Chip pressing device, chip hot pressing bonding machine and method

Abstract

The invention provides a chip pressing device, a chip hot pressing bonding machine and a method. The chip pressing device comprises an air cylinder main body with a containing cavity; comprising a plurality of pressing columns and is arranged on the air cylinder body in a sliding and penetrating mode. When gas is introduced into the containing cavity, the gas in the containing cavity generates pressure on the pressing execution piece and drives the pressing column to move towards the side away from the air cylinder body. And the end part of the pressing end is used for being in contact with the upper surface of the chip structure, so that the inclined upper surface of the chip structure is vertical to the pressing column. A plurality of pressing columns are arranged to apply pressure to the chip on the top surface, so that the upper chip and the lower chip can be subjected to thermocompression bonding, and when the chip on the top surface is inclined, the upwarp part of the chip on the inclined top surface is pressed downwards under certain gas pressure, so that the chip is changed from inclination to horizontal.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a chip bonding apparatus, a chip hot-press bonding machine and method. Background Technology

[0002] Chip stacking packaging, a highly forward-looking semiconductor packaging technology, is leading the industry towards miniaturization and high performance. Its core principle lies in the ingenious vertical stacking of multiple chips (dies) or pre-packaged chips, coupled with advanced interconnect technologies to ensure close collaboration. Even more remarkable is its exceptional performance optimization. Taking the well-known HBM (High Bandwidth Memory) packaging as an example, chip stacking significantly reduces the distance between memory chips, resulting in an exponential increase in data transfer rates. This provides powerful support for scenarios with extremely high memory bandwidth requirements, such as data center servers and high-performance graphics processing. Simultaneously, this architecture reduces power consumption and extends device battery life, offering multiple benefits. Chip stacking packaging technology is reshaping the semiconductor industry landscape with its unique advantages, laying a solid foundation for the future development of intelligent technologies, and continuously pushing the boundaries of electronic product performance.

[0003] In chip stacking and packaging, chip manufacturing factors such as wafer thinning, chip surface flatness, and irregular edge shapes, as well as alignment factors during chip stacking such as alignment equipment accuracy limitations, alignment mark accuracy issues, and adhesive material characteristics, can cause the upper layer chip to tilt relative to the lower layer chip. Chip tilting can lead to problems such as poor electrical connections, deteriorated heat dissipation, reduced mechanical stability, and decreased package dimensional accuracy, thereby affecting the performance and reliability of the stacked chips.

[0004] Currently, solutions to the problem of upper-layer chips tending to tilt relative to lower-layer chips are still being explored. In-depth research is being conducted on improving chip manufacturing precision, refining alignment technology and equipment, optimizing packaging structure and materials, and strengthening packaging process control, in order to effectively solve the tilting problem in chip stacking packaging and promote the further development of chip stacking packaging technology. Summary of the Invention

[0005] The problem to be solved by this application is to provide a chip bonding apparatus, a chip hot-press bonding machine and method to alleviate the problem that the upper chip is prone to tilting relative to the lower chip.

[0006] To address the aforementioned problems, this application provides a chip bonding apparatus, comprising: A cylinder body having a receiving cavity for containing gas; The pressing actuator includes multiple pressing pins. The pressing actuator is slidably disposed on the body wall of the cylinder body, and the multiple pressing pins are disposed through the cylinder body. One end of the multiple pressing pins that protrudes through the cylinder body is the pressing end. The sliding directions of the multiple pressing pins are parallel and perpendicular to the packaging plane of the chip structure. When a certain amount of gas is introduced into the cavity, the gas in the cavity exerts pressure on the pressing actuator and drives the pressing column to move closer to the chip structure. Multiple pressing ends protruding from the cylinder body are located on the same plane parallel to the packaging plane of the chip structure. The end of the pressing end is used to contact the upper surface of the chip structure. When the upper surface of the chip structure is not perpendicular to the pressing post, as the pressing end moves away from the cylinder body, at least one of the pressing ends first contacts the upper surface of the chip structure and continues to introduce gas into the receiving cavity. At least the pressing end that contacts the upper surface of the chip structure first can apply pressure to the upper surface of the chip structure, so that the upper surface of the chip structure is perpendicular to the pressing end.

[0007] The chip bonding apparatus provided in this application uses a pressing actuator with multiple pressing posts, which slides through the body wall of the cylinder. When gas is introduced into the cavity, according to Pascal's law, the gas pressure is uniformly transmitted through the apparatus, and the system eventually reaches a state of hydrostatic equilibrium, making the pressure at each pressing post equal. In chip stacking applications, when multiple chips are stacked sequentially, the apparatus of this application applies pressure to the top chip, enabling thermo-bonding between the upper and lower chips. The multiple pressing posts in the apparatus can press against different positions on the top surface of the chip. When the top chip is tilted, under a certain gas pressure, all pressing posts will move to the same level, and one pressing post will first contact the tilted part of the chip and press it down. As the pressure increases, the pressure will increase, and the tilted part of the chip will be pressed down. Other pressing posts will also contact other areas on the top surface of the chip in sequence, causing the chip to change from tilted to horizontal, thereby effectively improving the tilting problem during chip stacking.

[0008] In an optional embodiment, the cylinder body has a plurality of sub-cylinders, each sub-cylinder having a sub-accommodating space, the sub-accommodating space communicating with the accommodating cavity; The pressing actuator is a plurality of sub-pistons, the piston rod of the sub-pistons is the pressing column, and the plurality of sub-pistons are respectively slidably disposed in the sub-accommodating spaces of the plurality of sub-cylinders; The sub-cylinder body, the sub-piston, and the cylinder body form the receiving cavity.

[0009] In an optional embodiment, the sub-piston further includes a piston portion, and the sub-piston is slidably disposed on the sub-cylinder body via the piston portion; The piston rod is fixed to the surface of the piston.

[0010] In an optional embodiment, a first seal is further included, which is disposed between the sub-cylinder body and the piston portion of the sub-piston, and is used to seal the sub-piston and the sub-cylinder body.

[0011] In one optional embodiment, the sub-cylinder body has a through hole in its wall, and the piston rod of the sub-piston passes through the through hole to exit the sub-cylinder body.

[0012] In an optional embodiment, a second seal is further included, which is disposed on the through hole of the sub-cylinder body for sealing the piston rod portion of the sub-piston with the sub-cylinder body.

[0013] In an optional embodiment, a first air port is provided on the body wall of the sub-cylinder, the first air port being used to connect the sub-accommodating space to an air source; When the gas supply to the receiving cavity is canceled or reduced, and a certain amount of gas is supplied to the sub-receiving space through the first gas port, the gas in the sub-receiving space exerts pressure on the sub-piston, and the pressure exerted by the gas in the sub-receiving space on the sub-piston is greater than the pressure exerted by the gas in the receiving cavity on the sub-piston, the sub-piston can be driven to move closer to the cylinder body.

