Laminated ceramic electronic component

Abstract

Provided is a multilayer ceramic capacitor having high adhesion between an external electrode and a spacer and excellent durability when mounted. This laminated ceramic electronic component (1) is provided with: a capacitor body (1A) which is provided with a laminated body (2) and two external electrodes (3) that are arranged on both end surfaces of the laminated body (2), are connected to internal electrode layers (15), extend to both main surfaces, and cover a part of the main surfaces; and two spacers (4) which are disposed on one main surface side of the capacitor body (1A) and on both end surface sides with the external electrode (3) covering a part of the main surface interposed therebetween, the spacers (4) being longer in the longitudinal direction than the external electrode (3) covering the one main surface, the spacers (4) containing an intermetallic compound and a protective material (6), the intermetallic compound contains Cu and / or Ni as a high-melting-point metal and Sn as a low-melting-point metal, and the spacer (4) is divided into two parts in the longitudinal direction along a line extending in the stacking direction. The content of the protective material (6) in a region closer to the center of the capacitor body (1A) in the longitudinal direction is higher than in a region farther from the center of the capacitor body (1A) in the longitudinal direction.

Description

Technical Field

[0001] This invention relates to laminated ceramic capacitors and other laminated ceramic electronic components. Background Technology

[0002] Multilayer ceramic capacitors and other multilayer ceramic electronic components are widely used in mobile terminal devices such as portable telephones or various electronic devices such as personal computers. Multilayer ceramic capacitors have a cuboid-shaped stack of alternating dielectric layers and internal electrode layers, and external electrodes formed at opposite ends of the stack.

[0003] A multilayer ceramic capacitor has an inner layer in which dielectric layers and internal electrodes are alternately stacked. Furthermore, a cuboid-shaped multilayer is formed by placing dielectric layers as outer layers on the upper and lower parts of the inner layer, and external electrodes are provided on the two end faces of the multilayer in the long side direction to form the capacitor body.

[0004] Furthermore, a multilayer ceramic capacitor is known, which, in order to suppress the occurrence of so-called "whistling", has a spacer formed in the capacitor body and mounted on one side of the substrate to cover a portion of the external electrodes.

[0005] Prior art literature

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-216337 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] However, if the adhesion between the capacitor body and the spacer is weak, the spacer may peel off, resulting in insufficient durability during installation.

[0010] The purpose of this invention is to provide a multilayer ceramic capacitor with high adhesion between the capacitor body and the spacer, and excellent durability during installation.

[0011] Technical solutions for solving the problem

[0012] To address the aforementioned problems, the present invention provides a stacked ceramic electronic component comprising a capacitor body and two spacers. The capacitor body comprises: a stacked body, alternately stacking dielectric layers and internal electrode layers, having two main faces opposite each other in the stacking direction, two end faces opposite each other in a length direction intersecting the stacking direction, and two side faces opposite each other in a width direction intersecting the stacking direction and the length direction; and two external electrodes, respectively disposed on the two end faces, connected to the internal electrode layers, and extending to the two main faces and covering a portion of the main faces, and extending to the two side faces and covering a portion of the side faces. A spacer sandwiches an external electrode covering a portion of the main surface or the side surface of the capacitor body on one main surface side or one side surface side, respectively disposed on one end face side and the other end face side. The spacer is longer than the external electrode covering the main surface in the length direction. The spacer contains a metallic component and a protective material. When the spacer is divided into two parts in the length direction along a line extending in the stacking direction, the region closer to the center of the capacitor body in the length direction has a higher content of the protective material than the region farther from the center of the capacitor body in the length direction.

[0013] Invention Effects

[0014] According to the present invention, a multilayer ceramic capacitor with high adhesion between the capacitor body and the spacer and excellent durability during installation can be provided. Attached Figure Description

[0015] Figure 1 This is a schematic three-dimensional view of the multilayer ceramic capacitor 1.

[0016] Figure 2 It is along the multilayer ceramic capacitor 1 Figure 1 A sectional view along line II-II in the diagram.

[0017] Figure 3 It is along the multilayer ceramic capacitor 1 Figure 1 A sectional view along line III-III.

[0018] Figure 4 yes Figure 2 Enlarged view of the cross-sectional view of the stacked ceramic capacitor 1 and the spacer 4.

[0019] Figure 5 This is a flowchart illustrating the manufacturing method of the multilayer ceramic capacitor 1.

[0020] Figure 6 This diagram illustrates the laminate manufacturing process S1 and the external electrode formation process S2.

[0021] Figure 7 This diagram illustrates the steps S3 for preparing protective materials and reinforcing paste, S4 for preparing spacer paste, and S5 for reflow soldering.

[0022] Figure 8 This is a flowchart showing the protective material 6 and the process of forming the reinforcing member in the modified example.

[0023] Figure 9 This diagram illustrates the protective material 6 and the process of forming the reinforcing member in the modified example. Detailed Implementation

[0024] The following description describes a multilayer ceramic capacitor 1 as an embodiment of the multilayer ceramic electronic component of the present invention, but the present invention is not limited thereto. Furthermore, the accompanying drawings are sometimes schematically simplified for the purpose of illustrating the invention, and the dimensions of the depicted components or the ratios between the dimensions of the components may differ from those described in the specification. Additionally, the components described in the specification may sometimes be omitted in the accompanying drawings, or the number of components may be omitted, etc.

