Antenna module, frequency selective surface and communication equipment

Abstract

The embodiment of the invention provides an antenna module, a frequency selective surface and communication equipment. The filtering performance and the anti-interference capability of the antenna module are effectively improved. The antenna module comprises a first radiation unit, a second radiation unit and a frequency selective surface (FSS), wherein the FSS is located between the first radiation unit and the second radiation unit. The FSS comprises a first daughter board, a first conductive layer and an electric connecting piece, the first daughter board comprises a first surface and a second surface which are opposite in position, the first conductive layer is located on the first surface, a first end of the electric connecting piece is electrically connected with the first radiation unit, a second end of the electric connecting piece extends to the second surface, and the second surface comprises a conductive piece. The conductive part comprises a first pin, a conductive part body and a second pin which are connected in sequence, the second end of the electric connecting part is electrically connected with the first pin, the first sub-board is arranged between the conductive part body and the first conductive layer, and the second pin is electrically connected with the first conductive layer.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an antenna module, a frequency selective surface, and a communication device. Background Technology

[0002] A frequency selective surface (FSS) acts as a filter. If the electromagnetic wave is within the stopband frequency range of the FSS, the FSS acts as a reflector, reflecting the direction of the electromagnetic wave's propagation. If the electromagnetic wave is within the passband frequency range of the FSS, it can pass freely through the FSS. Incorporating an FSS into an antenna module allows for the utilization of its filtering effect, thereby improving the antenna module's performance.

[0003] Figure 1 This is a top-view example of an existing FSS structure. The FSS comprises multiple uniformly arranged units, each unit consisting of a conductive layer 100 and a dielectric layer from top to bottom. The conductive layer 100 mainly consists of a square ring 120 and a metal structure placed within the square ring 120. The metal structure includes a bend line 121 and a triangular structure 122. The different triangular structures 122 interact to form an equivalent capacitance, and the bend line 121 forms an equivalent inductance. The equivalent capacitance and equivalent inductance work together to form a resonator. The introduction of the resonator effectively improves the filtering performance of the FSS.

[0004] When it is necessary to power the radiating elements included in the antenna module, the electrical connector used to power the radiating elements passes through the FSS in a direction perpendicular to the FSS. This results in strong electromagnetic coupling between the electrical connector and the conductive layer 100, thereby degrading the filtering performance of the FSS and reducing the antenna module's anti-interference capability. Summary of the Invention

[0005] This application provides an antenna module, a frequency selective surface, and a communication device, which effectively improves the filtering performance and anti-interference capability of the antenna module.

[0006] In a first aspect, embodiments of this application provide an antenna module including a first radiating element, a second radiating element, and a frequency selective surface (FSS). The FSS is located between the first and second radiating elements along a direction perpendicular to the FSS. The FSS includes a first sub-board, a first conductive layer, and an electrical connector. The first conductive layer is located on the surface of the first sub-board. A first end of the electrical connector is electrically connected to the first radiating element, and a second end of the electrical connector extends to the surface of the first sub-board. The surface of the first sub-board includes conductive elements. The conductive elements and the first conductive layer may be located on the same surface of the first sub-board, or the conductive elements and the first conductive layer may be located on two different surfaces of the first sub-board. The conductive elements may be part of the electrical connector, or the conductive elements and the electrical connector may be two different components. The conductive element includes a first pin, a conductive element body, and a second pin connected sequentially. The second end of the electrical connector is electrically connected to the first pin. A gap exists between the conductive element body and the first conductive layer, and the second pin is electrically connected to the first conductive layer. The second end of the electrical connector is electrically connected to the first pin to form an equivalent inductance. A gap exists between the conductive body and the first conductive layer to form an equivalent capacitance. The series-connected equivalent inductance and equivalent capacitance form a resonator. The first radiating element operates in a first frequency band, and the second radiating element operates in a second frequency band. The first frequency band is located within the stopband frequency range of the FSS, and the second frequency band is located within the passband frequency range of the FSS. Therefore, the FSS reflects electromagnetic waves located in the first frequency band and transmits electromagnetic waves located in the second frequency band.

[0007] As shown in this aspect, the antenna module introduces a transmission null through a resonator, thereby improving the stopband suppression. This reduces the assembly difficulty of the antenna module and improves its assembly efficiency and reliability. Furthermore, the resonator formed by electrical connectors, conductive components, and the first conductive layer within the antenna module enhances the filtering performance of the FSS, thus improving the overall performance of the antenna module. This effectively suppresses electromagnetic coupling between the electrical connectors and the first conductive layer, ensuring stable performance over a wide angular range. For example, in scenarios where the antenna module receives different electromagnetic waves over a wide angular range, its performance parameters (e.g., gain and beamwidth) remain stable and consistent, improving the reliability of communication. The first and second frequency bands are distinct, meaning their intersection is empty. This ensures that the first radiating element operating in the first frequency band is reflected by the FSS, and that the second radiating element operating in the second frequency band freely passes through the FSS, suppressing interference between the electromagnetic waves transmitted and received by the first and second radiating elements, thus enhancing the antenna module's anti-interference capability.

[0008] Based on the first aspect, in an optional implementation, the FSS further includes a second sub-board located between the first sub-board and the first radiating unit, the surface of the second sub-board including a second conductive layer; a first slot is formed through the second conductive layer, a second slot is formed through the second sub-board, and the electrical connector passes through the first slot and the second slot to make the second end of the electrical connector electrically connected to the first pin.

[0009] Using this implementation, the FSS of the antenna module includes two sub-boards, namely the first sub-board and the second sub-board. The first sub-board includes a first conductive layer, and the second sub-board includes a second conductive layer, both of which are used to feed the radiating elements. This increases the number of radiating elements that the antenna module can feed, as well as the number of frequency bands supported by the antenna module, enabling the antenna module to realize a multi-band antenna.

[0010] Based on the first aspect, in an optional implementation, the antenna module further includes a third radiating element, the FSS is located between the third radiating element and the second radiating element, the second conductive layer is electrically connected to the third radiating element, there is a gap between the electrical connector and the second conductive layer, the third radiating element operates in a third frequency band, and electromagnetic waves located in the third frequency band are reflected by the FSS.

[0011] Using this implementation, the antenna module can simultaneously support a first radiating element, a second radiating element, and a third radiating element. The first conductive layer is used to feed the first radiating element, and the second conductive layer is used to feed the third radiating element, thereby increasing the number of radiating elements that the antenna module can feed and the number of frequency bands it supports, enabling the antenna module to realize a multi-band antenna. Moreover, because there is a gap between the electrical connector and the second conductive layer, electrical isolation between the electrical connector and the second conductive layer is achieved, improving the anti-interference capability of the antenna module.

[0012] Based on the first aspect, in one optional implementation, the first slot has a first orthographic projection on the second sub-board, the second slot has a second orthographic projection on the second sub-board, the second orthographic projection is located within the coverage area of ​​the first orthographic projection, and there is a gap between the first orthographic projection and the second orthographic projection.

[0013] By adopting this implementation method, since the second orthographic projection is located within the coverage area of ​​the first orthographic projection, and there is a gap between the first orthographic projection and the second orthographic projection, it is ensured that the electrical connector can successfully pass through the first slot and the second slot, and the electrical connector will not contact the second conductive layer, thus achieving electrical isolation between the electrical connector and the second conductive layer and improving the anti-interference capability of the antenna module.

[0014] Based on the first aspect, in one optional implementation, the first sub-board includes a first surface and a second surface positioned opposite each other, the first conductive layer is located on the first surface, the second end of the electrical connector extends to the second surface, the second surface includes the conductive element, and the first sub-board is spaced between the conductive element body and the first conductive layer.

[0015] In this implementation, the first conductive layer and the conductive component are located on different surfaces of the first sub-board, ensuring that the antenna module can successfully form a resonator.

[0016] Based on the first aspect, in one optional implementation, the electrical connector includes a first connecting plate and a second connecting plate connected to each other. The surface of the first connecting plate includes a power feeding element, and the surface of the second connecting plate includes the conductive element. A first end of the power feeding element is electrically connected to the first radiating unit, and a second end of the power feeding element is electrically connected to the first pin. The second connecting plate extends along the second surface, and the conductive element body is included between the second connecting plate and the second surface.

[0017] In this implementation, the electrical connector includes a power supply component and a conductive component. The electrical connector and the first pin are connected in series to form the equivalent inductance of the resonator. The conductive component body and the first conductive layer form the equivalent capacitance of the resonator. The antenna module introduces a transmission zero through the resonator, thereby improving the stopband rejection. This reduces the assembly difficulty of the antenna module, improves the assembly efficiency, enhances the reliability of the antenna module during use, and improves the anti-interference capability of the antenna module, ensuring that the antenna module can achieve stable performance over a large angle range.

[0018] Based on the first aspect, in one optional implementation, a first through-slot is formed through the first conductive layer, a second through-slot is formed through the first sub-board, one end of the second connecting plate and the second pin pass through the first through-slot and the second through-slot, and the second pin extending out from the first through-slot and the second through-slot is electrically connected to the first conductive layer.

[0019] In this implementation, the second pin is electrically connected to the first conductive layer, thereby achieving the electrical connection between the first radiating unit and the radio frequency module. In this way, the radio frequency module can send radio frequency signals to the first radiating unit, and the first radiating unit can convert the radio frequency signal into an electromagnetic wave and radiate it out. Alternatively, the first radiating unit can convert the received electromagnetic wave into a radio frequency signal and send it to the radio frequency module.

[0020] Based on the first aspect, a third through groove is formed through the first conductive layer, and a fourth through groove is formed through the first sub-board. One end of the first connecting plate and the second end of the power supply component pass through the third through groove and the fourth through groove. The second end of the power supply component that passes through the third through groove and the fourth through groove has a gap with the first conductive layer.

[0021] In this implementation, the first connecting plate can pass through the third and fourth through slots to achieve mechanical fixation between the electrical connector and the first sub-board. Moreover, the second end of the power supply component that extends out from the third and fourth through slots has a gap with the first conductive layer, ensuring that the electrical connector and the first conductive layer can successfully form a resonator.

[0022] Based on the first aspect, in one optional implementation, the third through slot has a third orthographic projection on the first sub-board, the fourth through slot has a fourth orthographic projection on the first sub-board, the fourth orthographic projection is located within the coverage area of ​​the third orthographic projection, and there is a gap between the third orthographic projection and the fourth orthographic projection.

