Image reading module for reducing overall thickness and portable electronic device

Abstract

The invention provides an image reading module for reducing the overall thickness and a portable electronic device. The image reading module includes a circuit substrate, an image sensing chip, an insulating connection structure and a lens assembly. The image sensing chip is arranged in the through opening of the circuit substrate and is electrically connected to the circuit substrate through a plurality of metal leads. The insulation connection structure is arranged in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier. Therefore, under the condition that the image sensing chip is not in contact with the circuit substrate, the image sensing chip can still be stably fixed in the through opening of the circuit substrate through the connection of the insulating connection structure, so that the overall thickness of the image reading module is reduced.

Description

Technical Field

[0001] This invention relates to an image reading module, and more particularly to an image reading module for reducing overall thickness, and a portable electronic device using the image reading module. Background Technology

[0002] In existing technologies, the image sensing chip of an image reading module can be mounted on the top of a circuit substrate without openings via wire bonding, or it can be mounted on the bottom of a circuit substrate with openings via flip-chip bonding. However, existing image reading modules still have room for improvement. Summary of the Invention

[0003] The problem that this invention aims to improve or solve is to provide an image reading module for reducing overall thickness and a portable electronic device using the image reading module, addressing the shortcomings of the prior art.

[0004] To improve or solve the above-mentioned problems, one technical means adopted by the present invention is to provide an image reading module for reducing overall thickness, comprising: a circuit substrate, an image sensing chip, an insulating connection structure, and a lens assembly. The circuit substrate has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate via multiple metal leads. The insulating connection structure is disposed within the through-hole of the circuit substrate and connects the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier disposed on the circuit substrate and a lens module supported by the lens carrier. The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The lower surface of the image sensing chip is exposed and not covered by the insulating connection structure. The image reading module further includes a filter element, which is supported by multiple supports or a surrounding support to be disposed above the image sensing chip, and the filter element is surrounded by multiple metal leads.

[0005] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide an image reading module for reducing overall thickness, comprising: a circuit substrate, an image sensing chip, an insulating connection structure, and a lens assembly. The circuit substrate has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate via multiple metal leads. The insulating connection structure is disposed within the through-hole of the circuit substrate and connects the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier disposed on the circuit substrate and a lens module supported by the lens carrier. The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The lower surface of the image sensing chip is exposed and not covered by the insulating connection structure.

[0006] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a portable electronic device configured to use an image reading module. The image reading module comprises: a circuit substrate, an image sensing chip, an insulating connection structure, and a lens assembly. The circuit substrate has an upper surface, a lower surface, and a through-hole connecting the upper and lower surfaces. The image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate via a plurality of metal leads. The insulating connection structure is disposed within the through-hole of the circuit substrate and connects the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier disposed on the circuit substrate and a lens module supported by the lens carrier. The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The lower surface of the image sensing chip is exposed and not covered by the insulating connection structure.

[0007] One of the beneficial effects of the present invention is that the image reading module provided by the present invention for reducing the overall thickness can, through the technical solutions of "a circuit substrate having an upper surface, a lower surface and a through opening connecting the upper surface and the lower surface", "an image sensing chip disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate through a plurality of metal leads", and "an insulating connection structure disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate", such that the image sensing chip can still be firmly fixed in the through opening of the circuit substrate through the connection of the insulating connection structure without contacting the circuit substrate, thereby reducing the overall thickness of the image reading module.

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 A flowchart illustrating a method for manufacturing an image reading module to reduce overall thickness, as provided by the present invention.

[0010] Figure 2 This is a schematic diagram of step S100 of a method for manufacturing an image reading module for reducing overall thickness, as provided in the first embodiment of the present invention.

[0011] Figure 3 This is a schematic diagram of steps S102 and S104 of a method for manufacturing an image reading module for reducing overall thickness, provided in the first embodiment of the present invention.

[0012] Figure 4 This is a schematic diagram of step S106 of a method for manufacturing an image reading module for reducing overall thickness, provided in the first embodiment of the present invention.

[0013] Figure 5 This is a schematic diagram of step S108 of a method for manufacturing an image reading module for reducing overall thickness, provided in the first embodiment of the present invention.

[0014] Figure 6 This is a schematic diagram of an image reading module for reducing overall thickness, provided in the first embodiment of the present invention.

[0015] Figure 7 This is a schematic diagram of one feasible implementation of a method for manufacturing an image reading module to reduce overall thickness, provided in the first embodiment of the present invention (after the step of electrically connecting the image sensing chip to the circuit substrate, the temporary support substrate is removed from the circuit substrate).

[0016] Figure 8 This is a schematic diagram of another feasible embodiment of a method for manufacturing an image reading module for reducing overall thickness provided in the first embodiment of the present invention (after the step of setting the lens assembly on the circuit substrate, the temporary support substrate is removed from the circuit substrate).

