Automatic acquisition control system for measuring temperature of initial mold for glass manufacturing

Abstract

The invention provides an initial mold temperature measurement automatic acquisition control system for glass manufacturing. The initial mold temperature measurement automatic acquisition control system comprises a high-precision high-temperature-resistant K-type sheathed thermocouple temperature sensor, a single-shielding K-type compensation wire, an analog quantity acquisition module and an on-state touch screen, the thermocouple sensor is fixedly mounted in a temperature measuring hole between the inner cavity and the outer diameter of the primary mold through a mechanical drilling hole, and the detection end of the thermocouple sensor is in direct contact with the metal surface of the primary mold; one end of the single-shielding K-type compensation wire is connected with the thermocouple sensor, and the other end passes through the stainless steel hose and then is connected to the analog quantity acquisition module to form an anti-interference shielding structure; the analog quantity acquisition module is in communication connection with the on-state touch screen through an industrial bus; data processing software is arranged in the on-state touch screen, so that the functions of displaying temperature data in real time, recording a curve in a process interval of 370-390 DEG C, setting an over-limit alarm threshold value and correcting the temperature are realized; the system calibrates the sensor and the acquisition module through the signal generator, so that the measurement precision is controlled in a range of + / -2 DEG C, and the temperature data run-out value is less than or equal to 1 DEG C.

Description

Technical Field

[0001] This invention belongs to the field of primary mold temperature measurement, and specifically relates to an automatic acquisition and control system for primary mold temperature measurement in glass manufacturing. Background Technology

[0002] Currently, in the glass bottle manufacturing process, precise control of the initial mold temperature is a core factor determining product quality. Traditional temperature measurement technologies have significant shortcomings, hindering improvements in production efficiency and product qualification rates. Existing technologies mainly rely on manual periodic inspections, such as technicians inserting thermocouples into the initial mold cavity for point measurements and manually recording data, or using handheld infrared thermometers to obtain readings by contacting the outer surface of the mold.

[0003] These methods require frequent removal of equipment safety barriers, which is not only highly dangerous to operate but also takes several minutes per test, resulting in extremely low testing frequency (usually only once a day or once per shift). This makes it impossible to capture the dynamic temperature fluctuations of the initial mold during continuous production, severely lagging behind real-time control requirements. In terms of accuracy, contact temperature measurement is prone to errors exceeding ±5℃ due to thermocouple misalignment or poor contact. Non-contact infrared methods are affected by environmental moisture, mold surface oxide layers, and installation angles, with actual measurement deviations reaching as high as ±20℃, far exceeding the ±2℃ accuracy threshold required for glass forming processes. Furthermore, the data obtained by traditional methods is discrete and discontinuous, making it difficult to establish a precise correlation model between temperature and product quality (such as bottle mouth deformation and uneven wall thickness), leaving process optimization without data support.

[0004] At the control system level, existing rotary kilns generally use a fixed airflow cooling mode, which cannot adjust the air volume in real time according to the initial mold temperature. When the temperature is abnormal, operators rely on experience to manually adjust the cooling parameters, resulting in a response delay of up to tens of minutes. This causes the initial mold temperature to fluctuate by more than ±10℃, directly leading to an increase in product defect rate. Insufficient system integration further exacerbates the management difficulty. Temperature data is independent of the production management system and must be transmitted through paper reports or manual reporting, resulting in prominent information silos. Managers cannot monitor the temperature status of multiple units in real time, making it even more difficult to formulate collaborative control strategies. At the hardware level, traditional contact thermocouples require drilling and welding to fix them in the initial mold body. The installation process is complex and disassembly and maintenance are difficult. Production stoppages to replace sensors cause production losses. Although non-contact solutions eliminate installation, they are limited by mold movement vibration and high maintenance costs, resulting in poor long-term stability.

[0005] Meanwhile, the signal transmission system has weak anti-interference capabilities. Unshielded wires are susceptible to interference in strong electromagnetic environments, leading to data fluctuations (typical values ​​> ±3℃). Furthermore, unreasonable wiring paths are more prone to mechanical wear and tear, causing open circuits. These defects collectively make it difficult for traditional technologies to meet the requirements of modern glass production, which demand high precision, high stability, and real-time feedback. Therefore, a systematic solution integrating automated temperature measurement and closed-loop control is urgently needed to address these issues. Summary of the Invention

[0006] This invention proposes an automatic temperature acquisition and control system for glass manufacturing molds, which solves the problems of inaccurate real-time monitoring and control of glass mold temperature, insufficient anti-interference ability, and achieves continuous temperature measurement with an accuracy of ±2℃. It also establishes a temperature-mass linkage control mechanism.

