Preparation method of photovoltaic module, photovoltaic module and photovoltaic equipment

By using appropriately weighted pads in photovoltaic modules and controlling the particle ratio and lamination temperature of the encapsulant layer, the problems of air bubbles and excess adhesive at the glass holes on the back of double-glass photovoltaic modules were solved, ensuring effective welding of the junction box and busbar, and improving the quality and reliability of photovoltaic modules.

CN120857643APending Publication Date: 2025-10-28INNER MONGOLIA JA SOLAR PHOTOVOLTAIC TECH CO LTD
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Patent Information

Application Number
CN202511019907.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-23
Publication Date
2025-10-28

AI Technical Summary

Technical Problem

Insufficient filler film at the glass holes on the back of the photovoltaic double-glass module can cause missing air bubbles or film overflow, affecting the welding of the junction box and busbar.

Method used

A pad with a weight of 200g/m2-300g/m2 is used, and perforations corresponding to the back plate are set. The second busbar passes through the perforations and the openings in the back plate, and is welded to the junction box pad after lamination. The ratio of high and low flowability particles and the lamination temperature of the adhesive film layer are controlled to avoid bubbles and adhesive overflow.

Benefits of technology

This achieves zero defects, bubbles, and film overflow, ensuring effective welding of the junction box and busbar, and improving the quality and reliability of photovoltaic modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a preparation method of a photovoltaic module, the photovoltaic module and photovoltaic equipment. The preparation method comprises the following steps: connecting a plurality of battery pieces into a battery string through interconnection strips; splicing the battery strings into a battery matrix by using a first bus bar; sequentially laying a light-transmitting layer, a first adhesive film layer and a battery array; welding a second bus bar on the first bus bar of the battery array; a second adhesive film layer, a cushion block and a back plate are sequentially laid on the battery array, the cushion block is provided with a through hole corresponding to the hole of the back plate, the gram weight of the cushion block is 200 g / m < 2 >-300 g / m < 2 >, and a second bus bar penetrates out of the through hole of the cushion block and the hole of the back plate to form a to-be-laminated assembly; the to-be-laminated assembly is placed in a laminating machine to be laminated; and welding a bonding pad of the junction box with one end, extending out of the through hole and the open hole, of the second bus bar. The application does not cause missing bubbles, does not cause the second adhesive film to overflow from the peripheral side of the second bus bar, and does not affect the welding of the junction box and the second bus bar.
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Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a method for preparing a photovoltaic module, a photovoltaic module, and a photovoltaic device. Background Technology

[0002] Currently, the back of the photovoltaic double-glass module has perforated glass to facilitate the exit of the lead wires, preparing for the next step of junction box installation. Because the back glass of the photovoltaic double-glass module is 1.6mm-2mm thick, the glass holes may have missing air bubbles due to insufficient encapsulant filling. If the encapsulant filling is too high, it will cause uncontrollable encapsulant amount, resulting in glue overflow on the lead wires, which will affect the junction box welding. The presence of glue overflow also acts as an insulator, preventing the effective welding of the junction box pads and busbars. Summary of the Invention

[0003] Based on this, a method for preparing a photovoltaic module, a photovoltaic module, and a photovoltaic device are provided. This preparation method will not cause missing bubbles, will not cause the second encapsulant film to overflow from the periphery of the second busbar, and will not affect the welding of the junction box and the second busbar.

[0004] Therefore, in a first aspect, embodiments of this application provide a method for manufacturing a photovoltaic module, comprising: connecting multiple solar cells into a cell string via interconnecting strips; assembling the connected cell strings into a cell array using a first busbar; sequentially applying a light-transmitting layer, a first encapsulating film layer, and the cell array from bottom to top; welding a second busbar onto the first busbar of the cell array; and sequentially applying a second encapsulating film layer, a spacer, and a backsheet onto the cell array, wherein the spacer has perforations corresponding to openings in the backsheet, and the weight of the spacer is 200 g / m³. 2 -300g / m 2 The second busbar is then passed through the perforation of the pad and the opening of the back plate to form a component to be laminated; the component to be laminated is placed in the laminator and then removed; the solder pads of the junction box are soldered to one end of the second busbar that extends out of the perforation and the opening.

[0005] In one embodiment, the area of ​​the pad is in the range of 400 mm². 2 -700mm 2 .

[0006] In one embodiment, the pad is made of at least one of EVA and POE.

[0007] In one embodiment, the perforation is elongated, and the second busbar extends from the straight edge of the perforation, the length of which is greater than or equal to 6.5 mm.

[0008] In one embodiment, the opening area of ​​the perforation is 39 mm.2 -113mm 2 .