[0025] Figure 1 This is a schematic perspective view of the stacked ceramic capacitor 1 according to the embodiment. Figure 2 Along the implementation of the multilayer ceramic capacitor 1 Figure 1 A sectional view along line II-II in the diagram. Figure 3 Along the implementation of the multilayer ceramic capacitor 1 Figure 1 A sectional view along line III-III.

[0026] The multilayer ceramic capacitor 1 is generally rectangular in shape and includes a capacitor body 1A comprising a multilayer body 2 and a pair of external electrodes 3 disposed at both ends of the multilayer body 2, spacers 4 mounted on the capacitor body 1A and including protective material 6, and reinforcing members 5 disposed between the two spacers 4. Furthermore, the multilayer body 2 includes an inner layer 11 in which a dielectric layer 14 and an internal electrode layer 15 are stacked.

[0027] In the following description, as a term indicating the orientation of the multilayer ceramic capacitor 1, the direction in which a pair of external electrodes 3 are disposed is designated as the length direction L. The direction in which the dielectric layer 14 and the internal electrode layer 15 are stacked is designated as the stacking direction T. The direction intersecting both the length direction L and the stacking direction T is designated as the width direction W. Furthermore, in the embodiment, the width direction W is orthogonal to both the length direction L and the stacking direction T.

[0028] (Outer surface of layer 2)

[0029] Furthermore, among the six outer surfaces of the laminate 2, a pair of opposite surfaces in the lamination direction T are designated as the first main surface A1 and the second main surface A2; a pair of opposite surfaces in the width direction W are designated as the first side surface B1 and the second side surface B2; and a pair of opposite surfaces in the length direction L are designated as the first end surface C1 and the second end surface C2. Additionally, unless there is a specific distinction between the first main surface A1 and the second main surface A2, they are uniformly referred to as main surface A; unless there is a specific distinction between the first side surface B1 and the second side surface B2, they are uniformly referred to as side surface B; and unless there is a specific distinction between the first end surface C1 and the second end surface C2, they are uniformly referred to as end surface C.

[0030] Preferably, the edge portion R1 including the corner of the laminate 2 has rounded corners. The edge portion R1 is the part where two surfaces of the laminate 2 intersect, namely the main surface A and the side surface B, the main surface A and the end surface C, or the side surface B and the end surface C.

[0031] (Layered body 2)

[0032] The laminate 2 includes an inner layer 11 that forms an electrostatic capacitor, an outer layer 12 that is configured to sandwich the inner layer 11 from the lamination direction T, and a side gap 16 that is configured to sandwich the inner layer 11 and the outer layer 12 from the width direction W.

[0033] (Inner layer 11)

[0034] The inner layer 11 includes a dielectric layer 14 and an inner electrode layer 15 that are alternately stacked along the stacking direction T.

[0035] (Dielectric layer 14)

[0036] The dielectric layer 14 is made of a ceramic material. For example, a dielectric ceramic with BaTiO3 as the main component can be used as the ceramic material.

[0037] (Internal electrode layer 15)

[0038] The internal electrode layer 15 includes a plurality of first internal electrode layers 15a and a plurality of second internal electrode layers 15b. The first internal electrode layers 15a and second internal electrode layers 15b are arranged alternately. The first internal electrode layer 15a includes a first opposing portion 152a opposite to the second internal electrode layer 15b and a first lead-out portion 151a extending from the first opposing portion 152a toward the first end face C1. The end of the first lead-out portion 151a is exposed at the first end face C1 and is electrically connected to the first external electrode 3a described later. The second internal electrode layer 15b includes a second opposing portion 152b opposite to the first internal electrode layer 15a and a second lead-out portion 151b extending from the second opposing portion 152b toward the second end face C2. The end of the second lead-out portion 151b is electrically connected to the second external electrode 3b described later. Charge is accumulated in the first opposing portion 152a of the first internal electrode layer 15a and the second opposing portion 152b of the second internal electrode layer 15b.

[0039] The internal electrode layer 15 is preferably formed of a metallic material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), silver-palladium (Ag-Pd) alloy, gold (Au).

[0040] (Outer layer 12)

[0041] The outer layer 12 can be formed of the same material as the dielectric layer 14 of the inner layer 11.

[0042] (Side gap section 16)

[0043] The capacitor has a first side gap 16a that forms the first side surface B1 of the laminated ceramic capacitor 1, and a second side gap 16b that forms the second side surface B2 of the laminated ceramic capacitor 1, which are configured to sandwich the inner layer 11 and the outer layer 12 in the width direction W. The side gap 16 can be formed of the same material as the dielectric layer 14.

[0044] (External electrode 3)

[0045] The external electrode 3 includes a first external electrode 3a disposed on the first end face C1 and a second external electrode 3b disposed on the second end face C2. The external electrode 3 covers not only the end face C, but also a portion of the main surface A and the side surface B connected to the end face C.