[0017] Figure 9 This is a schematic diagram of one feasible implementation of a method for manufacturing an image reading module for reducing overall thickness, provided in the second embodiment of the present invention.

[0018] Figure 10This is a schematic diagram of an image reading module for reducing overall thickness, provided in the second embodiment of the present invention.

[0019] Figure 11 This is a schematic diagram of an image reading module for reducing overall thickness, provided in the third embodiment of the present invention.

[0020] Figure 12 This is a schematic diagram of steps S200 and S202 of a method for manufacturing an image reading module for reducing overall thickness, as provided in the fourth embodiment of the present invention.

[0021] Figure 13 This is a schematic diagram of step S204 of a method for manufacturing an image reading module for reducing overall thickness, provided in the fourth embodiment of the present invention.

[0022] Figure 14 This is a schematic diagram of step S206 of a method for manufacturing an image reading module for reducing overall thickness, provided in the fourth embodiment of the present invention.

[0023] Figure 15 This is a functional block diagram of a portable electronic device using an image reading module, provided in the fifth embodiment of the present invention. Detailed Implementation

[0024] The following specific embodiments illustrate the implementation of the "image reading module for reducing overall thickness and portable electronic device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, the term "or" used herein may, depending on the actual situation, include any combination of any one or more of the associated listed items.

[0025] First Embodiment

[0026] See Figures 1 to 6 As shown, the first embodiment of the present invention provides a method for manufacturing an image reading module for reducing overall thickness, which includes: firstly, cooperating with Figure 1 and Figure 2As shown, a circuit substrate 1 and a temporary support substrate C (or a movable substrate, a separable substrate, or a detachable substrate) are brought close together so that the circuit substrate 1 is disposed on the temporary support substrate C (or until the circuit substrate 1 and the temporary support substrate C are in complete contact). The circuit substrate 1 has an upper surface 1001, a lower surface 1002, and a through opening 1003 (or a through opening 1003 penetrating the circuit substrate 1) connecting the upper surface 1001 and the lower surface 1002, and the bottom end of the through opening 1003 of the circuit substrate 1 is closed by the temporary support substrate C (step S100); then, in conjunction with... Figure 1 and Figure 3 As shown, an image sensing chip 2 is housed within a through-hole 1003 of a circuit substrate 1 and disposed on a temporary support substrate C (step S102). Then, an insulating connection structure 3 is formed within the through-hole 1003 of the circuit substrate 1 and connects the image sensing chip 2 to the circuit substrate 1 (step S104). Then, in conjunction with… Figure 1 and Figure 4 As shown, the temporary carrier substrate C is removed from the circuit substrate 1 (step S106); next, in conjunction with Figure 1 and Figure 5 As shown, the image sensing chip 2 is electrically connected to the circuit substrate 1 via multiple metal leads W (which can be any conductive metal material, such as gold, silver, or copper) (step S108); then, in conjunction with Figure 1 and Figure 6 As shown, a lens assembly 4 is disposed on a circuit substrate 1, wherein the lens assembly 4 includes a lens carrier 41 disposed on the circuit substrate 1 and a lens module 42 supported by the lens carrier 41 (step S110). However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0027] For example, coordination Figure 1 and Figure 2 As shown, in step S100, where the circuit substrate 1 and the temporary support substrate C are brought close together so that the circuit substrate 1 is disposed on the temporary support substrate C, the present invention can use the operation of a processing machine to gradually bring the circuit substrate 1 closer to the temporary support substrate C, or to gradually bring the temporary support substrate C closer to the circuit substrate 1, until the circuit substrate 1 and the temporary support substrate C are in complete contact. That is, any method of "bringing the circuit substrate 1 and the temporary support substrate C close together so that the circuit substrate 1 is disposed on the temporary support substrate C" can be applied to the manufacturing method of the image reading module for reducing overall thickness provided in the first embodiment of the present invention. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0028] For example, coordination Figure 1 and Figure 3 As shown, in step S102, where the image sensing chip 2 is housed within the through-hole 1003 of the circuit substrate 1 and disposed on the temporary support substrate C, the present invention can first determine the position of the through-hole 1003 of the circuit substrate 1 using an image sensing module (not shown), and then accurately house the image sensing chip 2 within the through-hole 1003 of the circuit substrate 1 and disposed on the temporary support substrate C, thereby improving the optical alignment accuracy of the image sensing chip 2. It is worth noting that the image sensing chip 2 can be directly disposed on the temporary support substrate C without any medium, or the image sensing chip 2 can also be disposed on the temporary support substrate C using a low-adhesion adhesive layer. However, the examples given above are merely one feasible embodiment and are not intended to limit the present invention.