[0023] In this implementation, there is a gap between the third orthographic projection and the fourth orthographic projection, which ensures electrical isolation between the first power supply component and the first conductive layer, and ensures that the electrical connector and the first conductive layer can successfully form a resonator.

[0024] Based on the first aspect, in one optional implementation, the first sub-board includes a first surface and a second surface positioned opposite each other, the first conductive layer is located on the first surface, the second end of the electrical connector extends to the second surface, the electrical connector includes a connecting plate, the surface of the connecting plate includes a power feeding element, one end of the connecting plate is plugged into and connected to the first sub-board, the conductive element is formed on the second surface, the first end of the power feeding element is electrically connected to the first radiating unit, and the second end of the power feeding element is electrically connected to the first pin.

[0025] In this implementation, the first sub-board uses copper-clad laminate technology or etching technology to form a conductive element on the second surface. An equivalent capacitance is formed between the conductive element body and the first conductive layer. The power supply element of the electrical connector is electrically connected to the conductive element to form an equivalent inductance. The series equivalent inductance and equivalent capacitance form a resonator, which improves the anti-interference capability of the antenna module, introduces a transmission null point, and improves the assembly efficiency and reliability of the antenna module.

[0026] Based on the first aspect, in one optional implementation, a metallized via is provided through the first sub-board, and the second pin is electrically connected to the first conductive layer through the metallized via.

[0027] In this implementation, the second pin is electrically connected to the first conductive layer through a metallized via, thereby achieving electrical connection between the first radiating unit and the radio frequency module. In this way, the radio frequency module can send radio frequency signals to the first radiating unit, and the first radiating unit can convert the radio frequency signal into an electromagnetic wave and radiate it out. Alternatively, the first radiating unit can convert the received electromagnetic wave into a radio frequency signal and send it to the radio frequency module.

[0028] Based on the first aspect, in one optional implementation, a third through-slot is formed through the first conductive layer, and a fourth through-slot is formed through the first sub-board. One end of the connecting plate and the second end of the power supply component pass through the third through-slot and the fourth through-slot. The second end of the power supply component that extends out from the third through-slot and the fourth through-slot has a gap with the first conductive layer.

[0029] With this implementation, the connecting plate can pass through the third and fourth through slots to achieve mechanical fixation between the electrical connector and the first sub-board. Moreover, the second end of the power supply component that extends out from the third and fourth through slots has a gap with the first conductive layer, ensuring that the electrical connector and the first conductive layer can successfully form a resonator.

[0030] Based on the first aspect, in one optional implementation, the first conductive layer and the conductive element are both located on the first surface of the first sub-board, the second end of the electrical connector extends to the first surface, the second end of the electrical connector is electrically connected to the first pin on the first surface, and there is a gap between the conductive element body and the first conductive layer.

[0031] In this implementation, the first conductive layer and the conductive component are located on the same surface (i.e., the first surface) of the first sub-board, ensuring that the antenna module can successfully form a resonator.

[0032] Based on the first aspect, in one optional implementation, the electrical connector includes a connecting plate, the surface of the connecting plate includes a power feeding element, a first end of the power feeding element is electrically connected to the first radiating unit, a second end of the power feeding element is electrically connected to the first pin, the first surface includes a first gap, a second gap and a third gap, the first gap is located between the first conductive layer and the second end of the power feeding element, the second gap is located between the first pin and the first conductive layer, and the third gap is located between the conductive element body and the first conductive layer.

[0033] This implementation ensures electrical isolation between the power supply component and the first conductive layer based on the first gap, and electrical isolation between the first pin and the first conductive layer based on the second gap. An equivalent inductance is formed between the electrically connected power supply component and the first pin. A third gap ensures an equivalent capacitance is formed between the conductive component body and the first conductive layer, thus guaranteeing the successful formation of a resonator using this implementation.

[0034] Based on the first aspect, in one optional implementation, a fifth through slot is formed through the first conductive layer, and a sixth through slot is formed through the first sub-board. One end of the connecting plate and the second end of the power supply component are inserted into the fifth through slot and the sixth through slot, so that the second end of the power supply component and the first conductive layer have the first gap, and the second end of the power supply component is electrically connected to the first pin.

[0035] By adopting this implementation method, electrical isolation between the power supply component and the first conductive layer is ensured, and the second end of the power supply component is electrically connected to the first pin, thereby ensuring the successful formation of the equivalent inductance of the resonator.

[0036] Based on the first aspect, in one optional implementation, the fifth through slot has a fifth orthographic projection on the first sub-board, the sixth through slot has a sixth orthographic projection on the first sub-board, the sixth orthographic projection is located within the coverage area of ​​the fifth orthographic projection, and there is a gap between the fifth orthographic projection and the sixth orthographic projection.

[0037] By adopting this implementation method, electrical isolation between the power supply component and the first conductive layer is ensured, thereby ensuring the successful formation of the equivalent inductance of the resonator.

[0038] Based on the first aspect, in one optional implementation, the antenna module further includes a reflector, wherein the first radiating element, the FSS, the second radiating element and the reflector are arranged in sequence, the second radiating element operates in a second frequency band, and the reflector is used to reflect electromagnetic waves located in the second frequency band.

[0039] Using this implementation, the reflector can reflect the electromagnetic waves emitted by the second radiating unit to the FSS and allow them to pass freely through the FSS, so that the electromagnetic waves radiated by the second radiating unit can be successfully directed to the coverage area where the terminal device is located.

[0040] Based on the first aspect, in one optional implementation, the electrically connected components and the first pin form an equivalent inductance, the conductive body and the first conductive layer spaced apart from the first sub-board form an equivalent inductance, and the equivalent inductance and the equivalent capacitance connected in series form a resonator.

[0041] As shown in this aspect, the antenna module introduces a transmission null through a resonator, thereby improving the stopband rejection. This reduces the assembly difficulty of the antenna module, improving its assembly efficiency and reliability. Furthermore, it ensures that the antenna module can achieve stable performance over a wide angular range.

[0042] Secondly, embodiments of this application provide a frequency selective surface, including a first sub-board, a first conductive layer, and an electrical connector. A first end of the electrical connector is electrically connected to a radiating unit, and a second end of the electrical connector extends to the first sub-board. The first conductive layer is located on the surface of the first sub-board. The surface of the first sub-board also includes a conductive element, which includes a first pin, a conductive element body, and a second pin connected sequentially. The second end of the electrical connector is electrically connected to the first pin. A gap exists between the conductive element body and the first conductive layer. The second pin is electrically connected to the first conductive layer. For an explanation of the beneficial effects of this aspect, please refer to the first aspect; specific details will not be repeated here.

[0043] Based on the second aspect, in an optional implementation, the FSS further includes a second sub-board located between the first sub-board and the first radiating unit. The surface of the second sub-board includes a second conductive layer. A first slot is formed through the second conductive layer, and a second slot is formed through the second sub-board. The electrical connector passes through the first slot and the second slot so that the second end of the electrical connector is electrically connected to the first pin.

[0044] Based on the second aspect, in one optional implementation, the first slot has a first orthographic projection on the second sub-board, the second slot has a second orthographic projection on the second sub-board, the second orthographic projection is located within the coverage area of ​​the first orthographic projection, and there is a gap between the first orthographic projection and the second orthographic projection.

[0045] Based on the second aspect, in one optional implementation, the first sub-board includes a first surface and a second surface positioned opposite each other, the first conductive layer is located on the first surface, the second end of the electrical connector extends to the second surface, the second surface includes the conductive element, and the first sub-board is spaced between the conductive element body and the first conductive layer.

[0046] Based on the second aspect, in an optional implementation, the electrical connector includes a first connecting plate and a second connecting plate connected to each other. The surface of the first connecting plate includes a power feeding element, and the surface of the second connecting plate includes a conductive element. A first end of the power feeding element is electrically connected to the first radiating unit, and a second end of the power feeding element is electrically connected to the first pin. The second connecting plate extends along the second surface, and the conductive element body is included between the second connecting plate and the second surface.

[0047] Based on the second aspect, in one optional implementation, a first through-slot is formed through the first conductive layer, a second through-slot is formed through the first sub-board, one end of the second connecting plate and the second pin pass through the first through-slot and the second through-slot, and the second pin that passes through the first through-slot and the second through-slot is electrically connected to the first conductive layer.

[0048] Based on the second aspect, in one optional implementation, a third through slot is formed through the first conductive layer, and a fourth through slot is formed through the first sub-board. One end of the first connecting plate and the second end of the power supply component pass through the third through slot and the fourth through slot. The second end of the power supply component that extends out from the third through slot and the fourth through slot has a gap with the first conductive layer.

[0049] Based on the second aspect, in an optional implementation, the third through slot has a third orthographic projection on the first sub-board, the fourth through slot has a fourth orthographic projection on the first sub-board, the fourth orthographic projection is located within the coverage area of ​​the third orthographic projection, and there is a gap between the third orthographic projection and the fourth orthographic projection.

[0050] Based on the second aspect, in one optional implementation, the first sub-board includes a first surface and a second surface positioned opposite each other, the first conductive layer is located on the first surface, the second end of the electrical connector extends to the second surface, the electrical connector includes a connecting plate, the surface of the connecting plate includes a power feeding element, one end of the connecting plate is plugged into and connected to the first sub-board, the conductive element is formed on the second surface, the first end of the power feeding element is electrically connected to the first radiating unit, and the second end of the power feeding element is electrically connected to the first pin.

[0051] Based on the second aspect, in one optional implementation, a metallized via is provided through the first sub-board, and the second pin is electrically connected to the first conductive layer through the metallized via.

[0052] Based on the second aspect, in one optional implementation, a third through-slot is formed through the first conductive layer, and a fourth through-slot is formed through the first sub-board. One end of the connecting plate and the second end of the power supply component pass through the third through-slot and the fourth through-slot. The second end of the power supply component that extends out from the third through-slot and the fourth through-slot has a gap with the first conductive layer.

[0053] Based on the second aspect, in an optional implementation, the first conductive layer and the conductive element are both located on the first surface of the first sub-board, the second end of the electrical connector extends to the first surface, the second end of the electrical connector is electrically connected to the first pin on the first surface, and there is a gap between the conductive element body and the first conductive layer.

[0054] Based on the second aspect, in an optional implementation, the electrical connector includes a connecting plate, the surface of the connecting plate includes a power feeding element, a first end of the power feeding element is electrically connected to the first radiating unit, a second end of the power feeding element is electrically connected to the first pin, the first surface includes a first gap, a second gap and a third gap, the first gap is located between the first conductive layer and the second end of the power feeding element, the second gap is located between the first pin and the first conductive layer, and the third gap is located between the conductive element body and the first conductive layer.