[0046] As described above, the end of the first lead-out portion 151a of the first inner electrode layer 15a is exposed at the first end face C1 and electrically connected to the first outer electrode 3a. Furthermore, the end of the second lead-out portion 151b of the second inner electrode layer 15b is exposed at the second end face C2 and electrically connected to the second outer electrode 3b. Thus, the first outer electrode 3a and the second outer electrode 3b form a configuration where multiple capacitor elements are electrically connected in parallel.

[0047] Furthermore, the external electrode 3 may include, for example, a base electrode layer 30 and a plating layer 31. However, the external electrode 3 does not necessarily need to have such a layered structure.

[0048] The substrate electrode layer 30 is formed, for example, by applying and sintering a conductive paste containing copper (Cu). Alternatively, the substrate electrode layer 30 may also contain glass or ceramic materials. However, the structure of the substrate electrode layer 30 is not limited to these methods.

[0049] The plating layer 31 includes a nickel (Ni) plating layer 31a disposed on the surface of the substrate electrode layer 30, and a tin (Sn) plating layer 31b disposed on the surface of the nickel (Ni) plating layer 31a. However, the structure of the plating layer 31 is not limited to this.

[0050] (Spacer 4)

[0051] The spacer 4 includes a first spacer 4a and a second spacer 4b. The first spacer 4a is disposed on one end face C1 side of the capacitor body 1A on the side of the second main surface A2, which serves as the substrate mounting surface, in the longitudinal direction L, and the second spacer 4b is disposed on the other end face C2 side. The spacers 4 are respectively configured to connect with the portion of the external electrode 3 disposed on the second main surface A2. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, the first spacer 4a is disposed on one end face C1 side of the capacitor body 1A on the side of the first side surface B1, which serves as the substrate mounting surface, in the longitudinal direction L, and the second spacer 4b is disposed on the other end face C2 side.

[0052] Hereinafter, the two opposite faces of each spacer 4 in the stacking direction T will be described as the main face SA of the spacer, the two opposite faces in the length direction L will be described as the end face SC of the spacer, and the two opposite faces in the width direction W will be described as the side face SB of the spacer.

[0053] Furthermore, among the two spacer end faces SC, the spacer end face SC on the side closest to the center of the length direction L of the capacitor body 1A will be described as the central side spacer end face SC1, and the spacer end face SC on the outside of the length direction L of the laminate 2 will be described as the outer side spacer end face SC2.

[0054] Of the two spacer main surfaces SA, the spacer main surface SA on the capacitor body 1A side will be described as the body-side spacer main surface SA1, and the spacer main surface SA on the other side will be described as the mounting-side spacer main surface SA2. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, of the two spacer sides SB, the spacer side SB on the capacitor body 1A side will be described as the body-side spacer side SB1, and the spacer side SB on the other side will be described as the mounting-side spacer main surface SB2.

[0055] In this embodiment, the length L of each spacer 4 is longer than the external electrode 3 disposed on the second main surface A2. That is, the central side spacer end face SC1 of each spacer 4 extends beyond the external electrode 3, and there is a portion where the main body side spacer main surface SA1 of the spacer 4 directly contacts the second main surface A2 of the laminate 2. However, this is not a limitation; the length L of each spacer 4 may also be shorter than the external electrode disposed on the second main surface A2. The same applies when the substrate mounting surface of the capacitor body 1A is the first side surface B1.

[0056] In this embodiment, an external electrode 3 is shown consisting of a base electrode layer 30 and a plating layer 31 covering the base electrode layer 30, with a spacer 4 disposed on the surface of the plating layer 31. However, for example, the spacer 4 may also be disposed on the surface of the base electrode layer 30, and a second plating layer may be disposed to cover the spacer 4 and the base electrode layer 30. By disposing of the second plating layer, the adhesion between the spacer 4 and the base electrode layer 30 is improved.

[0057] (Material of spacer 4)

[0058] Spacer 4 contains either copper (Cu) or nickel (Ni) as metal powder and tin (Sn) as metal. Copper (Cu) and nickel (Ni) may also be coated with silver (Ag). In addition, silver (Ag) may also be included as a metal constituting the intermetallic compound.

[0059] The intermetallic compound formed by adding either copper (Cu) or nickel (Ni) and tin (Sn) has a melting point that does not melt even when soldering the multilayer ceramic capacitor 1 onto the wiring substrate, thus preventing heat-induced deformation. Therefore, the shape of the spacer 4 can be reliably maintained, and it can be configured in a desired form even during soldering. It is particularly preferred to use an intermetallic compound formed by adding tin (Sn) to an alloy of copper (Cu) and nickel (Ni) as a component forming the spacer 4.

[0060] Phenolic resin may also be included in the metal region MP formed by metal powder. The phenolic resin is dispersed as particles coated with intermetallic compounds and fills the gaps between the particles. The phenolic resin may also be in a state where the particles are not completely coated with intermetallic compounds. Furthermore, by using phenolic resin, the amount of gas generated during the heat treatment when forming the spacer 4 can be reduced, thus reducing the voids within the spacer 4. The phenolic resin may also be exposed on the surface of the spacer 4 and coat at least a portion of the surface. By coating the surface of the spacer 4 with phenolic resin, the smoothness of the surface of the spacer 4 is improved, thereby increasing the mechanical strength of the spacer 4.