[0029] For example, coordination Figure 1 and Figure 3 As shown, in step S104, where the insulating connection structure 3 is formed within the through-hole 1003 of the circuit substrate 1 and connected between the image sensing chip 2 and the circuit substrate 1, the present invention can first identify a gap between the image sensing chip 2 and the circuit substrate 1 (that is, the space in the through-hole 1003 not occupied by the image sensing chip 2) using an image sensing module (not shown). Then, an insulating material (such as silicone or epoxy resin) is filled into the through-hole 1003, and then the insulating material is baked using a heating device (not shown) (or allowed to harden naturally at room temperature), thereby completing the fabrication of the insulating connection structure 3. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0030] For example, coordination Figure 1 and Figure 4As shown, in step S106, which removes the temporary support substrate C from the circuit substrate 1, since the circuit substrate 1 can be pre-fixed, the temporary support substrate C can move directly downward relative to the circuit substrate 1, thereby allowing the temporary support substrate C to detach directly from the circuit substrate 1. In another feasible embodiment, the bonding force or adhesion between the insulating connection structure 3 and the temporary support substrate C can be weakened or reduced by "direct irradiation by a laser (heat source) generated by a laser generator (not shown)" or "indirect heating by a heat source generated by a heater (not shown)," thereby allowing the temporary support substrate C to detach from the circuit substrate 1 with less effort, and the configuration position (or optical alignment) of the image sensing chip 2 is less likely to be affected by the detachment of the temporary support substrate C. It is worth noting that when the temporary support substrate C moves directly downward and detaches from the circuit substrate 1, a colloidal separation mark T1 will be generated on the lower surrounding surface 3000 of the insulating connection structure 3 "after separation from the temporary support substrate C." Furthermore, when the temporary support substrate C is detached from the circuit substrate 1 by "direct irradiation by a laser generated by a laser generator" or "indirect heating by a heat source generated by a heater", a colloidal deformation mark (not shown) will be generated on the lower surrounding surface 3000 of the insulating connection structure 3 after being heated by the heat source generated by the laser generator or the heater. However, the above examples are only one possible embodiment and are not intended to limit the present invention.

[0031] For example, coordination Figure 1 , Figure 3 and Figure 5 As shown, in step S108, where the image sensing chip 2 is electrically connected to the circuit substrate 1 via multiple metal leads W, the upper surface 1001 of the circuit substrate 1 has multiple substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 has multiple chip conductive pads 20P. Furthermore, the multiple chip conductive pads 20P of the image sensing chip 2 can be connected to the circuit substrate 1 via multiple metal leads W (e.g., such as...). Figure 5 The presented bridging metal leads (or continuous metal traces simultaneously generated on the surface of the image sensing chip 2, the surface of the insulating connection structure 3, and the surface of the circuit substrate 1) are electrically connected to the plurality of substrate conductive pads 10P of the circuit substrate 1, respectively. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0032] For example, such as Figure 5As shown, the method for manufacturing an image reading module for reducing overall thickness provided in the first embodiment of the present invention further includes: a filter element 5 is disposed above the image sensing chip 2 by means of multiple supports (unlabeled) or a surrounding support (unlabeled). That is, in step S108, where the image sensing chip 2 is electrically connected to the circuit substrate 1 by multiple metal leads W, the filter element 5 can be disposed at a predetermined position above the image sensing chip 2 by means of multiple supports (unlabeled) or a surrounding support (unlabeled). However, the above examples are merely one possible embodiment and are not intended to limit the present invention.

[0033] It is worth noting, for example, such as Figure 7 As shown, in one feasible embodiment, after step S104 of generating the insulating connection structure 3 within the through-hole 1003 of the circuit substrate 1, the temporary support substrate C may not be temporarily removed from the circuit substrate 1, but rather... Figure 7 As shown, after the step of electrically connecting the image sensing chip 2 to the circuit substrate 1 via multiple metal leads W (or after the step of supporting the filter element 5 above the image sensing chip 2 via multiple supports or a surrounding support), the temporary support substrate C is then removed from the circuit substrate 1. Additionally, as... Figure 8 As shown, in one feasible embodiment, after step S104 of generating the insulating connection structure 3 within the through-hole 1003 of the circuit substrate 1, the temporary support substrate C may not be temporarily removed from the circuit substrate 1, but rather... Figure 8 As shown, after the step of setting the lens assembly 4 on the circuit substrate 1, the temporary support substrate C is removed from the circuit substrate 1. That is, depending on different processing requirements, the temporary support substrate C can be removed from the circuit substrate 1 after the step of "generating the insulating connection structure 3 within the through opening 1003 of the circuit substrate 1," or after the step of "electrically connecting the image sensing chip 2 to the circuit substrate 1 via multiple metal leads W," or even after the step of "setting the lens assembly 4 on the circuit substrate 1." However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0034] Furthermore, cooperation Figures 2 to 6 As shown, the first embodiment of the present invention further provides an image reading module M (or image sensing module or image capture module) for reducing overall thickness, which includes: a circuit substrate 1, an image sensing chip 2, an insulating connection structure 3, and a lens assembly 4.