[0014] In an optional embodiment, a first elastic element is further included, which is disposed in the sub-cylinder body, and the two ends of the first elastic element are respectively used to cooperate with the sub-cylinder body and the sub-piston; When the sub-piston moves away from the cylinder body, the first elastic element is compressed. When the gas supply to the cavity is canceled or reduced, and the gas in the cavity exerts a pressure on the sub-piston that is less than the reset force of the first elastic element, the sub-piston moves toward the side closer to the cylinder body under the reset action of the first elastic element.

[0015] At this point, there is no need to set up a first air inlet.

[0016] In an optional embodiment, the first elastic element is a spring or an elastic rubber ring.

[0017] In actual use, the spring or elastic rubber ring is sleeved on the outside of the sub-piston.

[0018] In one optional embodiment, multiple sub-cylinders are located on the same side wall of the cylinder body, and the multiple sub-cylinders are at the same horizontal height.

[0019] In an optional embodiment, a limiting member is further included, which is disposed on the inner wall of the sub-cylinder body. The limiting member is used to cooperate with the piston portion of the sub-piston to limit the sliding distance of the sub-piston on the side of the sub-cylinder body near the cylinder body.

[0020] In an optional embodiment, the cylinder body has a second air port on its wall, the second air port being used to connect the receiving cavity to an air source.

[0021] In an optional embodiment, the pressing end is provided with a buffer pad for contacting the upper surface of the chip structure.

[0022] When the pressing post engages with the chip structure or applies pressure to the chip structure, the buffer pad is used to prevent the chip structure from being crushed.

[0023] In an optional embodiment, the cushioning pad is bonded to the end of the pressing end.

[0024] In one optional embodiment, the buffer pad is a silicone rubber buffer pad or a high-temperature resistant rubber buffer pad.

[0025] In an optional embodiment, a heating element is further included, which is disposed on the pressing post and is used to heat the chip structure.

[0026] In one optional embodiment, the heating element is a heating wire.

[0027] In an alternative embodiment, the surface areas of the plurality of pressing posts exposed within the sub-accommodating space are equal.

[0028] In an optional embodiment, the chip structure includes a substrate and a plurality of chips disposed on the surface of the substrate, wherein the plurality of chips are stacked. The pressing end engages with the chip furthest from the substrate.

[0029] In an optional embodiment, a deformable diaphragm is further included, the deformable diaphragm being disposed inside the cylinder body, and the upper surface of the deformable diaphragm forming the receiving cavity with the cylinder body, and the lower surface of the deformable diaphragm forming the mounting cavity with the cylinder body; The pressing actuator is disposed in the mounting cavity, and the pressing actuator cooperates with the side of the deformable diaphragm away from the receiving cavity; When a certain amount of gas is introduced into the receiving cavity, the deformable diaphragm deforms towards the side closer to the pressing actuator and drives the pressing actuator to move away from the cylinder body.

[0030] In an optional embodiment, the pressing actuator includes a pressing plate and a pressing rod disposed on the pressing plate, the pressing rod being perpendicular to the pressing plate and being the pressing column; The pressing plate is disposed inside the mounting cavity, and the pressing rod extends out of the mounting cavity.

[0031] In an optional embodiment, the pressing plate of the pressing actuator cooperates with the deformable diaphragm.

[0032] In one optional embodiment, the deformable diaphragm serves as a pressing plate for the pressing actuator, and the pressing rod is fixedly and perpendicularly to the deformable diaphragm.

[0033] In an optional embodiment, a second elastic element is further included, which is disposed in the mounting cavity, and the two ends of the second elastic element are respectively used to cooperate with the pressing plate and the bottom wall of the mounting cavity; When the pressing actuator moves away from the cylinder body, the second elastic element is in a compressed state; When the gas flow into the cavity is stopped or reduced, the pressure rod moves toward the side closer to the cylinder body under the reset action of the second elastic element.

[0034] In one optional embodiment, the second elastic element is a spring or an elastic rubber ring.

[0035] In an optional embodiment, the deformable diaphragm is sealed to the cylinder body.

[0036] In one optional embodiment, the outer peripheral sidewall of the deformable diaphragm is bonded and fixed to the inner peripheral sidewall of the cylinder body.

[0037] In one specific embodiment, the pressing plate is bonded and fixed to the deformable diaphragm, and the portion of the deformable diaphragm between the inner wall of the cylinder body and the pressing plate undergoes elastic deformation.

[0038] In one optional embodiment, the outer peripheral sidewall of the deformable diaphragm has a first mounting protrusion, and the inner peripheral sidewall of the cylinder body has a second mounting protrusion. The first mounting protrusion and the second mounting protrusion overlap and are fixed by fasteners.

[0039] In an optional embodiment, a sealing ring is provided between the first mounting protrusion and the second mounting protrusion.

[0040] In an optional embodiment, the system further includes a control system and a position sensor signal-connected to the control system, the position sensor being used to detect the position height of the pressing column; The control system controls the air intake or exhaust volume of the receiving cavity based on the position and height of the pressing column.

[0041] When the chip is tilted, at least one pressing post first descends to a position that can contact the surface of the chip structure, controlling the air intake or exhaust of the receiving cavity until all pressing posts are in the predetermined position, ensuring that the thermo-bonded chip is not easily tilted.

[0042] In an optional embodiment, the system further includes a control system and a position sensor signal-connected to the control system, the position sensor being used to detect the position height of the pressing column; The control system controls the air intake or exhaust volume of the receiving cavity and / or sub-receiving cavity according to the position and height of the pressing column, so that different pressing columns generate different pressures.

[0043] The control system adjusts the air intake or exhaust volume of the receiving cavity and sub-receiving space based on the information fed back by the position sensor, so as to control the descent height of the pressing column and achieve precise control of the pressing column position height, thereby ensuring that the thermo-bonded chip is not prone to tilting. Furthermore, the pressure generated by different pressing columns can be adjusted so that the pressing column that comes into contact first generates greater pressure, thereby achieving precise control of the pressing column position height and ensuring that the thermo-bonded chip is not prone to tilting.

[0044] In an optional embodiment, the position sensor is a magnetic position sensor located in the pressing column.

[0045] This application also provides a chip hot-press bonding machine, including the chip pressing device described above.

[0046] In an optional embodiment, the chip hot-press bonding machine further includes a vacuum chamber, which provides a vacuum environment during the bonding process. The vacuum chamber helps to improve bonding quality and reduce the impact of adverse factors such as oxidation.

[0047] In one optional embodiment, the vacuum chamber is filled with a protective gas, namely nitrogen.

[0048] In an optional embodiment, the chip bonding device is disposed within a vacuum chamber and is used to cooperate with the bonding mechanism to prevent the chip structure from tilting during stacking thermo-bonding.

[0049] In an optional embodiment, it further includes a frame, a heating device, and a pressing mechanism disposed within the vacuum chamber; The rack has a mounting platform for mounting other components, and the mounting platform has a positioning mechanism for fixing a substrate or chip structure. The pressing mechanism is disposed above the mounting platform and is used to apply pressure to the chip structure to be bonded in order to achieve bonding; The heating device is mounted on the mounting platform and is used to heat the substrate or chip structure.

