Evaporative deposition apparatus, method, coupling agent layer and applications thereof

Abstract

The application belongs to the field of parylene material, and particularly relates to a coupling agent evaporation deposition device, a method, a coupling agent layer and application. The device comprises: a coupling agent storage part provided with a coupling agent outlet; a coupling agent vapor generator part comprising a coupling agent vaporization cavity, a vapor generator arranged outside the coupling agent vaporization cavity, a coupling agent inlet and a coupling agent vapor outlet arranged on the coupling agent vaporization cavity, and the coupling agent inlet being in communication with the coupling agent outlet; and a vacuum deposition cavity, at least two coupling agent vapor inlets being arranged on the side wall of the vacuum deposition cavity at intervals, the coupling agent vapor inlets being in communication with the coupling agent vapor outlet through a vapor pipeline, at least two branch vapor pipelines being arranged on the side of the vapor pipeline close to the coupling agent vapor inlets, the at least two branch vapor pipelines being in one-to-one communication with the at least two coupling agent vapor inlets, respectively, a valve being arranged on the branch vapor pipeline, and the vapor pipeline being wrapped with a heat preservation layer. When the coupling agent is deposited, the binding force between the coupling agent layer and the substrate can be improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of parylene material, and particularly relates to a coupling agent evaporation deposition device and method, a coupling agent layer and application. BACKGROUND

[0002] The parylene layer is a high molecular film polymerized from xylene, which provides various properties such as protection performance, dry lubrication performance, barrier performance, insulation voltage resistance performance, and is increasingly applied to electronic circuit board protection, semiconductor chip protection, insulation protection of high-voltage electrode modules, and the like.

[0003] The parylene material itself is relatively symmetrical (weak polarity), and is a low surface energy material, which is not easy to combine with the surface of the product substrate, and the bonding force often cannot meet the use requirements of the product. It has been proposed to deposit a coupling agent layer as an adhesive layer on the surface of the product before the growth of the parylene film layer, to enhance the bonding force of the parylene film layer to the surface of the product.

[0004] At present, when the coupling agent layer is used as an intermediate layer to enhance the bonding force of the parylene layer to the substrate, the bonding force between the coupling agent layer and the substrate is limited, and the coupling agent cannot uniformly form a layer of adhesive film on the surface of the substrate, thereby affecting the bonding of the parylene layer to the substrate.

[0005] It should be noted that this part of the present application only provides background technology related to the present application, and does not necessarily constitute prior art or public knowledge. SUMMARY

[0006] The purpose of the present application is to overcome the defects of the prior art that the bonding force between the coupling agent layer and the substrate is limited, the coupling agent cannot uniformly form a layer of adhesive film on the surface of the substrate, and the bonding of the parylene layer to the substrate is affected, and to provide a coupling agent evaporation deposition device and method, a coupling agent layer and application, which can enhance the bonding force of the coupling agent layer and the substrate when preparing the coupling agent layer, uniformly form a layer of coupling agent adhesive film on the surface of the substrate, and significantly improve the bonding force of the parylene layer to the substrate.

[0007] In order to achieve the above-mentioned purpose, in a first aspect, the present application provides a coupling agent evaporation deposition device, comprising:

[0008] a coupling agent storage part provided with a coupling agent outlet;

[0009] a coupling agent vapor generation part, comprising a coupling agent vaporization cavity, wherein a vapor generator is arranged outside the coupling agent vaporization cavity, a coupling agent inlet and a coupling agent vapor outlet are arranged on the coupling agent vaporization cavity, and the coupling agent inlet is in communication with the coupling agent outlet;

[0010] A vacuum deposition cavity, at least two coupling agent vapor inlets are arranged on the side wall of the vacuum deposition cavity in intervals, the coupling agent vapor inlets are communicated with the coupling agent vapor outlet through a vapor pipeline, at least two branch vapor pipelines are arranged on the side of the vapor pipeline close to the coupling agent vapor inlets, the at least two branch vapor pipelines are communicated with the at least two coupling agent vapor inlets one by one, a valve is arranged on the branch vapor pipeline, the vapor pipeline is wrapped with a heat preservation layer, and the step of opening the valve of each branch vapor pipeline for a preset time and then closing the valve is performed during vapor deposition.

[0011] In some preferred embodiments, the coupling agent storage part is provided with a desiccant containing cavity and a humidity sensor, the desiccant in the desiccant containing cavity removes the moisture in the coupling agent storage part, and the humidity sensor monitors the humidity in the coupling agent storage part.

[0012] In some preferred embodiments, the coupling agent vaporization cavity is further provided with a bypass inlet and a bypass outlet.

[0013] In some preferred embodiments, the coupling agent vaporization cavity is wrapped with a heat preservation layer outside; the coupling agent vaporization cavity is provided with a liquid level sensor, a barometer and a temperature sensor; and a mass flow meter is arranged on the vapor pipeline to control the amount of coupling agent vapor entering the vacuum deposition cavity.

[0014] In some preferred embodiments, a rotating stage is arranged on the central axis of the vacuum deposition cavity, the rotating stage is used to carry a fixed substrate, and an air extraction hole is arranged on the side wall of the vacuum deposition cavity, the angle between the air extraction hole and the side of the rotating stage away from the coupling agent vapor inlet is 20°-40°.

[0015] In the second aspect, the application provides a coupling agent vapor deposition method applied to the coupling agent vapor deposition device in the first aspect, which comprises the following steps: placing the coupling agent into the coupling agent storage part, introducing dry compressed air into the coupling agent storage part, and pressing the coupling agent from the coupling agent outlet into the coupling agent vaporization cavity through the coupling agent inlet; heating the vapor generator to vaporize the coupling agent in the coupling agent vaporization cavity to form coupling agent vapor, opening the valve of each branch vapor pipeline for a preset time and then closing the valve, introducing the coupling agent vapor from the coupling agent vapor outlet into the coupling agent vapor inlets of the vacuum deposition cavity through the vapor pipeline, and depositing the coupling agent layer on the surface of the substrate in the vacuum deposition cavity.

[0016] In some preferred embodiments, the method further comprises the following steps: the desiccant in the desiccant containing cavity removes the moisture in the coupling agent storage part, and the humidity sensor monitors the humidity in the coupling agent storage part; and when the humidity in the coupling agent storage part exceeds a preset value, the desiccant is replaced and / or added.

