A heat dissipation system and electronic device

Abstract

The application discloses a heat dissipation system and electronic equipment, and is applied to the technical field of heat dissipation, wherein the heat dissipation system comprises a liquid cooling main body used for being connected with a heating element, a flow channel for cooling medium flowing is arranged in the liquid cooling main body; the flow channel comprises an inlet liquid cavity layer, an outlet liquid cavity layer and a plurality of through cavities, the inlet liquid cavity layer and the outlet liquid cavity layer are arranged at intervals, the outlet liquid cavity layer is located on the side of the inlet liquid cavity layer which is away from the heating element, and the through cavities are arranged at intervals and are communicated between the inlet liquid cavity layer and the outlet liquid cavity layer; a liquid supply assembly; a fan assembly used for providing a heat dissipation airflow for the liquid cooling main body; and a controller used for adjusting the flow rate of the cooling medium and / or the rotating speed of the fan assembly. The heat dissipation system provided by the application can realize efficient heat exchange, significantly reduce the influence of local hot spots on the heating element, and guarantee the efficiency and reliability of the heat dissipation effect.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation system and electronic device. Background Technology

[0002] As electronic devices (such as servers) become smaller, the size of heat-generating components is also decreasing. This reduction in size leads to an increase in the heat flux density per unit area, which in turn increases the risk of overheating.

[0003] In related technologies, a cold-plate liquid cooling architecture is used to dissipate heat from heat-generating components. The coolant is distributed to each cold plate through a single main channel. This linear flow channel design is prone to fluid distribution defects. Cold plates in these technologies typically employ a single main channel linear flow channel design, with coolant directly distributed to each cold plate. The internal flow channel structure of the cold plate is a simple straight line or manifold branch, often with regular geometric shapes such as straight lines or U-shapes. This flow channel structure results in a relatively thick heat exchange layer within the cold plate, leading to uneven thermal stress distribution. Experimental data shows that the temperature difference between the inlet and outlet of the cold plate in these technologies can reach 8-12℃, causing localized hot spots to form in the core area of ​​the heat-generating components, severely impacting the reliability of computing equipment.

[0004] Therefore, how to effectively improve the heat dissipation efficiency of heating elements and reduce local hot spots of heating elements is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation system and electronic device for improving the heat dissipation efficiency of heat-generating components and reducing the impact of local hot spots.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] A heat dissipation system includes: a liquid cooling body for connection to a heat-generating element, wherein the liquid cooling body has a flow channel for the flow of a cooling medium; the flow channel includes an inlet channel layer, an outlet channel layer, and a plurality of conductive channels, the inlet channel layer and the outlet channel layer are spaced apart, the outlet channel layer is located on the side of the inlet channel layer away from the heat-generating element, and the conductive channels are spaced apart and connected between the inlet channel layer and the outlet channel layer; a liquid supply assembly connected to the flow channel for introducing a cooling medium into the flow channel and adjusting the flow rate of the cooling medium; a fan assembly for providing heat dissipation airflow to the liquid cooling body, the fan assembly being installed on the side of the liquid cooling body away from the heat-generating element; and a controller connected to the liquid supply assembly and the fan assembly for controlling the operation of the liquid supply assembly and / or the fan assembly according to the temperature difference between the inlet and outlet media of the flow channel, thereby adjusting the flow rate of the cooling medium and / or the rotation speed of the fan assembly.

[0008] The present invention also provides an electronic device comprising a heat dissipation system according to any one of the above claims.

[0009] The heat dissipation system provided by this invention has the following advantages: By connecting the liquid cooling body to the heating element, the heat dissipated by the heating element can be transferred to the liquid cooling body. The liquid cooling body, through the flow of the cooling medium within it, carries away the heat, ultimately meeting the heat dissipation requirements of the heating element. Simultaneously, by setting an inlet channel layer, an outlet channel layer, and a connecting channel within the liquid cooling body, with the inlet channel layer positioned close to the heating element and the outlet channel layer positioned far from it, and the inlet and outlet channels connected by the connecting channel, this layered arrangement ensures that the relatively lower-temperature cooling medium is closer to the heating element, while the relatively higher-temperature cooling medium is further away. This reduces localized hot spots in the inlet channel layer and improves the cooling efficiency of the inlet channel. The heat exchange efficiency between the heat exchange layer and the heating element is improved by uniformly introducing the cooling medium into each conductive cavity through the liquid inlet channel layer, which helps to reduce the thickness of the heat exchange layer and achieve efficient heat exchange. At the same time, by setting up the liquid supply component, the flow rate of the cooling medium in the flow channel can be adjusted according to the temperature difference between the inlet and outlet media, thereby improving the heat dissipation efficiency of the heating element and providing higher temperature control precision for the heating element, which helps to ensure the reliable operation of the heating element. Furthermore, by setting up the fan assembly, which is installed on the side of the liquid cooling body away from the heating element, since the temperature on the side of the liquid cooling body away from the heating element is higher, the air flow accelerates the heat dissipation on the side of the liquid cooling body away from the heating element, achieving an effective combination of air cooling and liquid cooling, and further improving the heat dissipation efficiency of the heating element.

[0010] The heat dissipation system provided by this invention can achieve efficient heat exchange, significantly reduce the impact of local hot spots on heat-generating components, and ensure the efficiency and reliability of heat dissipation.

[0011] In one embodiment, both the inlet and outlet channels include inlet / outlet holes, primary channels, and several secondary channels. The primary channels have an I-shaped structure and extend within the corresponding inlet or outlet channel layer. The inlet / outlet holes are connected to the abdomen of the primary channel. Each wing of the primary channel is connected to a secondary channel, and the secondary channels are connected to the connecting channels. In the above configuration, the inlet and outlet ports serve as the main pipeline, allowing the cooling medium to flow into the primary cavity or to merge the cooling medium within the primary cavity. The inlet and outlet ports, primary cavity, secondary cavity, and conductive cavity are sequentially connected, forming a tertiary cavity system. Specifically, the inlet and outlet ports are connected to the primary cavity, which divides the cooling medium into N paths. Each path of cooling medium flows into a secondary cavity, resulting in N secondary cavities. Each secondary cavity then divides the cooling medium into M paths, with each path flowing into a conductive cavity, resulting in N multiplied by M conductive cavities. Ultimately, the conductive cavities permeate the entire liquid cooling unit, allowing the cooling medium within these cavities to fully exchange heat with the liquid cooling unit, thereby improving the heat dissipation efficiency of the liquid cooling unit.

