Packaging module and electronic equipment

Abstract

The invention discloses a packaging module and electronic equipment. The packaging module comprises a first substrate, a first element group and a second substrate, wherein the first substrate is provided with a first surface arranged along the thickness direction of the first substrate; the first element group is mounted on the first surface of the first substrate; the second substrate and the first substrate are arranged at an interval, and the second substrate is arranged opposite to the first surface; the LED lamp further comprises an adapter plate, the adapter plate is in an annular shape, and the adapter plate is arranged between the first substrate and the second substrate. The first substrate, the adapter plate and the second substrate enclose to form a cavity part, and the first element group is located in the cavity part; the adapter plate is provided with a grounding pad, and the grounding point of the first substrate and the grounding point of the second substrate are respectively connected with the grounding pad; and the grounding bonding pad surrounds the cavity part to form an annular structure.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more specifically, to a packaging module and an electronic device. Background Technology

[0002] In today's era of rapid technological advancement, smart glasses, as wearable devices that integrate advanced technologies such as augmented reality (AR), are gradually demonstrating enormous application potential in numerous fields, including consumer electronics, industry, and healthcare. With the continuous evolution of wearable products like smart glasses, the market's demand for miniaturization, lightweight design, and high integration is becoming increasingly urgent.

[0003] In traditional smart glasses design and development, printed circuit board (PCB) solutions are a common implementation method. However, this traditional approach has several significant drawbacks. On the one hand, traditional PCB solutions have a large overall board area and a relatively simple design, leaving very limited room for optimization. While functional modules are constantly being added to improve product performance and user experience, the size of these modules is difficult to reduce effectively, failing to meet the ever-increasing demands for miniaturization.

[0004] On the other hand, traditional solutions typically employ shielding designs to address electromagnetic interference (EMI) issues. However, shielding in AR systems not only occupies a significant area but also increases the module's weight, contradicting the miniaturization and lightweight goals of smart glasses. Furthermore, as product functionality becomes increasingly sophisticated and the electromagnetic environment grows more complex, traditional shielding has become less effective at ensuring stable operation in such environments. It struggles to effectively shield external interference from capacitors in the core system and from power module interference, leaving external signal interference and crosstalk issues prominent and severely impacting communication stability.

[0005] In summary, existing traditional PCB solutions and shielding designs can no longer meet the requirements of smart glasses in terms of miniaturization, integration, lightweighting, and electromagnetic interference resistance. There is an urgent need for a new technical solution to address these issues and promote the further development and application of smart glasses products. Summary of the Invention

[0006] One objective of this application is to provide a new technical solution for packaging modules and electronic devices.

[0007] According to a first aspect of this application, a packaging module is provided, the packaging module comprising:

[0008] A first substrate, the first substrate having a first surface disposed along its thickness direction;

[0009] A first component group is mounted on a first surface of the first substrate;

[0010] The second substrate is disposed at a distance from the first substrate, and the second substrate is disposed opposite to the first surface;

[0011] An adapter plate, the adapter plate being annular, is disposed between the first substrate and the second substrate; the first substrate, the adapter plate, and the second substrate enclose a cavity portion, and the first component group is located within the cavity portion;

[0012] The adapter plate is provided with a grounding pad, and the grounding points of the first substrate and the second substrate are respectively connected to the grounding pad; the grounding pad is in a ring structure around the cavity.

[0013] Optionally, the grounding pad includes a plurality of first metallized through holes, the first metallized through holes penetrating the adapter plate along the thickness direction of the adapter plate, and the inner sidewall of the first metallized through holes is plated with a first metal layer; the plurality of first metallized through holes are spaced apart and arranged in a ring around the cavity portion.

[0014] One end of each of the first metallized vias is connected to the ground point of the first substrate, and the other end of each of the first metallized vias is connected to the ground point of the second substrate.

[0015] Optionally, the grounding pad further includes a first solder ball and a second solder ball, wherein the first solder ball and the second solder ball are respectively provided in a one-to-one correspondence with the first metallized through hole;

[0016] One end of each of the first metallized vias is connected to the ground point of the first substrate via the first solder ball, and the other end of each of the first metallized vias is connected to the ground point of the second substrate via the second solder ball.

[0017] Optionally, the first metal layer is a copper layer.