[0055] Based on the second aspect, in one optional implementation, a fifth through slot is formed through the first conductive layer, and a sixth through slot is formed through the first sub-board. One end of the connecting plate and the second end of the power supply component are inserted into the fifth through slot and the sixth through slot, so that the second end of the power supply component and the first conductive layer have the first gap, and the second end of the power supply component is electrically connected to the first pin.

[0056] Based on the second aspect, in an optional implementation, the fifth through slot has a fifth orthographic projection on the first sub-board, the sixth through slot has a sixth orthographic projection on the first sub-board, the sixth orthographic projection is located within the coverage area of ​​the fifth orthographic projection, and there is a gap between the fifth orthographic projection and the sixth orthographic projection.

[0057] Based on the second aspect, in one optional implementation, the electrically connected components and the first pin form an equivalent inductance, the spaced conductive body and the first conductive layer form an equivalent inductance, and the equivalent inductance and the equivalent capacitance connected in series form a resonator.

[0058] Thirdly, embodiments of this application provide a communication device, including a baseband module, a radio frequency module, and an antenna module as described in any of the first aspects above. The radio frequency module includes a transmitter and / or a receiver. The baseband module is used to transmit a first digital signal to the transmitter, the radio frequency module is used to convert the first digital signal into a first radio frequency signal, and the antenna module is used to convert the first radio frequency signal into a first electromagnetic wave and radiate it. And / or, the antenna module is used to receive a second electromagnetic wave and convert the second electromagnetic wave into a second radio frequency signal, and the receiver is used to convert the second radio frequency signal into a second digital signal and transmit the second digital signal to the baseband module.

[0059] Fourthly, embodiments of this application provide a base station, including a baseband module, a radio frequency module, and an antenna module as described in any of the first aspects above. The radio frequency module includes a transmitter and / or a receiver. The baseband module is used to transmit a first digital signal to the transmitter, the radio frequency module is used to convert the first digital signal into a first radio frequency signal, and the antenna module is used to convert the first radio frequency signal into a first electromagnetic wave and radiate it. And / or, the antenna module is used to receive a second electromagnetic wave and convert the second electromagnetic wave into a second radio frequency signal, and the receiver is used to convert the second radio frequency signal into a second digital signal and transmit the second digital signal to the baseband module.

[0060] Fifthly, embodiments of this application provide a communication system, which includes a base station and a terminal device. The base station includes a baseband module, a radio frequency module, and an antenna module as described in any of the first aspects above. The base station uses the antenna module to transmit and receive radio frequency signals with the terminal device. Attached Figure Description

[0061] Figure 1 Example diagram of an existing FSS top view structure;

[0062] Figure 2 Example diagram of a communication system;

[0063] Figure 3 An example structural diagram of one embodiment of the communication device provided in this application;

[0064] Figure 4 This is a structural example diagram of a first embodiment of the antenna module provided in this application;

[0065] Figure 5 for Figure 4 The diagram shows the insertion loss frequency response of the antenna module.

[0066] Figure 6 for Figure 4 The diagram shows an example of the structure of a double-layer FSS;

[0067] Figure 7 for Figure 6 An example diagram of the exploded structure of the FSS module is shown below;

[0068] Figure 8 for Figure 7 The diagram shows an example of the structure of the first surface of the first sub-plate.

[0069] Figure 9 for Figure 7 The diagram shown is an example of the overall structure of the FSS module.

[0070] Figure 10 for Figure 9 The diagram shows a partial structural example of the FSS module.

[0071] Figure 11 for Figure 9 The following is an example of the overall structure of the electrical connector;

[0072] Figure 12 A schematic diagram of the insertion loss frequency response of the antenna module including the resonator provided in this application;

[0073] Figure 13 A structural example diagram of a portion of the FSS module provided in this application;

[0074] Figure 14 Example diagram of the specific structure of the electrical connector provided in this application;

[0075] Figure 15 Another structural example diagram of a portion of the FSS module provided in this application;

[0076] Figure 16 This is a first example diagram of the overall structure of the FSS module provided in this application;

[0077] Figure 17 for Figure 16 The diagram shows a top view of the first submodule in the FSS module.

[0078] Figure 18 for Figure 16 The diagram shown is an example of the overall structure of the first submodule in the FSS module.

[0079] Figure 19 for Figure 16 The diagram shows a top view of the structure of the first submodule in the FSS module.

[0080] Figure 20 for Figure 16 The diagram shown is an example of the structure of a portion of the FSS module;

[0081] Figure 21 for Figure 16 The diagram shows a partial structural example of the FSS module.

[0082] Figure 22 This is a second example diagram of the overall structure of the FSS module provided in this application;

[0083] Figure 23 for Figure 22 The diagram shows an example of the radial structure of the first sub-board in the FSS module. Detailed Implementation

[0084] Combination Figure 2 The diagram illustrates the communication system used in the embodiments of this application. Figure 2This is an example diagram of a communication system. The communication system includes a base station 101 and multiple terminal devices 102. This embodiment does not limit the number of base stations 101 and terminal devices. This embodiment does not limit the type of communication system; for example, the communication system can be a wireless local area network (WLAN), or other types of wireless communication systems, such as Long Term Evolution (LTE) systems, Frequency Division Duplex (FDD) systems, Time Division Duplex (TDD) systems, Universal Mobile Telecommunications System (UMTS), Worldwide Interoperability for Microwave Access (WiMAX) systems, New Radio (NR), satellite communication, 5th generation mobile communication technology (5G), 6th generation mobile networks (6G) or 6th generation wireless systems (6G), and future communication systems, etc.

[0085] Base station 101 is used to communicate with terminal device 102. For example, base station 101 transmits signals from terminal device 102 to the network side, or transmits signals from the network side to terminal device 102. Base station 101 can be any device with wireless transceiver capabilities. The base station 101 includes, but is not limited to: evolved Node B (eNB), radio network controller (RNC), Node B (NB), basestation controller (BSC), base transceiver station (BTS), home evolved Node B (or home Node B (HNB), baseband unit (BBU), access point (AP), wireless relay node, wireless backhaul node, transmission point (TP), transmission and reception point (TRP) or network equipment (such as switch or router) in a wireless fidelity (WIFI) system, and may also be a gNB or transmission point (TRP or TP) in a 5G system, one or a group of antenna panels (including multiple antenna panels) of a base station in a 5G system, or may also be a network node constituting a gNB or transmission point, such as a building baseband unit (BBU) or a distributed unit (DU). The terminal device 102 can refer to user equipment, access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication equipment, user agent, or user device. The terminal device 102 can also be a cellular phone, cordless phone, session initiation protocol (SIP) phone, wireless local loop (WLL) station, personal digital assistant (PDA), handheld device with wireless communication capabilities, computing device or other processing device connected to a wireless modem, vehicle-mounted device, wearable device, terminal device in a future 5G network, or terminal device in a future evolved public land mobile network (PLMN), etc., and this application does not limit it to these categories.

[0086] Figure 3This is a structural example diagram of an embodiment of the communication device provided in this application. Exemplarily, Figure 3 Base stations or terminal equipment in the middle can all be accessed through Figure 3The communication device shown is used to implement this. This communication device includes a processor 201, a communication bus 202, a memory 203, a radio frequency module 204, an antenna module 205, and a baseband module 206. The processor 201 may include one or more chips, or one or more integrated circuits. For example, the processor 201 may include one or more of the following: neural processing unit (NPU), optical digital signal processor (oDSP), field-programmable gate array (FPGA), application-specific integrated circuit (ASIC), system-on-chip (SoC), central processing unit (CPU), network processor (NP), microcontroller unit (MCU), programmable logic device (PLD), network interface card chip, storage interface chip, or other integrated chips, etc. Specific details are not elaborated here. The communication bus 202 may include a path for transmitting information between the above components. The memory 203 can be a read-only memory (ROM), random access memory (RAM), or other types of storage devices. It can also be an electrically erasable programmable read-only memory (EEPROM), optical disk, magnetic disk, or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures that can be accessed by a computer. The memory 203 can exist independently and be connected to the processor 201. Alternatively, the memory 203 can be integrated with the processor 201. The radio frequency module 204 and the antenna module 205 are used to cooperate in transmitting and receiving radio frequency signals. The antenna module 205 is the antenna module provided in this embodiment. The structure of this antenna module can be found in the relevant description in subsequent embodiments. The baseband module 206 is used to process the received wireless signals or the wireless signals to be transmitted. Specifically, the communication device includes P transmitting channels and J receiving channels, where P is any integer greater than or equal to 1, and J is any integer greater than or equal to 1. In the J receiving channels, each receiving channel includes a receiver in the radio frequency module 204 and a radiating element in the antenna module 205.In the P transmission channels, each transmission channel includes a transmitter in the RF module 204 and a radiating element in the antenna module 205. For example, the baseband module 206 sends a first digital signal to the transmission channel. The transmitter in the RF module 204 converts the first digital signal into a first RF signal and processes the first RF signal to obtain a processed first RF signal. The transmitter may include devices such as a switch, filter, power amplifier (PA), low noise amplifier (LNA), antenna tuner, or phase shifter. The radiating element of the antenna module 205 converts the first RF signal into electromagnetic waves and radiates them. Alternatively, the radiating element of the antenna module 205 receives electromagnetic waves and converts them into a second RF signal. The receiver in the RF module 204 processes the second RF signal to obtain a processed second RF signal and converts the processed second RF signal into a second digital signal. For a description of the components included in the receiver and the processing, please refer to the description of the components included in the transmitter and the processing; details will not be elaborated here. The receiver sends the second digital signal to the baseband module 206, and the baseband module 206 performs digital processing on the second digital signal.

