5G RedCap terminal access master station equipment

Abstract

The invention relates to the technical field of telecommunication, and discloses 5G RedCap terminal access master station equipment, which comprises a shell, a first heat dissipation mechanism, a second heat dissipation mechanism and a 5G communication module, the temperature control board and the temperature control fins transmit heat dissipated by the circuit board and the communication assembly upwards, air is sucked from the air inlet through the circulating fan to take away the heat of the temperature control fins, the heat is discharged through the air outlet, and therefore air cooling heat dissipation is achieved. Then the switching assembly drives the semiconductor assembly to move in the second direction so that the semiconductor assembly can be inserted between the temperature control board and the temperature control fins, the heat dissipation effect is greatly enhanced through refrigeration of the semiconductor assembly, and the semiconductor assembly can conduct heating so as to be suitable for the extremely cold environment; therefore, the driving assembly drives the semiconductor assembly to move so as to switch between air cooling heat dissipation and semiconductor refrigeration or heating, and the switching device is suitable for different use conditions, so that the applicability and reliability of accessing the 5G RedCap terminal to the master station equipment are improved.

Description

Technical Field

[0001] This invention relates to the field of telecommunications technology, and in particular to a 5G RedCap terminal access master station device. Background Technology

[0002] Wireless remote communication modules are miniaturized communication devices that integrate radio frequency, baseband, and protocol processing functions. They achieve low power consumption, low cost, and high reliability remote data transmission through technologies such as 5G RedCap (lightweight 5G), and are widely used in fields such as industrial IoT, smart grids, video surveillance, and wearable devices.

[0003] With the rapid development of the Internet of Things (IoT), 5G technology, due to its high bandwidth, low latency, and massive connectivity, has become the core of digital transformation in various industries. However, with the improvement of chip computing power (such as supporting complex functions like 5G LAN, URLLC, and network slicing), the heat generation of 5G RedCap terminal access master station equipment has increased significantly. Furthermore, the wireless remote communication module in 5G RedCap terminal access master station equipment typically operates in a limited environment and cannot adapt to extreme environments. For example, when operating outside the limited range, internal structural damage, startup difficulties, and unstable operation may occur, potentially leading to complete failure. Existing 5G RedCap terminal access master station equipment typically relies on common heat dissipation devices such as circulating fans and temperature control boards for air cooling, which has limited heat dissipation effectiveness and cannot adapt to the large heat generation and extreme operating environments, greatly affecting the applicability and reliability of the device. Summary of the Invention

[0004] The purpose of this invention is to provide a 5G RedCap terminal access master station device that solves the problems of poor heat dissipation and inability to adapt to large heat generation and extreme usage environments in existing 5G RedCap terminal access master station devices.

[0005] To achieve the above objectives, the present invention provides a 5G RedCap terminal access master station device, which includes a shell, a first heat dissipation mechanism, a second heat dissipation mechanism, and a 5G communication module;

[0006] The outer casing has an installation cavity, and the top of the outer casing has an air inlet and an air outlet spaced apart along a first direction; both the air inlet and the air outlet are connected to the installation cavity.

[0007] The 5G communication module includes a circuit board and a communication component. The circuit board is fixed to the bottom of the mounting cavity, and the communication component is fixed to the upper surface of the circuit board. The communication component is used to realize 5G communication function.

[0008] The first heat dissipation mechanism includes a heat dissipation component, an elastic connection component, and a circulating fan; the circulating fan is disposed in the mounting cavity and fixedly connected to the inner side of the air inlet; the heat dissipation component includes a temperature control plate and temperature control fins arranged sequentially from bottom to top in a vertical direction; the temperature control plate is disposed above the circuit board and fixedly installed in the mounting cavity; at least part of the lower end of the temperature control fins is attached to the upper end of the temperature control plate, and the temperature control fins are elastically connected to the temperature control plate through the elastic connection component;

[0009] The second heat dissipation mechanism includes a switching component and a semiconductor component; the switching component is fixed in the mounting cavity; the semiconductor component is disposed on one side of the temperature control fin in the second direction and is movably connected to the switching component in the second direction; the switching component is used to drive the semiconductor component to move in the second direction, so that the semiconductor component can be inserted between the temperature control plate and the temperature control fin or moved to one side of the temperature control fin in the second direction.

