A device for forming through holes in FPC flexible circuit boards

By using a combination of positioning protrusions and flattening rollers with air control rails in the FPC flexible circuit board through-hole forming device, the curling problem of the circuit board during processing was solved, and high-quality forming of the through holes was achieved.

CN120881869BActive Publication Date: 2026-03-06DONGGUAN XINXIONG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510948399.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-07-10
Publication Date
2026-03-06
Estimated Expiration
2045-07-10

AI Technical Summary

Technical Problem

During the processing of vias in FPC flexible circuit boards, internal stress causes curling, making it difficult for the vacuum adsorption platform to keep the board flat, resulting in deviations in the position of the vias and affecting the molding quality.

Method used

An FPC flexible circuit board through-hole forming device is adopted. The circuit board is initially restricted by positioning protrusions, flattened by flattening rollers and protective wheels, and fixed by air control rails and air control rods to ensure its flattened state.

Benefits of technology

This effectively avoids deviations in the position of the vias, improves molding quality, and ensures the flatness and stability of the FPC flexible circuit board during processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to the field of circuit board manufacturing, and more particularly to a via forming device for FPC flexible circuit boards. The device includes a forming stage, an opening mechanism at the rear upper end of the forming stage, a vacuum adsorption platform mounted at the front upper end of the forming stage, an air control component inside the vacuum adsorption platform, a pad attached to the upper end of the vacuum adsorption platform, guide holes on the pad aligning with air holes on the vacuum adsorption platform, a fixed corner attached to the corner of the pad, the lower end of the fixed corner being fixed to the vacuum adsorption platform, two symmetrically extending positioning protrusions extending from the upper end of the pad, the two positioning protrusions being adapted to the vias on the FPC flexible circuit board, and a pushing component at the middle upper end of the forming stage, with a pressure seat connected to the pushing component. This invention improves the forming quality of vias and ensures smooth flattening of the FPC flexible circuit board.
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Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing, and more particularly to a device for forming through holes in FPC flexible circuit boards. Background Technology

[0002] Flexible printed circuit boards (FPCs) are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. FPCs and integrated circuits have a complementary and collaborative relationship in electronic devices; therefore, the quality of the FPCs is closely related to their performance during integrated circuit manufacturing.

[0003] When processing vias in FPC (Flexible Printed Circuit) boards, a vacuum adsorption platform is typically used to fix the FPC board before processing the vias. However, in actual processing, the FPC board itself has internal stress and is prone to curling. This makes it difficult for the vacuum adsorption platform to ensure that the FPC board is flat during adsorption and fixation, resulting in deviations in the position of the subsequently processed vias and seriously affecting the forming quality of the vias. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of the prior art by proposing an FPC flexible circuit board via forming device.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: an FPC flexible circuit board via forming device, comprising a forming stage, an opening mechanism provided at the upper rear of the forming stage, a vacuum adsorption platform installed at the upper front of the forming stage, an air control component provided inside the vacuum adsorption platform, a pad attached to the upper end of the vacuum adsorption platform, guide holes on the pad being aligned with air holes on the vacuum adsorption platform, a fixed plate corner attached to the corner of the pad, and the lower end of the fixed plate corner being fixed to the vacuum adsorption platform. The upper end of the pad has two symmetrically extending positioning protrusions, which are adapted to the through holes on the FPC flexible circuit board. A pushing member is provided in the middle of the upper end of the forming table, and a pressure seat is connected to the pushing member. A roller seat is elastically installed at the lower end of the pressure seat, and a flattening roller is installed inside the roller seat. The total height of the pad and the FPC flexible circuit board is the same as the height of the flattening roller from the vacuum adsorption platform. Protective wheels are fitted and installed at the front and rear edges of the upper end of the vacuum adsorption platform, and the protective wheels are connected to the roller seat.

[0006] Preferably, the upper end of the roller seat has two straight guide pillars extending symmetrically, and the two ends of the pressure seat are slidably installed on the outer surfaces of the two straight guide pillars, and the upper ends of the straight guide pillars are coaxially fitted with limit caps.

[0007] Preferably, a pressure roller spring is wound around the outside of the straight guide post, the lower end of the pressure roller spring is fixed to the roller seat, the upper end of the pressure roller spring is fixed to the lower end of the pressure seat, and two wheel frames extend symmetrically from the lower end of the roller seat, with the protective wheel installed at the end of the wheel frame.

