrows and dotted lines, but this is merely an example; the formation of the first channel 211 and the second channel 221 in this application can be varied. The rear vent 103 of the housing 10 can connect the second space 1012 and the outside. It is understood that the first channel 211 is a channel for the first diaphragm 21 to release the gas compressed during the vibration of the first diaphragm 21 from the first earphone body 100. The second channel 221 is a channel for the second diaphragm 22 to release the gas compressed during the vibration of the second diaphragm 22 from the first earphone body 100. When the speaker 20 uses a dual-diaphragm speaker, both diaphragms of the speaker 20 are connected to the second space 1012, and the gas compressed by the rotation of the two diaphragms can be connected to the outside through the rear vent 103 of the housing 10 to balance the internal air pressure of the speaker 20. The two diaphragms of the speaker 20 can share the rear venting channel of the housing 10's rear venting hole 103, which can reduce the number of rear venting paths and save internal space 101 of the housing 10. This will help improve the utilization rate of internal space 101 of the housing 10, and make the first earphone body 100 smaller. The earphone 1000 can be suitable for more people with smaller in-ear space; or more components can be installed in the first earphone body 100.

[0122] In some embodiments, the periphery 230 of the speaker 20 is provided with a first opening 205, which connects the first channel 211 and the second space 1012. It is understood that, compared to the first opening 205 being located on the first side 210 of the speaker 20, in this embodiment, the first channel 211 is located on the periphery 230 of the speaker 20 and connects to the second space 1012 through the first opening 205. The position of the first opening 205 is more reasonable, resulting in a shorter backflow path for the gas compressed by the vibration of the first diaphragm 21. This allows for smoother communication between the gas compressed by the vibration of the first diaphragm 21 and the outside environment, leading to a smaller equivalent acoustic load in the second space 1012 of the first earphone body 100. This is beneficial for improving the loudness of the speaker 20 and resulting in better sound production of the earphone 1000. Furthermore, compared to providing a first opening 205 on the side of the speaker 20 facing away from the sound outlet 102 for gas exhaust, this embodiment does not require additional clearance space on the side of the speaker 20 facing away from the sound outlet 102 for smooth gas exhaust, which is beneficial for the miniaturization of the entire headphone 1000. For example, in a single-diaphragm scenario (e.g., the speaker only has a first diaphragm 21), if a rear vent hole is provided on the side of the speaker 20 facing away from the sound outlet 102, the vented gas corresponding to the first diaphragm 21 will connect to the rear vent hole 103 on the outer casing through the second through hole 261 and the opening on the speaker cover 27. However, to avoid the vented gas being blocked, additional space usually needs to be reserved above the speaker cover 27, which would prevent the miniaturization of the entire headphone 1000. By providing the first opening 205 on the side, it avoids the need to provide the first opening 205 on the side of the speaker 20 facing away from the sound outlet 102 for gas exhaust, and avoids reserving extra space above the upper cover 27 of the speaker 20, thus improving the overall space utilization of the headphone 1000. It is understood that the accompanying drawings of this application embodiment are illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on the headphone 1000 with a dual-diaphragm speaker. In other embodiments of this application, the speaker 20 can also be a single-diaphragm speaker or other types of speakers. When the speaker 20 is a single-diaphragm speaker, the first diaphragm 21 faces the first space 1011, and the periphery 230 of the speaker 20 can also be provided with the first opening 205.

[0123] In some embodiments, the first opening 205 may be located on the frame. Exemplarily, the second portion 254 of the frame 25 may have a third through hole 255 communicating with the first opening 205. The first magnetic plate 265 of the magnetic circuit system 26 may have a fourth through hole 262 communicating with the third through hole 255. The third through hole 255 and the fourth through hole 262 may be used to form a first channel 211. It is understood that the accompanying drawings of the embodiments of this application are all illustrative of a dual-diaphragm loudspeaker, but this does not mean that the technical features of this embodiment can only be used on dual-diaphragm loudspeakers; the loudspeaker 20 can also be a single-diaphragm loudspeaker or other types of loudspeakers.

[0124] In some embodiments, the first channel 211 is tilted.

[0125] In some embodiments, the third through-hole 255 is angled. It should be understood that angled refers to an angle with respect to the thickness direction (X) of the speaker. For example, Figure 7A The third through hole 255 is set at an angle.

[0126] By setting the first channel 211 or the third through hole 255 to be inclined, since the third through hole 255 is directly connected to the second space, the gas squeezed by the diaphragm vibration is less affected by the outer shell 10 after reaching the second space through the third through hole 255 (for example, the gas is reflected back to the third through hole 255 by the outer shell 10), and the gas is discharged more smoothly.

[0127] In some embodiments, since the first diaphragm 21 vibrates along the X direction of the speaker thickness, in order to improve the efficiency of gas removal, the fourth through hole 262 near the diaphragm side is configured to extend in the direction of diaphragm vibration or along the direction of speaker thickness.

[0128] In some embodiments, the second side 220 of the speaker 20 is provided with a second opening 271, which can connect to the second channel 221 and the second space 1012.

