Processing method of spring sleeve integrated probe and probe

Abstract

The invention discloses a processing method of a spring sleeve integrated probe and the probe, and the method comprises the following steps: S1, processing spring wires into a spring sleeve with a close winding area and an elastic area through a spring machine, and enabling the adjacent spring wires in the close winding area to be attached; s2, the dense winding area of the spring sleeve is clamped through a clamping device, the dense winding area is welded through a brazing machine, the adjacent spring wires are fixed, and gaps between the adjacent spring wires are filled; s3, the inner surface of the welded spring sleeve is polished; s4, carrying out electroplating treatment on the surface of the whole spring sleeve by utilizing an electroplating process; and S5, cleaning and drying the electroplated spring sleeve, and then assembling the spring sleeve, the upper probe body and the lower probe body to form the test probe. By improving the spring structure, the purposes of meeting the stable performance requirement and reducing the cost can be achieved.

Description

Technical Field

[0001] This application relates to the field of chip testing, and more specifically, to a method for fabricating a spring sleeve integrated probe and the probe itself. Background Technology

[0002] During chip testing, a connection is typically established between the chip and the test board via probes. Since the chip is powered during testing, the probe's conductivity and current-carrying capacity are crucial performance indicators for chip testing. Existing semiconductor test probes mainly include... Figure 1 The four-part type shown is as follows: Figure 2 The three-part type shown and such Figure 3 The two-part structure shown is as follows: the four-part probe consists of an upper needle 1, a sleeve 4, a spring 2, and a lower needle 3; the three-part probe consists of an upper needle 1, a spring 2, and a lower needle 3; and the two-part probe consists of an upper needle 1 and a spring 2.

[0003] Of the three structures mentioned above, the four-part type offers stable current carrying capacity and resistance, but has more components, higher cost, and complex assembly. The three-part type is simple in structure, low in material cost, and easy to assemble, but current flows through a longer spring wire, resulting in poor current carrying capacity and unstable resistance. Similarly, the two-part type is also simple in structure, low in material cost, and easy to assemble, but current flows through a longer spring wire, resulting in poor current carrying capacity and unstable resistance. Both the three-part and two-part types require a longer spring wire for current to conduct, and the relatively long and thin spring wire reduces current carrying capacity, affecting the probe's current withstand rating. These types of probes can only be used in testing situations where low current and low resistance requirements are not necessary.

[0004] For the reasons mentioned above, those skilled in the art urgently need to improve the existing probe structure and seek a test probe with fewer parts, easy assembly, high current resistance, and stable resistance, which can achieve stable performance requirements while reducing costs. Summary of the Invention

[0005] The main purpose of this application is to provide a processing method and probe for an integrated spring sleeve probe, so as to solve the problems of inconvenient assembly or poor stability of multiple parts in related technologies. By improving the existing structure, the goal is to achieve both stable performance requirements and cost reduction.

[0006] To achieve the above objectives, firstly, this application provides a method for manufacturing a spring sleeve integrated probe, comprising the following steps: S1. Using a spring machine, spring wire is processed into a spring sleeve with a tightly wound area and an elastic area, and adjacent spring wires are in close contact within the tightly wound area. S2. The tightly wound area of ​​the spring sleeve is clamped by the clamping device, and the tightly wound area is welded by the brazing machine to fix the adjacent spring wires and fill the gap between the adjacent spring wires. S3. Polish the inner surface of the welded spring sleeve. S4. Electroplating process is used to electroplat the entire surface of the spring sleeve. S5. After the electroplating is completed, the spring sleeve is cleaned and dried, and then assembled with the upper needle body and the lower needle body to form a test probe.

[0007] A further improvement is that the electroplating process in step S4 specifically includes immersing the spring sleeve in an electroplating bath containing an electroplating solution, applying a current density of 2-3.0A, a temperature of 50-60℃, and an electroplating time of 3-8 minutes to form a nickel layer, and then applying a current density of 0.5-1.5A, a temperature of 55-65℃, and an electroplating time of 1-5 minutes to form a gold layer.

[0008] A further improvement is that the thickness of the electroplated nickel layer is 1-2 micrometers, and the thickness of the electroplated gold layer is 1-1.5 micrometers.

[0009] A further improvement is that the length ratio between the tightly wound area and the elastic area of ​​the spring sleeve is 1:0.5-0.8.

[0010] A further improvement is that the spring sleeve is machined from a single piece of spring wire.

[0011] To achieve the above objectives, in a second aspect, this application provides a spring-integrated probe, which is manufactured using the aforementioned spring-sleeve integrated probe manufacturing method.