[0007] The technical solution of this invention is implemented as follows: An automatic temperature acquisition and control system for a glass manufacturing primary mold includes a high-precision, high-temperature resistant K-type armored thermocouple temperature sensor, a single-shielded K-type compensating wire, an analog quantity acquisition module, and a through-screen touchscreen. The thermocouple sensor is fixedly installed in the temperature measurement hole between the inner cavity and outer diameter of the primary mold through mechanical drilling, with its probe end in direct contact with the metal surface of the primary mold. One end of the single-shielded K-type compensating wire is connected to the thermocouple sensor, and the other end passes through a stainless steel flexible tube and is connected to the analog quantity acquisition module, forming an anti-interference shielding structure. The analog quantity acquisition module is communicatively connected to the through-screen touchscreen via an industrial bus. The through-screen touchscreen has built-in data processing software to realize real-time display of temperature data (370-390°C). The system features temperature range curve recording, over-limit alarm threshold setting, and temperature correction functions. It calibrates sensors and acquisition modules via a signal generator to ensure measurement accuracy is within ±2℃, with temperature data fluctuations ≤1℃. The thermocouple sensors are installed away from the initial mold movement mechanism, and their wiring is fully wrapped in stainless steel flexible tubing to isolate mechanical vibration and electromagnetic interference. The system includes a daily maintenance mechanism: operators check the sensor's appearance daily, maintenance personnel check the wire signal quality weekly, and a spare sensor is provided for fault replacement. A correlation model is established between the temperature data and bottle-making quality; when the temperature exceeds the 370-390℃ range, the system triggers an alarm, guiding adjustments to the cooling airflow parameters to maintain the ideal temperature range.

[0008] Existing technologies suffer from three major flaws: Inefficient and outdated detection methods: Traditional manual inspections (1-2 times daily) or infrared non-contact temperature measurement (deviation ±20℃) cannot capture dynamic temperature fluctuations, and installation locations are limited by mold movement, resulting in discrete data and a lack of basis for process optimization. Poor signal transmission reliability: Unshielded wires are susceptible to interference in strong electromagnetic environments, causing data jumps >±3℃; unisolated wiring paths are prone to wear and breakage due to mechanical vibration; and thermocouples require production stoppage for maintenance after welding and fixing. Lack of closed-loop control: Fixed cold air flow patterns are disconnected from temperature data; manual adjustment of cooling parameters based on experience results in a response delay exceeding 10 minutes; temperature fluctuations >±10℃ cause defects such as bottle mouth deformation and uneven wall thickness.

[0009] The key technical challenges overcome by this solution are: High-precision dynamic monitoring: Overcoming the long-term stability problem of contact sensors in high-temperature and vibration environments, a K-type armored thermocouple is installed in direct contact with the metal surface (the temperature sensing hole extends to the solid layer between the inner cavity and outer diameter). Combined with online calibration using a signal generator, the accuracy is improved to ±2℃ with a fluctuation value ≤1℃, achieving continuous data acquisition at the second level. Anti-interference transmission architecture: To address the dual interference of strong electromagnetic fields and mechanical vibration, an innovative double-shielding structure of "single-shielded compensating wire + full-length stainless steel flexible hose" is adopted. The two ends of the flexible hose are sealed and clamped to the static base, blocking external interference sources and ensuring signal transmission stability. Temperature-quality closed-loop control: A precise correlation model between the 370-390℃ range and product quality is established. When the temperature exceeds the limit, the system automatically alarms and outputs a cooling air adjustment command, reducing the manual response delay from minutes to seconds, and narrowing the temperature fluctuation range from ±10℃ to ±2℃.