[0008] Preferably, the pusher includes a support frame fixedly installed at the upper middle part of the forming table, a threaded rod rotatably installed at the middle of the front end face of the support frame, a push seat screwed onto the outer surface of the threaded rod, an extension frame fixedly installed at both the upper and lower ends of the push seat, a push roller frame extending from the front end of the upper extension frame, and the end of the push roller frame being fixed to the pressure seat.

[0009] Preferably, a servo motor is installed through the side of the support frame, the output end of the servo motor is fixed to the threaded rod, and guide rails extend from the upper and lower edges of the front end face of the support frame. Slide seats are slidably installed on the outer surfaces of the two guide rails, and the rear ends of the two extension frames are respectively fixed to the front ends of the two slide seats.

[0010] Preferably, the gas control component includes multiple semi-circular sleeves evenly distributed and fixedly installed on the inner top surface of the vacuum adsorption platform. Multiple gas control rods are fitted inside each of the multiple semi-circular sleeves. The gas control rods are rotatably connected to the vacuum adsorption platform and extend through the rear end face of the vacuum adsorption platform. Multiple gas control holes are opened through the outer surface of the gas control rods and the inner surface of the semi-circular sleeves. The gas control holes on the semi-circular sleeves are aligned with the gas holes on the vacuum adsorption platform, and the gas control holes on the gas control rods are offset from the gas control holes on the semi-circular sleeves by ninety degrees.

[0011] Preferably, a control rod gear is coaxially embedded at the rear end of the control rod, a control rod tooth plate meshes with the side of the control rod gear, a control plate wheel is installed at the rear end of the control rod tooth plate, two fixed reinforcing frames are fixedly installed at the front end of the lower extension frame, and a control rod rail is installed at the front end of each of the two fixed reinforcing frames. The two control rod rails are arranged in parallel, and the control plate wheel is located between the two control rod rails.

[0012] Preferably, each of the two air control rails has multiple reinforcing ears extending from opposite sides. The ends of the reinforcing ears are fixed to the fixed reinforcing frames. A T-shaped guide seat is slidably installed inside the control rod tooth plate. The T-shaped guide seat extends through the lower end of the control rod tooth plate. Two fixed frames are symmetrically fixed to the sides of the T-shaped guide seat. The ends of the fixed frames are fixed to the vacuum adsorption platform.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. Place the FPC flexible circuit board on the pad. At this time, the two positioning protrusions on the pad are inserted into the through holes of the FPC flexible circuit board, and the upper end face of the positioning protrusions is coplanar with the upper end face of the FPC flexible circuit board to initially restrict the FPC flexible circuit board. Then, the moving pressure seat drives the flattening roller to move towards the position of the FPC flexible circuit board. At the same time, the protective wheel rolls on the vacuum adsorption platform to limit the height of the flattening roller from the vacuum adsorption platform, so that the flattening roller can roll over the FPC flexible circuit board to gradually flatten the FPC flexible circuit board. This allows the FPC flexible circuit board to be flattened and adsorbed and fixed by the vacuum adsorption platform to avoid deviation in the position of the through holes after subsequent processing, thereby improving the forming quality of the through holes.

[0015] 2. As the pressure seat moves the flattening roller toward the location of the FPC flexible circuit board, the air control rail moves simultaneously. The inclined section of the air control rail passes through multiple control rollers in sequence. During the process of the flattening roller flattening the FPC flexible circuit board, the inclined section of the air control rail pushes the control rollers, causing the control rod tooth plate to move downwards. This drives the control rod gear to rotate, allowing the air control rod to rotate 90 degrees. This aligns the air control holes on the air control rod with the air holes on the vacuum adsorption platform, generating suction on the corresponding part of the vacuum adsorption platform to adsorb and fix the flattened part of the FPC flexible circuit board. This process continues until the entire FPC flexible circuit board is adsorbed and fixed. This method of flattening and adsorbing simultaneously gradually adsorbs and fixes the entire FPC flexible circuit board, effectively avoiding the phenomenon where the vacuum adsorption platform adsorbs and fixes the entire FPC flexible circuit board at once, making it difficult for the subsequent flattening rollers to flatten the FPC flexible circuit board. This effectively ensures the smooth flattening operation of the FPC flexible circuit board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a through-hole forming device for FPC flexible circuit boards according to the present invention.