[0017] In some preferred embodiments, the method further comprises: before the dry compressed air is introduced into the coupling agent storage, repeating the water vapor removal step of the coupling agent vaporization cavity, which comprises sequentially performing vacuumizing the coupling agent vaporization cavity through the bypass outlet and introducing inert gas into the coupling agent vaporization cavity through the bypass inlet.

[0018] In some preferred embodiments, the method further comprises: controlling the amount of coupling agent entering the coupling agent vaporization cavity by the liquid level sensor according to the amount of coupling agent required by each branch steam pipe; before switching the branch steam pipe, increasing the temperature in the coupling agent vaporization cavity to above the vaporization temperature of the coupling agent by the steam generator, and vacuumizing the coupling agent vaporization cavity through the bypass outlet.

[0019] Preferably, the amount of coupling agent required by each branch steam pipe is divided into a preset number of portions, and the coupling agent is introduced into the coupling agent vaporization cavity in the preset number of portions by the liquid level sensor.

[0020] In some preferred embodiments, the method further comprises: when the barometer detects that the pressure in the coupling agent vaporization cavity reaches a preset pressure, turning on the mass flow meter; monitoring the temperature in the coupling agent vaporization cavity by the temperature sensor, and adjusting the heating power of the steam generator according to the monitoring results.

[0021] In a third aspect, the present application provides a coupling agent layer on a substrate surface, which is obtained by evaporation deposition using the coupling agent evaporation deposition device of the first aspect or the coupling agent evaporation deposition method of the second aspect.

[0022] In a fourth aspect, the present application provides a use in the preparation of a parylene layer on a substrate surface, which uses the coupling agent evaporation deposition device of the first aspect or the coupling agent evaporation deposition method of the second aspect or the coupling agent layer of the third aspect.

[0023] The inventor finds that the coupling agent layer and the substrate in the prior art have limited bonding strength, thereby affecting the bonding strength of the parylene layer and the substrate, the evaporation deposition device of the coupling agent sets a coupling agent storage part before the coupling agent vaporization cavity, and the coupling agent is introduced from the coupling agent storage part to the coupling agent vaporization cavity according to the type of the coupling agent and the deposition area, so that the coupling agent is prevented from being repeatedly heated by the steam generator, the coupling agent with an excessively large molecular weight is prevented from entering the holes on the surface of the substrate, the bonding force between the coupling agent and the substrate is improved, the coupling agent is prevented from being hydrolyzed due to the introduction of moisture into the coupling agent vaporization cavity when the coupling agent is directly added into the vaporization cavity, and the bonding force between the coupling agent layer and the substrate is improved; the steam pipeline between the coupling agent steam inlet and the coupling agent steam outlet is wrapped with a heat preservation layer, so that the coupling agent steam is prevented from being condensed due to cold, the coupling agent vaporizes to become small droplets, the small droplets are easily attached to the substrate after reaching the deposition cavity, become a droplet foreign matter on the surface of the substrate, and cause the coupling agent to fail to form a 'bonding' film between the parylene layer and the substrate, so that the coupling agent cannot play a role, and the bonding force between the parylene layer and the substrate is affected; at least two coupling agent steam inlets are arranged on the side wall of the vacuum deposition cavity, at least two branch steam pipelines are arranged on the side of the steam pipeline close to the coupling agent steam inlet, the at least two branch steam pipelines are respectively and one-to-one communicated with the at least two coupling agent steam inlets, and valves are arranged on the branch steam pipelines, since the deposition gas is in a dynamic flow process in the deposition cavity, fresh coupling agent steam is introduced through the coupling agent steam inlet, the coupling agent steam that fails to be deposited is extracted through the air extraction hole, the valves are opened for a preset time and then closed through the branch steam pipelines, the coupling agent steam is introduced into the vacuum deposition cavity through the at least two coupling agent steam inlets arranged at intervals in turn, the coupling agent steam is uniformly attached to the surface of the substrate, the local coupling agent gas concentration is prevented from being too large due to the diffusion and overlap of the coupling agent gas, the opportunity of mutual collision of the coupling agent molecules is increased, the coupling agent molecules are spontaneously condensed into small droplets in the vacuum deposition cavity, the coupling agent fails to form a 'bonding' film between the parylene layer and the substrate, and the bonding force between the parylene layer and the substrate is improved.

[0024] The coupling agent storage part arranged before the coupling agent vaporization cavity, the steam pipeline between the coupling agent steam inlet and the coupling agent steam outlet wrapped with the heat preservation layer, the at least two coupling agent steam inlets arranged on the side wall of the vacuum deposition cavity, the at least two branch steam pipelines arranged on the side of the steam pipeline close to the coupling agent steam inlet, the at least two branch steam pipelines respectively and one-to-one communicated with the at least two coupling agent steam inlets, and the valves arranged on the branch steam pipelines, and the step of opening the valves for a preset time and then closing the valves through the branch steam pipelines during the evaporation deposition, the synergistic effect therebetween, can significantly improve the bonding force between the parylene layer and the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of the drawings.

[0026] Figure 1 is a structural schematic diagram of an evaporation deposition device of the coupling agent of the present application;

[0027] Figure 2 is a top view structural schematic diagram of a vacuum deposition cavity of the present application.

[0028] Legend of reference signs

[0029] 10, coupling agent storage part; 11, coupling agent outlet; 12, humidity sensor;

[0030] 20, coupling agent steam generation part; 21, coupling agent vaporization cavity; 22, steam generator; 23, coupling agent inlet; 24, coupling agent steam outlet; 25, liquid level sensor; 26, air pressure gauge; 27, temperature sensor;

[0031] 30, steam pipeline; 31, mass flow meter; 32, branch steam pipeline; 33, valve;

[0032] 40, vacuum deposition cavity; 41, coupling agent steam inlet; 42, air exhaust hole. DETAILED DESCRIPTION

[0033] The endpoints of the ranges and any values disclosed herein are not limited to the precise values recited as the exact dimensions are not considered critical for the present application. The endpoints of the ranges and any values are provided as approximations only, and are understood to encompass values approximately the same as the value recited. Each numerical range is intended to include each narrower numerical range that falls within the broader range. Each maximum numerical limitation control range is intended to include each narrower numerical range falling within such broader range, as well as each individual number within such maximum limit, even if the individual number is not expressly recited.