[0010] In a preferred embodiment, the mounting structure of the thermocouple sensor includes a cylindrical temperature measuring hole machined on the initial mold body. The axis of the temperature measuring hole is perpendicular to the inner surface of the initial mold cavity, and its depth terminates at the metal solid layer between the inner cavity and the outer diameter. The sensor probe end is tightly attached to the metal surface at the bottom of the hole by high-temperature thermal conductive paste and is axially pressed and fixed by threaded fasteners. At the same time, a high-temperature sealant is used to fill the gap between the sensor and the hole wall to isolate external thermal radiation interference.

[0011] As a preferred embodiment, the anti-interference shielding structure specifically consists of an inner single-shielded K-type compensating wire and an outer stainless steel flexible conduit for double protection; both ends of the stainless steel flexible conduit are sealed to the sensor junction box and the interface box of the analog quantity acquisition module through waterproof connectors, and the entire conduit is fixed to the initial mold static base with segmented clamps to form a continuous electromagnetic shielding channel and mechanical vibration isolation layer.

[0012] As a preferred embodiment, the software system built into the touch screen includes a temperature dynamic analysis module. The temperature dynamic analysis module compares the current temperature data with the preset process range threshold in real time. When the data exceeds the threshold range for three consecutive sampling cycles, it automatically triggers an audible and visual alarm and generates a temperature anomaly event log. At the same time, it links with the production process database to output cooling air parameter adjustment suggestions.

[0013] As a preferred implementation, the fault replacement mechanism specifically includes setting a parallel redundant interface at the input end of the analog quantity acquisition module, and connecting the backup thermocouple sensor to the redundant interface through a quick-connect high-temperature connector; when the main sensor fails, the system automatically switches to the backup sensor data channel, generates a sensor fault code and location information on the touch screen, and simultaneously starts the data continuity compensation algorithm.

[0014] The beneficial effects of this invention, achieved by adopting the above technical solutions, are as follows: This system, through the combination of direct contact temperature measurement and a dual anti-interference architecture, significantly improves the authenticity and accuracy of temperature monitoring, laying a reliable data foundation for production process optimization. The real-time continuous monitoring mechanism completely replaces the traditional manual inspection mode, greatly reducing production interruption time during the inspection process; the linkage response mechanism between over-limit alarms and cooling parameter adjustments effectively compresses the temperature anomaly handling cycle, significantly reducing the product defect rate. The modular hardware design, combined with a quick replacement solution, significantly shortens maintenance time, and the fully protected stainless steel hose structure greatly extends the service life of signal transmission components, achieving overall maintenance cost optimization. Based on a strong correlation model between precise process temperature ranges and product quality, it promotes the transformation of production control from experience-based decision-making to data-driven approaches, comprehensively improving bottle neck forming accuracy and wall thickness uniformity. The industrial bus architecture supports multi-unit data integration, providing an extended foundation for remote centralized monitoring and collaborative strategy deployment, empowering intelligent manufacturing upgrades. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a system block diagram of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example:

[0019] like Figure 1 As shown, an automatic temperature acquisition and control system for glass manufacturing molds includes a high-precision, high-temperature resistant K-type armored thermocouple temperature sensor, a single-shielded K-type compensating wire, an analog signal acquisition module, and a through-screen touchscreen. The thermocouple sensor is mechanically drilled and fixedly installed in a temperature measurement hole between the inner cavity and outer diameter of the mold, with its probe end in direct contact with the metal surface of the mold. One end of the single-shielded K-type compensating wire is connected to the thermocouple sensor, and the other end passes through a stainless steel flexible tube and connects to the analog signal acquisition module, forming an anti-interference shielding structure. The analog signal acquisition module communicates with the through-screen touchscreen via an industrial bus. The through-screen touchscreen has built-in data processing software to achieve real-time display of temperature data and display of the 370-390℃ process range. The system features line recording, over-limit alarm threshold setting, and temperature correction functions. It calibrates the sensor and acquisition module via a signal generator to ensure measurement accuracy is controlled within ±2℃, with temperature data fluctuations ≤1℃. The thermocouple sensor is installed away from the initial mold movement mechanism, and its wiring path is fully wrapped in stainless steel flexible tubing to isolate mechanical vibration and electromagnetic interference. The system includes a daily maintenance mechanism, requiring operators to check the sensor's appearance daily, maintenance personnel to check the wire signal quality weekly, and a spare sensor for fault replacement. A correlation model is established between the temperature data and bottle-making quality; when the temperature exceeds the 370-390℃ range, the system triggers an alarm, guiding adjustments to the cooling airflow parameters to maintain the ideal temperature range.