[0012] A further improvement is that the device includes an upper needle body, a lower needle body, and a spring sleeve fitted between a first connecting portion of the upper needle body and a second connecting portion of the lower needle body. The spring sleeve includes a tightly wound area and an elastic area. Both the first connecting portion and the second connecting portion are in contact with the inner wall of the tightly wound area. Adjacent spring wires in the tightly wound area of ​​the spring sleeve are fixed by welding. The surface of the spring sleeve has an electroplated layer.

[0013] Compared with existing technologies, its advantages are as follows: by modifying the existing spring to have a tightly wound area and an elastic area, the test probe assembled in this way has the same current carrying capacity and resistance stability as the four-part probe in the existing technology. Moreover, the absence of the sleeve component reduces costs and saves manpower during assembly. Compared with the three-part test probe in the existing technology, there is no increase in the number of components, and the cost and manpower cost during assembly are similar, but it has higher current carrying capacity and resistance stability. Attached Figure Description

[0014] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings: Figure 1 It is a four-part test probe structure; Figure 2 It is a three-part test probe structure; Figure 3 It is a two-part test probe structure; Figure 4 This is a schematic diagram of the present invention; Figure 5 This is an exploded view of the invention; Figure 6 This is a schematic diagram of a spring sleeve.

[0015] The components are: 1. Upper needle; 2. Spring; 3. Lower needle; 4. Sleeve; 5. Upper needle body; 6. Lower needle body; 7. Spring sleeve. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0017] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0018] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0019] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0020] In addition, the term "multiple" should mean two or more.

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] A method for manufacturing a spring sleeve integrated probe includes the following steps: S1. Using a spring machine, spring wire is processed into a spring sleeve with a tightly wound area and an elastic area. Adjacent spring wires are in close contact in the tightly wound area. It is preferable to use a whole spring wire for processing, that is, the spring sleeve has high overall strength after processing. S2. The tightly wound area of ​​the spring sleeve is clamped by the clamping device, and the tightly wound area is welded by the brazing machine to fix the adjacent spring wires and fill the gap between the adjacent spring wires. The tightly wound area is welded by brazing, which not only realizes the fixed connection between the adjacent spring wires, but also fills the gap between the adjacent spring wires on the inner and outer sides of the spring sleeve. S3. Polish the inner surface of the welded spring sleeve. The inner surface of the spring sleeve will be uneven after brazing. When it is directly applied to the probe, its flow resistance and resistance value are not stable enough. Therefore, polishing is used to improve its flatness. S4. Electroplating is used to electroplat the entire surface of the spring sleeve to further improve its flow resistance and stability. S5. After the electroplating is completed, the spring sleeve is cleaned and dried, and then assembled with the upper needle body and the lower needle body to form a test probe.

[0023] Finally, the probe processed in the above manner has a spring sleeve divided into two parts. The tightly wound area contacts the connecting parts of the upper and lower needle bodies respectively, achieving conductivity, while the elastic area provides elasticity. Its performance is at least equivalent to, or even better than, a four-part probe, and even better than a three-part or two-part probe. In terms of assembly, compared to the four-part probe, the sleeve, a core component, is added, which reduces costs and greatly simplifies the installation steps.

[0024] In addition, compared to the application of spring sleeves that directly include both the tightly wound area and the elastic area on probes, the tightly wound area is not fixed. As a result, the connection between the upper and lower needle bodies cannot guarantee good contact with the tightly wound area. Moreover, the surface roughness of the tightly wound area of ​​the spring sleeve is large, which results in poor resistance stability.

[0025] Preferably, the electroplating process in step S4 specifically includes immersing the spring sleeve in an electroplating tank containing an electroplating solution, and forming a nickel layer by passing a current density of 2-3.0A, a temperature of 50-60℃, and an electroplating time of 3-8 minutes, followed by forming a gold layer by passing a current density of 0.5-1.5A, a temperature of 55-65℃, and an electroplating time of 1-5 minutes.

[0026] More preferably, the thickness of the electroplated nickel layer is 1-2 micrometers, and the thickness of the electroplated gold layer is 1-1.5 micrometers.

[0027] More preferably, the length ratio between the tightly wound area and the elastic area of ​​the spring sleeve is 1:0.5-0.8.

[0028] like Figures 4-6 As shown, a spring sleeve integrated probe includes an upper needle body 5, a lower needle body 6, and a spring sleeve 7 sleeved between a first connecting part of the upper needle body 5 and a second connecting part of the lower needle body 6. The spring sleeve 7 includes a tightly wound area and an elastic area, and both the first connecting part and the second connecting part are in contact with the inner sidewall of the tightly wound area.