[0087] Figure 4This is a structural example diagram of a first embodiment of the antenna module provided in this application. This embodiment uses an antenna module as a multi-band antenna. Multi-band antennas allow multiple radiating elements of different frequency bands and polarization directions to operate simultaneously. For example, the antenna module employs a common-aperture antenna array (CAA) technology. CAA technology can meet the ever-increasing demands for mobile communication speeds and bandwidth. Specifically, an antenna module employing CAA technology allows multiple radiating elements of different frequency bands and polarizations to operate simultaneously within the same aperture area. The aperture area refers to the effective area of ​​the antenna radiating or receiving electromagnetic waves. The antenna module includes a first radiating element, a second radiating element, a first feed network (or power distribution network), a second feed network, a reflector 360, a first radome 371, and a second radome 372. The first radiating element and the first feed network are located within the first radome 371, while the second radiating element, the second feed network, and the reflector 360 are located within the second radome 372. The first radome 371 is used to house the first radiating element, preventing it from being affected by the external environment and improving its reliability. Furthermore, since the first radiating element operates in the first frequency band, it can penetrate the first radome 371. Therefore, the first radome 371 can block or reduce the impact of external electromagnetic interference on the first radiating element, improving the reception and transmission quality of electromagnetic waves. Simultaneously, it can also reduce the harm to the surrounding environment and personnel caused by the electromagnetic radiation generated by the first radiating element during operation. For an explanation of how the second radome 372 protects the second radiating element, please refer to the explanation of how the first radome 371 protects the first radiating element; details will not be repeated here.

[0088] This embodiment uses an antenna module with two radomes as an example; the specific number of radomes is not limited. For example, the antenna module may include only one radome. The first radiating element includes one or more first antenna elements (or simply elements) 310, and the second radiating element includes one or more second antenna elements 320. A first feeding network is used to feed each first antenna element 310, and a second feeding network is used to feed each second antenna element 320. This embodiment uses a first radiating element including multiple first antenna elements 310 and a second radiating element including multiple second antenna elements 320 as an example.

[0089] Specifically, the first feed network includes an FSS (Field-Side Array). This embodiment does not limit the number of layers in the FSS; that is, the FSS may include one layer of FSS units, or it may be composed of multiple layers of FSS units stacked along the target direction Z. For example, the FSS may include only one layer of FSS units 340, or it may include two FSS units, namely FSS units 340 and 341 stacked along the target direction Z. Taking FSS unit 340 as an example, along the target direction Z, the FSS unit 340 is located between multiple first antenna elements 310 and multiple second antenna elements 320. The surface of the FSS unit 340 extends along the target plane XY, which includes directions X and Y. Direction X is perpendicular to direction Y, and the target direction Z is perpendicular to the target plane XY. It can be understood that the target direction Z is perpendicular to the surface of the FSS 340. The first radiating element operates in a first frequency band, and the second radiating element operates in a second frequency band. The first and second frequency bands are different from each other, meaning the intersection of the first and second frequency bands is empty. This ensures that the first frequency band in which the first radiating element operates is reflected by the FSS340, and that the second frequency band in which the second radiating element operates freely passes through the FSS340, suppressing interference between the electromagnetic waves transmitted and received by the first and second radiating elements. This embodiment does not limit the number of radiating elements. For example, the antenna module may also include a third radiating element, which includes one or more third antenna elements 330. For a description of the third radiating element, please refer to the description of the first radiating element 310; further details are omitted here.

[0090] Along the target direction Z, the FSS unit 340 is located between the first radiating unit and the second radiating unit. If the antenna module includes a third radiating unit, then the FSS unit 340 is also located between the third radiating unit and the second radiating unit. The FSS unit 340 itself cannot absorb electromagnetic wave energy, but it can effectively control the reflection and transmission of electromagnetic waves, thus having a filtering function; essentially, it is a spatial filter. This embodiment uses a double-layer FSS as an example. A double-layer FSS refers to an FSS unit 340 and an FSS unit 341 stacked together. The following explains the function of the double-layer FSS shown in this embodiment:

[0091] Figure 5 for Figure 4The diagram shows the insertion loss frequency response of the antenna module. In this example, the horizontal axis represents frequency (in gigahertz, GHz), and the vertical axis represents insertion loss (in decibels, dB). The double-layer FSS has a passband frequency range and a stopband frequency range. The passband frequency range refers to the frequency range in which electromagnetic waves can freely pass through the double-layer FSS, and the stopband frequency range refers to the frequency range in which electromagnetic waves are reflected by the double-layer FSS. This double-layer FSS operates within the stopband frequency range (e.g., Figure 5 The frequencies shown are f1 to f4 (where f4 is greater than f1), and their insertion loss is less than or equal to the stopband rejection. Stopband rejection measures the degree to which a double-layer FSS reflects signals within its stopband frequency range. It can be understood that the larger the absolute value of the stopband rejection, the more energy of the electromagnetic waves in the frequency range of f1 to f4 will be reflected. This stopband rejection can be -15dB. In this embodiment, the first radiating element operates in the first frequency band, and the third radiating element operates in the third frequency band. Figure 5 As shown, the first and third frequency bands are located within the stopband frequency range of the double-layer FSS. For example, the frequency range of the first frequency band is from frequency f1 to frequency f2, and the frequency range of the third frequency band is from frequency f3 to frequency f4, with frequencies f1, f2, f3, and f4 increasing sequentially. In this embodiment, the double-layer FSS acts as a reflector for both the first and second radiating units. For example, the electromagnetic waves emitted by the first radiating unit specifically include a first electromagnetic wave and a second electromagnetic wave. The first and second electromagnetic waves propagate in opposite directions, and both the frequencies of the first and second electromagnetic waves are within the stopband frequency range of the double-layer FSS. Combined with... Figure 2 As shown, the first electromagnetic wave is transmitted to each terminal device within the coverage area so that each terminal device receives the first electromagnetic wave. The second electromagnetic wave is transmitted to the dual-layer FSS included in the base station 101. The dual-layer FSS reflects the second electromagnetic wave, which is located in the stopband frequency range. The reflected second electromagnetic wave and the first electromagnetic wave are superimposed in space, thereby being transmitted to each terminal device within the coverage area. For an explanation of the reflection of electromagnetic waves from the third radiating element by the dual-layer FSS, please refer to the explanation of the reflection of electromagnetic waves from the first radiating element by the dual-layer FSS; details will not be repeated here.

[0092] In this embodiment, the second radiating element includes individual second antenna elements located between the reflector 360 and the double-layer FSS along the target direction Z. The double-layer FSS operates within the passband frequency range (e.g., Figure 5The frequencies f5 to f6 (where f6 is greater than f5) have an insertion loss of approximately 0 dB for electromagnetic waves. Therefore, electromagnetic waves within the passband frequency range can pass freely through the double-layer FSS with near-lossless operation. This double-layer FSS acts as an electromagnetic transparency plate for the electromagnetic waves radiated by the second radiating unit, ensuring that these waves can pass freely to various terminal devices within the coverage area. Specifically, the electromagnetic waves emitted by the second radiating unit include a third and a fourth electromagnetic wave, with the third and fourth waves propagating in opposite directions. Figure 2 As shown, the third electromagnetic wave is transmitted to each terminal device within the coverage area so that each terminal device receives the third electromagnetic wave. The fourth electromagnetic wave is transmitted to the reflector 360 included in the base station 101. The reflector 360 reflects the fourth electromagnetic wave. Both the third electromagnetic wave and the reflected fourth electromagnetic wave will pass freely through the double-layer FSS, thereby being transmitted to each terminal device within the coverage area.

[0093] Figure 6 for Figure 4 The diagram shows an example of a two-layer FSS structure. (From...) Figure 6 As shown, the two-layer FSS includes multiple FSS modules 400 arranged in N rows and M columns, where N and M are any integers greater than 1, for example, Figure 5 The example shown uses N and M both being 8. It should be clarified that this embodiment uses a double-layer FSS comprising multiple uniformly arranged FSS modules 400 as an example, but this is not a limitation. In other examples, the double-layer FSS module may include multiple FSS modules arranged non-uniformly, for example, multiple FSS modules arranged randomly. Combined with... Figure 6 as well as Figure 7 The structure of each FSS module is illustrated below. Figure 7 for Figure 6The diagram shows an exploded view of the FSS module. The FSS unit 340 includes a first dielectric substrate 410 and a conductive layer on the first surface of the first dielectric substrate 410. The FSS unit 341 includes a second dielectric substrate 420 and a second conductive layer on the first surface of the second dielectric substrate 420. The first dielectric substrate 410 is exemplified by a printed circuit board (PCB), but is not limited to any particular type. For example, the first dielectric substrate 410 can also be a plastic substrate, a ceramic substrate, an epoxy glass cloth laminate, etc. The first dielectric substrate 410 includes N*M first sub-boards. For a description of the type of the second dielectric substrate 420, please refer to the description of the first dielectric substrate 410; details will not be repeated here. The second dielectric substrate 420 includes N*M second sub-boards. In this embodiment, the first surface of the first dielectric substrate 410 is the surface facing the first radiating unit, but this is not limited. In other examples, the first surface of the first dielectric substrate 410 can also be the surface facing the second radiating unit. The first surface of the first dielectric substrate 410 is formed with a conductive layer using copper clad laminate (CCL) technology or etching technology. This conductive layer includes N*M first conductive layers and N*M first conductive layers, which are respectively located on the first surfaces of the N*M first sub-boards of the first dielectric substrate 410. The first surface of the second dielectric substrate 420 is formed with a conductive layer, which includes N*M second conductive layers. In this embodiment, the first surface of the second dielectric substrate 420 is the surface of the second dielectric substrate 420 facing the second radiating unit, but this is not limited. In other examples, the first surface of the second dielectric substrate 420 can also be the surface of the second dielectric substrate 420 facing the first radiating unit. The conductive layer on the first surface of the second dielectric substrate 420 includes N*M second conductive layers and N*M second conductive layers, which are respectively located on the first surfaces of the N*M second sub-boards of the second dielectric substrate 420. It can be understood that each FSS module, along the target direction Z, includes a second conductive layer 503, a second sub-board 502, a first sub-board 501, and a first conductive layer 504.

[0094] In this embodiment, taking the complete overlap of the orthographic projections of the second conductive layer 503, the second sub-board 502, the first sub-board 501, and the first conductive layer 504 on the target plane XY as an example, is not limited to this embodiment. It is also possible that both the first sub-board 501 and the second sub-board 502 are parallel to the target plane XY. Taking the orthographic projection of the second conductive layer 503 on the target plane XY as an example, multiple parallel and perpendicular projection lines illuminate the second conductive layer 503 to form the orthographic projection on the target plane XY. In other examples, any two orthographic projections of the second conductive layer 503, the second sub-board 502, the first sub-board 501, and the first conductive layer 504 on the target plane XY may partially overlap. For example, the orthographic projection of the second conductive layer 503 onto the target plane XY may fall within the coverage area of ​​the orthographic projection of the second sub-board 502 onto the target plane XY. Similarly, the orthographic projection of the second sub-board 502 onto the target plane XY may fall within the coverage area of ​​the orthographic projection of the second conductive layer 503 onto the target plane XY. Furthermore, the orthographic projections of the second conductive layer 503 and the second sub-board 502 onto the target plane XY may intersect. For an explanation of the relationship between the orthographic projections of the first sub-board 501 onto the target plane XY and the first conductive layer 501 onto the target plane XY, please refer to the explanations of the orthographic projections of the second conductive layer 503 and the second sub-board 502 onto the target plane XY; further details will not be elaborated here.