[0035] Furthermore, in coordination Figure 5 and Figure 6 As shown, the circuit substrate 1 has an upper surface 1001, a lower surface 1002, and a through-hole 1003 connecting the upper surface 1001 and the lower surface 1002. The image sensing chip 2 is disposed within the through-hole 1003 of the circuit substrate 1 and is electrically connected to the circuit substrate 1 via a plurality of metal leads W. For example, the upper surface 1001 of the circuit substrate 1 has a plurality of substrate conductive pads 10P, and the upper surface 2001 of the image sensing chip 2 has a plurality of chip conductive pads 20P. The plurality of chip conductive pads 20P of the image sensing chip 2 are electrically connected to the plurality of substrate conductive pads 10P of the circuit substrate 1 via a plurality of metal leads W. In addition, depending on different application requirements, the image sensing chip 2 can be a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, the above examples are only one possible embodiment and are not intended to limit the present invention.

[0036] Furthermore, in coordination Figure 5 and Figure 6 As shown, the insulating connection structure 3 is disposed within the through opening 1003 of the circuit substrate 1 and connects the image sensing chip 2 and the circuit substrate 1. Additionally, the lens assembly 4 includes a lens carrier 41 disposed on the circuit substrate 1 and a lens module 42 (e.g., composed of multiple optical lenses) carried by the lens carrier 41. The upper surface 2001 of the image sensing chip 2 has an image sensing area 20S corresponding to the lens module 42. It is noteworthy that the lower surface 2002 of the image sensing chip 2 is exposed and not covered by the insulating connection structure 3, and the insulating connection structure 3 has a lower surrounding surface 3000 exposed and not covered. The lower surrounding surface 3000 of the insulating connection structure 3, the lower surface 1002 of the circuit substrate 1, and the lower surface 2002 of the image sensing chip 2 can be completely or substantially (substantially) flush with each other. However, the above examples are merely one possible embodiment and are not intended to limit the invention.

[0037] For example, coordination Figure 5 and Figure 6As shown, the thickness of the insulating connection structure 3 can be "less than or equal to the thickness of the image sensing chip 2" and "less than or equal to the thickness of the circuit substrate 1," and the insulating connection structure 3 can be tightly connected between an outer surrounding surface 2000 of the image sensing chip 2 and an inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1. In one feasible embodiment, when the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1 can be configured as a roughened surrounding surface, the roughened surrounding surface can be used to increase the adhesion or contact area between the insulating connection structure 3 and the circuit substrate 1. In one feasible embodiment, all or part of the outer surrounding surface 2000 of the image sensing chip 2 can be covered by the insulating connection structure 3, thereby adjusting the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2 (that is, the larger the area of ​​the outer surrounding surface 2000 of the image sensing chip 2 covered by the insulating connection structure 3, the larger the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0038] For example, coordination Figure 4 and Figure 6 As shown, the lower surrounding surface 3000 of the insulating connection structure 3 has a colloidal separation mark T1 formed after separation from a temporary support substrate C. In one feasible embodiment, when the temporary support substrate C is detached from the circuit substrate 1 by "direct irradiation by a laser generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surrounding surface 3000 of the insulating connection structure 3 will generate a colloidal deformation mark (not shown) formed "after being heated by a heat source generated by a laser generator or a heater". However, the above examples are only feasible embodiments and are not intended to limit the present invention.

[0039] For example, coordination Figure 5 and Figure 6 As shown, the image reading module M further includes a filter element 5. The filter element 5 can be positioned above the image sensing chip 2 by being supported by multiple supports (unlabeled) or a surrounding support (unlabeled). The filter element 5 can be surrounded by multiple metal leads W, and the height of the filter element 5 relative to the image sensing chip 2 can be higher or lower than the height of the multiple metal leads W relative to the image sensing chip 2. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0040] For example, in one feasible embodiment, the insulating connection structure 3 may have an extended connection portion (not shown) extending to the upper surface 1001 of the circuit substrate 1, thereby increasing the adhesion or contact area between the insulating connection structure 3 and the circuit substrate 1. That is, the insulating connection structure 3 can overlap the upper surface 1001 of the circuit substrate 1 through the extension of the extended connection portion, thus increasing the contact area between the insulating connection structure 3 and the circuit substrate 1 (or providing more support to the insulating connection structure 3 from the circuit substrate 1). This makes the insulating connection structure 3 less susceptible to damage from external forces (e.g., Figure 4 As shown, the external force generated when removing the temporary support substrate C from the circuit substrate 1 causes it to detach from the through opening 1003 of the circuit substrate 1. However, the example given above is only one possible embodiment and is not intended to limit the invention.