[0012] In one embodiment, the primary cavity is located at the center of the corresponding inlet or outlet cavity layer. Each secondary cavity is arranged symmetrically with respect to the primary cavity, and each conductive cavity is also arranged symmetrically with respect to the secondary cavities. This arrangement, with the primary, secondary, and conductive cavities all having an I-shaped structure and each level of channel being symmetrically distributed relative to the previous level, allows the conductive cavities to fully utilize the space within the entire liquid cooling unit. This ensures the conductive cavities are evenly distributed within the liquid cooling unit, resulting in a rational layout that helps reduce the volume of the liquid cooling unit and provides more uniform heat dissipation.

[0013] In one embodiment, a heat dissipation bracket is also included. The bottom surface of the liquid cooling body is connected to the heating element, and the top surface is connected to the heat dissipation bracket. The heat dissipation bracket has a cavity for housing a fan assembly. The side of the cavity facing away from the liquid cooling body is open to allow airflow in and out. With this configuration, by setting up the heat dissipation bracket and housing the cavity within it, the airflow generated by the fan assembly causes hot air inside the cavity to flow out from the cavity opening, accelerating air circulation within the cavity. This concentrates the airflow on the upper surface of the liquid cooling body. Since the upper surface temperature of the liquid cooling body is high, placing the fan assembly within the cavity accelerates air circulation, thereby improving the heat dissipation efficiency of the liquid cooling body.

[0014] In one embodiment, the fan assembly includes: a heat dissipation shaft, an angle adjustment assembly, and several blade assemblies. The blade assemblies are mounted on the periphery of the heat dissipation shaft and can rotate with it. The angle adjustment assembly is disposed between the heat dissipation shaft and the blade assemblies, with the axial direction of the blade assemblies aligned with the axial direction of the heat dissipation shaft. The angle adjustment assembly is used to adjust the rotation of the blade assemblies around their axial direction, thereby changing the tilt angle of the blades relative to the heat dissipation shaft. A controller is connected to the angle adjustment assembly and is also used to control the operation of the angle adjustment assembly based on the temperature difference between the inlet and outlet media of the flow channel. With the above configuration, the cavity only has an opening at the top. Therefore, the fan assembly will have a blind spot when disturbing the airflow within the cavity. To ensure that the airflow is disturbed at all locations within the cavity, the angle adjustment assembly is used to adjust the angle of the blade assemblies. This changes the tilt angle of the blades relative to the heat dissipation shaft, i.e., changes the windward angle of the blades, thereby changing the direction of the airflow provided by the fan assembly. This promotes effective airflow in different areas within the cavity, ensuring the uniformity of the cooling effect of the fan assembly on the liquid cooling body, and consequently ensuring the uniformity of the cooling effect of the liquid cooling body on the heat-generating elements.

[0015] In one embodiment, the angle adjustment assembly further includes an elastic component, an electromagnet, and a magnetic component. The electromagnet and elastic component are both disposed within the angle adjustment slot, and the magnetic component is mounted on the angle adjustment block. One end of the elastic component abuts against the angle adjustment slot, and the other end abuts against the side wall of the angle adjustment block. When the electromagnet drives the magnetic component to move, the elastic component is compressed. When the electromagnet is de-energized, the elastic component resets, driving the angle adjustment block to reset. The controller is connected to the electromagnet and is used to adjust the magnetic force of the electromagnet according to the target tilt angle of the blade. This configuration, through the interaction force between the electromagnet and the elastic component, adjusts the position of the angle adjustment block within the angle adjustment slot, thereby changing the rotation angle of the blade disk and consequently changing the tilt angle of the blade relative to the heat dissipation shaft. This alters the windward face of the blade. Because the windward face of the blade tilts, the flow direction of the airflow within the cavity also changes. In actual operation, the continuous adjustment of the electromagnet's magnetic force allows the tilt angle of the blade relative to the heat dissipation shaft to continuously change as the blade rotates with it, thereby disturbing the airflow at different heights and in different areas within the cavity and ensuring the timely discharge of hot air from the cavity.

[0016] The electronic device provided by the present invention is equipped with the above-mentioned heat dissipation system. Since the heat dissipation system has the above-mentioned technical effects, the electronic device equipped with the heat dissipation system should also have the corresponding technical effects. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a specific embodiment of the heat dissipation system provided by the present invention.

[0019] Figure 2 This is a cross-sectional view of the overall structure of the heat dissipation system provided by the present invention.

[0020] Figure 3 for Figure 1 The diagram shows a cross-sectional view of the heat dissipation system.

[0021] Figure 4 for Figure 1 A partial cross-sectional view of the heat sink bracket and fan assembly in the heat dissipation system shown.

[0022] Figure 5 for Figure 4 A partial enlarged view of the fan assembly shown.

[0023] Figure 6 for Figure 1 The diagram shows the flow channel structure of the liquid cooling main body in the heat dissipation system.

[0024] Figure 7 for Figure 1 A top sectional view of the liquid cooling unit in the heat dissipation system shown.

[0025] Figure 8 for Figure 1 The diagram shows the partitioning of the liquid cooling system.

[0026] Figure 9 The schematic diagram of the controller in the heat dissipation system provided by the present invention.

[0027] Reference numerals: 1-Liquid cooling body; 101-Heat dissipation block; 102-Main body base; 11-Liquid inlet channel layer; 12-Liquid outlet channel layer; 13-Conducting channel; 14-Liquid inlet / outlet hole; 141-Liquid inlet hole; 142-Liquid outlet hole; 15-Primary channel; 16-Secondary channel; 2-Liquid supply assembly; 21-Drive pump; 211-Drive pump base; 22-Liquid inlet pipe; 23-Liquid outlet pipe; 24-Flow rate adjustment component; 3-Fan assembly; 31-Heat dissipation shaft; 32-Angle adjustment assembly; 321-Elastic component; 322-Electromagnet; 323-Magnetic component; 33-Blade assembly; 331-Blade; 332-Blade disk; 34-Angle adjustment slot; 35-Angle adjustment block; 36-Angle adjustment shaft; 4-Controller; 41-Temperature sensor; 42-Flow rate sensor; 5-Heat dissipation bracket; 51-Heat dissipation bracket base; 52-Heat dissipation sleeve. Detailed Implementation

[0028] The core of this invention is to provide a heat dissipation system and electronic device that can ensure the reliable operation of heat-generating components and achieve high heat dissipation efficiency.