[0129] In some embodiments, the side of the second diaphragm 22 facing the sound outlet 102 has a third channel 222. The third channel 222 connects to the first space 1011. The rotation of the second diaphragm 22 compresses air through the third channel 222 and connects to the first space 1011. The sound emitted by the vibration of the second diaphragm 22 can be emitted to the first earphone body 100 through the third channel 222 and the sound outlet 102. Figure 7A The third channel 222 is roughly indicated by an arrow. For example, as shown... Figures 7A to 8As shown, both the first diaphragm 21 and the magnetic circuit system 26 can be annular. The first diaphragm 21 may have a first through-hole 223. The magnetic circuit system 26 may have a second through-hole 261. The second through-hole 261 penetrates the central magnet 263, the first magnetic plate 265, and the second magnetic plate 266. The first through-hole 223 connects the first space 1011 and the second through-hole 261. The first through-hole 223 and the second through-hole 261 can be used to form part of the third channel 222. It can be understood that by setting the structure of the first diaphragm 21, the frame 25, and the magnetic circuit system 26, the third channel 222 connects to the first space 1011. Figure 7A and Figure 7B This is merely one example of an implementation method. It should be understood that... Figure 7B and Figure 7A A cross-section can be two mutually orthogonal cross-sections.

[0130] By way of example, the loudspeaker 20 may also include a first acoustic mesh 28. The first acoustic mesh 28 may be fixedly connected to the magnetic circuit system 26 and cover the first through-hole 223. The first acoustic mesh 28 has damping and can be used to adjust the acoustic performance of the second diaphragm 22 of the loudspeaker 20.

[0131] In other embodiments, when the loudspeaker 20 is a single-diaphragm loudspeaker, the first diaphragm 21 may not have the first through hole 223, and the magnetic circuit system 26 may not have the second through hole 261.

[0132] In some embodiments, the loudspeaker 20 may further include a support member 29. The support member 29 is fixedly connected to the first diaphragm 21 and the magnetic circuit system 26, and is located between the first diaphragm 21 and the magnetic circuit system 26. It is understood that the support member 29 can be used to support the first diaphragm 21.

[0133] In some embodiments, the loudspeaker 20 may further include a second acoustic mesh (not shown). The second acoustic mesh may be fixed to the periphery 230 of the loudspeaker 20 and cover the first opening 205. The second acoustic mesh may have damping and may be used to regulate the air pressure in the first channel 211 when the first diaphragm 21 vibrates and compresses air and then leaks.

[0134] It is understandable that the first acoustic mesh 28, the support member 29, and the second acoustic mesh can be selectively set with one or more of them as needed.

[0135] In some implementations, such as Figure 1 and Figure 8As shown, the sound outlet 102 of the housing 10 is located at the first end 251 of the housing 10, and the connecting arm 300 connects to the second end 252 of the housing 10. The first end 251 and the second end 252 of the housing 10 are arranged opposite to each other. The direction from the first end 251 to the second end 252 of the housing 10 is a first direction, and the first space 1011 and the second space 1012 can be arranged along the first direction. The rear vent 103 of the housing 10 faces the side where the second end 252 of the housing 10 is located. It can be understood that the rear vent 103 of the housing 10 faces the side where the connecting arm 300 is located, so that when the user wears the earphone 1000, the rear vent 103 faces the side away from the user's skin, avoiding the user's skin from blocking the rear vent of the first earphone body 100. For example, the first direction can be parallel to the Z-axis direction (due to assembly tolerances, a slight angle is allowed, such as 2°, 5°, 10°, etc.). It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0136] In some embodiments, when the outer casing 10 includes a first casing 1 and a second casing 2, the first casing 1 and the second casing 2 can be arranged along a first direction, that is, the arrangement direction of the first casing 1 and the second casing 2 can be the same as the arrangement direction of the first space 1011 and the second space 1012. The sound outlet 102 of the outer casing 10 can be located on the first casing 1. The number of sound outlets 102 can be one or more. The rear vent 103 of the outer casing 10 can be located on the second casing 2. The number of rear vents 103 can be one or more. It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm loudspeaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm loudspeakers. In other embodiments of this application, the loudspeaker 20 of the headphones 1000 can also be a single-diaphragm loudspeaker or other types of loudspeakers.

[0137] For example, there can be two first openings 205, and the two first openings 205 can be rotationally symmetrical about the central axis L of the first earphone body 100. In this way, the appearance of the outer shell 10 is more consistent.