[0050] This application also provides a method for hot-press bonding of chips using a chip hot-press bonding machine, wherein the chip hot-press bonding machine is one of the chip hot-press bonding machines described above. The method includes: Provide a substrate or a chip structure to be bonded, and mount the substrate or chip structure to be bonded on the positioning mechanism; A heating device is used to heat the substrate or chip structure to the bonding temperature. Thermo-bonding is achieved by applying pressure to the chip structure using a chip bonding device.

[0051] In one optional embodiment, the sub-cylinder of the chip pressing device is a sub-cylinder with a first air port; The pressing column of the chip pressing device is equipped with a position sensor. The position sensor signal is connected to the control system. The control system also controls the inlet and outlet of gas in the receiving cavity and the inlet and outlet of gas in the sub-cylinder. The steps of applying pressure to a chip structure using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure to be bonded; Gas is introduced into the receiving cavity by the control system, so that the gas in the receiving cavity exerts pressure on the pressing actuator and drives the multiple pressing columns to move closer to the chip structure. The control system determines whether all pressing columns have reached the predetermined position height based on the position signals fed back by the position sensors. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post has not reached the predetermined height, the control system either controls the discharge of gas from the sub-cylinder corresponding to the pressing post that has not reached the predetermined height or controls the continued filling of gas into the receiving cavity, so that the pressing post that has not reached the predetermined height continues to move closer to the chip structure to reach the predetermined height.

[0052] In actual use, after the hot-press bonding is completed, the control system also controls the injection of gas into each sub-cylinder and / or controls the discharge of gas from the receiving cavity, so that the pressure on the pressing column in the sub-cylinder is greater than the pressure on the receiving cavity, so that each pressing column resets.

[0053] In one optional embodiment, the sub-cylinder of the chip pressing device is a sub-cylinder with a first elastic element inside; The pressing post of the chip pressing device is equipped with a position sensor, and the position sensor signal is connected to a control system. The control system also controls the inlet and outlet of gas in the containment cavity. The steps of applying pressure to a chip structure using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure to be bonded; Gas is introduced into the receiving cavity by the control system, so that the gas in the receiving cavity exerts pressure on the pressing actuator and drives the multiple pressing columns to move closer to the chip structure. The control system determines whether all pressing columns have reached the predetermined position height based on the position signals fed back by the position sensors. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post has not reached the predetermined height, the control system continues to fill the cavity with gas, causing the pressing post that has not reached the predetermined height to continue moving closer to the chip structure until it reaches the predetermined height.

[0054] In actual use, after the thermo-bonding is completed, the control system also controls the discharge of gas in the containment cavity so that each pressing column is reset under the action of the first elastic element.

[0055] In an optional embodiment, the chip bonding device is a device with a deformable film disposed thereon; The pressing post of the chip pressing device is equipped with a position sensor. The position sensor signal is connected to the control system, which also controls the inlet and outlet of gas in the cavity. The steps of applying pressure to a chip structure using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure to be bonded; Gas is introduced into the receiving cavity by the control system, so that the gas in the receiving cavity exerts pressure on the pressing actuator and drives the multiple pressing columns to move closer to the chip structure. The control system determines whether all pressing columns have reached the predetermined position height based on the position signals fed back by the position sensors. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post has not reached the predetermined height, the control system continues to fill the cavity with gas, causing the pressing post that has not reached the predetermined height to continue moving closer to the chip structure until it reaches the predetermined height.

[0056] In actual use, after the thermo-bonding is completed, the control system also controls the discharge of gas in the containment cavity so that each pressing column is reset under the action of the second elastic element.

[0057] In actual use, the chip bonding device can continue to thermally bond the chip structure to prevent the chip structure from tilting during stacking, thereby ensuring the electrical connection performance, heat dissipation performance, mechanical stability and packaging size accuracy between the bonded chips, and ensuring the overall performance and reliability of the stacked chips.

[0058] The advantages of the technical solution in this application are: The chip bonding apparatus provided in this application uses a pressing actuator with multiple pressing posts, which slides through the body wall of the cylinder. When gas is introduced into the cavity, according to Pascal's law, the gas pressure is uniformly transmitted through the apparatus, and the system eventually reaches a state of hydrostatic equilibrium, making the pressure at each pressing post equal. In chip stacking applications, when multiple chips are stacked sequentially, the apparatus of this application applies pressure to the top chip, enabling thermo-bonding between the upper and lower chips. The multiple pressing posts in the apparatus can press against different positions on the top surface of the chip. When the top chip is tilted, under a certain gas pressure, all pressing posts will move to the same level, and one pressing post will first contact the tilted part of the chip and press it down. As the pressure increases, the pressure will increase, and the tilted part of the chip will be pressed down. Other pressing posts will also contact other areas on the top surface of the chip in sequence, causing the chip to change from tilted to horizontal, thereby effectively improving the tilting problem during chip stacking. Meanwhile, this application provides two possible implementation methods: the structure of the sub-cylinder body and the sub-piston is flexible and simple, and the structure of the deformable diaphragm and the pressing plate and the pressure rod is simple. Attached Figure Description

[0059] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. In addition, in the following drawings, the components are not necessarily drawn to scale, and components with similar related characteristics or features may have the same or similar reference numerals.

[0060] Figure 1 This is a schematic diagram of the chip bonding device in one embodiment of this application; Figure 2 for Figure 1 A magnified schematic diagram of the structure of part A in the diagram; Figure 3 This is a schematic diagram of the chip bonding device in one embodiment of this application; Figure 4 This is a schematic diagram of the chip bonding device in another embodiment of this application; Figure 5 This is a schematic diagram of the chip bonding device in another embodiment of this application; Figure 6 This is a schematic flowchart of a method for hot-press bonding chips using a chip hot-press bonding machine in one embodiment of this application.

[0061] The labels for the attached figures are as follows: 10. Cylinder body; 101. Receiving cavity; 102. Second air port; 103. Mounting cavity; 110. Sub-cylinder body; 111. Sub-receiving space; 112. First air port; 120. Limiting element; 20. Pressing actuator; 210. Pressing column; 211. Pressing end; 220. Buffer pad; 230. Heating element; 240. Pressing plate; 250. Pressing rod; 30. Chip structure; 310. Substrate; 320. Chip; 40. Sub-piston; 410. Plug rod part; 420. Piston part; 510. First sealing element; 520. Second sealing element; 610. First elastic element; 620. Second elastic element; 70. Deformation diaphragm. Detailed Implementation

[0062] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.

[0063] In the description of this application, it should be noted that the use of terms such as "first" and "second" to define objects (such as elements, components, regions, layers, doping types and / or parts) is merely for the purpose of distinguishing different objects and is not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that such data can be used interchangeably where appropriate.