[0029] In order to ensure the current flow and controllable elastic force, the length ratio between the tightly wound area and the elastic area of ​​the spring sleeve 7 is 1:0.5-0.8, depending on the specific structure.

[0030] The key point of this solution is that the spring sleeve 7 includes a tightly wound area. The adjacent spring wires in the tightly wound area of ​​the spring sleeve 7 are brought together using the tightly wound technique, and then the adjacent spring wires in the tightly wound area of ​​the spring sleeve 7 are fixed by welding. Preferably, the adjacent spring wires in the tightly wound area of ​​the spring sleeve 7 are fixed by micro-welding.

[0031] Micro-welding includes one of laser micro-welding, arc micro-welding, and resistance micro-welding. Micro-welding can not only achieve tiny, high-precision connections, but also provide good electrical and mechanical properties, ensuring the reliability of the connection. In addition, the heat-affected zone of micro-welding is small, which can reduce thermal damage and deformation to surrounding materials.

[0032] Therefore, there are no gaps between the spring wires in the tightly wound area, which allows the tightly wound area to replace the sleeve in the four-part test probe. After the first connecting part of the upper needle body 5 and the second connecting part of the lower needle body 6 come into contact with the tightly wound area, they form a current-carrying conductor with a shorter current-carrying length. The elastic area of ​​the spring sleeve 7 generates elastic force, and the current is transmitted through the first connecting part of the upper needle body 5 to the tightly wound area and then to the second connecting part of the lower needle body 6, thereby achieving the purpose of current transmission. Moreover, the elastic area generates controllable elastic force, which saves the manufacturing and assembly of the sleeve, greatly reduces labor costs, and relatively improves the electrical performance of the probe.

[0033] Preferably, to further improve the electrical performance of the probe, the surface of the spring sleeve 7 has an electroplated layer, which is composed of nickel and gold, with a thickness of 1-2 micrometers for nickel and 1-1.5 micrometers for gold. The electroplating layer not only seals the tightly wound area of ​​the spring sleeve 7 but also further increases its flow resistance. The table below compares the cost, flow resistance, and resistance of the four-part test probe and the three-part test probe. parameter Four-part test probe Three-part test probe This embodiment cost high Low Low Flow resistance excellent inferior excellent resistance Low high Low The comparison in the table above clearly highlights the advantages of the test probe provided in this embodiment in terms of cost and performance.

[0034] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for manufacturing a spring sleeve integrated probe, characterized in that: Includes the following steps: S1. Using a spring machine, spring wire is processed into a spring sleeve with a tightly wound area and an elastic area, and adjacent spring wires are in close contact within the tightly wound area. S2. The tightly wound area of ​​the spring sleeve is clamped by the clamping device, and the tightly wound area is welded by the brazing machine to fix the adjacent spring wires and fill the gap between the adjacent spring wires. S3. Polish the inner surface of the welded spring sleeve. S4. Electroplating process is used to electroplat the entire surface of the spring sleeve. S5. After the electroplating is completed, the spring sleeve is cleaned and dried, and then assembled with the upper needle body and the lower needle body to form a test probe.

2. The processing method of the spring sleeve integrated probe as described in claim 1, characterized in that: The electroplating process described in step S4 specifically includes immersing the spring sleeve in an electroplating tank containing an electroplating solution, applying a current density of 2-3.0A, a temperature of 50-60℃, and an electroplating time of 3-8 minutes to form a nickel layer, and then applying a current density of 0.5-1.5A, a temperature of 55-65℃, and an electroplating time of 1-5 minutes to form a gold layer.

3. The processing method of the spring sleeve integrated probe as described in claim 1, characterized in that: The thickness of the electroplated nickel layer is 1-2 micrometers, and the thickness of the electroplated gold layer is 1-1.5 micrometers.

4. The processing method of the spring sleeve integrated probe as described in claim 1, characterized in that: The length ratio between the tightly wound area and the elastic area of ​​the spring sleeve is 1:0.5-0.

8.

5. The processing method of the spring sleeve integrated probe as described in claim 1, characterized in that: The spring sleeve is machined from a single spring wire.

6. A spring-integrated probe, characterized in that: It is manufactured by the processing method of the spring sleeve integrated probe as described in any one of claims 1-5.

7. The spring-integrated probe as described in claim 1, characterized in that: The device includes an upper needle body, a lower needle body, and a spring sleeve fitted between a first connecting part of the upper needle body and a second connecting part of the lower needle body. The spring sleeve includes a tightly wound area and an elastic area. Both the first connecting part and the second connecting part are in contact with the inner wall of the tightly wound area. Adjacent spring wires in the tightly wound area of ​​the spring sleeve are fixed by welding. The surface of the spring sleeve has an electroplated layer.

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