[0138] In some embodiments, the first earphone body 100 further includes a seal 80. The seal 80 connects the housing 10 and the speaker 20, sealing the gap between them. The seal 80 is located on the side of the first opening 205 closest to the first space 1011. It is understood that by providing the seal 80, the gap between the housing 10 and the speaker 20 is filled, isolating the first space 1011 and the second space 1012, preventing a short circuit caused by the connection between the first space 1011 and the second space 1012. This allows the energy generated by the diaphragm compressing air to be transferred to the ear canal more efficiently, reducing sound leakage. For example, it can reduce low-frequency sound leakage in the 20Hz to 200Hz range, significantly improving the depth and power of the speaker 20's bass response, thus improving the sound performance of the first earphone body 100. The seal 80's location on the side of the first opening 205 closest to the first space 1011 ensures that the first opening 205 connects to the second space 1012 without blocking the rear leakage channel of the first diaphragm 21. It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0139] In some embodiments, when the outer shell 10 includes a first shell 1 and a second shell 2, the arrangement direction of the first shell 1 and the second shell 2 can be the same as the arrangement direction of the first diaphragm 21 and the second diaphragm 22. The sealing member 80 can also connect the first shell 1 and the second shell 2. It is understood that the sealing member 80 can also be used for the connection between the first shell 1 and the second shell 2, eliminating the need for a separate connection structure between them. This helps save internal space 101 in the outer shell 10, thereby reducing the volume of the first earphone body 100. It is understood that the accompanying drawings of the embodiments of this application are illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on earphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the earphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0140] In some embodiments, the housing 10 also includes a protrusion 4. The protrusion 4 can be fixed to the inner side of the second housing 2, and the second housing 2 and the protrusion 4 are schematically distinguished by dashed lines in the figure. The protrusion 4 can be located on the side of the first opening 205 near the first space 1011, and the seal 80 connects to the surface of the protrusion 4 facing the first space 1011. It is understood that the protrusion 4 can be used to isolate the first space 1011 and the second space 1012, preventing the first space 1011 and the second space 1012 from communicating, which would cause an acoustic short circuit. An acoustic short circuit refers to the communication of gas on both sides of the same diaphragm. Therefore, the protrusion 4 can be used to prevent gas communication on both sides of the first diaphragm 21 and on both sides of the second diaphragm 22. The energy generated by the diaphragm compressing air can be transferred to the ear canal more efficiently, reducing sound leakage. For example, it can reduce low-frequency sound leakage in the 20Hz to 200Hz range, significantly improving the depth and power of the bass extension of the speaker 20. The protrusion 4 is located on the side of the first opening 205 near the first space 1011, preventing the protrusion 4 from blocking the leakage path of the first diaphragm 21 through the first opening 205. The sealing member 80 connects to the surface of the protrusion 4 facing the first space 1011. By setting the protrusion 4, the connection area between the first shell 1 and the second shell 2 can be increased, making the connection between the first shell 1 and the second shell 2 more reliable. In some embodiments, setting the protrusion 4 can make the gap near the peripheral side 230 of the speaker 20 smaller. The protrusion 4 can also be used to position the speaker 20, reducing the risk of the speaker 20 shaking and colliding in the internal space 101 of the housing 10. It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0141] In some embodiments, the seal 80 may be an adhesive component. It is understood that the adhesive component may include a curing adhesive. A curing adhesive, also known as a binder, is a bonding material that can cure from a liquid state into a strong gel-like substance upon contact with air or under specific conditions. For example, the seal 80 may include one or more of ultraviolet-curing adhesives (UV adhesives), infrared-curing adhesives, and moisture-curing adhesives.

[0142] In some embodiments, the seal 80 is an adhesive-applied component. In other words, the seal 80 can be cured with adhesive. It is understood that the seal 80 is cured with adhesive, and before the adhesive cures, the adhesive is fluid and can better fill and cover the gap between the speaker 20 and the housing 10, resulting in a better sealing effect between the speaker 20 and the housing 10.

[0143] In some embodiments, when the seal 80 is an adhesive dispensing component and the housing 10 includes a protrusion 4, the protrusion 4 can be located on the side of the first opening 205 near the first space 1011, and the seal 80 connects to the surface of the protrusion 4 facing the first space 1011. The protrusion 4 can also be used to block excess adhesive, preventing uncured adhesive from overflowing into the first opening 205 and blocking the leakage path when the first diaphragm 21 vibrates and compresses air. It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0144] Figure 9 yes Figure 5 The diagram shows a partial structural view of the outer casing 10 from another angle. Figure 10 yes Figure 9 The diagram shows a partial cross-sectional view of one embodiment of the structure shown at C1-C1.

[0145] like Figure 9 and Figure 10 As shown, the housing 10 may also include a retaining wall 3. The retaining wall 3 may be fixed to the inside of the first housing 1. The retaining wall 3 may be used to mount the speaker 20.

[0146] like Figure 8 As shown, when the speaker 20 is installed in the internal space 101 of the housing 10, the speaker 20 can be fixedly connected to the first housing 1. Exemplarily, when the housing 10 includes a baffle 3, the speaker 20 can be installed on the baffle 3. For example, the speaker 20 can be fixed to the inner side of the baffle 3. It is understood that when the sealant 80 is an adhesive, it is fluid before curing. By setting the baffle 3, the gap between the speaker 20 and the housing 10 can be reduced, and the adhesive is less likely to overflow into the first space 1011, affecting the normal operation of the speaker 20. For example, it prevents adhesive from adhering to the first diaphragm 21, which would interfere with the vibration of the first diaphragm 21. Furthermore, setting the baffle 3 increases the fixed connection area of ​​the speaker 20, which is beneficial to the reliability of the speaker 20's fixed connection to the housing 10; the baffle 3 can also be used to position the speaker 20 during installation into the housing 10, reducing the risk of the speaker 20 shaking within the housing 10. It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0147] In some embodiments, when the seal 80 is an adhesive dispensing component, the retaining wall 3 and the first housing 1 can form a receiving groove 31, with the seal 80 at least partially located within the receiving groove 31 and the seal 80 fixedly connected to the retaining wall 3. It is understood that the receiving groove 31 formed by the retaining wall 3 and the first housing 1 can be used to hold residual adhesive before the adhesive cures. After the adhesive cures, the seal 80 is formed, with the seal 80 at least partially located within the receiving groove 31 and the seal 80 fixedly connected to the retaining wall 3. By forming the receiving groove 31 with the retaining wall 3 and the first housing 1, more adhesive can be retained between the first housing 1 and the speaker 20, which is beneficial to the reliability of the connection between the speaker 20 and the first housing 1. Furthermore, more adhesive can better fill the gap between the housing 10 and the speaker 20, resulting in a better sealing effect of the seal 80.

[0148] Figure 11 yes Figure 5 The diagram shows a partial structural schematic of the outer casing 10 at another angle.