[0018] Optionally, at least two sets of grounding pads are provided, and the at least two sets of grounding pads are arranged sequentially from the inside to the outside in a direction that gradually moves away from the cavity.

[0019] Optionally, the adapter plate is provided with signal pads, and the signal points of the first substrate and the second substrate are respectively connected to the signal pads; the signal pads are arranged in a ring structure around the cavity, and the signal pads are disposed inside the grounding pads.

[0020] Optionally, the signal pad includes a plurality of second metallized vias, the second metallized vias penetrating the adapter plate along the thickness direction of the adapter plate, and the inner sidewall of the second metallized vias is plated with a second metal layer; the plurality of second metallized vias are spaced apart and arranged in a ring around the cavity portion;

[0021] One end of each of the second metallized vias is connected to a signal point on the first substrate, and the other end of each of the second metallized vias is connected to a signal point on the second substrate.

[0022] Optionally, the signal pad further includes a third solder ball and a fourth solder ball, wherein the third solder ball and the fourth solder ball are respectively disposed in a one-to-one correspondence with the second metallized via;

[0023] One end of each of the second metallized vias is connected to a signal point on the first substrate via the third solder ball, and the other end of each of the second metallized vias is connected to a signal point on the second substrate via the fourth solder ball.

[0024] Optionally, the packaging module further includes a second component group and a third component group, wherein the first substrate has a second surface disposed opposite to its first surface, the second component group is mounted on the second surface, and the third component group is mounted on the surface of the second substrate opposite to the first substrate.

[0025] According to a second aspect of this application, an electronic device is provided, the electronic device comprising the packaging module as described in the first aspect.

[0026] In the packaging module provided in this application embodiment, a cavity is formed by a first substrate and a second substrate spaced apart and connected by an annular adapter plate. A first component group is disposed within the cavity. Simultaneously, a grounding pad is provided on the adapter plate, connecting the grounding points of the first and second substrates. The grounding pad forms an annular structure around the cavity, thus shielding the first component group within the cavity from electromagnetic interference, reducing interference from external signals and minimizing the impact of the first component group on the external environment. Furthermore, this packaging module eliminates the need for a metal shielding cover, helping to reduce the module's weight and solving the problem of large shielding area requirements.

[0027] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0029] Figure 1 This is a schematic diagram of the overall structure of a packaging module according to an embodiment of this application;

[0030] Figure 2 This is a partial structural schematic diagram of a packaging module according to an embodiment of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Packaging module; 10. Cavity section; 11. First substrate; 12. Second substrate; 131. First component group; 132. Second component group; 133. Third component group; 14. Adapter board; 15. First metallized through-hole; 161. First solder ball; 162. Second solder ball; 163. Third solder ball; 164. Fourth solder ball; 17. Second metallized through-hole; 18. Flexible circuit board; 181. Connector. Detailed Implementation

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0034] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0035] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0036] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0038] Reference Figures 1-2 As shown, according to one embodiment of this application, a packaging module 1 is provided. The packaging module 1 includes a first substrate 11 and a first component group 131, wherein the first substrate 11 has a first surface disposed along its thickness direction; the first component group 131 is mounted on the first surface of the first substrate 11.

[0039] It also includes a second substrate 12 and a transition plate 14. The second substrate 12 is spaced apart from the first substrate 11 and is disposed opposite to the first surface. The transition plate 14 is annular and is disposed between the first substrate 11 and the second substrate 12. The first substrate 11, the transition plate 14 and the second substrate 12 enclose a cavity portion 10, and the first component group 131 is located within the cavity portion 10.

[0040] A grounding pad is provided on the adapter plate 14, and the grounding point of the first substrate 11 and the grounding point of the second substrate 12 are respectively connected to the grounding pad; the grounding pad is arranged in a ring structure around the cavity portion 10.

[0041] In the packaging module 1 provided in this application embodiment, the first substrate 11 and the second substrate 12 are arranged at intervals relative to each other along their thickness directions, and the first component group 131 is attached to the first surface of the first substrate 11 that is arranged opposite to the second substrate 12; that is, the first substrate 11, the second substrate 12 and the first component group 131 are stacked along the thickness direction (Z direction), which can effectively reduce the size in the length direction (X direction) and the width direction (Y direction), thereby helping to meet the miniaturization development needs of electronic devices.