[0010] The semiconductor component is used for cooling or heating;

[0011] The vertical direction, the first direction, and the second direction are all perpendicular to each other.

[0012] Furthermore, the temperature control fins include a fin portion and a first bonding portion connected from top to bottom; a plurality of heat dissipation fins are vertically spaced and fixed at the top of the fin portion, and the plurality of heat dissipation fins extend along a first direction; the outer diameter of the first bonding portion gradually decreases from top to bottom along the vertical direction.

[0013] The temperature control plate includes a main body and a second bonding part connected from bottom to top; the outer diameter of the second bonding part gradually decreases from bottom to top along the vertical direction;

[0014] The lower surface of the first bonding portion is bonded to the upper surface of the second bonding portion;

[0015] The body portion is provided with the elastic connecting components at both ends in the first direction and the second direction, and the body portion is elastically connected to the fin portion through the elastic connecting components;

[0016] The switching component is sleeved on the outer periphery of the first bonding portion, and the semiconductor component is located on one side of the first bonding portion in the second direction; and both the switching component and the semiconductor component are disposed between two adjacent elastic connecting components in the first direction.

[0017] Furthermore, the elastic connection assembly includes a first connector, a second connector, and a connecting spring;

[0018] The first connector is vertically arranged and fixed to the upper surface of the main body. A guide groove is provided on the top of the first connector, and the guide groove extends in the vertical direction.

[0019] The second connector is vertically arranged and fixed to the lower surface of the fin portion;

[0020] The connecting spring is vertically arranged and sleeved on the outer periphery of the first connecting member, and the two ends of the connecting spring are fixedly connected to the first connecting member and the second connecting member, respectively.

[0021] Furthermore, the switching assembly includes a fixed rod, a guide rod, a threaded rod, and a drive motor;

[0022] Two fixing rods are respectively fixed on both sides of the first fitting part in the second direction, and the fixing rods extend along the first direction; the guide rod and the threaded rod are respectively disposed on both sides of the first fitting part in the first direction, and the guide rod and the threaded rod both extend along the second direction; the two ends of the two fixing rods are respectively connected through the guide rod and the threaded rod, and the two ends of the threaded rod are rotatably connected to the fixing rod.

[0023] The drive motor is fixedly connected to one of the fixed rods, and the output end of the drive motor is fixedly connected to one end of the threaded rod for driving the threaded rod to rotate;

[0024] In the second direction, one end of the semiconductor component is sleeved on the outer periphery of the guide rod and slidably connected to the guide rod, and the other end is sleeved on the outer periphery of the threaded rod and screwed to the threaded rod.

[0025] Furthermore, the outer casing includes a main casing and a ventilation casing;

[0026] The main housing has the mounting cavity, and the top of the main housing has an opening that communicates with the mounting cavity; the ventilation housing is inserted into the mounting cavity through the opening;

[0027] The ventilation housing has a ventilation cavity, and the top of the ventilation housing has an air inlet and an air outlet, both of which are connected to the ventilation cavity;

[0028] The bottom of the ventilation housing is provided with multiple insertion slots that communicate with the ventilation cavity; the insertion slots are matched with the heat sinks, and the multiple heat sinks are slidably inserted into the multiple insertion slots one by one.

[0029] Furthermore, the semiconductor assembly includes a mounting bracket, a semiconductor wafer, and an extrusion piece;

[0030] The mounting bracket is movably connected to the switching assembly in a second direction, and a pressing member is fixed on the side surface of the mounting bracket opposite to the temperature control fin;

[0031] The semiconductor chip is fixedly mounted in the mounting frame, and the semiconductor chip is used for cooling or heating.

[0032] In the second direction, the thickness of the extruder gradually decreases in the direction away from the semiconductor wafer.

[0033] Furthermore, dustproof nets are installed on the outer sides of both the air inlet and the air outlet.

[0034] Furthermore, the communication component includes a card slot and a processor;

[0035] The card slot and the processor are electrically connected. The card slot is used to insert a SIM card, and the processor is used to implement 5G communication functions.

[0036] Furthermore, the communication components also include a 4G fallback module, a dual-mode switching chip, an optical module, and an expansion interface;

[0037] The 4G fallback module, dual-mode switching chip, optical module, and expansion interface are all electrically connected to the processor.

[0038] The outer casing has a first expansion hole, which communicates with the mounting cavity; the expansion interface extends out of the mounting cavity through the first expansion hole.

