A semiconductor multi-chip automatic packaging molding equipment and a packaging process

Abstract

The application discloses a kind of semiconductor multi-chip automatic packaging forming equipment and packaging process, it is related to chip packaging field, including operation platform, the side of the operation platform is provided with conveying part, the end of the operation platform is fixedly installed with adjusting assembly simultaneously, angle and position adjustment are carried out to chip by the adjusting assembly;The semiconductor multi-chip automatic packaging forming equipment and packaging process, the position and angle of welding tray can be ensured by accurate adjustment, and the uniformity and quality of welding point;The angle and position adjustment of supporting plate can improve heat conduction path simultaneously, so that semiconductor chip can effectively radiate when working;During semiconductor chip packaging process, the adjustment of supporting plate helps to reduce the mechanical stress caused by thermal expansion or shrinkage.

Description

Technical Field

[0001] This invention relates to chip packaging technology, specifically to an automated semiconductor multi-chip packaging equipment and packaging process. Background Technology

[0002] In the semiconductor chip manufacturing process, the packaging process is crucial for chip protection and stability, directly impacting chip performance and lifespan. Traditional semiconductor chip packaging often employs manual or semi-automated methods, which are inefficient and struggle to guarantee packaging quality, failing to meet the modern semiconductor industry's demands for high efficiency and high quality.

[0003] When using existing equipment, if the solder joints are not properly connected during the packaging process, it may lead to poor electrical contact, causing deviations in the subsequent use of semiconductors. Furthermore, the tray cannot adjust the angle and position of the chip or packaging substrate according to the requirements during the packaging process, resulting in incomplete solder joint connection of the pins, which in turn affects the overall quality of the semiconductor. At the same time, the thermal expansion and contraction during the pin soldering process may cause mechanical stress on the chip and packaging substrate, thus affecting the overall quality of the chip. Therefore, an automated semiconductor multi-chip packaging molding equipment and packaging process have been developed. Summary of the Invention

[0004] The purpose of this invention is to provide an automated semiconductor multi-chip packaging equipment and packaging process to address the aforementioned shortcomings in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automated semiconductor multi-chip packaging and molding equipment, including an operating table, a conveyor provided on one side of the operating table, and an adjustment component fixedly installed at the end of the operating table, through which the angle and position of the chip are adjusted;

[0006] A protective component is mounted on the end of the adjustment component. The protective component locks the chip and works in conjunction with the adjustment component to adjust the chip.

[0007] The adjustment assembly includes a base plate fixedly connected to the operating table, a rotating shaft rotatably mounted at the end of the base plate, a collar slidably mounted on the outer surface of the rotating shaft, and a telescopic component fixedly mounted at the end of the base plate and on one side of the rotating shaft, with the output end of the telescopic component fixedly connected to the end of the collar.

[0008] An arc-shaped plate is fixedly installed at the end of the rotating shaft. An arc-shaped groove is provided on one side of the arc-shaped plate. An adjusting block is slidably installed on the inner wall of the arc-shaped groove. A swing rod is rotatably installed on the outer surface of the adjusting block. The end of the swing rod away from the adjusting block is rotatably connected to the outer surface of the collar.

[0009] A movable block is fixedly installed at the end of the adjusting block, a limit block is engaged at the end of the movable block, and a support plate is fixedly installed at the end of the limit block to support the protective component.

[0010] As a further optimization of the present invention, a plurality of support columns are fixedly installed at the end of the base plate and near the edge, and the plurality of support columns are evenly distributed at the end of the base plate, and a support plate is fixedly installed at the end of the support column.

[0011] As a further optimization of the present invention, a ring is fixedly installed on the inner wall of the support plate, the inner wall of the ring is arc-shaped, and the inner wall of the ring is slidably connected to the end of the limiting block.

[0012] As a further optimization of the present invention, the protective component includes a docking plate that engages with the end of the tray, a power component is fixedly installed at the end of the docking plate, a power block is fixedly installed at the end of the power component, and the end of the power block is slidably connected to the inner wall of the docking plate.

[0013] As a further optimization of the present invention, a fixing plate is fixedly installed at the end of the docking plate, a cylinder is fixedly installed at the end of the fixing plate, and a sealing rod is slidably installed on the inner wall of the cylinder.

