Solid laser marking and cutting equipment

By combining a bidirectional cylinder with an airbag and elastic pad, rigid drive and flexible clamping are achieved, solving the problem of poor adaptability of traditional clamping devices to workpieces of various sizes. This improves the efficiency and quality of laser marking and cutting, especially for the protection of brittle materials and irregularly shaped parts.

CN120862090APending Publication Date: 2025-10-31JIANGSU MINGYAO LASER INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202511170276.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-20
Publication Date
2025-10-31

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Abstract

The invention relates to the technical field of laser processing equipment, in particular to solid laser marking and cutting equipment which comprises an equipment main cabinet, a workbench is arranged on the upper surface of the equipment main cabinet, a processing platform is arranged on the workbench, and a flexible clamping mechanism is arranged on the processing platform. Through the flexible clamping mechanism, combination of rigid driving and flexible clamping can be achieved through the combined design of a two-way air cylinder, an air bag and an elastic cushion, stable basic clamping force can be provided through the two-way air cylinder, and workpieces of different sizes and shapes can be adapted through self-adaptive deformation of the air bag and the buffering effect of the elastic cushion; especially for brittle materials and precise special-shaped parts, damage caused by hard contact can be avoided, the clamping rejection rate is remarkably reduced, the V-shaped anti-skid lines and the air bag are in stable pressure fit, workpiece slippage during machining can be effectively prevented, the laser marking and cutting precision is guaranteed, and then the overall laser machining efficiency and quality are improved; the method is suitable for diversified precision machining scenes.
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Description

Technical Field

[0001] This invention relates to a solid-state laser marking and cutting device, belonging to the technical field of laser processing equipment. Background Technology

[0002] Laser marking and cutting equipment is a multi-functional processing device that integrates laser technology, precision mechanics and CNC system. Its core consists of a solid-state laser, a galvanometer scanning system, a precision worktable, a cooling device and control software. It generates a high-energy laser beam through stimulated emission of a solid gain medium, which is focused into a micron-sized spot by a focusing lens. Under the control of the CNC system, it can mark and cut materials such as metals and non-metals.

[0003] In laser marking and cutting scenarios, the stability and adaptability of workpiece clamping directly affect the processing effect. Although traditional rigid clamping devices can provide stable clamping force, the hard contact with the workpiece can easily lead to cracking of brittle materials and damage to the surface of precision irregular parts. Furthermore, they cannot adapt to workpieces of multiple sizes, resulting in a high scrap rate, which seriously restricts the improvement of precision machining efficiency.

[0004] Therefore, it is urgent to improve solid-state laser marking and cutting equipment to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of this invention is to provide a solid-state laser marking and cutting device that combines rigid drive with flexible clamping through a combination design of a bidirectional cylinder, an airbag, and an elastic pad. The bidirectional cylinder provides a stable basic clamping force, while the adaptive deformation of the airbag and the buffering effect of the elastic pad adapt to workpieces of different sizes and shapes. Especially for brittle materials and precision irregular parts, it avoids damage caused by hard contact, significantly reducing the scrap rate. The V-shaped anti-slip texture, combined with the stable pressure of the airbag, effectively prevents workpiece slippage during processing, ensuring the accuracy of laser marking and cutting, thereby improving the overall efficiency and quality of laser processing. It is suitable for diverse precision machining scenarios.

[0006] To achieve the above objectives, the main technical solutions adopted by the present invention include:

[0007] A solid-state laser marking and cutting device includes a main equipment cabinet, a worktable fixedly installed on the upper surface of the main equipment cabinet, a processing platform installed on the worktable, a flexible clamping mechanism installed on the processing platform, and a laser component arranged above the processing platform.