[0039] Furthermore, the 5G communication module also includes an extension cable and an antenna assembly;

[0040] The communication component further includes a first antenna interface, which is electrically connected to the processor; the housing has a second expansion hole, which communicates with the mounting cavity; the first antenna interface extends out of the mounting cavity through the second expansion hole.

[0041] The antenna assembly includes a mounting base, an antenna body, and a magnetic block;

[0042] The mounting base has a second antenna interface, and the two ends of the extension cable are respectively inserted into the first antenna interface and the second antenna interface; the antenna body is fixed to the top of the mounting base and electrically connected to the second antenna interface; the magnet is fixed to the bottom of the mounting base.

[0043] Compared with existing technologies, the 5G RedCap terminal access master station device provided by this invention has the following advantages:

[0044] This invention provides a 5G RedCap terminal access master station device, comprising a housing, a first heat dissipation mechanism, a second heat dissipation mechanism, and a 5G communication module. Heat dissipated from the circuit board and communication components is transferred upwards via a temperature control plate and temperature control fins arranged sequentially from bottom to top. External air is drawn in from the air inlet by a circulating fan to remove heat from the temperature control fins, and the hot air is discharged through the air outlet, thus achieving air cooling under normal conditions. Since the temperature control fins are elastically connected to the temperature control plate via an elastic connection component, a switching component drives a semiconductor component to move along a second direction, allowing the semiconductor component to be inserted between the temperature control plate and the temperature control fins. The cooling effect of the semiconductor component is greatly enhanced, enabling the 5G RedCap terminal access master station device to achieve heat dissipation under high heat generation and extreme conditions. Furthermore, the switching component can drive the semiconductor component to move to one side of the temperature control fins in the second direction to revert to air cooling, thereby switching between air cooling and semiconductor cooling to suit different usage scenarios. The semiconductor component can also generate heat to suit extremely cold environments, thus greatly improving the performance of the 5G... Applicability and reliability of RedCap terminal access to master station equipment. Attached Figure Description

[0045] Figure 1 This is a three-dimensional structural diagram of a 5G RedCap terminal access master station device according to an embodiment of the present invention;

[0046] Figure 2 This is an exploded view of a 5G RedCap terminal access master station device according to an embodiment of the present invention;

[0047] Figure 3 This is an exploded view of the ventilation housing, the first heat dissipation structure, and the second heat dissipation structure in a 5G RedCap terminal access master station device according to an embodiment of the present invention.

[0048] Figure 4 This is an exploded schematic diagram of the ventilation housing and temperature control fins in a 5G RedCap terminal access master station device according to an embodiment of the present invention;

[0049] Figure 5 This is an exploded view of the heat dissipation component and the elastic connection component in a 5G RedCap terminal access master station device according to an embodiment of the present invention.

[0050] Figure 6 This is a schematic diagram of the structure of the second heat dissipation mechanism in a 5G RedCap terminal access master station device according to an embodiment of the present invention;

[0051] Figure 7This is a schematic diagram of the circuit board and communication components in a 5G RedCap terminal access master station device according to an embodiment of the present invention;

[0052] Figure 8 This is a schematic diagram of the antenna assembly in a 5G RedCap terminal access master station device according to an embodiment of the present invention.

[0053] In the diagram, 100 represents the 5G RedCap terminal access main station equipment; 1 represents the outer casing; 10 represents the mounting cavity; 101 represents the air inlet; 102 represents the air outlet; 103 represents the opening; 104 represents the first expansion hole; 105 represents the opening; 11 represents the main housing; 12 represents the ventilation housing; 120 represents the ventilation cavity; 121 represents the plug slot; 2 represents the first heat dissipation mechanism; 21 represents the heat dissipation component; 211 represents the temperature control board; 2111 represents the main body; 2112 represents the second bonding part; 212 represents the temperature control fin; 2121 represents the fin part; 2122 represents the first bonding part; 2123 represents the heat sink; 213 represents the temperature sensor; 214 represents the silicone pad; 22 represents the elastic connection component; 221 represents the first connector; 222 represents the second connector; 223 represents the connecting spring. 1. Spring; 23. Circulating fan; 3. Second heat dissipation mechanism; 31. Switching component; 311. Fixing rod; 312. Guide rod; 313. Threaded rod; 32. Semiconductor component; 321. Mounting bracket; 322. Semiconductor wafer; 323. Extrusion part; 4. 5G communication module; 41. Circuit board; 42. Communication component; 421. Card slot; 422. Processor; 423. 4G fallback module; 424. Dual-mode switching chip; 425. Optical module; 426. Expansion interface; 427. First antenna interface; 43. Extension cable; 44. Antenna assembly; 441. Mounting base; 4410. Second antenna interface; 442. Antenna body; 443. Magnet; 5. Dustproof mesh; 6. Indicator light. Detailed Implementation