[0095] Please refer to the first surface structure of the first sub-board 501. Figure 8 As shown, where, Figure 8 for Figure 7The diagram shows an example of the structure of the first surface of the first sub-board. The first surface of the first sub-board 501 includes a first conductive layer 504. Specifically, the first conductive layer 504 includes a first conductive loop 601. In this embodiment, the shape of the first conductive loop 601 is not limited; this embodiment uses a square loop as an example. In other examples, the first conductive loop 601 can be elliptical, circular, or any other loop with its ends connected. Optionally, the first conductive loop 601 may include a first conductive module 603. The first conductive module 603 has a square structure, and there is a gap between the first conductive module 603 and the first conductive loop 601. It can be understood that the first conductive module 603 and the first conductive loop 601 are nested in a U-shape with a gap in the middle. It should be clarified that this embodiment does not limit the unit structure, size, arrangement, or material properties of the first conductive layer 504, as long as it can achieve two functions: Function 1, the arrangement of N*M FSS modules allows electromagnetic waves in the passband frequency range to pass freely through the double-layer FSS in a near-lossless state, and also allows electromagnetic waves in the stopband frequency range to be reflected by the double-layer FSS. Function 2, the FSS modules can feed the radiating unit. For a description of the structure of the second conductive layer 503, please refer to the description of the structure of the first conductive layer 504; details will not be repeated here.

[0096] The following describes the structure of the FSS module as a radiating element feeder. Figure 9 for Figure 7 The diagram shows an example of the overall structure of the FSS module. Figure 10 for Figure 9 The diagram shown is a partial structural example of the FSS module. Figure 11 for Figure 9The overall structure of the electrical connector is shown as an example. The FSS module shown in this embodiment also includes an electrical connector 800, which is used to feed power to the first radiating unit. Specifically, the electrical connector 800 includes a first connecting plate 801 and a second connecting plate 802. For a description of the first connecting plate 801 and the second connecting plate 802 shown in this embodiment, please refer to the description of the first dielectric plate shown above; details will not be repeated here. The first connecting plate 801 intersects with the second connecting plate 802. This embodiment does not limit the angle of intersection between the first connecting plate 801 and the second connecting plate 802. For example, this embodiment takes the first connecting plate 801 being perpendicular to the second connecting plate 802 as an example. The second connecting plate 802 extends along the surface of the second surface 900 of the first sub-plate 501 and extends a certain distance on the second surface 900. Therefore, it can be understood that the electrical connector shown in this embodiment is generally "L"-shaped. Along the target direction Z, the first sub-plate 501 has a first surface and a second surface 900 positioned opposite each other. It can be understood that, in the example where the first surface of the first sub-plate 501 faces the second radiating element, the second surface 900 of the first sub-plate 501 faces the first radiating element. For example, in this embodiment, the first connecting plate 801 is perpendicular to the second surface 900, and the second connecting plate 802 is parallel to the second surface 900. This embodiment uses a rectangular structure for both the first connecting plate 801 and the second connecting plate 802 as an example, without limitation. The surface of the first connecting plate 801 includes a conductive feed element 811, and the surface of the second connecting plate 802 includes a conductive conductive element 812. Specifically, the first end of the feed element 811 is electrically connected to the first radiating element, and the conductive element 812 includes a first pin, a conductive element body, and a second pin connected in sequence. The first pin is electrically connected to the second end of the feed element 811. The method of electrical connection between the first pin and the second end of the power supply component 811 shown in this embodiment is not limited. For example, it can be achieved through welding, hinge, plugging, crimping, etc. For a description of the formation method and material of the power supply component 811 and the conductive component 812, please refer to the description of the first conductive layer above; specific details will not be repeated here. The conductive component body shown in this embodiment is located between the second connecting plate 802 and the second surface 900 of the first sub-plate. Therefore, between the conductive component body and the first conductive loop 601, separated by the first sub-plate 501, an equivalent capacitance can be formed between the conductive component body and the first conductive loop 601. The electrical connector shown in this embodiment has two functions.

[0097] Function 1 powers the first radiating element; Function 2 introduces a transmission zero between the passband and stopband frequency ranges. Functions 1 and 2 are explained in detail below:

[0098] Function 1 describes a first feeding network used to power the first radiating element, specifically including a transmission module (not shown in the figure), a power divider (not shown in the figure), a first conductive loop 601, electrical connectors, and a feeding component 811. As shown above, the electrical connectors include the feeding component 811 and a conductive component 812. The first end of the feeding component 811 is electrically connected to the first radiating element, for example, to a first antenna element included in the first radiating element. The second end of the feeding component 811 is electrically connected to the first end of the conductive component 812, and the second end of the conductive component 812 is electrically connected to the first conductive loop 601. The first conductive loop 601, the power divider, the transmission module, and the RF module are connected sequentially. The transmission module shown in this embodiment can be a coaxial cable. This embodiment does not limit the type of transmission module, as long as the transmission module can realize the transmission and reception of RF signals between the power divider and the RF module. For example, the transmission module can connect to one or more power dividers. One or more power dividers are used to split the power of the first radio frequency signal from the radio frequency module into multiple first sub-signals. This embodiment does not limit the number of power dividers included in the first feed network. For example, the power divider can be a 1-to-2 power divider. The two ports of the 1-to-2 power divider are respectively connected to two electrical connectors, and each electrical connector is connected to a first antenna element 310. Then, the two first sub-signals output from the two ports of the 1-to-2 power divider are transmitted to the two first antenna elements 310 respectively. The first antenna element 310 converts the received first sub-signals into electromagnetic waves and radiates them. Alternatively, the first antenna element of the first radiating unit 320 receives electromagnetic waves and converts them into second sub-signals, which are located within the first frequency band. Specifically, the electrical connectors of the first feed network send the second sub-signals to the power divider. The power divider combines the multiple second sub-signals into a second radio frequency signal and sends it to the radio frequency module through the transmission module. The radio frequency module 201 processes the second radio frequency signal. This embodiment uses the first feed network to connect the first radiating unit and the radio frequency module as an example. In other examples, the first feed network is also used to ground the first radiating unit. Specifically, the first feed network includes a grounding module, and the first radiating unit is electrically connected to the grounding module in sequence through an electrical connector and a first conductive loop. This embodiment does not limit the specific location of the grounding module; for example, the grounding module is located on the first daughter board. The grounding module generally refers to a grounded conductive plate. The grounding module provides a stable reference potential for the first feed network, which helps maintain stable signal transmission. At the same time, the grounding module also plays a role in shielding and reducing electromagnetic interference.

[0099] In function 2, the feed element 811 and the conductive element 812 are connected to form an equivalent inductance. The conductive element body and the first conductive loop 601 are separated by a first sub-board 501 to form an equivalent capacitance. It can be understood that the equivalent inductance and equivalent capacitance formed by the antenna module are connected in series, thus forming a series inductor (L) capacitor (C) resonator. In the insertion loss frequency response corresponding to the antenna module, the resonator produces the maximum insertion loss at a specific frequency, which is called the transmission zero, attenuation pole, or notch point, etc. It can be understood that the resonator produces the maximum signal suppression capability at the transmission zero. Combined with... Figure 12 As shown, where, Figure 12 A schematic diagram of the insertion loss frequency response of the antenna module including the resonator provided in this application. Figure 12 For an explanation of the coordinates of the schematic diagram of the insertion loss frequency response shown, please refer to [link to diagram]. Figure 5 The corresponding explanations are omitted here. Insertion loss frequency response 1101 is an example where the antenna module does not include a resonator; insertion loss frequency response 1102 is... Figures 6 to 11 The example shown includes a resonator antenna module. Comparing the insertion loss frequency response 1101 and insertion loss frequency response 1102, it can be seen that using the antenna module with the resonator shown in this embodiment introduces a transmission null at 2.8 GHz, meaning that the absolute value of the insertion loss corresponding to the antenna module is maximum at 2.8 GHz. Specifically, the insertion loss at 2.8 GHz is -30 dB. Therefore, the stopband suppression shown in this example can be -30 dB. Figure 5 as well as Figure 12 As shown, introducing transmission zeros effectively improves stopband rejection, thereby enhancing the filtering performance of the FSS. The technical effects of improving the stopband rejection of the FSS are explained below:

[0100] See also Figure 4 As shown, there is a certain mounting distance 380 between the first radome 371 and the second radome 372. The magnitude of the stopband suppression is related to the absolute value of the tolerance range of the mounting distance 380. Specifically, the absolute value of the tolerance range of the mounting distance 380 is positively correlated with the absolute value of the stopband suppression; that is, the larger the absolute value of the stopband suppression, the larger the absolute value of the tolerance range of the mounting distance 380. Similarly, the smaller the absolute value of the stopband suppression, the smaller the absolute value of the tolerance range of the mounting distance 380. For example, as shown in Table 1:

[0101] Table 1

[0102] Absolute value of the tolerance range for installation distance of 380 4mm 10mm 15mm Absolute value of stopband suppression 9dB 15dB 18dB

[0103] In the examples shown in Table 1, if the tolerance range of the installation distance 380° is within -4mm to 4mm, the corresponding absolute value of the stopband suppression is 9dB. Similarly, if the tolerance range of the installation distance 380° is within -15mm to 15mm, the corresponding absolute value of the stopband suppression is 18dB. Because the antenna module shown in this embodiment introduces a transmission null through a resonator, thereby improving the stopband suppression, the requirement for the absolute value of the installation distance 380° is relaxed. This reduces the difficulty of actual engineering assembly of the antenna module, improves the assembly efficiency, and enhances the reliability of the antenna module during use.