[0008] The flexible clamping mechanism includes two symmetrically distributed bidirectional cylinders. Both cylinders are fixedly mounted on the lower surface of the processing platform via fixing blocks. Two clamping plates are fixedly connected to the two output ends of each cylinder. The inner side of each clamping plate has a groove into which an airbag is embedded. An elastic pad is glued to the side of the airbag away from the clamping plate, and one side of the elastic pad has a V-shaped anti-slip texture. An inflation tube is fixedly connected to the side of the airbag away from the elastic pad. The end of the inflation tube away from the airbag passes through the clamping plate and is connected to an external air pump via a quick-connect connector. A one-way valve is installed inside the inflation tube. Before processing, the workpiece is placed on the processing platform. The two bidirectional cylinders drive the two clamping plates to move towards each other until they are close to the workpiece. The external air pump inflates the airbag through the inflation tube with the quick-connect connector. The one-way valve prevents gas leakage, causing the airbag to inflate. The airbag's flexibility... The device adapts to the shape of the workpiece, causing the attached elastic pad to fit tightly against the workpiece surface. The V-shaped anti-slip texture increases friction to prevent workpiece slippage. The rigid clamping plate provides basic clamping force, while the flexible airbag and elastic pad buffer the clamping pressure, avoiding hard contact damage to brittle or precision workpieces. During processing, the airbag maintains stable pressure, working with the clamping plate to firmly fix the workpiece, preventing workpiece displacement during laser assembly operation that could cause marking or cutting deviations. After processing, opening the one-way valve releases the gas in the airbag, and the bidirectional cylinder drives the clamping plate to move in the opposite direction to reset, allowing for easy removal of the workpiece. By combining the flexible adjustment of the airbag with the rigid drive of the bidirectional cylinder, it ensures clamping stability to meet the high precision requirements of laser processing, while also adapting to different workpiece sizes and shapes and avoiding clamping damage. It is especially suitable for laser processing of brittle materials, irregularly shaped parts, and other easily damaged workpieces, thereby reducing the scrap rate caused by clamping and improving laser processing efficiency and quality.

[0009] Preferably, the effective inflation volume of the airbag is 8-12 cm³. 3 The working pressure range of the airbag is 0.05-0.3 MPa, and the airbag is 8-12 cm long. 3 With an effective inflation volume and a working pressure range of 0.05-0.3MPa, it can adapt to workpieces of different sizes. After inflation, it fits the workpiece tightly through elastic deformation, ensuring a stable clamping without slippage and avoiding damage to the workpiece due to excessive pressure. With a one-way valve to prevent air leakage, it ensures a stable clamping state.

[0010] Preferably, the processing platform has several evenly distributed guide slots, and symmetrically distributed guide grooves are formed on the inner sidewalls of both sides of the guide slots. Guide sliders are slidably connected inside the guide grooves. Several guide sliders are fixedly installed at the lower end of the clamping plate. When the bidirectional cylinder drives the clamping plate to move, the guide sliders at the lower end of the clamping plate are embedded in the guide slots of the processing platform and slide synchronously along the guide grooves on both sides. The cooperation between the guide grooves and the guide sliders restricts the horizontal offset and torsion of the clamping plate, thereby ensuring that the two clamping plates always remain parallel and have the same movement trajectory. When clamping the workpiece, the guide sliders guide precisely along the guide slots, so that the clamping plate moves smoothly close to the workpiece, avoiding deviation in the contact position between the airbag and the workpiece due to shaking. In addition, during the processing, the tight cooperation between the guide grooves and the guide sliders can counteract the reaction force generated by laser processing, preventing the clamping plate from loosening or shifting. After processing is completed, the clamping plate is reset along the guide slots under the drive of the bidirectional cylinder. The guiding effect of the guide grooves and the guide sliders ensures the accuracy of the next clamping position, thereby improving the stability and reliability of the flexible clamping mechanism.

[0011] Preferably, the worktable includes an X-axis moving platform, which is fixedly installed on the upper surface of the main equipment cabinet. A Y-axis moving platform is mounted on the X-axis moving platform, and the processing platform is mounted on the Y-axis moving platform. The X-axis moving platform is fixed on the main equipment cabinet and drives the Y-axis moving platform to translate along the X-axis direction. The Y-axis moving platform carries the processing platform and drives it to move along the Y-axis direction. The two work together to enable the processing platform and the workpiece on it to be adjusted to any position in a two-dimensional plane, allowing the laser component to mark and cut different areas of the workpiece, thereby improving the processing flexibility and range of the equipment.