[0061] Examples of phenolic resins include phenolic varnish resin, phenolic aralkyl resin, cresol phenolic varnish resin, Tcrt-butylphenol phenolic varnish resin, nonylphenol phenolic varnish resin, etc., as well as methyl phenolic resin, poly(p-hydroxystyrene), etc.

[0062] Figure 4 yes Figure 2 An enlarged view of the cross-sectional view of the multilayer ceramic capacitor 1, and the spacer 4 portion. (See attached image.) Figure 4 As shown, metal powder MF can also be included in the resin region RP formed by phenolic resin. The metal powder MF hinders the shrinkage of phenolic resin, thereby mitigating the shrinkage stress generated by the phenolic resin.

[0063] In the region Z from the interface with the external electrode 3 to 5 μm, the porosity of the spacer 4 is preferably 20% or less. By suppressing the porosity to a lower level, the adhesion area of ​​the spacer 4 to the external electrode 3 is increased, and the adhesion force to the external electrode 3 is improved.

[0064] A gap P is formed inside the spacer 4. The maximum diameter of the gap P is preferably less than or equal to half of the maximum dimension of the thickness of the spacer 4 in the lamination direction T. If it is greater than half, cracking becomes more likely to occur starting from the gap P, and the strength of the spacer 4 decreases. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, the maximum diameter of the gap P formed inside the spacer 4 is preferably less than or equal to half of the maximum dimension of the thickness of the spacer 4 in the width direction W.

[0065] In the above examples, a structure comprising an intermetallic compound and a phenolic resin is shown as an example of a spacer material, but this is not a limitation. The structure may also contain other types of metallic components, or it may contain resins such as epoxy resin, rosin, and glass components in addition to phenolic resin. Furthermore, it may be formed without resin.

[0066] It can also be made of copper or copper alloys, i.e., materials containing copper, and configured to be bonded to Ni plating via solder.

[0067] Viewed from above in a direction connecting the surface to which the spacer 4 is attached to a surface opposite to it, when the spacer 4 is smaller than the external electrode 3, it is preferable to add a direction-determining unit to at least a portion of the spacer 4. The direction-determining unit is used to determine the orientation of the second main surface A2 or the first side surface B1 where the spacer 4 is disposed when the multilayer ceramic capacitor 1 is mounted on the wiring substrate. It can be a unit that colors the spacer 4 with a different color than the external electrode 3, a unit that prints a direction identification mark such as a QR code (registered trademark) for direction determination, or a unit that provides a recess in a portion of the multilayer. Alternatively, as a coloring unit, the phenolic resin contained in the spacer 4 can be exposed on the surface of the spacer 4, resulting in a color different from the external electrode 3. Furthermore, when the spacer 4 is larger than the external electrode 3, the direction-determining unit can also be provided.

[0068] For example, if the spacer 4 and the external electrode 3 have the same color tone, it may be difficult to determine which side is the surface to which the spacer 4 is applied when viewed from the top surface, potentially leading to image processing errors. However, by setting an orientation recognition mark, such image processing errors can be prevented.

[0069] (Protective material 6)

[0070] In this embodiment, the spacer 4 also contains a protective material 6 inside. The protective material 6 preferably includes resin, a hydrophobic agent, ceramic, glass, etc. The resin material can also be an epoxy resin as the main component, a phenolic resin combined with an epoxy resin curing agent, and a curing accelerator added to them. In this case, the curing agent can also be, for example, an anhydride-based, amine-based, or ester-based material.

[0071] Furthermore, the protective material 6 exhibits higher adhesion to components such as dielectrics contained in the laminate 2 compared to the intermetallic compound contained in the spacer 4. In this case, the bonding between the laminate 2 and the spacer 4 can be made stronger through the combination of the protective material 6 and the laminate 2.

[0072] (Content of protective material 6 along the length direction L)

[0073] like Figure 4 As shown, considering a line extending in the stacking direction T, spacer 4 is divided into L1, L2, L3 and L4 in the length direction L, from the central side spacer end face SC1 toward the outer side spacer end face SC2.

[0074] Here, if we consider it as a division of L1+L2 and L3+L4, then regarding the content of protective material 6, it is preferable that the region L1+L2, which is closer to the center, has more content than the region L3+L4, which is farther from the center.

[0075] Furthermore, if we consider the four divisions of L1, L2, L3, and L4, then regarding the content of protective material 6, the region L1 closest to the center is preferably the highest, followed by the region L2 closest to the center. More preferably, the content of protective material 6 decreases from the region L1 closest to the center in the order of L2, L3, and L4.

[0076] (Content of protective material 6 in the stacking direction T)

[0077] Considering a line extending along the length direction L, spacer 4 is divided into T1, T2 and T3 along the stacking direction T, from the main surface SA1 of the main spacer on the main body side closest to the capacitor body 1A toward the main surface SA2 of the mounting side spacer.