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0030] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0031] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] In this implementation, please refer to Figure 1 , Figure 3 and Figure 8The heat dissipation system includes: a liquid cooling body 1 for connecting to the heat-generating element; the liquid cooling body 1 has a flow channel for the flow of cooling medium; the flow channel includes an inlet channel layer 11, an outlet channel layer 12, and several conductive channels 13; the inlet channel layer 11 and the outlet channel layer 12 are spaced apart, the outlet channel layer 12 is located on the side of the inlet channel layer 11 away from the heat-generating element, and the conductive channels 13 are spaced apart and connect the inlet channel layer 11 and the outlet channel layer 12; the heat-generating element can be a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). Unit (graphics processor) or memory and other components; liquid supply assembly 2, connected to the flow channel, used to introduce cooling medium into the flow channel and adjust the flow rate of the cooling medium; fan assembly 3, used to provide heat dissipation airflow to the liquid cooling body 1, the fan assembly 3 is installed on the side of the liquid cooling body 1 away from the heat-generating element; controller 4, together with the liquid supply assembly 2 and the fan assembly 3, used to control the operation of the liquid supply assembly 2 and / or the fan assembly 3 according to the temperature difference between the inlet and outlet medium of the flow channel, so as to adjust the flow rate of the cooling medium and / or the rotation speed of the fan assembly 3.

[0033] Specifically, the liquid cooling body 1 can be fitted to the surface of the heating element, enabling more efficient absorption of heat from the heating element. The heating element can be a heating element on the motherboard of an electronic device, such as a CPU or GPU. The electronic device can be a server or similar device. The inlet channel layer 11 and the outlet channel layer 12 can be arranged in parallel, and both the inlet channel layer 11 and the outlet channel layer 12 are parallel to the surface of the heating element. The extension direction of the conductive channel 13 is perpendicular to the surface of the heating element, that is, perpendicular to the inlet channel layer 11 and the outlet channel layer 12. The plane containing the liquid channel layer 12 connects the inlet liquid channel layer 11 and the outlet liquid channel layer 12. The cooling medium flows from the inlet liquid channel layer 11 to the connecting channel 13 and then flows out through the outlet liquid channel layer 12. The liquid supply assembly 2 is used to supply cooling medium to the flow channel and adjusts the flow rate of the cooling medium according to the temperature of the cooling medium in the flow channel to improve the heat dissipation efficiency and control accuracy of the heat-generating element. The fan assembly 3 can perform air cooling heat dissipation on the liquid-cooled body 1. The cooling speed of the liquid-cooled body 1 can be changed by adjusting the speed of the fan assembly 3.

[0034] The heat dissipation system provided by this invention has the following advantages: By connecting the liquid cooling body 1 to the heating element, the heat emitted by the heating element can be transferred to the liquid cooling body 1. The liquid cooling body 1 carries away the heat through the flow of the cooling medium within it, ultimately achieving the heat dissipation requirement for the heating element. Simultaneously, by providing an inlet channel layer 11, an outlet channel layer 12, and a connecting channel 13 in the liquid cooling body 1, with the inlet channel layer 11 positioned close to the heating element and the outlet channel layer 12 positioned away from the heating element, and the inlet channel layer 11 and the outlet channel layer 12 connected by the connecting channel 13, this layered arrangement ensures that the relatively lower-temperature cooling medium is closer to the heating element, while the relatively higher-temperature cooling medium is further away. This reduces localized hot spots in the inlet channel layer 11 and improves the heat exchange efficiency between the inlet channel layer 11 and the heating element. The liquid inlet channel layer 11 uniformly introduces the cooling medium into each conductive channel 13, which helps to reduce the thickness of the heat exchange layer and achieve efficient heat exchange. At the same time, by setting the liquid supply component 2, the flow rate of the cooling medium in the channel can be adjusted according to the temperature difference between the inlet and outlet media, thereby improving the heat dissipation efficiency of the heating element and providing higher temperature control accuracy for the heating element, which helps to ensure the reliable operation of the heating element. Furthermore, by setting the fan component 3, which is installed on the side of the liquid cooling body 1 away from the heating element, since the temperature on the side of the liquid cooling body 1 away from the heating element is higher, the air flow accelerates the heat dissipation on the side of the liquid cooling body 1 away from the heating element, achieving an effective combination of air cooling and liquid cooling, further improving the heat dissipation efficiency of the heating element. This heat dissipation system can achieve efficient heat exchange, significantly reduce local hot spots, reduce the impact on the heating element, and ensure the efficiency and reliability of the heat dissipation effect.

[0035] In some implementation methods, please refer to Figure 3 and Figure 8 Both the inlet / outlet channel layer 11 and the outlet / outlet channel layer 12 include inlet / outlet holes 14, primary channels 15, and several secondary channels 16. The primary channels 15 extend within their respective inlet / outlet channel layers 11 and 12. The inlet / outlet holes 14 communicate with the primary channels 15. Each primary channel 15 may have multiple branch outlets, each connecting to a secondary channel 16. The secondary channels 16 communicate with the connecting channel 13. Specifically, the primary channels 15 have an I-shaped structure. The inlet / outlet holes 14 communicate with the belly of the primary channel 15. Each wing of the primary channel 15 is connected to a secondary channel 16 on both sides, and the secondary channels 16 communicate with the connecting channel 13.

[0036] Specifically, the inlet / outlet port 14 includes an inlet port 141 and an outlet port 142; the primary cavity 15 includes a primary inlet cavity and a primary outlet cavity; and the secondary cavity 16 includes a secondary inlet cavity and a secondary outlet cavity. The inlet cavity layer 11 includes an inlet port 141, a primary inlet cavity, and several secondary inlet cavities. The primary inlet cavity has an I-shaped structure, with the inlet port 141 communicating with the interior of the primary inlet cavity. Each wing of the primary inlet cavity is connected to a secondary inlet cavity, and the secondary inlet cavities are connected to the connecting cavity 13. The outlet cavity layer 12 includes an outlet port 142, a primary outlet cavity, and several secondary outlet cavities. The primary outlet cavity has an I-shaped structure, with the outlet port 142 communicating with the interior of the primary outlet cavity. Each wing of the primary outlet cavity is connected to a secondary outlet cavity, and the secondary outlet cavities are connected to the connecting cavity 13.