[0012] Preferably, the laser assembly includes a laser carrier plate, on the upper surface of which a laser body is fixedly mounted. A lens barrel is fixedly connected to the output end of the laser body, and a galvanometer is connected to the end of the lens barrel furthest from the laser body. A field lens is connected to the output port of the galvanometer, and the field lens is positioned above the processing platform. The laser carrier plate securely mounts the laser body, ensuring its stable working position. The laser emitted by the laser body enters the lens barrel, where the beam diameter is increased after processing, improving subsequent focusing accuracy. The laser beam enters the input end of the galvanometer, which controls the laser beam deflection direction through rapid lens deflection, achieving scanning of the processing area. The laser beam guided by the galvanometer enters the field lens, which focuses the laser beam onto the workpiece surface of the processing platform, concentrating the laser energy and accurately completing marking or cutting operations. All components work together to ensure the stability, accuracy, and efficiency of laser processing.

[0013] Preferably, a beam expander is provided inside the lens barrel, and the input end of the galvanometer is aligned with the beam expander. The beam expander inside the lens barrel can increase the diameter of the laser beam, improve the beam quality and subsequent focusing accuracy. The alignment of the input end of the galvanometer with the beam expander ensures that the laser beam is completely injected into the galvanometer, reduces beam loss, and ensures stable transmission of laser energy, providing a prerequisite for accurate scanning and focusing, thereby ensuring the processing effect.

[0014] Preferably, the focal length of the field lens is 100-200mm, the effective working area of ​​the field lens is not less than 100mm×100mm, and the field lens is provided with a dustproof protective cover on the outside. The focal length of the field lens of 100-200mm can accurately focus the laser on the surface of the workpiece, ensuring uniform marking and cutting depth, and the effective working area of ​​not less than 100mm×100mm meets certain processing requirements. At the same time, the dustproof protective cover on the outside of the field lens can prevent dust from adhering and affecting laser transmission, thereby ensuring stable beam energy. The combination of these three features improves processing accuracy and efficiency, and adapts to various processing scenarios.

[0015] Preferably, a Z-axis lifting platform is provided on one side of the worktable. The Z-axis lifting platform is fixedly installed on the upper surface of the main equipment cabinet by a support frame, and the laser carrier plate is installed on the Z-axis lifting platform. The Z-axis lifting platform is fixed on the main equipment cabinet by the support frame, carrying the laser carrier plate and laser components. It can drive them to move up and down along the Z-axis, thereby adjusting the vertical distance between the laser components and the processing platform, adapting to workpieces of different thicknesses, ensuring accurate focusing of the field lens, ensuring appropriate marking and cutting depth, and improving the adaptability of the equipment to diverse processing needs.

[0016] Preferably, the outer side walls of both sides of the Z-axis lifting platform are marked with scale values, which can intuitively display the height of the Z-axis lifting platform, thereby facilitating the operator to quickly and accurately adjust the distance between the laser component and the processing platform, ensuring focusing accuracy, and thus improving operating efficiency.

[0017] Preferably, a monitor bracket is provided on one side of the Z-axis lifting platform. The monitor bracket is fixedly installed on the upper surface of the equipment main cabinet via a support plate. The monitor bracket adopts a multi-joint folding structure. The monitor bracket is fixed to the equipment main cabinet via the support plate. Its multi-joint folding structure allows the monitor to be angled, enabling operators to easily change the position of the monitor according to their operating position and viewing angle requirements. This ensures that the processing interface, parameter settings, and other content are clearly visible, and each joint can be stably positioned to prevent the monitor from shaking. This adapts to the usage habits of different operators, thereby improving the convenience and comfort of viewing information during operation and ensuring smooth and efficient equipment operation.

[0018] The present invention has at least the following beneficial effects:

[0019] 1. This invention, through its flexible clamping mechanism, combines rigid drive with flexible clamping via a combination of a bidirectional cylinder, an airbag, and an elastic pad. The bidirectional cylinder provides a stable basic clamping force, while the adaptive deformation of the airbag and the buffering effect of the elastic pad adapt to workpieces of different sizes and shapes. Especially for brittle materials and precision irregular parts, it avoids damage caused by hard contact, significantly reducing the clamping scrap rate. The V-shaped anti-slip texture, combined with the stable pressure of the airbag, effectively prevents workpiece slippage during processing, ensuring the accuracy of laser marking and cutting, thereby improving the overall efficiency and quality of laser processing. It is suitable for diverse precision machining scenarios. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0021] Figure 1 Overall structural schematic diagram provided for this invention Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the processing platform and flexible clamping mechanism provided by the present invention;

[0023] Figure 3 A schematic diagram of the flexible clamping mechanism provided by the present invention;

[0024] Figure 4 This is a partial structural schematic diagram provided by the present invention;

[0025] Figure 5 Overall structural schematic diagram provided for this invention Figure 2 ;

[0026] Figure 6 Provided by the present invention Figure 5 Enlarged view of point A in the middle.