[0041] Second Embodiment

[0042] See Figure 1 , Figure 9 and Figure 10 As shown, the second embodiment of the present invention provides a method for manufacturing an image reading module for reducing overall thickness, and an image reading module M for reducing overall thickness. Figure 9 and Figure 3 The comparison, and Figure 10 and Figure 6 A comparison reveals that the most significant difference between the second embodiment and the first embodiment of the present invention lies in the following: after step S100, in which the circuit substrate 1 and the temporary support substrate C are brought close together so that the circuit substrate 1 is disposed on the temporary support substrate C, the method for manufacturing an image reading module for reducing overall thickness provided in the second embodiment of the present invention further includes: generating a bottom end surrounding the insulating layer 31 within the through opening 1003 of the circuit substrate 1 and connected between the image sensing chip 2 and the circuit substrate 1 (step S104(A)); and generating a top end surrounding the insulating layer 32 within the through opening 1003 of the circuit substrate 1 and connected between the image sensing chip 2 and the circuit substrate 1 (step S104(B)).

[0043] Furthermore, in coordination Figure 9 and Figure 10As shown, the bottom insulating layer 31 and the top insulating layer 32 can be connected to each other, and both the bottom insulating layer 31 and the top insulating layer 32 can be accommodated within the through opening 1003 of the circuit substrate 1 and tightly connected between the image sensing chip 2 and the circuit substrate 1. It is worth noting that the bottom insulating layer 31 of the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered, and the lower surrounding surface 3000 of the bottom insulating layer 31 of the insulating connection structure 3, the lower surface 1002 of the circuit substrate 1, and the lower surface 2002 of the image sensing chip 2 can be completely or substantially (substantially) flush with each other. However, the above example is only one possible embodiment and is not intended to limit the invention.

[0044] For example, coordination Figure 9 and Figure 10 As shown, in one feasible embodiment, the thickness of the bottom insulating layer 31 can be less than the thickness of the top insulating layer 32, or the viscosity of the bottom insulating layer 31 can be less than the viscosity of the top insulating layer 32, or the melting point of the bottom insulating layer 31 can be lower than the melting point of the top insulating layer 32. Therefore, the adhesion force between the bottom insulating layer 31 and the image sensing chip 2 will be less than the adhesion force between the top insulating layer 32 and the image sensing chip 2, and the adhesion force between the bottom insulating layer 31 and the circuit substrate 1 will be less than the adhesion force between the top insulating layer 32 and the circuit substrate 1. This will help the temporary support substrate C to detach more easily from the circuit substrate 1. However, the examples given above are only one feasible embodiment and are not intended to limit the present invention.

[0045] For example, coordination Figure 9 and Figure 10 As shown, in one feasible embodiment, when the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1 can be configured to contact a roughened surrounding surface of the top surrounding insulating layer 32, the roughened surrounding surface can be used to increase the adhesion or contact area between the top surrounding insulating layer 32 and the circuit substrate 1. However, the examples given above are merely feasible embodiments and are not intended to limit the invention.

[0046] For example, coordination Figure 9 and Figure 10As shown, when the temporary support substrate C is detached from the circuit substrate 1 by "direct irradiation by a laser generated by a laser generator (or direct irradiation by a laser generated by a laser generator around the bottom insulating layer 31)" or "indirect heating by a heat source generated by a heater (or indirect heating by a heat source generated by a heater around the bottom insulating layer 31)," a colloidal deformation mark T2 will be generated on the lower surrounding surface 3000 of the insulating connection structure 3 around the bottom of the insulating layer 31, which is the result of being heated by a heat source generated by a heating module L (e.g., a laser generator or a heater). In one feasible embodiment, when the temporary support substrate C is directly moved downwards and detached from the circuit substrate 1, a colloidal separation mark (not shown) will be generated on the lower surrounding surface 3000 of the insulating connection structure 3 around the bottom of the insulating layer 31, which is the result of being separated from the temporary support substrate C. However, the examples given above are only one feasible embodiment and are not intended to limit the present invention.

[0047] For example, in one feasible embodiment, the top of the insulating connection structure 3 has an extended connection portion (not shown) extending to the upper surface 1001 of the circuit substrate 1 around the insulating layer 32, thereby increasing the adhesion or contact area between the top of the insulating connection structure 3 around the insulating layer 32 and the circuit substrate 1. That is, the top of the insulating connection structure 3 around the insulating layer 32 can overlap the upper surface 1001 of the circuit substrate 1 through the extension of the extended connection portion, thus increasing the contact area between the top of the insulating connection structure 3 around the insulating layer 32 and the circuit substrate 1 (or allowing the top of the insulating connection structure 3 around the insulating layer 32 to receive more support from the circuit substrate 1). This makes the insulating connection structure 3 less susceptible to damage from external forces (e.g., Figure 4 As shown, the external force generated when removing the temporary support substrate C from the circuit substrate 1 causes it to detach from the through opening 1003 of the circuit substrate 1. However, the example given above is only one possible embodiment and is not intended to limit the invention.