[0034] In this document, unless otherwise indicated, the orientation words such as "up, down" are generally understood to be in the orientation shown in the drawings and in the actual application, and "inner, outer" refers to the inner and outer of the contour of the component.

[0035] In the description of the application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "transverse", "width", "thickness", "upper", "lower", "vertical", "top", "bottom", "inner", "outer", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the application.

[0036] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0038] The inventors of the present application have found that the coupling agent layer in the prior art has limited bonding force with the substrate, which affects the bonding of the paryline layer with the substrate.

[0039] For this first aspect, the present application provides an evaporation deposition device of a coupling agent, comprising:

[0040] A coupling agent storage part 10 is provided with a coupling agent outlet 11;

[0041] A coupling agent vapor generation part 20 comprises a coupling agent vaporization cavity 21, which is provided with a vapor generator 22 outside, and is provided with a coupling agent inlet 23 and a coupling agent vapor outlet 24 on the coupling agent vaporization cavity 21, and the coupling agent inlet 23 is in communication with the coupling agent outlet 11;

[0042] A vacuum deposition cavity 40, at least two coupling agent vapor inlets 41 are arranged on the side wall of the vacuum deposition cavity 40, the coupling agent vapor inlets 41 are communicated with the coupling agent vapor outlet 24 through the vapor pipeline 30, the vapor pipeline 30 is provided with at least two branch vapor pipelines 32 near one side of the coupling agent vapor inlets 41, the at least two branch vapor pipelines 32 are communicated with the at least two coupling agent vapor inlets 41 one by one, the branch vapor pipelines 32 are provided with valves 33, the vapor pipeline 30 is wrapped with a heat preservation layer, during the evaporation deposition, the step of opening the valves 33 of the branch vapor pipelines 32 for a preset time and then closing the valves 33 is carried out.

[0043] The inventor finds that the coupling agent layer and the substrate have limited bonding strength in the prior art, thereby affecting the bonding strength between the parylene layer and the substrate, further finds that the coupling agent is repeatedly heated before deposition, which easily causes the molecules in the coupling agent to polymerize, and the polymerized molecules cannot enter the pores on the surface of the substrate due to their long molecular chains and large molecular weight, thereby reducing the riveting and pinning effect of the coupling agent on the substrate, and further weakening the bonding force between the coupling agent and the substrate, the coupling agent is easily changed from gas to small droplets after vaporization, the small droplets are attached to the substrate, and a droplet foreign matter is formed on the surface of the substrate, the coupling agent cannot form a 'bonding' film between the parylene layer and the substrate, and cannot play the role of the coupling agent, thereby affecting the bonding force between the parylene layer and the substrate.

[0044] The evaporation deposition device of the coupling agent of the present application is provided with a coupling agent storage part 10 before the coupling agent vaporization cavity 21, and the coupling agent is introduced from the coupling agent storage part 10 to the coupling agent vaporization cavity 21 according to the type of the coupling agent and the deposition area as needed, which can avoid the coupling agent being repeatedly heated by the steam generator 22, avoid the coupling agent having too large a molecular weight and being unable to enter the holes on the surface of the substrate, and thus improve the bonding force of the coupling agent and the substrate. The steam pipeline 30 between the coupling agent steam inlet 41 and the coupling agent steam outlet 24 is wrapped with a heat preservation layer, which can prevent the coupling agent steam from condensing due to cold, and the coupling agent vaporizes from gas to small droplets, and the small droplets are easily attached to the substrate after reaching the deposition cavity, becoming a droplet foreign matter on the surface of the substrate, which causes the coupling agent to be unable to form a layer of 'adhesion' film between the parylene and the substrate, and thus the coupling agent cannot play a role, affecting the bonding force of the parylene layer and the substrate; at least two coupling agent steam inlets 41 are arranged at intervals on the side wall of the vacuum deposition cavity 40, at least two branch steam pipelines 32 are arranged on the side of the steam pipeline 30 close to the coupling agent steam inlet 41, the at least two branch steam pipelines 32 are respectively and one-to-one communicated with the at least two coupling agent steam inlets 41, and a valve 33 is arranged on the branch steam pipeline 32. Since the deposition gas is a dynamic flow process in the deposition cavity, fresh coupling agent steam enters through the coupling agent steam inlet 41, the coupling agent steam that is unable to be deposited is extracted through the air extraction hole 42, the valve 33 is opened for a preset time and then closed through the branch steam pipeline 32, the coupling agent steam is introduced into the vacuum deposition cavity 40 through the at least two coupling agent steam inlets 41 arranged at intervals in turn, which can make the coupling agent steam uniformly adhere to the surface of the substrate, and can avoid the coupling agent gas diffusion overlapping to cause the local coupling agent gas concentration to be too large, the coupling agent molecules to collide with each other, the coupling agent steam to spontaneously condense into small droplets in the vacuum deposition cavity 40, and thus the coupling agent to be unable to form a layer of 'adhesion' film between the parylene and the substrate, thereby improving the bonding force of the parylene layer and the substrate.

[0045] The present application can significantly improve the bonding force of the parylene layer and the substrate through the cooperation of the steps of arranging the coupling agent storage part 10 before the coupling agent vaporization cavity 21, wrapping the steam pipeline 30 between the coupling agent steam inlet 41 and the coupling agent steam outlet 24 with a heat preservation layer, arranging at least two coupling agent steam inlets 41 at intervals on the side wall of the vacuum deposition cavity 40, arranging at least two branch steam pipelines 32 on the side of the steam pipeline 30 close to the coupling agent steam inlet 41, and one-to-one communicating the at least two branch steam pipelines 32 with the at least two coupling agent steam inlets 41, and arranging a valve 33 on the branch steam pipeline 32, and opening the valve 33 for a preset time and then closing the valve 33 through the branch steam pipeline 32 during evaporation deposition.

[0046] The polymerization growth of the parylene is a mechanism of low-temperature preferred growth. The steam pipe 30 is wrapped with a thermal insulation layer, which can prevent the parylene layer from growing in the steam pipe 30 downstream of the electromagnetic valve or in the electromagnetic valve after the deposition of the coupling agent, resulting in the blockage of the steam pipe 30.