[0054] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0055] like Figures 1 to 8 As shown, a 5G RedCap terminal access master station device 100 according to an embodiment of the present invention includes a shell 1, a first heat dissipation mechanism 2, a second heat dissipation mechanism 3, and a 5G communication module 4.

[0056] The outer casing 1 has an installation cavity 10, and the top of the outer casing 1 has an air inlet 101 and an air outlet 102 spaced apart along the first direction X; the air inlet 101 and the air outlet 102 are both connected to the installation cavity 10.

[0057] The 5G communication module 4 includes a circuit board 41 and a communication component 42. The circuit board 41 is fixed to the bottom of the mounting cavity 10, and the communication component 42 is fixed to the upper surface of the circuit board 41. The communication component 42 is used to realize 5G communication function.

[0058] The first heat dissipation mechanism 2 includes a heat dissipation component 21, an elastic connection component 22, and a circulating fan 23; the circulating fan 23 is disposed in the mounting cavity 10 and fixedly connected to the inner side of the air inlet 101; the heat dissipation component 21 includes a temperature control plate 211 and temperature control fins 212 arranged sequentially from bottom to top in the vertical direction; the temperature control plate 211 is disposed above the circuit board 41 and fixedly installed in the mounting cavity 10; the lower end of the temperature control fins 212 is at least partially attached to the upper end of the temperature control plate 211, and the temperature control fins 212 are elastically connected to the temperature control plate 211 through the elastic connection component 22;

[0059] The second heat dissipation mechanism 3 includes a switching component 31 and a semiconductor component 32; the switching component 31 is fixed in the mounting cavity 10; the semiconductor component 32 is disposed on one side of the temperature control fin 212 in the second direction Y, and is movably connected to the switching component 31 along the second direction Y; the switching component 31 is used to drive the semiconductor component 32 to move along the second direction Y, so that the semiconductor component 32 can be inserted between the temperature control plate 211 and the temperature control fin 212 or moved to one side of the temperature control fin 212 in the second direction Y;

[0060] The semiconductor component 32 is used for cooling or heating;

[0061] Wherein, the vertical direction, the first direction X, and the second direction Y are mutually perpendicular.

[0062] Based on the above technical solution, the heat emitted by the circuit board 41 and communication component 42 is transferred upwards by the temperature control plate 211 and temperature control fins 212 arranged sequentially from bottom to top. External air is drawn in from the air inlet 101 by the circulating fan 23 to remove the heat from the temperature control fins 212, and the hot air is discharged through the air outlet, thus achieving air cooling under normal conditions. Since the temperature control fins 212 are elastically connected to the temperature control plate 211 via the elastic connection component 22, the semiconductor component 32 is driven to move along the second direction Y by the switching component 31, allowing the semiconductor component 32 to be inserted between the temperature control plate 211 and the temperature control fins 212. The semiconductor component 32 is used for cooling to greatly enhance the heat dissipation effect, enabling the 5GRedCap terminal access master station device 100 to dissipate heat under high heat generation and extreme conditions. The switching component 31 can drive the semiconductor component 32 to move to one side of the temperature control fin 212 in the second direction Y to restore air cooling, thereby realizing the switching between air cooling and semiconductor cooling to suit different usage conditions. The semiconductor component 32 can also generate heat to suit extremely cold environments, thereby greatly improving the applicability and reliability of the 5GRedCap terminal access master station device 100.

[0063] Preferably, such as Figure 3 As shown, a temperature sensor 213 is fixed on the upper surface of the temperature control board 211. The temperature sensor 213 monitors the temperature of the temperature control board 211 in real time to determine whether semiconductor cooling needs to be turned on.

[0064] Preferably, such as Figure 3 As shown, a silicone grease pad 214 is fixed on the lower surface of the temperature control board 211, which can improve the heat conduction efficiency between the temperature control board 211 and the communication module 4.