[0037] In some implementation methods, please refer to Figure 6 and Figure 7 Each secondary cavity 16 may have multiple branch outlets, and each outlet is connected to a connecting cavity 13. Specifically, the secondary cavity 16 has an I-shaped structure and extends within the corresponding inlet cavity layer 11 or outlet cavity layer 12. Each wing of the primary cavity 15 is connected to the abdomen of a secondary cavity 16 on both sides, and each wing of the secondary cavity 16 is connected to a connecting cavity 13 on both sides. In the above configuration, the inlet / outlet port 14 serves as the main pipeline, allowing the cooling medium to flow into the primary cavity 15 or to collect the cooling medium within the primary cavity 15. The inlet / outlet port 14, the primary cavity 15, the secondary cavity 16, and the connecting cavity 13 are sequentially connected, forming a tertiary system. Specifically, the inlet / outlet port 14 is connected to the primary cavity 15, which divides the cooling medium into N paths. Each path of cooling medium flows into a secondary cavity 16, resulting in N secondary cavities. Each secondary cavity 16 then divides the cooling medium into M paths, with each path flowing into a connecting cavity 13. The number of connecting cavities 13 is N multiplied by M. Ultimately, the connecting cavities 13 cover the entire liquid cooling body 1, allowing the cooling medium within the connecting cavities 13 to fully exchange heat with the liquid cooling body 1, thereby improving the heat dissipation efficiency of the liquid cooling body 1.

[0038] In some embodiments, the conductive cavity 13 is I-shaped, and the extension direction of the conductive cavity 13 is perpendicular to the extension direction of the liquid inlet cavity layer 11 or the liquid outlet cavity layer 12. The wings of the secondary cavity 16 are connected to the belly of the conductive cavity 13. The I-shaped structure can make full use of space and improve heat exchange efficiency.

[0039] In some embodiments, the primary cavity 15 is located at the center of the corresponding inlet cavity layer 11 or outlet cavity layer 12. Each secondary cavity 16 is arranged symmetrically with respect to the primary cavity 15, and each conductive cavity 13 is arranged symmetrically with respect to the secondary cavity 16. This arrangement, by setting the primary cavity 15, secondary cavity 16, and conductive cavity 13 to an I-shaped structure, and with each level of channel arranged symmetrically with respect to the previous level, allows the conductive cavity 13 to fully utilize the space within the entire liquid cooling body 1. This ensures that the conductive cavity 13 is evenly distributed within the liquid cooling body 1, resulting in a reasonable layout that helps reduce the volume of the liquid cooling body 1 and improves the uniform heat dissipation of the liquid cooling body 1. Specifically, one inlet / outlet port 14 can correspond to one primary cavity 15, one cavity can correspond to four secondary cavities 16, and four secondary cavities 16 can correspond to sixteen conductive cavities 13.

[0040] Specifically, such as Figure 7 As shown, the cooling medium flows into the I-shaped primary cavity 15 through the inlet hole 141 in the inlet / outlet hole 14. The four ports of the I-shaped structure of each primary cavity 15 are connected to a secondary cavity 16, which is also an I-shaped structure. The four ports of the I-shaped structure of each secondary cavity 16 are connected to a conductive cavity 13, which is also an I-shaped structure. Since each secondary cavity 16 is evenly distributed at the four corners of the primary cavity 15, and the conductive cavity 13 is evenly distributed at the four corners of each secondary cavity 16, the conductive cavity 13 can cover the entire internal structure of the liquid cooling body 1 while being isolated from the inlet / outlet hole 14 and the primary cavity 15, thereby improving the heat exchange efficiency between the conductive cavity 13 and the liquid cooling body 1.

[0041] In some embodiments, the diameters of the inlet / outlet holes 14, the primary cavity 15, and the secondary cavity 16 decrease sequentially to ensure that the cooling medium is evenly distributed to each stage of the cavity. Furthermore, the extension direction of the inlet / outlet holes 14 is perpendicular to the extension direction of the abdomen of the primary cavity 15, and the extension direction of the wing of the primary cavity 15 is perpendicular to the extension direction of the abdomen of the secondary cavity 16. By setting them vertically, it is easier to arrange each stage of the cavity and the space utilization rate is higher.

[0042] In some embodiments, the conductive channel 13 is a honeycomb-shaped branched channel, uniformly distributed between the liquid inlet channel layer 11 and the liquid outlet channel layer 12. The honeycomb-shaped branched channel has high heat exchange efficiency, which helps to reduce the height of the liquid cooling body 1, meeting heat dissipation requirements while reducing the volume of the liquid cooling body 1. The conductive channel 13, acting as a terminal capillary network, adopts a honeycomb structure and forms a cross-convective loop with the secondary channel 16. This allows the cooling medium to complete efficient heat exchange within a small space before converging through the secondary channel 16. The conductive channel 13 can guide the low-temperature cooling medium to the bottom of the heat sink 101. Through the guidance of the cooling medium inside the heat sink 101, the heat from the contact area with the heating element in the liquid cooling body 1 is drawn to the upper part of the liquid cooling body 1. Specifically, to improve the cooling effect on the heating element, the bottom height of the conductive channel 13 can be lower than the height of the liquid inlet channel layer 11, making the conductive channel 13 closer to the heating element.

[0043] In some embodiments, the I-shaped structure of the secondary cavity 16 can employ a gradually narrowing design for its abdominal tubing. Specifically, the middle section of the abdominal tubing serves as the inlet, while the two sides are outlets. The outlets of the abdominal tubing connect to the wing section. From the middle inlet to any outlet of the abdominal tubing, a Venturi tube structure can be used to increase the flow rate of the cooling medium, ensuring that the cooling medium flows into the two pairs of conductive cavities 13, i.e., the tertiary cavity, at an accelerated rate. Through the I-shaped channel design of the secondary cavity 16, not only can the liquid cooling body be maintained... It provides strong support and can promote the flow of cooling medium by means of the Venturi effect. Similarly, in the I-shaped structure of the primary cavity 15, the abdominal pipes can also adopt a gradually narrowing design. Specifically, the middle part of the abdominal pipes of the primary cavity 15 is the inlet, and the two sides are the outlets. The outlets of the abdominal pipes are connected to the wings. The Venturi tube structure can also be used from the middle inlet of the abdominal pipes to any outlet. The Venturi tube structure can be used to increase the flow rate of the cooling medium and ensure that the cooling medium flows into the two pairs of secondary cavities 16 at an accelerated rate.