[0149] like Figure 8 and Figure 11 As shown, the outer casing 10 may have a groove 104, the opening of which is located inside the outer casing 10. The groove 104 can connect the first opening 205 of the speaker 20 and the second space 1012. Exemplarily, the groove 104 can be located inside the second casing 2. The groove 104 can be disposed opposite to the first opening 205. It is understood that by providing the groove 104, the space between the outer casing 10 and the first opening 205 of the speaker 20 is made larger, avoiding the first opening 205, which is beneficial to make the back leakage path of the gas squeezed by the vibration of the first diaphragm 21 larger, so as to facilitate the passage of the back leakage gas of the first diaphragm 21. Exemplarily, the groove 104 can be formed by depressurizing the outer casing 10.

[0150] It is understood that the opening of the groove 104 can be located inside the second shell 2, or the opening of the groove 104 can be partially located inside the second shell 2 and partially located on the end face of the second shell 2 facing the first shell 1. For example, when the outer shell 10 includes the protrusion 4, the groove 104 can be located on the side of the protrusion 4 near the second space 1012. When the seal 80 is a dispensing component and the outer shell 10 does not have the protrusion 4, the groove 104 provided in the outer shell 10 can also be used to accommodate a certain amount of excess adhesive, preventing the adhesive from blocking the gas leakage path. Furthermore, the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0151] In some embodiments, the rear vent 103 of the housing 10 and the first opening 205 of the speaker both pass through the first plane, and the central axis L is located within the first plane. It is understood that, compared to a scheme where the first opening 205 and the rear vent 103 of the housing 10 are not on the same cross-section, this embodiment places the rear vent 103 of the housing 10 and the first opening 205 on the same cross-section. This results in a shorter rear vent path for the gas compressed by the vibration of the first diaphragm 21, smoother communication between the compressed gas and the outside environment, and a smaller equivalent acoustic load in the rear cavity (second space 1012) of the first earphone body 100. This is beneficial for improving the loudness of the speaker 20. Furthermore, the accompanying drawings of the embodiments in this application are all illustrative using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on earphones with dual-diaphragm speakers. In other embodiments, the speaker 20 of the earphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0152] In some embodiments, the number of rear vent holes 103 of the housing 10 is two, and the two rear vent holes 103 of the housing 10 are rotationally symmetrical about the central axis L. It can be understood that by arranging the two rear vent holes 103 rotationally symmetrically about the central axis L, the two rear vent holes 103 of the housing 10 can form a dipole, generating a sound wave in the opposite direction to the sound emission direction of the speaker 20, which can reduce the sound leakage of the first earphone body 100.

[0153] In other embodiments, the number of rear vent holes 103 of the housing 10 can be two or more, and the rear vent holes 103 of the multiple housings 10 can be rotationally symmetrical about the central axis L. The accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0154] In some embodiments, the positions of the two rear vent holes 103 are symmetrical about the OO plane. It is understood that symmetrical arrangement of the two rear vent holes 103 eliminates the need for users to distinguish between left and right ears when using the earphone 1000. Simultaneously, the symmetrical distribution of the two rear vent holes 103 ensures that when sweat blocks one rear vent hole 103 during earphone use, the other rear vent hole 103 remains operational, balancing the air pressure within the second space 1012.

[0155] In some embodiments, the housing 10 may also be provided with a connection hole 105. The connection hole 105 can connect the internal space 101 of the housing 10 to the outside. The connection hole 105 can be used for connecting the connecting arm 300, which can enter the internal space 101 of the housing 10 through the connection hole 105 and electrically connect the devices inside the internal space 101 of the housing 10.

[0156] In some embodiments, the first shell 1 is fixedly connected to the second shell 2. Exemplarily, the second shell 2 may include a insert located at the end of the second shell 2 facing the first shell 1. When the second shell 2 is fixedly connected to the first shell 1, the insert is inserted into the inner side of the first shell 1. This allows for a larger connection area between the second shell 2 and the first shell 1, resulting in a more reliable connection between the first shell 1 and the second shell 2.

[0157] In some implementations, such as Figure 11 As shown, the second shell 2 may be provided with an overflow groove 201, the opening of which is located on the end face of the second shell 2 facing the first shell 1. Exemplarily, the number of overflow grooves 201 may be one or more. Multiple overflow grooves 201 may be arranged at intervals along the circumference of the second shell 2.

[0158] Figure 12 yes Figure 4 The first earphone body 100 shown is a partial cross-sectional view of one embodiment at C2-C2 from another angle. Figure 12 The diagram illustrates the positional relationship between the first shell 1, the second shell 2, and the seal 80.

[0159] like Figure 11 and Figure 12 As shown, the seal 80 is an adhesive-applied component, and the speaker 20 is installed in the internal space 101 of the housing 10. The overflow groove 201 and the first opening 205 of the speaker 20 are staggered. The seal 80 may be partially located within the overflow groove 201. It is understood that the seal 80 is fluid before it cures. By providing the overflow groove 201 on the second housing 2, during the assembly of the speaker 20, when the second housing 2 is installed onto the first housing 1, the adhesive can flow to the overflow groove 201 under pressure, preventing the adhesive from overflowing into the second housing 2, blocking the first opening 205, and affecting the back leakage of the first diaphragm 21. The accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0160] In other embodiments, the seal 80 may also be double-sided adhesive or the like. Alternatively, the seal 80 may be a non-adhesive structure such as a rubber sealing ring, with an additional connecting structure provided between the first shell 1 and the second shell 2 for fixation.

[0161] Figure 13 yes Figure 4 The first earphone body 100 shown is a partial cross-sectional schematic diagram at BB of one embodiment.