[0014] As a further optimization of the present invention, the ends of both the power block and the sealing rod are inclined, and the end of the sealing rod is slidably connected to the end of the power block.

[0015] As a further optimization of the present invention, a telescopic rod is fixedly installed at the end of the fixed plate and at the end away from the cylinder, and a positioning plate is fixedly installed at the end of the telescopic rod.

[0016] As a further optimization of the present invention, the end of the positioning plate is provided with a through hole, the inner wall of the through hole is slidably connected to the outer surface of the sealing rod, and a connecting plate is fixedly installed at the end of the positioning plate and above the through hole;

[0017] The positioning plate has exhaust holes through both sides, and a fixing ring is fixedly installed on the inner wall of the exhaust hole. A sphere is attached to the inner wall of the fixing ring.

[0018] As a further optimization of the present invention, a limiting plate is fixedly installed on the inner wall of the exhaust hole and on one side of the sphere, and an elastic element is fixedly installed at the end of the limiting plate, and the end of the elastic element is fixedly connected to the outer surface of the sphere.

[0019] A semiconductor multi-chip automated packaging process, employing the packaging equipment described above, includes the following steps:

[0020] S1. When the collar moves, it synchronously drives the swing rod that is rotatably mounted on its outer surface to move. Since the end of the swing rod is rotatably connected to the outer surface of the adjusting block, the swing rod moves, thereby driving the adjusting block to move on the inner wall of the arc groove, thereby adjusting the movable block fixedly mounted on the end of the adjusting block to make angle adjustments.

[0021] S2. When the shaft rotates, it synchronously drives the arc plate set at its output end to rotate. Since the outer surface of the end of the adjusting block is slidably connected to the inner wall of the arc groove, the adjusting block is synchronously driven to rotate when the arc groove moves with the arc plate.

[0022] S3. When the positioning plate 361 moves downward, it squeezes the gas inside the through hole, thereby simultaneously pushing the ball to squeeze the elastic element, creating a gap between the ball and the fixing ring, which facilitates the gas inside the through hole to be discharged. When the positioning plate stops moving, the ball is restored to its initial position by the force of the elastic element. When the positioning plate moves upward, it compresses the internal gas, thereby adsorbing and locking the chip.

[0023] Compared with the prior art, the semiconductor multi-chip automatic packaging equipment and packaging process provided by the present invention have the following beneficial effects: by precisely adjusting the position and angle of the welding tray, the uniformity and quality of the welding points can be ensured; at the same time, the adjustment of the angle and position of the tray can improve the heat conduction path, so that the semiconductor chip can effectively dissipate heat during operation; during the semiconductor chip packaging process, the adjustment of the tray helps to reduce the mechanical stress caused by thermal expansion or contraction.

[0024] Precise locking can prevent semiconductors from shifting or being subjected to unnecessary impacts during the packaging process, thereby reducing the risk of semiconductor chip damage and extending product life. At the same time, it can adapt to semiconductor chips of different sizes and shapes, improving the versatility and adaptability of packaging equipment and facilitating the packaging of different types of semiconductor chips. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0026] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0027] Figure 2This is a schematic diagram of the adjustment component and protection component provided in an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the adjustment component structure provided in an embodiment of the present invention;

[0029] Figure 4 This is a first cross-sectional view of the internal structure of the adjustment component provided in an embodiment of the present invention;

[0030] Figure 5 This is a second cross-sectional view of the internal structure of the adjustment component provided in an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the protective component structure provided in an embodiment of the present invention;

[0032] Figure 7 This is a first cross-sectional view of the internal structure of the protective component provided in an embodiment of the present invention;

[0033] Figure 8 This is a second cross-sectional view of the internal structure of the protective component provided in an embodiment of the present invention;

[0034] Figure 9 This is a third cross-sectional view of the internal structure of the protective component provided in an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Operating platform; 2. Adjustment assembly; 3. Protective assembly; 11. Welded parts; 12. Conveying parts; 21. Base plate; 211. Support column; 212. Support plate; 22. Rotating shaft; 221. Collar; 23. Telescopic part; 24. Arc plate; 241. Arc groove; 25. Adjusting block; 251. Swing rod; 26. Movable block; 27. Ring; 28. Limiting block; 29. ​​Support plate; 31. Connecting plate; 32. Power component; 321. Power block; 33. Fixing plate; 34. Cylinder; 35. Sealing rod; 36. Telescopic rod; 361. Positioning plate; 362. Through hole; 37. Vent hole; 371. Fixing ring; 372. Ball; 373. Limiting plate; 374. Elastic component; 38. Connecting plate. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0038] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Example 1