[0078] At this point, regarding the content of the protective material 6, it is preferable that the region T1 closest to the capacitor body 1A has a higher content than the region T3 furthest from the capacitor body 1A. Furthermore, the region T3 preferably has the highest content of the metal component in the spacer 4. If the region T3, which is the side bonded to the solder, has a high content of the metal component, a strong bond between the solder and the spacer 4 can be ensured.

[0079] (Content of protective material 6 in the length direction L and the stacking direction T)

[0080] Consider dividing spacer 4 into L1, L2, L3, and L4 along the length direction L from the central side spacer end face SC1 toward the outer side spacer end face SC2, and dividing it into T1, T2, and T3 along the stacking direction T from the side closest to capacitor body 1A, i.e., the main body side spacer main face SA1, toward the mounting side spacer main face SA2, for a total of 12 divisions.

[0081] At this point, regarding the content of protective material 6, the preferred region LT11 has the highest content. This region LT11 is L1 and T1, meaning that this region LT11 is the region L1 closest to the central spacer end face SC1 and the region T1 closest to the capacitor body 1A. Moreover, the preferred content of protective material 6 decreases towards the outer spacer end face SC2 and towards the mounting side spacer main face SA2. The content of protective material 6 is lowest in region LT43, which is L4 and T3.

[0082] As described above, in this embodiment, each spacer 4 is longer than the length L of the external electrode 3 disposed on the second main surface A2. That is, the main surface SA1 of the spacer 4 on its main body side is in direct contact with the second main surface A2 of the laminate 2, which is not covered by the external electrode 3. This directly contacted portion is the region LT11 with the highest content of the protective material 6. Therefore, the spacer 4 is firmly bonded to the laminate 2 through the combination of the dielectric component of the laminate 2 and the protective material 6.

[0083] Furthermore, in spacer 4, the content of protective material 6 decreases towards the outer spacer end face SC2, thus relatively increasing the intermetallic compound and metal composition. Moreover, spacer 4 is connected to the external electrode 3 on the outer spacer end face SC2 side, thereby increasing the contact area between the intermetallic compound and metal composition of spacer 4 and the external electrode 3. This ensures good conductivity between spacer 4 and external electrode 3 and increases adhesion.

[0084] Furthermore, in the spacer 4, the content of protective material 6 decreases as it faces the main surface SA2 of the spacer on the mounting side, while the metal content increases, thus ensuring a strong bond between the solder and the spacer 4.

[0085] (Reinforcing component 5)

[0086] In the implementation method, such as Figure 1 As shown, the reinforcing member 5 is configured to cover the second main surface side of the capacitor body 1A between the two spacers 4. At this time, the length of the external electrode disposed on the main surface in the longitudinal direction and the length of the spacer in the longitudinal direction can be approximately equal, or the length of the external electrode in the longitudinal direction can be longer.

[0087] (Material of reinforcement component 5)

[0088] The main component of the reinforcing member 5 is preferably the same as the main component of the protective material 6. By having the same main component, the protective material 6 of the spacer 4 and the reinforcing member 5 are bonded together, and the adhesive strength between the spacer 4 and the protective material 6 is improved.

[0089] (Shape of reinforcement 5)

[0090] like Figure 2 As shown, the reinforcing member 5 is continuously arranged in the longitudinal direction L between the central side spacer end face SC1 of one spacer 4 and the central side spacer end face SC1 of the other spacer 4, covering the second main surface A2 side of the capacitor body 1A (laminated body 2) and each of the central side spacer end faces SC1 of the two spacers 4. Therefore, the capacitor body 1A can be more securely protected. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, it covers the first side surface B1 side of the capacitor body 1A (laminated body 2) and each of the central side spacer end faces SC1 of the two spacers 4.

[0091] However, the reinforcing member 5 does not necessarily need to be continuous between the first spacer 4a and the second spacer 4b. For example, the reinforcing member 5 may be configured discontinuously as a part covering a portion of the central spacer end face SC1 of the first spacer 4a and a portion of the second main surface A2 of the capacitor body 1A (laminated body 2), and as a part covering a portion of the central spacer end face SC1 of the second spacer 4b and a portion of the second main surface A2 of the capacitor body 1A (laminated body 2). When the substrate mounting surface of the capacitor body 1A is the first side surface B1, for example, the reinforcing member 5 may also be configured discontinuously as a part covering a portion of the central spacer end face SC1 of the first spacer 4a and a portion of the first side surface B1 of the capacitor body 1A (laminated body 2), and as a part covering a portion of the central spacer end face SC1 of the second spacer 4b and a portion of the first side surface B1 of the capacitor body 1A (laminated body 2).

[0092] (Determination Method)

[0093] The content of protective material 6 can be determined as follows. First, cutting is performed until the width W of the spacer 4 becomes 1 / 2, so that the cross-section of the side SB of the spacer can be seen.

[0094] The cross-section of spacer 4 was photographed using a microscope (Axio (registered trademark) - Imager-MAT, manufactured by ZEISS) with a magnification of 100 to 500x.