[0027] In the diagram, 1 represents the main equipment cabinet;

[0028] 2. Worktable; 21. X-axis moving platform; 22. Y-axis moving platform;

[0029] 3. Machining platform; 31. Guide groove; 32. Guide slide; 33. Guide slider;

[0030] 4. Flexible clamping mechanism; 41. Two-way cylinder; 42. Clamping plate; 43. Insertion groove; 44. Airbag; 45. Elastic pad; 46. Inflation tube;

[0031] 5. Laser assembly; 51. Laser carrier plate; 52. Laser body; 53. Lens tube; 54. Galvanometer; 55. Field lens;

[0032] 6. Z-axis lifting platform; 61. Scale value;

[0033] 7. Monitor stand. Detailed Implementation

[0034] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0035] like Figures 1-6 As shown, the solid laser marking and cutting equipment provided in this embodiment includes a main equipment cabinet 1, a worktable 2 is fixedly installed on the upper surface of the main equipment cabinet 1, a processing platform 3 is installed on the worktable 2, a flexible clamping mechanism 4 is installed on the processing platform 3, and a laser component 5 is arranged above the processing platform 3.

[0036] The flexible clamping mechanism 4 includes two symmetrically distributed bidirectional cylinders 41. Both bidirectional cylinders 41 are fixedly mounted on the lower surface of the processing platform 3 by fixing blocks. The two output ends of the two bidirectional cylinders 41 are fixedly connected to two clamping plates 42. The inner side of the clamping plates 42 is provided with a groove 43, and an airbag 44 is embedded in the groove 43. The effective inflation volume of the airbag 44 is 8-12 cm³. 3 The working pressure range of the airbag 44 is 0.05-0.3MPa. An elastic pad 45 is glued to the side of the airbag 44 away from the clamping plate 42. One side of the elastic pad 45 has a V-shaped anti-slip texture. An inflation tube 46 is fixedly connected to the side of the airbag 44 away from the elastic pad 45. The end of the inflation tube 46 away from the airbag 44 passes through the clamping plate 42 and is connected to an external air pump via a quick-connect coupling. A one-way valve is installed inside the inflation tube 46. Before processing, the workpiece is placed on the processing platform 3. Two bidirectional cylinders 41 drive the two clamping plates 42 to move towards each other and close to the workpiece. The external air pump inflates the airbag 44 through the inflation tube 46 with the quick-connect coupling. The one-way valve prevents gas leakage, keeping the airbag 44 at a pressure of 8-12cm. 3The airbag 44 expands within an effective inflation volume and working pressure range of 0.05-0.3MPa. Due to its flexible characteristics, the airbag 44 adapts to the shape of the workpiece, causing the attached elastic pad 45 to fit tightly against the workpiece surface. The V-shaped anti-slip texture increases friction to prevent workpiece slippage. The rigid clamping plate 42 provides basic clamping force, while the flexible airbag 44 and elastic pad 45 buffer the clamping pressure, avoiding hard contact damage to brittle or precision workpieces. During processing, the airbag 44 maintains stable pressure, working with the clamping plate 42 to firmly fix the workpiece, preventing workpiece displacement during laser assembly 5 operation. To prevent marking and cutting deviations, after processing, the gas in the airbag 44 is released by opening the one-way valve. The bidirectional cylinder 41 drives the clamping plate 42 to move in the opposite direction and reset, making it easy to remove the workpiece. Furthermore, the combination of the flexible adjustment of the airbag 44 and the rigid drive of the bidirectional cylinder 41 ensures that the clamping stability meets the high precision requirements of laser processing, while also adapting to different workpiece sizes and shapes and avoiding clamping damage. This is especially suitable for laser processing of brittle materials, irregularly shaped parts, and other easily damaged workpieces, thereby reducing the scrap rate caused by clamping and improving the efficiency and quality of laser processing.