[0039] Please see Figures 1-9 An automated semiconductor multi-chip packaging and molding equipment includes an operating table 1, a conveyor 12 on one side of the operating table 1, and an adjustment component 2 fixedly installed at the end of the operating table 1, through which the angle and position of the chip are adjusted.

[0040] In this solution, the conveyor 12 is a conveyor belt or other equipment with conveying function. The chip is transferred to the designated position through the conveyor 12. At the same time, a welding component 11 is fixedly installed on one side of the operating table 1. The welding component 11 is a welding gun or other component with welding function. The chip and pin are welded through the welding component 11.

[0041] Furthermore, the adjustment assembly 2 includes a base plate 21 fixedly connected to the operating table 1, a rotating shaft 22 rotatably mounted at the end of the base plate 21, a collar 221 slidably mounted on the outer surface of the rotating shaft 22, and a telescopic member 23 fixedly mounted at the end of the base plate 21 and on one side of the rotating shaft 22, with the output end of the telescopic member 23 fixedly connected to the end of the collar 221.

[0042] In this embodiment, the inner wall of the base plate 21 is provided with a device with power output such as a motor, and the output end of the motor is fixedly connected to the end of the rotating shaft 22, so that the rotating shaft 22 is driven to rotate by the motor.

[0043] The telescopic component 23 is a device with telescopic function such as an electric telescopic rod, and is connected to an external control device. When the telescopic component 23 is started, it drives the collar 221 fixedly installed at its output end to move on the outer surface of the rotating shaft 22.

[0044] An annular groove is provided at the end of the base plate 21, and the inner wall of the annular groove is slidably connected to the outer surface of the lower end of the telescopic member 23, so that when the collar 221 rotates, the telescopic member 23 moves synchronously with the collar 221, thereby ensuring the stability of the rotation of the adjusting block 25.

[0045] Furthermore, an arc-shaped plate 24 is fixedly installed at the end of the rotating shaft 22. An arc-shaped groove 241 is provided on one side of the arc-shaped plate 24. An adjusting block 25 is slidably installed on the inner wall of the arc-shaped groove 241. A swing rod 251 is rotatably installed on the outer surface of the adjusting block 25. The end of the swing rod 251 away from the adjusting block 25 is rotatably connected to the outer surface of the collar 221.

[0046] Specifically, when the rotating shaft 22 rotates, it synchronously drives the arc plate 24 set at its output end to rotate. Since the outer surface of the end of the adjusting block 25 is slidably connected to the inner wall of the arc groove 241, the adjusting block 25 is synchronously driven to rotate when the arc groove 241 moves with the arc plate 24.

[0047] Simultaneously, as the collar 221 moves, it drives the swing rod 251, which is rotatably mounted on its outer surface, to move as well. Since the end of the swing rod 251 is rotatably connected to the outer surface of the adjusting block 25, the swing rod 251 moves, causing the adjusting block 25 to move on the inner wall of the arc groove 241, thereby adjusting the angle of the movable block 26, which is fixedly mounted on the end of the adjusting block 25.

[0048] Furthermore, a movable block 26 is fixedly installed at the end of the adjusting block 25, and a limiting block 28 is engaged at the end of the movable block 26. A support plate 29 is fixedly installed at the end of the limiting block 28, and the protective component 3 is supported by the support plate 29.

[0049] Specifically, when the movable block 26 rotates, it synchronously drives the limiting block 28, which is attached to its end, to move. Since the end of the limiting block 28 is fixedly connected to the tray 29, the angle of the chip can be adjusted by the tray 29 to make it suitable for different scenarios.

[0050] By precisely adjusting the position and angle of the welding tray, the uniformity and quality of the welding points can be ensured; at the same time, adjusting the angle and position of the tray 29 can improve the heat conduction path, enabling the semiconductor chip to dissipate heat effectively during operation; during the semiconductor chip packaging process, adjusting the tray 29 helps to reduce mechanical stress caused by thermal expansion or contraction.