[0104] If the antenna module shown in this embodiment does not include the FSS unit 341, then the FSS unit 340 carries a portion of the first feed network (i.e., the feed element and conductive element shown above) for feeding the first radiating element. For a description of the first feed network and the feeding of the first radiating element, please refer to the above embodiment; specific details will not be repeated here. If the antenna module includes the FSS unit 341, then to form the resonator shown above, an electrical connector needs to pass through the FSS unit 341. For a detailed structural description, please refer to the following:

[0105] Figure 13 This is a structural example diagram of a portion of the FSS module provided in this application. Figure 14 This is a structural example diagram of the electrical connector provided in this application. Specifically, the FSS module includes a first submodule and a second submodule, which are stacked together. Specifically, in conjunction with... Figure 7 As shown, the first submodule includes a first subboard 501 and a first conductive layer 504 on the first surface of the first subboard 501. The second submodule includes a second subboard 502 and a second conductive layer 503 on the first surface of the second subboard 502. Figure 13The diagram shows a structural example of the second submodule. The second conductive layer specifically includes a second conductive loop 1201 and a second conductive module 1202 located inside the second conductive loop 1201, with a gap between the second conductive loop 1201 and the second conductive module 1202. For a description of the second conductive loop 1201 and the second conductive module 1202, please refer to the above description of the structure of the first conductive loop and the first conductive module included in the first conductive layer; further details are omitted here. It can be understood that, along the target direction Z, the second sub-plate 502 is located between the first sub-plate 501 and the first radiating unit, and also between the first sub-plate 501 and the third radiating unit. Along the target direction Z, in this embodiment, the second conductive layer 503 is located between the second sub-plate 502 and the first radiating unit. The first surface of the second sub-plate 502 has a region 1200, in which a first slot 1211 is formed through the second conductive layer 503, and a second slot 1212 is formed through the second sub-plate 502. Specifically, the first slot 1211 is a slot formed through the second conductive loop 1201. As shown in the above embodiment, the first connecting plate 801 of the electrical connector passes through the first slot 1211 and the second slot 1212. As shown above, the first connecting plate 801 includes a power supply component. When the first connecting plate 801 passes through the first slot 1211 and the second slot 1212, there is a gap between the power supply component and the second conductive loop 1201, thereby making the power supply component and the second conductive loop 1201 electrically isolated.

[0106] To effectively ensure that the power supply component 811 and the second conductive loop 1201 are electrically isolated, the first slot 1211 has a first orthographic projection on the second sub-board, and the second slot 1212 has a second orthographic projection on the second sub-board. The first orthographic projection refers to the projection formed by the first slot 1211 on the second sub-board by multiple projection lines that are parallel to each other and perpendicular to the second sub-board. Similarly, the second orthographic projection refers to the projection formed by the second slot 1212 on the second sub-board by multiple projection lines that are parallel to each other and perpendicular to the second sub-board. In this embodiment, the second orthographic projection is located within the coverage area of ​​the first orthographic projection, and there is a gap between the first and second orthographic projections. Specifically, because the second orthographic projection is located within the coverage area of ​​the first orthographic projection, it effectively ensures that the first connecting plate can pass through both the first slot 1211 and the second slot 1212. Because there is a gap between the first orthographic projection and the second orthographic projection, the first connecting plate passing through the first slot 1211 and the second slot 1212 will not contact the second conductive loop 1201 based on this gap, effectively ensuring the electrical isolation between the power supply component 811 and the second conductive loop 1201.

[0107] This embodiment uses electrical isolation between the electrical connector and the second conductive layer as an example. In other examples, the electrical connector and the second conductive layer can also be electrically connected. For example, the electrical connector can be electrically connected to both the first and second conductive layers. The electrical connection between the electrical connector and the first conductive layer enables electrical connection with the radio frequency module. The electrical connection between the electrical connector and the second conductive layer enables electrical connection with the grounding module. As another example, the electrical connection between the electrical connector and the first conductive layer enables electrical connection with the grounding module, and the electrical connection between the electrical connector and the second conductive layer enables electrical connection with the radio frequency module.

[0108] Combination Figure 14 as well as Figure 15 As shown, where, Figure 15 This is another structural example diagram of a portion of the FSS module provided in this application. The electrical connector specifically includes a first connecting plate 801 and a second connecting plate 802. The second connecting plate 802 includes regions 1300 and 1310. This embodiment does not limit the specific positions of regions 1300 and 1310 on the second connecting plate 802; this embodiment takes regions 1300 and 1310 at both ends of the second connecting plate 802 as an example. As shown above, the conductive element 812 includes a first pin, a conductive element body, and a second pin connected in sequence. Region 1300 includes a first end 1301 of the second connecting plate 802, which connects to the second pin 1302. The first sub-plate includes regions 1400 and 1410. Along the target direction Z, regions 1400 and 1300 are positioned opposite each other. In region 1400, a first through-slot 1401 is formed through the first conductive layer, and a second through-slot 1402 is formed through the first sub-plate. Specifically, the first through-slot 1401 is a through-slot formed by penetrating the first conductive loop. The first end 1301 is inserted into the second through-slot 1402 to form a mechanical fixation between the first sub-board and the electrical connector. After the first end 1301 exits from the second through-slot 1402, the second pin 1302 also exits from the first through-slot 1401. The second pin 1302 can then be electrically connected to the first conductive loop through welding, hinge, insertion, crimping, or other methods. This embodiment does not limit the size relationship between the first through-slot 1401 and the second through-slot 1402, as long as the first end 1301 of the first sub-board can successfully exit to achieve mechanical fixation. For example, the orthographic projection of the first through-slot 1401 on the first sub-board should at least partially overlap with the orthographic projection of the second through-slot 1402. As long as the first end 1301 exits from the second through-slot 1402, the second pin 1302 connected to the first end 1301 can be electrically connected to the first conductive loop.

[0109] It should be clarified that this embodiment does not limit the way the second pin 1302 of the conductive component is electrically connected to the first conductive loop. For example, in region 1400, there is a metallized via that is electrically connected to the first conductive loop. In this case, when the second end 1311 of the second connecting plate 802 passes through the third through slot 1411 and the fourth through slot 1412 to achieve mechanical fixation between the first sub-board and the electrical connector, the second pin 1302 is electrically connected to the metallized via, thereby achieving the electrical connection between the second pin 1302 and the first conductive loop.

[0110] Region 1310 of the second connecting plate 802 includes a second end 1311 of the second connecting plate 802, the surface of which includes a second end 1312 of the power feeder (as shown above, the first end of the power feeder is electrically connected to the first radiating unit). In region 1410 of the first sub-plate, a third through groove 1411 is formed through the first conductive layer, and a fourth through groove 1412 is formed through the first sub-plate. Specifically, the third through groove 1411 is a through groove formed through the first conductive loop. For a detailed explanation, please refer to the description of the first through groove shown above, which will not be repeated here. The second end 1311 of the second connecting plate 802 passes through the third through groove 1411 and the fourth through groove 1412 to achieve mechanical fixation between the first sub-plate and the electrical connector. In order to achieve an equivalent inductance between the power feeder and the conductive element on the surface of the electrical connector, electrical isolation is required between the power feeder and the first conductive layer. Therefore, when the second end 1311 of the second connecting plate 802 passes through the third through slot 1411 and the fourth through slot 1412, there is a gap between the second end 1312 of the power supply component and the first conductive loop, thereby making the power supply component and the first conductive loop electrically isolated. To effectively ensure that the power supply component and the first conductive loop are electrically isolated, the third through slot 1411 has a third orthographic projection on the first sub-plate, and the fourth through slot 1412 has a fourth orthographic projection on the first sub-plate. The third orthographic projection refers to the orthographic projection formed on the first sub-plate by multiple projection lines that are parallel to each other and perpendicular to the first sub-plate. Similarly, the fourth orthographic projection refers to the orthographic projection formed on the first sub-plate by multiple projection lines that are parallel to each other and perpendicular to the first sub-plate. In this embodiment, the fourth orthographic projection is located within the coverage area of ​​the third orthographic projection, and there is a gap between the third and fourth orthographic projections. Since the fourth orthographic projection is located within the coverage area of ​​the third orthographic projection, it effectively ensures that the second end 1311 can pass through the third through slot 1411 and the fourth through slot 1412 to achieve mechanical connection between the electrical connector and the first sub-board. Because there is a gap between the third and fourth orthographic projections, the second end 1312 of the power supply component passing through the third through slot 1411 and the fourth through slot 1412 will not contact the first conductive loop, effectively ensuring electrical isolation between the power supply component and the first conductive loop. It should be noted that this embodiment takes the second end 1312 of the power supply component passing through the third through slot 1411 and the fourth through slot 1412 as an example. In other examples, the second end 1312 of the power supply component can also abut against the slot opening of the fourth through slot 1412 facing the first radiating unit. In this case, since the second end 1312 of the power supply component will not extend to the first surface of the first sub-board, electrical isolation between the power supply component and the first conductive loop is achieved.

[0111] It should be clarified that this embodiment takes an FSS module including one electrical connector as an example. In other examples, an FSS module may also include two or more electrical connectors of any number. The structure of each electrical connector is shown in the above embodiment and will not be described in detail. If an FSS includes multiple electrical connectors, it is equivalent to including multiple resonators in parallel. Then, by changing the number of electrical connectors included in an FSS, the frequency corresponding to the transmission null of the antenna module can be adjusted accordingly, thereby adjusting the stopband frequency range and the passband frequency range to match the frequency band requirements of the first radiating element and the second radiating element.

[0112] Using the antenna module shown in this embodiment, the first end of the electrical connector of the FSS module is electrically connected to the first radiating element, and the second end of the electrical connector extends to the second surface of the first sub-board of the FSS module. The electrical connector and the first conductive layer of the FSS module form a resonator. This resonator can effectively improve the stopband suppression of the antenna module, thereby reducing the assembly difficulty of the antenna module. The resonator shown in this embodiment can introduce a transmission zero to the insertion loss frequency response of the antenna module, and can improve the steepness between the passband frequency range and the stopband frequency range. Here, the steepness between the passband frequency range and the stopband frequency range refers to the edge frequencies of the channel frequency range (e.g., the cutoff frequency). Figure 5 The difference between the insertion loss corresponding to frequency f5 and the insertion loss corresponding to the edge frequency of the stopband frequency range (e.g., frequency f4) is shown. It can be understood that in the insertion loss frequency response, the edge frequencies of the passband frequency range and the edge frequencies of the stopband frequency range are adjacent. Because the resonator shown in this embodiment increases the steepness between the passband and stopband frequency ranges, it improves the filtering performance of the FSS, thereby improving the performance of the antenna module, for example, effectively increasing the bandwidth of the antenna module. Furthermore, the electrical connectors and the first conductive layer of the antenna module in this embodiment work together to form a resonator, effectively suppressing electromagnetic coupling between the electrical connectors and the first conductive layer, improving the anti-interference capability of the antenna module, and ensuring that the antenna module can achieve stable performance over a large angle range. For example, in scenarios where the antenna module receives different electromagnetic waves over a large angle range, the performance parameters of the antenna module (e.g., the gain and beamwidth of the antenna module) will remain stable and consistent, improving the reliability of the antenna module's communication.