[0064] In the description of this application, it should be understood that the singular forms “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that when the terms “compose” and / or “comprise” are used in this specification, the presence of the stated feature, integer, step, operation, element, and / or part is established, but the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups is not excluded. Meanwhile, when used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0065] In the description of this application, it should also be noted that when a component is referred to as "on another component," "connected to another component," or "in contact with another component," it can mean not only that a component is directly on, directly connected to, or directly in contact with another component, but also that an intermediate component can be inserted between the two components. Furthermore, "connection" includes not only fixed connections but also detachable connections or integral connections. Similarly, when an element is referred to as "electrically connected," "electrically contacted," "electrically coupled," or "electrically coupled to" another element, the two elements can be in direct electrical contact or point coupling, or they can be in electrical contact or point coupling through an intermediate component.

[0066] In the description of this application, it should also be noted that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0067] Furthermore, in the description of this application, spatial relation terms such as "below," "under," "below," "below," "below," "above," "on the upper surface of," "above," etc., can be used to describe the spatial positional relationship between one element or feature shown in the figures and other elements or features. It should be understood that spatial relation terms, in addition to the orientation shown in the figures, also include different orientations of elements or features in use and operation. For example, if an element or feature in the figures is flipped or inverted, an element or feature described as "below" or "below" other elements or features will be oriented "above" other elements or features. Furthermore, elements may also include other orientations (e.g., rotated by an angle or other orientations).

[0068] This application provides a chip bonding apparatus, a chip thermal bonding machine, and a method, in conjunction with reference to... Figures 1-5 ,in Figure 1 This is a schematic diagram of the chip bonding device in one embodiment of this application; Figure 2 for Figure 1 A magnified schematic diagram of the structure of part A in the diagram; Figure 3 This is a schematic diagram of the chip bonding device in one embodiment of this application; Figure 4 This is a schematic diagram of the chip bonding device in another embodiment of this application; Figure 5This is a schematic diagram of the chip bonding device in another embodiment of this application. Figure 6 This is a schematic flowchart of a method for hot-press bonding chips using a chip hot-press bonding machine according to an embodiment of this application. The chip bonding apparatus includes: The cylinder body 10 has a receiving cavity 101 for containing gas. Pressing actuator 20 includes multiple pressing posts 210. The pressing actuator 20 is slidably disposed on the body wall of the cylinder body 10, and the multiple pressing posts 210 are disposed through the cylinder body 10. One end of the multiple pressing posts 210 that protrudes from the cylinder body 10 is a pressing end 211. The sliding directions of the multiple pressing posts 210 are parallel and perpendicular to the packaging plane of the chip structure 30. When a certain amount of gas is introduced into the receiving cavity 101, the gas in the receiving cavity 101 exerts pressure on the pressing actuator 20 and drives the pressing column 210 to move closer to the chip structure. The pressing ends 211 of the multiple cylinder bodies 10 are located on the same plane parallel to the packaging plane of the chip structure 30. The end of the pressing end 211 is used to contact the upper surface of the chip structure 30. When the upper surface of the chip structure 30 is not perpendicular to the pressing post 210, as the pressing end 211 moves away from the cylinder body 10, at least one pressing end 211 first contacts the upper surface of the chip structure 30 and continues to introduce gas into the receiving cavity 101. At least the pressing end 211 that first contacts the upper surface of the chip structure 30 can apply pressure to the upper surface of the chip structure 30, so that the upper surface of the chip structure 30 is perpendicular to the pressing post 210.

[0069] The chip pressing device provided in this application is configured with a pressing actuator 20 having multiple pressing posts 210, and the pressing actuator 20 is slidably inserted into the body wall of the cylinder body 10. When gas is filled into the receiving cavity 101, according to Pascal's law, the gas pressure is uniformly transmitted in the device, and the system will eventually reach a state of hydrostatic equilibrium, so that the pressure at each pressing post 210 is equal. In the application of stacked chips 320, when multiple chips 320 are stacked sequentially upwards, the device of this application applies pressure to the top chip 320, enabling thermo-bonding between the upper and lower chips 320. The multiple pressing posts 210 in the device of this application can press against different positions on the top surface of the chip 320. When the top chip 320 is tilted, under a certain gas pressure, all pressing posts 210 will move to the same level, and one pressing post 210 will first contact the tilted part of the chip 320 and press this part downwards. As the pressure increases, the pressure will increase, and the tilted part of the chip 320 will be pressed down. Other pressing posts 210 will also contact other areas on the top surface of the chip 320 in sequence, so that the chip 320 changes from tilted to horizontal, thereby effectively improving the tilting problem in the chip stacking process.

[0070] In one embodiment, the cylinder body 10 has a plurality of sub-cylinder bodies 110, each sub-cylinder body 110 having a sub-accommodating space 111, the sub-accommodating space 111 being connected to the accommodating cavity 101; The pressing actuator 20 consists of multiple sub-pistons 40, and the piston rod portion 410 of the sub-piston 40 is a pressing column 210. The multiple sub-pistons 40 are slidably disposed in the sub-accommodating space 111 of the multiple sub-cylinders 110. The sub-cylinder body 110, the sub-piston 40, and the cylinder body 10 form a receiving cavity 101.

[0071] In one embodiment, a plurality of sub-cylinders 110 are arranged in a matrix to correspond to the upper surface of the chip 320.

[0072] In one embodiment, the sub-piston 40 further includes a piston portion 420, through which the sub-piston 40 is slidably disposed on the sub-cylinder body 110; The piston rod portion 410 is fixed to the surface of the piston portion 420.

[0073] In one embodiment, a first seal 510 is also included, which is disposed between the sub-cylinder body 110 and the piston portion 420 of the sub-piston 40. The first seal 510 is used to seal the sub-piston 40 and the sub-cylinder body 110.

[0074] In one embodiment, the sub-cylinder body 110 has a through hole in its body wall, and the piston rod portion 410 of the sub-piston 40 passes through the through hole to extend out of the sub-cylinder body 110.

[0075] In one embodiment, a second seal 520 is also included. The second seal 520 is disposed on the through hole of the sub-cylinder 110 and is used to seal the piston rod portion 410 of the sub-piston 40 with the sub-cylinder 110.

[0076] Please refer to Figure 1 and Figure 2 In one embodiment, a first air port 112 is provided on the body wall of the sub-cylinder 110, and the first air port 112 is used to connect the sub-accommodating space 111 to an air source. When the gas supply to the receiving cavity 101 is canceled or reduced, and a certain amount of gas is supplied to the sub-receiving space 111 through the first gas port 112, the gas in the sub-receiving space 111 exerts pressure on the sub-piston 40. When the pressure exerted by the gas in the sub-receiving space 111 on the sub-piston 40 is greater than the pressure exerted by the gas in the receiving cavity 101 on the sub-piston 40, the sub-piston 40 can be driven to move closer to the cylinder body 10 to achieve the reset of the pressing actuator 20.