[0042] In the packaging module 1 provided in this application embodiment, a cavity portion 10 is formed by a first substrate 11 and a second substrate 12 arranged at intervals and connected by an annular adapter plate 14. A first component group 131 is disposed within the cavity portion 10. Simultaneously, a grounding pad is provided on the adapter plate 14, and the grounding points of the first and second substrates are connected to it. The grounding pad forms an annular structure around the cavity portion 10. This grounding pad can shield the first component group 131 within the cavity portion 10 from electromagnetic interference, thereby reducing interference from external signals to the first component group 131 within the cavity portion 10, and also reducing the influence of the first component group 131 within the cavity portion 10 on the external environment. Furthermore, this packaging module 1 eliminates the need for a metal shielding cover, thus helping to reduce the weight of the module and solving the problem of the large area occupied by the shielding cover.

[0043] It is understood that the first component group 131 includes components susceptible to external electromagnetic interference, such as capacitors corresponding to integrated circuits; components that easily generate electromagnetic interference to the outside world, such as power modules; and components that may be affected by external interference or may become sources of interference, such as inductors.

[0044] Reference Figure 2As shown, in one embodiment, the grounding pad includes a plurality of first metallized through holes 15, the first metallized through holes 15 penetrating the adapter plate 14 along the thickness direction of the adapter plate 14, and the inner sidewall of the first metallized through holes 15 is plated with a first metal layer; the plurality of first metallized through holes 15 are spaced apart and arranged in a ring around the cavity portion 10.

[0045] One end of each of the first metallized vias 15 is connected to the ground point of the first substrate 11, and the other end of each of the first metallized vias 15 is connected to the ground point of the second substrate 12.

[0046] In this specific example, the grounding pad is composed of multiple first metallized through-holes 15 that extend along the thickness direction of the adapter plate 14 and have a first metal layer plated on their inner sidewalls. These multiple first metallized through-holes 15 are arranged in a ring around the cavity portion 10 and are respectively connected to the grounding points of the first substrate 11 and the second substrate 12. This structure enhances the conductivity of the grounding, and the multiple first metallized through-holes 15 increase the area of ​​the grounding path, effectively reducing the grounding resistance, improving the shielding effect against electromagnetic interference, and allowing electromagnetic interference signals to be more smoothly discharged through the grounding path.

[0047] Reference Figure 1 As shown, in one embodiment, the grounding pad further includes a first solder ball 161 and a second solder ball 162, and the first solder ball 161 and the second solder ball 162 are respectively disposed in a one-to-one correspondence with the first metallized through hole 15;

[0048] One end of each of the first metallized vias 15 is connected to the ground point of the first substrate 11 via the first solder ball 161, and the other end of each of the first metallized vias 15 is connected to the ground point of the second substrate 12 via the second solder ball 162.

[0049] In this specific example, the first metallized through-hole 15 is connected to the grounding points of the first substrate 11 and the second substrate 12 by the first solder ball 161 and the second solder ball 162 respectively. The solder balls have good conductivity and flexibility, which can not only ensure reliable electrical connection, but also compensate for the flatness difference between the first substrate 11, the second substrate 12 and the adapter plate 14 to a certain extent, reduce the contact problems caused by uneven connection, and further improve the stability and shielding effect of grounding connection.

[0050] In one embodiment, the first metal layer is a copper layer.

[0051] In this specific example, the first metal layer plated on the inner wall of the first metallized via 15 is a copper layer. Copper has good electrical and thermal conductivity, and is relatively inexpensive and easy to process. As a plating layer on the inner wall of the first metallized via 15, it can effectively conduct current, achieve good grounding shielding function, and at the same time help dissipate the heat generated when the component is working, thereby improving the heat dissipation performance of the module.

[0052] In one embodiment, at least two sets of grounding pads are provided, and the at least two sets of grounding pads are arranged sequentially from the inside to the outside in a direction that gradually moves away from the cavity portion 10.

[0053] In this specific example, at least two sets of grounding pads are arranged sequentially from the inside to the outside along a direction gradually moving away from the cavity 10, forming a multi-layer shielding structure. This multi-layer shielding can more effectively block electromagnetic interference signals of different frequencies and intensities, further improving the electromagnetic interference resistance of the packaged module and enhancing the stability of the module in complex electromagnetic environments.