[0162] like Figure 13 As shown, in some embodiments, the first earphone body 100 may further include a first bracket 40. The first bracket 40 is installed inside the housing 10. Exemplarily, the first bracket 40 is installed on the second housing 2, and the first bracket 40 is provided with a rear leakage channel 41, which connects the rear leakage hole 103 of the housing 10 and the second space 1012. It can be understood that both the first channel and the second channel 221 are connected to the second space 1012. By setting the first bracket 40, the first channel 211 and the second channel 221 can be connected to the rear leakage hole 103 of the housing 10 through the second space 1012 and the rear leakage channel 41. The accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on earphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the earphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0163] In other embodiments, the first bracket 40 may also be used to support electronic components within the first earphone body 100.

[0164] In other embodiments, the second space 1012 may also be directly connected to the rear vent hole 103 of the housing 10. The first bracket 40 does not participate in forming the rear vent path of the speaker 20. That is, the first bracket 40 can be selectively configured, and the first bracket 40 does not have a rear vent channel 41, so the first bracket 40 does not cause rear venting of the speaker 20. This application does not limit the path of the speaker 20 from the second space 1012 to the outside or the shape of the first bracket 40.

[0165] In some embodiments, the first earphone body 100 may further include a first waterproof and breathable membrane 91. The first waterproof and breathable membrane 91 is connected to the inner side of the second shell 2 and covers the rear vent 103 of the shell 10. It is understood that by providing the first waterproof and breathable membrane 91, the second space 1012 and the external space of the first earphone body 100 are connected, the air pressure in the second space 1012 is balanced, and external dust and moisture are prevented from entering the second space 1012 through the rear vent 103 of the shell 10, thus avoiding affecting the operation of the internal components of the first earphone body 100.

[0166] In some embodiments, the number of rear vent holes 103 of the outer casing 10 is two, and the number of first waterproof and breathable membranes 91 is also two. The two rear vent holes 103 of the outer casing 10 and the two first waterproof and breathable membranes 91 are provided in a one-to-one correspondence.

[0167] Figure 14 yes Figure 5 The diagram shows an assembly structure of one embodiment of the electrical connection structure 70, the first bracket 40, the sensor, and the baffle 50. Figure 15 yes Figure 4A partial cross-sectional view of one embodiment of the first earphone body 100 at DD shown.

[0168] like Figure 14 and Figure 15 As shown, the bone sensor 30 and the baffle 50 are both installed inside the housing 10. For example, the bone sensor 30 and the baffle 50 can be fixedly connected to the first bracket 40. The first bracket 40 is fixedly connected to the second housing 2. The first bracket 40 and the speaker 20 can be arranged along a first direction. The bone sensor 30 is located on the side of the speaker 20 away from the sound outlet 102 of the housing 10. The baffle 50 is at least partially located on the side of the bone sensor 30 near the speaker 20. The bone sensor 30 can be used to pick up vibrations when the user speaks, thereby facilitating call noise reduction. It is understood that the baffle 50, being at least partially located on the side of the bone sensor 30 near the speaker 20, can be used to block the backflow of gas from the speaker 20, preventing the backflow of gas from the speaker 20 from interfering with the operation of the bone sensor 30. The accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0169] For example, the baffle 50 may include a bottom wall 51 and a side wall 52. The bottom wall 51 is fixedly connected to the first bracket 40 and is located on the side of the bone sensor 30 near the speaker 20. The side wall 52 is connected to the bottom wall 51 and is disposed facing the side of the bone sensor 30. It is understood that the bottom wall 51, side wall 52 and the first bracket 40 of the baffle 50 enclose a receiving space for accommodating the bone sensor 30.

[0170] In other embodiments, the baffle 50 may only have a bottom wall 51; or it may also have side walls 52 on the other two sides to further block the back leakage gas of the speaker 20 and improve the working accuracy of the bone sensor 30.

[0171] In other embodiments, the bone sensor 30 and the baffle 50 can be directly fixed to the inner wall surface of the housing 10.

[0172] In some embodiments, the feedback microphone 60 may be located near the sound-emitting position of the speaker 20. The feedback microphone 60 is installed inside the housing 10. Exemplarily, the feedback microphone 60 may be installed in the first housing 1 and located in the first space 1011. The feedback microphone 60 can pick up external sounds through the sound outlet 102 of the housing 10. When the user wears the headphones 1000, the feedback microphone 60 may be located inside the user's concha, near the ear canal. Sounds near the user's ear canal can be picked up by the feedback microphone 60 through the sound outlet 102 of the housing 10. It is understood that by setting the feedback microphone 60 and placing it near the speaker 20, the feedback microphone 60 can be used to pick up noise entering the user's ear canal, and the sound from the speaker 20 side can be fed back to the chip to output an inverted sound wave to cancel out the noise in the ear, resulting in a better user experience.

[0173] In some embodiments, the bone sensor 30 and the feedback microphone 60 may be electrically connected to the electrical connection structure 70. The electrical connection structure 70 may be used to power the bone sensor 30 and transmit electrical signals from the bone sensor 30 and the feedback microphone 60 to a chip in the earphone 1000. For example, when the battery and chip of the earphone 1000 are located on the second earphone 1000 body, the electrical connection structure 70 may be electrically connected to the connecting arm 300. The battery and chip are connected to the electrical connection structure 70 via the connecting arm 300. Exemplarily, the electrical connection structure 70 may be a flexible circuit board.

[0174] Figure 16 yes Figure 4 A partial cross-sectional view of another embodiment of the first earphone body 100 shown at BB.