[0009] In one embodiment, the ratio of high-flowability particles to low-flowability particles in the second film layer is in the range of 1-1.2:1; the minimum torque ML in the vulcanization curve of the high-flowability particles is 0.05-0.06, and the minimum torque ML in the vulcanization curve of the low-flowability particles is 0.12-0.13.

[0010] In one embodiment, the ratio of high-flowability particles to low-flowability particles in the second film layer is 1.1:1.

[0011] In one embodiment, the temperature of the laminator is between 145°C and 156°C.

[0012] Secondly, embodiments of this application provide a photovoltaic module, including the preparation method described in any of the above claims.

[0013] Thirdly, embodiments of this application provide a photovoltaic device, including the photovoltaic module described above.

[0014] According to the photovoltaic module manufacturing method, photovoltaic module, and photovoltaic equipment provided in the embodiments of this application, the photovoltaic module manufacturing method includes: connecting multiple solar cells into a cell string via interconnecting strips; splicing the connected cell strings into a cell array using a first busbar; sequentially applying a light-transmitting layer, a first encapsulating film layer, and the cell array from bottom to top; welding a second busbar onto the first busbar of the cell array; and sequentially applying a second encapsulating film layer, a spacer, and a backsheet onto the cell array, wherein the spacer has perforations corresponding to the openings in the backsheet, and the weight of the spacer is 200 g / m³. 2 -300g / m 2 The second busbar is then passed through the perforations in the pad and the opening in the back plate to form the assembly to be laminated. After lamination, the assembly is removed from the laminator. The solder pads of the junction box are then soldered to the end of the second busbar that extends out of the perforations and openings. This preparation method does not cause missing air bubbles and does not cause the second adhesive film to overflow from the periphery of the second busbar, thus not affecting the soldering of the junction box and the second busbar. Attached Figure Description

[0015] Figure 1 This illustration shows a structural schematic diagram of a photovoltaic module provided in an embodiment of this application;

[0016] Figure 2 A partial cross-sectional view of a photovoltaic module provided in an embodiment of this application is shown;

[0017] Figure 3 This diagram illustrates the structure of a pad provided in an embodiment of this application.

[0018] Explanation of reference numerals in the attached figures:

[0019] 1. Second busbar; 2. Pad; 21. Perforation; 3. Backplate. Detailed Implementation

[0020] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0021] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention.

[0022] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0023] The orientations or positional relationships indicated by terms such as "upper," "lower," "left," "right," "middle," "longitudinal," "lateral," "horizontal," "inner," "outer," "radial," and "circumferential" used in this specification are based on the orientations or positional relationships shown in the accompanying drawings and are only for the purpose of simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] Currently, the back of the photovoltaic double-glass module has perforated glass to facilitate the exit of the lead wires, preparing for the next step of junction box installation. Because the back glass of the photovoltaic double-glass module is 1.6mm-2mm thick, the glass holes may have missing air bubbles due to insufficient encapsulant filling. If the encapsulant filling is too high, it will cause uncontrollable encapsulant amount, resulting in glue overflow on the lead wires, which will affect the junction box welding. The presence of glue overflow also acts as an insulator, preventing the effective welding of the junction box pads and busbars.

[0025] To solve the above problems, refer to Figures 1-3 , Figure 1 This illustration shows a structural schematic diagram of a photovoltaic module provided in an embodiment of this application. Figure 2 This illustration shows a partial cross-sectional view of a photovoltaic module according to an embodiment of this application. Figure 3 This diagram illustrates the structure of a pad provided in an embodiment of this application.

[0026] This application provides a method for manufacturing a photovoltaic module, comprising:

[0027] Step 1: Connect multiple battery cells into a battery string using interconnecting strips;

[0028] Step 2: Connect the series-connected batteries into a battery array using the first busbar;

[0029] Step 3: Lay the light-transmitting layer, the first adhesive film layer, and the battery array sequentially from bottom to top;

[0030] Step 4: Weld the second busbar 1 onto the first busbar of the battery array;

[0031] Step 5: Sequentially apply the second adhesive film layer, pad 2, and backplate 3 onto the battery array. The pad 2 has perforations 21 corresponding to the openings in the backplate 3. The weight of the pad 2 is 200 g / m³. 2 -300g / m 2 The second busbar 1 is then passed through the perforation 21 of the pad 2 and the opening of the back plate 3 to form the component to be laminated.

[0032] Step 6: After the laminating components are placed in the laminator for lamination, remove them.

[0033] Step 7: Solder the pads of the junction box to one end of the second busbar 1 that extends out of the through hole 21 and the opening.