[0051] Furthermore, multiple sets of support columns 211 are fixedly installed at the end of the base plate 21 and near its edge, and these multiple sets of support columns 211 are evenly distributed at the end of the base plate 21. A support plate 212 is fixedly installed at the end of each support column 211. A ring 27 is fixedly installed on the inner wall of the support plate 212. The inner wall of the ring 27 is arc-shaped, and the inner wall of the ring 27 is slidably connected to the end of the limiting block 28.

[0052] Specifically, a sliding block is provided on the outer surface of the limiting block 28, and the outer surface of the sliding block is slidably connected to the inside of the ring 27, so that when the limiting block 28 moves, it rotates along the inner wall of the ring 27, ensuring that the whole remains stable when the limiting block 28 is subjected to force and rotates.

[0053] Furthermore, the protective component 3 is assembled at the end of the adjusting component 2. The protective component 3 locks the chip and adjusts the chip in conjunction with the adjusting component 2. The protective component 3 includes a docking plate 31 that is snapped into the end of the support plate 29. A power component 32 is fixedly installed at the end of the docking plate 31. A power block 321 is fixedly installed at the end of the power component 32. The end of the power block 321 is slidably connected to the inner wall of the docking plate 31.

[0054] In this embodiment, the power component 32 is a device with telescopic function such as an electric telescopic rod, and is connected to an external control device. When the power component 32 is started, it synchronously drives the power block 321 set at its output end to move.

[0055] The docking plate 31 has a guide groove inside, and the inner wall of the guide groove is slidably connected to the outer surface of the lower end of the power block 321, so that the whole remains stable when the power block 321 moves.

[0056] Furthermore, a fixing plate 33 is fixedly installed at the end of the mating plate 31, and a cylinder 34 is fixedly installed at the end of the fixing plate 33. A sealing rod 35 is slidably installed on the inner wall of the cylinder 34. The ends of the power block 321 and the sealing rod 35 are both inclined, and the end of the sealing rod 35 is slidably connected to the end of the power block 321.

[0057] Specifically, when the power block 321 moves, it synchronously drives the sealing rod 35 to move along the inner wall of the cylinder 34, thereby squeezing the gas inside the through hole 362, which facilitates the removal of the processed chip.

[0058] Meanwhile, a circular plate is provided at the end of the sealing rod 35, and the outer surface of the circular plate is provided with rubber or other sealing components to ensure that the circular plate fits against the inner wall of the through hole 362.

[0059] Furthermore, a telescopic rod 36 is fixedly installed at the end of the fixed plate 33 and at the end away from the cylinder 34, and a positioning plate 361 is fixedly installed at the end of the telescopic rod 36.

[0060] Specifically, the telescopic rod 36 is an electric telescopic rod or other device with telescopic function, and is connected to an external control device. When the telescopic rod 36 is started, it drives the positioning plate 361 fixedly installed at its output end to move until it reaches the optimal position and then stops.

[0061] Furthermore, a through hole 362 is provided at the end of the positioning plate 361, and the inner wall of the through hole 362 is slidably connected to the outer surface of the sealing rod 35. A connecting plate 38 is fixedly installed at the end of the positioning plate 361 and above the through hole 362. Vent holes 37 are provided through both sides of the positioning plate 361, and a fixing ring 371 is fixedly installed on the inner wall of the vent hole 37. A ball 372 is attached to the inner wall of the fixing ring 371.

[0062] Specifically, the chip is supported by the connecting plate 38 to ensure that the chip remains stable during processing. At the same time, the through hole 362 is connected to the exhaust hole 37, and the ball 372, which is slidably installed on the inner wall of the exhaust hole 37, seals it. When the positioning plate 361 moves upward, it compresses the internal gas, thereby adsorbing and locking the chip.

[0063] When the sealing rod 35 moves, it reduces the internal space of the through hole 362, thereby reducing the internal air pressure and making it easier to remove the processed chip.

[0064] Furthermore, a limiting plate 373 is fixedly installed on the inner wall of the vent 37 and on one side of the sphere 372. An elastic element 374 is fixedly installed at the end of the limiting plate 373, and the end of the elastic element 374 is fixedly connected to the outer surface of the sphere 372.