[0047] If at least two branch steam pipes 32 simultaneously introduce coupling agent gas into the vacuum deposition chamber 40, it cannot be guaranteed that the gas of each branch pipe is uniform, the coupling agent is uniformly attached to the surface of the substrate, and the coupling agent gas is easily diffused and overlapped, and the coupling agent vapor is easily condensed into small droplets in the vacuum deposition chamber 40.

[0048] In some preferred embodiments, the coupling agent storage part 10 is provided with a desiccant containing cavity and a humidity sensor 12, the desiccant in the desiccant containing cavity removes the moisture in the coupling agent storage part 10, and the humidity sensor 12 monitors the humidity in the coupling agent storage part 10. Under this preferred scheme, it is more conducive to prevent the coupling agent from hydrolyzing before deposition, and the hydrolysis process is the chemical process of coupling agent reacting with the substrate to produce a bonding effect, thereby improving the bonding force of the coupling agent to the substrate surface and the bonding force of the parylene layer to the substrate.

[0049] In some preferred embodiments, the coupling agent vaporization cavity 21 is also provided with a bypass inlet and a bypass outlet. Under this preferred scheme, by removing the water vapor in the coupling agent vaporization cavity 21 through the bypass, it can prevent the coupling agent from hydrolyzing before deposition, improve the bonding force of the coupling agent to the substrate surface, and improve the bonding force of the parylene layer to the substrate. By increasing the temperature in the coupling agent vaporization cavity 21 to above the vaporization temperature of the coupling agent through the steam generator 22, and vacuumizing the coupling agent vaporization cavity 21 through the bypass, it can prevent the coupling agent from not being easily heated and evaporated when there are dead corners in the coupling agent vaporization cavity 21, and from being in liquid form for a long time and polymerizing, thereby improving the bonding force of the coupling agent to the substrate and the bonding force of the parylene layer to the substrate.

[0050] In some preferred embodiments, the coupling agent vaporization cavity 21 is wrapped with a heat preservation layer on the outside; the coupling agent vaporization cavity 21 is provided with a liquid level sensor 25, an air pressure gauge 26 and a temperature sensor 27; a mass flow meter 31 is arranged on the steam pipeline 30 to control the amount of coupling agent vapor entering the vacuum deposition cavity 40. Under this preferred scheme, the coupling agent vaporization cavity 21 is provided with a liquid level sensor 25, and the amount of coupling agent added into the coupling agent vaporization cavity 21 is controlled to be small and multiple times. Even if there is local uneven heating in the coupling agent vaporization cavity 21 and the local temperature is a little higher, the coupling agent liquid can be evaporated in a short time because the amount of coupling agent liquid added is small, and the molecular polymerization in the coupling agent will not affect the bonding force between the coupling agent layer and the substrate. The mass flow meter 31 arranged on the steam pipeline 30 can control the flow of coupling agent vapor entering the vacuum deposition cavity 40, prevent the concentration of coupling agent vapor in the vacuum deposition cavity 40 from being too high when the steam flow is too large, and prevent the coupling agent vapor from spontaneously condensing into small droplets in the vacuum deposition cavity 40 and the deposition rate from being too fast to cause the coupling agent layer structure to be loose. It can measure the total amount of steam entering the vacuum deposition cavity 40 to prevent some positions of the substrate from not being able to deposit the coupling agent or the coupling agent layer from being too thin or too thick, so as to fully play the role of the coupling agent and improve the bonding force between the parylene layer and the substrate. The coupling agent vaporization cavity 21 is provided with an air pressure gauge 26, which can avoid the pressure of the coupling agent vaporization cavity 21 being too small to affect the accurate measurement of the flow of coupling agent vapor from the coupling agent vaporization cavity 21 by the mass flow meter 31, and avoid the pressure being too large to damage the mass flow meter 31. When the steam flow measurement is not accurate, the total amount of steam entering the vacuum deposition cavity 40 is easy to be biased, thereby affecting the full play of the role of the coupling agent and affecting the bonding force between the parylene layer and the substrate. The coupling agent vaporization cavity 21 is provided with a temperature sensor 27, which is more conducive to controlling the molecular polymerization in the coupling agent and improving the bonding force between the coupling agent layer and the substrate.

[0051] In some preferred embodiments, a rotating platform is arranged on the central axis of the vacuum deposition chamber 40 for carrying the fixed substrate, and an exhaust hole 42 is arranged on the sidewall of the vacuum deposition chamber 40, and the angle between the exhaust hole 42 and the side of the rotating platform away from the coupling agent vapor inlet 41 is 20°-40°. In this preferred scheme, the rotating platform for carrying the fixed substrate is arranged on the central axis of the vacuum deposition chamber 40, and the substrate can rotate, which can improve the uniformity of the coupling agent deposition in the circumferential direction of the substrate, prevent some positions in the circumferential direction of the substrate from being unable to deposit the coupling agent or the coupling agent layer being too thin or too thick, prevent the coupling agent gas concentration in a certain position in the vacuum deposition chamber 40 from being slightly high, and cause the local coupling agent layer of the substrate to be deposited too thick, so as to fully play the role of the coupling agent and improve the bonding force between the parylene layer and the substrate; the rotating platform for carrying the fixed substrate arranged on the central axis of the vacuum deposition chamber 40 can also promote the flow of the coupling agent gas in the deposition chamber, promote the diffusion of the coupling agent gas, make the coupling agent concentration in the deposition chamber more uniform, prevent the local coupling agent gas concentration in the deposition chamber from being too high, and the coupling agent vapor spontaneously condenses into small droplets, which cannot form a layer of 'adhesion' film between the parylene and the substrate, and cannot play the role of the coupling agent, thereby affecting the bonding force between the parylene layer and the substrate; on this basis, as shown in Figure 2 the angle between the exhaust hole 42 and the side of the rotating platform away from the coupling agent vapor inlet 41 is 20°-40°, which can be 20°, 23°, 25°, 28°, 30°, 33°, 35°, 38°, 40°, and any value therebetween, and more preferably 30°, which can further promote the diffusion of the coupling agent gas, make the coupling agent concentration in the deposition chamber more uniform, and prevent the coupling agent from condensing into small droplets. The possible principle is that this angle breaks the straight-line path of the gas from the vapor inlet to the exhaust hole, forcing the coupling agent vapor to flow along a longer and more complex trajectory in the vacuum deposition chamber 40; in addition, this angle is coordinated with the spatial limitation of the parylene gas inlet and the rotation direction of the substrate, ensuring that the gas naturally diffuses along the longest path in the vacuum (the coupling agent enters from the coupling agent vapor inlet 41 and gradually diffuses along the arc-shaped path in the rotation direction of the substrate to the exhaust hole 42), further optimizing the uniformity of the gas distribution, and ultimately enabling the coupling agent to uniformly adhere to the surface of the substrate in a gaseous form, forming a continuous and stable adhesion film, and significantly improving the bonding force between the parylene layer and the substrate.