[0077] Meanwhile, by controlling the amount of gas introduced into the receiving cavity and a certain amount of gas introduced into the sub-receiving space, the pressure of the gas in the sub-receiving space on the sub-piston can be adjusted so that the pressure of each sub-piston can be different.

[0078] Please refer to Figure 3 In another embodiment, a first elastic element 610 is also included. The first elastic element 610 is disposed in the sub-cylinder 110, and the two ends of the first elastic element 610 are respectively used to cooperate with the sub-cylinder 110 and the sub-piston 40. When the sub-piston 40 moves away from the cylinder body 10, the first elastic element 610 is in a compressed state. When the gas supply to the receiving cavity 101 is canceled or reduced, and the pressure exerted by the gas in the receiving cavity 101 on the sub-piston 40 is less than the reset force of the first elastic element 610, the sub-piston 40 moves towards the side closer to the cylinder body 10 under the reset action of the first elastic element 610, so as to realize the reset of the pressing actuator 20.

[0079] At this point, it is not necessary to set up the first air inlet 112.

[0080] In another embodiment, the first elastic element 610 is a spring or an elastic rubber ring.

[0081] In another specific embodiment, a spring or elastic rubber ring is sleeved on the outside of the piston rod portion 410 of the sub-piston 40.

[0082] In one embodiment, multiple sub-cylinders 110 are located on the same side wall of the cylinder body 10, and the multiple sub-cylinders 110 are located at the same horizontal height.

[0083] In one specific embodiment, multiple sub-cylinder bodies 110 are located on the same horizontal plane, and multiple pressing ends 211 protruding from the cylinder body 10 have equal lengths and are located on the same horizontal plane; the chip structure 30 is horizontally arranged.

[0084] In one embodiment, a limiting member 120 is also included. The limiting member 120 is disposed on the inner wall of the sub-cylinder body 110. The limiting member 120 is used to cooperate with the piston portion 420 of the sub-piston 40 to limit the sliding distance of the sub-piston 40 on the side of the sub-cylinder body 110 near the cylinder body 10.

[0085] In one embodiment, the cylinder body 10 has a second air port 102 on its body wall, which is used to connect the receiving cavity 101 to an air source.

[0086] In one specific embodiment, the second air port 102 has two parts: one is used to connect to an air source for supplying air, and the other is used to connect to the outside for venting air.

[0087] In one embodiment, a second air port 102 for connecting to a gas source is connected to an external pipeline and is connected to the gas source through a pipeline. A first air port 112 for connecting to a gas source in the sub-accommodation space 111 is also connected to the gas source through a pipeline. Both pipelines are equipped with switch valves, which are connected to the control system.

[0088] Please refer to Figure 4 In one embodiment, the pressing end 211 is provided with a buffer pad 220, which is used to contact the upper surface of the chip structure 30.

[0089] When the pressing post 210 engages with the chip structure 30 or applies pressure to the chip structure 30, the buffer pad 220 is used to prevent the chip structure 30 from being damaged.

[0090] In one embodiment, the buffer pad 220 is bonded to the end of the pressing end 211.

[0091] In one embodiment, the buffer pad 220 is a silicone rubber buffer pad or a high-temperature resistant rubber buffer pad.

[0092] Please refer to Figure 4 In one embodiment, a heating element 230 is also included. The heating element 230 is disposed on the pressing post 210 and is used to provide auxiliary heating for the chip structure 30.

[0093] In one embodiment, the heating element 230 is a heating wire.

[0094] In one specific embodiment, the pressing post 210 has a hollow structure, and the heating wire is disposed inside the pressing post 210.

[0095] In one embodiment, the plurality of sub-cylinders 110 have equal radial dimensions and the plurality of pressing posts 210 have equal surface areas exposed within the sub-accommodation space 111.

[0096] In one specific embodiment, the sub-cylinder body 110 is a cylindrical sub-cylinder body, the piston part 420 is a cylindrical piston part, and the piston rod part 410 is a cylindrical piston rod part.

[0097] In one embodiment, the chip structure 30 includes a substrate 310 and a plurality of chips 320 disposed on the surface of the substrate 310, wherein the plurality of chips are stacked. The pressing end 211 engages with the chip 320 furthest from the substrate 310.

[0098] Please refer to Figure 5 In another embodiment, a deformable diaphragm 70 is also included (in which case the sub-cylinder body 110 is not required). The deformable diaphragm 70 is disposed inside the cylinder body 10, and the upper surface of the deformable diaphragm 70 forms a receiving cavity 101 with the cylinder body 10, and the lower surface of the deformable diaphragm 70 forms an mounting cavity 103 with the cylinder body 10. The pressing actuator 20 is disposed in the mounting cavity 103, and the pressing actuator 20 cooperates with the side of the deformable diaphragm 70 away from the receiving cavity 101; When a certain amount of gas is introduced into the receiving cavity 101, the deformable diaphragm 70 deforms towards the side closer to the pressing actuator 20 and drives the pressing actuator 20 to move away from the cylinder body 10.

[0099] In one embodiment, the system further includes a control system and a position sensor connected to the control system. The position sensor is disposed on the pressing column and is used to detect the position height of the pressing column. The control system controls the intake or exhaust volume of the receiving cavity and / or the sub-receiving space of the sub-cylinder body connected to the cylinder body according to the position and height of the pressing column.

[0100] In actual use, the control system can control at least one pressing post to descend to a position where it can contact the surface of the chip structure, and then control all pressing posts to a predetermined position. The predetermined position is the theoretically calculated height of the chip stack.

[0101] The control system adjusts the air intake or exhaust volume of the accommodating cavity and sub-accommodating space based on the information fed back by the position sensor, so as to control the descent height of the pressing column and achieve precise control of the pressing column position height, thereby ensuring that the thermo-bonded chip is not prone to tilting.

[0102] In other embodiments, a control system and a position sensor signal-connected to the control system are also included, the position sensor being used to detect the position height of the pressing column; The control system controls the air intake or exhaust volume of the receiving cavity and / or sub-receiving cavity according to the position and height of the pressing column, so that different pressing columns generate different pressures.

[0103] Based on information from the position sensor, the control system simultaneously adjusts the air intake or exhaust volume of the receiving cavity and the sub-receiving space to control the descent height of the pressing column and achieve precise control of the pressing column's position height. This ensures that the thermo-bonded chip is not prone to tilting. Furthermore, the system can adjust the pressure generated by different pressing columns, so that the pressing column that comes into contact first generates greater pressure, thereby achieving precise control of the pressing column's position height and ensuring that the thermo-bonded chip is not prone to tilting.

[0104] In one embodiment, the position sensor is a magnetic position sensor.

[0105] In another embodiment, the pressing actuator 20 includes a pressing plate 240 and a pressing rod 250 disposed on the pressing plate 240. The pressing rod 250 is perpendicular to the pressing plate 240 and is a pressing column 210. The pressing plate 240 is set inside the mounting cavity 103, and the pressing rod 250 is set through the mounting cavity 103.