[0048] Third Embodiment

[0049] See Figure 11 As shown, the third embodiment of the present invention provides an image reading module M for reducing overall thickness. (The remaining text appears to be incomplete and requires further context.) Figure 11 and Figure 10A comparison reveals that the most significant difference between the third embodiment and the second embodiment of the present invention is that the top of the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered around the insulating layer 32, and the lower surrounding surface 3000 of the top of the insulating connection structure 3 around the insulating layer 32 has a predetermined vertical height with the lower surface 1002 of the circuit substrate 1, thereby enabling a surrounding unoccupied space S to be generated between the circuit substrate 1, the image sensing chip 2, and the insulating connection structure 3.

[0050] For example, the unoccupied space S surrounding the insulating connection structure 3 can be generated by removing a portion of the bottom material (e.g., by using a laser generator or heater). Therefore, the top of the insulating connection structure 3 surrounding the lower surrounding surface 3000 of the insulating layer 32, a portion of the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1, and a portion of the outer surrounding surface 2000 of the image sensing chip 2 can be exposed from the bottom of the through opening 1003 of the circuit substrate 1. However, the above example is merely one possible embodiment and is not intended to limit the invention.

[0051] Fourth embodiment

[0052] See Figure 1 as well as Figures 12 to 14 As shown, the fourth embodiment of the present invention provides a method for manufacturing an image reading module for reducing overall thickness, which includes: firstly, cooperating with Figure 1 and Figure 12 As shown, a circuit substrate 1 and a temporary support substrate C (or a movable substrate, a separable substrate, or a detachable substrate) are brought close together so that the circuit substrate 1 is disposed on the temporary support substrate C (or until the circuit substrate 1 and the temporary support substrate C are in complete contact). The circuit substrate 1 has an upper surface 1001, a lower surface 1002, and a through opening 1003 (or a through opening 1003 penetrating the circuit substrate 1) connecting the upper surface 1001 and the lower surface 1002, and the bottom end of the through opening 1003 of the circuit substrate 1 is closed by the temporary support substrate C (step S200); then, in conjunction with... Figure 1 and Figure 12 As shown, an image sensing chip 2 is housed within the through-hole 1003 of the circuit substrate 1 and disposed on the temporary support substrate C using an adhesive layer C100 (e.g., double-sided tape or any type of adhesive layer); then, in conjunction with... Figure 1 and Figure 13As shown, the image sensing chip 2 is electrically connected to the circuit substrate 1 via multiple metal leads W (which can be any conductive metal material, such as gold, silver, or copper) (or may include support via multiple supports or a surrounding support member to place a filter element 5 above the image sensing chip 2) (step S204); Next, in conjunction with Figure 1 and Figure 14 As shown, an insulating connection structure 3 is generated within the through-hole 1003 of the circuit substrate 1 and connected between the image sensing chip 2 and the circuit substrate 1 (step S206); then, as... Figure 1 As shown, the temporary carrier substrate C is removed from the circuit substrate 1 (step S208); then, as... Figure 1 As shown, a lens assembly 4 is disposed on a circuit substrate 1, wherein the lens assembly 4 includes a lens carrier 41 disposed on the circuit substrate 1 and a lens module 42 supported by the lens carrier 41 (step S210). It is worth noting that, depending on different requirements, steps S208 and S210 can also be executed in reverse order. For example, in one feasible embodiment, the adhesive layer C100 can be disposed only between the image sensing chip 2 and the temporary support substrate C. In another feasible embodiment, the adhesive layer C100 can also be distributed over a large area across the entire temporary support substrate C, so that the adhesive layer C100 can also be disposed between the circuit substrate 1 and the temporary support substrate C, and the adhesive layer C100 can also be disposed between the insulating connection structure 3 and the temporary support substrate C. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0053] In other words, coordination Figure 3 , Figure 5 , Figure 12 , Figure 13 and Figure 14 As shown, the "wire bonding step (or chip electrical connection step)" which electrically connects the image sensing chip 2 to the circuit substrate 1 via multiple metal leads W, and the "insulating filler step (chip positioning step)" which generates an insulating connection structure 3 within the through-hole 1003 of the circuit substrate 1 and connects the image sensing chip 2 and the circuit substrate 1, can be two steps performed sequentially (in conjunction with...). Figure 3 and Figure 5 As shown, this means performing the glue-filling step first, followed by the suture step, or either the two steps are performed in reverse order (in conjunction with...). Figure 12 , Figure 13 and Figure 14 As shown, this means that the wire bonding step is performed first, followed by the glue filling step.