[0054] For example, three sets of grounding pads are provided: a first annular grounding pad, a second annular grounding pad, and a third annular grounding pad. The first grounding pad is located on the innermost side, closest to the cavity 10, the second grounding pad is placed outside the first grounding pad, and the third grounding pad is placed outside the second grounding pad. Thus, three annular grounding pads are arranged around the cavity 10 from the inside out, forming three shielding layers.

[0055] Reference Figure 2 As shown, in one embodiment, a signal pad is provided on the adapter plate 14, and the signal points of the first substrate 11 and the second substrate 12 are respectively connected to the signal pad; the signal pad is arranged in a ring structure around the cavity portion 10, and the signal pad is disposed inside the grounding pad.

[0056] In this specific example, signal pads are provided on the adapter board, connecting the signal points of the first substrate 11 and the second substrate 12 to them respectively. The signal pads are arranged in a ring around the cavity and are located inside the grounding pad. This layout ensures the signal transmission path and provides some shielding protection for the signal transmission using the grounding pad, reducing interference and crosstalk during signal transmission and improving the quality and stability of signal transmission.

[0057] Reference Figure 2As shown, in one embodiment, the signal pad includes a plurality of second metallized vias 17, the second metallized vias 17 penetrating the adapter plate 14 along the thickness direction of the adapter plate 14, and the inner sidewall of the second metallized vias 17 is plated with a second metal layer; the plurality of second metallized vias 17 are spaced apart and arranged in a ring around the cavity portion 10.

[0058] One end of each of the second metallized vias 17 is connected to a signal point on the first substrate 11, and the other end of each of the second metallized vias 17 is connected to a signal point on the second substrate 12.

[0059] In this specific example, the signal pads are composed of multiple second metallized vias 17 that extend along the thickness direction of the adapter plate 14 and have a second metal layer plated on their inner sidewalls. These multiple second metallized vias 17 are arranged in a ring around the cavity portion 10 and connect to the signal points of the first substrate 11 and the second substrate 12, respectively. Similar to the first metallized via 15 of the ground pads, the structure of the multiple second metallized vias 17 provides a stable channel for signal transmission. The second metal layer ensures good signal conduction, and the multiple second metallized vias 17 can meet the needs of multi-channel signal transmission, improving the efficiency and reliability of signal transmission. Optionally, the second metal layer is a copper layer.

[0060] Reference Figure 1 As shown, in one embodiment, the signal pad further includes a third solder ball 163 and a fourth solder ball 164, and the third solder ball 163 and the fourth solder ball 164 are respectively disposed in a one-to-one correspondence with the second metallized via 17;

[0061] One end of each of the second metallized vias 17 is connected to a signal point on the first substrate 11 via the third solder ball 163, and the other end of each of the second metallized vias 17 is connected to a signal point on the second substrate 12 via the fourth solder ball 164.

[0062] In this specific example, the two ends of the second metallized via 17 are connected to the signal points of the first substrate 11 and the second substrate 12 by the third solder ball 163 and the fourth solder ball 164, respectively. Similar to the function of the first solder ball 161 and the second solder ball 162, the third solder ball 163 and the fourth solder ball 164 can ensure the reliability of the signal connection and compensate for the flatness difference between the first substrate 11, the second substrate 12 and the adapter board, reduce the loss and interference in the signal transmission process, and improve the quality of signal transmission.

[0063] Reference Figure 1As shown, in one embodiment, the packaging module further includes a second component group 132 and a third component group 133. The first substrate 11 has a second surface disposed opposite to its first surface, and the second component group 132 is attached to the second surface. The third component group 133 is attached to the surface of the second substrate 12 opposite to the first substrate 11.

[0064] In this specific example, a second component group 132 is mounted on the second surface of the first substrate 11 opposite to the second substrate 12, and a third component group 133 is mounted on the surface of the second substrate 12 opposite to the first substrate 11. This makes full use of the space of the packaging module in the thickness direction (Z direction), improves the integration of components, further reduces the volume of the module, and achieves the design goals of high integration and miniaturization, which is beneficial for use in devices with limited space.

[0065] For example, the second component group 132 includes integrated circuits and some capacitors that are not easily affected by external interference; the third component group 133 includes a WIFI module and an antenna spring.

[0066] In addition, a flexible circuit board 18 is connected to the edge of the second substrate 12 away from the surface of the first substrate 11, and is connected to the whole system through a connector 181 on the flexible circuit board 18.