[0106] In another specific embodiment, the pressing plate 240 is an integral pressing plate 240, and multiple pressing rods 250 are respectively installed on the integral pressing plate 240. At this time, the integral pressing plate 240 and the deformable diaphragm 70 have at least one fixed point.

[0107] In another specific embodiment, the pressing plate 240 is a plurality of sub-pressing plates 240, and a plurality of pressing rods 250 are respectively installed on the plurality of sub-pressing plates 240. At this time, the plurality of sub-pressing plates 240 are respectively fixed to the deformable diaphragm 70.

[0108] In another embodiment, the pressing plate 240 of the pressing actuator 20 cooperates with the deformable diaphragm 70, and the radial dimension of the pressing plate 240 is smaller than the radial dimension of the deformable diaphragm 70.

[0109] In another embodiment, the pressing plate 240 may be omitted, and the pressing rod 250 may be directly installed on the lower surface of the deformable diaphragm 70, in which case the deformable diaphragm 70 serves as the pressing plate.

[0110] In another embodiment, a second elastic element 620 is also included. The second elastic element 620 is disposed in the mounting cavity 103, and the two ends of the second elastic element 620 are respectively used to cooperate with the pressing plate 240 and the bottom wall of the mounting cavity 103. When the pressing actuator 20 moves away from the cylinder body 10, the second elastic element 620 is in a compressed state. When the gas supply to the receiving cavity 101 is canceled or reduced, the pressure rod 250 moves towards the side closer to the cylinder body 10 under the reset action of the second elastic element 620.

[0111] In another embodiment, the second elastic element 620 is a spring or an elastic rubber ring.

[0112] In another embodiment, the deformable diaphragm 70 is sealed to the cylinder body 10.

[0113] In another embodiment, the outer peripheral sidewall of the deformable diaphragm 70 is bonded and fixed to the inner peripheral sidewall of the cylinder body 10.

[0114] In another specific embodiment, the pressing plate 240 is bonded and fixed to the deformable diaphragm 70, and the portion of the deformable diaphragm 70 between the inner wall of the cylinder body 10 and the pressing plate 240 undergoes elastic deformation.

[0115] In another embodiment, the outer peripheral sidewall of the deformable diaphragm 70 has a first mounting protrusion, and the inner peripheral sidewall of the cylinder body 10 has a second mounting protrusion. The first mounting protrusion and the second mounting protrusion overlap and are fixed by fasteners.

[0116] In another embodiment, a sealing ring is provided between the first mounting protrusion and the second mounting protrusion.

[0117] This application also provides a chip hot-press bonding machine (not shown in the figure), which includes the chip pressing device described above.

[0118] In one embodiment, the chip hot-press bonding machine further includes a vacuum chamber, which provides a vacuum environment during the bonding process. The vacuum chamber helps to improve bonding quality and reduce the impact of adverse factors such as oxidation.

[0119] In one embodiment, the vacuum chamber is filled with a protective gas, namely nitrogen.

[0120] In one embodiment, the chip bonding device is disposed in a vacuum chamber and is used to cooperate with the bonding mechanism to prevent the chip structure 30 from tilting during stacking thermo-bonding.

[0121] In one embodiment, it also includes a frame, a heating device, and a pressing mechanism disposed within the vacuum chamber; The rack has a mounting platform for mounting other components, and a positioning mechanism for fixing the substrate or chip structure is formed on the mounting platform; The bonding mechanism is positioned above the mounting platform and is used to apply pressure to the chip structure to be bonded in order to achieve bonding; The heating device is set on the mounting platform and is used to heat the substrate or chip structure.

[0122] Please refer to Figure 1 and Figure 6 This application also provides a method for hot-press bonding of chips using a chip hot-press bonding machine, wherein the chip hot-press bonding machine is one of the chip hot-press bonding machines described above. The methods include: Provide a substrate 310 or a chip structure 30 to be bonded, and mount the substrate 310 or the chip structure 30 to be bonded on the positioning mechanism; The substrate 310 or chip structure 30 is heated to the bonding temperature using a heating device. The chip structure 30 is thermo-bonded by applying pressure using a chip bonding device.

[0123] In one embodiment, the sub-cylinder 110 of the chip bonding device is a sub-cylinder with a first air port 112 (see reference). Figure 1 , Figure 2 and Figure 4 ); The pressing post 210 of the chip pressing device is a pressing post equipped with a position sensor. The position sensor signal is connected to the control system. The control system also controls the gas inlet and outlet in the receiving cavity 101 and the gas inlet and outlet in the sub-cylinder 110 respectively. The steps of applying pressure to the chip structure 30 using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure 30 to be bonded; Gas is introduced into the receiving cavity 101 by the control system, so that the gas in the receiving cavity 101 exerts pressure on the pressing actuator 20 and drives multiple pressing columns 210 to move towards the side closer to the chip structure 30. The control system determines whether all pressing columns 210 have reached the predetermined position height based on the position signal fed back by the position sensor. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post 210 has not reached the predetermined position height, the control system controls the discharge of gas in the sub-cylinder 110 corresponding to the pressing post 210 that has not reached the predetermined position height, or controls the continued filling of gas into the receiving cavity 101, so that the pressing post 210 that has not reached the predetermined position height continues to move closer to the chip structure 30 to reach the predetermined position height.

[0124] In actual use, after the hot-press bonding is completed, the control system also controls the injection of gas into each sub-cylinder 110 and / or controls the discharge of gas from the receiving cavity 101, so that the pressure on the pressing column 210 in the sub-cylinder 110 is greater than the pressure on the receiving cavity 101, so that each pressing column 210 is reset.

[0125] In one embodiment, the sub-cylinder 110 of the chip bonding device is a sub-cylinder with a first elastic element 610 inside (see reference). Figure 3 ); The pressing post 210 of the chip pressing device is a pressing post 210 equipped with a position sensor. The position sensor signal is connected to the control system, which also controls the inlet and outlet of gas in the receiving cavity 101. The steps of applying pressure to the chip structure 30 using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure 30 to be bonded; Gas is introduced into the receiving cavity 101 by the control system, so that the gas in the receiving cavity 101 exerts pressure on the pressing actuator 20 and drives multiple pressing columns 210 to move towards the side closer to the chip structure 30. The control system determines whether the pressing column 210 has reached the predetermined position height based on the position signal fed back by the position sensor. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that the pressing post 210 has not reached the predetermined position height, the control system continues to fill the receiving cavity 101 with gas, so that the pressing post 210 that has not reached the predetermined position height continues to move closer to the chip structure 30 to reach the predetermined position height.

[0126] In actual use, after the thermo-bonding is completed, the control system also controls the discharge of gas in the accommodating cavity 101 so that each pressing column 210 is reset under the action of the first elastic element 610.