[0020] In the glass bottle manufacturing production line, the automatic temperature acquisition and control system for the initial mold uses a high-precision, high-temperature resistant K-type armored thermocouple temperature sensor as its core sensing unit. A cylindrical temperature sensing hole is machined into the solid metal layer between the inner cavity and outer diameter of the initial mold using a mechanical drilling process, ensuring direct physical contact between the sensor's probe and the mold's metal surface. During installation, high-temperature thermal conductive paste is used to fill the interface gaps and axial threading is applied for tightening, eliminating contact thermal resistance and isolating external heat radiation interference. A single-shielded K-type compensating wire is led out from the sensor's wiring terminal and then fully encased in a corrugated stainless steel flexible conduit to form a sealed channel. Both ends of the conduit are secured to the sensor junction box and analog acquisition module housing via waterproof connectors, and further secured with segmented clamps along the static base of the initial mold, constructing a dual protection system that combines electromagnetic shielding and mechanical vibration isolation. The analog acquisition module converts the millivolt-level signal output from the thermocouple into a digital signal, which is then transmitted to the touchscreen via an industrial bus. The touchscreen's built-in data processing software analyzes the temperature signal in real time, dynamically plots the process temperature curve, and overlays a preset process range threshold (370-390℃). When consecutive out-of-limit data points are detected, an audible and visual alarm is automatically triggered, and a temperature correction algorithm is invoked to compensate for sensor drift errors. The system periodically injects a standard electrical signal through a signal generator to perform online calibration of the measurement link between the sensor and the acquisition module, ensuring stable accuracy across the entire measurement range.

[0021] During daily operation, operators monitor real-time temperature curves and alarm status via a touchscreen interface. When the system determines that the temperature deviates from the process range, it automatically generates a suggestion to adjust the cooling airflow rate and pushes it to the control terminal. Maintenance personnel perform sensor appearance inspections and signal quality tests as planned. If a main sensor malfunction is found, a backup sensor with a pre-connected redundant interface to the analog signal acquisition module is immediately activated. Hot switching is achieved through a quick-connect high-temperature connector, and the system simultaneously activates a data compensation algorithm to maintain monitoring continuity. The correlation model between temperature data and bottle quality continuously optimizes the control strategy—when the temperature is within the ideal range, the glass droplets are evenly distributed and formed in the initial mold, resulting in a dense bottle mouth structure and uniform wall thickness distribution; once the temperature is abnormal, the system immediately links the cooling fan to adjust the damper opening, allowing the initial mold temperature to quickly return to a steady state.

[0022] The entire system workflow is as follows:

[0023] Data acquisition stage: The thermocouple sensor transmits the thermoelectric potential signal of the initial model metal solid layer to the analog acquisition module through shielded wires. The signal is protected from electromagnetic interference and mechanical stress under double protection.

[0024] Data processing stage: After the acquisition module completes the signal digitization, the industrial bus pushes the data packet to the touch screen in real time, and the software system performs temperature value analysis, curve plotting and over-limit judgment.

[0025] Control and decision-making phase: When continuous sampling data exceeds the process threshold, the system triggers a graded alarm and outputs a cooling air parameter optimization command, while simultaneously recording the abnormal event log;

[0026] Execution feedback phase: The control terminal receives instructions to adjust the cooling airflow rate, and the temperature change of the initial mold is captured by the sensor in real time and fed back to the touch screen, forming a closed-loop control;

[0027] Fault-tolerant maintenance phase: The backup sensor remains in standby mode through parallel redundant interfaces. When the main sensor fails, the system automatically switches the signal source and locates the fault point. Maintenance personnel replace the faulty unit according to the preset procedure.

[0028] This system deeply integrates temperature sensing, anti-interference transmission, intelligent decision-making, and fault tolerance mechanisms, enabling stable sensing and precise control of the initial mold temperature under high-temperature vibration environments, thus providing a closed-loop control foundation for the entire glass forming process.