[0034] It should be understood that the materials of the first and second adhesive films can be the same or different, depending on the actual situation. The pad 2 is provided with a perforation 21, which corresponds to the opening in the back plate 3, and the central axis of the perforation 21 is coaxial with the central axis of the opening in the back plate 3. The size of the perforation 21 and the opening in the back plate 3 also corresponds. The perforation 21 and the opening in the back plate 3 can be circular or other shapes; this application does not impose any restrictions.

[0035] This application does not limit the shape of the pad 2; the pad 2 can be rectangular, cylindrical, or other shapes. The basis weight of the pad 2 is 200 g / m². 2 -300g / m 2 That is, the weight of pad 2 can be 200g / m². 2 220g / m 2 240g / m 2 260g / m 2 280g / m 2 300g / m 2 No restrictions are imposed. When the weight of pad 2 is less than 200 g / m². 2 When the pressure of spacer 2 on the second adhesive film is insufficient, it can easily cause missing air bubbles. When the basis weight of spacer 2 exceeds 300 g / m²... 2When the pressure of the pad 2 on the second adhesive film is too high, adhesive overflow occurs on the line, meaning the second adhesive film flows out from the side of the second busbar 1, affecting the junction box soldering. The overflowing adhesive acts as an insulator, preventing effective soldering of the junction box pads and the second busbar. When the basis weight of the pad 2 is 200g / m... 2 -300g / m 2 At this time, no missing air bubbles will be generated, and the excess adhesive from the back plate 3 will not flow to the periphery of the second busbar, thus not affecting the welding of the junction box and the second busbar.

[0036] In some alternative embodiments, the area of ​​the pad 2 ranges from 400 mm². 2 -700mm 2 The area of ​​spacer 2 can be 400 mm². 2 500mm 2 600mm 2 700mm 2 The dimensions are not limited in this application. When the area of ​​spacer 2 is 400 mm²... 2 -700mm 2 At the same time, the weight of the pad 2 can be controlled, thereby controlling the pressure of the pad 2 on the second adhesive film.

[0037] In some optional embodiments, the material of the pad 2 includes at least one of EVA and POE. The material of the pad 2 can be EVA or POE, and this application does not impose any restrictions.

[0038] In some optional embodiments, the perforation 21 is elongated, and the second busbar 1 extends through the straight edge of the perforation 21, the length of which is greater than or equal to 6.5 mm. In this case, the straight edge of the perforation 21 facilitates the extension of the second busbar 1, while also reducing the gap between the second busbar 1 and the pad 2, reducing the amount of the second adhesive film overflowing, and thus not affecting the welding of the junction box and the second busbar.

[0039] In some optional embodiments, the opening area of ​​the perforation 21 is 39 mm. 2 -113mm 2 The opening area of ​​perforation 21 can be 39mm². 2 50mm 2 60mm 2 70mm 2 80mm 2 90mm 2 100mm 2 110mm 2 113mm 2 This application does not impose any restrictions.

[0040] In some optional embodiments, the ratio of high-flowability particles to low-flowability particles in the second adhesive film layer ranges from 1 to 1.2:1. This ratio can be 1:1, 1.1:1, or 1.2:1, and is not limited thereto. When the ratio of high-flowability particles to low-flowability particles in the second adhesive film layer is less than 1:1, the flowability is poor, and missing air bubbles are easily generated. When the ratio is greater than 1.2:1, the flowability is excessive, which easily leads to excessive adhesive overflow, affecting the welding of the junction box and the second busbar. When the ratio of high-flowability particles to low-flowability particles in the second adhesive film layer is in the range of 1 to 1.2:1, missing air bubbles are less likely to be generated, and excessive adhesive overflow is less likely to occur, thus not affecting the welding of the junction box and the second busbar.

[0041] In some optional embodiments, the minimum torque ML in the vulcanization curve of the high-flowability particles is 0.05-0.06, and the minimum torque ML in the vulcanization curve of the low-flowability particles is 0.12-0.13. When the high-flowability particles and the low-flowability particles are combined to form the second adhesive film layer, the minimum torque ML in the second adhesive film layer is 0.08-0.09.

[0042] In some optional embodiments, the laminator temperature is between 145°C and 156°C. The lamination temperature of the laminator can be 145°C, 150°C, 155°C, or 156°C, and this application does not impose any limitation on this; the range is to ensure the degree of crosslinking of the first and second films and to ensure the performance of the photovoltaic module.

[0043] The present application will be further described below through specific embodiments.