[0065] Specifically, the elastic element 374 is a spring or other elastic component. The elastic element 374 tightly presses the ball 372 against the inner wall of the fixing ring 371, thereby isolating the through hole 362 from the outside. When the positioning plate 361 moves downward, it squeezes the gas inside the through hole 362, thereby simultaneously pushing the ball 372 to squeeze the elastic element 374, creating a gap between the ball 372 and the fixing ring 371, which facilitates the discharge of gas inside the through hole 362. When the positioning plate 361 stops moving, the force of the elastic element 374 restores the ball 372 to its initial position.

[0066] Precise locking can prevent semiconductors from shifting or being subjected to unnecessary impacts during the packaging process, thereby reducing the risk of semiconductor chip damage and extending product life. At the same time, it can adapt to semiconductor chips of different sizes and shapes, improving the versatility and adaptability of packaging equipment and facilitating the packaging of different types of semiconductor chips.

[0067] The control device can choose a microcontroller as the control terminal. In this embodiment, the microcontroller is a typical embedded microcontroller unit, consisting of an arithmetic logic unit (ALU), a controller, memory, input / output devices, etc., essentially a miniature computer. Compared to general-purpose microprocessors used in personal computers, it emphasizes self-sufficiency (no external hardware required) and cost savings. Its biggest advantage is its small size, allowing it to be placed inside the instrument, but it has limited storage capacity, simple input / output interfaces, and low power consumption. Example 2

[0068] An automated semiconductor multi-chip packaging process, employing the packaging equipment described above, includes the following steps:

[0069] S1. When the collar 221 moves, it synchronously drives the swing rod 251, which is rotatably mounted on its outer surface, to move. Since the end of the swing rod 251 is rotatably connected to the outer surface of the adjusting block 25, the swing rod 251 moves, causing the adjusting block 25 to move on the inner wall of the arc groove 241, thereby adjusting the angle of the movable block 26 fixedly mounted on the end of the adjusting block 25.

[0070] S2. When the rotating shaft 22 rotates, it synchronously drives the arc plate 24 set at its output end to rotate. Since the outer surface of the end of the adjusting block 25 is slidably connected to the inner wall of the arc groove 241, the adjusting block 25 is synchronously driven to rotate when the arc groove 241 moves with the arc plate 24.

[0071] S3. When the positioning plate 361 moves downward, it compresses the gas inside the through hole 362, thereby simultaneously pushing the ball 372 to compress the elastic element 374, creating a gap between the ball 372 and the fixing ring 371, which facilitates the discharge of the gas inside the through hole 362. When the positioning plate 361 stops moving, the ball 372 is restored to its initial position by the force of the elastic element 374. When the positioning plate 361 moves upward, it compresses the internal gas, thereby adsorbing and locking the chip.

[0072] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor multi-chip automatic packaging molding apparatus, characterized by comprising: Including the operation platform (1), one side of the operation platform (1) is provided with conveying part (12), and the end of the operation platform (1) is fixedly installed with adjusting assembly (2), the angle and position of chip are adjusted through the adjusting assembly (2); The protection assembly (3) is assembled to the end of the adjusting assembly (2), the chip is locked through the protection assembly (3), and the chip is adjusted in cooperation with the adjusting assembly (2); Wherein, the adjusting assembly (2) includes the bottom plate (21) fixedly connected with the operation platform (1), the end of the bottom plate (21) is rotatably installed with the pivot (22), the outer surface of the pivot (22) is slidably installed with the collar (221), the end of the bottom plate (21) and one side of the pivot (22) are fixedly installed with the telescopic part (23), and the output end of the telescopic part (23) is fixedly connected with the end of the collar (221); The end of the pivot (22) is fixedly installed with the arc plate (24), one side of the arc plate (24) is provided with the arc slot (241), the inner wall of the arc slot (241) is slidably installed with the adjusting block (25), the outer surface of the adjusting block (25) is rotatably installed with the swing rod (251), and one end of the swing rod (251) away from the adjusting block (25) is rotatably connected with the outer surface of the collar (221); The end of the adjusting block (25) is fixedly installed with the movable block (26), the end of the movable block (26) is clamped with the limiting block (28), the end of the limiting block (28) is fixedly installed with the supporting plate (29), and the protection assembly (3) is supported through the supporting plate (29).