[0113] In the above embodiments, taking the conductive component used to form the resonator as part of the electrical connection component as an example, in this embodiment, the conductive component is part of the first sub-board. Combined with... Figures 16 to 21 As shown, Figure 16 This is a first example diagram of the overall structure of the FSS module provided in this application. Figure 17 for Figure 16The diagram shown is a top view of the first submodule in the FSS module. Figure 18 for Figure 16 The diagram shown is an example of the overall structure of the first submodule in the FSS module. Figure 19 for Figure 16 The diagram shown is a top-view example of the structure of the first submodule in the FSS module. Figure 20 for Figure 16 The diagram shows a partial structural example of an FSS module. Figure 21 for Figure 16 The diagram shows a partial structural example of the FSS module. The antenna module shown in this embodiment includes a first radiating element, a second radiating element, a third radiating element, a first feed network, a second feed network, a third feed network, a reflector, a first radome, and a second antenna cover. For descriptions of the first radiating element, second radiating element, third radiating element, second feed network, third feed network, reflector, first radome, and second antenna cover, please refer to the above embodiment; specific details will not be repeated here. Compared to the above embodiment, the structure of the FSS included in the first feed network shown in this embodiment differs from the above embodiment. Specifically, the FSS shown in this embodiment includes multiple FSS modules. For a description of the arrangement of multiple FSS modules to form an FSS, please refer to [link to previous documentation]. Figure 6 The corresponding explanations will not be elaborated upon here.

[0114] The FSS module 1600 specifically includes a first sub-board 1601, a first conductive layer 1602, a second sub-board 1603, and a second conductive layer 1604. For a description of the positions of the first sub-board 1601, the first conductive layer 1602, the second sub-board 1603, and the second conductive layer 1604, please refer to the above. Figure 6 as well as Figure 7The corresponding descriptions are not detailed here. The electrical connector shown in this embodiment includes a connecting plate 1611. For a description of the material of the connecting plate 1611, please refer to the above description of the dielectric board; details will not be repeated here. The electrical connector shown in the above embodiment includes a first connecting plate and a second connecting plate connected to each other, forming an "L" shape. The connector shown in this embodiment only includes one connecting plate 1611, forming an "I" shape. The surface of the connector includes a power supply component 2001. For a description of the power supply component, please refer to the description of the power supply component shown in the above embodiment; details will not be repeated here. The first end of the connecting plate 1611 is connected to the second sub-board 1603 of the FSS module. For a detailed description of the connection, please refer to the description of the connection between the first connecting plate and the second sub-board in the above embodiment; details will not be repeated here. The second end of the connecting plate 1611 extends to the second surface 2000 of the first sub-plate 1601. The first surface of the first sub-plate 1601 includes a first conductive layer. Specifically, the first conductive layer includes a first conductive loop 1901 and a first conductive module 1902 located within the first conductive loop 1901. For a detailed description of the first conductive layer, please refer to the above embodiment. Detailed descriptions will not be repeated here.

[0115] In region 2010 of the first sub-board 1601, a third through-slot 2011 is formed through the first conductive layer, and a fourth through-slot 2012 is formed through the first sub-board 1601. Specifically, the third through-slot 2011 is a through-slot formed through the first conductive loop. For a detailed explanation, please refer to the description of the third and fourth through-slots shown above, which will not be repeated here. The second end of the connecting plate 1611 passes through the third through-slot 2011 and the fourth through-slot 2012 to achieve mechanical fixation between the first sub-board and the electrical connector. In order to form a resonator, the power supply component on the electrical connector and the conductive component on the second surface of the first sub-board need to be electrically isolated from the first conductive layer. Therefore, when the second end 1311 of the connecting plate 1611 passes through the third through slot 2011 and the fourth through slot 2012, there is a gap between the power supply component on the surface of the connecting plate 1611 and the first conductive loop, thereby making the power supply component electrically isolated from the first conductive loop. For an explanation of the electrical isolation between the power supply component and the first conductive loop, please refer to [link to relevant documentation]. Figure 15 The corresponding explanations will not be elaborated upon here.

[0116] The following describes the location of the conductive component shown in this embodiment. Specifically, the conductive component in this embodiment includes a first pin 1701, a conductive component body 1702, and a second pin 1703 connected in sequence. Unlike the previous embodiment, the first pin 1701, the conductive component body 1702, and the second pin 1703 shown in this embodiment are formed on the second surface of the first sub-board 1601 using CCL technology or etching technology. For a description of the second surface of the first sub-board 1601, please refer to the previous embodiment; specific details will not be repeated here. When the connecting plate 1611 and the first sub-board are mechanically connected, the electrical connection between the feeder component on the connecting plate 1611 and the first pin 1701 can be achieved through welding, hinge, insertion, crimping, etc., thereby forming an equivalent inductance between the series-connected feeder component and the conductive component. Since the conductive component body 1702 is located on the second surface of the first sub-plate 1601, the first sub-plate separates the conductive component body 1702 from the first conductive loop located on the first surface of the first sub-plate, thereby forming an equivalent capacitance between the conductive component body 1702 and the first conductive loop. Therefore, the series equivalent inductance and equivalent capacitance shown in this embodiment can form a resonator. For a detailed description of the resonator, please refer to the above embodiment; further details will not be repeated here.

[0117] To achieve electrical connection between the second pin 1703 and the first conductive loop, and to ensure that the first feed network successfully feeds the first radiating unit, the region 2020 of the first sub-board includes a metallized via 2101 extending through the first sub-board 1601 along the target direction Z. The second pin 1703 is electrically connected to the first conductive layer through the metallized via 2101 to form the first feed network. For an explanation of the metallized via and the first feed network feeding the first radiating unit, please refer to the above embodiment, which will not be elaborated further.

[0118] For an explanation of the beneficial effects of the resonator formed using the antenna module shown in this embodiment, please refer to the embodiments described above; specific details will not be repeated here. Furthermore, using the antenna module shown in this embodiment reduces the difficulty of mechanically fixing the connecting plate and the first sub-board, improving the assembly efficiency of the antenna module. Since the conductive components can be directly etched onto the second surface of the first sub-board, the reliability of the equivalent capacitance formed between the conductive components and the first conductive layer is improved, thereby enhancing the reliability of the antenna module.

[0119] In the above embodiments, the conductive component and the first conductive layer are located on two different surfaces of the first sub-board as an example. In this embodiment, the conductive component and the first conductive layer can be located on the same surface of the first sub-board. See also Figure 22 as well as Figure 23 As shown, where, Figure 22This is a second example diagram of the overall structure of the FSS module provided in this application. Figure 23 for Figure 22 The diagram shows an example of the radiation structure of the first sub-board in the FSS module. The antenna module shown in this embodiment includes a first radiating element, a second radiating element, a third radiating element, a first feed network, a second feed network, a third feed network, a reflector, a first radome, and a second antenna cover. For descriptions of the first radiating element, second radiating element, third radiating element, second feed network, third feed network, reflector, first radome, and second antenna cover, please refer to the above embodiment; specific details will not be repeated here. Compared to the above embodiment, the structure of the FSS included in the first feed network shown in this embodiment differs from the above embodiment. Specifically, the FSS shown in this embodiment includes multiple FSS modules. For a description of the arrangement of multiple FSS modules to form an FSS, please refer to [link to previous embodiment]. Figure 6 The corresponding explanations will not be elaborated upon here.

[0120] The FSS module 2300 specifically includes a first sub-board 2301, a first conductive layer 2302, a second sub-board 2303, and a second conductive layer 2304. For a description of the positions of the first sub-board 2301, the first conductive layer 2302, the second sub-board 2303, and the second conductive layer 2304, please refer to the above. Figure 6 as well as Figure 7 The corresponding descriptions are not repeated here. The electrical connector shown in this embodiment includes a connecting plate 2311. For a description of the material of the connecting plate 2311, please refer to the description of the dielectric plate above. The connector shown in this embodiment includes only one connecting plate 2311, which is "I" shaped. The surface of the connector includes a power supply component 2312. For a description of the power supply component, please refer to the description of the power supply component shown in the above embodiment. The first end of the connecting plate 2311 is connected to the second sub-board 2303 of the FSS module. For a detailed description of the connection, please refer to the description of the first connecting plate connecting to the second sub-board in the above embodiment. The second end of the connecting plate 2311 extends to the first surface of the first sub-board 2301. The first surface of the first sub-board 2301 also includes a first conductive layer. The first conductive layer specifically includes a first conductive loop 2401 and a first conductive module 2402 located within the first conductive loop 2401. For a detailed description of the first conductive layer, please refer to the above embodiment.

[0121] In region 2410 of the first sub-board 2301, a fifth through-slot 2411 is formed through the first conductive layer, and a sixth through-slot 2412 is formed through the first sub-board 2301. Specifically, the fifth through-slot 2411 is a through-slot formed through the first conductive loop. One end of the connecting plate 2311 and the second end of the power supply component 2312 are inserted into the fifth through-slot 2411 and the sixth through-slot 2412, so that there is a first gap between the second end of the power supply component 2312 and the first conductive layer. Based on this first gap, the second end of the power supply component 2312 can be electrically isolated from the first conductive layer. Specifically, the fifth through slot 2411 has a fifth orthographic projection on the first sub-board 2301, and the sixth through slot 2413 has a sixth orthographic projection on the first sub-board 2301. The sixth orthographic projection is located within the coverage area of ​​the fifth orthographic projection, and there is a gap between the fifth orthographic projection and the sixth orthographic projection. Therefore, when the connecting plate 2311 is inserted into the fifth through slot 2411 and the sixth through slot 2412, the electrical isolation between the power supply component 2312 on the connecting plate 2311 and the first conductive layer is effectively guaranteed.

[0122] The following describes the location of the conductive component shown in this embodiment. Specifically, the conductive component in this embodiment includes a first pin 2413, a conductive component body 2414, and a second pin 2415 connected in sequence. The first pin 2413, the conductive component body 2414, and the second pin 2415 shown in this embodiment are formed on the first surface of the first sub-board 2301 using CCL technology or etching technology, etc. For a description of the first surface of the first sub-board 2301, please refer to the above embodiment; specific details will not be repeated here. A first gap exists between the first conductive layer and the second end of the power supply component; a second gap 2432 exists between the first pin 2413 and the first conductive layer; and a third gap 2415 exists between the conductive component body 2414 and the first conductive layer. To form an equivalent inductance, when the connecting plate 2311 is inserted into the fifth through slot 2411 and the sixth through slot 2412, the second end of the power supply component 2312 is electrically connected to the first pin 2413 and electrically isolated from the first conductive layer by means of welding, hinge, plugging, crimping, etc.