[0037] Furthermore, such as Figures 1-6 As shown, the processing platform 3 has several evenly distributed guide slots 31. Symmetrically distributed guide grooves 32 are formed on the inner walls of both sides of the guide slots 31. Guide sliders 33 are slidably connected inside the guide grooves 32. Several guide sliders 33 are fixedly installed at the lower end of the clamping plate 42. When the bidirectional cylinder 41 drives the clamping plate 42 to move, the guide sliders 33 at the lower end of the clamping plate 42 engage with the guide slots 31 of the processing platform 3 and slide synchronously along the guide grooves 32 on both sides. The cooperation between the guide grooves 32 and the guide sliders 33 restricts the horizontal offset and torsion of the clamping plate 42, thereby ensuring that the two clamping plates 42 always remain in motion. Maintaining parallelism and consistent movement trajectory, when clamping the workpiece, the guide slider 33 precisely guides along the guide groove 31, allowing the clamping plate 42 to smoothly approach the workpiece, avoiding deviation in the contact position between the airbag 44 and the workpiece due to shaking. Furthermore, during processing, the tight cooperation between the guide groove 32 and the guide slider 33 can counteract the reaction force generated by laser processing, preventing the clamping plate 42 from loosening or shifting. After processing is completed, the clamping plate 42 is reset along the guide groove 31 under the drive of the bidirectional cylinder 41. The guiding effect of the guide groove 32 and the guide slider 33 ensures the accuracy of the next clamping position, thereby improving the stability and reliability of the flexible clamping mechanism 4.

[0038] Furthermore, such as Figures 1-6As shown, the worktable 2 includes an X-axis moving platform 21, which is fixedly installed on the upper surface of the main equipment cabinet 1. A Y-axis moving platform 22 is installed on the X-axis moving platform 21, and the processing platform 3 is installed on the Y-axis moving platform 22. The X-axis moving platform 21 is fixed on the main equipment cabinet 1, which drives the Y-axis moving platform 22 to translate along the X-axis direction. The Y-axis moving platform 22 carries the processing platform 3 and drives it to move along the Y-axis direction. The two work together to enable the processing platform 3 and the workpiece on it to be adjusted to any position in the two-dimensional plane, so that the laser component 5 can mark and cut different areas of the workpiece, thereby improving the processing flexibility and range of the equipment.

[0039] Furthermore, such as Figures 1-6 As shown, the laser assembly 5 includes a laser carrier plate 51. A laser body 52 is fixedly mounted on the upper surface of the laser carrier plate 51. A lens barrel 53 is fixedly connected to the output end of the laser body 52. ​​A galvanometer 54 is connected to the end of the lens barrel 53 away from the laser body 52. ​​A beam expander is installed inside the lens barrel 53, and the input end of the galvanometer 54 is aligned with the beam expander. A field lens 55 is connected to the light outlet of the galvanometer 54. The field lens 55 is positioned above the processing platform 3. The focal length of the field lens 55 is 100-200mm, and the effective working area of ​​the field lens 55 is not less than 100mm × 100mm. A dustproof protective cover is provided on the outside of the field lens 55. The laser carrier plate 51 provides a stable mounting base for the laser body 52, ensuring its stable position during operation. The laser emitted by the laser body 52 first enters the lens barrel 53, where the beam expander is located. The laser beam is expanded to increase its diameter and improve subsequent focusing accuracy. The expanded laser beam is then precisely directed into the input end of the galvanometer 54. The galvanometer 54 controls the deflection direction of the laser beam through the rapid deflection of its lenses, thus scanning the processing area. The laser beam, guided by the galvanometer 54, then enters the field lens 55. The field lens 55 focuses the laser beam onto the workpiece surface on the processing platform 3 with a focal length of 100-200mm. Its effective working area of ​​not less than 100mm × 100mm can meet certain processing requirements. At the same time, the dustproof protective cover on the outside of the field lens 55 can effectively prevent dust and other impurities from adhering to the surface of the field lens 55, avoiding affecting the laser's transmittance and focusing effect. This ensures that the laser beam maintains a stable energy density and focusing accuracy, thereby ensuring the smooth progress of the marking and cutting process and improving processing quality and efficiency.