[0017] Figure 2 This is a schematic diagram of the support frame of the through-hole forming device for FPC flexible circuit board according to the present invention;

[0018] Figure 3 This is a schematic diagram of the vacuum adsorption platform of the FPC flexible circuit board through-hole forming device of the present invention.

[0019] Figure 4 This invention relates to a device for forming through-holes in an FPC (Flexible Printed Circuit) board. Figure 1 Enlarged view of A in the middle;

[0020] Figure 5 This invention relates to a device for forming through-holes in an FPC (Flexible Printed Circuit) board. Figure 2Enlarged view of B in the middle;

[0021] Figure 6 This is a schematic diagram of the internal top surface of the vacuum adsorption platform of the FPC flexible circuit board through-hole forming device of the present invention.

[0022] Figure 7 This is a schematic diagram of the rear end of the air control rod of the FPC flexible circuit board through-hole forming device of the present invention.

[0023] Figure 8 This is a schematic diagram of the air control rail of the FPC flexible circuit board through-hole forming device of the present invention;

[0024] Figure 9 This is a view of the FPC flexible circuit board through-hole forming device of the present invention.

[0025] Figure 10 This is an exploded view of the FPC flexible circuit board in the FPC flexible circuit board through-hole forming device of the present invention.

[0026] In the diagram: 1. Forming table; 2. Vacuum adsorption platform; 3. Opening mechanism; 4. Support frame; 5. Flattening roller; 6. Pressure seat; 7. Push roller frame; 8. Guide rail; 9. Push seat; 10. Slide seat; 11. Threaded rod; 12. Servo motor; 13. Fixed reinforcement frame; 14. Extension frame; 15. Air control rod; 16. Control rod gear; 17. Control rod tooth plate; 18. Control plate wheel; 19. Fixed frame; 20. T-shaped guide seat; 21. Air control rail; 22. Air control hole; 23. Semi-circular sleeve; 24. Pad plate; 25. Straight guide post; 26. Limit cap; 27. Wheel frame; 28. Protective wheel; 29. ​​Pressure roller spring; 30. Positioning protrusion; 31. Fixed plate angle; 32. Roller seat; 33. Reinforcing ear; 34. FPC flexible circuit board. Detailed Implementation

[0027] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0028] like Figures 1-10The device shown is an FPC flexible circuit board via forming device, including a forming stage 1. An opening mechanism 3 is provided at the rear upper end of the forming stage 1, and a vacuum adsorption platform 2 is installed at the front upper end of the forming stage 1. Since the use of the opening mechanism 3 to process vias in the FPC flexible circuit board 34 and the vacuum adsorption platform 2 to adsorb and fix the FPC flexible circuit board 34 using vacuum suction are existing technologies and have been widely used, they are not described in detail here. The vacuum adsorption platform 2 has an internal gas control component, and a pad 24 is attached to the upper end of the vacuum adsorption platform 2. The pad 24 can hold the FPC flexible circuit board... The plate 34 is supported to prevent deformation during the processing of the through holes. The guide holes on the pad 24 are aligned with the air holes on the vacuum adsorption platform 2. A fixed plate angle 31 is fitted at the corner of the pad 24 to position the pad 24, aligning the guide holes on the pad 24 with the air holes on the vacuum adsorption platform 2, so as to facilitate the adsorption and fixation of the FPC flexible circuit board 34. The lower end of the fixed plate angle 31 is fixed to the vacuum adsorption platform 2. Two positioning protrusions 30 extend symmetrically from the upper end of the pad 24. The two positioning protrusions 30 are adapted to the through holes on the FPC flexible circuit board 34 to hold the FPC flexible circuit board 34 in place. The plate 34 is placed on the pad 24. At this time, the two positioning protrusions 30 on the pad 24 are inserted into the through holes on the FPC flexible circuit board 34, and the upper end face of the positioning protrusion 30 is coplanar with the upper end face of the FPC flexible circuit board 34, so as to initially restrict the FPC flexible circuit board 34. This can position the FPC flexible circuit board 34 at the processing station and ensure that the FPC flexible circuit board 34 will not shift when the flattening roller 5 rolls over it. A pusher is provided at the middle of the upper end of the forming table 1. A pressure seat 6 is connected to the pusher. The lower end of the pressure seat 6 is elastically mounted with Roller seat 32, inside which a flattening roller 5 is installed. Roller seat 32 serves to support the flattening roller 5. The total height of pad 24 and FPC flexible circuit board 34 is the same as the height of flattening roller 5 from vacuum adsorption platform 2, which can ensure that flattening roller 5 will not excessively squeeze FPC flexible circuit board 34 when it rolls over it. Protective wheels 28 are fitted to the front and rear edges of the upper end of vacuum adsorption platform 2. Protective wheels 28 are connected to roller seat 32 and roll on vacuum adsorption platform 2 to limit the height of flattening roller 5 from vacuum adsorption platform 2.