[0052] In a second aspect, the present application provides an evaporation deposition method of a coupling agent applied to the evaporation deposition device of the coupling agent in the first aspect, comprising: placing the coupling agent into the coupling agent storage part 10, introducing dry compressed air into the coupling agent storage part 10, and pressing the coupling agent from the coupling agent outlet 11 into the coupling agent vaporization cavity 21 through the coupling agent inlet 23; the steam generator 22 heats to vaporize the coupling agent entering the coupling agent vaporization cavity 21 to form coupling agent vapor, the step of opening the valve 33 of the branch steam pipeline 32 for a preset time and then closing the valve 33, the coupling agent vapor enters the vacuum deposition cavity 40 from the coupling agent vapor outlet 24 through the steam pipeline 30 and the coupling agent vapor inlet 41, and the coupling agent layer is deposited on the surface of the substrate in the vacuum deposition cavity 40.

[0053] The evaporation deposition method of the present application places the coupling agent into the coupling agent storage part 10, and during evaporation deposition, the coupling agent is pressed from the coupling agent outlet 11 into the coupling agent vaporization cavity 21 through the coupling agent inlet 23, the coupling agent is introduced from the coupling agent storage part 10 into the coupling agent vaporization cavity 21 according to the type of the coupling agent and the deposition area, which can avoid the coupling agent being repeatedly heated by the steam generator 22, avoid the coupling agent having too large a molecular weight to enter the pores on the surface of the substrate, thereby improving the bonding force between the coupling agent and the substrate, can avoid introducing moisture into the coupling agent vaporization cavity 21 when the coupling agent is directly added to the vaporization cavity, causing the coupling agent to hydrolyze, thereby improving the bonding force between the coupling agent layer and the substrate, the step of opening the valve 33 of the branch steam pipeline 32 for a preset time and then closing the valve 33 can make the coupling agent vapor uniformly adhere to the surface of the substrate, can avoid the coupling agent gas diffusing and overlapping to cause the local coupling agent gas concentration to be too large, the coupling agent gas spontaneously condensing into small droplets, causing the coupling agent to fail to form a layer of 'adhesive' film between the parylene and the substrate, thereby improving the bonding force between the parylene layer and the substrate. The method of introducing compressed air into the coupling agent storage part 10 to press the coupling agent into the coupling agent vaporization cavity 21 is more secure because the coupling agent is an organic liquid.

[0054] In some preferred embodiments, further comprising: the desiccant in the desiccant containing cavity removes the moisture in the coupling agent storage part 10, and the humidity sensor 12 monitors the humidity in the coupling agent storage part 10 to exceed a preset value, and the desiccant is replaced and / or added. In this preferred scheme, it is more beneficial to prevent the coupling agent from hydrolyzing before deposition and improve the bonding force between the coupling agent and the surface of the substrate.

[0055] In some preferred embodiments, the method further comprises, before the step of introducing dry compressed air into the coupling agent storage 10, repeatedly performing a step of removing water vapor from the coupling agent vaporization cavity 21, which comprises sequentially performing a step of vacuumizing the coupling agent vaporization cavity 21 through the bypass outlet and a step of introducing inert gas into the coupling agent vaporization cavity 21 through the bypass inlet. In this preferred embodiment, the water vapor in the coupling agent vaporization cavity 21 is removed by repeatedly performing the steps of sequentially vacuumizing the coupling agent vaporization cavity 21 through the bypass outlet and introducing inert gas into the coupling agent vaporization cavity 21 through the bypass inlet, which is more conducive to preventing the coupling agent from hydrolyzing before deposition and improving the adhesion of the coupling agent to the substrate surface.

[0056] In some preferred embodiments, the amount of coupling agent introduced into the coupling agent vaporization cavity 21 is controlled by the liquid level sensor 25 according to the amount of coupling agent required by each branch vapor pipe 32, and the temperature in the coupling agent vaporization cavity 21 is increased to be higher than the vaporization temperature of the coupling agent by the steam generator 22 before switching the branch vapor pipe 32, and the coupling agent vaporization cavity 21 is vacuumized through the bypass outlet. In this preferred embodiment, the amount of coupling agent introduced into the coupling agent vaporization cavity 21 is controlled by the liquid level sensor 25 according to the amount of coupling agent required by each branch vapor pipe 32, so even if there is local uneven heating in the coupling agent vaporization cavity 21 and the local temperature is higher, the amount of coupling agent liquid added is small, and the coupling agent liquid can be evaporated in a short time, and the adhesion of the coupling agent layer to the substrate will not be affected by the polymerization of the molecules in the coupling agent. The temperature in the coupling agent vaporization cavity 21 is increased to be higher than the vaporization temperature of the coupling agent by the steam generator 22 before switching the branch vapor pipe 32, and the coupling agent vaporization cavity 21 is vacuumized through the bypass outlet, which is more conducive to preventing the coupling agent from not being easily heated and evaporated when there are dead corners in the coupling agent vaporization cavity 21, the coupling agent is in a liquid form for a long time and polymerizes, and thus cannot enter the pores on the substrate surface, thereby improving the adhesion of the coupling agent to the substrate and the adhesion of the parylene layer to the substrate.