[0040] Furthermore, such as Figures 1-6As shown, a Z-axis lifting platform 6 is provided on one side of the worktable 2. The Z-axis lifting platform 6 is fixedly installed on the upper surface of the main equipment cabinet 1 by a support frame, and the laser carrier plate 51 is installed on the Z-axis lifting platform 6. Scale values ​​61 are marked on both outer walls of the Z-axis lifting platform 6. The Z-axis lifting platform 6 is fixed to the upper surface of the main equipment cabinet 1 by a support frame, and the laser carrier plate 51 is installed on it, which can drive the laser component 5 to rise and fall along the Z-axis. The scale values ​​61 on its two outer walls are used to intuitively display the lifting height, which makes it easy for operators to quickly and accurately adjust the vertical distance between the laser component 5 and the processing platform 3, thereby ensuring that the focal length of the field lens 55 matches the processing requirements. During adjustment, the Z-axis lifting platform 6 is operated according to the workpiece thickness and processing accuracy requirements, referring to the scale value 61, so that the laser focus point falls accurately on the workpiece surface, ensuring the clarity and depth consistency of marking and cutting, thereby improving the ease of operation and processing accuracy.

[0041] Furthermore, such as Figures 1-6 As shown, a monitor bracket 7 is provided on one side of the Z-axis lifting platform 6. The monitor bracket 7 is fixedly installed on the upper surface of the main equipment cabinet 1 by a support plate. The monitor bracket 7 adopts a multi-joint folding structure. The monitor bracket 7 is fixed on the main equipment cabinet 1 by a support plate. Its multi-joint folding structure allows the monitor to be adjusted in angle, so that the operator can easily change the position of the monitor according to the operation position and viewing angle requirements, ensuring that the processing interface, parameter settings and other contents are clear and easy to see. Moreover, each joint can be stably positioned to avoid monitor shaking, adapt to the usage habits of different operators, thereby improving the convenience and comfort of viewing information during operation, and ensuring smooth and efficient operation of the equipment.

[0042] Meanwhile, the main equipment cabinet 1 is equipped with an electrical control system, an industrial computer, and a water chiller (the electrical control system, industrial computer, and water chiller are existing technologies, so they will not be described in detail in this embodiment). The electrical control system controls the operation of each component, the industrial computer processes the processing instructions, and the water chiller cools the laser component 5. The three are integrated into the main equipment cabinet 1 to work together to ensure the accuracy, stability, and safety of laser marking and cutting.

[0043] like Figures 1-6 As shown in the figure, the working principle of the solid-state laser marking and cutting equipment provided in this embodiment is as follows:

[0044] Before processing, the workpiece is placed on the processing platform 3. The built-in electrical control system of the main equipment cabinet 1 is activated, and the industrial control computer receives and processes the preset processing instructions. Under the control of the electrical control system, two symmetrically distributed bidirectional cylinders 41 drive the two clamping plates 42 to move towards each other. At this time, the guide sliders 33 at the lower end of the clamping plates 42 slide smoothly along the guide grooves 31 and guide slides 32 of the processing platform 3, ensuring that the clamping plates 42 are parallel and close to the workpiece. An external air pump inflates the air bag 44 through the air inflator 46 with a quick-connect connector. A one-way valve prevents gas leakage, keeping the air bag 44 at 8-12cm.3 The volume expands under pressure of 0.05-0.3MPa, causing the elastic pad 45 to fit against the workpiece for clamping.

[0045] During processing, the industrial control computer coordinates the linkage of various components. The laser is generated by the laser body 52, and after the parameters are adjusted by the beam expander in the lens barrel 53, it is transmitted to the galvanometer 54. The galvanometer 54 controls the deflection direction of the laser beam by rapidly deflecting the lens. The laser beam guided by the galvanometer 54 then enters the field lens 55. The field lens 55 focuses the laser beam onto the surface of the workpiece on the processing platform 3 with a focal length of 100-200mm. The X-axis moving platform 21 and the Y-axis moving platform 22 drive the processing platform 3 and the workpiece to move in a two-dimensional plane. The Z-axis lifting platform 6 ensures accurate focusing of the laser spot by adjusting the height of the laser component 5. The deflection of the galvanometer 54 and the movement of the worktable 2 work together to make the laser spot work along the preset trajectory. The water chiller cools the laser component 5 simultaneously to ensure stable operation of the laser.

[0046] During the processing, the guide groove 32 and the guide slider 33 counteract the laser reaction force to prevent workpiece displacement. The operator can monitor the processing parameters and status in real time through the display on the display bracket 7.