[0054] Fifth embodiment

[0055] See Figure 15 As shown, the fifth embodiment of the present invention provides a portable electronic device P, which can be configured to use any of the image reading modules M provided in the first to third embodiments. For example, the portable electronic device P can be a smartphone, desktop computer, laptop computer, tablet computer, or any kind of electronic device. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0056] Beneficial effects of the embodiments

[0057] One of the beneficial effects of the present invention is that the image reading module M provided by the present invention for reducing the overall thickness can achieve the following technical solutions: "circuit substrate 1 has an upper surface 1001, a lower surface 1002 and a through opening 1003 connecting the upper surface 1001 and the lower surface 1002", "image sensing chip 2 is disposed in the through opening 1003 of circuit substrate 1 and electrically connected to circuit substrate 1 by a plurality of metal leads W", and "insulating connection structure 3 is disposed in the through opening 1003 of circuit substrate 1 and connected between image sensing chip 2 and circuit substrate 1". This allows image sensing chip 2 to be firmly fixed in the through opening 1003 of circuit substrate 1 through the connection of insulating connection structure 3 without contacting circuit substrate 1, thereby reducing the overall thickness of image reading module M.

[0058] Another beneficial effect of the present invention is that the method for manufacturing an image reading module for reducing overall thickness provided by the present invention can reduce the overall thickness of the image reading module M by means of the following technical solutions: "bringing a circuit substrate 1 and a temporary support substrate C close to each other so that the circuit substrate 1 is disposed on the temporary support substrate C, wherein the circuit substrate 1 has an upper surface 1001, a lower surface 1002 and a through opening 1003 connecting the upper surface 1001 and the lower surface 1002", "accommodating an image sensing chip 2 in the through opening 1003 of the circuit substrate 1 and disposing it on the temporary support substrate C", and "generating an insulating connection structure 3 in the through opening 1003 of the circuit substrate 1 and connecting the image sensing chip 2 and the circuit substrate 1".

[0059] The above-disclosed content is only an optional and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. An image reading module for reducing overall thickness, characterized in that, The image reading module for reducing overall thickness includes: A circuit substrate having an upper surface, a lower surface, and a through opening connecting the upper surface and the lower surface; An image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate via a plurality of metal leads; An insulating connection structure is disposed within the through-hole of the circuit substrate and connects the image sensing chip and the circuit substrate; and A lens assembly, the lens assembly including a lens carrier disposed on the circuit substrate and a lens module supported by the lens carrier; The image sensing chip has an image sensing area on one upper surface corresponding to the lens module. In this embodiment, one surface of the image sensing chip is exposed and not covered by the insulating connection structure; The image reading module further includes a filter element, which is supported by multiple supports or a surrounding support to be disposed above the image sensing chip, and the filter element is surrounded by multiple metal leads.

2. The image reading module for reducing overall thickness according to claim 1, characterized in that, in, The upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through-hole of the circuit substrate; The inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface to increase the adhesion or contact area between the insulating connection structure and the circuit substrate. In this embodiment, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesion or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other. The lower surrounding surface of the insulating connection structure has a colloidal separation mark generated after separation from a temporary carrier substrate; The lower surrounding surface of the insulating connection structure has a colloidal deformation mark generated after being heated by a heat source generated by a heating module. The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

3. The image reading module for reducing overall thickness according to claim 1, characterized in that, in, The insulating connection structure includes a bottom-end surrounding insulating layer and a top-end surrounding insulating layer connected to the bottom-end surrounding insulating layer. Both the bottom-end surrounding insulating layer and the top-end surrounding insulating layer are disposed within the through-hole of the circuit substrate and connected between the image sensing chip and the circuit substrate. Wherein, the thickness of the insulating layer around the bottom end is less than the thickness of the insulating layer around the top end, the viscosity of the insulating layer around the bottom end is less than the viscosity of the insulating layer around the top end, and the melting point of the insulating layer around the bottom end is lower than the melting point of the insulating layer around the top end. Wherein, the adhesion force between the bottom end surrounding the insulating layer and the image sensing chip is less than the adhesion force between the top end surrounding the insulating layer and the image sensing chip, and the adhesion force between the bottom end surrounding the insulating layer and the circuit substrate is less than the adhesion force between the top end surrounding the insulating layer and the circuit substrate. In this circuit substrate, an inner surrounding surface of the through opening is configured to contact a roughened surrounding surface of the top surrounding insulating layer, thereby increasing the adhesion or contact area between the top surrounding insulating layer and the circuit substrate. The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other. Wherein, the lower surrounding surface of the bottom end surrounding the insulating layer has a colloidal separation mark generated after separation from a temporary carrier substrate; The lower surrounding surface of the bottom end surrounding the insulating layer has a colloidal deformation mark generated after being heated by a heat source generated by a heating module. The top end of the insulating connection structure has an extension connection portion extending to the upper surface of the circuit substrate around the insulating layer, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

4. The image reading module for reducing overall thickness according to claim 1, characterized in that, in, The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure has a predetermined vertical height with the lower surface of the circuit substrate, thereby creating a surrounding unoccupied space between the circuit substrate, the image sensing chip and the insulating connection structure. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate, and the lower surrounding surface of the insulating connection structure, a portion of the inner surrounding surface of the through opening of the circuit substrate, and a portion of the outer surrounding surface of the image sensing chip are exposed from the bottom end of the through opening of the circuit substrate. The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