[0065] Furthermore, such as Figure 2 , Figure 3 and Figure 5 As shown, in order to facilitate the configuration of the switching component 31 and the semiconductor component 32, and to avoid interference between the switching component 31 and the semiconductor component 32 and the elastic connection component 22;

[0066] The temperature control fin 212 includes a fin portion 2121 and a first bonding portion 2122 connected from top to bottom; a plurality of heat dissipation fins 2123 are vertically spaced and fixed at the top of the fin portion 2121, and the plurality of heat dissipation fins 2123 extend along the first direction X; the outer diameter of the first bonding portion 2122 gradually decreases from top to bottom along the vertical direction.

[0067] The temperature control plate 211 includes a body part 2111 and a second bonding part 2112 connected from bottom to top; the outer diameter of the second bonding part 2112 gradually decreases from bottom to top along the vertical direction;

[0068] The lower surface of the first bonding portion 2122 is bonded to the upper surface of the second bonding portion 2112;

[0069] The body portion 2111 is provided with the elastic connection component 22 at both ends in the first direction X and the second direction Y, and the body portion 2111 is elastically connected to the fin portion 2121 through the elastic connection component 22.

[0070] The switching component 31 is sleeved on the outer periphery of the first bonding portion 2122, and the semiconductor component 32 is located on one side of the first bonding portion 2122 in the second direction; and the switching component 31 and the semiconductor component 32 are both disposed between two adjacent elastic connecting components 22 in the first direction X.

[0071] Furthermore, such as Figure 2 , Figure 3 and Figure 5 As shown, to specifically achieve the elastic connection between the temperature control plate 211 and the temperature control fins 212, the elastic connection assembly 22 includes a first connector 221, a second connector 222, and a connecting spring 223.

[0072] The first connector 221 is vertically arranged and fixed on the upper surface of the main body 2111. A guide groove 2210 is provided on the top of the first connector 221, and the guide groove 2210 extends in the vertical direction.

[0073] The second connector 222 is vertically arranged and fixed to the lower surface of the fin portion 2121;

[0074] The connecting spring 223 is vertically arranged and sleeved on the outer periphery of the first connecting member 221. The two ends of the connecting spring 223 are fixedly connected to the first connecting member 221 and the second connecting member 222, respectively.

[0075] Furthermore, such as Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, the switching component 31 drives the semiconductor component 32 in a specific way; the switching component 31 includes a fixed rod 311, a guide rod 312, a threaded rod 313 and a drive motor (not shown in the figure);

[0076] Two fixing rods are respectively fixed on both sides of the first fitting part 2122 in the second direction Y, and the fixing rods 311 extend along the first direction X; the guide rod 312 and the threaded rod 313 are respectively disposed on both sides of the first fitting part 2122 in the first direction X, and both the guide rod 312 and the threaded rod 313 extend along the second direction Y; the two ends of the two fixing rods 311 are respectively connected through the guide rod 312 and the threaded rod 313, and both ends of the threaded rod 313 are rotatably connected to the fixing rods 311;

[0077] The drive motor is fixedly connected to one of the fixed rods 311, and the output end of the drive motor is fixedly connected to one end of the threaded rod 313 for driving the threaded rod 313 to rotate.

[0078] In the second direction Y, one end of the semiconductor component 32 is sleeved on the outer periphery of the guide rod 312 and slidably connected to the guide rod 312, and the other end is sleeved on the outer periphery of the threaded rod 313 and screwed to the threaded rod 313.

[0079] Furthermore, such as Figure 2 , Figure 3 and Figure 4 As shown, the outer casing 1 includes a main casing 11 and a ventilation casing 12;

[0080] The main housing 11 has the mounting cavity 10, and the top of the main housing 11 has an opening 103, which communicates with the mounting cavity 10; the ventilation housing 12 is inserted into the mounting cavity 10 through the opening 103.

[0081] The ventilation housing 12 has a ventilation cavity 120, and the top of the ventilation housing 12 has an air inlet 101 and an air outlet 102, both of which are connected to the ventilation cavity 120.

[0082] The bottom of the ventilation housing 12 is provided with a plurality of insertion slots 121 that communicate with the ventilation cavity 120; the insertion slots 121 are matched with the heat sinks 2123, and the plurality of heat sinks 2123 are slidably inserted into the plurality of insertion slots 121 in a one-to-one correspondence; so as to ensure that the temperature control fins 212 move vertically during the movement process, thereby ensuring that the temperature control fins 212 can maintain a relatively stable horizontal position after the semiconductor cooling is switched back to air cooling, thereby ensuring the effect of air cooling.