[0067] According to another embodiment of this application, an electronic device is provided, the electronic device including the packaging module 1 as described above.

[0068] The electronic device provided in this application embodiment includes the aforementioned packaging module 1 with multiple advantages. Since the packaging module 1 has advantages such as high integration, miniaturization and good anti-electromagnetic interference capability, it can improve the overall performance of the electronic device, reduce the device size, enable the electronic device to operate stably in complex electromagnetic environments, and reduce the device weight, thus meeting the needs of different application scenarios, especially for electronic devices with high requirements for size and performance, such as smart wearable devices.

[0069] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0070] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A packaging module, characterized in that, The packaging module includes: A first substrate (11) having a first surface disposed along its thickness direction; A first component group (131) is attached to the first surface of the first substrate (11); The second substrate (12) is disposed at a distance from the first substrate (11), and the second substrate (12) is disposed opposite to the first surface; The adapter plate (14) is annular and is disposed between the first substrate (11) and the second substrate (12); the first substrate (11), the adapter plate (14) and the second substrate (12) enclose a cavity (10), and the first component group (131) is located inside the cavity (10); A grounding pad is provided on the adapter plate (14), and the grounding point of the first substrate (11) and the grounding point of the second substrate (12) are respectively connected to the grounding pad; the grounding pad is in a ring structure around the cavity (10).

2. The packaging module according to claim 1, characterized in that, The grounding pad includes a plurality of first metallized through holes (15), which penetrate the adapter plate (14) along the thickness direction. The inner sidewall of the first metallized through hole (15) is plated with a first metal layer. The plurality of first metallized through holes (15) are spaced apart and arranged in a ring around the cavity (10). One end of each of the first metallized vias (15) is connected to the ground point of the first substrate (11), and the other end of each of the first metallized vias (15) is connected to the ground point of the second substrate (12).

3. The packaging module according to claim 2, characterized in that, The grounding pad also includes a first solder ball (161) and a second solder ball (162), and the first solder ball (161) and the second solder ball (162) are respectively provided in a one-to-one correspondence with the first metallized through hole (15); One end of each of the first metallized vias (15) is connected to the ground point of the first substrate (11) via the first solder ball (161), and the other end of each of the first metallized vias (15) is connected to the ground point of the second substrate (12) via the second solder ball (162).

4. The packaging module according to claim 2, characterized in that, The first metal layer is a copper layer.

5. The packaging module according to claim 1 or 2, characterized in that, At least two sets of grounding pads are provided, and the at least two sets of grounding pads are arranged sequentially from the inside to the outside in a direction that gradually moves away from the cavity (10).

6. The packaging module according to claim 1, characterized in that, The adapter plate (14) is provided with signal pads, and the signal points of the first substrate (11) and the second substrate (12) are respectively connected to the signal pads; the signal pads are arranged in a ring structure around the cavity (10), and the signal pads are located inside the grounding pads.

7. The packaging module according to claim 6, characterized in that, The signal pad includes a plurality of second metallized through holes (17), which penetrate the adapter plate (14) along the thickness direction. The inner sidewall of the second metallized through hole (17) is plated with a second metal layer. The plurality of second metallized through holes (17) are spaced apart and arranged in a ring around the cavity (10). One end of each of the second metallized vias (17) is connected to a signal point on the first substrate (11), and the other end of each of the second metallized vias (17) is connected to a signal point on the second substrate (12).

8. The packaging module according to claim 7, characterized in that, The signal pad also includes a third solder ball (163) and a fourth solder ball (164), and the third solder ball (163) and the fourth solder ball (164) are respectively provided in a one-to-one correspondence with the second metallized via (17); One end of each of the second metallized vias (17) is connected to a signal point of the first substrate (11) via the third solder ball (163), and the other end of each of the second metallized vias (17) is connected to a signal point of the second substrate (12) via the fourth solder ball (164).

9. The packaging module according to claim 1, characterized in that, The packaging module further includes a second component group (132) and a third component group (133). The first substrate (11) has a second surface disposed opposite to its first surface. The second component group (132) is attached to the second surface. The third component group (133) is attached to the surface of the second substrate (12) opposite to the first substrate (11).

10. An electronic device, characterized in that, The electronic device includes the packaging module (1) as described in any one of claims 1-9.

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