[0057] Preferably, the amount of coupling agent required by each branch vapor pipe 32 is divided into a predetermined number of portions, and the coupling agent is introduced into the coupling agent vaporization cavity 21 in the predetermined number of portions by the liquid level sensor 25. In this preferred embodiment, it is more conducive to preventing local uneven heating in the coupling agent vaporization cavity 21 and local high temperatures, which can cause the molecules in the coupling agent to polymerize and affect the adhesion of the coupling agent layer to the substrate.

[0058] In some preferred embodiments, the method further comprises: when the pressure in the coupling agent vaporization cavity 21 reaches the preset pressure, the mass flow meter 31 is turned on; the temperature sensor 27 monitors the temperature in the coupling agent vaporization cavity 21, and the heating power of the steam generator 22 is adjusted according to the monitoring result. In this preferred solution, when the pressure in the coupling agent vaporization cavity 21 reaches the preset pressure, the mass flow meter 31 is turned on, which can avoid too small pressure in the coupling agent vaporization cavity 21, affecting the accurate measurement of the flow of steam from the coupling agent vaporization cavity 21 by the mass flow meter 31, and then affecting the total amount of steam entering the vacuum deposition cavity 40, so as to fully play the role of the coupling agent and improve the bonding force between the parylene layer and the substrate. Also, too large pressure can damage the mass flow meter 31; the temperature sensor 27 monitors the temperature in the coupling agent vaporization cavity 21, and the heating power of the steam generator 22 is adjusted according to the monitoring result, which is more conducive to controlling the molecular polymerization in the coupling agent and improving the bonding force between the coupling agent layer and the substrate.

[0059] In a third aspect, the present application provides a coupling agent layer on a substrate surface, which is obtained by the evaporation deposition device for coupling agent or the evaporation deposition method for coupling agent according to the first aspect or the second aspect. The coupling agent layer of the present application has significantly improved bonding force with the substrate surface.

[0060] In a fourth aspect, the present application provides an application in the preparation of a parylene layer on a substrate surface, which uses the evaporation deposition device for coupling agent according to the first aspect or the evaporation deposition method for coupling agent according to the second aspect or the coupling agent layer according to the third aspect. The parylene layer of the present application has significantly improved bonding force with the substrate surface.

[0061] The present application will be further described in detail below with reference to specific examples.

[0062] Example 1

[0063] An evaporation deposition device for coupling agent, comprising: a coupling agent storage part 10, provided with a coupling agent outlet 11, a desiccant containing cavity and a humidity sensor 12, the desiccant in the desiccant containing cavity removes moisture in the coupling agent storage part 10, and the humidity sensor 12 monitors the humidity in the coupling agent storage part 10;

[0064] A coupling agent steam generation part 20, comprising a coupling agent vaporization cavity 21, a steam generator 22 arranged outside the coupling agent vaporization cavity 21, a heat preservation layer wrapped outside the coupling agent vaporization cavity 21, a liquid level sensor 25, a pressure gauge 26 and a temperature sensor 27 arranged on the coupling agent vaporization cavity 21, a coupling agent inlet 23 and a coupling agent steam outlet 24 arranged on the coupling agent vaporization cavity 21, the coupling agent inlet 23 being in communication with the coupling agent outlet 11, and a bypass inlet and a bypass outlet arranged on the coupling agent vaporization cavity 21.

[0065] The vacuum deposition cavity 40 is provided with at least two coupling agent vapor inlets 41 on the side wall, the coupling agent vapor inlets 41 are communicated with the coupling agent vapor outlet 24 through the vapor pipeline 30, the vapor pipeline 30 is provided with a mass flow meter 31 for controlling the amount of coupling agent vapor entering the vacuum deposition cavity 40, the vapor pipeline 30 is wrapped with a heat preservation layer, the side of the vapor pipeline 30 close to the coupling agent vapor inlet 41 is provided with at least two branch vapor pipelines 32, the at least two branch vapor pipelines 32 are communicated with the at least two coupling agent vapor inlets 41 one by one, the branch vapor pipeline 32 is provided with a valve 33, during the vapor deposition, the valve 33 of each branch vapor pipeline 32 is opened for a preset time and then closed, the middle axis of the vacuum deposition cavity 40 is provided with a rotating table for carrying the fixed substrate, the side wall of the vacuum deposition cavity 40 is provided with an air exhaust hole 42, the angle between the air exhaust hole 42 and the side of the rotating table away from the coupling agent vapor inlet 41 is 30°.

[0066] A coupling agent vapor deposition method using the aforementioned vapor deposition device, the coupling agent is put into the coupling agent storage part 10, the coupling agent vaporization cavity 21 removes water vapor step is repeatedly performed, the water vapor removal step includes sequentially performing vacuumizing the coupling agent vaporization cavity 21 through the bypass outlet, introducing inert gas into the coupling agent vaporization cavity 21 through the bypass inlet, introducing dry compressed air into the coupling agent storage part 10, the coupling agent is pressed into the coupling agent vaporization cavity 21 from the coupling agent outlet 11 through the coupling agent inlet 23, the vapor generator 22 heats to vaporize the coupling agent entering the coupling agent vaporization cavity 21 to form coupling agent vapor, when the pressure gauge 26 monitors that the pressure in the coupling agent vaporization cavity 21 reaches a preset pressure, the mass flow meter 31 is opened, the valve 33 of each branch vapor pipeline 32 is opened for a preset time and then closed, the coupling agent vapor enters the coupling agent vapor inlet 41 of the vacuum deposition cavity 40 from the coupling agent vapor outlet 24 through the vapor pipeline 30, and a coupling agent layer is deposited on the surface of the substrate in the vacuum deposition cavity 40, the temperature sensor 27 monitors the temperature in the coupling agent vaporization cavity 21, and the heating power of the vapor generator 22 is adjusted according to the monitoring result, the desiccant in the desiccant containing cavity removes the moisture in the coupling agent storage part 10, and the desiccant is replaced when the humidity sensor 12 monitors that the humidity in the coupling agent storage part 10 exceeds a preset value; according to the amount of coupling agent required by each branch vapor pipeline 32, the coupling agent enters the coupling agent vaporization cavity 21, the amount of coupling agent required by each branch vapor pipeline 32 is divided into a preset number of portions, the coupling agent is controlled to enter the coupling agent vaporization cavity 21 in a preset number of portions through the liquid level sensor 25, before switching the branch vapor pipeline 32, the temperature in the coupling agent vaporization cavity 21 is increased to be higher than the vaporization temperature of the coupling agent through the vapor generator 22, and the coupling agent vaporization cavity 21 is vacuumized through the bypass outlet;

[0067] After the deposition of the coupling agent, the electromagnetic valve between the coupling agent storage 10 and the coupling agent vaporization cavity 21 is closed, and the bypass outlet on the coupling agent vaporization cavity 21 is opened, so that the residual coupling agent vapor in the coupling agent vaporization cavity 21 is pumped away by the vacuum system. When the pressure in the coupling agent vaporization cavity 21 returns to atmospheric pressure, the heating device of the vapor generator 22 is turned off, and the coupling agent vaporization cavity 21 is cooled. After the vacuum system pumps the vacuum deposition cavity 40 to the vacuum degree before the deposition of the coupling agent, the parathyroid hormone evaporation deposition process is started, and the deposition and growth of the parathyroid hormone film layer are performed.