[0175] It is understandable that the inner wall surfaces of protrusion 4 and the second shell 2 can form a large angle, such as... Figure 12 As shown, the inner wall surfaces of protrusion 4 and the second shell 2 can form an angle of approximately 100°. Figure 16 As shown, the protrusion 4 can also smoothly transition to the inner wall surface of the second shell 2. Figure 16 The second shell 2 and the protrusion 4 are schematically distinguished by dashed lines.

[0176] For example, the second shell 2 and the protrusion 4 can be integrally molded structural components. Here, "integrated structure" means that during the formation of one of the components, that component is connected to the other component without requiring further processing (such as bonding, welding, snap-fit ​​connections, or screw connections) to join the two components together. For example, the second shell 2 and the protrusion 4 can be integrally molded using injection molding.

[0177] In other embodiments, the protrusion 4 can also be fixedly connected to the second shell 2 by means of adhesive or other methods.

[0178] Figure 17 yes Figure 5 The diagram shows a partial structural schematic of another embodiment of the first shell 1 as shown from another angle. Figure 18 Figure 4 A partial cross-sectional view of another embodiment of the first earphone body 100 shown at DD.

[0179] like Figure 17 and Figure 18 As shown, the outer surface of the first earphone body 100 is spherical, and the outer surface of the first earphone body 100 has a central axis L. The central axis L passes through the connection position between the connecting arm 300 and the first earphone body 100, and the sound outlet 102 of the outer shell 10 can be offset from the central axis L. It can be understood that when the earphone 1000 is clipped on the user's ear, the extension direction of the central axis L of the first earphone body 100 is approximately the same as the extension direction of the user's ear canal. If the orientation of the sound outlet 102 of the outer shell 10 is the same as the direction of the central axis L of the first earphone body 100, the sound outlet 102 is easily blocked by dust and oil. In this embodiment, the sound outlet 102 of the outer shell 10 can be offset from the central axis L, which can effectively reduce the accumulation of dust and oil in the sound outlet 102 and avoid blockage.

[0180] It is understood that the sound outlet 102 of the housing 10 forms a sound outlet on the outer surface of the housing 10. The sound outlet can be a flat surface or a curved surface, and this application does not impose any restrictions. When the sound outlet is a curved surface, the appearance of the housing 10 is more consistent.

[0181] It is understood that the accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used in headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphone 1000 can also be a single-diaphragm speaker or other types of speakers. Figure 17 and Figure 18 The arrangement of the sound outlet 102 of the outer casing 10 shown is not strongly related to the type and rear leakage method of the speaker 20 in the previous embodiment, such as Figure 17 and Figure 18 The sound outlet 102 of the housing 10 shown can also be combined with other types of speakers and placed inside the headphones 1000; or, combined with other types of headphones 1000 and rear-leaking methods.

[0182] For example, the number of sound outlet holes 102 of the housing 10 can be one or more, and the multiple sound outlet holes 102 of the housing 10 are rotationally symmetrical about the central axis L. Figure 17 and Figure 18As shown, the number of sound outlet holes 102 in the outer shell 10 can be two, and the two sound outlet holes 102 of the two outer shells 10 are rotationally symmetrical about the central axis L. In this way, the appearance of the first earphone body 100 is more consistent.

[0183] In some embodiments, the first earphone body 100 may further include a second waterproof and breathable membrane 92. The second waterproof and breathable membrane 92 is connected to the second shell 2 and covers the sound outlet 102 of the shell 10. It is understood that by setting the second waterproof and breathable membrane 92, while enabling communication between the first space 1011 and the external space of the first earphone body 100, it can also prevent external dust and moisture from entering the first space 1011 through the sound outlet 102 of the shell 10, thus avoiding affecting the operation of the internal components of the first earphone body 100.

[0184] In some embodiments, the first earphone body 100 may further include a second bracket 93. The second bracket 93 may be fixedly connected to the housing 10. A feedback microphone 60 may be mounted on the second bracket 93. Both the feedback microphone 60 and the second bracket 93 are located within the first space 1011. The second bracket 93 is provided with a pickup channel 931, which connects the sound outlet 102 of the housing 10 and the pickup port 61 of the feedback microphone 60. Exemplarily, along the first direction, the speaker 20 and the feedback microphone 60 may be arranged opposite each other, and the pickup port 61 of the feedback microphone 60 may be located on the side of the feedback microphone 60 away from the speaker 20. The pickup channel 931 may be partially located on the side of the feedback microphone 60 away from the speaker 20, that is, the pickup channel 931 may be partially located below the feedback microphone 60. Exemplarily, the second bracket 93 may be fixedly connected to the first housing 1.

[0185] Figure 19 yes Figure 4 A partial cross-sectional view of another embodiment of the first earphone body 100 shown at DD.

[0186] like Figure 19 As shown, the pickup port 61 of the feedback microphone 60 faces the second direction, which can be at an angle to the central axis L. The feedback microphone 60 can be placed vertically on the second bracket 93, such that the pickup port 61 of the feedback microphone 60 faces the left and right sides of the feedback microphone 60, and the orientation of the pickup port 61 of the feedback microphone 60 can be at an angle to the central axis L. Figure 19 The diagram illustrates that the pickup port 61 of the feedback microphone 60 faces to the left of the feedback microphone 60, and the orientation of the pickup port 61 of the feedback microphone 60 can be 90° with the central axis L. It is understandable that, compared to... Figure 18The arrangement of the feedback microphone 60, the second bracket 93, and the sound outlet 102 of the housing 10 shown in the figure allows the pickup channel 931 to be located on one side of the feedback microphone 60 in this embodiment. The space originally used for the pickup channel below the feedback microphone 60 can be eliminated, saving internal space 101 of the housing 10 and facilitating miniaturization of the first earphone body 100. Furthermore, the space originally used for the pickup channel can be used for the feedback microphone 60, allowing it to be moved downwards, i.e., away from the speaker 20. This increases the distance between the feedback microphone 60 and the first diaphragm 21 of the speaker 20, preventing the feedback microphone 60 from blocking the sound outlet of the speaker 20. The figure shows the pickup path of the feedback microphone 60 indicated by dashed arrows and the sound emission path of the speaker 20 indicated by solid arrows. The accompanying drawings of this application embodiment are illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on earphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the earphone 1000 can also be a single-diaphragm speaker or other types of speakers.