[0083] Furthermore, such as Figure 6 As shown, the semiconductor component 32 includes a mounting bracket 321, a semiconductor wafer 322, and an extruder 323;

[0084] The mounting bracket 321 is movably connected to the switching assembly 31 along the second direction Y, and a pressing member 323 is fixed on the side surface of the mounting bracket 321 opposite to the temperature control fin 212.

[0085] The semiconductor chip 322 is fixedly installed in the mounting bracket 321, and the semiconductor chip 322 is used for cooling or heating.

[0086] In the second direction Y, the thickness of the extruder 323 gradually decreases in the direction away from the semiconductor wafer 322; the extruder 323 facilitates the insertion of the mounting bracket 321 between the temperature control plate 211 and the temperature control fin 212.

[0087] Furthermore, such as Figure 4 As shown, dustproof nets 5 are installed on the outer sides of both the air inlet 101 and the air outlet 102 to prevent dust from accumulating in the mounting cavity 10.

[0088] Furthermore, such as Figure 7 As shown, this is a specific implementation of the communication function of the communication component 42; the communication component 42 includes a card slot 421 and a processor 422;

[0089] The card slot 421 and the processor 422 are electrically connected. The card slot 421 is used to insert a SIM card, and the processor 422 is used to implement 5G communication functions.

[0090] Furthermore, such as Figure 2 and Figure 7 As shown, to further expand the functionality of the communication component, the communication component 42 also includes a 4G fallback module 423, a dual-mode switching chip 424, an optical module 425, and an expansion interface 426.

[0091] The 4G fallback module 423, dual-mode switching chip 424, optical module 425, and expansion interface 426 are all electrically connected to the processor 422. The 4G fallback module 423 enables 4G data transmission in the event of 5G or fiber optic failure. The optical module 425 enables data transmission via fiber optic. The dual-mode switching chip 424 can intelligently switch between wireless communication and fiber optic communication, thereby improving applicability.

[0092] The outer casing 1 has a first expansion hole 104, which communicates with the mounting cavity 10; the expansion interface 426 extends out of the mounting cavity through the first expansion hole 104.

[0093] Furthermore, such as Figure 1 , Figure 2 , Figure 7 and Figure 8As shown, to optimize the signal reception performance of the 5G communication module 4, the 5G communication module 4 also includes an extension line 43 and an antenna assembly 44;

[0094] The communication component 42 further includes a first antenna interface 427, which is electrically connected to the processor 422; the housing 1 has a second expansion hole 105, which communicates with the mounting cavity 10; the first antenna interface 427 extends out of the mounting cavity 10 through the second expansion hole 105.

[0095] The antenna assembly 44 includes a mounting base 441, an antenna body 442, and a magnet 443;

[0096] The mounting base 441 has a second antenna interface 4410. The two ends of the extension cable 43 are respectively inserted into the first antenna interface 427 and the second antenna interface 4410. The antenna body 442 is fixed to the top of the mounting base 441 and electrically connected to the second antenna interface 4410. The magnet 443 is fixed to the bottom of the mounting base 441, so that the mounting base 441 can be magnetically attracted to the surface of the metal part.

[0097] Preferably, the mounting base 441 has a plurality of mounting lugs spaced circumferentially along its bottom periphery, which can be used to stably mount the mounting base 441 on various surfaces by means of fixing screws.

[0098] Preferably, an indicator light is also fixed on the outer surface of the housing 1, and the indicator light is electrically connected to the processor 422 to indicate the working status of the processor 422.

[0099] The working process of this invention is as follows: a SIM card is inserted through the card slot 421, and 5G communication is realized through the processor 422. Heat is transferred to the temperature control fins 212 and the ventilation cavity 120 through the temperature control plate 211 and temperature control fins 212.

[0100] The circulating fan 23 is activated to draw in outside air from the air inlet 101. The outside air flows through the ventilation cavity 120 to carry away the heat from the heat sink 2123 inserted in the insertion slot 121. The heated air is discharged from the air outlet 102 to achieve air cooling.