[0044] In some implementation methods, please refer to Figure 2The liquid supply assembly 2 includes a drive pump 21, an inlet pipe 22, an outlet pipe 23, and a flow rate regulating component 24. The flow rate regulating component 24 can be an electric proportional valve. The drive pump 21 is connected to the inlet pipe 22 and / or the outlet pipe 23 to drive the flow of the cooling medium. The flow rate regulating component 24 is connected to the controller 4. The inlet chamber layer 11 and the outlet chamber layer 12 are respectively connected to the inlet pipe 22 and the outlet pipe 23. The flow rate regulating component 24 is set on the inlet pipe 22 or the outlet pipe 23 to regulate the flow rate of the cooling medium in the liquid supply assembly 2. Specifically, the bottom of the drive pump 21 is provided with a drive pump base 211 to ensure the stability of the drive pump 21. Furthermore, there can be two drive pumps 21, adopting a dual-pump redundancy design. Each of the inlet pipe 22 and the outlet pipe 23 is equipped with a magnetically driven water pump, with a single pump flow rate of 2.5L / min, which can be connected in parallel to achieve a maximum flow rate of 5L / min. After the cooling medium is guided to the inside of the inlet hole 141 by the drive pump 21, it is guided one by one to the inside of the primary cavity 15 through the inlet hole 141. The cooling medium diffuses in a tree-like manner along the I-shaped section of the primary cavity 15. The cooling medium is guided to the two pairs of secondary cavities 16 through the outlets of the primary cavity 15, and then to the two pairs of conductive cavities 13 through the outlets of the secondary cavity 16, that is, the tertiary cavity groove.

[0045] In some implementation methods, please refer to Figure 9 It also includes a temperature sensor 41 for acquiring the inlet and outlet medium temperatures of the flow channel. The temperature sensor 41 is connected to the controller 4. The controller 4 is also used to calculate the inlet and outlet medium temperature difference of the flow channel based on the inlet and outlet medium temperatures, and to control the flow rate regulating component 24 to increase the flow rate of the cooling medium when the inlet and outlet medium temperature difference is greater than or equal to the target temperature difference. Specifically, the temperature sensor 41 may include two sensors, which are respectively set at the inlet hole 141 and the outlet hole 142. The medium temperatures of the inlet hole 141 and the outlet hole 142 are then sent to the controller 4. The controller 4 calculates the inlet and outlet medium temperature difference of the flow channel based on the medium temperatures of the inlet hole 141 and the outlet hole 142, which facilitates control and avoids local hot spots caused by excessive inlet and outlet medium temperature differences.

[0046] In some embodiments, a flow rate sensor 42 is also included. The flow rate sensor 42 is used to obtain the flow rate of the cooling medium in the flow channel. The flow rate sensor 42 is connected to the controller 4. The controller 4 is also used to control the fan assembly 3 to operate when the flow rate of the cooling medium in the flow channel is greater than or equal to the target flow rate, so as to increase the speed of the fan assembly 3. The flow rate sensor 42 is set to prevent the flow rate of the cooling medium in the flow channel from being too fast and affecting the heat exchange efficiency between the cooling medium and the liquid cooling body 1. The flow rate sensor 42 can also play a feedback role. The controller 4 determines whether the adjustment of the flow rate adjustment component 24 is accurate based on the feedback result of the flow rate sensor 42.

[0047] In some embodiments, a heat dissipation bracket 5 is also included. The bottom surface of the liquid cooling body 1 is connected to the heating element, and the top surface is connected to the heat dissipation bracket 5. The heat dissipation bracket 5 has a cavity for the fan assembly 3 to be placed inside. The side of the cavity away from the liquid cooling body 1 is an open structure to allow airflow to enter and exit the cavity. With the above configuration, by setting up the heat dissipation bracket 5, setting up the cavity inside the heat dissipation bracket 5, and placing the fan assembly 3 inside the cavity, the airflow generated by the fan assembly 3 will cause the hot air inside the cavity to flow out from the opening of the cavity, accelerating the air circulation inside the cavity, thereby concentrating the airflow on the upper surface of the liquid cooling body 1. Since the upper surface temperature of the liquid cooling body 1 is high, placing the fan assembly 3 inside the cavity can accelerate the air circulation efficiency inside the cavity, thereby improving the heat dissipation efficiency of the liquid cooling body 1.

[0048] In some embodiments, the fan assembly 3 includes: a heat dissipation shaft 31, an angle adjustment assembly 32, and a plurality of blade assemblies 33. The blade assemblies 33 are mounted on the periphery of the heat dissipation shaft 31 and can rotate with the heat dissipation shaft 31. The angle adjustment assembly 32 is disposed between the heat dissipation shaft 31 and the blade assemblies 33. The axial direction of the blade assemblies 33 is opposite to the axial direction of the heat dissipation shaft 31. The angle adjustment assembly 32 is used to adjust the rotation of the blade assemblies 33 about their axial direction to change the tilt angle of the blades 331 in the blade assembly 33 relative to the heat dissipation shaft 31. The controller 4 is connected to the angle adjustment assembly 32 and is also used to control the operation of the angle adjustment assembly 32 according to the temperature difference between the inlet and outlet media of the flow channel. With the above configuration, the cavity only has an opening at the top. Therefore, when the fan assembly 3 disturbs the airflow in the cavity, there will be a blind spot. In order to ensure that the air in all parts of the cavity is disturbed, the angle adjustment component 32 is set to adjust the angle of the blade assembly 33. This can change the tilt angle of the blade 331 in the blade assembly 33 relative to the heat dissipation shaft 31, that is, change the windward angle of the blade 331, thereby changing the airflow direction provided by the fan assembly 3. This promotes the effective flow of air in different areas of the cavity, thereby ensuring the uniformity of the cooling effect of the fan assembly 3 on the liquid cooling body 1, and thus ensuring the uniformity of the cooling effect of the liquid cooling body 1 on the heat-generating element.

[0049] In some implementation methods, please refer to Figure 3The blade assembly 33 includes a blade 331 and a blade disk 332. The blade disk 332 is mounted on the heat dissipation shaft 31 and can rotate relative to the heat dissipation shaft 31. The blade 331 is mounted on the blade disk 332 and extends along the axial direction of the blade disk 332. The axial direction of the blade disk 332 is perpendicular to the axial direction of the heat dissipation shaft 31. The angle adjustment assembly 32 can drive the blade disk 332 to rotate around its axial direction. When the blade disk 332 rotates around its axial direction, it will cause the blade 331 to deflect, thereby changing the tilt angle of the blade 331 relative to the heat dissipation shaft 31, which can change the windward angle of the blade 331 and change the airflow direction generated by the blade 331.