[0029] Two straight guide posts 25 extend symmetrically from the upper end of the roller seat 32. The two ends of the pressure seat 6 are slidably mounted on the outer surfaces of the two straight guide posts 25. The straight guide posts 25 serve to guide the roller seat 32. A limit cap 26 is coaxially embedded at the upper end of the straight guide post 25. The limit cap 26 serves to prevent the roller seat 32 and the pressure seat 6 from separating.

[0030] A pressure roller spring 29 is wound around the outside of the straight guide post 25. The lower end of the pressure roller spring 29 is fixed to the roller seat 32. The pressure roller spring 29 serves to press the protective wheel 28 onto the vacuum adsorption platform 2. The upper end of the pressure roller spring 29 is fixed to the lower end of the pressure seat 6. Two wheel frames 27 extend symmetrically from the lower end of the roller seat 32. The protective wheel 28 is installed at the end of the wheel frame 27. The wheel frame 27 serves to support the protective wheel 28.

[0031] The pusher includes a support frame 4 fixedly installed at the upper middle part of the forming table 1. A threaded rod 11 is rotatably installed at the middle of the front end face of the support frame 4. The support frame 4 serves to support the threaded rod 11, etc. A push seat 9 is screwed onto the outer surface of the threaded rod 11. When the threaded rod 11 rotates, it drives the push seat 9 to move the pressure seat 6 and the air control rail 21 synchronously. An extension frame 14 is fixedly installed at both the upper and lower ends of the push seat 9. A push roller frame 7 extends from the front end of the upper extension frame 14. The end of the push roller frame 7 is fixed to the pressure seat 6. The push roller frame 7 serves to fix the upper extension frame 14 and the pressure seat 6 together.

[0032] A servo motor 12 is installed through the side of the support frame 4. The output end of the servo motor 12 is fixed to the threaded rod 11. The servo motor 12 drives the threaded rod 11 to rotate. Guide rails 8 extend from the upper and lower edges of the front end face of the support frame 4. Slide seats 10 are slidably installed on the outer surface of the two guide rails 8. The cooperation between the guide rails 8 and the slide seats 10 serves as a guide. The rear ends of the two protruding frames 14 are fixed to the front ends of the two slide seats 10 respectively.

[0033] The gas control component includes multiple semi-circular sleeves 23 evenly distributed and fixedly installed on the inner top surface of the vacuum adsorption platform 2. Multiple gas control rods 15 are fitted inside each of the multiple semi-circular sleeves 23. The semi-circular sleeves 23 increase the contact area between the gas control rods 15 and the inner top surface of the vacuum adsorption platform 2. The gas control rods 15 are rotatably connected to the vacuum adsorption platform 2 and extend through the rear end face of the vacuum adsorption platform 2. Multiple gas control holes 22 are opened through the outer surface of the gas control rods 15 and the inner surface of the semi-circular sleeves 23. The gas control holes 22 control the gas. The gas control holes 22 on the semi-circular sleeves 23 are aligned with the gas holes on the vacuum adsorption platform 2. The gas control holes 22 on the gas control rods 15 and the gas control holes 22 on the semi-circular sleeves 23 are offset by 90 degrees, which prevents suction from being generated at the corresponding parts of the vacuum adsorption platform 2.

[0034] A control rod gear 16 is coaxially embedded at the rear end of the air control rod 15. A control rod tooth plate 17 meshes with the side of the control rod gear 16. The control rod tooth plate 17 drives the control rod gear 16 to rotate. A control plate wheel 18 is installed at the rear end of the control rod tooth plate 17. Two fixed reinforcing frames 13 are fixedly installed at the front end of the lower extension frame 14. Air control rails 21 are installed at the front end of each of the two fixed reinforcing frames 13. The fixed reinforcing frames 13 fix the air control rails 21. The two air control rails 21 are arranged in parallel. The control plate wheel 18 is located between the two air control rails 21. The inclined section of the air control rail 21 pushes the control plate wheel 18, causing the control rod tooth plate 17 to move down, thereby driving the control rod gear 16 to rotate. This allows the air control rod 15 to rotate 90 degrees, so that the air control hole 22 on the air control rod 15 can be aligned with the air hole on the vacuum adsorption platform 2. This allows the corresponding part of the vacuum adsorption platform 2 to generate suction force to adsorb and fix the flattened part of the FPC flexible circuit board 34.