[0123] Because there is a third gap 2415 between the conductive component body 2414 and the first conductive layer, an equivalent capacitance is formed between the conductive component body 2414 and the first conductive loop. Therefore, the series equivalent inductance and equivalent capacitance shown in this embodiment can form a resonator. For a detailed description of the resonator, please refer to the above embodiment; further details will not be repeated here. The region 2440 of the first sub-board shown in this embodiment includes a second pin 2415, which is electrically connected to the first conductive loop to ensure that the first feed network successfully feeds the first radiating unit. For an explanation of the first feed network feeding the first radiating unit, please refer to the above embodiment; further details will not be repeated here.

[0124] For an explanation of the beneficial effects of the resonator formed using the antenna module shown in this embodiment, please refer to the above embodiment; specific details will not be repeated here. Furthermore, in the antenna module shown in this embodiment, the electrical connectors and the first conductive layer are both located on the first surface of the first sub-board. This improves the reliability of the equivalent capacitance formed between the conductive connectors and the first conductive layer, thereby enhancing the reliability of the antenna module.

[0125] This application also provides an FSS, the structure of which can be found in [link to previous text]. Figure 4 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 13 , Figure 14 as well as Figure 15 As shown, or, the structure of the FSS can be found in [reference needed]. Figure 16 , Figure 17 , Figure 18 , Figure 19 , Figure 20 as well as Figure 21 As shown, or, the structure of the FSS can be found in [reference needed]. Figure 22 as well as Figure 23 As shown.

[0126] This application also provides a communication device, for which please refer to a detailed description. Figure 2 The corresponding explanations will not be elaborated upon here.

[0127] This application also provides a communication system. For a description of the structure of this communication system, please refer to [link / reference needed]. Figure 2 The corresponding explanations are not repeated here. The communication system includes a base station and one or more terminal devices located within the coverage area of ​​the base station. The base station includes an antenna module, the description of which is given in the above embodiments and will not be repeated here. Optionally, the terminal device shown in this embodiment may also include the antenna module shown in the above embodiments.

[0128] Those skilled in the art will readily understand that, in the several embodiments provided in this application, the disclosed systems, apparatuses, and devices can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual couplings, direct couplings, or communication connections may be indirect couplings or communication connections between devices or units through some interfaces, and may be electrical, mechanical, or other forms.

[0129] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0130] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

Claims

1. An antenna module, characterized in that, It includes a first radiating element, a second radiating element, and a frequency selective surface (FSS). The FSS is located between the first radiating element and the second radiating element. The first radiating element is used to operate in a first frequency band, and the second radiating element is used to operate in a second frequency band. The FSS is used to reflect electromagnetic waves located in the first frequency band and to transmit electromagnetic waves located in the second frequency band. The FSS includes a first sub-board, a first conductive layer, and an electrical connector. A first end of the electrical connector is electrically connected to the first radiating unit, and a second end of the electrical connector extends to the first sub-board. The first conductive layer is located on the surface of the first sub-board. The surface of the first sub-board also includes a conductive element. The conductive element includes a first pin, a conductive element body, and a second pin connected in sequence. The second end of the electrical connector is electrically connected to the first pin. There is a gap between the conductive element body and the first conductive layer. The second pin is electrically connected to the first conductive layer.

2. The antenna module according to claim 1, characterized in that, The FSS further includes a second sub-board located between the first sub-board and the first radiating unit. The surface of the second sub-board includes a second conductive layer. A first slot is formed through the second conductive layer, and a second slot is formed through the second sub-board. The electrical connector passes through the first slot and the second slot so that the second end of the electrical connector is electrically connected to the first pin.

3. The antenna module according to claim 2, characterized in that, The antenna module further includes a third radiating element, the FSS is located between the third radiating element and the second radiating element, the second conductive layer is electrically connected to the third radiating element, and there is a gap between the electrical connector and the second conductive layer. The third radiating element operates in a third frequency band, and electromagnetic waves in the third frequency band are reflected by the FSS.

4. The antenna module according to claim 2 or 3, characterized in that, The first slot has a first orthographic projection on the second sub-plate, and the second slot has a second orthographic projection on the second sub-plate. The second orthographic projection is located within the coverage area of ​​the first orthographic projection, and there is a gap between the first orthographic projection and the second orthographic projection.

5. The antenna module according to any one of claims 1 to 4, characterized in that, The first sub-board includes a first surface and a second surface that are positioned opposite each other. The first conductive layer is located on the first surface. The second end of the electrical connector extends to the second surface. The second surface includes the conductive element. The first sub-board is spaced between the conductive element body and the first conductive layer.

6. The antenna module according to claim 5, characterized in that, The electrical connector includes a first connecting plate and a second connecting plate connected to each other. The surface of the first connecting plate includes a power feeding element, and the surface of the second connecting plate includes a conductive element. A first end of the power feeding element is electrically connected to the first radiating unit, and a second end of the power feeding element is electrically connected to the first pin. The second connecting plate extends along the second surface, and the conductive element body is included between the second connecting plate and the second surface.

7. The antenna module according to claim 6, characterized in that, A first through-slot is formed through the first conductive layer, and a second through-slot is formed through the first sub-board. One end of the second connecting plate and the second pin pass through the first through-slot and the second through-slot. The second pin that passes through the first through-slot and the second through-slot is electrically connected to the first conductive layer.

8. The antenna module according to claim 6 or 7, characterized in that, A third through-slot is formed through the first conductive layer, and a fourth through-slot is formed through the first sub-board. One end of the first connecting plate and the second end of the power supply component pass through the third through-slot and the fourth through-slot. The second end of the power supply component that passes through the third through-slot and the fourth through-slot has a gap with the first conductive layer.

9. The antenna module according to claim 8, characterized in that, The third through slot has a third orthographic projection on the first sub-board, and the fourth through slot has a fourth orthographic projection on the first sub-board. The fourth orthographic projection is located within the coverage area of ​​the third orthographic projection, and there is a gap between the third orthographic projection and the fourth orthographic projection.

10. The antenna module according to any one of claims 1 to 4, characterized in that, The first sub-board includes a first surface and a second surface that are positioned opposite each other. The first conductive layer is located on the first surface. The second end of the electrical connector extends to the second surface. The electrical connector includes a connecting plate. The surface of the connecting plate includes a power feeding element. One end of the connecting plate is plugged into and connected to the first sub-board. The conductive element is formed on the second surface. The first end of the power feeding element is electrically connected to the first radiating unit. The second end of the power feeding element is electrically connected to the first pin.

11. The antenna module according to claim 10, characterized in that, A metallized via is provided through the first sub-board, and the second pin is electrically connected to the first conductive layer through the metallized via.

12. The antenna module according to claim 10 or 11, characterized in that, A third through-slot is formed through the first conductive layer, and a fourth through-slot is formed through the first sub-board. One end of the connecting plate and the second end of the power supply component pass through the third through-slot and the fourth through-slot. The second end of the power supply component that passes through the third through-slot and the fourth through-slot has a gap with the first conductive layer.

13. The antenna module according to any one of claims 1 to 4, characterized in that, The first conductive layer and the conductive element are both located on the first surface of the first sub-board. The second end of the electrical connector extends to the first surface. On the first surface, the second end of the electrical connector is electrically connected to the first pin. There is a gap between the conductive element body and the first conductive layer.

14. The antenna module according to claim 13, characterized in that, The electrical connector includes a connecting plate, the surface of which includes a power feeder. A first end of the power feeder is electrically connected to the first radiating unit, and a second end of the power feeder is electrically connected to the first pin. The first surface includes a first gap, a second gap, and a third gap. The first gap is located between the first conductive layer and the second end of the power feeder, the second gap is located between the first pin and the first conductive layer, and the third gap is located between the conductive body and the first conductive layer.

15. The antenna module according to claim 14, characterized in that, A fifth through slot is formed through the first conductive layer, and a sixth through slot is formed through the first sub-board. One end of the connecting plate and the second end of the power supply component are inserted into the fifth through slot and the sixth through slot, so that the second end of the power supply component and the first conductive layer have the first gap, and the second end of the power supply component is electrically connected to the first pin.

16. The antenna module according to claim 15, characterized in that, The fifth through slot has a fifth orthographic projection on the first sub-plate, and the sixth through slot has a sixth orthographic projection on the first sub-plate. The sixth orthographic projection is located within the coverage area of ​​the fifth orthographic projection, and there is a gap between the fifth orthographic projection and the sixth orthographic projection.

17. The antenna module according to any one of claims 1 to 16, characterized in that, The antenna module also includes a reflector. The first radiating element, the FSS, the second radiating element, and the reflector are arranged in sequence, and electromagnetic waves located in the second frequency band are reflected by the reflector.

18. The antenna module according to any one of claims 1 to 17, characterized in that, The electrically connected components and the first pin form an equivalent inductance, the spaced conductive body and the first conductive layer form an equivalent inductance, and the equivalent inductance and the equivalent capacitance connected in series form a resonator.

19. A frequency-selective surface, characterized in that, The frequency selective surface includes a first sub-board, a first conductive layer, and an electrical connector. A first end of the electrical connector is electrically connected to a radiating unit, and a second end of the electrical connector extends to the first sub-board. The first conductive layer is located on the surface of the first sub-board. The surface of the first sub-board also includes a conductive element. The conductive element includes a first pin, a conductive element body, and a second pin connected in sequence. The second end of the electrical connector is electrically connected to the first pin. There is a gap between the conductive element body and the first conductive layer. The second pin is electrically connected to the first conductive layer.

20. A communication device, characterized in that, The device includes a baseband module, a radio frequency module, and an antenna module as described in any one of claims 1-18, wherein the radio frequency module includes a transmitter and / or a receiver; The baseband module is used to send a first digital signal to the transmitter, the radio frequency module is used to convert the first digital signal into a first radio frequency signal, and the antenna module is used to convert the first radio frequency signal into a first electromagnetic wave and radiate it out. And / or, The antenna module is used to receive a second electromagnetic wave and convert the second electromagnetic wave into a second radio frequency signal. The receiver is used to convert the second radio frequency signal into a second digital signal and send the second digital signal to the baseband module.

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