[0050] In some implementation methods, please refer to Figure 4 and Figure 5 The heat dissipation shaft 31 is provided with a blade disk mounting groove, and the blade disk 332 is located in the blade disk mounting groove. The blade disk 332 can rotate in the blade disk mounting groove, and the blade disk mounting groove is partially extended circumferentially with an angle adjustment groove 34. The blade disk 332 is partially provided circumferentially with an angle adjustment block 35. The angle adjustment block 35 can slide in the angle adjustment groove 34 to drive the blade disk 332 to rotate. The rotation of the blade disk 332 will cause the blade 331 to deflect, thereby changing the tilt angle of the blade 331 relative to the heat dissipation shaft 31. The angle adjustment block 35 and the blade disk 332 can be an integral structure, which is convenient to process and more stable. Specifically, the blade disk mounting slots can be evenly distributed along the periphery of the heat dissipation area. For example, there can be three blade disk mounting slots. Several carbon fiber reinforced blades 331 are integrated on the surface of the angle disk. The angle adjustment slot 34 and the angle adjustment block 35 are in sliding fit. The sliding friction coefficient between the angle adjustment slot 34 and the angle adjustment block 35 is ≤0.15, which ensures the smooth sliding of the angle adjustment block 35 and reduces resistance.

[0051] In some embodiments, a heat dissipation drive is also included. The heat dissipation drive is connected to the heat dissipation shaft 31. The operation of the heat dissipation drive can drive the heat dissipation shaft 31 to rotate. The heat dissipation shaft 31 drives the blade disk mounting groove on it to rotate. The blade disk mounting groove drives the angle disk on its inner side to rotate horizontally, thereby driving the blade 331 to rotate horizontally and providing airflow to the cavity.

[0052] In some embodiments, both the angle adjustment slot 34 and the angle adjustment block 35 are fan-shaped ring structures, and the central angle corresponding to the angle adjustment block 35 is smaller than the central angle corresponding to the angle adjustment slot 34. The angle adjustment block 35 has a certain swing space in the angle adjustment slot 34. For example, the central angle corresponding to the angle adjustment slot 34 can be 100°, and the central angle corresponding to the angle adjustment block 35 can be 10°. Then the angle adjustment block 35 swings in the range of 0-90°, thereby realizing the swing of the blade 331 in the range of 0-90°.

[0053] In some embodiments, the angle adjustment assembly 32 further includes an elastic component 321, an electromagnet 322, and a magnetic component 323. The electromagnet 322 and the elastic component 321 are both disposed in the angle adjustment groove 34, and the magnetic component 323 is mounted on the angle adjustment block 35. One end of the elastic component 321 abuts against the angle adjustment groove 34, and the other end abuts against the side wall of the angle adjustment block 35. When the electromagnet 322 drives the magnetic component 323 to move, the elastic component 321 is compressed. When the electromagnet 322 is de-energized, the elastic component 321 resets and drives the angle adjustment block 35 to reset. The controller 4 is connected to the electromagnet 322 and is used to adjust the magnetic force of the electromagnet 322 according to the target tilt angle of the blade 331. Specifically, to accurately control the swing angle of the angle adjustment block 35, the magnetic force of the electromagnet can be adjusted. When the magnetic force of the electromagnet is large, the elastic component 321 is compressed to a larger extent, allowing the magnetic force of the electromagnet to balance the elastic force of the elastic component 321. This results in a larger swing amplitude of the angle adjustment block 35 relative to its initial position and a larger rotation angle of the blade 331. Conversely, when the magnetic force of the electromagnet is small, the elastic component 321 is compressed to a smaller extent, balancing the magnetic force of the electromagnet and the elastic force of the elastic component 321. This results in a smaller swing amplitude of the angle adjustment block 35 relative to its initial position and a smaller rotation angle of the blade 331. Furthermore, a resistor regulator is provided, connected to the electromagnet 322. The resistor regulator adjusts the current or voltage distribution by changing the resistance value, thereby changing the current in the electromagnet 322 and thus altering its magnetic force.

[0054] The above setup utilizes the interaction force between the electromagnet 322 and the elastic component 321 to adjust the position of the angle adjustment block 35 within the angle adjustment slot 34, thereby changing the rotation angle of the blade disk 332 and consequently changing the tilt angle of the blade 331 relative to the heat dissipation shaft 31. This alters the windward surface of the blade 331. Since the windward surface of the blade 331 is tilted, the flow direction of the airflow within the cavity also changes. In actual operation, the tilt angle of the blade 331 relative to the heat dissipation shaft 31 can be continuously changed as the electromagnet rotates with it, thereby disturbing the airflow at different heights and in different areas within the cavity and ensuring the timely discharge of hot air from the cavity.

[0055] In some embodiments, an angle adjustment shaft 36 is also provided in the angle adjustment groove 34. The angle adjustment shaft 36 passes through the angle adjustment block 35, and the angle adjustment block 35 can slide relative to the angle adjustment shaft 36. The curvature of the angle adjustment shaft 36 is the same as the curvature of the angle adjustment groove 34. The setting of the angle adjustment shaft 36 can guide the angle adjustment block 35, ensure the stability of the angle adjustment block 35, and thus ensure the stability of the rotation of the blade 331.

[0056] In some embodiments, the elastic component 321 is a spring with a stiffness of 6-10 N / mm, such as 8 N / mm. The elastic component 321 is sleeved on the angle adjustment shaft 36 to prevent the elastic component 321 from shaking randomly and to ensure its support effect. When the angle adjustment block 35 is in the initial state, the angle adjustment block 35 and the electromagnet 322 are respectively located at both ends of the angle adjustment groove 34 along its circumference to ensure that the angle adjustment block 35 can have the maximum swing stroke.

[0057] In some embodiments, there are multiple fan assemblies 3, which are evenly arranged around the circumference of the heat dissipation shaft 31; the controller 4 is connected to the angle adjustment components 32 in each fan assembly 3, and the controller 4 is also used to synchronously control the electromagnets 322 in each angle adjustment component 32.

[0058] In some embodiments, the heat dissipation bracket 5 includes a heat dissipation bracket base 51 and a heat dissipation sleeve 52. The heat dissipation sleeve 52 is located on the side of the heat dissipation bracket base 51 away from the liquid cooling body 1. The heat dissipation bracket base 51 is detachably connected to the liquid cooling body 1. The cavity is located inside the heat dissipation sleeve 52. That is, the fan assembly 3 is located inside the heat dissipation sleeve 52 and is installed on the heat dissipation bracket base 51 to ensure the stability of the heat dissipation sleeve 52.