[0127] In one embodiment, the chip bonding apparatus is an apparatus having a deformable diaphragm 70 (see reference). Figure 5 ); The pressing post 210 of the chip pressing device is a pressing post 210 equipped with a position sensor. The position sensor signal is connected to the control system, which also controls the inlet and outlet of gas in the receiving cavity 101. The steps of applying pressure to the chip structure 30 using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure 30 to be bonded; Gas is introduced into the receiving cavity 101 by the control system, so that the gas in the receiving cavity 101 exerts pressure on the pressing actuator 20 and drives multiple pressing columns 210 to move towards the side closer to the chip structure 30. The control system determines whether the pressing column 210 has reached the predetermined position height based on the position signal fed back by the position sensor. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that the pressing post 210 has not reached the predetermined position height, the control system continues to fill the receiving cavity 101 with gas, so that the pressing post 210 that has not reached the predetermined position height continues to move closer to the chip structure 30 to reach the predetermined position height.

[0128] In actual use, after the thermo-bonding is completed, the control system also controls the discharge of gas in the accommodating cavity 101 so that each pressing column 210 is reset under the action of the second elastic element 620.

[0129] In one embodiment, the bonding temperature is 200°C to 400°C.

[0130] In actual use, the chip structure 30 can be thermally bonded by the chip bonding device so that the chip structure 30 does not tilt when stacked, thereby ensuring the electrical connection performance, heat dissipation performance, mechanical stability and packaging size accuracy between the bonded chips, and ensuring the overall performance and reliability of the stacked chips.

[0131] It should be noted that, where there is no conflict, the features in the different embodiments of this application described above can be combined with each other. Furthermore, in each of the above embodiments, the focus is on describing the differences from other embodiments; other specific descriptions of the same / similar parts between the embodiments can be referred to (or referenced) interchangeably. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this application.

[0132] Although this application has been disclosed above with reference to preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make possible changes and modifications to the technical solutions of this application by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this application. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the protection scope of the technical solutions of this application.

Claims

1. A chip bonding device, characterized in that, include: A cylinder body having a receiving cavity for containing gas; The pressing actuator includes multiple pressing pins. The pressing actuator is slidably disposed on the body wall of the cylinder body, and the multiple pressing pins are disposed through the cylinder body. One end of the multiple pressing pins that protrudes through the cylinder body is the pressing end. The sliding directions of the multiple pressing pins are parallel and perpendicular to the packaging plane of the chip structure. When a certain amount of gas is introduced into the cavity, the gas in the cavity exerts pressure on the pressing actuator and drives the pressing column to move closer to the chip structure. Multiple pressing ends protruding from the cylinder body are located on the same plane parallel to the packaging plane of the chip structure. The end of the pressing end is used to contact the upper surface of the chip structure. When the upper surface of the chip structure is not perpendicular to the pressing post, as the pressing end moves away from the cylinder body, at least one of the pressing ends first contacts the upper surface of the chip structure and continues to introduce gas into the receiving cavity. At least the pressing end that contacts the upper surface of the chip structure first can apply pressure to the upper surface of the chip structure, so that the upper surface of the chip structure is perpendicular to the pressing end.

2. The chip bonding apparatus as described in claim 1, characterized in that, The cylinder body has multiple sub-cylinders, each sub-cylinder has a sub-accommodating space, and the sub-accommodating space is connected to the accommodating cavity. The pressing actuator is a plurality of sub-pistons, the piston rod of the sub-pistons is the pressing column, and the plurality of sub-pistons are respectively slidably disposed in the sub-accommodating spaces of the plurality of sub-cylinders; The sub-cylinder body, the sub-piston, and the cylinder body form the receiving cavity.

3. The chip bonding apparatus as described in claim 2, characterized in that, The sub-piston further includes a piston portion, and the sub-piston is slidably disposed on the sub-cylinder body via the piston portion; The piston rod is fixed to the surface of the piston.

4. The chip bonding apparatus as described in claim 3, characterized in that, It also includes a first seal, which is disposed between the sub-cylinder body and the piston portion of the sub-piston, and is used to seal the sub-piston and the sub-cylinder body.

5. The chip bonding apparatus as described in claim 3, characterized in that, The sub-cylinder body has a through hole in its wall, and the piston rod of the sub-piston passes through the through hole and extends out of the sub-cylinder body.

6. The chip bonding apparatus as described in claim 5, characterized in that, It also includes a second seal, which is disposed on the through hole of the sub-cylinder body and is used to seal the piston rod portion of the sub-piston to the sub-cylinder body.

7. The chip bonding apparatus as described in claim 2, characterized in that, A first air port is provided on the body wall of the sub-cylinder, and the first air port is used to connect the sub-accommodating space to an air source. When the gas supply to the receiving cavity is canceled or reduced, and a certain amount of gas is supplied to the sub-receiving space through the first gas port, the gas in the sub-receiving space exerts pressure on the sub-piston, and the pressure exerted by the gas in the sub-receiving space on the sub-piston is greater than the pressure exerted by the gas in the receiving cavity on the sub-piston, the sub-piston can be driven to move closer to the cylinder body.

8. The chip bonding apparatus as described in claim 2, characterized in that, It also includes a first elastic element, which is disposed in the sub-cylinder body, and the two ends of the first elastic element are respectively used to cooperate with the sub-cylinder body and the sub-piston; When the sub-piston moves away from the cylinder body, the first elastic element is compressed. When the gas supply to the cavity is canceled or reduced, and the pressure exerted by the gas in the cavity on the sub-piston is less than the reset force of the first elastic element, the sub-piston moves closer to the cylinder body under the reset action of the first elastic element.

9. A chip bonding apparatus as described in claim 8, characterized in that, The first elastic element is a spring or an elastic rubber ring.

10. A chip bonding apparatus as described in claim 2, characterized in that, Multiple sub-cylinders are located on the same side wall of the cylinder body, and the multiple sub-cylinders are at the same horizontal height.

11. The chip bonding apparatus as described in claim 2, characterized in that, It also includes a limiting member disposed on the inner wall of the sub-cylinder body. The limiting member is used to cooperate with the piston portion of the sub-piston to limit the sliding distance of the sub-piston on the side of the sub-cylinder body near the cylinder body.

12. The chip bonding apparatus as described in claim 1, characterized in that, The cylinder body has a second air port on its wall, which is used to connect the receiving cavity to the air source.

13. The chip bonding apparatus as described in claim 1, characterized in that, The pressing end is provided with a buffer pad, which is used to contact the upper surface of the chip structure.

14. The chip bonding apparatus as described in claim 13, characterized in that, The buffer pad is bonded and fixed to the end of the pressing end.

15. A chip bonding apparatus as described in claim 13, characterized in that, The buffer pad is a silicone rubber buffer pad or a high-temperature resistant rubber buffer pad.

16. The chip bonding apparatus as described in claim 1, characterized in that, It also includes a heating element disposed on the pressing post, the heating element being used to heat the chip structure.

17. The chip bonding apparatus as described in claim 1, characterized in that, The heating element is a heating wire, which is disposed inside the pressing column.

18. A chip bonding apparatus as described in claim 2, characterized in that, The surface areas of the multiple pressing columns exposed within the sub-accommodating space are equal.