[0187] In other embodiments, the sound outlet of the feedback microphone 60 can be positioned on the side of the feedback microphone 60 facing the speaker 20, so that the pickup port 61 of the feedback microphone 60 can face the speaker 20, and the pickup channel 931 can be partially located between the feedback microphone 60 and the speaker 20. The feedback microphone 60 can be moved downwards, that is, moved away from the speaker 20. The increased distance between the feedback microphone 60 and the first diaphragm 21 of the speaker 20 can prevent the feedback microphone 60 from blocking the sound outlet of the speaker 20. The accompanying drawings of the embodiments of this application are all illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0188] In some embodiments, the sound outlet 102 of the housing 10 can be offset from the central axis L, so that the bottom of the housing 10 can have more space for placing the feedback microphone 60, which is beneficial for the feedback microphone 60 to be moved down, and thus for the miniaturization of the first earphone body 100.

[0189] Figure 20 yes Figure 5 A structural schematic diagram of another embodiment of the first shell 1 shown in the diagram from another angle. Figure 21 yes Figure 5 The diagram shows a structural schematic of another embodiment of the first shell 1 as shown from another angle.

[0190] like Figure 20 and Figure 21As shown, the number of sound outlet holes 102 in the outer casing 10 can also be three or four. Figure 20 As shown, the three sound outlets 102 of the outer casing 10 are rotationally symmetrical about the central axis L. Figure 21 As shown, the four sound holes 102 of the outer casing 10 are rotationally symmetrical about the central axis L.

[0191] Figure 22 yes Figure 5 The diagram shows a structural schematic of another embodiment of the first shell 1 as shown from another angle.

[0192] like Figure 22 As shown, the outer casing 10 has a perforated area S (shown by dashed lines in the figure), and the sound outlet 102 includes multiple sub-holes 1021. These sub-holes 1021 are spaced apart in the perforated area S and are rotationally symmetrical about the central axis L. At least some of the sub-holes 1021 can be offset from the central axis L. This prevents dust and oil accumulation in the sub-holes offset from the central axis L, and even if some sub-holes 1021 are blocked, it does not affect the sound output of the headphones 1000. It is understood that the accompanying drawings of this application embodiment are illustrated using a dual-diaphragm speaker as an example, but this does not mean that the technical features of this embodiment can only be used on headphones with dual-diaphragm speakers. In other embodiments of this application, the speaker 20 of the headphones 1000 can also be a single-diaphragm speaker or other types of speakers.

[0193] Figure 23 This is a schematic diagram of one embodiment of the audio device 3000 provided in this application.

[0194] like Figure 23 As shown, this application also provides an audio device 3000, which includes headphones 1000 and a headphone case 2000. The headphones 1000 are disposed inside the headphone case 2000. The headphone case 2000 can be used to store the headphones 1000. In some embodiments, the headphone case 2000 can also be used to charge the headphones 1000. In this way, when the headphones 1000 are small in size, the headphone case 2000 does not need a large space to accommodate the headphones 1000, which helps to make the audio device 3000 small in size, making it easy for users to grab and carry.

[0195] In some embodiments, the audio device 3000 may include two headphones 1000.

[0196] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0197] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0198] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A pair of headphones (1000), characterized in that, It includes a first earphone body (100), a second earphone body (200), and a connecting arm (300), wherein the connecting arm (300) connects the first earphone body (100) and the second earphone body (200); The first earphone body (100) includes a shell (10) and a speaker (20). The shell (10) is provided with a sound outlet (102) and a rear vent (103). The speaker (20) is disposed in the internal space (101) of the shell (10) and divides the internal space (101) of the shell (10) into a first space (1011) and a second space (1012). The sound outlet (102) of the shell (10) connects the first space (1011) and the outside, and the rear vent (103) of the shell (10) connects the second space (1012) and the outside. The loudspeaker (20) includes a first diaphragm (21), the side of the first diaphragm (21) facing away from the sound outlet (102) has a first channel (211), the peripheral side (230) of the loudspeaker (20) is provided with a first opening (205), the first opening (205) communicates with the first channel (211), and the first channel (211) communicates with the second space (1012).

2. The earphone (1000) according to claim 1, characterized in that, The first earphone body (100) further includes a seal (80) that connects the housing (10) and the speaker (20) and seals the gap between the housing (10) and the speaker (20). The seal (80) is located on the side of the first opening (205) near the first space (1011).

3. The earphone (1000) according to claim 2, characterized in that, The outer shell (10) includes a first shell (1) and a second shell (2), the arrangement direction of the first shell (1) and the second shell (2) is the same as the arrangement direction of the first space (1011) and the second space (1012), and the sealing member (80) also connects the first shell (1) and the second shell (2).