[0059] In some embodiments, the heat dissipation sleeve 52 is circular, the heat dissipation shaft 31 is located on the axis of the heat dissipation sleeve 52, and the height of the heat dissipation shaft 31 is lower than the height of the heat dissipation sleeve 52. The height of the blade assembly 33 on the heat dissipation shaft 31 is 0.4-0.6 times the height of the heat dissipation shaft 31. The airflow generated by the rotation of the blade 331 can cover the cavity of the entire heat dissipation sleeve 52 to ensure the heat dissipation effect.

[0060] In some embodiments, the liquid cooling body 1 includes a heat sink 101 and a main body base 102. The main body base 102 is located on the outer periphery of the bottom of the heat sink 101, forming a stepped structure at the bottom of the heat sink 101. The main body base 102 is used for detachable mounting on the motherboard at the position corresponding to the heat-generating element. The main body base 102 may be provided with threaded holes for easy assembly with the motherboard or the chassis of the electronic device. Furthermore, copper fins can be spaced and inserted inside the liquid cooling body 1 to form a fin structure. The spacing between the parallel insertions of the copper fins can be 0.4-0.6 mm, forming a highly efficient heat conduction channel. This design increases material utilization by 35% and significantly improves heat exchange efficiency.

[0061] In one specific embodiment, the heat dissipation system adopts a three-level tree-like flow distribution structure: a primary main bronchial duct → a secondary gradually changing branch hole → a tertiary honeycomb branch groove. Combined with an I-shaped cross-section flow channel design and the Venturi tube effect, it achieves balanced distribution and accelerated flow of the cooling medium. The three-level branch groove constructs an ultra-thin heat exchange layer through cross-convection loops. The thickness of the heat exchange layer can be less than or equal to 0.5 mm, improving the temperature difference control accuracy of the cooling medium to ±1.5℃ and reducing the risk of hot spots by 80%. A dual-mode control system of electromagnetic drive and spring reset is adopted. The electromagnet 322 controls the displacement of the magnetic component 323 through PWM (Pulse Width Modulation), achieving stepless angle adjustment of the blades 3310-90°. The integrated elastic component 321 provides an automatic reset function upon power failure, shortening the response time to the 0.1 ms level. With the closed-loop control system, the flow sensor has an accuracy of ±2%FS, and the temperature sensor 41 is linked with the flow regulation component to ensure PUE (Power Usage Effectiveness) in high-density scenarios of 50kW / m². Effectiveness (electrical energy utilization efficiency) value is stable below 1.1; where FS is an abbreviation for Full Scale, which represents the maximum range value of the measuring instrument. When used to describe measurement error or accuracy, it is usually expressed as a percentage of full scale (%FS).

[0062] In addition to the heat dissipation system described above, the present invention also provides an electronic device including the heat dissipation system described above. For the structure of other parts of the electronic device, please refer to the relevant technology, which will not be described in detail here.

[0063] The heat dissipation system and electronic device provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. A heat dissipation system, characterized in that, include: A liquid cooling body (1) is used to connect with a heating element. The liquid cooling body (1) is provided with a flow channel for the flow of cooling medium. The flow channel includes an inlet cavity layer (11), an outlet cavity layer (12), and a plurality of conductive cavities (13). The inlet cavity layer (11) and the outlet cavity layer (12) are spaced apart. The outlet cavity layer (12) is located on the side of the inlet cavity layer (11) away from the heating element. Each of the conductive cavities (13) is spaced apart and connected between the inlet cavity layer (11) and the outlet cavity layer (12). The liquid supply assembly (2) is connected to the flow channel and is used to introduce the cooling medium into the flow channel and adjust the flow rate of the cooling medium. A fan assembly (3) is used to provide heat dissipation airflow to the liquid cooling body (1), and the fan assembly (3) is installed on the side of the liquid cooling body (1) away from the heat-generating element; The controller (4) is connected to the liquid supply assembly (2) and the fan assembly (3) and is used to control the operation of the liquid supply assembly (2) and / or the fan assembly (3) according to the temperature difference between the inlet and outlet media of the flow channel, so as to adjust the flow rate of the cooling medium and / or the rotation speed of the fan assembly (3); The liquid inlet channel layer (11) and the liquid outlet channel layer (12) each include a liquid inlet / outlet hole (14), a primary channel (15) and several secondary channels (16). The primary channel (15) has an I-shaped structure and extends within the corresponding liquid inlet channel layer (11) or liquid outlet channel layer (12). The liquid inlet / outlet hole (14) is connected to the abdomen of the primary channel (15). Each wing of the primary channel (15) is connected to a secondary channel (16). The secondary channel (16) is connected to the connecting channel (13). The secondary cavity (16) has an I-shaped structure and extends within the corresponding inlet cavity layer (11) or outlet cavity layer (12). Each wing of the primary cavity (15) is connected to the abdomen of a secondary cavity (16) on both sides, and each wing of the secondary cavity (16) is connected to a connecting cavity (13) on both sides.

2. The heat dissipation system according to claim 1, characterized in that, The connecting channel (13) is I-shaped, and the extending direction of the connecting channel (13) is perpendicular to the extending direction of the liquid inlet channel layer (11) or the liquid outlet channel layer (12). The wings of the secondary channel (16) are connected to the abdomen of the connecting channel (13).

3. The heat dissipation system according to claim 1, characterized in that, The primary cavity (15) is located at the center of the corresponding inlet cavity layer (11) or outlet cavity layer (12). Each secondary cavity (16) is arranged symmetrically with respect to the primary cavity (15), and each connecting cavity (13) is arranged symmetrically with respect to the secondary cavity (16).

4. The heat dissipation system according to claim 1, characterized in that, The diameters of the inlet / outlet port (14), the primary cavity (15), and the secondary cavity (16) decrease sequentially, and the extension direction of the inlet / outlet port (14) is perpendicular to the abdominal extension direction of the primary cavity (15), and the extension direction of the wing of the primary cavity (15) is perpendicular to the abdominal extension direction of the secondary cavity (16).

5. The heat dissipation system according to claim 1, characterized in that, The conductive cavity (13) is a honeycomb branched cavity, and the conductive cavity (13) is evenly distributed between the liquid inlet cavity layer (11) and the liquid outlet cavity layer (12).