[0101] The drive motor is started, which drives the threaded rod 313 to rotate, thereby moving the mounting bracket 321 along the second direction Y, so that the mounting bracket 321 is inserted between the temperature control fin 212 and the temperature control plate 211, and the semiconductor chip 322 is activated to perform cooling, so as to achieve semiconductor cooling; when it is necessary to switch back to air cooling, the drive motor is reversed, so that the mounting bracket 321 moves along the second direction Y to one side of the temperature control fin 212, and the temperature control fin 212 returns to its original position against the top of the temperature control plate 211 under the tension of the connecting spring 223.

[0102] In summary, this embodiment of the invention provides a 5G RedCap terminal access master station device 100, which includes a housing 1, a first heat dissipation mechanism 2, a second heat dissipation mechanism 3, and a 5G communication module 4. The heat dissipated by the circuit board 41 and communication components 42 is transferred upwards by a temperature control plate 211 and temperature control fins 212 arranged sequentially from bottom to top. External air is drawn in from the air inlet 101 by a circulating fan 23 to remove the heat from the temperature control fins 212, and the hot air is discharged through the air outlet, thus achieving air cooling under normal conditions. Since the temperature control fins 212 are elastically connected to the temperature control plate 211 via the elastic connection component 22, the semiconductor component 32 is driven to move along the second direction Y by the switching component 31, allowing the semiconductor component 32 to be inserted between the temperature control plate 211 and the temperature control fins 212. The cooling effect of the semiconductor component 32 is greatly enhanced, thus improving the heat dissipation of the 5G terminal access master station 4. The RedCap terminal access master station equipment 100 can achieve heat dissipation under high heat generation and extreme conditions; and the switching component 31 can drive the semiconductor component 32 to move to one side of the temperature control fin 212 in the second direction Y, so as to restore air cooling, thereby realizing the switching between air cooling and semiconductor cooling to suit different usage conditions; and the semiconductor component 32 can generate heat to suit extremely cold environments, thereby greatly improving the applicability and reliability of the 5G RedCap terminal access master station equipment 100.

[0103] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A 5G RedCap terminal access master station device, characterized in that, It includes a housing, a first heat dissipation mechanism, a second heat dissipation mechanism, and a 5G communication module; The outer casing has an installation cavity, and the top of the outer casing has an air inlet and an air outlet spaced apart along a first direction; both the air inlet and the air outlet are connected to the installation cavity. The 5G communication module includes a circuit board and a communication component. The circuit board is fixed to the bottom of the mounting cavity, and the communication component is fixed to the upper surface of the circuit board. The communication component is used to realize 5G communication function. The first heat dissipation mechanism includes a heat dissipation component, an elastic connection component, and a circulating fan; the circulating fan is disposed in the mounting cavity and fixedly connected to the inner side of the air inlet; the heat dissipation component includes a temperature control plate and temperature control fins arranged sequentially from bottom to top in a vertical direction; the temperature control plate is disposed above the circuit board and fixedly installed in the mounting cavity; at least part of the lower end of the temperature control fins is attached to the upper end of the temperature control plate, and the temperature control fins are elastically connected to the temperature control plate through the elastic connection component; The second heat dissipation mechanism includes a switching component and a semiconductor component; the switching component is fixedly disposed in the mounting cavity; The semiconductor component is disposed on one side of the temperature control fin in the second direction and is movably connected to the switching component in the second direction; the switching component is used to drive the semiconductor component to move in the second direction so that the semiconductor component can be inserted between the temperature control plate and the temperature control fin or moved to one side of the temperature control fin in the second direction. The semiconductor component is used for cooling or heating; The vertical direction, the first direction, and the second direction are all perpendicular to each other.

2. The 5G RedCap access master station device as described in claim 1, characterized in that, The temperature control fins include a fin portion and a first bonding portion connected from top to bottom; a plurality of heat dissipation fins are vertically spaced and fixed at the top of the fin portion, and the plurality of heat dissipation fins extend along a first direction; the outer diameter of the first bonding portion gradually decreases from top to bottom along the vertical direction; The temperature control plate includes a main body and a second bonding part connected from bottom to top; the outer diameter of the second bonding part gradually decreases from bottom to top along the vertical direction; The lower surface of the first bonding portion is bonded to the upper surface of the second bonding portion; The body portion is provided with the elastic connecting components at both ends in the first direction and the second direction, and the body portion is elastically connected to the fin portion through the elastic connecting components; The switching component is sleeved on the outer periphery of the first bonding portion, and the semiconductor component is located on one side of the first bonding portion in the second direction; and both the switching component and the semiconductor component are disposed between two adjacent elastic connecting components in the first direction.