[0035] Multiple reinforcing ears 33 extend from opposite sides of the two air control rails 21. The ends of the reinforcing ears 33 are fixed to the fixed reinforcing frame 13. The reinforcing ears 33 serve to fix the air control rails 21 and the fixed reinforcing frame 13 together. A T-shaped guide seat 20 is slidably installed inside the control rod tooth plate 17. The T-shaped guide seat 20 extends through the lower end of the control rod tooth plate 17 and serves to guide the control rod tooth plate 17. Two fixing frames 19 are symmetrically fixed on the side of the T-shaped guide seat 20. The ends of the fixing frames 19 are fixed to the vacuum adsorption platform 2 and serve to fix the T-shaped guide seat 20.

[0036] During processing, the FPC flexible circuit board 34 is placed on the pad 24. At this time, the two positioning protrusions 30 on the pad 24 are inserted into the through holes on the FPC flexible circuit board 34, and the upper end face of the positioning protrusion 30 is coplanar with the upper end face of the FPC flexible circuit board 34, so as to initially restrict the FPC flexible circuit board 34. Then, the servo motor 12 drives the threaded rod 11 to rotate, which in turn drives the push seat 9 to move the pressure seat 6, so that the moving pressure seat 6 drives the flattening roller 5 towards the FPC flexible circuit board. As the position of the flexible printed circuit board 34 moves, the protective roller 28 rolls on the vacuum adsorption platform 2 to limit the height of the flattening roller 5 from the vacuum adsorption platform 2, allowing the flattening roller 5 to roll over the FPC flexible printed circuit board 34 and gradually flatten it. During this process, the push seat 9 also drives the air control rail 21 to move synchronously, so that the inclined section of the air control rail 21 passes through multiple control rollers 18 in sequence, thereby flattening the FPC flexible printed circuit board 34 as the flattening roller 5 rolls over it. During the flattening process of the flexible printed circuit board 34, the inclined section of the air control rail 21 pushes the control plate wheel 18, causing the control rod tooth plate 17 to move downward, thereby driving the control rod gear 16 to rotate, so that the air control rod 15 can rotate 90 degrees, so that the air control hole 22 on the air control rod 15 can be aligned with the air hole on the vacuum adsorption platform 2, thereby generating suction on the corresponding part of the vacuum adsorption platform 2 to adsorb and fix the flattened part of the FPC flexible printed circuit board 34. This process is repeated until the entire FPC flexible printed circuit board 34 is adsorbed and fixed. By flattening and adsorbing simultaneously, the entire FPC flexible printed circuit board 34 is gradually adsorbed and fixed, effectively avoiding the phenomenon that the vacuum adsorption platform 2 would adsorb and fix the entire FPC flexible printed circuit board 34 at once, which would make it difficult for the subsequent flattening roller 5 to flatten the FPC flexible printed circuit board 34. This ensures that the FPC flexible printed circuit board 34 is flattened and fixed by the vacuum adsorption platform 2, and then the through hole on the FPC flexible printed circuit board 34 can be processed by the hole opening mechanism 3.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A FPC flexible circuit board via forming device, comprising a forming table (1), the upper end rear part of the forming table (1) is provided with an opening mechanism (3), and the upper end front part of the forming table (1) is provided with a vacuum adsorption platform (2), characterized in that: The inside of the vacuum adsorption platform (2) is provided with a gas control part, the upper end of the vacuum adsorption platform (2) is attached with a backing plate (24), the guide hole on the backing plate (24) is aligned with the air hole on the vacuum adsorption platform (2), the corner of the backing plate (24) is attached with a fixed corner (31), the lower end of the fixed corner (31) is fixed with the vacuum adsorption platform (2), the upper end of the backing plate (24) symmetrically extends two positioning convex columns (30), the two positioning convex columns (30) are matched with the through hole on the FPC flexible circuit board, the upper end of the forming table (1) is provided with a pushing piece, the pushing piece is connected with a pressing seat (6), the lower end of the pressing seat (6) is elastically mounted with a roller seat (32), the inside of the roller seat (32) is mounted with a flattening roller (5), the total height of the backing plate (24) and the FPC flexible circuit board is the same as the height of the flattening roller (5) from the vacuum adsorption platform (2), the upper end of the vacuum adsorption platform (2) is attached with a protection wheel (28) at the front and rear edges, and the protection wheel (28) is connected with the roller seat (32).