19. A chip bonding apparatus as described in claim 1, characterized in that, The chip structure includes a substrate and a plurality of chips disposed on the surface of the substrate, wherein the plurality of chips are stacked. The pressing end engages with the chip on the top surface furthest from the substrate.

20. The chip bonding apparatus as described in claim 1, characterized in that, It also includes a deformable diaphragm, which is disposed inside the cylinder body, and the upper surface of the deformable diaphragm forms the receiving cavity with the cylinder body, and the lower surface of the deformable diaphragm forms the mounting cavity with the cylinder body; The pressing actuator is disposed in the mounting cavity, and the pressing actuator cooperates with the side of the deformable diaphragm away from the receiving cavity; When a certain amount of gas is introduced into the receiving cavity, the deformable diaphragm deforms towards the side closer to the pressing actuator and drives the pressing actuator to move away from the cylinder body.

21. The chip bonding apparatus as described in claim 20, characterized in that, The pressing actuator includes a pressing plate and a pressing rod disposed on the pressing plate. The pressing rod is disposed perpendicular to the pressing plate and is the pressing column. The pressing plate is disposed inside the mounting cavity, and the pressing rod extends out of the mounting cavity.

22. The chip bonding apparatus as described in claim 21, characterized in that, The pressing plate of the pressing actuator cooperates with the deformable diaphragm.

23. The chip bonding apparatus as described in claim 21, characterized in that, The deformable diaphragm serves as a pressing plate for the pressing actuator, and the pressure rod is fixedly and perpendicularly to the deformable diaphragm.

24. The chip bonding apparatus as described in claim 21, characterized in that, It also includes a second elastic element, which is disposed in the mounting cavity, and the two ends of the second elastic element are respectively used to cooperate with the pressing plate and the bottom wall of the mounting cavity; When the pressing actuator moves away from the cylinder body, the second elastic element is in a compressed state; When the gas flow into the cavity is stopped or reduced, the pressure rod moves toward the side closer to the cylinder body under the reset action of the second elastic element.

25. A chip bonding apparatus as described in claim 24, characterized in that, The second elastic element is a spring or an elastic rubber ring.

26. The chip bonding apparatus as described in claim 20, characterized in that, The deformable diaphragm is sealed to the cylinder body.

27. The chip bonding apparatus as described in claim 20, characterized in that, The outer peripheral sidewall of the deformable diaphragm is bonded and fixed to the inner peripheral sidewall of the cylinder body.

28. The chip bonding apparatus as described in claim 1, characterized in that, It also includes a control system and a position sensor connected to the control system, the position sensor being used to detect the position height of the pressing column; The control system controls the air intake or exhaust volume of the receiving cavity based on the position and height of the pressing column.

29. A chip bonding apparatus as described in claim 7, characterized in that, It also includes a control system and a position sensor connected to the control system, the position sensor being used to detect the position height of the pressing column; The control system controls the air intake or exhaust volume of the receiving cavity and / or sub-receiving cavity according to the position and height of the pressing column, so that different pressing columns generate different pressures.

30. A chip bonding apparatus as described in claim 28 or 29, characterized in that, The position sensor is a magnetic position sensor located in the pressing column.

31. A chip hot-press bonding machine, characterized in that, Includes a chip bonding apparatus as described in any one of claims 1 to 30.

32. A chip hot-press bonding machine as described in claim 31, characterized in that, It also includes the frame and heating device; The rack has a mounting platform for mounting other components, and the mounting platform has a positioning mechanism for fixing a substrate or chip structure. The heating device is mounted on the mounting platform and is used to heat the substrate or chip structure.

33. A method for hot-press bonding chips using a chip hot-press bonding machine, characterized in that, The chip hot-press bonding machine is the chip hot-press bonding machine as described in claim 31 or 32; The method includes: Provide a substrate or a chip structure to be bonded, and mount the substrate or chip structure to be bonded on the positioning mechanism; A heating device is used to heat the substrate or chip structure to the bonding temperature. Thermo-bonding is achieved by applying pressure to the chip structure using a chip bonding device.

34. A method for hot-press bonding chips using a chip hot-press bonding machine as described in claim 33, characterized in that, The sub-cylinder of the chip pressing device is a sub-cylinder with a first air port; The pressing column of the chip pressing device is equipped with a position sensor. The position sensor signal is connected to the control system, which controls the inlet and outlet of gas in the receiving cavity and the inlet and outlet of gas in the sub-cylinder respectively. The steps of applying pressure to a chip structure using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure to be bonded; Gas is introduced into the receiving cavity by the control system, so that the gas in the receiving cavity exerts pressure on the pressing actuator and drives the multiple pressing columns to move closer to the chip structure. The control system determines whether all the pressing columns have reached the predetermined position height based on the position signal fed back by the position sensor. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post has not reached the predetermined height, the control system either controls the discharge of gas from the sub-cylinder corresponding to the pressing post that has not reached the predetermined height or controls the continued filling of gas into the receiving cavity, so that the pressing post that has not reached the predetermined height continues to move closer to the chip structure to reach the predetermined height.

35. A method for hot-press bonding chips using a chip hot-press bonding machine as described in claim 33, characterized in that, The sub-cylinder of the chip pressing device is a sub-cylinder with a first elastic element inside; The pressing post of the chip pressing device is a pressing post equipped with a position sensor. The position sensor signal is connected to a control system, which also controls the inlet and outlet of gas in the containment cavity. The steps of applying pressure to a chip structure using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure to be bonded; Gas is introduced into the receiving cavity by the control system, so that the gas in the receiving cavity exerts pressure on the pressing actuator and drives the multiple pressing columns to move closer to the chip structure. The control system determines whether all the pressing columns have reached the predetermined position height based on the position signal fed back by the position sensor. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post has not reached the predetermined height, the control system continues to fill the cavity with gas, causing the pressing post that has not reached the predetermined height to continue moving closer to the chip structure until it reaches the predetermined height.

36. A method for hot-press bonding chips using a chip hot-press bonding machine as described in claim 33, characterized in that, The chip bonding device is a device with a deformable diaphragm. The pressing post of the chip pressing device is equipped with a position sensor. The position sensor signal is connected to the control system, which also controls the inlet and outlet of gas in the containment cavity. The steps of applying pressure to a chip structure using a chip bonding device to achieve thermo-bonding include: Position the chip bonding device above the chip structure to be bonded; Gas is introduced into the receiving cavity by the control system, so that the gas in the receiving cavity exerts pressure on the pressing actuator and drives the multiple pressing columns to move closer to the chip structure. The control system determines whether all the pressing columns have reached the predetermined position height based on the position signal fed back by the position sensor. The predetermined position height is the theoretically calculated height of the chip stack. When the control system detects that a pressing post has not reached the predetermined height, the control system continues to fill the cavity with gas, causing the pressing post that has not reached the predetermined height to continue moving closer to the chip structure until it reaches the predetermined height.

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