6. The heat dissipation system according to claim 1, characterized in that, The liquid supply assembly (2) includes a drive pump (21), an inlet pipe (22), an outlet pipe (23), and a flow rate regulating component (24). The drive pump (21) is connected to the inlet pipe (22) and / or the outlet pipe (23) to drive the flow of the cooling medium. The flow rate regulating component (24) is connected to the controller (4). The inlet cavity layer (11) and the outlet cavity layer (12) are respectively connected to the inlet pipe (22) and the outlet pipe (23). The flow rate regulating component (24) is disposed on the inlet pipe (22) or the outlet pipe (23) to regulate the flow rate of the cooling medium in the liquid supply assembly (2).

7. The heat dissipation system according to claim 6, characterized in that, It also includes a temperature sensor (41) for acquiring the inlet and outlet medium temperature of the flow channel. The temperature sensor (41) is connected to the controller (4). The controller (4) is also used to calculate the inlet and outlet medium temperature difference of the flow channel based on the inlet and outlet medium temperature of the flow channel, and when the inlet and outlet medium temperature difference of the flow channel is greater than or equal to the target temperature difference, control the flow rate adjustment component (24) to increase the flow rate of the cooling medium. And / or, it also includes a flow rate sensor (42) for obtaining the flow rate of the cooling medium in the flow channel, the flow rate sensor (42) being connected to the controller (4), the controller (4) being further used to control the fan assembly (3) to operate when the flow rate of the cooling medium in the flow channel is greater than or equal to the target flow rate, so as to increase the rotation speed of the fan assembly (3).

8. The heat dissipation system according to any one of claims 1 to 7, characterized in that, It also includes a heat dissipation bracket (5), the bottom surface of the liquid cooling body (1) is connected to the heating element, and the top surface is connected to the heat dissipation bracket (5). The heat dissipation bracket (5) has a cavity for the fan assembly (3) to be placed inside. The side of the cavity away from the liquid cooling body (1) is an open structure to allow airflow to enter and exit the cavity.

9. The heat dissipation system according to claim 8, characterized in that, The fan assembly (3) includes: The device includes a heat dissipation shaft (31), an angle adjustment assembly (32), and several blade assemblies (33). The blade assemblies (33) are mounted on the periphery of the heat dissipation shaft (31) and can rotate with the heat dissipation shaft (31). The angle adjustment assembly (32) is disposed between the heat dissipation shaft (31) and the blade assembly (33). The axial direction of the blade assembly (33) is disposed in the axial direction of the heat dissipation shaft (31). The angle adjustment assembly (32) is used to adjust the rotation of the blade assembly (33) around its axial direction to change the tilt angle of the blades (331) in the blade assembly (33) relative to the heat dissipation shaft (31). The controller (4) is connected to the angle adjustment component (32), and the controller (4) is also used to control the operation of the angle adjustment component (32) according to the temperature difference between the inlet and outlet media of the flow channel.

10. The heat dissipation system according to claim 9, characterized in that, The blade assembly (33) includes a blade (331) and a blade disk (332). The blade disk (332) is disposed on the heat dissipation shaft (31). The blade (331) is disposed on the blade disk (332) and the blade (331) extends along the axial direction of the blade disk (332). The axial direction of the blade disk (332) is perpendicular to the axial direction of the heat dissipation shaft (31). The angle adjustment assembly (32) can drive the blade disk (332) to rotate around its axial direction.

11. The heat dissipation system according to claim 10, characterized in that, The heat dissipation shaft (31) is provided with a blade disk mounting groove, the blade disk (332) is located in the blade disk mounting groove, and the blade disk mounting groove is provided with an angle adjustment groove (34) extending in a circumferential direction. The blade disk (332) is provided with an angle adjustment block (35) in a circumferential direction. The angle adjustment block (35) can slide in the angle adjustment groove (34) to drive the blade disk (332) to rotate.

12. The heat dissipation system according to claim 11, characterized in that, Both the angle adjustment groove (34) and the angle adjustment block (35) are fan-ring structures, and the central angle corresponding to the angle adjustment block (35) is smaller than the central angle corresponding to the angle adjustment groove (34).

13. The heat dissipation system according to claim 11, characterized in that, The angle adjustment assembly (32) further includes an elastic component (321), an electromagnet (322), and a magnetic component (323). The electromagnet (322) and the elastic component (321) are both disposed in the angle adjustment groove (34). The magnetic component (323) is mounted on the angle adjustment block (35). One end of the elastic component (321) abuts against the angle adjustment groove (34), and the other end abuts against the side wall of the angle adjustment block (35). When the electromagnet (322) drives the magnetic component (323) to move, the elastic component (321) is compressed. When the electromagnet (322) is de-energized, the elastic component (321) resets and drives the angle adjustment block (35) to reset. The controller (4) is connected to the electromagnet (322) and is used to adjust the magnetic force of the electromagnet (322) according to the target tilt angle of the blade (331).

14. The heat dissipation system according to claim 13, characterized in that, An angle adjustment shaft (36) is also provided in the angle adjustment groove (34). The angle adjustment shaft (36) passes through the angle adjustment block (35), and the angle adjustment block (35) can slide relative to the angle adjustment shaft (36). The arc of the angle adjustment shaft (36) is the same as the arc of the angle adjustment groove (34).

15. The heat dissipation system according to claim 14, characterized in that, The elastic component (321) is a spring, and the elastic component (321) is sleeved on the angle adjustment shaft (36); when the angle adjustment block (35) is in the initial state, the angle adjustment block (35) and the electromagnet (322) are respectively located at both ends of the angle adjustment groove (34) along its circumference.

16. The heat dissipation system according to claim 8, characterized in that, The heat dissipation bracket (5) includes a heat dissipation bracket base (51) and a heat dissipation sleeve (52). The heat dissipation sleeve (52) is located on the side of the heat dissipation bracket base (51) away from the liquid cooling body (1). The heat dissipation bracket base (51) is detachably connected to the liquid cooling body (1). The cavity is located inside the heat dissipation sleeve (52).

17. The heat dissipation system according to claim 8, characterized in that, The liquid cooling body (1) includes a heat sink (101) and a main body base (102). The main body base (102) is located on the bottom outer periphery of the heat sink (101) to form a stepped structure at the bottom of the heat sink (101). The main body base (102) is used to be detachably installed on the motherboard at the position corresponding to the heat-generating element.

18. An electronic device, characterized in that, Includes the heat dissipation system as described in any one of claims 1 to 17.

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