3. The 5G RedCap access master station device as described in claim 2, characterized in that, The elastic connection assembly includes a first connector, a second connector, and a connecting spring; The first connector is vertically arranged and fixed to the upper surface of the main body. A guide groove is provided on the top of the first connector, and the guide groove extends in the vertical direction. The second connector is vertically arranged and fixed to the lower surface of the fin portion; The connecting spring is vertically arranged and sleeved on the outer periphery of the first connecting member, and the two ends of the connecting spring are fixedly connected to the first connecting member and the second connecting member, respectively.

4. The 5G RedCap access master station device as described in claim 2, characterized in that, The switching assembly includes a fixed rod, a guide rod, a threaded rod, and a drive motor; Two fixing rods are respectively fixed on both sides of the first fitting part in the second direction, and the fixing rods extend along the first direction; the guide rod and the threaded rod are respectively disposed on both sides of the first fitting part in the first direction, and the guide rod and the threaded rod both extend along the second direction; the two ends of the two fixing rods are respectively connected through the guide rod and the threaded rod, and the two ends of the threaded rod are rotatably connected to the fixing rod. The drive motor is fixedly connected to one of the fixed rods, and the output end of the drive motor is fixedly connected to one end of the threaded rod for driving the threaded rod to rotate; In the second direction, one end of the semiconductor component is sleeved on the outer periphery of the guide rod and slidably connected to the guide rod, and the other end is sleeved on the outer periphery of the threaded rod and screwed to the threaded rod.

5. The 5G RedCap access master station device as described in claim 2, characterized in that, The outer casing includes a main casing and a ventilation casing; The main housing has the mounting cavity, and the top of the main housing has an opening that communicates with the mounting cavity; the ventilation housing is inserted into the mounting cavity through the opening; The ventilation housing has a ventilation cavity, and the top of the ventilation housing has an air inlet and an air outlet, both of which are connected to the ventilation cavity; The bottom of the ventilation housing is provided with multiple insertion slots that communicate with the ventilation cavity; the insertion slots are matched with the heat sinks, and the multiple heat sinks are slidably inserted into the multiple insertion slots one by one.

6. The 5G RedCap access master station device as described in claim 1, characterized in that, The semiconductor assembly includes a mounting bracket, a semiconductor wafer, and an extrusion. The mounting bracket is movably connected to the switching assembly in a second direction, and a pressing member is fixed on the side surface of the mounting bracket opposite to the temperature control fin; The semiconductor chip is fixedly mounted in the mounting frame, and the semiconductor chip is used for cooling or heating. In the second direction, the thickness of the extruder gradually decreases in the direction away from the semiconductor wafer.

7. The 5G RedCap access master station device as described in claim 1, characterized in that, Dustproof nets are installed on the outside of both the air inlet and the air outlet.

8. The 5G RedCap access master station device as described in claim 1, characterized in that, The communication components include a card slot and a processor; The card slot and the processor are electrically connected. The card slot is used to insert a SIM card, and the processor is used to implement 5G communication functions.

9. The 5G RedCap access master station device as described in claim 8, characterized in that, The communication components also include a 4G fallback module, a dual-mode switching chip, an optical module, and an expansion interface; The 4G fallback module, dual-mode switching chip, optical module, and expansion interface are all electrically connected to the processor. The outer casing has a first expansion hole, which communicates with the mounting cavity; the expansion interface extends out of the mounting cavity through the first expansion hole.

10. The 5G RedCap access master station device as described in claim 8, characterized in that, The 5G communication module also includes an extension cable and an antenna assembly; The communication component further includes a first antenna interface, which is electrically connected to the processor; the housing has a second expansion hole, which communicates with the mounting cavity; the first antenna interface extends out of the mounting cavity through the second expansion hole. The antenna assembly includes a mounting base, an antenna body, and a magnetic block; The mounting base has a second antenna interface, and the two ends of the extension cable are respectively inserted into the first antenna interface and the second antenna interface; the antenna body is fixed to the top of the mounting base and electrically connected to the second antenna interface; the magnet is fixed to the bottom of the mounting base.

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