[0029] The mounting structure of the thermocouple sensor includes a cylindrical temperature measuring hole machined on the initial mold body. The axis of the temperature measuring hole is perpendicular to the inner surface of the initial mold cavity, and its depth terminates at the metal solid layer between the inner cavity and the outer diameter. The sensor probe end is tightly attached to the metal surface at the bottom of the hole by high-temperature thermal conductive paste and is axially pressed and fixed by threaded fasteners. At the same time, high-temperature sealant is used to fill the gap between the sensor and the hole wall to isolate external thermal radiation interference.

[0030] In the modification of the initial mold on the glass bottle manufacturing production line, the technical team machined a cylindrical temperature measuring hole at a specific location on the mold body. The axis of this hole is strictly perpendicular to the normal direction of the inner cavity surface, and the depth is precisely controlled to the metal solid layer between the inner cavity and the outer diameter. During installation, high-temperature resistant thermal conductive paste is first evenly applied to the metal surface at the bottom of the hole. Then, the sheathed thermocouple probe end is pressed into the bottom of the hole, and axial clamping is achieved by applying a preset torque through the threaded fastener at the tail. Finally, a high-temperature sealant is injected into the gap between the sensor and the hole wall to form a physical isolation layer. This structure has been verified under the high-speed opening and closing conditions of the initial mold: the thermal conductive paste continuously fills the microscopically uneven surface, eliminating temperature measurement lag caused by contact thermal resistance; the sealant effectively blocks external radiant heat and environmental corrosion, maintaining the temperature consistency between the sensor and the mold solid layer. Under abnormal process conditions, the sealant still maintains structural integrity, avoiding misjudgments caused by thermal radiation interference.

[0031] The anti-interference shielding structure consists of an inner single-shielded K-type compensating wire and an outer stainless steel flexible conduit for double protection. The two ends of the stainless steel flexible conduit are sealed to the sensor junction box and the interface box of the analog quantity acquisition module through waterproof connectors. The entire conduit is fixed to the initial static base with segmented clamps to form a continuous electromagnetic shielding channel and a mechanical vibration isolation layer.

[0032] To address strong electromagnetic interference environments, a dual-layer protection system was designed: the inner layer consists of compensating conductors covered by a shielded mesh, while the outer layer is fitted with a stainless steel corrugated flexible conduit. Along the wiring path, both ends of the flexible conduit are sealed and secured to the sensor junction box and data acquisition module housing via waterproof connectors, with compression sealing rings installed inside the connectors. The flexible conduit is segmentally fixed to the initial static base. In actual operation, when a nearby device suddenly starts, causing an increase in the electromagnetic field, the inner shielding mesh absorbs the main electromagnetic interference, while the remaining interference is canceled out by the stainless steel flexible conduit; simultaneously, the fixed points significantly attenuate mechanical vibration energy. During abnormal equipment vibration events, unprotected lines exhibit signal anomalies, while the signal stability under the protection of this structure has been fully verified.

[0033] The software system built into the touch screen includes a temperature dynamic analysis module. The temperature dynamic analysis module compares the current temperature data with the preset process range threshold in real time. When the data exceeds the threshold range for three consecutive sampling cycles, it automatically triggers an audible and visual alarm and generates a temperature anomaly event log. At the same time, it links with the production process database to output cooling air parameter adjustment suggestions.

[0034] During the production of specific glass products, the touchscreen's built-in analysis module monitors the temperature at set intervals. When the initial mold experiences a continuous temperature rise due to abnormal cooling, the module detects consecutive out-of-limit data and immediately triggers an audible and visual alarm, simultaneously generating an event log to record the details of the out-of-limit events. At the same time, it calls the production process database to match the current product model and outputs parameter adjustment instructions to the control system. After the operator confirms the instructions, the system quickly completes the process adjustment to bring the temperature down. During this process, the software automatically marks abnormal curve segments for analysis. This mechanism successfully intercepted multiple temperature drift events during continuous production, preventing the production of defective products.

[0035] The fault replacement mechanism specifically includes setting up a parallel redundant interface at the input end of the analog quantity acquisition module, and connecting the backup thermocouple sensor to the redundant interface through a quick-connect high-temperature connector; when the main sensor fails, the system automatically switches to the backup sensor data channel, generates a sensor fault code and location information on the touch screen, and simultaneously starts the data continuity compensation algorithm.