[0095] In the captured image, the spacer 4 is divided into 3 parts along the length direction L in the region where the thickness of the spacer 4 is the thickest in the stacking direction T, and also divided into 2 or 4 parts along the length direction L in the stacking direction T.

[0096] (Manufacturing method of multilayer ceramic capacitor 1)

[0097] Figure 5 This is a flowchart illustrating the manufacturing method of the multilayer ceramic capacitor 1. The manufacturing method of the multilayer ceramic capacitor 1 includes a multilayer body manufacturing process S1, an external electrode forming process S2, a process of applying protective material and reinforcing paste S3, a process of applying spacer paste S4, and a reflow soldering process S5. Figure 6 This diagram illustrates the laminate manufacturing process S1 and the external electrode formation process S2. Figure 7 This diagram illustrates the steps S3 for preparing protective materials and reinforcing paste, S4 for preparing spacer paste, and S5 for reflow soldering.

[0098] (Laminated body manufacturing process S1)

[0099] A ceramic slurry containing ceramic powder, binder, and solvent is formed into a sheet on the surface of a carrier film using a die coater, gravure coater, or micro-gravure coater to create a laminated ceramic green sheet 101 that forms the dielectric layer 14. Next, a conductive paste is printed into a strip on the laminated ceramic green sheet 101 using screen printing, inkjet printing, or gravure printing to create a conductive pattern 102 that forms the internal electrode layer 15, thus creating a raw material sheet 103.

[0100] Next, as Figure 6 As shown in (a), multiple raw material sheets 103 are stacked such that the conductive patterns 102 face the same direction and are staggered by, for example, half a pitch in the length direction L between adjacent raw material sheets 103. Furthermore, on both sides of the stacked raw material sheets 103, outer layer ceramic green sheets 112 are stacked to form the outer layer 12.

[0101] Multiple stacked raw material sheets 103 and the outer layer are pressed together using ceramic green sheets 112 through isostatic pressing and other methods to produce... Figure 6 The mother block 110 shown in (b)

[0102] Next, move the mother block 110 along... Figure 6 Cut along the cutting line X shown in (b) and the cutting line Y intersecting with the cutting line X to manufacture multiple [products / processes]. Figure 6 The stacked body 2 shown in (c)

[0103] (External electrode formation process S2)

[0104] Next, a conductive paste containing copper (Cu) is applied and sintered onto the end face C of the laminate 2 to form a base electrode layer 30. The base electrode layer 30 is formed to cover not only the end faces C on both sides of the laminate 2, but also to extend to the main surface A and side surface B of the laminate 2, and to cover a portion of the end face C side of the main surface A. Next, a nickel (Ni) plating layer 31a and a tin (Sn) plating layer 31b disposed on the surface of the nickel (Ni) plating layer 31a are formed on the surface of the base electrode layer 30, thus manufacturing... Figure 6 The capacitor body 1A is shown in (d). The structure of the external electrodes is not limited thereto.

[0105] (Reinforcing compound preparation process S3)

[0106] In this embodiment, the protective material 6 and the reinforcing member are formed using the same material, but in this case, firstly, the surface of the capacitor body 1A, where the spacer 4 is disposed, is cleaned with a solvent, such as... Figure 7 As shown in (a), a reinforcing paste 51 is applied between the two external electrodes 3.

[0107] (S4 step of preparing grease for spacers)

[0108] Next, as Figure 7 As shown in (b), on the external electrodes 3 of the capacitor body 1A, which has a reinforcing paste 51 applied between the two external electrodes 3, a spacer paste 41 is applied. At this time, the spacer paste 41 is applied so that it covers not only the external electrodes 3 but also a portion of the reinforcing paste 51.

[0109] (Reflow soldering process S5)

[0110] Next, as Figure 7 As shown in (c), the uncured reinforcing paste 51 and the uncured spacer paste 41 are simultaneously cured by reflow soldering. At this time, the reinforcing material 6 penetrates the area of ​​the spacer paste 41 close to the reinforcing paste 51, forming an area with a high content of protective material 6. Furthermore, the content of protective material 6 within the spacer 4 can be increased by increasing the amount of reinforcing paste 51 at this time.

[0111] (Modified example)

[0112] In the case of a modified example where the protective material 6 and the reinforcing member 5 are formed from different materials, after the external electrode forming process S2, such as Figure 8 And such as Figure 9 Proceed in the following order as shown. Figure 8 This is a flowchart showing the protective material 6 and the process of forming the reinforcing member in the modified example. Figure 9 This diagram illustrates the protective material 6 and the process of forming the reinforcing member in the modified example.

[0113] (Preparation process for protective material paste S13)

[0114] like Figure 9 As shown in (a), a protective material paste 61, which is a material that forms a protective material 6, is applied to the exposed portion of the laminate 2 between the external electrodes 3 of the capacitor body 1A by printing with a dispenser or squeegee. The protective material paste 61 is in contact with the external electrodes 3, and is applied to cover at least 15% of the area of ​​the external electrodes 3 without covering them.

[0115] (Spacer grout preparation process S14)

[0116] like Figure 9 As shown in (b), spacer paste 41 is applied to the capacitor body 1A, which is coated with protective material paste 61.