2. The FPC flexible circuit board via forming device according to claim 1, characterized in that: The upper end of the roller seat (32) symmetrically extends two straight guide columns (25), the two ends of the pressing seat (6) are respectively slidably installed on the outer surfaces of the two straight guide columns (25), and the upper end of the straight guide column (25) is coaxially embedded with a limiting cap (26).

3. The FPC flexible circuit board via forming device of claim 2, wherein: The outer side of the straight guide column (25) is wound with a pressure roller spring (29), the lower end of the pressure roller spring (29) is fixed with the roller seat (32), the upper end of the pressure roller spring (29) is fixed with the lower end of the pressing seat (6), and the lower end of the roller seat (32) symmetrically extends two wheel frames (27), and the protection wheel (28) is installed at the end of the wheel frame (27).

4. The FPC flexible circuit board via forming device of claim 1, wherein: The pushing piece comprises a bearing frame (4) fixedly installed at the upper end of the forming table (1), a threaded rod (11) rotatably installed at the middle of the front end face of the bearing frame (4), a pushing seat (9) screwed on the outer surface of the threaded rod (11), a protruding frame (14) fixedly installed at the upper and lower ends of the pushing seat (9), a pushing roller frame (7) extending at the front end of the upper protruding frame (14), and the pushing roller frame (7) is fixed with the pressing seat (6).

5. The FPC flexible circuit board via forming apparatus of claim 4, wherein: The side of the bearing frame (4) is penetratedly installed with a servo motor (12), the output end of the servo motor (12) is fixed with the threaded rod (11), the front end face of the bearing frame (4) extends a guide rail (8) at the upper and lower edges, the outer surfaces of the two guide rails (8) are slidably installed with a sliding seat (10), and the rear ends of the two protruding frames (14) are respectively fixed with the front ends of the two sliding seats (10).

6. The FPC flexible circuit board via forming apparatus of claim 4, wherein: The gas control piece includes a plurality of semicircular envelopes (23) evenly distributed and fixedly installed on the inner top surface of the vacuum adsorption platform (2), the interiors of the plurality of semicircular envelopes (23) are each attached with a plurality of gas control rods (15), the gas control rods (15) are rotationally connected with the vacuum adsorption platform (2), the gas control rods (15) penetrate out from the rear end surface of the vacuum adsorption platform (2), the outer surface of the gas control rod (15) and the inner surface of the semicircular envelope (23) are each penetrated to be provided with a plurality of gas control holes (22), the gas control holes (22) on the semicircular envelope (23) are aligned with the gas holes on the vacuum adsorption platform (2), and the gas control holes (22) on the gas control rod (15) are arranged in a ninety-degree staggered manner with the gas control holes (22) on the semicircular envelope (23).

7. The FPC flexible circuit board via forming apparatus of claim 6, wherein: The rear end portion of the gas control rod (15) is coaxially embedded with a control rod gear (16), the side surface of the control rod gear (16) is engaged with a control rod tooth plate (17), the rear end of the control rod tooth plate (17) is installed with a control plate wheel (18), the front end of the lower extension frame (14) is fixedly installed with two fixed reinforcing frames (13), the front end of the two fixed reinforcing frames (13) is each installed with a gas control rail (21), the two gas control rails (21) are arranged in parallel, and the control plate wheel (18) is located between the two gas control rails (21).

8. The FPC flexible circuit board via forming apparatus of claim 7, wherein: The opposite surfaces of the two gas control rails (21) are each extended with a plurality of reinforcing ears (33), the end portions of the reinforcing ears (33) are fixed with the fixed reinforcing frames (13), the interior of the control rod tooth plate (17) is slidably installed with a T-shaped guide seat (20), the T-shaped guide seat (20) penetrates out from the lower end of the control rod tooth plate (17), the side surface of the T-shaped guide seat (20) is fixedly installed with two fixed frames (19) in a symmetrical manner, and the end portions of the fixed frames (19) are fixed with the vacuum adsorption platform (2).

Citation Information

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