[0047] After processing is completed, the electrical control system controls the bidirectional cylinder 41 to drive the clamping plate 42 to move in the opposite direction, opens the one-way valve to release the gas in the air bag 44, and the workpiece can be taken out. All components are reset to wait for the next operation, thereby realizing high-precision, safe and stable marking and cutting of various workpieces.

[0048] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A solid-state laser marking and cutting device, comprising a main unit cabinet (1), characterized in that: A workbench (2) is fixedly installed on the upper surface of the main equipment cabinet (1), a processing platform (3) is installed on the workbench (2), a flexible clamping mechanism (4) is installed on the processing platform (3), and a laser component (5) is arranged above the processing platform (3). The flexible clamping mechanism (4) includes two symmetrically distributed bidirectional cylinders (41). Both bidirectional cylinders (41) are fixedly installed on the lower surface of the processing platform (3) by fixing blocks. The two output ends of the two bidirectional cylinders (41) are fixedly connected to two clamping plates (42). The inner side of the clamping plate (42) is provided with a groove (43). An airbag (44) is embedded in the groove (43). An elastic pad (45) is glued to the side of the airbag (44) away from the clamping plate (42). A V-shaped anti-slip texture is provided on one side of the elastic pad (45). An inflation tube (46) is fixedly connected to the side of the airbag (44) away from the elastic pad (45). The end of the inflation tube (46) away from the airbag (44) passes through the clamping plate (42) and is connected to an external air pump through a quick-connect connector. A one-way valve is provided inside the inflation tube (46).

2. The solid-state laser marking and cutting equipment according to claim 1, characterized in that: The effective inflation volume of the airbag (44) is 8-12 cm³. 3 The working pressure range of the airbag (44) is 0.05-0.3MPa.

3. The solid-state laser marking and cutting equipment according to claim 1, characterized in that: The processing platform (3) has several evenly distributed guide slots (31), and symmetrically distributed guide grooves (32) are provided on the inner sidewalls of both sides of the guide slots (31). Guide sliders (33) are slidably connected inside the guide grooves (32), and several guide sliders (33) are fixedly installed at the lower end of the clamping plate (42).

4. The solid-state laser marking and cutting equipment according to claim 1, characterized in that: The workbench (2) includes an X-axis moving platform (21), which is fixedly installed on the upper surface of the main equipment cabinet (1), and a Y-axis moving platform (22) is installed on the X-axis moving platform (21), and the processing platform (3) is installed on the Y-axis moving platform (22).

5. A solid-state laser marking and cutting device according to claim 1, characterized in that: The laser assembly (5) includes a laser carrier plate (51), a laser body (52) is fixedly mounted on the upper surface of the laser carrier plate (51), a lens barrel (53) is fixedly connected to the output end of the laser body (52), a galvanometer (54) is connected to the end of the lens barrel (53) away from the laser body (52), a field lens (55) is connected to the light outlet of the galvanometer (54), and the field lens (55) is positioned above the processing platform (3).

6. A solid-state laser marking and cutting device according to claim 5, characterized in that: The inside of the lens tube (53) is provided with a beam expander, and the input end of the galvanometer (54) is aligned with the beam expander.

7. A solid-state laser marking and cutting device according to claim 6, characterized in that: The focal length of the field lens (55) is 100-200mm, the effective working area of ​​the field lens (55) is not less than 100mm×100mm, and the outer side of the field lens (55) is provided with a dustproof protective cover.

8. A solid-state laser marking and cutting device according to claim 7, characterized in that: A Z-axis lifting platform (6) is provided on one side of the workbench (2). The Z-axis lifting platform (6) is fixedly installed on the upper surface of the main equipment cabinet (1) by a support frame, and the laser carrier plate (51) is installed on the Z-axis lifting platform (6).

9. A solid-state laser marking and cutting device according to claim 8, characterized in that: The Z-axis lifting platform (6) has scale values ​​(61) marked on both outer walls.

10. A solid-state laser marking and cutting device according to claim 9, characterized in that: A monitor bracket (7) is provided on one side of the Z-axis lifting platform (6). The monitor bracket (7) is fixedly installed on the upper surface of the equipment main cabinet (1) by a support plate, and the monitor bracket (7) adopts a multi-joint folding structure.

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