5. An image reading module for reducing overall thickness, characterized in that, The image reading module for reducing overall thickness includes: A circuit substrate having an upper surface, a lower surface, and a through opening connecting the upper surface and the lower surface; An image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate via a plurality of metal leads; An insulating connection structure is disposed within the through-hole of the circuit substrate and connects the image sensing chip and the circuit substrate; and A lens assembly, the lens assembly including a lens carrier disposed on the circuit substrate and a lens module supported by the lens carrier; The image sensing chip has an image sensing area on one upper surface corresponding to the lens module. In this embodiment, one surface of the image sensing chip is exposed and not covered by the insulating connection structure.

6. The image reading module for reducing overall thickness according to claim 5, characterized in that, in, The upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through-hole of the circuit substrate; The inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface to increase the adhesion or contact area between the insulating connection structure and the circuit substrate. In this embodiment, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesion or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other. The lower surrounding surface of the insulating connection structure has a colloidal separation mark generated after separation from a temporary carrier substrate; The lower surrounding surface of the insulating connection structure has a colloidal deformation mark generated after being heated by a heat source generated by a heating module. The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

7. The image reading module for reducing overall thickness according to claim 5, characterized in that, in, The insulating connection structure includes a bottom-end surrounding insulating layer and a top-end surrounding insulating layer connected to the bottom-end surrounding insulating layer. Both the bottom-end surrounding insulating layer and the top-end surrounding insulating layer are disposed within the through-hole of the circuit substrate and connected between the image sensing chip and the circuit substrate. Wherein, the thickness of the insulating layer around the bottom end is less than the thickness of the insulating layer around the top end, the viscosity of the insulating layer around the bottom end is less than the viscosity of the insulating layer around the top end, and the melting point of the insulating layer around the bottom end is lower than the melting point of the insulating layer around the top end. Wherein, the adhesion force between the bottom end surrounding the insulating layer and the image sensing chip is less than the adhesion force between the top end surrounding the insulating layer and the image sensing chip, and the adhesion force between the bottom end surrounding the insulating layer and the circuit substrate is less than the adhesion force between the top end surrounding the insulating layer and the circuit substrate. In this circuit substrate, an inner surrounding surface of the through opening is configured to contact a roughened surrounding surface of the top surrounding insulating layer, thereby increasing the adhesion or contact area between the top surrounding insulating layer and the circuit substrate. The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other. Wherein, the lower surrounding surface of the bottom end surrounding the insulating layer has a colloidal separation mark generated after separation from a temporary carrier substrate; The lower surrounding surface of the bottom end surrounding the insulating layer has a colloidal deformation mark generated after being heated by a heat source generated by a heating module. The top end of the insulating connection structure has an extension connection portion extending to the upper surface of the circuit substrate around the insulating layer, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

8. The image reading module for reducing overall thickness according to claim 5, characterized in that, in, The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure has a predetermined vertical height with the lower surface of the circuit substrate, thereby creating a surrounding unoccupied space between the circuit substrate, the image sensing chip and the insulating connection structure. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate, and the lower surrounding surface of the insulating connection structure, a portion of the inner surrounding surface of the through opening of the circuit substrate, and a portion of the outer surrounding surface of the image sensing chip are exposed from the bottom end of the through opening of the circuit substrate. The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

9. A portable electronic device configured to use an image reading module, characterized in that, The image reading module includes: A circuit substrate having an upper surface, a lower surface, and a through opening connecting the upper surface and the lower surface; An image sensing chip is disposed within the through-hole of the circuit substrate and electrically connected to the circuit substrate via a plurality of metal leads; An insulating connection structure is disposed within the through-hole of the circuit substrate and connects the image sensing chip and the circuit substrate; and A lens assembly, the lens assembly including a lens carrier disposed on the circuit substrate and a lens module supported by the lens carrier; The image sensing chip has an image sensing area on one upper surface corresponding to the lens module. In this embodiment, one surface of the image sensing chip is exposed and not covered by the insulating connection structure.

10. The portable electronic device according to claim 9, characterized in that, in, The upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads. The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through-hole of the circuit substrate; The inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface to increase the adhesion or contact area between the insulating connection structure and the circuit substrate. In this embodiment, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesion or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other. The lower surrounding surface of the insulating connection structure has a colloidal separation mark generated after separation from a temporary carrier substrate; The lower surrounding surface of the insulating connection structure has a colloidal deformation mark generated after being heated by a heat source generated by a heating module. The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate. The image reading module further includes a filter element, which is supported by multiple supports or a surrounding support to be disposed above the image sensing chip, and the filter element is surrounded by multiple metal leads.

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