2. A semiconductor multi-chip automatic packaging molding apparatus according to claim 1, wherein The end of the bottom plate (21) and the edge part are fixedly installed with a plurality of supporting columns (211), and a plurality of supporting columns (211) are uniformly distributed on the end of the bottom plate (21), and the end of the supporting column (211) is fixedly installed with the supporting plate (212).

3. A semiconductor multi-chip automatic packaging molding apparatus according to claim 2, wherein The inner wall of the supporting plate (212) is fixedly installed with the circular ring (27), the inner wall of the circular ring (27) is arc-shaped, and the inner wall of the circular ring (27) is slidably connected with the end of the limiting block (28).

4. The semiconductor multi-chip automatic packaging molding apparatus according to claim 1, wherein The protection assembly (3) includes the butt plate (31) clamped with the end of the supporting plate (29), the end of the butt plate (31) is fixedly installed with the power part (32), the end of the power part (32) is fixedly installed with the power block (321), and the end of the power block (321) is slidably connected with the inner wall of the butt plate (31).

5. The apparatus of claim 4 wherein, The end of the butt plate (31) is fixedly installed with the fixed plate (33), the end of the fixed plate (33) is fixedly installed with the cylinder (34), and the inner wall of the cylinder (34) is slidably installed with the sealing rod (35).

6. A semiconductor multi-chip automatic packaging molding apparatus according to claim 5, wherein The end of the power block (321) and the sealing rod (35) is inclined, and the end of the sealing rod (35) is slidably connected with the end of the power block (321).

7. A semiconductor multi-chip automatic packaging molding apparatus according to claim 6, wherein The end of the fixing plate (33) and away from the cylinder (34) is fixedly installed with a telescopic rod (36), and the end of the telescopic rod (36) is fixedly installed with a positioning plate (361).

8. A semiconductor multi-chip automatic packaging molding apparatus according to claim 7, wherein The end of the positioning plate (361) is provided with a through hole (362), the inner wall of the through hole (362) is in sliding connection with the outer surface of the sealing rod (35), and the end of the positioning plate (361) and above the through hole (362) is fixedly installed with a connecting plate (38). The two sides of the positioning plate (361) are provided with exhaust holes (37) in penetration, the inner wall of the exhaust hole (37) is fixedly installed with a fixing ring (371), and the inner wall of the fixing ring (371) is attached with a sphere (372).

9. The semiconductor multi-chip automatic packaging molding apparatus according to claim 8, wherein The inner wall of the exhaust hole (37) and on one side of the sphere (372) is fixedly installed with a limiting plate (373), the end of the limiting plate (373) is fixedly installed with an elastic element (374), and the end of the elastic element (374) is fixedly connected with the outer surface of the sphere (372).

10. A semiconductor multi-chip automatic packaging process, characterized by, The semiconductor multi-chip automatic packaging molding equipment of claim 9, wherein the packaging process comprises the following steps: S1. When the sleeve (221) moves, the swing rod (251) rotatably installed on the outer surface thereof is synchronously driven to move, because the end of the swing rod (251) is rotatably connected with the outer surface of the adjusting block (25), the adjusting block (25) is driven to move on the inner wall of the arc-shaped groove (241) when the swing rod (251) moves, so as to adjust the angle of the movable block (26) fixedly installed at the end of the adjusting block (25); S2. When the rotating shaft (22) rotates, the arc-shaped plate (24) arranged at the output end thereof is synchronously driven to rotate, because the outer surface of the end of the adjusting block (25) is in sliding connection with the inner wall of the arc-shaped groove (241), the adjusting block (25) is synchronously driven to rotate when the arc-shaped groove (241) moves following the arc-shaped plate (24); S3. When the positioning plate (361) moves downward, the gas inside the through hole (362) is extruded, so as to synchronously push the sphere (372) to extrude the elastic element (374), so that a gap is generated between the sphere (372) and the fixing ring (371), and the gas inside the through hole (362) is easily discharged, when the positioning plate (361) stops moving, the sphere (372) is restored to the initial position by the action force of the elastic element (374), and when the positioning plate (361) moves upward, the internal gas is compressed, and then the chip is adsorbed and locked.

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