[0068] The coupling agent is uniformly attached to the surface of the substrate. According to the ASTM D3359 crosshatch test method, the adhesion of the parathyroid hormone layer to the substrate is tested, and the detection result of the crosshatch test method is divided into 0B-5B. The higher the grade number, the stronger the adhesion. The crosshatch test method includes making a line on the surface of the coating according to the standard, and then using a special adhesive tape to adhere, to judge whether the coating can be adhered by the adhesive tape, to judge the adhesion of the coating. In this embodiment, the detection result of the adhesion of the parathyroid hormone layer to the substrate is 5B.

[0069] Example 2

[0070] The evaporation deposition method of the coupling agent of Reference Example 1 is used for reference, except that the following steps are not performed. Before switching the branch steam pipe 32, the temperature in the coupling agent vaporization cavity 21 is increased to be higher than the vaporization temperature of the coupling agent by the vapor generator 22, and the coupling agent vaporization cavity 21 is pumped by the bypass outlet. In this embodiment, the detection result of the adhesion of the parathyroid hormone layer to the substrate is 4B.

[0071] Example 3

[0072] The evaporation deposition method of the coupling agent of Reference Example 1 is used for reference, except that the following steps are not performed. The amount of coupling agent required by each branch steam pipe 32 is divided into a preset number of portions, and the coupling agent is controlled to enter the coupling agent vaporization cavity 21 in a preset number of portions by the liquid level sensor 25. In this embodiment, the detection result of the adhesion of the parathyroid hormone layer to the substrate is 4B.

[0073] Example 4

[0074] The evaporation deposition method of the coupling agent of Reference Example 1 is used for reference, except that the angle between the pumping hole 42 and the side of the rotary table away from the coupling agent steam inlet 41 is 40°. In this embodiment, the detection result of the adhesion of the parathyroid hormone layer to the substrate is 4B.

[0075] Comparative Example 1

[0076] The evaporation deposition device and the evaporation deposition method of the coupling agent of the comparative example 1 are referred to, except that the valves 33 on the branch steam pipes 32 are opened simultaneously, and the coupling agent steam is introduced into the vacuum deposition cavity 40 through at least two branch steam pipes 32, instead of opening the valve 33 of each branch steam pipe 32 for a preset time and then closing the valve 33. The uniformity of the coupling agent adhered to the surface of the substrate is poor, the bonding force between the Pergarelin layer and the substrate is detected, and the detection result is 2B.

[0077] Comparative example 2

[0078] The evaporation deposition device and the evaporation deposition method of the coupling agent of the comparative example 1 are referred to, except that only one coupling agent steam inlet 41 is arranged on the side wall of the vacuum deposition cavity 40, and the uniformity of the coupling agent adhered to the surface of the substrate is poor, the bonding force between the Pergarelin layer and the substrate is detected, and the detection result is 1B.

[0079] Compared with the branch steam pipes 32 being opened simultaneously, and the coupling agent steam being introduced into the vacuum deposition cavity 40 through at least two branch steam pipes 32, and only one coupling agent steam inlet 41 being arranged on the side wall of the vacuum deposition cavity 40, the valve 33 of each branch steam pipe 32 being opened for a preset time and then being closed, a layer of coupling agent adhesive film can be uniformly formed on the surface of the substrate, and the bonding force between the Pergarelin layer and the substrate can be improved. Compared with the comparative example 1 and the example 2, before switching the branch steam pipes 32, the temperature in the coupling agent vaporization cavity 21 is increased to be higher than the vaporization temperature of the coupling agent by the steam generator 22, and the coupling agent vaporization cavity 21 is vacuumized through the bypass outlet, which is more conducive to improving the bonding force between the Pergarelin layer and the substrate. Compared with the comparative example 1 and the example 3, the amount of the coupling agent required by each branch steam pipe 32 is divided into a preset number of portions, and the coupling agent is controlled to enter the coupling agent vaporization cavity 21 in the preset number of portions by the liquid level sensor 25, which is more conducive to improving the bonding force between the Pergarelin layer and the substrate.

[0080] The preferred embodiments of the present application are described in detail above, but the present application is not limited thereto. Within the technical concept of the present application, various simple modifications can be made to the technical solutions of the present application, including various technical features being combined in any other suitable manner, and these simple modifications and combinations should also be considered as disclosed by the present application, and all belong to the protection scope of the present application.

Claims

1. An evaporation deposition apparatus of a coupling agent, characterized by, The coupling agent storage part is provided with a coupling agent outlet. The coupling agent vapor generation part includes a coupling agent vaporization cavity, which is provided with a vapor generator outside, and is provided with a coupling agent inlet and a coupling agent vapor outlet on the coupling agent vaporization cavity, and the coupling agent inlet is in communication with the coupling agent outlet; the coupling agent is introduced into the coupling agent vaporization cavity from the coupling agent storage part according to the type of the coupling agent and the deposition area as needed; the vacuum deposition cavity is provided with at least two coupling agent vapor inlets on the side wall at intervals, the coupling agent vapor inlets are in communication with the coupling agent vapor outlet through a vapor pipeline, the vapor pipeline is provided with at least two branch vapor pipelines on the side close to the coupling agent vapor inlet, the at least two branch vapor pipelines are in one-to-one communication with the at least two coupling agent vapor inlets respectively, the branch vapor pipeline is provided with a valve, the vapor pipeline is wrapped with a heat preservation layer, and the vacuum deposition cavity is provided with an air exhaust hole on the side wall; during evaporation deposition, the step of opening the valve of each branch vapor pipeline for a preset time and then closing the valve is performed. The coupling agent storage part is provided with a desiccant containing cavity and a humidity sensor, the desiccant in the desiccant containing cavity removes moisture in the coupling agent storage part, and the humidity sensor monitors the humidity in the coupling agent storage part. The coupling agent vaporization cavity is also provided with a bypass inlet and a bypass outlet.