4. The earphone (1000) according to claim 3, characterized in that, The outer shell (10) also includes a protrusion (4) fixed to the inner side of the second shell (2). The protrusion (4) is located on the side of the first opening (205) near the first space (1011). The seal (80) connects the surface of the protrusion (4) facing the first space (1011).

5. The earphone (1000) according to claim 4, characterized in that, The sealing element (80) is an adhesive dispensing element.

6. The earphone (1000) according to claim 5, characterized in that, The second shell (2) is provided with an overflow groove (201), the opening of the overflow groove (201) is located on the end face of the second shell (2) facing the first shell (1), the sealing element (80) is partially located in the overflow groove (201), and the overflow groove (201) and the first opening (205) are staggered.

7. The earphone (1000) according to claim 5 or 6, characterized in that, The outer casing (10) also includes a retaining wall (3), which is fixed to the inner side of the first casing (1), and the speaker (20) is mounted on the retaining wall (3).

8. The earphone (1000) according to claim 7, characterized in that, The retaining wall (3) and the first shell (1) enclose a receiving groove (31), and the sealing element (80) is at least partially located in the receiving groove (31). The sealing element (80) is fixedly connected to the retaining wall (3).

9. The earphone (1000) according to any one of claims 1 to 8, characterized in that, The outer shell (10) is provided with a groove (104) that connects the first opening (205) and the second space (1012).

10. The earphone (1000) according to any one of claims 1 to 9, characterized in that, The outer surface of the first earphone body (100) is spherical, and the outer surface of the first earphone body (100) has a central axis (L), which passes through the connection position of the connecting arm (300) and the first earphone body (100); The rear vent (103) of the outer casing (10) and the first opening (205) both pass through the first plane, and the central axis (L) is located in the first plane.

11. The earphone (1000) according to any one of claims 1 to 10, characterized in that, The loudspeaker (20) also includes a frame (25), the first diaphragm (21) is fixedly connected to the frame (25), and the first opening (205) is located on the frame (25).

12. The earphone (1000) according to any one of claims 1 to 11, characterized in that, The first earphone body (100) also includes a bone sensor (30) and a baffle (50), both of which are installed inside the outer shell (10); The bone sensor (30) is located on the side of the speaker (20) away from the sound outlet (102) of the housing (10), and the baffle (50) is at least partially located on the side of the bone sensor (30) closer to the speaker (20).

13. The earphone (1000) according to any one of claims 1 to 12, characterized in that, The outer surface of the first earphone body (100) is spherical, and the outer surface of the first earphone body (100) has a central axis (L). The central axis (L) passes through the connection position between the connecting arm (300) and the first earphone body (100). The sound outlet (102) of the outer shell (10) is staggered from the central axis (L). The outer casing (10) has one sound outlet (102); or, the outer casing (10) has multiple sound outlets (102), and the multiple sound outlets (102) of the outer casing (10) are rotationally symmetrical about the central axis (L).

14. The earphone (1000) according to any one of claims 1 to 12, characterized in that, The outer surface of the first earphone body (100) is spherical, and the outer surface of the first earphone body (100) has a central axis (L), which passes through the connection position of the connecting arm (300) and the first earphone body (100); The outer casing (10) is provided with a perforated area (S), and the sound outlet (102) includes a plurality of sub-holes (1021). The plurality of sub-holes (1021) are spaced apart in the perforated area (S), and the plurality of sub-holes (1021) are rotationally symmetrical about the central axis (L). At least a portion of the plurality of sub-holes (1021) are offset from the central axis (L).

15. The earphone (1000) according to any one of claims 1 to 14, characterized in that, The outer surface of the first earphone body (100) is spherical, and the outer surface of the first earphone body (100) has a central axis (L), which passes through the connection position of the connecting arm (300) and the first earphone body (100); The first earphone body (100) further includes a feedback microphone (60) and a second bracket (93). The feedback microphone (60) and the second bracket (93) are both located in the first space (1011). The second bracket (93) is fixedly connected to the outer shell (10). The feedback microphone (60) is installed on the second bracket (93). The second bracket (93) is provided with a pickup channel (931). The pickup channel (931) connects the sound outlet (102) of the outer shell (10) and the pickup port (61) of the feedback microphone (60). The pickup port (61) of the feedback microphone (60) faces the speaker (20), and the pickup conduit (931) is located between the feedback microphone (60) and the speaker (20). Alternatively, the pickup port (61) of the feedback microphone (60) is oriented in a second direction, which forms an angle with the central axis (L).

16. The earphone (1000) according to any one of claims 1 to 15, characterized in that, The loudspeaker (20) further includes a second diaphragm (22), the first diaphragm (21) faces the first space (1011), the second diaphragm (22) faces the second space (1012), and the side of the second diaphragm (22) facing away from the sound outlet (102) has a second channel (221) that communicates with the second space (1012).

17. The earphone (1000) according to claim 16, characterized in that, The loudspeaker (20) also includes a magnetic circuit system (26), a first voice coil (23), and a second voice coil (24); The first voice coil (23) is fixedly connected to the first diaphragm (21), and the second voice coil (24) is fixedly connected to the second diaphragm (22). When the first voice coil (23) is energized, it drives the first diaphragm (21) to vibrate in the magnetic field of the magnetic circuit system (26). When the second voice coil (24) is energized, it drives the second diaphragm (22) to vibrate in the magnetic field of the magnetic circuit system (26).

18. An audio device (3000), characterized in that, It includes an earphone case (2000) and earphones (1000) as claimed in any one of claims 1 to 17, wherein the earphones (1000) are disposed within the earphone case (2000).

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