[0117] (First reflow soldering process S15)

[0118] like Figure 9As shown in (c), reflow soldering is performed with the capacitor body 1A coated with protective material paste 61 and spacer paste 41.

[0119] The uncured protective material paste 61 and the spacer paste 41 are simultaneously cured by reflow soldering, thereby forming a spacer 4 in which the content of the protective material 6 varies depending on the location. Furthermore, the content of the protective material 6 in the spacer 4 can be controlled by changing the amount and position of the protective material 6.

[0120] (Reinforcing compound preparation process S16)

[0121] like Figure 9 As shown in (d), the surface of the capacitor body 1A with spacers 4 is cleaned with solvent, and a reinforcing paste 51 is applied between the two spacers 4 using a dispenser or squeegee for printing on the capacitor body 1A with spacers 4.

[0122] (Second reflow soldering process S17)

[0123] Next, reflow soldering is performed on the capacitor body 1A, which has reinforcing paste 51 disposed between the two spacers 4. The uncured reinforcing paste 51 is cured by reflow soldering.

[0124] Through the above processes, the multilayer ceramic capacitor 1 of the embodiment is manufactured.

[0125] According to the above embodiment, the stacked ceramic capacitor 1 has a spacer 4 mounted on the capacitor body 1A, so the spacer 4 can buffer the vibration generated in the capacitor body 1A and suppress the vibration transmitted to the mounting substrate.

[0126] Furthermore, in the stacked ceramic capacitor 1 according to the embodiment, a reinforcing member 5 is installed between the spacers 4, which can enhance the adhesion between the external electrode 3 and the spacers 4 and prevent the spacers 4 from peeling off from the capacitor body 1A.

[0127] The spacer 4 is longer than the portion of the outer electrode 3 covering the capacitor body 1A on the second main surface A2 side in the length direction L. Furthermore, the spacer 4 comprises an intermetallic compound and a protective material, the intermetallic compound comprising at least one of Cu or Ni as a high-melting-point metal and Sn as a low-melting-point metal.

[0128] Furthermore, the protective material 6 has a higher adhesion to components such as dielectrics contained in the laminate 2 compared to the intermetallic compound contained in the spacer 4.

[0129] Furthermore, when the spacer 4 is divided into two parts along the length direction L, the region closer to the center of the length direction L of the capacitor body 1A has a higher content of protective material 6 compared to the region farther from the center of the length direction L of the capacitor body 1A.

[0130] Thus, the content of protective material 6 is high in the joint portion between spacer 4 and laminate 2. The adhesive force between protective material 6 and the dielectric component of laminate 2 is strong, thereby ensuring a strong bond between spacer 4 and laminate 2.

[0131] Furthermore, in the junction of the spacer 4 and the external electrode 3, the content of protective material is low and the content of intermetallic compounds is high. Therefore, the intermetallic compounds of the spacer 4 and the metal of the external electrode 3 are bonded together, ensuring a strong bond between the spacer 4 and the external electrode 3.

[0132] The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments and can be implemented in various ways without departing from the spirit of the present invention. The present invention includes the following combinations.

[0133] <1> A stacked ceramic electronic component includes a capacitor body and two spacers. The capacitor body comprises: a stacked body, alternatingly stacked dielectric layers and internal electrode layers, having two main faces opposite each other in a stacking direction, two end faces opposite each other in a length direction intersecting the stacking direction, and two side faces opposite each other in a width direction intersecting the stacking direction and the length direction; and two external electrodes, respectively disposed on the two end faces, connected to the internal electrode layers, and extending to the two main faces and covering a portion of the main faces. The two spacers are located on one main face side of the capacitor body, covering the portion of the main face. The external electrodes are sandwiched between the two electrodes, respectively disposed on one end face and the other end face. The spacers are longer than the external electrodes covering one of the main faces in the length direction. The spacers each contain an intermetallic compound and a protective material. The intermetallic compound contains at least one of Cu or Ni as a high-melting-point metal and Sn as a low-melting-point metal. When the spacers are divided into two parts in the length direction along a line extending in the stacking direction, the region closer to the center of the capacitor body in the length direction has a higher content of the protective material than the region farther from the center of the capacitor body in the length direction.

[0134] <2> A stacked ceramic electronic component includes a capacitor body and two spacers. The capacitor body comprises: a stacked body, alternatingly stacked dielectric layers and internal electrode layers, having two main faces opposite each other in a stacking direction, two end faces opposite each other in a length direction intersecting the stacking direction, and two side faces opposite each other in a width direction intersecting the stacking direction and the length direction; and two external electrodes, respectively disposed on the two end faces, connected to the internal electrode layers, and extending to the two main faces and covering a portion of the main faces, and extending to the two side faces and covering a portion of the side faces. A spacer is disposed on one main face side or one side side of the capacitor body, sandwiching the external electrode covering a portion of the main face or the side side. The spacer is disposed on one end face side and the other end face side. The spacer comprises a metallic component and a protective material. When the spacer is divided into two parts along the length direction along a line extending in the stacking direction, the region closer to the center of the capacitor body in the length direction has a higher content of the protective material than the region farther from the center of the capacitor body in the length direction. A reinforcing member is disposed between the two external electrodes.