[0036] In continuous production units, analog signal acquisition modules are configured with parallel redundant interfaces. Backup sensors are pre-connected to the backup channel via quick-connect connectors. When the primary sensor experiences a sudden failure, the system immediately detects the signal anomaly and automatically switches to the backup data source. The touchscreen simultaneously displays the fault code and location information, and initiates a data compensation algorithm to generate a continuous curve. Maintenance personnel can quickly locate and replace the faulty sensor based on the fault code. Temperature monitoring remains uninterrupted throughout the switching process, ensuring continuous production. This mechanism significantly reduces maintenance time and minimizes capacity loss.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic temperature acquisition and control system for primary molds used in glass manufacturing, characterized in that, The system includes a high-precision, high-temperature resistant K-type armored thermocouple temperature sensor, a single-shielded K-type compensating wire, an analog signal acquisition module, and a touchscreen. The thermocouple sensor is mechanically drilled and fixedly installed in a temperature measuring hole located between the inner cavity and outer diameter of the initial mold, with its probe end in direct contact with the metal surface of the initial mold. One end of the single-shielded K-type compensating wire is connected to the thermocouple sensor, and the other end passes through a stainless steel flexible tube and connects to the analog signal acquisition module, forming an anti-interference shielding structure. The analog signal acquisition module communicates with the touchscreen via an industrial bus. The touchscreen has built-in data processing software, enabling real-time temperature data display, recording of process curves within the 370-390℃ range, and setting of over-limit alarm thresholds. The system includes temperature correction functionality; it calibrates the sensor and acquisition module via a signal generator to ensure measurement accuracy is within ±2℃, with temperature data fluctuations ≤1℃; the thermocouple sensor is installed away from the initial mold movement mechanism, and its wiring path is fully wrapped with stainless steel flexible tubing to isolate mechanical vibration and electromagnetic interference; the system has a routine maintenance mechanism, including daily inspection of the sensor's appearance by operators, weekly testing of the wire signal quality by maintenance personnel, and provision of spare sensors for fault replacement; a correlation model is established between the temperature data and bottle quality, and the system triggers an alarm when the temperature exceeds the 370-390℃ range, guiding adjustments to the cooling airflow parameters to maintain the ideal temperature range.

2. The automatic temperature acquisition and control system for primary molds used in glass manufacturing as described in claim 1, characterized in that: The mounting structure of the thermocouple sensor includes a cylindrical temperature measuring hole machined on the initial mold body. The axis of the temperature measuring hole is perpendicular to the inner surface of the initial mold cavity, and its depth terminates at the metal solid layer between the inner cavity and the outer diameter. The sensor probe end is tightly attached to the metal surface at the bottom of the hole by high-temperature thermal conductive paste and is axially pressed and fixed by threaded fasteners. At the same time, high-temperature sealant is used to fill the gap between the sensor and the hole wall to isolate external thermal radiation interference.

3. The automatic temperature acquisition and control system for primary molds used in glass manufacturing as described in claim 1, characterized in that: The anti-interference shielding structure consists of an inner single-shielded K-type compensating wire and an outer stainless steel flexible conduit for double protection. The two ends of the stainless steel flexible conduit are sealed to the sensor junction box and the interface box of the analog quantity acquisition module through waterproof connectors. The entire conduit is fixed to the initial static base with segmented clamps to form a continuous electromagnetic shielding channel and a mechanical vibration isolation layer.

4. The automatic temperature acquisition and control system for primary molds used in glass manufacturing as described in claim 1, characterized in that: The software system built into the touch screen includes a temperature dynamic analysis module. The temperature dynamic analysis module compares the current temperature data with the preset process range threshold in real time. When the data exceeds the threshold range for three consecutive sampling cycles, it automatically triggers an audible and visual alarm and generates a temperature anomaly event log. At the same time, it links with the production process database to output cooling air parameter adjustment suggestions.

5. The automatic temperature acquisition and control system for primary molds used in glass manufacturing as described in claim 1, characterized in that: The fault replacement mechanism specifically includes setting up a parallel redundant interface at the input end of the analog quantity acquisition module, and connecting the backup thermocouple sensor to the redundant interface through a quick-connect high-temperature connector; when the main sensor fails, the system automatically switches to the backup sensor data channel, generates a sensor fault code and location information on the touch screen, and simultaneously starts the data continuity compensation algorithm.

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