2. The vapor deposition apparatus according to claim 1, wherein The coupling agent vaporization cavity is wrapped with a heat preservation layer on the outside; the coupling agent vaporization cavity is provided with a liquid level sensor, a barometer and a temperature sensor; the vapor pipeline is provided with a mass flow meter for controlling the amount of coupling agent vapor entering the vacuum deposition cavity.

3. The vapor deposition apparatus according to claim 1, wherein A rotating table is arranged on the central axis of the vacuum deposition cavity, the rotating table is used to carry a fixed substrate, and the included angle between the air exhaust hole and the side of the rotating table away from the coupling agent vapor inlet is 20°-40°.

4. The vapor deposition apparatus according to claim 1, wherein The coupling agent is placed in the coupling agent storage part, dry compressed air is introduced into the coupling agent storage part, the coupling agent is pressed into the coupling agent vaporization cavity from the coupling agent outlet through the coupling agent inlet, the coupling agent is introduced into the coupling agent vaporization cavity from the coupling agent storage part according to the type of the coupling agent and the deposition area as needed; the coupling agent in the coupling agent vaporization cavity is vaporized to form coupling agent vapor by heating of the vapor generator, the step of opening the valve of each branch vapor pipeline for a preset time and then closing the valve is performed, the coupling agent vapor enters the coupling agent vapor inlet of the vacuum deposition cavity from the coupling agent vapor outlet through the vapor pipeline, and a coupling agent layer is deposited on the surface of the substrate in the vacuum deposition cavity.

5. The vapor deposition apparatus according to claim 1, wherein The coupling agent is placed in the coupling agent storage part, dry compressed air is introduced into the coupling agent storage part, the coupling agent is pressed into the coupling agent vaporization cavity from the coupling agent outlet through the coupling agent inlet, the coupling agent is introduced into the coupling agent vaporization cavity from the coupling agent storage part according to the type of the coupling agent and the deposition area as needed; the coupling agent in the coupling agent vaporization cavity is vaporized to form coupling agent vapor by heating of the vapor generator, the step of opening the valve of each branch vapor pipeline for a preset time and then closing the valve is performed, the coupling agent vapor enters the coupling agent vapor inlet of the vacuum deposition cavity from the coupling agent vapor outlet through the vapor pipeline, and a coupling agent layer is deposited on the surface of the substrate in the vacuum deposition cavity.

6. An evaporation deposition method of a coupling agent applied to an evaporation deposition apparatus of the coupling agent according to any one of claims 1 to 5, characterized by, The coupling agent is placed in the coupling agent storage part, dry compressed air is introduced into the coupling agent storage part, the coupling agent is pressed into the coupling agent vaporization cavity from the coupling agent outlet through the coupling agent inlet, the coupling agent is introduced into the coupling agent vaporization cavity from the coupling agent storage part according to the type of the coupling agent and the deposition area as needed; the coupling agent in the coupling agent vaporization cavity is vaporized to form coupling agent vapor by heating of the vapor generator, the step of opening the valve of each branch vapor pipeline for a preset time and then closing the valve is performed, the coupling agent vapor enters the coupling agent vapor inlet of the vacuum deposition cavity from the coupling agent vapor outlet through the vapor pipeline, and a coupling agent layer is deposited on the surface of the substrate in the vacuum deposition cavity. The coupling agent is placed in the coupling agent storage part, dry compressed air is introduced into the coupling agent storage part, the coupling agent is pressed into the coupling agent vaporization cavity from the coupling agent outlet through the coupling agent inlet, the coupling agent is introduced into the coupling agent vaporization cavity from the coupling agent storage part according to the type of the coupling agent and the deposition area as needed; the coupling agent in the coupling agent vaporization cavity is vaporized to form coupling agent vapor by heating of the vapor generator, the step of opening the valve of each branch vapor pipeline for a preset time and then closing the valve is performed, the coupling agent vapor enters the coupling agent vapor inlet of the vacuum deposition cavity from the coupling agent vapor outlet through the vapor pipeline, and a coupling agent layer is deposited on the surface of the substrate in the vacuum deposition cavity.

7. The method of evaporative deposition according to claim 6, wherein ​ ​ 8. The method of evaporative deposition according to claim 6, wherein ​ ​ 9. The method of evaporative deposition according to claim 6, wherein, controlling the amount of coupling agent entering the coupling agent vaporization cavity by a liquid level sensor; before switching the branch vapor pipe, increasing the temperature in the coupling agent vaporization cavity to be higher than the vaporization temperature of the coupling agent by a steam generator, and vacuumizing the coupling agent vaporization cavity through a bypass outlet.

10. The method of evaporative deposition according to claim 9, wherein, dividing the amount of coupling agent required by each branch vapor pipe into a preset number of portions, and controlling the coupling agent to enter the coupling agent vaporization cavity in the preset number of portions by a liquid level sensor.

11. The method of evaporative deposition according to claim 6, wherein Further comprising: when the barometer monitors that the pressure in the coupling agent vaporization cavity reaches a preset pressure, opening the mass flow meter; a temperature sensor monitors the temperature in the coupling agent vaporization cavity, and regulates the heating power of the steam generator according to the monitoring result.

12. A primer layer on a surface of a substrate, characterized in that, evaporating and depositing by the coupling agent evaporation and deposition device of any one of claims 1-5 or the coupling agent evaporation and deposition method of any one of claims 6-11.

13. Use in the preparation of a layer of parylene on a substrate surface, characterized in that the application of the coupling agent layer according to the coupling agent evaporation and deposition device of any one of claims 1-5 or the coupling agent evaporation and deposition method of any one of claims 6-11 or the coupling agent layer of claim 12.

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