[0135] <3> according to <1> or <2> The described laminated ceramic electronic component, wherein the protective material comprises resin.

[0136] <4> according to <1> to <3> In any of the following descriptions of a stacked ceramic electronic component, when the spacer is divided into three parts in the stacking direction, the region closest to the capacitor body has a higher content of the protective material compared to the region farthest from the capacitor body.

[0137] <5> according to <4> In the described stacked ceramic electronic component, the region of the spacer that has been divided into three parts decreases sequentially from the region closer to the capacitor body to the region farther from the capacitor body, and the content of the protective material decreases sequentially.

[0138] <6> according to <1> to <5> In any of the stacked ceramic electronic components described herein, when the spacers are divided into four sections along the length direction, the region closest to the center of the capacitor body along the length direction has the highest content of the protective material, and the region second closest to the center of the length direction has the second highest content of the protective material.

[0139] <7> according to <1> to <6> The laminated ceramic electronic component described in any one of the following, wherein a reinforcing member is disposed between the two external electrodes, the main component of the reinforcing member being the same as the main component of the protective material.

[0140] <8> according to <7> The described laminated ceramic electronic component, wherein the reinforcing member is continuously arranged in the length direction.

[0141] Explanation of reference numerals in the attached figures

[0142] 1. Multilayer ceramic capacitor

[0143] 1A capacitor body

[0144] 2-layered body

[0145] 3a First external electrode

[0146] 3b Second external electrode

[0147] 4 spacers

[0148] 4a First spacer

[0149] 4b Second spacer

[0150] 5 Reinforcing components

[0151] 6. Protective materials

[0152] 11 Inner layer

[0153] 12 Outer layer

[0154] 14 Dielectric layer

[0155] 15 Internal electrode layer

[0156] 51 Reinforcing compound

[0157] 61. Protective material paste.

Claims

1. A stacked ceramic electronic component comprising a capacitor body and two spacers, The capacitor body comprises: A laminate, alternately stacked with dielectric layers and internal electrode layers, having two main faces opposite each other in the stacking direction, two end faces opposite each other in the length direction intersecting the stacking direction, and two side faces opposite each other in the width direction intersecting both the stacking direction and the length direction; and Two external electrodes are respectively disposed on the two end faces, connected to the internal electrode layer, and extend to the two main faces and cover a portion of the main faces, and extend to the two side faces and cover a portion of the side faces. The two spacers sandwich the external electrode, which covers a portion of the main surface or the side surface, between one main surface or one side surface of the capacitor body, and are respectively disposed on one end face and the other end face. The spacers are each longer than the outer electrode covering one of the main surfaces in the longitudinal direction. The spacers each contain a metallic component and a protective material. When the spacer is divided into two parts along the length direction along a line extending in the stacking direction, the region closer to the center of the capacitor body in the length direction has a higher content of protective material compared to the region farther from the center of the capacitor body in the length direction.

2. A stacked ceramic electronic component comprising a capacitor body and two spacers, The capacitor body comprises: A laminate, alternately stacked with dielectric layers and internal electrode layers, having two main faces opposite each other in the stacking direction, two end faces opposite each other in the length direction intersecting the stacking direction, and two side faces opposite each other in the width direction intersecting both the stacking direction and the length direction; and Two external electrodes are respectively disposed on the two end faces, connected to the internal electrode layer, and extend to the two main faces and cover a portion of the main faces, and extend to the two side faces and cover a portion of the side faces. The two spacers sandwich the external electrode, which covers a portion of the main surface or the side surface, between one main surface or one side surface of the capacitor body, and are respectively disposed on one end face and the other end face. The spacers each contain a metallic component and a protective material. When the spacers are divided into two parts along the length direction along a line extending in the stacking direction, the region closer to the center of the capacitor body in the length direction has a higher content of protective material compared to the region farther from the center of the capacitor body in the length direction. A reinforcing member is disposed between the two external electrodes.

3. The laminated ceramic electronic component according to claim 1 or claim 2, wherein, The protective material comprises resin.

4. The laminated ceramic electronic component according to any one of claims 1 to 3, wherein, When the spacers are divided into three sections in the stacking direction, the area closest to the capacitor body has a higher content of protective material compared to the area farthest from the capacitor body.

5. The laminated ceramic electronic component according to claim 4, wherein, The spacer is divided into three regions, with the content of the protective material decreasing sequentially from the region closer to the capacitor body to the region farther from the capacitor body.

6. The laminated ceramic electronic component according to any one of claims 1 to 5, wherein, When the spacer is divided into 4 sections along the length direction... The region closest to the center of the capacitor body along its length has the highest content of the protective material. The region closest to the center of the length direction has the second highest content of the protective material.

7. The laminated ceramic electronic component according to any one of claims 1 to 6, wherein, A reinforcing member is disposed between the two external electrodes. The main component of the reinforcing member is the same as the main component of the protective material.

8. The laminated ceramic electronic component according to claim 7, wherein, The reinforcing members are continuously arranged along the length direction.

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