[0044] The photovoltaic module fabrication process in Example 1 includes the following steps:

[0045] Step 1: Weld the interconnecting strips onto the main grid lines on the front and back of the solar cells to connect the solar cells into a battery string;

[0046] Step 2: Connect the series-connected batteries into a battery array using the first busbar;

[0047] Step 3: Lay the light-transmitting layer, the first adhesive film layer, and the battery array sequentially from bottom to top;

[0048] Step 4: Weld the second busbar 1 onto the first busbar of the battery array;

[0049] Step 5: Sequentially apply the second adhesive film layer, pad 2, and backplate 3 onto the battery array. The pad 2 has perforations 21 corresponding to the openings in the backplate 3. The weight of the pad 2 is 200 g / m³. 2 The area of ​​pad 2 is 400mm². 2The ratio of medium-high flowability particles to low flowability particles in the second adhesive film is in the range of 1:1, and the second busbar 1 is passed through the perforation 21 of the pad block 2 and the opening of the back plate 3 to form the component to be laminated.

[0050] Step 6: After the laminating components are placed in the laminator for lamination, remove them. The temperature of the laminator is 150℃.

[0051] Step 7: Solder the pads of the junction box to one end of the second busbar 1 that extends out of the through hole 21 and the opening.

[0052] Except for the parameters mentioned in Table 1, all other parameters in Comparative Examples 1-4 are the same as those in Example 1.

[0053] Except for the parameters mentioned in Table 1, all other parameters in Examples 2-3 are the same as those in Example 1.

[0054] Table 1:

[0055]

[0056] As shown in the table above, comparative examples 1-4 and examples 1-3 show that when the weight of the pad is 2 grams, it is 200 g / m². 2 -300g / m 2 When the ratio of high-flowability particles to low-flowability particles in the second adhesive film layer is between 1 and 1.2:1, and the minimum torque ML in the second adhesive film is between 0.08 and 0.09, no missing bubbles will be generated, and the second adhesive film will not overflow the periphery of the second busbar 1, thus not affecting the effective soldering of the junction box pads and the busbar.

[0057] Reference Figures 1-3 This application also includes a photovoltaic module, which is prepared using the method described above. The photovoltaic module includes a light-transmitting layer, a first encapsulating film layer, a cell array, a second encapsulating film, a spacer 2, and a backsheet 3 arranged sequentially. It also includes a second busbar 1 connected to the first busbar of the cell array, with one end of the second busbar 1 passing through a perforation 21 in the spacer 2 and an opening in the backsheet 3.

[0058] This application also includes photovoltaic equipment, including the photovoltaic modules described above.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for preparing a photovoltaic module, characterized in that, include: Multiple battery cells are connected into a battery string using interconnecting strips; The connected battery strings are assembled into a battery array using the first busbar; The light-transmitting layer, the first adhesive film layer, and the battery array are laid sequentially from bottom to top. A second busbar (1) is welded onto the first busbar of the battery array; A second adhesive film layer, a pad (2), and a backplate (3) are sequentially laid on the battery array. The pad (2) is provided with perforations (21) corresponding to the openings in the backplate (3). The weight of the pad (2) is 200 g / m³. 2 -300g / m 2 The second busbar (1) is passed through the perforation (21) of the pad (2) and the opening of the back plate (3) to form the assembly to be laminated; The component to be laminated is placed in the laminator for lamination and then removed; The solder pads of the junction box are soldered to one end of the second busbar (1) that extends out of the through hole (21) and the opening.

2. The method for preparing a photovoltaic module according to claim 1, characterized in that, The area of ​​the pad (2) is in the range of 400 mm². 2 -700mm 2 .

3. The method for preparing a photovoltaic module according to claim 1, characterized in that, The material of the pad (2) includes at least one of EVA and POE.

4. The method for preparing a photovoltaic module according to claim 1, characterized in that, The perforation (21) is elongated, and the second busbar (1) passes through the straight edge of the perforation (21), the length of which is greater than or equal to 6.5 mm.

5. The method for preparing a photovoltaic module according to claim 1, characterized in that, The opening area of ​​the perforation (21) is 39 mm. 2 -113mm 2 .

6. The method for preparing a photovoltaic module according to claim 1, characterized in that, The ratio of high-flowability particles to low-flowability particles in the second film layer is in the range of 1-1.2:1; the minimum torque ML in the vulcanization curve of the high-flowability particles is 0.05-0.06, and the minimum torque ML in the vulcanization curve of the low-flowability particles is 0.12-0.

13.

7. The method for preparing a photovoltaic module according to claim 6, characterized in that, The ratio of high-flowability particles to low-flowability particles in the second film layer is 1.1:

1.

8. The method for preparing a photovoltaic module according to claim 1, characterized in that, The temperature of the laminator is between 145℃ and 156℃.

9. A photovoltaic module, characterized in that, The application uses the preparation method described in any one of claims 1-8.

10. A photovoltaic device, characterized in that, Includes the photovoltaic module as described in claim 9.